JP6298109B2 - Substrate processing apparatus and alignment method - Google Patents
Substrate processing apparatus and alignment method Download PDFInfo
- Publication number
- JP6298109B2 JP6298109B2 JP2016136251A JP2016136251A JP6298109B2 JP 6298109 B2 JP6298109 B2 JP 6298109B2 JP 2016136251 A JP2016136251 A JP 2016136251A JP 2016136251 A JP2016136251 A JP 2016136251A JP 6298109 B2 JP6298109 B2 JP 6298109B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- movement
- alignment
- processing
- movement information
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims description 199
- 238000000034 method Methods 0.000 title claims description 27
- 238000003384 imaging method Methods 0.000 description 5
- 238000007781 pre-processing Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
- Physical Vapour Deposition (AREA)
Description
本発明は、基板処理装置及びアライメント方法に関するものである。 The present invention relates to a substrate processing apparatus and an alignment method.
特許文献1には、基板とマスクとのアライメントを行うアライメント方法が開示されている。この特許文献1では、光学手段を用いて取得した基板及びマスクの各アライメントマークの相対距離から算出した算出移動量と実移動量との差異データを記録しておき、2回目以降のアライメントでは、前記差異データに基づき前記算出移動量を予め補正して基板を移動することで、迅速にアライメントを行う。 Patent Document 1 discloses an alignment method for performing alignment between a substrate and a mask. In this Patent Document 1, the difference data between the calculated movement amount and the actual movement amount calculated from the relative distance between the alignment marks of the substrate and the mask acquired using the optical means is recorded, and in the second and subsequent alignments, By quickly correcting the calculated movement amount based on the difference data and moving the substrate, alignment is performed quickly.
ところで、上記特許文献1には、基板及びマスクのアライメントマークが、光学手段、即ち、カメラの撮像範囲に入っている場合の処理は記載されているが、カメラの撮像範囲にアライメントマークが入っていない場合の処理については記載されていない。 By the way, the above-mentioned patent document 1 describes the processing when the alignment mark of the substrate and the mask is within the imaging range of the optical means, that is, the camera, but the alignment mark is in the imaging range of the camera. No processing is described when there is not.
しかしながら、実際には、処理室に搬送された基板のアライメントマークがカメラの撮像範囲に入っていない場合がある。この場合、アライメントを行う前に、アライメントマークが撮像範囲に入るように基板の位置調整を行うアライメント前の位置調整工程が必要となる。 However, in reality, the alignment mark of the substrate transferred to the processing chamber may not be within the imaging range of the camera. In this case, before alignment, a position adjustment step before alignment is necessary to adjust the position of the substrate so that the alignment mark falls within the imaging range.
以上の現状に鑑み、発明者等が種々検討したところ、以下の知見を得た。 In view of the above situation, the inventors have made various studies and obtained the following findings.
即ち、基板のアライメントマークがカメラの撮像範囲に入らない原因は、基板の搬送経路が異なると、基板が処理室に搬入された際の位置(搬入時位置)が変わってしまうためである。具体的には、直前に搬送された前の処理室(前処理室)が異なったり、同じ前処理室でも基板ステージ(基板載置部)が異なる場合には、前処理室における処理後の基板位置が異なるため、同じ処理室に搬送された基板でも、搬入時位置が異なる。 That is, the reason why the alignment mark of the substrate does not enter the imaging range of the camera is that if the substrate transport path is different, the position when the substrate is loaded into the processing chamber (the position at the time of loading) changes. Specifically, if the previous processing chamber (preprocessing chamber) transported immediately before is different, or if the substrate stage (substrate mounting part) is different even in the same preprocessing chamber, the substrate after processing in the preprocessing chamber Since the positions are different, even the substrates transferred to the same processing chamber have different loading positions.
図1に、所謂クラスター型の成膜装置において、同一のハンドを用いて基板を搬送する際、処理室A−B−C’を経由する場合の基板の経路X、及び、処理室A’−B−Cを経由する場合の基板の経路X’の例を示す。このようにX,X’両経路で通過する処理室Bにおける基板の搬入時位置は、前処理室が異なることで同一とはならない。図1中、符号D,Eは搬送室、Fは搬入部、G,Hは基板搬送用ロボットのハンドである。 In FIG. 1, when a substrate is transported using the same hand in a so-called cluster type film forming apparatus, the substrate path X when passing through the processing chamber ABC ′, and the processing chamber A′− An example of the route X ′ of the substrate when passing through BC is shown. As described above, the substrate loading position in the processing chamber B that passes through both the X and X ′ paths is not the same because the preprocessing chamber is different. In FIG. 1, symbols D and E are transfer chambers, F is a carry-in section, and G and H are hands of a substrate transfer robot.
また、搬入部Fには通常、搬送用ロボットのハンドG,Hが複数設けられるが、ハンド毎に動きの癖があるため、異なるハンドを使用して基板を搬送した場合、各処理室における基板の搬送時位置が異なる。 In addition, a plurality of transfer robot hands G and H are usually provided in the carry-in portion F. However, since there is a tendency to move for each hand, when a substrate is transferred using a different hand, the substrate in each processing chamber The transport position is different.
本発明は、上述のような知見に基づいて完成したもので、前処理室の違いや搬送ロボットのハンドの違い等により異なる搬送経路毎にグループ化した移動情報を用いて、基板をアライメント前に事前に移動制御できるようにすることで、アライメントをより効率的に行える基板処理装置及びアライメント方法を提供するものである。 The present invention has been completed on the basis of the above-described knowledge, and the substrate is aligned before alignment by using movement information grouped for each different transport path due to a difference in the pretreatment chamber, a difference in the hand of the transport robot, and the like. The present invention provides a substrate processing apparatus and an alignment method capable of performing alignment more efficiently by allowing movement control in advance.
また、本発明では、基板が直前に搬送された他の処理室の基板載置部と搬送に使用した搬送手段をまとめて「搬送経路」と称する。 In the present invention, the substrate placement unit of another processing chamber in which the substrate has been transported immediately before and the transport means used for transport are collectively referred to as a “transport route”.
基板に対して処理を施すための複数の処理室と、前記複数の処理室の各々に設けられた基板載置部と、前記基板載置部に前記基板を搬送する搬送手段とを備えた基板処理装置であって、搬送経路毎にグループ化された移動情報を有する記憶手段と、前記移動情報に基づいて前記基板を移動制御する制御手段とを備えることを特徴とする基板処理装置に係るものである。 A substrate provided with a plurality of processing chambers for performing processing on a substrate, a substrate mounting portion provided in each of the plurality of processing chambers, and a transfer means for transferring the substrate to the substrate mounting portion A processing apparatus, comprising: a storage unit having movement information grouped for each conveyance path; and a control unit that controls movement of the substrate based on the movement information. It is.
本発明は上述のように構成したから、前処理室の違いや搬送ロボットのハンドの違い等により異なる搬送経路毎にグループ化した移動情報を用いて、基板をアライメント前に事前に移動制御できるようにすることで、アライメントをより効率的に行える基板処理装置及びアライメント方法となる。 Since the present invention is configured as described above, it is possible to control the movement of the substrate in advance before alignment using the movement information grouped for each different transfer path due to the difference in the pretreatment chamber, the difference in the hand of the transfer robot, and the like. By doing so, it becomes a substrate processing apparatus and an alignment method capable of performing alignment more efficiently.
好適と考える本発明の実施形態を、図面に基づいて本発明の作用を示して簡単に説明する。 An embodiment of the present invention which is considered to be suitable will be briefly described with reference to the drawings showing the operation of the present invention.
搬送手段により処理室に搬送された基板を、搬送経路毎にグループ化された移動情報に基づいて移動させた後、基板とマスク等の対象物とのアライメントを行う。 After the substrate transported to the processing chamber by the transport means is moved based on the movement information grouped for each transport path, alignment between the substrate and an object such as a mask is performed.
この際、搬送に使用した搬送手段や基板が直前に搬送された他の処理室の基板載置部の組み合わせ毎に設定された搬送経路毎にグループ化された移動情報を用い、処理室に搬送された基板が経由した搬送経路に合った移動情報を用いてアライメント前に基板を移動制御することで、搬送経路毎に異なる搬送時位置のずれを相殺し、基板のアライメントマークをより確実にカメラの撮像範囲内に収めることができ、それだけスムーズに基板と対象物とのアライメントを行える。 At this time, transfer information grouped for each transfer path set for each combination of transfer means used for transfer and substrate placement units in other process chambers where the substrate was transferred immediately before is transferred to the process chamber. By controlling the movement of the substrate before alignment using the movement information that matches the transfer path through which the transferred substrate passes, the shift in the position during transfer that differs for each transfer path is offset, and the alignment mark on the substrate is more reliably detected by the camera. Thus, the substrate and the object can be aligned smoothly as much as possible.
例えば、搬送経路毎にグループ化された移動情報を用いる際、この移動情報は、基板を基板載置部に載置した際の位置情報と、基板の載置後に、基板をアライメントした後の位置情報との差分情報とし、搬送経路毎にグループ化されて蓄積された多数の差分情報の平均値等を用いて基板を移動制御することができる。 For example, when using movement information grouped for each transport path, the movement information includes position information when the substrate is placed on the substrate placement portion, and position after the substrate is aligned after placement of the substrate. It is possible to control the movement of the substrate by using difference information with the information and using an average value of a large number of difference information grouped and accumulated for each transport path.
本発明の具体的な実施例について図面に基づいて説明する。 Specific embodiments of the present invention will be described with reference to the drawings.
本実施例は、図2に図示したように、基板に対して成膜処理等を施すための複数の処理室11,12,13,14と、前記複数の処理室11,12,13,14の各々に設けられた基板載置部(基板ステージ)111,121,131,141と、前記基板載置部111,121,131,141に前記基板を搬送する搬送手段20,21とを備えた成膜装置に本発明を適用した例である。図2中、符号15はマスクストック室、16は搬入部、17,18は搬送室である。
In this embodiment, as shown in FIG. 2, a plurality of
本実施例においては、処理室毎に1つの基板載置部が設けられており、基板は、第1の処理を行う処理室11若しくは処理室12に運ばれた後、第2の処理を行う処理室13若しくは処理室14に運ばれる。この場合、用いられる2つの基板載置部の組み合わせは4パターンある。なお、1つの処理室内に2つ以上の基板載置部を設けても良く、この場合は、基板載置部の組み合わせパターンはその分増加する。
In this embodiment, one substrate placement unit is provided for each processing chamber, and the substrate is transported to the processing chamber 11 or the
また、基板の処理室間の移動には、基板搬送手段として搬送ロボット19のハンド20若しくはハンド21が使用される。本実施例においては、ハンドが2つあるため、基板載置部と搬送手段との組み合わせ(搬送経路)は全部で8パターンになる。
Further, for the movement of the substrate between the processing chambers, the
また、各処理室11,12,13,14には、マスクを支持するマスク支持体と、基板載置部に載置された基板とマスク支持体に支持されたマスクとのアライメントを行うアライメント機構が設けられている。
Further, each
成膜装置は、搬送経路毎にグループ化された移動情報を有する記憶手段と、前記移動情報に基づいて前記基板を移動制御する制御手段とを備えている。 The film forming apparatus includes a storage unit having movement information grouped for each conveyance path, and a control unit that controls movement of the substrate based on the movement information.
前記移動情報は、基板を基板載置部に載置した際の位置情報と、基板の載置後に、基板をアライメントした後の位置情報との差分情報を有している。 The movement information includes difference information between position information when the substrate is placed on the substrate placement portion and position information after the substrate is aligned after the substrate is placed.
本実施例は、この移動情報を用いて制御手段により、アライメント前に基板を事前に補正移動させるものである。 In this embodiment, the movement information is used to correct and move the substrate in advance by the control means before alignment.
制御手段は、基板載置部を用いて基板を移動制御する構成である。具体的には、基板載置部を水平移動及び水平回転が可能なステージ装置(XYθステージ)に支持させ、このステージ装置に接続されるコンピュータを用い、基板を前記移動情報に基づいてマスクと平行に移動させたり水平回転させるように構成している。コンピュータには記憶手段(HDDやメモリ等の記憶装置、データレジスタ等の記憶領域)が設けられており、コンピュータで、基板を基板載置部に載置した際の位置情報と、基板の載置後に、基板をアライメントした後の位置情報との差分情報を取得して、8パターンの搬送経路毎にデータベース化して記憶装置に蓄積する。 The control means is configured to control the movement of the substrate using the substrate platform. Specifically, the substrate platform is supported on a stage device (XYθ stage) capable of horizontal movement and rotation, and a computer connected to the stage device is used to parallel the substrate with the mask based on the movement information. It is configured to move to the horizontal or rotate horizontally. The computer is provided with storage means (storage device such as HDD or memory, storage area such as a data register), and the position information when the substrate is placed on the substrate placement portion by the computer and the placement of the substrate. Later, difference information with respect to the position information after the alignment of the substrate is acquired, and a database is created for each of the eight patterns of conveyance paths and stored in the storage device.
なお、搬送経路毎にグループ化された移動情報を有する前記記憶手段を備えた構成でなく、処理室と搬送手段とに夫々基づいた移動情報を有する記憶手段と、基板が搬送された処理室と搬送経路との移動情報に基づいて基板を移動制御する制御手段とを備える構成としても良い。具体的には、記憶手段は夫々の処理室(基板載置部)と夫々の搬送手段全てに基づいた移動情報を有しており、対象となる基板が搬送された処理室と、対象となる処理室の直前に基板が搬送された他の処理室と、対象となる処理室の搬送に使用された搬送手段とに基づいた移動情報を演算することで、アライメント前に基板を事前に補正移動させる移動情報を算出する構成としても良い。 In addition, it is not the structure provided with the said memory | storage means which has the movement information grouped for every conveyance path | route, the memory | storage means which has the movement information based on the processing chamber and the conveyance means, respectively, and the processing chamber where the board | substrate was conveyed, It is good also as a structure provided with the control means which controls a movement of a board | substrate based on movement information with a conveyance path | route. Specifically, the storage means has movement information based on all the processing chambers (substrate placement units) and all the transporting means, and the processing chamber in which the target substrate is transported and the target. The substrate is corrected and moved in advance before alignment by calculating movement information based on the other processing chamber in which the substrate is transferred immediately before the processing chamber and the transfer means used to transfer the target processing chamber. The movement information to be calculated may be calculated.
また、制御手段は、基板載置部ではなく搬送手段を用いて基板を移動制御する構成としても良い。具体的には、搬送手段で基板を基板載置部に載置する前に、搬送手段に接続されるコンピュータを用い、基板を前記移動情報に基づいてマスクと平行に移動させたり水平回転させるように構成しても良い。 In addition, the control means may be configured to control the movement of the substrate using the transport means instead of the substrate placement unit. Specifically, before the substrate is placed on the substrate platform by the transport unit, a computer connected to the transport unit is used to move the substrate in parallel with the mask or horizontally rotate based on the movement information. You may comprise.
本実施例におけるアライメント前の基板の補正移動は具体的には以下のようにして行う。 Specifically, the correction movement of the substrate before alignment in the present embodiment is performed as follows.
図3に図示したように、処理室11又は処理室12で、基板への第1の処理が終了する。処理室11の基板ステージ111若しくは処理室12の基板ステージ121に載置された基板をハンド20若しくはハンド21で搬出する。第1の処理の処理室とハンドと第2の処理の処理室の情報から搬送経路を特定し、位置情報を保存するデータベースを決定する。このデータベースの決定は、基板の取り出し前でも後でも可能である。データベースは、搬送経路毎に複数用意する。図1の場合は8種類のデータベースが必要となる。
As illustrated in FIG. 3, the first process on the substrate is completed in the process chamber 11 or the
続いて、基板は、第2の処理の処理室13若しくは処理室14に搬入され、基板載置部131若しくは基板載置部141に載置される。基板載置時の基板位置を位置情報Aとして記録する。決定したデータベースに後述する位置情報Dがある場合、位置情報Aを取得後、位置情報Dを元に基板を補正移動する。
Subsequently, the substrate is carried into the processing chamber 13 or the
続いて、基板のアライメントを行う。アライメント後の基板位置を位置情報Bとして記録する。位置情報Aと位置情報Bの差分である位置情報Cを算出する。位置情報Cを先ほど決定したデータベースに保存する。蓄積された(1つ若しくは複数の)位置情報Cから基板の位置補正に使用する位置情報Dを算出する。位置情報Dの算出方法は、位置情報Cの平均値や中央値等、適宜選択することができる。補正移動は、位置情報Dの移動量分基板を移動する。 Subsequently, the substrate is aligned. The substrate position after alignment is recorded as position information B. The position information C, which is the difference between the position information A and the position information B, is calculated. The position information C is stored in the previously determined database. Position information D to be used for substrate position correction is calculated from the accumulated position information (one or more). The calculation method of the position information D can be selected as appropriate, such as the average value or median value of the position information C. In the correction movement, the substrate is moved by the movement amount of the position information D.
なお、位置情報Dを固定値として、位置情報A,B,Cを取得せずに補正移動を行っても良い。 The position information D may be a fixed value, and the correction movement may be performed without acquiring the position information A, B, and C.
例えば、記憶手段は夫々の処理室(基板載置部)と夫々の搬送手段全てに基づいた移動情報を有しており、対象となる基板が搬送された処理室と、対象となる処理室の直前に基板が搬送された他の処理室と、対象となる処理室の搬送に使用された搬送手段とに基づいた移動情報を演算することで、アライメント前に基板を事前に補正移動させる移動情報を算出する構成として、図4に図示した別例のように処理しても良い。 For example, the storage means has movement information based on each processing chamber (substrate placement unit) and all the transporting means, and the processing chamber in which the target substrate is transported and the target processing chamber. Movement information for correcting and moving the substrate in advance before alignment by calculating movement information based on the other processing chamber in which the substrate was transferred immediately before and the transfer means used for transferring the target processing chamber. As a configuration for calculating the above, processing may be performed as in another example illustrated in FIG.
即ち、基板への第1の処理が終了した後、処理室11の基板ステージ111若しくは処理室12の基板ステージ121に載置された基板をハンド20若しくはハンド21で搬出する。この際、第1の処理の処理室の基板載置部、第2の処理の処理室の基板載置部及び使用したハンドに基づく移動情報から位置情報Dを算出する。続いて、基板を第2の処理の処理室13若しくは処理室14に搬入して基板載置部131若しくは基板載置部141に載置し、位置情報Dに基づいて補正移動する。その後、基板のアライメントを行う。
That is, after the first processing on the substrate is completed, the substrate placed on the
この場合、位置情報A,B,Cを取得せずにアライメント前の基板の事前補正移動を行うことが可能となり、それだけ構成を簡素化できる。 In this case, it becomes possible to perform the pre-correction movement of the substrate before alignment without acquiring the position information A, B, C, and the configuration can be simplified accordingly.
位置情報Dを元に基板を補正移動する方法としては、上述したように、処理室内にある基板載置部を動かしてもよいし、基板を載置する前に、ハンドを使用して基板を移動してから基板載置部上に載置しても良い。 As described above, as a method of correcting and moving the substrate based on the position information D, the substrate mounting portion in the processing chamber may be moved, or the substrate may be moved using the hand before mounting the substrate. After moving, it may be placed on the substrate placement portion.
また、基板載置部によって、基板を補正移動する際には、基板を載置する前に、補正移動量分を、基板を動かす移動方向とは逆の方向に、あらかじめ基板載置部を移動してから、基板を載置して補正移動してもよい。即ち、制御手段は、移動情報に基づいた基板の移動と反対方向に同量だけ、基板載置部を、基板の移動情報に基づく移動の前に移動させるように構成しても良い。 In addition, when the substrate is moved by the substrate mounting unit, the substrate mounting unit is moved in advance in the direction opposite to the moving direction for moving the substrate before the substrate is mounted. Then, the substrate may be placed and corrected for movement. In other words, the control unit may be configured to move the substrate platform by the same amount in the opposite direction to the movement of the substrate based on the movement information before the movement based on the movement information of the substrate.
この場合、基板の補正移動後に基板載置部が稼働範囲の中心位置にくるため、後のアライメントを行う際に、稼動範囲が広くなり、精度の良い稼動範囲中心部でのアライメントが可能であるという効果がある。 In this case, since the substrate mounting portion comes to the center position of the operating range after the correction movement of the substrate, the operating range is widened when performing subsequent alignment, and the alignment at the center of the operating range with high accuracy is possible. There is an effect.
なお、本実施例は、基板とマスクとのアライメントを行う例について説明しているが、例えば、基板とインクジェットヘッドとのアライメントを行ったり、電子機器等のフロントパネルとリアパネルとのアライメントを行う等、本発明は他の部材のアライメントにも用いることができる。 In addition, although the present Example demonstrates the example which performs alignment with a board | substrate and a mask, for example, alignment with a board | substrate and an inkjet head, alignment with a front panel and rear panels, such as an electronic device, etc. The present invention can also be used for alignment of other members.
本発明は、本実施例に限られるものではなく、各構成要件の具体的構成は適宜設計し得るものである。 The present invention is not limited to this embodiment, and the specific configuration of each component can be designed as appropriate.
Claims (12)
前記搬送手段により前記処理室に前記基板が搬送される工程と、
前記記憶手段の前記搬送経路毎にグループ化された移動情報に基づいて前記基板を移動させる工程と、
前記基板と前記対象物とのアライメントを行うアライメント工程とを有することを特徴とするアライメント方法。 A plurality of processing chambers for performing processing on the substrate; a substrate mounting portion provided in each of the plurality of processing chambers; a transporting means for transporting the substrate to the substrate mounting portion; and a transport path in the film forming apparatus and a storage means having a moving information grouped, to the target object to said substrate is provided in the processing chamber and the substrate by moving the substrate mounting part that is mounted An alignment method for performing alignment,
A step of transporting the substrate to the processing chamber by the transport means;
Moving the substrate based on movement information grouped for each transport path of the storage means ;
An alignment method comprising an alignment step of aligning the substrate and the object.
前記搬送手段により前記処理室のうちの一つに前記基板が搬送される工程と、
前記記憶手段の前記基板が搬送された前記処理室の前記基板載置部と前記搬送手段とに夫々基づいた移動情報に基づいて前記基板を移動させる工程と、
前記基板と前記対象物とのアライメントを行うアライメント工程とを有することを特徴とするアライメント方法。 A plurality of processing chambers for performing processing on a substrate; a substrate mounting portion provided in each of the plurality of processing chambers; a transporting means for transporting the substrate to the substrate mounting portion; and the processing chamber In the film forming apparatus comprising storage means for storing movement information based on the substrate placement part and the transfer means , the substrate placement part on which the substrate is placed is moved to An alignment method for performing alignment with an object provided in the processing chamber,
A step of transporting the substrate to one of the processing chambers by the transport means;
Moving the substrate based on movement information based on the substrate placement unit and the transfer unit of the processing chamber in which the substrate of the storage unit has been transferred, and
An alignment method comprising an alignment step of aligning the substrate and the object.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016136251A JP6298109B2 (en) | 2016-07-08 | 2016-07-08 | Substrate processing apparatus and alignment method |
KR1020170086161A KR102006067B1 (en) | 2016-07-08 | 2017-07-06 | Substrate processing apparatus and alignment method |
CN201710549222.2A CN107591346B (en) | 2016-07-08 | 2017-07-07 | Substrate processing apparatus and alignment method |
CN202111089795.4A CN113808975B (en) | 2016-07-08 | 2017-07-07 | Substrate processing apparatus and alignment method |
KR1020190089809A KR102061456B1 (en) | 2016-07-08 | 2019-07-24 | Substrate processing apparatus and alignment method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016136251A JP6298109B2 (en) | 2016-07-08 | 2016-07-08 | Substrate processing apparatus and alignment method |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018003143A JP2018003143A (en) | 2018-01-11 |
JP6298109B2 true JP6298109B2 (en) | 2018-03-20 |
Family
ID=60948377
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016136251A Active JP6298109B2 (en) | 2016-07-08 | 2016-07-08 | Substrate processing apparatus and alignment method |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6298109B2 (en) |
KR (2) | KR102006067B1 (en) |
CN (2) | CN113808975B (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7379072B2 (en) * | 2019-01-11 | 2023-11-14 | キヤノントッキ株式会社 | Film forming equipment, electronic device manufacturing equipment, film forming method, and electronic device manufacturing equipment |
JP7259476B2 (en) * | 2019-03-27 | 2023-04-18 | 東京エレクトロン株式会社 | Alignment apparatus, substrate processing apparatus, alignment method, and substrate processing method |
JP7262703B2 (en) * | 2019-06-11 | 2023-04-24 | 日本電気硝子株式会社 | Glass roll manufacturing method |
CN111092039B (en) * | 2019-12-30 | 2022-04-15 | 武汉大学 | Wafer transmission system |
JP7446169B2 (en) * | 2020-06-26 | 2024-03-08 | キヤノントッキ株式会社 | Substrate transfer device, substrate processing system, substrate transfer method, electronic device manufacturing method, program and storage medium |
CN111926306B (en) * | 2020-09-22 | 2020-12-22 | 上海陛通半导体能源科技股份有限公司 | Deposition equipment based on multi-process-cavity transmission and wafer deposition method |
JP7177128B2 (en) * | 2020-09-30 | 2022-11-22 | キヤノントッキ株式会社 | Film deposition apparatus, detection apparatus, detection method, and electronic device manufacturing method |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4239572B2 (en) * | 2002-11-27 | 2009-03-18 | 東京エレクトロン株式会社 | Transport position adjusting method and processing system of transport system |
JP4849825B2 (en) * | 2005-05-18 | 2012-01-11 | 東京エレクトロン株式会社 | Processing apparatus, alignment method, control program, and computer storage medium |
KR100772843B1 (en) * | 2006-02-13 | 2007-11-02 | 삼성전자주식회사 | Apparatus and method to align wafer |
JP4961895B2 (en) * | 2006-08-25 | 2012-06-27 | 東京エレクトロン株式会社 | Wafer transfer device, wafer transfer method, and storage medium |
JP2008173744A (en) * | 2007-01-22 | 2008-07-31 | Tokyo Electron Ltd | Conveying position alignment method for conveying system |
JP5064835B2 (en) * | 2007-02-28 | 2012-10-31 | 株式会社アルバック | Substrate transfer device |
JP5005428B2 (en) * | 2007-05-31 | 2012-08-22 | 株式会社アルバック | Substrate transport method and substrate transport apparatus |
JP5390753B2 (en) * | 2007-06-04 | 2014-01-15 | 株式会社アルバック | Substrate transport method and substrate transport apparatus |
JP2009194046A (en) * | 2008-02-13 | 2009-08-27 | Hitachi High-Tech Control Systems Corp | Substrate conveyor and method of correcting eccentricity of substrate |
US8185242B2 (en) * | 2008-05-07 | 2012-05-22 | Lam Research Corporation | Dynamic alignment of wafers using compensation values obtained through a series of wafer movements |
KR101517020B1 (en) | 2008-05-15 | 2015-05-04 | 삼성디스플레이 주식회사 | Apparatus and method for fabricating Organic Light Emitting Diode Display Device |
JP5208800B2 (en) * | 2009-02-17 | 2013-06-12 | 東京エレクトロン株式会社 | Substrate processing system and substrate transfer method |
JP5773613B2 (en) * | 2010-10-25 | 2015-09-02 | 東京エレクトロン株式会社 | Abnormal cause analysis method and abnormality analysis program |
JP5851099B2 (en) * | 2011-01-21 | 2016-02-03 | 株式会社日立ハイテクノロジーズ | Operation method of vacuum processing equipment |
JP5600703B2 (en) * | 2012-03-30 | 2014-10-01 | 東京エレクトロン株式会社 | Conveying apparatus and conveying method |
JP6118044B2 (en) * | 2012-07-19 | 2017-04-19 | 株式会社Screenホールディングス | Substrate processing apparatus and substrate processing method |
-
2016
- 2016-07-08 JP JP2016136251A patent/JP6298109B2/en active Active
-
2017
- 2017-07-06 KR KR1020170086161A patent/KR102006067B1/en active IP Right Grant
- 2017-07-07 CN CN202111089795.4A patent/CN113808975B/en active Active
- 2017-07-07 CN CN201710549222.2A patent/CN107591346B/en active Active
-
2019
- 2019-07-24 KR KR1020190089809A patent/KR102061456B1/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
KR20190089822A (en) | 2019-07-31 |
JP2018003143A (en) | 2018-01-11 |
KR20180006326A (en) | 2018-01-17 |
KR102006067B1 (en) | 2019-07-31 |
CN107591346B (en) | 2022-02-11 |
CN107591346A (en) | 2018-01-16 |
KR102061456B1 (en) | 2019-12-31 |
CN113808975A (en) | 2021-12-17 |
CN113808975B (en) | 2023-05-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6298109B2 (en) | Substrate processing apparatus and alignment method | |
JP7097691B2 (en) | Teaching method | |
JP6576124B2 (en) | Droplet ejection apparatus, droplet ejection method, program, and computer storage medium | |
US8223319B2 (en) | Exposure device | |
KR102000334B1 (en) | Alignment mark detecting method, alignment method and vapor deposition method | |
JP4865414B2 (en) | Alignment method | |
JP6117724B2 (en) | Coating apparatus and coating method | |
JP2004174669A5 (en) | ||
CN104465335B (en) | Plotting method and drawing apparatus | |
JP2020105629A (en) | Alignment system, film deposition apparatus, film deposition method, and method of manufacturing electronic device | |
JP2006017895A (en) | Aligner | |
JP2009267387A (en) | Method for mounting electronic component | |
JP2016062909A (en) | Substrate transfer system, substrate transfer method, lithography device, and manufacturing method for article | |
TWI700160B (en) | Substrate conveying method and substrate processing system | |
WO2017130746A1 (en) | Exposure device and exposure method | |
JP2006198712A (en) | Lens module assembling device and method | |
JP4685066B2 (en) | Printing device | |
JP2009164450A (en) | Solder drawing device and method of manufacturing wiring board | |
JP2005072317A (en) | Packaging method and apparatus | |
US20090303483A1 (en) | Exposure apparatus and device manufacturing method | |
JP2008083520A (en) | Exposure apparatus and alignment method | |
JP2017204508A5 (en) | ||
JP5648242B2 (en) | Exposure system and control method thereof | |
US7006200B2 (en) | Substrate exposure system | |
WO2014109008A1 (en) | Deformation measuring method and device, and sheet processing method and device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20171106 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20171113 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20171228 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180129 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180222 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6298109 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |