JP7111348B2 - Screen mask manufacturing method - Google Patents

Description

An embodiment of the present invention relates to a method for manufacturing a screen mask.

The screen printing method, which is one of the printing methods, uses a screen mask in which a predetermined pattern of openings made of a resin composition is formed on a mesh to form an arbitrary printed material on a material to be printed. This screen printing method is used for various printing such as printing of wiring, electrodes, fluorescent materials, etc., and is used in various fields including electronic parts.

In recent years, due to the miniaturization and improvement in quality of electronic components, there is a demand for higher precision screen masks.

For example, a screen mask includes a mesh having holes through which a coating material can pass, and a mask film provided in the mesh and having pattern openings. For example, pattern openings are formed by exposure processing in which a photomask having a predetermined pattern is overlaid after coating an emulsion for forming a mask film on a mesh.

The mesh is constructed by knitting a plurality of mesh wires. For example, when the pattern opening overlaps with the mesh wire, the pattern opening is partially blocked by the mesh material, which changes the print shape, making it difficult to obtain the desired print shape.

JP 2013-169783 A

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a screen mask that enables high-precision printing.

A method for manufacturing a screen mask according to an aspect of the present invention includes irradiating a mask film of a photosensitive material formed in a mesh portion having a transmission portion through which a coating material is transmitted, with an exposure pattern based on predetermined exposure data , maskless exposure processing for forming a predetermined pattern opening in the mask film ; and correcting the exposure data of the maskless exposure processing based on the information of the transmission portion, wherein the correction includes: and the relative position of the transparent portion of the mesh portion .

According to the embodiments of the present invention, it is possible to provide a screen mask manufacturing method capable of forming a high-definition pattern.

1 is an explanatory diagram showing the configuration of a screen printing apparatus according to a first embodiment; FIG. The top view of the screen mask of the same screen printing apparatus. The top view which expands and shows a part of the same screen mask. The top view which expands and shows a part of the same screen mask. Sectional drawing which expands and shows a part of same screen mask. Explanatory drawing of the solar cell pattern-formed using the same screen mask. Explanatory drawing which shows the manufacturing method of the screen mask concerning the same embodiment. Explanatory drawing which shows the manufacturing method of the same screen mask. Explanatory drawing which shows the correction|amendment process in the manufacturing method of the same screen mask. Explanatory drawing which shows the structure of the screen mask concerning other embodiment. Explanatory drawing which shows the structure of the screen mask concerning other embodiment. Explanatory drawing which shows the structure of the screen mask concerning other embodiment. Explanatory drawing which shows the structure of the screen mask concerning other embodiment. Explanatory drawing which shows the structure of the screen mask concerning other embodiment. FIG. 9 is an explanatory diagram showing correction processing in a screen mask manufacturing method according to another embodiment;

A screen printing apparatus 10 and a screen mask 20 according to a first embodiment of the present invention will be described below with reference to FIGS. 1 to 3. FIG. FIG. 1 is an explanatory diagram showing the configuration of a screen printing apparatus 10 according to this embodiment, and FIG. 2 is a plan view of a screen mask 20 of the screen printing apparatus 10. As shown in FIG. 3 to 5 are plan views and cross-sectional views showing enlarged portions of the screen mask 20. FIG. FIG. 6 is a perspective view showing the structure of a solar cell patterned using the screen mask 20. FIG. In addition, in each drawing, for the sake of explanation, the configuration is appropriately enlarged, reduced, or omitted. Arrows X, Y, and Z in the drawing respectively indicate three directions orthogonal to each other, the first direction being the Y direction and the second direction being the X direction.

As shown in FIGS. 1 and 2, the screen printing apparatus 10 includes a screen mask 20 and a holding member 12 that holds a print medium 30 facing one surface (surface) of the screen mask 20 that is the printing surface side. , a squeegee 13 configured to be movable while in contact with the other surface (back surface) of the screen mask 20 opposite to the printing surface side; moving means for moving the squeegee 13; and support means for supporting against the.

The screen printing device 10 forms various printing materials in a predetermined pattern on the surface of the printing medium 30 . Screen printer 10, for example, chip parts (capacitors, chip resistors, inductors, thermistors, etc.), touch panels, liquid crystal substrate (Liquid crystal display, LCD) seals, LTCC (Low Temperature Co-fired ceramics) substrates, for solar cells It is used in the manufacture of electrodes and other electronic components.

The screen mask 20 includes a frame 21 , a mesh portion 22 stretched over the frame 21 , and a mask film 23 of a photosensitive material formed on the mesh portion 22 . In the screen mask 20, the side facing the surface of the printing medium 30 when printing is performed is the front side, and the opposite side to which the coating material is supplied is the back side.

The frame 21 has two pairs of sides parallel to each other, and is configured in the shape of a frame with a rectangular opening of a desired size, for example. The frame 21 supports the outer periphery of the mesh part 22 and stretches the mesh part 22 over the opening.

The frame 21 also functions as a frame that holds a predetermined amount of coating material on the back side of the mask film 23 . The frame 21 and the mesh portion 22 are joined at a joint portion by, for example, a synthetic rubber-based or cyanoacrylate-based adhesive.

The mesh part 22 is a so-called combination type in which an inner main mesh 26 and an outer support mesh 27 having different elongation rates are fixed and connected with a UV curable adhesive. The mesh part 22 holds the mask film 23 in the opening of the frame 21 .

As shown in FIGS. 1 to 5, the main mesh 26 is configured in a square or rectangular shape. The main mesh 26 is a fabric knitted by warp yarns 26a and weft yarns 26b as mesh wire materials, and has a large number of holes 26c, which are permeable parts that are open for the application material to pass through. The warp yarns 26a and the weft yarns 26b of the main mesh 26 are composed of metal wires such as stainless steel and tungsten. The diameter d1 of the warp 26a and the diameter d2 of the weft are 10 to 150 μm, respectively. The warp yarn 26a and the weft yarn 26b have a phase difference of 90°. For example, the warp yarn 26a runs along the X direction and the weft yarn 26b runs along the Y direction. As an example, in this embodiment, d1=d2=φ16 μm, the vertical and horizontal dimensions of the hole 26c are 54.6 μm, and the number of meshes is 360 each.

The support mesh 27 is bonded to the outer circumference of the main mesh 26 with an adhesive. The support mesh 27 is a fabric formed by knitting warp yarns 27a and weft yarns 27b. The support mesh 27 is configured to have a higher elongation rate than the main mesh 26. - 特許庁The warp yarns 27a and the weft yarns 27b of the support mesh 27 are made of synthetic resin such as polyester, for example.

For example, in this embodiment, the elongation rate of the main mesh 26 is smaller than the elongation rate of the support mesh 27 .

The outer shape of the support mesh 27 has a shape corresponding to the shape of the opening of the frame 21, and is a square having the same dimensions in the X direction and the Y direction. The outer periphery of the support mesh 27 is joined to the frame 21 with an adhesive or the like and supported.

The mask film 23 is a layer made of a photocurable resin composition such as PVA, PVAc, silicon resin, acrylic resin, epoxy resin, or the like. The mask film 23 is formed on the mesh portion 22 and arranged in the opening portion of the frame 21 . A predetermined pattern opening 23a for printing is formed in the mask film 23 by maskless exposure.

The pattern opening 23 a is formed within the effective area of the mask film 23 formed on the main mesh 26 . The pattern opening 23a of this embodiment has a shape corresponding to, for example, the pattern shape of the electrode of the solar cell, and includes a plurality of parallel line-shaped finger portions 23b and a line-shaped bus bar portion 23c extending across the finger portions 23b. and are configured in a rectangular shape.

A plurality of finger portions 23b are arranged in the vertical direction, and a plurality of busbar portions are arranged in the horizontal direction. That is, the finger portions 23b and the busbar portions 23c extend in directions along the warp and weft of the main mesh 26, respectively.

As an example, in the present embodiment, the pattern opening 23a has a rectangular shape of 100 mm to 400 mm square, the line width wf1 of the finger portions 23b is 0.015 mm to 0.050 mm, and the pitch Pf1 of the finger portions 23b is 0.5 to 2. .0 mm. The busbar portions 23c have a width dimension Wb1 of 0.1 mm to 2.0 mm and a pitch Pb1 of 15 mm to 60 mm, and three to six busbar portions are arranged in the drawing area. The inclination angle between the finger portions 23b and the warp yarns 26a of the mesh material is set to 0±0.1°, and the inclination angle between the finger portions 23b and the weft yarns 26b of the mesh material is set to 90±5°. The inclination angle between the busbar portion 23c and the warp yarns 26a of the mesh material is set to 90±5°, and the inclination angle between the busbar portion 23c and the weft yarns 26b of the mesh material is set to 0±5°.

A plurality of finger portions 23b are arranged in parallel along the direction of the warp yarns 26a, and are arranged at positions not overlapping the warp yarns 26a, that is, along the alignment of the hole portions 26c between a pair of adjacent warp yarns 26a. The openings are arranged so as not to be blocked by the mesh wire. On the other hand, the busbar portion 23c is arranged along the alignment of the hole portion 26c between a pair of adjacent weft yarns 26b, and is arranged so that the opening is not blocked by the mesh yarn. The finger portions 23b are perpendicular to the weft yarns 26b at 90 degrees, and the busbar portions 23c are perpendicular to the warp yarns 26a at 90 degrees.

The mask film 23 forms a printing portion in which the photosensitive resin does not exist in the pattern openings 23a and the coating material can pass through the holes of the mesh portion 22 from the back surface to the front surface. The portions other than the pattern openings 23a of the mask film 23, where the holes of the mesh portion 22 are closed with the photosensitive resin, form non-printing portions through which the ink as the coating material does not pass.

The mesh portion 22 formed with the mask film 23 is configured to be elastically deformable so as to be elastically deformed by the pressing force of the squeegee 13, for example, and to restore itself when the pressing force is released. While the mask film 23 is held in the pattern openings 23a of the mask film 23, the mask film 23 contacts and separates from the printing medium 30 due to the elastic deformation of the mesh portion 22, whereby the coating material is transferred from the pattern openings 23a to the printing medium 30. be done.

The squeegee 13 is made of a material such as urethane rubber, silicon rubber, synthetic rubber, metal, plastic, or the like, and is formed in a thin plate shape, for example. For example, the squeegee 13 is chamfered to reduce the thickness of the tip. The squeegee 13 is configured to be reciprocally movable relative to the frame 21 . For example, the squeegee 13 is configured to have a length covering the entire region of the mask film 23 in the direction orthogonal to the movement direction. The front end portion 13a of the squeegee 13 is in contact with the back surface of the screen mask 20 and pressed against the front side, and moved in the moving direction along the Y direction, thereby pressing the entire surface of the mask film 23 and filling the coating material in advance. The coating material is extruded to the front side from the pattern openings 23a thus formed.

The support means supports the frame 21 in parallel with the print medium 30 at a predetermined interval. The moving means moves the squeegee 13 along the first direction at a predetermined speed.

Next, a printed matter manufacturing method for manufacturing a printed matter 31 by a screen printing method using the screen printing apparatus 10 according to the present embodiment will be described with reference to FIGS. 1 to 6. FIG. First, the surface side of the screen mask 20 is arranged so as to face the surface of the printing medium 30 held by the holding member 12 .

Then, a high-viscosity paste-like coating material is supplied from the back side of the screen mask 20, ie, the surface opposite to the printing medium 30, to fill the pattern openings 23a with the coating material.

Next, the squeegee 13 is arranged on the back surface of the screen mask 20, that is, the surface opposite to the printing surface side. At this time, for example, the squeegee 13 is arranged at a predetermined angle θ with respect to the front surface of the print medium 30 . Then, the squeegee 13 is moved along the Y direction at a predetermined speed while pressing the squeegee 13 toward the print medium 30 side with a predetermined printing pressure on the back surface of the mesh portion 22 and the mask film 23 .

The squeegee 13 presses the mask film 23 in a region covering the entire back surface of the mask film 23, for example. By pressing the squeegee 13 , the mask film 23 is deformed so that the pressed portion is displaced to the front side and comes into contact with the printing medium 30 . The coating material passed by the squeegee 13 is extruded toward the print medium 30 through the pattern openings 23a.

After the squeegee 13 has passed through, the mask film 23 and the mesh portion 22 are deformed so as to restore and separate from the printing medium 30 , and part of the coating material is transferred onto the printing medium 30 and remains thereon. A pattern is printed thereon, and a printed matter 31 is completed. Note that the coating material is, for example, various materials including metal materials and resin materials, and various materials are used depending on the types of objects to be printed, such as electronic components and displays. For example, the solar cell 100 shown in FIG. 6 is patterned using, for example, a screen mask 20 to form an electrode 123 having a pattern shape corresponding to the pattern openings 23 a of the screen mask 20 . The electrode 123 has linear finger electrodes 123b and busbar electrodes 123c respectively corresponding to the plurality of finger portions 23b and the plurality of busbar portions 23c, which are linear openings in the pattern opening 23a.

During printing, the squeegee 13, which is long in the X direction, is moved in the Y direction by a predetermined amount while being pressed in the Z direction. The mesh portion 22 is deformed and stretched by this movement and pressing.

Next, a method for manufacturing the screen mask 20 according to this embodiment will be described with reference to FIGS. 1 to 9. FIG. 7 and 8 are explanatory diagrams showing the manufacturing method of the screen mask 20, and FIG. 7 shows the configuration of the mesh detection device 60. As shown in FIG. FIG. 8 shows an exposure device. FIG. 9 is an explanatory diagram showing correction processing. The method of manufacturing the screen mask 20 includes mesh data detection processing, emulsion Pm application processing, and exposure processing.

In the method of manufacturing the screen mask 20, first, the mesh base having the mesh portion 22 attached thereto is set in the frame of the frame 21, and the mesh pattern data including information on the position and shape of the mesh wire and the transmission portion is detected by scanning processing. mesh pattern detection processing is performed.

A mesh detection device 60 shown in FIG. 7 includes a support device 61 , a scan head 62 and an LED illumination 63 . The mesh detection device 60 detects mesh pattern data, which is information on the shape and size of the mesh portion 22, and the positions and shapes of the warp yarns 26a, weft yarns 26b, and hole portions 26c of the main mesh 26, as CAD data. The mesh detection device 60 stores mesh data and transmits it to the exposure device 50 .

Next, a coating process is performed to coat the emulsion Pm on the mesh portion 22, and the emulsion Pm is formed on the mesh portion 22 in the form of a flat plate.

The emulsion Pm serving as the mask material is a photocurable resin, such as a liquid including polyvinyl alcohol (PVA), polyvinyl acetate (PVAc), silicon resin, acrylic resin, epoxy resin, and the like.

For example, coating treatment may be repeated multiple times as necessary. In this embodiment, the thickness of the emulsion Pm is set so that the emulsion thickness tm after drying is about 10 μm. In the application process, the mesh may be applied in a horizontal orientation, or may be applied in a vertical orientation.

Next, a so-called maskless exposure apparatus 50 (maskless exposure apparatus) that does not use a photomask performs maskless exposure processing with a predetermined exposure pattern.

FIG. 8 is an explanatory diagram showing the configuration of the exposure device 50. As shown in FIG. As shown in FIG. 8, the exposure apparatus 50 includes a support device 51, an irradiation head 52 having a DMD element, and a control device 57 that controls the operation of each section.

The exposure device 50 is an exposure device that draws a predetermined exposure pattern directly on the screen mask 20 with an irradiation head 52 without intervening a photomask.

The support device 51 includes a stage 51a capable of moving a mesh member having the frame 21 and the mesh portion 22. As shown in FIG. The support device 51 is driven by, for example, the control device 57, and includes a moving mechanism that moves the stage 51a in two directions, for example, the X-axis and the Y-axis. The stage 51a has, for example, a suction mechanism. The moving mechanism relatively moves the irradiation head 52 and the screen mask 20 .

The irradiation head 52 is configured to be able to irradiate lasers of multiple wavelengths. For example, it is driven by the control of the control device 57, and irradiates, for example, two-wavelength (375, 405 nm) lasers singly or in combination.

The irradiation head 52 includes a laser light source 52a that emits laser light, a plurality of DMD elements 52b as irradiation elements that reflect and irradiate light from the laser light source 52a, and a microlens array 52c. Each DMD element 52b is controlled by the controller 57a to be ON/OFF controlled in accordance with a predetermined exposure pattern stored or calculated as CAD data. be irradiated. The laser light is condensed by the microlens array 52c. For example, the DMD element 52b is switched ON/OFF tens of thousands of times per second.

The control device 57 includes a control section 57a that executes a predetermined program, and a storage section 57b that stores various programs and setting values. For example, the storage unit 57b stores drawing data such as exposure patterns, output conditions for exposure processing, and the like.

The control unit 57a drives the irradiation head 52 and the support device 51 based on, for example, a preset program and various data, thereby exposing the mask film 23 with a predetermined exposure pattern and forming the pattern openings 23a. .

Further, the control unit 57a corrects the exposure pattern based on the mesh pattern data including the positional information of the holes 26c. That is, based on the mesh information, the control unit 57a performs correction processing (adjustment processing) on base pattern data, which is CAD data set in advance corresponding to the shape of the pattern opening to be drawn, and performs actual exposure processing. An exposure pattern, which is pattern CAD data, is determined.

In the correction process, the control unit 57a adjusts the positional relationship between the pattern openings 23a and the hole portions 26c of the mesh portion 22 within the target drawing area. For example, the control unit 57a adjusts one or more of the opening width and pitch of the line-shaped openings 23d of the pattern opening 23a, and the inclination angle between the mesh wire 26d and the line-shaped openings 23d.

Specifically, for example, positional adjustment is performed so that the opening of the pattern opening 23a overlaps the position of the hole (transmissive portion) 26c of the mesh. The opening width and pitch of each linear opening 23d are increased or decreased.

As an example, in the correction process shown in FIG. 9, the shape of the pattern opening 23a in the original data is a plurality of finger portions 23b, which are linear openings 23d with a width of 0.03 mm, arranged at intervals of 0.18 mm. is exemplified. As a detection process, the control unit detects the data of the main mesh 26 by scanning, converts the positions of the openings in the mesh, that is, the positions of the transmissive parts into data, and detects the alignment direction and parallel intervals of the transmissive parts. As a correction process, the control unit increases or decreases the arrangement intervals and extension angles of the finger portions 23b in accordance with the arrangement intervals and parallel angles of the transmitting portions.

That is, the control unit tilts the extension direction of the finger portions 23b in accordance with the extension direction of the row of the transmission portions as correction processing. For example, the relative angle between the pattern openings 23a and the mesh portion 22 is adjusted so that the inclination angle with respect to the warp yarns 26a, which are the mesh wires 26d, is in the range of -5 degrees to 5 degrees, preferably 0 degrees.

Further, as an example of adjusting the relative position with respect to the reference position, for example, the center line as the reference position of the finger portion 23b is moved closer to the intermediate position of the pair of warp yarns 26a. Preferably, the center line of the finger portion 23b is superimposed on the middle line of the pair of warp yarns 26a.

Furthermore, by setting the pitch Pf1, which is the interval between the arrangement of the finger portions 23b, to a multiple of the pitch Pm1 of the warp yarns 26a, all the finger portions 23b are arranged so as not to overlap the warp yarns 26a of the main mesh 26. FIG. For example, in the example shown in FIG. 9, the interval is changed from 0.18 mm to 0.22 mm.

As another example of adjusting the relative position with respect to the reference position, in the correction, the center line of the busbar portion 23c is arranged at the intermediate position between the pair of weft yarns 26b so that the opening is not blocked by the mesh yarn. The position of the busbar portion in the exposure pattern is adjusted so that the relationship is established.
Wide patterns, such as busbars, may have relatively large weft and bevel angles. Therefore, when there are linear openings in a plurality of different directions, the angle is adjusted with priority given to the direction of the narrower linear opening.

Here, the correction amount for shifting the position of the linear opening is ±0.05 mm or less. Further, in the present embodiment, for example, the correction amount for shifting the position of the linear opening is preferably equal to or less than the line width. For example, when the width dimension Wf1 of the electrodes and the finger portions 23b is about 0.030 mm and the pitch Pf1 of the arrangement is about 1.4 mm, the correction amount for shifting the positions of the finger portions 23b is 0.03 mm or less. More preferably, the amount of correction for the linear opening may be set to 1/2 or less of the line width. That is, for example, in a #360 mesh with 360 meshes, if the line width of the finger portion 23b and the electrode is 0.071, then ±0.035 or less.

The exposure process is an exposure process for irradiating light from the printing surface side, and by exposing with a predetermined exposure pattern, a predetermined range corresponding to the exposure pattern is cured. Specifically, in a predetermined area, the surface side of the emulsion Pm is placed facing an irradiation head such as an ultraviolet lamp or an ultraviolet LED, and the irradiation head 52 irradiates light to perform an exposure process for illuminating the surface of the emulsion Pm. . As an example, the exposure amount is, for example, about 1000 mJ/cm ² .

The controller 57a irradiates a predetermined exposure area with laser light based on the calculated exposure pattern data. At this time, a predetermined drawing area may be exposed while scanning an area narrower than the drawing area in a plurality of times.

By the exposure process, the portions of the emulsion Pm irradiated with the ultraviolet rays are cured by the ultraviolet rays corresponding to the portions of the exposure pattern.

After the exposure process, as an etching process, the surface side of the emulsion Pm is washed away with water or a solvent. This treatment washes away the unhardened portion of the emulsion Pm. That is, in the layer of the emulsion Pm, all the uncured regions are washed away, and pattern openings 23a penetrating from the front side to the back side in the thickness direction are formed. As described above, the mask film 23 having the pattern opening 23a of a predetermined shape is formed from the emulsion Pm.

According to the screen mask manufacturing method configured as described above, it is possible to prevent the openings from being blocked by the mesh wires 26d by correcting the positions of the pattern openings 23a and the hole portions 26c. Therefore, it is possible to manufacture a screen mask 20 that can obtain a desired print shape. Therefore, for example, in a screen mask for forming electrodes of a solar cell having a large number of finger portions 23b, which are fine line-shaped openings 23d, the pattern shape is not interrupted and the variation in opening width is reduced, so that disconnection and increase in resistance value can be prevented. , can form a stable electrode. By setting the correction amount to 0.05 mm or less, or the line width or less, more preferably 1/2 or less of the line width, in the solar cell electrodes, the performance of the solar cell electrodes can be ensured.

Further, in the above-described embodiment, maskless exposure without using a photomask makes it possible to easily realize correction processing according to the shape of each mesh portion 22 . That is, for example, in the case of pattern formation using a photomask, it is necessary to form a photomask that matches the shape of each mesh. Only by correcting the exposure data of the exposure, correction corresponding to each different mesh shape can be realized, and a screen mask capable of highly accurate pattern formation can be formed.

It should be noted that the present invention is not limited to the above-described embodiments as they are, and can be embodied by modifying constituent elements without departing from the gist of the present invention at the implementation stage.

For example, the shapes of the mesh portion 22 and the pattern openings 23a are not limited to those in the above embodiment, and can be changed as appropriate. For example, FIG. 10 is an explanatory diagram showing correspondence between a plurality of types of mesh portions 22 and pattern openings 23a. In the drawing, φ indicates the wire diameter of the warp 26a and the weft 26b of the mesh portion 22, and OP indicates the opening width of the mesh portion 22, respectively. As shown in FIG. 10, by aligning the angles of the line openings 23d and the warp yarns 26a or the weft yarns 26b and arranging the line openings 23d in the holes 26c between a pair of parallel yarns, the above embodiment and the A similar effect can be obtained.

Moreover, in the above embodiment, the pattern openings 23a forming the electrodes for the photovoltaic cell are illustrated, but the present invention is not limited to this.

As another embodiment, as shown in FIG. 11, in the case of a pattern shape having a plurality of linear openings 23d extending in one direction, both the warp yarns 26a and the weft yarns 26b may be adjusted so that the angles are inclined. good. Even in this case, since each line-shaped opening 23d is not blocked by the mesh wire 26d, the same effect as in the above embodiment can be obtained.

As another embodiment, as shown in FIGS. 12 and 13, in a pattern-shaped pattern opening 23a having line-shaped openings 23d having line-shaped portions bent in different directions, each line-shaped portion is divided into warp 26a and weft 26a. 26b, and by correcting such that the linear openings 23d are arranged between the adjacent mesh wires 26d, the same effects as in the above embodiment can be obtained.

As another embodiment, as shown in FIG. 14, a plurality of square or circular openings 23e and 23f are scattered in a pattern opening 23a. You may correct|amend so that it may be arrange|positioned. Even in this case, since the respective openings 23e and 23f are not blocked by the mesh wire 26d, the same effects as in the above embodiment can be obtained.

Also, in the above-described embodiment, an example of adjusting the angle after adjusting the pitch of the pattern was shown, but the present invention is not limited to this. For example, as shown in FIG. 15, after adjusting the angle of the entire pattern in accordance with the extension angle of the mesh, the position of the linear opening 23d may be shifted and corrected.

Furthermore, in the above embodiment, an example in which a laser light source is used to irradiate a laser beam is shown, but the present invention is not limited to this, and may be configured to include an ultraviolet light source for irradiating ultraviolet light.

In addition, each component exemplified in the above embodiment may be deleted, and the shape, structure, material, etc. of each component may be changed. Various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the above embodiments.
The invention described in the original claims of the present application is added below.
(1)
an exposure process of irradiating a mask film made of a photosensitive material formed in a mesh portion having a transmission portion for transmitting a coating material with light in a predetermined exposure pattern to form a predetermined pattern opening in the mask film;
A method of manufacturing a screen mask, comprising: correcting an exposure pattern of the exposure process based on the information of the transmission portion.
(2)
The exposure processing is maskless exposure,
The screen mask manufacturing method according to (1), wherein in the correction, a relative position between a reference position of the exposure pattern and a transmission portion of the mesh portion is adjusted.
(3)
The mesh part has a plurality of mesh wires arranged in parallel,
The pattern opening has a plurality of line-shaped openings arranged in parallel,
(1) adjusting any one or more of the width of the linear openings, the pitch of the linear openings, and the inclination angle between the mesh wire forming the mesh portion and the linear openings in the correction in the correction; Or the manufacturing method of the screen mask as described in (2).
(4)
The screen mask manufacturing method according to (3), wherein in the correction, the center position of the line-shaped opening and the intermediate position of the plurality of mesh wires are brought close to each other.
(5)
The method of manufacturing a screen mask according to any one of (1) to (4), comprising detecting position information of the transmissive portion of the mesh portion.

DESCRIPTION OF SYMBOLS 10... Screen printing apparatus, 12... Holding member, 13... Squeegee, 13a... Tip part, 20... Screen mask, 21... Frame, 22... Mesh part, 23... Mask film, 23a... Pattern opening, 23b... Finger part, 23c Busbar portion 26 Main mesh 26a Warp 26b Weft 26c Hole (transmissive portion) 27 Support mesh 27a Warp 27b Weft 30 Print medium 31 Printed matter 50 EXPOSURE APPARATUS 51 Support device 51a Stage 52 Irradiation head 52a Laser light source 52b DMD element 52c Microlens array 57 Control device 57a Control unit 57b Storage unit 60 Mesh detection device, 61 ... support device, 62 ... scan head, 63 ... LED illumination.

Claims (4)

Maskless exposure in which a mask film made of a photosensitive material formed in a mesh portion having a transmission portion for transmitting a coating material is irradiated with light in an exposure pattern based on predetermined exposure data to form a predetermined pattern opening in the mask film. processing;
compensating the exposure data of the maskless exposure process based on the information of the transparent portion ;
A method of manufacturing a screen mask, wherein in the correction, a relative position between a reference position of the exposure pattern and the transmission portion of the mesh portion is adjusted . The mesh part has a plurality of mesh wires arranged in parallel,
The pattern opening has a plurality of line-shaped openings arranged in parallel,
2. In the correction, any one or more of an opening width, a pitch of the linear openings, and an inclination angle between the mesh wire forming the mesh portion and the linear openings in the exposure pattern is adjusted. The method for manufacturing the screen mask according to 1. 3. The method of manufacturing a screen mask according to claim 2 , wherein, in said correction, the central position of said line-shaped opening and the intermediate position of said plurality of mesh wires are brought close to each other. 4. The method of manufacturing a screen mask according to any one of claims 1 to 3 , comprising detecting positional information of said transmissive portion of said mesh portion.

Images