JP6298109B2 - Substrate processing apparatus and alignment method - Google Patents

Substrate processing apparatus and alignment method Download PDF

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JP6298109B2
JP6298109B2 JP2016136251A JP2016136251A JP6298109B2 JP 6298109 B2 JP6298109 B2 JP 6298109B2 JP 2016136251 A JP2016136251 A JP 2016136251A JP 2016136251 A JP2016136251 A JP 2016136251A JP 6298109 B2 JP6298109 B2 JP 6298109B2
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substrate
movement
alignment
processing
movement information
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JP2018003143A (en
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康信 小林
康信 小林
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Canon Tokki Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682Mask-wafer alignment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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Description

本発明は、基板処理装置及びアライメント方法に関するものである。   The present invention relates to a substrate processing apparatus and an alignment method.

特許文献1には、基板とマスクとのアライメントを行うアライメント方法が開示されている。この特許文献1では、光学手段を用いて取得した基板及びマスクの各アライメントマークの相対距離から算出した算出移動量と実移動量との差異データを記録しておき、2回目以降のアライメントでは、前記差異データに基づき前記算出移動量を予め補正して基板を移動することで、迅速にアライメントを行う。   Patent Document 1 discloses an alignment method for performing alignment between a substrate and a mask. In this Patent Document 1, the difference data between the calculated movement amount and the actual movement amount calculated from the relative distance between the alignment marks of the substrate and the mask acquired using the optical means is recorded, and in the second and subsequent alignments, By quickly correcting the calculated movement amount based on the difference data and moving the substrate, alignment is performed quickly.

特開2009−277655号公報JP 2009-277655 A

ところで、上記特許文献1には、基板及びマスクのアライメントマークが、光学手段、即ち、カメラの撮像範囲に入っている場合の処理は記載されているが、カメラの撮像範囲にアライメントマークが入っていない場合の処理については記載されていない。   By the way, the above-mentioned patent document 1 describes the processing when the alignment mark of the substrate and the mask is within the imaging range of the optical means, that is, the camera, but the alignment mark is in the imaging range of the camera. No processing is described when there is not.

しかしながら、実際には、処理室に搬送された基板のアライメントマークがカメラの撮像範囲に入っていない場合がある。この場合、アライメントを行う前に、アライメントマークが撮像範囲に入るように基板の位置調整を行うアライメント前の位置調整工程が必要となる。   However, in reality, the alignment mark of the substrate transferred to the processing chamber may not be within the imaging range of the camera. In this case, before alignment, a position adjustment step before alignment is necessary to adjust the position of the substrate so that the alignment mark falls within the imaging range.

以上の現状に鑑み、発明者等が種々検討したところ、以下の知見を得た。   In view of the above situation, the inventors have made various studies and obtained the following findings.

即ち、基板のアライメントマークがカメラの撮像範囲に入らない原因は、基板の搬送経路が異なると、基板が処理室に搬入された際の位置(搬入時位置)が変わってしまうためである。具体的には、直前に搬送された前の処理室(前処理室)が異なったり、同じ前処理室でも基板ステージ(基板載置部)が異なる場合には、前処理室における処理後の基板位置が異なるため、同じ処理室に搬送された基板でも、搬入時位置が異なる。   That is, the reason why the alignment mark of the substrate does not enter the imaging range of the camera is that if the substrate transport path is different, the position when the substrate is loaded into the processing chamber (the position at the time of loading) changes. Specifically, if the previous processing chamber (preprocessing chamber) transported immediately before is different, or if the substrate stage (substrate mounting part) is different even in the same preprocessing chamber, the substrate after processing in the preprocessing chamber Since the positions are different, even the substrates transferred to the same processing chamber have different loading positions.

図1に、所謂クラスター型の成膜装置において、同一のハンドを用いて基板を搬送する際、処理室A−B−C’を経由する場合の基板の経路X、及び、処理室A’−B−Cを経由する場合の基板の経路X’の例を示す。このようにX,X’両経路で通過する処理室Bにおける基板の搬入時位置は、前処理室が異なることで同一とはならない。図1中、符号D,Eは搬送室、Fは搬入部、G,Hは基板搬送用ロボットのハンドである。   In FIG. 1, when a substrate is transported using the same hand in a so-called cluster type film forming apparatus, the substrate path X when passing through the processing chamber ABC ′, and the processing chamber A′− An example of the route X ′ of the substrate when passing through BC is shown. As described above, the substrate loading position in the processing chamber B that passes through both the X and X ′ paths is not the same because the preprocessing chamber is different. In FIG. 1, symbols D and E are transfer chambers, F is a carry-in section, and G and H are hands of a substrate transfer robot.

また、搬入部Fには通常、搬送用ロボットのハンドG,Hが複数設けられるが、ハンド毎に動きの癖があるため、異なるハンドを使用して基板を搬送した場合、各処理室における基板の搬送時位置が異なる。   In addition, a plurality of transfer robot hands G and H are usually provided in the carry-in portion F. However, since there is a tendency to move for each hand, when a substrate is transferred using a different hand, the substrate in each processing chamber The transport position is different.

本発明は、上述のような知見に基づいて完成したもので、前処理室の違いや搬送ロボットのハンドの違い等により異なる搬送経路毎にグループ化した移動情報を用いて、基板をアライメント前に事前に移動制御できるようにすることで、アライメントをより効率的に行える基板処理装置及びアライメント方法を提供するものである。   The present invention has been completed on the basis of the above-described knowledge, and the substrate is aligned before alignment by using movement information grouped for each different transport path due to a difference in the pretreatment chamber, a difference in the hand of the transport robot, and the like. The present invention provides a substrate processing apparatus and an alignment method capable of performing alignment more efficiently by allowing movement control in advance.

また、本発明では、基板が直前に搬送された他の処理室の基板載置部と搬送に使用した搬送手段をまとめて「搬送経路」と称する。   In the present invention, the substrate placement unit of another processing chamber in which the substrate has been transported immediately before and the transport means used for transport are collectively referred to as a “transport route”.

基板に対して処理を施すための複数の処理室と、前記複数の処理室の各々に設けられた基板載置部と、前記基板載置部に前記基板を搬送する搬送手段とを備えた基板処理装置であって、搬送経路毎にグループ化された移動情報を有する記憶手段と、前記移動情報に基づいて前記基板を移動制御する制御手段とを備えることを特徴とする基板処理装置に係るものである。   A substrate provided with a plurality of processing chambers for performing processing on a substrate, a substrate mounting portion provided in each of the plurality of processing chambers, and a transfer means for transferring the substrate to the substrate mounting portion A processing apparatus, comprising: a storage unit having movement information grouped for each conveyance path; and a control unit that controls movement of the substrate based on the movement information. It is.

本発明は上述のように構成したから、前処理室の違いや搬送ロボットのハンドの違い等により異なる搬送経路毎にグループ化した移動情報を用いて、基板をアライメント前に事前に移動制御できるようにすることで、アライメントをより効率的に行える基板処理装置及びアライメント方法となる。   Since the present invention is configured as described above, it is possible to control the movement of the substrate in advance before alignment using the movement information grouped for each different transfer path due to the difference in the pretreatment chamber, the difference in the hand of the transfer robot, and the like. By doing so, it becomes a substrate processing apparatus and an alignment method capable of performing alignment more efficiently.

従来例の概略説明図である。It is a schematic explanatory drawing of a prior art example. 本実施例の概略説明図である。It is a schematic explanatory drawing of a present Example. 本実施例の処理手順を示すフローチャートである。It is a flowchart which shows the process sequence of a present Example. 別例の処理手順を示すフローチャートである。It is a flowchart which shows the process sequence of another example.

好適と考える本発明の実施形態を、図面に基づいて本発明の作用を示して簡単に説明する。   An embodiment of the present invention which is considered to be suitable will be briefly described with reference to the drawings showing the operation of the present invention.

搬送手段により処理室に搬送された基板を、搬送経路毎にグループ化された移動情報に基づいて移動させた後、基板とマスク等の対象物とのアライメントを行う。   After the substrate transported to the processing chamber by the transport means is moved based on the movement information grouped for each transport path, alignment between the substrate and an object such as a mask is performed.

この際、搬送に使用した搬送手段や基板が直前に搬送された他の処理室の基板載置部の組み合わせ毎に設定された搬送経路毎にグループ化された移動情報を用い、処理室に搬送された基板が経由した搬送経路に合った移動情報を用いてアライメント前に基板を移動制御することで、搬送経路毎に異なる搬送時位置のずれを相殺し、基板のアライメントマークをより確実にカメラの撮像範囲内に収めることができ、それだけスムーズに基板と対象物とのアライメントを行える。   At this time, transfer information grouped for each transfer path set for each combination of transfer means used for transfer and substrate placement units in other process chambers where the substrate was transferred immediately before is transferred to the process chamber. By controlling the movement of the substrate before alignment using the movement information that matches the transfer path through which the transferred substrate passes, the shift in the position during transfer that differs for each transfer path is offset, and the alignment mark on the substrate is more reliably detected by the camera. Thus, the substrate and the object can be aligned smoothly as much as possible.

例えば、搬送経路毎にグループ化された移動情報を用いる際、この移動情報は、基板を基板載置部に載置した際の位置情報と、基板の載置後に、基板をアライメントした後の位置情報との差分情報とし、搬送経路毎にグループ化されて蓄積された多数の差分情報の平均値等を用いて基板を移動制御することができる。   For example, when using movement information grouped for each transport path, the movement information includes position information when the substrate is placed on the substrate placement portion, and position after the substrate is aligned after placement of the substrate. It is possible to control the movement of the substrate by using difference information with the information and using an average value of a large number of difference information grouped and accumulated for each transport path.

本発明の具体的な実施例について図面に基づいて説明する。   Specific embodiments of the present invention will be described with reference to the drawings.

本実施例は、図2に図示したように、基板に対して成膜処理等を施すための複数の処理室11,12,13,14と、前記複数の処理室11,12,13,14の各々に設けられた基板載置部(基板ステージ)111,121,131,141と、前記基板載置部111,121,131,141に前記基板を搬送する搬送手段20,21とを備えた成膜装置に本発明を適用した例である。図2中、符号15はマスクストック室、16は搬入部、17,18は搬送室である。   In this embodiment, as shown in FIG. 2, a plurality of processing chambers 11, 12, 13, 14 for performing a film forming process or the like on the substrate, and the plurality of processing chambers 11, 12, 13, 14. Substrate placement units (substrate stages) 111, 121, 131, 141 provided in each of the substrate mounting units 111, 121, 131, 141, and transfer means 20, 21 for transferring the substrate to the substrate mounting units 111, 121, 131, 141. This is an example in which the present invention is applied to a film forming apparatus. In FIG. 2, reference numeral 15 denotes a mask stock chamber, 16 denotes a carry-in section, and 17 and 18 denote transfer chambers.

本実施例においては、処理室毎に1つの基板載置部が設けられており、基板は、第1の処理を行う処理室11若しくは処理室12に運ばれた後、第2の処理を行う処理室13若しくは処理室14に運ばれる。この場合、用いられる2つの基板載置部の組み合わせは4パターンある。なお、1つの処理室内に2つ以上の基板載置部を設けても良く、この場合は、基板載置部の組み合わせパターンはその分増加する。   In this embodiment, one substrate placement unit is provided for each processing chamber, and the substrate is transported to the processing chamber 11 or the processing chamber 12 for performing the first processing and then subjected to the second processing. It is carried to the processing chamber 13 or the processing chamber 14. In this case, there are four patterns of combinations of the two substrate platforms used. Two or more substrate placement units may be provided in one processing chamber. In this case, the combination pattern of the substrate placement units is increased accordingly.

また、基板の処理室間の移動には、基板搬送手段として搬送ロボット19のハンド20若しくはハンド21が使用される。本実施例においては、ハンドが2つあるため、基板載置部と搬送手段との組み合わせ(搬送経路)は全部で8パターンになる。   Further, for the movement of the substrate between the processing chambers, the hand 20 or the hand 21 of the transfer robot 19 is used as a substrate transfer means. In this embodiment, since there are two hands, the total number of combinations (transport paths) of the substrate platform and transport means is eight patterns.

また、各処理室11,12,13,14には、マスクを支持するマスク支持体と、基板載置部に載置された基板とマスク支持体に支持されたマスクとのアライメントを行うアライメント機構が設けられている。   Further, each processing chamber 11, 12, 13, 14 has an alignment mechanism for aligning a mask support that supports the mask, a substrate placed on the substrate placement portion, and a mask supported by the mask support. Is provided.

成膜装置は、搬送経路毎にグループ化された移動情報を有する記憶手段と、前記移動情報に基づいて前記基板を移動制御する制御手段とを備えている。   The film forming apparatus includes a storage unit having movement information grouped for each conveyance path, and a control unit that controls movement of the substrate based on the movement information.

前記移動情報は、基板を基板載置部に載置した際の位置情報と、基板の載置後に、基板をアライメントした後の位置情報との差分情報を有している。   The movement information includes difference information between position information when the substrate is placed on the substrate placement portion and position information after the substrate is aligned after the substrate is placed.

本実施例は、この移動情報を用いて制御手段により、アライメント前に基板を事前に補正移動させるものである。   In this embodiment, the movement information is used to correct and move the substrate in advance by the control means before alignment.

制御手段は、基板載置部を用いて基板を移動制御する構成である。具体的には、基板載置部を水平移動及び水平回転が可能なステージ装置(XYθステージ)に支持させ、このステージ装置に接続されるコンピュータを用い、基板を前記移動情報に基づいてマスクと平行に移動させたり水平回転させるように構成している。コンピュータには記憶手段(HDDやメモリ等の記憶装置、データレジスタ等の記憶領域)が設けられており、コンピュータで、基板を基板載置部に載置した際の位置情報と、基板の載置後に、基板をアライメントした後の位置情報との差分情報を取得して、8パターンの搬送経路毎にデータベース化して記憶装置に蓄積する。   The control means is configured to control the movement of the substrate using the substrate platform. Specifically, the substrate platform is supported on a stage device (XYθ stage) capable of horizontal movement and rotation, and a computer connected to the stage device is used to parallel the substrate with the mask based on the movement information. It is configured to move to the horizontal or rotate horizontally. The computer is provided with storage means (storage device such as HDD or memory, storage area such as a data register), and the position information when the substrate is placed on the substrate placement portion by the computer and the placement of the substrate. Later, difference information with respect to the position information after the alignment of the substrate is acquired, and a database is created for each of the eight patterns of conveyance paths and stored in the storage device.

なお、搬送経路毎にグループ化された移動情報を有する前記記憶手段を備えた構成でなく、処理室と搬送手段とに夫々基づいた移動情報を有する記憶手段と、基板が搬送された処理室と搬送経路との移動情報に基づいて基板を移動制御する制御手段とを備える構成としても良い。具体的には、記憶手段は夫々の処理室(基板載置部)と夫々の搬送手段全てに基づいた移動情報を有しており、対象となる基板が搬送された処理室と、対象となる処理室の直前に基板が搬送された他の処理室と、対象となる処理室の搬送に使用された搬送手段とに基づいた移動情報を演算することで、アライメント前に基板を事前に補正移動させる移動情報を算出する構成としても良い。   In addition, it is not the structure provided with the said memory | storage means which has the movement information grouped for every conveyance path | route, the memory | storage means which has the movement information based on the processing chamber and the conveyance means, respectively, and the processing chamber where the board | substrate was conveyed, It is good also as a structure provided with the control means which controls a movement of a board | substrate based on movement information with a conveyance path | route. Specifically, the storage means has movement information based on all the processing chambers (substrate placement units) and all the transporting means, and the processing chamber in which the target substrate is transported and the target. The substrate is corrected and moved in advance before alignment by calculating movement information based on the other processing chamber in which the substrate is transferred immediately before the processing chamber and the transfer means used to transfer the target processing chamber. The movement information to be calculated may be calculated.

また、制御手段は、基板載置部ではなく搬送手段を用いて基板を移動制御する構成としても良い。具体的には、搬送手段で基板を基板載置部に載置する前に、搬送手段に接続されるコンピュータを用い、基板を前記移動情報に基づいてマスクと平行に移動させたり水平回転させるように構成しても良い。   In addition, the control means may be configured to control the movement of the substrate using the transport means instead of the substrate placement unit. Specifically, before the substrate is placed on the substrate platform by the transport unit, a computer connected to the transport unit is used to move the substrate in parallel with the mask or horizontally rotate based on the movement information. You may comprise.

本実施例におけるアライメント前の基板の補正移動は具体的には以下のようにして行う。   Specifically, the correction movement of the substrate before alignment in the present embodiment is performed as follows.

図3に図示したように、処理室11又は処理室12で、基板への第1の処理が終了する。処理室11の基板ステージ111若しくは処理室12の基板ステージ121に載置された基板をハンド20若しくはハンド21で搬出する。第1の処理の処理室とハンドと第2の処理の処理室の情報から搬送経路を特定し、位置情報を保存するデータベースを決定する。このデータベースの決定は、基板の取り出し前でも後でも可能である。データベースは、搬送経路毎に複数用意する。図1の場合は8種類のデータベースが必要となる。   As illustrated in FIG. 3, the first process on the substrate is completed in the process chamber 11 or the process chamber 12. The substrate placed on the substrate stage 111 in the processing chamber 11 or the substrate stage 121 in the processing chamber 12 is carried out by the hand 20 or the hand 21. A transport path is specified from the information of the processing chamber of the first processing, the hand, and the processing chamber of the second processing, and a database for storing the position information is determined. The database can be determined before or after the substrate is taken out. A plurality of databases are prepared for each transport route. In the case of FIG. 1, eight types of databases are required.

続いて、基板は、第2の処理の処理室13若しくは処理室14に搬入され、基板載置部131若しくは基板載置部141に載置される。基板載置時の基板位置を位置情報Aとして記録する。決定したデータベースに後述する位置情報Dがある場合、位置情報Aを取得後、位置情報Dを元に基板を補正移動する。   Subsequently, the substrate is carried into the processing chamber 13 or the processing chamber 14 of the second process, and is placed on the substrate platform 131 or the substrate platform 141. The substrate position at the time of placing the substrate is recorded as position information A. When there is position information D described later in the determined database, the position information A is acquired, and then the substrate is corrected and moved based on the position information D.

続いて、基板のアライメントを行う。アライメント後の基板位置を位置情報Bとして記録する。位置情報Aと位置情報Bの差分である位置情報Cを算出する。位置情報Cを先ほど決定したデータベースに保存する。蓄積された(1つ若しくは複数の)位置情報Cから基板の位置補正に使用する位置情報Dを算出する。位置情報Dの算出方法は、位置情報Cの平均値や中央値等、適宜選択することができる。補正移動は、位置情報Dの移動量分基板を移動する。   Subsequently, the substrate is aligned. The substrate position after alignment is recorded as position information B. The position information C, which is the difference between the position information A and the position information B, is calculated. The position information C is stored in the previously determined database. Position information D to be used for substrate position correction is calculated from the accumulated position information (one or more). The calculation method of the position information D can be selected as appropriate, such as the average value or median value of the position information C. In the correction movement, the substrate is moved by the movement amount of the position information D.

なお、位置情報Dを固定値として、位置情報A,B,Cを取得せずに補正移動を行っても良い。   The position information D may be a fixed value, and the correction movement may be performed without acquiring the position information A, B, and C.

例えば、記憶手段は夫々の処理室(基板載置部)と夫々の搬送手段全てに基づいた移動情報を有しており、対象となる基板が搬送された処理室と、対象となる処理室の直前に基板が搬送された他の処理室と、対象となる処理室の搬送に使用された搬送手段とに基づいた移動情報を演算することで、アライメント前に基板を事前に補正移動させる移動情報を算出する構成として、図4に図示した別例のように処理しても良い。   For example, the storage means has movement information based on each processing chamber (substrate placement unit) and all the transporting means, and the processing chamber in which the target substrate is transported and the target processing chamber. Movement information for correcting and moving the substrate in advance before alignment by calculating movement information based on the other processing chamber in which the substrate was transferred immediately before and the transfer means used for transferring the target processing chamber. As a configuration for calculating the above, processing may be performed as in another example illustrated in FIG.

即ち、基板への第1の処理が終了した後、処理室11の基板ステージ111若しくは処理室12の基板ステージ121に載置された基板をハンド20若しくはハンド21で搬出する。この際、第1の処理の処理室の基板載置部、第2の処理の処理室の基板載置部及び使用したハンドに基づく移動情報から位置情報Dを算出する。続いて、基板を第2の処理の処理室13若しくは処理室14に搬入して基板載置部131若しくは基板載置部141に載置し、位置情報Dに基づいて補正移動する。その後、基板のアライメントを行う。   That is, after the first processing on the substrate is completed, the substrate placed on the substrate stage 111 in the processing chamber 11 or the substrate stage 121 in the processing chamber 12 is unloaded by the hand 20 or the hand 21. At this time, the position information D is calculated from movement information based on the substrate placement unit of the first processing chamber, the substrate placement unit of the second processing chamber, and the used hand. Subsequently, the substrate is carried into the processing chamber 13 or the processing chamber 14 of the second processing and placed on the substrate platform 131 or the substrate platform 141, and is corrected and moved based on the position information D. Thereafter, the substrate is aligned.

この場合、位置情報A,B,Cを取得せずにアライメント前の基板の事前補正移動を行うことが可能となり、それだけ構成を簡素化できる。   In this case, it becomes possible to perform the pre-correction movement of the substrate before alignment without acquiring the position information A, B, C, and the configuration can be simplified accordingly.

位置情報Dを元に基板を補正移動する方法としては、上述したように、処理室内にある基板載置部を動かしてもよいし、基板を載置する前に、ハンドを使用して基板を移動してから基板載置部上に載置しても良い。   As described above, as a method of correcting and moving the substrate based on the position information D, the substrate mounting portion in the processing chamber may be moved, or the substrate may be moved using the hand before mounting the substrate. After moving, it may be placed on the substrate placement portion.

また、基板載置部によって、基板を補正移動する際には、基板を載置する前に、補正移動量分を、基板を動かす移動方向とは逆の方向に、あらかじめ基板載置部を移動してから、基板を載置して補正移動してもよい。即ち、制御手段は、移動情報に基づいた基板の移動と反対方向に同量だけ、基板載置部を、基板の移動情報に基づく移動の前に移動させるように構成しても良い。   In addition, when the substrate is moved by the substrate mounting unit, the substrate mounting unit is moved in advance in the direction opposite to the moving direction for moving the substrate before the substrate is mounted. Then, the substrate may be placed and corrected for movement. In other words, the control unit may be configured to move the substrate platform by the same amount in the opposite direction to the movement of the substrate based on the movement information before the movement based on the movement information of the substrate.

この場合、基板の補正移動後に基板載置部が稼働範囲の中心位置にくるため、後のアライメントを行う際に、稼動範囲が広くなり、精度の良い稼動範囲中心部でのアライメントが可能であるという効果がある。   In this case, since the substrate mounting portion comes to the center position of the operating range after the correction movement of the substrate, the operating range is widened when performing subsequent alignment, and the alignment at the center of the operating range with high accuracy is possible. There is an effect.

なお、本実施例は、基板とマスクとのアライメントを行う例について説明しているが、例えば、基板とインクジェットヘッドとのアライメントを行ったり、電子機器等のフロントパネルとリアパネルとのアライメントを行う等、本発明は他の部材のアライメントにも用いることができる。   In addition, although the present Example demonstrates the example which performs alignment with a board | substrate and a mask, for example, alignment with a board | substrate and an inkjet head, alignment with a front panel and rear panels, such as an electronic device, etc. The present invention can also be used for alignment of other members.

本発明は、本実施例に限られるものではなく、各構成要件の具体的構成は適宜設計し得るものである。   The present invention is not limited to this embodiment, and the specific configuration of each component can be designed as appropriate.

Claims (12)

基板に対して処理を施すための複数の処理室と、前記複数の処理室の各々に設けられた基板載置部と、前記基板載置部に前記基板を搬送する搬送手段とを備え、前記基板と前記処理室に備えられた対象物とのアライメントを行う基板処理装置であって、搬送経路毎にグループ化された移動情報を有する記憶手段と、前記移動情報に基づいて前記基板をアライメント前に事前に移動制御する制御手段とを備えることを特徴とする基板処理装置。 Comprising a plurality of processing chambers for performing a process on a substrate, and the substrate platform provided on each of said plurality of processing chambers, and a conveying means for conveying the substrate to the substrate placement portion, wherein A substrate processing apparatus for performing alignment between a substrate and an object provided in the processing chamber, the storage means having movement information grouped for each transport path, and the substrate before alignment based on the movement information And a control means for controlling movement in advance . 前記移動情報は、前記基板を前記基板載置部に載置した際の位置情報と、前記基板の載置後に、前記基板をアライメントした後の位置情報との差分情報を有することを特徴とする請求項1に記載の基板処理装置。   The movement information includes difference information between position information when the substrate is placed on the substrate placement portion and position information after alignment of the substrate after placement of the substrate. The substrate processing apparatus according to claim 1. 基板に対して処理を施すための複数の処理室と、前記複数の処理室の各々に設けられた基板載置部と、前記基板載置部に前記基板を搬送する搬送手段とを備え、前記基板と前記処理室に備えられた対象物とのアライメントを行う基板処理装置であって、前記処理室の前記基板載置部と前記搬送手段とに夫々基づいた移動情報を有する記憶手段と、前記基板が搬送された前記処理室と搬送経路との前記移動情報に基づいて前記基板をアライメント前に事前に移動制御する制御手段とを備えることを特徴とする基板処理装置。 Comprising a plurality of processing chambers for performing a process on a substrate, and the substrate platform provided on each of said plurality of processing chambers, and a conveying means for conveying the substrate to the substrate placement portion, wherein A substrate processing apparatus for performing alignment between a substrate and an object provided in the processing chamber , the storage means having movement information based on the substrate mounting portion and the transporting means of the processing chamber , and A substrate processing apparatus comprising: control means for controlling movement of the substrate in advance before alignment based on the movement information between the processing chamber in which the substrate is transferred and the transfer path. 前記制御手段は、前記移動情報に基づいた前記基板の移動制御に前記搬送手段を用いることを特徴とする請求項1〜3のいずれか1項に記載の基板処理装置。   The substrate processing apparatus according to claim 1, wherein the control unit uses the transfer unit for movement control of the substrate based on the movement information. 前記制御手段は、前記移動情報に基づいた前記基板の移動制御に前記基板載置部を用いることを特徴とする請求項1〜3のいずれか1項に記載の基板処理装置。   The substrate processing apparatus according to claim 1, wherein the control unit uses the substrate placement unit for movement control of the substrate based on the movement information. 前記制御手段は、前記移動情報に基づいた前記基板の移動と反対方向に同量だけ、前記基板載置部を、前記基板の前記移動情報に基づく移動の前に移動させるように構成されていることを特徴とする請求項5に記載の基板処理装置。   The control means is configured to move the substrate platform by the same amount in the opposite direction to the movement of the substrate based on the movement information before the movement based on the movement information of the substrate. The substrate processing apparatus according to claim 5. 基板に対して処理を施すための複数の処理室と、前記複数の処理室の各々に設けられた基板載置部と、前記基板載置部に前記基板を搬送する搬送手段と、搬送経路毎にグループ化された移動情報を有する記憶手段とを備えた成膜装置において、前記基板が載置された前記基板載置部を移動させてこの基板と前記処理室に備えられた対象物とのアライメントを行うアライメント方法であって、
前記搬送手段により前記処理室に前記基板が搬送される工程と、
前記記憶手段の前記搬送経路毎にグループ化された移動情報に基づいて前記基板を移動させる工程と、
前記基板と前記対象物とのアライメントを行うアライメント工程とを有することを特徴とするアライメント方法。
A plurality of processing chambers for performing processing on the substrate; a substrate mounting portion provided in each of the plurality of processing chambers; a transporting means for transporting the substrate to the substrate mounting portion; and a transport path in the film forming apparatus and a storage means having a moving information grouped, to the target object to said substrate is provided in the processing chamber and the substrate by moving the substrate mounting part that is mounted An alignment method for performing alignment,
A step of transporting the substrate to the processing chamber by the transport means;
Moving the substrate based on movement information grouped for each transport path of the storage means ;
An alignment method comprising an alignment step of aligning the substrate and the object.
前記移動情報は、前記基板を前記基板載置部に載置した際の位置情報と、前記基板の前記アライメント工程後の位置情報との差分情報を有することを特徴とする請求項7に記載のアライメント方法The said movement information has the difference information of the positional information at the time of mounting the said board | substrate on the said board | substrate mounting part, and the positional information after the said alignment process of the said board | substrate, It is characterized by the above-mentioned. Alignment method . 基板に対して処理を施すための複数の処理室と、前記複数の処理室の各々に設けられた基板載置部と、前記基板載置部に前記基板を搬送する搬送手段と、前記処理室の前記基板載置部と前記搬送手段とに夫々基づいた移動情報を記憶した記憶手段とを備えた成膜装置において、前記基板が載置された前記基板載置部を移動させてこの基板と前記処理室に備えられた対象物とのアライメントを行うアライメント方法であって、
前記搬送手段により前記処理室のうちの一つに前記基板が搬送される工程と、
前記記憶手段の前記基板が搬送された前記処理室の前記基板載置部と前記搬送手段とに夫々基づいた移動情報に基づいて前記基板を移動させる工程と、
前記基板と前記対象物とのアライメントを行うアライメント工程とを有することを特徴とするアライメント方法。
A plurality of processing chambers for performing processing on a substrate; a substrate mounting portion provided in each of the plurality of processing chambers; a transporting means for transporting the substrate to the substrate mounting portion; and the processing chamber In the film forming apparatus comprising storage means for storing movement information based on the substrate placement part and the transfer means , the substrate placement part on which the substrate is placed is moved to An alignment method for performing alignment with an object provided in the processing chamber,
A step of transporting the substrate to one of the processing chambers by the transport means;
Moving the substrate based on movement information based on the substrate placement unit and the transfer unit of the processing chamber in which the substrate of the storage unit has been transferred, and
An alignment method comprising an alignment step of aligning the substrate and the object.
前記移動情報に基づいた前記基板の移動は、前記搬送手段により行うことを特徴とする請求項7〜9のいずれか1項に記載のアライメント方法。   The alignment method according to claim 7, wherein the movement of the substrate based on the movement information is performed by the transport unit. 前記移動情報に基づいた前記基板の移動は、前記基板載置部により行うことを特徴とする請求項7〜9のいずれか1項に記載のアライメント方法。   The alignment method according to claim 7, wherein the movement of the substrate based on the movement information is performed by the substrate placement unit. 前記移動情報に基づいた前記基板の移動と反対方向に同量だけ、前記基板載置部を、前記基板の前記移動情報に基づく移動の前に移動させる工程を有することを特徴とする請求項11に記載のアライメント方法。   12. The method of moving the substrate mounting unit by the same amount in a direction opposite to the movement of the substrate based on the movement information before the movement based on the movement information of the substrate. The alignment method described in 1.
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