JP6513639B2 - Probe card assembly for testing electronic devices - Google Patents

Description

[0001] A probe card assembly is an apparatus that can provide an interface between a tester and an electronic device that controls testing of the electronic device. Embodiments of the present invention are directed to various improvements of such a probe card assembly.

[0002] In some embodiments, the contact probe can comprise a flexure element and a compliant connection element. The flexure element can include a contact tip, the contact tip being arranged to contact a first electronic device arranged in the plane of the contact tip. The compliant connection element may include a connection tip, the connection tip being arranged to contact a second electronic device arranged in the plane of the connection tip. A conductive path from the contact tip to the connection tip can be provided.

[0003] In some embodiments, a probe card assembly can include a wiring structure and a guide plate. The wiring structure can include an electrical contact on a first side of the wiring structure. The guide plate can be attached to the wiring structure and can include probe guides from the first side to the second side of the guide plate. A contact probe can be placed in the probe guide. The contact probes may each include a compliant connection element extending from the second surface of the guide plate, wherein the compliant connection element contacts one of the electrical contacts of the first surface of the wiring structure. Can have a connected (eg attached) connection tip. The connection element can be compliant in a first plane substantially parallel to the first plane of the wiring structure.

[0004] FIG. 1 illustrates a test system according to some embodiments of the present invention comprising a probe card assembly that includes a guide plate that holds a probe. [0005] FIG. 5 illustrates an example of a probe guide in the guide plate of FIG. 1, in accordance with some embodiments of the present invention. [0006] FIG. 3 depicts an example of a probe according to some embodiments of the present invention that can be inserted into the probe guide of FIG. [0007] FIG. 4 illustrates the probe of FIG. 3 disposed within the probe guide of FIG. 2 and attached to the probe guide of FIG. 2 in accordance with some embodiments of the present invention. [0008] FIG. 6 illustrates another example of a probe in accordance with some embodiments of the present invention. [0009] FIG. 1 illustrates an example configuration of a probe card assembly according to some embodiments of the present invention, including a thermal path through the wiring structure. [0010] FIG. 7 illustrates another example of a probe card assembly in accordance with some embodiments of the present invention. [0011] FIG. 5 illustrates an example of a self-testing configuration for testing a probe card assembly, in accordance with some embodiments of the present invention. FIG. 5 illustrates an example of a self-testing configuration for testing a probe card assembly in accordance with some embodiments of the present invention.

[0012] This specification describes exemplary embodiments and applications of the present invention. However, the present invention relates only to those exemplary embodiments and applications, or the manner in which those exemplary embodiments and applications work or the manner in which these exemplary embodiments and applications are described herein. It is not limited to. Further, the figures may show simplified views or subfigures, and the dimensions of elements in the figures may be exaggerated or not as true to scale as they are. In addition, as used herein, the terms "on", "attached to", "connected to", "coupled to" ) Or the like is used, one element (eg, material, layer, substrate, etc.) may be “on” another element or “attached to” another element, Another element may be "connected to" or "connected to" another element, in which case one of the elements is directly "on" the other element, or directly Whether the other element is "attached to" the other element "connected to" or "connected to" the other element, or one between the one element and the other element It does not matter if there are multiple intervening elements. In addition, direction (eg, above, below, top, bottom, side, up, down, down, ~, ~ If over, upper, lower, horizontal, vertical, "x", "y", "z" etc. are shown, their direction is It is relative, and is shown only as an example for the purpose of clarifying the description and the discussion, and is not intended to be limiting. In addition, when referring to the listed elements (eg, elements a, b, c), such references may be listed elements alone, any combination and / or not all of the listed elements. It is intended to include any one of the combinations of all the elements.

[0013] As used herein, "substantially" means sufficient to function for the intended purpose. Thus, the term "substantially" refers to minor non-significant variations from absolute or perfect conditions, dimensions, measurements, results, etc., which have a significant impact on the overall performance of what the skilled artisan would expect. Allow small variations that do not affect. When used in reference to a parameter or property that can be expressed as a numerical value or numerical value, "substantially" means within 10 percent. The term "ones" means two or more. The term "disposed" includes the meaning of "located" within its meaning.

[0014] In some embodiments of the present invention, the probe card assembly can include a guide plate, which can have a probe guide that holds the probes in place. The probe card assembly may further comprise a wiring structure, such that the connection tips of the probes are positioned with respect to the contacts on the wiring structure and the connection tips are attached to the contacts, Attached to the guide plate. The attachment of the guide plate to the wiring structure can allow the wiring structure to expand or contract at a greater rate than the guide plate, thereby making the cheaper components as the wiring structure It can be used. The probe may include elements that fail at high current and thermal stress and are located away from the contact tip.

FIG. 1 is a cross-sectional side view of an example 100 of a test system for testing an electronic device (hereinafter referred to as a device under test (DUT) 116, which may be an example of a first electronic device). Figure shows. Examples of DUTs 116 include semiconductor wafers including non-singulated dies, singulated semiconductor dies, and other electronic devices. The system 100 can include a test controller 102, a probe card assembly 110, and a communication channel 104 that connects the probe card assembly 110 to the test controller 102. The contact tip 152 of the probe 150 of the probe card assembly 110 can be in contact with the terminal 118 of the DUT 116. The tester 102 can then control the testing of the DUT 116 by providing test signals to the DUT through the communication channel 104 and the probe card assembly 110, and similarly, the tester 102 can control the probe card assembly 110 and the channel 104. Can receive a response signal from the DUT 116. Alternatively, some or all of test controller 102 may be located on probe card assembly 110.

As shown, the probe card assembly 110 can comprise a wiring structure 120 (which can be an example of a second electronic device) and a guide plate 140. Wiring structure 120 may include an electrical connector 124 on one side 122 and an electrical contact 130 on the opposite side 124. An electrical connection 128 can connect the connector 124 to the contact 130. The wiring structure 120 can be, for example, a wiring board such as a printed circuit board or a laminated ceramic wiring structure.

[0017] Guide plate 140 may comprise a probe guide 146, each of which may be one or more passageways, openings and / or features (within or within guide plate 140). feature) can be provided. Each probe 150 can be inserted into one of the probe guides 146 and secured therein. Thereby, the probe 150 can be attached to the guide plate 140. As shown, each probe 150 has a contact tip 152 for contacting a terminal 118 of the DUT 116 and a connection contact 154 for connecting to one of the contacts 130 on the first surface 124 of the wiring structure 120. And can be provided. The probe 150 can provide a conductive path between the connection tip 154 and the contact tip 152, and thus a conductive path between the interconnect structure 120 and the DUT 116. The contact tip 152 of the probe 150 can be substantially disposed in a plane (hereinafter, contact tip plane) 170, and similarly, the connection tip 154 is substantially in a plane (hereinafter, connection tip plane) 172. It can be arranged.

The contact tip plane 170 can be substantially parallel to the first surface 124 of the wiring structure 120 and / or the second surface 122 of the wiring structure 120. The connection tip plane 172 may be substantially parallel to the first surface 144 of the guide plate 140, the second surface 142 of the guide plate 140, and / or the plane (not shown) of the terminals 118 of the DUT 116. it can. In some embodiments, contact tip plane 170 can be substantially parallel to connection tip plane 172.

Guide plate 140 may comprise a material having a coefficient of thermal expansion (CTE) close to that of DUT 116 (eg, a silicon wafer). Also shown in FIG. 1, a spacer 132 may be disposed between the wiring structure 120 and the guide plate 140, which functions as a planarizing mechanism for the guide plate 140. Although two spacers 132 are shown in FIG. 1, more or less spacers 132 may be disposed. For example, a sufficient number of spacers 132 can be disposed to provide support between the wiring structure 120 and the guide plate 140.

Guide plate 140 may be attached to wiring structure 120. For example, attachment mechanisms 134 (eg, one or more bolts, screws, clamps, solders, adhesives, etc.) can attach guide plate 140 to wiring structure 120. In some embodiments, an attachment mechanism 134 can attach the guide plate 140 to the wiring structure 120 approximately at the center of the guide plate 140 and at about the center of the wiring structure 120. Thereby, the wiring structure 120 is, for example, the contact tip plane 170, the connection tip plane 172, the first surface 122 or the second surface 124 of the wiring structure 120, the first surface 142 or the second surface of the guide plate 140. It can expand and contract (eg, due to varying thermal conditions) in a plane substantially parallel to the plane 144 and / or the plane (not shown) of the DUT terminal 118. However, the attachment mechanism 134 substantially prevents the wiring structure 120 and the guide plate 140 from moving relative to each other in a direction substantially perpendicular to one of the above-mentioned planes.

As another example, the clip 160 may attach the guide plate 140 to the wiring structure 120. For example, the respective clips 160 may be fixedly attached to the wiring structure 120, for example using bolts, screws, clamps, solders, adhesives etc., but the guide plate 140 may be mounted on the lip or ledge of the clips 160. The mounting structure 120 can expand and contract relative to the guide plate 140 in a plane substantially parallel to the contact tip plane 172 discussed generally above. . However, the clip 160 substantially prevents relative movement between the wiring structure 120 and the guide plate 140 in a direction substantially perpendicular to one or more of those planes. Can.

The DUT 116 may be disposed on a stage (not shown) or other support that may include a temperature controller (not shown) that heats or cools the DUT 116. Thus, the ambient temperature around the probe card assembly 110 may change during testing. In addition, there may be a temperature gradient across the probe card assembly 110 (e.g., a gradient that generally increases from the second surface 122 of the wiring structure 120 toward the DUT 116). As a result of the above temperature conditions and / or other temperature conditions, wiring structure 120, guide plate 140 and / or DUT 116 may expand or contract at different rates. In FIG. 1, the thermally induced expansion or contraction of the wiring structure 120 is indicated by T ₁ , and the thermally induced expansion or contraction of the guide plate 140 is indicated by T ₂ . expansion or contraction of the induced DUT116 is indicated by _{T 3.}

As a result of this expansion or contraction, relative movement between the wiring structure 120, the guide plate 140, and / or the DUT 116 may occur. As a result of excessive relative movement, one or more contact tips 152 of probe 150 move away from corresponding terminals 118 of DUT 116 (and thus one or more contact tips 152 break contact with corresponding terminals 118). )Sometimes. As a result of such movement, one or more connection tips 154 disengage from corresponding contacts 130 and / or one or more connection tips 154 move away from corresponding contacts 130 (and thus one or more). Connection tip 154 may break contact with the corresponding contact 130.

The above problems can be addressed by constructing the wiring structure 120 and the guide plate 140 such that each has a coefficient of thermal expansion (CTE) substantially similar to that of the DUT 116. However, such wiring structures 120 may be relatively expensive. However, economical wiring structures such as printed circuit boards often have CTEs that are significantly larger than typical DUTs 116.

In the example of the probe card assembly 110 shown in FIG. 1, the guide plate 140 can be constructed of a material that provides the guide plate 140 with a CTE substantially the same as the CTE of the DUT 116. However, wiring structure 120 may have a significant CTE. For example, the CTE of the wiring structure 120 may be more than twice, three times, four times, five times or five times the CTE of the guide plate 140. Therefore, the thermal expansion or contraction T ₁ of the wiring structure 120 may be considerably larger than the thermal expansion or contraction T _{2 of} the guide plate 140. As discussed above, the wiring structure 120 is attached to the guide plate 140 such that relative movement of the wiring structure 120 relative to the guide plate 140 is allowed. Further, as will be appreciated, each probe 150 is fixed in one probe guide 146 in the guide plate 140, and each probe 150 is compliantly connected to one contact 130, discussed above. The relative motion of the wiring structure 120 can be adapted.

FIG. 2 shows an exemplary configuration of one probe guide 146, and FIG. 3 is an exemplary configuration of the probe 150. As shown in FIG. FIG. 4 shows the probe 150 inserted into the probe guide 146 and immobilized within the probe guide 146.

[0027] In the example shown in FIG. 2, the probe guide 146 can include a passage 202, a lower alignment aperture 208, and an upper alignment aperture 214. The passage 202 may be a through hole from the second surface 142 of the guide plate 140 through the guide plate 140 to the first surface 144. The lower alignment aperture 208 may be a cavity extending from the passage 202 into the guide plate 140. The alignment aperture 214 may be an opening in the first surface 144 of the guide plate 140 and extending from the passage 202. As shown, alignment openings 214 may comprise alignment features 216 as well as other alignment features 218, 220, 222 and 224.

[0028] As shown in FIG. 3, the probe 150 can comprise a body 312 from which the mounting element 308, the alignment element 314 and the flexure element 332 can extend. The probe 150 can further include a compliant connection element 304 that extends from the body 312 to the connection tip 154.

As seen in FIGS. 3 and 4, the mounting element 308 is sized and positioned to the lower alignment aperture 208 of the probe guide 146. For example, mounting element 308 can form a friction fit with lower alignment aperture 208. The attachment element 308 can further include one or more spring structures 310 that can extend relative to the side wall of the lower alignment opening 208.

[0030] Alignment element 314 may be sized and positioned to fit within alignment opening 214 of probe guide 146. Alignment element 314 may correspond to alignment feature 216 of alignment aperture 214 and may include alignment feature 316 that fits within alignment feature 216. While the probe 150 is inserted into the probe guide 146 and locked in place within the probe guide 146, alignment so that the contact tip 152 of the probe 150 is precisely located at a specific position relative to the guide plate 140 The features 216 may be located in the alignment aperture 214 and the corresponding alignment feature 316 may be located on the alignment element 314. As shown, the alignment element 314 further corresponds to the alignment feature 218 of the alignment opening 214 of the guide plate 140 and is positioned to contact the alignment feature 218, and the alignment opening Alignment feature 320 corresponding to alignment feature 220 of 214 and positioned to contact alignment feature 220, corresponding to alignment feature 222 of alignment aperture 214 and positioned to contact alignment feature 222 And the alignment feature 322. The feature alignment pairs 218/318, 220/320, 222/322 are used to precisely position the probe 150 at the desired position relative to the guide plate 140.

The flexure element 332 can extend from the body 314 of the probe 150 to the contact tip 152. The flexure element 332 can be flexible and thus can bend or move in response to the contact force F on the contact tip 152. For example, the deflecting element 332 can bend in a direction generally away from the DUT 116 in response to the contact force F. Thus, the flexure element 332 can provide a _first compliance C ₁ (eg, flexibility) in a direction substantially perpendicular to the contact tip plane 170.

The compliant connection 304 of the probe 150 can extend from the body 312 of the probe 150 to the connection contact 154. The connection contacts 154 can contact one of the electrical contacts 130 on the first surface 124 of the wiring structure 120, as discussed above and shown in FIG. At least the flexure element 332 of the probe 150, the body 312 and the compliant connection 304 can be electrically conductive and thus from the contact tip 152 (which can also be electrically conductive) to the connecting tip 154 (electrically conductive) Conductive paths can be formed.

The connection tip 154 may simply contact the electrical contact 130 or may be attached to the electrical contact 130. For example, an adhesive (eg, a conductive adhesive), solder or the like (not shown) can attach the connection tip 154 to the electrical contact 130. Alternatively, the connection tip 154 can be attached to the contacts 130 using mechanical contact and / or bonding techniques such as tape automated bonding, wire bonding, laser bonding, piezoelectric bonding, and the like. In any case, the compliant connection 304 can provide a _second compliance C ₂ (eg, flexible) in a direction substantially parallel to the connection tip plane 172. As discussed above, differences in thermal expansion or contraction may cause relative movement of the wiring structure 120 relative to the guide plate 140 in a plane substantially parallel to the connection tip plane 172. Second compliance _{C 2,} the electrical contacts 130, without destroying the attachment of the connecting tip 154 to the electrical contacts 130, with the wiring structure 120, the body 312 (and therefore the probe 150 relative to the guide plate 140, the attachment element 308, it may be possible to move (relative to the alignment element 314 and the deflection element 332). The compliant connection element 304 can include a flexible or elastic material and / or a spring structure.

[0034] As shown in FIGS. 3 and 4, the compliant connection element 304 can further comprise an element 306, which is disposed in a conductive path extending from the contact tip 152 to the connection tip 154. The heat generated by the current in the path can be dissipated. Further, because element 306 is in compliant connection 304 away from flexure element 332, most of the heat dissipated in the conductive path between contact tip 152 and connection tip 154 is away from flexure element 332. It may be at element 306. For example, as shown in FIG. 3, the flexure element 332 to which the contact tip 152 is attached may be located at a _first distance D ₁ from the contact tip plane 170 and the element 306 may be a contact tip It can be located at a _second distance D ₂ from the plane 170. The second distance D ₂ may be greater than the first distance D _1. For example, the second distance _{D 2,} 2 times the first distance _{D 1,} 3-fold, 4-fold, can be a 5-fold or 5-fold.

The configuration of the probe 150 and corresponding probe guide 146 shown in FIGS. 2-4 is merely an example, and many variations are possible. For example, the probe 150 can have fewer or more elements than those shown in FIGS. 3 and 4. As another example, the elements shown in FIG. 150 can have different shapes and can be in different positions. FIG. 5 shows an example 500 of a probe that can be an example of the probe 150. Thus, probe 150 can be replaced with probe 500 in any of the figures or discussions herein.

[0036] As shown in FIG. 5, the probe 500 can comprise a contact tip 552 and a connection tip 554, which can be examples of the contact tip 152 and the connection tip 154 of FIGS. Probe 500 may further include a body 512 from which compliant connection elements 504, attachment elements 508, alignment elements 514 and flexure elements 532 may extend. The elements described above may be examples of the body 312, the compliant connection 304 (including the element 306), the mounting element 308, the alignment element 314 and the flexure element 332 of FIGS. 3 and 4, respectively.

[0037] As shown, the compliant connection element 504 can include a serpentine shape that can provide compliance. Thus, the serpentine shape of the connecting element 504 can be an example of the element 306 of FIGS. 3 and 4.

[0038] As also shown, the attachment element 508 can include one or more springs 510, which can be examples of the springs 310 of FIGS. Alignment features 516 and other alignment features 518, 520, 522, which may be examples of alignment feature 316 and other alignment features 318, 320, 322 of FIGS. 3 and 4, respectively.

FIG. 6 shows an example of a modified configuration of the probe card assembly 110 of FIG. The probe card assembly 600 of FIG. 6 may be a probe card assembly generally similar to the probe card assembly 110 of FIG. 1, and like numbered elements may be the same element. However, as shown, the probe card assembly 600 further includes a thermal structure 602 (eg, a structure comprising a high thermal conductivity material such as metal) and a layer 632 of thermal insulating / thermal conductive material of the guide plate 140 (FIG. , But only on the underside, but can be placed on both sides). A thermally conductive mounting structure 614 (eg, metal screws, bolts, clamps, etc.) can couple the wiring structure 120 to the thermal structure 602. The thermal conductivity of the mounting structure 614 can be greater (e.g., by a factor of 2) than the wiring structure 120, and thus, the mounting structure 614 penetrates the wiring structure 120 to reach the thermal structure 602. A thermally conductive pathway can be provided. A thermally conductive material 616 (eg, thermally conductive paste, adhesive, tape, etc.) can be disposed from the second surface 142 of the guide plate 140 to the mounting structure 614. A thermally conductive path including material 616 and mounting structure 614 can thus be provided to conduct heat from guide plate 140 through wiring structure 120 to thermal structure 602. In addition, another thermally conductive material 622 may be disposed between the guide plate 140 and the wiring structure 120.

Wiring structure 120 and guide plate 140 are shown in FIG. 1 and discussed above as being probe card assembly 110, but instead, wiring structure 120 and guide plate 140 are of a larger device. It can also be a subassembly. FIG. 7 shows that the combination of the wiring structure 120 and the guide plate 140 is a subassembly 704 attached to other components to form a larger assembly, and the larger assembly itself may be a probe card assembly 700. An example is shown. As shown in FIG. 7, the probe card assembly 700 comprises a reusable assembly 702 that allows quick and easy attachment and removal of the subassembly 704 corresponding to the probe card assembly 110 of FIG. be able to.

[0041] The reusable assembly 702 can comprise a stiffening structure 706, a primary wiring structure 708, and an interposer 712, wherein the interposer 712 includes a primary wiring structure 708 and a wiring structure 120. A flexible electrical connection between the two. The stiffening structure 706 can be, for example, a mechanically rigid (eg, metal) structure. The primary wiring structure 708 may comprise an electrical connector 710, which may, for example, connect to a channel such as 104 in FIG. 1 leading to a test device (such as the test device 102). The primary wiring structure 708 can comprise an electrical connection (not shown) extending from the connector 710 through the primary wiring structure 708 to the interposer 712, the interposer 712 can be a subassembly from the primary wiring structure 708 A flexible electrical connection (not shown) can be provided that extends up to 704. The flexible electrical connections (not shown) of interposer 712 can be arranged in a standard pattern.

[0042] As shown, the subassembly 704 can comprise the wiring structure 120 and the guide plate 140, and the guide plate 140 includes the probes 150 schematically illustrated in FIGS. Is attached. However, an interface (not shown) to interposer 712 could be used in place of connector 124 of FIG. As outlined above, wiring structure 120 may provide electrical connection from interposer 712 to probe 150 as discussed above.

Reusable assembly 702 and subassembly 704 can each be a single assembly unit that can be easily attached and removed from one another. For example, subassembly 704 may be attached to and removed from reusable assembly 702 as a single unit. The reusable assembly 702 can be a standard assembly used to test several different types of DUTs (such as 116) that each have a different pattern of terminals 118. However, for each different type of DUT, only one subassembly 704 with a customized layout of the probes 150 can be designed and fabricated. Each time a different type of DUT is tested, the subassembly 704 corresponding to the previous type of DUT is removed from the reusable assembly 702 and the new subassembly 704 customized for that new type of DUT is re-created. It can be attached to a usable assembly 702. Thus, the probe card assembly 700 of FIG. 7 can be customized for different types of DUTs by simply replacing the subassembly 704. However, the reusable assembly 702 can also be used to test several different types of DUTs.

[0044] Figures 8A and 8B show an example of a daisy-chained configuration for testing connectivity within the probe card assembly 700 of Figure 7. Common causes of failure within the probe card assembly include connection failure of interposer 712 to primary wiring structure 708 or wiring structure 120.

FIG. 8A shows a partial cross-sectional view of primary wiring structure 708, interposer 712, and wiring structure 120. As shown in FIG. As shown, the electrical connections 802 may reach, for example, the connector 710 (see FIG. 7; not shown in FIG. 8) through the primary wiring structure 708 to the interposer 712 and then the electrical connections 804. Electrical pathways can be provided, and electrical connections 804 pass through the interconnect structure 120 to the contacts 130 on the first side 122 of the interconnect structure 120. As shown in FIG. 8C 8A, the switch 812 in or on the primary wiring structure 708 and the similar switch 814 in or on the wiring structure 120 are closed. From a first location 822 through multiple connections between the primary wiring structure 708 and the interposer 712 and between the wiring structure 120 and the interposer 712 when this is the state of the switches 812, 814. A daisy chained temporary path 820 can be generated to a second location 824 (see FIG. 8B). For example, if the test signal provided at the first location 822 is detected at the second location 824, the connection from the interposer 712 to the wiring structures 708, 120 along the daisy-chained path 820 is good. . Otherwise, at least one of the above connections is bad. An indicator mechanism 816 (eg, a light) is positioned along path 820 to indicate that probe card assembly 700 is in a daisy chain test mode and / or to indicate whether the test signal successfully passed path 820. be able to. After the above self-testing of the probe card assembly 700 is complete, the switches 812 814 can be opened and the probe card assembly 700 can be used to test the DUT (eg, as the DUT 116).

[0046] Although specific embodiments and applications of the invention have been described herein, these embodiments and applications are merely examples, and many other variations and applications are possible.

Claims (20)

A deflecting element comprising a contact tip, the contact tip being arranged to contact a first electronic device arranged in the plane of the contact tip;
A compliant connection element comprising a connection tip, wherein the connection tip is arranged to contact a second electronic device arranged in the plane of the connection tip;
A conductive path from the contact tip to the connection tip;
It said compliant connecting element comprises a radiating element having a large heat dissipation capacity than any other portion of the disposed conductive path and the conductive path,
A contact probe, wherein the distance between the heat dissipation element and the plane of the contact tip is greater than the distance between the deflection element and the plane of the contact tip.   The contact probe according to claim 1, wherein the compliant connection element is designed to fail at high current and thermal stress. The flexure element is disposed at a first distance from the plane of the contact tip,
The compliant connection element that fails with high current and thermal stress is located at a second distance from the plane of the contact tip,
Said second distance is greater than said first distance,
The contact probe according to claim 2.   The contact probe of claim 2, wherein the compliant connection elements that fail at high current and thermal stress include compliant connection elements spaced from one another.   The contact probe according to claim 1, wherein the size of the contact probe is determined to fit in a probe guide in a guide plate.   The contact probe according to claim 5, further comprising a mounting element adapted to fit into the alignment opening of the probe guide, thereby attaching the contact probe to the guide plate.   The apparatus further comprises an alignment element corresponding to the alignment opening of the probe guide, the alignment element comprising an alignment feature, wherein the alignment feature contacts a corresponding restraint in the alignment opening, thereby 6. A method according to claim 5, wherein the movement of the contact probe in the probe guide due to the contact force of the first electronic device on the contact tip is positioned to stop at a predetermined position relative to the guide plate. Contact probe as described. The deflection element is compliant in a first direction in response to the contact force of the first electronic device on the contact tip,
The compliant connection element is compliant in the second direction,
The first direction is substantially perpendicular to the second direction,
The contact probe according to claim 1. A wiring structure comprising electrical contacts, wherein the electrical contacts are on a first side of the wiring structure;
A guide plate attached to the wiring structure, the guide plate including a probe guide from the first surface to the second surface of the guide plate;
A contact probe disposed in the probe guide;
The contact probes each comprise a compliant connection element extending from the second surface of the guide plate, wherein the compliant connection element is one of the electrical contacts of the first surface of the wiring structure. With a connection tip attached to the electrical contacts,
The compliant connection element is compliant in a first plane substantially parallel to the first surface of the wiring structure;
The contact probes are each
A flexure element extending from the first surface of the guide plate and arranged to contact a device under test (DUT) in a second plane substantially parallel to the first plane A flexing element comprising a contact tip,
And a conductive path from the contact tip to the connection tip,
It said compliant connecting element comprises a radiating element having a large heat dissipation capacity than any other portion of the disposed conductive path and the conductive path,
The distance between the heat dissipating element and the second plane is greater than the distance between the deflecting element and the second plane,
Probe card assembly. The connection tip does not move to the one of the electrical contacts during differential thermal expansion or contraction relative to the guide plate substantially in the first plane of the wiring structure. 10. The probe card assembly of claim 9, wherein compliance of the compliant connection element is sufficient to maintain the connector attached thereto.   The probe card assembly according to claim 9, wherein a coefficient of thermal expansion (CTE) of the wiring structure can be greater than a CTE of the guide plate.   The probe card assembly according to claim 11, wherein the wiring structure may be a printed circuit board or a multilayer ceramic. The apparatus further comprises a mounting clip for mounting the wiring structure to the guide plate, the mounting clip comprising:
Allowing relative movement of the wiring structure relative to the guide plate substantially in the first plane,
Restricting relative movement of the wiring structure relative to the guide plate in a direction substantially perpendicular to the first plane,
The probe card assembly according to claim 9.   The probe card assembly according to claim 9, further comprising a biasing element positioned inside the probe guide for biasing the contact probe to a specific position in the probe guide.   The probe card assembly according to claim 9, further comprising a spacer disposed between the first surface of the wiring structure and the second surface of the guide plate. A thermal insulating or thermally conductive material disposed on the first and second surfaces of the guide plate;
10. The probe card assembly of claim 9, further comprising: a thermally conductive structure extending from the second surface of the guide plate to create a thermally conductive path through the wiring structure. The apparatus further comprises a first assembly, the first assembly comprising:
With a rigid body,
Primary wiring structure with electrical connection to the test equipment;
10. A probe card assembly according to claim 9, comprising: an interposer comprising a flexible electrical connection from said primary wiring structure. The wiring structure provided with the electrical contact is a secondary wiring structure,
The probe card assembly further comprises a second assembly including the secondary wiring structure attached to the guide plate;
The second assembly is attached to the first assembly as a single unit and configured to be removed from the first assembly,
The probe card assembly of claim 17.   The electrical switch in the primary wiring structure and the electrical switch in the secondary wiring structure are further provided, the electrical wiring between the primary wiring structure and the interposer and the interposer when the electrical switch is closed. The probe card assembly of claim 18, generating daisy-chained electrical paths through the plurality of interconnections between the secondary wiring structures.   Each of the contact probes further comprises an alignment element comprising alignment features positioned to contact corresponding alignment features in an alignment aperture of a corresponding one of the probe guides. 10. The probe card assembly of claim 9, wherein the features of the alignment aperture stop at a predetermined position relative to the guide plate.

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