JP6113945B2 - Lighting device - Google Patents

Description

  The present invention relates to a lighting device using a light emitting diode.

  In recent years, as a lighting device, an LED lighting device using a light emitting diode (LED) as a light source instead of a light source such as an incandescent bulb and a fluorescent lamp has been spreading. The LED is a PN junction semiconductor element, and when a forward voltage is applied, electrons from the N region and holes from the P region move to the PN junction portion and emit light when the electrons and holes recombine. Such LEDs emit only monochromatic light in a narrow wavelength range because the energy emitted when free electrons recombine is emitted as light.

  As LED lighting devices, for example, daylight color suitable for illumination by mixing light of different colors such as blue light emitted by blue LED elements, red light emitted by red LED elements, and green light emitted by green LED elements LED bulbs that emit light in daylight white, white, warm white, or bulb color are known. As another method, as shown in Patent Document 1 below, a wavelength conversion plane containing phosphors attached at a predetermined distance to emit light from a light source unit that uses light emitted from an LED element as a light source. There is also known an LED illumination device that emits white light by converting the wavelength by using.

  These LED illuminating devices have a very long life compared to conventional incandescent bulbs and illuminating devices using fluorescent tubes, for example, several tens of times longer than incandescent bulbs and several times longer than fluorescent tubes. . Therefore, the greatest advantage is that the light source part of the LED lighting device does not need to be frequently replaced due to wear unlike conventional incandescent bulbs and fluorescent tubes. On the other hand, the LED lighting device has a disadvantage that its price is extremely high because it is not sufficiently widespread at the present time as compared with the conventional lighting device.

  By the way, in recent years, for example, LED light bulbs that are capable of changing colors such as white light that makes it easy to identify characters when performing office work and warm light bulb colors when resting are commercially available. . Such an LED bulb includes, for example, three LED light sources of blue light, red light, and green light and a control circuit that controls the light emission intensity of each LED light source, and adjusts the light emission intensity of each LED light source. It changes the illumination color.

Japanese Patent Laid-Open No. 2006-244779

  As described above, an LED bulb including a plurality of LED light sources that emit different emission colors and a control circuit has a narrow distribution of light emitted from each LED, and has a problem in color rendering for illumination. In addition, when there are variations in the light emission characteristics of a plurality of LED light sources, the electrical control circuit applied to the LED light sources becomes complicated, or variations in the color of light emitted in the lighting device increase instead of simple control. There was a problem.

In view of the problems described above, without requiring a plurality of LED light sources and their control that emit different emission colors from each other, an illumination device that can color rendering properties superior color of the illumination light in a timely change child transgression The purpose is to provide.

Lighting device of one aspect of the present invention includes a plurality of light emitting diodes, and a circuit board in which a plurality of light emitting diodes, the circuit board was yield capacity, and an opening for emitting the light emission of the plurality of light emitting diodes or a housing member that having a light transmitting surface, and separated from the circuit board, so as to cover the plurality of light emitting diodes, so as to be movable in the plane direction, the wavelength conversion of one of the openings or light-transmitting surface is disposed And a single wavelength conversion cover , the first sub-region for converting the light emission wavelength of each light-emitting diode to the first light emission wavelength, and the second sub-region for converting to the second light emission wavelength It has a wavelength conversion region of multiple, including bets, the first sub-region and a second sub-region, unlike the phosphor composition, at least one phosphor weight or thickness from each other, the plurality of light emitting diodes, respectively At the same time the first A position facing either one of the region or the second sub-region, each from a position facing the first sub-region, a position facing the second sub-region, or each being the second sub-region by moving the wavelength conversion cover at a position opposed to the first sub-region from the emission color of the emitted light is characterized that you change. According to such a lighting device, by moving a single wavelength conversion cover, by varying the sub-area in which Ru is incident light emitted from the light-emitting diodes, it can change its emission color. Thereby, the emission color of illumination can be changed as appropriate without replacing the light source itself.

Also, according to such an illumination device, by changing the positional relationship between the wavelength conversion cover described above with light emitting diodes as appropriate, be made incident light emitted from the light emitting diode to a desired wavelength conversion region of the wavelength conversion cover Can do .

  According to the present invention, it is possible to provide an illumination device that can appropriately change the color of illumination light without replacing the light source itself in the LED illumination device.

FIG. 1 is a schematic perspective view of an LED lighting device 10 including a wavelength conversion cover 2 according to this embodiment. 2A and 2B are schematic cross-sectional views taken along the line AA ′ of the LED lighting device 10 of FIG. FIGS. 3A and 3B are schematic cross-sectional views for explaining color changes when two wavelength conversion covers 2 are overlapped and moved independently of each other. FIG. 4 is a schematic cross-sectional view for explaining another example of the support means of the wavelength conversion cover in the LED lighting device of the present embodiment. FIG. 5 is a schematic cross-sectional view of the LED lighting device 20 including the wavelength conversion cover 12 of the present embodiment. FIG. 6 is a schematic cross-sectional view when the wavelength conversion cover 12 of the LED lighting device 20 is moved. FIG. 7 is an xy chromaticity diagram in the XYZ color system for explaining color conversion by the wavelength conversion cover of the present embodiment. FIG. 8 is a schematic cross-sectional view of the LED illumination device 30 including the wavelength conversion cover 22 of the present embodiment. FIG. 9 is a schematic cross-sectional view when the wavelength conversion cover 22 of the LED lighting device 30 is moved. FIG. 10 is a schematic perspective view of the wavelength conversion cover 25 formed by laminating the wavelength conversion layer 32 on the support base 24. FIG. 11 is a schematic perspective view of a wavelength conversion cover 26 in which an ultraviolet absorbing layer 23 is laminated on the surface of the support base 24 shown in FIG. FIG. 12 is a perspective view of the wavelength conversion cover 27 in which the phosphor-containing members 43 (43a, 43b) are scattered on the surface of the support base 24. FIG. FIGS. 13A and 13B are explanatory diagrams for explaining the color conversion of the LED illumination device 40 using the wavelength conversion cover 27. FIG. 14 is a perspective view of a wavelength conversion cover 29 in which phosphor-containing members 44 (44a, 44b) are scattered on the surface of a support base material 34 that is a frame. FIG. 15 is an explanatory diagram for explaining an LED illumination device 50 in which a light diffusion prevention cylinder 45 is disposed between the wavelength conversion cover 2 and the circuit board 3. FIG. 16 is a schematic cross-sectional view for explaining an LED lighting device 60 in which a wavelength conversion cover 27 in which a lens 54 is provided on a support base 24 is disposed. FIG. 17A is a partially transparent perspective view for explaining the LED illumination device 70 provided with the wavelength conversion cover 77, and FIG. 17B is a schematic sectional view thereof. 18A is a schematic perspective view in the middle of assembling the LED lighting device 80 provided with the wavelength conversion cover 87, and FIG. 18B is a partially transparent perspective view after the assembly. FIG. 19A is a partially transparent perspective view for explaining the LED illumination device 90 provided with the wavelength conversion cover 97, and FIG. 17B is a schematic sectional view thereof.

  First, the LED lighting device 10 using the wavelength conversion cover 2 according to the present embodiment will be described in detail with reference to FIGS.

  FIG. 1 is a schematic perspective view for explaining the LED lighting device 10, and FIG. 2 is a schematic cross-sectional view taken along the line AA ′ of the LED lighting device 10 of FIG. 1. 2A and 2B are different from each other in the arrangement position of the wavelength conversion cover 2 with respect to the light emitting diode 1.

  In the figure, 1 is a light emitting diode (LED), 2 is a wavelength conversion cover, 3 is a circuit board, 3a is an electric circuit formed on the surface of the circuit board 3, 4 is a housing member, and 5 is a power supply to the circuit board 3. A plug 6 is a slide groove for supporting the wavelength conversion cover 2. As shown in FIGS. 2 and 3, the wavelength conversion cover 2 has a plurality of wavelength conversion regions C1 facing the LEDs 1, and each wavelength conversion region C1 has a sub-region A1 and a sub-region B1. In FIG. 1, in order to explain the internal structure of the LED lighting device 10, a part of the wavelength conversion cover 2 is shown through the watermark.

  In the LED lighting device 10, a plurality of LEDs 1, 1,... Are mounted on an electric circuit 3a formed on the surface of the circuit board 3 in a straight line to constitute a light source unit. In addition, the number and arrangement of the LEDs 1 are not limited to such a form, and can be freely adjusted according to applications and purposes. Each plug 1 is turned on by inserting the plug 5 into an unillustrated outlet and supplying power to the circuit board 3. A battery may be used as the power source. Further, on the circuit board 3, a control circuit for controlling lighting of the LED 1, an optical sensor, and the like may be provided as necessary. The light source unit is accommodated in the housing member 4. The housing member 4 has an opening or a light transmission surface on the light emitting side of the LED 1.

  The wavelength conversion cover 2 is supported by a slide groove 6 provided in the housing member 4 at a predetermined distance from the LED 1. The wavelength conversion cover 2 covers the plurality of LEDs 1. Although the wavelength conversion cover 2 and the LED 1 shown in FIG. 1 are separated from each other by a predetermined distance, the wavelength conversion cover C1 and the LED 1 of the wavelength conversion cover 2 are not necessarily separated from each other. It may be in close contact. The distance between the wavelength conversion cover 2 and the LED 1 can be appropriately adjusted by the support means of the wavelength conversion cover 2.

  In the LED lighting device 10, the LED 1 emits light by supplying power from the plug 5 to the circuit board 3. The emission color of the LED 1 depends on the emission wavelength of the LED chip that is the emission source of the LED 1. Light emitted from the LED 1 enters the wavelength conversion cover 2. Then, part or all of the light incident on the wavelength conversion cover 2 is wavelength-converted by the phosphor contained in the incident region of the wavelength conversion cover 2 to a wavelength determined according to the phosphor composition in the region, and the LED 1 It emits light having a wavelength different from the emission wavelength. And it mixes with the light emission of LED1 which was not wavelength-converted.

  In the wavelength conversion cover 2, as shown in FIG. 2A, in the plurality of wavelength conversion regions C1 respectively facing the plurality of LEDs 1, two subregions A1 and subregions containing phosphors having different amounts or compositions from each other. B1 are alternately arranged while maintaining a predetermined interval. In addition, since the light emitted from the LED 1 has high directivity, the emitted light is incident on a region facing the wavelength conversion cover 2. Thereby, for example, when the light emitted from the LED 1 is incident on the sub-region A1, the emission color (for example, white) corresponding to the composition and amount of the phosphor contained in the sub-region A1 is shown, and FIG. As shown in b), when the light is incident on the sub-region B1, an emission color (for example, a light bulb color) corresponding to the composition and amount of the phosphor contained in the sub-region B1 is shown. Therefore, when each LED 1 is made incident on the sub-region A1 of the wavelength conversion cover 2, for example, white illumination light is obtained, and the wavelength conversion cover 2 is slid by the slide groove 6 to place the LED 1 in the sub-range of the wavelength conversion cover 2. When the light is incident on the region B1, for example, light bulb-colored illumination light is obtained. In such an LED lighting device 10, the color of the illumination light can be easily changed without replacing the LED 1 itself.

  As another form, as shown in FIG. 3, a plurality of independent wavelength conversion covers 2 are arranged so as to be slidable or spaced apart from each other, and each wavelength conversion cover is moved independently, It is also possible to change to various emission colors. That is, in FIG. 3A, a light emission color in which colors emitted from the phosphors contained in each of the sub-region A1 and the sub-region B1 are mixed is obtained, and in FIG. An emission color emitted when the sub-region A1 overlaps is obtained. In this way, the colors that can be changed increase by moving the plurality of wavelength conversion covers independently. In FIG. 3, two wavelength conversion covers having two types of sub-regions are used, but three or more wavelength conversion covers having three or more types of sub-regions may be combined.

  As the LED 1, there is no particular limitation on a conventionally known LED device that emits light in a wavelength region such as ultraviolet light, near ultraviolet light, visible light indicating wavelengths in the blue to red region, near infrared light, and infrared light. Used. The LED device may be in the form of an LED package obtained by mounting and sealing an LED chip on a circuit, or may be in the form of an LED chip, but in the form of an LED package from the viewpoint of environmental resistance Preferably there is. Among these, ultraviolet light, near-ultraviolet light, blue to green wavelength, specifically blue LED and green LED having a peak in the range of 360 to 600 nm are preferable from the viewpoint that wide color expression is possible. Moreover, you may use white LED which converted the wavelength of light emission from a blue LED chip with a yellowish fluorescent substance. Examples of blue LEDs include GaN-based, SiC-based; ZnS-based, ZnSe-based, and the like. Moreover, as green LED, GaP type; N type; GaP type etc. are mentioned. These may be used alone or in combination of two or more.

  As the circuit board 3, an inorganic substrate such as an aluminum substrate such as an aluminum nitride substrate; a resin substrate such as an epoxy resin substrate, a polyamide resin substrate, an aromatic resin substrate, or the like is used without particular limitation.

  The number and output of the LEDs 1 mounted on the circuit board 3 can be freely selected according to the required illuminance or the like.

  In the LED illumination device 10, the wavelength conversion cover 2 is movably supported by a slide groove 6 provided in the housing member 4. Then, by sliding the wavelength conversion cover 2, the sub-area facing the LED 1 can be changed. Specifically, as shown in FIG. 2A, the wavelength conversion cover 2 in which the LED 1 is disposed so as to face the sub-region A1 is slid along the slide groove 6, thereby FIG. As shown, each LED 1 can be made to face the sub-region B1. In this way, by changing the facing region of the wavelength conversion cover 2 with respect to the LED 1, the emission color (for example, white and light bulb color) can be changed. By using such a wavelength conversion cover 2, the emission color can be changed without replacing the LED 1 itself of the LED lighting device 10. Therefore, when the LED lighting device 10 is installed and the illumination atmosphere is desired to be changed, the emission color can be changed by simply sliding the wavelength conversion cover 2.

  In the LED illumination device 10, the wavelength conversion cover 2 is movably supported by the slide groove 6 provided in the housing member 4, but the movable support method is not limited to such a form. Specifically, for example, as shown in FIG. 4, an annular wavelength conversion cover 102 is supported on shafts 110 and 111 disposed in the housing member 104, and the wavelength conversion cover is used with the shafts 110 and 111 as rotation axes. A form or the like that moves 102 may be used.

  Next, a modification of the wavelength conversion cover will be described in detail.

  FIG. 5 is a schematic cross-sectional view of the LED lighting device 20 including the wavelength conversion cover 12. The LED lighting device 20 has the same configuration as the LED lighting device 10 except that the wavelength conversion cover 2 is replaced with the wavelength conversion cover 12.

  As described above, the wavelength conversion cover 2 includes the sub-region A1 or the sub-region that faces the LED 1 by forming the plurality of wavelength conversion regions C1 having the sub-region A1 and the sub-region B1 having different phosphor compositions. Wavelength conversion according to B1 is performed. On the other hand, as shown in FIG. 5, the wavelength conversion cover 12 is continuously connected with a certain interval so that a plurality of wavelength conversion regions C <b> 2 having a sawtooth cross-sectional shape having an inclination face each LED 1. Is formed. The wavelength conversion region C2 is formed so that the thickness of the vertical cross section gradually changes. In addition, a phosphor having a uniform composition is dispersed in the wavelength conversion cover 12.

  Since the wavelength conversion cover 12 is formed so that the thickness of the vertical cross section of the wavelength conversion region C2 changes gradually, the amount of phosphor in the vertical cross section of the wavelength conversion region C2 changes along the horizontal direction. Thus, in each wavelength conversion area | region C2, the part from which the fluorescent substance amount in a vertical cross section mutually differs is formed continuously. Thereby, for example, when the light emission from the LED 1 is incident on the thin sub-region A2 as shown in FIG. 5, the amount of the phosphor that excites the light emission is reduced. On the other hand, when the light enters the thick sub-region B2 as shown in FIG. 6, the amount of the phosphor that excites the light increases. Therefore, for example, when the LED 1 is opposed to the sub-area A2 having a small thickness, a light emission color having a small color change with respect to the light emission color from the LED 1 is obtained. On the other hand, when the wavelength conversion cover 12 is slid by the slide groove 6 and the LED 1 is opposed to the thick sub-region B2, a light emission color having a large color change with respect to the light emission color from the LED 1 is obtained. Thus, also in the LED lighting device 20, the color of the illumination light can be easily changed without replacing the LED 1 itself. Further, since each wavelength conversion region has a continuous inclination, when it is moved to an intermediate portion between the sub-region A2 and the sub-region B2, an intermediate color between the emission color of the sub-region A2 and the emission color of the sub-region B2 Can also be obtained.

  By the way, a white LED that has been widely used in the past is generally called pseudo-white, which is obtained by mixing blue light emitted from a blue LED chip and yellow light obtained by exciting a yellow phosphor with a part of the emitted light. Emits white light. Referring to the xy chromaticity diagram of the XYZ color system shown in FIG. 7, in the mixed color of the chromaticity coordinate (P1) of blue light and the chromaticity coordinate (P2) of yellow light, the range on the line connecting them The range of P3 to P4 on the straight line is a range of a pseudo white region obtained by mixing blue and yellow. In the wavelength conversion cover 12 of the present embodiment, by using the wavelength conversion cover 12 in which a predetermined amount of yellow phosphor is uniformly dispersed, by changing the portion facing each LED 1 by the movement of the wavelength conversion cover 12, When facing a thin portion (subregion A2), bluish white light is obtained because the amount of yellow phosphor is reduced, and facing a thick portion (subregion B2) Since the amount of the yellow phosphor increases, yellowish white light can be obtained. In this way, the chromaticity of the illumination light can be changed between P3 and P4 in FIG.

  For example, in general lighting used in stores and homes, the color tone on or near the line called the black body radiation locus shown by R in FIG. 7 matches the lighting color standard. It is demanded as. However, in the pseudo-white color as described above, the color development region in the vicinity of the blackbody radiation locus is only a narrow range between P3 and P4, and if the yellowishness is too strong or the blueness is too strong, the blackbody radiation locus is Move away from yellow or blue. Such colors that are too far away from the vicinity of the blackbody radiation locus are not normally used for general lighting applications. Therefore, the method of changing the amount of yellow phosphor through which blue light passes may not be able to sufficiently cope with the range of illumination color standards.

  In such a case, in addition to the yellow fluorescent material as the fluorescent material in the wavelength conversion cover 12, a red or orange fluorescent material or the like is further blended to extend along a wider region near the black body radiation locus. Can produce different shades.

  Specifically, for example, blue light emitted from a blue LED, yellow light emitted when blue light is excited by exciting a yellow phosphor, and red light emitted when blue light is emitted by exciting a red phosphor are mixed. In this case, as shown in FIG. 7, a region connecting the chromaticity coordinates of the blue light chromaticity coordinate (P1), the yellow light chromaticity coordinate (P2), and the red light chromaticity coordinate (P5) with a straight line. Colors contained within can be created. Therefore, for example, by using a blue LED as the LED 1 and using the wavelength conversion cover 12 in which a yellow phosphor and a red phosphor are uniformly dispersed at a predetermined blending ratio, a wide range of color changes is possible. Specifically, when the LED 1 is opposed to a thin portion (sub-region A2), the amount of phosphor is reduced, so that light with strong bluish light is obtained, and a thick portion (sub-region B2). When facing each other, a strong yellow-orange-red color corresponding to the ratio of the yellow phosphor and the red phosphor can be obtained. Thus, when a phosphor such as a red phosphor is used in addition to the yellow phosphor, a color expression having a two-dimensional region surrounded by P1, P2, and P5 in FIG. It becomes possible. Such a region encompasses a blackbody radiation locus including daylight color, daylight white, white, warm white, or light bulb color. Accordingly, by using the wavelength conversion cover 12 in which the contents and thicknesses of plural types of phosphors are adjusted, it is possible to obtain an illumination color that follows a black body radiation locus by moving one sheet. it can.

  FIG. 8 is a schematic cross-sectional view of the LED lighting device 30 including the wavelength conversion cover 22. The LED illumination device 30 has the same configuration as the LED illumination device 10 except that the wavelength conversion cover 2 is replaced with the wavelength conversion cover 22.

  As described above, when the color is changed using the wavelength conversion cover 12 including the yellow phosphor and the red phosphor in the blue LED, in order to express the range of P6 to P7 along the black body radiation locus. Requires two types of light emission colors, yellow light emission color of yellow phosphor and red light emission color of red phosphor. On the other hand, in order to express the range of P7 to P5, the red emission color is required at a higher rate than the point P7, while the yellow emission color may be lower than the P7 point. Therefore, when it is desired to change the color along the black body radiation locus as P3 → P4 → P6 → P7 → P5 in FIG. 7, both yellow and red phosphors are increased from P3 → P4 → P6 → P7. On the other hand, in the change of P7 → P5, an increase in red phosphor is required at a higher rate than an increase in yellow phosphor. When high color rendering properties are required, use a green phosphor instead of a yellow phosphor, add a green phosphor to a yellow phosphor, use an orange phosphor instead of a red phosphor, By adding an orange color to a red color, illumination light having a wide spectrum and excellent color rendering can be obtained.

  On the other hand, in the case of a white LED having P6 color, as shown in FIG. 8, the thicknesses of both the yellow color conversion layer 12y and the red color conversion layer 12r for changing the color in the range of P6 → P7 gradually increase. A sub-region A3, a sub-region B3 in which the yellow color conversion layer 12y decreases and the red color conversion layer 12r increases in the range of P7 → P8, a sub-region C3 in which only the red color conversion layer 12r exists in the range of P8 → P5, It is preferable to use a wavelength conversion cover 22 having According to such a wavelength conversion cover 22, when the LED 1 is opposed to the sub-region A3 as shown in FIG. 8, the color can be changed in the range of P3 → P4 → P6 → P7, as shown in FIG. Thus, when the LED 1 is opposed to the sub-region C3, the color can be changed in the range of P8 → P5. Further, when the LED 1 is opposed to the sub-region B3, the color can be changed in the range of P7 → P8.

  The wavelength conversion cover 22 shown in FIG. 8 has a configuration in which a red conversion layer 12r containing a red phosphor and a yellow conversion layer 12y containing a yellow phosphor are stacked. In the sub-region A3, the thicknesses of the red color conversion layer 12r and the yellow color conversion layer 12y are gradually increased. On the other hand, in the sub-region B3, the red color conversion layer 12r increases, while the yellow color conversion layer 12y decreases in thickness, and the sub-region C3 is formed from a thick layer in which only the red color conversion layer 12r increases gradually. . Thus, according to the wavelength conversion cover having a laminated structure obtained by laminating layers of phosphors having different compositions, the composition of the phosphor contained in the thickness direction of the laminated structure is independent for each layer. Can be controlled. Then, by adjusting the thickness of each layer, the color of the illumination light can be changed in a wide area range along the black body radiation locus or in the vicinity of the black body radiation locus.

  As the white LED, there is one using an ultraviolet to near ultraviolet LED chip in addition to the pseudo white using the blue LED chip described above. Those using ultraviolet to near-ultraviolet LED chips obtain light such as white light by mixing LED chips mainly emitting ultraviolet to near-ultraviolet light and a plurality of three or more kinds of phosphors excited by the light. In general, red (R), green (G), and blue (B) RGB phosphors are often used as the phosphors used for this purpose. In addition, yellow fluorescent materials such as yellowish green, yellow, and orange may be added.

  In the case of a white LED using such an ultraviolet light chip, as a phosphor used for the wavelength conversion cover, leaked ultraviolet light or ultraviolet light that has been emitted from the ultraviolet LED chip but could not be used for phosphor conversion. Blue light is obtained by light emission of the blue phosphor excited by, and the color of the light of the white LED can be changed by using the blue excited phosphor that is secondarily excited by this blue light.

Specifically, SrGa ₂ S ₄ , CaGa ₂ S ₄ , YAG: Cs, and BAM that emit light using leaked ultraviolet light with respect to a white LED based on a near-ultraviolet LED chip that emits light having a dominant wavelength of 405 nm: Eu, BAM: Mn and alpha sialon-based phosphors can be used, and blue-excited phosphors that emit light using the blue light contained in the white LED can be used.

  Next, an example of a method for manufacturing the wavelength conversion cover described above and other typical configuration examples will be described.

  The wavelength conversion cover has a plurality of wavelength conversion regions in which at least one of the phosphor composition, the phosphor amount, and the thickness is different from each other, and the light emitted from the LED 1 is emitted according to the wavelength conversion region into which the light emitted from the LED 1 is incident. If it is comprised so that a wavelength may differ, the specific form will not be specifically limited. Moreover, even if it is a sheet | seat of a single layer like the wavelength conversion cover 2 or the wavelength conversion cover 12, it is a laminated body by which the layer from which the composition composition of a fluorescent substance mutually differs was laminated | stacked like the wavelength conversion cover 22. Further, a laminate in which a layer containing a phosphor and a layer not containing a phosphor are laminated may be used. Furthermore, even if the phosphor blended in the wavelength conversion cover is uniformly dispersed on the entire surface of the sheet, the phosphor is partially unevenly distributed or partially unevenly distributed. There may be a region where the density is changed, a concentration gradient is provided in the plane direction, or the phosphor is not present.

  Specific examples of the translucent resin material for dispersing the phosphor in the wavelength conversion cover include, for example, epoxy resins, silicone resins such as silicone elastomers, polyolefin resins, polyester resins, polyurethane elastomers, and the like. Can be mentioned. Of these, silicone elastomers are preferred because they are excellent in light resistance and light transmission, so that there is little deterioration such as discoloration due to long-time use, and phosphors can be easily dispersed uniformly. In addition, so-called millable silicone is particularly preferable because sheet processing is easy while maintaining uniform dispersibility of the phosphor.

  Specific examples of the millable silicone include, for example, trade names TSE-2257U and TSE-2287U manufactured by Momentive Performance Materials, Inc., and trade names KE-9610-U manufactured by Shin-Etsu Chemical Co., Ltd. KE-9710-U and the like, trade name SE-8711-CVU manufactured by Toray Dow Corning Silicone Co., Ltd. and the like.

  Next, the phosphor contained in the wavelength conversion cover will be described.

The phosphor contained in the wavelength conversion cover is not particularly limited. Specific examples _{thereof, Y 3-X Gd X Al} 5 O 12: Ce (0 ≦ x ≦ 3) yttrium aluminate based fluorescent material represented by (YAG), Ca-α- SiAlON: Eu-like Yellow phosphor; red phosphor such as CaS: Eu, CaAlSiN ₃ : Eu; general formula AEu _(1-x) Ln _x B ₂ O ₈ (A is selected from the group consisting of Li, K, Na, and Ag) Ln is one selected from the group consisting of Y, La, and Gd, and B is W or Mo. The red phosphor represented by the general formula a (Sr _1-x Eu _{x (1-y)} Yb _xy ) O · SiO ₂ (where 2.9 ≦ a ≦ 3.1, 0.005 ≦ x ≦ 0.10, 0.001 ≦ y ≦ 0.1) Examples thereof include orange phosphors such as earth metal silicate phosphors, green phosphors represented by β-SiAlON: Eu, and the like. These may be used alone or in combination of two or more.

  The blending composition is appropriately adjusted according to the chromaticity and wavelength of light emitted from the LED 1 used and the target light emission color (for example, daylight color, daylight white, white, warm white, or light bulb color).

  Although the content rate of the fluorescent substance contained in the resin material for disperse | distributing fluorescent substance is not specifically limited, It is preferable that it is the range of 5-60 mass%, Furthermore, 20-50 mass%.

  Moreover, you may mix | blend inorganic particles with a fluorescent substance in order to scatter the light emitted from LED1, or to color further. Examples of such inorganic particles include silica, titanium oxide, aluminum oxide, talc, glass powder, and pigments such as cobalt blue, ultramarine blue, and iron oxide. These may be used alone or in combination of two or more.

  A single-layer phosphor-containing sheet such as the wavelength conversion cover 2 is prepared by preparing a plurality of phosphor-containing members containing phosphors having different compositions, and arranging them alternately with each other and crimping or bonding them at their ends. It is obtained by the method. Moreover, when manufacturing the single layer fluorescent substance containing sheet | seat which has several wavelength conversion area | regions from which thickness differs like the wavelength conversion cover 12, a roll, a Banbury mixer, an extruder, etc. are used for a fluorescent substance and a resin component. After kneading and extruding with a T-die, pressing or calendering to obtain a sheet, and forming the obtained sheet so that its cross-sectional shape is a saw blade, thereby changing the in-plane thickness Is mentioned. Further, when a laminated body made of layers having different thicknesses such as the wavelength conversion cover 22 is manufactured, a single-layer phosphor-containing sheet having a saw-toothed cross section like the wavelength conversion cover 12 is used as the first layer. Further, it can be obtained by applying a liquid resin containing a phosphor on its surface, or by bonding or pressure-bonding a phosphor-containing member adjusted to a predetermined thickness.

  The thickness of the wavelength conversion cover is preferably about 10 to 3000 μm, more preferably about 100 to 500 μm. When the thickness of the wavelength conversion cover is within the above range, it can be molded with high thickness accuracy.

  In addition, the wavelength conversion cover is preferably a wavelength conversion cover supported by a support base material from the viewpoint of improving handling properties when the arrangement is changed. As an example, FIG. 10 shows a schematic perspective view of a wavelength conversion cover 25 in which a wavelength conversion layer 32 including a wavelength conversion region composed of sub-regions A1 and B1 is laminated and supported on a support base 24.

  In order to improve the mobility at the time of color conversion by imparting rigidity to the wavelength conversion layer 32, the support base material 24 is wavelength-converted by laminating the wavelength conversion layer 32 and performing partial adhesion or gripping. It is a sheet-like or plate-like object or frame-like object that supports the cover. As the support base material 24, a base material made of a material that transmits light emitted from the LED 1 or light emitted by being converted by a sheet containing a phosphor is preferably used. Examples of the material constituting the support base 24 include polyolefin resins such as polyethylene and polypropylene, polyester resins such as polyethylene terephthalate (PET) and polybutylene terephthalate (PBT), polycarbonate, polyarylate, acrylic resin, and epoxy resin. Light transmissive resin materials, and light transmissive inorganic materials such as glass and silicone substrates are used. In addition, when using a frame that does not exist in the wavelength conversion region and grips the end of the wavelength conversion layer, a non-translucent material such as a metal, a wire mesh, or a nonwoven fabric with a hole in only that part It may be.

  The wavelength conversion cover 25 is formed by laminating a wavelength conversion layer 32 on the surface of the support substrate 24. Lamination is performed by, for example, extruding a phosphor-containing sheet from a T-die and bonding it to the support substrate 24 in a molten or softened state, or forming a liquid resin for forming the wavelength conversion layer 32 on the support substrate 24. After the coating, it can be obtained by a method of curing or solidifying, or bonding the preliminarily formed wavelength conversion layer 32 and the support base 24 with an adhesive excellent in light transmittance. The supporting base material may be arranged on the side facing the LED 1 or on the opposite side. Further, the support base material 24 may be used on both surfaces of the wavelength conversion layer 32. When at least one support base material is detachably laminated with the wavelength conversion layer 32, various installations are possible in subsequent operations. It becomes.

  The thickness of the support base 24 can be appropriately selected depending on the installation location. In the case of a light-transmitting resin material or a light-transmitting inorganic material such as a silicone substrate, the thickness is preferably about 10 to 3000 μm, more preferably about 30 to 300 μm. If the support base 24 is too thick, the light transmittance tends to decrease and the illuminance tends to decrease. If it is too thin, the wavelength conversion cover has insufficient rigidity, and handling properties when moved are insufficient. There is a tendency to decrease.

  In addition, when LED1 emits an ultraviolet light, the leakage of the ultraviolet light to the exterior can be suppressed by providing the ultraviolet absorption layer 23 in the wavelength conversion layer 32 or the outer surface side of the support base material 24. FIG. FIG. 11 is a schematic perspective view of the wavelength conversion cover 26 in which the ultraviolet absorption layer 23 is laminated on the outer surface side of the support base 24 when the wavelength conversion layer 32 faces the LED 1. When providing a support base material in the opposite side to the side facing LED1, you may make a support base material contain an ultraviolet absorber. When the supporting substrate is opposed to the LED 1 and the wavelength conversion layer is on the outer surface side, an ultraviolet absorbing layer may be provided on the outer surface side of the wavelength conversion layer 32. When the LED 1 that emits ultraviolet light is used, it is difficult for the phosphor to absorb all the ultraviolet light. Therefore, it is preferable to provide the ultraviolet absorbing layer 23 containing the ultraviolet absorber on the outer surface side of the support base 24.

  As the ultraviolet absorber, 2- (2-hydroxy-3,5-di-t-butylphenyl) -5-chlorobenzotriazole or the like can be used. By providing the ultraviolet absorption layer 23 in this manner, it is possible to suppress the leakage of ultraviolet rays from the LED lighting device. The ultraviolet absorbing layer 23 can be formed by the same method except that the resin component described above is mixed with an ultraviolet absorber instead of the phosphor.

  Further, a wavelength conversion cover 27 shown in FIG. 12 will be described as another example of the wavelength conversion cover. A method of changing the color of the illumination light in the LED illumination device 40 including the wavelength conversion cover 27 will be described with reference to FIG.

  The wavelength conversion cover 27 is bonded so that two types of phosphor-containing members 43 a and 43 b are scattered on the surface of the support base 24. The scattered phosphor-containing members 43a and 43b contain phosphors having different compositions and amounts, or have different thicknesses, and have different types of wavelength conversion characteristics. Then, as shown in FIG. 13, the wavelength conversion cover 27 is appropriately moved so that the LED 1 faces the phosphor-containing member 43a (FIG. 13 (a)) or the phosphor-containing member 43b (FIG. 13 (b)). By doing so, the color can be changed. In addition, according to the wavelength conversion cover 27, since the several fluorescent substance containing member 43 is dotted on the surface of the support base material 24, the usage-amount of expensive fluorescent substance can be reduced significantly.

  Furthermore, the wavelength conversion cover 29 in which the phosphor-containing members 44a and 44b are supported on the frame-shaped support base material 34 will be described with reference to FIG.

  The wavelength conversion cover 29 has a configuration in which two types of phosphor-containing members 44a and 44b are arranged in the open window 28 of the support base material 34 that is a frame. The respective phosphor-containing members 44a and 44b contain phosphors having different compositions and amounts, or have different thicknesses, and have different types of wavelength conversion characteristics. According to such a form, the phosphor-containing members 44a and 44b do not have a structure laminated on the support base 24 like the wavelength conversion covers 25, 26, and 27 described above. Therefore, since light absorption by the support base material 24 does not occur, higher illuminance can be ensured. The method of fixing the phosphor-containing members 44a and 44b to the support base material 34 having the open window 28 is not particularly limited. For example, the method of fixing the phosphor-containing members 44a and 44b to the support base material 34 by adhesion or the like, A method of fitting the phosphor-containing members 44a and 44b to the open window 28 can be used. In addition, you may form a reflecting film in the surface which opposes LED1 of the support base material 34 which is a frame in order to reflect diffused light in an illuminating device.

  Moreover, since the light emitted from the LED has high directivity, the emitted light is incident only on the opposing wavelength conversion region. However, due to the influence of the distance between the LED and the wavelength conversion cover, the distance between the plurality of LEDs, the internal structure, etc., some light may become diffused light and not be used effectively as illumination light. In order to further improve the illumination efficiency, it is important to use such light. As an example of a method for guiding such diffused light to the wavelength conversion cover 2 and using it effectively, FIG. FIG. 15 is a cross-sectional view of the LED lighting device 50 having the same configuration except that the light diffusion preventing cylinder 45 is provided on the surface of the circuit board 3 of the LED lighting device 10 shown in FIG. . In the LED illumination device 50, a light diffusion prevention cylinder 45 that accommodates the LED 1 is provided between the surface of the circuit board 3 and the wavelength conversion cover 2. In this case, as shown by an arrow Q in the LED lighting device 50 in FIG. 15, the light emitted from the LED 1 can be efficiently guided to the wavelength conversion cover 2 by reflecting it on the wall surface of the light diffusion prevention cylinder 45. it can. Such a light diffusion preventing cylinder 45 is formed of a resin cylinder or the like in which a thin film having a high reflectance is formed on the inner surface thereof. Such a light diffusion preventing cylinder 45 may be supported on the circuit board 3 or may be supported on the surface of the wavelength conversion cover 2.

  Moreover, you may provide the light guide part which guides the light emission from LED1 to the wavelength conversion cover 2 instead of the light diffusion prevention cylinder mentioned above. As a specific example of the light guide unit, a light-transmitting rubber made of a light-transmitting rubber or gel that is in close contact with or close to the surface of the LED 1 and also close to or close to the wavelength conversion region of the wavelength conversion cover 2 A part or a translucent gel part is mentioned. Examples of the translucent rubber part or translucent gel part include a silicone molded sheet. By providing such a light guide, light emitted from the LED 1 can be effectively guided to the wavelength conversion region of the wavelength conversion cover 2.

Furthermore, a lens structure may be provided in the wavelength conversion region of the wavelength conversion cover. By providing such a lens structure, illumination light radiated to the outside can be diffused. Since the light emitted from the LED has high directivity, the directivity of the light emitted from the LED lighting device inevitably increases. In such a case, by providing the lens structure, the directivity is relaxed and the diffusibility is increased, so that light can be irradiated over a wide range. Specifically, for example, as shown in the schematic cross-sectional view of FIG. 16, a lens 54 is formed on the surface of the support base 24 in the wavelength conversion cover 27. When such a lens structure is provided, as shown by an arrow N in FIG. 16, light having high directivity from the LED 1 can be turned into highly diffusible illumination light. Such a lens structure may be provided directly on the surface of the phosphor-containing member.
Further, by providing the LED illumination device with a lens structure, the area of the light emission region can be reduced. Thereby, the area of the phosphor-containing member 44 can also be reduced.

  Further, as another example of the wavelength conversion cover, an LED lighting device 70 provided with a wavelength conversion cover 77 shown in FIG. 17 will be described. FIG. 17A is a perspective view of the LED illumination device 70, and FIG. 17B is a schematic cross-sectional view taken along the line CC ′ of FIG. In the figure, 1 is an LED, 71 is a phosphor-containing member, 72 is a housing member that is a support base material that supports the phosphor-containing member 71, 73 is a circuit board, 74 is a base member, and 5 is power to the circuit board 73. A plug for supply, 76 is a rotating shaft that supports the support base 77, 78 is a lens that collects light emitted from the LED 1, and 79 is a reflective film. A plurality of phosphor-containing members 71 are supported by the housing member 72 so as to face each LED 1, thereby forming a wavelength conversion cover 77. Each phosphor-containing member 71 has sub-regions having different phosphor contents and phosphor compositions. In FIG. 17A, a part of the wavelength conversion cover 77 is shown in a transparent manner in order to explain the internal structure of the LED lighting device 70.

  In the LED illumination device 70, a plurality of LEDs 1, 1,... Are concentrically mounted on an unillustrated electric circuit formed on the surface of the circuit board 73 to constitute a light source unit. Then, each LED 1 is turned on by inserting the plug 5 into a not-shown outlet and supplying power to the circuit board 73. The wavelength conversion cover 77 is supported so as to be rotatable about the rotation shaft 76. Each phosphor-containing member 71 is disposed opposite to the LED 1.

  In the LED lighting device 70, the LED 1 emits light by supplying power from the plug 5 to the circuit board 73. Light emitted from each LED 1 is collected by the lens 78 and enters the phosphor-containing member 71 facing each other. Then, part or all of the light incident on the phosphor-containing member 71 is wavelength-converted to a wavelength determined according to the phosphor composition in the region by the phosphor contained in the incident region of the phosphor-containing member 71, It emits light having a wavelength different from the emission wavelength of the LED 1. And it mixes with the light emission of LED1 which was not wavelength-converted. A reflective film 79 made of a metal thin film or the like for increasing light extraction efficiency is formed on the inner surface of the support base 72 and the surface of the circuit board 73. In the wavelength conversion cover 77, the LED 1 can be disposed opposite to the desired position of the phosphor-containing member 71 by rotating around the rotation shaft 76. Therefore, the emission color can be changed by changing the position where the light emitted from the LED 1 is transmitted within the surface of the phosphor-containing member 71.

  Further, as another example of the wavelength conversion cover, an LED illumination device 80 provided with a wavelength conversion cover 87 shown in FIG. 18 will be described. FIG. 18A is a perspective view in the middle of attaching the wavelength conversion cover 87 constituting the LED illumination device 80 to the light source unit. FIG. 18B is a perspective view of the LED lighting device 80. In the figure, 1 is a light emitting diode (LED), 81 is a phosphor-containing member, 82 is a base member, 83 is a cylindrical circuit board, 84 is an electric circuit, and 85 is a support base material that supports the phosphor-containing member 81. The housing member 5 is a plug for supplying electric power to the circuit board 83. The wavelength conversion cover 87 includes a plurality of phosphor-containing members 81 (wavelength conversion regions) and housing members 85 that face each LED 1. Each phosphor-containing member 81 is fitted into a housing member 85 having a window, and has sub-regions having different phosphor contents and phosphor compositions. In FIG. 18B, a part of the wavelength conversion cover 87 is shown in a transparent manner in order to explain the internal structure of the LED lighting device 70.

  In the LED lighting device 80, a plurality of LEDs 1, 1,... Are spirally mounted on an electric circuit 84 formed on the surface of the circuit board 83 to constitute a light source unit. Then, each LED 1 is turned on by inserting the plug 5 into a not-shown outlet and supplying power to the circuit board 83. The wavelength conversion cover 87 is rotatably supported by a sliding groove 86 provided in the support member 82. Each phosphor-containing member 81 is disposed opposite to the LED 1.

  In the LED lighting device 80, the LED 1 emits light by supplying power from the plug 5 to the circuit board 83. Then, part or all of the light incident on the phosphor-containing member 81 is wavelength-converted to a wavelength determined according to the phosphor composition in the region by the phosphor contained in the incident region of the phosphor-containing member 81, It emits light having a wavelength different from the emission wavelength of the LED 1. And it mixes with the light emission of LED1 which was not wavelength-converted. In the wavelength conversion cover 87, the LED 1 can be disposed opposite to the desired position of the phosphor-containing member 81 by being rotated by the sliding groove 86. Therefore, the emission color can be changed by changing the position where the light emitted from the LED 1 is transmitted within the surface of the phosphor-containing member 81. A reflective film made of a white thin film of paint containing titanium oxide for increasing light extraction efficiency is formed on the inner surface of the housing member 85 and the surface of the circuit board 83.

  Further, as another example of the wavelength conversion cover, an LED illumination device 90 provided with a wavelength conversion cover 97 shown in FIG. 19 will be described. FIG. 19A is a perspective view of the LED lighting device 90. FIG. 19B is a schematic cross-sectional view in the DD ′ cross section of the LED lighting device 90. In the figure, 1 is a light emitting diode (LED), 91 is a phosphor-containing member, 92 is a base member, 93 is a cylindrical circuit board, 94 is an electric circuit, and 95 is a support base material that supports the phosphor-containing member 91. The housing member 5 is a plug for supplying power to the circuit board 93, 96 is a sliding groove, and 98 is a light diffusion prevention cylinder. A wavelength conversion cover 97 is formed from the phosphor-containing member 91 and the housing member 95. Each phosphor-containing member 91 has sub-regions having different phosphor contents and phosphor compositions. In FIG. 19A, a part of the wavelength conversion cover structure 97 is shown in a watermarked manner in order to explain the internal structure of the LED lighting device 90.

  In the LED lighting device 90, a plurality of LEDs 1, 1,... Are mounted on an electric circuit 94 formed on the surface of the circuit board 93 to constitute a light source unit. Then, each plug 1 is turned on by inserting the plug 5 into a not-shown outlet and supplying power to the circuit board 93. The wavelength conversion cover 97 is rotatably supported by a sliding groove 96 provided in the base member 92. Each LED 1, 1,... Is covered with a light diffusion prevention cylinder 98. The open end of the light diffusion preventing cylinder 98 is slidably in contact with the surface of the wavelength conversion cover 97 or holds a slight gap. Each phosphor-containing member 91 faces the LED 1. By providing such a light diffusion prevention cylinder 98, the area of the light emission region can be reduced. Thereby, the area of the phosphor-containing member 91 can also be reduced.

  In the LED lighting device 90, the LED 1 emits light by supplying power from the plug 5 to the circuit board 93. Then, part or all of the light incident on the phosphor-containing member 91 is wavelength-converted by the phosphor contained in the incident region of the phosphor-containing member 91 to a wavelength determined according to the phosphor composition in that region, It emits light having a wavelength different from the emission wavelength of the LED 1. And it mixes with the light emission of LED1 which was not wavelength-converted. In the wavelength conversion cover 97, the LED 1 can be disposed opposite to the desired position of the phosphor-containing member 91 by being rotated by the sliding groove 96. Therefore, the emission color can be changed by changing the position where the light emitted from the LED 1 is transmitted within the surface of the phosphor-containing member 91.

  The LED lighting device described above can be preferably used as a light source for various displays in addition to a lighting device such as indoor lighting.

1 ... LED
2, 12, 22, 25, 26, 27, 29, 77, 87, 97, 102 ... wavelength conversion covers 3, 73, 83, 93 ... circuit boards 3a, 84, 94 ... electrical circuits 4, 104, 72, 85 95 ... Housing member 5 ... Plug,
6 ... slide groove 86, 96 ... slide groove 10, 20, 30, 40, 50, 60, 70, 80, 90 ... LED lighting device 12r ... red color conversion layer 12y ... yellow color conversion layer 23 ... UV absorbing layer 24 , 34 ... support base material 82, 92 ... base base material 28 ... open windows 43a, 43b, 44a, 44b, 71, 81, 91 ... phosphor-containing members,
45, 98 ... light diffusion prevention cylinders 54, 78 ... lenses 110, 111 ... axes C1, C2, C3 ... wavelength conversion regions A1, A2, A3, B1, B2, B3 ... subregions of the wavelength conversion region

Claims (6)

A plurality of light emitting diodes;
A circuit board in which a plurality of the light - emitting diode,
The pre SL circuit board was yield capacity, and a housing member that having a opening or light transmitting surface for emitting the light emission of the plurality of light emitting diodes,
And isolated from the circuit board, so that it can move a plurality of the light emitting diode covered state, and a wavelength conversion cover one which is disposed in the opening or the light transmitting surface,
The one wavelength conversion cover is:
The emission wavelength of each light emitting diode having a first sub-region into a first emission wavelength, the wavelength conversion region of multiple and a second sub-area to be converted into a second emission wavelength,
The first sub-region and the second sub-region are different from each other in at least one of phosphor composition, phosphor amount or thickness,
The plurality of light emitting diodes respectively simultaneously face either the first sub-region or the second sub-region, and each of the light-emitting diodes faces the first sub-region from the position facing the first sub-region. The emission color of the emitted light is changed by moving the wavelength conversion cover from a position facing each other or a position each facing the first sub-region from the second sub-region. Lighting device. Wherein the first sub-region and the second sub-region, a laminate of at least two layers phosphor layer containing a phosphor different compositions, 請 Motomeko thickness in vertical cross-section that differs from one another The lighting device according to 1. The illuminating device according to claim 1 or 2, wherein the chromaticity of the emitted light includes a black body radiation locus in an xy chromaticity diagram of the XYZ color system. The lighting device according to any one of claims 1 to 3, wherein the plurality of wavelength conversion regions are made of a silicone-based elastomer containing a phosphor. The lighting device according to claim 1, further comprising a support base material that supports the wavelength conversion region.   The lighting device according to claim 1, wherein the housing member has a slide groove that supports the one wavelength conversion cover and moves the cover in the surface direction.

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