JP6127749B2 - Electronic equipment - Google Patents

Description

  The present invention relates to an electronic apparatus having a plurality of card slots in which a plurality of cards can be mounted, for example.

  In an electronic device such as a personal computer, a plurality of electronic boards on which electronic components are mounted are mounted at high density. When such an electronic device is operated, the electronic components on the electronic substrate in the electronic device become hot. For this reason, a structure in which an electronic component or the like is cooled using a cooling fan unit is employed in many electronic devices.

  Patent Document 1 discloses a technique for individually adjusting the amount of air sent to each of a plurality of heat generating cards (computer devices) that are cooling objects by electronic control. In the technique described in Patent Document 1, a temperature sensor and a movable louver are arranged in the vicinity of each of a plurality of air inlets provided corresponding to each of a plurality of heat generating cards. The temperature sensor measures the intake temperature and the exhaust temperature of the heat generating card in the vicinity of the intake port. Then, the control device compares the temperature difference (temperature rise amount) between the intake air temperature and the exhaust gas temperature measured by the temperature sensor with a reference temperature difference set in advance for each heat generation card. The louver was moved under control to change the wind direction to the heating unit. Thereby, the air volume to each heat generating card was adjusted. As a result, according to the technique described in Patent Document 1, each heat generating card can be cooled according to the temperature rise of each heat generating card.

JP 2009-123877 A

  However, in the technique described in Patent Document 1, the louver is moved based on the temperature rise amount measured by the temperature sensor and the reference temperature difference to adjust the air volume to the heat generating card. For this reason, if the electronic device that uses both a heat generating card that contains an electronic board and generates heat and a blank card that does not contain an electronic board and does not generate heat, the blank card does not generate heat. The reference value cannot be set, and the temperature rise value of the blank card cannot be measured. For this reason, the technique described in Patent Document 1 cannot be applied to an electronic device that uses both a heat generating card and a blank card. Further, the technique described in Patent Document 1 aims to keep the heat generating card below the recommended temperature without increasing the power consumption for cooling more than necessary. For this reason, in the technique described in Patent Document 1, the air volume to the heat generating card is adjusted to the minimum necessary air volume, but various devices are loaded and the various devices have a short life.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a fan unit with a simple configuration in accordance with the temperature outside the housing when a heat generating card and a blank card are used in combination. It is an object of the present invention to provide an electronic apparatus capable of adjusting the air outside the casing sent by the above to an appropriate air volume and supplying the air to the heat generating card to cool the heat generating card.

  The electronic device of the present invention is provided inside the housing, and can be mounted inside the housing so that each of the plurality of cards faces each other, and the air outside the housing A fan unit that sends to each of a plurality of card slots, and a fan unit that accommodates a board on which electronic components are mounted and can be mounted so as to be inserted into and removed from the card slot, and when mounted in the card slot, the fan unit The heat generating card configured to be able to supply air outside the housing sent to the card slot to the electronic component and the board on which the electronic component is not mounted is housed and can be mounted so as to be inserted into and removed from the card slot. And when mounted in the card slot, the fan portion sends the card slot to the card slot. The blank card having a movable shielding plate that blocks air, and the movable card so that air outside the casing sent to the card slot by the fan unit passes through the blank card according to the temperature outside the casing. Move the shielding plate.

  According to the technology according to the present invention, the air outside the housing, which is sent by the fan unit, is adjusted to an appropriate air volume and supplied to the heat generating card according to the temperature outside the housing with a simple configuration, and the heat generating card is cooled. can do.

It is a permeation | transmission front view which shows the structure of the electronic device in embodiment of this invention. It is a perspective view which shows the structure of the electronic device in embodiment of this invention. It is a perspective view which extracts and shows a fan mounting unit, a card mounting unit, and an air intake unit among electronic devices in an embodiment of the invention. It is a perspective view which shows the structure of a heat_generation | fever card. It is a perspective view which shows the structure of a blank card. Fig.5 (a) is a figure which shows the state which closed the movable shielding board. FIG.5 (b) is a figure which shows the state which opened the movable shielding board. It is a figure which shows notionally the mode at the time of operating the electronic device in embodiment of this invention in a high temperature environment. It is a figure which shows notionally the mode at the time of operating the electronic device in embodiment of this invention in a low temperature environment.

<Embodiment>
FIG. 1 is a transparent front view showing a configuration of an electronic apparatus 1000 according to an embodiment of the present invention.
FIG. 2 is a perspective view illustrating a configuration of the electronic apparatus 1000. FIG. 3 is a perspective view showing the fan-mounted unit 110, the card-mounted unit 120, and the intake unit 130 extracted from the electronic device 1000. 1 to 3 show the vertical direction G for convenience of explanation. In addition, the electronic device 1000 illustrated in FIG. 1 is illustrated in a simplified manner in comparison with the configuration of the electronic device 1000 illustrated in FIGS.

  As shown in FIGS. 1 and 2, the electronic apparatus 1000 includes a housing 100, a fan mounting unit 110, a card mounting unit 120, and an intake unit 130. The electronic device 1000 is, for example, a communication device such as a radio base station device installed in a communication station or the like, or a forced air cooling communication device such as an exchange. As shown in FIG. 2, the electronic device 1000 is used by being mounted in the housing 100. The housing 100 is also called a rack. The card mounting unit 120 is also called a shelf.

  The housing 100 corresponds to an exterior frame of the electronic device 1000. As shown in FIGS. 1 and 2, the housing 100 accommodates a fan mounting unit 110, a card mounting unit 120, and an intake unit 130. As shown in FIG. 2, a plurality of openings 101 are provided on the upper surface of the housing 100.

  As shown in FIG. 1, a fan unit side exhaust opening 140 is formed between the fan mounting unit 110 and the card mounting unit 120 at a position corresponding to the fan unit 111. Similarly, a card mounting unit side exhaust opening 150 is formed between the fan mounting unit 110 and the card mounting unit 120 at a position corresponding to each card slot 121 described later. Further, between the card mounting unit 120 and the air intake unit 130, a card mounting unit side intake opening 160 is formed at a position corresponding to each card slot 121. The card mounting unit side exhaust opening 150 and the card mounting unit side intake opening 160 are arranged so as to face each other. Thus, the fan unit side exhaust opening 140, the card mounting unit side exhaust opening 150, and the card mounting unit side intake opening 160 are provided in the housing 100. As a result, the air outside the casing 100 sucked from the intake unit 130 by the fan unit 111 is discharged out of the casing 100 via the intake unit 130, the card mounting unit 120, and the fan mounting unit 110.

  As shown in FIGS. 1, 2, and 3, the fan mounting unit 110 is disposed on the upper side in the vertical direction G in the housing 100. The fan mounting unit 110 is provided on the upper surface side of the card mounting unit 120.

  The fan mounting unit 110 has a fan unit 111. That is, the electronic apparatus 1000 has a structure in which a heat generating card 170 described later is forcibly cooled by air by the fan unit 111 (forced air cooling structure). The fan unit 111 is provided inside the housing 100 and sucks air outside the housing 100 from the intake unit 130 side. In addition, the fan unit 111 sends air sucked from the intake unit 130 side to each of a plurality of card slots 121 in the card mounting unit 200 described later. Further, the fan unit 111 exhausts air passing through each of the plurality of card slots 121 from the upper surface side of the housing 100 to the outside of the housing 100. The airflow of all the fan units 111 in the fan-mounted unit 110 is such that the airflow can maintain the device operation guaranteed temperature or less even when the heat generating card 1700 is mounted in all of the card slots 121. Is set. In FIG. 1, two fan units 111 are shown, and in FIG. 2, six fan units 111 are shown. However, it is sufficient that one or more fan units 111 are mounted on the fan mounting unit 110.

  As shown in FIGS. 1 and 2, the card mounting unit 120 is disposed between the fan mounting unit 110 and the intake unit 130. As shown in FIG. 1, a plurality of card slots 121 are provided in the card mounting unit 120.

  In each of the plurality of card slots 121, a plurality of cards are mounted with a back plug-in structure so that the card surfaces face each other. As shown in FIG. 1, the card mounting unit 120 includes a first card holding unit 122 and a second card holding unit 123. Each of the first card holder 122 and the first card holder 123 is provided for each card slot 121 as shown in FIG. The first card holding unit 122 holds the upper end of the card, and the second card holding unit 123 holds the lower end of the card. This prevents the card from falling out of the card slot 121 after being received in the card slot 121.

  Here, the plurality of cards include a heat generating card 170 and a blank card 180. That is, both the heat generating card 170 and the blank card 180 are mounted in each of the plurality of card slots 121 so that they can be inserted and removed along a direction substantially perpendicular to the front surface 100a of the housing. The configurations of the heat generating card 170 and the blank card 180 will be described.

  FIG. 4 is a perspective view showing the configuration of the heat generating card 170. FIG. 5 is a perspective view showing the configuration of the blank card 180. Fig.5 (a) is a figure which shows the state which closed the below-mentioned movable shielding board. FIG.5 (b) is a figure which shows the state which opened the movable shielding board.

  As shown in FIG. 4, the heat generating card 170 has an electronic substrate 171 and a front protective plate 172. As shown in FIG. 4, electronic components 173 such as resistors and ICs are mounted on the substrate surface of the electronic substrate 171. At least one of the electronic components 173 is a CPU (Central Processing Unit), for example, and has heat generation. The front protective plate 172 is formed in a flat plate shape. The front protective plate 172 is attached to one end of the electronic substrate 171 along a direction substantially perpendicular to the substrate surface of the electronic substrate 171. A pair of mounting screws 172 a are attached to the front protective plate 172. The mounting screw 172a is used to hold the heat generating card 170 in the housing 100 after the heat generating card 170 is mounted in the card slot 121. That is, in a state where the heat generating card 170 is accommodated in the card slot 121, the mounting screw 172a is attached to a screw hole (not shown) of the housing 100 and tightened to hold the heat generating card 170 in the housing 100. Can do.

  As shown in FIGS. 1 and 4, in a state where the heat generating card 170 is accommodated in the card slot 121, the air outside the housing 100 sent to the card slot 121 by the fan unit 111 is supplied to the board surface of the electronic board 171. (Arrows a1 to a3 in FIG. 1). Thereby, the electronic component 173 on the electronic substrate 171 is cooled by the air supplied by the fan unit 111.

  As shown in FIGS. 5A and 5B, the blank card 180 includes a dummy substrate 181, a front protective plate 182, a movable shielding plate 185, an outside air temperature sensor 186, and a shielding plate movable portion 187. Have Unlike the electronic substrate 170 described above, no electronic component is mounted on the dummy substrate 181. The front protective plate 182 is attached to one end of the dummy substrate 181 along a direction substantially perpendicular to the substrate surface of the dummy substrate 181. A pair of attachment screws 182 a are attached to the front protective plate 182. The mounting screw 182 a is used to hold the blank card 180 in the housing 100 after the blank card 180 is mounted in the card slot 121. That is, the blank card 180 is held in the casing 100 by attaching the mounting screw 182a to the screw hole (not shown) of the casing 100 and tightening it with the blank card 180 accommodated in the card slot 121. Can do.

  As shown in FIGS. 1, 5 (a), and 5 (b), the movable shielding plate 185 is attached to the lower end portion of the dummy substrate 181. As shown in FIGS. 1, 5A, and 5B, the movable shielding plate 185 is attached to the dummy substrate 181 so as to be rotatable between α1 and α2 about the rotation shaft 185a. . The rotation shaft 185a is installed along the dummy substrate surface as shown in FIG. This movable shielding plate 185 is controlled by a shielding plate movable portion 187 described later.

  As shown in FIG. 1 and FIG. 5A, when the movable shielding plate 185 is rotated to the α1 side in a state where the blank card 180 is accommodated in the card slot 121, the movable shielding plate 185 is moved by the fan unit 111. Air outside the housing 100 sent to the card slot 121 can be blocked. As described above, when the movable shielding plate 185 is rotated to the α1 side while the blank card 180 is accommodated in the card slot 121, the air sent by the fan unit 111 is blocked by the movable shielding plate 185 (FIG. 1). Arrow c).

  As shown in FIG. 1 and FIG. 5B, when the movable shielding plate 185 is rotated to the α2 side in a state where the blank card 180 is accommodated in the card slot 121, the movable shielding plate 185 is Air outside the casing 100 sent to the card slot 121 can be passed through the blank card 180. As described above, when the movable shielding plate 185 is rotated to the α2 side in a state where the blank card 180 is accommodated in the card slot 121, the air sent by the fan unit 111 is not blocked by the movable shielding plate 185, and is blanked. It passes through the card 180 (arrow d in FIG. 1).

  The outside air temperature sensor 186 measures the temperature outside the housing 100. The outside air temperature sensor 186 outputs the measured temperature, which is the temperature result, to the shielding plate movable unit 187.

  The shielding plate movable part 187 moves the movable shielding plate based on the measured temperature of the outside air temperature sensor 186. More specifically, when the measured temperature measured by the outside air temperature sensor 186 is higher than a predetermined temperature T (° C.), the shielding plate movable unit 187 moves the movable shielding plate 185 to the position on the α1 side, that is, the fan unit. 111 is arranged at a position where air outside the casing 100 sent to the card slot 121 is blocked. On the other hand, when the measured temperature measured by the outside air temperature sensor 186 is lower than the predetermined temperature T (° C.), the shielding plate movable unit 187 moves the movable shielding plate 185 to the card slot by the position on the α2 side, that is, the fan unit 111. It is arranged at a position where air outside the casing 100 sent to 121 passes through the blank card 180. The predetermined temperature T (° C.) is set in advance as a threshold value.

  Next, the operation of electronic device 1000 in the embodiment of the present invention will be described.

  FIG. 6 is a diagram conceptually illustrating a state when the electronic apparatus 1000 is operated in a low temperature environment. FIG. 7 is a diagram conceptually illustrating a state when the electronic apparatus 1000 is operated in a high temperature environment.

  As shown in FIGS. 6 and 7, a plurality of heat generating cards 170 and a plurality of blank cards 180 are mounted in each of a plurality of card slots 121 in the card mounting unit 120. 6 and 7, as shown in FIG. 6 and FIG. 7, in the front view of the electronic device 100, a blank card 180 is mounted in the central card slot 121, and a heat generating card is disposed at both ends sandwiching the central portion. Assume that 170 is mounted. In the present invention, the arrangement of the heat generating card 170 and the blank card 180 is not limited to the arrangement illustrated in FIGS. 6 and 7.

  First, each outside air temperature sensor 186 of each blank card 180 measures the temperature outside the housing 100 and outputs this measured temperature to the shielding plate movable unit 187.

  Next, the shielding plate movable part 187 moves the movable shielding plate 185 based on the measured temperature of the outside air temperature sensor 186.

  First, a case where the measured temperature measured by the outside air temperature sensor 186 is higher than a predetermined temperature T ° C. will be described with reference to FIG. For example, it is assumed that the predetermined temperature T is T = 5 ° C.

  When the measured temperature measured by the outside air temperature sensor 186 is higher than the predetermined temperature of 5 ° C., the shield plate movable unit 187 closes the movable shield plate 185. That is, the shielding movable unit 187 arranges the movable shielding plate 185 at a position (position on the α2 side in FIG. 1) that blocks the air outside the casing 100 sent to the card slot 121 by the fan unit 111.

  At this time, the air outside the casing 100 sent by the fan unit 111 is shielded by the movable shielding plate 185 in the card slot 121 that accommodates the blank card 180. On the other hand, the air outside the casing 100 sent by the fan unit 111 passes through the heat generating card 170 so as to be supplied to the electronic component 173 on the electronic board 171 in the card slot 121 that accommodates the heat generating card 170. Passes from the intake unit 130 to the fan-mounted unit 110. At this time, in the card slot 121 that accommodates the blank card 180, the air sucked from the intake unit 130 is shielded by the movable shielding plate 185. Therefore, most of the air sucked from the intake unit 130 flows to the card slot 121 that houses the heat generating card 170 (arrow A in FIG. 6).

  Thus, for example, when the measured temperature measured by the outside air temperature sensor 186 is higher than the predetermined temperature 5 ° C., a large amount of wind is blown to the card slot 121 that houses the heat generating card 170 with the movable shielding plate 185 closed. The cooling capacity for the heat generating card 170 can be concentrated and efficiently improved. For this reason, the structure of the electronic device 1000 when operating in a high temperature environment is also called a cooling structure.

  Next, a case where the measured temperature measured by the outside air temperature sensor 186 is lower than a predetermined temperature T ° C. will be described with reference to FIG. In accordance with the above description, for example, it is assumed that the predetermined temperature T is T = 5 ° C.

  When the measured temperature measured by the outside air temperature sensor 186 is lower than a predetermined temperature of 5 ° C., the shielding plate movable unit 187 opens the movable shielding plate 185. That is, the shield movable part 187 arranges the movable shield plate 185 at a position (position on the α1 side in FIG. 1) through which air outside the casing 100 sent to the card slot 121 by the fan part 111 passes inside the blank card 180. To do.

  At this time, the air outside the housing 100 sent by the fan unit 111 passes through the blank card 180 in the card slot 121 that accommodates the blank card 180 without being shielded by the movable shielding plate 185, and is thus sucked into the intake unit 130. To the fan-mounted unit 110. In addition, the air outside the casing 100 sent by the fan unit 111 passes through the heat generation card 170 and is sucked into the card slot 121 that accommodates the heat generation card 170 so as to be supplied to the electronic component 173 on the electronic board 171. The unit 130 passes through to the fan-mounted unit 110. At this time, in the blank card 180, the resistance to the air sent from the fan unit 111 (ventilation resistance) is smaller than the heat generation card 170 because the electronic component 173 is not accommodated. For this reason, in the card slot 121 that accommodates the blank card 180, the air sent from the fan unit 111 is larger than the amount of air passing through the card slot 121 that accommodates the heat generating card 170 (arrow B in FIG. 7). For this reason, the air volume of the air flowing into the card slot 121 that accommodates the heat generating card 170 can be suppressed (arrow C in FIG. 7).

  Thus, for example, when the measured temperature measured by the outside air temperature sensor 186 is lower than the predetermined temperature 5 ° C., a large amount of wind to the card slot 121 that accommodates the blank card 180 with the movable shielding plate 185 opened. And the air volume to the card slot 121 that accommodates the heat generating card 170 can be reduced. As a result, it is possible to prevent the heat generating card 170 from being excessively cooled and to keep the heat. For this reason, the structure of the electronic device 1000 when operating in a low temperature environment is also referred to as a heat retaining structure.

  As described above, the electronic apparatus 1000 according to the embodiment of the present invention includes the plurality of card slots 121, the fan unit 111, the heat generating card 170, the blank card 180, and the shielding plate movable unit 187.

  The plurality of card slots 121 are provided inside the housing 100, and each of the plurality of cards (the heat generating card 170 and the blank card 180) can be mounted so as to face each other. The fan unit 111 is provided inside the housing 100 and sends air outside the housing 100 to each of the plurality of card slots 121. The heat generating card 170 can be mounted so as to accommodate a board (electronic board 171) on which the electronic component 173 is mounted and to be inserted into and removed from the card slot 121. Further, the heat generating card 170 is configured to supply air outside the housing 100 sent to the card slot 121 by the fan unit 111 to the electronic component 173 when it is mounted in the card slot 121. The blank card 180 can be mounted so as to accommodate a substrate (dummy substrate 181) on which the electronic component 173 is not mounted and to be inserted into and removed from the card slot 121. Further, the blank card 180 has a movable shielding plate 185 that blocks air outside the housing 100 sent to the card slot 121 by the fan unit 111 when it is mounted in the card slot 121. The shield plate movable portion 187 moves the movable shield plate 185 so that the air outside the housing 100 sent to the card slot 121 by the fan unit 111 passes through the blank card 180 according to the temperature outside the housing 100. Let

  As described above, the electronic apparatus 1000 can be mounted so that the heat generating card 170 and the blank card 180 can be inserted into and removed from the plurality of card slots 121. The heat generating card 170 is configured to supply air outside the housing 100 sent to the card slot 121 by the fan unit 111 to the electronic component 173 when mounted in the card slot 121. For this reason, in the heat generating card 170 mounted in the card slot 121, the air outside the housing 100 that is always sent to the card slot 121 by the fan unit 111 is supplied to the electronic component 173. The blank card 180 has a movable shielding plate 185 that blocks air outside the housing 100 sent to the card slot 121 by the fan unit 111 when it is mounted in the card slot 121. The blank card 180 mounted in the card slot 121 can block the air outside the casing 100 sent to the card slot 121 by the fan unit 111 by the movable shielding plate 185. Then, the movable shielding plate 185 allows the shielding plate movable unit 187 to pass the air outside the housing 100 sent to the card slot 121 by the fan unit 111 through the blank card 180 according to the temperature outside the housing 100. Move. For this reason, depending on the temperature outside the housing 100, the movable shielding plate 185 is placed at a position where the fan portion 111 blocks the air outside the housing 100 sent to the card slot 121, or the movable shielding plate 185 is moved by the fan portion 111. The air outside the housing 100 sent to the card slot 121 can be arranged at a position where the air passes through the blank card 180. Thereby, the air volume supplied to the electronic component 173 in the heat generating card 170 can be adjusted according to the temperature outside the housing 100. As a result, when the heat generating card 170 and the blank card 180 are used together, the air outside the casing 100 sent by the fan unit 111 is adjusted to an appropriate amount of air according to the temperature outside the casing 100 with a simple configuration. Can be supplied to the heat generating card 170 to cool the heat generating card 170.

  Note that, as described above, the technique described in Patent Document 1 aims to keep the heat generating card below the recommended temperature without increasing the power consumption for cooling more than necessary. For this reason, the air volume to the heat generating card is adjusted to the minimum necessary air volume by electronic control, but various devices are loaded and the various devices have a short life. On the other hand, in the electronic apparatus 1000 according to the embodiment of the present invention, there is no configuration for adjusting the air volume to the heat generating card to the necessary minimum air volume by electronic control. Therefore, unlike the technique described in Patent Document 1, there is no problem that various devices are loaded and the various devices have a short life.

  In addition, the electronic apparatus 1000 according to the embodiment of the present invention includes an outside air temperature sensor 186 that measures the temperature outside the housing 100. When the measured temperature T measured by the outside air temperature sensor 186 is higher than a predetermined temperature, the shielding plate movable portion 187 blocks the movable shielding plate 185 from the air outside the housing 100 sent to the card slot 121 by the fan portion 111. Place in position. On the other hand, when the measured temperature measured by the outside air temperature sensor 186 is lower than the predetermined temperature T, the shielding plate movable unit 187 sends the movable shielding plate 185 to the card slot 121 by the fan unit 111. Is placed in a position where it passes through the blank card 180.

  As described above, in electronic device 1000 according to the embodiment of the present invention, when measured temperature T measured by outside air temperature sensor 186 is higher than a predetermined temperature, shielding plate movable unit 187 uses movable shielding plate 185 as a fan unit. 111 is arranged at a position where air outside the casing 100 sent to the card slot 121 is blocked.

  Thereby, in the card slot 121 that accommodates the blank card 180, the air outside the casing 100 sent by the fan unit 111 is blocked by the movable shielding plate 185. On the other hand, in the card slot 121 that accommodates the heat generating card 170, the air outside the casing 100 sent by the fan unit 111 is supplied to the electronic component 173. At this time, in the card slot 121 that accommodates the blank card 180, air sent by the fan unit 111 is shielded by the movable shielding plate 185, so that most of the air sent by the fan unit 111 accommodates the heat generating card 170. It flows to 121.

  Therefore, when the measured temperature measured by the outside air temperature sensor 186 is higher than the predetermined temperature T, a large amount of air can be flowed to the card slot 121 that accommodates the heat generating card 170 with the movable shielding plate 185 closed. The cooling capacity for the heat generating card 170 can be concentrated and efficiently improved.

  On the other hand, when the measured temperature measured by the outside air temperature sensor 186 is lower than the predetermined temperature T, the shielding plate movable unit 187 sends the movable shielding plate 185 to the card slot 121 by the fan unit 111. Is placed in a position where it passes through the blank card 180.

  Thereby, in the card slot 121 that accommodates the blank card 180, the air outside the casing 100 sent by the fan unit 111 passes through the blank card 180 without being shielded by the movable shielding plate 185. On the other hand, in the card slot 121 that houses the heat generating card 170, the air outside the casing 100 sent by the fan unit 111 is supplied to the electronic component 173. At this time, in the blank card 180, the resistance to the air sucked from the intake unit 130 (ventilation resistance) is smaller than the heat generation card 170 because the electronic component 173 is not accommodated.

  For this reason, in the card slot 121 that accommodates the blank card 180, the air outside the casing 100 sent by the fan unit 111 is larger than the air volume that passes through the card slot 121 that accommodates the heat generating card 170. Therefore, the air volume of the air flowing into the card slot 121 that accommodates the heat generating card 170 can be suppressed.

  Therefore, when the measured temperature measured by the outside air temperature sensor 186 is lower than the predetermined temperature T, a large amount of wind can be passed to the card slot 121 that accommodates the blank card 180 with the movable shielding plate 185 opened. The air volume to the card slot 121 that accommodates the heat generating card 170 can be reduced. As a result, it is possible to prevent the heat generating card 170 from being excessively cooled and to keep the heat.

  In electronic device 1000 according to the embodiment of the present invention, fan unit 111 is provided on the vertically upper side of the plurality of card slots 121, and is a housing from the vertically lower side of the plurality of card slots 121 toward the vertically upper side. Send 100 out of air.

  Under a normal indoor environment, the air temperature increases as it goes upward in the vertical direction G, and the air temperature decreases as it goes downward in the vertical direction G. Therefore, the heat generating card 170 can be cooled more efficiently by the fan unit 111 sending the air outside the casing 100 from the vertically lower side to the vertically upper side of the plurality of card slots 121.

  In addition, although the said embodiment demonstrated and demonstrated the specific example, the case where the electronic apparatus 1000 is installed in an outdoor facility like a small relay box is assumed, for example. In this case, since the number of heat generating cards 170 mounted in the card slot 121 is reduced and the total heat generation amount of the plurality of heat generating cards 170 is reduced, the temperature rise in the outdoor facility is also reduced, and the embodiment of the present invention is further improved. The above heat retaining structure of the electronic device 1000 can be utilized.

  Moreover, in the said embodiment, the movable shielding board 185 demonstrated that it was arrange | positioned in the position of (alpha) 1 or (alpha) 2. However, the movable shielding plate 185 may be disposed between α1 and α2. In this case, the movable shielding plate 185 may have a plurality of arrangement positions between α1 and α2.

  The present invention has been described above based on the embodiment. The embodiment is an exemplification, and various modifications, increases / decreases, and combinations may be added to the above-described embodiments without departing from the gist of the present invention. It will be understood by those skilled in the art that modifications to which these changes, increases / decreases, and combinations are also within the scope of the present invention.

DESCRIPTION OF SYMBOLS 100 Case 110 Fan mounting unit 111 Fan part 120 Card mounting unit 121 Card slot 130 Air intake unit 140 Fan unit side exhaust opening 150 Card mounting unit side exhaust opening 160 Card mounting unit side air intake opening 170 Heat generation card 171 Electronic board 172 Front protective plate 172a Mounting screw 173 Electronic component 180 Blank card 181 Dummy substrate 182 Front protective plate 182a Mounting screw 185 Movable shielding plate 186 Outside air temperature sensor 187 Shielding plate movable portion 1000 Electronic device 2000 Rack

Claims (3)

A plurality of card slots provided inside the housing and capable of being mounted so that each of the plurality of cards face each other;
A fan unit that is provided inside the housing and sends air outside the housing to each of the plurality of card slots;
Air outside the housing can be mounted so as to accommodate a board on which electronic components are mounted and can be inserted into and removed from the card slot, and is sent to the card slot by the fan unit when mounted in the card slot. A heat generating card configured to supply the electronic component to the electronic component;
Air that is mounted on the card slot so that it can be inserted into and removed from the card slot and that is not mounted with the electronic component is sent to the card slot by the fan unit when the board is mounted on the card slot. A blank card having a movable shielding plate for shielding,
A shielding plate movable portion that moves the movable shielding plate so that air outside the housing, which is sent to the card slot by the fan unit, passes through the blank card according to a temperature outside the housing. Electronic device. An outside temperature sensor for measuring the temperature outside the housing;
When the measured temperature measured by the outside air temperature sensor is higher than a predetermined temperature, the shielding plate movable portion is placed at a position where the movable shielding plate is blocked by the fan portion from the outside of the housing sent to the card slot. Place and
When the measured temperature measured by the outside air temperature sensor is lower than the predetermined temperature, the shielding plate movable portion uses the movable shielding plate as the blank outside air that is sent to the card slot by the fan portion. The electronic device according to claim 1, wherein the electronic device is disposed at a position where the card passes through the card.   3. The electronic device according to claim 1, wherein the fan unit is provided vertically above the plurality of card slots and sends air outside the housing from a vertically lower side to a vertically upper side of the plurality of card slots. apparatus.

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