JP6459192B2 - Photosensitive resin composition - Google Patents

Description

  The present invention relates to a polymer and a photosensitive resin composition.

  As an insulating film constituting an electronic device, a resin film obtained by exposing a photosensitive resin composition may be used. As a technique regarding such a photosensitive resin composition, for example, the one described in Patent Document 1 can be mentioned. Patent Document 1 describes a positive photosensitive resin composition containing an alkali-soluble resin, a 1,2-quinonediazide compound, and a crosslinkable compound containing two or more epoxy groups. Patent Document 2 discloses a radiation-sensitive resin composition containing a copolymer containing a polymerized unit of an unsaturated carboxylic acid and a polymerized unit of a specific compound, a 1,2-quinonediazide compound, and a latent acid generator. Things are listed.

JP 2004-271767 A Japanese Patent Laid-Open No. 9-230596

  As described in Patent Document 2, for example, an acrylic polymer is used as the base polymer of the photosensitive resin composition for forming an interlayer insulating film. On the other hand, the present inventor examined the use of an alicyclic olefin-based polymer that is superior in heat resistance, insulation, low water absorption, and the like as a base polymer. However, especially when used in thick films, or when developing with a high concentration developer, due to the distortion to the coating that seems to be due to the rigidity and hydrophobicity derived from the alicyclic hydrocarbon skeleton, There is a concern that a dent (undercut) may occur at the lower end of the pattern formed on the resin film. Under such circumstances, development of a photosensitive resin composition that satisfies various properties required for a cured film such as an interlayer insulating film and has excellent undercut resistance is strongly desired.

According to the present invention, a structural unit represented by the following formula (1a), a structural unit represented by the following formula (1b), the polymer comprising a structural unit represented by the following formula (3), a in the main chain A photosensitive resin composition that is used to form a permanent film and that is a positive type is provided.
Similarly, according to the present invention, a structural unit represented by the following formula (1a), a structural unit represented by the following formula (1b), and a structural unit represented by the following formula (3) are included in the main chain. There is provided a photosensitive resin composition that is a negative type photosensitive resin composition that is used to form a permanent film including a polymer.

（式（３）中、Ｒ _９ は、水素または炭素数１〜１２の有機基である） In the above formula (1a), n is 0, 1 or 2. R ₁ , R ₂ , R ₃ and R ₄ are each independently hydrogen or an organic group having 1 to 10 carbon atoms, and at least one of them is an organic group containing a carboxyl group, an epoxy ring, or an oxetane ring. is there. In the above formula (1b), m is 0, 1 or 2. R ₅ , R ₆ , R ₇ and R ₈ are each independently hydrogen or an organic group having 1 to 10 carbon atoms, and at least one of them is an alkoxysilyl group.

(In formula (3), R ₉ is hydrogen or an organic group having 1 to 12 carbon atoms)

  According to the present invention, occurrence of undercut in the patterning process can be suppressed.

It is sectional drawing which shows an example of an electronic device.

  Hereinafter, embodiments will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

  The polymer (first polymer) according to the present embodiment includes a structural unit represented by the following formula (1a) and a structural unit represented by the following formula (1b).

In the above formula (1a), n is 0, 1 or 2. R ₁ , R ₂ , R ₃ and R ₄ are each independently hydrogen or an organic group having 1 to 10 carbon atoms, and at least one of them is an organic group containing a carboxyl group, an epoxy ring, or an oxetane ring. is there. In the above formula (1b), m is 0, 1 or 2. R ₅ , R ₆ , R ₇ and R ₈ are each independently hydrogen or an organic group having 1 to 10 carbon atoms, and at least one of them is an alkoxysilyl group.

The present inventor has eagerly investigated a new polymer capable of suppressing the occurrence of undercut in the patterning step for the photosensitive resin film, that is, capable of realizing a photosensitive resin composition having excellent undercut resistance. did. As a result, a first polymer containing the structural unit represented by the above formula (1a) and the structural unit represented by the above formula (1b) has been newly developed. By using such a first polymer, the adhesion between the photosensitive resin film and the substrate can be improved, and the occurrence of undercut in the development process can be suppressed. Therefore, according to the present embodiment, it is possible to suppress the occurrence of undercut in the patterning process.
Moreover, according to the present embodiment, it is possible to satisfy various characteristics required for a permanent film such as an interlayer insulating film while improving the undercut resistance as described above. Examples of such various properties include heat resistance, transparency, chemical solution resistance, and low dielectric constant. Furthermore, it becomes possible to contribute to the improvement of developability, resolution, and crack resistance.

  Hereinafter, the first polymer, the photosensitive resin composition, and the electronic device will be described in detail.

(First polymer)
First, the first polymer will be described.
As described above, the first polymer according to this embodiment is composed of a copolymer having a structural unit represented by the following formula (1a) and a structural unit represented by the following formula (1b).

In the above formula (1a), n is 0, 1 or 2. R ₁ , R ₂ , R ₃ and R ₄ are each independently hydrogen or an organic group having 1 to 10 carbon atoms, and at least one of them is an organic group containing a carboxyl group, an epoxy ring, or an oxetane ring. is there. In the above formula (1b), m is 0, 1 or 2. R ₅ , R ₆ , R ₇ and R ₈ are each independently hydrogen or an organic group having 1 to 10 carbon atoms, and at least one of them is an alkoxysilyl group.

As described above, the first polymer according to this embodiment comprises a norbornene-derived structural unit having an organic group containing a carboxyl group, an epoxy ring, or an oxetane ring, and a norbornene-derived structural unit having an alkoxysilyl group. Have. The present inventor has found that when the first polymer contains both of these structural units, the undercut resistance of the resin film formed using the photosensitive resin composition containing the first polymer can be improved. did. This is assumed to result from the fact that the balance of various properties such as sensitivity, curability, and adhesion to other members of the resin film formed using the photosensitive resin composition can be improved. . Therefore, according to the present embodiment, it is possible to suppress the occurrence of undercut in the patterning process.
Moreover, according to the 1st polymer which concerns on this embodiment, in addition to undercut resistance, it is calculated | required by the photosensitive resin composition used in order to form permanent films, such as chemical | medical solution tolerance, rework characteristics, and transparency. It is also possible to improve the characteristics.

When a plurality of structural units represented by the above formula (1a) are present in the first polymer, the structure of each structural unit represented by the above formula (1a) can be independently determined. When a plurality of structural units represented by the above formula (1b) are present in the first polymer, the structure of each structural unit represented by the above formula (1b) can be determined independently.
In the present embodiment, the molar ratio of the structural unit represented by the formula (1a) in the first polymer is not particularly limited, but is preferably 1 or more and 90 or less with respect to the entire first polymer. In addition, the molar ratio of the structural unit represented by the formula (1b) in the first polymer is not particularly limited, but is preferably 1 or more and 50 or less with respect to the entire first polymer.

In the above formula (1a), at least one of R ₁ , R ₂ , R ₃ and R _{4 is} a C 1-10 organic group having a carboxyl group, an epoxy ring, or an oxetane ring. In the present embodiment, from the viewpoint of effectively improving the balance between rework characteristics, stability over time, and solvent resistance, any one of R ₁ , R ₂ , R _3, and R ₄ is a carboxyl group, an epoxy ring. Or an organic group having 1 to 10 carbon atoms having an oxetane ring and the other being hydrogen.

In this embodiment, as the structural unit represented by the above formula (1a), at least one of R ₁ , R ₂ , R ₃ and R ₄ is an organic group containing a carboxyl group, R ₁ , R ₂ , At least one of R ₃ and R ₄ is an organic group containing an epoxy ring, or at least one of R ₁ , R ₂ , R ₃ and R ₄ is an organic group containing an oxetane ring It is particularly preferred to include more than one species in the first polymer. This makes it possible to more effectively improve the balance of rework characteristics, stability over time, and solvent resistance.

The organic group having 1 to 10 carbon atoms having a carboxyl group constituting R _{1, R} 2, _{R 3} and _{R 4,} examples thereof include organic groups represented by the following equation (5).

  In said formula (5), Z is a single bond or a C1-C9 bivalent organic group. The divalent organic group constituting Z is a linear or branched divalent hydrocarbon group which may have any one or more of oxygen, nitrogen and silicon. In the present embodiment, Z can be, for example, a single bond or an alkylene group having 1 to 9 carbon atoms. One or more hydrogen atoms in the organic group constituting Z may be substituted with a halogen atom such as fluorine, chlorine, bromine or iodine. As an organic group shown by the said Formula (5), what is shown by the following formula | equation (6) is mentioned as an example.

Examples of the organic group having 1 to 10 carbon atoms having an epoxy ring constituting R ₁ , R ₂ , R ₃ and R ₄ include an organic group represented by the following formula (4) and the following formula (7): And the organic groups shown.

In formula (4), Y ₁ is a divalent organic group having 4 to 8 carbon atoms. By including the structural unit represented by the formula (1a) having such an organic group, it is possible to improve the crack resistance of the resin film formed using the photosensitive resin composition containing the first polymer. It becomes. The divalent organic group constituting Y ₁ is a linear or branched divalent hydrocarbon group which may have any one kind or two or more kinds of oxygen, nitrogen and silicon. In the present embodiment, Y ₁ can be a linear or branched alkylene group having 4 to 8 carbon atoms, for example. From the viewpoint of improving the crack resistance, it is more preferable to employ a linear alkylene group as Y _1. One or more hydrogen atoms in the organic group constituting Y ₁ may be substituted with a halogen atom such as fluorine, chlorine, bromine or iodine. Examples of the organic group represented by the above formula (4) include those represented by the following formula (4a).
In the present embodiment, the first polymer includes, for example, a plurality of structural units represented by the above formula (1a), and at least some of the structural units represented by the above formula (1a) include R ₁ , R ₂ , A compound in which at least one of R ₃ and R ₄ is an organic group represented by the above formula (4) can be employed.

In the above formula (7), Y ₂ is a single bond or a divalent organic group having 1 or 2 carbon atoms. The divalent organic group constituting Y ₂ is a divalent hydrocarbon group that may have one or more of oxygen, nitrogen, and silicon. In the present embodiment, Y ₂ can be, for example, an alkylene group having 1 or 2 carbon atoms. One or more hydrogen atoms in the organic group constituting Y ₂ may be substituted with a halogen atom such as fluorine, chlorine, bromine or iodine. Examples of the organic group represented by the above formula (7) include those represented by the following formula (7a).

The R _{1, R} 2, an organic group having 1 to 10 carbon atoms having an oxetane ring constituting _{R 3} and _{R 4,} examples thereof include organic groups represented by the following equation (8).

In Formula (8), X ₁ is a single bond or a divalent organic group having 1 to 7 carbon atoms, and X ₂ is hydrogen or an alkyl group having 1 to 7 carbon atoms. The divalent organic group constituting X ₁ is a linear or branched divalent hydrocarbon group which may have any one kind or two or more kinds of oxygen, nitrogen and silicon. Among these, an amino group (—NR—), an amide bond (—NHC (═O) —), an ester bond (—C (═O) —O—), a carbonyl group (—C (═O) —) or an ether Those having at least one linking group such as a bond (—O—) in the main chain are more preferable, and those having at least one ester bond, carbonyl group or ether bond in the main chain as a linking group are particularly preferable. One or more hydrogen atoms in the organic group constituting X ₁ may be substituted with a halogen atom such as fluorine, chlorine, bromine or iodine. The alkyl group constituting X ₂ is, for example, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, pentyl group, neopentyl group, A hexyl group and a heptyl group are mentioned. One or more hydrogen atoms contained in the alkyl group constituting X ₂ may be substituted with a halogen atom such as fluorine, chlorine, bromine or iodine. Examples of the organic group represented by the above formula (8) include those represented by the following formula (8a) and those represented by the following formula (8b).

Examples of the organic group having 1 to 10 carbon atoms constituting R ₁ , R ₂ , R ₃ and R ₄ and having neither a carboxyl group, an epoxy ring nor an oxetane ring include an alkyl group, an alkenyl group and an alkynyl group. Groups, alkylidene groups, aryl groups, aralkyl groups, alkaryl groups, cycloalkyl groups, and heterocyclic groups other than epoxy groups and oxetane groups. As the alkyl group, for example, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, pentyl group, neopentyl group, hexyl group, heptyl group, An octyl group, a nonyl group, and a decyl group are mentioned. Examples of the alkenyl group include allyl group, pentenyl group, and vinyl group. An ethynyl group is mentioned as an alkynyl group. Examples of the alkylidene group include a methylidene group and an ethylidene group. Examples of the aryl group include a phenyl group and a naphthyl group. Examples of the aralkyl group include a benzyl group and a phenethyl group. Examples of the alkaryl group include a tolyl group and a xylyl group. Examples of the cycloalkyl group include an adamantyl group, a cyclopentyl group, a cyclohexyl group, and a cyclooctyl group. Note that these alkyl groups, alkenyl groups, alkynyl groups, alkylidene groups, aryl groups, aralkyl groups, alkaryl groups, cycloalkyl groups, and heterocyclic groups each have one or more hydrogen atoms such as fluorine, chlorine, bromine, or iodine. May be substituted by a halogen atom.

In the above formula (1b), at least one of R ₅ , R ₆ , R ₇ and R ₈ is an alkoxysilyl group. In the present embodiment, from the viewpoint of improving the undercut resistance more effectively, any one of R ₅ , R ₆ , R ₇ and R ₈ is an alkoxysilyl group, and the other is hydrogen. Particularly preferred.

More preferably, the alkoxysilyl group constituting R ₅ , R ₆ , R ₇ and R ₈ is, for example, a trialkoxysilyl group. Thereby, undercut-proof property can be improved more effectively. In this embodiment, as the trialkoxysilyl group constituting R ₅ , R ₆ , R ₇ and R ₈ , for example, those represented by the following formula (2) can be adopted.

In said formula (2), R < ₁₀ >, R < ₁₁ > and R < ₁₂ > are respectively independently a C1-C6 alkyl group. Examples of the alkyl group include a methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, pentyl group, neopentyl group, and hexyl group. . Examples of the organic group represented by the above formula (2) include those represented by the following formula (2a).

Examples of the organic group having 1 to 10 carbon atoms constituting R ₅ , R ₆ , R ₇ and R ₈ that are not alkoxysilyl groups include alkyl groups, alkenyl groups, alkynyl groups, alkylidene groups, aryl groups, aralkyls. Groups, alkaryl groups, cycloalkyl groups, and heterocyclic groups other than epoxy groups and oxetane groups. As the alkyl group, for example, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, pentyl group, neopentyl group, hexyl group, heptyl group, An octyl group, a nonyl group, and a decyl group are mentioned. Examples of the alkenyl group include allyl group, pentenyl group, and vinyl group. An ethynyl group is mentioned as an alkynyl group. Examples of the alkylidene group include a methylidene group and an ethylidene group. Examples of the aryl group include a phenyl group and a naphthyl group. Examples of the aralkyl group include a benzyl group and a phenethyl group. Examples of the alkaryl group include a tolyl group and a xylyl group. Examples of the cycloalkyl group include an adamantyl group, a cyclopentyl group, a cyclohexyl group, and a cyclooctyl group. Note that these alkyl groups, alkenyl groups, alkynyl groups, alkylidene groups, aryl groups, aralkyl groups, alkaryl groups, cycloalkyl groups, and heterocyclic groups each have one or more hydrogen atoms such as fluorine, chlorine, bromine, or iodine. May be substituted by a halogen atom.

  The first polymer can further include a structural unit represented by the following formula (3), for example. Thereby, the balance of the various characteristics calculated | required by the resin film as permanent films, such as heat resistance, transparency, a low dielectric constant, low birefringence, chemical resistance, and water repellency, can be improved. On the other hand, the first polymer may not include the structural unit represented by the following formula (3).

In the above formula (3), _{R 9} is hydrogen or an organic group having 1 to 12 carbon atoms. Examples of the organic group having 1 to 12 carbon atoms constituting R ₉ include an alkyl group, an alkenyl group, an alkynyl group, an alkylidene group, an aryl group, an aralkyl group, an alkaryl group, or a cycloalkyl group. A hydrocarbon group is mentioned. As the alkyl group, for example, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, pentyl group, neopentyl group, hexyl group, heptyl group, An octyl group, a nonyl group, and a decyl group are mentioned. Examples of the alkenyl group include allyl group, pentenyl group, and vinyl group. An ethynyl group is mentioned as an alkynyl group. Examples of the alkylidene group include a methylidene group and an ethylidene group. Examples of the aryl group include a phenyl group and a naphthyl group. Examples of the aralkyl group include a benzyl group and a phenethyl group. Examples of the alkaryl group include a tolyl group and a xylyl group. Examples of the cycloalkyl group include an adamantyl group, a cyclopentyl group, a cyclohexyl group, and a cyclooctyl group. One or more hydrogen atoms contained in R ₉ may be substituted with a halogen atom such as fluorine, chlorine, bromine or iodine.

In the present embodiment, as the first polymer, for example, a structural unit represented by the formula (3) in which R ₉ is hydrogen and a structure represented by the formula (3) in which R ₉ is an organic group having 1 to 12 carbon atoms. A unit including the unit can be adopted. Such a first polymer includes, for example, a structural unit represented by the following formula (1a), a structural unit represented by the following formula (1b), a structural unit represented by the following formula (3a), and the following formula ( It includes the structural unit represented by 3b). R ₉ in the following formula (3b) is exemplified in the formula (3) as an organic group having 1 to 12 carbon atoms.

  The first polymer can further include, for example, a structural unit represented by the following formula (9). Thereby, the crack resistance of the resin film formed using the photosensitive resin composition containing a 1st polymer can be improved more effectively. On the other hand, the first polymer may not include the structural unit represented by the following formula (9).

In the above formula _{(9), R 13} and _{R 14} are each independently an alkyl group having 1 to 10 carbon atoms. As the alkyl group, for example, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, tert-butyl group, pentyl group, neopentyl group, hexyl group, heptyl group, An octyl group, a nonyl group, and a decyl group are mentioned. In this embodiment, from the viewpoint of improving crack resistance, it is particularly preferable that R ₁₃ and R ₁₄ are each independently an alkyl group having 3 to 10 carbon atoms.

  In the present embodiment, the structural unit represented by the above formula (9) can be derived from, for example, a fumaric acid diester monomer. That is, the first polymer including a structural unit composed of a carboxylic acid ester bonded to the main chain can be realized without using maleic anhydride. For this reason, the first polymer can be free of a structural unit having an anhydride ring derived from maleic anhydride. Thereby, the rework characteristic of a resin film formed using a photosensitive resin composition, chemical | medical solution tolerance, and transparency can be improved more effectively.

  The first polymer has a structural unit represented by the above formula (1a), a structural unit represented by the above formula (1b), a structural unit represented by the above formula (3), as long as the effects of the present invention are not impaired. In addition, other structural units other than the structural unit represented by the above formula (9) may be included.

  The first polymer includes, for example, a monomer represented by the following formula (10), a monomer represented by the following formula (11), a monomer represented by the following formula (12), and a monomer represented by the following formula (13) as the low molecular weight component. One kind or two or more kinds may be contained.

（式（１０）中、ｎ、Ｒ_１、Ｒ_２、Ｒ_３およびＲ_４は、上記式（１ａ）において例示したものとすることができる）

(In formula (10), n, R ₁ , R ₂ , R ₃ and R ₄ can be exemplified in the above formula (1a)).

（式（１１）中、ｍ、Ｒ_５、Ｒ_６、Ｒ_７およびＲ_８は、上記式（１ｂ）において例示したものとすることができる）

(In formula (11), m, R ₅ , R ₆ , R ₇ and R ₈ can be exemplified in the above formula (1b)).

（式（１２）中、Ｒ_９は、上記式（３）において例示したものとすることができる）

(In Formula (12), R ₉ can be exemplified in Formula (3) above)

（式（１２）中、Ｒ_１３およびＲ_１４は、上記式（９）において例示したものとすることができる）

(In formula (12), R ₁₃ and R ₁₄ may be those exemplified in the above formula (9))

The first polymer can be synthesized, for example, as follows.
First, a compound represented by the above formula (10) and a compound represented by the above formula (11) are prepared. Moreover, you may prepare 1 type, or 2 or more types of the compound shown by the said Formula (12), the compound shown by the said Formula (13), and another compound as needed. In this embodiment, for example, a synthesis method that does not use maleic anhydride can be adopted as a monomer for synthesizing the first polymer. Thereby, a 1st polymer can be made into the thing which does not contain the structural unit which has an anhydride ring derived from maleic anhydride.

Next, the compound represented by the above formula (10) and the compound represented by the above formula (11) are subjected to addition polymerization to obtain a copolymer (copolymer 1). Here, addition polymerization is performed by radical polymerization, for example. In this embodiment, for example, a compound represented by the above formula (10), a compound represented by the above formula (11), and a polymerization initiator are dissolved in a solvent and then heated for a predetermined time to perform solution polymerization. It can be carried out. At this time, the heating temperature can be, for example, 50 ° C. to 80 ° C. Further, the heating time can be, for example, 1 hour to 20 hours. It is more preferable to perform solution polymerization after removing dissolved oxygen in the solvent by nitrogen bubbling.
Moreover, a molecular weight modifier and a chain transfer agent can be used as needed. Examples of the chain transfer agent include thiol compounds such as dodecyl mercaptan, mercaptoethanol, and 4,4-bis (trifluoromethyl) -4-hydroxy-1-mercaptobutane. These chain transfer agents may be used individually by 1 type, and may be used in combination of 2 or more type.

  As the solvent used in the solution polymerization, for example, one or more of methyl ethyl ketone (MEK), propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, diethyl ether, tetrahydrofuran (THF), and toluene can be used. As the polymerization initiator, one or more of azo compounds and organic peroxides can be used. Examples of the azo compound include azobisisobutyronitrile (AIBN), dimethyl 2,2′-azobis (2-methylpropionate), and 1,1′-azobis (cyclohexanecarbonitrile) (ABCN). Examples of the organic peroxide include hydrogen peroxide, ditertiary butyl peroxide (DTBP), benzoyl peroxide (benzoyl peroxide (BPO)), and methyl ethyl ketone peroxide (MEKP).

  The reaction liquid containing the copolymer 1 thus obtained is added to hexane or methanol to precipitate a polymer. Next, the polymer is collected by filtration, washed with hexane or methanol, and then dried. In the present embodiment, for example, the first polymer can be synthesized in this way.

(Photosensitive resin composition)
The photosensitive resin composition is used for forming a permanent film.
The permanent film is composed of a resin film obtained by curing the photosensitive resin composition. In this embodiment, for example, after a coating film composed of a photosensitive resin composition is patterned into a desired shape by exposure and development, a permanent film is formed by curing the coating film by heat treatment or the like.

Examples of the permanent film formed using the photosensitive resin composition include an interlayer film, a surface protective film, and a dam material. The permanent film can also be used as an optical material such as an optical lens. The application of the permanent film is not limited to these.
The interlayer film refers to an insulating film provided in a multilayer structure, and the kind thereof is not particularly limited. Examples of the interlayer film include those used in semiconductor device applications such as an interlayer insulating film constituting a multilayer wiring structure of a semiconductor element, a buildup layer or a core layer constituting a circuit board. Further, as the interlayer film, for example, a flattening film that covers a thin film transistor (TFT) in the display device, a liquid crystal alignment film, and a protrusion provided on a color filter substrate of an MVA (Multi Domain Vertical Alignment) type liquid crystal display device Or what is used in display apparatus uses, such as a partition for forming the cathode of an organic EL element, is also mentioned.
The surface protective film refers to an insulating film that is formed on the surface of an electronic component or an electronic device and protects the surface, and the type thereof is not particularly limited. Examples of such a surface protective film include a passivation film provided on a semiconductor element, a bump protective film or a buffer coat layer, or a cover coat provided on a flexible substrate. The dam material is a spacer used to form a hollow portion for arranging an optical element or the like on the substrate.

  The photosensitive resin composition contains a first polymer.

  As the first polymer, those exemplified above can be used. The photosensitive resin composition according to the present embodiment can include one or more of the first polymers exemplified above. Although content of the 1st polymer in the photosensitive resin composition is not specifically limited, It is preferable that it is 20 to 90 mass% with respect to the whole solid content of the photosensitive resin composition, and is 30 mass% or more. More preferably, it is 80 mass% or less. In addition, solid content of the photosensitive resin composition refers to the component except the solvent contained in the photosensitive resin composition. The same applies hereinafter.

The photosensitive resin composition can contain a photosensitive agent, for example.
As a photosensitizer, it can have a diazoquinone compound, for example. Examples of the diazoquinone compound used as the photosensitizer include those exemplified below.

（ｎ２は、１以上５以下の整数である）

(N2 is an integer from 1 to 5)

  In each of the above compounds, Q is any one of the structures (a), (b) and (c) shown below, or a hydrogen atom. However, at least one of Q contained in each compound is any one of the structure (a), the structure (b), and the structure (c). From the viewpoint of the transparency and dielectric constant of the photosensitive resin composition, an o-naphthoquinonediazidesulfonic acid derivative in which Q is the structure (a) or the structure (b) is more preferable.

  The content of the photosensitive agent in the photosensitive resin composition is preferably 1% by mass or more and 40% by mass or less, and preferably 5% by mass or more and 30% by mass or less with respect to the entire solid content of the photosensitive resin composition. It is more preferable. Thereby, it is possible to effectively improve the balance between reactivity, rework characteristics, and developability in the photosensitive resin composition.

  The photosensitive resin composition can contain, for example, an acid generator that generates an acid by light or heat. Examples of the photoacid generator that generates an acid by light include triphenylsulfonium trifluoromethanesulfonate, tris (4-t-butylphenyl) sulfonium-trifluoromethanesulfonate, diphenyl [4- (phenylthio) phenyl] sulfoniumtetrakis (penta Sulfonium salts such as fluorophenyl) borate, diazonium salts such as p-nitrophenyldiazonium hexafluorophosphate, ammonium salts, phosphonium salts, diphenyliodonium trifluoromethanesulfonate, iodonium salts such as (triccumyl) iodonium-tetrakis (pentafluorophenyl) borate , Quinonediazides, diazomethanes such as bis (phenylsulfonyl) diazomethane, 1-phenyl-1 (4-Methylphenyl) sulfonyloxy-1-benzoylmethane, sulfonic acid esters such as N-hydroxynaphthalimide-trifluoromethanesulfonate, disulfones such as diphenyldisulfone, tris (2,4,6-trichloromethyl)- Compounds such as triazines such as s-triazine and 2- (3,4-methylenedioxyphenyl) -4,6-bis- (trichloromethyl) -s-triazine can be included. The photosensitive resin composition in the present embodiment can also contain one or more of the photoacid generators exemplified above.

  As an acid generator (thermal acid generator) which generates an acid by heat, for example, SI-45L, SI-60L, SI-80L, SI-100L, SI-110L, SI-150L (Sanshin Chemical Industry Co., Ltd.) And an aromatic sulfonium salt. The photosensitive resin composition in the present embodiment may contain one or more of the thermal acid generators exemplified above. In the present embodiment, the photo acid generator exemplified above and these thermal acid generators can be used in combination.

  The content of the acid generator in the photosensitive resin composition is preferably 0.1% by mass or more and 15% by mass or less, and preferably 0.5% by mass or more and 10% by mass or less with respect to the entire solid content of the photosensitive resin composition. It is more preferable that the amount is not more than mass%. Thereby, it is possible to effectively improve the balance between reactivity, rework characteristics, and developability in the photosensitive resin composition.

  The photosensitive resin composition may contain a crosslinking agent. Thereby, sclerosis | hardenability can be improved and it can contribute to the mechanical characteristic of a cured film. The cross-linking agent preferably includes, for example, a compound having a hetero ring as a reactive group, and particularly preferably includes a compound having a glycidyl group or an oxetanyl group. Among these, it is more preferable to include a compound having a glycidyl group from the viewpoint of reactivity with a functional group having active hydrogen such as a carboxyl group or a hydroxyl group.

  An example of the compound having a glycidyl group used as a crosslinking agent is an epoxy compound. Examples of the epoxy compound include n-butyl glycidyl ether, 2-ethoxyhexyl glycidyl ether, phenyl glycidyl ether, allyl glycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, neopentyl glycol diglycidyl ether, glycerol polyglycidyl ether. Glycidyl ether such as sorbitol polyglycidyl ether, glycidyl ether of bisphenol A (or F), glycidyl ester such as adipic acid diglycidyl ester, o-phthalic acid diglycidyl ester, 3,4-epoxycyclohexylmethyl (3,4) -Epoxycyclohexane) carboxylate, 3,4-epoxy-6-methylcyclohexylmethyl (3,4-epoxy) -6-methylcyclohexane) carboxylate, bis (3,4-epoxy-6-methylcyclohexylmethyl) adipate, dicyclopentanediene oxide, bis (2,3-epoxycyclopentyl) ether, and Celoxide manufactured by Daicel Corporation 2021, celoxide 2081, ceroxide 2083, celoxide 2085, celoxide 8000, epoxide GT401, and the like, 2,2 '-((((1- (4- (2- (4- (oxiran-2-ylmethoxy) Phenyl) propan-2-yl) phenyl) ethane-1,1-diyl) bis (4,1-phenylene)) bis (oxy)) bis (methylene)) bis (oxirane) (eg Techmore VG3101L, Inc.) Printec)), Epolite Aliphatic polyglycidyl ethers such as 00MF (manufactured by Kyoeisha Chemical Industry Co., Ltd.), Epiol TMP (manufactured by NOF Corporation), 1,1,3,3,5,5-hexamethyl-1,5-bis (3 -(Oxiran-2-ylmethoxy) propyl) tri-siloxane (for example, DMS-E09 (manufactured by Gerest)) or the like can be used.

In addition, bisphenols such as LX-01 (manufactured by Daiso Corporation), jER1001, 1002, 1003, 1004, 1007, 1009, 1010, and 828 (trade names; manufactured by Mitsubishi Chemical Corporation) A type epoxy resin, bisphenol F type epoxy resin such as jER807 (trade name; manufactured by Mitsubishi Chemical Corporation), jER152, 154 (trade name; manufactured by Mitsubishi Chemical Corporation), EPPN201, 202 (trade name; Japan) Phenolic novolak type epoxy resins such as EOCN102, 103S, 104S, 1020, 1025, 1027 (trade name; manufactured by Nippon Kayaku Co., Ltd.), jER157S70 (trade name; Mitsubishi Chemical Corporation) Cresol novolac type epoxy resin, Araldite CY179, 184 (trade name; Hunts) Advanced Materials, Inc.), ERL-4206, 4221, 4234, 4299 (trade name; manufactured by Dow Chemical Co.), Epicron 200, 400 (trade name; manufactured by DIC Corporation), jER871, 872 (trade name; Cyclic aliphatic epoxy resin such as Mitsubishi Chemical Co., Ltd., Poly [(2-oxylanyl) -1,2-cyclohexanediol] 2-ethyl-2- (hydroxymethyl) -1,3-propaneether (3: 1) Polyfunctional alicyclic epoxy resins such as EHPE-3150 (manufactured by Daicel Corporation) can also be used.
In addition, the photosensitive resin composition in this embodiment can contain 1 type, or 2 or more types of the epoxy compound illustrated above.

  Examples of the compound having an oxetanyl group used as a crosslinking agent include 1,4-bis {[(3-ethyl-3-oxetanyl) methoxy] methyl} benzene, bis [1-ethyl (3-oxetanyl)] methyl ether, 4 , 4′-bis [(3-ethyl-3-oxetanyl) methoxymethyl] biphenyl, 4,4′-bis (3-ethyl-3-oxetanylmethoxy) biphenyl, ethylene glycol bis (3-ethyl-3-oxetanylmethyl) ) Ether, diethylene glycol bis (3-ethyl-3-oxetanylmethyl) ether, bis (3-ethyl-3-oxetanylmethyl) diphenate, trimethylolpropane tris (3-ethyl-3-oxetanylmethyl) ether, pentaerythritol tetrakis ( 3-ethyl-3-oki Tanylmethyl) ether, poly [[3-[(3-ethyl-3-oxetanyl) methoxy] propyl] silasesquioxane] derivatives, oxetanyl silicate, phenol novolac oxetane, 1,3-bis [(3-ethyloxetane-3 -Yl) methoxy] benzene and the like, but are not limited thereto. These may be used alone or in combination.

  In the present embodiment, the content of the crosslinking agent in the photosensitive resin composition is preferably 1% by mass or more, more preferably 5% by mass or more based on the entire solid content of the photosensitive resin composition. preferable. On the other hand, the content of the crosslinking agent in the photosensitive resin composition is preferably 50% by mass or less and more preferably 40% by mass or less with respect to the entire solid content of the photosensitive resin composition. By adjusting the content of the cross-linking agent to such a range, it is possible to more effectively improve the balance between reactivity and stability over time in the photosensitive resin composition.

The photosensitive resin composition may contain an adhesion assistant. The adhesion aid is not particularly limited, but may include, for example, a silane coupling agent such as amino silane, epoxy silane, acrylic silane, mercapto silane, vinyl silane, ureido silane, or sulfide silane. These may be used alone or in combination of two or more. Among these, it is more preferable to use epoxysilane from the viewpoint of effectively improving the adhesion to other members.
Examples of aminosilanes include bis (2-hydroxyethyl) -3-aminopropyltriethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropylmethyldiethoxysilane, and γ-aminopropyl. Methyldimethoxysilane, N-β (aminoethyl) γ-aminopropyltrimethoxysilane, N-β (aminoethyl) γ-aminopropyltriethoxysilane, N-β (aminoethyl) γ-aminopropylmethyldimethoxysilane, N -Β (aminoethyl) γ-aminopropylmethyldiethoxysilane and N-phenyl-γ-amino-propyltrimethoxysilane. Examples of the epoxy silane include γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, and β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane. Examples of the acrylic silane include γ- (methacryloxypropyl) trimethoxysilane, γ- (methacryloxypropyl) methyldimethoxysilane, and γ- (methacryloxypropyl) methyldiethoxysilane. Examples of mercaptosilane include γ-mercaptopropyltrimethoxysilane. Examples of the vinyl silane include vinyl tris (β methoxyethoxy) silane, vinyl triethoxy silane, and vinyl trimethoxy silane. Examples of ureidosilane include 3-ureidopropyltriethoxysilane. Examples of the sulfide silane include bis (3- (triethoxysilyl) propyl) disulfide and bis (3- (triethoxysilyl) propyl) tetrasulfide.

  In the present embodiment, the content of the adhesion assistant in the photosensitive resin composition is preferably 0.1% by mass or more, and 0.5% by mass or more with respect to the entire solid content of the photosensitive resin composition. It is more preferable that On the other hand, the content of the adhesion assistant in the photosensitive resin composition is preferably 20% by mass or less and more preferably 15% by mass or less with respect to the entire solid content of the photosensitive resin composition. . By adjusting the content of the adhesion aid to such a range, the adhesion of the cured film formed using the photosensitive resin composition to other members can be more effectively improved.

  The photosensitive resin composition may contain a surfactant. The surfactant includes, for example, a compound containing a fluorine group (for example, a fluorinated alkyl group) or a silanol group, or a compound having a siloxane bond as a main skeleton. In this embodiment, it is more preferable to use a surfactant containing a fluorosurfactant or a silicone surfactant, and it is particularly preferable to use a fluorosurfactant. Examples of the surfactant include Megafac F-554, F-556, and F-557 manufactured by DIC Corporation, but are not limited thereto.

  In the present embodiment, the content of the surfactant in the photosensitive resin composition is preferably 0.1% by mass or more, and 0.2% by mass or more with respect to the entire solid content of the photosensitive resin composition. It is more preferable that On the other hand, the content of the surfactant in the photosensitive resin composition is preferably 3% by mass or less and more preferably 2% by mass or less with respect to the entire solid content of the photosensitive resin composition. . By adjusting the content of the surfactant to such a range, the flatness of the photosensitive resin composition can be effectively improved. In addition, it is possible to prevent the occurrence of radial striations on the coating film during spin coating.

  In addition, you may add additives, such as antioxidant, a filler, and a sensitizer, in the photosensitive resin composition as needed. The antioxidant can include, for example, one or more selected from the group of phenolic antioxidants, phosphorus antioxidants, and thioether antioxidants. The filler can contain 1 type, or 2 or more types selected from inorganic fillers, such as a silica, for example. The sensitizer is selected from the group of, for example, anthracene, xanthone, anthraquinone, phenanthrene, chrysene, benzpyrene, fluoracene, rubrene, pyrene, indanthrine and thioxanthen-9-ones 1 type, or 2 or more types can be included.

  The photosensitive resin composition may contain a solvent. In this case, the photosensitive resin composition is varnished. Examples of the solvent include propylene glycol monomethyl ether (PGME), propylene glycol monomethyl ether acetate (PGMEA), ethyl lactate, methyl isobutyl carbinol (MIBC), gamma butyrolactone (GBL), N-methylpyrrolidone (NMP), methyl n-amyl ketone. One or more of (MAK), diethylene glycol monomethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, and benzyl alcohol can be included. In addition, the solvent which can be used in this embodiment is not limited to these.

The photosensitive resin composition according to the present embodiment can be, for example, a positive type. Thereby, when patterning the resin film formed using the photosensitive resin composition by lithography, it is possible to further facilitate the formation of a fine pattern. It is also possible to contribute to the reduction of the dielectric constant of the resin film. In addition, as compared with a negative photosensitive resin composition to be described later, PEB (Post Exposure Bake) treatment is not necessary when performing lithography, and thus the number of steps can be reduced.
When the photosensitive resin composition is a positive type, the photosensitive resin composition includes, for example, a first polymer and a photosensitive agent. Moreover, the positive photosensitive resin composition can also contain an acid generator with a 1st polymer and a photosensitive agent, for example. Thereby, the sclerosis | hardenability of the photosensitive resin composition can be improved more effectively. The positive photosensitive resin composition can further contain components other than the first polymer, the photosensitive agent, and the acid generator exemplified above.

  Patterning of a resin film formed using a positive photosensitive resin composition can be performed, for example, as follows. First, the exposure process is performed with respect to the resin film obtained by prebaking the coating film of the photosensitive resin composition. Next, the exposed resin film is developed with a developer and then rinsed with pure water. As a result, a resin film on which a pattern is formed is obtained.

  The photosensitive resin composition according to the present embodiment can be, for example, a negative type. Thereby, transparency and chemical | medical solution tolerance of the resin film formed using the photosensitive resin composition can be improved more effectively. When the photosensitive resin composition is a negative type, the photosensitive resin composition includes, for example, a first polymer and a photoacid generator. On the other hand, the negative photosensitive resin composition does not contain a photosensitizer. In addition, the negative photosensitive resin composition can further contain each component other than the first polymer, the photoacid generator, and the photosensitizer exemplified above.

  Patterning of a resin film formed using a negative photosensitive resin composition can be performed, for example, as follows. First, the exposure process is performed with respect to the resin film obtained by prebaking the coating film of the photosensitive resin composition. Next, a PEB (Post Exposure Bake) process is performed on the exposed resin film. Thereby, the crosslinking reaction of a 1st polymer can be accelerated | stimulated and insolubilization of an irradiation part can be advanced. In addition, although the conditions of PEB are not specifically limited, For example, it can be 100-150 degreeC and 120 second. Next, the resin film that has been subjected to the PEB treatment is developed using a developer, and then rinsed with pure water. As a result, a resin film on which a pattern is formed is obtained.

  The photosensitive resin composition as described above preferably has the physical properties described below. These physical properties can be realized by appropriately adjusting the type and content of each component contained in the photosensitive resin composition.

(1) Residual film ratio It is preferable that the photosensitive resin composition has, for example, a residual film ratio after development of 80% or more. In addition, the photosensitive resin composition preferably has a remaining film ratio after post-baking of 70% or more, for example. Thereby, a pattern having a desired shape can be realized with very high accuracy. The upper limit values of the remaining film ratio after development and the remaining film ratio after post-baking are not particularly limited, but can be, for example, 99%.
The measurement of the remaining film rate can be performed as follows, for example. First, the photosensitive resin composition is spin-coated on a glass substrate and heated on a hot plate at 100 ° C. for 120 seconds, and the resulting resin film is designated as thin film A. Next, using an exposure apparatus, exposure is performed with an optimum exposure amount so that the width of the 5 μm line and the space becomes 1: 1. When the photosensitive resin composition is a negative type, the exposed thin film A is baked on a hot plate at 100 to 150 ° C. for 120 seconds. Next, the thin film A is developed using a developer at 23 ° C. for 90 seconds to obtain the thin film B. Next, the entire surface of the thin film B is exposed by g + h + i line at 300 mJ / cm ² , and then post-baked by heating in an oven at 230 ° C. for 60 minutes. And from the film thicknesses of the measured thin film A, thin film B, and thin film C, the remaining film ratio is calculated from the following equation.
Residual film ratio after development (%) = [film thickness of thin film B (μm) / film thickness of thin film A (μm)] × 100
Residual film ratio after baking (%) = [film thickness of thin film C (μm) / film thickness of thin film A (μm)] × 100

(2) Relative dielectric constant The relative dielectric constant of the resin film formed using the photosensitive resin composition is preferably 5.0 or less, for example. The lower limit value of the relative dielectric constant is not particularly limited, but can be set to 1, for example.
In the positive photosensitive resin composition, the relative dielectric constant can be measured, for example, as follows. First, the photosensitive resin composition is spin-coated on an aluminum substrate and baked on a hot plate at 100 ° C. for 120 seconds to obtain a resin film. Next, the entire surface is exposed by g + h + i line at 300 mJ / cm ² and then post-baked by heating in an oven at 230 ° C. for 60 minutes to form a film having a thickness of 3 μm. Thereafter, a gold electrode is formed on this film, and the relative dielectric constant is measured using an LCR meter under conditions of room temperature (25 ° C.) and 10 kHz.
In the negative photosensitive resin composition, the relative dielectric constant can be measured, for example, as follows. First, the photosensitive resin composition is spin-coated on an aluminum substrate and baked on a hot plate at 100 ° C. for 120 seconds to obtain a resin film. Next, the entire surface of the resin film is exposed with g + h + i lines at 300 mJ / cm ² . Next, the resin film after exposure is baked on a hot plate at 100 to 150 ° C. for 120 seconds. Next, post baking is performed by heating in an oven at 230 ° C. for 60 minutes to form a film having a thickness of 3 μm. Thereafter, a gold electrode is formed on this film, and the relative dielectric constant is measured using an LCR meter under conditions of room temperature (25 ° C.) and 10 kHz.

(3) Transmittance The transmittance of a resin film formed using the photosensitive resin composition at a light wavelength of 400 nm is preferably 80% or more, for example. The upper limit of the transmittance is not particularly limited, but can be 99.9%, for example.
In the positive photosensitive resin composition, the transmittance can be measured, for example, as follows. First, the photosensitive resin composition is spin-coated on a glass substrate and baked on a hot plate at 100 ° C. for 120 seconds to obtain a resin film. Next, the resin film is immersed in a developing solution for 90 seconds and then rinsed with pure water. Next, the entire surface of the resin film is exposed by g + h + i line at 300 mJ / cm ² and then post-baked by heating in an oven at 230 ° C. for 60 minutes. And the transmittance | permeability in wavelength 400nm of light about this resin film is measured using an ultraviolet-visible light spectrophotometer, and let the numerical value converted into the film thickness of 3 micrometers be the transmittance | permeability.
In the negative photosensitive resin composition, the transmittance can be measured, for example, as follows. First, the photosensitive resin composition is spin-coated on a glass substrate and baked on a hot plate at 100 ° C. for 120 seconds to obtain a resin film. Next, the entire surface of the resin film is exposed with g + h + i lines at 300 mJ / cm ² . Next, the resin film after exposure is baked on a hot plate at 100 to 150 ° C. for 120 seconds. Next, the resin film is immersed in a developing solution for 90 seconds and then rinsed with pure water. Next, post baking is performed by heating in an oven at 230 ° C. for 60 minutes. And the transmittance | permeability in wavelength 400nm of light about this resin film is measured using an ultraviolet-visible light spectrophotometer, and let the numerical value converted into the film thickness of 3 micrometers be the transmittance | permeability.

(4) Swelling rate and recovering rate The swelling rate of the photosensitive resin composition is preferably 20% or less, for example. Moreover, it is preferable that the recovery rate of the photosensitive resin composition is 95% or more and 105% or less, for example. Thereby, the photosensitive resin composition which has the outstanding chemical | medical solution tolerance is implement | achieved. In addition, the lower limit value of the swelling rate is not particularly limited, but may be 0%, for example.
In the positive photosensitive resin composition, the swelling rate and the recovery rate can be measured, for example, as follows. First, a photosensitive resin composition is spin-coated on a glass substrate, and prebaked using a hot plate at 100 ° C. for 120 seconds to obtain a resin film. Next, the resin film is immersed in a developer for 90 seconds, and then rinsed with pure water. Next, the entire surface of the resin film is exposed with g + h + i lines so that the integrated light amount is 300 mJ / cm ² . Next, thermosetting treatment is performed on the resin film in an oven at 230 ° C. for 60 minutes. Subsequently, the film thickness (1st film thickness) of the cured film obtained by this is measured. Next, the cured film is immersed in TOK106 (manufactured by Tokyo Ohka Kogyo Co., Ltd.) at 70 ° C. for 15 minutes, and then rinsed with pure water for 30 seconds. At this time, the swelling ratio is calculated from the following equation, with the film thickness after rinsing of the cured film as the second film thickness.
Swelling ratio: [(second film thickness-first film thickness) / (first film thickness)] × 100 (%)
Next, the cured film is heated in an oven at 230 ° C. for 15 minutes, and the film thickness after heating (third film thickness) is measured. Then, the recovery rate is calculated from the following equation.
Recovery rate: [(third film thickness) / (first film thickness)] × 100 (%)
In the negative photosensitive resin composition, the swelling ratio and the recovery ratio can be measured, for example, as follows. First, a photosensitive resin composition is spin-coated on a glass substrate, and prebaked using a hot plate at 100 ° C. for 120 seconds to obtain a resin film. Next, the entire surface of the resin film is exposed with g + h + i lines so that the integrated light amount is 300 mJ / cm ² . Next, the resin film after exposure is further baked on a hot plate at 100 to 150 ° C. for 120 seconds. Next, the resin film is immersed in a developer for 90 seconds, and then rinsed with pure water. Next, thermosetting treatment is performed on the resin film in an oven at 230 ° C. for 60 minutes. Subsequently, the film thickness (1st film thickness) of the cured film obtained by this is measured. Next, the cured film is immersed in TOK106 (manufactured by Tokyo Ohka Kogyo Co., Ltd.) at 70 ° C. for 15 minutes, and then rinsed with pure water for 30 seconds. At this time, the swelling ratio is calculated from the following equation, with the film thickness after rinsing of the cured film as the second film thickness.
Swelling ratio: [(second film thickness-first film thickness) / (first film thickness)] × 100 (%)
Next, the cured film is heated in an oven at 230 ° C. for 15 minutes, and the film thickness after heating (third film thickness) is measured. Then, the recovery rate is calculated from the following equation.
Recovery rate: [(third film thickness) / (first film thickness)] × 100 (%)

(5) the sensitivity of the sensitive photosensitive resin composition, for example, it is preferable that the 200 mJ / cm ² or more 600 mJ / cm ² or less. Thereby, the photosensitive resin composition which has the outstanding lithography performance is realizable.
For the positive photosensitive resin composition, the sensitivity can be measured, for example, as follows. First, the photosensitive resin composition is spin-coated on a glass substrate and baked on a hot plate at 100 ° C. for 120 seconds to obtain a thin film having a thickness of about 3.5 μm. The thin film is exposed using a 5 μm hole pattern mask using an exposure apparatus. Next, the resist pattern formed by developing for 90 seconds at 23 ° C. using a developer is observed by SEM, and the exposure amount when a 5 μm square hole pattern is obtained is defined as sensitivity.
Moreover, in a negative photosensitive resin composition, a sensitivity can be measured as follows, for example. First, the obtained photosensitive resin composition is spin-coated on a glass substrate and baked on a hot plate at 100 ° C. for 120 seconds to obtain a thin film A having a thickness of about 3.5 μm. The thin film A is exposed by varying the exposure amount by 20 mJ / cm ² using an exposure apparatus. As an exposure apparatus, for example, a g + h + i-line mask aligner (PLA-501F) manufactured by Canon Inc. can be used. Next, the exposed thin film A is baked on a hot plate at 100 to 150 ° C. for 120 seconds. Next, development is performed at 23 ° C. for 90 seconds using a developer, and pure water rinsing is performed to obtain a thin film B. The exposure amount at which thin film B / thin film A × 100 = 95% is defined as sensitivity (mJ / cm ² ).

(Electronic device)
Next, the electronic device 100 according to the present embodiment will be described.
The electronic device 100 includes an insulating film 20 that is a permanent film formed of, for example, the above-described photosensitive resin composition. The electronic device 100 according to the present embodiment is not particularly limited as long as it includes an insulating film formed of a photosensitive resin composition. For example, a display device having the insulating film 20 as a planarizing film or a microlens, or an insulating device Examples thereof include a semiconductor device having a multilayer wiring structure using the film 20 as an interlayer insulating film.

FIG. 1 is a cross-sectional view illustrating an example of the electronic device 100.
FIG. 1 illustrates the case where the electronic device 100 is a liquid crystal display device and the insulating film 20 is used as a planarization film. An electronic device 100 illustrated in FIG. 1 is provided on, for example, a substrate 10, a transistor 30 provided on the substrate 10, an insulating film 20 provided on the substrate 10 so as to cover the transistor 30, and the insulating film 20. Wiring 40.

  The substrate 10 is, for example, a glass substrate. The transistor 30 is a thin film transistor that constitutes a switching element of a liquid crystal display device, for example. On the substrate 10, for example, a plurality of transistors 30 are arranged in an array. The transistor 30 shown in FIG. 1 includes, for example, a gate electrode 31, a source electrode 32, a drain electrode 33, a gate insulating film 34, and a semiconductor layer 35. The gate electrode 31 is provided on the substrate 10, for example. The gate insulating film 34 is provided on the substrate 10 so as to cover the gate electrode 31. The semiconductor layer 35 is provided on the gate insulating film 34. The semiconductor layer 35 is, for example, a silicon layer. The source electrode 32 is provided on the substrate 10 so that a part thereof is in contact with the semiconductor layer 35. The drain electrode 33 is provided on the substrate 10 so as to be separated from the source electrode 32 and partially in contact with the semiconductor layer 35.

The insulating film 20 functions as a planarization film for eliminating a step due to the transistor 30 and the like and forming a flat surface on the substrate 10. Moreover, the insulating film 20 is comprised with the hardened | cured material of the above-mentioned photosensitive resin composition. The insulating film 20 is provided with an opening 22 that penetrates the insulating film 20 so as to be connected to the drain electrode 33.
A wiring 40 connected to the drain electrode 33 is formed on the insulating film 20 and in the opening 22. The wiring 40 functions as a pixel electrode that constitutes a pixel together with the liquid crystal.
An alignment film 90 is provided on the insulating film 20 so as to cover the wiring 40.

A counter substrate 12 is disposed above one surface of the substrate 10 where the transistor 30 is provided so as to face the substrate 10. A wiring 42 is provided on one surface of the counter substrate 12 facing the substrate 10. The wiring 42 is provided at a position facing the wiring 40. An alignment film 92 is provided on the one surface of the counter substrate 12 so as to cover the wiring 42.
The liquid crystal constituting the liquid crystal layer 14 is filled between the substrate 10 and the counter substrate 12.

The electronic device 100 shown in FIG. 1 can be formed as follows, for example.
First, the transistor 30 is formed over the substrate 10. Next, the photosensitive resin composition is applied to one surface of the substrate 10 on which the transistor 30 is provided by a printing method or a spin coating method, and the insulating film 20 that covers the transistor 30 is formed. Next, the insulating film 20 is exposed to ultraviolet light or the like and developed to pattern the insulating film 20. Thereby, an opening 22 is formed in a part of the insulating film 20. Next, the insulating film 20 is heated and cured. As a result, the insulating film 20 that is a planarizing film is formed on the substrate 10.
Next, a wiring 40 connected to the drain electrode 33 is formed in the opening 22 of the insulating film 20. Thereafter, the counter substrate 12 is disposed on the insulating film 20, and liquid crystal is filled between the counter substrate 12 and the insulating film 20 to form the liquid crystal layer 14.
As a result, the electronic device 100 shown in FIG. 1 is formed.

（式（１ａ）中、ｎは０、１または２である。Ｒ _１ 、Ｒ _２ 、Ｒ _３ およびＲ _４ はそれぞれ独立して水素または炭素数１〜１０の有機基であり、これらのうちの少なくとも一つがカルボキシル基、エポキシ環、またはオキセタン環を含む有機基である。式（１ｂ）中、ｍは０、１または２である。Ｒ _５ 、Ｒ _６ 、Ｒ _７ およびＲ _８ はそれぞれ独立して水素または炭素数１〜１０の有機基であり、これらのうちの少なくとも一つがアルコキシシリル基である）
２． １．に記載のポリマーにおいて、
前記アルコキシシリル基は、以下の式（２）により示されるポリマー。

（式（２）中、Ｒ _１０ 、Ｒ _１１ およびＲ _１２ はそれぞれ独立して炭素数１〜６のアルキル基である）
３． １．または２．に記載のポリマーにおいて、
下記式（３）により示される構造単位をさらに含むポリマー。

（式（３）中、Ｒ _９ は、水素または炭素数１〜１２の有機基である）
４． １．〜３．いずれか一つに記載のポリマーにおいて、
前記式（１ａ）により示される構造単位の少なくとも一部は、Ｒ _１ 、Ｒ _２ 、Ｒ _３ およびＲ _４ のうちの少なくとも一つが下記式（４）により示される有機基であるポリマー。

（式（４）中、Ｙ _１ は、炭素数４〜１０の二価の有機基である）
５． 永久膜を形成するために用いられる感光性樹脂組成物であって、
１．〜４．いずれか一つに記載のポリマーを含む感光性樹脂組成物。
６． ５．に記載の感光性樹脂組成物であって、
ポジ型である感光性樹脂組成物。
７． ５．に記載の感光性樹脂組成物であって、
ネガ型である感光性樹脂組成物。
It should be noted that the present invention is not limited to the above-described embodiments, and modifications, improvements, and the like within the scope that can achieve the object of the present invention are included in the present invention.
Hereinafter, examples of the reference form will be added.
1. A polymer comprising a structural unit represented by the following formula (1a) and a structural unit represented by the following formula (1b).

(In the formula (1a), n is 0, 1 or 2. R ₁ , R ₂ , R ₃ and R ₄ are each independently hydrogen or an organic group having 1 to 10 carbon atoms, At least one is an organic group containing a carboxyl group, an epoxy ring, or an oxetane ring, wherein m is 0, 1 or 2. R ₅ , R ₆ , R ₇ and R ₈ are each independently Hydrogen or an organic group having 1 to 10 carbon atoms, at least one of which is an alkoxysilyl group)
2. 1. In the polymer described in
The alkoxysilyl group is a polymer represented by the following formula (2).

(In Formula (2), R ₁₀ , R ₁₁ and R ₁₂ are each independently an alkyl group having 1 to 6 carbon atoms)
3. 1. Or 2. In the polymer described in
A polymer further comprising a structural unit represented by the following formula (3).

(In formula (3), R ₉ is hydrogen or an organic group having 1 to 12 carbon atoms)
4). 1. ~ 3. In the polymer according to any one of the following:
At least a part of the structural unit represented by the formula (1a) is a polymer in which at least one of R ₁ , R ₂ , R ₃ and R ₄ is an organic group represented by the following formula (4).

(In the formula (4), _{Y 1} is a divalent organic group having 4 to 10 carbon atoms)
5). A photosensitive resin composition used to form a permanent film,
1. ~ 4. The photosensitive resin composition containing the polymer as described in any one.
6). 5). The photosensitive resin composition according to claim 1,
A positive photosensitive resin composition.
7). 5). The photosensitive resin composition according to claim 1,
A photosensitive resin composition that is negative.

  Next, examples of the present invention will be described.

(Polymer synthesis)
(Synthesis Example 1)
In a reaction vessel equipped with a stirrer and a condenser, triethoxysilylnorbornene (3.84 g, 15 mmol), maleimide (2.43 g, 25 mmol), N-cyclohexylmaleimide (4.48 g, 25 mmol), norbornene carboxylic acid ( 3.25 g, 25 mmol), methyl glycidyl ether norbornene (0.9 g, 5 mmol) and dibutyl fumaric acid (1.14 g, 5 mmol) were weighed. Furthermore, 9.1 g of propylene glycol monomethyl ether acetate in which V-601 (0.92 g, 4.0 mmol) was dissolved was added to the reaction vessel, and stirred and dissolved. Next, after removing dissolved oxygen in the system by nitrogen bubbling, the reaction was held at 70 ° C. in a nitrogen atmosphere for 5 hours. The reaction mixture was then cooled to room temperature and diluted with 30 g of MEK. The diluted solution was poured into a large amount of hexane to precipitate a polymer. Next, the polymer was collected by filtration, further washed with hexane, and then vacuum-dried at 30 ° C. for 16 hours. The polymer yield was 13.2 g and the yield was 82%. The polymer had a weight average molecular weight Mw of 11,430 and a dispersity (weight average molecular weight Mw / number average molecular weight Mn) of 2.34.
The obtained polymer had a structure represented by the following formula (14).

As the weight average molecular weight (Mw) and number average molecular weight (Mn) of the obtained polymer, a polystyrene equivalent value obtained from a calibration curve of standard polystyrene (PS) obtained by GPC measurement was used. The measurement conditions are as follows.
Gel permeation chromatography device HLC-8320GPC manufactured by Tosoh Corporation
Column: Tosoh Corporation TSK-GEL Supermultipore HZ-M
Detector: RI detector for liquid chromatogram Measurement temperature: 40 ° C
Solvent: THF
Sample concentration: 2.0 mg / milliliter In addition, the measurement conditions of a weight average molecular weight (Mw) and a number average molecular weight (Mn) are the same in the synthesis examples 2-4 mentioned later.

(Synthesis Example 2)
In a reaction vessel equipped with a stirrer and a condenser tube, triethoxysilyl norbornene (3.20 g, 12.5 mmol), maleimide (2.43 g, 25 mmol), N-cyclohexylmaleimide (4.48 g, 25 mmol), norbornene carbon Acid (3.58 g, 27.5 mmol), epoxyoctylnorbornene (1.10 g, 5 mmol), dibutyl fumaric acid (1.14 g, 5 mmol) were weighed. Furthermore, 8.9 g of propylene glycol monomethyl ether acetate in which V-601 (0.92 g, 4.0 mmol) was dissolved was added to the reaction vessel, and stirred and dissolved. Next, after removing dissolved oxygen in the system by nitrogen bubbling, the reaction was held at 70 ° C. in a nitrogen atmosphere for 5 hours. The reaction mixture was then cooled to room temperature and diluted with 30 g of MEK. The diluted solution was poured into a large amount of hexane to precipitate a polymer. Next, the polymer was collected by filtration, further washed with hexane, and then vacuum-dried at 30 ° C. for 16 hours. The polymer yield was 13.2 g and the yield was 83%. The polymer had a weight average molecular weight Mw of 12,100 and a dispersity (weight average molecular weight Mw / number average molecular weight Mn) of 2.40.
The obtained polymer had a structure represented by the following formula (15).

(Synthesis Example 3)
In a reaction vessel equipped with a stirrer and a condenser, triethoxysilylnorbornene (3.84 g, 15 mmol), maleimide (2.67 g, 27.5 mmol), N-cyclohexylmaleimide (4.03 g, 22.5 mmol), Norbornene carboxylic acid (0.65 g, 5 mmol), methyl glycidyl ether norbornene (4.50 g, 25 mmol), and dibutyl fumaric acid (1.14 g, 5 mmol) were weighed. Furthermore, 9.1 g of propylene glycol monomethyl ether acetate in which V-601 (0.92 g, 4.0 mmol) was dissolved was added to the reaction vessel, and stirred and dissolved. Next, after removing dissolved oxygen in the system by nitrogen bubbling, the reaction was held at 70 ° C. in a nitrogen atmosphere for 5 hours. The reaction mixture was then cooled to room temperature and diluted with 30 g of MEK. The diluted solution was poured into a large amount of hexane to precipitate a polymer. Next, the polymer was collected by filtration, further washed with hexane, and then vacuum-dried at 30 ° C. for 16 hours. The polymer yield was 13.2 g and the yield was 82%. Further, the polymer had a weight average molecular weight Mw of 9,450 and a dispersity (weight average molecular weight Mw / number average molecular weight Mn) of 2.38.
The obtained polymer had a structure represented by the above formula (14).

(Synthesis Example 4)
Methyl glycidyl ether norbornene (0.66 g, 3 mmol), hexafluoromethyl alcohol norbornene (7.40 g, 27 mmol), and toluene (18 g) were charged into a reaction vessel equipped with a stirrer, and the inside was replaced with dry nitrogen gas. When the contents were heated and the internal temperature reached 60 ° C., a solution in which (η ⁶ -toluene) Ni (C ₆ F ₅ ) ₂ (0.29 g, 0.60 mmol) was dissolved in 10 g of toluene was added. Subsequently, after making it react at 60 degreeC for 5 hours, it cooled to room temperature. 30 g of THF was added to the solution after the reaction, acetic acid (6 g) and 30% aqueous hydrogen peroxide (8.0 g) were further added, and the mixture was stirred at room temperature for 5 hours. Then, the water washing operation | work with ion-exchange water was implemented 3 times. The organic layer was concentrated with an evaporator and then reprecipitated with 300 g of hexane to obtain a white solid. The obtained solid was dried in a vacuum dryer at 30 ° C. overnight to obtain 6.0 g of white powder. The molecular weight of the obtained polymer was Mw = 23,500 and Mn = 13,700 by GPC.
The obtained polymer had a structure represented by the following formula (26).

(Adjustment of photosensitive resin composition)
Example 1
10.0 g of the polymer synthesized according to Synthesis Example 1, 4,4 ′-(1- {4- [1- (4-hydroxyphenyl) -1-methylethyl] phenyl} ethylidene) bisphenol and 1,2-naphthoquinonediazide 2.2 g of esterified product with -5-sulfonyl chloride (manufactured by Daitokemix Co., Ltd .: PA-28) and 3.0 g of ε-caprolactone-modified 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate ( Daicel's Celoxide 2081), diphenyl [4- (phenylthio) phenyl] sulfonium tetrakis (pentafluorophenyl) borate (CPI-110B from San Apro), KBM-403 (Shin-Etsu Silicone) to improve adhesion 1.0g, resist at the time of spin coating 0.05 g of F-557 (manufactured by DIC), propylene glycol monomethyl ether acetate: diethylene glycol methyl ethyl ether: benzyl alcohol = 50: 42.5: 7.5 Was dissolved in the mixed solvent so as to have a solid content of 20%. This was filtered with a 0.2 μm PTFE filter to prepare a positive photosensitive resin composition.

(Example 2)
10.0 g of the polymer synthesized according to Synthesis Example 2, 4,4 ′-(1- {4- [1- (4-hydroxyphenyl) -1-methylethyl] phenyl} ethylidene) bisphenol and 1,2-naphthoquinonediazide 2.0 g of esterified product with -5-sulfonyl chloride (manufactured by Daitokemix Co., Ltd .: PA-28) and 2.0 g of ε-caprolactone-modified 3,4′-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate ( Daicel Corporation's Celoxide 2081), diphenyl [4- (phenylthio) phenyl] sulfonium tetrakis (pentafluorophenyl) borate (CPI-110B made by San Apro), KBM-403 (Shin-Etsu Silicone) to improve adhesion 0.5g, resist when spin coating In order to prevent radial striations formed on the membrane, 0.05 g of F-557 (manufactured by DIC) was added to a mixed solvent of propylene glycol monomethyl ether acetate: diethylene glycol methyl ethyl ether = 50: 50 with a solid content of 20%. It dissolved so that it might become. This was filtered with a 0.2 μm PTFE filter to prepare a positive photosensitive resin composition.

(Example 3)
10.0 g of the polymer synthesized according to Synthesis Example 3, 4,4 ′-(1- {4- [1- (4-hydroxyphenyl) -1-methylethyl] phenyl} ethylidene) bisphenol and 1,2-naphthoquinonediazide 2.2 g of esterified product with -5-sulfonyl chloride (manufactured by Daitokemix Co., Ltd .: PA-28) and 3.0 g of ε-caprolactone-modified 3,4-epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate ( Daicel's Celoxide 2081), diphenyl [4- (phenylthio) phenyl] sulfonium tetrakis (pentafluorophenyl) borate (CPI-110B from San Apro), KBM-403 (Shin-Etsu Silicone) to improve adhesion 1.0g, resist at the time of spin coating In order to prevent radial striations formed on the membrane, 0.05 g of F-557 (manufactured by DIC) was added to a mixed solvent of propylene glycol monomethyl ether acetate: diethylene glycol methyl ethyl ether = 50: 50 with a solid content of 20%. It dissolved so that it might become. This was filtered with a 0.2 μm PTFE filter to prepare a positive photosensitive resin composition.

(Example 4)
A positive photosensitive resin composition was prepared in the same manner as in Example 3 except that Celoxide 2081 was changed to LX-01 manufactured by Daicel Corporation. In addition, the compounding quantity of each component is as showing in Table 1.

(Example 5)
A positive photosensitive resin composition was prepared in the same manner as in Example 3 except that Celoxide 2081 was changed to EHPE-3150 manufactured by Daicel Corporation. In addition, the compounding quantity of each component is as showing in Table 1.

(Comparative Example 1)
A positive photosensitive resin composition was prepared in the same manner as in Example 1 except that the polymer synthesized in Synthesis Example 4 was used. In addition, the compounding quantity of each component is as showing in Table 1.

(Undercut resistance)
With respect to Examples 1 to 5 and Comparative Example 1, the undercut resistance was evaluated as follows. First, the obtained photosensitive resin composition was spin-coated on a 1737 glass substrate manufactured by Corning Inc. having a length of 100 mm and a width of 100 mm, and baked on a hot plate at 100 ° C. for 120 seconds to obtain a thin film having a thickness of about 3.5 μm. It was. The thin film was exposed using a 5 μm hole pattern mask with a g + h + i line mask aligner (PLA-501F) manufactured by Canon Inc. Next, a patterned thin film was obtained by developing for 90 seconds at 23 ° C. using a developer. In Examples 1 and 2, 0.5% by mass tetramethylammonium hydroxide aqueous solution was used as the developer, and in Examples 3 to 5 and Comparative Example 1, 2.38% by mass tetramethyl hydroxide was used as the developer. Each ammonium aqueous solution was used for development processing. The entire surface of this thin film was exposed to 300 mJ / cm ² with PLA-501F and then post-baked by heating in an oven at 230 ° C. for 60 minutes. SEM observation of the cross-section of the hole pattern formed in the thin film, and evaluation of undercut resistance was made with ○ indicating that no undercut was observed at the lower end of the hole pattern and × indicating that undercut was observed. It was.

(Crack resistance)
About Examples 1-5 and Comparative Example 1, the crack resistance was evaluated as follows. First, the obtained photosensitive resin composition was spin-coated on a 1737 glass substrate manufactured by Corning Inc. having a length of 100 mm and a width of 100 mm, and baked on a hot plate at 100 ° C. for 120 seconds to obtain a thin film having a thickness of about 3.5 μm. It was. The thin film was exposed using a 5 μm hole pattern mask with a g + h + i line mask aligner (PLA-501F) manufactured by Canon Inc. Next, a resist pattern was formed by developing for 90 seconds at 23 ° C. using a developer. In Examples 1 and 2, 0.5% by mass tetramethylammonium hydroxide aqueous solution was used as the developer, and in Examples 3 to 5 and Comparative Example 1, 2.38% by mass tetramethyl hydroxide was used as the developer. Each ammonium aqueous solution was used for development processing. Next, the surface of the formed resist pattern was observed with an SEM, and the crack resistance was evaluated with x indicating that the thin film had cracks and ◯ indicating that there were no cracks.

(Rework characteristics)
About Examples 1-5 and Comparative Example 1, the rework characteristic of the photosensitive resin composition was evaluated as follows. First, the photosensitive resin composition is spin-coated on a 1737 glass substrate manufactured by Corning Inc. having a length of 100 mm and a width of 100 mm (rotation speed: 500 to 2500 rpm), and prebaked at 100 ° C. for 120 seconds using a hot plate. Thus, a resin film having a thickness of about 3.0 μm was obtained. Next, a g + h + i line mask aligner (manufactured by Canon Inc., PLA-501F (extra-high pressure mercury lamp)) is used to apply g + h + i line to the resin film using a mask having a mask pattern having a width of 5 μm. / Cm ² was exposed. Then, the thin film with a pattern was obtained by developing with a developing solution and rinsing with pure water. In Examples 1 and 2, 0.5% by mass tetramethylammonium hydroxide aqueous solution was used as the developer, and in Examples 3 to 5 and Comparative Example 1, 2.38% by mass tetramethyl hydroxide was used as the developer. Each ammonium aqueous solution was used for development processing. A bleaching process was performed on the thin film without using a mask so that the integrated light amount was 300 mJ / cm ² . Next, the resin film is allowed to stand for 24 hours in a yellow room (using a HEPA filter) maintained at a temperature of 23 ± 1 ° C. and a humidity of 40 ± 5%, and then g + h + i lines are accumulated on the resin film without using a mask. The bleaching process was performed again so that the amount of light was 300 mJ / cm ² . Next, the resin film was immersed in a 2.38% TMAH (tetramethylammonium hydroxide) solution at 23 ± 1 ° C. for 240 seconds. At this time, the presence or absence of the resin film on the substrate was observed with a microscope. Here, the evaluation of the rework characteristics was performed by assuming that the resin film was not observed to be “O” and the resin film was observed to be “X”.

(Formation of thin film pattern)
About Examples 1-5 and Comparative Example 1, the thin film pattern was formed as follows. First, the obtained photosensitive resin composition was spin-coated on a 1737 glass substrate manufactured by Corning Inc. having a length of 100 mm and a width of 100 mm (rotation speed: 300 to 2500 rpm), and baked on a hot plate at 100 ° C. for 120 seconds, and then about A thin film A having a thickness of 3.5 μm was obtained. This thin film A was exposed with an optimum exposure dose so that the width of the 5 μm line and the space would be 1: 1 with g + h + i line mask aligner (PLA-501F) manufactured by Canon Inc., and 23 ° C. using a developer. By developing for 90 seconds, a thin film B with a line & space pattern having a line and space width of 1: 1 was obtained. In Examples 1 and 2, 0.5% by mass tetramethylammonium hydroxide aqueous solution was used as the developer, and in Examples 3 to 5 and Comparative Example 1, 2.38% by mass tetramethyl hydroxide was used as the developer. Each ammonium aqueous solution was used for development processing. The thin film B was exposed to 300 mJ / cm ^{2 on the} entire surface with PLA-501F, and then post-baked by heating in an oven at 230 ° C. for 60 minutes to obtain a thin film C with a pattern.

(Remaining film ratio after development and post-baking)
About Examples 1-5 and Comparative Example 1, the remaining film ratio was calculated from the following formulas from the film thicknesses of the thin film A, the thin film B, and the thin film C obtained by forming the above-described thin film pattern.
Residual film ratio after development (%) = [film thickness of thin film B (μm) / film thickness of thin film A (μm)] × 100
Post-baking residual film ratio (%) = [film thickness of thin film C (μm) / film thickness of thin film A (μm)] × 100

(Developability)
For Examples 1 to 5 and Comparative Example 1, a 5 μm pattern of the thin film B obtained by forming the above-described thin film pattern was observed with an SEM (scanning electron microscope). The developability was evaluated as x when a residue was found in the space portion and ◯ when no residue was found.

(Relative permittivity)
For Examples 1 to 5 and Comparative Example 1, except that the test pattern was not exposed and developed with PLA-501F and an aluminum substrate was used as the substrate, the same operation as in the formation of the thin film pattern was performed. A 3.0 μm-thick thin film without a pattern was obtained on an aluminum substrate. Thereafter, a gold electrode was formed on this thin film, and the relative dielectric constant was calculated from the capacitance obtained using a Hewlett Packard LCR meter (4282A) under the conditions of room temperature (25 ° C.) and 10 kHz.

(Transmittance)
About Examples 1-5 and Comparative Example 1, except not exposing a test pattern, the thin film without a pattern was obtained on the glass substrate by performing operation similar to formation of the above-mentioned thin film pattern. For this thin film, the transmittance (%) of light at a wavelength of 400 nm was measured using an ultraviolet-visible light spectrophotometer, and the numerical value converted to a film thickness of 3 μm was taken as the transmittance.

(Chemical resistance)
For Examples 1 to 5 and Comparative Example 1, the swelling rate and the recovery rate were measured as follows. First, the obtained photosensitive resin composition was spin-coated on a 1737 glass substrate manufactured by Corning Inc. having a length of 100 mm and a width of 100 mm, and prebaked at 100 ° C. for 120 seconds using a hot plate to obtain about 3 A resin film having a thickness of 5 μm was obtained. Next, the resin film was immersed in a developer for 90 seconds, and then rinsed with pure water. In Examples 1 and 2, 0.5% by mass tetramethylammonium hydroxide aqueous solution was used as the developer, and in Examples 3 to 5 and Comparative Example 1, 2.38% by mass tetramethyl hydroxide was used as the developer. Each ammonium aqueous solution was used for development processing. Next, the entire surface of the resin film was exposed using a g + h + i line mask aligner (manufactured by Canon Inc., PLA-501F (extra-high pressure mercury lamp)) so that the integrated light amount was 300 mJ / cm ² . . Next, a thermosetting treatment was performed on the resin film in an oven at 230 ° C. for 60 minutes. Subsequently, the film thickness (first film thickness) of the obtained cured film was measured. Next, the cured film was immersed in TOK106 (manufactured by Tokyo Ohka Kogyo Co., Ltd.) at 70 ° C. for 15 minutes, and then rinsed with pure water for 30 seconds. At this time, the swelling ratio was calculated from the following equation, with the film thickness after rinsing of the cured film as the second film thickness.
Swelling ratio: [(second film thickness-first film thickness) / (first film thickness)] × 100 (%)
Next, the cured film was heated in an oven at 230 ° C. for 15 minutes, and the film thickness after heating (third film thickness) was measured. And the recovery rate was computed from the following formula.
Recovery rate: [(third film thickness) / (first film thickness)] × 100 (%)

(sensitivity)
For Examples 1 to 5 and Comparative Example 1, the sensitivity was measured as follows. First, the obtained photosensitive resin composition was spin-coated on a 1737 glass substrate made by Corning 100 mm long and 100 mm wide, baked on a hot plate at 100 ° C. for 120 seconds, and a thin film A having a thickness of about 3.5 μm was formed. Obtained. The thin film was exposed using a 5 μm hole pattern mask with a g + h + i line mask aligner (PLA-501F) manufactured by Canon Inc. Next, a resist pattern was formed by developing for 90 seconds at 23 ° C. using a developer. In Examples 1 and 2, 0.5% by mass tetramethylammonium hydroxide aqueous solution as the developer, and in Example 3 and Comparative Example 1, 2.38% by mass tetramethylammonium hydroxide aqueous solution as the developer. Each was used for development processing. Next, the formed resist pattern was observed with an SEM, and the exposure amount (mJ / cm ² ) when a 5 μm square hole pattern was obtained was defined as sensitivity.

  In Table 1, among the numerical values indicating the blending amount of each component contained in the photosensitive resin composition, the numerical values outside the parentheses indicate the mass (g) of each component, and the numerical values within the parentheses indicate the total solid content of the resin composition. The blending ratio (mass%) of each component when (the component excluding the solvent) is 100 mass% is shown.

(Example 6)
10.0 g of the polymer synthesized in Synthesis Example 1, 2.0 g of Celoxide 2081 manufactured by Daicel Corporation, and 0.01 of diphenyl [4- (phenylthio) phenyl] sulfonium tetrakis (pentafluorophenyl) borate (CPI-110B manufactured by San Apro). 5 g, 0.5 g of KBM-403 (manufactured by Shin-Etsu Silicone) to improve adhesion, F-557 (manufactured by DIC) to prevent radial striations formed on the resist film during spin coating Was dissolved in a mixed solvent of propylene glycol monomethyl ether acetate: diethylene glycol methyl ethyl ether: benzyl alcohol = 42.5: 50: 7.5 to a solid content of 20%. This was filtered with a 0.2 μm PTFE filter to prepare a negative photosensitive resin composition.

(Example 7)
A negative photosensitive resin composition was prepared in the same manner as in Example 6 except that the polymer synthesized in Synthesis Example 2 was used. In addition, the compounding quantity of each component is as showing in Table 2.

(Undercut resistance)
For Examples 6 and 7, the undercut resistance was evaluated as follows. First, the obtained photosensitive resin composition was spin-coated on a 1737 glass substrate manufactured by Corning Inc. having a length of 100 mm and a width of 100 mm, and baked on a hot plate at 100 ° C. for 120 seconds to obtain a thin film having a thickness of about 3.5 μm. It was. This thin film was exposed using a 10 μm hole pattern mask with g + h + i line mask aligner (PLA-501F) manufactured by Canon Inc. Next, the thin film was baked on a hot plate at 140 ° C. for 120 seconds. Subsequently, the thin film with a pattern was obtained by developing for 90 second at 23 degreeC using 0.5 mass% tetramethylammonium hydroxide aqueous solution. The entire surface of this thin film was exposed to 300 mJ / cm ² with PLA-501F and then post-baked by heating in an oven at 230 ° C. for 60 minutes. SEM observation of the cross-section of the hole pattern formed in the thin film, and evaluation of undercut resistance was made with ○ indicating that no undercut was observed at the lower end of the hole pattern and × indicating that undercut was observed. It was.

(Crack resistance)
Examples 6 and 7 were evaluated for crack resistance as follows. First, the obtained photosensitive resin composition was spin-coated on a 1737 glass substrate manufactured by Corning Inc. having a length of 100 mm and a width of 100 mm, and baked on a hot plate at 100 ° C. for 120 seconds to obtain a thin film having a thickness of about 3.5 μm. It was. This thin film was exposed using a 10 μm hole pattern mask with g + h + i line mask aligner (PLA-501F) manufactured by Canon Inc. Next, the thin film was baked on a hot plate at 140 ° C. for 120 seconds. Subsequently, the resist pattern was formed by developing on the conditions of 23 degreeC and 90 second using 0.5 mass% tetramethylammonium hydroxide aqueous solution. Subsequently, the surface of the formed resist pattern was observed with an SEM, and “X” indicates that the thin film has cracks, and “◯” indicates that there are no cracks.

(Formation of thin film pattern)
For Examples 6 and 7, thin film patterns were formed as follows. First, the obtained photosensitive resin composition was spin-coated on a 1737 glass substrate manufactured by Corning Inc. having a length of 100 mm and a width of 100 mm (rotation speed: 300 to 2500 rpm), and baked on a hot plate at 100 ° C. for 120 seconds, and then about A thin film A having a thickness of 3.5 μm was obtained. This thin film A was exposed with an optimum exposure dose so that the width of the 10 μm line and the space would be 1: 1 with a g + h + i line mask aligner (PLA-501F) manufactured by Canon Inc., and a hot plate at 140 ° C. for 120 seconds. I baked at. Thereafter, the thin film was developed using a 0.5% by mass tetramethylammonium hydroxide aqueous solution at 23 ° C. for 90 seconds to obtain a thin film B with a line & space pattern having a line and space width of 1: 1. This thin film B was exposed to 300 mJ / cm ^{2 on the} entire surface with PLA-501F and then post-baked by heating in an oven at 230 ° C. for 60 minutes to obtain a patterned thin film C having a thickness of about 3.0 μm.

(Evaluation of remaining film ratio after development and post-baking)
For Examples 6 and 7, the remaining film ratio was calculated from the following equations from the film thicknesses of the thin film A, the thin film B, and the thin film C obtained by forming the above-described thin film pattern.
Residual film ratio after development (%) = [film thickness of thin film B (μm) / film thickness of thin film A (μm)] × 100
Post-baking residual film ratio (%) = [film thickness of thin film C (μm) / film thickness of thin film A (μm)] × 100

(Evaluation of developability)
In Examples 6 and 7, a 10 μm pattern of the thin film B obtained by forming the above-described thin film pattern was observed with an SEM (scanning electron microscope). The developability was evaluated as x when a residue was found in the space portion and ◯ when no residue was found.

(Evaluation of relative dielectric constant)
For Examples 6 and 7, the relative dielectric constant was measured as follows. First, the obtained photosensitive resin composition was spin-coated on an aluminum substrate (rotation speed: 300 to 2500 rpm) and baked on a hot plate at 100 ° C. for 120 seconds to obtain a thin film of about 3.5 μm. Next, the entire surface of the thin film was exposed to 300 mJ / cm ² using a g + h + i line mask aligner (PLA-501F) manufactured by Canon Inc. Next, the exposed thin film was baked on a hot plate at 140 ° C. for 120 seconds. Subsequently, a post-baking process was performed by heating at 230 ° C. for 60 minutes in an oven to obtain a 3.0 μm-thick thin film without a pattern on an aluminum substrate. Thereafter, a gold electrode was formed on this thin film, and the relative dielectric constant was calculated from the capacitance obtained using a Hewlett Packard LCR meter (4282A) under the conditions of room temperature (25 ° C.) and 10 kHz.

(Evaluation of transmittance)
For Examples 6 and 7, the transmittance was measured as follows. First, the obtained photosensitive resin composition was spin-coated on a 1737 glass substrate manufactured by Corning Inc. having a length of 100 mm and a width of 100 mm (rotation speed: 300 to 2500 rpm), and baked on a hot plate at 100 ° C. for 120 seconds, and then about A thin film of 3.5 μm was obtained. Next, the entire surface of the thin film was exposed to 300 mJ / cm ² using a g + h + i line mask aligner (PLA-501F) manufactured by Canon Inc. Next, the exposed thin film was baked on a hot plate at 140 ° C. for 120 seconds. Next, the thin film is developed with a 0.5 mass% tetramethylammonium hydroxide aqueous solution at 23 ° C. for 90 seconds, and then rinsed with pure water. Next, post baking was performed by heating in an oven at 230 ° C. for 60 minutes, and a thin film having no pattern was obtained on a glass substrate. For this thin film, the transmittance (%) of light at a wavelength of 400 nm was measured using an ultraviolet-visible light spectrophotometer, and the numerical value converted to a film thickness of 3 μm was taken as the transmittance.

(Evaluation of chemical resistance)
For Examples 6 and 7, the swelling rate and the recovery rate were measured as follows. First, the obtained photosensitive resin composition was spin-coated on a 1737 glass substrate manufactured by Corning Inc. having a length of 100 mm and a width of 100 mm, and prebaked at 100 ° C. for 120 seconds using a hot plate to obtain about 3 A resin film having a thickness of 5 μm was obtained. Next, the entire surface of the resin film was exposed to 300 mJ / cm ² using a g + h + i line mask aligner (PLA-501F) manufactured by Canon Inc. Next, the resin film after exposure was baked under conditions of 140 ° C. and 120 seconds. Next, the resin film was immersed in a developer (0.5 wt% TMAH) for 90 seconds, and then rinsed with pure water. Next, a thermosetting treatment was performed on the resin film in an oven at 230 ° C. for 60 minutes. Subsequently, the film thickness (first film thickness) of the obtained cured film was measured. Next, the cured film was immersed in TOK106 (manufactured by Tokyo Ohka Kogyo Co., Ltd.) at 70 ° C. for 15 minutes, and then rinsed with pure water for 30 seconds. At this time, the swelling ratio was calculated from the following equation, with the film thickness after rinsing of the resin film as the second film thickness.
Swelling ratio: [(second film thickness-first film thickness) / (first film thickness)] × 100 (%)
Next, the cured film was heated in an oven at 230 ° C. for 15 minutes, and the film thickness after heating (third film thickness) was measured. And the recovery rate was computed from the following formula.
Recovery rate: [(third film thickness) / (first film thickness)] × 100 (%)

(sensitivity)
For Examples 6 and 7, the sensitivity was measured as follows. First, the obtained photosensitive resin composition was spin-coated on a 1737 glass substrate made by Corning 100 mm long and 100 mm wide, baked on a hot plate at 100 ° C. for 120 seconds, and a thin film A having a thickness of about 3.5 μm was formed. Obtained. The thin film was exposed with a g + h + i-line mask aligner (PLA-501F) manufactured by Canon Inc. while changing the exposure amount by 20 mJ / cm ² . Next, the film was baked on a hot plate at 140 ° C. for 120 seconds, developed with a 0.5 mass% tetramethylammonium hydroxide aqueous solution at 23 ° C. for 90 seconds, and rinsed with pure water. The exposure amount at which thin film B / thin film A × 100 = 95% was defined as sensitivity (mJ / cm ² ).

  In Table 2, among the numerical values indicating the amount of each component contained in the photosensitive resin composition, the numerical values outside the parentheses indicate the mass (g) of each component, and the numerical values within the parentheses indicate the total solid content of the resin composition. The blending ratio (mass%) of each component when (the component excluding the solvent) is 100 mass% is shown.

10 substrate 12 counter substrate 14 liquid crystal layer 20 insulating film 22 opening 30 transistor 31 gate electrode 32 source electrode 33 drain electrode 34 gate insulating film 35 semiconductor layers 40 and 42 wiring 90 and 92 alignment film 100 electronic device

Claims (4)

Forming a permanent film including a polymer containing a structural unit represented by the following formula (1a), a structural unit represented by the following formula (1b), and a structural unit represented by the following formula (3) in the main chain. A photosensitive resin composition that is used to make a positive type .

(In the formula (1a), n is 0, 1 or 2. R ₁ , R ₂ , R ₃ and R ₄ are each independently hydrogen or an organic group having 1 to 10 carbon atoms, At least one is an organic group containing a carboxyl group, an epoxy ring, or an oxetane ring, wherein m is 0, 1 or 2. R ₅ , R ₆ , R ₇ and R ₈ are each independently Hydrogen or an organic group having 1 to 10 carbon atoms, at least one of which is an alkoxysilyl group . )

(In Formula (3), R ₉ is hydrogen or an organic group having 1 to 12 carbon atoms . ) Forming a permanent film including a polymer containing a structural unit represented by the following formula (1a), a structural unit represented by the following formula (1b), and a structural unit represented by the following formula (3) in the main chain. A photosensitive resin composition that is a negative type photosensitive resin composition .

(In the formula (1a), n is 0, 1 or 2. R ₁ , R ₂ , R ₃ and R ₄ are each independently hydrogen or an organic group having 1 to 10 carbon atoms, At least one is an organic group containing a carboxyl group, an epoxy ring, or an oxetane ring, wherein m is 0, 1 or 2. R ₅ , R ₆ , R ₇ and R ₈ are each independently And hydrogen or an organic group having 1 to 10 carbon atoms, at least one of which is an alkoxysilyl group.)

(In Formula (3), R ₉ is hydrogen or an organic group having 1 to 12 carbon atoms.) In the photosensitive resin composition of Claim 1 or 2 ,
The alkoxysilyl group in the polymer is a photosensitive resin composition represented by the following formula (2).

(In formula (2), R ₁₀ , R ₁₁ and R ₁₂ are each independently an alkyl group having 1 to 6 carbon atoms . ) In the photosensitive resin composition of any one of Claims 1-3,
At least a part of the structural unit represented by the formula (1a) in the polymer is a photosensitivity in which at least one of R ₁ , R ₂ , R ₃ and R ₄ is an organic group represented by the following formula (4). Resin composition .

(In the formula (4), _{Y 1} is a divalent organic group having 4 to 10 carbon atoms.)

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