JP5899424B2 - Coating apparatus and coating method - Google Patents

Coating apparatus and coating method Download PDF

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JP5899424B2
JP5899424B2 JP2013012826A JP2013012826A JP5899424B2 JP 5899424 B2 JP5899424 B2 JP 5899424B2 JP 2013012826 A JP2013012826 A JP 2013012826A JP 2013012826 A JP2013012826 A JP 2013012826A JP 5899424 B2 JP5899424 B2 JP 5899424B2
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substrate
porous material
coating
dummy plate
liquid
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JP2014144386A (en
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修三 土田
修三 土田
晃宏 堀川
晃宏 堀川
奥村 智洋
智洋 奥村
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Panasonic Intellectual Property Management Co Ltd
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Description

本発明は、太陽電池用ガラス基板などの表面に反射防止膜などの材料を塗布する塗布装置および塗布方法に関する。   The present invention relates to a coating apparatus and a coating method for coating a material such as an antireflection film on the surface of a glass substrate for a solar cell.

現在、太陽電池やディスプレイパネル、照明などを対象に、反射防止膜や特定の波長光を遮る波長調整膜と言った機能性膜を大面積に塗布する塗布技術が開発されている。例えば、基板に塗布膜を形成する方法としてダイコート法がある。図9は、従来のダイコート法について説明する概略図である。   Currently, a coating technique for applying a functional film such as an antireflection film or a wavelength adjusting film that blocks light of a specific wavelength to a large area has been developed for solar cells, display panels, lighting, and the like. For example, there is a die coating method as a method for forming a coating film on a substrate. FIG. 9 is a schematic diagram for explaining a conventional die coating method.

同図において、基板111に機能性膜を塗布する際、塗布幅方向に長い金型のダイ112Dから、ダイ112Dの長手方向に形成されたスリット113を介して塗布液114を吐出し、基板111上に塗布する。このとき、ダイ112Dと基板111間のギャップ115を維持しながら、ダイ112Dと基板111と相対的に移動させながら基板111上に塗布液114を塗布している。   In this figure, when a functional film is applied to the substrate 111, a coating solution 114 is discharged from a die 112D having a long length in the coating width direction through a slit 113 formed in the longitudinal direction of the die 112D. Apply on top. At this time, the coating liquid 114 is applied onto the substrate 111 while moving relative to the die 112D and the substrate 111 while maintaining the gap 115 between the die 112D and the substrate 111.

しかしながら、上述のダイコート法では、塗布始終端において膜厚が不均一になるという課題を有する。塗布始終端の膜厚を安定に制御するために、ダイ112Dと基材111間のギャップ115を狭い状態で保持し、ダイ112Dと基板111の相対移動を低速にするなど、非常に精細な制御および時間を有する。   However, the above-described die coating method has a problem that the film thickness becomes non-uniform at the start and end of coating. In order to control the film thickness at the start and end of coating stably, the gap 115 between the die 112D and the base material 111 is held in a narrow state, and the relative movement between the die 112D and the substrate 111 is slowed down. And have time.

上記問題を解決するために、特許文献1に開示される内容が知られ、図10を用いて説明する。   In order to solve the above problem, the contents disclosed in Patent Document 1 are known and will be described with reference to FIG.

ダイ112Dから塗布液114を吐出しながら基板111を相対移動させ、基板111上に塗布膜を形成する際、塗布開始位置116にダミー板117を配置し、そのダミー板上面から塗布を開始することにより、塗布始端部の膜厚変動部118を除去することできる。   When the substrate 111 is relatively moved while discharging the coating liquid 114 from the die 112D and a coating film is formed on the substrate 111, the dummy plate 117 is disposed at the coating start position 116, and coating is started from the upper surface of the dummy plate. Thus, the film thickness variation portion 118 at the coating start end portion can be removed.

また、塗布膜を塗布する方法として、ダイコート法のような非接触式塗布方法以外に、多孔質塗布法、ロール塗布法など接触式塗布方法がある。   In addition to the non-contact coating method such as the die coating method, there are contact coating methods such as a porous coating method and a roll coating method.

例えば、多孔質塗布法として特許文献2示す内容が知られ、図11を用いて説明する。   For example, the contents shown in Patent Document 2 are known as a porous coating method and will be described with reference to FIG.

塗布液114を供給した多孔質材112を基板111に接触させながら多孔質材112と基板111が相対移動することにより、基板111上に塗布液114を塗布する方法である。   In this method, the porous material 112 supplied with the coating liquid 114 is brought into contact with the substrate 111 and the porous material 112 and the substrate 111 move relative to each other to apply the coating liquid 114 on the substrate 111.

特開2007−000865号公報JP 2007-000865 A 特開平9−047703号公報JP-A-9-047703

しかしながら、上記特許文献2に開示される方法でも、塗布始端部では、多孔質材112が基板111に当接する際、多孔質材112の先端が押しつぶされることにより多孔質材112に含侵していた塗布液114が一度に基板111上に染み出し、始端部の膜厚が厚くなる問題が発生する。また、その染み出した塗布液114が多孔質材112の先端に引きずられ、塗布膜面全体に膜厚ムラが発生するという問題も生じる。   However, even in the method disclosed in Patent Document 2, the porous material 112 is impregnated at the application start end portion by crushing the tip of the porous material 112 when the porous material 112 contacts the substrate 111. The coating liquid 114 oozes out onto the substrate 111 at a time, resulting in a problem that the film thickness at the start end is increased. In addition, the exuded coating liquid 114 is dragged to the tip of the porous material 112, causing a problem that film thickness unevenness occurs on the entire coating film surface.

そこで、上記ダイコート法のダミー板の考え方を、上記多孔質材塗布法に適用することが容易に考えられるが、以下のような問題が発生することになる。   Therefore, it is easily considered that the die coating dummy plate concept is applied to the porous material coating method, but the following problems occur.

この問題について図12を用いて説明する。   This problem will be described with reference to FIG.

図12は、多孔質塗布法にダミー板を導入した場合の塗布工程を示す断面図である。   FIG. 12 is a cross-sectional view showing a coating process when a dummy plate is introduced into the porous coating method.

塗布液114を供給された多孔質材112がダミー板117に当接した箇所で、塗布液114が染み出し、液だまり119が発生する。その状態で多孔質材112と基板111およびダミー板117が相対移動すると、ダミー板117の先端部120において多孔質材112がダミー板から基板111上へ乗り移る。   The coating liquid 114 oozes out at a location where the porous material 112 supplied with the coating liquid 114 contacts the dummy plate 117, and a liquid pool 119 is generated. When the porous material 112, the substrate 111, and the dummy plate 117 are relatively moved in this state, the porous material 112 is transferred from the dummy plate onto the substrate 111 at the front end portion 120 of the dummy plate 117.

そのとき、ダミー板117上で染み出した液だまり119が多孔質材112の先端に引きずられ、基板111上に液だまり119の一部が移動し、基板111上の塗布膜の膜厚が不均一になりスジムラなどの不良が発生する。また、ダミー板先端部120の裏面側、すなわちダミー板の基板側121へ液だまり119の一部が回り込み、ダミー板と基板111間の隙間へ毛細管現象で入り込むことで、基板111上に形成される塗布膜の始端部における塗布境界線がにじみ、外観不良になる。   At this time, the liquid puddle 119 that has oozed out on the dummy plate 117 is dragged to the tip of the porous material 112, and a part of the liquid puddle 119 moves on the substrate 111, so that the film thickness of the coating film on the substrate 111 is reduced. It becomes uniform and defects such as streaks occur. Further, a part of the liquid pool 119 goes around to the back side of the dummy plate front end portion 120, that is, the substrate side 121 of the dummy plate, and enters the gap between the dummy plate and the substrate 111 by capillary action, so that it is formed on the substrate 111. The coating boundary line at the start end of the coating film bleeds, resulting in poor appearance.

そこで本発明は、このような課題に鑑みなされたもので、安定してムラがない塗布膜を形成することが可能な、塗布装置および塗布方法を提供することを目的としている。   Therefore, the present invention has been made in view of such problems, and an object of the present invention is to provide a coating apparatus and a coating method capable of stably forming a coating film without unevenness.

上記目的を達成するために、本発明の塗布装置は、以下の特徴を有する。   In order to achieve the above object, the coating apparatus of the present invention has the following characteristics.

〔1〕基板を載置する基板保持台と、基板の表面に塗布液を塗布する多孔質材と、多孔質材に前記塗布液を供給する液供給機構と、基板保持台と多孔質材とを相対的に移動可能とする搬送機構と、多孔質材と基板とを接触可能とする上下駆動機構と、基板の外周に配置され、基板の表面の一部を覆うダミー板と、で構成され、ダミー板は、基板保持台のうち基板が載置される表面に対して、基板保持台の外側に傾斜して配置される、塗布装置。   [1] A substrate holder on which a substrate is placed, a porous material for applying a coating liquid to the surface of the substrate, a liquid supply mechanism for supplying the coating liquid to the porous material, a substrate holding table and a porous material, A movable mechanism capable of relatively moving the substrate, a vertical driving mechanism capable of contacting the porous material and the substrate, and a dummy plate disposed on the outer periphery of the substrate and covering a part of the surface of the substrate. The dummy apparatus is a coating apparatus in which the dummy plate is disposed to be inclined to the outside of the substrate holding table with respect to the surface of the substrate holding table on which the substrate is placed.

〔2〕上記〔1〕において、ダミー板の表面において、多孔質材と接触する箇所より上流側に、過剰な塗布液を流す溝が設けられた、塗布置。
[2] In the above [1], the surface of the dummy plate, upstream of the point of contact with the porous material, a groove for flowing the excess coating solution is provided, the coating equipment.

〔3〕上記〔1〕又は〔2〕において、ダミー板の先端部分にR加工が施された、塗布装置。   [3] The coating apparatus according to [1] or [2], wherein the tip portion of the dummy plate is rounded.

〔4〕上記〔1〕〜〔3〕において、ダミー板の上面には、多孔質材と接触する箇所より上流側に、塗布液が弾く膜がコーティングされた、塗布装置。   [4] The coating apparatus according to [1] to [3], wherein the upper surface of the dummy plate is coated with a film that repels the coating liquid on an upstream side from a position in contact with the porous material.

〔5〕上記〔1〕〜〔4〕において、ダミー板の下面の一部には、塗布液が弾く膜がコーティングされた、塗布装置。   [5] The coating apparatus according to [1] to [4], wherein a part of the lower surface of the dummy plate is coated with a film that repels the coating liquid.

また、本発明の塗布方法は、以下の特徴を有する。   The coating method of the present invention has the following characteristics.

〔6〕多孔質材に塗布液を浸透させ、多孔質材を基板の表面に接触させることで塗布液を塗布する塗布方法であって、基板の塗布開始部において、基板の一部を覆い基板の外側に向かって傾斜したダミー板を基板の外周に設置し、多孔質材をダミー板に接触させた状態で、多孔質材と基板とを一方向に相対移動させることで、基板の表面に塗布膜を形成すること、塗布方法。   [6] A coating method in which the coating liquid is applied by infiltrating the coating liquid into the porous material and bringing the porous material into contact with the surface of the substrate, and covers a part of the substrate at the substrate coating start portion. A dummy plate inclined toward the outside of the substrate is placed on the outer periphery of the substrate, and the porous material and the substrate are moved relative to each other in one direction while the porous material is in contact with the dummy plate. Forming a coating film, coating method.

〔7〕上記〔6〕において、ダミー板を多孔質材が通過した直後から、ダミー板を基板から離間させる、塗布方法。   [7] The coating method according to [6], wherein the dummy plate is separated from the substrate immediately after the porous material passes through the dummy plate.

以上のように、塗布装置および塗布方法において、塗布開始部に前記ダミー板を設置することにより、塗布始端分の膜厚変動を低減でき均一な塗布膜を塗布対象物に形成することができる。   As described above, in the coating apparatus and the coating method, by installing the dummy plate at the coating start portion, the variation in film thickness for the coating start end can be reduced, and a uniform coating film can be formed on the coating target.

本発明の塗布装置の基本構成を示す概略図Schematic showing the basic configuration of the coating apparatus of the present invention 実施例1における塗布工程を示す図The figure which shows the application | coating process in Example 1 実施例1におけるダミー板付近の挙動を示す図The figure which shows the behavior near the dummy board in Example 1. 実施例1における塗布膜の目視結果を示す図The figure which shows the visual result of the coating film in Example 1 実施例2におけるダミー板形状を示す上面図The top view which shows the dummy board shape in Example 2. 実施例3におけるダミー板形状を示す上面、断面図The upper surface and sectional view showing the dummy plate shape in Example 3 実施例4におけるダミー板形状を示す断面図Sectional drawing which shows the dummy plate shape in Example 4 実施例5におけるダミー板形状を示す断面図Sectional drawing which shows the dummy plate shape in Example 5 従来のダイコート法を示す図Diagram showing conventional die coating method 特許文献1における塗布装置の基本動作を示す図The figure which shows the basic operation | movement of the coating device in patent document 1 特許文献2の従来の多孔質塗布法を示す図The figure which shows the conventional porous coating method of patent document 2 多孔質塗布法に特許文献1のダミー板を適用した場合を示す図The figure which shows the case where the dummy board of patent document 1 is applied to the porous coating method

本発明の塗布装置の構成について、図1を用いて説明する。   The structure of the coating apparatus of this invention is demonstrated using FIG.

図1は、本発明の塗布装置の基本構成を示す概略図である。本発明の塗布装置は、塗布液を多孔質材2へ定量に送る液供給ノズル4と、塗布対象物である基板7を保持し、多孔質材2と相対的に移動可能にする搬送機構(図示せず)と、多孔質材2と基板7とを接触可能とする上下駆動機構(図示せず)を有し、基板7の塗布始端部にダミー板6を配置する機構を有している。   FIG. 1 is a schematic view showing the basic configuration of the coating apparatus of the present invention. The coating apparatus of the present invention holds a liquid supply nozzle 4 that sends a coating liquid to the porous material 2 in a fixed amount and a substrate 7 that is an application target, and a transport mechanism (movable relative to the porous material 2). (Not shown), and a vertical drive mechanism (not shown) that enables the porous material 2 and the substrate 7 to be in contact with each other, and a mechanism for disposing the dummy plate 6 at the coating start end of the substrate 7. .

以下に、これらの構成部材について詳述する。本発明の塗布装置は、塗布幅以上の幅を有する2枚のSUSやAl等の金属プレート1の間に多孔質材2が挟まれた構成である。この状態で、ポンプ3により所定の速度で塗布液5を液供給ノズル4へ供給し、液供給ノズル4を介して塗布液5が多孔質材2上面に供給される。   Below, these structural members are explained in full detail. The coating apparatus of the present invention has a configuration in which a porous material 2 is sandwiched between two metal plates 1 such as SUS and Al having a width equal to or larger than the coating width. In this state, the coating liquid 5 is supplied to the liquid supply nozzle 4 at a predetermined speed by the pump 3, and the coating liquid 5 is supplied to the upper surface of the porous material 2 through the liquid supply nozzle 4.

多孔質材2に供給された塗布液5は、多孔質材2全体へ浸透する。また、基板7は搬送ステージ8へ固定された状態で多孔質材2と当接し、当接した状態を維持したまま、相対移動することが可能である。基板7の塗布開始部にはダミー板6が設置されている。多孔質材2は一旦、ダミー板6へ当接し、そのままダミー板6と基板7が多孔質材2と相対移動する。多孔質材2は、ダミー板6から基板7へ移動するものである。   The coating liquid 5 supplied to the porous material 2 penetrates into the entire porous material 2. Further, the substrate 7 is in contact with the porous material 2 in a state of being fixed to the transfer stage 8, and can be relatively moved while maintaining the contacted state. A dummy plate 6 is installed at the application start portion of the substrate 7. The porous material 2 once comes into contact with the dummy plate 6, and the dummy plate 6 and the substrate 7 move relative to the porous material 2 as they are. The porous material 2 moves from the dummy plate 6 to the substrate 7.

図1では、このダミー板6は、基板7を固定する搬送ステージ8に固定され、基板7と同期して移動することを示す。但し、それに限られたものではない。例えば、塗布ノズルに固定、もしくは、全く別の箇所に固定する形態でも良い。   In FIG. 1, the dummy plate 6 is fixed to the transfer stage 8 that fixes the substrate 7, and moves in synchronization with the substrate 7. However, it is not limited to that. For example, it may be fixed to the application nozzle or fixed to a completely different location.

更に具体的な装置の動作を、実施例として、図面を用いて説明する。   More specific operation of the apparatus will be described as an example with reference to the drawings.

(実施例1)
図1で説明した塗布装置の塗布動作を、図2を参照しながら説明する。
(Example 1)
The coating operation of the coating apparatus described in FIG. 1 will be described with reference to FIG.

まず減圧吸着方式、静電吸着方式、物理的固定などにより、搬送/塗布によりズレない程度に搬送ステージ8に基板7を固定し、多孔質材2の下方へ移動する(図2(a))。   First, the substrate 7 is fixed to the transfer stage 8 by a reduced pressure adsorption method, an electrostatic adsorption method, physical fixation, etc. so as not to be displaced by conveyance / application, and is moved below the porous material 2 (FIG. 2A). .

次に基板7の塗布開始位置上に、ダミー板6が配置される(図2(b))。そして、多孔質材2の上下駆動機構(図示せず)により、多孔質材2とダミー板6との距離を狭くし、多孔質材2の先端をダミー板6の表面に当接する。   Next, the dummy plate 6 is disposed on the application start position of the substrate 7 (FIG. 2B). Then, the distance between the porous material 2 and the dummy plate 6 is reduced by the vertical drive mechanism (not shown) of the porous material 2, and the tip of the porous material 2 is brought into contact with the surface of the dummy plate 6.

ここで、多孔質材2の先端では塗布液だまり9が発生する(図2(c))。その状態で多孔質材2と基板7とを相対的に移動させ、多孔質材2がダミー板6から基板7上へ移動する(図2(d))。そのまま相対移動が継続されることで、基板7上に塗布膜10が形成される。   Here, a coating liquid pool 9 is generated at the tip of the porous material 2 (FIG. 2C). In this state, the porous material 2 and the substrate 7 are relatively moved, and the porous material 2 is moved from the dummy plate 6 onto the substrate 7 (FIG. 2D). The coating film 10 is formed on the substrate 7 by continuing the relative movement as it is.

そして、塗布終了位置まで多孔質材2が相対移動したら、多孔質材を基板7から離間させ、塗布動作を終了する(図2(e)〜(g))。ここで、図2(e)のように、多孔質材2がダミー板6を通過し基板7上に移動した時点で、ダミー板6が基板7から遠ざかる方向に移動する機構を付加しておくことで、ダミー板6と基板7との間に塗布液が入り込む不具合を防ぐ効果がある。   When the porous material 2 is relatively moved to the application end position, the porous material is separated from the substrate 7 and the application operation is completed (FIGS. 2E to 2G). Here, as shown in FIG. 2 (e), when the porous material 2 passes through the dummy plate 6 and moves onto the substrate 7, a mechanism for moving the dummy plate 6 away from the substrate 7 is added. Thus, there is an effect of preventing a problem that the coating liquid enters between the dummy plate 6 and the substrate 7.

上記課題で述べた通り、液だまりの引きずりを解決するために、塗布方向に向かってダミー板6の上面は基板7の表面に対して遠ざかる方向に配置されていることが望ましい。これにより、多孔質材2の余分な液をかきとる効果があり、液だまり9を基板7上へ引きずることを防止する効果がある。更に、ダミー板6上へ残った液だまり9が基板7上へ流れ落ちるのを防ぐ効果もある。   As described in the above problem, it is desirable that the upper surface of the dummy plate 6 is disposed in a direction away from the surface of the substrate 7 in the application direction in order to solve the dragging of the liquid pool. This has the effect of scraping off excess liquid from the porous material 2 and the effect of preventing the liquid pool 9 from being dragged onto the substrate 7. Furthermore, there is an effect of preventing the liquid pool 9 remaining on the dummy plate 6 from flowing down onto the substrate 7.

更に上記動作で説明した図2(d)前後の多孔質材2の先端とダミー板6の先端の状態について、図3を用いて詳述する。   Further, the state of the tip of the porous material 2 and the tip of the dummy plate 6 before and after FIG. 2 (d) described in the above operation will be described in detail with reference to FIG.

図3(a)のように、一旦、ダミー板6に当接した多孔質材2の先端から染み出た塗布液の液だまり9は、多孔質材2の先端が相対移動すると、ダミー板6の上面が高くなっている分だけ多孔質材2の先端は更に圧縮され液が染み出す(図3(b))。   As shown in FIG. 3A, the liquid pool 9 of the coating liquid that has once oozed out from the tip of the porous material 2 that has been in contact with the dummy plate 6 moves to the dummy plate 6 when the tip of the porous material 2 relatively moves. The tip of the porous material 2 is further compressed by the height of the upper surface of, so that the liquid oozes out (FIG. 3B).

次に、ダミー板6から基板7上に多孔質材2の先端が移動する際、図中A部において多孔質材2の圧縮量が緩和する(図3(c))。つまり、多孔質材の圧縮量緩和により多孔質材がダミー板6の極先端部における過剰な液を吸収する作用が働き、多孔質材2の先端が基板7に接するときには、液だまり9を基板7上に引きずることを防止する。これにより塗布ムラが解消する効果を発揮する。   Next, when the tip of the porous material 2 moves from the dummy plate 6 onto the substrate 7, the amount of compression of the porous material 2 is relaxed at the portion A in the figure (FIG. 3C). That is, the porous material absorbs excess liquid at the extreme tip of the dummy plate 6 due to relaxation of the compression amount of the porous material, and when the tip of the porous material 2 comes into contact with the substrate 7, the liquid pool 9 is formed on the substrate. 7 Prevents dragging up. This demonstrates the effect of eliminating coating unevenness.

ここで本実施例では、多孔質材2と基板7との位置関係を、多孔質材2が上側、基板7が下側に配置した形態を示したが、それに限られるものではない。   In the present embodiment, the positional relationship between the porous material 2 and the substrate 7 is shown as the porous material 2 on the upper side and the substrate 7 on the lower side. However, the present invention is not limited to this.

更にここで上述した効果を更に発揮させるために、多孔質材2がダミー板6から基板7へ移動するときに、多孔質材2の高さを可変させることも有効である。   In order to further exhibit the above-described effects, it is also effective to vary the height of the porous material 2 when the porous material 2 moves from the dummy plate 6 to the substrate 7.

或いは、多孔質材2とダミー板6および基板7との相対移動の速度を可変させることも有効である。具体的には、多孔質材2がダミー板6から基板7へ移動するときに、多孔質材2の高さをわずかに高くなるように移動し、移動速度を緩めた。これは、使用する塗布液の粘度、表面張力などによっても異なるため、装置上可変できる機構を設けておくことが望ましい。   Alternatively, it is also effective to vary the speed of relative movement between the porous material 2 and the dummy plate 6 and the substrate 7. Specifically, when the porous material 2 moved from the dummy plate 6 to the substrate 7, the height of the porous material 2 was moved slightly higher, and the moving speed was reduced. Since this varies depending on the viscosity and surface tension of the coating solution used, it is desirable to provide a mechanism that can be varied on the apparatus.

更にダミー板6の詳細な説明をする。本実施例では、塗布液として塗布すれば反射防止膜となり得る材料を用いた。具体的には、溶媒90〜98%、膜となりうる固形分:2〜10%である溶液を使用し、粘度:1〜10mPa・sの低粘度溶液を使用した。   Further, the dummy plate 6 will be described in detail. In this embodiment, a material that can be used as an antireflection film when applied as a coating solution is used. Specifically, a solution having a solvent content of 90 to 98% and a solid content capable of forming a film: 2 to 10% was used, and a low viscosity solution having a viscosity of 1 to 10 mPa · s was used.

また多孔質材として、メラミン樹脂やウレタン樹脂などの発泡体材料を用いた。この溶液を用いた場合、上述した効果を得るためのダミー板6の形状について、塗布膜の目視確認により実験的に最適な数値を求めた。その結果を図4に示す。   Moreover, foam materials, such as a melamine resin and a urethane resin, were used as a porous material. When this solution was used, an optimal numerical value was experimentally obtained by visual confirmation of the coating film for the shape of the dummy plate 6 for obtaining the above-described effect. The result is shown in FIG.

まずダミー板6の上面において、多孔質材2が当接する箇所から基板7へ移動するまでの距離(図2中のA)は、実験より5mm以上必要であり、望ましくは10mm以上必要という結果が得られた。また長い方がより基板7上へ形成される塗布膜厚が安定しやすいが、長すぎると設備が大きくなる、また材料のロスが多くなるといった問題も発生するため、可能な限り短いほうが望ましい。
また、塗布方向に向かってダミー板6の上面が基板7の表面に対して遠ざかる方向に配置したが、このダミー板6の上面と基板7の表面が成す角度(図2中のB)は、実験結果より0°より大きく15°以下が望ましい。0°では上述した効果が得られにくく、15°より大きいと、多孔質材2から必要以上に塗布液を染み出させるため、基板7上に形成される塗布膜にかすれにより、スジムラという別の不具合が発生するためである。
First, on the upper surface of the dummy plate 6, the distance (A in FIG. 2) from the position where the porous material 2 abuts to the substrate 7 is required to be 5 mm or more, preferably 10 mm or more from the experiment. Obtained. Further, the coating film formed on the substrate 7 tends to be more stable when the length is longer, but if it is too long, there are problems that the equipment becomes larger and the material loss increases.
Further, although the upper surface of the dummy plate 6 is arranged in a direction away from the surface of the substrate 7 in the coating direction, the angle (B in FIG. 2) formed by the upper surface of the dummy plate 6 and the surface of the substrate 7 is From the experimental results, it is desirable that the angle is greater than 0 ° and 15 ° or less. The effect described above is difficult to obtain at 0 °, and if it is larger than 15 °, the coating liquid is oozed out from the porous material 2 more than necessary. This is because a problem occurs.

次に、ダミー板6の上面の先端と基板7の表面との高さ、つまり、多孔質材2の先端がダミー板6から基板7へ移動するときに落ちる高さ(図2中のC)について述べる。   Next, the height between the tip of the upper surface of the dummy plate 6 and the surface of the substrate 7, that is, the height that falls when the tip of the porous material 2 moves from the dummy plate 6 to the substrate 7 (C in FIG. 2). Is described.

上記A、Bを固定した状態でダミー板6の厚みを変更することによりCの高さを変更した場合の塗布膜の目視確認を実施した。その結果、ダミー板6の上面の先端と基板7の表面との高さ(C)は、0.5mm以上、1.5mm以下が望ましい。0.5mmより小さいと上述した効果が得られにくいためと推測する。   Visual confirmation of the coating film in the case where the height of C was changed by changing the thickness of the dummy plate 6 with the above A and B fixed. As a result, the height (C) between the tip of the upper surface of the dummy plate 6 and the surface of the substrate 7 is preferably 0.5 mm or more and 1.5 mm or less. If it is smaller than 0.5 mm, it is presumed that the above-described effects are hardly obtained.

また1.5mmより大きいと、多孔質材2の先端がダミー板6から基板7上へ移動する際、多孔質材2の先端と基板7との間に気泡がかみ込まれることによるムラが発生するためと考える。   On the other hand, when the diameter is larger than 1.5 mm, unevenness occurs due to air bubbles being caught between the tip of the porous material 2 and the substrate 7 when the tip of the porous material 2 moves from the dummy plate 6 onto the substrate 7. I think to do.

(実施例2)
次にダミー板の形状に関する内容を説明する。前述した図3において、図3(c)〜図3(d)において、多孔質材2の先端が基板7に接触する際、塗布幅方向に同時に接触すると、幅方向の何れかの場所で、多孔質材2の先端と基板7との間で気泡を巻き込むことが考えられる。このような状態となると、気泡を巻き込んだまま塗布することになり、塗布ムラの発生が懸念されることになる。
(Example 2)
Next, the contents relating to the shape of the dummy plate will be described. In FIG. 3 described above, when the tip of the porous material 2 is in contact with the substrate 7 in FIGS. 3 (c) to 3 (d), if it is simultaneously contacted in the coating width direction, in any place in the width direction, It is conceivable that bubbles are involved between the tip of the porous material 2 and the substrate 7. If it becomes such a state, it will apply | coating with a bubble being involved, and generation | occurrence | production of an application | coating unevenness will be anxious.

その問題は、以下に示す装置構成にすることで解消できる。図は、基板7、多孔質材2の先端、ダミー板6の位置関係を上面から見た略図である。
This problem can be solved by using the following apparatus configuration. FIG. 5 is a schematic view of the positional relationship between the substrate 7, the tip of the porous material 2, and the dummy plate 6 as viewed from above.

多孔質材2の先端と基板7の相対移動方向に対し、多孔質材2の先端と基板7は垂直方向に設置し、例えば、図5(a),(b)に示すように、ダミー板6の先端は所定の角度を有して設置した。そのことにより、多孔質材2の先端と基板7とが幅方向に同時に接触するのを防ぎ、幅方向に時間差を有して接することができる。この結果、多孔質材2の先端と基板7との間に気泡を巻き込むことを防ぐ効果が得られる。更に、多孔質材2の先端と基板7の相対速度を緩めることで、上記効果を更に高めることが可能となる。   The tip of the porous material 2 and the substrate 7 are installed in the vertical direction with respect to the relative movement direction of the tip of the porous material 2 and the substrate 7. For example, as shown in FIGS. 5A and 5B, a dummy plate The tip of 6 was installed with a predetermined angle. As a result, the tip of the porous material 2 and the substrate 7 can be prevented from contacting simultaneously in the width direction, and can be contacted with a time difference in the width direction. As a result, an effect of preventing entrainment of bubbles between the tip of the porous material 2 and the substrate 7 can be obtained. Furthermore, by relaxing the relative speed between the tip of the porous material 2 and the substrate 7, the above effect can be further enhanced.

ここで、ダミー板6の先端と多孔質材2の先端との角度(図5中のD)は、多孔質材2の材質、塗布液の粘度などによっても異なるため限定するものではない。しかしながら、当該角度が大きいと、基板7上へ形成される塗布膜の始端部分が傾いた形状になるため、最終的には商品形状から許される範囲で傾ける必要がある。   Here, the angle between the tip of the dummy plate 6 and the tip of the porous material 2 (D in FIG. 5) is not limited because it varies depending on the material of the porous material 2, the viscosity of the coating solution, and the like. However, if the angle is large, the starting end portion of the coating film formed on the substrate 7 has a tilted shape, so that it is necessary to finally tilt the product film within the allowable range.

(実施例3)
次にダミー板の形状について説明する。図6(a)は上面図、図6(b)は図6(a)のXX‘断面図を示す。
(Example 3)
Next, the shape of the dummy plate will be described . 6 (a) is a top view, FIG. 6 (b) shows a XX 'cross-sectional view of FIGS. 6 (a).

実施例1,2で述べたように、多孔質材2の先端とダミー板6とが接触する箇所では、塗布液が染み出し、液だまりが発生する。しかし量産を考えると、毎回、ダミー板6を洗浄することはタクトや洗浄に必要な部材/溶剤などロスが多く、コストが高くなる。そこで、ダミー板6の表面に発生した液だまりを容易に除去するために、ダミー板6に不必要な液を除去する機構を設けた。その一例を、図6を用いて説明する。   As described in the first and second embodiments, the coating liquid oozes out and a liquid pool is generated at a portion where the tip of the porous material 2 and the dummy plate 6 are in contact with each other. However, in consideration of mass production, cleaning the dummy plate 6 each time has a lot of loss such as tact and member / solvent necessary for cleaning, and the cost becomes high. Therefore, in order to easily remove the liquid pool generated on the surface of the dummy plate 6, a mechanism for removing unnecessary liquid from the dummy plate 6 is provided. An example thereof will be described with reference to FIG.

ダミー板6の多孔質材2の先端が接触する箇所11より更に上流側(多孔質材2の先端が相対移動する方向の逆側)に、発生した液だまりがたまる溝12を設けた。また、この溝12から液回収タンク(図示せず)に接続された液回収口14まで液が流れ易いような誘導溝13を設置した。   A groove 12 in which the generated liquid pool is accumulated is provided on the upstream side (the opposite side to the direction in which the tip of the porous material 2 relatively moves) from the portion 11 where the tip of the porous material 2 of the dummy plate 6 contacts. In addition, a guide groove 13 is provided so that the liquid can easily flow from the groove 12 to a liquid recovery port 14 connected to a liquid recovery tank (not shown).

ここで、溝12は塗布幅(多孔質材2の幅)より長い長さにすることが望ましく、より液が溝へ流れやすくするために、溝の端部15は傾斜を持たせることが望ましい。また溝の底面16についても、液が誘導溝へ流れやすくするために、誘導溝付近が低くなるような形状にすることが望ましい。ここで、誘導溝13、液回収口の形状、個数は、特に限定するものではない。   Here, the groove 12 is desirably longer than the coating width (the width of the porous material 2), and the end 15 of the groove is preferably inclined so that the liquid can easily flow into the groove. . Also, the bottom surface 16 of the groove is desirably shaped so that the vicinity of the guide groove is lowered so that the liquid can easily flow into the guide groove. Here, the shape and number of the guide groove 13 and the liquid recovery port are not particularly limited.

更に多孔質材2の先端がダミー板6から基板7へ移動する際、多孔質材の先端の磨耗を低減するために、ダミー板6の極先端WはR加工した方が望ましい。   Further, when the tip of the porous material 2 moves from the dummy plate 6 to the substrate 7, it is desirable that the pole tip W of the dummy plate 6 is R-processed in order to reduce wear of the tip of the porous material.

(実施例4)
次にダミー板6の先端の表面処理について説明する。図7は、本実施例で用いたダミー板6の断面図を示す。ダミー板6の上面において、多孔質材2の先端が当接する箇所11より上流側に塗布液を弾く撥水膜17を形成することで、実施例3で説明した過剰な液が溝12へ流れ易くする効果が得られる。
Example 4
Next, the surface treatment of the tip of the dummy plate 6 will be described. FIG. 7 shows a cross-sectional view of the dummy plate 6 used in this embodiment. By forming the water repellent film 17 that repels the coating liquid on the upper surface of the dummy plate 6 upstream of the portion 11 where the tip of the porous material 2 abuts, the excess liquid described in the third embodiment flows into the groove 12. The effect which makes it easy is acquired.

また、ダミー板6の下面において、基板側に塗布液を弾く撥水膜18を形成することにより、ダミー板6と基板7との間に形成される隙間に液が侵入することを防ぐことができ、更に、塗布始端の直線性を制御しやすくなる効果が得られる。   Further, by forming the water repellent film 18 that repels the coating liquid on the substrate side on the lower surface of the dummy plate 6, it is possible to prevent the liquid from entering the gap formed between the dummy plate 6 and the substrate 7. In addition, an effect of easily controlling the linearity of the coating start end can be obtained.

ここで、塗布液を弾く膜として本実施例で用いた膜として、DLC、窒化珪素、酸化珪素、炭化珪素から少なくとも一つの材質からなる膜を用いた。   Here, a film made of at least one material of DLC, silicon nitride, silicon oxide, and silicon carbide was used as the film used in this example as a film for repelling the coating liquid.

(実施例5)
上で述べたダミー板の効果は、色々な形状でも発揮することが可能である。図8(a)〜(c)にダミー板先端の形状例図を示す。このような形状でも同様な効果が得られる。ここで必要な要素は、ダミー板6の上面の角度、高さ、長さが実施例1で述べた内容であれば形状は特に限定されるものではない。
(Example 5)
The effect of the dummy plate described above can be exhibited in various shapes. FIGS. 8A to 8C show examples of the shape of the tip of the dummy plate. A similar effect can be obtained with such a shape. The necessary elements are not particularly limited as long as the angle, height, and length of the upper surface of the dummy plate 6 are the same as those described in the first embodiment.

本発明の塗布装置および塗布方法は、太陽電池、ディスプレイなどの基板へ、反射防止膜、波長調整膜などの機能性膜を塗布するのに利用することができる。   The coating apparatus and coating method of the present invention can be used for coating functional films such as antireflection films and wavelength adjusting films on substrates such as solar cells and displays.

1 金属プレート
2,112 多孔質材
3 ポンプ
4 液供給ノズル
5,114 塗布液
6,117 ダミー板
7,111 基板
8 搬送ステージ
10 塗布膜
12 溝
14 液回収口
17,18 撥水膜
DESCRIPTION OF SYMBOLS 1 Metal plate 2,112 Porous material 3 Pump 4 Liquid supply nozzle 5,114 Coating liquid 6,117 Dummy plate 7,111 Substrate 8 Transfer stage 10 Coating film 12 Groove 14 Liquid collection port 17, 18 Water repellent film

Claims (7)

基板を載置する基板保持台と、
前記基板の表面に塗布液を塗布する多孔質材と、
前記多孔質材に前記塗布液を供給する液供給機構と、
前記基板保持台と前記多孔質材とを相対的に移動可能とする搬送機構と、
前記多孔質材と前記基板とを接触可能とする上下駆動機構と、
前記多孔質材と接触し前記基板の外周に配置され、前記基板の端部表面の一部を覆うダミー板と、で構成され、
前記ダミー板は、前記基板保持台のうち基板が載置される表面に対して、前記基板保持台の外側に傾斜して配置されること、
を特徴とする塗布装置。
A substrate holder on which the substrate is placed;
A porous material for applying a coating solution to the surface of the substrate;
A liquid supply mechanism for supplying the coating liquid to the porous material;
A transport mechanism capable of relatively moving the substrate holding table and the porous material;
An up-and-down drive mechanism capable of contacting the porous material and the substrate;
A dummy plate that is in contact with the porous material and disposed on the outer periphery of the substrate, and covers a part of the end surface of the substrate;
The dummy plate is disposed to be inclined to the outside of the substrate holding table with respect to a surface on which the substrate is placed in the substrate holding table;
An applicator characterized by.
前記ダミー板の表面には、前記多孔質材と接触する箇所より上流側に、過剰な塗布液を流す溝設けられた、請求項1記載の塗布装置。 The coating apparatus according to claim 1, wherein a groove for allowing an excessive coating liquid to flow is provided on the surface of the dummy plate upstream of a position in contact with the porous material. 前記ダミー板は、先端部分にR加工が施された、請求項1または2に記載の塗布装置。 The dummy plate, R processing was facilities in the tip section, coating apparatus according to claim 1 or 2. 前記ダミー板の上面には、前記多孔質材と接触する箇所より上流側に、塗布液弾く膜コーティングされた、請求項1〜3の何れか一項に記載の塗布装置。 The coating apparatus according to any one of claims 1 to 3, wherein a film that repels the coating liquid is coated on an upper surface of the dummy plate upstream of a position in contact with the porous material. 前記ダミー板の下面の一部には、塗布液弾く膜コーティングされた、請求項1〜4の何れか一項に記載の塗布装置。 The coating apparatus according to claim 1 , wherein a part of the lower surface of the dummy plate is coated with a film that repels a coating liquid. 多孔質材に塗布液を浸透させ、前記多孔質材を基板の表面に接触させることで前記塗布液を塗布する塗布方法であって、
前記基板の塗布開始部において、前記基板の一部を覆い前記基板の外側に向かって傾斜したダミー板を前記基板の外周に設置し、前記多孔質材を前記ダミー板に接触させた状態で、前記多孔質材と前記基板とを一方向に相対移動させることで、前記基板の表面に前記塗布液を塗布すること、
を特徴とする塗布方法。
An application method for applying the coating liquid by infiltrating a coating liquid into a porous material and bringing the porous material into contact with the surface of a substrate,
In the application start part of the substrate, a dummy plate that covers a part of the substrate and is inclined toward the outside of the substrate is installed on the outer periphery of the substrate, and the porous material is in contact with the dummy plate, Applying the coating liquid on the surface of the substrate by relatively moving the porous material and the substrate in one direction;
A coating method characterized by the above.
前記ダミー板を前記多孔質材が通過した直後から、前記ダミー板を前記基板から離間させる、請求項6記載の塗布方法。 The coating method according to claim 6, wherein the dummy plate is separated from the substrate immediately after the porous material passes through the dummy plate.
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