JP7188217B2 - Manufacturing method of cathode plate for metal electrodeposition - Google Patents

Description

The present invention relates to a method for manufacturing a cathode plate for metal electrodeposition.

Conventionally, electrolytic nickel, which is supplied as an anode raw material for nickel plating, is placed in a titanium basket serving as an anode holder and suspended in a nickel plating tank for use. At this time, as the electrolytic nickel as the raw material for the anode, a plate-like electrolytic nickel electrodeposited on the cathode plate was cut into small pieces to be used.

However, since the small pieces of electrolytic nickel have sharp corners, it is difficult to handle when putting them into the titanium basket. In addition, after the small pieces of electrolytic nickel are thrown into the titanium basket, the corners thereof are caught in the mesh of the titanium basket, causing so-called shelf hanging, which changes the state of filling in the titanium basket and causes uneven plating. It happened to be.

Therefore, it has been proposed to use electrolytic nickel in the form of small lumps (buttons) with rounded corners. Electrolytic nickel in the form of small lumps is obtained, for example, by using a cathode plate in which a plurality of circular conductive portions are arranged at equal intervals, nickel is deposited on the conductive portions by electrolysis, and then nickel is electrodeposited from the conductive portions. can be manufactured by stripping off the According to such a method, it is possible to efficiently produce a plurality of small lumps of electrolytic nickel from a single cathode plate.

FIG. 4 is a diagram showing an example of a conventional cathode plate used for producing nodular electrolytic nickel. The cathode plate 11 is formed by masking a flat metal plate 12 with a non-conductive film 13 while leaving portions to be the conductive portions 12a. The film 13 is a convex portion. By using such a cathode plate 11, nickel of a suitable size is electrodeposited on the conductive portion 12a to produce electrolytic nickel in the form of small lumps.

As a method of forming the non-conductive film 13 on the metal plate 12 like the cathode plate 11, for example, as shown in FIG. There is a method of forming a non-conductive film 13 having a desired pattern by applying a non-conductive resin having a specific property by a screen printing method and heating it (see Patent Documents 1 and 2). FIG. 5(b) shows a state in which nickel (electronic nickel) 14 is electrodeposited on the conductive portion 12a using the cathode plate 11 on which the non-conductive film 13 is formed. On the cathode plate 11 , the nickel 14 begins to be electrodeposited from the conductive portion 12 a, grows not only in the thickness (vertical) direction but also in the plane (horizontal) direction. Become.

Alternatively, for example, as shown in FIG. 6A, a photosensitive non-conductive resin is applied onto the metal plate 22, and the non-conductive resin is removed from the portions corresponding to the conductive portions 22a by exposure and development. , a method of forming a non-conductive film 23 having a desired pattern has also been proposed. FIG. 6(b) shows a state in which nickel (electronic nickel) 24 is electrodeposited on the conductive portion 22a using the cathode plate 21 on which the non-conductive film 23 is formed. In the cathode plate 21 as well, the nickel 24 begins to be electrodeposited from the conductive portion 22a and grows not only in the thickness direction but also in the planar direction.

Furthermore, a cathode plate that constitutes a non-conductive portion is formed by using an injection molding method to solidify the periphery of a metal structure in which a plurality of studs serving as conductive portions are arranged at equal intervals with an insulating resin. A manufacturing method has also been proposed (see Patent Document 3).

Japanese Patent Publication No. 51-036693 JP-A-52-152832 Japanese Patent Publication No. 56-029960

When producing small lumps of electrolytic nickel using the cathode plate as described above, the life of the non-conductive film (non-conductive part) formed on the cathode plate is long, and if the non-conductive film is missing (deteriorated) However, it is required to be easily maintainable.

As shown in FIG. 5A, when the non-conductive resin is applied to the metal plate 12 by screen printing to form the non-conductive film 13, the film thickness of the non-conductive film 13 decreases as it approaches the conductive portion 12a. Therefore, it gradually becomes thinner. Changes in the film thickness of the non-conductive film 13 include the coating amount of the non-conductive resin, the viscosity of the non-conductive resin, the temperature characteristics of the viscosity, the curing temperature of the non-conductive resin, and the surface roughness of the metal surface. It depends on the surface free energy and the like. Therefore, the film thickness of the non-conductive film 13 becomes extremely thin at the boundary with the conductive portion 12a.

As described above, when the conventional cathode plate 11 as shown in FIGS. 4 and 5 is used to produce small lumps of electrolytic nickel, the nickel 14 begins to be electrodeposited from the conductive portions 12a, and not only in the vertical direction but also in the horizontal direction. grow in both directions. As a result, the nickel 14 gradually rises on the non-conductive film 13 as well. Therefore, in the vicinity of the boundary between the non-conductive film 13 and the conductive portion 12a where the non-conductive film 13 is thin, penetration of the electrolytic solution tends to reduce the adhesion between the non-conductive film 13 and the metal plate 12, and the nickel 14 becomes electrically conductive. The non-conductive film 13 is likely to be chipped off due to the stress at the time of deposition, the impact at the time of stripping off the electrolytic nickel, or the like. Also, once the non-conductive film 13 is chipped off, the non-conductive film 13 around it floats up from the surface of the metal plate 12, making it easier for the electrolyte to enter the gap. As a result, when it is attempted to continue to electrodeposit nickel, the electrolyte penetrates into the gaps of the non-conductive film 13 which is lifted from the surface of the metal plate 12, and nickel 14 is electrodeposited. Then, when an attempt is made to slip into the gap and strip off the electrodeposited nickel 14, the non-conductive film 13 in which the nickel 14 is caught is further removed.

As described above, in the conventional cathode plate 11, the missing portions of the non-conductive film 13 occur in a chain reaction. It is not possible to obtain electrolytic nickel in the shape of , resulting in a defective product. Therefore, it is necessary to strip off all of the non-conductive film 13, form the non-conductive film 3 again, and maintain the cathode plate 11 before the non-conductive film 13 becomes missing. However, in practice, it becomes necessary to maintain the cathode plate 11 after nickel electrodeposition has been performed several times or less than ten times at most, which not only lowers productivity but also increases maintenance costs. increase.

On the other hand, as shown in FIG. 6(a), in the cathode plate 21 on which the non-conductive film 23 is formed by exposure and development using a photosensitive non-conductive resin, the non-conductive film 23 is formed with a uniform thickness. can do. However, when the nickel 24 is stripped off after electrodeposition, the nickel 24 is caught on the steps of the non-conductive film 23 forming the projections, and a large impact is likely to be applied to the non-conductive film 23 . will be missing.

In addition, in the method of forming the non-conductive portion by injection molding as in Patent Document 3, although the life of the formed non-conductive portion is prolonged, the manufacturing cost of the cathode plate itself increases, and the non-conductive portion deteriorates. Maintenance of the cathode plate in the case is difficult.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a negative electrode plate for metal electrodeposition, which can be used repeatedly and in which the non-conductive film on the metal plate is less likely to come off.

The present inventors have made extensive studies to solve the problems described above. As a result, by providing a protrusion on the metal plate as a conductive part and applying resin to the part other than the protrusion on the surface of the metal plate with a dispenser to provide a non-conductive film, it is possible to prevent the non-conductive film from falling off easily. The inventors have found that it is possible to manufacture a cathode plate for electrodeposition, and have completed the present invention.

(1) A method for manufacturing a cathode plate for metal electrodeposition, comprising the steps of: forming a plurality of disk-shaped projections on at least one surface of a metal plate; and forming a non-conductive film in the step of forming the non-conductive film, wherein the resin for forming the non-conductive film is applied by a dispenser. .

(2) The method for producing a cathode plate for metal electrodeposition according to (1), wherein the protrusion has a height of 50 μm or more and 1000 μm or less.

(3) The method for producing a cathode plate for metal electrodeposition according to (1) or (2), wherein the non-conductive film is a thermosetting resin.

(4) After the thermosetting resin is applied to the metal plate, a temporary heat retention process is performed to maintain the temperature in a temperature range of 30 ° C. or more and 20 ° C. or more lower than the curing temperature of the thermosetting resin. The method for producing a cathode plate for metal electrodeposition according to (3), wherein after spreading over the entire non-conductive film formation region, the temperature is raised to a temperature equal to or higher than the curing temperature for curing.

According to the present invention, it is possible to provide a negative electrode plate for metal electrodeposition, in which the non-conductive film is less likely to fall off and which can be used repeatedly.

1 is a plan view showing the configuration of a cathode plate for metal electrodeposition according to the present invention; FIG. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an enlarged cross-sectional view of a main part showing the structure of a cathode plate for metal electrodeposition according to the present invention, wherein (a) is an enlarged cross-sectional view of a main part explaining the state of the cathode plate before nickel electrodeposition, and (b) is an enlarged cross-sectional view of the main part; FIG. 4 is an enlarged cross-sectional view of a main part for explaining the state of a cathode plate after nickel electrodeposition; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an enlarged cross-sectional view of a main part for explaining a method of manufacturing a cathode plate for metal electrodeposition according to the present invention, wherein (a) is an enlarged cross-sectional view of a main part for explaining the first step, and (b) is for explaining the second step; FIG. 2 is an enlarged cross-sectional view of a main part. FIG. 3 is a plan view showing the configuration of a conventional cathode plate for metal electrodeposition. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an enlarged cross-sectional view of a main part showing the structure of a conventional cathode plate for metal electrodeposition, wherein (a) is an enlarged cross-sectional view of the main part explaining the state of the cathode plate before nickel electrodeposition, and (b) is a nickel electrodeposition; FIG. 4 is an enlarged cross-sectional view of a main part for explaining the state of the cathode plate after attachment; FIG. 3 is an enlarged cross-sectional view of a main part showing another configuration of a conventional cathode plate for metal electrodeposition, where (a) is an enlarged cross-sectional view of a main part explaining the state of the cathode plate before nickel electrodeposition, and (b) is an enlarged cross-sectional view of the main part; FIG. 4 is an enlarged cross-sectional view of a main part for explaining the state of a cathode plate after nickel electrodeposition;

The method for producing a cathode plate for metal electrodeposition according to the present invention will now be described in detail. In addition, the present invention is not limited to the following embodiments, and can be changed as appropriate without changing the gist of the present invention.

<Cathode plate for metal electrodeposition>
[overall structure]
The cathode plate 1 that can be manufactured by the manufacturing method of the present invention comprises, as shown in FIG. It has a non-conductive film 3 formed in a portion other than that. As will be described later, the cathode plate 1 is used by being suspended by a suspension member 5 in an electrolytic cell containing, for example, a nickel-containing electrolytic solution or an anode. Let

[Metal plate]
As shown in FIGS. 1 and 2(a), the metal plate 2 is a flat metal plate and has a plurality of disk-shaped protrusions 2a. Here, the portion of the surface of the metal plate 2 other than the protruding portion 2a is referred to as a "flat portion 2b" with respect to the protruding portion 2a. Also, the height X of the disk-shaped projection is the height of projection from the surface of the flat portion 2b of the metal plate 2. As shown in FIG.

Although FIG. 2 shows an example in which one surface of the metal plate 2 has the projections 2a, both surfaces may have the projections 2a.

The size of the metal plate 2 is not particularly limited, and may be appropriately set according to the desired size and number of electrolytic nickel to be produced. For example, it can have a rectangular size with one side of 100 mm or more and 2000 mm or less. The thickness of the metal plate 2 is preferably about 1.5 mm or more and 5 mm or less when the protrusions 2a are provided on one surface. is preferably, for example, about 3 mm or more and 10 mm or less. If the thickness of the metal plate 2 is too small, there is a tendency that warping is likely to occur due to the protrusions 2a and the flat portions 2b. On the other hand, if the thickness of the metal plate 2 is too large, the weight of the metal plate 2 increases, making it difficult to handle.

The material of the metal plate 2 is not particularly limited as long as it is less corroded by the electrolyte used and forms only loose adhesion with electrodeposits such as nickel, but titanium and stainless steel are preferable.

In the metal plate 2, the plurality of disk-shaped protrusions 2a are exposed from the non-conductive film 3 described later and function as conductive portions, and the non-conductive film 3 is formed with a predetermined thickness. Therefore, adjacent protrusions 2a form a recessed step. Hereinafter, the surface of the protrusion 2a exposed from the non-conductive film 3 may be referred to as the "conductive portion 2c". In the conductive portion 2c, nickel 4 is electrodeposited by electrolytic treatment.

The size of the disk-shaped protrusion 2a may be appropriately set according to the desired size of electrolytic nickel, and the diameter thereof may be, for example, 5 mm or more and 30 mm or less. Moreover, the height X of the protrusion 2a is preferably 50 μm or more and 1000 μm or less, and more preferably 200 μm or more and 800 μm or less. If the height X of the protruding portion 2a is too small, the thickness of the non-conductive film 3 formed on the flat portion 2b of the metal plate 2 will be insufficient, resulting in stress during the electrodeposition of the nickel 4 and the electric nickel. It becomes easy to fall off due to the impact at the time of stripping.

On the other hand, if the height X of the protrusion 2a is too large, the metal plate 2 is likely to be distorted during processing of the protrusion 2a, and the metal plate 2 is likely to warp, making it difficult to form the non-conductive film 3. . Although it is possible to increase the thickness of the metal plate 2 in order to reduce the influence of distortion of the metal plate 2, the weight of the metal plate 2 increases and handling becomes difficult.

Further, the surface of the metal plate 2, that is, the surface of the disk-shaped protrusion 2a of the metal plate 2 may be provided with fine irregularities by sandblasting or etching. As a result, the nickel 4 electrodeposited on the protruding portion 2a does not come off during the electrolytic treatment, and can be stripped off with a moderate impact. In this case, the film thickness of the non-conductive film 3 to be described later is preferably at least twice the maximum surface roughness Rz of the metal plate 2 . If the film thickness of the non-conductive film 3 is less than twice the maximum surface roughness Rz of the metal plate 2, there is concern that pinholes or insulation defects may occur in the non-conductive film 3 .

[Non-conductive film]
As shown in FIG. 2, the non-conductive film 3 is formed on the flat portion 2b on the surface of the metal plate 2 other than the protruding portion 2a. As a result, the surfaces of the plurality of protrusions 2a arranged on the metal plate 2, that is, the conductive portions 2c are exposed. Then, the nickel 4 is electrodeposited on the conductive portion 2c of the metal plate 2, so that the nickel 4 is individually divided into small blocks.

Here, in the cathode plate 1, since the non-conductive film 3 is formed on the flat portion 2b having a recessed step formed by the adjacent projections 2a, it is formed with a predetermined thickness. Become.

The non-conductive film 3 is formed on the flat portion 2b having a recessed step formed by the adjacent projections 2a. Therefore, unlike the conventional non-conductive film 13 shown in FIG. It becomes hard to be missing even by. Moreover, the non-conductive film 3 does not protrude like the conventional non-conductive film 23 shown in FIG. 6, and its end is protected by a recessed step. Therefore, even when the nickel 4 is peeled off from the cathode plate 1, the impact given by the nickel 4 to the end portion of the non-conductive film 3 is small, and the non-conductive film 3 is less likely to come off. Thus, in the cathode plate 1, since the non-conductive film 3 is less likely to fall off, it is possible to repeatedly use it for electrodeposition without replacing the non-conductive film 3, which reduces maintenance costs and increases productivity. can be improved.

The non-conductive material forming the non-conductive film 3 is preferably a thermosetting resin. Specifically, insulating resins such as epoxy-based resins, phenol-based resins, polyamide-based resins, and polyimide-based resins can be used.

[Production of Electrolytic Nickel Using Cathode Plate for Metal Electrodeposition]
In the cathode plate 1 configured as described above, as shown in FIG. 2(b), the surfaces of the protrusions 2a exposed from the non-conductive film 3 serve as the conductive portions 2c, and the nickel 4 is electrodeposited. In the cathode plate 1 , the nickel 4 grows not only in the thickness direction but also in the plane direction, so that it rises above the non-conductive film 3 . For this reason, it is preferable to finish the electrodeposition before the nickel 4 grown from the conductive portions 2c on the surfaces of the adjacent projections 2a come into contact with each other.

After the electrodeposition of nickel is finished, the nickel 4 is stripped from the cathode plate 1 , thereby obtaining a plurality of small lumps of electrolytic nickel from one cathode plate 1 . As described above, in the cathode plate 1, since the non-conductive film 3 is less likely to break off, it can be used repeatedly without replacing the non-conductive film 3, thereby reducing maintenance costs and improving productivity. can be done.

Although the cathode plate 1 is electrodeposited with nickel 4, it is not limited to nickel, and may be electrodeposited with silver, gold, zinc, tin, chromium, cobalt, or alloys thereof.

<Manufacturing method of cathode plate for metal electrodeposition>
As shown in FIG. 3, the method of manufacturing a cathode plate for metal electrodeposition according to the present invention comprises a first step of forming a plurality of disk-shaped protrusions 2a on at least one surface of a metal plate 2 (see FIG. ) and a second step of forming the non-conductive film 3 on the surface of the metal plate 2 other than the projections 2a (FIG. 3(b)).

[First step]
In the first step, a plurality of disk-shaped protrusions 2a are formed on the surface of the metal plate 2. As shown in FIG. For example, the flat portion 2b is formed by cutting away the portions other than the protrusions 2a from the flat metal plate 2 to leave the protrusions 2a having a height of X. The processing method is not particularly limited, and for example, wet etching processing, end mill processing, laser processing, etc., or a combination of these processing methods can be used.

For example, when a flat stainless steel plate is processed by wet etching, the surface of the stainless steel plate is coated with a photosensitive etching resist, and then exposed through a film or glass on which a desired pattern is drawn, and the portion to be etched. is removed by development processing. Then, the developed stainless steel plate is immersed in an etchant (for example, a ferric chloride solution), a portion of the stainless steel plate from which the etching resist has been removed is removed, and finally the etching resist is peeled off to obtain a desired surface. A plurality of disk-shaped protrusions 2a corresponding to the pattern can be formed.

Incidentally, the protrusions 2 a may be formed only on one surface of the metal plate 2 or may be formed on both surfaces of the metal plate 2 .

[Second step]
In the second step, the non-conductive film 3 is formed on the flat portion 2b on the surface of the metal plate 2 other than the disk-shaped protrusion 2a. The non-conductive film 3 is formed by applying a thermosetting resin using a dispenser 5 (see FIG. 3(b)). In addition, in the present invention, various known dispensers capable of supplying a fixed amount of liquid material can be appropriately selected and used.

When the thermosetting resin is applied by the dispenser 5, the amount of application is controlled by the temperature, the air pressure for projection, the diameter of the nozzle, the moving speed of the syringe, the number of times of application, and the like.

In addition, regarding the application of the thermosetting resin, after applying a predetermined amount of resin, the temperature of the thermosetting resin is set to 30 ° C. or more, and in an appropriate temperature range that is 20 ° C. or more lower than the heat curing temperature. It is preferable to go through a temporary heat retention procedure to hold. Specifically, the thermosetting resin may be applied while the metal plate 2 is heated to a temperature within the above range.

By reducing the viscosity of the thermosetting resin by the above-described temporary heat retention procedure, even if the resin cannot be completely applied to the outer edge portion of the disk-shaped protrusion 2a, the resin can be applied as a non-conductive film. It can be poured evenly over the entire formation area. In addition, by forming the non-conductive film 3 through such a procedure, it is possible to form a non-conductive film having a uniform thickness all the way through, even if it is not necessarily applied accurately to the portion at the edge of the disk-shaped protrusion 2a. A conductive film 3 can be formed.

If the resin has a low viscosity even at room temperature, the thermosetting resin can be poured even if the temperature of the metal plate 2 is less than 30°C, but it is easier to manage if the temperature is 30°C or higher.

In addition, thermosetting resins may start curing when the curing temperature is approached, even if the temperature of the curing condition has not been reached completely. Once curing begins, the viscosity increases, making it impossible to pour the resin into the gaps. It is desirable to appropriately set the holding temperature and holding time depending on the thermosetting resin to be used. A similar effect can also be obtained by slowing the temperature rise by reducing the rate of temperature rise. In this case, the heating time in a certain temperature range may be considered as the holding time.

According to the manufacturing method of the cathode plate of the present invention, it is possible to obtain the cathode plate 1 which can be used repeatedly without causing the non-conductive film on the metal plate to come off easily by the above-described simple method.

EXAMPLES The present invention will be described in more detail below with reference to Examples. However, the present invention is by no means limited by these examples. For convenience, members having the same functions as the members shown in FIGS. 1 to 6 are denoted by the same reference numerals. In the following examples and comparative examples, the manufacturing method of the cathode plate was different, and electrolytic nickel was manufactured under the same conditions except for the manufacturing method of each cathode plate, and evaluated by the same method.

<Preparation of cathode plate for metal electrodeposition>
[Example 1]
A cathode plate 1 as shown in FIGS. 1 and 2 was produced. Specifically, first, a stainless steel metal plate 2 having a size of 200 mm×100 mm×4 mm was subjected to wet etching to form disk-shaped protrusions 2a (18 pieces). At this time, the disk-shaped protrusion 2a had a diameter of 14 mm and a height X of 300 μm.

Next, a thermosetting resin (curing start temperature: 115° C. to 120° C.) having an epoxy resin as a base resin is applied by a dispenser onto the flat portion 2b of the metal plate 2, held at 80° C. for 40 minutes, and then held at 80° C. for 40 minutes. The non-conductive film 3 was formed by curing by heating at 60° C. for 60 minutes.

[Example 2]
A cathode plate 1 was produced under the same conditions as in Example 1, except that the height X of the disk-shaped protrusion 2a of the metal plate 2 was set to 1000 μm.

[Example 3]
The same type of thermosetting resin as that used in Example 1 was applied with a dispenser onto the flat portion 2b of the metal plate 2 and held at 60 ° C. for 60 minutes. A cathode plate 1 was produced under the same conditions as in Example 1.

[Example 4]
The same type of thermosetting resin as used in Example 1 was applied with a dispenser onto the flat portion 2b of the metal plate 2, and then immediately cured by heating at 150° C. for 60 minutes. A cathode plate 1 was produced under the same conditions.

[Comparative Example 1]
In Comparative Example 1, a conventional cathode plate 11 as shown in FIGS. 5 and 6 was produced. Specifically, the flat metal plate 12 made of stainless steel of 200 mm × 100 mm × 4 mm was screen-printed, leaving 18 conductive portions 12 a having a diameter of 14 mm, which was used in Example 1. Epoxy resin of the same kind as in the above was applied and hardened by heating at 150° C. for 60 minutes to form a non-conductive film 13, and a cathode plate 11 was produced. Incidentally, in the cathode plate 11 of Comparative Example 1, the film thickness of the non-conductive film 13 was measured at arbitrary 10 points with a laser displacement meter and found to be in the range of 90 to 110 μm.

<Production of electrolytic nickel>
Electrolytic nickel was produced by electrolytic treatment using each cathode plate produced in each example and comparative example, each having different production conditions. Specifically, a cathode plate and an anode plate made of electrolytic nickel of 200 mm×100 mm×10 mm were immersed so as to face each other in an electrolytic bath containing a nickel chloride electrolyte. Then, nickel was electrodeposited on the surface of the cathode plate under conditions of an initial current density of 710 A/m ² and an electrolysis time of 3 days. After the electrolysis, the electrolytic nickel deposited on the cathode plate was stripped off to obtain small blocks of electrolytic nickel for plating.

<Evaluation>
The number of times the cathode plate used for electrolytic treatment can be used repeatedly was evaluated. If the lack of the non-conductive film spreads, the nickel electrodeposited on the adjacent protrusions and conductive portions may be connected to each other, failing to obtain the desired shape of electrolytic nickel. Therefore, when the non-conductive film was chipped over 1 mm or more in the direction of the flat portion from the boundary with the disc-shaped protrusion, the use was stopped and the number of repetitions up to that point was evaluated. Also, when the non-conductive film was missing and the diameter of the conductive portion expanded by 1 mm or more, the use was stopped, and the number of repetitions up to this point was evaluated. Table 1 below shows the evaluation results together with the structure of the cathode plate.

As shown in Table 1, in Examples 1 to 4 in which the thermosetting resin was applied with a dispenser, the lack of the non-conductive film 3 was sufficiently suppressed, and Comparative Example 1 in which the same resin was applied by screen printing. In contrast, it was confirmed that a clear superiority was expressed in the number of times of repeated use.

In addition, as shown in the remarks column of Table 1, after the thermosetting resin is applied to the metal plate, a process of "holding at a temperature range of 30 ° C. or more and 20 ° C. or more lower than the curing temperature of the thermosetting resin" is performed. In Example 4, where this was not carried out, it was confirmed that the masking defect occurred due to the fact that the resin had not completely spread on a part of the cathode plate.

As described above, the cathode plate manufacturing method of the present invention, in which the thermosetting resin is applied with a dispenser, can demonstrate superiority over the conventional manufacturing method, and that in the present invention, after the thermosetting resin is applied, It was confirmed that a more excellent cathode plate can be obtained by passing through the process of holding at a predetermined temperature before heat curing.

REFERENCE SIGNS LIST 1 cathode plate 2 metal plate 2a protrusion 2b flat portion 2c conductive portion 3 non-conductive film 4 nickel 5 dispenser

Claims (3)

A method for manufacturing a cathode plate for metal electrodeposition, comprising:
forming a plurality of disk-shaped protrusions on at least one surface of the metal plate;
and forming a non-conductive film on a surface of the metal plate other than the protrusion,
The resin forming the non-conductive film is a thermosetting resin,
In the step of forming the non-conductive film,
After applying the thermosetting resin to the metal plate with a dispenser , temporary heat retention is performed in a temperature range of 30 ° C. or more and 20 ° C. or more lower than the curing temperature of the thermosetting resin, so that the thermosetting resin is non-conductive. After spreading over the entire film-forming region, the temperature is raised to a temperature equal to or higher than the curing temperature to cure.
A method for manufacturing a cathode plate for metal electrodeposition. In the temporary heat retention process, the temperature of the thermosetting resin is maintained within the temperature range for 40 minutes or longer.
The manufacturing method of the cathode plate for metal electrodeposition according to claim 1. The height of the protrusion is 50 μm or more and 1000 μm or less,
3. The method for producing a cathode plate for metal electrodeposition according to claim 1 or 2 .

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