JP6822863B2 - Thermosetting composition, encapsulant containing the same, frame encapsulant for organic EL element, surface encapsulant for organic EL element, and cured product thereof. - Google Patents
Thermosetting composition, encapsulant containing the same, frame encapsulant for organic EL element, surface encapsulant for organic EL element, and cured product thereof. Download PDFInfo
- Publication number
- JP6822863B2 JP6822863B2 JP2017013367A JP2017013367A JP6822863B2 JP 6822863 B2 JP6822863 B2 JP 6822863B2 JP 2017013367 A JP2017013367 A JP 2017013367A JP 2017013367 A JP2017013367 A JP 2017013367A JP 6822863 B2 JP6822863 B2 JP 6822863B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- meth
- acrylic monomer
- thermosetting composition
- sealant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229920001187 thermosetting polymer Polymers 0.000 title claims description 126
- 239000000203 mixture Substances 0.000 title claims description 122
- 239000008393 encapsulating agent Substances 0.000 title description 5
- 239000000178 monomer Substances 0.000 claims description 93
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 84
- 125000001931 aliphatic group Chemical group 0.000 claims description 44
- 238000007789 sealing Methods 0.000 claims description 38
- 239000003795 chemical substances by application Substances 0.000 claims description 30
- 239000000565 sealant Substances 0.000 claims description 30
- -1 2,2,6,6-tetramethylpiperidin 1-oxyl free radical Chemical class 0.000 claims description 26
- 239000003505 polymerization initiator Substances 0.000 claims description 26
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 20
- 125000003277 amino group Chemical group 0.000 claims description 10
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 claims description 9
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 7
- 125000004043 oxo group Chemical group O=* 0.000 claims description 6
- VXIVSQZSERGHQP-HQMMCQRPSA-N 2-chloroacetamide Chemical group N[14C](=O)CCl VXIVSQZSERGHQP-HQMMCQRPSA-N 0.000 claims description 5
- PGLTVOMIXTUURA-HQMMCQRPSA-N 2-iodoacetamide Chemical group N[14C](=O)CI PGLTVOMIXTUURA-HQMMCQRPSA-N 0.000 claims description 5
- DLFVBJFMPXGRIB-UHFFFAOYSA-N Acetamide Chemical group CC(N)=O DLFVBJFMPXGRIB-UHFFFAOYSA-N 0.000 claims description 5
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 claims description 5
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 5
- 125000004093 cyano group Chemical group *C#N 0.000 claims description 5
- ZBKFYXZXZJPWNQ-UHFFFAOYSA-N isothiocyanate group Chemical group [N-]=C=S ZBKFYXZXZJPWNQ-UHFFFAOYSA-N 0.000 claims description 5
- 125000005395 methacrylic acid group Chemical group 0.000 claims description 5
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 claims description 5
- 238000005538 encapsulation Methods 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 53
- 238000005401 electroluminescence Methods 0.000 description 24
- 239000000758 substrate Substances 0.000 description 21
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 20
- 239000000126 substance Substances 0.000 description 17
- 150000001875 compounds Chemical class 0.000 description 16
- 239000011248 coating agent Substances 0.000 description 14
- 238000000576 coating method Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 10
- 229920000642 polymer Polymers 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 9
- 239000003963 antioxidant agent Substances 0.000 description 8
- 238000000354 decomposition reaction Methods 0.000 description 8
- 239000002202 Polyethylene glycol Substances 0.000 description 7
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical class C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 7
- 229920001223 polyethylene glycol Polymers 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000001723 curing Methods 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 5
- 230000003078 antioxidant effect Effects 0.000 description 5
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 239000003607 modifier Substances 0.000 description 5
- SFLRURCEBYIKSS-UHFFFAOYSA-N n-butyl-2-[[1-(butylamino)-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound CCCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCCC SFLRURCEBYIKSS-UHFFFAOYSA-N 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 150000003254 radicals Chemical class 0.000 description 5
- DVWQNBIUTWDZMW-UHFFFAOYSA-N 1-naphthalen-1-ylnaphthalen-2-ol Chemical compound C1=CC=C2C(C3=C4C=CC=CC4=CC=C3O)=CC=CC2=C1 DVWQNBIUTWDZMW-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 229920001451 polypropylene glycol Polymers 0.000 description 4
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 229930185605 Bisphenol Natural products 0.000 description 3
- 0 CC1C([C@](C)(*=*C(C)(c2ccccc2)OC(C)=O)OC(C)=O)=CC=CC1 Chemical compound CC1C([C@](C)(*=*C(C)(c2ccccc2)OC(C)=O)OC(C)=O)=CC=CC1 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- QUZSUMLPWDHKCJ-UHFFFAOYSA-N bisphenol A dimethacrylate Chemical class C1=CC(OC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OC(=O)C(C)=C)C=C1 QUZSUMLPWDHKCJ-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- 230000004580 weight loss Effects 0.000 description 3
- RKMGAJGJIURJSJ-UHFFFAOYSA-N 2,2,6,6-tetramethylpiperidine Chemical compound CC1(C)CCCC(C)(C)N1 RKMGAJGJIURJSJ-UHFFFAOYSA-N 0.000 description 2
- AVTLBBWTUPQRAY-UHFFFAOYSA-N 2-(2-cyanobutan-2-yldiazenyl)-2-methylbutanenitrile Chemical compound CCC(C)(C#N)N=NC(C)(CC)C#N AVTLBBWTUPQRAY-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 125000000623 heterocyclic group Chemical group 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- ZQMHJBXHRFJKOT-UHFFFAOYSA-N methyl 2-[(1-methoxy-2-methyl-1-oxopropan-2-yl)diazenyl]-2-methylpropanoate Chemical compound COC(=O)C(C)(C)N=NC(C)(C)C(=O)OC ZQMHJBXHRFJKOT-UHFFFAOYSA-N 0.000 description 2
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 2
- 238000010943 off-gassing Methods 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 239000002530 phenolic antioxidant Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- MVEKCXBOGWJNOS-UHFFFAOYSA-N 1-tert-butyl-4-(4-tert-butylcyclohexyl)peroxycyclohexane;carbonic acid Chemical compound OC(O)=O.C1CC(C(C)(C)C)CCC1OOC1CCC(C(C)(C)C)CC1 MVEKCXBOGWJNOS-UHFFFAOYSA-N 0.000 description 1
- KGRVJHAUYBGFFP-UHFFFAOYSA-N 2,2'-Methylenebis(4-methyl-6-tert-butylphenol) Chemical compound CC(C)(C)C1=CC(C)=CC(CC=2C(=C(C=C(C)C=2)C(C)(C)C)O)=C1O KGRVJHAUYBGFFP-UHFFFAOYSA-N 0.000 description 1
- LRKHETTZBPSQLT-UHFFFAOYSA-N 2,2-bis(2,2,6,6-tetramethyl-1-octoxypiperidin-4-yl)decanedioic acid Chemical compound C1C(C)(C)N(OCCCCCCCC)C(C)(C)CC1C(CCCCCCCC(O)=O)(C(O)=O)C1CC(C)(C)N(OCCCCCCCC)C(C)(C)C1 LRKHETTZBPSQLT-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- MJGLWGBXQWRFCX-UHFFFAOYSA-N 2-[(1-imino-2-methyl-1-pyrrolidin-1-ylpropan-2-yl)diazenyl]-2-methyl-1-pyrrolidin-1-ylpropan-1-imine;dihydrochloride Chemical compound Cl.Cl.C1CCCN1C(=N)C(C)(C)N=NC(C)(C)C(=N)N1CCCC1 MJGLWGBXQWRFCX-UHFFFAOYSA-N 0.000 description 1
- PFHOSZAOXCYAGJ-UHFFFAOYSA-N 2-[(2-cyano-4-methoxy-4-methylpentan-2-yl)diazenyl]-4-methoxy-2,4-dimethylpentanenitrile Chemical compound COC(C)(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)(C)OC PFHOSZAOXCYAGJ-UHFFFAOYSA-N 0.000 description 1
- AEZBIUBWOJAYOA-UHFFFAOYSA-N 2-[2-[2-[2-[1-(2-hydroxyethyl)-4,5-dihydroimidazol-2-yl]propan-2-yldiazenyl]propan-2-yl]-4,5-dihydroimidazol-1-yl]ethanol Chemical compound N=1CCN(CCO)C=1C(C)(C)N=NC(C)(C)C1=NCCN1CCO AEZBIUBWOJAYOA-UHFFFAOYSA-N 0.000 description 1
- CKSAKVMRQYOFBC-UHFFFAOYSA-N 2-cyanopropan-2-yliminourea Chemical compound N#CC(C)(C)N=NC(N)=O CKSAKVMRQYOFBC-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- LYPGJGCIPQYQBW-UHFFFAOYSA-N 2-methyl-2-[[2-methyl-1-oxo-1-(prop-2-enylamino)propan-2-yl]diazenyl]-n-prop-2-enylpropanamide Chemical compound C=CCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCC=C LYPGJGCIPQYQBW-UHFFFAOYSA-N 0.000 description 1
- IFXDUNDBQDXPQZ-UHFFFAOYSA-N 2-methylbutan-2-yl 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(C)CC IFXDUNDBQDXPQZ-UHFFFAOYSA-N 0.000 description 1
- BSXGCUHREZFSRY-UHFFFAOYSA-N 3-[[1-amino-2-[[1-amino-1-(2-carboxyethylimino)-2-methylpropan-2-yl]diazenyl]-2-methylpropylidene]amino]propanoic acid;tetrahydrate Chemical compound O.O.O.O.OC(=O)CCNC(=N)C(C)(C)N=NC(C)(C)C(=N)NCCC(O)=O BSXGCUHREZFSRY-UHFFFAOYSA-N 0.000 description 1
- VFXXTYGQYWRHJP-UHFFFAOYSA-N 4,4'-azobis(4-cyanopentanoic acid) Chemical compound OC(=O)CCC(C)(C#N)N=NC(C)(CCC(O)=O)C#N VFXXTYGQYWRHJP-UHFFFAOYSA-N 0.000 description 1
- HPFWYRKGZUGGPB-UHFFFAOYSA-N 4,6-dichloro-n-(2,4,4-trimethylpentan-2-yl)-1,3,5-triazin-2-amine Chemical compound CC(C)(C)CC(C)(C)NC1=NC(Cl)=NC(Cl)=N1 HPFWYRKGZUGGPB-UHFFFAOYSA-N 0.000 description 1
- PRWJPWSKLXYEPD-UHFFFAOYSA-N 4-[4,4-bis(5-tert-butyl-4-hydroxy-2-methylphenyl)butan-2-yl]-2-tert-butyl-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(C)CC(C=1C(=CC(O)=C(C=1)C(C)(C)C)C)C1=CC(C(C)(C)C)=C(O)C=C1C PRWJPWSKLXYEPD-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-VAWYXSNFSA-N AIBN Substances N#CC(C)(C)\N=N\C(C)(C)C#N OZAIFHULBGXAKX-VAWYXSNFSA-N 0.000 description 1
- 102100040409 Ameloblastin Human genes 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 101000891247 Homo sapiens Ameloblastin Proteins 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- JWUXJYZVKZKLTJ-UHFFFAOYSA-N Triacetonamine Chemical compound CC1(C)CC(=O)CC(C)(C)N1 JWUXJYZVKZKLTJ-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical class CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- ALBJGICXDBJZGK-UHFFFAOYSA-N [1-[(1-acetyloxy-1-phenylethyl)diazenyl]-1-phenylethyl] acetate Chemical compound C=1C=CC=CC=1C(C)(OC(=O)C)N=NC(C)(OC(C)=O)C1=CC=CC=C1 ALBJGICXDBJZGK-UHFFFAOYSA-N 0.000 description 1
- LXEKPEMOWBOYRF-UHFFFAOYSA-N [2-[(1-azaniumyl-1-imino-2-methylpropan-2-yl)diazenyl]-2-methylpropanimidoyl]azanium;dichloride Chemical compound Cl.Cl.NC(=N)C(C)(C)N=NC(C)(C)C(N)=N LXEKPEMOWBOYRF-UHFFFAOYSA-N 0.000 description 1
- FHLPGTXWCFQMIU-UHFFFAOYSA-N [4-[2-(4-prop-2-enoyloxyphenyl)propan-2-yl]phenyl] prop-2-enoate Chemical class C=1C=C(OC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OC(=O)C=C)C=C1 FHLPGTXWCFQMIU-UHFFFAOYSA-N 0.000 description 1
- KYIKRXIYLAGAKQ-UHFFFAOYSA-N abcn Chemical compound C1CCCCC1(C#N)N=NC1(C#N)CCCCC1 KYIKRXIYLAGAKQ-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 239000003242 anti bacterial agent Substances 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- XITRBUPOXXBIJN-UHFFFAOYSA-N bis(2,2,6,6-tetramethylpiperidin-4-yl) decanedioate Chemical compound C1C(C)(C)NC(C)(C)CC1OC(=O)CCCCCCCCC(=O)OC1CC(C)(C)NC(C)(C)C1 XITRBUPOXXBIJN-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- LWMFAFLIWMPZSX-UHFFFAOYSA-N bis[2-(4,5-dihydro-1h-imidazol-2-yl)propan-2-yl]diazene Chemical compound N=1CCNC=1C(C)(C)N=NC(C)(C)C1=NCCN1 LWMFAFLIWMPZSX-UHFFFAOYSA-N 0.000 description 1
- LBSPZZSGTIBOFG-UHFFFAOYSA-N bis[2-(4,5-dihydro-1h-imidazol-2-yl)propan-2-yl]diazene;dihydrochloride Chemical compound Cl.Cl.N=1CCNC=1C(C)(C)N=NC(C)(C)C1=NCCN1 LBSPZZSGTIBOFG-UHFFFAOYSA-N 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- GEJHIUFJTCYNSC-UHFFFAOYSA-N methyl 1-[(1-methoxycarbonylcyclohexyl)diazenyl]cyclohexane-1-carboxylate Chemical compound C1CCCCC1(C(=O)OC)N=NC1(C(=O)OC)CCCCC1 GEJHIUFJTCYNSC-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- SYWIXHZXHQDFOO-UHFFFAOYSA-N methyl n-phenyliminocarbamate Chemical class COC(=O)N=NC1=CC=CC=C1 SYWIXHZXHQDFOO-UHFFFAOYSA-N 0.000 description 1
- GDOPTJXRTPNYNR-UHFFFAOYSA-N methyl-cyclopentane Natural products CC1CCCC1 GDOPTJXRTPNYNR-UHFFFAOYSA-N 0.000 description 1
- 230000000051 modifying effect Effects 0.000 description 1
- YIMHRDBSVCPJOV-UHFFFAOYSA-N n'-(2-ethoxyphenyl)-n-(2-ethylphenyl)oxamide Chemical compound CCOC1=CC=CC=C1NC(=O)C(=O)NC1=CC=CC=C1CC YIMHRDBSVCPJOV-UHFFFAOYSA-N 0.000 description 1
- LKTCWOYIQVKYIV-UHFFFAOYSA-N n-butyl-4-chloro-n-(1,2,2,6,6-pentamethylpiperidin-4-yl)-1,3,5-triazin-2-amine Chemical compound N=1C=NC(Cl)=NC=1N(CCCC)C1CC(C)(C)N(C)C(C)(C)C1 LKTCWOYIQVKYIV-UHFFFAOYSA-N 0.000 description 1
- NPFIXJIFUHTLRP-UHFFFAOYSA-N n-cyclohexyl-2-methylpropanamide Chemical compound CC(C)C(=O)NC1CCCCC1 NPFIXJIFUHTLRP-UHFFFAOYSA-N 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical class OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- QLNJFJADRCOGBJ-UHFFFAOYSA-N propionamide Chemical compound CCC(N)=O QLNJFJADRCOGBJ-UHFFFAOYSA-N 0.000 description 1
- 229940080818 propionamide Drugs 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- XJAJNAQBHCNNBM-UHFFFAOYSA-N sulfo hydrogen sulfate dihydrate Chemical compound O.O.OS(=O)(=O)OS(O)(=O)=O XJAJNAQBHCNNBM-UHFFFAOYSA-N 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/10—Esters
- C08F20/12—Esters of monohydric alcohols or phenols
- C08F20/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F20/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
- C08K5/23—Azo-compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3432—Six-membered rings
- C08K5/3435—Piperidines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/14—Gas barrier composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymerisation Methods In General (AREA)
- Polymerization Catalysts (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Description
本発明は、熱硬化性組成物、これを含む封止剤、有機ＥＬ素子用枠封止剤、及び有機ＥＬ素子用面封止剤、並びにその硬化物に関する。 The present invention relates to a thermosetting composition, a sealant containing the same, a frame sealant for an organic EL device, a surface sealant for an organic EL element, and a cured product thereof.
有機ＥＬ（Ｅｌｅｃｔｒｏ−Ｌｕｍｉｎｅｓｃｅｎｃｅ）素子は、消費電力が少ないことから、ディスプレイや照明装置などに用いられつつある。有機ＥＬ素子は、大気中の水分や酸素によって劣化しやすいことから、各種シール部材で封止されて使用されることが一般的である。 Organic EL (Electro-Luminescence) elements are being used in displays, lighting devices, and the like because of their low power consumption. Since the organic EL element is easily deteriorated by moisture and oxygen in the atmosphere, it is generally used by being sealed with various sealing members.
有機ＥＬデバイスは、例えば、基板と、当該基板上に配置された有機ＥＬ素子と、基板と対になる封止基板とを含む構造体とすることができる。このような構造体の有機ＥＬ素子を封止する方法として、有機ＥＬ素子の周囲の基板に封止剤を枠状に塗布し、当該封止剤によって基板と封止基板とを貼り合わせる方法（枠封止法）が挙げられる。また、封止基板と基板との間、及び有機ＥＬ素子と封止基板との間に、封止剤を塗布し、これを硬化させる方法（面封止法）も挙げられる。 The organic EL device can be, for example, a structure including a substrate, an organic EL element arranged on the substrate, and a sealing substrate paired with the substrate. As a method of sealing the organic EL element of such a structure, a sealing agent is applied in a frame shape to the substrate around the organic EL element, and the substrate and the sealing substrate are bonded to each other by the sealing agent ( Frame sealing method) can be mentioned. Further, a method of applying a sealing agent between the sealing substrate and the substrate and between the organic EL element and the sealing substrate and curing the sealing agent (surface sealing method) can also be mentioned.
有機ＥＬ素子等の表示素子を封止するための封止剤として、１分子内に２個以上のエポキシ基を有するエポキシ樹脂と、硬化促進剤とを含む樹脂組成物が知られている（特許文献１）。 As a sealing agent for sealing a display element such as an organic EL element, a resin composition containing an epoxy resin having two or more epoxy groups in one molecule and a curing accelerator is known (patented). Document 1).
ここで、封止剤には、熱硬化中や硬化後に有機ＥＬ素子等の表示素子に影響を与えるアウトガスが少ないことが求められている。さらに、封止剤には、塗布時の流動性が高いことや、塗布装置内（例えば、無酸素かつ４０℃以下の環境）等で一定期間保持しても、変質がないことも求められている。これに対し、上記特許文献１に記載の樹脂組成物は、塗布時の流動性が低いことがあり、熱安定性も十分でないことがあった。 Here, the sealing agent is required to have a small amount of outgas that affects a display element such as an organic EL element during or after heat curing. Further, the sealing agent is required to have high fluidity at the time of coating and to be not deteriorated even if it is held in a coating device (for example, an oxygen-free environment at 40 ° C. or lower) for a certain period of time. There is. On the other hand, the resin composition described in Patent Document 1 may have low fluidity at the time of coating and may not have sufficient thermal stability.
本発明は、上記のような事情に鑑みてなされたものである。すなわち、本発明は、塗布装置内等でも変質がなく、塗布性が良好であり、さらに熱処理や熱処理後にアウトガスが少ない熱硬化性組成物を提供する。 The present invention has been made in view of the above circumstances. That is, the present invention provides a thermosetting composition that does not deteriorate even in a coating apparatus or the like, has good coatability, and has less outgas after heat treatment or heat treatment.
すなわち、本発明の第１は、以下の熱硬化性組成物に関する。
［１］（Ａ）脂肪族（メタ）アクリルモノマーと、（Ｂ）アゾ系重合開始剤と、（Ｃ）下記一般式（１）で表される２，２，６，６−テトラメチルピペリジン１−オキシル フリーラジカル誘導体と、を含み、Ｅ型粘度計で測定される、２５℃、２．５ｒｐｍにおける粘度が５ｍＰａ・ｓ以上４００ｍＰａ・ｓ以下である、熱硬化性組成物。
[1] (A) an aliphatic (meth) acrylic monomer, (B) an azo-based polymerization initiator, and (C) 2,2,6,6-tetramethylpiperidin 1 represented by the following general formula (1). A thermosetting composition containing an oxyl-free radical derivative and having a viscosity at 25 ° C. and 2.5 rpm of 5 mPa · s or more and 400 mPa · s or less as measured by an E-type viscometer.
［２］前記（Ａ）脂肪族（メタ）アクリルモノマーの重量平均分子量が、４００以上２０００以下である、［１］に記載の熱硬化性組成物。
［３］前記（Ａ）脂肪族（メタ）アクリルモノマーが、メタクリルモノマーである、［１］または［２］に記載の熱硬化性組成物。
［４］（Ａ−２）環構造を有する（メタ）アクリルモノマーをさらに含む、［１］〜［３］のいずれかに記載の熱硬化性組成物。
［５］前記（Ａ−２）環構造を有する（メタ）アクリルモノマーの重量平均分子量が、４００以上２０００以下である、［４］に記載の熱硬化性組成物。
［６］前記（Ａ−２）環構造を有する（メタ）アクリルモノマーが、ビスフェノールＡ型の構造を含む、［４］または［５］に記載の熱硬化性組成物。
［７］（Ｄ）レベリング剤をさらに含む、［１］〜［６］のいずれかに記載の熱硬化性組成物。
[2] The thermosetting composition according to [1], wherein the (A) aliphatic (meth) acrylic monomer has a weight average molecular weight of 400 or more and 2000 or less.
[3] The thermosetting composition according to [1] or [2], wherein the (A) aliphatic (meth) acrylic monomer is a methacrylic monomer.
[4] The thermosetting composition according to any one of [1] to [3], further comprising a (meth) acrylic monomer having a ring structure (A-2).
[5] The thermosetting composition according to [4], wherein the (meth) acrylic monomer having the ring structure (A-2) has a weight average molecular weight of 400 or more and 2000 or less.
[6] The thermosetting composition according to [4] or [5], wherein the (meth) acrylic monomer having the (A-2) ring structure contains a bisphenol A type structure.
[7] The thermosetting composition according to any one of [1] to [6], further comprising a leveling agent (D).
本発明の第２は、以下の封止剤や有機ＥＬ素子用の封止剤等に関する。
［８］前記［１］〜［７］のいずれかに記載の熱硬化性組成物を含む、表示素子用の封止剤。
［９］前記［１］〜［７］のいずれかに記載の熱硬化性組成物を含み、有機ＥＬ素子の枠封止に用いる、有機ＥＬ素子用枠封止剤。
［１０］前記［１］〜［７］のいずれかに記載の熱硬化性組成物を含み、有機ＥＬ素子の面封止に用いる、有機ＥＬ素子用面封止剤。
［１１］シート状に成形されている、［１０］に記載の有機ＥＬ素子用面封止剤。
［１２］前記［１０］に記載の有機ＥＬ素子用面封止剤の硬化物。
The second aspect of the present invention relates to the following encapsulants, encapsulants for organic EL devices, and the like.
[8] A sealing agent for a display device containing the thermosetting composition according to any one of the above [1] to [7].
[9] A frame sealant for an organic EL device, which contains the thermosetting composition according to any one of the above [1] to [7] and is used for frame sealing of an organic EL element.
[10] A surface sealant for an organic EL device containing the thermosetting composition according to any one of the above [1] to [7] and used for surface sealing of an organic EL element.
[11] The surface sealant for an organic EL element according to [10], which is molded into a sheet shape.
[12] A cured product of the surface sealant for an organic EL device according to the above [10].
本発明によれば、塗布装置内等でも変質せず、塗布性が良好であり、さらに熱処理を行ってもアウトガスが少ない熱硬化性組成物とすることができる。 According to the present invention, it is possible to obtain a thermosetting composition which does not deteriorate even in a coating apparatus or the like, has good coatability, and has little outgas even when heat-treated.
１．熱硬化性組成物について
本発明の熱硬化性組成物は、各種表示素子を封止するための封止剤として用いられる。各種表示素子を封止するための封止剤には、適度な流動性が求められる。流動性が低いと、所望の領域に封止剤を塗り広げられず、十分な封止性能が得られないことがある。また、封止剤には、保存時に重合性組成物と重合開始剤とが反応し難く、ポットライフが長いことも求められる。また、塗布装置内（例えば、無酸素かつ４０℃以下の環境下）で安定であることも求められている。さらに、封止基板と基板との貼り合わせは、真空中で行われることが一般的であり、通常、１Ｐａ以下の真空環境下で行われる。そのため、封止剤には、真空環境下でも、成分が揮発し難いことが求められることがある。また、封止剤には、熱硬化中や硬化後にアウトガスが少ないことも求められる。封止剤の硬化中や硬化後に、封止剤やその硬化物から表示素子に影響のあるアウトガスが発生すると、表示素子が劣化すること等がある。しかしながら、これらの性能を併せ持った熱硬化性組成物が得られていないのが実状である。さらに、封止基板と基板との貼り合わせは、真空中で行われることが一般的であり、通常、１Ｐａ以下の真空環境下で行われる。
1. 1. Thermosetting Composition The thermosetting composition of the present invention is used as a sealing agent for sealing various display elements. Appropriate fluidity is required for the sealing agent for sealing various display elements. If the fluidity is low, the sealant cannot be spread over the desired region, and sufficient sealing performance may not be obtained. Further, the sealant is also required to have a long pot life because the polymerizable composition and the polymerization initiator are difficult to react with each other during storage. It is also required to be stable in the coating apparatus (for example, in an oxygen-free environment and at 40 ° C. or lower). Further, the bonding between the sealing substrate and the substrate is generally performed in a vacuum, and is usually performed in a vacuum environment of 1 Pa or less. Therefore, the sealant may be required to have components that are difficult to volatilize even in a vacuum environment. In addition, the sealant is also required to have a small amount of outgas during and after thermosetting. If outgas that affects the display element is generated from the sealant or its cured product during or after the sealant is cured, the display element may deteriorate. However, the reality is that a thermosetting composition having these performances has not been obtained. Further, the bonding of the sealing substrate and the substrate is generally performed in a vacuum, and is usually performed in a vacuum environment of 1 Pa or less.
これに対し、本発明の熱硬化性組成物では、（Ａ）脂肪族（メタ）アクリルモノマーを含むため、熱硬化性組成物の粘度が適度に低い。また、重合開始剤が（Ｂ）アゾ系重合開始剤であるため、（Ａ）（メタ）アクリルモノマーを短時間で硬化させることができ、熱硬化性組成物の硬化中や硬化後に、表示素子に影響を与えるガスが発生し難い。さらに、熱硬化型の（Ａ）（メタ）アクリルモノマーは、一般的に安定性が低いことが多いが、本発明の熱硬化性組成物では（Ｃ）テトラメチルピペリジンフリーラジカル誘導体によって、保存中や塗布装置等の内部で（Ａ）（メタ）アクリルモノマーと（Ｂ）アゾ系重合開始剤との反応が抑制されるため、熱硬化性組成物を安定して塗布することができる。つまり、本発明によれば、塗布性が良好であり、さらに熱処理や熱処理後にアウトガスが少ない熱硬化性組成物とすることができる。
以下、熱硬化性組成物が含む各成分について説明する。
On the other hand, since the thermosetting composition of the present invention contains (A) an aliphatic (meth) acrylic monomer, the viscosity of the thermosetting composition is moderately low. Further, since the polymerization initiator is (B) an azo-based polymerization initiator, the (A) (meth) acrylic monomer can be cured in a short time, and the display element can be cured during or after the thermosetting composition is cured. It is difficult to generate gas that affects the temperature. Further, the thermosetting (A) (meth) acrylic monomer is generally less stable, but in the thermosetting composition of the present invention, it is being stored by the (C) tetramethylpiperidin-free radical derivative. Since the reaction between the (A) (meth) acrylic monomer and the (B) azo-based polymerization initiator is suppressed inside the coating device or the like, the thermosetting composition can be stably coated. That is, according to the present invention, it is possible to obtain a thermosetting composition having good coatability and less outgas after heat treatment or heat treatment.
Hereinafter, each component contained in the thermosetting composition will be described.
（Ａ）脂肪族（メタ）アクリルモノマーについて
本発明の熱硬化性組成物が含む脂肪族（メタ）アクリルモノマーは、（メタ）アクリロイル基を少なくとも１つ、好ましくは２つ以上有するモノマーであれば特に制限されない。熱硬化性組成物を各種表示素子の封止剤とする場合、（メタ）アクリルモノマーの重合物が大気中の酸素や水分等から各種表示素子を保護する機能を果たす。なお、本明細書における（メタ）アクリルとは、アクリル及び／またはメタクリルを表す。脂肪族（メタ）アクリルモノマーを用いることで、熱硬化性組成物の粘度を低くでき、かつ、得られる硬化物に柔軟性を持たせることができる。
(A) Aliphatic (meth) acrylic monomer The aliphatic (meth) acrylic monomer contained in the thermosetting composition of the present invention is a monomer having at least one (meth) acryloyl group, preferably two or more. There are no particular restrictions. When the thermosetting composition is used as a sealant for various display elements, the polymer of the (meth) acrylic monomer functions to protect the various display elements from oxygen and moisture in the atmosphere. In addition, (meth) acrylic in this specification represents acrylic and / or methacryl. By using the aliphatic (meth) acrylic monomer, the viscosity of the thermosetting composition can be lowered, and the obtained cured product can be made flexible.
熱硬化性組成物は、（Ａ）脂肪族（メタ）アクリルモノマーを１種のみ含んでもよく、２種以上含んでもよい。一般に、重量平均分子量が大きい脂肪族（メタ）アクリルモノマーによれば、得られる硬化物の膜強度を高くできるものの、熱硬化性組成物の粘度が高くなる。一方、重量平均分子量が小さい脂肪族（メタ）アクリルモノマーは、得られる硬化物の膜強度が低いものの、熱硬化性組成物の粘度を低くすることができる。したがって、２種以上の（メタ）アクリルモノマーを組み合わせることで、熱硬化性組成物の粘度と、熱硬化性組成物から得られる硬化膜の膜強度とを、所望の範囲に調整しやすくなる。 The thermosetting composition may contain only one type of (A) aliphatic (meth) acrylic monomer, or may contain two or more types. In general, an aliphatic (meth) acrylic monomer having a large weight average molecular weight can increase the film strength of the obtained cured product, but increase the viscosity of the thermosetting composition. On the other hand, the aliphatic (meth) acrylic monomer having a small weight average molecular weight can reduce the viscosity of the thermosetting composition, although the film strength of the obtained cured product is low. Therefore, by combining two or more kinds of (meth) acrylic monomers, it becomes easy to adjust the viscosity of the thermosetting composition and the film strength of the cured film obtained from the thermosetting composition within a desired range.
ここで、（Ａ）脂肪族（メタ）アクリルモノマーの重量平均分子量は、４００以上２０００以下であることが好ましく、５００以上１０００以下であることがより好ましい。なお、本明細書において、「重量平均分子量」は、モノマーの構造から導き出しされる分子量であってもよく、ＧＰＣ（ゲルパーミエーションクロマトグラフィー）によって測定される値（ポリスチレン換算）であってもよい。脂肪族（メタ）アクリルモノマーの重量平均分子量が２０００以下であると、熱硬化性組成物の粘度が過度に高まらず、熱硬化性組成物の塗布性が良好になりやすい。一方、脂肪族（メタ）アクリルモノマーの重量平均分子量が４００以上であると、（Ａ）脂肪族（メタ）アクリルモノマーが真空環境下でも揮発し難くなる。そこで、真空環境下で揮発しやすい成分をより少なくすることが求められる場合、重量平均分子量が４００未満の脂肪族（メタ）アクリルモノマーの量は、熱硬化性組成物１００質量部に対して、好ましくは１０質量部未満、より好ましくは５質量部未満である。 Here, the weight average molecular weight of the (A) aliphatic (meth) acrylic monomer is preferably 400 or more and 2000 or less, and more preferably 500 or more and 1000 or less. In the present specification, the "weight average molecular weight" may be a molecular weight derived from the structure of the monomer, or may be a value (polystyrene conversion) measured by GPC (gel permeation chromatography). .. When the weight average molecular weight of the aliphatic (meth) acrylic monomer is 2000 or less, the viscosity of the thermosetting composition does not become excessively high, and the coatability of the thermosetting composition tends to be good. On the other hand, when the weight average molecular weight of the aliphatic (meth) acrylic monomer is 400 or more, the (A) aliphatic (meth) acrylic monomer is less likely to volatilize even in a vacuum environment. Therefore, when it is required to reduce the components that are easily volatilized in a vacuum environment, the amount of the aliphatic (meth) acrylic monomer having a weight average molecular weight of less than 400 is based on 100 parts by mass of the thermosetting composition. It is preferably less than 10 parts by mass, more preferably less than 5 parts by mass.
また、（Ａ）脂肪族（メタ）アクリルモノマーは、アクリロイル基及びメタクリロイル基のいずれの基を有するモノマーであってもよいが、メタクリロイル基を有するモノマー、つまりメタクリルモノマーのほうが好ましい。熱硬化性組成物が、メタクリルモノマーを含む場合、アクリルモノマーを含む場合より、得られる硬化膜の強度が高くなりやすい。メタクリルモノマーのほうが、アクリルモノマーより反応速度が遅く、停止反応が生じ難い。したがって、分子量が十分に大きくなりやすく、膜強度が高まりやすい。 Further, the (A) aliphatic (meth) acrylic monomer may be a monomer having either an acryloyl group or a methacryloyl group, but a monomer having a methacryloyl group, that is, a methacrylic monomer is preferable. When the thermosetting composition contains a methacrylic monomer, the strength of the obtained cured film tends to be higher than when the thermosetting composition contains an acrylic monomer. The reaction rate of the methacrylic monomer is slower than that of the acrylic monomer, and the termination reaction is less likely to occur. Therefore, the molecular weight tends to be sufficiently large, and the film strength tends to increase.
（Ａ）脂肪族（メタ）アクリルモノマーは、脂肪族鎖を有し、かつ上記重量平均分子量を有するモノマーであれば特に制限されず、直鎖状および分岐鎖状のいずれの構造を有する（メタ）アクリルモノマーであってもよい。（Ａ）脂肪族（メタ）アクリルモノマーの具体例には、ポリエチレングリコールジ（メタ）アクリレート、ポリプロピレングリコールジ（メタ）アクリレート、ポリテトラメチレングリコールジ（メタ）アクリレート等のジ（メタ）アクリレート；グリセリンポリエチレングリコールトリ（メタ）アクリレート、ジペンタエリスリトールペンタ（メタ）アクリレート、ジペンタエリスリトールヘキサ（メタ）アクリレート、グリセリンポリグリシジルエーテルポリ（メタ）アクリレート等の多官能（メタ）アクリレートが含まれる。 The (A) aliphatic (meth) acrylic monomer is not particularly limited as long as it has an aliphatic chain and has the above weight average molecular weight, and has either a linear structure or a branched chain structure (meth). ) It may be an acrylic monomer. Specific examples of the aliphatic (meth) acrylic monomer include di (meth) acrylates such as polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, and polytetramethylene glycol di (meth) acrylate; glycerin. Polyfunctional (meth) acrylates such as polyethylene glycol tri (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and glycerin polyglycidyl ether poly (meth) acrylate are included.
上記の中でも分子量が高くても、粘度が適度に低いとの観点から、好ましいモノマーとして、ポリエチレングリコールジ（メタ）アクリレート及びポリプロピレングリコールジ（メタ）アクリレートが挙げられる。 Among the above, polyethylene glycol di (meth) acrylate and polypropylene glycol di (meth) acrylate can be mentioned as preferable monomers from the viewpoint that the viscosity is moderately low even if the molecular weight is high.
さらに、（Ａ−２）環構造を有する（メタ）アクリルモノマーを含むことが好ましい。（Ａ）脂肪族（メタ）アクリルモノマーと、（Ａ−２）環構造を有する（メタ）アクリルモノマーとを含有することで、熱硬化性組成物の粘度を低く、かつ、得られる硬化膜の膜強度を高くすることができる。 Further, it is preferable to contain a (meth) acrylic monomer having a (A-2) ring structure. By containing (A) an aliphatic (meth) acrylic monomer and (A-2) a (meth) acrylic monomer having a ring structure, the viscosity of the thermosetting composition is lowered, and the obtained cured film has a low viscosity. The film strength can be increased.
ここで、（Ａ−２）環構造を有する（メタ）アクリルモノマーの重量平均分子量は、４００以上２０００以下であることが好ましく、５００以上１０００以下であることがより好ましい。重量平均分子量が２０００以下であると、熱硬化性組成物の粘度が過度に高まらず、熱硬化性組成物の塗布性が良好になりやすい。一方、重量平均分子量が４００以上であると、（Ａ−２）環構造を有する（メタ）アクリルモノマーが真空環境下でも揮発し難くなる。そこで、真空環境下で揮発しやすい成分をより少なくすることが求められる場合、重量平均分子量が４００未満の環構造を有する（メタ）アクリルモノマーの量は、熱硬化性組成物１００質量部に対して、好ましくは１０質量部未満、より好ましくは５質量部未満である。 Here, the weight average molecular weight of the (meth) acrylic monomer having the (A-2) ring structure is preferably 400 or more and 2000 or less, and more preferably 500 or more and 1000 or less. When the weight average molecular weight is 2000 or less, the viscosity of the thermosetting composition does not become excessively high, and the coatability of the thermosetting composition tends to be good. On the other hand, when the weight average molecular weight is 400 or more, the (meth) acrylic monomer having the (A-2) ring structure is less likely to volatilize even in a vacuum environment. Therefore, when it is required to reduce the amount of components that easily volatilize in a vacuum environment, the amount of the (meth) acrylic monomer having a ring structure having a weight average molecular weight of less than 400 is based on 100 parts by mass of the thermosetting composition. It is preferably less than 10 parts by mass, more preferably less than 5 parts by mass.
（Ａ）脂肪族（メタ）アクリルモノマーと、（Ａ−２）環構造を有する（メタ）アクリルモノマーとの比率（重量比）は、３０：７０〜９０：１０であることが好ましく、４０：６０〜８０：２０であることがより好ましい。 The ratio (weight ratio) of the (A) aliphatic (meth) acrylic monomer to the (A-2) ring-structured (meth) acrylic monomer is preferably 30:70 to 90:10, preferably 40: More preferably, it is 60 to 80:20.
一方、（Ａ−２）環構造を有する（メタ）アクリルモノマーは、芳香環、脂環式、またはヘテロ環を含むモノマーであれば特に制限されない。特に、芳香環を有する（メタ）アクリルモノマーが好ましい。 On the other hand, the (meth) acrylic monomer having the (A-2) ring structure is not particularly limited as long as it is a monomer containing an aromatic ring, an alicyclic ring, or a heterocycle. In particular, a (meth) acrylic monomer having an aromatic ring is preferable.
芳香環を有する（メタ）アクリルモノマーの例には、（ポリ）エトキシ変性ビスフェノールＡジ（メタ）アクリレート、（ポリ）プロポキシ変性ビスフェノールＡジ（メタ）アクリレート、（ポリ）エトキシ（ポリ）プロポキシ変性ビスフェノールＡジ（メタ）アクリレート等のビスフェノールＡ型構造を有するジ（メタ）アクリレート；（ポリ）エトキシ変性ビスフェノールＦジ（メタ）アクリレート、（ポリ）プロポキシ変性ビスフェノールＦジ（メタ）アクリレート、（ポリ）エトキシ（ポリ）プロポキシ変性ビスフェノールＦジ（メタ）アクリレート等のビスフェノールＦ型構造を有するジ（メタ）アクリレート；（ポリ）エトキシ変性ビスフェノールＳジ（メタ）アクリレート、（ポリ）プロポキシ変性ビスフェノールＳジ（メタ）アクリレート、（ポリ）エトキシ（ポリ）プロポキシ変性ビスフェノールＳジ（メタ）アクリレート等のビスフェノールＳ型構造を有するジ（メタ）アクリレート；ビフェノール（ポリ）エトキシジ（メタ）アクリレート、ビフェノール（ポリ）プロポキシジ（メタ）アクリレート等のビフェノール構造を有するジ（メタ）アクリレート；フタル酸変性ペンタエリスリトールトリ（メタ）アクリレート；ジヒドロキシナフタレン（ポリ）エトキシジ（メタ）アクリレート、ジヒドロキシナフタレン（ポリ）プロポキシジ（メタ）アクリレート、ビナフトールジ（メタ）アクリレート、ビナフトール（ポリ）エトキシジ（メタ）アクリレート、ビナフトール（ポリ）プロポキシジ（メタ）アクリレート、（ポリ）カプロラクトン変性ビナフトールジ（メタ）アクリレート等の縮合環を有する（メタ）アクリレート；ビスフェノールフルオレンジ（メタ）アクリレート、ビスフェノキシメタノールフルオレンジ（メタ）アクリレート、ビスフェノキシエタノールフルオレンジ（メタ）アクリレート、ビスフェノキシ（ポリ）カプロラクトンフルオレンジ（メタ）アクリレート等の複数の芳香環を有するジ（メタ）アクリレート；ビフェニル型フェノールアラルキルエポキシ樹脂とアクリル酸との反応物；等が含まれる。 Examples of (meth) acrylic monomers having an aromatic ring include (poly) ethoxy-modified bisphenol A di (meth) acrylate, (poly) propoxy-modified bisphenol A di (meth) acrylate, and (poly) ethoxy (poly) propoxy-modified bisphenol. Di (meth) acrylate having a bisphenol A type structure such as A di (meth) acrylate; (poly) ethoxy-modified bisphenol F di (meth) acrylate, (poly) propoxy-modified bisphenol F di (meth) acrylate, (poly) ethoxy Di (meth) acrylate having a bisphenol F type structure such as (poly) propoxy-modified bisphenol F di (meth) acrylate; (poly) ethoxy-modified bisphenol S di (meth) acrylate, (poly) propoxy-modified bisphenol S di (meth) Di (meth) acrylate having a bisphenol S-type structure such as acrylate, (poly) ethoxy (poly) propoxy-modified bisphenol S di (meth) acrylate; biphenol (poly) ethoxydi (meth) acrylate, biphenol (poly) propoxydi (meth) Di (meth) acrylate having a biphenol structure such as acrylate; phthalic acid-modified pentaerythritol tri (meth) acrylate; dihydroxynaphthalene (poly) ethoxydi (meth) acrylate, dihydroxynaphthalene (poly) propoxydi (meth) acrylate, binaphthol di (meth) acrylate ) A (meth) acrylate having a fused ring such as acrylate, binaphthol (poly) ethoxydi (meth) acrylate, binaphthol (poly) propoxydi (meth) acrylate, (poly) caprolactone-modified binaphthol di (meth) acrylate; bisphenol full orange (meth) acrylate. ) Di (meth) acrylate having multiple aromatic rings such as acrylate, bisphenoli methanol full orange (meth) acrylate, bisphenoliethanol full orange (meth) acrylate, bisphenoli (poly) caprolactone full orange (meth) acrylate; biphenyl type Reactants of phenol aralkyl epoxy resin and acrylic acid; etc. are included.
脂環式炭化水素骨格を有する（メタ）アクリレート化合物の例には、水添ビスフェノールＡ（ポリ）エトキシジ（メタ）アクリレート、水添ビスフェノールＡ（ポリ）プロポキシジ（メタ）アクリレート、水添ビスフェノールＦ（ポリ）エトキシジ（メタ）アクリレート、水添ビスフェノールＦ（ポリ）プロポキシジ（メタ）アクリレート、水添ビスフェノールＳ（ポリ）エトキシジ（メタ）アクリレート、水添ビスフェノールＳ（ポリ）プロポキシジ（メタ）アクリレート等が含まれる。 Examples of (meth) acrylate compounds having an alicyclic hydrocarbon skeleton include hydrogenated bisphenol A (poly) ethoxydi (meth) acrylate, hydrogenated bisphenol A (poly) propoxydi (meth) acrylate, and hydrogenated bisphenol F (poly). ) Ethoxydi (meth) acrylate, hydrogenated bisphenol F (poly) propoxydi (meth) acrylate, hydrogenated bisphenol S (poly) ethoxydi (meth) acrylate, hydrogenated bisphenol S (poly) propoxydi (meth) acrylate and the like.
ヘテロ環骨格を有する（メタ）アクリレート化合物の例には、イソシアヌル酸ＥＯ変性ジ（メタ）アクリレート、ε−カプロラクトン変性トリス（（メタ）アクロキシエチル）イソシアヌレート、イソシアヌル酸ＥＯ変性ジ及びトリアクリレート、ヒドロキシピバルアルデヒド変性トリメチロールプロパンジ（メタ）アクリレート、スピログリコールジ（メタ）アクリレート等が含まれる。 Examples of (meth) acrylate compounds having a heterocyclic skeleton include isocyanuric acid EO-modified di (meth) acrylate, ε-caprolactone-modified tris ((meth) acloxyethyl) isocyanurate, isocyanuric acid EO-modified di and triacrylate, Hydroxypivalaldehyde-modified trimethylolpropane di (meth) acrylate, spiroglycol di (meth) acrylate and the like are included.
上記の中でも入手が容易である等の観点から、好ましいモノマーの例には、（ポリ）エトキシ変性ビスフェノールＡジ（メタ）アクリレート、（ポリ）プロポキシ変性ビスフェノールＡジ（メタ）アクリレート、（ポリ）エトキシ（ポリ）プロポキシ変性ビスフェノールＡジ（メタ）アクリレート等のビスフェノールＡ型構造を有するジ（メタ）アクリレートが含まれる。 Among the above, examples of preferable monomers from the viewpoint of easy availability include (poly) ethoxy-modified bisphenol A di (meth) acrylate, (poly) propoxy-modified bisphenol A di (meth) acrylate, and (poly) ethoxy. Di (meth) acrylate having a bisphenol A type structure such as (poly) propoxy-modified bisphenol A di (meth) acrylate is included.
ここで、（Ａ）脂肪族（メタ）アクリルモノマーは、熱硬化性組成物１００質量部に対して、９０質量部以上９９．９質量部以下含まれることが好ましく、９５質量部以上９９．９質量部以下含まれることがより好ましい。（Ａ）脂肪族（メタ）アクリルモノマーが上記範囲含まれると、熱硬化性組成物を各種表示素子の封止剤としたとき、当該熱硬化性組成物の硬化物が、各種表示素子を大気中の酸素や水分から保護する機能を十分に果たすことができる。 Here, the (A) aliphatic (meth) acrylic monomer is preferably contained in an amount of 90 parts by mass or more and 99.9 parts by mass or less, and 95 parts by mass or more and 99.9 parts by mass, based on 100 parts by mass of the thermosetting composition. It is more preferable that it is contained in an amount of parts by mass or less. (A) When the aliphatic (meth) acrylic monomer is included in the above range, when the thermosetting composition is used as a sealant for various display elements, the cured product of the thermosetting composition makes the various display elements into the atmosphere. It can fully fulfill the function of protecting from oxygen and moisture inside.
ただし、（Ａ）脂肪族（メタ）アクリルモノマーと共に、（Ａ−２）環構造を有する（メタ）アクリルモノマーを含む場合は、熱硬化性組成物１００質量部に対して、（Ａ）脂肪族（メタ）アクリルモノマーと（Ａ−２）環構造を有する（メタ）アクリルモノマーとの合計量が、９０質量部以上９９．９質量部以下であることが好ましく、９５質量部以上９９．９質量部以下であることがより好ましい。 However, when the (A-2) aliphatic (meth) acrylic monomer and the (A-2) ring-structured (meth) acrylic monomer are contained, the (A) aliphatic (A) aliphatic is based on 100 parts by mass of the thermosetting composition. The total amount of the (meth) acrylic monomer and the (meth) acrylic monomer having a (A-2) ring structure is preferably 90 parts by mass or more and 99.9 parts by mass or less, and 95 parts by mass or more and 99.9 parts by mass or more. More preferably, it is less than or equal to a part.
（Ｂ）アゾ系重合開始剤
アゾ系重合開始剤は、熱によって分解してフリーラジカルを発生させる、アゾ基を有する化合物であり、上述の（Ａ）脂肪族（メタ）アクリルモノマー等を硬化（重合）させるための化合物である。一般的に、熱硬化性組成物の塗膜や硬化物から、重合開始剤が揮発したり、重合開始剤の分解物（例えば、アセトンやトルエン等の低分子量体、水酸基やアミノ基を有する極性物質）等が揮発することで、表示素子に影響が生じやすい。これに対し、アゾ系重合開始剤は、熱によって生成したラジカル成分が分解せずに重合に寄与することから、低分子量成分が発生し難い。したがって、熱硬化性組成物の塗膜や硬化物から表示素子に影響を与えるアウトガスが発生し難い。
(B) Azo-based polymerization initiator The azo-based polymerization initiator is a compound having an azo group that decomposes by heat to generate a free radical, and cures the above-mentioned (A) aliphatic (meth) acrylic monomer or the like. It is a compound for polymerization). In general, a polymerization initiator volatilizes from a coating film or a cured product of a thermosetting composition, or a decomposition product of the polymerization initiator (for example, a low molecular weight substance such as acetone or toluene, or a polarity having a hydroxyl group or an amino group). The volatilization of substances) and the like tends to affect the display element. On the other hand, in the azo-based polymerization initiator, the radical component generated by heat does not decompose and contributes to the polymerization, so that a low molecular weight component is unlikely to be generated. Therefore, outgas that affects the display element is unlikely to be generated from the coating film or the cured product of the thermosetting composition.
（Ｂ）アゾ系重合開始剤は、アゾニトリル化合物、アゾエステル化合物、アゾアミド化合物、アゾアミジン化合物、アゾイミダゾリン化合物、高分子アゾ系化合物のいずれの化合物であってもよい。 (B) The azo-based polymerization initiator may be any compound of an azonitrile compound, an azo ester compound, an azoamide compound, an azoamidine compound, an azoimidazoline compound, and a high molecular weight azo compound.
アゾニトリル化合物の例には、２，２’−アゾビス（イソブチロニトリル）、２，２’−アゾビス−２−メチルイソブチロニトリル、１，１’−アゾビス（シクロヘキサン−１−カルボニトリル）、１−［（１−シアノ−１−メチルエチル）アゾ］ホルムアミド、２，２’−アゾビス（４−メトキシ−２，４−ジメチルバレロニトリル）、２，２’−アゾビス（２，４−ジメチルバレロニトリル）、２，２’−アゾビス（２メチルブチロニトリル）、４，４’−アゾビス（４−シアノバレリック酸）等が含まれる。 Examples of azonitrile compounds include 2,2'-azobis (isobutyronitrile), 2,2'-azobis-2-methylisobutyronitrile, 1,1'-azobis (cyclohexane-1-carbonitrile), 1-[(1-cyano-1-methylethyl) azo] formamide, 2,2'-azobis (4-methoxy-2,4-dimethylvaleronitrile), 2,2'-azobis (2,4-dimethylvalero) Nitrile), 2,2'-azobis (2 methylbutyronitrile), 4,4'-azobis (4-cyanovaleric acid) and the like.
アゾエステル化合物の例には、ジメチル２，２’−アゾビス（２−メチルプロピオネート）、ジメチル１，１’−アゾビス（１−シクロヘキサンカルボキシレート）、１，１’−アゾビス−（１−アセトキシ−１−フェニルエタン）等が含まれる。 Examples of azoester compounds include dimethyl 2,2'-azobis (2-methylpropionate), dimethyl 1,1'-azobis (1-cyclohexanecarboxylate), 1,1'-azobis- (1-acetoxy-). 1-Phenylethane) and the like are included.
アゾアミド化合物の例には、２，２’−アゾビス［Ｎ−（２−プロペニル）−２−メチルプロピオンアミド］、２，２’−アゾビス（Ｎ−ブチル−２−メチルプロピオンアミド）、２，２’−アゾビス（Ｎ−シクロヘキシル−２−メチルプロピオンアミド）、２，２’−アゾビス｛２−メチル−Ｎ−［１，１−ビス（ハイドロキシメチル）−２−ハイドロキシエチル］プロピオンアミド、２，２’−アゾビス［２−メチル−Ｎ−（２‐ヒドロキシエチル）］プロピオンアミド等が含まれる。 Examples of azoamide compounds include 2,2'-azobis [N- (2-propenyl) -2-methylpropionamide], 2,2'-azobis (N-butyl-2-methylpropionamide), 2,2. '-Azobis (N-cyclohexyl-2-methylpropionamide), 2,2'-azobis {2-methyl-N- [1,1-bis (hydroxymethyl) -2-hydroxyethyl] propionamide, 2,2 ′ -Azobis [2-methyl-N- (2-hydroxyethyl)] propionamide and the like are included.
アゾアミジン化合物の例には、２，２’−アゾビス（２−メチルプロピオンアミジン）ジヒドロクロリド、２，２’−アゾビス（Ｎ−（２−カルボキシエチル）−２−メチルプロピオンアミジン）テトラヒドレート、２，２’−アゾビス（２−アミジノプロパン）ジハイドロクロライド、２，２’−アゾビス（１−イミノ−１−ピロリジノ−２−メチルプロパン）ジハイドロクロライド等が含まれる。 Examples of azoamidine compounds include 2,2'-azobis (2-methylpropionamidine) dihydrochloride, 2,2'-azobis (N- (2-carboxyethyl) -2-methylpropionamidine) tetrahydrate, 2 , 2'-azobis (2-amidineopropane) dihydrochloride, 2,2'-azobis (1-imino-1-pyrrolidino-2-methylpropane) dihydrochloride and the like.
アゾイミダゾリン化合物の例には、２，２’−アゾビス［２−［１−（２−ヒドロキシエチル）−２−イミダゾリン−２−イル］プロパン］ジヒドロキシクロライド、２，２’−アゾビス［２−（２−イミダゾリン−２−イル）プロパン］、２，２−アゾビス［２−（２‐イミダゾリン―２−イル）プロパン］ジハイドロクロライド、２，２−アゾビス［２−（２‐イミダゾリン―２−イル）プロパン］ジスルフェイトジハイドレート等が含まれる。 Examples of azoimidazoline compounds include 2,2'-azobis [2- [1- (2-hydroxyethyl) -2-imidazolin-2-yl] propane] dihydroxychloride, 2,2'-azobis [2-( 2-Imidazoline-2-yl) propane], 2,2-azobis [2- (2-imidazolin-2-yl) propane] dihydrochloride, 2,2-azobis [2- (2-imidazolin-2-yl) yl) ) Propane] Disulfate dihydrate and the like are included.
高分子アゾ系化合物の例には、商品名ＶＰＥ−０２０１、ＶＰＥ−０４０１、ＶＰＥ−０６０１、ＶＰＳ−１００１（いずれも和光純薬社製）等が含まれる。 Examples of the polymer azo compound include trade names VPE-0201, VPE-0401, VPE-0601, VPS-1001 (all manufactured by Wako Pure Chemical Industries, Ltd.) and the like.
熱硬化性組成物は、（Ｂ）アゾ系重合開始剤を１種のみ含んでいてもよく、２種以上含んでいてもよい。上記の中でも、アゾニトリル化合物またはアゾエステル化合物が好ましい。 The thermosetting composition may contain only one type (B) azo-based polymerization initiator, or may contain two or more types. Among the above, an azonitrile compound or an azo ester compound is preferable.
（Ｂ）アゾ系重合開始剤は、分解温度が高いことが好ましく、具体的には、１０時間半減期温度（分解温度）が４５℃〜８５℃であることが好ましく、５５℃〜７０℃であることがより好ましい。（Ｂ）アゾ系重合開始剤の分解温度が高いと、熱硬化性組成物を無酸素環境、４０℃以下で一定期間保持した場合にも、熱硬化性組成物が変質し難く、熱硬化性組成物の塗布等を安定して行うことができる。 The azo-based polymerization initiator (B) preferably has a high decomposition temperature, specifically, the 10-hour half-life temperature (decomposition temperature) is preferably 45 ° C to 85 ° C, and 55 ° C to 70 ° C. More preferably. (B) When the decomposition temperature of the azo-based polymerization initiator is high, the thermosetting composition is hardly deteriorated even when the thermosetting composition is held in an oxygen-free environment at 40 ° C. or lower for a certain period of time, and is thermosetting. The composition can be stably applied.
（Ｂ）アゾ系重合開始剤は、（Ａ）脂肪族（メタ）アクリルモノマーと（Ａ−２）環構造を有する（メタ）アクリルモノマーの合計量１００質量部に対して、０．０５質量部以上、５質量部以下含まれることが好ましく、０．１質量部以上３質量部以下含まれることがより好ましい。（Ｂ）アゾ系重合開始剤が上記範囲含まれると、（メタ）アクリルモノマーを十分に熱硬化させることが可能となる。 The (B) azo-based polymerization initiator is 0.05 parts by mass with respect to 100 parts by mass of the total amount of the (A) aliphatic (meth) acrylic monomer and the (A-2) ring-structured (meth) acrylic monomer. As mentioned above, it is preferably contained in an amount of 5 parts by mass or less, and more preferably 0.1 parts by mass or more and 3 parts by mass or less. When the (B) azo-based polymerization initiator is included in the above range, the (meth) acrylic monomer can be sufficiently thermoset.
（Ｃ）テトラメチルピペリジンフリーラジカル誘導体
（Ｃ）テトラメチルピペリジンフリーラジカル誘導体は、熱硬化性組成物中で重合禁止剤として機能し、熱硬化性組成物が当該化合物を含むと、熱硬化性組成物のポットライフが高まる。ここで、上記（Ｃ）テトラメチルピペリジンフリーラジカル誘導体は、下記一般式（１）で表される化合物である。
(C) Tetramethylpiperidin-free radical derivative (C) The tetramethylpiperidin-free radical derivative functions as a polymerization inhibitor in the thermosetting composition, and when the thermosetting composition contains the compound, the thermosetting composition Increases the pot life of things. Here, the (C) tetramethylpiperidin-free radical derivative is a compound represented by the following general formula (1).
熱硬化性組成物は、（Ｃ）テトラメチルピペリジンフリーラジカル誘導体を１種のみ含んでいてもよく、２種以上含んでいてもよい。また、上記の中でも、入手しやすさ等の観点から、一般式（１）におけるＲがＨ、オキソ基、またはヒドロキシ基である化合物が好ましい。 The thermosetting composition may contain only one type (C) tetramethylpiperidin-free radical derivative, or may contain two or more types. Further, among the above, from the viewpoint of availability and the like, a compound in which R in the general formula (1) is H, an oxo group, or a hydroxy group is preferable.
（Ｃ）テトラピペリジンフリーラジカル誘導体は、（Ａ）脂肪族（メタ）アクリルモノマーと（Ａ−２）環構造を有する（メタ）アクリルモノマーの合計量１００質量部に対して、０．０００５質量部以上、０．２質量部以下含まれることが好ましく、０．００１質量部以上０．１質量部以下含まれることがより好ましい。（Ｃ）テトラピペリジンフリーラジカル誘導体が上記範囲含まれると、熱硬化性組成物のポットライフを長くすることができる。また、（Ｃ）テトラピペリジンフリーラジカル誘導体の量が過剰となると、アクリルモノマーの熱硬化性が低下することがあるが、（Ａ）脂肪族（メタ）アクリルモノマーと（Ａ−２）環構造を有する（メタ）アクリルモノマーの合計量１００質量部に対して０．２質量部以下であれば、熱硬化性組成物の熱硬化性を良好にすることができる。 The (C) tetrapiperidin-free radical derivative is 0.0005 parts by mass with respect to 100 parts by mass of the total amount of the (A) aliphatic (meth) acrylic monomer and the (A-2) ring-structured (meth) acrylic monomer. As described above, it is preferably contained in an amount of 0.2 parts by mass or less, and more preferably 0.001 part by mass or more and 0.1 part by mass or less. When the tetrapiperidine-free radical derivative (C) is included in the above range, the pot life of the thermosetting composition can be extended. Further, if the amount of (C) tetrapiperidin-free radical derivative is excessive, the thermosetting property of the acrylic monomer may decrease, but (A) the aliphatic (meth) acrylic monomer and (A-2) the ring structure are formed. When the total amount of the (meth) acrylic monomers contained is 0.2 parts by mass or less with respect to 100 parts by mass, the thermosetting property of the thermosetting composition can be improved.
（Ｄ）レベリング剤
前述のように、熱硬化性組成物は、（Ｄ）レベリング剤を含んでいてもよい。レベリング剤は、熱硬化性組成物を加熱硬化させる過程で、熱硬化性組成物の塗膜表面に配向して塗膜の表面張力を均一化し、ハジキなどを生じにくくし、被塗布物上に濡れ広がりやすくする化合物である。
(D) Leveling Agent As described above, the thermosetting composition may contain (D) a leveling agent. In the process of heat-curing the thermosetting composition, the leveling agent is oriented toward the surface of the coating film of the thermosetting composition to make the surface tension of the coating film uniform, to prevent repellency and the like, and to be applied on the object to be coated. It is a compound that makes it easier to get wet and spread.
レベリング剤が、熱硬化性組成物の塗膜表面の表面張力を調整すると、被塗布物への組成物の濡れ性が改善され、塗膜面の流動性や消泡性が改善されやすくなる。なお、これらの効果は、わずかな添加量で発現することが多い。そのため、レベリング剤としては、表面改質作用が比較的小さいシリコーン系ポリマーやアクリレート系ポリマーを用いることが好ましい。このようなシリコーン系ポリマーやアクリレート系ポリマーは、公知のものを用いることができる。 When the leveling agent adjusts the surface tension of the coating film surface of the thermosetting composition, the wettability of the composition to the object to be coated is improved, and the fluidity and defoaming property of the coating film surface are easily improved. In addition, these effects are often exhibited with a small amount of addition. Therefore, as the leveling agent, it is preferable to use a silicone-based polymer or an acrylate-based polymer having a relatively small surface modifying action. As such a silicone-based polymer or an acrylate-based polymer, known ones can be used.
（Ｄ）レベリング剤は、（Ａ）脂肪族（メタ）アクリルモノマーと（Ａ−２）環構造を有する（メタ）アクリルモノマーの合計量１００質量部に対して０．０１〜１質量部含まれることが好ましく、０．０５〜０．５質量部であることがより好ましい。レベリング剤の含有量が一定以上であると、熱硬化性組成物の塗膜表面に十分な量のレベリング剤が配向しやすく、十分なレベリング効果が得られやすい。一方、レベリング剤の含有量が一定以下であると、レベリング剤と（メタ）アクリルモノマーとの相溶性や硬化物の透明性が損なわれにくい。 The (D) leveling agent is contained in an amount of 0.01 to 1 part by mass with respect to 100 parts by mass of the total amount of the (A) aliphatic (meth) acrylic monomer and the (A-2) ring-structured (meth) acrylic monomer. It is preferably 0.05 to 0.5 parts by mass, and more preferably 0.05 to 0.5 parts by mass. When the content of the leveling agent is a certain level or more, a sufficient amount of the leveling agent is likely to be oriented on the surface of the coating film of the thermosetting composition, and a sufficient leveling effect is easily obtained. On the other hand, when the content of the leveling agent is not more than a certain level, the compatibility between the leveling agent and the (meth) acrylic monomer and the transparency of the cured product are not easily impaired.
（Ｅ）その他の成分
熱硬化性組成物は、本発明の効果を大きくは損なわない範囲において、その他の樹脂を含んでいてもよい。その他の樹脂は、例えば熱硬化性樹脂等とすることができる。熱硬化性樹脂の例には、エポキシ樹脂、フェノール樹脂、ジアリルフタレート樹脂、ユリア樹脂、ポリエステル樹脂等が含まれる。熱硬化性組成物は、熱硬化性樹脂を１種のみ含んでいてもよく、２種以上含んでいてもよい。
(E) Other components The thermosetting composition may contain other resins as long as the effects of the present invention are not significantly impaired. Other resins can be, for example, thermosetting resins. Examples of thermosetting resins include epoxy resins, phenol resins, diallyl phthalate resins, urea resins, polyester resins and the like. The thermosetting composition may contain only one type of thermosetting resin, or may contain two or more types of thermosetting resin.
熱硬化性組成物は、充填材を含んでいてもよい。熱硬化性組成物が含む充填材の例には、ガラスビーズ、スチレン系ポリマー粒子、メタクリレート系ポリマー粒子、エチレン系ポリマー粒子、プロピレン系ポリマー粒子等が含まれる。熱硬化性組成物は、充填材を１種のみ含んでいてもよく、２種以上含んでいてもよい。 The thermosetting composition may include a filler. Examples of the filler contained in the thermosetting composition include glass beads, styrene-based polymer particles, methacrylate-based polymer particles, ethylene-based polymer particles, propylene-based polymer particles, and the like. The thermosetting composition may contain only one type of filler, or may contain two or more types of filler.
熱硬化性組成物は、改質剤や安定剤を含んでいてもよい。改質剤の具体例には、老化防止剤、レベリング剤、濡れ性改良剤、界面活性剤、可塑剤等が含まれる。これらの改質剤は、１種単独または２種以上を組み合わせて用いることができる。一方、安定剤の具体例には、紫外線吸収剤、防腐剤、抗菌剤等が含まれる。熱硬化性組成物は、これらの改質剤や安定剤を１種のみ含んでいてもよく、２種以上含んでいてもよい。 The thermosetting composition may contain a modifier and a stabilizer. Specific examples of the modifier include an anti-aging agent, a leveling agent, a wettability improving agent, a surfactant, a plasticizer and the like. These modifiers can be used alone or in combination of two or more. On the other hand, specific examples of stabilizers include ultraviolet absorbers, preservatives, antibacterial agents and the like. The thermosetting composition may contain only one kind of these modifiers and stabilizers, or may contain two or more kinds of these modifiers.
熱硬化性組成物は酸化防止剤を含んでいてもよい。酸化防止剤は、プラズマ照射や日光照射により発生するラジカルを失活させるもの（Ｈｉｎｄｅｒｅｄ Ａｍｉｎｅ Ｌｉｇｈｔ Ｓｔａｂｉｌｉｚｅｒ， ＨＡＬＳ）や、過酸化物を分解するものなどをいう。酸化防止剤は、熱硬化性組成物の硬化物の変色を防ぐ機能を有する。酸化防止剤の例には、ヒンダードアミン、フェノール系酸化防止剤、リン系酸化防止剤等が含まれる。 The thermosetting composition may contain an antioxidant. Antioxidants are those that inactivate radicals generated by plasma irradiation or sunlight irradiation (Hindered Amine Light Stabilizer, HALS), those that decompose peroxides, and the like. The antioxidant has a function of preventing discoloration of the cured product of the thermosetting composition. Examples of antioxidants include hindered amines, phenolic antioxidants, phosphorus-based antioxidants and the like.
ヒンダードアミンの例には、ビス（２，２，６，６−テトラメチルピペリジン−４−イル）セバケート、２，４−ジクロロ−６−ｔｅｒｔ−オクチルアミノ−ｓ−トリアジンと４，４’−ヘキサメチレンビス（アミノ−２，２，６，６−テトラメチルピヘリジン）の重縮合生成物、ビス［１−（２−ヒドロキシ−２−メチルプロポキシ）−２，２，６，６−テトラメチルピペリジン−４−イル］セバケートが含まれる。 Examples of hindered amines are bis (2,2,6,6-tetramethylpiperidine-4-yl) sebacate, 2,4-dichloro-6-tert-octylamino-s-triazine and 4,4'-hexamethylene. Polycondensation product of bis (amino-2,2,6,6-tetramethylpihelidine), bis [1- (2-hydroxy-2-methylpropoxy) -2,2,6,6-tetramethylpiperidine) -4-Il] Sevacate is included.
フェノール系酸化防止剤の例には、２，６−ジ−ｔ−ブチル−ｐ−クレゾールなどのモノフェノール類、２，２’−メチレンビス（４−メチル−６−ｔ−ブチルフェノール）等のビスフェノール類、１，１，３−トリス（２−メチル−４−ヒドロキシ−５−ｔ−ブチルフェニル）ブタンなどの高分子型フェノール類が含まれる。 Examples of phenolic antioxidants include monophenols such as 2,6-di-t-butyl-p-cresol and bisphenols such as 2,2'-methylenebis (4-methyl-6-t-butylphenol). , 1,1,3-Tris (2-methyl-4-hydroxy-5-t-butylphenyl) butane and other high molecular weight phenols are included.
リン系酸化防止剤は、ホスファイト類から選ばれる酸化防止剤及びオキサホスファフェナントレンオキサイド類から選ばれる着色防止剤が好ましく用いられる。 As the phosphorus-based antioxidant, an antioxidant selected from phosphite and an antioxidant selected from oxaphosphaphenanthrene oxides are preferably used.
特に、紫外線への耐性を付与するという点では、Ｔｉｎｕｖｉｎ１２３（ビス（１−オクチロキシ−２，２，６，６−テトラメチル−４−ピペリジル）セバシン酸）、Ｔｉｎｕｖｉｎ７６５（ビス（１，２，２，６，６−ペンタメチル−４−ピペリジル）セバシン酸とメチル １，２，２，６，６−ペンタメチル−４−ピペリジルセバシン酸との混合物）、Ｈｏｓｔａｖｉｎ ＰＲ２５（ジメチル ４−メトキシベンジル Ｉｄｅｎｅｍａｌｏｎａｔｅ）、Ｔｉｎｕｖｉｎ ３１２ または Ｈｏｓｔａｖｉｎ ｖｓｕ（エタンジアミド Ｎ−（２−エトキシフェニル）−Ｎ’−（２−エチルフェニル））、ＣＨＩＭＡＳＳＯＲＢ １１９ ＦＬ（Ｎ，Ｎ’−ビス（３−アミノプロピル）エチレンジアミン−２，４−ビス［Ｎ−ブチル−Ｎ−（１，２，２，６，６−ペンタメチル−４−ピペリジル）アミノ］−６−クロロ−１，３，５−トリアジン縮合物が好ましい。 In particular, in terms of imparting resistance to ultraviolet rays, Tinuvin123 (bis (1-octyloxy-2,2,6,6-tetramethyl-4-piperidyl) sebacic acid), Tinuvin765 (bis (1,2,2,2) 6,6-Pentamethyl-4-piperidyl) sebacic acid and methyl 1,2,2,6,6-pentamethyl-4-piperidylsevacinic acid), Propyl PR25 (dimethyl 4-methoxybenzyl Ideamalonate), Tinuvin 312 or Hostavin vsu (Ethandiamide N- (2-ethoxyphenyl) -N'-(2-ethylphenyl)), CHIMASORB 119 FL (N, N'-bis (3-aminopropyl) ethylenediamine-2,4-bis [N- Butyl-N- (1,2,2,6,6-pentamethyl-4-piperidyl) amino] -6-chloro-1,3,5-triazine condensate is preferred.
熱硬化性組成物は、必要に応じて溶剤を含んでいてもよい。溶剤は、各成分を均一に分散または溶解させる機能を有する。溶剤の例にはトルエン、キシレン等の芳香族溶媒；アセトン、メチルエチルケトン、メチルイソブチルケトン等のケトン系溶媒；エーテル、ジブチルエーテル、テトラヒドロフラン、ジオキサン、エチレングリコ−ルモノアルキルエーテル等のエーテル類；Ｎ−メチルピロリドン等の非プロトン性極性溶媒；酢酸エチル、酢酸ブチル等のエステル類等が含まれる。 The thermosetting composition may contain a solvent, if necessary. The solvent has a function of uniformly dispersing or dissolving each component. Examples of solvents include aromatic solvents such as toluene and xylene; ketone solvents such as acetone, methyl ethyl ketone and methyl isobutyl ketone; ethers such as ether, dibutyl ether, tetrahydrofuran, dioxane and ethylene glycol monoalkyl ether; N-methyl. Aprotonic polar solvents such as pyrrolidone; esters such as ethyl acetate and butyl acetate are included.
（Ｆ）熱硬化性組成物の物性等
本発明の熱硬化性組成物の、Ｅ型粘度計により２５℃、２．５ｒｐｍで測定される粘度は、５ｍＰａ・ｓ以上４００ｍＰａ・ｓ以下であり、５〜２００ｍＰａ・ｓであることが好ましい。熱硬化性組成物の粘度が上記範囲であると、熱硬化性組成物を各種封止剤とする際の貼り合わせ時の流動性が十分に得られやすい。上記粘度は、例えばＢＲＯＯＫＦＩＥＬ社製のデジタルレオメータ型式ＤII−III ＵＬＴＲＡ等で測定することができる。
(F) Physical Properties of Thermosetting Composition, etc. The viscosity of the thermosetting composition of the present invention measured at 25 ° C. and 2.5 rpm by an E-type viscometer is 5 mPa · s or more and 400 mPa · s or less. It is preferably 5 to 200 mPa · s. When the viscosity of the thermosetting composition is within the above range, it is easy to obtain sufficient fluidity at the time of bonding when the thermosetting composition is used as various sealing agents. The viscosity can be measured with, for example, a digital rheometer model DII-III ULTRA manufactured by BROOKFIEL.
熱硬化性組成物に含まれる、各成分の含有量を調製することで、熱硬化性組成物の粘度を上記範囲に調整できる。また、（Ａ）脂肪族（メタ）アクリルモノマーや、（Ａ−２）環構造を有する（メタ）アクリルモノマーの重量平均分子量を調整することも、熱硬化性組成物の粘度を上記範囲に調整するために有効である。 By adjusting the content of each component contained in the thermosetting composition, the viscosity of the thermosetting composition can be adjusted within the above range. Further, adjusting the weight average molecular weight of the (A) aliphatic (meth) acrylic monomer and the (A-2) ring-structured (meth) acrylic monomer also adjusts the viscosity of the thermosetting composition within the above range. It is effective to do.
上記熱硬化性組成物は、（Ａ）脂肪族（メタ）アクリルモノマー、（Ｂ）アゾ系重合開始剤、及び（Ｃ）テトラメチルピペリジンフリーラジカル誘導体と、必要に応じて他の成分（（Ａ−２）環構造を有する（メタ）アクリルモノマー等）を、公知の方法で混合することにより製造することができる。混合順序は特に制限されないが、例えば、（Ａ）脂肪族（メタ）アクリルモノマーや（Ａ−２）環構造を有する（メタ）アクリルモノマーに（Ｃ）テトラメチルピペリジンフリーラジカル誘導体を溶解させてから、（Ｂ）アゾ系重合開始剤を混合することが好ましい。 The thermosetting composition comprises (A) an aliphatic (meth) acrylic monomer, (B) an azo-based polymerization initiator, and (C) a tetramethylpiperidin-free radical derivative, and other components ((A), if necessary. -2) It can be produced by mixing (meth) acrylic monomer having a ring structure, etc.) by a known method. The mixing order is not particularly limited, but for example, after dissolving (C) a tetramethylpiperidin-free radical derivative in (A) an aliphatic (meth) acrylic monomer or (A-2) a (meth) acrylic monomer having a ring structure. , (B) It is preferable to mix the azo-based polymerization initiator.
（Ｇ）熱硬化性組成物の用途
本発明の熱硬化性組成物は、各種表示素子を封止するための封止剤として好ましく用いられる。各種表示素子の例には、無機ＬＥＤ（Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ）素子、液晶素子、有機ＥＬ素子などが含まれ、好ましくは有機ＥＬ素子である。各種表示素子を封止することにより、これらの表示素子が、水分などにより劣化することを抑制できる。
(G) Use of Thermosetting Composition The thermosetting composition of the present invention is preferably used as a sealing agent for sealing various display elements. Examples of various display elements include an inorganic LED (Light Emitting Diode) element, a liquid crystal element, an organic EL element, and the like, and are preferably an organic EL element. By sealing various display elements, it is possible to prevent these display elements from deteriorating due to moisture or the like.
本発明の熱硬化性組成物の使用方法は特に制限されず、熱硬化性組成物の用途に応じて適宜選択される。本発明の熱硬化性組成物は、各種表示素子を面封止するための面封止剤としてもよく、枠封止するための枠封止剤としてもよい。ここで、液状の熱硬化性組成物を、被封止物（基板や表示素子）上に塗布した後、基板と封止基板とを対向させて熱硬化性組成物を硬化させること等により、表示素子を封止することができる。この場合、熱硬化性組成物は、スクリーン印刷法、インクジェット印刷法、ディスペンサー塗布等により塗布することができる。 The method of using the thermosetting composition of the present invention is not particularly limited, and is appropriately selected depending on the use of the thermosetting composition. The thermosetting composition of the present invention may be used as a surface sealant for surface-sealing various display elements, or may be used as a frame sealant for frame-sealing. Here, a liquid thermosetting composition is applied onto an object to be sealed (a substrate or a display element), and then the substrate and the sealing substrate are opposed to each other to cure the thermosetting composition. The display element can be sealed. In this case, the thermosetting composition can be applied by a screen printing method, an inkjet printing method, dispenser application, or the like.
また、熱硬化性組成物を予めフィルム状に成形し、当該フィルムを被封止物（基板や表示素子）上にラミネートしてもよい。この場合、フィルム状の熱硬化性組成物上に、さらに封止基板を載置し、熱硬化性組成物を硬化させることにより、表示素子を封止することができる。 Further, the thermosetting composition may be formed into a film in advance, and the film may be laminated on an object to be sealed (a substrate or a display element). In this case, the display element can be sealed by further placing the sealing substrate on the film-shaped thermosetting composition and curing the thermosetting composition.
本発明の熱硬化性組成物は、無酸素環境、４０℃以下での使用が可能である。したがって、このような環境でも熱硬化性組成物が変質することなく粘度変化も少ないため、熱硬化性組成物の塗布や基板と封止基板との貼りあわせが可能となる。 The thermosetting composition of the present invention can be used in an oxygen-free environment at 40 ° C. or lower. Therefore, even in such an environment, the thermosetting composition does not deteriorate and the viscosity does not change much, so that the thermosetting composition can be applied and the substrate and the sealing substrate can be bonded to each other.
また、上記熱硬化性組成物の硬化は、加熱により行うことができる。加熱温度は、適宜設定され、被封止物の耐熱温度や効率等を考慮して適宜設定されるが、通常８０〜１３０℃とすることができ、９０〜１１０℃とすることが好ましい。本発明の熱硬化性組成物によれば、上記温度で加熱しても、硬化中や硬化後に、表示素子に影響を及ぼすアウトガスが生じ難く、高品質な表示装置が得られる。 Moreover, the curing of the thermosetting composition can be performed by heating. The heating temperature is appropriately set and is appropriately set in consideration of the heat resistant temperature and efficiency of the object to be sealed, but it can usually be 80 to 130 ° C., preferably 90 to 110 ° C. According to the thermosetting composition of the present invention, even when heated at the above temperature, outgas that affects the display element is unlikely to be generated during or after curing, and a high-quality display device can be obtained.
以下において、実施例を参照して本発明を説明する。実施例によって、本発明の範囲は限定して解釈されない。 Hereinafter, the present invention will be described with reference to examples. The scope of the present invention is not construed as limited by the examples.
［材料］
実施例及び比較例では、以下の材料を用いた。
[material]
In the examples and comparative examples, the following materials were used.
（Ａ）脂肪族（メタ）アクリルモノマー
・９Ｇ：下記式で表されるポリエチレンングリコール＃４００ジメタクリレート（新中村化学工業社製 分子量５３６）
（Ａ−２）環構造を有する（メタ）アクリルモノマー
・ＢＰＥ−５００：下記式で表されるエトキシ化ビスフェノールＡジメタクリレート（新中村化学社製 分子量８０４）
（Ｂ）アゾ系重合開始剤
・ＯＴＡＺＯ：下記化学式で表される１，１’−アゾビス−（１−アセトキシ−１−フェニルエタン）（大塚化学社製 分子量３５４．４、融点１０６〜１１０℃、分解点１０６〜１１０℃、１０時間半減期の温度６１℃）
（Ｃ）テトラメチルピペリジンフリーラジカル誘導体
・ＴＥＭＰＯ：下記化学式で表される２，２，６，６−テトラメチルピペリジン１−オキシル フリーラジカル
（Ｄ）レベリング剤
・ＬＳ−４６０ （楠本化成社製）
(D) Leveling agent-LS-460 (manufactured by Kusumoto Kasei Co., Ltd.)
（その他）
・ルペロックス５７５：ｔ−アミルパーオキシ−２−エチルヘキサノエート（アルケマ吉富社製）
・パーロイルＴＣＰ：ビス（４−ｔｅｒｔブチルシクロヘキシル）パーオキサイドカーボネート（日本油脂社製）
(Other)
Luperox 575: t-amylperoxy-2-ethylhexanoate (manufactured by Arkema Yoshitomi)
-Perloyl TCP: Bis (4-tert-butylcyclohexyl) peroxide carbonate (manufactured by NOF Corporation)
［実施例１］
（Ａ）脂肪族（メタ）アクリルモノマーとして９Ｇ ５０ｇ、（Ａ−２）環構造を有する（メタ）アクリルモノマーとしてＢＰＥ−５００ ５０ｇと、（Ｃ）テトラメチルピペリジンフリーラジカル誘導体として、ＴＥＭＰＯ ０．０３ｇを混合・攪拌した後、（Ｂ）アゾ系重合開始剤としてＯＴＡＺＯ ０．３ｇを加え、さらに混合・攪拌して、熱硬化性組成物を調製した。
[Example 1]
(A) 50 g of 9G as an aliphatic (meth) acrylic monomer, 50 g of BPE-500 as a (meth) acrylic monomer having a (A-2) ring structure, and 0.03 g of a TEMPO as a (C) tetramethylpiperidin-free radical derivative. (B) 0.3 g of OTAZO as an azo-based polymerization initiator was added after mixing and stirring, and the mixture was further mixed and stirred to prepare a thermosetting composition.
［実施例２〜２１、及び比較例１〜４］
表１〜３に示す材料及び組成とした以外は、実施例１と同様に熱硬化性組成物を調製した。
[Examples 2 to 21 and Comparative Examples 1 to 4]
A thermosetting composition was prepared in the same manner as in Example 1 except that the materials and compositions shown in Tables 1 to 3 were used.
［評価］
各実施例及び比較例で調製した熱硬化性組成物の粘度を測定した。さらに、以下の方法で、熱硬化性組成物のポットライフ、硬化物からのアウトガスの量、硬化物（フィルム）の鉛筆硬度、真空環境下での重量減少率、を測定した。結果を表１〜３に示す。
[Evaluation]
The viscosity of the thermosetting composition prepared in each Example and Comparative Example was measured. Further, the pot life of the thermosetting composition, the amount of outgas from the cured product, the pencil hardness of the cured product (film), and the weight loss rate in a vacuum environment were measured by the following methods. The results are shown in Tables 1-3.
・粘度測定
Ｅ型粘度計（ＢＲＯＯＫＦＩＥＬ社製のデジタルレオメータ型式ＤII−III ＵＬＴＲＡ）にて、２５℃、２．５ｒｐｍにおける熱硬化性組成物の粘度を測定した。
-Viscosity measurement The viscosity of the thermosetting composition at 25 ° C. and 2.5 rpm was measured with an E-type viscometer (digital rheometer model DII-III ULTRA manufactured by BROOKFIEL).
・窒素環境、４０℃における熱硬化性組成物のポットライフの評価
２０ｍＬバイアル瓶に１０ｇの熱硬化性組成物を入れて酸素濃度（東レエンジニアリング製ＬＣ−８５０ＫＳ測定）が０．１ｐｐｂであるグローブボックス内で密閉した。その後、４０℃オーブン内で保管した。そして、２４時間ごとに、オーブン内でバイアル瓶を逆さにして１分保持し、熱硬化性組成物が下に落ちてくるまでの日数を評価した。熱硬化性組成物が下に落ちてくるまでの日数が長いほど、ポットライフが長い、と評価できる。
-Evaluation of the pot life of the thermosetting composition in a nitrogen environment and 40 ° C. A glove box in which 10 g of the thermosetting composition is placed in a 20 mL vial and the oxygen concentration (measured by LC-850KS manufactured by Toray Engineering) is 0.1 ppb. Sealed inside. Then, it was stored in an oven at 40 ° C. Then, every 24 hours, the vial was held upside down in the oven for 1 minute, and the number of days until the thermosetting composition fell down was evaluated. It can be evaluated that the longer the number of days until the thermosetting composition falls down, the longer the pot life.
・硬化物からのアウトガス量の測定
テフロン（登録商標）シートで１００μｍのギャップを作ったガラスの間に熱硬化性組成物を挟み込み、１００℃３０分で窒素パージオーブン（ヤマト科学製ＤＮ４１０１）中で硬化させ、フィルムを作製した。その後、ヘッドスペース型のＧＣで１００℃３０分加熱後のアウトガスを測定した。
-Measurement of outgas amount from cured product A thermosetting composition is sandwiched between glasses having a gap of 100 μm made of Teflon (registered trademark) sheet, and placed in a nitrogen purge oven (DN4101 manufactured by Yamato Scientific Co., Ltd.) at 100 ° C. for 30 minutes. It was cured to prepare a film. Then, the outgas after heating at 100 ° C. for 30 minutes was measured with a headspace type GC.
・硬化フィルムの鉛筆硬度測定
アウトガス量の測定と同様に、硬化フィルムを作製した。そして、当該硬化フィルムについて、ＪＩＳ−Ｓ−６００６が規定する試験用鉛筆（硬度６Ｂ〜３Ｈ）を用いて、ＪＩＳＫ５６００−５−４（１９９９）が規定する鉛筆硬度評価方法に従い、４．９Ｎの荷重にて、硬化フィルム表面の鉛筆硬度を測定した。
-Measurement of pencil hardness of cured film A cured film was prepared in the same manner as the measurement of the amount of outgas. Then, for the cured film, a test pencil (hardness 6B to 3H) specified by JIS-S-6006 was used, and a load of 4.9 N was applied according to the pencil hardness evaluation method specified by JISK5600-5-4 (1999). The pencil hardness on the surface of the cured film was measured.
・真空環境下での重量減少率の測定
１０ｃｍ×１０ｃｍのガラスに０．５ｇの熱硬化性組成物をのせて真空チャンバー内に入れ、真空ポンプで１．２Ｐａまで減圧し、減圧前後の重量減少を測定した。
-Measurement of weight loss rate in a vacuum environment Place 0.5 g of thermosetting composition on 10 cm x 10 cm glass, put it in a vacuum chamber, reduce the pressure to 1.2 Pa with a vacuum pump, and reduce the weight before and after decompression. Was measured.
表１〜３に示すように、（Ａ）脂肪族（メタ）アクリルモノマーと、（Ｂ）アゾ系重合開始剤と、（Ｃ）テトラメチルピペリジンフリーラジカル誘導体と、を含む熱硬化性樹脂組成物（実施例１〜２１）では、ポットライフがいずれも４日超であり、非常に安定であった。またこれらの熱硬化性組成物は、硬化物からのアウトガスも少なく、例えば有機ＥＬ素子の封止剤としたときに、有機ＥＬ素子に影響を及ぼすおそれが少ない。さらに、（Ａ）脂肪族（メタ）アクリルモノマーの重量平均分子量が４００以上２０００以下であると、真空下での重量減少が殆どなく、熱硬化性組成物中の成分が揮発し難いといえる（実施例１〜２０）。 As shown in Tables 1 to 3, a thermosetting resin composition containing (A) an aliphatic (meth) acrylic monomer, (B) an azo-based polymerization initiator, and (C) a tetramethylpiperidin-free radical derivative. In (Examples 1 to 21), the pot life was more than 4 days, which was very stable. Further, these thermosetting compositions have less outgassing from the cured product, and are less likely to affect the organic EL element when used as a sealant for the organic EL element, for example. Further, when the weight average molecular weight of the (A) aliphatic (meth) acrylic monomer is 400 or more and 2000 or less, there is almost no weight loss under vacuum, and it can be said that the components in the thermosetting composition are hard to volatilize ( Examples 1 to 20).
ただし、（Ａ）脂肪族（メタ）アクリルモノマーを含まない場合には、熱硬化性組成物の粘度が４００ｍＰａ・ｓを超え、当該組成物は塗布性が低く、均一に塗布することが難しかった（比較例２）。 However, when the (A) aliphatic (meth) acrylic monomer was not contained, the viscosity of the thermosetting composition exceeded 400 mPa · s, the composition had low coatability, and it was difficult to apply the composition uniformly. (Comparative example 2).
また、（Ｃ）テトラメチルピペリジンフリーラジカル誘導体を含まない場合には、ポットライフが非常に短かった（比較例１）。これは、熱硬化性組成物が窒素環境、４０℃において、（Ａ）（メタ）アクリルモノマーと、（Ｂ）アゾ系重合開始剤とが反応してしまったためである、と推察される。 Moreover, when (C) a tetramethylpiperidin-free radical derivative was not contained, the pot life was very short (Comparative Example 1). It is presumed that this is because the (A) (meth) acrylic monomer and the (B) azo-based polymerization initiator have reacted in the thermosetting composition in a nitrogen environment at 40 ° C.
また、（Ｂ）アゾ系重合開始剤以外の重合開始剤を用いた場合（例えば過酸化物開始剤）には、硬化後にアウトガスが発生しやすかった（比較例３および４）。生成したラジカルが分解や転移して、低分子量成分が発生したことが要因であると推察され、アウトガスが発生すると、有機ＥＬ素子にダメージを与えると推測される。 Further, when a polymerization initiator other than (B) an azo-based polymerization initiator was used (for example, a peroxide initiator), outgas was likely to be generated after curing (Comparative Examples 3 and 4). It is presumed that the cause is that the generated radicals are decomposed or transferred to generate low molecular weight components, and that when outgas is generated, the organic EL device is damaged.
本発明の熱硬化性組成物は、塗布性が良好であり、さらに熱処理や熱処理後にアウトガスが少ない。したがって、種々の表示素子の封止剤に適用可能である。 The thermosetting composition of the present invention has good coatability and has less outgassing after heat treatment or heat treatment. Therefore, it can be applied to a sealing agent for various display elements.
Claims (13)
（Ｂ）アゾ系重合開始剤と、
（Ｃ）下記一般式（１）で表される２，２，６，６−テトラメチルピペリジン１−オキシル フリーラジカル誘導体と、
を含み、
かつ、Ｅ型粘度計で測定される、２５℃、２．５ｒｐｍにおける粘度が５ｍＰａ・ｓ以上４００ｍＰａ・ｓ以下である熱硬化性組成物を含む、表示素子用の封止剤。
(B) Azo-based polymerization initiator and
(C) 2,2,6,6-tetramethylpiperidin 1-oxyl free radical derivative represented by the following general formula (1), and
Including
And is measured by E-type viscometer, 25 ° C., a viscosity at 2.5rpm comprises a thermosetting composition Ru der below 5 mPa · s or higher 400 mPa · s, a sealing agent for a display element.
請求項１に記載の表示素子用の封止剤。 The weight average molecular weight of the (A) aliphatic (meth) acrylic monomer is 400 or more and 2000 or less.
The sealant for a display element according to claim 1.
請求項１または２に記載の表示素子用の封止剤。 The (A) aliphatic (meth) acrylic monomer is a methacrylic monomer.
The sealant for the display element according to claim 1 or 2.
請求項１〜３のいずれか一項に記載の表示素子用の封止剤。 (A-2) Further containing a (meth) acrylic monomer having a ring structure,
The sealant for a display element according to any one of claims 1 to 3.
請求項４に記載の表示素子用の封止剤。 The weight average molecular weight of the (meth) acrylic monomer having the (A-2) ring structure is 400 or more and 2000 or less.
The sealant for a display element according to claim 4.
請求項４または５に記載の表示素子用の封止剤。 The (meth) acrylic monomer having the (A-2) ring structure contains a bisphenol A type structure.
The sealant for the display element according to claim 4 or 5.
請求項１〜６のいずれか一項に記載の表示素子用の封止剤。 (D) Further containing a leveling agent,
The sealant for a display element according to any one of claims 1 to 6.
有機ＥＬ素子用枠封止剤。 The sealant for the display element according to any one of claims 1 to 7 is contained, and is used for frame sealing of an organic EL element.
Frame sealant for organic EL elements.
有機ＥＬ素子用面封止剤。 The sealant for the display element according to any one of claims 1 to 7 is contained, and is used for surface encapsulation of an organic EL element.
Surface sealant for organic EL elements.
請求項９に記載の有機ＥＬ素子用面封止剤。 Molded into a sheet,
The surface sealant for an organic EL device according to claim 9 .
（Ｂ）アゾ系重合開始剤と、 (B) Azo-based polymerization initiator and
（Ｃ）下記一般式（１）で表される２，２，６，６−テトラメチルピペリジン１−オキシル フリーラジカル誘導体と、 (C) 2,2,6,6-tetramethylpiperidin 1-oxyl free radical derivative represented by the following general formula (1), and
（Ａ−２）ビスフェノールＡ型の、環構造を有する（メタ）アクリルモノマーと、 (A-2) Bisphenol A type (meth) acrylic monomer having a ring structure and
を含み、 Including
Ｅ型粘度計で測定される、２５℃、２．５ｒｐｍにおける粘度が５ｍＰａ・ｓ以上４００ｍＰａ・ｓ以下である、熱硬化性組成物。 A thermosetting composition having a viscosity of 5 mPa · s or more and 400 mPa · s or less at 25 ° C. and 2.5 rpm as measured by an E-type viscometer.
（Ｂ）アゾ系重合開始剤と、 (B) Azo-based polymerization initiator and
（Ｃ）下記一般式（１）で表される２，２，６，６−テトラメチルピペリジン１−オキシル フリーラジカル誘導体と、 (C) 2,2,6,6-tetramethylpiperidin 1-oxyl free radical derivative represented by the following general formula (1), and
（Ｄ）レベリング剤と、 (D) Leveling agent and
を含み、 Including
Ｅ型粘度計で測定される、２５℃、２．５ｒｐｍにおける粘度が５ｍＰａ・ｓ以上４００ｍＰａ・ｓ以下である、熱硬化性組成物。 A thermosetting composition having a viscosity of 5 mPa · s or more and 400 mPa · s or less at 25 ° C. and 2.5 rpm as measured by an E-type viscometer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016071054 | 2016-03-31 | ||
| JP2016071054 | 2016-03-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017186521A JP2017186521A (en) | 2017-10-12 |
| JP6822863B2 true JP6822863B2 (en) | 2021-01-27 |
Family
ID=60045610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017013367A Active JP6822863B2 (en) | 2016-03-31 | 2017-01-27 | Thermosetting composition, encapsulant containing the same, frame encapsulant for organic EL element, surface encapsulant for organic EL element, and cured product thereof. |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP6822863B2 (en) |
| KR (1) | KR101868269B1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102465211B1 (en) * | 2018-03-19 | 2022-11-10 | 미쯔이가가꾸가부시끼가이샤 | A sealing material for display elements and a cured product thereof, a frame sealing material for an organic EL element, and a surface sealing material for an organic EL element |
| JP2019177685A (en) * | 2018-03-30 | 2019-10-17 | 大日本印刷株式会社 | Woody member |
| JP6719694B1 (en) * | 2018-11-26 | 2020-07-08 | リンテック株式会社 | Dicing sheet for plasma dicing |
| WO2022210663A1 (en) * | 2021-03-30 | 2022-10-06 | デンカ株式会社 | Sealing agent for organic electroluminescence element and organic electroluminescence display device |
| WO2024090151A1 (en) * | 2022-10-28 | 2024-05-02 | 株式会社レゾナック | Radically polymerizable resin composition and pipe rehabilitation liner material |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH072948A (en) * | 1993-06-17 | 1995-01-06 | Fukuvi Chem Ind Co Ltd | Transparent thermosetting resin |
| JP3433826B2 (en) * | 1993-09-03 | 2003-08-04 | 株式会社クラレ | Thermosetting resin composition |
| US5412047A (en) * | 1994-05-13 | 1995-05-02 | Xerox Corporation | Homoacrylate polymerization processes with oxonitroxides |
| JPH10245407A (en) * | 1997-03-06 | 1998-09-14 | Jsr Corp | Method of radical polymerization |
| JP4620816B2 (en) * | 1998-10-07 | 2011-01-26 | 株式会社日本触媒 | Polymerizable acrylic polymer |
| KR100720982B1 (en) * | 2004-02-27 | 2007-05-22 | 니폰 쇼쿠바이 컴파니 리미티드 | Curable composition for optical parts |
| JP4163653B2 (en) * | 2004-02-27 | 2008-10-08 | 株式会社日本触媒 | Curable composition for optical parts |
| US8147728B2 (en) * | 2004-04-01 | 2012-04-03 | Novartis Ag | Pad transfer printing of silicone hydrogel lenses using colored ink |
| JP2007077217A (en) * | 2005-09-13 | 2007-03-29 | Yoshika Kk | Curable resin composition, lining material and tubular lining material |
| JP5255369B2 (en) * | 2007-09-25 | 2013-08-07 | 富士フイルム株式会社 | Photocurable coating composition, overprint and method for producing the same |
| CN102209760B (en) * | 2008-11-07 | 2014-01-15 | 帝斯曼知识产权资产管理有限公司 | Heat-curable powder coating composition |
| JP2011227121A (en) * | 2010-04-15 | 2011-11-10 | Fuji Xerox Co Ltd | Electrostatic image developing toner, electrostatic image developer, toner cartridge, process cartridge, image formation method and image formation device |
| WO2013035206A1 (en) * | 2011-09-09 | 2013-03-14 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | Sealant composition for electronic device |
| EP2781535A4 (en) * | 2011-11-17 | 2015-07-29 | Three Bond Fine Chemical Co Ltd | Acrylic resin composition |
| US20140367670A1 (en) * | 2012-02-10 | 2014-12-18 | Mitsui Chemicals, Inc. | Surface sealing agent for organic el element, organic el device using same, and manufacturing method for same |
| WO2014199626A1 (en) * | 2013-06-10 | 2014-12-18 | 三井化学株式会社 | Heat-curable composition, surface sealing material for organic el element, and cured object obtained therefrom |
-
2017
- 2017-01-27 JP JP2017013367A patent/JP6822863B2/en active Active
- 2017-02-24 KR KR1020170024787A patent/KR101868269B1/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| KR101868269B1 (en) | 2018-06-15 |
| JP2017186521A (en) | 2017-10-12 |
| KR20170113068A (en) | 2017-10-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6822863B2 (en) | Thermosetting composition, encapsulant containing the same, frame encapsulant for organic EL element, surface encapsulant for organic EL element, and cured product thereof. | |
| CN107109190B (en) | Sealing agent for electronic device and method for manufacturing electronic device | |
| CN102210192B (en) | Organic el element surface sealant, method for producing display, and display | |
| JP5895757B2 (en) | Photosensitive composition, method for producing molded product, molded product, and semiconductor device | |
| KR101553717B1 (en) | Composition for encapsulant cured products and organic electroluminescent device | |
| JP2014140797A (en) | Moisture capture agent, moisture capture body forming composition, moisture capture body and electronic device | |
| KR20130045197A (en) | Composition for forming thermoset moisture-capturing body, moisture-capturing body, and electronic device | |
| JP6955085B2 (en) | Encapsulant for display element and its cured product, frame encapsulant for organic EL element, and surface encapsulant for organic EL element | |
| CN109960110B (en) | Photocurable composition and photocurable film formed therefrom | |
| TW201323079A (en) | Thermosetting composition for forming moisture capturing article, moisture capturing article and electronic device | |
| JP6763915B2 (en) | Acrylate compounds, photocurable compositions containing them, photocurable cured films and image display devices | |
| JPWO2020149359A1 (en) | Encapsulant set for organic EL display element and organic EL display element | |
| CN112449649A (en) | Adhesive and adhesive sheet | |
| JP2018024716A (en) | Photocurable resin composition, image display device and method for producing image display device | |
| KR20170037071A (en) | Pressure-sensitive adhesive composition | |
| JPWO2012063626A1 (en) | Composition, cured body for moisture capture, and electronic device | |
| JP2017179002A (en) | Curable resin composition, cured product and resin sheet | |
| WO2021002379A1 (en) | Sealing agent set for organic el display element and organic el display element | |
| JP6496214B2 (en) | Sealant for display element | |
| JP7426154B2 (en) | resin composition | |
| JP7439283B2 (en) | Encapsulants for display elements and their cured products | |
| JP7294107B2 (en) | Adhesive composition, adhesive film | |
| WO2022059740A1 (en) | Sealing material for display element, cured object obtained therefrom, and display device | |
| JP6597525B2 (en) | Photocurable composition and cured product containing the same | |
| CN115867959A (en) | Sealing agent for display element, cured product thereof, and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20190621 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20191004 |
|
| RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20191105 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20200729 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200818 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20201001 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20210105 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210107 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 6822863 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |