JP6927814B2 - Dry polishing equipment - Google Patents

Description

The present invention relates to a dry polishing apparatus for polishing a workpiece such as a wafer.

In the polishing process of semiconductor wafers and the like, the bending strength is improved by polishing the grinding strain remaining on the surface to be ground of the wafer after grinding. Conventionally, a dry polishing device that polishes (dry polishes) a wafer without using a polishing liquid is known as a polishing device (see, for example, Patent Document 1 or Patent Document 2). In such a dry polishing apparatus, a dry polishing pad containing abrasive grains is pressed against the wafer to perform polishing processing.

In the dry polishing process, the polishing debris produced by polishing is dried, so that the polishing debris flies around in the processing chamber where the polishing process is performed. Therefore, the processing chamber is sucked by a dust collector (see, for example, Patent Document 3) to create a negative pressure and an air flow is generated, and the polishing dust is collected by the dust collector.

Japanese Unexamined Patent Publication No. 2002-283212 Japanese Unexamined Patent Publication No. 2012-101321 Japanese Unexamined Patent Publication No. 2004-001118

The processing chamber of the dry polishing apparatus is provided with an exhaust port to which a dust collector is connected and an intake port for taking in air into the processing chamber. The dust collector sucks air in the processing chamber from the exhaust port, removes polishing debris contained in the air with a filter, and then exhausts the air. Therefore, in order to prevent polishing debris from adhering to the filter and reducing the suction force, the dust collector performing suction periodically injects air in the direction opposite to the suction direction and adheres to the filter. It has a function to remove polishing debris and prevent clogging of the filter. However, at the time of reverse injection of this air, the injected air enters the processing chamber from the exhaust port, so that the processing chamber becomes positive pressure and the air in the processing chamber flows back from the intake port to the outside of the processing chamber and is ejected from the intake port. Abrasive debris may be ejected together with the air.

As a method of preventing the ejection of polishing debris from the intake port, there is a method of arranging a door at the intake port. This door keeps the intake port open by the airflow flowing from the intake port into the processing chamber when the dust collector is sucking, and when the dust collector reverse-injects air, the air flow in the processing chamber is eliminated. The air intake can be closed. However, even when the door is arranged at the intake port in this way, the dust collector reversely injects air to clean the filter, so that the airflow from the processing chamber to the dust collector is eliminated and toward the outside of the processing chamber. A backflow that tries to blow out the air in the processing chamber is generated momentarily, and the direction of the airflow may change, causing air containing abrasive debris to blow out from the air intake before the door is closed. ..

Therefore, in the dry polishing apparatus, there is a problem of preventing the polishing debris from being ejected from the intake port provided in the processing chamber to the outside of the processing chamber.

The present invention for solving the above problems includes a holding table for holding a wafer, a polishing means on which a polishing pad containing abrasive grains for polishing the wafer held by the holding table is rotatably mounted, and the holding table. A dry polishing apparatus including a processing chamber for accommodating the polishing pad and the polishing pad, wherein the processing chamber includes a bottom plate having an opening for penetrating the holding table, a side wall erected from the outer periphery of the bottom plate, and A top plate facing the bottom plate and having a second opening connected to the upper end of the side wall and penetrating the polishing pad of the polishing means, and a dust collector that collects polishing debris generated when the polishing pad polishes a wafer. The side wall is provided with an intake port for taking in air into the processing chamber, a punching plate provided with a plurality of fine holes and arranged so as to cover the intake port, and the punching. It is a dry polishing device equipped with a shower unit that supplies water to the plate.

In the dry polishing apparatus according to the present invention, at least two punching plates are arranged so as to cover the intake port with a predetermined gap so that the fine holes of the adjacent punching plates do not overlap. It is preferable that the side wall is displaced in the surface direction.

The dry polishing apparatus according to the present invention includes a processing chamber for accommodating a holding table and a polishing pad. A top plate having a second opening connected to the upper end of the side wall facing and penetrating the polishing pad of the polishing means, and an exhaust port connected to a dust collector that collects polishing dust generated when the polishing pad polishes the wafer. , And the side wall is equipped with an intake port that takes in air into the processing chamber, and is provided with a punching plate that is provided with a plurality of fine holes and is arranged so as to cover the intake port, and a shower portion. When water is supplied to the punching plate and the dust collector is sucking, the intake port can take in air into the processing chamber, and when the dust collector injects air in the direction opposite to the suction direction, it is supplied. A water film is formed in the fine holes by the generated water, and the fine holes are immediately closed by the water film, so that it is possible to prevent the polishing debris from being ejected from the intake port to the outside of the processing chamber. The water stream formed on the punching plate can then remove the abrasive debris from the punching plate.

Further, in the dry polishing apparatus according to the present invention, at least two punching plates are arranged so as to cover the intake port with a predetermined gap, and the surface of the side wall so that the fine holes of the adjacent punching plates do not overlap. By shifting in the direction, it is more reliable to prevent polishing debris from being ejected from the intake port to the outside of the processing chamber as compared with the case where one punching plate is arranged so as to cover the intake port. Can be done. That is, the polishing debris that has passed through the first punching plate can be further collected by the water film on the second punching plate.

It is a perspective view which shows an example of the dry polishing apparatus. It is explanatory drawing explaining the intake of air from an intake port into a processing chamber when a dust collector is sucking. It is explanatory drawing explaining the state that the gap between two punching plates is too small, the thick water film is formed between two punching plates, and the intake air from an intake port cannot be made. It is explanatory drawing explaining the state which the water film was formed on the 1st punching plate and the 2nd punching plate immediately after the air was injected from the dust collector in the direction opposite to the suction direction. After the polishing debris is taken into the water film of the first punching plate and the water film of the second punching plate, the water containing the polishing debris is applied to both sides of the first punching plate and both sides of the second punching plate. It is explanatory drawing explaining the state which flows down.

The dry polishing device 1 shown in FIG. 1 is a device that performs dry polishing on the wafer W held on the holding table 30 by a polishing pad 64 containing abrasive grains, and is a device that holds the wafer W together with the holding table 30. A polishing means 6 to which a polishing pad 64 containing abrasive grains for polishing the wafer W held by the holding table 30 is rotatably mounted, and a processing chamber 5 for accommodating the holding table 30 and the polishing pad 64 are provided. ing.

The front side (-Y direction side) on the base 10 of the dry polishing apparatus 1 on which the holding table 30 and the like are arranged is a region where the wafer W is attached to and detached from the holding table 30, and is on the base 10. The rear side (+ Y direction side) is a region where the wafer W held on the holding table 30 by the rotating polishing pad 64 is polished.

The holding table 30 has, for example, a circular outer shape, and sucks and holds the wafer W on an upper surface 300 which is made of a porous member or the like and communicates with a suction source (not shown). The holding table 30 is rotatable around the axis in the Z-axis direction, and is placed between the attachment / detachment region and the polishing region by a Y-axis direction moving means (not shown) arranged below the bellows cover 31 shown in FIG. Can be reciprocated in the Y-axis direction.

A column 17 is erected on the rear side on the base 10, and a polishing feeding means 7 for polishing and feeding the polishing means 6 in the Z-axis direction is arranged on the side surface of the column 17 on the −Y direction side. There is. The polishing feed means 7 includes a ball screw 70 having an axial center in the Z-axis direction, a pair of guide rails 71 arranged in parallel with the ball screw 70, a motor 72 connected to the ball screw 70 to rotate the ball screw 70, and the inside. The nut is screwed into the ball screw 70 and the side portion of the ball screw 70 is slidably contacted with the guide rail 71. As a result, the elevating plate 73 is guided by the guide rail 71 and reciprocates in the Z-axis direction, and the polishing means 6 supported by the holder 74 also reciprocates in the Z-axis direction.

The polishing means 6 includes, for example, a spindle 60 whose axial direction is the Z-axis direction, a housing 61 that rotatably supports the spindle 60, a motor 62 that rotationally drives the spindle 60, and a circle connected to the lower end of the spindle 60. It is composed of a plate-shaped mount 63 and a circular plate-shaped polishing pad 64 detachably attached to the lower surface of the mount 63. The polishing pad 64 is made of, for example, a non-woven fabric such as felt or urethane, and contains appropriate abrasive grains. The diameter of the polishing pad 64 having substantially the same diameter as the mount 63 is larger than the diameter of the wafer W and the holding table 30, for example. ) Contact.

For example, a processing chamber 5 having a box-shaped outer shape is arranged at a position on the base 10 in front of the column 17 and below the polishing means 6. The processing chamber 5 has a bottom plate 50 having an opening 500 for penetrating the holding table 30, a side wall 51a, a side wall 51b, a side wall 51c, and a side wall 51d standing upright from the outer periphery of the bottom plate 50, and side walls 51a to side walls facing the bottom plate 50. It is provided with a top plate 52 connected to the upper end of 51d and having a second opening 520 that penetrates the polishing pad 64 of the polishing means 6.

For example, the lower side of the side wall 51a is cut out in a substantially rectangular shape to form an carry-in outlet (not shown), and the holding table 30 moving in the + Y direction passes through the carry-in outlet so that the holding table 30 can be formed. It is in a state of being housed in the processing chamber 5. A shutter 510 that opens and closes the carry-in outlet and a guide rail 511 that guides the vertical movement of the shutter 510 are arranged on the side wall 51a, and the shutter 510 is moved up and down by a shutter movable means 512 such as an air cylinder. It is movable.
The opening 500 formed in the substantially central portion of the bottom plate 50 has, for example, a circular shape having a diameter slightly larger than that of the holding table 30.

The second opening 520 formed in the substantially central portion of the top plate 52 has, for example, a circular shape having a diameter slightly larger than that of the polishing pad 64 and the mount 63, and a sealing member 520a is arranged around the second opening 520. It is installed. While the polishing means 6 is lowered and the polishing pad 64 is housed in the processing chamber 5, and the wafer W is dry-polished by the polishing pad 64 in the processing chamber 5, the mount 63 and the sealing member 520a As a result, the second opening 520 is in a tightly closed state, and polishing debris does not scatter from the second opening 520 to the outside of the processing chamber 5.

For example, the side wall 51d of the processing chamber 5 is provided with an exhaust port 56 connected to a dust collector 8 that collects polishing debris generated during the dry polishing process, and the exhaust port 56 is flexible. One end of an exhaust pipe 560 made of a drain hose or a metal pipe having the above is communicated.

The dust collectors 8 that collect the polishing debris in the processing chamber 5 are installed side by side, for example, on the side of the dry polishing apparatus 1. The dust collector 8 in the illustrated embodiment is, for example, a cyclone-type separating means capable of separating a rectangular parallelepiped device housing 81 and air including polishing dust sucked from the inside of the processing chamber 5 into polishing dust and clean air. It is equipped with 83.

A caster (not shown) for facilitating movement is mounted on the lower surface of the device housing 81 having a rectangular parallelepiped outer shape, and is configured to be movable as a unit. Then, the separating means 83 is arranged above the device housing 81.

The separating means 83 includes an outer cylinder 831 formed of a metal material such as SUS, and three tubular filters 832 arranged in the outer cylinder 831. A block plate 833 is attached to the upper part of the outer cylinder 831, and the inside of the outer cylinder 831 is divided into two chambers by the block plate 833. That is, a separation chamber 830 for separating air containing polishing debris into clean air and polishing debris is formed between the lower side in the outer cylinder 831 and each filter 832, and is formed on the upper side in the outer cylinder 831. Is formed with an inflow chamber 834 into which clean air that has passed through the three filters 832 flows.

On the side surface of the outer cylinder 831, an intake pipe 835 for taking in air containing polishing debris into the separation chamber 830 is provided. The other end of the exhaust pipe 560 described above is connected to the intake pipe 835. The dust collector 8 swirls the air containing the polishing debris that has flowed into the separation chamber 830 from the intake pipe 835 by suction in the separation chamber 830, and separates the polishing debris and the air by the action of centrifugal force due to the swirling. .. The separated polishing debris falls into the polishing debris storage container 85 described later, and the purified air flows into the inside of each filter 832 from the outer surface of each filter 832.

A funnel-shaped polishing debris receiving portion 831b housed inside the device housing 81 and whose diameter is reduced downward is attached to the lower end of the outer cylinder 831, and is attached to the lower end side of the polishing debris receiving portion 831b. , A polishing debris storage container 85 for accommodating polishing debris is arranged. Water is stored in the polishing waste storage container 85, and the polishing dust that falls into the polishing waste storage container 85 is taken in by the water and settles in the polishing waste storage container 85, so that the separation chamber 830 is again used. Never go back to. For example, the polishing waste storage container 85 communicates with a waste liquid treatment device (not shown) outside the device housing 81, and the waste liquid sufficiently containing the polishing waste in the polishing waste storage container 85 is appropriately discharged to the waste liquid treatment device. NS.

The lower end surface of the three bottomed cylindrical filters 832 provided with the central hole 832a is closed. The filter 832 may be formed into a tubular shape by folding it in a bellows shape so as to increase the separation area of the polishing debris of the filter 832 and forming it in an annular shape as a whole. The filter 832 is arranged by inserting it into a mounting hole (not shown) provided in the closing plate 833, and a mounting flange 832b provided at the upper end thereof is mounted on the closing plate 833 by a fixing means such as a screw. The air in the separation chamber 830 is further filtered from the outer surface of the filter 832 to the center hole 832a, and fine polishing debris that could not be separated even by swirling in the separation chamber 830 is further filtered to become clean air in the center hole. It flows into the inflow chamber 834 from the upper end of 832a. The number of filters 832 arranged is not limited to the number of the present embodiment.

An exhaust pipe 836 for exhausting clean air from the inside of the inflow chamber 834 is provided in the upper part of the side surface of the outer cylinder 831, and one end of an exhaust flow path 836a made of a drain hose or a metal pipe is connected to the exhaust pipe 836. The other end of the exhaust flow path 836a is connected to an intake pipe 840 described later.

A suction motor 84 including an intake pipe 840 and an exhaust duct 841 is disposed inside the apparatus housing 81, and by driving the suction motor 84, polishing debris is removed from the intake pipe 840 to the suction motor 84. After that, the clean air is sucked in, and the sucked air is discharged from the exhaust duct 841 to the outside of the device housing 81.

The dust collector 8 includes a filter regeneration means 88 for removing fine polishing debris collected by the three filters 832. The filter regeneration means 88 is arranged in the inflow chamber 834 and supplies high pressure to three injection nozzles 881 and three injection nozzles 881 for injecting high pressure air toward the center holes 832a of the three filters 832, respectively. An air tank 882 that stores air, an air hose 883 that connects the air tank 882 and the injection nozzle 881, three control valves 884 that control the air supplied from the air hose 883 to the injection nozzle 881, and three control valves 884, respectively. It is provided with a valve control unit 885 for controlling the above. The air hose 883 is connected to each of the injection nozzles 881 by a branch pipe (not shown) arranged in the inflow chamber 834.

The three control valves 884 are air operation valves or solenoid valves. When the three control valves 884 are air operation valves, the control valve 884 is connected to a valve control unit 885 provided with a compressor or the like via an air supply pipe, and the valve control unit 885 controls the control valve 884. When air is applied, the control valve 884 is opened. When the three control valves 884 are solenoid valves, the control valve 884 and the valve control unit 885 are electrically connected by wiring, and when the valve control unit 885 energizes the control valve 884, the control valve 884 is energized. The control valve 884 is opened.
When the control valve 884 is opened, the high-pressure air in the air tank 882 passes through the air hose 883 and the control valve 884, and is injected from the injection nozzle 881 toward the center hole 832a of the filter 832. As a result, high-pressure air flows from the center hole 832a side of the filter 832 toward the outer circumference in the opposite direction to that during filtration, so that fine polishing debris collected by the filter 832 is blown off from the outer surface of the filter 832, and the filter 832 Is washed. The blown-off fine polishing debris falls and is stored in the polishing debris storage container 85. The filter regeneration means 88 may be periodically operated when the dust collector 8 is operated for a predetermined time.

As shown enlarged in the round frame of the alternate long and short dash line in FIG. 1, an intake port 57 for taking in air into the processing chamber 5 is formed through the side wall 51a of the processing chamber 5. For example, the outer shape of the intake port 57 is rectangular, and a short tubular duct 570 communicates with the intake port 57. The first punching plate 571 and the second punching are connected to the duct 570. The plates 572 and the plates 572 are arranged side by side in the Y-axis direction so as to cover the intake port 57. Only one punching plate may be arranged so as to cover the intake port 57, or three or more punching plates may be arranged side by side so as to cover the intake port 57.

For example, the first punching plate 571 (second punching plate 572) is a rectangular flat plate made of SUS or the like, and a plurality of fine holes 571a (fine holes 572a) are vertically and horizontally aligned and formed through. .. For example, the first punching plate 571 and the second punching plate 572 are attached side by side by bolts or the like (not shown) in a short tubular duct 570, and the first punching plate 571 and the second punching plate 571 and the second punching. A predetermined gap V is formed between the plate 572 and the plate 572 in the Y-axis direction.

The fine holes 571a of the first punching plate 571 and the fine holes 572a of the second punching plate 572 are displaced in the surface direction of the side wall 51a (in the present embodiment, the Z-axis direction) so as not to overlap each other. It is in a state. The fine holes 571a of the first punching plate 571 and the fine holes 572a of the second punching plate 572 may be displaced in the X-axis direction so as not to overlap each other.

A first shower portion 573 and a second shower portion 574 are arranged above the first punching plate 571 and the second punching plate 572, respectively. The first shower portion 573 and the second shower portion 574 are nozzles extending in the X-axis direction, and an injection port (not shown) for injecting water downward is provided on the lower surface (the surface on the −Z direction side) thereof. A plurality of them are arranged side by side. The injection port may have a narrow slit shape that extends continuously on the lower surface of the first shower portion 573 (second shower portion 574). The first shower section 573 and the second shower section 574 communicate with the water supply source 575 via a pipe. For example, below the first punching plate 571 and the second punching plate 572, a wastewater treatment means (not shown) that receives and treats the water supplied to the first punching plate 571 and the second punching plate 572 is arranged. It may be installed.

The operation of the dry polishing apparatus 1 when the wafer W held on the holding table 30 is dry-polished will be described below. The wafer W shown in FIG. 1 is, for example, a semiconductor wafer having a circular plate shape in outer shape, and the upper surface of the wafer W is a surface to be polished Wa. The lower surface of the wafer W is protected by a protective tape (not shown).

First, in the attachment / detachment region, the wafer W is placed on the upper surface 300 of the holding table 30 so that the surface to be polished Wa is on the upper side. Then, the suction force generated by a suction source (not shown) is transmitted to the upper surface 300, so that the holding table 30 sucks and holds the wafer W.

Next, a Y-axis direction moving means (not shown) moves the holding table 30 holding the wafer W in the + Y direction. Further, the shutter 510 of the processing chamber 5 is opened, the holding table 30 is carried into the processing chamber 5 through a carry-in outlet (not shown), and then the shutter 510 is closed. The holding table 30 housed in the processing chamber 5 penetrates the opening 500 and protrudes upward from the bottom plate 50.

The motor 62 of the polishing means 6 rotates and drives the spindle 60, and the polishing pad 64 also rotates accordingly. Further, the polishing means 6 is sent in the −Z direction by the polishing feeding means 7, and the rotating polishing pad 64 comes into contact with the entire surface Wa of the wafer W to be polished. Then, as the holding table 30 rotates around the axis in the Z-axis direction, the wafer W also rotates, and the entire surface of the wafer W to be polished Wa is dry-polished by the polishing pad 64.

When the dry polishing process is started, polishing debris is generated and scattered in the processing chamber 5. Therefore, during the dry polishing process, the dust collector 8 sucks air containing the polishing debris from the inside of the processing chamber 5. Specifically, when the suction motor 84 performs suction, an air flow (suction force) toward the exhaust port 56 is generated in the processing chamber 5, and the inside of the processing chamber 5 becomes in a negative pressure state. The polishing debris generated in the processing chamber 5 passes through the exhaust port 56 and the exhaust pipe 560 together with the air by the suction force, and flows into the separation chamber 830 of the dust collector 8. The air containing the polishing debris swirls in the separation chamber 830, and the polishing debris and the air are separated by the action of centrifugal force. The separated polishing debris falls in the separation chamber 830, passes through the polishing debris receiving portion 831b, and is stored in the polishing debris storage container 85. The air from which the polishing debris has been separated flows into the inside of each filter 832 from the outer surface of each filter 832, so that finer polishing debris is further filtered to become clean air from the upper end of the center hole 832a of the filter 832. It flows into the inflow chamber 834. The clean air that has flowed into the inflow chamber 834 is exhausted to the outside of the dust collector 8 through the exhaust pipe 836, the exhaust flow path 836a, the intake pipe 840, the suction motor 84, and the exhaust duct 841.

As the dust collector 8 sucks air containing polishing debris from the processing chamber 5, water is supplied from the water supply source 575 to the first shower section 573 and the second shower section 574 as shown in FIG. Is started to be supplied in a predetermined amount, and water is injected downward from the injection ports (not shown) of the first shower unit 573 and the second shower unit 574, respectively. The water jetted from each injection port flows on both side surfaces of the first punching plate 571 and the second punching plate 572, respectively. Since an air flow toward the exhaust port 56 shown in FIG. 1 is generated in the processing chamber 5, external air is taken into the processing chamber 5 from the intake port 57. Here, due to the flow of air in the intake direction, the water flowing on both side surfaces of the first punching plate 571 and the second punching plate 572 does not form a water film, and the air outside the processing chamber 5 becomes a water film. It is taken into the processing chamber 5 from the intake port 57 through the fine hole 572a of the second punching plate 572 and the fine hole 571a of the first punching plate 571.

For example, as shown in FIG. 3, when the gap V1 between the first punching plate 571 and the second punching plate 572 is too close to each other and the gap V1 between the two is too small, the water supply source 575 Due to the supply of water from, the water flowing on the side surface of the first punching plate 571 and the water flowing on the side surface of the second punching plate 572 merge, and the first punching plate 571 and the second punching plate 572 merge. A thick water film is formed between and. As a result, the air outside the processing chamber 5 cannot pass through the fine hole 571a of the first punching plate 571, and the air cannot be taken into the processing chamber 5 from the intake port 57, and the processing chamber by the dust collector 8 cannot be taken in. The suction of air containing polishing debris from within 5 also stops. Therefore, as shown in FIG. 2, the gap between the first punching plate 571 and the second punching plate 572 is such that the water flowing on the side surface of the first punching plate 571 and the side surface of the second punching plate 572 are formed. The gap V may be large enough to prevent the flowing water from merging.

When the air containing the polishing debris continues to be sucked from the inside of the processing chamber 5 by the dust collector 8 shown in FIG. 1 and a predetermined time elapses, the polishing debris accumulates on the outer surfaces of the three filters 832 of the dust collector 8. Therefore, while suction is being performed by the suction motor 84, three control valves 884 are sequentially opened at intervals of, for example, 1 minute under the control of the valve control unit 885, and the high pressure in the air tank 882 is increased. Air is injected from each injection nozzle 881 toward the center hole 832a of the filter 832 through the air hose 883 and the control valve 884. As a result, the polishing debris adhering to the outer surface of the filter 832 is blown to the outside, and the three filters 832 are sequentially air-cleaned one by one. After air is sequentially injected into each filter 832, the three control valves 884 are sequentially closed under the control of the valve control unit 885. The injection time of high-pressure air for each filter 832 may be very short.

As described above, when the control valve 884 is opened and the high pressure air is injected from the injection nozzle 881 toward the center hole 832a of the filter 832, that is, the high pressure air is injected in the direction opposite to the suction direction of the suction motor 82. Immediately after that (hereinafter referred to as immediately after reverse injection), the high-pressure air that has passed through the outer surface of the filter 832 passes through the separation chamber 830, the intake pipe 835, the exhaust pipe 560, and the exhaust port 56 in the direction opposite to the suction direction. It flows and flows into the processing chamber 5. As a result, the flow of air toward the exhaust port 56 in the processing chamber 5 is momentarily eliminated, and therefore, as shown in FIG. 4, flows on both side surfaces of the first punching plate 571 and the second punching plate 572, respectively. The water spreads like a water film, and the fine holes 571a of the first punching plate 571 and the fine holes 572a of the second punching plate 572 are closed by the water film.

Immediately after the fine holes 571a of the first punching plate 571 and the fine holes 572a of the second punching plate 572 are blocked by the water film, the high-pressure air flowing into the processing chamber 5 causes the processing chamber 5 to work. The inside becomes positive pressure for a short time, and an air flow toward the intake port 57 is instantaneously generated. Here, since the fine holes 571a of the first punching plate 571 and the fine holes 572a of the second punching plate 572 are in a state of being blocked by the water film, the polishing that flows together with the air toward the intake port 57. The debris is first taken into the water film on the first punching plate 571. Therefore, it is possible to prevent the polishing debris from passing through the fine hole 571a of the first punching plate 571 and being ejected to the outside of the processing chamber 5 and scattered.

There is also a small amount of abrasive debris that passes through the fine holes 571a of the first punching plate 571. However, as in the present embodiment, the second punching plate 572 is arranged so as to be adjacent to the first punching plate 571 with a predetermined gap V provided, and the first punching plate 571 is also provided. Since the fine hole 571a and the second punching plate 572 are shifted in the surface direction of the side wall 51a (in the present embodiment, the Z-axis direction) so as not to overlap the fine hole 572a, the first punching plate Abrasive debris that has passed through the fine holes 571a of 571 is taken into the water film on the second punching plate 572. Therefore, it is possible to more reliably prevent the polishing debris from being ejected to the outside of the processing chamber 5 and scattered.

As shown in FIG. 5, the polishing debris taken into the water film on the first punching plate 571 and the polishing debris taken into the water film on the second punching plate 572 are the side surfaces of the first punching plate 571. And the side surface of the second punching plate 572 flows downward together with water, and is housed and treated in a wastewater treatment means (not shown).

As described above, since the injection time of the high-pressure air for each filter 832 shown in FIG. 1 is a very short time, it is very likely that the inside of the processing chamber 5 becomes positive pressure and an air flow toward the intake port 57 is generated. It's a short time. Therefore, since suction is performed by the suction motor 84, the inside of the processing chamber 5 is in a negative pressure state again, and an air flow (suction force) toward the exhaust port 56 shown in FIG. 2 is generated. Return to.

After the surface Wa to be polished of the wafer W is polished by a predetermined amount while the polishing dust is sucked by the dust collector 8, the polishing means 6 shown in FIG. 1 is pulled up in the + Z direction by the polishing feeding means 7, and the polishing pad 64 Is separated from the wafer W. Next, a Y-axis direction moving means (not shown) moves the holding table 30 holding the polished wafer W in the −Y direction. Further, the shutter 510 of the processing chamber 5 is opened, and the holding table 30 is carried out of the processing chamber 5 through an inlet / outlet (not shown).

The dry polishing apparatus according to the present invention is not limited to the above embodiment, and each configuration of the dry polishing apparatus 1 shown in the attached drawings is not limited to this, and the effect of the present invention is not limited to this. It can be changed as appropriate within the range where can be exhibited. For example, the dry polishing apparatus according to the present invention may be incorporated in the grinding and polishing apparatus as a part of the grinding and polishing apparatus including the rough grinding means, the finish grinding means and the like.

1: Dry polishing device 10: Base 17: Column 30: Holding table 300: Top surface of holding table 31: Bellows cover 5: Processing room 50: Bottom plate 500: Opening 51a: Side wall 510: Shutter 511: Guide rail 512: Shutter movable means 51b: Side wall 51c: Side wall
51d: Side wall 56: Exhaust port 52: Top plate 520: Second opening 520a: Sealing member 57: Intake port 570: Piping 571: First punching plate 571a: Fine hole 572: Second punching plate 572a: Fine hole 573: First shower part 574: Second shower part 575: Water supply source 6: Polishing means 60: Spindle 61: Housing 62: Motor 63: Mount 64: Polishing pad 7: Polishing feeding means 70: Ball screw 71: Pair Guide rail 72: Motor 73: Elevating plate 74: Holder 8: Dust collector 81: Equipment housing 83: Separation means 831: Outer cylinder 831b: Abrasive dust receiving part 832: Filter 833: Closed plate 834: Inflow chamber 835: Intake pipe 836 : Exhaust pipe 836a: Exhaust flow path 85: Abrasive waste storage container 84: Suction motor 840: Intake pipe 841: Exhaust duct 88: Filter regeneration means 881: Injection nozzle 882: Air tank 883: Air hose 884: Control valve 885: Valve control unit W: Wafer

Claims (2)

A holding table for holding the wafer, a polishing means rotatably mounted with a polishing pad containing abrasive grains for polishing the wafer held by the holding table, and a processing chamber for accommodating the holding table and the polishing pad. A dry polishing device equipped with,
The processing chamber is connected to a bottom plate having an opening for penetrating the holding table, a side wall erected from the outer periphery of the bottom plate, and the upper end of the side wall facing the bottom plate, and penetrates the polishing pad of the polishing means. A top plate having a second opening and an exhaust port connected to a dust collector that collects polishing debris generated when the polishing pad polishes a wafer are provided.
The side wall is provided with an intake port for taking in air into the processing chamber.
A dry polishing device including a punching plate provided with a plurality of fine holes and arranged so as to cover the intake port, and a shower portion for supplying water to the punching plate. At least two punching plates are arranged so as to cover the intake port with a predetermined gap.
The dry polishing apparatus according to claim 1, wherein the fine holes of the adjacent punching plates are displaced in the surface direction of the side wall so as not to overlap each other.

Images