JP6331389B2 - Light emitting device - Google Patents

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JP6331389B2
JP6331389B2 JP2013271859A JP2013271859A JP6331389B2 JP 6331389 B2 JP6331389 B2 JP 6331389B2 JP 2013271859 A JP2013271859 A JP 2013271859A JP 2013271859 A JP2013271859 A JP 2013271859A JP 6331389 B2 JP6331389 B2 JP 6331389B2
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emitting element
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JP2015126209A (en
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雄祐 川野
雄祐 川野
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Nichia Corp
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Description

本発明は、発光装置に関する。   The present invention relates to a light emitting device.

特許文献１に記載の半導体発光装置は、パッケージの凹部に、赤色発光素子、青色発光素子、及び緑色発光素子が配置されている（例えば、図１及び図２参照）。これにより、１つの半導体発光装置内から異なる色を発光させることができる。   In the semiconductor light emitting device described in Patent Document 1, a red light emitting element, a blue light emitting element, and a green light emitting element are arranged in a recess of a package (see, for example, FIGS. 1 and 2). Thereby, different colors can be emitted from within one semiconductor light emitting device.

特開2009-188201号公報JP 2009-188201

しかしながら、特許文献１に記載の半導体発光装置においては、赤色、緑色及び青色発光素子のそれぞれの駆動電圧、温度特性及び寿命特性が異なることから、半導体発光装置として特性が安定していなかった。   However, in the semiconductor light-emitting device described in Patent Document 1, the driving voltage, temperature characteristics, and life characteristics of the red, green, and blue light-emitting elements are different, so that the characteristics of the semiconductor light-emitting device are not stable.

本発明は、上記問題に鑑みてなされたものであり、特性が安定した発光装置を提供することを目的とする。   The present invention has been made in view of the above problems, and an object thereof is to provide a light emitting device having stable characteristics.

本発明にかかる発光装置は、基体と、基体上に配置される第１発光素子及び第２発光素子と、第１発光素子の上面に設けられた第１透光性部材と、第２発光素子の上面に設けられた第２透光性部材と、第１及び第２発光素子の側面並びに第１及び第２透光性部材の側面を被覆する遮光部材と、を有する。特に、第１及び第２発光素子は青色光を発する発光素子であり、第１透光性部材は波長変換部材を含まず、第２透光性部材は波長変換部材を含む。   A light emitting device according to the present invention includes a base, a first light emitting element and a second light emitting element disposed on the base, a first translucent member provided on an upper surface of the first light emitting element, and a second light emitting element. And a light shielding member that covers the side surfaces of the first and second light-emitting elements and the side surfaces of the first and second light-transmissive members. In particular, the first and second light emitting elements are light emitting elements that emit blue light, the first light transmissive member does not include a wavelength conversion member, and the second light transmissive member includes a wavelength conversion member.

本発明によれば、発光装置内に載置する発光素子を青色光を発する発光素子に統一し、波長変換部材を用いて異なる色を発光させているため、特性の安定した発光装置とすることができる。   According to the present invention, the light emitting element mounted in the light emitting device is unified with the light emitting element that emits blue light, and the wavelength conversion member is used to emit different colors. Can do.

図１は、第１実施形態に係る発光装置を光取出し面側から見た概略平面図である。FIG. 1 is a schematic plan view of the light emitting device according to the first embodiment as viewed from the light extraction surface side. 図２は、図１の発光装置を説明するための概略断面図である。FIG. 2 is a schematic cross-sectional view for explaining the light emitting device of FIG. 図３は、図１の発光装置の第２透光性部材の変形例を示すための概略断面図である。FIG. 3 is a schematic cross-sectional view for illustrating a modification of the second light transmissive member of the light emitting device of FIG. 1. 図４は、第２実施形態に係る発光装置を光取出し面側から見た概略平面図である。FIG. 4 is a schematic plan view of the light emitting device according to the second embodiment as viewed from the light extraction surface side. 図５は、図４の発光装置を説明するための概略断面図である。FIG. 5 is a schematic cross-sectional view for explaining the light emitting device of FIG. 図６は、第３実施形態に係る発光装置を光取出し面側から見た概略平面図である。FIG. 6 is a schematic plan view of the light emitting device according to the third embodiment as viewed from the light extraction surface side. 図７は、第４実施形態に係る発光装置を光取出し面側から見た概略平面図である。FIG. 7 is a schematic plan view of the light emitting device according to the fourth embodiment as viewed from the light extraction surface side.

以下に図面を参照しながら、本発明を実施するための形態を説明する。ただし、以下に示す形態は、本発明の技術思想を具体化するための例示であって、本発明を以下に限定するものではない。また、各図面が示す部材の大きさや位置関係等は、説明を明確にするために誇張していることがある。さらに、同一の名称、符号については、原則として同一もしくは同質の部材を示しており、重複した説明は適宜省略する。なお、各部材については少なくとも１つあればよく、複数個あってもよいものとする。   Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. However, the form shown below is the illustration for materializing the technical idea of this invention, Comprising: This invention is not limited to the following. In addition, the size, positional relationship, and the like of the members illustrated in each drawing may be exaggerated for clarity of explanation. Further, in principle, the same name and reference sign indicate the same or the same members, and a duplicate description will be omitted as appropriate. Each member may be at least one, and a plurality of members may be provided.

＜第１実施形態＞
図１に、本実施形態に係る発光装置１００を光取出し面（上面）側から見た概略平面図を示す。また、図２は図１のＸ−Ｘにおける概略断面図である。発光装置１００は、基体１０と、基体１０上に配置される第１発光素子２１及び第２発光素子２２と、第１発光素子２１の上面に設けられた第１透光性部材３１と、第２発光素子２２の上面に設けられた第２透光性部材３２と、第１及び第２発光素子の側面並びに第１及び第２透光性部材の側面を被覆する遮光部材４０と、を有する。特に、第１及び第２発光素子は青色光を発する発光素子であり、第１透光性部材３１は波長変換部材を含まず、第２透光性部材３２は波長変換部材を含む。 <First Embodiment>
FIG. 1 is a schematic plan view of the light emitting device 100 according to the present embodiment as viewed from the light extraction surface (upper surface) side. FIG. 2 is a schematic sectional view taken along line XX in FIG. The light emitting device 100 includes a base 10, a first light emitting element 21 and a second light emitting element 22 disposed on the base 10, a first translucent member 31 provided on the upper surface of the first light emitting element 21, A second light transmissive member 32 provided on the upper surface of the two light emitting elements 22; and a light shielding member 40 covering the side surfaces of the first and second light emitting elements and the side surfaces of the first and second light transmissive members. . In particular, the first and second light emitting elements are light emitting elements that emit blue light, the first light transmissive member 31 does not include a wavelength conversion member, and the second light transmissive member 32 includes a wavelength conversion member.

本実施形態では、発光装置１００内に載置される発光素子（第１発光素子２１及び第２発光素子２２）を青色光を発する発光素子で統一し、波長変換部材を含む透光性部材と波長変換部材を含まない透光性部材とを用いて異なる色を発光させている。これにより、異なる種類の発光素子を用いる必要がないため、寿命特性を各色で揃えることができる。
以下に、発光装置１００に用いられる主な部材について詳しく説明する。 In the present embodiment, the light-emitting elements (first light-emitting element 21 and second light-emitting element 22) placed in the light-emitting device 100 are unified with light-emitting elements that emit blue light, and a translucent member including a wavelength conversion member is used. Different colors are emitted using a translucent member that does not include a wavelength conversion member. Thereby, since it is not necessary to use a different kind of light emitting element, a lifetime characteristic can be arrange | equalized with each color.
Hereinafter, main members used in the light emitting device 100 will be described in detail.

（基体１０）
基体１０は、第１発光素子２１及び第２発光素子２２を載置するための部材であり、基体１０上には配線が形成されている。第１発光素子２１及び第２発光素子２２は、配線に対して直接的に配置されてもよいし、何らかの部材を介して間接的に配置されてもよい。基体１０の形状は特に限定されないが、好ましくは、板状体とすることができる。 (Substrate 10)
The base 10 is a member for mounting the first light emitting element 21 and the second light emitting element 22, and wiring is formed on the base 10. The 1st light emitting element 21 and the 2nd light emitting element 22 may be arrange | positioned directly with respect to wiring, and may be arrange | positioned indirectly via a certain member. Although the shape of the base | substrate 10 is not specifically limited, Preferably, it can be set as a plate-shaped object.

基体１０としては、例えば、セラミックス（Ａｌ２Ｏ３、ＡｌＮなど）、あるいはフェノール樹脂、エポキシ樹脂、ポリイミド樹脂、ＢＴ樹脂（bismaleimide triazine resin）、ポリフタルアミド（ＰＰＡ）樹脂などを用いることができる。発光装置１００では、セラミックスを用いており、外部からの電力を供給するために各色につき一対の電極が備えられている。 As the substrate 10, for example, ceramics (Al 2 O 3 , AlN, etc.), phenol resin, epoxy resin, polyimide resin, BT resin (bismaleimide triazine resin), polyphthalamide (PPA) resin, or the like can be used. The light emitting device 100 uses ceramics and is provided with a pair of electrodes for each color in order to supply electric power from the outside.

図１では上面視において正方形で示しているが、基体１０の形状は、例えば長方形とすることもできる。また、基体１０の外形（つまり、発光装置１００の外形）は、例えば、一辺が５ｍｍ以下、好ましくは３．５ｍｍ以下とすることができる。こうすることで、基体１０を別の部材に実装する際に生じる半田のクラック発生を抑制することができる。なお、ここでは一例を示したのみであり、この大きさに限定されないことは言うまでもない。   In FIG. 1, the top surface 10 is shown as a square, but the shape of the base body 10 may be a rectangle, for example. Further, the outer shape of the substrate 10 (that is, the outer shape of the light emitting device 100) can be, for example, 5 mm or less on one side, preferably 3.5 mm or less. By doing so, it is possible to suppress the occurrence of solder cracks that occur when the base 10 is mounted on another member. It should be noted that only an example is shown here, and it is needless to say that the size is not limited to this.

（第１発光素子２１及び第２発光素子２２）
第１発光素子２１及び第２発光素子２２は青色に発する発光素子（以下、青色発光素子という。）であり、基体上に載置されている。青色発光素子としては、青色領域（４３０ｎｍ〜４９０ｎｍ）にピーク波長を有するＧａＮ系のＬＥＤを用いることができる。こうすることで、素子間における特性のばらつきをより低減し、安定した特性を得ることができる。 (First light emitting element 21 and second light emitting element 22)
The first light emitting element 21 and the second light emitting element 22 are light emitting elements that emit blue light (hereinafter referred to as blue light emitting elements), and are placed on a substrate. As the blue light emitting element, a GaN-based LED having a peak wavelength in a blue region (430 nm to 490 nm) can be used. By doing so, it is possible to further reduce variation in characteristics between elements and obtain stable characteristics.

第１発光素子２１及び第２発光素子２２としてはサファイア基板などの透光性の成長基板を備えるものを用いてもよいし、成長基板を剥離し半導体層が露出しているものを用いてもよい。各発光素子は、フリップチップ実装で基体に載置するのが好ましい。発光装置１００においては、バンプにより基体と電気的に接続されているが、他の例としてＡｕＳｎペースト、半田ペースト、異方性導電層等の導電部材を用いて接続することもできる。   As the 1st light emitting element 21 and the 2nd light emitting element 22, what is provided with translucent growth substrates, such as a sapphire substrate, may be used, and the thing which peeled the growth substrate and exposed the semiconductor layer may be used. Good. Each light emitting element is preferably placed on the substrate by flip chip mounting. In the light emitting device 100, the bump is electrically connected to the base body, but as another example, the light emitting device 100 may be connected using a conductive member such as an AuSn paste, a solder paste, or an anisotropic conductive layer.

（第１透光性部材３１及び第２透光性部材３２）
第１透光性部材３１は第１発光素子２１の上面に、第２透光性部材３２は第２発光素子２２の上面にそれぞれ設けられている。図１においては、各発光素子が形成されている領域を点線で示している。各発光素子の上面は、各発光素子が成長基板を備える場合は成長基板で構成され、各発光素子が成長基板を剥離している場合は半導体層で構成される。後者の場合は、半導体層に直接透光性部材が接合されることとなる。各透光性部材（第１透光性部材３１及び第２透光性部材３２）と各発光素子（第１発光素子２１及び第２発光素子２２）とは、圧着、焼結、接着剤による接着等公知の方法により接続することができる。各透光性部材の形状は特に限定されないが、好ましくは板状体とする。 (First translucent member 31 and second translucent member 32)
The first light transmissive member 31 is provided on the upper surface of the first light emitting element 21, and the second light transmissive member 32 is provided on the upper surface of the second light emitting element 22. In FIG. 1, a region where each light emitting element is formed is indicated by a dotted line. The upper surface of each light emitting element is composed of a growth substrate when each light emitting element includes a growth substrate, and is composed of a semiconductor layer when each light emitting element peels off the growth substrate. In the latter case, the translucent member is bonded directly to the semiconductor layer. Each translucent member (the 1st translucent member 31 and the 2nd translucent member 32) and each light emitting element (the 1st light emitting element 21 and the 2nd light emitting element 22) are pressure bonding, sintering, and an adhesive agent. They can be connected by a known method such as adhesion. The shape of each translucent member is not particularly limited, but is preferably a plate-like body.

第１透光性部材３１と第２透光性部材３２とは、０．２ｍｍ以上間隔を置いて配置するのが好ましい。間隔を一定以上とすることで、ある発光素子から出射された光が、遮光部材４０を通過してその素子の上面に接続された透光性部材以外の透光性部材に入射して混色するのを防止することができる。透光性部材間の間隔は広い方が良いが、広すぎると発光装置の大きさが大きくなるので、混色を防止する程度の間隔をあけておけば良い。   It is preferable that the 1st translucent member 31 and the 2nd translucent member 32 are arrange | positioned at intervals of 0.2 mm or more. By setting the interval to a certain value or more, the light emitted from a certain light emitting element enters the light transmitting member other than the light transmitting member connected to the upper surface of the element through the light shielding member 40 and is mixed. Can be prevented. Although the space between the translucent members is preferably wide, if the space is too wide, the size of the light emitting device becomes large. Therefore, it is sufficient to leave a space that prevents color mixing.

第１透光性部材３１は、波長変換部材を含まない部材である。つまり、第１透光性部材３１においては、第１発光素子２１からの光（青色光）の波長を変えることなく外部へと放出する。第１発光素子２１の上面に第１透光性部材３１を載置することにより、第１透光性部材３１の上面の高さと第２透光性部材３２の上面と高さを揃えることができる。こうすることで、光の出射面の高さが各色で揃い、光が広がりにくくなるため、レンズまたはリフレクタ等の光学部品を大きくする必要がなくなる。また、第１透光性部材３１の側方に遮光部材４０を形成しやすくなる。なお、本明細書において「波長変換部材を含まない」とは、波長変換部材を全く含まないものはもちろんのこと、波長変換されない程度に波長変換部材を含むもの（不純物程度に波長変換部材を含むもの）も含む。   The 1st translucent member 31 is a member which does not contain a wavelength conversion member. That is, the first light transmissive member 31 emits the light (blue light) from the first light emitting element 21 to the outside without changing the wavelength. By placing the first light transmissive member 31 on the upper surface of the first light emitting element 21, the height of the upper surface of the first light transmissive member 31 and the height of the upper surface of the second light transmissive member 32 may be aligned. it can. By doing this, the height of the light exit surface is uniform for each color and the light is difficult to spread, so there is no need to enlarge the optical component such as a lens or a reflector. In addition, the light shielding member 40 can be easily formed on the side of the first light transmissive member 31. In this specification, “not including a wavelength conversion member” means not including a wavelength conversion member at all, but also including a wavelength conversion member to the extent that wavelength conversion is not performed (including a wavelength conversion member to the extent of impurities). Thing).

第１透光性部材３１としては、エポキシ樹脂、ユリア樹脂、シリコーン樹脂、変性エポキシ樹脂、変性シリコーン樹脂、ポリアミドなどの耐候性に優れた有機材料、又はガラス、セラミックス等の無機材料を用いることができる。また、第１透光性部材３１中には光散乱材を含有させることができる。光散乱材としては、例えば、酸化ケイ素、酸化アルミニウム、酸化チタン等を用いることができる。   As the 1st translucent member 31, it is using organic materials excellent in weather resistance, such as an epoxy resin, a urea resin, a silicone resin, a modified epoxy resin, a modified silicone resin, and polyamide, or inorganic materials, such as glass and ceramics. it can. The first light transmissive member 31 can contain a light scattering material. As the light scattering material, for example, silicon oxide, aluminum oxide, titanium oxide, or the like can be used.

第１透光性部材３１は１つの第１発光素子２１の上面に１つの透光性部材を設けることもできるし、複数の第１発光素子２１の上面に１つの第１透光性部材を設けることもできる。前者の構成によれば各発光素子の実装傾きを考慮する必要がなくなるため実装が容易となり、後者の構成によれば光を取り出す面積を大きくできるため発光強度を向上させることができる。発光装置１００においては１つの第１発光素子２１に対して１つの第１透光性部材３１を載置している。このとき、第１透光性部材３１の下面の面積と第１発光素子２１の上面の面積とを同じに形成することもできるが、好ましくは第１発光素子２１の上面の面積よりも大きくなるように形成する。これにより、第１透光性部材３１を第１発光素子２１上に載置する際に、実装が容易となるとともに、光取出し効率も向上する。   The first translucent member 31 can be provided with one translucent member on the upper surface of one first light emitting element 21, or one first translucent member on the upper surface of the plurality of first light emitting elements 21. It can also be provided. According to the former configuration, it is not necessary to consider the mounting inclination of each light emitting element, so that the mounting is facilitated. According to the latter configuration, the light extraction area can be increased, and the light emission intensity can be improved. In the light emitting device 100, one first light transmissive member 31 is placed on one first light emitting element 21. At this time, the area of the lower surface of the first light transmissive member 31 and the area of the upper surface of the first light emitting element 21 can be formed to be the same, but are preferably larger than the area of the upper surface of the first light emitting element 21. To form. Thereby, when mounting the 1st translucent member 31 on the 1st light emitting element 21, mounting becomes easy and light extraction efficiency improves.

第２透光性部材３２は、第２発光素子２２からの光の波長を変換して出射する波長変換部材を含む部材である。第２透光性部材３２に含まれる波長変換部材は、第２発光素子２２からの光（青色光）により励起され、第２発光素子２２の発光波長よりも長い波長（例えば赤色又は緑色）を発光する波長変換部材とすることができる。   The second light transmissive member 32 is a member including a wavelength conversion member that converts the wavelength of light from the second light emitting element 22 and emits the light. The wavelength conversion member included in the second light transmissive member 32 is excited by light (blue light) from the second light emitting element 22 and has a wavelength (for example, red or green) longer than the emission wavelength of the second light emitting element 22. It can be set as the wavelength conversion member which light-emits.

発光装置１００では、第２透光性部材３２に含まれる波長変換部材として赤色に発光する蛍光体を用いている。赤色に発光する蛍光体（赤色蛍光体）としては、たとえばＳＣＡＳＮ系蛍光体、ＣＡＳＮ系蛍光体等の窒化物系蛍光体、Ｋ２ＳｉＦ６：Ｍｎ等のフッ化物系蛍光体等を用いることができる。 In the light emitting device 100, a phosphor that emits red light is used as the wavelength conversion member included in the second light transmissive member 32. As a phosphor emitting red light (red phosphor), for example, a nitride phosphor such as a SCASN phosphor or CASN phosphor, a fluoride phosphor such as K 2 SiF 6 : Mn, or the like is used. it can.

発光装置１００では、図２に示すようにバインダ中に蛍光体を含有したもの（図示せず。）を第２透光性部材３２としている。バインダとしては、シリコーン樹脂若しくはエポキシ樹脂からなる有機材料、又は酸化ケイ素（ＳｉＯ２）、酸化アルミニウム（Ａｌ２Ｏ３）、酸化チタン（ＴｉＯ２）、若しくはガラス等の無機材料を用いることができるが、好ましくは無機材料とすることができる。バインダとして無機材料を用いれば、熱や光によりバインダ自体が変色したり変形したりすることを抑制することができる。なお、発光装置１００においては、バインダとしてホウ珪酸ガラスを、波長変換部材として第２発光素子２２からの光で励起されて赤色を発光する赤色蛍光体（ＳＣＡＳＮ）を用いている。 In the light emitting device 100, as shown in FIG. 2, a material containing a phosphor in a binder (not shown) is used as the second light transmissive member 32. As the binder, an organic material made of a silicone resin or an epoxy resin, or an inorganic material such as silicon oxide (SiO 2 ), aluminum oxide (Al 2 O 3 ), titanium oxide (TiO 2 ), or glass can be used. Preferably, it can be an inorganic material. If an inorganic material is used as the binder, the binder itself can be prevented from being discolored or deformed by heat or light. In the light emitting device 100, borosilicate glass is used as a binder, and a red phosphor (SCASN) that emits red light when excited by light from the second light emitting element 22 is used as a wavelength conversion member.

また、第２透光性部材３２の別の形態として、図３に示すように透明板３２ａの下面に波長変換部材３２ｂを設けて構成することもできる。例えば、蛍光体のみからなる波長変換部材を透明板３２ａの下面に形成することもできるし、バインダ中に波長変換部材を含有したものを透明板３２ａの下面に設けることもできる。図３においては、波長変換部材含有のバインダを透明板３２ａの下面に形成している。   Moreover, as another form of the 2nd translucent member 32, as shown in FIG. 3, it can also comprise by providing the wavelength conversion member 32b in the lower surface of the transparent plate 32a. For example, a wavelength conversion member made only of a phosphor can be formed on the lower surface of the transparent plate 32a, or a binder containing the wavelength conversion member in the binder can be provided on the lower surface of the transparent plate 32a. In FIG. 3, the binder containing a wavelength conversion member is formed on the lower surface of the transparent plate 32a.

図３の第２透光性部材３２は、例えばスクリーン印刷法等により透明板３２ａの下面に形成することができる。透明板３２ａとしてはガラス等の無機材料を用いることができ、バインダとしてはシリコーン樹脂若しくはエポキシ樹脂からなる有機材料を用いることができる。発光装置１００では、透明板３２ａとしてホウ珪酸ガラスを、バインダとしてシリコーン樹脂を用いている。第２透光性部材３２として波長変換部材を含有するものを用いる場合は焼成時の温度を考慮し耐熱性の高い波長変換部材、もしくは焼成温度の低いガラス等を選択する必要があるが、波長変換部材を透明板３２ａの下面に設けることで耐熱性を考慮することなく蛍光体を選択することが可能となる。   The second translucent member 32 in FIG. 3 can be formed on the lower surface of the transparent plate 32a by, for example, a screen printing method or the like. An inorganic material such as glass can be used as the transparent plate 32a, and an organic material made of silicone resin or epoxy resin can be used as the binder. In the light emitting device 100, borosilicate glass is used as the transparent plate 32a, and silicone resin is used as the binder. When using a material containing a wavelength conversion member as the second translucent member 32, it is necessary to select a wavelength conversion member with high heat resistance or glass with a low baking temperature in consideration of the temperature during baking. By providing the conversion member on the lower surface of the transparent plate 32a, it becomes possible to select the phosphor without considering heat resistance.

また、第２透光性部材３２は第１透光性部材３１同様に、１つの第２発光素子２２の上面に第２透光性部材３２を設けることもできるし、複数の第２発光素子２２の上面に第２透光性部材３２を設けることもできる。つまり１つの第２発光素子２２に対して１つの第２透光性部材３２を設けることもできるし、複数の第２発光素子２２に対して１つの第２透光性部材３２を設けることもできる。また、第２透光性部材３２の上面の面積は波長変換部材の濃度等に合わせて適宜変更することができ、例えば、第１透光性部材３１の上面の面積よりも大きくなるように形成することができる。   Similarly to the first light transmissive member 31, the second light transmissive member 32 can be provided with the second light transmissive member 32 on the upper surface of one second light emitting element 22, or a plurality of second light emitting elements. The second translucent member 32 may be provided on the upper surface of the member 22. That is, one second light transmissive member 32 can be provided for one second light emitting element 22, or one second light transmissive member 32 can be provided for a plurality of second light emitting elements 22. it can. In addition, the area of the upper surface of the second light transmissive member 32 can be appropriately changed according to the concentration of the wavelength conversion member, for example, and is formed to be larger than the area of the upper surface of the first light transmissive member 31 can do.

（遮光部材４０）
第１発光素子２１及び第２発光素子２２の側面並びに第１透光性部材３１及び第２透光性部材３２の側面は遮光部材４０により被覆されている。こうすることで、各発光素子及び各透光性部材の側面へと向かう光（青色光及び波長変換された光）を遮ることができるため、配光が広がらず見切りがよい光とすることができる。また、配光の広がりを抑制できることで、レンズまたはリフレクタ等の光学部品を使用する場合に、光学部品も小さくすることができる。 (Light shielding member 40)
The side surfaces of the first light emitting element 21 and the second light emitting element 22 and the side surfaces of the first light transmitting member 31 and the second light transmitting member 32 are covered with a light shielding member 40. By doing so, light (blue light and wavelength-converted light) traveling toward the side surfaces of each light-emitting element and each light-transmitting member can be blocked, so that light distribution is not widened and the light can be cut off. it can. In addition, since the spread of the light distribution can be suppressed, the optical component can also be reduced when using an optical component such as a lens or a reflector.

遮光部材４０としては、例えば、ＴｉＯ２、Ａｌ２Ｏ３、ＺｒＯ２、ＭｇＯなどの光反射部材を含有したフェノール樹脂、エポキシ樹脂、ＢＴ樹脂、ＰＰＡ樹脂、またはシリコーン樹脂などの光反射性樹脂等を用いることができる。なお、発光装置１００ではＴｉＯ２を含有したシリコーン樹脂を用いている。 Examples of the light shielding member 40 include a light reflecting resin such as a phenol resin, an epoxy resin, a BT resin, a PPA resin, or a silicone resin containing a light reflecting member such as TiO 2 , Al 2 O 3 , ZrO 2 , and MgO. Can be used. In the light emitting device 100, a silicone resin containing TiO 2 is used.

遮光部材４０は、側面のみならず、第１透光性部材３１及び第２透光性部材３２の下面の一部も被覆することができる。好ましくは、第１透光性部材３１及び第２透光性部材３２の下面において第１及び第２発光素子２２と接しない領域すべてを被覆する。こうすることで、第１透光性部材３１及び第２透光性部材３２に入射した光のうち上面で反射して下面へと向かう光も遮光部材４０で反射させることができるため、効率よく光を取り出すことができる。   The light shielding member 40 can cover not only the side surfaces but also part of the lower surfaces of the first light transmissive member 31 and the second light transmissive member 32. Preferably, the entire lower surface of the first light transmissive member 31 and the second light transmissive member 32 is covered with the first and second light emitting elements 22. By doing so, light that is reflected on the upper surface and is directed toward the lower surface among the light incident on the first light transmissive member 31 and the second light transmissive member 32 can be reflected by the light shielding member 40, so that the light can be efficiently reflected. Light can be extracted.

また、遮光部材４０は第１発光素子２１及び第２発光素子２２においても同様に下面の一部を被覆することができる。つまり、基体上における第１発光素子２１及び第２発光素子２２並びに第１透光性部材３１及び第２透光性部材３２のうち、第１透光性部材３１及び第２透光性部材３２の上面以外の露出領域全てを被覆することができる。こうすることで、第１及び第２発光素子２２の下面へと向かう光の一部を反射させて取り出すことができる。   Further, the light shielding member 40 can also cover part of the lower surface of the first light emitting element 21 and the second light emitting element 22 in the same manner. That is, among the first light emitting element 21 and the second light emitting element 22 and the first light transmitting member 31 and the second light transmitting member 32 on the base, the first light transmitting member 31 and the second light transmitting member 32 are used. All exposed areas other than the top surface of the substrate can be covered. By so doing, it is possible to reflect and extract a part of the light traveling toward the lower surfaces of the first and second light emitting elements 22.

（保護素子）
基体１０上には、第１発光素子２１及び第２発光素子２２の他に保護素子を設けることもできる。保護素子を設けることで、過大な電圧印加による素子破壊や性能劣化から保護することができる。保護素子は特に限定されるものではなく、公知のもののいずれでもよい。保護素子は、遮光部材に埋設して配置することが好ましい。 (Protective element)
In addition to the first light emitting element 21 and the second light emitting element 22, a protective element can be provided on the base 10. By providing a protective element, it is possible to protect against element destruction and performance deterioration due to excessive voltage application. The protective element is not particularly limited and may be any known element. It is preferable that the protective element is embedded in the light shielding member.

＜第２実施形態＞
図４に本実施形態に係る発光装置２００を光取出し面側から見た概略平面図を示す。また、図５は図４のＸ−Ｘ線の概略断面図である。発光装置２００は、次に説明する事項以外は、第１実施形態において記載した事項と実質的に同一である。 Second Embodiment
FIG. 4 is a schematic plan view of the light emitting device 200 according to the present embodiment as viewed from the light extraction surface side. FIG. 5 is a schematic sectional view taken along line XX of FIG. The light emitting device 200 is substantially the same as the matters described in the first embodiment except for the items described below.

発光装置２００では、発光装置１００の構成に加えて第３発光素子２３及び第３透光性部材３３が基体上に設けられており、第３発光素子２３及び第３透光性部材３３の側面に遮光部材４０が設けられている。特に、第２透光性部材３２は第２発光素子２２からの光により赤色又は緑色のいずれか一方に発光する波長変換部材を含み、第３透光性部材３３は第３発光素子２３からの光により赤色又は緑色の他の一方に発光する波長変換部材を含んでいる。なお、遮光部材４０は第１実施形態において説明した遮光部材４０と共通である。また、基体１０の形状は上面視において長方形であり、各発光素子が長手方向に一列に配置されている。   In the light emitting device 200, in addition to the configuration of the light emitting device 100, the third light emitting element 23 and the third light transmissive member 33 are provided on the base, and the side surfaces of the third light emitting element 23 and the third light transmissive member 33 are provided. A light shielding member 40 is provided. In particular, the second translucent member 32 includes a wavelength conversion member that emits red or green light by the light from the second light emitting element 22, and the third translucent member 33 is from the third light emitting element 23. A wavelength conversion member that emits light to the other one of red or green by light is included. The light shielding member 40 is common to the light shielding member 40 described in the first embodiment. Moreover, the shape of the base | substrate 10 is a rectangle in top view, and each light emitting element is arrange | positioned in the longitudinal direction at 1 row.

発光装置２００において、第３発光素子２３には青色発光素子を用いており、第３透光性部材３３に含まれる波長変換部材には緑色に発光する蛍光体（緑色蛍光体）を用いている。なお、第３発光素子２３は、第１及び第２発光素子２２の構成と同様の構成を採用することができ、緑色蛍光体としては、例えば、クロロシリケート蛍光体やβサイアロン蛍光体等を用いることができる。   In the light emitting device 200, a blue light emitting element is used for the third light emitting element 23, and a phosphor that emits green light (green phosphor) is used for the wavelength conversion member included in the third light transmissive member 33. . The third light emitting element 23 can adopt the same configuration as that of the first and second light emitting elements 22. As the green phosphor, for example, a chlorosilicate phosphor or a β sialon phosphor is used. be able to.

発光装置２００によれば、安定した特性を得ながら、１つの発光装置内から光の３原色（赤色・青色・緑色）を発光させることができる。これにより、光学部品等と組み合わせて使用する際に、光学部品も小型化することができる。   According to the light emitting device 200, the three primary colors (red, blue, and green) of light can be emitted from one light emitting device while obtaining stable characteristics. Thereby, when using in combination with an optical component etc., an optical component can also be reduced in size.

＜第３実施形態＞
図６に本実施形態に係る発光装置３００を光取出し面側から見た概略断面図を示す。発光装置３００は、次に説明する事項以外は、第１実施形態において記載した事項と実質的に同一である。 <Third Embodiment>
FIG. 6 is a schematic sectional view of the light emitting device 300 according to the present embodiment as viewed from the light extraction surface side. The light emitting device 300 is substantially the same as the items described in the first embodiment except for the items described below.

発光装置３００は、発光装置１００の構成に加えて第３発光素子２３及び第３透光性部材３３が基体上に設けられており、第３発光素子２３及び第３透光性部材３３の側面に遮光部材４０が設けられている。特に、第２透光性部材３２は第２発光素子２２からの光により赤色又は緑色のいずれか一方に発光する波長変換部材を含み、第３透光性部材３３は、第３発光素子２３からの光と第３透光性部材３３に含まれる波長変換部材からの光とにより白色に発光するような波長変換部材を含む。   In the light emitting device 300, in addition to the configuration of the light emitting device 100, the third light emitting element 23 and the third light transmissive member 33 are provided on the base, and the side surfaces of the third light emitting element 23 and the third light transmissive member 33 are provided. A light shielding member 40 is provided. In particular, the second translucent member 32 includes a wavelength conversion member that emits red or green light by the light from the second light emitting element 22, and the third translucent member 33 is formed from the third light emitting element 23. And a wavelength conversion member that emits white light by the light from the wavelength conversion member included in the third translucent member 33.

発光装置３００は、第３発光素子２３には青色発光素子を用いている。第３透光性部材３３に含まれる波長変換部材としては、例えば第３発光素子２３からの光により黄色に発光する蛍光体（黄色蛍光体）を用いることができる。黄色蛍光体としては、例えば、ＹＡＧ系蛍光体、ＬＡＧ系蛍光体を用いることができる。   In the light emitting device 300, a blue light emitting element is used as the third light emitting element 23. As the wavelength conversion member included in the third light transmissive member 33, for example, a phosphor that emits yellow light by the light from the third light emitting element 23 (yellow phosphor) can be used. As the yellow phosphor, for example, a YAG phosphor or a LAG phosphor can be used.

また、第３透光性部材３３は、第３発光素子からの光により赤色に発光する波長変換部材と第３発光素子からの光により緑色に発光する波長変換部材とを含んで構成することもできる。緑色に発光する波長変換部材としては緑色蛍光体、赤色に発光する波長変換部材としては赤色蛍光体を用いることができ、例えば、緑色蛍光体としてβサイアロン、赤色蛍光体としてＫ２ＳｉＦ６：Ｍｎを用いることができる。これにより、カラーフィルタと組み合わせた際に発光強度を大きくすることができる。 Further, the third light transmissive member 33 may include a wavelength conversion member that emits red light by the light from the third light emitting element and a wavelength conversion member that emits green light by the light from the third light emitting element. it can. A green phosphor can be used as the wavelength conversion member that emits green light, and a red phosphor can be used as the wavelength conversion member that emits red light. For example, β sialon as the green phosphor and K 2 SiF 6 : Mn as the red phosphor. Can be used. Thereby, the light emission intensity can be increased when combined with a color filter.

発光装置３００の第３発光素子２３の上面においては、第３発光素子２３からの青色光と第３透光性部材３３に含まれる波長変換部材とからの光により白色光が放出されることとなる。このとき、第１発光素子２１と第３発光素子２３、第２発光素子２２と第３発光素子２３、のように青色光又は緑色光を白色光と組み合わせて発光させることで、青色光や緑色光の色純度は下がるものの光束を向上させることができる。   On the upper surface of the third light emitting element 23 of the light emitting device 300, white light is emitted by the blue light from the third light emitting element 23 and the light from the wavelength conversion member included in the third light transmissive member 33. Become. At this time, blue light or green light is emitted by combining blue light or green light with white light as in the first light emitting element 21 and the third light emitting element 23, and the second light emitting element 22 and the third light emitting element 23. Although the color purity of light is reduced, the luminous flux can be improved.

なお、発光装置３００では第２透光性部材３２に含まれる波長変換部材として第２発光素子２２からの光（青色光）に対して緑色光を発する緑色蛍光体を用いているが、青色光に対して赤色光を発する赤色蛍光体を用いることもできる。   In the light emitting device 300, a green phosphor that emits green light with respect to light (blue light) from the second light emitting element 22 is used as a wavelength conversion member included in the second light transmissive member 32. Alternatively, a red phosphor that emits red light can be used.

＜第４実施形態＞
図７に本実施形態に係る発光装置４００を光取出し面側から見た概略平面図を示す。発光装置４００は、次に説明する事項以外は、第３実施形態において記載した事項と実質的に同一である。 <Fourth embodiment>
FIG. 7 is a schematic plan view of the light emitting device 400 according to the present embodiment as viewed from the light extraction surface side. The light emitting device 400 is substantially the same as the items described in the third embodiment except for the items described below.

発光装置４００は、発光装置３００の構成に加えて、第４発光素子２４及び第４透光性部材３４が基体上に設けられており、第４発光素子２４及び第４透光性部材３４の側面に遮光部材４０が設けられている。   In the light emitting device 400, in addition to the configuration of the light emitting device 300, the fourth light emitting element 24 and the fourth light transmissive member 34 are provided on the base, and the fourth light emitting element 24 and the fourth light transmissive member 34 have the same structure. A light shielding member 40 is provided on the side surface.

発光装置４００は、第４発光素子２４には青色発光素子を用いており、第４透光性部材３４に含まれる波長変換部材としては第４発光素子２４からの光（青色光）により赤色に発光する赤色蛍光体を用いている。   In the light emitting device 400, a blue light emitting element is used for the fourth light emitting element 24, and the wavelength conversion member included in the fourth light transmissive member 34 turns red due to light (blue light) from the fourth light emitting element 24. A red phosphor that emits light is used.

これにより、特性が安定しており、高光束で且つ小型化可能な発光装置とすることができる。   Accordingly, a light-emitting device having stable characteristics, a high luminous flux, and a small size can be obtained.

以上、本発明の第１実施形態から第５実施形態に係る発光装置は、様々な用途に用いることができる。特に好ましくは、例えば、投射型ディスプレイ（ピコプロジェクタ、プロジェクタ他）等に用いることができる。   As described above, the light emitting devices according to the first to fifth embodiments of the present invention can be used for various applications. Particularly preferably, it can be used for, for example, a projection display (pico projector, projector, etc.).

１００、２００、３００、４００…発光装置
１０…基体
２１…第１発光素子
２２…第２発光素子
２３…第３発光素子
２４…第４発光素子
３１…第１透光性部材
３２…第２透光性部材
３２ａ…透明板
３２ｂ…波長変換部材
３３…第３透光性部材
３４…第４透光性部材
４０…遮光部材 DESCRIPTION OF SYMBOLS 100, 200, 300, 400 ... Light-emitting device 10 ... Base | substrate 21 ... 1st light emitting element 22 ... 2nd light emitting element 23 ... 3rd light emitting element 24 ... 4th light emitting element 31 ... 1st translucent member 32 ... 2nd translucent Optical member 32a ... Transparent plate 32b ... Wavelength conversion member 33 ... Third light transmitting member 34 ... Fourth light transmitting member 40 ... Light shielding member

Claims (9)

基体と、
前記基体上に配置される第１発光素子及び第２発光素子と、
前記第１発光素子の上面に設けられた第１透光性部材と、
前記第２発光素子の上面に設けられた第２透光性部材と、
前記第１及び第２発光素子の側面並びに前記第１及び第２透光性部材の側面を被覆する遮光部材と、を有し、
前記第１及び第２発光素子は、青色光を発する発光素子であり、前記基体にフリップチップ実装され、
前記第１透光性部材は波長変換部材を含まず、
前記第２透光性部材は、無機材料からなる透明板と、蛍光体及び有機材料からなるバインダを含みかつ前記透明板の下面に形成された波長変換部材と、を備え、
前記遮光部材は、前記透明板及び前記波長変換部材の側面を直接被覆することを特徴とする発光装置。 A substrate;
A first light emitting element and a second light emitting element disposed on the substrate;
A first light transmissive member provided on an upper surface of the first light emitting element;
A second light transmissive member provided on an upper surface of the second light emitting element;
A light shielding member that covers side surfaces of the first and second light emitting elements and side surfaces of the first and second light transmissive members,
The first and second light emitting devices is a light emitting element which emits blue light, is flip-chip mounted on the substrate,
The first translucent member does not include a wavelength conversion member,
The second translucent member includes a transparent plate made of an inorganic material, and a wavelength conversion member that includes a binder made of a phosphor and an organic material and is formed on the lower surface of the transparent plate,
The light-shielding member directly covers side surfaces of the transparent plate and the wavelength conversion member. 前記遮光部材は、前記第１及び第２透光性部材の下面の一部を被覆することを特徴とする請求項１に記載の発光装置。   The light-emitting device according to claim 1, wherein the light shielding member covers a part of a lower surface of the first and second light transmissive members. 前記第２透光性部材に含まれる波長変換部材は、前記第２発光素子からの光により赤色又は緑色に発光する波長変換部材であることを特徴とする請求項１又は２に記載の発光装置。   3. The light emitting device according to claim 1, wherein the wavelength conversion member included in the second light transmissive member is a wavelength conversion member that emits red or green light by light from the second light emitting element. . 複数の前記第１発光素子の上面に前記第１透光性部材が設けられており、又は／且つ、複数の前記第２発光素子の上面に前記第２透光性部材が設けられていることを特徴とする請求項１から３のいずれかに記載の発光装置。   The first translucent member is provided on the upper surfaces of the plurality of first light emitting elements, and / or the second translucent member is provided on the upper surfaces of the plurality of second light emitting elements. The light-emitting device according to any one of claims 1 to 3. 前記遮光部材は光反射性樹脂であることを特徴とする請求項１から４のいずれかに記載の発光装置。   The light-emitting device according to claim 1, wherein the light shielding member is a light reflecting resin. 前記基体上に配置される第３発光素子と、
前記第３発光素子の上面に設けられた第３透光性部材と、
前記第３発光素子の側面及び前記第３透光性部材の側面を被覆する遮光部材と、を有し、
前記第３発光素子は青色光を発する発光素子であり、
前記第２透光性部材は、前記第２発光素子からの光により赤色又は緑色のいずれか一方に発光する波長変換部材を含み、
前記第３透光性部材は、前記第３発光素子からの光により赤色又は緑色の他の一方に発光する波長変換部材を含むことを特徴とする請求項１に記載の発光装置。 A third light emitting element disposed on the substrate;
A third light transmissive member provided on an upper surface of the third light emitting element;
A light shielding member that covers a side surface of the third light emitting element and a side surface of the third light transmissive member,
The third light emitting element is a light emitting element emitting blue light;
The second translucent member includes a wavelength conversion member that emits light in red or green by light from the second light emitting element,
2. The light emitting device according to claim 1, wherein the third light transmissive member includes a wavelength conversion member that emits light to the other one of red and green by light from the third light emitting element. 前記基体上に配置される第３発光素子と、
前記第３発光素子の上面に設けられた第３透光性部材と、
前記第３発光素子の側面及び前記第３透光性部材の側面を被覆する遮光部材と、を有し、
前記第３発光素子は、青色光を発する発光素子であり、前記基体にフリップチップ実装され、
前記第２透光性部材は、前記第２発光素子からの光により赤色又は緑色のいずれか一方に発光する波長変換部材を含み、
前記第３透光性部材は、前記第３発光素子からの光により黄色に発光する波長変換部材を含むことを特徴とする請求項１に記載の発光装置。 A third light emitting element disposed on the substrate;
A third light transmissive member provided on an upper surface of the third light emitting element;
A light shielding member that covers a side surface of the third light emitting element and a side surface of the third light transmissive member,
The third light emitting element is a light emitting element that emits blue light, is flip-chip mounted on the base,
The second translucent member includes a wavelength conversion member that emits light in red or green by light from the second light emitting element,
The light emitting device according to claim 1, wherein the third light transmissive member includes a wavelength conversion member that emits yellow light by light from the third light emitting element. 前記基体上に配置される第３発光素子と、
前記第３発光素子の上面に設けられた第３透光性部材と、
前記第３発光素子の側面及び前記第３透光性部材の側面を被覆する遮光部材と、を有し、
前記第３発光素子は、青色光を発する発光素子であり、前記基体にフリップチップ実装され、
前記第２透光性部材は、前記第２発光素子からの光により赤色又は緑色のいずれか一方に発光する波長変換部材を含み、
前記第３透光性部材は、前記第３発光素子からの光により赤色に発光する波長変換部材と緑色に発光する波長変換部材とを含むことを特徴とする請求項１に記載の発光装置。 A third light emitting element disposed on the substrate;
A third light transmissive member provided on an upper surface of the third light emitting element;
A light shielding member that covers a side surface of the third light emitting element and a side surface of the third light transmissive member,
The third light emitting element is a light emitting element that emits blue light, is flip-chip mounted on the base,
The second translucent member includes a wavelength conversion member that emits light in red or green by light from the second light emitting element,
2. The light emitting device according to claim 1, wherein the third light transmissive member includes a wavelength conversion member that emits red light and a wavelength conversion member that emits green light by light from the third light emitting element. 基体上に、青色光を発する第１発光素子及び青色光を発する第２発光素子をフリップチップ実装する工程と、
前記第１発光素子の上面に波長変換部材を含まない第１透光性部材を載置する工程と、
無機材料からなる透明板の下面に、スクリーン印刷法によって、蛍光体及び有機材料からなるバインダを含む波長変換部材を形成することにより、前記透明板及び前記波長変換部材を含む第２透光性部材を準備する工程と、
前記第２発光素子の上面に前記第２透光性部材を載置する工程と、
前記第１発光素子の側面、前記第２発光素子の側面、前記第１透光性部材の側面並びに前記第２透光性部材に含まれる前記透明板及び前記波長変換部材の側面を直接被覆するように遮光部材を形成する工程と、を有する発光装置の製造方法。 Flip-chip mounting a first light emitting element emitting blue light and a second light emitting element emitting blue light on a substrate;
Placing a first light transmissive member not including a wavelength conversion member on the upper surface of the first light emitting element;
A second translucent member including the transparent plate and the wavelength conversion member is formed on the lower surface of the transparent plate made of an inorganic material by forming a wavelength conversion member including a binder made of a phosphor and an organic material by screen printing. The process of preparing
Placing the second light transmissive member on the top surface of the second light emitting element;
The side surface of the first light emitting element, the side surface of the second light emitting element, the side surface of the first light transmissive member, and the side surfaces of the transparent plate and the wavelength conversion member included in the second light transmissive member are directly covered. Forming a light shielding member as described above.
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