JP6576467B2 - 電気接続エレメントおよびこれに取り付けられた結合エレメントを備えたガラス板 - Google Patents
電気接続エレメントおよびこれに取り付けられた結合エレメントを備えたガラス板 Download PDFInfo
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- JP6576467B2 JP6576467B2 JP2017557392A JP2017557392A JP6576467B2 JP 6576467 B2 JP6576467 B2 JP 6576467B2 JP 2017557392 A JP2017557392 A JP 2017557392A JP 2017557392 A JP2017557392 A JP 2017557392A JP 6576467 B2 JP6576467 B2 JP 6576467B2
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- 238000010168 coupling process Methods 0.000 title claims description 111
- 230000008878 coupling Effects 0.000 title claims description 110
- 238000005859 coupling reaction Methods 0.000 title claims description 110
- 239000011521 glass Substances 0.000 title claims description 65
- 239000000463 material Substances 0.000 claims description 83
- 229910000679 solder Inorganic materials 0.000 claims description 65
- 239000000758 substrate Substances 0.000 claims description 58
- 238000005476 soldering Methods 0.000 claims description 42
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 25
- 239000010949 copper Substances 0.000 claims description 24
- 229910052802 copper Inorganic materials 0.000 claims description 24
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 22
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 19
- 229910052709 silver Inorganic materials 0.000 claims description 19
- 239000004332 silver Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 16
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 15
- 229910052804 chromium Inorganic materials 0.000 claims description 15
- 239000011651 chromium Substances 0.000 claims description 15
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 12
- 229910000831 Steel Inorganic materials 0.000 claims description 11
- 229910052759 nickel Inorganic materials 0.000 claims description 11
- 239000010959 steel Substances 0.000 claims description 11
- 238000002844 melting Methods 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 235000008733 Citrus aurantifolia Nutrition 0.000 claims description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 6
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 6
- 235000011941 Tilia x europaea Nutrition 0.000 claims description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 239000004571 lime Substances 0.000 claims description 6
- 229910052750 molybdenum Inorganic materials 0.000 claims description 6
- 239000011733 molybdenum Substances 0.000 claims description 6
- 229910052758 niobium Inorganic materials 0.000 claims description 6
- 239000010955 niobium Substances 0.000 claims description 6
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 239000011572 manganese Substances 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 3
- PMVSDNDAUGGCCE-TYYBGVCCSA-L Ferrous fumarate Chemical compound [Fe+2].[O-]C(=O)\C=C\C([O-])=O PMVSDNDAUGGCCE-TYYBGVCCSA-L 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 230000035882 stress Effects 0.000 description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 12
- 239000011135 tin Substances 0.000 description 12
- 229910052718 tin Inorganic materials 0.000 description 12
- 229910052797 bismuth Inorganic materials 0.000 description 10
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- 239000004020 conductor Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 125000006850 spacer group Chemical group 0.000 description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 229910052725 zinc Inorganic materials 0.000 description 5
- 239000011701 zinc Substances 0.000 description 5
- 230000006378 damage Effects 0.000 description 4
- 229910052720 vanadium Inorganic materials 0.000 description 4
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 4
- 239000000356 contaminant Substances 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000010941 cobalt Substances 0.000 description 2
- 229910017052 cobalt Inorganic materials 0.000 description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000004049 embossing Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 2
- 230000005499 meniscus Effects 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 229910001006 Constantan Inorganic materials 0.000 description 1
- 229910002545 FeCoNi Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000005349 heatable glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920005554 polynitrile Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
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- 239000005336 safety glass Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/1271—Supports; Mounting means for mounting on windscreens
- H01Q1/1278—Supports; Mounting means for mounting on windscreens in association with heating wires or layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/27—Adaptation for use in or on movable bodies
- H01Q1/32—Adaptation for use in or on road or rail vehicles
- H01Q1/325—Adaptation for use in or on road or rail vehicles characterised by the location of the antenna on the vehicle
- H01Q1/3275—Adaptation for use in or on road or rail vehicles characterised by the location of the antenna on the vehicle mounted on a horizontal surface of the vehicle, e.g. on roof, hood, trunk
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/27—Adaptation for use in or on movable bodies
- H01Q1/32—Adaptation for use in or on road or rail vehicles
- H01Q1/325—Adaptation for use in or on road or rail vehicles characterised by the location of the antenna on the vehicle
- H01Q1/3283—Adaptation for use in or on road or rail vehicles characterised by the location of the antenna on the vehicle side-mounted antennas, e.g. bumper-mounted, door-mounted
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/65—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/023—Soldered or welded connections between cables or wires and terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/029—Welded connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0235—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for applying solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/06—Heater elements structurally combined with coupling elements or holders
- H05B3/08—Heater elements structurally combined with coupling elements or holders having electric connections specially adapted for high temperatures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/84—Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/1271—Supports; Mounting means for mounting on windscreens
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/016—Heaters using particular connecting means
Landscapes
- Engineering & Computer Science (AREA)
- Remote Sensing (AREA)
- Manufacturing & Machinery (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Surface Heating Bodies (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Joining Of Glass To Other Materials (AREA)
Description
− 基材、
− この基材の領域上の導電性構造、
− 1つのブリッジ領域と少なくとも2つのはんだ付け脚部とを含み、このはんだ付け脚部が、はんだ材料を介して導電性構造の領域と結合されているブリッジ型の電気接続エレメント、および
− 接続エレメントに取り付けられた電気結合エレメント
を含む。
− 第1の実施態様の場合に、結合エレメントは、ブリッジ領域の、基材に向かう側の表面に取り付けられている。
− 第2の実施態様の場合に、結合エレメントは、ブリッジ領域の、基材とは反対側の表面に取り付けられていて、かつブリッジ領域の周りを回るように案内されているので、この結合エレメントは、ブリッジ領域の、基材に向かう側の表面に当接する。結合エレメントは、基材とは反対側の表面から、ブリッジ領域の一方の側縁の周りを回り、ブリッジ領域の、基材に向かう側の表面に沿って延びる。好ましくは、この結合エレメントは、基材に向かう側の全体の表面に(完全に)当接している。このように、最適な安定性が達成される。しかしながら、基本的に、この結合エレメントは、表面の一部にだけ当接する、例えば、結合エレメントが周りを回って案内されている側縁に対峙する縁部に当接する場合で十分である。
(a)ブリッジ型の電気接続エレメントを結合エレメントと結合し、
(b)接続エレメントのはんだ付け脚部の接触面上にはんだ材料を施し、
(c)はんだ材料を備えた接続エレメントを、基材の領域上に施されている導電性構造の領域上に配置し、かつ
(d)接続エレメントを導電性構造とエネルギー導入下で結合する、
本発明によるガラス板の製造方法を含む。
一連のブリッジ型の接続エレメント3を、本発明の場合に、結合エレメント5と溶接しかつ固定した。引き続き、上方向に向かう200Nの引張力を、この結合エレメント5に及ぼした。同じ試験を、結合エレメントが慣用の方法様式で接続エレメント1の上側IIに取り付けられている接続エレメントを用いて実施した。この材料は、両方の場合に、図1〜3において実施例に相応して選択されていた。
引張試験を、慣用の接続エレメントと、本発明による接続エレメント3とについて実施した。結合エレメントには、接続エレメント3と結合エレメント5との間の結合が破壊されるまで連続的に高められた上方向に向かう引張力を及ぼした。最大引張力について測定された値が、表1にまとめられている。測定値aおよびbは、この場合、異なる製造元の接続エレメント3に関する。
(2) 導電性構造
(3) ブリッジ型の電気接続エレメント
(3a) 3のブリッジ領域
(3b) 3のはんだ付け脚部
(4) はんだ材料
(5) 結合エレメント
(6) 遮閉印刷部
(I) 基材1に向かう側の3aの下側
(II) 基材1とは反対側の3aの上側
(K) 3bの接触面
Claims (12)
- 少なくとも、
− 基材(1)、
− 前記基材(1)の領域上の導電性構造(2)、
− 1つのブリッジ領域(3a)と少なくとも2つのはんだ付け脚部(3b)とを含み、前記はんだ付け脚部(3b)がはんだ材料(4)を介して前記導電性構造(2)の領域と結合されているブリッジ型の電気接続エレメント(3)、および
− 前記接続エレメント(3)に取り付けられた、電気ケーブルを用いた電気接触のための電気結合エレメント(5)
を含む、少なくとも1つの電気接続エレメントを備えたガラス板であり、
前記結合エレメント(5)は、
− 前記ブリッジ領域(3a)の、前記基材(1)に向かう側の表面(I)上に取り付けられているか、または
− 前記ブリッジ領域(3a)の、前記基材(1)とは反対側の表面(II)に取り付けられていて、かつ前記ブリッジ領域(3a)の周りを回るように案内されているので、前記結合エレメント(5)は、前記ブリッジ領域(3a)の、基材(1)に向かう側の表面(I)に当接し、
ここで、前記接続エレメント(3)の材料の溶融温度と、前記結合エレメント(5)の材料の溶融温度との間の差は、200℃より大きく、かつ前記結合エレメント(5)は、溶接結合によって前記接続エレメント(3)に取り付けられ、前記結合エレメント(5)は、堅固な金属小板である、少なくとも1つの電気接続エレメントを備えたガラス板。 - 前記はんだ材料(4)は鉛フリーはんだ材料である、請求項1記載のガラス板。
- 前記接続エレメント(3)の材料の溶融温度と、前記結合エレメント(5)の材料の溶融温度との間の差は、300℃より大きく、特に好ましくは400℃より大きい、請求項1または2のいずれか1項記載のガラス板。
- 前記接続エレメント(3)は、少なくとも1種の鉄含有合金を含む、請求項1から3までのいずれか1項記載のガラス板。
- 前記接続エレメント(3)は、少なくとも1種のクロム含有鋼を含み、好ましくは鉄66.5質量%〜89.5質量%、クロム10.5質量%〜20質量%、炭素0質量%〜1質量%、ニッケル0質量%〜5質量%、マンガン0質量%〜2質量%、モリブデン0質量%〜2.5質量%、ニオブ0質量%〜2質量%、およびチタン0質量%〜1質量%を含む、請求項4記載のガラス板。
- 前記結合エレメント(5)は、少なくとも銅または銅含有合金を含む、請求項1から5までのいずれか1項記載のガラス板。
- 前記接続エレメント(3)の材料の厚みは、0.1mm〜4mm、好ましくは0.2mm〜2mm、特に好ましくは0.4mm〜1mmである、請求項1から6までのいずれか1項記載のガラス板。
- 前記基材(1)の熱膨張係数と、前記接続エレメント(3)の熱膨張係数との間の差は、5×10-6/℃未満、好ましくは3×10-6/℃未満である、請求項1から7までのいずれか1項記載のガラス板。
- 前記基材(1)は、ガラス、好ましくは石灰ソーダガラスを含む、請求項1から8までのいずれか1項記載のガラス板。
- 前記導電性構造(2)は、少なくとも銀、好ましくは銀粒子およびガラスフリットを含み、かつ5μm〜40μmの層厚を有する、請求項1から9までのいずれか1項記載のガラス板。
- (a)ブリッジ型の電気接続エレメント(3)を結合エレメント(5)と結合し、
(b)はんだ材料(4)を前記接続エレメント(3)のはんだ付け脚部(3b)の接触面(K)上に施し、
(c)前記はんだ材料(4)を備えた前記接続エレメント(3)を、基材(1)の領域上に施されている導電性構造(2)の領域上に配置し、かつ
(d)前記接続エレメント(3)を前記導電性構造(2)とエネルギー導入下で結合する、
請求項1から10までのいずれか1項記載のガラス板の製造方法。 - 建築物における、または陸上、空中もしくは水上での交通用の移動手段における、ことに鉄道車両または自動車における、好ましくはフロントウインドウ、リヤウインドウ、サイドウインドウ、および/またはルーフウインドウとして、ことに加熱可能なガラス板としてまたはアンテナ機能を備えたガラス板としての、請求項1から10までのいずれか1項記載のガラス板の使用。
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PCT/EP2016/059716 WO2016177653A1 (de) | 2015-05-05 | 2016-05-01 | Scheibe mit elektrischem anschlusselement und daran angebrachtem verbindungselement |
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EA034685B1 (ru) | 2020-03-06 |
CA2984056A1 (en) | 2016-11-10 |
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MX368692B (es) | 2019-10-11 |
CN106463845A (zh) | 2017-02-22 |
WO2016177653A1 (de) | 2016-11-10 |
CA2984056C (en) | 2020-03-24 |
US10700408B2 (en) | 2020-06-30 |
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