JP6255546B1 - Vacuum bonding equipment for bonding devices - Google Patents

Abstract

This prevents the first workpiece and the second workpiece from being displaced due to changes in pressure and temperature in the bonding space. A first holding member having a first workpiece holding surface of the first workpiece, a second holding member facing the first workpiece holding surface across the bonding space and having a second workpiece holding surface of the second workpiece, An approach / separation drive unit that relatively moves one or both of the one holding member and the second holding member, and a gas is discharged from the bonding space to the external space, and the bonding space is reduced from the atmospheric atmosphere to the reduced pressure atmosphere. A chamber pressure adjusting unit that adjusts to and a control unit that operates and controls the contact / separation driving unit and the chamber pressure adjusting unit, either one or both of the first work holding surface and the second work holding surface, A plurality of convex portions formed so as to detachably contact one or both of the first workpiece and the second workpiece, and a non-bonding surface adjacent to the plurality of convex portions. A plurality of concave grooves formed so as to face each other, The plurality of convex portions and the plurality of groove portions are either the first work holding surface or the second work holding surface, or the whole of both of the plurality of convex portions and the plurality of groove portions. Ventilation that is arranged in an isotropic arrangement in the direction in which the non-bonding surfaces intersect, and in which the plurality of groove portions communicate with the bonding space and the external space in a contact state of the non-bonding surfaces with respect to the plurality of convex portions The control unit controls the gas to flow in the same manner in the direction in which the non-bonding surfaces intersect with each other when the bonding space is reduced by the chamber pressure adjusting unit and when the atmosphere is released.

Description

  The present invention may be a flat panel display (FPD) or a sensor device such as a liquid crystal display (LCD), an organic EL display (OLED), a plasma display (PDP), or a flexible display, or a touch panel type FPD or 3D (three-dimensional). Another plate-like workpiece such as a touch panel, cover glass, cover film, or FPD is used for a plate-like workpiece such as a liquid crystal module (LCM) or flexible printed wiring board (FPC) such as a display or an electronic book. It is related with the vacuum bonding apparatus of the bonding device bonded together.

Conventionally, as a vacuum bonding apparatus for this type of bonding device, a lower flat plate (table) that sucks and holds a first substrate in a vacuum chamber and an upper flat plate (adhesive) that holds and holds a second substrate. There is a bonded substrate board manufacturing apparatus in which a plurality of suction grooves are formed on a suction surface of a pressure plate or a table (for example, see Patent Document 1).
The plurality of suction grooves are formed by cutting out sides so as to extend to end faces of the pressure plate and the table along a predetermined direction, and communicate with the space in the vacuum chamber. The convex portions formed between the plurality of suction grooves are formed with suction pipes that are not in communication with the plurality of suction grooves, and the substrate is vacuum-sucked by the suction pipes.
The press device controlled by the control device evacuates and depressurizes the inside of the vacuum chamber, and after the alignment of the substrate is performed, the substrate is pressed and bonded, and then the inside of the vacuum chamber is opened to the atmosphere. .

JP 2006-178476 A

By the way, the temperature in the vacuum chamber changes due to adiabatic expansion or adiabatic compression of the gas in the plurality of adsorption grooves due to pressure change during decompression or release to the atmosphere.
More specifically, when the pressure is reduced by evacuation in the vacuum chamber while the substrate is in close contact with the pressure plate or table, the gas in the plurality of adsorption grooves communicating with the space in the vacuum chamber adiabatically expands. The temperature drops.
On the other hand, when the atmosphere is released, the gas in the plurality of adsorption grooves communicating with the space in the vacuum chamber is adiabatically compressed and the temperature rises.
Such temperature changes in the space in the vacuum chamber, the pressure plate, and the table are also transmitted to the closely held substrate, and the substrate expands and contracts in the direction in which the temperature change occurs.
However, in Patent Document 1, since a plurality of adsorption grooves are mainly arranged in a striped anisotropy extending in one direction, parallel linear grooves are arranged at the time of decompression in the vacuum chamber or when the atmosphere is released. A temperature change mainly occurs in the linear extension direction of each suction groove. Along with this, the substrate also expands and contracts mainly in the linear extension direction of each suction groove, and the overall shape of the substrate changes.
In addition, there may be a case where a plurality of suction grooves (straight grooves) are provided in only one of the pressure plate and the table for design reasons, or the linear extension directions of the suction grooves provided in the pressure plate and the table may be different. Conceivable. In such a case, misalignment occurs between the substrates facing each other, and even if the substrates are precisely aligned in a reduced pressure state, local distortion and misalignment may occur due to the next atmospheric release.
This expansion / contraction is affected even if a slight change is applied to a liquid crystal panel or organic EL panel display that requires submicron order alignment on a large substrate with a side exceeding 1 meter. There was a problem of getting out.
In addition, liquid crystal (LC) and UV curable optical transparent resin (OCR) solutions and alignment films used for bonding devices are particularly vulnerable to temperature changes, and liquid crystal (LC ) And UV curable optically transparent resin (OCR) solution and the physical properties of the alignment film are adversely affected, resulting in a decrease in yield.

  In order to solve such a problem, a vacuum bonding apparatus for a bonding device according to the present invention includes a first holding member having a first work holding surface of a first work, the first work holding surface, and a bonding space. A second holding member that is opposed to each other and has a second workpiece holding surface of the second workpiece, and one of or both of the first holding member and the second holding member that are relatively close to each other. A driving unit for driving, a chamber pressure adjusting unit that discharges gas from the bonding space to an external space and adjusts the bonding space from an atmospheric atmosphere to a reduced pressure atmosphere, and the contacting / separating driving unit and the chamber pressure adjusting unit. A control unit that controls the operation, and either one or both of the first workpiece holding surface and the second workpiece holding surface are not bonded to either or both of the first workpiece and the second workpiece. Face to face A plurality of convex portions formed so as to be detachably contacted, and a plurality of concave groove portions formed so as to face the non-bonding surface next to the plurality of convex portions, The plurality of convex portions and the plurality of concave groove portions are formed over the whole of either one or both of the first work holding surface and the second work holding surface. In the contact state of the non-bonding surface with respect to the plurality of convex portions, the plurality of concave groove portions are in the bonding space. And the external space communicated with each other, and the control unit is configured to pass the gas through the air passage when the bonded space is decompressed and released to the atmosphere by the chamber pressure adjusting unit. Control to flow in the same way in the crossing direction And wherein the Rukoto.

It is explanatory drawing which shows the whole structure of the vacuum bonding apparatus of the bonding device which concerns on embodiment of this invention, (a) is a vertical front view before bonding, (b) is a vertical front view after bonding. . FIG. 2 is a cross-sectional plan view taken along line (2)-(2) in FIG. 1.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
As shown in FIG.1 and FIG.2, the vacuum bonding apparatus A of the bonding device W which concerns on embodiment of this invention makes a 1st holding member 1 and the 1st holding member 1 and a pair of workpiece | work W1, W2 formed in plate shape. It is a bonding device manufacturing apparatus that holds the two holding members 2 and aligns and bonds the pair of workpieces W1 and W2 by the relative close movement of the first holding member 1 and the second holding member 2. The pair of workpieces W1 and W2 that have been bonded together are peeled off from the first holding member 1 and the second holding member 2.
As a specific example of this bonding device manufacturing apparatus, the 1st workpiece | work W1 by which the 1st holding member 1 and the 2nd holding member 2 were arrange | positioned facing the bonding space S, and was conveyed to the bonding space S in air | atmosphere. And the second workpiece W2 are received by the first holding member 1 and the second holding member 2, respectively. Thereafter, either one or both of the first holding member 1 and the second holding member 2 are relatively moved in the opposing direction in the decompressed bonding space S. The first workpiece W1 and the second workpiece W2 are bonded (bonded) after being relatively aligned in a direction intersecting with the facing direction as necessary. Thereby, the bonding device W which has sealing space inside is created. Following this, after peeling the first workpiece W1 of the bonding device W from the first holding member 1, the pressure difference between the internal pressure and the sealing space of the bonding device W is returned to atmospheric pressure. The bonding device W is evenly pressurized to a predetermined gap due to this pressure difference. Then, the completed bonding device W peels from the 2nd holding member 2, and is conveyed out of the bonding space S. FIG.
As shown in FIGS. 1A and 1B, the first work W1 and the second work W2 are usually arranged so as to face each other in the vertical direction, and the upper first work W1 and the lower first work W1. The direction in which the two workpieces W2 are bonded together is hereinafter referred to as “Z direction”. A direction along the first workpiece W1 and the second workpiece W2 that intersects the Z direction is hereinafter referred to as an “XY direction”.

If it demonstrates in detail, the vacuum bonding apparatus A of the bonding device W which concerns on embodiment of this invention will be provided with the 1st holding member 1 and the 2nd holding member 2, which are provided facing the Z direction, and the 1st holding member 1 or The contact / separation drive unit 3 that relatively moves either one or both of the second holding members 2 in the Z direction, and the gas is discharged from the bonding space S to the external space (not shown), and the bonding space. Operation control of a chamber pressure adjusting unit (not shown) that adjusts S from the atmospheric atmosphere AP to the reduced pressure DP, the first holding member 1, the second holding member 2, the contact / separation driving unit 3, the chamber pressure adjusting unit, and the like. And a control unit 4 are provided as main components.
Further, the second holding member 2 includes an alignment drive unit (not shown) that relatively adjusts and moves either the first holding member 1 or the second holding member 2 in the XY direction or the XYθ direction. It is preferable to include a peeling member (not shown) made of a lift pin or the like that peels the bonding device W that has been bonded from the second holding member 2.

The bonding device W is a thin plate-like structure including a module in which components are integrally assembled, such as an FPD such as an LCD, a 3D (three-dimensional) display, an electronic book, or an organic EL display. is there.
The first work W1 is made of, for example, a glass touch panel or a cover glass, and is composed so as to cover the second work W2 made of LCM or a flexible printed wiring board (FPC), thereby forming an FPD, an OLED, or the like. To do.
Further, a sealing material W3 is applied in a frame shape to one or both of the opposing surfaces of the first workpiece W1 and the second workpiece W2 using a quantitative discharge nozzle such as a dispenser, and the sealing is surrounded by the sealing material W3. The stop space is filled with liquid crystal (LC).
As the sealing material W3, a photo-curing adhesive such as a UV curable optical transparent resin (OCR), which is cured by absorbing light energy such as ultraviolet rays and is cured by the progress of polymerization, is used. Yes.
As other examples, a sealing space surrounded by the sealing material W3 is filled with a material other than the liquid crystal (LC), or the sealing material W3 is cured by absorption of heat energy to be cured and cured. It is also possible to use or change an agent, a two-component mixed curable adhesive or the like.

The first holding member 1 is composed of a plate such as a flat plate having a thickness that does not deform (bend) with a rigid body such as a metal, and faces the first workpiece W1 loaded in the Z direction on the surface thereof. And has a first work holding surface 1a in contact therewith.
In the case of the example shown in FIG. 1 as a specific example of the first workpiece holding surface 1a, the first workpiece holding surface 1a is disposed on the entire surface of the first holding member 1 that is in contact with the first workpiece W1 or on the entire surface. Is forming.
The second holding member 2 is composed of a plate such as a flat plate having a thickness that does not deform (bend) with a rigid body such as metal, and the surface thereof faces the second workpiece W2 loaded in the Z direction. And has a second work holding surface 2a that comes into contact.
In the case of the example shown in FIG. 1 and FIG. 2 as a specific example of the second work holding surface 2a, the second work is placed on the entire surface of the second holding member 2 in contact with the second work W2 or on the entire surface. A holding surface 2a is formed.
Although not shown as another example, the entire surface of the first holding member 1 can be changed to the first workpiece holding surface 1a, or the entire surface of the second holding member 2 can be changed to the second workpiece holding surface 2a. It is.

Either the first workpiece holding surface 1a or the second workpiece holding surface 2a or both the first workpiece holding surface 1a and the second workpiece holding surface 2a are either or both of the first workpiece W1 and the second workpiece W2. A plurality of convex portions 11, 21 formed so as to be detachably surface-facing opposite to each other, and a plurality of concave grooves 12, 22 formed adjacent to the convex portions 11, 21 ing.
The plurality of convex portions 11 and 21 and the plurality of concave groove portions 12 and 22 are formed on the first workpiece holding surface 1a and the second workpiece holding surface 2a by blasting such as cutting or sandblasting, etching processing, lapping processing, or the like. It is formed by roughening or molding.
The plurality of convex portions 11 and 21 protrude at predetermined intervals along the first workpiece holding surface 1a and the second workpiece holding surface 2a, and are formed so as to be separated into independent island shapes. 11a, 21a.
The plurality of smooth surfaces 11a and 21a are respectively formed on the top surfaces of the plurality of convex portions 11 and 21 protruding from the plurality of concave groove portions 12 and 22, respectively, of the non-bonding surface W11 of the first workpiece W1 and the second workpiece W2. It is formed in parallel with the non-bonding surface W21 and is in surface contact with the non-bonding surfaces W11 and W21.
The plurality of recessed groove portions 12 and 22 are recessed at predetermined intervals along the first work holding surface 1a and the second work holding surface 2a between the plurality of convex portions 11 and 21, respectively, and the first work holding surface 1a. Or a concave shape that is connected over the entire length of the second workpiece holding surface 2a. It is preferable that the shape of each recessed groove part 12 and 22 is made linearly continuous.
The plurality of convex portions 11 and 21 and the plurality of concave groove portions 12 and 22 extend over the entire first work holding surface 1a and the second work holding surface 2a. 12, 22 are arranged in an arrangement having isotropic properties in the intersecting direction along the non-bonding surfaces W11, W21. In the state where the non-bonding surface W11 of the first work W1 and the non-bonding surfaces W11 and W21 of the second work W2 are in contact with the first work holding surface 1a and the second work holding surface 2a, a plurality of groove portions 12 are provided. , 22 constitute an air passage that connects the bonding space S and the external space.

As for the shape of each convex-shaped part 11, 21, a prism, a truncated pyramid, a cylinder, a truncated cone etc. are mentioned.
Each smooth surface 11a, 21a is preferably a uniform surface having a flatness of about 10 μm or less by grinding or polishing.
Thereby, since the first workpiece W1 and the second workpiece W2 are bonded in the Z direction in a state where the surface is uniform, it is possible to perform high-precision bonding that requires submicron accuracy.
It is preferable that a large number of the smooth surfaces 11a and 21a are arranged with a small (narrow) contact area with the first workpiece W1 and the second workpiece W2. In particular, it is preferable to set the total contact area of all the smooth surfaces 11a and 21a to be about 50% or less of the surface area of the first workpiece W1 and the second workpiece W2.
Thereby, the static electricity which arises in the interface of the non-bonding surface W11 of the some smooth surfaces 11a and 21a and the 1st workpiece | work W1, and the non-bonding surface W21 of the 2nd workpiece W2 is suppressed. For this reason, the influence which it has on the physical property of the liquid agent and alignment film of liquid crystal (LC) weak against static electricity by peeling electrification or friction electrification and UV curable optical transparent resin (OCR) can be reduced.
In addition, as the size of each convex-shaped part 11, 21, when the one side becomes 20 mm or more, the air which entered the clearance gap between the smooth surface 11a and the 1st workpiece | work W1, or the smooth surface 21a and the 2nd workpiece | work W2 sticks. It is preferable that one side is set to about 20 mm or less because there is a possibility that the first work W1 and the second work W2 may be displaced due to expansion due to decompression of the mating space S and increase rapidly.
When the thickness of the first work W1 and the second work W2 is 10 times or more, the width of each of the concave groove portions 12 and 22 partially increases in temperature when the bonding space S is depressurized or released to the atmosphere. Since there is a risk of unevenness on the display body such as, it is preferable to set within about 10 times (about 1 mm).

By the way, as the material of the first holding member 1 and the second holding member 2, precision processing is easy (excellent in workability), but is lightweight (excellent in workability) and inexpensive. Materials are commonly used.
On the other hand, glass, silicon, or the like that is harder than a metal material such as an aluminum-based material is generally used as the material of the first workpiece W1 and the second workpiece W2 that constitute a substrate such as an LCD or an OLED.
Therefore, when the first workpiece W1 and the second workpiece W2 are brought into contact with the first workpiece holding surface 1a of the first holding member 1 and the second workpiece holding surface 2a of the second holding member 2 and repeatedly attached and detached, The soft first workpiece holding surface 1a and the second workpiece holding surface 2a are gradually worn by friction generated each time they come into contact.
Therefore, in addition to such wear prevention, non-adhesive coating treatment is applied to the plurality of smooth surfaces 11a and 21a in order to simultaneously achieve problems such as improvement of peelability from the first workpiece W1 and second workpiece W2 and countermeasures against static electricity. It is preferable to apply a roughening treatment.
As a result, the first work W1 and the second work W2 are repeatedly brought into contact with the first work holding surface 1a and the second work holding surface 2a, and change with time such as wear hardly occurs. Since the area of each of the smooth surfaces 11a and 21a in contact with the second workpiece W2 is small, the influence is small. For this reason, highly accurate bonding can be performed semipermanently and stably.

In the case of the example shown in FIG. 1 and FIG. 2 as an example of arrangement of the plurality of convex portions 11 and 21, uneven processing such as cutting is performed on both the first work holding surface 1a and the second work holding surface 2a. In the molding, a plurality of convex portions 11 and 21 protruding in a substantially square prism shape are arranged at equal intervals in the X direction and the Y direction.
In the case of the example shown in FIG. 1 and FIG. 2 as an example of arrangement of the plurality of groove portions 12 and 22, the plurality of groove portions 12 and 22 are arranged between the plurality of protrusion portions 11 and 21. It is formed in a lattice shape (lattice pattern) of approximately 90 degrees. In a state in which the first workpiece W1 and the second workpiece W2 are in surface contact with the plurality of smooth surfaces 11a and 21a, both end portions of the concave grooves 12 and 22 arranged in a lattice shape (both end portions in the X direction and both end portions in the Y direction) The part) is configured to communicate with the bonding space S.
In addition, although not illustrated as another example of arrangement, the shape of the plurality of convex portions 11 and 21 may be changed to a substantially circular shape, a substantially regular polygon shape, or a similar shape, instead of a substantially square shape. It is also possible to change the intersecting angle of the recessed groove portions 12 and 22 to approximately 90 degrees orthogonal to the intersection other than 90 degrees or a radial shape in which three or more recessed groove portions 12 and 22 intersect at one point. Furthermore, the alignment direction of the convex portions 11 and 21 and the extending direction of the concave groove portions 12 and 22 can be changed to a direction inclined with respect to the X direction or the Y direction. It is also possible to change the arrangement example of the recessed groove portions 12 and 22 to a honeycomb shape (honeycomb pattern) or a shape similar to these instead of the lattice shape. It is also possible to change the shape of each of the convex portions 11 and 21 to a truncated pyramid by blasting such as sandblasting, or to change to a cylinder or a truncated cone by molding.

The bonding space S is formed inside a vacuum apparatus (not shown) composed of a vacuum chamber or the like, and gas is exhausted (vacuum evacuation, evacuation) from the bonding space S by operation of a vacuum pump (not shown). As a result, the bonding space S is configured to be adjustable from the atmospheric atmosphere AP to the reduced pressure atmosphere DP having a predetermined degree of vacuum.
The vacuum device is configured to be openable and closable in whole or in part so that the first work W1 and the second work W2 can be taken in and out of the bonding space S. A conveying means (not shown) for the first workpiece W1 and the second workpiece W2 including, for example, a conveyance robot is provided across the bonding space S in the vacuum device and the external space of the vacuum device.
More specifically, when the bonding space S is the atmospheric atmosphere AP, the first workpiece W1 and the second workpiece W2 are respectively carried into the bonding space S by the conveying means. After the bonding space S becomes a reduced pressure atmosphere DP with a predetermined degree of vacuum, the first workpiece W1 and the second workpiece W2 are bonded together, and the bonding device W that has been bonded is carried out to the external space of the vacuum apparatus. ing.

The first holding member 1 disposed above has a holding chuck 13 for detachably suspending the upper first work W1.
In the case of the example shown in FIGS. 1 and 2 as a specific example of the holding chuck 13, by using an adhesive chuck that adheres to the first workpiece W1, the bonding space S becomes a reduced-pressure atmosphere DP having a predetermined degree of vacuum. Also makes the first workpiece W1 impossible to drop.
The adhesive chuck that becomes the holding chuck 13 includes an elevating part 13a that can be reciprocated in the Z direction through the through-hole 1b opened in the first holding member 1, and a first work W1 at the tip of the elevating part 13a. An adhesive portion 13b provided to face the Z direction, an adhesive driven portion 13c provided at the proximal end of the elevating portion 13a, and an adhesive driving portion 13d linked to the adhesive driven portion 13c are provided. .
A plurality of sets of elevating parts 13a and adhesive parts 13b are arranged so as to be dispersed in the XY direction, and the number and interval of the elevating parts 13a and adhesive parts 13b correspond to the size, thickness, material, weight, etc. of the first workpiece W1. Can be decided.
The adhesion drive unit 13d is configured by an actuator or the like that can reciprocate in the Z direction, and the control unit 4 described later of the first workpiece W1 carried into the bonding space S as shown by the solid line in FIG. The operation is controlled such that the adhesive portion 13b is brought into contact with the non-bonding surface W11 to be adhesively held. After the first workpiece W1 and the second workpiece W2 are bonded, the first workpiece holding surface 1a of the first holding member 1 contacts the non-bonding surface W11 of the first workpiece W1 as shown by the solid line in FIG. In this state, the operation is controlled such that the adhesive portion 13b is separated from the non-bonding surface W11 of the first workpiece W1 in the Z direction.
Although not shown in the drawings as other examples, changes such as using an electrostatic chuck instead of an adhesive chuck, using a combination of an adhesive chuck and an electrostatic chuck, and combining an adsorption chuck as an auxiliary can be made.

It is preferable that the 2nd workpiece holding surface 2a of the 2nd holding member 2 arrange | positioned below has the positioning part 23 of the lower 2nd workpiece W2.
The positioning part 23 of the second workpiece W2 does not need to be disposed on the entire second workpiece W2, and only a suction means, an adhesive means, etc. are partially disposed at a location facing the outer edge of the second workpiece W2. Thus, the second workpiece holding surface 2a can be detachably attached and temporarily fixed so as not to move.
In the case of the example shown in FIG.1 and FIG.2 as a specific example of the positioning part 23 of the 2nd workpiece | work W2, it adsorb | sucks to the smooth surface 21a of each convex-shaped part 21 arrange | positioned at the four corners of the 2nd workpiece holding surface 2a. As a means, one or a plurality of suction holes 23a having a diameter of 1 mm or less are provided. The suction hole 23a communicates with an intake source (not shown) such as a vacuum pump. This intake source is controlled to be sucked from the suction hole 23a from the time of receiving the second workpiece W2 carried into the bonding space S to the time of bonding by the control unit 4 described later.
Further, although not shown as another example, it is possible to change the arrangement and number of the suction holes 23a to other than the example shown. Further, instead of the suction means (suction hole 23a), it is possible to provide an adhesive surface only on a predetermined smooth surface 21a as an adhesive means so as to slightly protrude toward the second workpiece W2 from the other smooth surfaces 21a. Other than that, the second workpiece W2 is temporarily fixed with stoppers that are unevenly fitted to the four corners of the second workpiece W2, or formed on any one of the plurality of smooth surfaces 21a formed on the second workpiece holding surface 2a. It is also possible to temporarily fix or change the second workpiece W2 on the rough surface.

The contact / separation drive unit 3 includes an actuator that reciprocates one or both of the first holding member 1 and the second holding member 2 in the Z direction, and the operation is controlled by a control unit 4 described later. .
As an example of the control of the contact / separation drive unit 3 by the control unit 4, as shown by the solid line in FIG. 1A, when the first work W1 and the second work W2 carried into the bonding space S are delivered. The contact / separation drive unit 3 moves either the first holding member 1 or the second holding member 2 relatively apart from the other in the Z direction, or the first holding member 1 and the second holding member 2 Both are moved relatively apart from each other in the Z direction. Thereafter, as shown by the two-dot chain line in FIG. 1 (a) and the solid line in FIG. 1 (b), the contact / separation drive unit 3 is on either the first holding member 1 side or the second holding member 2 side. Is moved toward the other in the Z direction, or both the first holding member 1 side and the second holding member 2 side are moved closer to each other in the Z direction. Thereby, the first workpiece W1 and the second workpiece W2 are overlapped in the Z direction with the sealing material W3 interposed therebetween, and if necessary, further pressed and bonded.
As a specific example of the contact / separation drive unit 3, in the example shown in FIG. 1, only the first holding member 1 is linked to the contact / separation drive unit 3 and the first holding member 1 side is held second. It is relatively moved in the Z direction toward the member 2 side.
Although not shown as another example, only the second holding member 2 is linked to the contact / separation driving unit 3 so that the second holding member 2 side is relatively close to the first holding member 1 side in the Z direction. The first holding member 1 and the second holding member 2 are respectively linked to the contact / separation driving unit 3 so that the first holding member 1 side and the second holding member 2 side simultaneously approach each other in the Z direction. It can also be moved and changed.

The control unit 4 is electrically connected to the adhesion driving unit 13d of the holding chuck 13, the suction source of the suction hole 23a, the contact / separation driving unit 3, the chamber pressure adjusting unit, the alignment driving unit, and the separation member driving unit. Controller.
In addition to this, the controller is also electrically connected to a conveying means for the first workpiece W1 and the second workpiece W2, an opening / closing drive (not shown) for opening / closing the whole or a part of the vacuum apparatus.
The controller serving as the control unit 4 sequentially controls the operation at a preset timing in accordance with a preset program in its control circuit (not shown).

Specifically, as shown by the solid line in FIG. 1A, the control unit 4 transfers the first workpiece W <b> 1 that has been carried into the bonding space S of the atmospheric atmosphere AP by the conveyance unit, as shown in FIG. The operation is controlled so as to be received by the first work holding surface 1a of the first holding member 1. The second workpiece W2 carried into the bonding space S by the conveying means is placed on the second workpiece holding surface 2a of the second holding member 2, and temporarily moved in the suction hole 23a of the positioning portion 23 so that it cannot move. The operation is controlled to be stopped.
Following this, when the bonding space S is depressurized by the chamber pressure adjusting section, the gas in the ventilation path intersects at the non-bonding surfaces W11 and W21 by the ventilation path composed of the plurality of recessed grooves 12 and 22. The flow is controlled in the same way in the XY direction and the XYθ direction.
After that, after the bonding space S is switched to the reduced-pressure atmosphere DP by the chamber pressure adjusting unit, as shown by the two-dot chain line in FIG. 1A and the solid line in FIG. The drive unit 13d and the contact / separation drive unit 3 perform operation control so that the first holding member 1 and the adhesive portion 13b are moved relatively closer to the second holding member 2 in the Z direction. Thereby, the 1st work W1 and the 2nd work W2 are piled up in the Z direction on both sides of seal material W3.
At substantially the same time as this superposition, the alignment drive unit adjusts and moves either the first holding member 1 or the second holding member 2 in the XY direction or the XYθ direction with respect to the other, so that the first work W1 and the second work The relative alignment (alignment) of W2 is performed. After the alignment is completed, the operation is controlled by the contact / separation drive unit 3 so that the first workpiece W1 and the second workpiece W2 are bonded together.
Further, after the first workpiece W1 and the second workpiece W2 are bonded, the first workpiece holding surface 1a of the first holding member 1 is moved by the contact / separation driving unit 3 as shown by the solid line in FIG. The state which contacts with respect to the non-bonding surface W11 of the 1st workpiece | work W1 is hold | maintained. Following this, as shown by the one-dot chain line in FIG. 1 (b), the adhesive drive unit 13d of the holding chuck 13 moves the adhesive part 13b away from the first workpiece W1 and peels it off. I have control.
Thereafter, as shown by a two-dot chain line in FIG. 1B, the first holding member 1 and the adhesive portion 13 b are separated in the Z direction relative to the second holding member 2 by the contact / separation driving unit 3. The operation is controlled so as to be moved back to the initial state.
At this time, the bonding space S is opened to the atmosphere by the room pressure adjusting unit. Similarly to the time of decompression, when the atmosphere is released, the air passage formed by the plurality of concave grooves 12 and 22 is similarly used in the XY direction and the XYθ direction in which the gas in the air passage intersects at the non-bonding surfaces W11 and W21. Controlled to flow.
By this release to the atmosphere, an internal pressure and a pressure difference in the sealed space of the bonded bonding device W are generated, and the bonding device W is evenly pressurized to a predetermined gap by this pressure difference. Following this, the bonding device W is peeled off from the second holding member 2 by the peeling member, and the operation is controlled so as to be carried out of the bonding space S by the conveying means.

According to the vacuum bonding apparatus A of the bonding device W according to the embodiment of the present invention, the entire first work holding surface 1a of the first holding member 1 or the second holding member 2 in the atmospheric atmosphere AP. The first workpiece W1 and the second workpiece W2 are brought into contact with the plurality of convex portions 11 and 21 formed on the entire workpiece holding surface 2a, and are detachably held.
In this contact state, the plurality of concave groove portions 12 and 22 serve as an air passage that communicates the bonding space S and the external space, and the gas in each concave groove portion 12 and 22 can flow.
Thereby, at the time of pressure reduction of the bonding space S by the chamber pressure adjusting unit and release to the atmosphere, the flow state of the gas passing through the air passage composed of the plurality of groove portions 12 and 22 intersects the non-bonding surfaces W11 and W21. It becomes almost the same.
For this reason, the gas in each groove part 12 and 22 adiabatically expands and the temperature decreases as the bonding space S is depressurized, or the gas in each groove part 12 and 22 adiabatically compresses as the atmosphere is released to the temperature. Even if it raises repeatedly, the expansion-contraction change in the 1st workpiece | work W1 and the 2nd workpiece | work W2 becomes substantially the same to the cross direction of the non-bonding surfaces W11 and W21.
Accordingly, when the plurality of convex portions 11 and 21 and the plurality of concave groove portions 12 and 22 are arranged only on either the first workpiece holding surface 1a or the second workpiece holding surface 2a, or the first workpiece holding surface 1a. Even when the plurality of convex portions 11, 21 and the plurality of concave groove portions 12, 22 are arranged in different arrangements on both the second work holding surface 2 a, A positional shift between the first workpiece W1 and the second workpiece W2 can be prevented.
As a result, as compared with the conventional arrangement in which the parallel linear grooves are arranged in a striped anisotropy extending in one direction as the plurality of adsorption grooves, the number of times when the bonding space S is reduced or the atmosphere is released The overall shape of the first workpiece W1 or the second workpiece W2 does not change due to the expansion / contraction change of the one workpiece W1 or the second workpiece W2, and the first workpiece W1 and the second workpiece W2 can be precisely aligned and bonded together.
Furthermore, by setting the width of each concave groove 12, 22 within about 10 times the thickness of the first workpiece W1 or the second workpiece W2, liquid crystal (LC) that is vulnerable to temperature changes or UV curable optical transparent resin ( It is also possible to reduce the influence of OCR) on the liquid agent and the physical properties of the alignment film.
For this reason, the highly accurate bonding device W in which submicron precision is requested | required can be manufactured, without reducing a yield.

In particular, it is preferable to form the plurality of concave groove portions 12 and 22 in a linearly continuous lattice shape.
In this case, by performing uneven processing such as cutting or blasting on one or both of the first work holding surface 1a and the second work holding surface 2a, the plurality of groove portions 12, 22 are smooth and Accurately formed.
Therefore, it is possible to create the highly accurate concave groove portions 12 and 22 with a simple structure.
As a result, the workability of the recessed groove portions 12 and 22 is excellent, the cost can be reduced, and a more accurate bonding device W can be manufactured.

Further, the first holding member 1 and the second holding member 2 are arranged so as to face each other in the vertical direction, and the second workpiece holding surface 2a of the lower second holding member 2 is a positioning portion of the lower second workpiece W2. 23 is preferable.
In this case, even if an unexpected gas flow occurs before bonding with the first workpiece W1 in the bonding space S, the second workpiece W2 is positioned relative to the second workpiece holding surface 2a by the positioning portion 23. Does not shift.
Therefore, the position shift of the second workpiece W2 can be prevented and the first workpiece W1 can be bonded with high accuracy.
As a result, there is no need for a strong vacuum suction compared to the conventional method in which the substrate is strongly vacuum-sucked by the table suction pipe and kept immovable, so the bonding device W is not subjected to excessive load and quality. As a result, the entire structure can be simplified and the cost can be further reduced.

Moreover, the control part 4 is the non-bonding surface W11, W21 of the 1st workpiece | work W1 and the 2nd workpiece W2 which oppose the some groove part 12, 22 at the time of pressure reduction of the bonding space S by a chamber pressure adjustment part, It is preferable to control the gas to flow at substantially the same flow rate on the opposite bonding surfaces W12 and W22.
In this case, even if the bonding space S is depressurized by vacuum evacuation, the vacuum evacuation is performed at substantially the same flow rate on the non-bonding surfaces W11 and W21 and the bonding surfaces W12 and W22. No pressure difference occurs.
Thereby, since it is not necessary to hold the non-bonding surfaces W11 and W21 of the first workpiece W1 and the second workpiece W2 in a strong vacuum and hold the entire first workpiece W1 and the second workpiece W2 immovably, The one workpiece W1 and the second workpiece W2 are free from unevenness and distortion due to the differential pressure.
At the same time, as the bonding space S is depressurized, the portions of the first work W1 and the second work W2 that have small heat capacities facing the concave groove portions 12 and 22 are likely to decrease in temperature due to adiabatic expansion. However, since this small heat capacity portion is in surface contact with the smooth surfaces 11a and 21a and is adjacent to the large heat capacity portion, the non-bonding surfaces W11 and W21 of the first workpiece W1 and the second workpiece W2 are bonded. The temperatures of the surfaces W12 and W22 change to equilibrium, and no significant temperature difference occurs between them.
Accordingly, the first workpiece W1 and the second workpiece W2 can be prevented from being displaced with respect to the first workpiece holding surface 1a and the second workpiece holding surface 2a with a simple structure, and the temperature at the first workpiece W1 and the second workpiece W2 can be prevented. Generation of unevenness can be prevented.

  In the embodiment described above, the adhesive chuck that adheres to the first workpiece W1 is used as the holding chuck 13 that detachably suspends the upper first workpiece W1. Instead, an electrostatic chuck may be used, or a combination of an adhesive chuck and an electrostatic chuck may be used.

A Vacuum bonding apparatus for bonding device 1 First holding member 1a First work holding surface 11 Convex part 12 Concave groove part 2 Second holding member 2a Second work holding surface 21 Convex part 22 Concave groove part 23 Positioning part 23a Adsorption Means (Suction hole) 3 Drive unit for contact / separation 4 Control unit AP Air atmosphere DP Depressurized atmosphere S Bonding space W Bonding device W1 First workpiece W11 Non-bonding surface W2 Second workpiece W21 Non-bonding surface

Claims (4)

A first holding member having a first work holding surface of the first work;
A second holding member facing the first work holding surface across the bonding space and having a second work holding surface of the second work;
A contact / separation driving unit that relatively moves either one or both of the first holding member and the second holding member, and
A chamber pressure adjusting unit that adjusts the bonding space from an air atmosphere to a reduced pressure atmosphere by discharging gas from the bonding space to an external space;
A control unit for controlling the operation of the contact / separation driving unit and the chamber pressure adjusting unit,
Either one or both of the first workpiece holding surface and the second workpiece holding surface are detachably contacted to face one or both non-bonding surfaces of the first workpiece or the second workpiece. A plurality of convex portions formed as described above, and a plurality of concave grooves formed so as to face the non-bonding surface next to the plurality of convex portions,
The plurality of convex portions and the plurality of concave groove portions are formed over the whole of either one or both of the first work holding surface and the second work holding surface. The grooves are arranged in an isotropic arrangement in the direction in which the non-bonding surfaces intersect,
In the contact state of the non-bonding surface with respect to the plurality of convex portions, the plurality of concave groove portions are air passages that respectively communicate the bonding space and the external space;
The control unit controls the gas to flow in the same manner in the direction in which the non-bonding surfaces intersect with each other when the bonding space is depressurized and released into the atmosphere by the chamber pressure adjusting unit. A vacuum bonding apparatus for a bonding device.   The vacuum bonding apparatus for a bonding device according to claim 1, wherein the plurality of concave grooves are each formed in a lattice shape that is linearly continuous.   The first holding member and the second holding member are arranged so as to face each other in the vertical direction, and the second work holding surface of the lower second holding member has a positioning part of the lower second work. The vacuum bonding apparatus of the bonding device of Claim 1 or 2 characterized by the above-mentioned.   The said positioning part is the suction means or adhesive means provided in at least 1 place or more among these convex-shaped parts in said 2nd workpiece holding surface, The vacuum bonding of the bonding device of Claim 3 characterized by the above-mentioned. Alignment device.

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