JP6357734B2 - Photocurable resin composition, photocurable light-shielding coating material using the same, light leakage prevention material, liquid crystal display panel and liquid crystal display device, and photocuring method - Google Patents
Photocurable resin composition, photocurable light-shielding coating material using the same, light leakage prevention material, liquid crystal display panel and liquid crystal display device, and photocuring method Download PDFInfo
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- JP6357734B2 JP6357734B2 JP2013132287A JP2013132287A JP6357734B2 JP 6357734 B2 JP6357734 B2 JP 6357734B2 JP 2013132287 A JP2013132287 A JP 2013132287A JP 2013132287 A JP2013132287 A JP 2013132287A JP 6357734 B2 JP6357734 B2 JP 6357734B2
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- light
- component
- resin composition
- photocurable
- liquid crystal
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- 239000011342 resin composition Substances 0.000 title claims description 40
- 239000004973 liquid crystal related substance Substances 0.000 title claims description 28
- 239000000463 material Substances 0.000 title claims description 23
- 238000000034 method Methods 0.000 title claims description 18
- 238000000576 coating method Methods 0.000 title claims description 16
- 239000011248 coating agent Substances 0.000 title claims description 15
- 238000000016 photochemical curing Methods 0.000 title claims description 11
- 230000002265 prevention Effects 0.000 title claims description 7
- -1 thiol compounds Chemical class 0.000 claims description 17
- 239000003973 paint Substances 0.000 claims description 13
- 239000000843 powder Substances 0.000 claims description 13
- 239000000178 monomer Substances 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 9
- 239000000945 filler Substances 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 7
- 239000003999 initiator Substances 0.000 claims description 6
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920002050 silicone resin Polymers 0.000 claims description 4
- 229920002379 silicone rubber Polymers 0.000 claims description 4
- 239000004945 silicone rubber Substances 0.000 claims description 4
- 239000005995 Aluminium silicate Substances 0.000 claims description 2
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 235000012211 aluminium silicate Nutrition 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000010445 mica Substances 0.000 claims description 2
- 229910052618 mica group Inorganic materials 0.000 claims description 2
- 239000000454 talc Substances 0.000 claims description 2
- 229910052623 talc Inorganic materials 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 13
- 238000001723 curing Methods 0.000 description 11
- 238000002156 mixing Methods 0.000 description 11
- 239000006087 Silane Coupling Agent Substances 0.000 description 9
- 239000007822 coupling agent Substances 0.000 description 8
- OAZWDJGLIYNYMU-UHFFFAOYSA-N Leucocrystal Violet Chemical compound C1=CC(N(C)C)=CC=C1C(C=1C=CC(=CC=1)N(C)C)C1=CC=C(N(C)C)C=C1 OAZWDJGLIYNYMU-UHFFFAOYSA-N 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 239000000047 product Substances 0.000 description 6
- VTLHIRNKQSFSJS-UHFFFAOYSA-N [3-(3-sulfanylbutanoyloxy)-2,2-bis(3-sulfanylbutanoyloxymethyl)propyl] 3-sulfanylbutanoate Chemical compound CC(S)CC(=O)OCC(COC(=O)CC(C)S)(COC(=O)CC(C)S)COC(=O)CC(C)S VTLHIRNKQSFSJS-UHFFFAOYSA-N 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 4
- 239000000975 dye Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- UMHKOAYRTRADAT-UHFFFAOYSA-N [hydroxy(octoxy)phosphoryl] octyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OP(O)(=O)OCCCCCCCC UMHKOAYRTRADAT-UHFFFAOYSA-N 0.000 description 3
- DZBUGLKDJFMEHC-UHFFFAOYSA-N acridine Chemical compound C1=CC=CC2=CC3=CC=CC=C3N=C21 DZBUGLKDJFMEHC-UHFFFAOYSA-N 0.000 description 3
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 2
- PMNLUUOXGOOLSP-UHFFFAOYSA-N 2-mercaptopropanoic acid Chemical class CC(S)C(O)=O PMNLUUOXGOOLSP-UHFFFAOYSA-N 0.000 description 2
- KUDUQBURMYMBIJ-UHFFFAOYSA-N 2-prop-2-enoyloxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC(=O)C=C KUDUQBURMYMBIJ-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- NPKSPKHJBVJUKB-UHFFFAOYSA-N N-phenylglycine Chemical compound OC(=O)CNC1=CC=CC=C1 NPKSPKHJBVJUKB-UHFFFAOYSA-N 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- 229940072282 cardura Drugs 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- RUZYUOTYCVRMRZ-UHFFFAOYSA-N doxazosin Chemical compound C1OC2=CC=CC=C2OC1C(=O)N(CC1)CCN1C1=NC(N)=C(C=C(C(OC)=C2)OC)C2=N1 RUZYUOTYCVRMRZ-UHFFFAOYSA-N 0.000 description 2
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 230000003449 preventive effect Effects 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 150000004053 quinones Chemical class 0.000 description 2
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical class OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 description 2
- 150000003573 thiols Chemical class 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 150000003673 urethanes Chemical class 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 1
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 1
- PAEWNKLGPBBWNM-UHFFFAOYSA-N 1,3,5-tris[2-(3-sulfanylbutoxy)ethyl]-1,3,5-triazinane-2,4,6-trione Chemical group CC(S)CCOCCN1C(=O)N(CCOCCC(C)S)C(=O)N(CCOCCC(C)S)C1=O PAEWNKLGPBBWNM-UHFFFAOYSA-N 0.000 description 1
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 1
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 1
- RSZHBVPYGJXEGF-UHFFFAOYSA-N 1-(2-sulfanylacetyl)oxybutyl 2-sulfanylacetate Chemical compound SCC(=O)OC(CCC)OC(=O)CS RSZHBVPYGJXEGF-UHFFFAOYSA-N 0.000 description 1
- KBVVEEWTRWVZNY-UHFFFAOYSA-N 1-(2-sulfanylacetyl)oxyhexyl 2-sulfanylacetate Chemical compound CCCCCC(OC(=O)CS)OC(=O)CS KBVVEEWTRWVZNY-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- QEDJMOONZLUIMC-UHFFFAOYSA-N 1-tert-butyl-4-ethenylbenzene Chemical compound CC(C)(C)C1=CC=C(C=C)C=C1 QEDJMOONZLUIMC-UHFFFAOYSA-N 0.000 description 1
- HIQAWCBKWSQMRQ-UHFFFAOYSA-N 16-methylheptadecanoic acid;2-methylprop-2-enoic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(=C)C(O)=O.CC(=C)C(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O HIQAWCBKWSQMRQ-UHFFFAOYSA-N 0.000 description 1
- IEKHISJGRIEHRE-UHFFFAOYSA-N 16-methylheptadecanoic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O IEKHISJGRIEHRE-UHFFFAOYSA-N 0.000 description 1
- GKZPEYIPJQHPNC-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO GKZPEYIPJQHPNC-UHFFFAOYSA-N 0.000 description 1
- UCSGWEMRGIONEW-UHFFFAOYSA-N 2-(2-chlorophenyl)-4,5-bis(2-methoxyphenyl)-1h-imidazole Chemical class COC1=CC=CC=C1C1=C(C=2C(=CC=CC=2)OC)NC(C=2C(=CC=CC=2)Cl)=N1 UCSGWEMRGIONEW-UHFFFAOYSA-N 0.000 description 1
- UIHRWPYOTGCOJP-UHFFFAOYSA-N 2-(2-fluorophenyl)-4,5-diphenyl-1h-imidazole Chemical class FC1=CC=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 UIHRWPYOTGCOJP-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- PSYGHMBJXWRQFD-UHFFFAOYSA-N 2-(2-sulfanylacetyl)oxyethyl 2-sulfanylacetate Chemical compound SCC(=O)OCCOC(=O)CS PSYGHMBJXWRQFD-UHFFFAOYSA-N 0.000 description 1
- SNFCQJAJPFWBDJ-UHFFFAOYSA-N 2-(4-methoxyphenyl)-4,5-diphenyl-1h-imidazole Chemical class C1=CC(OC)=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 SNFCQJAJPFWBDJ-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical class OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
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- LZMNXXQIQIHFGC-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl 2-methylprop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C(C)=C LZMNXXQIQIHFGC-UHFFFAOYSA-N 0.000 description 1
- FMGBDYLOANULLW-UHFFFAOYSA-N 3-isocyanatopropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCN=C=O FMGBDYLOANULLW-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- ADUMIBSPEHFSLA-UHFFFAOYSA-N 4-[bis(4-aminophenyl)methyl]aniline Chemical compound C1=CC(N)=CC=C1C(C=1C=CC(N)=CC=1)C1=CC=C(N)C=C1 ADUMIBSPEHFSLA-UHFFFAOYSA-N 0.000 description 1
- OKJSFKIUVDXFMS-UHFFFAOYSA-N 4-[bis[4-(diethylamino)-2-methylphenyl]methyl]-n,n-diethyl-3-methylaniline Chemical compound CC1=CC(N(CC)CC)=CC=C1C(C=1C(=CC(=CC=1)N(CC)CC)C)C1=CC=C(N(CC)CC)C=C1C OKJSFKIUVDXFMS-UHFFFAOYSA-N 0.000 description 1
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- SAPGBCWOQLHKKZ-UHFFFAOYSA-N 6-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCOC(=O)C(C)=C SAPGBCWOQLHKKZ-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- MGXHYQAQEKLYFL-UHFFFAOYSA-N C=CC(OC(COCCOCCOCCO)O)=O.N=C=O Chemical compound C=CC(OC(COCCOCCOCCO)O)=O.N=C=O MGXHYQAQEKLYFL-UHFFFAOYSA-N 0.000 description 1
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- SRORDPCXIPXEAX-UHFFFAOYSA-N CCCCCCCCCCCCCP(CCCCCCCCCCCCC)(O)(OCCCCCCCC)OCCCCCCCC.CCCCCCCCCCCCCP(CCCCCCCCCCCCC)(O)(OCCCCCCCC)OCCCCCCCC Chemical compound CCCCCCCCCCCCCP(CCCCCCCCCCCCC)(O)(OCCCCCCCC)OCCCCCCCC.CCCCCCCCCCCCCP(CCCCCCCCCCCCC)(O)(OCCCCCCCC)OCCCCCCCC SRORDPCXIPXEAX-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
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- 239000005062 Polybutadiene Substances 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
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- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 1
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- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000000641 acridinyl group Chemical group C1(=CC=CC2=NC3=CC=CC=C3C=C12)* 0.000 description 1
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- 238000007259 addition reaction Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
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- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 150000008365 aromatic ketones Chemical class 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 235000010354 butylated hydroxytoluene Nutrition 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 125000000332 coumarinyl group Chemical class O1C(=O)C(=CC2=CC=CC=C12)* 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- VTIXMGZYGRZMAW-UHFFFAOYSA-N ditridecyl hydrogen phosphite Chemical compound CCCCCCCCCCCCCOP(O)OCCCCCCCCCCCCC VTIXMGZYGRZMAW-UHFFFAOYSA-N 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- SKEQOTBKQUCUGK-UHFFFAOYSA-N o-(2-hydroxyethyl) propanethioate Chemical compound CCC(=S)OCCO SKEQOTBKQUCUGK-UHFFFAOYSA-N 0.000 description 1
- XVKLLVZBGMGICC-UHFFFAOYSA-N o-[3-propanethioyloxy-2,2-bis(propanethioyloxymethyl)propyl] propanethioate Chemical compound CCC(=S)OCC(COC(=S)CC)(COC(=S)CC)COC(=S)CC XVKLLVZBGMGICC-UHFFFAOYSA-N 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical group OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical compound NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Macromonomer-Based Addition Polymer (AREA)
- Liquid Crystal (AREA)
- Paints Or Removers (AREA)
Description
本発明は、光硬化性樹脂組成物並びにそれを用いた光硬化性遮光塗料、光漏洩防止材、液晶表示パネル及び液晶表示装置、並びに光硬化方法に関する。さらに詳しくは、LED光源に基づく光照射による硬化に適した光硬化性樹脂組成物、それを用いた光硬化性遮光塗料及び光漏洩防止材に関し、これらを用いた液晶表示パネル及び液晶表示装置、並びに光硬化方法に関する。 The present invention relates to a photocurable resin composition, a photocurable light-shielding coating material using the same, a light leakage prevention material, a liquid crystal display panel and a liquid crystal display device, and a photocuring method. More specifically, the present invention relates to a photocurable resin composition suitable for curing by light irradiation based on an LED light source, a photocurable light-shielding paint and a light leakage preventing material using the same, a liquid crystal display panel and a liquid crystal display device using these, And a photocuring method.
光硬化性樹脂組成物は、種々の分野で使用されている。該組成物効果には、当然に光の照射が必要であるが、最近、省エネの一環として、その光源の省力化が要望されている。そこで、注目されているのが、LED光源であり、特に、LEDによる紫外線波長365nmの光の照射が注目されており、それに適した光硬化性樹脂組成物の提供が急務である。 The photocurable resin composition is used in various fields. The composition effect naturally requires light irradiation, but recently, as part of energy saving, there is a demand for labor saving of the light source. Therefore, attention is focused on LED light sources, and in particular, irradiation of light with an ultraviolet wavelength of 365 nm by LEDs has been attracting attention, and it is an urgent need to provide a photocurable resin composition suitable for it.
例えば、光硬化性樹脂組成物の応用として、特許文献1に記載されるような、耐湿性やヒートサイクル性を要求される分野での保護コーティングとしての使用があり、液晶ディスプレイ又はそのモジュールへの利用が図られている。 For example, as an application of a photocurable resin composition, there is use as a protective coating in a field where moisture resistance and heat cycle properties are required, as described in Patent Document 1, and applied to a liquid crystal display or a module thereof. Use is planned.
また、液晶表示装置は、液晶表示パネルと該液晶表示パネルを裏面から照明するバックライトで構成されている。そして、これらを筐体内に組み込む際には、バックライトの照明光が、液晶表示パネルの画像表示領域のみから透過し、例えば、液晶表示パネルと筐体との隙間などから漏出するのを抑制することが必要である。しかも、液晶表示装置においては、液晶表示装置の画面枠に対する狭額縁の要求があるため、額縁部分における筐体と液晶表示パネルとの隙間からの光漏れが発生し易くなる。 The liquid crystal display device includes a liquid crystal display panel and a backlight that illuminates the liquid crystal display panel from the back surface. When these are incorporated into the housing, the illumination light of the backlight is transmitted only from the image display area of the liquid crystal display panel, and is prevented from leaking from, for example, a gap between the liquid crystal display panel and the housing. It is necessary. In addition, in the liquid crystal display device, since there is a demand for a narrow frame for the screen frame of the liquid crystal display device, light leakage from the gap between the casing and the liquid crystal display panel at the frame portion is likely to occur.
そこで、光漏れ対策としては、特許文献2のように、遮光性両面接着シートをバックライトと液晶表示パネルとの間の周辺部に配置する方法、特許文献3のように、光反射防止膜または光反射防止テープやスプレーなどで吹き付ける黒色の塗料などの光漏洩防止材(遮光材料)をバックライトを収納するためのケースと液晶表示パネルとの間に配置する方法等が提案されている。 Therefore, as a countermeasure against light leakage, as disclosed in Patent Document 2, a light-shielding double-sided adhesive sheet is disposed in the peripheral portion between the backlight and the liquid crystal display panel, and as disclosed in Patent Document 3, a light reflection preventing film or There has been proposed a method of arranging a light leakage prevention material (light shielding material) such as a black paint sprayed with a light reflection preventing tape or a spray between a case for housing a backlight and a liquid crystal display panel.
しかしながら、これらの方法では遮光シートの幅が狭くなると配置する作業が煩雑になり、寸法精度や作業に時間がかかるという問題が生じ、また、遮光性塗料を塗布する方法の場合、溶剤乾燥型や加熱硬化型は、塗料を完全に乾燥硬化させる為に、高温度処理、また長時間処理が必要である。一方、短時間処理、例えば数秒〜数分での硬化が可能な光硬化性遮光塗料が開発されているが、遮光に必要な膜厚(例えば、数百μm程度)を硬化させる光硬化性遮光材料は得られていない。 However, in these methods, when the width of the light-shielding sheet becomes narrow, the work of arranging becomes complicated, and there arises a problem that it takes time for dimensional accuracy and work. In the case of a method of applying a light-shielding paint, a solvent drying type or The heat-curing type requires high-temperature treatment and long-time treatment in order to completely dry and cure the paint. On the other hand, photo-curable light-shielding coatings that can be cured in a short time, for example, several seconds to several minutes, have been developed, but photo-curable light-shielding that cures the film thickness necessary for light shielding (for example, about several hundred μm). The material is not available.
本発明は、第一に、LED光源による硬化、特に、LEDによる紫外線波長365nmの光の照射による硬化に適した光硬化性樹脂組成物を提供するものであり、第二に、遮光に有用な光硬化性樹脂組成物、光硬化性遮光塗料及び光漏洩防止剤を提供するものであり、さらに、これらを利用した液晶パネル及び液晶表示装置、並びに光硬化方法を提供するものである。 The present invention provides, firstly, a photocurable resin composition suitable for curing by an LED light source, in particular, curing by irradiation with light having an ultraviolet wavelength of 365 nm by an LED, and secondly, useful for light shielding. The present invention provides a photocurable resin composition, a photocurable light-shielding coating material, and a light leakage preventing agent, and further provides a liquid crystal panel and a liquid crystal display device using these, and a photocuring method.
本発明は、次のものに関する。
1. (A)数平均分子量が900〜10,000の重合性不飽和基を有する樹脂、(B)重合性不飽和基を有する単量体および(C)光重合開始剤を(A)と(B)の総計100質量部に対して、1〜10質量部を含有してなる光硬化性樹脂組成物。
2. (B)成分が、(A)成分50質量部に対して、1〜50質量部を含有する項1に記載の光硬化性樹脂組成物。
3. さらに、(D)チオール化合物を上記(A)と(B)の総計100質量部に対して5〜20質量部を含有する項1又は2のいずれかに記載の光硬化性樹脂組成物。
4. さらに、(E)平均粒子径が10μm以下で遮光性を有するフィラーを、(A)成分と(B)成分の総計100質量部に対して、1〜50質量部含有する項1〜3のいずれかに記載の光硬化性樹脂組成物。
5. さらに、(F)ロイコ化合物を、(A)成分と(B)成分の総計100質量部に対して、0.1〜3.0質量部含む項1〜4のいずれかに記載の光硬化性樹脂組成物。
6. 項4又は5のいずれかに記載の光硬化性樹脂組成物を含む光硬化性遮光塗料。
7. 項4又は5のいずれかに記載の光硬化性樹脂組成物を含む光漏洩防止材。
8. 項6に記載の光硬化性遮光塗料又は項7に記載の光漏洩防止材をパネル外周に塗布し、遮光した液晶表示パネル。
9. 項8に記載された液晶表示パネルを用いた液晶表示装置。
10.項1〜5に記載の光硬化性樹脂組成物、項6記載の光硬化性遮光塗料及び項7記載の光漏洩防止材のいずれかにLED光源に基づく365nm付近の波長を主に含む紫外線を照射することを特徴とする光硬化方法。
The present invention relates to the following.
1. (A) A resin having a polymerizable unsaturated group having a number average molecular weight of 900 to 10,000, (B) a monomer having a polymerizable unsaturated group, and (C) a photopolymerization initiator, (A) and (B The photocurable resin composition containing 1 to 10 parts by mass with respect to 100 parts by mass in total.
2. Item 2. The photocurable resin composition according to Item 1, wherein the component (B) contains 1 to 50 parts by mass with respect to 50 parts by mass of the component (A).
3. Furthermore, (D) The photocurable resin composition in any one of the term 1 or 2 which contains 5-20 mass parts with respect to the total of 100 mass parts of said (A) and (B) thiol compound.
4). Further, any one of Items 1-3, wherein (E) an average particle diameter of 10 μm or less and a light-shielding filler is contained in an amount of 1 to 50 parts by mass relative to a total of 100 parts by mass of the component (A) and the component (B). A photocurable resin composition according to claim 1.
5). Furthermore, the photocurability in any one of claim | item 1-4 which contains 0.1-3.0 mass parts of (F) leuco compounds with respect to a total of 100 mass parts of (A) component and (B) component. Resin composition.
6). Item 6. A photocurable light-shielding coating material comprising the photocurable resin composition according to any one of Items 4 and 5.
7). Item 6. A light leakage preventing material comprising the photocurable resin composition according to Item 4 or 5.
8). Item 7. A liquid crystal display panel that is shielded by applying the photocurable light-shielding coating material according to Item 6 or the light leakage preventing material according to Item 7 to the outer periphery of the panel.
9. Item 9. A liquid crystal display device using the liquid crystal display panel according to item 8.
10. Item 6. The photocurable resin composition according to items 1-5, the photocurable light-shielding coating material according to item 6, and the light leakage prevention material according to item 7, wherein ultraviolet rays mainly containing wavelengths near 365 nm based on LED light sources are used. Irradiating, a photocuring method.
本発明に係る光硬化性樹脂組成物は、LED光源による硬化、特に、LEDによる紫外線波長365nmの光の照射による硬化に適しており、優れた硬化性を示す。特に、(D)成分〔チオール化合物〕を含むことにより、表面硬化性に優れ、さらに、(E)成分〔遮光のためのフィラー〕を含むことにより、LED光源により短時間処理で遮光に必要な膜厚を硬化させることが可能である。また、(F)成分〔ロイコ化合物〕を含むことにより、紫外線を照射することによって色が変化することで、硬化したことを確認できる光硬化性樹脂組成物とすることができる。このような樹脂組成物を遮光塗料又は光漏洩防止剤として液晶パネル側面部へ塗布することで光漏れを抑制した液晶表示装置を提供することができる。また、本発明の光硬化方法によれば、LED光源を用いて、効果的に光硬化させるこができる。 The photocurable resin composition according to the present invention is suitable for curing by an LED light source, particularly curing by irradiation with light having an ultraviolet wavelength of 365 nm by an LED, and exhibits excellent curability. In particular, by including the component (D) [thiol compound], it is excellent in surface curability, and further, by including the component (E) [filler for light shielding], it is necessary for light shielding in a short time with an LED light source. It is possible to cure the film thickness. Moreover, it can be set as the photocurable resin composition which can confirm having hardened | cured by changing a color by irradiating an ultraviolet-ray by containing (F) component [leuco compound]. By applying such a resin composition to the side surface of the liquid crystal panel as a light-shielding paint or a light leakage preventing agent, a liquid crystal display device in which light leakage is suppressed can be provided. Moreover, according to the photocuring method of the present invention, it is possible to effect photocuring effectively using an LED light source.
以下に本発明をその好適な実施形態に即して詳細に説明する。
(A)成分である数平均分子量が900〜10,000の重合性不飽和基を有する樹脂の具体例としては、例えば、ウレタン結合を有する(メタ)アクリレート化合物等のウレタンオリゴマーが例示可能である。これらは1種を単独で又は2種以上を組み合わせて用いることができる。
Hereinafter, the present invention will be described in detail with reference to preferred embodiments thereof.
Specific examples of the resin having a polymerizable unsaturated group having a number average molecular weight of 900 to 10,000 as the component (A) include urethane oligomers such as (meth) acrylate compounds having a urethane bond. . These can be used individually by 1 type or in combination of 2 or more types.
ウレタンオリゴマーとしては、例えば、β位にOH基を有する(メタ)アクリルモノマーとイソホロンジイソシアネート、2,6−トルエンジイソシアネート、2,4−トルエンジイソシアネート、1,6−ヘキサメチレンジイソシアネート等のジイソシアネート化合物との付加反応物、トリス((メタ)アクリロキシテトラエチレングリコールイソシアネート)ヘキサメチレンイソシアヌレート、EO変性ウレタンジ(メタ)アクリレート、EO又はPO変性ウレタンジ(メタ)アクリレート、カルボキシル基含有ウレタン(メタ)アクリレート等が挙げられる。これらは1種を単独で又は2種以上を組み合わせて用いることができる。 Examples of urethane oligomers include (meth) acrylic monomers having an OH group at the β-position and diisocyanate compounds such as isophorone diisocyanate, 2,6-toluene diisocyanate, 2,4-toluene diisocyanate, and 1,6-hexamethylene diisocyanate. Addition reaction products, tris ((meth) acryloxytetraethylene glycol isocyanate) hexamethylene isocyanurate, EO-modified urethane di (meth) acrylate, EO or PO-modified urethane di (meth) acrylate, carboxyl group-containing urethane (meth) acrylate, etc. It is done. These can be used individually by 1 type or in combination of 2 or more types.
本発明に用いられる(B)成分である重合性不飽和基を有する単量体としては、スチレン、ビニルトルエン、α−メチルスチレン、p−ターシャリーブチルスチレン、クロルスチレン、ジビニルベンゼン、ジアリルフタレート、2−ヒドロオキシエチルメタクリレート、2−ヒドロオキシプロピルメタクリレート、メチルメタクリレート、エチルメタクリレート、ラウリルメタクリレート、メタクリル酸とカージュラE−10(シェル化学社製、高級脂肪酸のグリシジルエステルの商品名)の反応物などの1官能性のメタクリル酸エステル、エチレングリコールジメタクリレート、ジエチレングリコールジメタクリレート、1,6−ヘキサンジオールジメタクリレートなどの2官能性のメタクリル酸エステル、トリメチロールプロパントリメタクリレートなどの3官能性のメタクリル酸エステル、メチルアクリレート、エチルアクリレート、ラウリルアクリレート、2−ヒドロオキシエチルアクリレート、2−ヒドロオキシプロピルアクリレート、アクリル酸とカージュラE−10の反応物などの1官能性のアクリル酸エステル、エチレングリコールジアクリレート、ジエチレングリコールジアクリレート、1,6−ヘキサンジオールジアクリレートなどの2官能のアクリル酸エステル、トリメチロールプロパントリアクリレート、ペンタエリスリトールトリアクリレートなどの3官能性のアクリル酸エステル、ペンタエリスリトールテトラアクリレートなどの4官能性のアクリル酸エステル、ペンタエリスリトールヘキサアクリレートなどの6官能性のアクリル酸エステルなどが用いられ、これらの2種以上を組み合わせて使用できる。 As the monomer having a polymerizable unsaturated group (B) used in the present invention, styrene, vinyltoluene, α-methylstyrene, p-tertiarybutylstyrene, chlorostyrene, divinylbenzene, diallyl phthalate, 2-Hydroxyethyl methacrylate, 2-hydroxypropyl methacrylate, methyl methacrylate, ethyl methacrylate, lauryl methacrylate, methacrylic acid and Cardura E-10 (manufactured by Shell Chemical Co., Ltd., trade name of glycidyl ester of higher fatty acid), etc. Monofunctional methacrylate ester, ethylene glycol dimethacrylate, diethylene glycol dimethacrylate, bifunctional methacrylate ester such as 1,6-hexanediol dimethacrylate, trimethylolpropane trime Monofunctional methacrylates such as acrylate, methyl acrylate, ethyl acrylate, lauryl acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, and a reaction product of acrylic acid and Cardura E-10. Bifunctional acrylic esters such as acrylic ester, ethylene glycol diacrylate, diethylene glycol diacrylate, 1,6-hexanediol diacrylate, trifunctional acrylic ester such as trimethylolpropane triacrylate, pentaerythritol triacrylate, For example, tetrafunctional acrylic esters such as pentaerythritol tetraacrylate, hexafunctional acrylic esters such as pentaerythritol hexaacrylate, etc. These can be used in combination of two or more.
これら(B)重合性不飽和基を有する単量体の配合割合は、硬化速度と塗料の粘度、および塗膜の可とう性の点から前記の(A)成分50質量部に対して、1〜50質量部の範囲が好ましく、20〜50質量部の範囲がより好ましい。 The blending ratio of the monomer (B) having a polymerizable unsaturated group is 1 with respect to 50 parts by mass of the component (A) from the viewpoints of the curing speed, the viscosity of the coating material, and the flexibility of the coating film. The range of -50 mass parts is preferable, and the range of 20-50 mass parts is more preferable.
また、(B)重合性不飽和基を有する単量体の中で、重合性二重結合を3個以上有する単量体(B−1)と重合性二重結合が2個以下である単量体(B−2)を併用することが好ましい。その配合割合は、(B−1)成分/(b−2)成分が重量比で10/90〜75/25の範囲であることが好ましい。この比が小さすぎると硬化物の強度が小さくなる傾向があり、この比が大きすぎると硬化物がもろくなる傾向がある。 Among the monomers having a polymerizable unsaturated group (B), a monomer (B-1) having 3 or more polymerizable double bonds and a single monomer having 2 or less polymerizable double bonds. It is preferable to use the monomer (B-2) in combination. The blending ratio of the component (B-1) / component (b-2) is preferably in the range of 10/90 to 75/25 by weight ratio. If this ratio is too small, the strength of the cured product tends to be small, and if this ratio is too large, the cured product tends to be brittle.
(C)成分である光重合開始剤は、増感剤と呼ばれるものも包含される。かかる光重合開始剤の具体例としては、アクリジン又は分子内に少なくとも1つのアクリジニル基を有するアクリジン系化合物、ベンゾフェノン、N,N’−テトラメチル−4,4’−ジアミノベンゾフェノン(ミヒラーケトン)等のN,N’−テトラアルキル−4,4’−ジアミノベンゾフェノン、2−ベンジル−2−ジメチルアミノ−1−(4−モルホリノフェニル)−ブタノン−1、2−メチル−1−[4−(メチルチオ)フェニル]−2−モルフォリノ−プロパノン−1等の芳香族ケトン、アルキルアントラキノン等のキノン類、ベンゾインアルキルエーテル等のベンゾインエーテル化合物、ベンゾイン、アルキルベンゾイン等のベンゾイン化合物、ベンジルジメチルケタール等のベンジル誘導体、2−(o−クロロフェニル)−4,5−ジフェニルイミダゾール二量体、2−(o−クロロフェニル)−4,5−ジ(メトキシフェニル)イミダゾール二量体、2−(o−フルオロフェニル)−4,5−ジフェニルイミダゾール二量体、2−(o−メトキシフェニル)−4,5−ジフェニルイミダゾール二量体、2−(p−メトキシフェニル)−4,5−ジフェニルイミダゾール二量体等の2,4,5−トリアリールイミダゾール二量体、N−フェニルグリシン、N−フェニルグリシン誘導体、クマリン系化合物、オニウム塩などが挙げられる。これらは1種類を単独で又は2種類以上を組み合わせて使用できる。これら(C)光重合開始剤の配合割合は、硬化速度と造膜性、および塗膜の可とう性の点から前記の(A)成分と(B)成分の総量100質量部に対して0.1〜15質量部が好ましく、0.1〜10質量部の範囲がより好ましい。この配合割合が0.1質量部未満であると、光硬化が不十分となる傾向にあり、15質量部を超えると、得られる硬化物の特性(深部硬化性、可とう性及び密着性等)が全般的に低下する傾向にある。 The photopolymerization initiator which is the component (C) includes what is called a sensitizer. Specific examples of such a photopolymerization initiator include acridine or an acridine compound having at least one acridinyl group in the molecule, benzophenone, N, such as N, N′-tetramethyl-4,4′-diaminobenzophenone (Michler ketone), and the like. , N′-tetraalkyl-4,4′-diaminobenzophenone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,2-methyl-1- [4- (methylthio) phenyl ] Aromatic ketones such as 2-morpholino-propanone-1, quinones such as alkylanthraquinones, benzoin ether compounds such as benzoin alkyl ether, benzoin compounds such as benzoin and alkylbenzoin, benzyl derivatives such as benzyldimethyl ketal, 2- (O-chlorophenyl) -4 5-diphenylimidazole dimer, 2- (o-chlorophenyl) -4,5-di (methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-diphenylimidazole dimer, 2 2,4,5-triarylimidazole dimers such as-(o-methoxyphenyl) -4,5-diphenylimidazole dimer, 2- (p-methoxyphenyl) -4,5-diphenylimidazole dimer N-phenylglycine, N-phenylglycine derivatives, coumarin compounds, onium salts and the like. These can be used alone or in combination of two or more. The blending ratio of these (C) photopolymerization initiators is 0 with respect to 100 parts by mass of the total amount of the above-mentioned components (A) and (B) from the viewpoints of curing speed, film-forming property, and coating flexibility. 0.1-15 mass parts is preferable, and the range of 0.1-10 mass parts is more preferable. If the blending ratio is less than 0.1 parts by mass, photocuring tends to be insufficient, and if it exceeds 15 parts by mass, the properties of the resulting cured product (deep part curability, flexibility, adhesion, etc.) ) Generally tends to decrease.
本発明に係る光硬化性樹脂組成物には、好ましくは、(D)成分としてチオール化合物が配合される。これを配合することにより、特に、光硬化性樹脂組成物の硬化に際し、硬化物の表面硬化性が優れる。(D)成分〔チオール化合物〕の具体例としては、チオール基を2個以上有する化合物であれば種々の化合物が使用できる。具体的には、単純なチオールの他に、チオグリコール酸誘導体及びメルカプトプロピオン酸誘導体等が挙げられる。単純なチオールとしては、o−,m−又はp−キシレンジチオール等が挙げられる。チオグリコール酸誘導体としては、エチレングリコールビスチオグリコレート、ブタンジオールビスチオグリコレート、ヘキサンジオールビスチオグリコレート等が挙げられる。メルカプトプロピオン酸誘導体としては、エチレングリコールビスチオプロピオネート、ブタンジオールビスチオプロピオネート、トリメチロールプロパントリスチオプロピオネート、ペンタエリスリトールテトラキスチオプロピオネート及びトリヒドロキシエチルトリイソシアヌール酸トリスチオプロピオネート等が挙げられる。
(D)成分としては、チオール基を2個以上有する化合物が、硬化性に優れるため好ましい。
In the photocurable resin composition according to the present invention, a thiol compound is preferably blended as the component (D). By blending this, the surface curability of the cured product is excellent particularly when the photocurable resin composition is cured. As specific examples of the component (D) [thiol compound], various compounds can be used as long as they have two or more thiol groups. Specific examples include thioglycolic acid derivatives and mercaptopropionic acid derivatives in addition to simple thiols. Simple thiols include o-, m- or p-xylenedithiol. Examples of the thioglycolic acid derivative include ethylene glycol bisthioglycolate, butanediol bisthioglycolate, hexanediol bisthioglycolate, and the like. Mercaptopropionic acid derivatives include ethylene glycol bisthiopropionate, butanediol bisthiopropionate, trimethylolpropane tristhiopropionate, pentaerythritol tetrakisthiopropionate and trihydroxyethyl triisocyanurate tristhioproate. Pionate etc. are mentioned.
As the component (D), a compound having two or more thiol groups is preferable because of excellent curability.
(D)成分の配合量は、上記(A)成分と(B)成分の総計100質量部に対して5〜20質量部とすることが好ましく、5〜15質量部とすることが特に好ましい。(D)成分が少なすぎると表面硬化性の改善効果が小さくなり、多すぎると硬化物がもろくなる傾向がある。 The blending amount of the component (D) is preferably 5 to 20 parts by mass, particularly preferably 5 to 15 parts by mass with respect to the total of 100 parts by mass of the components (A) and (B). If the amount of component (D) is too small, the effect of improving the surface curability will be small, and if it is too large, the cured product tends to be brittle.
本発明に係る光硬化性樹脂組成物に遮光性を付与するために、(E)成分として遮光性を有するフィラーを配合することが好ましい。このフィラーの具体例としては、シリコーンレジンパウダー、シリコーンゴムパウダー、シリコーンゴムパウダーの表面をシリコーンレジンで被覆した複合パウダー、アルミナ、ジルコニア、セラミック微粉、タルク、マイカ、窒化ホウ素、カオリン、又は硫酸バリウム等を使用することができる。 In order to impart light-shielding properties to the photocurable resin composition according to the present invention, it is preferable to blend a light-shielding filler as the component (E). Specific examples of the filler include silicone resin powder, silicone rubber powder, composite powder in which the surface of silicone rubber powder is coated with silicone resin, alumina, zirconia, ceramic fine powder, talc, mica, boron nitride, kaolin, barium sulfate, etc. Can be used.
遮光性の観点から、本発明に使用される(E)成分としては平均粒子径が10μm以下のものが好ましく、さらに平均粒子径が5μm以下のものがより好ましい。平均粒子径が10μmを超えると、遮光性が劣るようになる。なお、本明細書で記載する「平均粒子径」は、光散乱法による測定によって得られる値とする
(E)成分の配合割合は(A)成分と(B)成分の総量100質量部に対して1〜50質量部、好ましくは1〜20質量部配合することが好ましい。該配合割合が1質量部未満では遮光の効果が小さくなる傾向があり、50質量部を越えても取り立てて遮光性に更なる効果が見られず、また粘度が上昇し取り扱いが難しくなる傾向がある。
From the viewpoint of light shielding properties, the component (E) used in the present invention preferably has an average particle size of 10 μm or less, and more preferably has an average particle size of 5 μm or less. When the average particle diameter exceeds 10 μm, the light shielding property is deteriorated. The “average particle diameter” described in the present specification is a value obtained by measurement by a light scattering method. The blending ratio of the component (E) is 100 parts by mass of the total amount of the components (A) and (B). 1 to 50 parts by mass, preferably 1 to 20 parts by mass. If the blending ratio is less than 1 part by mass, the light-shielding effect tends to be small, and even if it exceeds 50 parts by mass, no further effect on the light-shielding property is observed, and the viscosity tends to increase and handling becomes difficult. is there.
硬化したこと又は硬化のための光が照射されたことを確認するために用いられる(F)成分であるロイコ化合物としては、例えばトリス(4−ジメチルアミノフェニル)メタン[ロイコクリスタルバイオレット]、トリス(4−ジエチルアミノ−2−メチルフェニル)メタン、ロイコマラカイトグリーン、ロイコアニリン、ロイコメチルバイオレット等が挙げられる。かかる(F)ロイコ化合物の配合割合は(A)成分と(B)成分の総量100質量部に対して0.1〜3.0質量部、好ましくは0.1〜2.0質量部配合することが好ましい。該配合割合が0.1質量部未満では光硬化後の着色が薄くなり遮光の効果が小さく、3.0質量部を越えても取り立てて効果が見られない。 Examples of the leuco compound as the component (F) used for confirming that it has been cured or irradiated with light for curing include tris (4-dimethylaminophenyl) methane [leuco crystal violet], tris ( 4-diethylamino-2-methylphenyl) methane, leucomalachite green, leucoaniline, leucomethyl violet and the like. The blending ratio of the (F) leuco compound is 0.1 to 3.0 parts by weight, preferably 0.1 to 2.0 parts by weight, based on 100 parts by weight of the total amount of the components (A) and (B). It is preferable. If the blending ratio is less than 0.1 parts by mass, the color after photocuring becomes thin and the effect of shading is small, and even if it exceeds 3.0 parts by mass, no effect is seen.
本発明の光硬化性遮光塗料又は光漏洩防止剤は、前記の(A)、(B)、(C)、(D)及び(E)の各成分を配合することによって得られ、好ましくはさらに(F)成分が配合される。 The photocurable light-shielding paint or light leakage preventive agent of the present invention is obtained by blending the components (A), (B), (C), (D) and (E), preferably further (F) A component is mix | blended.
また、本発明に係る光硬化性樹脂組成物、光硬化性遮光塗料又は光漏洩防止剤には、必要に応じてカップリング剤、重合禁止剤、および着色剤などを添加することができる。 In addition, a coupling agent, a polymerization inhibitor, a colorant, and the like can be added to the photocurable resin composition, the photocurable light-shielding coating material, or the light leakage preventing agent according to the present invention as necessary.
カップリング剤としては、チタネート系カップリング剤およびシラン系カップリング剤があり、チタネート系カップリング剤は、少なくとも炭素数1〜60のアルキレート基を有するチタネート系カップリング剤、アルキルホスファイト基を有するチタネート系カップリング剤、アルキルホスフェート基を有するチタネート系カップリング剤もしくはアルキルパイロホスフェート基を有するチタネート系カップリング剤等が挙げられる。具体的にはイソプロピルトリイソステアロイルチタネート、イソプロピルトリオクタノイルチタネート、イソプロピルジメタクリルイソステアロイルチタネート、イソプロピルイソステアロイルジアクリルチタネート、イソプロピルトリス(ジオクチルパイロホスフェート)チタネート、テトラオクチルビス(ジトリデシルホスファイト)チタネート、テトラ(2,2−ジアリルオキシメチル−1−ブチル)ビス(ジトリデシル)ホスファイトチタネート、ビス(ジオクチルパイロホスフェート)オキシアセテートチタネート、ビス(ジオクチルパイロホスフェート)エチレンチタネートなどが挙げられる。 The coupling agent includes a titanate coupling agent and a silane coupling agent. The titanate coupling agent includes a titanate coupling agent having an alkylate group having at least 1 to 60 carbon atoms and an alkyl phosphite group. And titanate coupling agents having an alkyl phosphate group, titanate coupling agents having an alkyl phosphate group, and titanate coupling agents having an alkyl phosphate group. Specifically, isopropyl triisostearoyl titanate, isopropyl trioctanoyl titanate, isopropyl dimethacryl isostearoyl titanate, isopropyl isostearoyl diacryl titanate, isopropyl tris (dioctyl pyrophosphate) titanate, tetraoctyl bis (ditridecyl phosphite) titanate, Examples include tetra (2,2-diallyloxymethyl-1-butyl) bis (ditridecyl) phosphite titanate, bis (dioctylpyrophosphate) oxyacetate titanate, bis (dioctylpyrophosphate) ethylene titanate, and the like.
またシラン系カップリング剤は、アミノ系シランカップリング剤、ウレイド系シランカップリング剤、ビニル系シランカップリング剤、メタクリル系シランカップリング剤、エポキシ系シランカップリング剤、メルカプト系シランカップリング剤及びイソシアネート系シランカップリング剤等が挙げられる。具体的には、γ−アミノプロピルトリエトキシシラン、γ−アミノプロピルトリメトキシシラン、N−β−(アミノエチル)−γ−アミノプロピルトリメトキシシラン、γ−フェニルアミノプロピルトリメトキシシラン、ウレイドプロピルトリエトキシシラン、ビニルトリエトキシシラン、ビニルトリメトキシシラン、ビニルトリス(β−メトキシエトキシ)シラン、γ−メタクリロキシプロピルトリメトキシシラン、γ−メタクリロキシプロピルメチルジメトキシシラン、β−(3,4−エポキシシクロヘキシル)エチルトリメトキシシラン、γ−グリシドキシプロピルトリメトキシシラン、γ−メルカプトプロピルトリメトキシシラン、γ−イソシアネートプロピルトリメトキシシランなどが挙げられ、これらは単独でまたは2種以上を組み合わせて使用できる。 Silane coupling agents include amino silane coupling agents, ureido silane coupling agents, vinyl silane coupling agents, methacrylic silane coupling agents, epoxy silane coupling agents, mercapto silane coupling agents and An isocyanate silane coupling agent etc. are mentioned. Specifically, γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, N-β- (aminoethyl) -γ-aminopropyltrimethoxysilane, γ-phenylaminopropyltrimethoxysilane, ureidopropyltri Ethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, vinyltris (β-methoxyethoxy) silane, γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropylmethyldimethoxysilane, β- (3,4-epoxycyclohexyl) Examples include ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, and γ-isocyanatopropyltrimethoxysilane, which are used alone or in combination of two or more. It can be used Te.
重合禁止剤としては、ハイドロキノン、ハイドロキノンモノメチルエーテル、ベンゾキノン、p−tert−ブチルカテコール、2,6−ジ−tert−ブチル−4−メチルフェノール、ピロガロール等のキノン類、その他一般に使用されているものが用いられる。 Polymerization inhibitors include hydroquinone, hydroquinone monomethyl ether, benzoquinone, p-tert-butylcatechol, quinones such as 2,6-di-tert-butyl-4-methylphenol, pyrogallol, and other commonly used ones. Used.
消泡剤としては例えば、シリコーン系オイル、フッ素系オイル、ポリカルボン酸系ポリマーなど一般に使用されているものが挙げられる。 Examples of the antifoaming agent include those commonly used such as silicone oil, fluorine oil, and polycarboxylic acid polymer.
着色剤として、黒色染料〔例えば、OPLAS Black 833(オリエント化学工業株式会社製)〕を配合すると、光硬化性樹脂組成物に光を照射しても硬化が不十分になる可能性があるので、注意を要する。 When a black dye [for example, OPLAS Black 833 (manufactured by Orient Chemical Co., Ltd.)] is blended as a colorant, there is a possibility that curing may be insufficient even if the photocurable resin composition is irradiated with light. Need attention.
本発明に係る光硬化性樹脂組成物、光硬化性遮光塗料又は光漏洩防止剤は、液晶表示パネル側面部にディスペンサー装置等で塗布され、それぞれの目的に応じて利用される。この際、樹脂組成物の硬化のためには、高圧水銀灯、メタルハライドランプ等を光源としたランプ方式およびLED方式のUV照射装置を用い、必要量の紫外線を照射し硬化させることができる。 The photocurable resin composition, the photocurable light-shielding paint, or the light leakage preventing agent according to the present invention is applied to the side surface of the liquid crystal display panel with a dispenser device or the like, and is used according to each purpose. At this time, in order to cure the resin composition, it is possible to cure by irradiating a necessary amount of ultraviolet rays using a lamp type or LED type UV irradiation apparatus using a high pressure mercury lamp, a metal halide lamp or the like as a light source.
本発明に係る光硬化性樹脂組成物、光硬化性遮光塗料又は光漏洩防止剤は、LED光源により光照射することが好ましく適しており、特に、主に365nmの波長の光を照射することが好ましく適している。主に365nmの波長の光とは、365nmの単波長の光だけでなく、365nmを中心とする光であり、例えば、350nm〜380nmの波長の光が、全体の光量の90%以上を占める光である。 The photocurable resin composition, the photocurable light-shielding paint or the light leakage preventive agent according to the present invention is preferably suitably irradiated with light from an LED light source, and in particular, may be irradiated mainly with light having a wavelength of 365 nm. Preferably suitable. The light mainly having a wavelength of 365 nm is not only light having a single wavelength of 365 nm but also light having a center of 365 nm. For example, light having a wavelength of 350 nm to 380 nm accounts for 90% or more of the total light amount. It is.
照射する光量は、配合(特に、光重合開始剤の種類及び量、充填材や染料の有無、使用する場合の充填材や染料の種類及び量など)を考慮して、十分に硬化する程度で決定されるが、例えば、光硬化性樹脂組成物、光硬化性遮光塗料又は光漏洩防止剤の厚さ300μm当たり、50〜3000mJ/cm2の範囲から適宜決定され、充填材や染料を含む場合は、光量を多い目にすることが好ましく、例えば、300mJ/cm2以上とされ、また、エネルギーコストや適度な硬化度を考慮すると1500mJ/cm2以下とされることが好ましい。 The amount of light to be irradiated is such that it cures sufficiently in consideration of the formulation (especially the type and amount of photopolymerization initiator, the presence or absence of fillers and dyes, the type and amount of fillers and dyes when used, etc.). For example, when it is appropriately determined from the range of 50 to 3000 mJ / cm 2 per 300 μm thickness of the photocurable resin composition, the photocurable light-shielding paint or the light leakage preventing agent, and contains a filler or a dye is preferably to more eyes light quantity, for example, is a 300 mJ / cm 2 or more, and is preferably in consideration of the energy cost and moderate degree of curing and 1500 mJ / cm 2 or less.
以下、本発明を実施例により詳細に説明する。以下に示す実施例は、本発明を好適に説明する例示であって、なんら本発明を限定するものではない。 Hereinafter, the present invention will be described in detail with reference to examples. The following examples are illustrations for suitably explaining the present invention, and do not limit the present invention.
(A−1)成分としてTA37−248A(日立化成ポリマー株式会社製、ウレタンアクリレート樹脂、数平均分子量約1,800)35質量部、(A−2)成分としてUN−3320HA(根上工業株式会社製、ウレタンアクリレート樹脂、数平均分子量約1,000)25質量部(B−1)成分としてジペンタエリスリトールヘキサアクリレート10質量部、(B−2)成分としてイソボルニルアクリレート30質量部、(C−1)成分として1−ヒドロキシーシクロヘキシルーフェニル−ケトン4質量部、(C−2)成分としてビス(2,4,6−トリメチルベンゾイル)−フェニルフォスフィンオキサイド1.0質量部、(D)成分としてペンタエリスリトールテトラキス(3−メルカプトブチレート)10質量部、(E)成分としKMP−605(信越化学工業株式会社製、シリコーン複合パウダー、平均粒子径2μm)8質量部、さらに(F)成分としてロイコクリスタルバイオレット1.0質量部、を混合し、60℃で加熱攪拌して光硬化性樹脂組成物(遮光塗料もしくは光漏洩防止材)を得た。 TA37-248A (Hitachi Chemical Polymer Co., Ltd., urethane acrylate resin, number average molecular weight of about 1,800) 35 parts by mass as component (A-1), UN-3320HA (manufactured by Negami Kogyo Co., Ltd.) as component (A-2) , Urethane acrylate resin, number average molecular weight of about 1,000) 25 parts by mass (B-1) component 10 parts by mass of dipentaerythritol hexaacrylate, (B-2) 30 parts by mass of isobornyl acrylate, (C- 1) 4 parts by mass of 1-hydroxycyclohexylphenyl-ketone as component, 1.0 part by mass of bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide as component (C-2), component (D) 10 parts by mass of pentaerythritol tetrakis (3-mercaptobutyrate) as component (E) 8 parts by mass of MP-605 (manufactured by Shin-Etsu Chemical Co., Ltd., silicone composite powder, average particle size 2 μm) and 1.0 part by mass of leuco crystal violet as component (F) were mixed and heated and stirred at 60 ° C. A photocurable resin composition (light-shielding paint or light leakage prevention material) was obtained.
実施例1のTA37−248A 35質量部をTE−2000(日本曹達株式会社製、アクリル変性ポリブタジエン樹脂、数平均分子量:約1,000)35質量部に変えたこと以外は実施例1と同様にした。 Except for changing 35 parts by mass of TA37-248A of Example 1 to 35 parts by mass of TE-2000 (manufactured by Nippon Soda Co., Ltd., acrylic-modified polybutadiene resin, number average molecular weight: about 1,000), the same as Example 1 did.
実施例1のペンタエリスリトールテトラキス(3−メルカプトブチレート)10質量部を1,3,5−トリス(3−メルカブトブチルオキシエチル)−1,3,5−トリアジン−2,4,6(1H,3H,5H)−トリオン10質量部に変えたこと以外は実施例1と同様にした。 10 parts by mass of pentaerythritol tetrakis (3-mercaptobutyrate) of Example 1 was replaced with 1,3,5-tris (3-mercaptobutyloxyethyl) -1,3,5-triazine-2,4,6 (1H , 3H, 5H) -trione The procedure was the same as Example 1 except that the amount was changed to 10 parts by mass.
実施例1のKMP−605 20質量部をKMP−600(信越化学工業株式会社製、シリコーン複合パウダー、平均粒子径5μm)8質量部に変えたこと以外は実施例1と同様にした。 The same procedure as in Example 1 was performed except that 20 parts by mass of KMP-605 of Example 1 was changed to 8 parts by mass of KMP-600 (manufactured by Shin-Etsu Chemical Co., Ltd., silicone composite powder, average particle size 5 μm).
実施例1のロイコクリスタルバイオレット1.0質量部を3−ジブチルアミノ−6−メチル−7−アニリノフルオラン1.0質量部変えたこと以外は実施例1と同様にした。 The procedure was the same as Example 1 except that 1.0 part by mass of leuco crystal violet of Example 1 was changed to 1.0 part by mass of 3-dibutylamino-6-methyl-7-anilinofluorane.
実施例1のロイコクリスタルバイオレット1.0質量部を加えないこと以外は実施例1と同様にした。 The procedure was the same as Example 1 except that 1.0 part by mass of leuco crystal violet of Example 1 was not added.
実施例1のペンタエリスリトール テトラキス(3−メルカプトブチレート)10質量部を加えないこと以外は実施例1と同様にした。 The same procedure as in Example 1 was conducted except that 10 parts by mass of pentaerythritol tetrakis (3-mercaptobutyrate) in Example 1 was not added.
実施例1のKMP−605 8質量部を加えないこと以外は実施例1と同様にした。 The same procedure as in Example 1 was conducted except that 8 parts by mass of KMP-605 in Example 1 was not added.
実施例1のKMP−605 8質量部、ロイコクリスタルバイオレット1.0質量部、ペンタエリスリトール テトラキス(3−メルカプトブチレート)10質量部、を加えないこと以外は実施例1と同様にした。 The same procedure as in Example 1 was carried out except that 8 parts by mass of KMP-605 of Example 1, 1.0 part by mass of leucocrystal violet, and 10 parts by mass of pentaerythritol tetrakis (3-mercaptobutyrate) were not added.
実施例1のロイコクリスタルバイオレット1.0質量部、ペンタエリスリトールテトラキス(3−メルカプトブチレート)10質量部、を加えないこと以外は実施例1と同様にした。 Example 1 was carried out in the same manner as in Example 1 except that 1.0 part by mass of leuco crystal violet and 10 parts by mass of pentaerythritol tetrakis (3-mercaptobutyrate) in Example 1 were not added.
実施例1のKMP−605 8質量部をトスパール1110(モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社製、シリコーンパウダー、平均粒子径11μm) 8質量部に変えたこと以外は実施例1と同様にした。 Except for changing 8 parts by mass of KMP-605 of Example 1 to 8 parts by mass of Tospearl 1110 (manufactured by Momentive Performance Materials Japan GK, silicone powder, average particle size 11 μm), the same as Example 1 was performed. .
以上で得た光硬化性樹脂組成物について、深部硬化性、表面硬化性、色変化、および透過率について下記のようにして評価した。結果を、配合とともに表1に示す。 About the photocurable resin composition obtained above, deep part curability, surface curability, color change, and transmittance were evaluated as follows. The results are shown in Table 1 together with the formulation.
〔深部硬化性〕
実施例1〜11で得られた光硬化性樹脂組成物を深さが5mmの鋳型へ流し込み、これに紫外線照射装置(日本電池株式会社製、UV−0308)でバンドパスフィルターを使用し365nm付近以外の光を取り除いて波長365nmをピークとした光を、照射出力100mW/cm2で総照射量が500mJ/cm2になるように照射して、硬化物の厚みをマイクロメータ((株)ミツトヨ製、MDC−MJ)で測定した。
[Deep part curability]
The photocurable resin composition obtained in Examples 1 to 11 was poured into a mold having a depth of 5 mm, and a bandpass filter was used at around 365 nm with an ultraviolet irradiation device (manufactured by Nippon Battery Co., Ltd., UV-0308). The light having a wavelength of 365 nm was removed by removing light other than the above and irradiated so that the total irradiation amount was 500 mJ / cm 2 at an irradiation output of 100 mW / cm 2 , and the thickness of the cured product was measured with a micrometer (Mittoyo Corporation). Manufactured by MDC-MJ).
〔表面硬化性〕
実施例1〜11で得られた光硬化性樹脂組成物をガラス板に300μm厚みになるように塗布し、得られた塗膜に紫外線照射装置(日本電池株式会社製、UV−0308)でバンドパスフィルターを使用し365nm付近以外の光を取り除いて波長365nmをピークとした光を、照射出力100mW/cm2で総照射量が500mJ/cm2になるように照射して試験片を作製し、塗膜表面のべたつきについて指触評価した。べたつきがないものを「○」」、べとつきがあり塗料が指につくものを「×」として評価した。
[Surface curing]
The photocurable resin composition obtained in Examples 1 to 11 was applied to a glass plate so as to have a thickness of 300 μm, and the obtained coating film was banded with an ultraviolet irradiation device (manufactured by Nippon Battery Co., Ltd., UV-0308). Using a pass filter, light other than around 365 nm is removed and light having a peak at a wavelength of 365 nm is irradiated so that the total irradiation amount is 500 mJ / cm 2 at an irradiation output of 100 mW / cm 2 , and a test piece is prepared. The touch of the surface of the coating film was evaluated. Evaluations were made as “O” for those without stickiness, and “X” for those with stickiness and paint on fingers.
〔透過率〕
表面硬化性の評価と同様に、実施例1〜11で得られた光硬化性樹脂組成物をガラス板に300μm厚みになるように塗布し、得られた塗膜に紫外線照射装置(日本電池株式会社製、UV−0308)でバンドパスフィルターを使用し365nm付近以外の光を取り除いて波長365nmをピークとした光を、照射出力100mW/cm2で総照射量が500mJ/cm2になるように照射して試験片を作製し、分光光度計((株)日立ハイテクノロジーズ製、商品名「U―3310」)を用いて、400〜700nmにおける平均光透過率を測定した。
[Transmissivity]
Similarly to the evaluation of the surface curability, the photocurable resin composition obtained in Examples 1 to 11 was applied to a glass plate so as to have a thickness of 300 μm, and an ultraviolet irradiation device (Nippon Battery Co., Ltd.) was applied to the obtained coating film. Company-manufactured, UV-0308) using a bandpass filter to remove light other than around 365 nm and peaking at a wavelength of 365 nm so that the total irradiation amount is 500 mJ / cm 2 at an irradiation output of 100 mW / cm 2. A test piece was prepared by irradiation, and the average light transmittance at 400 to 700 nm was measured using a spectrophotometer (trade name “U-3310” manufactured by Hitachi High-Technologies Corporation).
Claims (9)
(B)重合性不飽和基を有する単量体と、
(C)光重合開始剤と、
(E)平均粒子径が2μm以上10μm以下であり、シリコーンレジンパウダー、シリコーンゴムパウダー、シリコーンゴムパウダーの表面をシリコーンレジンで被覆した複合パウダー、アルミナ、ジルコニア、セラミック微粉、タルク、マイカ、窒化ホウ素、カオリン、及び硫酸バリウムからなる群より選ばれる少なくとも1種のフィラーと、
(F)ロイコ化合物と、を含有し、
(C)成分の含有量が、(A)成分と(B)成分の総計100質量部に対して、1〜10質量部であり、
光硬化性遮光塗料又は光漏洩防止材に用いられる、光硬化性樹脂組成物。 (A) a resin having a polymerizable unsaturated group having a number average molecular weight of 900 to 10,000;
(B) a monomer having a polymerizable unsaturated group;
(C) a photopolymerization initiator;
(E) An average particle diameter of 2 μm or more and 10 μm or less, a silicone resin powder, a silicone rubber powder, a composite powder in which the surface of the silicone rubber powder is coated with a silicone resin, alumina, zirconia, ceramic fine powder, talc, mica, boron nitride, At least one filler selected from the group consisting of kaolin and barium sulfate;
(F) a leuco compound ,
(C) Content of a component is 1-10 mass parts with respect to a total of 100 mass parts of (A) component and (B) component,
A photocurable resin composition used for a photocurable light-shielding paint or a light leakage prevention material.
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