JP6554406B2 - Liquid-cooled cooler - Google Patents
Liquid-cooled cooler Download PDFInfo
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- JP6554406B2 JP6554406B2 JP2015230228A JP2015230228A JP6554406B2 JP 6554406 B2 JP6554406 B2 JP 6554406B2 JP 2015230228 A JP2015230228 A JP 2015230228A JP 2015230228 A JP2015230228 A JP 2015230228A JP 6554406 B2 JP6554406 B2 JP 6554406B2
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- 239000002826 coolant Substances 0.000 claims description 98
- 239000000110 cooling liquid Substances 0.000 claims description 25
- 239000007788 liquid Substances 0.000 claims description 21
- 238000001816 cooling Methods 0.000 claims description 19
- 238000010438 heat treatment Methods 0.000 claims description 19
- 239000012809 cooling fluid Substances 0.000 claims description 17
- 239000000470 constituent Substances 0.000 claims description 14
- 238000004891 communication Methods 0.000 claims description 13
- 239000000463 material Substances 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 9
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 238000005219 brazing Methods 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 7
- 239000002648 laminated material Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000680 Aluminized steel Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- -1 copper alloy Chemical compound 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
この発明は、たとえば半導体素子などの電子部品からなる発熱体を冷却する液冷式冷却器に関する。 The present invention relates to a liquid-cooled cooler that cools a heating element made of an electronic component such as a semiconductor element, for example.
この明細書および特許請求の範囲において、図２の上下を上下というものとする。 In this specification and claims, the upper and lower sides of FIG.
たとえば、電気自動車、ハイブリッド自動車、電車などに搭載される電力変換装置に用いられるＩＧＢＴ（Insulated Gate Bipolar Transistor）などのパワーデバイス（半導体素子）を冷却する液冷式冷却器として、本出願人は、先に、頂壁および底壁を有しかつ内部を冷却液が流れるようになっているケーシングと、ケーシングに固定された放熱器とを備えており、放熱器が、ケーシングの頂壁を兼ね、かつ第１面がケーシング内に臨ませられるとともに第２面が発熱体取付面となされている放熱基板と、放熱基板の第１面にケーシング内に突出するように一体に設けられかつケーシング内の全体に点在する複数のピンフィンとからなり、発熱体取付面に取り付けられた発熱体から発せられる熱が放熱器の放熱基板およびピンフィンを介してケーシング内を流れる冷却液に放熱される液冷式冷却器を提案した(特許文献１参照)。 For example, as a liquid-cooled cooler for cooling a power device (semiconductor element) such as an IGBT (Insulated Gate Bipolar Transistor) used in a power conversion device mounted on an electric vehicle, a hybrid vehicle, a train, etc., First, it has a casing having a top wall and a bottom wall and in which a coolant flows, and a radiator fixed to the casing, the radiator also serves as the top wall of the casing, The heat radiation board having the first surface facing the casing and the second surface serving as the heating element mounting surface, and the first surface of the heat radiation board are integrally provided so as to protrude into the casing and A plurality of pin fins scattered throughout, and the heat generated from the heating element attached to the heating element mounting surface is transferred to the case through the heat dissipation board and the pin fins of the radiator. Proposed a liquid cooled condenser is radiated to the cooling fluid flowing through the inner (see Patent Document 1).
特許文献１記載の液冷式冷却器は、ボルトなどの締結具を用いて上述したような車両に固定するのが一般的であるが、この場合、ケーシング外に、ボルトなどの締結具の一端部を固定するための固定部材を溶接などによって接合する必要があり、部品点数が増えるとともに、固定部材をケーシングに溶接などにより接合する必要があって製造工数が増えるという問題がある。
The liquid-cooled cooler described in
この発明の目的は、上記問題を解決し、部品点数および製造工数を削減しうる液冷式冷却器を提供することにある。 An object of the present invention is to provide a liquid-cooled cooler that solves the above problems and can reduce the number of parts and the number of manufacturing steps.
本発明は、上記目的を達成するために以下の態様からなる。 In order to achieve the above object, the present invention comprises the following aspects.
1)頂壁および底壁を有しかつ内部を冷却液が流れるようになっているケーシングと、ケーシング内に設けられたフィンとを備えており、ケーシングの頂壁外面および底壁外面のうちいずれか一方が発熱体取付面となされ、発熱体取付面に取り付けられた発熱体から発せられる熱がフィンを介してケーシング内を流れる冷却液に放熱される液冷式冷却器であって、
ケーシングの頂壁および底壁のうちいずれか一方の第１壁に、ケーシング内方に突出して先端が同他方の第２壁に接合された内方突出部が一体に設けられ、第１壁および内方突出部に、第１壁の外面と内方突出部の先端とを通じさせる貫通穴が形成され、当該貫通穴の一端が第１壁の外面に開口するとともに、他端が前記第２壁に形成された連通穴を介して第２壁の外面に開口しており、内方突出部の先端における貫通穴の周囲の部分が、第２壁のケーシング内方を向いた面における連通穴の周囲の部分に接合されている液冷式冷却器。
1) A casing having a top wall and a bottom wall, in which a coolant flows, and a fin provided in the casing, and any one of the top wall outer surface and the bottom wall outer surface of the casing Either of these is a heating element mounting surface, and a liquid cooling type cooler in which heat generated from the heating element mounted on the heating element mounting surface is dissipated to the coolant flowing in the casing through the fins,
The first wall of the casing is integrally provided with an inward protrusion which protrudes inward of the casing and whose tip is joined to the other second wall on the first wall of any one of the top wall and the bottom wall of the casing; The inward protrusion is formed with a through hole for communicating the outer surface of the first wall with the tip of the inward protrusion, one end of the through hole is open to the outer surface of the first wall, and the other end is the second wall The portion around the through hole at the tip of the inward projecting portion is open to the outer surface of the second wall through the communication hole formed in the second wall. Liquid-cooled coolers bonded to the surrounding area.
2)ケーシングが、互いにろう付された上下両構成部材からなり、上構成部材がケーシングの頂壁を有するとともに下構成部材がケーシングの底壁を有し、ケーシング内に、冷却液が外部から流入する入口ヘッダと、冷却液が外部に流出する出口ヘッダと、入口ヘッダに流入した冷却液を出口ヘッダに流す冷却液流路とが設けられ、内方突出部が、入口ヘッダおよび出口ヘッダに設けられ、フィンが冷却液流路に設けられ、入口ヘッダおよび出口ヘッダに、ケーシングの第１壁と第２壁とを連結しかつ両壁間で突っ張る連結部が設けられている上記1)記載の液冷式冷却器。 2) The casing is composed of upper and lower components that are brazed to each other, the upper component has the top wall of the casing and the lower component has the bottom wall of the casing, and coolant flows into the casing from the outside. Inlet header, an outlet header from which the coolant flows out, and a coolant flow path for flowing the coolant flowing into the inlet header to the outlet header, and an inward protrusion is provided on the inlet header and the outlet header The fins are provided in the coolant flow path, and the inlet header and the outlet header are provided with a connecting portion for connecting the first wall and the second wall of the casing and extending between the walls. Liquid-cooled cooler.
3)前記連結部が、ケーシングの第１壁および第２壁のうちのいずれか一方に一体に設けられるとともに、先端が同他方に接合されている上記2)記載の液冷式冷却器。 3) The liquid cooling type cooler according to 2), wherein the connecting portion is integrally provided on one of the first wall and the second wall of the casing, and the tip is joined to the other.
4)ケーシングの第１壁および第２壁のうちのいずれか一方に、ケーシング内の入口ヘッダに冷却液を流入させる冷却液流入口が設けられ、同じく第１壁および第２壁のうちの冷却液流入口が設けられた壁と同じ壁または異なる壁に、ケーシング内の出口ヘッダから冷却液を流出させる冷却液流出口が設けられ、前記連結部が、入口ヘッダに設けられかつ冷却液流入口から流入した冷却液を冷却液流路側に案内する入口側ガイド部と、出口ヘッダに設けられかつ冷却液流路を流れてきた冷却液を集めて冷却液流出口側に案内する出口側ガイド部とからなる上記2)または3)記載の液冷式冷却器。 4) One of the first wall and the second wall of the casing is provided with a cooling liquid inlet for allowing the cooling liquid to flow into the inlet header in the casing, and the cooling of the first wall and the second wall is also performed. A cooling liquid outlet for allowing the cooling liquid to flow out from an outlet header in the casing is provided on the same wall as the wall provided with the liquid inlet or a different wall, and the connecting portion is provided in the inlet header and the cooling liquid inlet. The inlet side guide part which guides the cooling fluid which flowed in from the side to the cooling fluid channel side, The outlet side guiding part which is provided in the outlet header and collects the cooling fluid which flowed in the cooling fluid channel and guides it to the cooling fluid outlet side The liquid-cooled cooler as described in 2) or 3) above.
5)ケーシングの第１壁の外面が発熱体取付面となされ、ケーシングの第１壁の内面に、内方突出部、入口側ガイド部および出口側ガイド部が一体に設けられ、内方突出部、入口側ガイド部および出口側ガイド部がケーシングの第２壁の内面に接合され、フィンが、第１壁の内面に一体に設けられたピンフィンからなるとともに冷却液流路の全体に点在しており、ケーシングの第２壁に、冷却液流入口および冷却液流出口が設けられている上記4)記載の液冷式冷却器。 5) The outer surface of the first wall of the casing serves as a heating element mounting surface, and an inward protruding portion, an inlet side guide portion and an outlet side guide portion are integrally provided on the inner surface of the first wall of the casing. And the inlet-side guide portion and the outlet-side guide portion are joined to the inner surface of the second wall of the casing, and the fins consist of pin fins integrally provided on the inner surface of the first wall and are scattered throughout the coolant channel. The liquid-cooled cooler as described in 4) above, wherein a coolant inlet and a coolant outlet are provided on the second wall of the casing.
上記1)〜5)の液冷式冷却器によれば、ケーシングの頂壁および底壁のうちいずれか一方の第１壁に、ケーシング内方に突出して先端が同他方の第２壁に接合された内方突出部が一体に設けられ、第１壁および内方突出部に、第１壁の外面と内方突出部の先端とを通じさせる貫通穴が形成され、当該貫通穴の一端が第１壁の外面に開口するとともに、他端が前記第２壁に形成された連通穴を介して第２壁の外面に開口しており、内方突出部の先端における貫通穴の周囲の部分が、第２壁のケーシング内方を向いた面における連通穴の周囲の部分に接合されているので、液冷式冷却器を車両に固定する際に、内方突出部の貫通穴を利用することができる。したがって、貫通穴を有する固定部材を別個に用意してケーシングに溶接する場合に比べて、部品点数および製造工数を削減することが可能になる。しかも、ケーシング内に冷却液を流入させる入口パイプおよびケーシング内から冷却液を流出させる出口パイプを、内方突出部の貫通穴を利用してケーシングに固定することも可能になる。 According to the liquid-cooled cooler of the above 1) to 5), the first wall of the top and bottom walls of the casing protrudes inward of the casing and the tip is joined to the other second wall of the casing The first wall and the inward projection are formed with a through hole for communicating the outer surface of the first wall with the tip of the inward projection, and one end of the through hole is One end of the inner wall is open, and the other end is open at the outer surface of the second wall through a communication hole formed in the second wall, and a portion around the through hole at the tip of the inward protrusion is And the through-hole of the inward projection when fixing the liquid-cooled cooler to a vehicle, since it is joined to a portion around the communication hole in the inward facing surface of the second wall casing. Can. Therefore, the number of parts and the number of manufacturing steps can be reduced as compared with the case where a fixing member having a through hole is separately prepared and welded to the casing. In addition, it is possible to fix the inlet pipe for introducing the cooling fluid into the casing and the outlet pipe for discharging the cooling fluid from the casing to the casing using the through hole of the inward protrusion.
上記2)〜4)の液冷式冷却器によれば、上下両構成部材を適当な手段で仮止めし、接合面に適当な荷重を加えながらろう付する際に、連結部の働きによって、入口ヘッダおよび出口ヘッダにおいて頂壁および底壁が変形することが防止され、上下両構成部材のろう付を確実に行うことができる。 According to the liquid-cooled cooler of the above 2) to 4), when the upper and lower structural members are temporarily fixed by an appropriate means and brazing is performed while applying an appropriate load to the joint surface, the function of the connecting portion It is possible to prevent the top wall and the bottom wall from being deformed in the inlet header and the outlet header, and it is possible to reliably braze both the upper and lower components.
上記4)の液冷式冷却器によれば、冷却液流入口を通ってケーシング内の入口ヘッダに流入した冷却液を、スムーズに冷却液流路側に流し、冷却液流路を流れて出口ヘッダに流入した冷却液をスムーズに冷却液流出口を通してケーシング外に流出させることができる。 According to the liquid-cooled cooler of 4) above, the coolant flowing into the inlet header in the casing through the coolant inlet is smoothly flowed to the coolant channel side, and flows through the coolant channel to the outlet header. The coolant flowing into the casing can be smoothly discharged out of the casing through the coolant outlet.
上記5)の液冷式冷却器によれば、発熱体取付面に取り付けられた発熱体からピンフィンへの熱伝導性が向上し、ひいては発熱体から発せられる熱のケーシング内を流れる冷却液への放熱性能が向上する。しかも、鍛造加工によって、放熱器の放熱基板、内方突出部、入り側ガイド部、出側ガイド部およびピンフィンを、比較的少ない工数で形成することができる。 According to the liquid cooling type cooler of 5) above, the thermal conductivity from the heating element attached to the heating element mounting surface to the pin fins is improved, and as a result, the heat generated from the heating element is transferred to the coolant flowing in the casing. Heat dissipation performance is improved. In addition, the heat radiating substrate, the inward projecting portion, the entry side guide portion, the exit side guide portion, and the pin fins of the radiator can be formed with a relatively small number of man-hours by forging.
以下、この発明の実施形態を、図面を参照して説明する。この実施形態は、この発明による液冷式冷却器を、電力変換装置などのパワーモジュールを構成し、かつＩＧＢＴなどのパワーモジュール用半導体素子を冷却するパワーモジュール用ベースに適用したものである。 Embodiments of the present invention will be described below with reference to the drawings. In this embodiment, the liquid-cooled cooler according to the present invention is applied to a power module base that constitutes a power module such as a power converter and cools a power module semiconductor element such as an IGBT.
この明細書において、「アルミニウム」という用語には、純アルミニウムの他にアルミニウム合金を含むものとする。 In this specification, the term "aluminum" includes aluminum alloys in addition to pure aluminum.
また、以下の説明において、図２の左右を左右といい、図３の上下方向を前後方向というものとする。 Moreover, in the following description, the right and left in FIG. 2 are referred to as the left and right, and the vertical direction in FIG. 3 is referred to as the front and back direction.
さらに、全図面を通じて同一物および同一部分には同一符号を付す。 Furthermore, the same symbols are attached to the same items and the same parts throughout the drawings.
図１〜図３は、この発明による液冷式冷却器を適用したパワーモジュール用ベースの全体構成を示す。 1 to 3 show an overall configuration of a power module base to which a liquid cooling type cooler according to the present invention is applied.
図１〜図３において、パワーモジュール用ベース(1)は、頂壁(3a)、底壁(3b)および周壁(3c)を有するケーシング(3)、ならびにケーシング(3)内に設けられた複数のピンフィン(4)を有する液冷式冷却器(2)と、液冷式冷却器(2)のケーシング(3)の頂壁(3a)および底壁(3b)のうちのいずれか一方の壁、ここでは頂壁(3a)外面にろう付、すなわちろう材を介して接合された絶縁積層材(5)と、液冷式冷却器(2)のケーシング(3)の頂壁(3a)および底壁(3b)のうちのいずれか他方の壁、ここでは底壁(3b)外面にろう付された反り抑制板(6)とからなる。 In FIGS. 1 to 3, the power module base (1) comprises a casing (3) having a top wall (3a), a bottom wall (3b) and a peripheral wall (3c), and a plurality of casings provided in the casing (3) Liquid-cooled cooler (2) having pin fins (4) of any one of the top wall (3a) and bottom wall (3b) of the casing (3) of the liquid-cooled cooler (2) Here, the insulating laminate (5) brazed to the outer surface of the top wall (3a), that is, joined via the brazing material, the top wall (3a) of the casing (3) of the liquid-cooled cooler (2) and It consists of a warp suppressing plate (6) brazed to the other wall of the bottom wall (3b), here the bottom wall (3b).
液冷式冷却器(2)のケーシング(3)は、頂壁(3a)を構成する板状のアルミニウム製上構成部材(7)と、底壁(3b)および周壁(3c)を構成する上方に開口した箱状のアルミニウム製下構成部材(8)とよりなり、上構成部材(7)下面の周縁部が下構成部材(8)の周壁(3c)を構成する部分の上端部に設けられた外向きフランジ(8a)上面にろう付されている。ケーシング(3)内には、ケーシング(3)の長手方向の一端寄り、ここでは左端寄りの部分に位置し、かつ冷却液が外部から流入する入口ヘッダ(9)と、ケーシング(3)の長手方向の他端寄り、ここでは右端寄りの部分に位置し、かつ冷却液が外部に流出する出口ヘッダ(11)と、入口ヘッダ(9)に流入した冷却液を出口ヘッダ(11)に流す冷却液流路(12)とが設けられている。ケーシング(3)の底壁(3b)外面における入口ヘッダ(9)と出口ヘッダ(11)との間の冷却液流路(12)と対応する部分に、底壁(3b)が変形させられることによってケーシング(3)内方(上方)に凹んだ凹所(13)が形成されている。 The casing (3) of the liquid-cooled cooler (2) has a plate-like aluminum upper component (7) constituting the top wall (3a), and an upper portion constituting the bottom wall (3b) and the peripheral wall (3c) The lower part of the upper component (7) is provided at the upper end of the part constituting the peripheral wall (3c) of the lower component (8). It is brazed to the upper surface of the outward flange (8a). In the casing (3), the inlet header (9) is located closer to one end in the longitudinal direction of the casing (3), here, near the left end, and the inlet header (9) through which the coolant flows from the outside; The outlet header (11) located near the other end in the direction, here near the right end, and the cooling liquid flows out to the outside, and the cooling liquid flowing into the inlet header (9) flows to the outlet header (11) A liquid flow path (12) is provided. The bottom wall (3b) is deformed to the part corresponding to the coolant flow passage (12) between the inlet header (9) and the outlet header (11) on the outer surface of the bottom wall (3b) of the casing (3) Thus, a recess (13) recessed inward (upward) of the casing (3) is formed.
ケーシング(3)の底壁(3b)の左側部分の前後方向中央部に、入口ヘッダ(9)に通じる冷却液流入口(16)が形成され、ケーシング(3)の底壁(3b)の右側部分の前後方向中央部に、出口ヘッダ(11)に通じる冷却液流出口(17)が形成されている。 A coolant inlet (16) leading to the inlet header (9) is formed in the front-rear central portion of the left side portion of the bottom wall (3b) of the casing (3), and the right side of the bottom wall (3b) of the casing (3) A coolant fluid outlet (17) communicating with the outlet header (11) is formed at the longitudinal center of the portion.
ケーシング(3)の入口ヘッダ(9)の前後方向中央部において、ケーシング(3)の頂壁(3a)（ケーシング(3)の頂壁(3a)および底壁(3b)のうちいずれか一方の第１壁）に、ケーシング(3)内方(下方)に突出して先端が底壁(3b)（ケーシング(3)の頂壁(3a)および底壁(3b)のうちいずれか他方の第２壁）にろう付され、かつ冷却液流入口(16)から入口ヘッダ(9)内に流入した冷却液を冷却液流路(12)側に向けて流す入口側ガイド部(18)が一体に設けられている。また、ケーシング(3)の出口ヘッダ(11)の前後方向中央部において、ケーシング(3)の頂壁(3a)に、下方に突出して先端が底壁(3b)にろう付され、かつ冷却液流路(12)から出口ヘッダ(11)内に流入した冷却液を冷却液流出口(17)側に向けて流す出口側ガイド部(19)が一体に設けられている。両ガイド部(18)(19)は、上下両側から見て開口が冷却液流路(12)側を向いたＵ字状であり、冷却液流入口(16)および冷却液流出口(17)がそれぞれ両ガイド部(18)(19)内に臨んでいる。両ガイド部(18)(19)が、ケーシング(3)の頂壁(3a)と底壁(3b)とを連結しかつ両壁(3a)(3b)間で突っ張る連結部となっている。 At the center in the front-rear direction of the inlet header (9) of the casing (3), the top wall (3a) of the casing (3) (one of the top wall (3a) and the bottom wall (3b) of the casing (3) The first wall protrudes inward (downward) from the casing (3), and the tip end is the bottom wall (3b) (the top wall (3a) or the bottom wall (3b) of the casing (3)) The inlet side guide (18) that is brazed to the wall) and flows the coolant flowing into the inlet header (9) from the coolant inlet (16) toward the coolant channel (12) is integrated. It is provided. Further, at the center in the front-rear direction of the outlet header (11) of the casing (3), the top wall (3a) of the casing (3) protrudes downward and the tip is brazed to the bottom wall (3b), and the coolant An outlet side guide portion (19) is integrally provided for flowing the coolant flowing from the flow path (12) into the outlet header (11) toward the coolant outlet (17) side. Both guides (18) and (19) are U-shaped with the opening facing the coolant flow channel (12) when viewed from both the upper and lower sides, and the coolant inlet (16) and the coolant outlet (17) Respectively face the two guide parts (18) and (19). Both guide portions (18) and (19) serve as a connecting portion that connects the top wall (3a) and the bottom wall (3b) of the casing (3) and stretches between the walls (3a) and (3b).
ケーシング(3)の入口ヘッダ(9)および出口ヘッダ(11)における両ガイド部(18)(19)よりも前後方向外側部分において、ケーシング(3)の頂壁(3a)に、それぞれケーシング(3)内方(下方)に突出して先端が底壁(3b)にろう付された内方突出部(21)が一体に設けられている。ケーシング(3)の頂壁(3a)および内方突出部(21)に、頂壁(3a)外面と内方突出部(21)の先端とを通じさせる貫通穴(22)が形成されており、貫通穴(22)の一端が頂壁(3a)の外面に開口するとともに、他端が底壁(3b)に形成された連通穴(23)を介して底壁(3b)外面に開口している。内方突出部(21)の先端における貫通穴(22)の周囲の部分が、底壁(3b)のケーシング(3)内方を向いた面における連通穴(23)の周囲の部分にろう付されている。また、入口側ガイド部(18)と入口ヘッダ(9)の前後の内方突出部(21)、および出口側ガイド部(19)と出口ヘッダ(11)の前後の内方突出部(21)とは、頂壁(3a)の下面に一体に設けられた下方隆起部(14)(15)により一体に連結されている。 Casing (3) is provided on the top wall (3a) of the casing (3) at the outer side in the front-rear direction of the guide headers (18) and (19) in the inlet header (9) and outlet header (11) of the casing (3). ) An inward projecting portion (21) protruding inward (downward) and having a tip brazed to the bottom wall (3b) is integrally provided. The top wall (3a) and the inward protrusion (21) of the casing (3) are formed with a through hole (22) for communicating the outer surface of the top wall (3a) with the tip of the inward protrusion (21) One end of the through hole (22) opens to the outer surface of the top wall (3a), and the other end opens to the outer surface of the bottom wall (3b) through a communication hole (23) formed in the bottom wall (3b) There is. The portion around the through hole (22) at the tip of the inward projection (21) is brazed to the portion around the communicating hole (23) in the inward facing surface of the casing (3) of the bottom wall (3b) It is done. In addition, the inward projections (21) on the front and rear of the inlet side guide (18) and the inlet header (9), and the inward projections (21) on the front and rear of the outlet side guide (19) and the outlet header (11) Are integrally connected by lower raised portions (14) and (15) integrally provided on the lower surface of the top wall (3a).
液冷式冷却器(2)の複数のピンフィン(4)は横断面円形であり、ケーシング(3)の頂壁(3a)(絶縁積層材(5)がろう付された壁)の下面における冷却液流路(12)の臨む部分に、冷却液流路(12)の全体に点在するように千鳥配置状に一体に設けられている。なお、ピンフィン(4)の横断面形状は円形に限定されるものではない。ピンフィン(4)の先端部はケーシング(3)の底壁(3b)内面にろう付されていることが好ましい。 The plurality of pin fins (4) of the liquid-cooled cooler (2) has a circular cross section, and cooling on the lower surface of the top wall (3a) of the casing (3) (the wall on which the insulating laminate (5) is brazed) It is integrally provided in a staggered arrangement so as to be scattered all over the coolant flow path (12) at the part facing the liquid flow path (12). The cross-sectional shape of the pin fin (4) is not limited to a circle. The tip of the pin fin (4) is preferably brazed to the inner surface of the bottom wall (3b) of the casing (3).
絶縁積層材(5)は、絶縁板(24)と、絶縁板(24)の上面に設けられかつパワーモジュール用半導体素子が取り付けられる回路層(25)と、絶縁板(24)の下面に設けられた伝熱層(26)とよりなり、伝熱層(26)が、ケーシングの頂壁(3a)外面にろう付されている。絶縁板(24)は、必要とされる電気絶縁特性、熱伝導率および機械的強度を満たしていれば、どのようなセラミックスから形成されていてもよいが、たとえばＡｌＮ、Ａｌ2Ｏ3およびＳｉ3Ｎ4のうちのいずれか１種からなるものが用いられる。絶縁板(24)の肉厚は０．１〜１ｍｍであることが好ましい。回路層(25)は、導電性に優れたアルミニウム、銅(銅合金も含む。以下、同じ）などの金属により形成されるが、電気伝導率が高く、変形能が高く、しかも熱伝導性に優れた純度の高いアルミニウムにより形成されていることが好ましい。伝熱層(26)は、熱伝導性に優れたアルミニウム、銅などの金属により形成されるが、熱伝導率が高く、変形能が高く、しかも溶融したろう材との濡れ性に優れた純度の高いアルミニウムにより形成されていることが好ましい。また、回路層(25)および伝熱層(26)は同一材料で形成されていることが好ましい。絶縁積層材(5)としては、たとえば絶縁板(24)に、回路層(25)および伝熱層(26)が予め設けられている三菱マテリアル社製、ＤＢＡ(Direct Brazed Alminum、登録商標)基板が用いられる。また、絶縁積層材(5)としては、絶縁板(24)とは別個に形成された回路層(25)をつくる金属板および伝熱層(26)をつくる金属板が、ケーシング(3)の両構成部材(7)(8)のろう付と同時にろう付されたものであってもよい。 The insulating laminate (5) is provided on the insulating plate (24), the circuit layer (25) provided on the upper surface of the insulating plate (24) and to which the power module semiconductor element is attached, and the lower surface of the insulating plate (24). The heat transfer layer (26) is brazed to the outer surface of the top wall (3a) of the casing. The insulating plate (24) may be made of any ceramic as long as it satisfies the required electrical insulating properties, thermal conductivity and mechanical strength, but it is possible to use, for example, AlN, Al 2 O 3 and Si. A material consisting of any one of 3 N 4 is used. The wall thickness of the insulating plate (24) is preferably 0.1 to 1 mm. The circuit layer (25) is formed of a metal such as aluminum or copper (including copper alloy, hereinafter the same) having excellent conductivity, but it has high electric conductivity, high deformability, and thermal conductivity. It is preferable that it is made of excellent high purity aluminum. The heat transfer layer (26) is made of a metal such as aluminum or copper with excellent thermal conductivity, but has high thermal conductivity, high deformability, and purity with excellent wettability with molten brazing material. Preferably, it is formed of high aluminum. The circuit layer (25) and the heat transfer layer (26) are preferably formed of the same material. As an insulating laminated material (5), for example, a DBA (Direct Brazed Alminum (registered trademark)) board manufactured by Mitsubishi Materials Corporation, in which a circuit layer (25) and a heat transfer layer (26) are provided in advance on an insulating plate (24) Is used. Further, as the insulating laminate (5), the metal plate forming the circuit layer (25) and the metal plate forming the heat transfer layer (26) formed separately from the insulating plate (24) are formed on the casing (3). It may be brazed simultaneously with the brazing of the two component members (7) and (8).
反り抑制板(6)は、線膨張係数がアルミニウムよりも低い材料で形成されており、凹所(13)内に配置されてケーシング(3)の底壁(3c)における凹所(13)の底となる部分にろう付されている。反り抑制板(6)の肉厚は、凹所(13)の深さ以下であることが好ましく、反り抑制板(6)の下面が、ケーシング(3)の底壁(3b)における凹所(13)を除いた部分の下面と面一か、またはケーシング(3)の底壁(3b)における凹所(13)を除いた部分の下面よりも上方に位置していることが好ましい。また、反り抑制板(6)の大きさ、形状、肉厚は、用いる材料によって適宜最適なものが選ばれる。また、反り抑制板(6)は、線膨張係数が絶縁積層材(5)の絶縁板(24)と同程度である材料で形成されていることが好ましい。絶縁板(24)がＡｌＮ、Ａｌ2Ｏ3およびＳｉ3Ｎ4のうちのいずれか１種で形成されている場合、反り抑制板(6)は、ＡｌＮ、Ａｌ2Ｏ3、Ｓｉ3Ｎ4、溶融アルミニウムめっき鋼およびステンレス鋼のうちのいずれか１種で形成されていることが好ましい。 The warpage suppressing plate (6) is formed of a material having a linear expansion coefficient lower than that of aluminum, and is disposed in the recess (13) to be located in the recess (13) in the bottom wall (3c) of the casing (3). It is brazed to the bottom part. The wall thickness of the warpage suppressing plate (6) is preferably equal to or less than the depth of the recess (13), and the lower surface of the warpage suppressing plate (6) is a recess in the bottom wall (3b) of the casing (3) ( It is preferable to be flush with the lower surface of the part excluding 13) or above the lower surface of the part of the bottom wall (3b) of the casing (3) excluding the recess (13). Further, the optimal size, shape and thickness of the warp suppressing plate (6) are appropriately selected depending on the material used. The warpage suppressing plate (6) is preferably formed of a material having a linear expansion coefficient comparable to that of the insulating plate (24) of the insulating laminate (5). When the insulating plate (24) is formed of any one of AlN, Al 2 O 3 and Si 3 N 4 , the warpage suppressing plate (6) is made of AlN, Al 2 O 3 , Si 3 N 4 It is preferably formed of any one of hot-dip aluminized steel and stainless steel.
パワーモジュール用ベース(1)は、以下に述べる方法で製造される。 The power module base (1) is manufactured by the method described below.
すなわち、ケーシング(3)の下構成部材(8)の外向きフランジ(8a)上に上構成部材(7)の周縁部を載せることにより両構成部材(7)(8)を組み合わせるとともに、上構成部材(7)の頂壁(3a)となる部分の外面上に、絶縁板(24)、回路層(25)および伝熱層(26)が一体に設けられている絶縁積層材(5)を、伝熱層(26)が頂壁(3a)側に来るように配置し、さらに下構成部材(8)の底壁(3b)の凹所(13)内に反り抑制板(6)を配置する。なお、上構成部材(7)の周縁部と下構成部材(8)の外向きフランジ(8a)との間、上構成部材(7)の頂壁(3a)となる部分の外面と絶縁積層材(5)の伝熱層(26)との間、ならびに下構成部材(8)の底壁(3b)における凹所(13)内に存在する部分と反り抑制板(6)との間に、適当な方法によりろう材を配置しておく。 That is, both the constituent members (7) and (8) are combined by placing the peripheral portion of the upper constituent member (7) on the outward flange (8a) of the lower constituent member (8) of the casing (3), and the upper configuration An insulating laminate (5) in which an insulating plate (24), a circuit layer (25) and a heat transfer layer (26) are integrally provided on the outer surface of a portion to be the top wall (3a) of the member (7) The heat transfer layer (26) to the top wall (3a) side, and further the warpage suppressing plate (6) in the recess (13) of the bottom wall (3b) of the lower component (8) Do. The outer surface of the portion to be the top wall (3a) of the upper component (7) and the insulating laminated material between the peripheral edge of the upper component (7) and the outward flange (8a) of the lower component (8) Between the heat transfer layer (26) of (5) and the portion of the bottom wall (3b) of the lower component (8) in the recess (13) and the warpage suppressing plate (6) Place the brazing material in a suitable manner.
ついで、上下両構成部材(7)(8)、絶縁積層材(5)および反り抑制板(6)を適当な手段で仮止めし、接合面に適当な荷重を加えながら、真空雰囲気中または不活性ガス雰囲気中において、５７０〜６００℃に加熱することによって、上構成部材(7)と下構成部材(8)の外向きフランジ(8a)、上構成部材(7)の頂壁(3a)外面と絶縁積層材(5)の伝熱層(26)、および下構成部材(8)の底壁(3b)外面と反り抑制板(6)とをそれぞれ同時にろう付する。また、ろう付と同時にピンフィン(4)の先端を下構成部材(8)の底壁(3b)内面にろう付してもよい。こうして、パワーモジュール用ベース(1)が製造される。 Next, the upper and lower structural members (7) and (8), the insulating laminated material (5) and the warpage suppressing plate (6) are temporarily fixed by an appropriate means, and while applying an appropriate load to the bonding surface The outward flanges (8a) of the upper component (7) and the lower component (8) and the top wall (3a) outer surface of the upper component (7) by heating to 570 to 600 ° C. in an active gas atmosphere And the heat transfer layer (26) of the insulating laminate (5), and the outer surface of the bottom wall (3b) of the lower component (8) and the warp suppressing plate (6) are brazed simultaneously. Further, simultaneously with brazing, the tip of the pin fin (4) may be brazed to the inner surface of the bottom wall (3b) of the lower component (8). Thus, the power module base (1) is manufactured.
上述した製造方法において、上下両構成部材(7)(8)、絶縁積層材(5)および反り抑制板(6)を適当な手段で仮止めし、接合面に適当な荷重を加えた際に、入口側ガイド部(18)および内方突出部(21)の働きによって、頂壁(3a)および底壁(3b)の入口ヘッダ(9)を構成する部分の内方への変形が防止されるとともに、出口側ガイド部(19)および内方突出部(21)の働きによって、頂壁(3a)および底壁(3b)の出口ヘッダ(11)を構成する部分の内方への変形が防止される。したがって、上下両構成部材(7)(8)のろう付が確実に行われる。 In the manufacturing method described above, when the upper and lower structural members (7, 8), the insulating laminated material (5) and the warpage suppressing plate (6) are temporarily fixed by an appropriate means, and an appropriate load is applied to the joint surface The action of the inlet guide (18) and the inward projection (21) prevent the inward deformation of the parts constituting the inlet header (9) of the top wall (3a) and the bottom wall (3b) And the inward deformation of the part constituting the outlet header (11) of the top wall (3a) and the bottom wall (3b) by the action of the outlet side guide portion (19) and the inward protrusion (21) It is prevented. Therefore, brazing of the upper and lower structural members (7) and (8) is reliably performed.
また、上述した製造方法において、上下両構成部材(7)(8)と絶縁積層材(5)の絶縁板(24)との線膨張係数の差に起因して、上下両構成部材(7)(8)および絶縁板(24)を反らせようとする力が発生するとともに、上下両構成部材(7)(8)と反り抑制板(6)との線膨張係数の差に起因して上下両構成部材(7)(8)および反り抑制板(6)を反対側に反らせようとする力が発生する。その結果、これら２つの力が相殺されることになって、得られたパワーモジュール用ベース(1)の全体、すなわちケーシング(3)、絶縁積層材(5)および反り抑制板(6)に反りが発生することが抑制される。 Further, in the above-described manufacturing method, the upper and lower structural members (7) are caused due to the difference in linear expansion coefficient between the upper and lower structural members (7, 8) and the insulating plate (24) of the insulating laminated material (5). (8) A force is generated to warp the insulating plate (24), and both the upper and lower members are caused due to the difference in linear expansion coefficient between the upper and lower structural members (7, 8) and the warpage suppressing plate (6). A force is generated to cause the constituent members (7) and (8) and the warp suppressing plate (6) to warp to the opposite side. As a result, these two forces are offset, and the entire power module base (1) obtained, ie, the casing (3), the insulating laminate (5) and the warpage suppressing plate (6) are warped. Is suppressed.
なお、絶縁積層材(5)が、絶縁板(24)とは別個に形成された回路層(25)をつくる金属板および伝熱層(26)をつくる金属板が、絶縁板(24)にろう付されたものである場合、上述した上下両構成部材(7)(8)および反り抑制板(6)のろう付と同時にろう付される。 In addition, a metal plate in which the insulating laminated material (5) forms the circuit layer (25) separately formed from the insulating plate (24) and a metal plate in which the heat transfer layer (26) is formed are the insulating plate (24). In the case of brazing, the upper and lower constituent members (7) and (8) and the warpage suppressing plate (6) are brazed simultaneously.
上述した構成のパワーモジュール用ベース(1)において、絶縁積層材(5)の回路層(25)に所定パターンの回路が形成され、たとえばＩＧＢＴなどの半導体素子が搭載され、さらに回路層(25)と半導体素子との間に配線がはんだ付されてパワーモジュールとして用いられる。 In the power module base (1) configured as described above, a circuit of a predetermined pattern is formed on the circuit layer (25) of the insulating laminate (5), and a semiconductor element such as an IGBT is mounted. The wiring is soldered between the semiconductor element and the semiconductor element to be used as a power module.
上記パワーモジュールは、内方突出部(21)の貫通穴(22)を利用してハイブリッド自動車などに取り付けられ、冷却液流入口(16)から入口ヘッダ(9)内に冷却液が流入させられる。入口ヘッダ(9)内に流入した冷却液は、入口側ガイド部(18)に案内されて冷却液流路(12)側に案内され、ピンフィン(4)の間を通って冷却液流路(12)を右方に流れて出口ヘッダ(11)内に入る。出口ヘッダ(11)内に入った冷却液は、出口側ガイド部(19)に案内されて冷却液流出口(17)側に向けて流され、冷却液流出口(17)を通って排出される。パワーモジュールの半導体素子から発せられる熱は、回路層(25)、絶縁板(24)を通って伝熱層(26)に伝わり、伝熱層(26)の面方向に拡散されてケーシング(3)の頂壁(3a)を経て冷却液流路(12)内を流れる冷却液に放熱される。こうして、半導体素子が冷却される。 The power module is attached to a hybrid vehicle or the like using the through hole (22) of the inward protrusion (21), and the coolant is allowed to flow into the inlet header (9) from the coolant inlet (16) . The coolant flowing into the inlet header (9) is guided to the inlet side guide portion (18) and guided to the coolant flow channel (12) side, passes between the pin fins (4), and passes through the coolant flow channel ( 12) flows to the right into the outlet header (11). The coolant that has entered the outlet header (11) is guided by the outlet side guide portion (19), flows toward the coolant outlet (17), and is discharged through the coolant outlet (17). Ru. The heat generated from the semiconductor element of the power module is transmitted to the heat transfer layer (26) through the circuit layer (25) and the insulating plate (24) and diffused in the surface direction of the heat transfer layer (26) to form the casing (3 The heat is dissipated to the cooling fluid flowing in the cooling fluid channel (12) through the top wall (3a) of. Thus, the semiconductor element is cooled.
図４〜図７はケーシングの上構成部材の変形例を示す。 4 to 7 show modifications of the upper component of the casing.
図４に示す上構成部材(30)の場合、ケーシング(3)の頂壁(3a)となる部分に下方に突出するように一体に設けられて先端が底壁(3b)にろう付され、かつ冷却液流入口(16)から入口ヘッダ(9)内に流入した冷却液を冷却液流路(12)側に向けて流す入口側ガイド部(31)、およびケーシング(3)の頂壁(3a)となる部分に下方に突出するように一体に設けられて先端が底壁(3b)にろう付され、かつ冷却液流路(12)から出口ヘッダ(11)内に流入した冷却液を冷却液流出口(17)側に向けて流す出口側ガイド部(32)は、それぞれ上下両側から見て開口が冷却液流路(12)側を向いた略Ｕ字状であり、前後両側壁の内面は冷却液流路(12)側に向かって前後方向外方に傾斜している。また、頂壁(3a)の下面に一体に設けられ、かつ入口側ガイド部(31)と入口ヘッダ(9)の前後の内方突出部(21)、および出口側ガイド部(32)と出口ヘッダ(11)の前後の内方突出部(21)とを連結する下方隆起部(33)(34)の下方への隆起高さは、上述した実施形態の下方隆起部(14)(15)の下方への隆起高さよりも高くなっている。その他の構成は、上述した実施形態の上構成部材(7)と同様である。 In the case of the upper component (30) shown in FIG. 4, it is integrally provided so as to project downward from the portion to be the top wall (3a) of the casing (3), and its tip is brazed to the bottom wall (3b) And the inlet side guide part (31) for flowing the coolant flowing into the inlet header (9) from the coolant inlet (16) toward the coolant channel (12) side, and the top wall of the casing (3) ( It is integrally provided so as to project downward to the portion to be 3a), the tip is brazed to the bottom wall (3b), and the coolant that has flowed into the outlet header (11) from the coolant channel (12) The outlet side guide portions (32) flowing toward the coolant fluid outlet (17) are substantially U-shaped with the openings directed to the coolant fluid channel (12) as viewed from the upper and lower sides respectively The inner surface of the is inclined outward in the front-rear direction toward the coolant flow channel (12) side. In addition, it is integrally provided on the lower surface of the top wall (3a), and the inward projections (21) before and after the inlet guide (31) and the inlet header (9), and the outlet guide (32) and the outlet The downward height of the lower protuberances (33) (34) connecting the header (11) to the front and rear inward protuberances (21) corresponds to the lower protuberances (14) (15) of the embodiment described above. The height of the ridge below is higher. The other configuration is the same as the upper component (7) of the embodiment described above.
図５に示す上構成部材(35)の場合、ケーシング(3)の頂壁(3a)となる部分における入口ヘッダ(9)を構成する部分の入口側ガイド部(31)よりも冷却液流路(12)側の部分、および出口ヘッダ(11)を構成する部分の出口側ガイド部(32)よりも冷却液流路(12)側の部分に、それぞれ下方に突出して先端が底壁(3b)にろう付される複数のピン状下方突出部(36)が一体に設けられている。ピン状下方突出部(36)も、ケーシング(3)の頂壁(3a)と底壁(3b)とを連結しかつ両壁(3a)(3b)間で突っ張る連結部となっている。 In the case of the upper structural member (35) shown in FIG. 5, the coolant flow path from the inlet side guide portion (31) of the portion constituting the inlet header (9) in the portion to be the top wall (3a) of the casing (3) (12) side part, and the outlet side guide part (32) of the part constituting the outlet header (11), the part projecting downward from the coolant flow path (12) side respectively, and the tip of the bottom wall (3b A plurality of pin-like lower projections (36) to be brazed to one another. The pin-like lower projecting portion (36) is also a connecting portion connecting the top wall (3a) and the bottom wall (3b) of the casing (3) and extending between the both walls (3a) and (3b).
ピン状下方突出部(36)の横断面形状は略長円形であり、平面から見て前後方向の中央部が冷却液流路(12)側に凸となった１つの円弧上に、長手方向を当該円弧の径方向に向けた状態で周方向に間隔をおいて設けられている。入口ヘッダ(9)のピン状下方突出部(36)は、入口ヘッダ(9)内に流入した冷却液を、冷却液流路(12)の全体に広がるように冷却液流路(12)側に向けて流し、出口ヘッダ(11)のピン状下方突出部(36)は、冷却液流路(12)から出口ヘッダ(11)内に流入した冷却液を集めて冷却液流出口(17)側に向けて流す。その他の構成は、図４に示す上構成部材(30)と同様である。 The cross-sectional shape of the pin-like lower projecting portion (36) is a substantially oval shape, and the longitudinal direction on one arc where the central portion in the front-rear direction as viewed from a plane is convex toward the coolant flow channel (12) Are provided at intervals in the circumferential direction in a state in which they are directed in the radial direction of the arc. The pin-like downward protrusion (36) of the inlet header (9) is on the side of the coolant channel (12) so that the coolant flowing into the inlet header (9) can be spread over the entire coolant channel (12). And the pin-like downward protrusion (36) of the outlet header (11) collects the coolant that has flowed into the outlet header (11) from the coolant flow passage (12), and the coolant outlet (17) Flow towards the side. The other configuration is the same as that of the upper component (30) shown in FIG.
図６に示す上構成部材(40)の場合、頂壁(3a)となる部分の下面に、入口側ガイド部(31)の前後両側壁の左右方向内側端部および出口側ガイド部(32)の前後両側壁の左右方向内側端部に連なって冷却液流路(12)側に向かって前後方向外方に傾斜して延びる傾斜壁(41)(42)が、下方突出状に一体に設けられている。傾斜壁(41)(42)の下端は底壁(3b)にろう付される。傾斜壁(41)(42)も、ケーシング(3)の頂壁(3a)と底壁(3b)とを連結しかつ両壁(3a)(3b)間で突っ張る連結部となっている。また、入口側ガイド部(31)および出口側ガイド部(32)と内方突出部(21)とを連結する下方隆起部は設けられていない。 In the case of the upper structural member (40) shown in FIG. 6, on the lower surface of the portion to be the top wall (3a), the left and right direction inner end portions of the front and rear side walls of the inlet side guide portion (31) and the outlet side guide portion (32) Sloped walls (41) and (42) extending in an inclined manner outward toward the coolant flow channel (12) side by side with the left and right direction inner end portions of the front and rear both side walls integrally provided in a downward projecting shape It is done. The lower end of the inclined wall (41) (42) is brazed to the bottom wall (3b). The inclined walls (41) and (42) also serve as a connecting portion connecting the top wall (3a) and the bottom wall (3b) of the casing (3) and extending between the two walls (3a) and (3b). Moreover, the downward ridge part which connects an entrance side guide part (31) and an exit side guide part (32), and an inward protrusion part (21) is not provided.
入口ヘッダ(9)の傾斜壁(41)は、入口ヘッダ(9)に流入した入口側ガイド部(31)内の冷却液を、冷却液流路(12)の全体に広がるように冷却液流路(12)側に向けて流し、出口ヘッダ(11)の傾斜壁(42)は、冷却液流路(12)から出口ヘッダ(11)内に流入した冷却液を集めて出口側ガイド部(32)内に向けて流す。その他の構成は、図４に示す上構成部材 (30)と同様である。 The inclined wall (41) of the inlet header (9) flows the cooling fluid so that the cooling fluid in the inlet side guide portion (31) which has flowed into the inlet header (9) is spread over the entire cooling fluid flow passage (12). The inclined wall (42) of the outlet header (11) flows toward the passage (12) side, collects the coolant flowing into the outlet header (11) from the coolant flow passage (12), and 32) Flow inwards. The other configuration is similar to that of the upper component (30) shown in FIG.
図７に示す上構成部材(45)の場合、ケーシング(3)の頂壁(3a)となる部分における入口ヘッダ(9)を構成する部分の前後方向中央部、および出口ヘッダ(11)を構成する部分の前後方向中央部に、それぞれ下方に突出して先端が底壁(3b)にろう付される複数のピン状下方突出部(46)が一体に設けられている。ピン状下方突出部(46)も、ケーシング(3)の頂壁(3a)と底壁(3b)とを連結しかつ両壁(3a)(3b)間で突っ張る連結部となっている。ピン状下方突出部(46)の横断面形状は略長円形であり、１つの円周上に、長手方向を当該円周の径方向に向けた状態で周方向に間隔をおいて設けられている。 In the case of the upper structural member (45) shown in FIG. 7, the longitudinal central portion of the portion constituting the inlet header (9) in the portion to be the top wall (3a) of the casing (3) and the outlet header (11) A plurality of pin-shaped lower projections (46) are integrally provided at the central portion in the front-rear direction of the portion to be projected so as to respectively project downward and the tip is brazed to the bottom wall (3b). The pin-like lower projecting portion (46) is also a connecting portion connecting the top wall (3a) and the bottom wall (3b) of the casing (3) and extending between the both walls (3a) and (3b). The cross-sectional shape of the pin-like lower projecting portion (46) is substantially oval, and provided on one circumference at intervals in the circumferential direction with the longitudinal direction oriented in the radial direction of the circumference There is.
また、上構成部材(45)は、ケーシング(3)の頂壁(3a)に加えて周壁(3c)を構成する。周壁(3c)の前後両側壁部の下縁部には、下構成部材の底壁(3b)に設けられかつ反り抑制板(6)を収容する凹所(13)に合わせて切り欠き(47)が形成されている。この場合、下構成部材としては板状のものが用いられる。その他の構成は、上述した実施形態の上構成部材(7)と同様である。 In addition to the top wall (3a) of the casing (3), the upper structural member (45) constitutes a peripheral wall (3c). The lower edges of the front and rear side walls of the peripheral wall (3c) are notched (47) in accordance with the recess (13) provided in the bottom wall (3b) of the lower component and accommodating the warpage suppressing plate (6). ) Is formed. In this case, a plate-shaped member is used as the lower component. The other configuration is the same as the upper component (7) of the embodiment described above.
この発明による液冷式冷却器は、電気自動車、ハイブリッド自動車、電車などに搭載される電力変換装置などのパワーモジュールにおいて、ＩＧＢＴなどのパワーデバイスを冷却するパワーモジュール用ベースに好適に用いられる。 The liquid cooling type cooler according to the present invention is suitably used as a power module base for cooling a power device such as an IGBT in a power module such as a power converter mounted in an electric vehicle, a hybrid vehicle, a train or the like.
(2)：液冷式冷却器
(3)：ケーシング
(3a)：頂壁
(3b)：底壁
(4)：ピンフィン
(7)(30)(35)(40)(45)：上構成部材
(8)：下構成部材
(9)：入口ヘッダ
(11)：出口ヘッダ
(12)：冷却液流路
(18)(31)：入口側ガイド部(連結部)
(19)(32)：出口側ガイド部(連結部)
(21)：内方突出部
(22)：貫通穴
(23)：連通穴
(36)：ピン状下方突出部(連結部)
(41)(42)：傾斜壁(連結部)
(46)：ピン状下方突出部(連結部)
(2): Liquid-cooled cooler
(3): Casing
(3a): Top wall
(3b): Bottom wall
(4): Pin fin
(7) (30) (35) (40) (45): Upper component
(8): Lower component
(9): Entrance header
(11): Exit header
(12): Coolant flow path
(18) (31): Entrance side guide (connecting part)
(19) (32): Exit side guide part (connection part)
(21): Inward protrusion
(22): Through hole
(23): Communication hole
(36): Pin-like downward projecting part (connecting part)
(41) (42): Inclined wall (connecting part)
(46): Pin-like downward projecting part (connecting part)
Claims (8)
ケーシングの頂壁および底壁のうちいずれか一方の第１壁に、ケーシング内方に突出して先端が同他方の第２壁に接合された内方突出部が一体に設けられ、第１壁および内方突出部に、第１壁の外面と内方突出部の先端とを通じさせる貫通穴が形成され、当該貫通穴の一端が第１壁の外面に開口するとともに、他端が前記第２壁に形成された連通穴を介して第２壁の外面に開口しており、内方突出部の先端における貫通穴の周囲の部分が、第２壁のケーシング内方を向いた面における連通穴の周囲の部分に接合され、
ケーシングの第２壁に、ケーシング内に冷却液を流入させる冷却液流入口が設けられ、同じく第２壁に、ケーシング内から冷却液を流出させる冷却液流出口が設けられ、前記連通穴は複数設けられており、冷却液流入口が一組の前記連通穴に挟まれるように設けられ、同じく冷却液流出口が一組の前記連通穴に挟まれるように設けられている液冷式冷却器。 A casing having a top wall and a bottom wall, in which a coolant flows, and fins provided in the casing, and one of the top wall outer surface and the bottom wall outer surface of the casing Is a liquid-cooled type cooler that is used as a heating element mounting surface, and heat generated from the heating element mounted on the heating element mounting surface is dissipated to the coolant flowing through the casing through the fins,
The first wall of the casing is integrally provided with an inward protrusion which protrudes inward of the casing and whose tip is joined to the other second wall on the first wall of any one of the top wall and the bottom wall of the casing; A through hole is formed in the inward projecting portion through the outer surface of the first wall and the tip of the inward projecting portion. One end of the through hole opens on the outer surface of the first wall, and the other end is the second wall. The portion around the through hole at the tip of the inward projecting portion is open to the outer surface of the second wall through the communication hole formed in the second wall. Joined to the surrounding area ,
The second wall of the casing is provided with a coolant inlet for letting the coolant flow into the casing, and the second wall is also provided with a coolant outlet for letting the coolant flow out of the casing, and the communication holes are plural A liquid-cooled cooler that is provided so that a coolant inlet is sandwiched between the pair of communication holes and is similarly provided so that a coolant outlet is sandwiched between the pair of communication holes .
ケーシングの頂壁および底壁のうちいずれか一方の第１壁に、ケーシング内方に突出して先端が同他方の第２壁に接合された内方突出部が一体に設けられ、第１壁および内方突出部に、第１壁の外面と内方突出部の先端とを通じさせる貫通穴が形成され、当該貫通穴の一端が第１壁の外面に開口するとともに、他端が前記第２壁に形成された連通穴を介して第２壁の外面に開口しており、内方突出部の先端における貫通穴の周囲の部分が、第２壁のケーシング内方を向いた面における連通穴の周囲の部分に接合され、 The first wall of the casing is integrally provided with an inward protrusion which protrudes inward of the casing and whose tip is joined to the other second wall on the first wall of any one of the top wall and the bottom wall of the casing; The inward protrusion is formed with a through hole for communicating the outer surface of the first wall with the tip of the inward protrusion, one end of the through hole is open to the outer surface of the first wall, and the other end is the second wall Of the communication hole in the surface of the second wall facing inward of the casing, the portion of the periphery of the through hole at the tip of the inward projection being open to the outer surface of the second wall through the communication hole formed in the Bonded to the surrounding part,
ケーシングが、互いにろう付された上下両構成部材からなり、上構成部材がケーシングの頂壁を有するとともに下構成部材がケーシングの底壁を有し、ケーシング内に、冷却液が外部から流入する入口ヘッダと、冷却液が外部に流出する出口ヘッダと、入口ヘッダに流入した冷却液を出口ヘッダに流す冷却液流路とが設けられ、内方突出部が、入口ヘッダおよび出口ヘッダに設けられ、フィンが冷却液流路に設けられ、入口ヘッダおよび出口ヘッダに、ケーシングの第１壁と第２壁とを連結しかつ両壁間で突っ張る連結部が設けられ、 The casing is composed of upper and lower constituent members brazed to each other, the upper constituent member has the top wall of the casing and the lower constituent member has the bottom wall of the casing, and an inlet through which coolant flows from the outside into the casing A header, an outlet header through which the coolant flows out, and a coolant flow path for flowing the coolant flowing into the inlet header to the outlet header, and inward protrusions are provided on the inlet header and the outlet header, Fins are provided in the coolant flow path, and the inlet header and the outlet header are provided with a connecting portion that connects the first wall and the second wall of the casing and stretches between both walls,
ケーシングの第１壁および第２壁のうちのいずれか一方に、ケーシング内の入口ヘッダに冷却液を流入させる冷却液流入口が設けられ、同じく第１壁および第２壁のうちの冷却液流入口が設けられた壁と同じ壁または異なる壁に、ケーシング内の出口ヘッダから冷却液を流出させる冷却液流出口が設けられ、前記連結部が、入口ヘッダに設けられかつ冷却液流入口から流入した冷却液を冷却液流路側に案内する入口側ガイド部と、出口ヘッダに設けられかつ冷却液流路を流れてきた冷却液を集めて冷却液流出口側に案内する出口側ガイド部とからなる液冷式冷却器。 Either one of the first wall and the second wall of the casing is provided with a cooling liquid inlet for allowing the cooling liquid to flow into the inlet header in the casing, and the cooling liquid flow in the first wall and the second wall is also provided. A cooling liquid outlet is provided on the same wall as the wall provided with the inlet or on a different wall from the outlet header in the casing, and the connecting portion is provided on the inlet header and flows in from the cooling liquid inlet. From the inlet side guide portion for guiding the cooled liquid to the cooling liquid flow path side, and the outlet side guide part provided at the outlet header and collecting the cooling liquid flowing through the cooling liquid flow path and guiding it to the cooling liquid outlet side Liquid-cooled cooler.
ケーシングの頂壁および底壁のうちいずれか一方の第１壁に、ケーシング内方に突出して先端が同他方の第２壁に接合された内方突出部が一体に設けられ、第１壁および内方突出部に、第１壁の外面と内方突出部の先端とを通じさせる貫通穴が形成され、当該貫通穴の一端が第１壁の外面に開口するとともに、他端が前記第２壁に形成された連通穴を介して第２壁の外面に開口しており、内方突出部の先端における貫通穴の周囲の部分が、第２壁のケーシング内方を向いた面における連通穴の周囲の部分に接合され、 The first wall of the casing is integrally provided with an inward protrusion which protrudes inward of the casing and whose tip is joined to the other second wall on the first wall of any one of the top wall and the bottom wall of the casing; The inward protrusion is formed with a through hole for communicating the outer surface of the first wall with the tip of the inward protrusion, one end of the through hole is open to the outer surface of the first wall, and the other end is the second wall Of the communication hole in the surface of the second wall facing inward of the casing, the portion of the periphery of the through hole at the tip of the inward projection being open to the outer surface of the second wall through the communication hole formed in the Joined to the surrounding area,
ケーシングが、互いにろう付された上下両構成部材からなり、上構成部材がケーシングの頂壁を有するとともに下構成部材がケーシングの底壁を有し、ケーシング内に、冷却液が外部から流入する入口ヘッダと、冷却液が外部に流出する出口ヘッダと、入口ヘッダに流入した冷却液を出口ヘッダに流す冷却液流路とが設けられ、内方突出部が、入口ヘッダおよび出口ヘッダに設けられ、フィンが冷却液流路に設けられ、入口ヘッダおよび出口ヘッダに、ケーシングの第１壁と第２壁とを連結しかつ両壁間で突っ張る連結部が設けられ、 The casing is composed of upper and lower constituent members brazed to each other, the upper constituent member has the top wall of the casing and the lower constituent member has the bottom wall of the casing, and an inlet through which coolant flows from the outside into the casing A header, an outlet header through which the coolant flows out, and a coolant flow path for flowing the coolant flowing into the inlet header to the outlet header, and inward protrusions are provided on the inlet header and the outlet header, Fins are provided in the coolant flow path, and the inlet header and the outlet header are provided with a connecting portion that connects the first wall and the second wall of the casing and stretches between both walls,
前記連結部が、ケーシングの第１壁および第２壁のうちのいずれか一方に一体に設けられるとともに、先端が同他方に接合され、The connecting portion is provided integrally with one of the first wall and the second wall of the casing, and the tip is joined to the other,
ケーシングの第１壁および第２壁のうちのいずれか一方に、ケーシング内の入口ヘッダに冷却液を流入させる冷却液流入口が設けられ、同じく第１壁および第２壁のうちの冷却液流入口が設けられた壁と同じ壁または異なる壁に、ケーシング内の出口ヘッダから冷却液を流出させる冷却液流出口が設けられ、前記連結部が、入口ヘッダに設けられかつ冷却液流入口から流入した冷却液を冷却液流路側に案内する入口側ガイド部と、出口ヘッダに設けられかつ冷却液流路を流れてきた冷却液を集めて冷却液流出口側に案内する出口側ガイド部とからなる液冷式冷却器。Either one of the first wall and the second wall of the casing is provided with a cooling liquid inlet for allowing the cooling liquid to flow into the inlet header in the casing, and the cooling liquid flow in the first wall and the second wall is also provided. A cooling liquid outlet is provided on the same wall as the wall provided with the inlet or on a different wall from the outlet header in the casing, and the connecting portion is provided on the inlet header and flows in from the cooling liquid inlet. From the inlet side guide portion for guiding the cooled liquid to the cooling liquid flow path side, and the outlet side guide part provided at the outlet header and collecting the cooling liquid flowing through the cooling liquid flow path and guiding it to the cooling liquid outlet side Liquid-cooled cooler.
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