JP6853309B2 - Fluid injection device with fluid supply holes - Google Patents

Description

The fluid injection device injects droplets on demand. For example, fluid injection devices are present in three-dimensional (3D) printers such as inkjet printers, two-dimensional (2D) printers, and other high-precision digital feeders such as digital titrators.

An inkjet printer prints an image on a printing medium such as paper by ejecting ink droplets through a plurality of nozzles. The nozzles are typically arranged along the printheads in one or more arrays, in the proper order from those nozzles when the printheads and print media are moving relative to each other. By ejecting ink droplets, characters and other images are printed on the printing medium. The thermal inkjet printhead ejects droplets from a nozzle by passing an electric current through a heating element (heating element) that generates heat and vaporizes a small part of the fluid in the injection chamber. Piezoelectric inkjet printheads use piezoelectric actuators to generate pressure pulses that push ink droplets out of the nozzles.

Hereinafter, some examples will be described with reference to the attached drawings.
It is sectional drawing of an exemplary fluid injection device. It is sectional drawing which shows a part of an exemplary molded fluid injection device. It is sectional drawing of the exemplary molded fluid injection device of FIG. 2 along the dashed line AA of FIG. It is sectional drawing seen from the bottom of the exemplary molded fluid injection apparatus of FIG. 2 along the dotted line BB of FIG. FIG. 2 is a cross-sectional view of the exemplary molded fluid injection device of FIG. 2 along the dashed line CC of FIG. FIG. 3 is a block diagram showing an exemplary printer with a print cartridge incorporating an example of a molded fluid injection device. It is a perspective view (perspective view) of an exemplary print cartridge incorporating an example of a molded fluid injection device. It is a perspective view (perspective view) of another exemplary print cartridge incorporating an example of a molded fluid injection device. FIG. 3 is a block diagram showing another exemplary printer with a medium-width fluid injection assembly comprising an example of a molded fluid injection device. It is a perspective view (perspective view) which shows the exemplary fluid injection assembly which comprises the fluid injection apparatus. FIG. 5 is a perspective sectional view showing an exemplary fluid injection assembly of FIG.

When manufacturing a fluid injection device, it may be a problem to maintain or increase the density of nozzles while reducing the width and / or thickness of the die substrate. Some silicon die architectures include longitudinal fluid supply slots formed through the silicon die substrate. Their longitudinal fluid supply slots are all fluid in one or two rows through the die from a fluid distribution manifold (eg, a plastic interposer or chiclet) on the back of the die. Allows fluid to flow through the injection chamber and the nozzle on the front of the die. The manifold and longitudinal fluid supply slots provide fluid fanout from a small downstream injection chamber to a larger upstream fluid supply channel (ie, a larger flow path). The longitudinal fluid supply slot can occupy space in the die and reduce the structural integrity of the die. In another example, those fluid slots complicate the process of integrating the die with the manifold and increase the cost of the process. For example, reducing the pitch of the slots to make the overall width of the die smaller in order to integrate the die with the manifold is difficult if the die has a large number of slots. It is possible. According to one example of the present disclosure, it has been found that the amount of die shrink (reducing the size of the die) can be limited by integrating the plastic manifold with the closely spaced die slots.

In another example, it was found that fluid crosstalk that occurs when droplet (or fluid droplet) generators are placed in close proximity to each other can limit the amount of die shrink and nozzle density. In general, fluid crosstalk occurs when the ejection of a fluid droplet (or droplet) from the nozzle of one droplet generator affects the hydrodynamics in a nearby droplet generator. The pressure wave generated by the injection of fluid from the chamber / nozzle can propagate into the adjacent fluid chamber and cause fluid displacement. The resulting volume change in adjacent chambers affects the droplet ejection process within the adjacent chamber (eg, droplet volume, droplet shape, droplet ejection velocity, chamber (fluid) replenishment). It can have an adverse effect.

In one example of the present disclosure, the fluid injector provides longitudinal (longitudinal) fluid slots formed from the back to the front (front surface) of the substrate to supply fluid to the nozzle array. I don't have it. Instead, a narrow "sliver" die is molded into an integrally molded body that provides fluid fanout through a molded channel on the back of the die. This eliminates the costly and complex integration of the die and manifold on the back of the die. A substrate can be provided on the back surface of the die and a fluid layer can be provided on the front surface of the die. Each molded channel can supply fluid to the back surface of the substrate. The fluid passes through an array of fluid supply holes (FFH) formed within the substrate (several or multiple fluid supply holes arranged to form an array) and a droplet generator in the fluid layer. To reach. The fluid supply holes are separated from each other and the fluid supply holes can be arranged in a row parallel to the row of nozzles. Bridges or ribs between these fluid supply holes provide strength to the substrate. In the present disclosure, a molded sliver type fluid injection device is referred to as a molded fluid injection device (hereinafter, the molded fluid injection device is referred to as a "molded fluid injection device").

The molded sliver configuration can allow for a relatively small width of the die. In one example, the nozzle density can be increased when two parallel rows of droplet generators along both sides of the FFH array are provided close to each other. An exemplary columnar structure formed within the fluid layer can reduce fluid crosstalk and / or bubble formation that may appear near adjacent fluid injection chambers. Such a columnar structure can impede the movement of particles and bubbles within the fluid layer, which can help prevent clogging of the injection chamber and nozzles.

Thus, in addition to allowing relatively small die sizes and high nozzle densities, molding fluid injectors are associated with fluid crosstalk and clogging that limits the ability to reduce die size and increase nozzle density. It can contain features or features that help overcome the problem.

In one example, the fluid injection device comprises a die molded into a molded product. The die comprises a fluid layer and a substrate having a front surface exposed to the outside of the molding to supply fluid, the substrate having the front surface on which the fluid layer is formed and at least one in the molding. It has a back surface for receiving fluid through the channel. An array of fluid supply holes is provided within the die substrate to allow fluid to flow from the back surface to the fluid layer on the front surface of the substrate. An array of droplet generators (multiple or multiple droplet generators arranged to form an array) within the fluid layer provides fluid supply along the outlets of the fluid supply holes. It can extend parallel to the array of holes. In one example, the array of droplet generators extends on one or both sides of the fluid supply hole. The fluid supply holes can traverse bulk silicon, and silicon ribs are provided so as to be sandwiched between the fluid supply holes, and each rib traverses at least a part of the molding channel. Can be done.

In one example, a medium-width fluid injection assembly is provided. Such a fluid injection assembly can eject droplets over the entire width of the medium, for example in a 2D or 3D printer. Some examples of media are paper and powder. In one example, the fluid injection assembly comprises a plurality of fluid injection dies incorporated into the molding. Each die forms the back of the die and fluids from channels within the molding on the back to at least one parallel array of droplet generators on the opposite front (on the back). It comprises a die substrate having an array of fluid supply holes for carrying. Silicon ribs are sandwiched between fluid supply holes and extend across at least a portion of the channel. In one example, the ribs extend between parallel arrays of droplet generators near the anterior surface. As used herein, "fluid injection device" and "fluid injection die" mean a device (or device) capable of supplying fluid from one or more nozzles. The fluid injection device can include one or more fluid injection dies. The fluid injection device can be molded into a molded product. Depending on the situation, the fluid injection device may include moldings incorporating those dies. By "sliver" is meant a fluid injection die having a length-to-width ratio (L / W) of 50 or greater. Fluid injection devices and fluid injection dies can be used in two-dimensional or three-dimensional printing applications to supply, for example, inks, agents, or other fluids. In addition to printing applications, fluid injectors can be used in digital titrators, laboratory equipment, dispensing units, or any other precision digital supply unit.

FIG. 1 is an exemplary diagram of the fluid injection device 1. In this example, the fluid injection device 1 includes a fluid injection die 2. The fluid injection die 2 includes a fluid layer (fluidic layer) 6 on the front side (front side) of the die 2 and a substrate 8 on the back side (rear side) of the die 2. An array of fluid supply holes 14 (eg, rows, ie, a plurality or number of fluid supply holes 14 arranged in a row) is arranged along the substrate 8, and each fluid supply hole 14 is a substrate. It passes through (penetrates) the substrate 8 from the rear portion (back portion) of the 8 to the front portion of the substrate 8 and extends to the fluid layer 6. The rib 20 is sandwiched between the fluid supply holes 14 and thereby defines the side wall 18 of the fluid supply hole 14. In FIG. 1, the front and back surfaces are at the top and bottom, respectively, but in one exemplary situation, the fluid layer 6 extends at the bottom and the substrate 8 extends at the top. The fluid layer 6 comprises an array of droplet generators 24 (eg, rows, i.e., multiple or multiple droplet generators 24 arranged in rows). The array of droplet generators 24 can extend along the opening of the fluid supply hole 14 downstream of the opening and parallel to the array of the fluid supply holes 14. Each droplet generator 24 includes an injection chamber 34 and a nozzle 36. The array of droplet generators 24 extends perpendicular to the traveling direction of the medium. Injection elements 38 are provided in each injection chamber 34 to inject fluid from the nozzle 36. A manifold layer 32 can be provided between the droplet generator 24 and the fluid supply hole 14 to guide (guide) the fluid from the fluid supply hole 14 to the chamber 34.

In one example, the fluid supply holes 14 with the ribs 20 in between can provide a relatively strong and mechanically stable fluid injection die 2. This makes it possible to make the die 2 with a relatively small width, for example, to make the die 2 smaller than a fluid injection die having a longitudinal fluid slot penetrating a silicon substrate. Such a relatively small width die can be combined with a relatively high nozzle density and a relatively high droplet generator density.

2 to 5 show a portion of another exemplary molding fluid injection device 100 in several different diagrams. FIG. 2 is a plan view of an exemplary molding fluid injection device 100, and FIG. 3 is a vertical cross-sectional view of the fluid injection device 100 along the dotted line AA of FIG. FIG. 4 is a view from the bottom of the fluid injection device 100 along the dotted line BB of FIG. 3, and FIG. 5 is a vertical cross-sectional view of the fluid injection device 100 along the dotted line CC of FIG. is there.

Referring to FIGS. 2-5, the molding fluid injection device 100 includes an integral structure 104, an elongated and thin "sliver" fluid injection die 102 formed into a molding 104. The die 102 can be made of silicon, such as SU8 (or from silicon, such as SU8). The molded product 104 can be formed of plastic, epoxy molded compound, or other moldable material. The fluid injection die 102 is molded into the part 104 so that the front surface of the fluid layer 106 on the die 102 remains exposed to the outside of the part 104, thereby allowing the die to supply fluid. I have to. The substrate 108 forms the back surface 110 of the die 102, which back surface is covered by the molded product 104 except for the channel 112 formed in the molded product 104. The molding channel 112 allows the fluid to flow directly to the die 102. In another example, the fluid injection device 100 comprises one or more fluid injection dies 102 incorporated (embedded) in the integrally molded product 104, in which case the fluid is delivered to the back surface 110 of the dies 102. A fluid channel 112 is formed in the molding 104 for each die 102 for direct transport.

In one example, the substrate 108 is composed of a thin sliver with a thickness of about 100 micrometers. The substrate 108 has fluid supply holes 114 that are dry-etched or otherwise formed in the substrate to carry the fluid through the substrate from the back surface 110 of the substrate 108 to the front surface 116 of the substrate. I have. In one example, the fluid supply hole 114 completely traverses the substrate 108 made of bulk silicon. The fluid supply holes 114 form an array (ie, column or row) that can extend parallel to the forming channel 112, eg, the central position of the width W2 of the forming channel 112, along the length (L) direction of the substrate 108. It is arranged like this. In yet another example, the array of fluid supply holes is also located at the center of the width (W) of the substrate 108. In other words, the rows or columns of the fluid supply holes 114 can extend the central portion of the substrate 108 along the length (L) direction of the substrate 108. Note that, for example, the length (L) shown in FIG. 4 is not intended to indicate the overall length of the substrate 108. The length (L) is intended to indicate the orientation of the length with respect to the width of the substrate 108. As described above, FIGS. 2 to 4 show only a part of the exemplary molding fluid injection device 100. In many examples, the substrate 108 will be significantly longer than the length (L) and the number of fluid supply holes 114 will be significantly greater than the number shown. A single molding channel 112 in the molding 104 can supply fluid to the array of fluid supply holes 114.

In one example, the fluid supply hole 114 comprises a wall 118 that tapers (ie, narrows) the distance (that is, narrows) from the front surface 116 to the back surface 110 of the substrate 108. The cross section of such tapered fluid supply holes 114 is smaller or narrower at the front surface 116 of the substrate 108, and do those fluid supply holes increase as they extend through the substrate 108 toward the back surface 110? Or the width becomes wider. Therefore, the dimensions of the various shape portions (feature portions) of the fluid injection device 100 shown in FIGS. 2 to 5 are not drawn at a constant scale, but the fluid shown in the plan view of FIG. The opening of the supply hole 114 can be displayed as being smaller than the opening of the fluid supply hole 114 shown in the bottom view of the fluid injection device 100 shown in FIG. In one example, the tapered fluid supply hole 114 helps control or control air bubbles generated in the fluid injection device 100. Inks and other liquids may contain a variable amount of dissolved air, and the temperature of the fluid rises during the ejection of droplets (fluid droplets), thus reducing the solubility of the air in the fluid. As a result, bubbles in the ink or other liquid can be relatively low, thereby blocking or suppressing certain consequences caused by bubbles in the liquid, which can include defective nozzle performance and poor print quality. can do. During the injection of the fluid (droplet), the nozzle 136 can be directed below the fluid supply hole 114, so that air bubbles generated elsewhere in the fluid injection chamber 134 and the fluid injection device 100 are in the fluid supply hole. It may have a tendency to rise through 114. Such ascending movement of air bubbles away from the nozzle 136 and the chamber 134 can be supported by the widened taper 118 in the fluid supply hole 114.

The substrate 108 also includes ribs 120 or bridges across the fluid channels 112 between the fluid supply holes 114 on one or both sides of the fluid supply holes 114. The rib 120 may be derived from the formation and presence of the fluid supply hole 114. Each rib 120 is located between the two fluid supply holes 114 and extends laterally across the substrate 108 as it traverses the underlying fluid channel 112 formed within the molding 104. In one example, the substrate is made of bulk silicon (or from bulk silicon) and the rib 120 is part of the bulk silicon and traverses part of the molding channel of the part 104.

The cross-sectional view taken along the broken line CC of FIG. 2 is a cross-sectional view of the fluid injection device 100 shown in FIG. The cross-sectional view of the fluid injection device 100 of FIG. 5 shows a silicon rib 120 extending between the fluid supply holes 114 and a front surface 116 and a back surface 110 of the substrate 108. The partially dashed line 118 in FIG. 5 represents the contour (outer shape) of the wall 118 of the tapered fluid supply hole behind (or in front of) the silicon rib 120. The tapered portion 118 of the fluid supply hole 114 that widens from the front surface 116 to the back surface 110 of the substrate 108 narrows those ribs (or the width of the ribs) as the ribs 120 extend from the front surface to the back surface. To narrow down).

A fluid supply hole 114 sandwiching a rib 120 across the fluid channel 112 enhances the strength and mechanical stability of the fluid injection die 102. This allows the die 102 to be smaller than a conventional fluid injection die having a fluid slot that completely penetrates the silicon substrate.

In one example, the reduced die size can increase the density of nozzles and droplet generators. Fabrication of a fluid injection die 102 with a relatively small width (W) by bringing opposing droplet generators 124 (ie, injection chambers, resistors, and nozzles) within an array of opposing droplet generators close to each other. Can be done. For example, at the time of writing this disclosure, the die size of the fluid injection die 102 in the molding fluid injection apparatus 100 according to one example of the present disclosure is about 2 to 2 compared to a silicon printhead having a longitudinal fluid slot. It can be made four times smaller. For example, at the time of writing this disclosure, some of those printheads with longitudinal fluid supply slots support two parallel nozzle arrays on a silicon die with a width of about 2000 micrometers. Can be done. The fluid injection die "sliver" in the molding of the present disclosure supports an array of two opposing (ie opposite) parallel nozzles on a silicon die 102 having a width W of approximately 350 micrometers. Can be done. In another example, the width W of the die 102 can be in the range of about 150 micrometers to about 550 micrometers. In yet another example, one or two nozzle arrays are arranged within a substrate width W of 200 micrometers.

As shown in FIGS. 3 and 5, the fluid layer 106 is formed on the front surface 116 of the substrate 108. The fluid layer 106 generally defines a fluid architecture that includes a droplet generator 124, columnar structures 128, 130, and a manifold channel or manifold 132. Each droplet generator 124 can be actuated to eject a fluid injection chamber 134, nozzle 136, chamber inlet 126, and fluid from chamber 134 through nozzle 136, injection element 138 formed on substrate 108. It has. A common manifold fluidly connects each fluid supply hole 114 to the inlet 126. In the illustrated example, two rows of droplet generators 124 extend vertically (ie, longitudinally) parallel to the array of fluid supply holes on either side of the array of fluid supply holes.

In another embodiment, the fluid layer 106 can be composed of a single monolithic layer, or the fluid layer can be composed of a plurality of layers. For example, the fluid layer 106 may be formed from both the chamber layer 140 (also referred to as the barrier layer) and the separately formed nozzle layer 142 (also referred to as the top hat layer) above the chamber layer 140. it can. All or a significant portion of the one or more layers constituting the fluid layer 106 can be formed with SU8 epoxy, or other polyimide material, and various processes such as spin coating and lamination processes. It can be formed using a process.

In yet another example, the position and pitch of each fluid supply hole 114 in the array is such that the center of each fluid supply hole 114 is approximately between the approximate centers of the closest (two) injection chambers 134. It is set to extend on both sides of the chamber. For example, in a plan view (eg, FIG. 2), if a straight line SL is drawn through the closest center points of the generally opposed nozzles 136, the straight line SL is the center of the fluid supply holes 114 between the nozzles 136 or It will intersect the center of the rib 120. In yet another example, in plan view (eg, FIG. 2), any line (eg, SL) in the die 102 that can be drawn through the center of the fluid supply hole 114 and the center of the injection chamber 134 is of the medium. Not parallel to the direction of travel.

During printing, the fluid is ejected from the injection chamber 134 through the corresponding nozzles 136 and the fluid is replenished from the molding channel 112. The fluid from the channel 112 flows into the manifold 132 through the supply hole 114. The fluid flows from the manifold 132 through the chamber inlet 126 into the injection chamber 134. By rapidly replenishing the injection chamber 134 with fluid, the printing speed can be increased. However, as the fluid flows toward and into the chamber 134, small particles in the fluid may get caught inside and outside the chamber inlet 126 leading to the chamber 134. Those small particles can reduce and / or completely block the flow of fluid into their chambers, which can lead to premature failure of injection element 138, reduction of ink droplet size or in the wrong direction. It can cause ink droplets to be ejected. The columnar structure 128 near the chamber inlet 126 serves, at least in part, as a barrier to prevent the particles from blocking the chamber inlet 126, i.e., to prevent the particles from passing through the chamber inlet 126. It provides a particle-tolerant architecture (PTA) that can be used. The arrangement, size, and spacing of the PTA columnar structure (PTA columnar body) 128 generally prevents the particles from blocking the inlet 126 to the injection chamber 134, even when the particle size is relatively small. Designed to. In the illustrated example, the PTA columnar structure 128 is located close to the inlet. For example, the two PTA columnar structures 128 can be provided at a distance to the opening of the inlet of about twice the diameter of the columnar structure or less, or about one time or less of the diameter of the columnar structure. In yet another example, at least one PTA columnar structure 128 is located in the inlet bay 127 through which the inlet 126 communicates. In such an example, an array of inlet bays 127 can be provided on the manifold side wall between the manifold 132 and each inlet 126. In another example, one or three or more PTA columnar structures 128 may be provided near the inlet 126 to suppress or prevent the movement of particles towards the chamber 134.

In yet another example, the inlet 126 to the chamber 134 is narrowed, i.e. the maximum width W4 of each inlet 126 is smaller than the diameter D of each corresponding chamber 134, in this case the measured width W4. The direction and the direction of the diameter D are parallel to the long axis of the manifold 132 or the long axis of the array of fluid supply holes. For example, the maximum width W4 of the inlet 126 is less than two-thirds of the diameter D of the chamber. In one example, the narrowed portion can reduce crosstalk. In another example, the narrowed inlet can reduce the effect of changes in the size, position, or length of the fluid supply hole.

The additional columnar structure 130 has a bubble resistant architecture (BTA) 130 that is generally configured to prevent bubbles from moving through the die manifold 132 and to guide the bubbles into the tapered fluid supply holes 114. In the fluid supply hole 114, the air bubbles can be lifted upward in the direction away from the downward droplet generator nozzle 136. The BTA columnar structure (BTA columnar body) 130 can be arranged in the manifold 132 between the openings of the fluid supply holes 114 at the top of the ribs 120. In one example, the BTA columnar body 130 can have a larger volume or wider width than the PTA columnar structure 128. For example, the BTA columnar structure has a width W3 that is at least 1/2 the diameter of the opening 115 of the fluid supply hole leading to the manifold 132 (eg, approximately the same as the diameter of the opening 115 of the fluid supply hole leading to the manifold 132). be able to. In this exemplary description, columnar structures 128, 130 are referred to as "PTA" columnar structures, "BTA" columnar structures, but in another example, the functions and advantages of columnar structures 128, 130 can be different. It should be noted that, although not necessarily related to particles or bubbles (only), respectively, they can have additional or different functions and advantages.

In yet another example, the columnar structures 128, 130, for example, in addition to reducing the adverse effects of air bubbles and / or particles, or instead of reducing the adverse effects, are in close proximity to the droplet generators. It serves the purpose of reducing fluid crosstalk between 124. As mentioned above, the presence of a smaller fluid injection die 102 in the forming fluid injection apparatus 100, in part, is a fluid supply hole 114 and associated ribs 120 that reinforce the substrate 108 across the fluid channel 112. Makes it possible. The reduced die size increases the density of the nozzle and droplet generator by bringing the droplet generators closer together across the width (W) of the substrate 108 across the channel 112. A relatively large nozzle density within the fluid injector 100 can cause relatively high levels of fluid crosstalk between nearby droplet generators 124. That is, when the droplet generators are brought closer to each other, the fluid crosstalk between nearby injection chambers increases, which can adversely affect the injection of droplets, resulting in changes in fluid pressure and / or volume within those chambers. Can occur. In some examples, the columnar structures 128, 130 within the fluid layer 106 can serve to reduce the effects of fluid crosstalk.

The fluid injection device 100 includes a fluid channel 112. The fluid channel 112 is formed through the compact 104 to allow the fluid to flow directly onto the back surface 110 of the silicon substrate 108 and into the substrate 108 through the fluid supply holes 114. Will be done. The fluid channel 112 can be formed in the molded body 104 in various ways. For example, a rotary or other type of cutting saw is used to cut and define the channel 112 in the compact 104 and to cut and define a thin silicon cap (not shown) over the feed hole 114. be able to. By using saw blades (saw blades) having different outer peripheral blade shapes in various combinations, it is possible to form channels 112 having various shapes that promote or facilitate the flow of fluid to the back surface 110 of the substrate. .. In another example, the fluid injection die 102 can form at least a portion of the channel 112 when it is molded into the molded body 104 of the fluid injection device 100 during a compression molding process or a transfer molding process. The material removal process (eg, powder blasting, etching, laser machining, milling, drilling, electrical discharge machining) can then be used to remove the remaining molding material. The removal process can enlarge the channel 112 and complete the flow path through the part 104 to the fluid supply hole 114. When the channel 112 is formed using a molding process, the shape of the channel 112 generally reflects the reverse shape of the mold chase shape used in the process. Therefore, by changing the shape of the mold chase, it is possible to generate channels having various different shapes that promote or facilitate the flow of fluid to the back surface 110 of the silicon substrate 108.

As mentioned above, the molding fluid injection device 100 is suitable for use, for example, in interchangeable fluid injection cartridges and / or medium width fluid injection assemblies (“print bars”) for 2D or 3D printers. FIG. 6 is a block diagram showing an exemplary printer 700 with a replaceable print cartridge 702 incorporating an exemplary fluid injecting device 100, wherein the fluid injecting device is in a molded product 104 and a molded product 104. Includes an embedded die 102. The die includes a fluid supply hole 114. In one example, the printer is an inkjet printer, and the cartridge 702 comprises at least one ink compartment (ink chamber) 708 that is at least partially filled with ink. Different compartments can hold different colors of ink. In one example of the printer 700, the carriage 704 scans the print cartridge 702 back and forth over the print medium 706 in order to add ink to the medium 706 in a desired pattern. During printing, the media transfer assembly 712 moves the print medium 706 with respect to the print cartridge 702 to facilitate the addition of ink to the print medium 706 in the desired pattern. The controller 714 generally includes a processor, a memory (storage device), an electronic circuit, and other components for controlling the operating elements of the printer 700. The memory stores instructions for controlling the operating elements of the printer 700.

FIG. 7 is a perspective view (or perspective view) of an exemplary print cartridge 702. The print cartridge 702 includes a molding fluid injection device 100 supported by a cartridge housing 716. The fluid injection device 100 includes four elongated fluid injection dies 102 and a PCB (printed circuit board) 103 attached to the molded product 104. The PCB may include electrical and electronic circuits such as drive circuits for driving the fluid injection elements in each die 102. In the illustrated example, the fluid injection dies 102 are arranged parallel to each other in the width direction of the fluid injection device 100. The four fluid injection dies 102 are arranged in a window 148 cut out from the PCB 103. A single fluid injector 100 with four dies 102 is shown for the print cartridge 702, for example, more fluid injectors 100 with each fluid injector 100 having more or less dies 102. Other configurations are also possible.

The print cartridge 702 can be electrically connected to the controller 714 via electrical contacts 720. In one example, the contacts 720 are formed within the flex circuit 722 attached to the housing 716 (eg, along one of the outer surfaces of the housing 716). The signal line incorporated into the flex circuit 722 fluids the contact 720, for example, via a bond wire covered by a low profile (ie low height) protective cover 717 at both ends of the fluid injection die 102. It can be connected to the corresponding circuit on the injection die 102. In one example, the ink jet nozzles on each fluid jet die 102 are exposed along the bottom of the cartridge housing 716 through an opening in the flex circuit 722 or an opening adjacent to the edge of the flex circuit.

FIG. 8 is a perspective view (or perspective view) of another exemplary print cartridge 702 suitable for use with the printer 700 or any other suitable precision digital feeder. In this example, the print cartridge 702 has four fluid injection devices 100 and PCB 103 attached to the part 104 and includes a medium width fluid injection assembly 724 supported by a cartridge housing 716. Each fluid injection device 100 includes four fluid injection dies 102 and is arranged in a window 148 cut out from the PCB 103. The print cartridge 702 of this example shows a printhead assembly 724 with four fluid injectors 100, eg, each fluid injector 100 has more or less dies 102. Other configurations with or less fluid injection device 100 are also possible. Molding channels can be provided on the back surface of each die 102 so as to pass through the molded product in order to supply fluid to the fluid layer of each die 102. Bond wires (covered by a low profile protective cover 717 consisting of a suitable protective material such as epoxy and a flat cap placed on top of the protective material) are placed in each fluid injector 100. It can be provided at one or both ends of the fluid injection die 102. An electrical contact 720 is provided to electrically connect the fluid injection assembly 724 to the printer controller 714. The electrical contacts 720 can be connected to wires (traces) embedded in the flex circuit 722.

FIG. 9 is a block diagram showing a printer 1000 with a fixed medium width fluid injection assembly 1100 equipped with another exemplary molding fluid injection device 100. The printer 1000 includes a medium width fluid injection assembly 1100 over the entire width of the print medium 1004, a fluid supply system 1006 associated with the fluid injection assembly 1100, a medium transfer mechanism 1008, a receiving structure of a fluid supply source 1010, and a printer controller 1012. ing. The controller 1012 includes a processor, a memory (storage device) for storing control instructions, and electronic circuits and components necessary for controlling the operating elements of the printer 1000. The fluid injection assembly 1100 comprises an array of fluid injection dies 102 for supplying or adding fluid to a sheet, continuous paper or other printing medium 1004. During operation, each fluid injection die 102 receives fluid from the supply source 1010 through a flow path extending from the supply source 1010 through the fluid supply system 1006 and the fluid channel 112 to the fluid injection die 102.

10 and 11 are perspective views (or views) of a molded medium width fluid injection assembly 1100 with a plurality of fluid injection devices 100, including, for example, a print cartridge, a page wide (page width) array print bar, or a printer. (Perspective view). FIG. 12 is a cross-sectional view different from that of FIG. The molded fluid injection assembly 1100 comprises a plurality of fluid injection devices 100 and PCB 103, all of which are attached to the molded product 104. The fluid injection device 100 is arranged in a window 148 cut out from the PCB 103. The fluid injection devices are longitudinally arranged in a row across the fluid injection assembly 1100 (or over the entire length of the assembly 1100). When viewed from the medium traveling direction, the fluid injection devices 100 in the opposing rows overlap (overlap) with a part of the adjacent fluid injection devices 100 facing each other. They are arranged in a staggered arrangement (that is, they are arranged in a staggered manner). Therefore, some of the droplet generators at the ends of the fluid injection die 102 can be extra due to this overlap. Although ten fluid injectors 100 are shown in FIG. 11, more or less fluid injectors 100 can be used in the same or different configurations. The fluid injection of each fluid injection device 100 is a bond wire that can be covered by a suitable protective material such as epoxy and a low profile protective cover 717 that can consist of a flat cap placed on top of the protective material. It can be provided at one or both ends of the die 102.

In some examples of the present disclosure, the fluid injection die is provided in the part. The molding comprises elongated channels. The die is embedded in the molded product. In one example, the die is provided in a cut-out window of a PCB embedded (embedded) in the molding. A row of fluid supply holes extends parallel to the long axis of the elongated molding channel. Ribs between those fluid supply holes extend across the molding channel. For example, there is one row of droplet generators on each side of the opening of the fluid supply hole so that the ribs extend between the two rows of droplet generators. The two rows extend along the downstream opening of the fluid supply hole. Columnar structures can be provided on top of their ribs between the rows of their droplet generators. A columnar structure can also be provided at the entrance of a nearby chamber. A single common manifold for fluid connection can be provided in each of these chambers and fluid supply holes. In some examples, the pitch of their fluid supply holes is the same as the pitch of the droplet generators within one row of droplet generators.

In one example, one molding channel can supply fluid to an array (eg, row) of one fluid supply hole. In another example, one molding channel can supply fluid to an array of fluid supply holes (eg, multiple rows) in a single die or multiple corresponding dies. In the present disclosure, the width of those dies can be relatively small, for example, the ratio of length to width can be 50 or more. Such dies are sometimes referred to as "slivers." The dies can also be relatively thin and can generally be constructed, for example, from a bulk silicon substrate and a thin film fluid layer.

In the example described, a plurality of fluid injection devices and PCBs are attached to the molded product 104. In the present disclosure, "attaching" includes both "attaching (or attaching)" and "embedding (or incorporating)". In one example, the fluid injectors are embedded (eg, overmolded) in the molding and the PCBs are attached (attached) to the molded fluid injector after the implantation. Those PCBs are equipped with windows that expose their dies. In another example, both the fluid injector and the PCB are embedded in the part.

In one example, it was found that the use of an array of supply holes rather than longitudinal supply slots could have a positive effect on heat transfer within the die. For example, the fluid can cool the die better.

In the following, an exemplary embodiment consisting of a combination of various constituent elements of the present invention will be shown.
1. 1. It is a fluid injection device
A fluid injection die comprising a fluid layer for supplying a fluid and a substrate, wherein the substrate has a front surface on which the fluid layer is formed and a back surface for receiving the fluid.
An array of fluid supply holes penetrating the substrate, the fluid supply holes separated by ribs between the fluid supply holes, and each fluid supply hole guides the fluid from the back surface to the fluid layer. With an array of fluid supply holes,
An array of droplet generators in the fluid layer, the fluid injection device comprising an array of droplet generators arranged in parallel with the array of fluid supply holes downstream of the fluid supply holes.
2. Molds and
An elongated channel in the molded product that comprises an elongated channel for carrying fluid into the fluid supply hole toward the back surface of the substrate.
The fluid injection device according to 1 above, wherein the rib extends across the channel.
3. 3. 2. The fluid injection device according to the above 2, further comprising a plurality of fluid injection dies arranged parallel to each other so as to cross the molded product.
4. In a fluid injection assembly including the plurality of fluid injection devices of the above 3, each fluid injection device has a plurality of dies arranged in parallel, and the plurality of fluid injection devices are arranged in parallel and alternately. A fluid injection assembly that is arranged along the molding in a configured configuration and the ends of adjacent fluid injection devices overlap within the configuration.
5. A fluid injection assembly comprising the plurality of fluid injection devices of the above 2, wherein a printed circuit board is attached to the fluid injection device around the fluid injection die.
6. It further comprises a manifold formed within the fluid layer, the separated fluid supply holes leading to the manifold, the manifold being at least one droplet generator for supplying fluid to the droplet generator. The fluid injection device according to 1 above, which extends along an array of.
7. The fluid injection device according to 1 above, wherein the width of the die is in the range of about 150 micrometers to about 550 micrometers.
8. Each drop generator
With the injection chamber
The inlet between the injection chamber and the manifold,
With the nozzle above the injection chamber,
The fluid injection device according to the above 1, comprising an injection element in the chamber for injecting a fluid from the chamber through the nozzle.
9. 8. The fluid injection device according to 8, wherein the substrate is made of bulk silicon, and the injection element is arranged on the bulk silicon substrate.
10. 8. The fluid injection device according to 8 above, wherein the inlet is narrowed so that the maximum width of the inlet to the injection chamber is smaller than the diameter of the injection chamber.
11. 10. The fluid injection device according to 10. The maximum width of the inlet is smaller than 2/3 of the diameter of the injection chamber.
12. The fluid injection device according to the above 6, further comprising a columnar structure arranged adjacent to each inlet in the manifold outside each inlet.
13. 6. The fluid injection device according to the above 6, further comprising a columnar structure arranged in the manifold on each silicon rib.
14. Each fluid supply hole is tapered so that the opening on the front surface of the silicon substrate is smaller than the opening on the back surface of the silicon substrate, and each silicon rib is tapered. The fluid injection device according to 1 above, which becomes narrower as it extends from the front surface of the silicon substrate to the back surface corresponding to the fluid supply hole.
15. Molds and
A fluid injection assembly comprising at least one fluid injection die attached to the molding.
Each die
A bulk silicon substrate forming the back surface of the die,
With at least one row of droplet generators on the front surface of the bulk silicon substrate,
At least one row of fluid supply holes penetrating the substrate and spaced along the longitudinal direction of the substrate to carry fluid to the row of droplet generators, said of the fluid supply holes. The rows are parallel to said row of droplet generators, with at least one row of fluid supply holes, and
A bulk silicon rib sandwiched between the fluid supply holes
A fluid injection assembly comprising the molding having a channel on the back surface of the substrate to carry the fluid to the fluid supply hole.

Claims (15)

It is a fluid injection device
A fluid injection die comprising a fluid layer for supplying a fluid and a substrate, wherein the substrate has a front surface on which the fluid layer is formed and a back surface for receiving the fluid.
An array of fluid supply holes penetrating the substrate, the fluid supply holes separated by ribs between the fluid supply holes, and each fluid supply hole guides the fluid from the back surface to the fluid layer. With an array of fluid supply holes,
A first array of droplet generators in the fluid layer, downstream of the array of fluid supply holes, with a first array of droplet generators arranged parallel to the array of fluid supply holes. ,
A common manifold formed in the fluid layer, wherein the separated fluid supply holes lead to the common manifold, and the common manifold feeds fluid into the droplet generator of the first array. With a common manifold extending along a first array of said droplet generators for feeding,
A columnar structure including a plurality of aerotolerant foam Architecture (BTA) columnar body, the BTA columnar body is disposed in said common manifold between the fluid supply hole on the rib, and the BTA columnar body Includes a columnar structure that is not located above the fluid supply hole.
A fluid injection device in which the width of each of the BTA columns is at least 1/2 the diameter of a fluid supply hole leading to the common manifold. The fluid injection device according to claim 1, wherein each width of the BTA columnar body is substantially the same as the diameter of the fluid supply hole leading to the common manifold. A second array of droplet generators in the fluid layer, downstream of the array of fluid supply holes, a second array of droplet generators arranged parallel to the array of fluid supply holes. Including
An array of fluid supply holes and an array of the plurality of BTA columns extend between the first and second arrays of the droplet generator.
Claim that the common manifold extends between the first and second arrays of the droplet generators to supply fluid to the droplet generators of the first and second arrays. The fluid injection device according to 1 or 2. Molds and
Elongated channels in the part, including elongated channels for carrying fluid into the fluid supply holes towards the back surface of the substrate.
The fluid injection device according to any one of claims 1 to 3, wherein the rib extends across the elongated channel. The fluid injection device according to claim 4, wherein the array of fluid supply holes extends along the elongated channel in the molded product. The fluid injection apparatus according to claim 4 or 5, further comprising a plurality of fluid injection dies arranged parallel to each other so as to cross the molded product. The fluid injection device according to any one of claims 1 to 6, wherein the width of the fluid injection die is in the range of 150 micrometers to 550 micrometers. Each drop generator
With the injection chamber
The inlet from the common manifold to the injection chamber,
With the nozzle above the injection chamber,
The fluid injection device according to any one of claims 1 to 7, further comprising an injection element in the injection chamber for injecting a fluid from the injection chamber through the nozzle. The fluid injection device according to claim 8, wherein the substrate is made of bulk silicon, and the injection element is arranged on the bulk silicon substrate. The fluid injection device according to claim 8 or 9, wherein the inlet is narrowed so that the maximum width of the inlet to the injection chamber is smaller than the diameter of the injection chamber. The fluid injection device according to claim 10, wherein the maximum width of the inlet is smaller than two-thirds of the diameter of the injection chamber. Claims 8-11 include another columnar structure comprising at least one particle resistant architecture (PTA) columnar body located within the common manifold outside each of the inlets and adjacent to each of the inlets. The fluid injection device according to any one of. The fluid injection device according to claim 12, wherein the at least one PTA columnar body is arranged in an inlet bay through which the inlet communicates. The at least one PTA columnar body is two PTA columnar bodies provided at a distance to the inlet of 2 times or less the diameter of the PTA columnar body or 1 time or less of the diameter of the PTA columnar body. The fluid injection device according to claim 12 or 13. Each fluid supply hole is tapered so that its opening on the front surface of the substrate is smaller than its opening on the back surface of the substrate, and each rib is tapered. The fluid injection device according to any one of claims 1 to 14, which becomes narrower as it extends from the front surface of the substrate to the back surface of the substrate corresponding to the fluid supply holes.

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