JP6163085B2 - Pallet for parts alignment and manufacturing method thereof - Google Patents

Pallet for parts alignment and manufacturing method thereof Download PDF

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JP6163085B2
JP6163085B2 JP2013237413A JP2013237413A JP6163085B2 JP 6163085 B2 JP6163085 B2 JP 6163085B2 JP 2013237413 A JP2013237413 A JP 2013237413A JP 2013237413 A JP2013237413 A JP 2013237413A JP 6163085 B2 JP6163085 B2 JP 6163085B2
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太賀 森田
太賀 森田
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株式会社ウエステック
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本発明は、パレットに形成された部品収容穴に部品を収容しパレット上に部品を整列させる部品整列用パレットおよびその製造方法に関する。   The present invention relates to a component aligning pallet for storing components in component receiving holes formed in the pallet and aligning the components on the pallet, and a method for manufacturing the same.

電子機器等を製造するに際し、製造の効率化を図るために、多数のチップ部品を自動供給装置に供給する段階の自動化が望まれている。そのためには、パレットに設けた部品収容穴内にチップ部品を効率よく収容して整列させることが要求される。そこで、例えば、特許文献1には、パレットに多数の部品収容穴を形成し、パレットを振動させる加振部とパレットを揺動させる揺動部を設け、パレットに振動および揺動を加えることによりパレット上に供給した多数の極小ネジをそれぞれの部品収容穴内に収容して整列させるようにした極小部品整列機が開示されている。   When manufacturing an electronic device or the like, it is desired to automate the stage of supplying a large number of chip parts to an automatic supply device in order to improve the manufacturing efficiency. For this purpose, it is required to efficiently accommodate and align the chip components in the component accommodation holes provided in the pallet. Therefore, for example, in Patent Document 1, a large number of component receiving holes are formed in the pallet, a vibration part that vibrates the pallet and a rocking part that rocks the pallet are provided, and vibration and rocking are applied to the pallet. There is disclosed a minimal component aligning machine in which a large number of micro screws supplied on a pallet are accommodated and aligned in respective component accommodating holes.

特開平05−043042号公報Japanese Patent Laid-Open No. 05-043042

ところで、パレットの部品収容穴に収容するチップ部品の形状は、年々、極小化してきている。このためそれぞれの部品収容穴内に1個ずつのチップ部品を収容することが必ずしも容易ではなくなってきており、さらなる効率のよいチップ部品の収容手段の開発が望まれている。   By the way, the shape of the chip component accommodated in the component accommodation hole of the pallet has been miniaturized year by year. For this reason, it is not always easy to accommodate one chip component in each component accommodation hole, and development of a more efficient chip component accommodation means is desired.

部品収容穴に薄型形状のチップ部品を収容する場合、パレット上の部品収容穴を例えば円形に形成すると、部品収容穴の大きさのバラツキによって1個の部品収容穴内に2個のチップ部品がチップ部品の厚さ方向に重なった状態で収容されてしまうことがあった。
そこで、チップ部品の形状(薄型)に対応した例えば長穴形状の部品収容穴を形成することが考えられるが、長穴形状の部品収容穴を形成することは加工時間が長くなることになる。また、通常、パレットには数千から数万の部品収容穴を形成する必要があるため、円形の部品収容穴を形成する場合に比べて1つのパレットを作成するのに膨大な加工時間が必要となったり、加工不可になったりする場合がある。
When a thin chip component is accommodated in the component accommodation hole, if the component accommodation hole on the pallet is formed, for example, in a circular shape, two chip components are chipped in one component accommodation hole due to variations in the size of the component accommodation hole. In some cases, the parts are housed in a state where they overlap in the thickness direction of the parts.
Thus, it is conceivable to form, for example, a long hole-shaped component accommodating hole corresponding to the shape (thin shape) of the chip component. However, forming a long hole-shaped component accommodating hole increases the processing time. Also, since it is usually necessary to form several thousand to several tens of thousands of component receiving holes in the pallet, it takes a lot of processing time to create one pallet compared to the case of forming circular component receiving holes. Or processing may not be possible.

そこで、本発明は、チップ部品の形状に合わせた部品収容穴を容易に形成することができ、1個の部品収容穴内へ2個のチップ部品が収容される確率を低減させるとともに、部品整列用パレットを少ない加工時間で製造することが可能な部品整列用パレットおよびその製造方法を提供することを目的とする。   Therefore, the present invention can easily form a component accommodation hole that matches the shape of the chip component, reduces the probability that two chip components are accommodated in one component accommodation hole, and is used for component alignment. It is an object of the present invention to provide a parts alignment pallet that can be manufactured in a short processing time and a manufacturing method thereof.

上記の目的を達成するために、本発明の部品整列用パレットは、パレットの一面に分散して載置されたチップ部品が、前記一面に設けられた前記チップ部品を収容するための複数の部品収容穴にそれぞれ収容されることにより、前記チップ部品が前記パレット上に整列される部品整列用パレットであって、
複数の前記部品収容穴の各々は、第1の径を有する第1の穴と、第2の径を有する第2の穴とを備え、
前記第1の穴と前記第2の穴とは、一部分が重なり合うように形成されており、
前記部品収容穴に収容される前記チップ部品が直方体の形状を有し、その厚さ方向の大きさをT、幅方向の大きさをW、長さ方向の大きさをL、厚さ方向と幅方向との辺で形成される面の対角線の大きさをXとしてT≦W≦Lの関係にあるとすると、
前記第1の径および前記第2の径は、X以下の大きさを有し、
前記部品収容穴の内壁面を形成する前記第1の穴の内壁面と前記第2の穴の内壁面において、前記第1の穴の内壁面と前記第2の穴の内壁面との境界部分における対向する内壁面間の距離は、2T以下の大きさを有しているものである。
In order to achieve the above-mentioned object, the component aligning pallet according to the present invention includes a plurality of components in which chip components distributed and placed on one surface of the pallet accommodate the chip components provided on the one surface. A component aligning pallet in which the chip components are aligned on the pallet by being accommodated in the accommodating holes,
Each of the plurality of component receiving holes includes a first hole having a first diameter and a second hole having a second diameter,
The first hole and the second hole are formed so as to partially overlap each other,
The chip component accommodated in the component accommodation hole has a rectangular parallelepiped shape, the size in the thickness direction is T, the size in the width direction is W, the size in the length direction is L, and the thickness direction is Assuming that the size of the diagonal line of the surface formed by the side with the width direction is X and T ≦ W ≦ L,
The first diameter and the second diameter have a size of X or less,
A boundary portion between the inner wall surface of the first hole and the inner wall surface of the second hole in the inner wall surface of the first hole and the inner wall surface of the second hole forming the inner wall surface of the component housing hole. The distance between the inner wall surfaces facing each other has a size of 2T or less.

また、本発明の部品整列用パレットの製造方法は、上記の部品整列用パレットの製造方法であって、前記第1の穴の第1の径よりも前記第2の穴の第2の径の方が大きい場合、前記第1工程の後に前記第1の穴を形成する第1工程と、前記第2の穴を形成する第2工程と、を含むものである。   In addition, a method for manufacturing a component aligning pallet according to the present invention is the above method for manufacturing a component aligning pallet, wherein the second diameter of the second hole is larger than the first diameter of the first hole. If it is larger, the method includes a first step of forming the first hole after the first step and a second step of forming the second hole.

また、本発明の部品整列用パレットの製造方法において、前記第1工程における第1の穴はドリルを用いて形成され、前記第2工程における第2の穴はエンドミルを用いて形成されることが好ましい。   In the method for manufacturing a parts alignment pallet of the present invention, the first hole in the first step may be formed using a drill, and the second hole in the second step may be formed using an end mill. preferable.

本発明の部品整列用パレットおよびその製造方法によれば、1個の部品収容穴内へ2個のチップ部品が収容される確率を低減させることができるとともに、複数の部品収容穴が形成される部品整列用パレットを少ない加工時間で製造することができる。   According to the component alignment pallet and the manufacturing method thereof of the present invention, it is possible to reduce the probability that two chip components are accommodated in one component accommodating hole, and a component in which a plurality of component accommodating holes are formed. The alignment pallet can be manufactured in a short processing time.

本発明に係る部品整列用パレットの構成を示す図である。It is a figure which shows the structure of the components alignment pallet which concerns on this invention. 部品整列用パレットに形成された部品収容穴の一例を示す図であり、(a)はその平面図、(b)は(a)のE−E断面図を示す。It is a figure which shows an example of the component accommodation hole formed in the pallet for components alignment, (a) is the top view, (b) shows EE sectional drawing of (a). 部品収容穴に収容されるチップ部品の一例を示す図である。It is a figure which shows an example of the chip component accommodated in a component accommodation hole. 部品整列用パレットの製造手順を示すフローチャートである。It is a flowchart which shows the manufacture procedure of the components alignment pallet. 部品収容穴の比較例を示す図であり、(a)は丸穴形状、(b)は長穴形状の部品収容穴を示す。It is a figure which shows the comparative example of a component accommodation hole, (a) is a round hole shape, (b) shows the component accommodation hole of a long hole shape. 部品収容穴の変形例を示す図である。It is a figure which shows the modification of a component accommodation hole.

以下、本発明に係る部品整列用パレットおよびその製造方法の実施形態の一例について、図面を参照して詳細に説明する。   Hereinafter, an example of an embodiment of a parts alignment pallet and a manufacturing method thereof according to the present invention will be described in detail with reference to the drawings.

図1は、本実施形態に係る部品整列用パレット1の構成を示す平面図である。部品整列用パレット1は、例えば、部品整列機(図示省略)に固定されて使用される。部品整列用パレット1は、多数のチップ部品が部品整列用パレット1上に分散して載置された状態で、部品整列機から部品整列用パレット1に振動および揺動を加えることで、各チップ部品を部品整列用パレット1に形成された複数の部品収容穴にそれぞれ収容させることができるものである。また、各部品収容穴にチップ部品を1個ずつ収容させることにより部品整列用パレット1上にチップ部品を整列させることができるものである。   FIG. 1 is a plan view showing a configuration of a component alignment pallet 1 according to the present embodiment. The component aligning pallet 1 is used by being fixed to a component aligner (not shown), for example. The component aligning pallet 1 is configured so that each chip is subjected to vibration and swinging from the component aligning machine to the component aligning pallet 1 in a state where a large number of chip components are dispersedly placed on the component aligning pallet 1. The components can be accommodated respectively in a plurality of component accommodation holes formed in the component alignment pallet 1. Further, the chip components can be aligned on the component aligning pallet 1 by storing the chip components one by one in each component receiving hole.

図1に示すように、部品整列用パレット1は、本体基板2と、本体基板2の周部に設けられた枠部3とを備える。本体基板2の一面2aには、枠部3で囲まれた領域内に複数の部品収容穴5が形成されている。   As shown in FIG. 1, the component aligning pallet 1 includes a main body substrate 2 and a frame portion 3 provided on a peripheral portion of the main body substrate 2. On one surface 2 a of the main body substrate 2, a plurality of component housing holes 5 are formed in a region surrounded by the frame portion 3.

本体基板2は、例えば、矩形状を有した板状部材によって形成されており、その材質はベークライト(フェノール樹脂)等によって構成されている。なお、材質は、ベークライトに限らず、カーボンの粉を含んだ他の樹脂によって構成するようにしてもよい。   The main body substrate 2 is formed by, for example, a rectangular plate-shaped member, and the material thereof is made of bakelite (phenol resin) or the like. The material is not limited to bakelite, but may be made of other resin containing carbon powder.

枠部3は、本体基板2の一面2aの周部に、一面2aから突出するように形成されており、本体基板2と同じ材質で構成されている。   The frame portion 3 is formed on the peripheral portion of the one surface 2 a of the main body substrate 2 so as to protrude from the one surface 2 a and is made of the same material as that of the main body substrate 2.

部品収容穴5は、本体基板2の一面2aにマトリクス状に複数形成されている。形成される部品収容穴5の数としては、例えば、数千から数万となる。   A plurality of component housing holes 5 are formed in a matrix on one surface 2 a of the main body substrate 2. The number of component housing holes 5 to be formed is, for example, several thousands to several tens of thousands.

図2は、本体基板2から1個の部品収容穴5が形成されている部分のみを抜き出して示した部分拡大図である。図2(a)はその平面図であり、図2(b)は図2(a)のE−E線及び図1のE−E線における断面図である。なお、本例では、本体基板2の複数の部品収容穴5はいずれも同じ構造を有するものとして説明するが、各穴について製造上の公差は生じうる。   FIG. 2 is a partially enlarged view showing only a portion where one component accommodating hole 5 is formed from the main body substrate 2. 2A is a plan view, and FIG. 2B is a cross-sectional view taken along the line EE in FIG. 2A and the line EE in FIG. In this example, the plurality of component housing holes 5 of the main board 2 are described as having the same structure, but manufacturing tolerances may occur for each hole.

図2に示すように、部品収容穴5は、O1を中心としたR1の径(第1の径の一例)を有する穴(第1の穴の一例)5aと、O2を中心としたR2の径(第2の径の一例)を有する穴(第2の穴の一例)5bを備える。穴5aの径の大きさと穴5bの径の大きさとは相違しており、この形態では穴5aの径R1の方が穴5bの径R2よりも小さい。   As shown in FIG. 2, the component receiving hole 5 includes a hole (an example of the first hole) 5a having a diameter R1 (an example of the first diameter) centered on O1, and an R2 centered on O2. A hole (an example of the second hole) 5b having a diameter (an example of the second diameter) is provided. The diameter of the hole 5a is different from the diameter of the hole 5b. In this embodiment, the diameter R1 of the hole 5a is smaller than the diameter R2 of the hole 5b.

部品収容穴5は、本体基板2の一面2aから一面2aとは反対側の一面2bへ向かって垂直に切削されて形成されている。穴5aと穴5bとは、互いの穴の一部分が重なり合うように、この形態においては平面視で穴5aの左側の一部分と穴5bの右側の一部分とが重なり合うように形成されている。穴5aは穴5bよりも深く形成されている。深い方の穴5aはドリルを用いて切削され、浅い方の穴5bはエンドミルを用いて切削される。   The component accommodation hole 5 is formed by cutting perpendicularly from the one surface 2a of the main body substrate 2 toward the one surface 2b opposite to the one surface 2a. In this embodiment, the hole 5a and the hole 5b are formed such that a part on the left side of the hole 5a and a part on the right side of the hole 5b overlap each other in plan view so that a part of each hole overlaps. The hole 5a is formed deeper than the hole 5b. The deeper hole 5a is cut using a drill, and the shallower hole 5b is cut using an end mill.

部品収容穴5における一面2a側の開口縁部には、面取り部6が設けられる。面取り部6は、部品収容穴5の開口上端部において径R6の円形状を有し、その中心位置は、穴5aの中心O1と穴5bの中心O2を通る線分であって、穴5aの端部から穴5bの端部までの線分の中央(中心O2よりやや中心O1寄りの位置)に位置する。面取り部6は、一面2aから離れるにしたがい径が小さくなる方向に傾斜する。   A chamfered portion 6 is provided at the opening edge of the component housing hole 5 on the one surface 2a side. The chamfered portion 6 has a circular shape with a diameter R6 at the upper end of the opening of the component receiving hole 5, and the center position thereof is a line segment passing through the center O1 of the hole 5a and the center O2 of the hole 5b, and It is located at the center of the line segment from the end to the end of the hole 5b (position slightly closer to the center O1 than the center O2). The chamfered portion 6 is inclined in a direction in which the diameter decreases as the distance from the one surface 2a increases.

ここで、部品収容穴5の各々には、図3に示すような直方体の形状を有するチップ部品10が収容される。チップ部品10は、例えば、その厚さがT[mm]の大きさ、幅がW[mm]の大きさ、長さがL[mm]の大きさを有しており、厚さTと幅Wと長さLとの間にはT≦W≦Lの関係がある。また、チップ部品10の厚さ方向の辺と幅方向の辺とで形成される面の対角線がX[mm]の大きさを有する。部品収容穴5には薄型タイプのチップ部品10、具体的には、抵抗、コンデンサ等のチップ部品が収容される。   Here, in each of the component receiving holes 5, a chip component 10 having a rectangular parallelepiped shape as shown in FIG. The chip component 10 has, for example, a thickness of T [mm], a width of W [mm], and a length of L [mm]. There is a relationship of T ≦ W ≦ L between W and the length L. Further, the diagonal line of the surface formed by the side in the thickness direction and the side in the width direction of the chip component 10 has a size of X [mm]. The component housing hole 5 accommodates a thin type chip component 10, specifically, a chip component such as a resistor or a capacitor.

部品収容穴5内に収容されたチップ部品10を図2において破線で示す。チップ部品10は、部品収容穴5の深さ方向へチップ部品10の長さ方向が沿うような姿勢で収容される。すなわち、チップ部品10の厚さ方向の辺と幅方向の辺とで形成される一対の面のうちの一方の面を本体基板2の一面2aと平行に近い姿勢で部品収容穴5に収容される。   The chip component 10 accommodated in the component accommodating hole 5 is indicated by a broken line in FIG. The chip component 10 is accommodated in such a posture that the length direction of the chip component 10 is along the depth direction of the component accommodation hole 5. That is, one of the pair of surfaces formed by the thickness direction side and the width direction side of the chip component 10 is accommodated in the component accommodation hole 5 in a posture close to parallel to the one surface 2 a of the main body substrate 2. The

図3に示すような形状のチップ部品10を部品収容穴5内に図2に示すような姿勢で1個のみ収容するために、部品収容穴5は、穴5aの径R1および穴5bの径R2の大きさが、チップ部品10の厚さ方向の辺と幅方向の辺とで形成される面の対角線Xとの関係で少なくともR1,R2≦Xを満たしている。   In order to accommodate only one chip component 10 having the shape as shown in FIG. 3 in the component accommodation hole 5 in the posture as shown in FIG. 2, the component accommodation hole 5 has a diameter R1 of the hole 5a and a diameter of the hole 5b. The size of R2 satisfies at least R1, R2 ≦ X in relation to the diagonal line X of the surface formed by the side in the thickness direction and the side in the width direction of the chip component 10.

また、部品収容穴5の内壁面を形成する穴5aの内壁面と穴5bの内壁面とにおいて、穴5aの内壁面と穴5bの内壁面との境界部分における対向する内壁面間の距離rが、チップ部品10の厚さTとの関係でT<r≦2Tを満たしている。   In addition, the distance r between the inner wall surfaces facing each other at the boundary between the inner wall surface of the hole 5a and the inner wall surface of the hole 5b in the inner wall surface of the hole 5a and the inner wall surface of the hole 5b forming the inner wall surface of the component housing hole 5. However, T <r ≦ 2T is satisfied in relation to the thickness T of the chip component 10.

また、図2(a)に示される平面視において、穴5aの中心O1と穴5bの中心O2を結ぶ直線から上下両側にT/2(チップ部品10の厚さTの半分の距離)離れた位置における、部品収容穴5の左右方向において対向する内壁面間の距離sが、チップ部品10の幅Wとの関係でW<sを満たす。   Further, in the plan view shown in FIG. 2 (a), it is separated from the straight line connecting the center O1 of the hole 5a and the center O2 of the hole 5b by T / 2 (a distance half the thickness T of the chip part 10) on both the upper and lower sides. The distance s between the inner wall surfaces facing each other in the left-right direction of the component housing hole 5 at the position satisfies W <s in relation to the width W of the chip component 10.

次に、部品整列用パレット1の製造手順を図4に示すフローチャートを参照して説明する。   Next, the manufacturing procedure of the component alignment pallet 1 will be described with reference to the flowchart shown in FIG.

先ず、部品収容穴5を形成するための切削工具としてドリルを用い、部品整列用パレット1上の予め設定された位置に径R1を有する穴5aを形成する(ステップS1:第1工程の一例)。   First, a drill is used as a cutting tool for forming the component accommodation hole 5, and a hole 5a having a diameter R1 is formed at a preset position on the component alignment pallet 1 (step S1: example of the first step). .

続いて、部品収容穴5を形成するための切削工具としてエンドミルを用い、部品整列用パレット1に径R1よりも大きい径R2を有する穴5bを形成する(ステップS2:第2工程の一例)。後から形成する穴5bは、先に形成された穴5aの一部分に穴5bの一部分が重なり合うように形成される。このとき、穴5bは、収容されるチップ部品10の厚さTに対して境界部分の内壁面間の距離r(図2(a)参照)がT<r≦2Tとなり、且つ、チップ部品10の幅Wに対して部品収容穴5の内壁面間の距離s(図2(a)参照)がW<sとなるような予め設定された位置に穴5aに重ねて形成される。また、部品収容穴5の深さは、チップ部品10が部品収容穴5内に全て収容されるような深さに形成される。すなわち浅い方の穴5bの深さがチップ部品10の長さLよりも大きくなるように形成される。   Subsequently, an end mill is used as a cutting tool for forming the component accommodation hole 5, and a hole 5b having a diameter R2 larger than the diameter R1 is formed in the component alignment pallet 1 (step S2: an example of a second step). The hole 5b to be formed later is formed so that a part of the hole 5b overlaps a part of the hole 5a formed previously. At this time, in the hole 5b, the distance r between the inner wall surfaces of the boundary portion (see FIG. 2A) is T <r ≦ 2T with respect to the thickness T of the chip component 10 to be accommodated, and the chip component 10 The distance s (see FIG. 2A) between the inner wall surfaces of the component receiving hole 5 is formed so as to overlap the hole 5a at a preset position such that W <s. Further, the depth of the component accommodation hole 5 is formed such that the chip component 10 is entirely accommodated in the component accommodation hole 5. That is, the shallow hole 5 b is formed so that the depth thereof is larger than the length L of the chip component 10.

続いて、部品収容穴5の縁部に面取り部6を形成する(ステップS3)。   Subsequently, the chamfered portion 6 is formed at the edge of the component housing hole 5 (step S3).

ステップS1からステップS3の製造工程により1個の部品収容穴5の加工を完了する。   The machining of one component housing hole 5 is completed by the manufacturing process from step S1 to step S3.

続いて、全ての部品収容穴5の加工を完了したか否かの判定を行う(ステップS4)。判定の結果、全ての部品収容穴5の加工を完了していない場合(ステップS4:No)には、次の部品収容穴5の加工位置に移動して、ステップS1からステップS3までの製造工程を繰り返す。部品収容穴5を形成する位置は、形成する部品収容穴5の数に応じて予め設定されている。例えば、一面2a上に一万個の部品収容穴5を形成する場合、部品収容穴5は一面2a上に100行100列に配列されるように設定されている。   Subsequently, it is determined whether or not processing of all the component receiving holes 5 has been completed (step S4). As a result of the determination, when the machining of all the component accommodation holes 5 has not been completed (step S4: No), the process moves to the machining position of the next component accommodation hole 5 and the manufacturing process from step S1 to step S3. repeat. The position where the component accommodation hole 5 is formed is set in advance according to the number of the component accommodation holes 5 to be formed. For example, when 10,000 component housing holes 5 are formed on one surface 2a, the component housing holes 5 are set to be arranged in 100 rows and 100 columns on the one surface 2a.

全ての部品収容穴5の加工を完了した場合には(ステップS4:Yes)、部品整列用パレット1の製造を終了する。これにより複数の部品収容穴5がマトリクス状に配列された部品整列用パレット1が製造される。   When the machining of all the component accommodation holes 5 is completed (step S4: Yes), the production of the component alignment pallet 1 is finished. Thereby, the component aligning pallet 1 in which the plurality of component receiving holes 5 are arranged in a matrix is manufactured.

以上説明した本実施形態の部品整列用パレット1およびその製造方法によれば、部品整列用パレット1上の部品収容穴5は、チップ部品10の幅方向の大きさWを考慮して、穴5aの径R1と穴5bの径R2とが、チップ部品10の対角線の大きさX[mm]以下になるように設計される。これにより部品収容穴5に収容されるチップ部品10の、2個の穴(穴5aと穴5b)にまたがらない向きでの収容が防止される。   According to the component aligning pallet 1 and the manufacturing method thereof according to the present embodiment described above, the component receiving hole 5 on the component aligning pallet 1 is a hole 5a in consideration of the width W of the chip component 10 in the width direction. The diameter R1 and the diameter R2 of the hole 5b are designed to be equal to or smaller than the diagonal X of the chip component 10 [mm]. As a result, the chip component 10 accommodated in the component accommodation hole 5 is prevented from being accommodated in a direction that does not extend over the two holes (hole 5a and hole 5b).

また、チップ部品10の厚さ方向の大きさTを考慮して、穴5aの内壁面と穴5bの内壁面との境界部分における対向する内壁面間の距離rが、T<r≦2T[mm]となるように設計される。これにより境界部分の内壁面間に収容されるチップ部品10の、厚さ方向に2個重なった状態での収容が防止されるとともに、境界部分の内壁面間に1個のチップ部品10の厚さ方向の部分を収容可能な空間が確保される。   In consideration of the size T of the chip component 10 in the thickness direction, the distance r between the opposing inner wall surfaces at the boundary between the inner wall surface of the hole 5a and the inner wall surface of the hole 5b is T <r ≦ 2T [ mm]. This prevents the chip components 10 housed between the inner wall surfaces of the boundary portion from being housed in a state where two chip components 10 are overlapped in the thickness direction, and the thickness of one chip component 10 between the inner wall surfaces of the boundary portion is prevented. A space that can accommodate the vertical portion is secured.

また、チップ部品10の幅方向の大きさWを考慮して、図2(a)に示される平面視において、穴5aの中心O1と穴5bの中心O2とを結ぶ直線から上下両側にT/2離れた位置における部品収容穴5の内壁面間の距離sが、W<s[mm]となるように設計される。これにより部品収容穴5の2個の穴(穴5aと穴5b)にまたがる空間内に1個のチップ部品10の幅方向の部分を収容可能な空間が確保される。   Further, considering the size W in the width direction of the chip component 10, in the plan view shown in FIG. 2 (a), T / T is formed on both the upper and lower sides from the straight line connecting the center O1 of the hole 5a and the center O2 of the hole 5b. The distance s between the inner wall surfaces of the component receiving holes 5 at positions separated by two is designed so that W <s [mm]. As a result, a space that can accommodate the widthwise portion of one chip component 10 is secured in a space that spans the two holes (hole 5a and hole 5b) of the component accommodation hole 5.

ここで、図5に部品収容穴の比較例を示す。図5(a)は丸穴形状に形成された部品収容穴25を示し、図5(b)は長穴形状に形成された部品収容穴35を示す。また、部品収容穴25内に収容されたチップ部品20と部品収容穴35内に収容されたチップ部品30を破線で示す。チップ部品20と30はいずれも図3に示したチップ部品10と同様に直方体で薄型タイプものである。   Here, the comparative example of a component accommodation hole is shown in FIG. 5A shows the component receiving hole 25 formed in a round hole shape, and FIG. 5B shows the component receiving hole 35 formed in a long hole shape. Also, the chip component 20 accommodated in the component accommodation hole 25 and the chip component 30 accommodated in the component accommodation hole 35 are indicated by broken lines. The chip components 20 and 30 are both rectangular parallelepiped and thin type like the chip component 10 shown in FIG.

図5(a)に示すように部品収容穴25を1個の円形状の穴で形成する場合、部品収容穴25はチップ部品20の幅方向の大きさW1のみを考慮してその穴の大きさ(径R25)が設計される。このため部品収容穴25の加工バラツキやチップ部品20の大きさのバラツキにより、部品収容穴25におけるチップ部品20の厚さT1方向の空間余裕(t1+t2)がチップ部品20の厚さT1よりも大きくなってしまうこともある。この場合、チップ部品20が厚さ方向に重なった状態で1個の部品収容穴25内に2個のチップ部品20が収容され得る。これはチップ部品が薄くなるほど高い確率で発生し得る。   As shown in FIG. 5A, when the component accommodation hole 25 is formed by a single circular hole, the component accommodation hole 25 is sized in consideration of only the width W1 of the chip component 20 in the width direction. (Diameter R25) is designed. For this reason, the space margin (t1 + t2) in the thickness T1 direction of the chip component 20 in the component accommodation hole 25 is larger than the thickness T1 of the chip component 20 due to the processing variation of the component accommodation hole 25 and the size variation of the chip component 20. Sometimes it becomes. In this case, two chip components 20 can be accommodated in one component accommodation hole 25 in a state where the chip components 20 overlap in the thickness direction. This can occur with higher probability as the chip component becomes thinner.

これに対して本実施形態の部品整列用パレット1に形成される部品収容穴5は、上述したように2種類の径の異なる穴の組み合わせで形成されるため、チップ部品10の幅方向の大きさWだけでなくチップ部品10の厚さ方向の大きさTも考慮して部品収容穴5の収容空間を設計することができる。チップ部品10の形状(薄型形状)に合わせて部品収容穴5の大きさを設計することができるため、1個の部品収容穴5へ2個のチップ部品10が収容される確率を低減させることができる。   On the other hand, the component receiving hole 5 formed in the component aligning pallet 1 of the present embodiment is formed by a combination of two types of holes having different diameters as described above. The accommodation space of the component accommodation hole 5 can be designed in consideration of not only the length W but also the size T of the chip component 10 in the thickness direction. Since the size of the component accommodation hole 5 can be designed in accordance with the shape (thin shape) of the chip component 10, the probability that two chip components 10 are accommodated in one component accommodation hole 5 is reduced. Can do.

また、部品収容穴へのチップ部品の2個入りの確率を低下させるために、薄型のチップ部品の形状に合わせて図5(b)に示すように長穴形状の部品収容穴35を形成することが考えられる。長穴形状の部品収容穴35を形成する場合、例えば、ドリルを用い、中心線Yに沿って中心位置を移動させ丸穴を連続的に繰り返し形成することができる。しかしこの場合、切削時に切削刃の逃げ(撓み)が発生し易く切削刃への負荷も大きい。そして径の細い切削刃が用いられるため折損の可能性も高い。また折損せずに形成できても加工精度が低く、さらに部品整列用パレット1の複数の穴を全て完成させるには膨大な加工時間が必要になる。また、例えば、ドリルの替わりにエンドミルを用いることも可能である。しかしこの場合、切削時に切削刃の逃げを小さくし加工精度を向上させることはできるものの、複数の穴を全て完成させるには膨大な加工時間が必要になる。   Further, in order to reduce the probability of entering two chip components into the component housing hole, a long hole shaped component housing hole 35 is formed as shown in FIG. 5B in accordance with the shape of the thin chip component. It is possible. In the case of forming the long hole-shaped component receiving hole 35, for example, a drill can be used to move the center position along the center line Y to form round holes continuously and repeatedly. However, in this case, the cutting blade is likely to escape (bend) during cutting, and the load on the cutting blade is large. And since the cutting blade with a small diameter is used, the possibility of breakage is high. Further, even if it can be formed without breaking, the processing accuracy is low, and enormous processing time is required to complete all of the plurality of holes in the component aligning pallet 1. Further, for example, an end mill can be used instead of the drill. However, in this case, it is possible to reduce the clearance of the cutting blade at the time of cutting and improve the processing accuracy, but enormous processing time is required to complete all of the plurality of holes.

これに対して本実施形態の部品整列用パレット1は、部品収容穴5を穴5aと穴5bとの2個の丸穴によって形成することができるので、少ない作業工程で容易に各部品収容穴5を加工することができる。これにより部品整列用パレット1に複数の部品収容穴5を加工して完成させるまでの加工時間を短くすることができる。また、径の小さい穴5aをドリルを用いて先に形成し、その後に径の大きい穴5bをエンドミルを用いて形成するので、穴の切削時における切削刃への負荷を低減することができる。これにより切削刃を部品整列用パレット1へ食い付かせる際の切削刃の逃げ(撓み)を少なくすることができるので部品収容穴5の加工精度を高めることができる。したがって部品収容穴5の大きさのバラツキを抑制することができ、1個の部品収容穴5へ2個のチップ部品10が収容される確率を低減することができる。   On the other hand, the component alignment pallet 1 of this embodiment can form the component receiving holes 5 by two round holes, that is, the holes 5a and 5b. 5 can be processed. As a result, it is possible to shorten the processing time required for processing and completing the plurality of component receiving holes 5 in the component aligning pallet 1. Moreover, since the hole 5a with a small diameter is formed first using a drill, and then the hole 5b with a large diameter is formed using an end mill, the load on the cutting blade at the time of cutting the hole can be reduced. As a result, it is possible to reduce the escape (bending) of the cutting blade when the cutting blade bites into the component aligning pallet 1, so that the processing accuracy of the component receiving hole 5 can be increased. Therefore, variation in the size of the component accommodation holes 5 can be suppressed, and the probability that two chip components 10 are accommodated in one component accommodation hole 5 can be reduced.

また、部品整列用パレット1の材質にベークライト(フェノール樹脂)を用いているので、部品整列用パレット1に振動や揺動を加えたときに、パレット上に分散して載置したチップ部品10がパレット上を滑ったり転がり易く部品収容穴5に収容され易い。   Further, since bakelite (phenolic resin) is used as the material of the component aligning pallet 1, when the component aligning pallet 1 is vibrated or shaken, the chip components 10 dispersedly placed on the pallet are arranged. It is easy to slide and roll on the pallet and is easily accommodated in the component accommodating hole 5.

また、部品収容穴5の縁部に面取り部6が設けられているので、部品整列用パレット1上のチップ部品10を部品収容穴5内に円滑に誘導することができる。   Further, since the chamfered portion 6 is provided at the edge of the component accommodation hole 5, the chip component 10 on the component alignment pallet 1 can be smoothly guided into the component accommodation hole 5.

なお、本発明は、上述した実施形態に限定されず、適宜、変形、改良等が自在である。その他、上述した実施形態における各構成要素の材質、形状、寸法、数値、形態、数、配置場所等は、本発明を達成できるものであれば任意であり、限定されない。   In addition, this invention is not limited to embodiment mentioned above, A deformation | transformation, improvement, etc. are possible suitably. In addition, the material, shape, dimension, numerical value, form, number, location, and the like of each component in the above-described embodiment are arbitrary and are not limited as long as the present invention can be achieved.

例えば、部品収容穴は、図2に示す部品収容穴5に限定されるものではなく、図6に示すような部品収容穴50であっても良い。部品収容穴50は、R1’の径を有する穴50aと、R2’の径を有する穴50bと、R3’の径を有する穴50cとを備える。穴50aと穴50bとの関係、および穴50cと穴50bとの関係は、上述した実施形態における穴5aと穴5bとの関係と同様である。穴50cは、穴50bに対して穴50aが設けられる側とは反対側(平面視図6において穴50bの左側)に設けられる。   For example, the component accommodation hole is not limited to the component accommodation hole 5 shown in FIG. 2, but may be a component accommodation hole 50 as shown in FIG. The component receiving hole 50 includes a hole 50a having a diameter R1 ', a hole 50b having a diameter R2', and a hole 50c having a diameter R3 '. The relationship between the hole 50a and the hole 50b and the relationship between the hole 50c and the hole 50b are the same as the relationship between the hole 5a and the hole 5b in the above-described embodiment. The hole 50c is provided on the opposite side of the hole 50b from the side where the hole 50a is provided (on the left side of the hole 50b in the plan view 6).

このような部品収容穴50により、チップ部品60は図6に示すように3個の穴(穴50aと穴50bと穴50c)にまたがった状態で収容される。部品収容穴50は、チップ部品60の薄型化がさらに進んだ場合の収容に適している。3個の穴で構成した場合にはチップ部品60が収容される幅方向の長さを大きく確保することができるので、2個の穴で構成する場合に比べて各穴の径を小さくすることができ、部品収容穴50の大きさを小型化することができる。   As shown in FIG. 6, the chip component 60 is accommodated in such a state that the chip component 60 extends over three holes (hole 50 a, hole 50 b, and hole 50 c). The component housing hole 50 is suitable for housing when the chip component 60 is further thinned. When configured with three holes, it is possible to ensure a large length in the width direction in which the chip component 60 is accommodated, so that the diameter of each hole is made smaller than when configured with two holes. And the size of the component receiving hole 50 can be reduced.

また、上記実施形態では、穴5aの径R1の方が穴5bの径R2よりも小さい場合を例示した。しかし、これに限定されず、形成される穴の径が相違していればいずれが大きくても良い。
また、穴5aおよび穴5bの深さについて、チップ部品10が全て収容されるような深さを例示したが、これに限定されず、チップ部品10の長さLより浅くても良い。
また、浅い方の穴5aをドリルを用いて切削し、深い方の穴5bをエンドミルを用いて切削する場合を例示したが、これに限定されず、いずれの穴をドリルまたはエンドミルで切削しても良い。
Moreover, in the said embodiment, the case where the diameter R1 of the hole 5a was smaller than the diameter R2 of the hole 5b was illustrated. However, the present invention is not limited to this, and any diameter may be used as long as the diameters of the holes to be formed are different.
In addition, the depth of the hole 5a and the hole 5b is exemplified as the depth at which all the chip components 10 are accommodated, but is not limited thereto, and may be shallower than the length L of the chip components 10.
Moreover, although the case where the shallow hole 5a was cut using a drill and the deep hole 5b was cut using an end mill was illustrated, it is not limited to this, Any hole is cut with a drill or an end mill. Also good.

また、上記実施形態では、部品整列用パレット1は、本体基板2の周部に枠部3を有する構成を例示したがこの例に限られない。例えば、部品整列用パレット1は枠部3を有さなくてもよい。   Moreover, in the said embodiment, although the components alignment pallet 1 illustrated the structure which has the frame part 3 in the peripheral part of the main body board | substrate 2, it is not restricted to this example. For example, the component aligning pallet 1 may not have the frame portion 3.

1:部品整列用パレット、2:本体基板、2a:一面、3:枠部、5:部品収容穴、5a:穴(第1の穴)、5b:穴(第2の穴)、6:面取り部、10:チップ部品、T:厚さ、W:幅、L:長さ   1: Pallet for parts alignment, 2: Main board, 2a: One side, 3: Frame part, 5: Part accommodation hole, 5a: Hole (first hole), 5b: Hole (second hole), 6: Chamfer Part: 10: chip part, T: thickness, W: width, L: length

Claims (3)

パレットの一面に分散して載置されたチップ部品が、前記一面に設けられた前記チップ部品を収容するための複数の部品収容穴にそれぞれ収容されることにより、前記チップ部品が前記パレット上に整列される部品整列用パレットであって、
複数の前記部品収容穴の各々は、第1の径を有する第1の穴と、第2の径を有する第2の穴とを備え、
前記第1の穴と前記第2の穴とは、一部分が重なり合うように形成されており、
前記部品収容穴に収容される前記チップ部品が直方体の形状を有し、その厚さ方向の大きさをT、幅方向の大きさをW、長さ方向の大きさをL、厚さ方向と幅方向との辺で形成される面の対角線の大きさをXとしてT≦W≦Lの関係にあるとすると、
前記第1の径および前記第2の径は、X以下の大きさを有し、
前記部品収容穴の内壁面を形成する前記第1の穴の内壁面と前記第2の穴の内壁面において、前記第1の穴の内壁面と前記第2の穴の内壁面との境界部分における対向する内壁面間の距離は、2T以下の大きさを有している、部品整列用パレット。
The chip components dispersed and placed on one surface of the pallet are respectively accommodated in a plurality of component accommodation holes for accommodating the chip components provided on the one surface, so that the chip components are placed on the pallet. A component alignment pallet to be aligned,
Each of the plurality of component receiving holes includes a first hole having a first diameter and a second hole having a second diameter,
The first hole and the second hole are formed so as to partially overlap each other,
The chip component accommodated in the component accommodation hole has a rectangular parallelepiped shape, the size in the thickness direction is T, the size in the width direction is W, the size in the length direction is L, and the thickness direction is Assuming that the size of the diagonal line of the surface formed by the side with the width direction is X and T ≦ W ≦ L,
The first diameter and the second diameter have a size of X or less,
A boundary portion between the inner wall surface of the first hole and the inner wall surface of the second hole in the inner wall surface of the first hole and the inner wall surface of the second hole forming the inner wall surface of the component housing hole. The part alignment pallet has a distance between opposing inner wall surfaces of 2T or less.
請求項1に記載された部品整列用パレットの製造方法であって、
前記第1の穴の第1の径よりも前記第2の穴の第2の径の方が大きい場合、
前記第1の穴を形成する第1工程と、
前記第1工程の後に前記第2の穴を形成する第2工程と、
を含む、部品整列用パレットの製造方法。
A method for manufacturing a component alignment pallet according to claim 1,
If the second diameter of the second hole is larger than the first diameter of the first hole,
A first step of forming the first hole;
A second step of forming the second hole after the first step;
A method of manufacturing a parts alignment pallet including
前記第1工程における第1の穴はドリルを用いて形成され、
前記第2工程における第2の穴はエンドミルを用いて形成される、請求項2に記載の部品整列用パレットの製造方法。
The first hole in the first step is formed using a drill,
The method for manufacturing a parts alignment pallet according to claim 2, wherein the second hole in the second step is formed using an end mill.
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