JP6508607B1 - Electronic component mounting container and electronic component mounting structure - Google Patents

Abstract

Provides mounting technology that does not require a dedicated substrate when mounting electronic components in electrical products. FIG. 1 is a schematic configuration view of the electronic component mounting container. The electronic component mounting container 1 includes a container body 2 and electronic components 8 and the like. The container body 2 is made of resin and has a bottom 3, a body 4 and a flange 5. A pair of terminals 6 is provided on the top surface of the flange portion 5, and an electronic component 8 is mounted on the bottom portion 3. The wiring 7 connects the electronic component 8 and the terminal 6. The circuit 11 and the circuit side terminal 12 are provided on the back surface of the housing 10. The terminals 6 and the circuit side terminals 12 are made to correspond to each other, and soldered by electromagnetic induction heating.

Description

  The present invention relates to a technology for mounting an electronic component on an electrical product.

  When mounting electronic components on electrical products, a dedicated substrate is required. It will be specifically described based on the following example.

  FIG. 11 is an example of a refrigerator having an operation panel, which is commercially available in recent years. The operation panel has a capacitive touch sensor.

  In the initial state, the operation panel is not displayed. This produces a simple appearance and harmonizes with other interiors. Also, unlike a button type switch, it maintains flatness and is hard to get dirty.

  When the user touches any of the operation panels, LEDs (light emitting diodes) provided corresponding to the touch sensors emit light, and all menu icons are displayed on the operation panel.

  When the user selects one of the menus, the corresponding touch sensor detects a change in capacitance between the electrodes. The control device causes only the LEDs corresponding to the corresponding LEDs and the home icon to emit light, and gradually turns off the other LEDs. This allows the user to recognize that the intended menu has been correctly selected.

  Furthermore, a detailed submenu is displayed on the operation panel. The user can perform detailed operations such as temperature setting. When the user wants to select another menu, the user selects the home menu. All menu icons are displayed again.

  FIG. 12 is a conceptual view of the mounting structure of the electric product.

  A decorative film 102 is attached to the surface of the light transmitting resin plate 101 (or glass plate). The part 103 corresponding to the display on the operation panel in the decorative film 102 is transparent.

  The touch sensor 104 and the wiring 105 are provided on the substrate 106 on the back surface of the resin plate 101. The touch sensor 104 responds to a touch on the display portion 103 and detects a change in capacitance. The substrate 106 is light transmissive.

  The LED 107 and the wiring 108 are provided on the substrate 109 on the back surface of the substrate 106. The substrate 109 is supported by a support mechanism (not shown).

  The control device causes the LED 106 to emit light or to turn off based on the detection signal of the touch sensor 104. At that time, a shielding plate 110 corresponding to the LEDs is provided so that light from the plurality of LEDs is not mixed. A plurality of shielding plates 110 are integrated to form a case.

  The light from the LED 107 is emitted through the display portion 103 of the substrate 106, the touch sensor 104, the resin plate 101, and the decorative film. As a result, the icon display provided on the decorative film 102 appears.

  Patent Document 1 discloses a refrigerator having an operation panel and an operation panel formed by laminating and forming a display substrate equipped with an LED light emitter and an operation substrate equipped with an electrostatic touch sensor as separate substrates.

  That is, the LED and the touch sensor are mounted on the respective substrates.

JP, 2014-31959, A

  As described above, in the display device integrated type operation panel, the touch sensor mounting substrate 106 and the LED mounting substrate 109 are required. This makes the structure complex and expensive.

  By the way, in the electric products, so-called minor changes are performed in which only the details are changed without changing the main structure. In the above case, it may be desirable to change the arrangement of the menu icons.

  At that time, it is necessary to change the arrangement of the LEDs 107 on the substrate 109 and the arrangement of the shielding plate 110 along with the arrangement of the display portion 103 in the decoration film 102 and the arrangement of the touch sensor 104 on the substrate 106. . As a result, even minor changes will be major changes.

  Also, in the case of a large-sized electrical product such as a refrigerator, a sufficient space can be expected on the back of the operation panel, but when space is limited as in a small audio, the touch sensor mounting substrate 106 can be limited. The provision of the two substrates of the LED mounting substrate 109 hinders the miniaturization of the electrical product.

  Providing a dedicated substrate when mounting an electronic component on an electrical product has the above-described problems.

  The present invention is to solve the above-mentioned problems, and it is an object of the present invention to provide a mounting technique which does not require a dedicated substrate when mounting an electronic component on an electric product.

  The present invention for solving the above problems is a resin container having a bottom, a body standing upright from the bottom, and a flange extending horizontally from the upper end of the body, an electronic component provided in the bottom, and It is an electronic component mounting container provided with a pair of terminals provided in a flange part, and wiring provided in the said trunk part and connecting the said electronic component and the said terminal.

  By mounting the electronic component mounting container on an electronic product, a dedicated substrate is not required.

  The present invention for solving the above problems is an electronic component mounting structure. The electronic component mounting structure includes a circuit provided on the back surface of the resin case, a circuit side terminal provided on the circuit, and the electronic component mounting container. The circuit side terminal and the terminal of the electronic component mounting container are connected

  According to the electronic component mounting container of the present invention, it can be attached to the circuit provided on the back of the housing. For example, even if the housing is a curved surface, it can be attached.

  The present invention for solving the above problems is an electronic component mounting structure. The electronic component mounting structure includes a first electronic component, a circuit for the first electronic component, a substrate provided with the first electronic component and the circuit for the first electronic component, and a second electronic component provided on the substrate And a circuit-side terminal provided in the circuit for the second electronic component, and the electronic component-mounting container according to claim 1 on which the second electronic component is mounted. The said circuit side terminal and the terminal of the said electronic component mounting container are connected.

  According to the electronic component mounting container of the present invention, it can be attached to the circuit on the substrate of another electronic component. That is, a common substrate can be used.

  The present invention for solving the above problems is an electronic component mounting structure. The electronic component mounting structure includes an operation panel, a touch sensor provided on the back of the operation panel for detecting an operation signal, a circuit for a touch sensor, and the substrate on which the touch sensor and the circuit for a touch sensor are provided; The electronic component mounting container according to claim 1, comprising: a circuit for an LED provided on the substrate; a circuit side terminal provided on the circuit for an LED; and an LED element. The said circuit side terminal and the terminal of the said electronic component mounting container are connected.

  According to the electronic component mounting container of the present invention, the LED can be mounted on the substrate of the touch sensor. That is, a common substrate can be used.

  In the above invention, preferably, the solder paste contains solder particles, a solvent, and a flux, and in the electromagnetic induction heating step, the solvent is heated to evaporate the solvent, and the temperature is maintained to liquefy the flux. The oxide film is removed and further heated to melt the solder particles.

  The present invention which solves the above-mentioned subject is a manufacturing method of an electronic component loading container. The steps of forming a container group consisting of a plurality of resin containers continuous in the vertical and horizontal directions, the step of forming a wire and a terminal in the container group, the step of connecting the wire and an electronic component, and each resin from the container group And cutting the container.

  This enables mass production of electronic component mounting containers.

  The present invention for solving the above problems is an electronic component mounting method. Providing a circuit-side terminal on the circuit and the circuit, disposing solder on the circuit-side terminal or the terminal on the electronic component mounting container, positioning and arranging the electronic component mounting container, electromagnetic induction heating And connecting the circuit-side terminal and the terminal of the electronic component mounting container.

  According to the electronic component mounting container of the present invention, no special substrate is required when mounting the electronic component on the electric product.

  According to the electronic component mounting container of the present invention, it can be attached to the circuit provided on the back of the housing. For example, even if the housing is a curved surface, it can be attached.

  According to the electronic component mounting container of the present invention, it can be attached to the circuit on the substrate of another electronic component. For example, an LED can be mounted on a touch sensor substrate.

Schematic diagram of the electronic component mounting container Schematic Configuration of Mounting Structure (First Embodiment) Schematic Configuration of Mounting Structure (First Embodiment) Schematic Configuration of Mounting Structure (Second Embodiment) Schematic Configuration of Mounting Structure (Second Embodiment) Schematic Configuration of Mounting Structure (Second Embodiment) Illustration of manufacturing process of electronic component mounting container Schematic diagram of container group (intermediate product) An illustration of the mounting method Schematic configuration diagram of the electronic component mounting container (modification) An example of an electrical product and an example of an operation panel (prior art) Schematic diagram of mounting structure (prior art)

  <Electronic component mounting container>

  FIG. 1 is a schematic configuration view of the electronic component mounting container. The electronic component mounting container 1 includes a container body 2 and electronic components 8 and the like.

  The container body 2 has a bottom 3, a body 4 standing upright from the bottom, and a flange 5 protruding horizontally from the upper end of the body. The container is made of resin. Although a rectangular container is used as an example, it may be a circular container or a polygonal container.

  It may be a heat resistant resin such as polyamide imide or polyimide, or a non heat resistant resin such as ABS resin, acrylic, polycarbonate, polyester, polyurethane or the like. Details will be described later in the description of the manufacturing method and the mounting method.

  A pair of terminals 6 is provided on the top surface of the flange portion 5. A wire 7 is provided from the terminal 6 along the body 4, and the wire 7 is extended to the bottom 3.

  The electronic component 8 is mounted at the bottom 3. The wiring 7 connects the electronic component 8 and the terminal 6. The bonding structure of the electronic component 8 and the wiring 7 is not particularly limited. For example, it is soldered.

  The terminal 6 and the wiring 7 are not particularly limited as long as they are conductive materials. For example, it is formed by Ni / Au plating.

  The electronic component 8 is not particularly limited. When the directivity is important electronic components such as LED elements and proximity sensors (infrared transmitting elements and receiving elements), the features of the electronic component mounting container can be exhibited.

  In the case where the electronic component 8 is accompanied by heat generation, a heat dissipation hole may be provided in the bottom 2 (see FIG. 3).

First Embodiment
~Constitution~
The first embodiment will be described by taking an LED mounting structure in an electronic product as an example.

  2 and 3 are schematic configuration diagrams of the mounting structure according to the first embodiment. FIG. 2 shows the appearance from the surface of the housing, and FIG. 3 shows the appearance from the rear surface of the housing. For convenience of explanation, the case 10 is a partial cross-sectional display, and the electronic component mounting case 1 is a semi-transparent display.

  The housing 10 of the electrical product is made of resin. It may be a heat resistant resin or a non heat resistant resin. However, when forming MID by laser direct structuring (Laser Direct Structuring), it is limited to corresponding resin.

  A circuit 11 is provided on the back of the housing 10. The circuit 11 may be a three-dimensional injection molded circuit component (Molded Interconnect Device). Alternatively, a flexible printed circuit (Flexible Printed Circuits) may be attached to the back of the housing 10. A film of copper foil may be formed on the back of the housing 10 and etched. With these methods, circuits can be formed on curved surfaces as shown. When the back surface of the housing 10 is flat, the circuit may be formed by a printed circuit board.

  The circuit 11 is provided with a terminal (circuit side terminal) 12 corresponding to the electronic component mounting container 1.

  Furthermore, a light guiding window 13 is provided at the LED mounting compatible portion. The window 13 is formed of, for example, a transparent resin.

  Further, corresponding to the flange shape of the electronic component mounting container 1, a projection 14 for positioning is provided.

  The electronic component mounting container 1 is mounted on the back surface of the housing 10. The flange outer edge of the electronic component mounting container 1 is fitted in the positioning projection 14. Thereby, the circuit side terminal 12 and the electronic component mounting container side terminal 6 correspond. The bonding structure of the circuit side terminal 12 and the electronic component mounting container side terminal 6 is not particularly limited. For example, it is soldered. Details will be described later in the description of the mounting method.

  When electricity is supplied through the circuit 11, the LED element 8 emits light. The LED light has directivity and is emitted from the outside of the eyelid through the window 13.

~effect~
According to the first embodiment, the LED can be mounted without the need for a dedicated substrate. As a result, the electrical product can be miniaturized.

  By the way, when the LED element 8 is directly mounted on the circuit 11, the LED light emission has directivity, so it is not emitted outside the body. On the other hand, by using the electronic component mounting container 1, the light emission direction can be made outside the body. In addition, also in mounting of a proximity sensor, a communication direction can be made into the outside of a body by interposing the electronic component mounting container 1.

  The size of the electronic component mounting container 1 is about one size larger than the LED element 8 element. That is, it is significantly smaller than a dedicated substrate. Thereby, it can mount easily, even if housing 10 back is a curved surface.

  Further, by having the flange portion 5, a positioning mechanism can be provided. This enables accurate implementation.

Second Embodiment
~Constitution~
In the second embodiment, the mounting structure of the LED on the operation panel of the electronic product will be described as an example.

  4 to 6 are schematic configuration diagrams of the mounting structure according to the second embodiment. FIG. 4 is an appearance from the surface of the operation panel. The part shown in outline is the operation icon. FIG. 5 shows the appearance of a substrate provided on the back of the operation panel. FIG. 6 is a cross-sectional view of the mounting structure.

  The operation panel 20 of the electrical product is made of resin. It may be a heat resistant resin or a non heat resistant resin.

  A decorative film 22 is attached to the surface of the light transmitting resin plate 21 (or glass plate). The part 23 corresponding to the display of the operation panel in the decorative film 22 is transparent (or translucent).

  The touch sensor 24 and the wiring 25 are provided on the substrate 26 on the back surface of the resin plate 21.

  The touch sensor 24 responds to a touch on the display portion 23 and detects a change in capacitance. The touch sensor 24 has conductivity and light transparency. For example, it is formed of ITO (indium tin oxide), PEDOT (conductive polymer), metal nanowires such as silver, CNT (carbon nanotube) and the like.

  The substrate 26 is a PET film having light transparency.

  Through holes 27 of silver are provided in the substrate 26 to electrically connect the front and back of the substrate.

  A wiring circuit 28 for the touch sensor 24 is drawn around the back surface of the substrate 26 so as to avoid a portion corresponding to the display portion 23. The wiring circuit 28 is a copper foil. The wiring circuit 28 is continuous with the FPC 29 for external connection.

  The substrate 26 is further provided with a circuit 31 for LEDs. The circuit 31 is a copper foil. The circuit 31 is continuous with the FPC 29 for external connection. At this time, the circuit 31 is formed so as not to mix with the circuit 28.

  The circuit 31 is provided with a terminal (circuit side terminal) 32 corresponding to the electronic component mounting container 1.

  The electronic component mounting container 1 is mounted on the back of the operation panel 20. It arrange | positions via a positioning mechanism (above-mentioned), and the circuit side terminal 32 and the electronic component mounting container side terminal 6 respond | correspond. The bonding structure of the circuit side terminal 32 and the electronic component mounting container side terminal 6 is not particularly limited. For example, it is soldered. Details will be described later in the description of the mounting method.

  The control device (not shown) causes the LED 8 to emit light or go out based on the detection signal of the touch sensor 24. At that time, since the sides are shielded by the container body 2, light from a plurality of LEDs is not mixed.

~ Operation ~
The light from the LED element 8 is emitted through the display portion 23 of the substrate 26, the touch sensor 24, the resin plate 21 and the decorative film. As a result, the icon display provided on the decorative film 22 appears.

  A usage example of the operation panel 20 will be described.

  When the user touches any of the operation panel 20, the touch sensor 24 detects the touch, the LED 8 emits light, and all operation icons are displayed on the operation panel 20.

  When the user selects one of the operation icons, the corresponding touch sensor 24 detects a change in capacitance between the electrodes. The controller increases the brightness of the corresponding LED 8. This allows the user to recognize that the intended operation has been performed.

~effect~
According to the second embodiment, the LED 8 can be mounted on the touch sensor substrate 26. That is, the configuration of the LED substrate 109, the substrate support mechanism, the shielding plate 110 and the like in the prior art is not required, and the configuration of the operation panel 20 can be simplified. As a result, it can be applied even when space is limited, such as small audio.

  Even in the case of a minor change of the electrical product, the arrangement of the electronic component mounting container 1 may be changed in accordance with the change of the arrangement of the display portion 23 on the decorative film 22 and the arrangement of the touch sensor 24 on the substrate 26. In other words, minor changes are acceptable.

<Manufacturing method>
FIG. 7 is an explanatory view according to the manufacturing process of the electronic component mounting container 1. FIG. 8 is a schematic configuration view of a container group 9 which is an intermediate product.

  A container group 9 is formed, in which a plurality of resin container bodies 2 are arranged continuously in the vertical and horizontal directions. For example, injection molding is performed.

  The wire 7 and the terminal 6 are formed in the container group 9. Although the circuit formation method is not limited, it is formed by, for example, the MID method. Although the details of the MID method are not limited, for example, they are formed by the LDS method. When using LDS method, it is limited to resin for LDS.

  The LDS method will be briefly described. The wire equivalent portion is activated by an infrared laser. Wiring is formed by electroless plating.

  Wiring 7 and electronic component 8 are connected. For example, it is soldered. In the case of solder bonding by solder reflow, a heat-resistant resin is used. In the case of solder bonding by electromagnetic induction heating (IH), a non-heat-resistant resin can be used. Thereby, an intermediate product (see FIG. 8) is formed.

  Each electronic component mounting container 1 is cut out from the container group 9 in which the electronic components 8 are mounted.

  Thus, the electronic component mounting container 1 can be easily mass-produced.

<Implementation method>
~Overview~
The mounting method of the electronic component mounting container 1 will be described. The bonding structure of the electronic component mounting container side terminal 6 and the circuit side terminals 12 and 32 is not particularly limited, but solder bonding is preferable. Although the details of the solder bonding are not limited, electromagnetic induction heating is preferred. Hereinafter, solder bonding by electromagnetic induction heating will be described.

  FIG. 9 is a conceptual view of a mounting method by electromagnetic induction heating. An electromagnetic induction heating apparatus is comprised from a coil lead and a power supply.

  When an alternating current flows through the coil wire, magnetic lines of varying strength are generated. If a substance (usually a metal, more specifically, an object to be joined) that conducts electricity is placed near it, an eddy current flows in the metal under the influence of the changing magnetic field lines. Since a metal usually has electrical resistance, when current flows in the metal, Joule heat is generated and the metal self-heats. This phenomenon is called induction heating.

The calorific value Q by electromagnetic induction is expressed by the following equation. Q = (V ² / R) × t [V = applied voltage: R = resistance: t = time]

  In electromagnetic induction heating, only the metal generates heat, so there is little risk of heat damage to the resin part in the vicinity.

  In electromagnetic induction heating, since only metal generates heat, bonding can be performed with less energy and in a short time. The time required for one bonding is several to several tens of seconds.

  In the electromagnetic induction heating, if it is in a uniform magnetic field, a predetermined Joule heat can be obtained, so the bonding accuracy is high. Moreover, if it is in a uniform magnetic field, several junctions can be done at once.

~ Details ~
The description returns to the mounting method of the electronic component mounting container 1. The first embodiment or the second embodiment is taken as an example.

  First, the circuit side terminals 12 and 32 are formed in the circuits 11 and 31.

  Solder paste is disposed on the circuit side terminals 12 and 32. If possible, solder paste may be disposed on the electronic component mounting container side terminal 6.

  The electronic component mounting container 1 is positioned and disposed at a predetermined position. Thereby, the electronic component mounting container side terminal 6 and the circuit side terminals 12 and 32 correspond to each other.

  The solder is melted by electromagnetic induction heating, and the electronic component mounting container side terminal 6 and the circuit side terminals 12 and 32 are joined.

~effect~
By the way, in electromagnetic induction heating, the influence of the magnetic field lines becomes weaker as it gets farther from the coil.

  In the example of FIG. 9, the thickness of the operation panel 20 is about 1 to 2 mm, whereas the depth of the electronic component mounting container 1 is about 2 to 5 mm. That is, when the distance L1 from the coil to the joining position of the electronic component mounting container side terminal 6 and the circuit side terminal 32 and the distance L2 from the coil to the joining position of the wiring 7 and the electronic component 8 are compared, the distance L2 is It is twice or more of the distance L1.

  As a result, the solder between the electronic component mounting container side terminal 6 and the circuit side terminal 32 is melted, but the space between the wiring 7 and the electronic component 8 is not remelted. That is, the electromagnetic induction heating does not affect the mounting of the electronic component 8 in the electronic component mounting container 1 and reliably mounts the electronic component mounting container 1 in the operation panel 20.

<Modification example of electronic component mounting container>
FIG. 10 shows a modification of the electronic component mounting container. In the above embodiment, one electronic component is mounted on one container body, but a plurality of electronic components may be mounted on one container body.

  For example, in the container body 2, the red LED element 8R, the green LED element 8G, and the blue LED element 8B are mounted. Each LED element 8 is connected to each terminal 6 through a wire 7.

  If the electronic component mounting container 41 according to the modification is applied to the first embodiment or the second embodiment, it is possible to express the difference in color other than the ON / OFF of the LED and the intensity of the luminance. In that case, when using the some electronic component mounting container 41, since the side is shielded by the container main body 2, multiple colors do not mix. Each color can be displayed clearly.

  Further, digital signage is configured by arranging a large number of electronic component mounting containers 41 according to the modification continuously in vertical and horizontal directions. Since the sides are shielded by the container body 2, plural colors do not mix. Each color can be displayed clearly.

  Further, a modified example of the alignment mechanism is additionally described in FIG. Notches 15 are provided at two corners of the flange portion 5 and engaged with pin projections (not shown) on the housing side. This enables accurate positioning.

  As mentioned above, although an example of the modification of an electronic component mounting container was shown, this invention is not limited to the said embodiment, A various deformation | transformation is possible in the range of the technical thought.

DESCRIPTION OF SYMBOLS 1 electronic component mounting container 2 container main body 3 bottom part 4 trunk | drum 5 flange part 6 container side terminal 7 wiring 8 electronic components (example: LED)
9 container group 10 frame 11 circuit (first embodiment)
12 Circuit-side terminal 13 Window 14 Positioning projection 15 Positioning notch 20 Operation panel 21 Resin plate 22 Decorative film 23 Display icon equivalent location 24 Touch sensor 25 Wiring 26 Board 27 Through hole 28 Wiring circuit (for touch sensor)
29 Flexible Printed Circuit Board 31 Circuit for LED (Second Embodiment)
32 Circuit-side terminal 41 Electronic component mounting container (modification)

Claims (7)

An electronic component mounting structure in which the electronic component mounting container is mounted on a circuit board by electromagnetic induction heating,
A resin container having a bottom, a body standing upright from the bottom, and a flange projecting horizontally from an upper end of the body;
An electronic component provided at the bottom;
A pair of terminals provided on the flange portion;
Wiring provided to the body and extending to the bottom and connecting the electronic component and the terminal,
An electronic component mounting container in which the electronic component and the wiring are soldered together;
A circuit provided with a circuit side terminal,
And a circuit board on which the circuit is provided;
The circuit-side terminal and the terminal of the electronic component mounting container are connected by solder bonding,
The depth dimension of the said resin-made container is longer than the thickness dimension of the said circuit board, The electronic component mounting structure characterized by the above-mentioned . The circuit according to claim 1 is provided on the back surface of a resin housing,
The said resin-made cage | basket functions as said circuit board, The electronic component mounting structure characterized by the above-mentioned . A first electronic component, and a circuit for the first electronic component;
A substrate on which the first electronic component and the circuit for the first electronic component are provided;
A circuit for a second electronic component provided on the substrate;
A circuit side terminal provided in the circuit for the second electronic component;
The electronic component mounting container according to claim 1, wherein the second electronic component is mounted;
Equipped with
An electronic component mounting structure, wherein the circuit side terminal and the terminal of the electronic component mounting case are connected by solder bonding. Operation panel,
A touch sensor provided on the back of the operation panel for detecting an operation signal, a circuit for touch sensor,
A substrate on which the touch sensor and the circuit for touch sensor are provided;
An LED circuit provided on the substrate;
A circuit side terminal provided in the LED circuit;
The electronic component mounting container according to claim 1, wherein the LED component is mounted;
Equipped with
An electronic component mounting structure, wherein the circuit side terminal and the terminal of the electronic component mounting case are connected by solder bonding. Forming a container group consisting of a plurality of resin containers continuous in the vertical and horizontal directions;
Forming a wire and a terminal in the container group;
Connecting the wiring and the electronic component by solder bonding;
The method according to claim 1, further comprising the step of: cutting out each resin container from the container group. The electronic component mounting container according to claim 1, wherein the electronic component is soldered in advance.
Providing the circuit of claim 1;
Placing a solder on the circuit side terminal or the terminal on the electronic component mounting container side;
Positioning and positioning the electronic component mounting container;
And e. Connecting the circuit-side terminal and the terminal of the electronic component mounting container by electromagnetic induction heating. The electronic component mounting container according to claim 1, wherein a heat radiation hole is provided in the bottom portion.

Images