JP6586778B2 - X-ray apparatus and structure manufacturing method - Google Patents

Description

  The present invention relates to an X-ray apparatus and a method for manufacturing a structure.

  As an apparatus that acquires information inside an object nondestructively, for example, an X-ray apparatus that irradiates an object with X-rays and detects X-rays passing through the object is known. This X-ray apparatus has an X-ray source that irradiates X-rays, and can detect X-rays passing through an object and observe the inside (see Patent Document 1). Thereby, information inside the object is acquired.

US Patent Application Publication No. 2010/0098209

  However, it is necessary to change the position of the X-ray irradiated to the object to be measured. In that case, measurement failure may occur.

According to the first aspect, the X-ray apparatus includes an electron beam generating unit that emits an electron beam toward the target, a moving unit that moves a collision position of the electron beam to the target, and an X beam emitted from the target. a plurality of light collecting member for converging the linear object to be measured, the detector for detecting the X-rays transmitted through the object to be measured, a support member for supporting one of the previous SL plurality of condensing member, wherein the plurality of light collector is the magnification of the transmission image of the object to be measured to be projected onto the detector Ru different from each other.
According to a second aspect, a method of structure creation creates design information about the shape of the structure, to create the structure on the basis of the design information, the shape of the structure that was created, first The shape information is obtained by measurement using the X-ray apparatus of the aspect, and the obtained shape information is compared with the design information.

  ADVANTAGE OF THE INVENTION According to this invention, the measurement defect at the time of measuring a to-be-measured object by scanning an X-ray can be suppressed.

It is a block diagram which shows typically the principal part structure of the scanning X-ray microscope by 1st Embodiment. It is a figure explaining the structure of the condensing member which the scanning X-ray microscope by 1st Embodiment has. It is a figure which shows typically the locus | trajectory of the X-ray in a condensing member. It is a figure which shows typically the principal part structure of the scanning X-ray microscope by a modification (1). It is a figure which shows typically the principal part structure of the scanning X-ray microscope by a modification (2). It is a block diagram which shows typically the principal part structure of the scanning X-ray microscope by 2nd Embodiment. It is a block diagram which shows the structure of the structure manufacturing system by 3rd Embodiment. It is a flowchart explaining operation | movement of the structure manufacturing system by 3rd Embodiment.

-First embodiment-
The X-ray apparatus according to the first embodiment will be described with reference to the drawings. In the present embodiment, the X-ray apparatus can detect an enlarged transmission image obtained. In the present embodiment, since it can be enlarged and detected, it is called an X-ray microscope. Further, since the X-ray irradiation position of the object to be measured can be moved, it is called a scanning X-ray microscope. In this embodiment, the device under test is used for industrial products such as electronic boards and circuit boards. For example, it is used to judge whether the solder contact is good or bad from the obtained transmitted X-ray image in the soldered portion of the electric board. In the present embodiment, the object to be measured is not limited to an industrial product, and may be a plant or a living thing.
FIG. 1 is a block diagram schematically showing the main configuration of the scanning X-ray microscope 1 according to the first embodiment. The scanning X-ray microscope 1 includes an X-ray source 10, a condensing member 11, an X-ray detector 12, a stage 13, a control device 14, a support member 15, and a chamber member C. The X-ray source 10 emits X-rays toward the object to be measured S placed on the stage 13 in accordance with control by the control device 14. The X-ray source 10 can emit X-rays having a maximum energy of about 5 keV to about 10 keV, for example.
The range of the X-rays emitted from the X-ray source 10 is not limited to this, and the X-ray source 10 may be, for example, an ultra-soft X-ray of about 50 eV, a soft X-ray of about 0.1 to 2 keV, or about 2 to 20 keV. At least one of X-rays and hard X-rays of about 20-100 keV can be emitted. Further, the X-ray source 10 may emit X-rays of 1 to 10 MeV, for example.

  The X-ray source 10 includes a filament 101, a target 102, a scanning unit 103, and a converging unit 104. The filament 101 is heated by flowing a current in a state where a negative bias voltage is applied, and emits an electron beam (thermoelectrons) from the sharpened tip toward the target 102. That is, the filament 101 functions as an electron beam generator for generating an electron beam. The target 102 includes, for example, tungsten, and generates X-rays by collision of an electron beam emitted from the filament 101 or a change in the progress of the electron beam.

  The scanning unit 103 is a deflection coil (scanning coil) that is provided between the filament 101 and the target 102 and scans the electron beam emitted from the filament 101 on the target 102. The scanning unit 103 functions as a moving unit that moves (scans) the position of an electron beam that collides on the target 102 in a two-dimensional direction by adjusting power supplied by the control device 14 described later. That is, in FIG. 1, the target 102 is an exit in which X-rays are emitted on a plane parallel to the XY plane and a plane parallel to the XY plane that is separated from the incident plane on which electrons enter by a certain distance in the Z-axis direction. Including face. The target 102 is a flat plate. Moreover, the external shape of the flat plate of the target 102 is a rectangle. X-rays are generated in the target 102 by the action of the electron beam incident on the inside of the target 102 from the incident surface and the metal of the target 102. X-rays generated in the target 102 pass through the target 102 and are emitted from the emission surface of the target 102. The outer shape of the target 102 is not limited to a rectangle, and may be a circle, for example.

The position where the electron beam collides with the target 102 and the amount of movement change according to the power supplied to the scanning unit 103. That is, the position at which the electron beam is focused on the incident surface of the target is changed by the power supplied to the scanning unit 103. Note that the position where the electron beam is focused along the Z-axis direction may be the incident surface of the target 102 or may be inside the target 102 between the incident surface and the exit surface of the target 102. Further, the condensing position of the electron beam may be a position different from the incident surface of the target 102 and the inside of the target 102. A region where the electron beam is scanned on the target 102 is called a scanning region. A moving region in which the electron beam condensing region is moved on the target 102 by the scanning unit 103 is referred to as a scanning region. The scanning area may be the entire area of the target 102 or a part of the area. The converging unit 104 is provided between the scanning unit 103 and the target 102, converges the electron beam that has passed through the scanning unit 103, and guides it to the target 102. As the position of the electron beam colliding on the target 102 is moved within the scanning region by the scanning unit 103, the position where the X-rays are generated inside the target 102 is also moved. That is, the irradiation position of the X-rays generated from the target 102 is determined according to the position of the electron beam that collides with the target 102. Further, the irradiation position of the X-rays generated from the target 102 is determined according to the position of the electron beam colliding on the target 102. In the present embodiment, in FIG. 1, the direction in which the electron beam is irradiated and the direction in which the X-ray is emitted coincide with each other in the Z-axis direction. For example, the central axis of the electron beam colliding with the target 102 matches the central axis of the emitted X-ray. The position (exit point) of X-rays emitted from the target 102 is scanned within the scanning region. By scanning the emission point, the position of the X-ray irradiated on the measurement object S is scanned in a two-dimensional direction within an area corresponding to the above-described scanning area. In the present specification, the central axis of the X-ray with the center of the scanning region on the target 102 as the emission point is called an optical axis Z2.
The shape of the target 102 is not limited to a flat plate, and the distance in the Z-axis direction may be changed regardless of the position of the XY plane in FIG. Further, the outer shape of the target 102 is a rectangle, but is not limited to a rectangle, and may be, for example, a circle.

  The condensing member 11 is provided between the X-ray source 10 and the object S to be measured on the stage 13, reflects at least a part of the X-rays emitted from the X-ray source 10, and performs the stage X-rays are focused on the object to be measured S placed on 13. In other words, X-rays from a certain exit point on the target 102 are collected in a minute range on the measurement object S, pass through the measurement object S, and enter an X-ray detector 12 described later. As will be described in detail later, the condensing member 11 includes a rotationally symmetric member 111 having a rotationally symmetric axis Z1 as an axis (see FIG. 2). The condensing member 11 has a positional relationship with the X-ray source 10 determined so that the rotational symmetry axis Z1 of the rotationally symmetric member 111 coincides with the optical axis Z2 of the X-ray emitted from the center of the scanning region, and the support member 15 is supported by the X-ray source 10.

  The support member 15 is attached to the body of the X-ray source 10 and supports the light collecting member 11 in the vicinity of the end portion on the stage 13 side. The support member 15 is configured to adjust the light collecting member 11 via an adjusting mechanism (not shown) such as an adjusting screw for finely adjusting the position of the light collecting member 11 in a two-dimensional manner on a surface orthogonal to the optical axis Z2. To support. Using this adjustment mechanism, the position of the light collecting member 11 is adjusted so that the rotational symmetry axis Z1 of the rotationally symmetric member 111 coincides with the optical axis Z2 of the X-ray.

The chamber member C forms a first space surrounded so that X-rays generated from the X-ray source 10 do not leak into the external space. Thereby, X-rays generated in the first space are shielded from leaking out of the chamber C. The chamber member C is made of lead, for example. The chamber member C is in contact with the support surface D via the base member B. The support surface D is, for example, a floor surface of a factory that is grounded. In the present embodiment, the chamber member C is supported via the base member B. Of course, the chamber member C may be supported by contacting the chamber member C and the support surface D without using the base member B.
In the present embodiment, the support member 15 is attached to the body of the X-ray source 10, but the attachment position is not limited to this. The X-ray source 10 and the condensing member 11 may be connected to the chamber member C independently. Further, for example, in FIG. 1, a partition member may be provided on the XY plane, the partition member may be connected to the chamber member C, and the light collecting member 11 may be supported by the partition member. That is, the X-ray source 10 and the condensing member 11 may be supported separately. Of course, the condensing member 11 may be attached to the stage 13 described later.

  In the present embodiment, in FIG. 1, the X-ray source 10, the condensing member 11, the stage 13, and the X-ray detector in a direction intersecting with the support surface D in the Z-axis direction (90 ° in FIG. 1). 14 are arranged side by side, but the order is not limited to that shown in FIG. The X-ray source 10 may be arranged in the −Z direction, and the X-rays irradiated on the stage 103 may be detected by the X-ray detector 12 arranged in the + Z direction. Further, the X-ray source 10, the condensing member 11, the stage 103, and the X-ray detector 12 may be arranged in the direction along the support surface D. Moreover, you may change the arrangement direction of the one part. For example, the X-ray source 10, the condensing member 11, and the stage 13 are disposed along the Z-axis direction, a mirror that folds the X-rays incident on the X-ray detector 12 is disposed, and the X-ray detector 12 is disposed. The X-ray detector 12 may be disposed at a position away from the center of the X-ray light beam irradiated with the X-axis.

The X-ray detector 12 detects transmitted X-rays after the X-rays emitted from the X-ray source 10 and collected by the light collecting member 11 pass through the measurement object S and / or the stage 13. The X-ray detector 12 includes a scintillator section containing a known scintillation substance, a photomultiplier tube, a light receiving section, and the like. The X-ray detector 12 converts the energy of X-rays incident on the incident surface 121 of the scintillator unit into light energy such as visible light or ultraviolet light, and amplifies the light energy with the photomultiplier tube. Are converted into electrical energy by the light receiving unit and output to the control device 14 as an electrical signal. The X-ray detector 12 is composed of one pixel including a scintillator section, a photomultiplier tube, and a light receiving section.
Note that the X-ray detector 12 may convert the incident X-ray energy into electric energy without converting it into light energy, and output the electric energy as an electric signal. The X-ray detector 12 may have a structure in which the scintillator section, the photomultiplier tube, and the light receiving section are each divided into a plurality of pixels, and these pixels are arranged in a dimension. . In this case, the X-rays emitted from each of the emission points scanned in the scanning region are emitted from the X-ray source 10 and the intensity of the X-rays that have passed through a minute range of the object S to be measured is any one of a plurality of pixels. Can be detected. Further, the X-ray detector 12 may be configured by a line sensor. Further, the X-ray detector 12 may have a structure in which a scintillator portion is formed directly on a light receiving portion (photoelectric conversion portion) without providing a photomultiplier tube.

  The control device 14 has a microprocessor and its peripheral circuits, and reads and executes a control program stored in advance in a storage medium (not shown) (for example, a flash memory), thereby executing a scanning X-ray microscope. 1 part is controlled. The control device 14 includes an X-ray control unit 141 and an image generation unit 142. The X-ray control unit 141 controls the operation of the X-ray source 10. The X-ray control unit 141 adjusts the power supplied to emit an electron beam from the filament 101 of the X-ray source 10 and the current supplied to the scanning unit 103. The image generation unit 142 uses the electrical signal output from the X-ray detector 12 to map projection data corresponding to transmitted X-rays that have passed through a minute region on the measurement object S that differs depending on the emission point. Then, the projection data of the entire object to be measured S is generated, and a reconstructed image of the object to be measured S is generated based on the backprojection data and displayed on a monitor (not shown). In the reconstructed image of the object S to be measured, the resolution is determined by the size of a minute region where X-rays have passed through the object S to be measured. That is, the smaller the size of the minute area, the higher the resolution of the reconstructed image. Further, the smaller the distance between minute regions where X-rays pass through the object S, that is, the amount of movement when the X-rays scan the object S, the greater the number of projection data to be mapped. The magnification of the image can be increased. With this configuration, for example, a maximum magnification of about 1000 times can be obtained.

  Next, the light collecting member 11 will be described in detail with reference to FIG. 2 is a diagram schematically illustrating a cross section of the light collecting member 11, and FIG. 2A is a cross sectional view of the light collecting member 11 in a plane including the optical axis Z2 and parallel to the XZ plane. FIG. 2B is a cross-sectional view of the light collecting member 11 on the plane P1 in FIG. 2A, that is, a plane parallel to the XY plane orthogonal to the optical axis Z2. The condensing member 11 includes a plurality of cylindrical rotationally symmetric members 111 having a rotationally symmetric axis Z1 as an axis, and a connecting portion 112. As the rotationally symmetric member 111, for example, a Walter mirror is used in which the inner wall surface is a combination of two surfaces of a rotating hyperboloid 1111 and a rotating ellipsoid 1112. The Walter mirror reflects the X-rays from the X-ray source 10 to focus the image on the object S to be measured. As shown in FIG. 2, the rotationally symmetric member 111 is arranged such that the rotational ellipsoid 1112 is disposed on the X-ray source 10 side and the rotational hyperboloid 1111 is on the measured object S side. The light emission position of the line is adjusted to be the focal position of the spheroid 1112. The obliquely incident component of X-rays emitted from the X-ray emission position of the X-ray source 10 is reflected by the spheroid 1112 and the rotating hyperboloid 1111, is condensed by the rotating hyperboloid 1111, and is measured on the object S to be measured. Focus the image. Note that the X-ray incident direction may be reversed between the rotating hyperboloid 1111 and the ellipsoid 1111, and the X-ray may be incident on the rotating hyperboloid 1111, reflected by the ellipsoid 1112, and focused. Absent. In this embodiment, it is possible to acquire an image magnified 10 times. However, the magnification to be magnified is not limited to 10 times, and may be 1 time or larger than 1 time. . For example, a plurality of condensing members having different magnifications may be prepared, held so as to be changeable, and appropriately switched.

  In order to reflect the oblique incident component of X-rays on the inner wall surface of the rotationally symmetric member 111, the inner wall surface of the rotationally symmetric member 111 is a metal made of a material that reflects X-rays such as gold, molybdenum, tungsten, etc. Consists of a membrane. In order to secure the strength of the rotationally symmetric member 111, for example, the above metal film may be coated on the inner wall surface of a cylindrical structure made of resin or the like to form a reflective surface.

  In the light collecting member 11 according to the present embodiment, a plurality of rotationally symmetric members 111 having a common inner diameter Z1 and having different inner diameters are concentrically configured. FIG. 2 shows an example in which the light collecting member 11 is configured by four rotationally symmetric members 111a to 111d having different inner diameters. The inner diameters of the rotationally symmetric members 111a, 111b, 111c, and 111d on the plane P1 perpendicular to the rotational symmetry axis Z1 are D1, D2, D3, and D4 (D1 <D2 <D3 <D4), respectively. However, the inner diameter of the surface P2 orthogonal to the rotational symmetry axis Z1 on the emission end side of each of the rotationally symmetric members 111a, 111b, 111c, and 111d is smaller than the inner diameter of the surface P1. In addition, the inner diameter of the surface P3 perpendicular to the rotational symmetry axis Z1 on the incident end side of each of the rotationally symmetric members 111a, 111b, 111c, and 111d is larger than the inner diameter of the surface P1. The difference d1 between the inner diameter of the rotationally symmetric member 111a and the inner diameter of the rotationally symmetric member 111b, the difference d2 between the inner diameter of the rotationally symmetric member 111b and the inner diameter of the rotationally symmetric member 111c, the inner diameter of the rotationally symmetric member 111c and the rotationally symmetric member 111d The rotationally symmetric members 111a to 111d are arranged so as to satisfy the relationship d1 <d2 <d3 with the difference d3 from the inner diameter. That is, in the condensing member 11, in the plane P1 orthogonal to the rotational symmetry axis Z1, the distance between the adjacent rotational symmetry members 111 increases as the distance from the rotational symmetry axis Z1 increases. In addition, regarding the surfaces P2 and P3 orthogonal to the rotational symmetry axis Z1 on the emission end side and the incident end side of the rotationally symmetric member 111, the distance between the adjacent rotationally symmetric members 111 increases as the distance from the rotationally symmetric axis Z1 increases.

  The connecting portion 112 connects adjacent rotationally symmetric members 111 to maintain the positional relationship between the rotationally symmetric portions 111 described above, and ensures the strength of the light collecting member 11. The connecting portion 112 is fixed to the rotationally symmetric members 111a, 111b, 111c, and 111d using, for example, an adhesive or a fixing bracket. FIG. 2 shows an example in which a connecting portion 112a and a connecting portion 112b are provided. In the example shown in FIG. 2, the connecting portion 112a passes through the rotationally symmetric member 111 through the rotational symmetry axis Z1, and the connecting portion 112b has a predetermined angle with the connecting portion 112a in a plane orthogonal to the rotationally symmetric axis Z1. , And passes through the rotationally symmetric member 111 through the rotationally symmetric axis Z1. It should be noted that the surface orthogonal to the rotational symmetry axis Z1 is not limited to the one provided with the two connecting portions 112a and 112b, and the shape does not collapse based on the characteristics of the substance when the rotationally symmetric member 111 is manufactured. It suffices if the number of connecting portions 112 required to obtain a sufficient strength is provided. 2 shows an example in which one connecting portion 112a and 112b is provided along the longitudinal direction of the rotationally symmetric member 111, but the present invention is not limited to this. Also in the longitudinal direction of the rotationally symmetric member 111, it is only necessary to provide the number of connecting portions 112 necessary for obtaining strength that does not collapse the shape based on the characteristics of the substance when the rotationally symmetric member 111 is manufactured. . Since the connecting part 112 blocks X-rays, it is preferable to configure the connecting part 112 so that the area through which the X-rays pass is small. Moreover, the connection part 112 is manufactured using the substance with a low X-ray absorption factor so that the intensity | strength of the X-ray which advances the inside of the condensing member 11 may not be attenuated. It is desirable that the substance having a low X-ray absorption rate used for the connecting portion 112 is lower than the absorption rate per predetermined weight of the reflection surface used. In addition, when AU196, Mo95, and W183 are used as the materials having a low X-ray absorption rate, those having a small atomic weight are preferable. Moreover, it is desirable that it is a high molecular compound. For example, an acrylic resin which is a polymer of acrylic acid ester or methacrylic acid ester is desirable. Further, beryllium may be used. For example, a substance containing C12 smaller than Mo96 is desirable. Moreover, the connection part 112 may connect a part of rotation object member 111, and may fill all the space between each of the several rotation object members 111 with a connection part. Further, the reflection surface may be flat or uneven. Further, the material of the connecting member 112 may be selected based on the type of sample to be measured.

In addition, the rotationally symmetric member 111 which comprises the condensing member 11 is not limited to four, You may be comprised by the two, three, or five or more rotationally symmetric members 111. Further, one rotationally symmetric member 111 may be used. In this case, the light collecting member 11 does not have to include the connecting portion 112.
In the present embodiment, the reflection surface composed of the rotation hyperboloid 1111 and the rotation ellipsoid 1112 is used, but the present invention is not limited to this. The reflection surface constituted only by the spheroid 1111 may be a single type of mirror. For example, only the spheroid ellipsoid 1112 may be used, and the focal position of the ellipsoid may be formed by two or more types of surfaces. Here, the type of surface is determined by, for example, the number of functions that define the surface. Further, in the present embodiment, it is rotationally symmetric, and the reflection surface is formed in a circular shape around the rotational symmetry axis Z1, but it may be a shape that becomes a symmetrical shape a plurality of times around the rotational symmetry axis Z1. . For example, a 6-fold symmetrical shape may be used.

  FIG. 3 is a diagram schematically showing an X-ray trajectory in the light collecting member 11. In FIG. 3, the connecting portion 112 is omitted for easy understanding of the description. In FIG. 3, X-ray trajectories 600, 700, 800, and 900 emitted from the X-ray source 10 are shown. A trajectory 600 indicates X-rays that are emitted after entering the inside of the rotationally symmetric member 111a having the smallest inner diameter among the rotationally symmetric members 111 constituting the light collecting member 11. Trajectories 700, 800, and 900 are X-rays that are emitted after entering the space between the rotationally symmetric members 111a and 111b, X-rays that are emitted after entering the space between the rotationally symmetric members 111b and 111c, and rotationally symmetric. X-rays emitted after entering the space between the members 111c and 111d are respectively shown.

Trajectories 600a, 700a, 800a, and 900a represent X-ray trajectories when the incident angles to the rotationally symmetric members 111a, 111b, 111c, and 111d are the largest. The X-rays represented by the trajectories 600a, 700a, 800a, and 900a are reflected for the first time by the rotation ellipsoid 1112 of the rotationally symmetric members 111a, 111b, 111c, and 111d, and are reflected by the rotation hyperboloid 1111 for the second time. Then, the light is condensed at a predetermined position. X-rays represented by the trajectories 600b, 700b, 800b, and 900b indicate the trajectories of the X-rays when the incident angles to the rotationally symmetric members 111a, 111b, 111c, and 111d are the smallest. Each of the trajectories 600b, 700b, 800b, and 900b also reflects the first time on the spheroid 1111 of the rotationally symmetric members 111a, 111b, 111c, and 111d, and reflects the second time on the rotating hyperboloid 1111 so that a predetermined value is obtained. It is condensed at the position. In this case, X-rays emitted from the X-ray emission location are reflected by the spheroid 1111 and the rotation hyperboloid 1111, and the X-rays are collected at the focal position of the rotation hyperboloid 1111. In this embodiment, the position which condenses with the condensing member 11 can be moved with the movement of the X-ray emission place. In this embodiment, the rotation hyperboloid 1111 and the ellipsoidal surface 1112 are configured. When the distance from the X-ray emission point to the end of the rotation hyperboloid 1111 on the rotation ellipsoid 1112 is set to 10 X mm, The distance from the measured object S to the spheroid 1111 on the rotating hyperboloid 1111 is set to X mm. The unit is not limited to mm, and may be, for example, cm or m. Further, in this embodiment, 3 is entered in X, but an appropriate number from 1 to 9 other than 3 is substituted. Of course, a number after the decimal point may be substituted.
The condensing member 11 includes a plurality of rotationally symmetric members 111 having different internal diameters and having a common rotationally symmetric axis Z1, and the distance between adjacent rotationally symmetric members 111 increases as the distance from the rotationally symmetric axis Z1 increases. The solid angle at which the X-rays incident on 11 are captured can be increased.

The condensing lens 11 is produced as follows, for example.
First, a cylindrical member is formed with resin. The outer surface shape of this cylindrical member is composed of a rotation hyperboloid 1111 and a rotation ellipsoid 1112 and is formed to have a shape corresponding to the inner surface shape of the rotationally symmetric member 111a. From the outer surface of the cylindrical member, a metal rod having a sufficient length is penetrated and fixed so as to be orthogonal to the axis of the cylindrical member. Next, a first-layer metal film is formed on the outer surface of the cylindrical member using a material that reflects X-rays such as gold, molybdenum, and tungsten as described above. Next, a cylindrical member made of resin and having an outer surface shape corresponding to the inner surface shape of the rotationally symmetric member 111b is formed on the outer surface of the first metal film. A second-layer metal film is formed on the outer surface of the cylindrical member. Hereinafter, similarly, a cylindrical member is formed of resin, and a metal film is formed on the outer surface thereof, thereby forming the third and fourth metal films. Next, the metal rod protruding outside from the fourth metal film is cut. By immersing the resin in an organic solvent, the resin portion is removed. In this manner, the above-described condensing lens 11 in which the first to fourth metal films form the rotationally symmetric members 111a, 111b, 111c, and 111d and the metal rod forms the connecting portion 112 is manufactured. . Note that the above manufacturing method is an example, and any method capable of manufacturing the condensing lens 11 having the above-described shape can be used. For example, a groove having a shape corresponding to the rotationally symmetric members 111a, 111b, 111c, and 111d is processed in a molded body such as a resin, and a substance that reflects X-rays is formed in the groove by a vacuum process or the like. It may be removed by dipping in a solvent or heating.

The operation of the scanning X-ray microscope 1 will be described.
The X-ray control unit 141 of the control device 14 supplies power to the X-ray source 10 to emit an electron beam from the filament 101, and the scanning unit 103 and the converging unit 104 converge the electron beam to a predetermined position on the target 102. And collide with the target 102. The X-ray control unit 141 controls the power supplied to the scanning unit 103 to cause the electron beam to scan in a predetermined direction within a scanning range on the target 102 with a predetermined movement amount. As described above, the magnification of the reconstructed image of the object S to be generated is the amount of movement when the X-ray scans the object S, that is, the electron beam scans within the scanning range of the target 102. Depends on the amount of movement. Therefore, the amount of movement of the electron beam is calculated by the X-ray control unit 141 calculating the amount of movement of the electron beam based on the magnification of the image set by the user using an operation unit (not shown), for example. Is supplied to the scanning unit 103.

  X-rays are emitted from the position (exit point) where the electron beam collides with the target 102. As the electron beam moves on the target 102 as described above, the X-rays emitted from the target 102 also move following the electron beam. The X-ray control unit 141 controls the X-ray source 10 to emit X-rays, for example, at 5 keV first, and switches to X-rays of, for example, 10 keV when the measured object S does not pass through. The X-rays emitted from the X-ray source 10 enter the light collecting member 11, travel or reflect on the light collecting member 11 as described above with reference to FIG. Since the X-rays are emitted while being scanned from the X-ray source 10, the X-rays collected on the object to be measured S are scanned as the emission point moves on the target 102. X-rays scanned on the measurement object S pass through the measurement object S at each scanning position and enter the X-ray detector 14. The X-ray detector 14 outputs an electrical signal corresponding to the intensity of the incident X-ray. As described above, the image generation unit 142 uses the electrical signal output from the X-ray detector 12 to generate the entire projection data of the measurement object S, and the measurement object S based on the back projection data. The reconstructed image is generated.

According to the first embodiment described above, the following operational effects are obtained.
(1) The scanning unit 103 scans or moves the electron beam on the target 102 to scan and move the X-ray toward the object S to be emitted. The condensing member 11 is provided between the target 102 and the measured object S, and condenses the X-rays emitted from the target 102 onto the measured object S. Therefore, by moving the irradiation position of the electron beam that irradiates the target 102 inside the X-ray source 10 and changing the relative position between the light collecting member 11 and the object S to be measured, the X-rays are measured. The position irradiated with S can be changed. That is, in this embodiment, when it is desired to change the X-ray irradiation position of the measurement object S, this can be achieved by changing the electron beam irradiation position on the target 102 of the X-ray source 10. When changing the irradiation position of the electron beam, for example, the X-ray irradiation position of the target 102 of the X-ray source 10 is fixed, and the X-ray source 10 is moved to move the irradiation position of the object S to be measured. Compared with the case where the scanning is performed, the scanning unit 103 is electrically controlled to change the X-ray irradiation position of the object S to be measured, so that the scanning unit 103 can be moved at a high speed. Thereby, the measurement time of the to-be-measured object S can be shortened. Further, in the present embodiment, when only the measurement object S is moved in order to move the irradiation position of the measurement object S by a minute amount, the stage 13 holding the measurement object S is moved by a minute amount. Thus, since the irradiation position of the electron beam on the target 102 is moved by a minute amount, it is not necessary to provide a drive mechanism for moving the minute amount of the stage 13. Further, when the object to be measured S is moved minutely, the object to be measured is caused by the influence of vibration of the object to be measured S accompanying the movement and the conduction of heat from the minute movement mechanism to the object to be measured S. There is a possibility that the mounting conditions of the object to be measured such as the posture of the object S, the mounting position, and the alteration of the object to be measured S or the deformation of the object to be measured will be changed. In the present embodiment, the minute movement of the X-ray irradiation position on the measurement object S can be achieved by minutely moving the electron beam irradiation position on the target 102. Moreover, in this embodiment, the condensing member 10 was provided between the X-ray source 10 and the to-be-measured object. Thereby, since the to-be-measured object S and the X-ray source 10 are arrange | positioned away, the conduction to the to-be-measured object S of the heat | fever generated from the X-ray source 10 can be suppressed. The conduction of heat to the object to be measured S results in alteration of the protein when, for example, the object to be measured S contains a protein. In addition, as a result of the conduction of heat to the object S to be measured, for example, when the object to be measured S contains a substance such as metal that contracts due to heat, the substance contracts. Thereby, there is a possibility of causing a measurement failure of the object S to be measured.
In the present embodiment, the obtained image is also determined by the light collecting ability of the light collecting member 11. For example, the ability to separate and resolve two points in the obtained image is determined by the light collecting ability of the light collecting member 11. The light collecting ability is determined by, for example, the wavelength of X-rays incident on the light collecting member 11 and the numerical aperture of the light collecting member 11. Therefore, in the present embodiment, the amount of movement of the electron beam on the target 102 in the X-ray source 10 may be determined according to the resolvable distance. That is, it is difficult to acquire an X-ray image beyond the resolvable distance even if the electron beam is moved for a predetermined time interval at a distance shorter than the resolvable distance and the image is acquired. Therefore, it is desirable that at least the amount of movement of the electron beam corresponding to the resolvable distance is determined and moved by the determined amount of movement. Of course, the condensing member 11 may be selected according to the distance of the possible movement interval when the position of the electron beam on the target 102 in the X-ray source 10 is moved.
Further, in the present embodiment, in order to change the position where the X-ray is irradiated on the object S, the driving mechanism for moving the light collecting member 11 or the object S to be measured is not used. When a drive mechanism is used, the resolution of the obtained image is determined depending on the accuracy of the drive mechanism. In this embodiment, unlike such a drive mechanism, since the scanning unit 103 which is an aligner is used, the electron beam can be moved with higher accuracy. Of course, a mechanism for driving the condensing member 11 or the object S to be measured is provided, and an electronic device using the scanning unit 103 according to the present embodiment is required for a case where higher accuracy than that required when the drive mechanism is used is used. A line moving mechanism may be further provided and used in combination.

(2) The reflecting surface of the condensing member 11 is constituted by a cylindrical rotationally symmetric member 111 and reflects an oblique incident component of X-rays. Therefore, the oblique incident component of X-rays incident on the condensing member 11 can be condensed at one point.

(3) The condensing member 11 includes a plurality of rotationally symmetric members 111a, 111b, 111c, and 111d that are concentrically arranged and have different diameters, each having a common rotationally symmetric axis Z1, and a plurality of rotationally symmetric members. 111a, 111b, 111c, and 111d, in the plane orthogonal to the common rotational symmetry axis Z1, the distance between the adjacent reflecting surfaces increases as the distance from the common rotational symmetry axis Z1 increases. Therefore, the solid angle for taking in the X-rays incident on the light collecting member 11 can be increased.

(4) The support member 15 is rotationally symmetric by matching the optical axis Z2 of the X-ray emitted from the center of the scanning region when the electron beam is scanned on the target 102 and the rotational symmetry axis Z1 of the rotationally symmetric member 111. The member 111 is supported. Therefore, since the positional relationship between the X-ray source 10 and the condensing member 11 is continuously maintained, it is possible to prevent a change in the correspondence between the X-ray emission point on the target 102 and the position where the measurement object S is transmitted. .

(5) The condensing member 11 includes a connecting member 112 that connects the rotationally symmetric members 111 adjacent to each other, and the connecting member 112 fixes each of the plurality of rotationally symmetric members 111a, 111b, 111c, and 111d. Therefore, the intensity | strength of the condensing member 11 is securable by connecting between the rotationally symmetric members 111 manufactured with a metal film etc.

The scanning X-ray microscope 1 of the first embodiment described above can be modified as follows.
(1) The condensing member 11 included in the scanning X-ray microscope 1 is not limited to the one configured by the rotationally symmetric member 111. For example, as schematically shown in FIG. 4, a part of the X-ray from the X-ray source 10 may be reflected toward the object to be measured S using a Cassegrain-shaped mirror as the light collecting member 11.

(2) The scanning X-ray microscope 1 includes a shielding plate for preventing the object to be measured S from being irradiated by components that do not enter the light collecting member 11 among the X-rays emitted from the X-ray source 10. Also good. In this case, as schematically shown in FIG. 5A, the shielding plate 19 has an opening on the incident end (X-ray source 10) side of the condensing member 11 according to the shape of the incident end of the condensing member 11. Is provided. The shielding plate 19 is manufactured using a substance having a high X-ray absorption rate such as lead. As schematically shown in FIG. 5B, the shielding plate 19 may form a part of the support member 15 for supporting the light collecting member 11 on the X-ray source 10.
In the above-described embodiment, the X-ray source 10 and the condensing member 11 are fixed and arranged. However, a drive mechanism is provided in at least one of the X-ray source 10 and the central axis of the condensing member 11. You may enable it to adjust position. For example, a position adjustment mechanism may be provided on the light collecting member 11 so that the optical axis direction of the light collecting member 11 can be changed. In this case, it may be adjusted so that the posture is always the same, or the posture of the light collecting member may be adjusted so that the light amount always reaches the maximum light amount based on the light amount reaching the X-ray detector 12.
In the above-described embodiment, the stage 13 is fixed, but may be driven. For example, when the measurement area of the measurement object S is wider than the area of the measurement object that can be irradiated with X-rays as the electron beam moves, the X-ray irradiation area of the measurement object S is changed. In addition, it is necessary to move the stage 13 on which the object to be measured S is placed. In this case, the movement distance of the X-ray irradiation position accompanying the electron beam irradiation movement is shorter than the movement distance of the object S to be measured by the stage 13. That is, the stage 13 can be moved with a larger movement amount than an area that can be measured by moving a minute amount in the electron beam irradiation area. Of course, the X-ray irradiation position on the measurement object S may be moved by moving the irradiation position of the electron beam while moving the measurement object S while being supported by the stage 13.

  In the first embodiment and the modifications (1) and (2) described above, the configuration in which the scanning X-ray microscope 1 includes the X-ray detector 12 has been described as an example. The line microscope 1 may be configured by the X-ray source 10 and the light collecting member 11.

-Second embodiment-
A scanning X-ray microscope according to the second embodiment will be described with reference to the drawings.
FIG. 6 is a block diagram schematically illustrating a main configuration of the scanning X-ray microscope 2 according to the second embodiment. The scanning X-ray microscope 2 includes an X-ray source 20, an X-ray detector 21, a stage 23, a control device 24, a light shielding unit 25, and a moving unit 26. The X-ray source 20 emits X-rays toward the measurement object S placed on the stage 23 in accordance with control by the control device 24. The X-ray source 20 in the second embodiment can also emit X-rays having a maximum energy of about 5 keV to about 10 keV, for example. The scanning X-ray microscope 2 of the second embodiment is also surrounded so that X-rays generated from the X-ray source 20 do not leak into the external space, as in the case of the first embodiment. It has a chamber member C formed of lead or the like. The chamber member C is in contact with a support surface D such as a floor surface of a factory via the base member B. In the present embodiment, the chamber member C and the support surface D may be contacted and supported without using the base member B.

  The X-ray source 20 includes a filament 201, a target 202, and a converging unit 204. In other words, unlike the X-ray source 10 of the first embodiment, the X-ray source 20 of the second embodiment does not have the scanning unit 103. About another structure, it is the same as that of the X-ray source 10 of 1st Embodiment. Therefore, in the scanning X-ray microscope 2 of the second embodiment, the X-ray emitted from the X-ray source 20 is scanned on the object S to be measured. The scanning X-ray microscope of the first embodiment Different from 1.

  The light shielding unit 25 is disposed between the X-ray source 20 and the measurement object S placed on the stage 23. The light shielding part 25 is manufactured using a substance having a property of absorbing X-rays such as lead. A minute opening, that is, a pinhole 251 for passing a part of the X-ray from the X-ray source 20 and guiding it to the object S to be measured is provided. The light shielding unit 25 shields the object to be measured S from the X-ray irradiation except at the position where the pinhole 251 is provided. The X-rays that have passed through the pinhole 251 of the light shielding unit 25 pass through the measurement object S and / or the stage 23 and enter the X-ray detector 21. The X-ray detector 21 has a configuration similar to that of the X-ray detector 14 of the first embodiment, detects incident transmitted X-rays, and outputs detection data to the control device 24.

  The moving unit 26 includes, for example, a motor, a rail, a slider, and the like, and is controlled by the control device 24 to move the light shielding unit 25 two-dimensionally on a plane along the stage 23. That is, the relative position of the pinhole 251 with respect to the measured object S moves. Further, the relative position of the pinhole 251 with respect to the object S to be measured is changed. Therefore, the X-rays are scanned on the measurement object S by moving the position where the X-rays that have passed through the pinhole 251 irradiate the measurement object S.

  The control device 24 includes an X-ray control unit 241 and an image generation unit 242. The X-ray control unit 241 controls the operation of the X-ray source 20 by adjusting the power supplied to emit an electron beam from the filament 201 of the X-ray source 20. The image generation unit 242 uses the electrical signal output from the X-ray detector 21 to project a projection corresponding to transmitted X-rays that have passed through a minute region on the measurement object S via the pinhole 251 of the light shielding unit 25. Data is mapped to generate projection data for the entire object to be measured S, and a reconstructed image of the object to be measured S is generated based on the backprojection data. In the reconstructed image of the object S to be measured, the resolution is determined by the size of a minute region where X-rays have passed through the object S to be measured, that is, the size of the pinhole 251. That is, as the size of the pinhole 251 is reduced, the resolution of the reconstructed image is increased. The smaller the interval between minute regions where the X-rays pass through the object to be measured S, that is, the movement amount of the pinhole 251 is smaller, the number of projection data to be mapped increases and the magnification of the reconstructed image becomes higher.

According to the second embodiment described above, the following operational effects can be obtained.
The light shielding unit 25 is provided between the X-ray source 20 and the X-ray detector 21 and has an opening 251 that allows a part of the X-rays to pass therethrough. The moving unit 26 relatively moves the positional relationship along the stage 23 between the light shielding unit 25 and the object S to be measured. Therefore, for example, it is possible to perform measurement using X-rays in a wide wavelength range as compared with the case of condensing the object to be measured S using a member that condenses X-rays of a specific single wavelength.

The scanning X-ray microscope 2 of the second embodiment described above can be modified as follows.
(1) The light shielding unit 25 may be disposed between the stage 23 and the X-ray detector 21 in place of the light shielding unit 25 disposed between the X-ray source 20 and the object S to be measured. That is, the X-ray detector 21 may detect only transmitted X-rays that have passed through the pinhole 251 of the light shielding unit 25 among transmitted X-rays that have passed through the measurement object S.

(2) The moving unit 26 may move the stage 23 instead of moving the light shielding unit 25. In this case, the moving unit 26 moves the stage 23 in a two-dimensional manner, thereby moving the object to be measured S placed on the stage 23 relative to the light shielding unit 25 in a two-dimensional manner.

-Third embodiment-
A structure manufacturing system according to an embodiment of the present invention will be described with reference to the drawings. The structure manufacturing system of the present embodiment creates a molded product such as an electronic component including, for example, an automobile door portion, an engine portion, a gear portion, and a circuit board.

  FIG. 7 is a block diagram showing an example of the configuration of a structure manufacturing system 600 according to this embodiment. The structure manufacturing system 600 includes the scanning X-ray microscope 100, the design apparatus 610, the molding apparatus 620, the control system 630, and the repair apparatus 640 described in the first or second embodiment or modification. Is provided.

  The design device 610 is a device used by a user when creating design information related to the shape of a structure, and performs design processing for creating and storing design information. The design information is information indicating the coordinates of each position of the structure. The design information is output to the molding apparatus 620 and a control system 630 described later. The molding apparatus 620 performs a molding process for creating and molding a structure using the design information created by the design apparatus 610. In this case, the molding apparatus 620 includes an apparatus that performs at least one of laminating, casting, forging, and cutting represented by 3D printer technology.

  The scanning X-ray microscope 100 performs a measurement process for measuring the shape of the structure formed by the forming apparatus 620. The scanning X-ray microscope 100 outputs information (hereinafter referred to as shape information) indicating the coordinates of the structure, which is a measurement result of measuring the structure, to the control system 630. The control system 630 includes a coordinate storage unit 631 and an inspection unit 632. The coordinate storage unit 631 stores design information created by the design apparatus 610 described above.

  The inspection unit 632 determines whether or not the structure molded by the molding device 620 is molded according to the design information created by the design device 610. In other words, the inspection unit 632 determines whether or not the molded structure is a non-defective product. In this case, the inspection unit 632 reads the design information stored in the coordinate storage unit 631 and performs an inspection process for comparing the design information with the shape information input from the scanning X-ray microscope 100. For example, the inspection unit 632 compares the coordinates indicated by the design information with the coordinates indicated by the corresponding shape information as the inspection process, and if the coordinates of the design information and the coordinates of the shape information match as a result of the inspection process. It is determined that the non-defective product is molded according to the design information. If the coordinates of the design information and the coordinates of the corresponding shape information do not match, the inspection unit 632 determines whether or not the coordinate difference is within a predetermined range, and if it is within the predetermined range, it can be restored. Judged as a defective product.

  If it is determined that the defective product can be repaired, the inspection unit 632 outputs repair information indicating the defective portion and the repair amount to the repair device 640. The defective part is the coordinate of the shape information that does not match the coordinate of the design information, and the repair amount is the difference between the coordinate of the design information and the coordinate of the shape information in the defective part. The repair device 640 performs a repair process for reworking a defective portion of the structure based on the input repair information. The repair device 640 performs the same process as the molding process performed by the molding apparatus 620 in the repair process again.

The process performed by the structure manufacturing system 600 will be described with reference to the flowchart shown in FIG.
In step S111, the design apparatus 610 is used when the structure is designed by the user. The design information on the shape of the structure is created and stored by the design process, and the process proceeds to step S112. Note that the present invention is not limited to only the design information created by the design apparatus 610. If design information already exists, the design information is acquired by inputting the design information, and is included in one aspect of the present invention. It is. In step S112, the molding apparatus 620 creates and molds a structure based on the design information by a molding process, and proceeds to step S113. In step S113, the scanning X-ray microscope 100 performs measurement processing, measures the shape of the structure, outputs shape information, and proceeds to step S114.

  In step S114, the inspection unit 632 performs an inspection process for comparing the design information created by the design apparatus 610 with the shape information measured and output by the scanning X-ray microscope 100, and the process proceeds to step S115. In step S115, based on the result of the inspection process, the inspection unit 632 determines whether the structure molded by the molding apparatus 620 is a non-defective product. If the structure is a non-defective product, that is, if the coordinates of the design information coincide with the coordinates of the shape information, an affirmative determination is made in step S115 and the process ends. If the structure is not a non-defective product, that is, if the coordinates of the design information do not match the coordinates of the shape information, or if coordinates that are not in the design information are detected, a negative determination is made in step S115 and the process proceeds to step S116.

  In step S116, the inspection unit 632 determines whether the defective portion of the structure can be repaired. If the defective part cannot be repaired, that is, if the difference between the coordinates of the design information and the coordinates of the shape information in the defective part exceeds the predetermined range, a negative determination is made in step 116 and the process ends. If the defective part can be repaired, that is, if the difference between the coordinates of the design information and the shape information in the defective part is within a predetermined range, an affirmative determination is made in step S116 and the process proceeds to step S117. In this case, the inspection unit 632 outputs repair information to the repair device 640. In step S117, the repair device 640 performs a repair process on the structure based on the input repair information, and returns to step S113. As described above, the repair device 640 performs the same process as the molding process performed by the molding apparatus 620 in the repair process.

According to the structure manufacturing system of the third embodiment described above, the following functions and effects can be obtained.
(1) The scanning X-ray microscope 100 of the structure manufacturing system 600 performs a measurement process for acquiring shape information of the structure created by the molding apparatus 620 based on the design process of the design apparatus 610, and controls the control system 630. The inspection unit 632 performs an inspection process that compares the shape information acquired in the measurement process with the design information created in the design process. Therefore, it is possible to determine whether a structure is a non-defective product created according to the design information by acquiring defect inspection of the structure or information inside the structure by nondestructive inspection. Contribute to.

(2) The repair device 640 performs the repair process for performing the molding process again on the structure based on the comparison result of the inspection process. Therefore, when the defective portion of the structure can be repaired, the same processing as the molding process can be performed again on the structure, which contributes to the manufacture of a high-quality structure close to design information.

The following modifications are also within the scope of the present invention, and one or a plurality of modifications can be combined with the above-described embodiment.
(3) In the above-described embodiment, the X-ray irradiation position on the measurement object S is moved and the X-ray transmitted through the measurement object S is detected. However, the X-rays to be detected are limited to this. Absent. For example, fluorescent X-rays or diffracted X-rays may be detected. Of course, a plurality of types of X-rays may be detected. For example, while detecting the fluorescent X-ray spectrum, the transmission X-ray image is detected, and the X-ray irradiation position information is acquired, so that the X-ray transmission image data and the fluorescent X-ray at the X-ray irradiation position are acquired. It becomes possible to compare and examine the composition information of the material calculated from the spectrum. Further, when detecting X-rays transmitted through the measurement object S, the angle applied to the measurement object S may be changed to detect a plurality of transmission X-ray images and form a reconstructed image. For example, a plurality of X-ray images obtained by irradiating the measurement object S with X-rays while rotating the measurement object S are detected. The to-be-measured object S is reconfigure | reconstructed using the detected several transmission X-ray image, and, thereby, the three-dimensional data (three-dimensional structure) of the internal structure of the to-be-measured object S are produced | generated. Examples of a method for reconstructing a tomographic image of the measurement object S include a back projection method, a filtered back projection method, and a successive approximation method. The back projection method and the filtered back projection method are described in, for example, US Patent Application Publication No. 2002/0154728. The successive approximation method is described, for example, in US Patent Application Publication No. 2010/0220908.

(4) It is also possible to compare and examine the X-ray transmission image and other images. For example, the design information of the entire image of the object to be measured, the transmitted X-ray image or the surface image, and the image at the X-ray measurement position may be compared and displayed. This makes it possible to clarify which region the X-ray measurement result is measuring.

  As long as the characteristics of the present invention are not impaired, the present invention is not limited to the above-described embodiments, and other forms conceivable within the scope of the technical idea of the present invention are also included in the scope of the present invention. .

1, 2, 100 ... scanning X-ray microscope, 10, 20 ... X-ray source, 11 ... condensing member,
12, 21 ... X-ray detector, 13, 23 ... Stage, 14, 24 ... Control device,
DESCRIPTION OF SYMBOLS 15 ... Support member, 19 ... Shielding plate, 25 ... Light-shielding part, 26 ... Drive part,
101, 201 ... Filament, 102, 202 ... Target, 103 scanning unit,
111 ... rotationally symmetric member, 112 ... connecting part, 141, 241 ... X-ray control part,
142, 242 ... image generation unit, 251 ... pinhole 600 ... structure manufacturing system, 610 ... design device, 620 ... molding device,
630 ... Control system, 632 ... Inspection section, 640 ... Repair device

Claims (18)

An electron beam generator that emits an electron beam toward the target;
A moving unit that moves a collision position of the electron beam to the target;
A plurality of condensing members for condensing X-rays emitted from the target onto the object to be measured;
A detector for detecting the X-ray transmitted through the object to be measured;
Comprising a supporting member for supporting one of the previous SL plurality of condensing member,
The plurality of condensing members are X-ray apparatuses having different magnifications of transmission images of the object to be measured projected onto the detector . The X-ray apparatus according to claim 1,
Each of the plurality of condensing members is an X-ray apparatus including a reflecting surface that reflects at least a part of the X-rays emitted from the target and collects the light toward the object to be measured. The X-ray apparatus according to claim 2,
Each of the plurality of condensing members includes a cylindrical rotationally symmetric member having the reflection surface, and reflects an oblique incident component of the X-ray with respect to the reflection surface. The X-ray apparatus according to claim 3,
The plurality of light collecting members each include a plurality of rotationally symmetric members having different diameters, and the plurality of rotationally symmetric members each have a common rotationally symmetric axis. The X-ray apparatus according to claim 4,
Any of the plurality of rotationally symmetrical member, said in a common plane orthogonal to the axis of rotational symmetry, said common farther from the axis of rotational symmetry, X-rays apparatus distance between the reflective surface adjacent increases. The X-ray apparatus according to claim 4 or 5,
The support member has the plurality of X-ray optical axes emitted from the center of the moving region when the electron beam is moved on the target, and the rotational symmetry axis of the rotationally symmetric member coincides with the plurality of rotational symmetry members . An X-ray apparatus that supports any of the light collecting members. The X-ray apparatus according to any one of claims 4 to 6,
Each of the rotationally symmetric members is an X-ray apparatus having the reflecting surface on the inner wall side of the structure. The X-ray apparatus according to any one of claims 4 to 7,
Each of the plurality of condensing members includes a connecting member that connects the rotationally symmetric members adjacent to each other, and the connecting member fixes each of the plurality of rotationally symmetric members. The X-ray apparatus according to any one of claims 3 to 8,
Each of the rotationally symmetric members is an X-ray apparatus constituted by a Walter mirror having a rotational hyperboloid and a rotational ellipsoid. The X-ray apparatus according to any one of claims 1 to 9,
An X-ray apparatus comprising an adjustment mechanism for adjusting a relative position between the target and the support member. The X-ray apparatus according to any one of claims 1 to 10,
A control unit for controlling the moving unit;
The control unit determines a moving amount of the electron beam by the moving unit according to a light collecting ability of the light collecting member supported by the support member or a preset magnification of the image, and the determined moving amount An X-ray apparatus that controls the moving unit to move an electron beam. The X-ray apparatus according to any one of claims 1 to 11,
An X-ray apparatus comprising a shielding plate that shields X-rays traveling outside the light collecting member among the emitted X-rays. The X-ray apparatus according to claim 12,
An X-ray apparatus in which a part of the support member forms the shielding plate. The X-ray apparatus according to any one of claims 1 to 13,
A detector that outputs a detection signal each time a transmitted X-ray transmitted through a different position of the object to be measured is detected by the movement of the collision position of the electron beam to the target;
A generating unit that generates transmission image data of the object to be measured using the detection signal;
An X-ray apparatus comprising: The X-ray apparatus according to any one of claims 1 to 14,
An X-ray apparatus in which the magnification of each of the plurality of light collecting members is greater than 1. Create design information about the shape of the structure,
Create the structure based on the design information,
The shape of the created structure is measured using the X-ray apparatus according to any one of claims 1 to 15 to obtain shape information,
A structure manufacturing method for comparing the acquired shape information and the design information. In the manufacturing method of the structure according to claim 16 ,
A method of manufacturing a structure, which is executed based on a comparison result between the shape information and the design information, and reworks the structure. In the manufacturing method of the structure according to claim 17 ,
The reworking of the structure is a structure manufacturing method in which the structure is created again based on the design information.

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