JP6257458B2 - LED lighting device - Google Patents

Description

  The present invention relates to an LED lighting device using LEDs as a light source, and the present invention particularly relates to an LED lighting device assembled in a building such as a fence.

  In general, fences are installed at various places such as entrances and exits of buildings, windows, and corridors. For example, at the entrance of a building, a board is installed so as to project forward from the outer wall surface of the building to a position above the floor surface. The kite is intended to prevent strong sunlight and rainwater. If the projection width of the kite (the length in the longitudinal direction of the kite plate) is large, the effect of blocking sunlight and rainwater is enhanced, but the lower part of the kite becomes dark. For this reason, a lighting fixture is incorporated into the lower surface of the plate. Conventionally, as this type of luminaire with a lighting fixture, an illuminating cover is mounted on an opening window formed on the lower surface of the glazing plate, and an illuminating box with a built-in light bulb is arranged inside the illuminating cover. (For example, refer to Patent Document 1).

JP 2000-27350 A

  Since the thing of patent document 1 uses the light bulb with short lifetime as a light source, it is easy to produce a bulb | ball break and needs to replace | exchange light bulbs frequently. In addition, since a large opening window for mounting the lighting cover is formed on the bottom surface of the plate, it takes time to process the plate and it is necessary to devise a seal structure to prevent the intrusion of rainwater. There is.

  In recent years, LED lighting devices using long-life LEDs as light sources have been put into practical use. In this type of LED illumination device, an LED module in which an LED chip is mounted on a substrate is used. In this LED module, the upper part of the LED is covered with a light-transmitting cover. On the rear surface of the substrate, a heat dissipation mechanism for radiating heat generated by the LEDs is provided integrally with the substrate. In order to efficiently dissipate heat, the heat dissipating mechanism generally has a fin structure. However, the LED module becomes large due to this heat dissipation mechanism, and it is necessary to form a large opening window on the lower surface of the cover plate in order to position the heat dissipation mechanism in the internal space of the cover plate.

  This invention was made paying attention to the above-mentioned problem, and it aims at providing the LED lighting apparatus which can discharge | release the heat | fever which LED emits efficiently, without using the heat dissipation mechanism of a fin structure.

  An LED lighting device according to the present invention is assembled to a building, and an LED module in which an LED covered with a light-transmitting cover is mounted on a substrate integrally having a heat sink on the rear surface; It consists of a fixed frame for fixing the LED module to a heat radiating body (heat sink) composed of an aluminum building. In the LED module, at least one diagonal position of the outer peripheral portion of the substrate protrudes from the outer peripheral edge of the cover. The fixing frame has a shape in which the opening on the rear surface matches the outer shape of the substrate of the LED module and the opening on the front surface matches the outer shape of the cover, and on the outer peripheral portion where the substrate protrudes into the opening on the front surface. A presser frame part to be covered is provided. The fixing frame is fixed to the heat radiating body in a state where the heat radiating plate of the LED module is pressed against the mounting surface of the heat radiating body by the holding frame portion.

  In the LED lighting device having the above-described configuration, the protruding outer peripheral portion of the LED module substrate is pressed by the holding frame portion of the fixed frame, and the heat sink integrated with the substrate is fixed in a state of being pressed against the heat radiating body. The plate is in close contact with the radiator, and the heat of the radiator plate is efficiently conducted to the radiator. Since the radiator is configured with an aluminum structure, the heat dissipation area is large, heat is efficiently dissipated into the air, and the temperature rise of the LED module is prevented.

  In a preferred embodiment of the present invention, a flexible heat conductive sheet is interposed between the heat radiating plate of the LED module and the heat radiating body.

  According to this embodiment, the heat of the heat radiating plate is transmitted to the heat radiating body through the heat conductive sheet and radiated into the air. Since the heat conductive sheet is flexible, the heat conductive sheet comes into close contact with the heat radiating plate and the heat radiating body when the substrate of the LED module is pressed by the holding frame portion of the fixed frame. As a result, unevenness and warpage of each surface of the heat sink and the heat sink are absorbed, and adhesion between the heat conductive sheet and the heat sink and between the heat conductive sheet and the heat sink is improved, Increases efficiency.

  In a preferred embodiment, in the LED module, the 90 ° equiangular position of the outer peripheral portion of the substrate protrudes from the outer peripheral edge of the cover, but is not limited thereto, and the 180 ° equiangular position protrudes. Alternatively, a 60 degree equiangular position, a 45 degree equiangular position, a 30 degree equiangular position, or the like may be projected. In this embodiment, the outer peripheral portion of the substrate is pressed by the holding frame portion of the fixed frame at four locations, and the LED module is fixed to the heat radiating body with the heat radiating plate pressed against the heat radiating body.

  Furthermore, in a preferred embodiment, the fixing frame is fixed to the heat radiating body by a screw member (for example, a screw) penetrating each holding frame portion. However, the fixing frame is not limited to this, and penetrates a portion other than the holding frame portion. The screw member may be attached to the radiator.

  In the above-described configuration of the present invention, the fixed frame can be made of various materials such as metal and synthetic resin. However, in order to improve heat dissipation, it is desirable to form the fixed frame by aluminum die casting.

  In addition, there are various types of aluminum structures that constitute the heat radiator, such as those that constitute roofs and ceilings, and those that constitute wall surfaces. The optimum embodiment is formed by extrusion of aluminum. There is a trap.

  According to the present invention, the heat generated by the LED can be efficiently released without using a fin-structure heat dissipation mechanism, and the temperature rise of the LED module can be prevented. Moreover, since the LED module does not need to have a fin-structure heat dissipation mechanism, it is not necessary to form a large opening window on the mounting surface of the building.

It is a side surface which shows the external appearance of the ridge | bag with which the LED lighting apparatus which is one Example of this invention was assembled | attached. It is a front view which shows the external appearance of a LED lighting apparatus. It is a side view which shows the external appearance of a LED lighting apparatus. It is sectional drawing which follows the AA line of FIG. It is a front view which shows the external appearance of a LED module. It is a side view which shows the external appearance of a LED module. It is a front view which shows the external appearance of a fixed frame. It is a rear view which shows the external appearance of a fixed frame. It is sectional drawing which follows the BB line of FIG. It is a front view which shows the external appearance of the LED lighting apparatus with which the fixed frame of other embodiment was used. It is sectional drawing which shows the other Example of LED lighting apparatus. It is a top view which expands and shows a part of Example of FIG.

  FIG. 1 shows the appearance of a basket 1 in which the LED lighting device 2 of the present invention is assembled. In the figure, reference numeral 10 denotes an outer wall surface of the building, and the base end portion of the roof plate 11 is supported by the support member 12 so that the roof plate 11 projects from the outer wall surface 10. The LED lighting device 2 is attached to the lower surface of the roof plate 11, and is provided at one location in the center when the lateral width is short, and at multiple locations when the lateral width is long. In addition, ridges having a large protruding width can be provided at a plurality of locations in the protruding width direction. The lower part of the basket 1 is illuminated brightly by the LED lighting device 2.

  The gutter plate 11 and the support member 12 constituting the gutter 1 are formed by extrusion molding of aluminum. The entire plate 11 may be a single plate, or may be a plate in which a plurality of plate members are connected in the width direction or the width direction. Moreover, although the inner side of the illustrated plate 11 is hollow, it is not necessarily required to be a hollow body.

  FIGS. 2-4 shows the structure of the LED lighting apparatus 2 which is one Example of this invention, The LED module 3, the fixing frame 4, and the heat conductive sheet 5 are provided. In this embodiment, the awning 1 that is an aluminum building is used as a radiator (heat sink) for releasing the heat generated by the LED module 3. Can also be used for the radiator. Aluminum has good thermal conductivity and excellent heat dissipation characteristics. Even if the building such as the firewood 1 does not have a fin structure, it has a large heat radiation area and can function as a heat radiator.

  The LED module 3 is fixed to the lower plate portion 11 a of the cover plate 11 with screws 6 and 6 while being fitted in the fixed frame 4. In FIGS. 3 and 4, 11b is an upper plate portion of the cover plate 11, and a space between the lower plate portion 11a and the upper plate portion 11b is a hollow portion. A through hole 13 is formed in the lower plate portion 11 a of the flange plate 11, and a lead wire 30 is drawn from the through hole 13 into a hollow portion of the flange plate 11. The through hole 13 may have a size that allows the lead wire 30 to pass through, and the diameter is set to about 10 to 15 mm. The lead wire 30 is connected to a power supply unit (not shown). A voltage for driving the LED module 3 to emit light is supplied from the power supply unit.

  As shown in FIGS. 5 and 6, the LED module 3 has four LED chips (hereinafter simply referred to as “LEDs”) 33 mounted on an insulating synthetic resin substrate 32. . The substrate 32 has a thin plate shape, and a thick heat sink 31 made of aluminum is integrally joined to the rear surface of the substrate 32. A light-transmitting synthetic resin cover 34 that covers the LEDs 33 from above is attached to the front surface of the substrate 32 with a plurality of bolts 35 and nuts 36.

  The substrate 32 and the heat radiating plate 31 have a square planar shape, and the LED 33 is mounted on each of the four regions on the substrate 32. The heat radiating plate 31 conducts the heat generated by the LEDs 33 to the eaves 1 through the heat conductive sheet 5, and the heat is radiated into the air using the surface of the eaves plate 11 as a heat radiating surface. A wiring pattern (not shown) is formed on the surface of the substrate 32. The lead wire 30 is connected to the wiring pattern. The lead wire 30 is drawn out behind the heat sink 31 from a lead wire lead hole (not shown) penetrating the substrate 32 and the heat sink 31. In FIG. 6, reference numeral 38 denotes a synthetic resin sleeve through which the lead wire passes.

  The cover 34 has a plate-like portion 34a having a constant thickness along the outer peripheral edge, and first and second accommodating portions 34b, 34c surrounded by the plate-like portion 34a. The front and rear surfaces of the plate-like portion 34 a are flat surfaces, and the rear surface is in close contact with the front surface of the substrate 32. The first housing portion 34 b has a recessed inner surface and is a space for housing the LED 33. The outer surface of the first accommodating portion 34b is a convex curved surface, and constitutes a lens for spreading light from the LED 33 in a predetermined direction by a predetermined angle. The second accommodating portion 34 c has a recessed inner surface and is a space for accommodating the connecting end portion of the lead wire 30.

  The cover 34 has an approximately octagonal outer shape. Of the outer peripheral edge of the cover 34, long vertical and horizontal edges are aligned with each side of the substrate 32, and oblique edges are located at corners of the substrate 32. Each corner portion of the substrate 32 protrudes from the outer peripheral edge of the cover 34 and constitutes a substantially triangular protrusion 37. Of the four projecting portions 37, two projecting portions 37 at one diagonal position are formed with circular notches 38 through which the screws 6 pass. In this embodiment, only a part (corner part) of the outer peripheral portion of the substrate 32 protrudes from the outer peripheral edge of the cover 34. However, the present invention is not limited to this, and the outer peripheral edge of the cover 34 extends over the entire periphery. You may make it protrude more.

  The fixed frame 4 is formed by aluminum die casting and has a square outer shape. As shown in FIG. 8, the opening 41 on the rear surface of the fixed frame 4 has a square shape that matches the outer shape of the substrate 32 of the LED module 3. The depth d1 of the opening 41 coincides with the thickness of the substrate 32 and the heat radiating plate 31, as shown in FIGS. As shown in FIG. 7, the opening 42 on the front surface of the fixed frame 4 has a substantially octagonal shape that matches the outer shape of the cover 34. The depth d2 of the opening 42 coincides with the thickness of the plate-like portion 34a of the cover 34 as shown in FIGS.

  By configuring the shapes and depths d1 and d2 of the openings 41 and 42 on the rear surface and the front surface of the fixed frame 4 as described above, the triangles that cover the protrusions 37 of the substrate 32 at the respective corner positions of the openings 42. A presser frame portion 43 having a shape is formed. The thickness of the pressing frame portion 43 matches the thickness of the plate-like portion 34 a of the cover 34.

The heat radiating plate 31 of the LED module 3 is pressed against the lower surface of the flange plate 11 that is a heat radiating body via the heat conductive sheet 5, and the fixing frame 4 has four supporting plates 32 of the LED module 3. In a state of being pressed against the lower surface of the flange plate 11 by the portion 43, it is fixed to the flange plate 11 with screws 6 and 6.
Of the four presser frame portions 43, a through hole 44 through which the screw 6 passes is formed in the presser frame portion 43 at one diagonal position. Each through hole 44 has a tapered dish-like portion 45 formed at the opening edge of the front surface, and the head of the screw 6 is supported by the dish-like portion 45.

  The heat conductive sheet 5 has flexibility and desirably has elasticity. Although a silicon sheet is used as the heat conductive sheet 5, the present invention is not limited to this, and a non-silicon type heat conductive sheet such as acrylic may be used. The heat radiation plate 31 of the LED module 3 and the flange plate 11 as a heat radiator have fine irregularities and warpages, and the heat from the LED module 3 to the flange plate 11 is improved by improving the adhesion between the two and the heat conductive sheet 5. Increases the efficiency of conduction. Moreover, if the heat conductive sheet 5 has elasticity, the vibration and impact from the outside will be absorbed into the heat conductive sheet 5, and LED33 will be protected from physical external force.

  In the LED lighting device 2 having the above-described configuration, since the protruding portion 37 of the substrate 32 of the LED module 3 is pressed by the holding frame portion 43 of the fixed frame 4, the heat radiating plate 31 integrated with the substrate 32 supports the heat conductive sheet 5. The fixing frame 4 is pressed and fixed with screws 6 in this state. The heat radiating plate 31 is in close contact with the lower surface of the flange plate 11 via the heat conductive sheet 5, and the heat of the heat radiating plate 31 is efficiently conducted to the flange plate 11. Since the cover plate 11 is a structure made of aluminum, the heat dissipation area is large, heat is efficiently dissipated into the air, and the temperature rise of the LED module 3 is prevented.

  Moreover, since the heat conductive sheet 5 is flexible, the heat conductive sheet 5 is pressed against the rear surface of the heat radiating plate 31 and the bottom plate 11 by the substrate 32 of the LED module 3 being pressed by the holding frame portion 43 of the fixed frame 4. Since it is in close contact with the lower surface of the heat sink, unevenness and warpage of the lower surface of the heat radiating plate 31 and the cover plate 11 are absorbed, and between the heat conductive sheet 5 and the heat radiating plate 31 and between the heat conductive sheet 5 and the plate 11 Is improved, and the efficiency of heat conduction is improved.

The LED lighting device 2 of the present invention is not limited to the above embodiment, and various other design changes can be made.
For example, the fixed frame 4 is not limited to a square shape, and may be a circular shape or other shapes such as an octagonal shape as shown in FIG.
Further, in the above embodiment, the fixed frame 4 is screwed at the position of the presser frame portion 43. However, as shown by the one-dot chain lines L1 and L2 in FIG. May be. The same applies to the square-shaped fixed frame 4 described above, and the fixed frame 4 may be screwed at a position on the center line c as indicated by alternate long and short dash lines L1 and L2 in FIG. Further, the number of screwing points is not limited to two, and may be three or more.

FIG. 11 and FIG. 12 show an embodiment in which the LED lighting device 2 is assembled to a gutter plate 11 having a plate shape without a hollow portion.
In this embodiment, since the lead wire 30 of the LED module 3 is drawn out from the through hole 13 to the upper surface of the cover plate 11, the lead wire 30 is covered with the cover 7 along the guide direction. Although not shown, the caulking material is filled between the cover 7 and the flange 11 with the lead wire 30 interposed therebetween. The cover 7 also covers the screws 6 for fixing the fixed frame 4. However, if the position of the screws 6 is on the center line c, the width of the cover 7 may be small.

1 庇 2 LED lighting device 3 LED module 4 fixed frame 5 thermal conductive sheet 6 screw 11 庇 plate 31 heat sink 32 substrate 33 LED
37 Projection 41, 42 Opening

Claims (6)

  An LED lighting device to be assembled in a building, wherein an LED module in which an LED covered with a light-transmitting cover is mounted on a substrate integrally having a heat sink on its rear surface, and the LED module made of aluminum A fixed frame for fixing to a heat dissipating body configured with a building, wherein the LED module has at least one diagonal position of an outer peripheral portion of the substrate protruding from an outer peripheral edge of the cover; Has a shape in which the opening on the rear surface coincides with the outer shape of the substrate of the LED module and the opening on the front surface coincides with the outer shape of the cover, and the presser frame covers the outer periphery of the substrate protruding from the front opening. The fixing frame is fixed to the radiator with the heat sink of the LED module pressed against the mounting surface of the radiator by the holding frame. LED lighting device comprising Te.   The LED lighting device according to claim 1, wherein a flexible heat conductive sheet is interposed between the heat sink of the LED module and the heat radiator.   The LED illumination device according to claim 1, wherein the LED module has a 90 ° equiangular position of an outer peripheral portion of the substrate protruding from an outer peripheral edge of the cover.   The LED lighting device according to claim 1, wherein the fixing frame is fixed to the heat radiating body by a screw member that penetrates the holding frame portion.   The LED lighting device according to claim 1, wherein the fixed frame is formed by aluminum die casting.   The LED lighting device according to claim 1, wherein the heat radiating body is a ridge formed by extrusion molding of aluminum.

Images