JP7215735B2 - Age-hardenable copper alloy - Google Patents
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本発明は、熱処理によりＳｉ系の金属間化合物粒子を分散させて用いられる時効硬化型のコルソン系銅合金に関し、特に、（Ｎｉ，Ｃｏ）－Ｓｉ系の金属間化合物粒子を分散させて用いられる時効硬化型銅合金に関する。 The present invention relates to an age-hardening Corson copper alloy that is used by dispersing Si-based intermetallic compound particles by heat treatment, and in particular, it is used by dispersing (Ni, Co)-Si-based intermetallic compound particles. It relates to age-hardenable copper alloys.
コルソン系銅合金は、コネクタやスイッチといった電気部品の摺動接点に用いられ、導電性及び機械強度を兼ね備えた銅合金として知られている。基本成分組成は、Ｃｕ－Ｎｉ－Ｓｉであり、Ｎｉ２Ｓｉのような金属間化合物を熱処理によって析出させて機械強度の向上を図られ得る。一方、導電性を高める観点から、更に、Ｃｏを添加したＣｕ－Ｎｉ－Ｃｏ－Ｓｉ系の銅合金が提案されている。 Corson copper alloys are used for sliding contacts of electrical parts such as connectors and switches, and are known as copper alloys having both electrical conductivity and mechanical strength. The basic composition is Cu--Ni--Si, and the mechanical strength can be improved by precipitating an intermetallic compound such as Ni.sub.2Si by heat treatment. On the other hand, a Cu--Ni--Co--Si system copper alloy to which Co is further added has been proposed from the viewpoint of enhancing electrical conductivity.
例えば、特許文献１では、Ｃｕ－Ｎｉ－Ｃｏ－Ｓｉ系銅合金において、曲げ加工性を向上させるため、冷間圧延と熱処理とを制御し、所定の内部組織を与えた合金を開示している。ここでは、成分組成として、０．５～３．０質量％のＣｏ及び０．１～１．０質量％のＮｉを含有し、Ｎｉに対するＣｏの質量比（Ｎｉ／Ｃｏ）を０．１～１．０、（Ｃｏ＋Ｎｉ）／Ｓｉ（質量比）を３～５とした銅合金であるとしている。
For example,
また、特許文献２でも、Ｃｕ－Ｎｉ－Ｃｏ－Ｓｉ系銅合金において、０．１～１．０質量％のＮｉ、０．５～３．０質量％のＣｏ及び０．１～１．５質量％のＳｉを含有し、（Ｃｏ＋Ｎｉ）／Ｓｉ（質量比）を３～５、時効処理後に冷間圧延し、機械強度、導電率、曲げ加工性、ばね限界値を高めた合金を開示している。ここで、Ｎｉの含有量が１．０質量％を超える場合や、Ｃｏの含有量が３．０質量％を超える場合は、高い機械強度を得られるものの、粗大なＮｉ－Ｓｉ系粒子やＣｏ－Ｓｉ系粒子を生成して、導電率や曲げ加工性を低下させてしまうことを述べている。さらに、（Ｎｉ＋Ｃｏ）／Ｓｉが５を超えると、ＮｉやＣｏが過剰となって、導電率を低下させてしまうことも述べている。 Further, in Patent Document 2, the Cu—Ni—Co—Si-based copper alloy contains 0.1 to 1.0% by mass of Ni, 0.5 to 3.0% by mass of Co, and 0.1 to 1.5% by mass of Co. Disclosed is an alloy that contains Si by mass%, (Co + Ni) / Si (mass ratio) is 3 to 5, and is cold-rolled after aging treatment to increase mechanical strength, electrical conductivity, bending workability, and spring limit value. ing. Here, when the Ni content exceeds 1.0% by mass or the Co content exceeds 3.0% by mass, although high mechanical strength can be obtained, coarse Ni—Si particles and Co - It states that Si-based particles are generated and the conductivity and bending workability are lowered. Furthermore, it also states that when (Ni+Co)/Si exceeds 5, Ni and Co become excessive and the electrical conductivity is lowered.
ところで、銅合金においてＣrを添加することで機械強度の向上を図ることができるとともに、導電率を確保できることが知られている。 By the way, it is known that adding Cr to a copper alloy can improve the mechanical strength and ensure the electrical conductivity.
例えば、特許文献３では、Ｃｕ－Ｎｉ－Ｃｏ－Ｓｉ系銅合金において、Ｃｒを添加した合金が開示されている。ここでは、Ｃｏ及びＮｉのＳｉ系化合物に加えて、Ｃｒ－Ｓｉ系化合物も析出させることで機械強度を高めるとしている。このような析出硬化型銅合金とすることで、固溶強化型銅合金に比べて母相中の固溶元素を減少させて導電率を向上させ得るとしている。このとき、Ｃｏ及びＮｉとの化合物を形成させてさらに余剰のあるようにＳｉを添加することでＣｒ－Ｓｉ系化合物を得ることも述べている。 For example, Patent Document 3 discloses a Cu--Ni--Co--Si based copper alloy to which Cr is added. Here, in addition to Si-based compounds of Co and Ni, Cr—Si-based compounds are also precipitated to increase the mechanical strength. It is stated that by using such a precipitation hardening copper alloy, it is possible to reduce the solid solution elements in the matrix and improve the electrical conductivity as compared with the solid solution strengthening copper alloy. At this time, it also states that a Cr--Si-based compound is obtained by forming a compound with Co and Ni and then adding Si so as to have a surplus.
このようなＣｒを添加したＣｕ－Ｃｏ－Ｎｉ－Ｓｉ系銅合金においても、Ｎｉ、Ｃｏ、Ｃｒの含有量を増加させることで機械強度を高め得るが、その量が過剰となると導電率を低下させてしまう。また、造塊時に粒界に粗大な金属間化合物の析出物が形成されやすく、これは一般的な溶体化熱処理では完全に固溶させることが難しく、割れなどの原因となり得る。 Even in such a Cu-Co-Ni-Si-based copper alloy to which Cr is added, the mechanical strength can be increased by increasing the content of Ni, Co, and Cr, but if the amount is excessive, the electrical conductivity is reduced. Let me. In addition, coarse precipitates of intermetallic compounds are likely to be formed at grain boundaries during ingot formation, and these precipitates are difficult to dissolve completely in a general solution heat treatment, and may cause cracks and the like.
本発明は、以上のような状況に鑑みてなされたものであって、その目的とするところは、機械強度及び導電性に優れた時効硬化型銅合金及びその製造方法を提供することにある。 The present invention has been made in view of the above circumstances, and its object is to provide an age-hardening copper alloy having excellent mechanical strength and electrical conductivity, and a method for producing the same.
本願発明者は、Ｎｉ量に対してＣｏ量を多くすることで、造塊時における粗大な粒界析出物を抑制できる傾向にあること、Ｃｒを多くしてこれを最終製品の固溶強化に用いても導電率を低下させることなく機械強度を向上できる傾向にあることを見いだし、一方で、機械強度を上げる観点から、かかる粒界析出物を固溶させるべく、溶体化処理温度をより高くすることを考慮した。 The inventors of the present application have found that by increasing the amount of Co relative to the amount of Ni, there is a tendency to suppress coarse grain boundary precipitates during ingot-making, and that increasing the amount of Cr is effective for solid-solution strengthening of the final product. It was found that the mechanical strength tends to be improved without lowering the electrical conductivity even when used, and on the other hand, from the viewpoint of increasing the mechanical strength, the solution treatment temperature is set higher in order to dissolve such grain boundary precipitates. considered doing.
すなわち、本発明による時効硬化型銅合金は、質量％で、Ｃｏ：１．０～３．５％、Ｃｒ：０．２％～１．３％で含み、元素Ｍの含有量を［Ｍ］質量％とするとき、［Ｎｉ］＋［Ｃｏ］＝５．０～９．０となるようにＮｉを含有するとともに、（［Ｎｉ］＋［Ｃｏ］）／［Ｓｉ］＝３．３～４．４となるようにＳｉを含有し、残部をＣｕ及び不可避的不純物とする合金組成を有し、熱処理されて（Ｎｉ，Ｃｏ）－Ｓｉからなる金属間化合物粒子を分散させて２０ＨＲＣ以上の硬さ且つ２５．０％ＩＡＣＳ以上の導電率に調製されて用いられ得る時効硬化型銅合金であって、導電率を１５．０％ＩＡＣＳ以下とすることを特徴とする。 That is, the age-hardenable copper alloy according to the present invention contains Co: 1.0 to 3.5%, Cr: 0.2% to 1.3%, and the content of the element M is [M] When expressed as mass%, Ni is contained so that [Ni] + [Co] = 5.0 to 9.0, and ([Ni] + [Co]) / [Si] = 3.3 to 4 .4, having an alloy composition in which the balance is Cu and unavoidable impurities, and is heat-treated to disperse intermetallic compound particles composed of (Ni, Co)-Si to obtain a hardness of 20 HRC or more. Furthermore, it is an age-hardening copper alloy that can be prepared to have a conductivity of 25.0%IACS or more and can be used, and is characterized by having a conductivity of 15.0%IACS or less.
かかる発明によれば、Ｃｒの含有量及びＮｉ、Ｃｏの含有量をそれぞれ多くしても、造塊時における粗大な粒界析出物を抑制でき、さらに溶体化処理温度をより高くし得て粒界析出物などの固溶を促進させて、溶体化熱処理後の導電率を１５．０％ＩＡＣＳ以下とし得る。このような溶体化熱処理後の時効硬化型銅合金であれば、金属間化合物粒子を分散させる時効処理によって機械強度及び導電性に優れる銅合金とすることができる。 According to this invention, even if the content of Cr and the content of Ni and Co are increased, coarse grain boundary precipitates can be suppressed during agglomeration, and the temperature of the solution treatment can be increased to increase the grain size. By promoting the solid solution of boundary precipitates and the like, the electrical conductivity after the solution heat treatment can be reduced to 15.0% IACS or less. Such an age-hardening copper alloy after solution heat treatment can be made into a copper alloy having excellent mechanical strength and electrical conductivity by aging treatment to disperse intermetallic compound particles.
上記した発明において、切断面において１μｍ以上の粒界金属間化合物が１個／ｃｍ２未満であることを特徴としてもよい。さらに、前記切断面において５５ＨＲＢ以上の硬さであることを特徴としてもよい。かかる発明によれば、粗大な粒界析出物の量をより確実に抑制でき、時効処理をした後において機械強度及び導電性に優れる銅合金を容易に得ることができる。 In the above invention, the number of grain boundary intermetallic compounds having a size of 1 μm or more is less than 1/cm 2 in a cut surface. Furthermore, it may be characterized by having a hardness of 55 HRB or more at the cut surface. According to this invention, the amount of coarse grain boundary precipitates can be more reliably suppressed, and a copper alloy having excellent mechanical strength and electrical conductivity after aging treatment can be easily obtained.
上記した発明において、前記成分組成は、更にＡｌ、Ｆｅ、Ｍｎ、Ａｇ、Ｓｎ、Ｔｉ、Ｚｒ、Ｐ、Ｍｇ、Ｂ、Ｓ、Ｎｂ及びＺｎからなる群から選ばれる少なくとも１種を、総計１．０質量％以下で含むことを特徴としてもよい。かかる発明によれば、上記した優れた機械強度と導電性とを維持しつつさらなる合金特性の改善を得られる。 In the above-described invention, the component composition further includes at least one selected from the group consisting of Al, Fe, Mn, Ag, Sn, Ti, Zr, P, Mg, B, S, Nb and Zn, and a total of 1. It may be characterized by containing 0% by mass or less. According to this invention, it is possible to further improve the alloy properties while maintaining the excellent mechanical strength and electrical conductivity described above.
また、本発明による時効硬化型銅合金の製造方法は、質量％で、Ｃｏ：１．０％～３．５％、Ｃｒ：０．２％～１．３％で含み、元素Ｍの含有量を［Ｍ］質量％とするとき、［Ｎｉ］＋［Ｃｏ］＝５．０～９．０となるようにＮｉを含有するとともに、（［Ｎｉ］＋［Ｃｏ］）／［Ｓｉ］＝３．３～４．４となるようにＳｉを含有し、残部をＣｕ及び不可避的不純物とする合金組成を有し、熱処理されて（Ｎｉ，Ｃｏ）－Ｓｉからなる金属間化合物粒子を分散させて２０ＨＲＣ以上の硬さ且つ２５．０％ＩＡＣＳ以上の導電率に調製されて用いられ得る時効硬化型銅合金の製造方法であって、導電率を１５．０％ＩＡＣＳ以下とするような９２０℃以上の温度での溶体化熱処理を含むことを特徴とする。 In addition, the method for producing an age-hardening copper alloy according to the present invention contains, in mass%, Co: 1.0% to 3.5%, Cr: 0.2% to 1.3%, and the content of the element M When [M] mass%, Ni is contained so that [Ni] + [Co] = 5.0 to 9.0, and ([Ni] + [Co]) / [Si] = 3 .3 to 4.4, having an alloy composition in which the balance is Cu and unavoidable impurities, and is heat-treated to disperse intermetallic compound particles composed of (Ni, Co)-Si A method for producing an age-hardening copper alloy that can be prepared and used to have a hardness of 20 HRC or higher and a conductivity of 25.0% IACS or higher, wherein the temperature is 920° C. or higher such that the conductivity is 15.0% IACS or lower. and a solution heat treatment at a temperature of
かかる発明によれば、Ｃｒの含有量及びＮｉ、Ｃｏの含有量をそれぞれ多くした上で、造塊時における粗大な粒界析出物を抑制でき、さらに溶体化処理温度を９２０℃と高くし得て粒界析出物などの固溶を促進させて、溶体化熱処理後の導電率を１５．０％ＩＡＣＳ以下とし得る。このような溶体化熱処理後の時効硬化型銅合金であれば、金属間化合物粒子を分散させる時効処理によって機械強度及び導電性に優れる銅合金とすることができる。 According to this invention, the content of Cr and the content of Ni and Co can be increased, and coarse grain boundary precipitates can be suppressed during ingot-making, and the solution treatment temperature can be increased to 920°C. This promotes the solid solution of grain boundary precipitates and the like, so that the electrical conductivity after the solution heat treatment can be 15.0% IACS or less. Such an age-hardening copper alloy after solution heat treatment can be made into a copper alloy having excellent mechanical strength and electrical conductivity by aging treatment to disperse intermetallic compound particles.
上記した発明において、前記溶体化熱処理は、切断面において、１μｍ以上の粒界金属間化合物を１個／ｃｍ２未満とする熱処理であることを特徴としてもよい。さらに、前記切断面において、５５ＨＲＢ以上の硬さであることを特徴としてもよい。かかる発明によれば、粗大な粒界析出物の量をより確実に抑制でき、時効処理をした後において機械強度及び導電性に優れる銅合金を容易に得ることができる。 In the invention described above, the solution heat treatment may be a heat treatment that reduces the number of grain boundary intermetallic compounds of 1 μm or more to less than 1/cm 2 on a cut surface. Further, the cut surface may be characterized by having a hardness of 55 HRB or more. According to this invention, the amount of coarse grain boundary precipitates can be more reliably suppressed, and a copper alloy having excellent mechanical strength and electrical conductivity after aging treatment can be easily obtained.
以下に、本発明による時効硬化型銅合金の１つの実施例について、図１を用いて説明する。 One embodiment of the age-hardenable copper alloy according to the present invention will be described below with reference to FIG.
図１の実施例１及び２に、本実施例における時効硬化型銅合金の代表的な成分組成を示すように、本実施例における時効硬化型銅合金は、質量％で、Ｃｏを１．０％以上３．５％以下、Ｃｒを０．２％以上１．３％以下で含み、さらに、元素Ｍの含有量を［Ｍ］質量％とするとき、［Ｎｉ］＋［Ｃｏ］を５．０～９．０とするようにＮｉを含むとともに、（［Ｎｉ］＋［Ｃｏ］）／［Ｓｉ］を３．３～４．４とするようにＳｉを含有し、残部をＣｕ及び不可避的不純物とする合金組成を有する。 As shown in Examples 1 and 2 of FIG. 1, representative chemical compositions of the age-hardening copper alloys in the present examples, the age-hardening copper alloys in the present examples contain 1.0% Co by mass %. % or more and 3.5% or less, Cr of 0.2% or more and 1.3% or less, and further, when the content of the element M is [M] mass%, [Ni] + [Co] is 5.5%. Contains Ni so as to be 0 to 9.0, contains Si such that ([Ni] + [Co]) / [Si] is 3.3 to 4.4, and the balance is Cu and unavoidable It has an alloy composition as an impurity.
すなわち、ＣｏはＮｉとともにＳｉに対する含有量を規定されて、時効処理によって分散析出させるべき金属間化合物であるＮｉ２ＳｉやＣｏ２Ｓｉなどを生成する元素の含有量の比率を調整して、時効処理後の機械強度と導電率とを共に高くするようになされる。このように、時効処理で析出させるＳｉとの金属間化合物を形成するＮｉ及びＣｏの含有量を調整することで、溶体化熱処理により金属間化合物の固溶状態を比較的容易に制御できる。他方、時効処理時において、ＳｉをＮｉやＣｏとの金属間化合物の生成で消費することで、ＣｒのＳｉ化合物の生成を抑制して時効処理後のＣｒの母相への固溶を維持させる。 That is, the content of Co, together with Ni, relative to Si is specified, and the ratio of the content of the elements that generate intermetallic compounds such as Ni 2 Si and Co 2 Si, which are to be dispersed and precipitated by the aging treatment, is adjusted. It is designed to increase both mechanical strength and electrical conductivity after treatment. Thus, by adjusting the contents of Ni and Co that form intermetallic compounds with Si precipitated during aging treatment, the solid solution state of the intermetallic compounds can be relatively easily controlled by solution heat treatment. On the other hand, during the aging treatment, Si is consumed by the formation of intermetallic compounds with Ni and Co, thereby suppressing the formation of Si compounds of Cr and maintaining the solid solution of Cr in the matrix after the aging treatment. .
また、造塊時に生成された金属間化合物による粗大な粒界析出物を溶体化熱処理によって十分に固溶させると導電率は低下する。そこで、鋳造で生成された粗大な粒界析出物が十分に固溶されたことの指標として、固溶熱処理後の導電率を１５．０％ＩＡＣＳ以下とする。換言すれば、上記した成分組成の銅合金によって得た合金塊の溶体化熱処理後の導電率を１５．０％ＩＡＣＳ以下とできれば、粗大な粒界析出物は十分に固溶されており、その後に時効処理することでＣｏやＮｉの金属間化合物による微細な分散析出物を得るとともに、Ｃｒの固溶を維持して、機械強度及び導電性の双方において優れる銅合金とし得るのである。 Further, if coarse grain boundary precipitates due to intermetallic compounds generated during ingot making are fully dissolved by solution heat treatment, the electrical conductivity is lowered. Therefore, as an index of sufficient solid solution of coarse grain boundary precipitates generated by casting, the electrical conductivity after solid solution heat treatment is set to 15.0% IACS or less. In other words, if the electrical conductivity of the alloy ingot obtained from the copper alloy having the above composition after the solution heat treatment can be 15.0% IACS or less, the coarse grain boundary precipitates are sufficiently dissolved, and then By aging treatment to 1000 rpm, fine dispersed precipitates of intermetallic compounds of Co and Ni can be obtained, and the solid solution of Cr can be maintained, so that a copper alloy having excellent mechanical strength and conductivity can be obtained.
以上のような、時効硬化型銅合金であれば、ＮｉやＣｏの含有量を多くしたにも関わらず溶体化熱処理後に粗大な粒界析出物を十分固溶させることができる。そして、その後に時効処理することによって、機械強度及び導電性に優れる銅合金を得ることができる。 With the age-hardening copper alloy as described above, coarse grain boundary precipitates can be fully dissolved after the solution heat treatment despite the fact that the Ni and Co contents are increased. A copper alloy having excellent mechanical strength and electrical conductivity can be obtained by performing an aging treatment thereafter.
次に、上記した時効硬化型銅合金を試作した結果について説明する。 Next, the results of trial production of the age-hardening copper alloy described above will be described.
図１の実施例１、実施例２、比較例１及び比較例２のそれぞれに示す成分組成の銅合金を鋳造し、９２０℃で１時間保持後し水冷する溶体化熱処理をして、４７０℃で２．７５時間保持し炉冷する時効処理をした。造塊後（鋳造後）、溶体化熱処理後（溶体化後）、時効処理後（時効後）のそれぞれにおいて組織観察、硬さ測定、導電率の測定を行った。なお、実施例１、実施例２、比較例１、比較例２の順に、Ｃｏの含有量が多くなり、逆にＮｉの含有量が少なくなっている。 Copper alloys having the chemical compositions shown in Examples 1, 2, Comparative Examples 1 and 2 in FIG. was held for 2.75 hours and then cooled in a furnace for aging treatment. After ingot making (after casting), after solution heat treatment (after solution treatment), and after aging treatment (after aging), structure observation, hardness measurement, and conductivity measurement were performed. In addition, the content of Co increases in the order of Example 1, Example 2, Comparative Example 1, and Comparative Example 2, and the content of Ni decreases.
図２に硬さと導電率の測定結果を示した。なお、硬さはＨＲＢで測定したが、実施例１及び実施例２の時効処理後の硬さについてはＨＲＣで測定した。時効処理後の硬さについてＨＲＢ又はＨＲＣのうち、測定していない単位については換算値を括弧書きで示した。 FIG. 2 shows the measurement results of hardness and conductivity. The hardness was measured by HRB, but the hardness after aging treatment in Examples 1 and 2 was measured by HRC. Regarding the hardness after aging treatment, conversion values are shown in parentheses for units of HRB or HRC that are not measured.
硬さについては、いずれの実施例、比較例でも、鋳造後から溶体化熱処理後にかけて同等か又はやや低くなるが、時効処理後に高くなっていることが判る。しかし、比較例１及び２は実施例１及び２に比べて硬さの値が小さい。時効処理後の硬さの値は、最小の比較例２から、比較例１、実施例２、実施例１の順に大きくなっており、これはＣｏの含有量の少なくなる順に沿っている。つまり、Ｃｏの含有は、導電率の向上に有効であるが、Ｎｉに対する含有量を多くし過ぎると硬さを低下させてしまうと言える。 It can be seen that the hardness is the same or slightly lower after casting and after solution heat treatment in any of the examples and comparative examples, but increases after aging treatment. However, Comparative Examples 1 and 2 have lower hardness values than Examples 1 and 2. The hardness value after the aging treatment increases in the order of comparative example 2, comparative example 1, example 2, and example 1, and this is along the order of decreasing Co content. In other words, it can be said that the content of Co is effective for improving electrical conductivity, but if the content is too large relative to Ni, the hardness is lowered.
導電率については、いずれの実施例、比較例でも、鋳造後から溶体化熱処理後にかけて低くなっており、その後時効処理によって鋳造後よりも高くなっていることが判る。さらに詳細には、比較例１や比較例２に比べて、実施例１や実施例２のように溶体化熱処理後の導電率をより低くするほうが、時効処理後（時効後）の導電率を高くしている。つまり、ＮｉやＣｏを多く含有することで鋳造後に金属間化合物の粗大な粒界析出物を生成してしまうが、溶体化熱処理によってこれを十分固溶できると溶体化熱処理後の導電率をより低くでき、十分に固溶された金属間化合物を時効処理によって微細に析出させることで導電率をより高くできるのである。 It can be seen that the electrical conductivity decreases after casting and after solution heat treatment in all of the examples and comparative examples, and then increases due to the aging treatment after casting. More specifically, compared to Comparative Examples 1 and 2, lowering the conductivity after the solution heat treatment as in Example 1 and Example 2 increases the conductivity after the aging treatment (after aging). Raise. In other words, when Ni and Co are contained in a large amount, coarse grain boundary precipitates of intermetallic compounds are generated after casting, but if this can be sufficiently dissolved by solution heat treatment, the conductivity after solution heat treatment can be improved. The electrical conductivity can be made higher by finely precipitating the intermetallic compound that has been dissolved sufficiently by the aging treatment.
図３において、実施例１及び比較例１の鋳造後の断面組織写真を例示する。同図に示すように、鋳造後においては、いずれの実施例及び比較例においても粗大な析出物が観察される。 In FIG. 3, photographs of cross-sectional structures after casting of Example 1 and Comparative Example 1 are illustrated. As shown in the figure, after casting, coarse precipitates are observed in all the examples and comparative examples.
図４に示すように、固溶化熱処理後において、実施例１では粗大な粒界析出物がほとんど消失しているのに対し、比較例１では粗大な粒界析出物が残存している。図示を省略した実施例２でも粗大な粒界析出物はほとんど消失しており、比較例２では粗大な粒界析出物が残存していた。 As shown in FIG. 4, in Example 1, the coarse grain boundary precipitates almost disappeared after the solution heat treatment, whereas in Comparative Example 1, coarse grain boundary precipitates remained. In Example 2 (not shown), most of the coarse grain boundary precipitates disappeared, and in Comparative Example 2, coarse grain boundary precipitates remained.
さらに、図５に示すように、時効処理後において、実施例１では微細な析出物が分散して析出したのに対し、比較例１においては微細な析出物は観察されるものの、その分布に偏りがある。図示を省略した実施例２でも析出物は分散して析出し、比較例２では析出物の分布に偏りがあった。 Furthermore, as shown in FIG. 5, after the aging treatment, fine precipitates were dispersed and precipitated in Example 1, whereas fine precipitates were observed in Comparative Example 1. biased. In Example 2 (not shown), precipitates were dispersed and precipitated, and in Comparative Example 2, the distribution of precipitates was uneven.
以上のように、本実施例及び比較程のうち、実施例１及び実施例２において、時効処理によって（Ｎｉ，Ｃｏ）－Ｓｉからなる金属間化合物粒子を分散させて２０ＨＲＣ以上の硬さ且つ２５．０％ＩＡＣＳ以上の導電率に調製できた。すなわち、機械強度及び導電性に優れる銅合金を得ることができた。 As described above, among the present examples and comparative examples, in Examples 1 and 2, intermetallic compound particles composed of (Ni, Co)-Si were dispersed by aging treatment to obtain a hardness of 20 HRC or more and a hardness of 25 HRC. A conductivity of 0% IACS or higher could be prepared. That is, a copper alloy having excellent mechanical strength and electrical conductivity could be obtained.
なお、実施例１、２、及び、比較例１、２、その他いくつかの製造例より、Ｎｉの含有量に対して融点の高いＣｏの含有量を多くすることで、造塊時における粗大な粒界析出物を抑制できる傾向にあることが判った。他方、Ｎｉに対してＣｏの含有量が多いと、溶体化熱処理によって粗大な粒界析出物を十分に固溶できない傾向にあることが判った。このような観点から、上記した機械強度及び導電性に優れる銅合金を得るために、Ｃｏ及びＮｉの含有量は、それぞれ３．５％以下及び３．０％以上とする。 In addition, from Examples 1 and 2, Comparative Examples 1 and 2, and some other production examples, by increasing the content of Co, which has a high melting point, relative to the content of Ni, coarse grains during ingot making It was found that grain boundary precipitates tend to be suppressed. On the other hand, it was found that when the content of Co is large relative to Ni, there is a tendency that coarse grain boundary precipitates cannot be dissolved sufficiently by solution heat treatment. From this point of view, the contents of Co and Ni are set to 3.5% or less and 3.0% or more, respectively, in order to obtain a copper alloy having excellent mechanical strength and electrical conductivity.
以上、本発明による実施例及びこれに基づく変形例を説明したが、本発明は必ずしもこれらに限定されるものではなく、当業者であれば、本発明の主旨又は添付した特許請求の範囲を逸脱することなく、様々な代替実施例及び改変例を見出すことができるであろう。 Although the embodiments according to the present invention and modifications based thereon have been described above, the present invention is not necessarily limited to these, and a person skilled in the art can deviate from the gist of the present invention or the scope of the appended claims. Various alternatives and modifications may be found without further ado.
Claims (3)
Ｃｏ：１．０％～３．５％、
Ｃｒ：０．２％～１．３％で含み、
元素Ｍの含有量を［Ｍ］質量％とするとき、
［Ｎｉ］＋［Ｃｏ］＝５．０～９．０となるようにＮｉを含有するとともに、
（［Ｎｉ］＋［Ｃｏ］）／［Ｓｉ］＝３．３～４．４となるようにＳｉを含有し、残部をＣｕ及び不可避的不純物とする合金組成を有し、（Ｎｉ，Ｃｏ）－Ｓｉからなる金属間化合物粒子を分散させるように時効熱処理して２０ＨＲＣ以上の硬さ且つ２５．０％ＩＡＣＳ以上の導電率に調製されて用いられ得る時効硬化型銅合金であって、
導電率を１５．０％ＩＡＣＳ以下とするとともに切断面の硬さを５５ＨＲＢ以上とすることを特徴とする時効硬化型銅合金。 in % by mass,
Co: 1.0% to 3.5%,
Cr: 0.2% to 1.3%,
When the content of element M is [M] mass%,
Contains Ni such that [Ni] + [Co] = 5.0 to 9.0,
An alloy composition containing Si such that ([Ni] + [Co]) / [Si] = 3.3 to 4.4, and the balance being Cu and inevitable impurities, (Ni, Co) - An age-hardening copper alloy that can be used by being prepared to have a hardness of 20 HRC or more and a conductivity of 25.0% IACS or more by aging heat treatment so as to disperse intermetallic compound particles made of Si,
An age-hardening copper alloy characterized by having an electrical conductivity of 15.0% IACS or less and a cut surface hardness of 55 HRB or more.
The alloy composition further contains at least one selected from the group consisting of Al, Fe, Mn, Ag, Sn, Ti, Zr, P, Mg, B, S, Nb and Zn in a total amount of 1.0% by mass or less. 3. The age-hardenable copper alloy of claim 1 or 2, comprising:
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