JP5830668B2 - Light emitting device and light source for illumination - Google Patents

Description

  The present invention relates to a substrate, a light emitting device, a light source for illumination, and a method for manufacturing the substrate, and in particular, a substrate for mounting a light emitting diode (LED), a method for manufacturing the same, and a light emitting device using the substrate. And a light source for illumination.

  LEDs are expected to be a light source (LED light source) for various products because of their high efficiency and long life. For example, research and development of LED lamps using LEDs as light sources are being promoted.

  Examples of the LED lamp include a bulb-type LED lamp (LED bulb) that replaces a bulb-type fluorescent lamp and an incandescent bulb, a straight-tube LED lamp that substitutes for a straight-tube fluorescent lamp, and the like. For example, Patent Document 1 discloses a conventional bulb-type LED lamp. Patent Document 2 discloses a conventional straight tube LED lamp.

  In the LED lamp, an LED module (light emitting device) configured by mounting a plurality of LEDs on a substrate is used as a light source.

JP 2006-313717 A JP 2009-043447 A

  In recent years, a light bulb-type LED lamp having a configuration in which a light distribution characteristic and an appearance are similar to an incandescent bulb has been studied. For example, a bulb-type LED lamp having a configuration in which an LED module is held in a hollow state at a central position in the globe using a globe (glass bulb) used in an incandescent bulb has been proposed. More specifically, a configuration in which the LED module is fixed to the top of the column using a column (stem) extending from the globe opening toward the center of the globe is considered. In this case, in order to make the light distribution characteristics close to those of an incandescent light bulb, it is preferable to use a double-sided light emitting LED module that emits light to both the top side and the base side of the globe.

  In order to construct a double-sided light emitting LED module, there is a method of mounting LEDs on both sides of a substrate. Thereby, light can be emitted from both the front surface and the back surface of the substrate.

  However, in order to mount the LED on both sides of the substrate, complicated manufacturing equipment is required, and there is a problem that the manufacturing cost increases. Therefore, a method of using two substrates on which LEDs are mounted only on one side and bonding the back surfaces of the substrates together is also conceivable. However, in this case, since two substrates are required, there is a problem that the material cost increases.

  Further, as another method for constructing a double-sided light emitting LED module, a method of mounting an LED only on one surface of the substrate using a substrate having a high light transmittance such as a transparent substrate (for example, a substantially transparent substrate). is there. In this case, the light emitted from the LED is emitted to the outside from the surface (front surface) on which the LED is mounted, and also from the surface (back surface) opposite to the surface on which the LED is mounted through the substrate. Released.

  However, the higher the light transmittance, the higher the light transmittance of the substrate, the more expensive the substrate. On the other hand, the lower the light transmittance, the smaller the amount of light emitted from the back surface of the substrate to the outside. There is a problem that a sufficient amount of light cannot be obtained.

  The present invention has been made to solve such a problem, and even when a substrate having low light transmittance such as a white substrate is used, the light emitting element is mounted on the side opposite to the mounting surface. Another object of the present invention is to provide a substrate, a light emitting device, a light source for illumination, and a method for manufacturing the substrate, which can obtain a sufficient amount of light.

  In order to achieve the above object, one embodiment of a substrate according to the present invention is a substrate on which a light-emitting element is mounted. The substrate has translucency and is a surface on which the light-emitting element is mounted. An uneven surface is provided on the opposite surface, and the uneven portion is formed at a position facing the light emitting element to be mounted.

  Further, in one embodiment of the substrate according to the present invention, the substrate is a polycrystalline ceramic substrate formed by combining a plurality of crystal grains, and the surface shape of the exposed surface of the concavo-convex portion is the surface of the plurality of crystal grains. It is good also as a shape.

  One embodiment of the light-emitting device according to the present invention includes a light-transmitting substrate and a light-emitting element mounted on the first main surface of the substrate, and the substrate has a surface on which the light-emitting element is mounted. It has a concavo-convex part on the opposite surface, and the concavo-convex part is formed at a position facing the light emitting element.

  In one embodiment of the light emitting device according to the present invention, the substrate is a polycrystalline ceramic substrate formed by combining a plurality of crystal grains, and the surface shape of the concavo-convex portion is the surface shape of the plurality of crystal grains. There may be.

  Moreover, the one aspect | mode of the light-emitting device which concerns on this invention WHEREIN: Furthermore, it is good also as providing the sealing member which seals the said light emitting element while containing a wavelength conversion material.

  Moreover, the one aspect | mode of the light-emitting device which concerns on this invention WHEREIN: Furthermore, it is good also as providing the wavelength conversion member formed so that it might overlap with the said uneven | corrugated | grooved part while containing a wavelength conversion material.

  Moreover, the one aspect | mode of the light-emitting device which concerns on this invention WHEREIN: The said uneven | corrugated | grooved part is good also as being formed so that it may not protrude from the said wavelength conversion member.

  An aspect of the light source for illumination according to the present invention includes any of the light-emitting devices described above and a heat radiator connected to the light-emitting device, and the heat radiator is the substrate in the substrate of the light-emitting device. It is connected to the surface opposite to the surface on which the light emitting element is mounted, and the uneven portion is not formed on the connection surface between the heat radiator and the substrate.

  Moreover, the aspect of the light source for illumination according to the present invention further includes a globe that covers the light emitting device, and the heat radiator is provided to extend inward of the globe and supports the light emitting device. It may be a support.

  An embodiment of a method for manufacturing a substrate according to the present invention is a method for manufacturing a substrate on which a light emitting element is mounted, wherein the substrate is a light-transmitting polycrystalline ceramic substrate, and a predetermined region of the substrate. Is etched with an acid to form a concavo-convex portion on a surface opposite to the surface on which the light-emitting element is mounted and at a position facing the light-emitting element.

  According to the present invention, even when a substrate having a low light transmittance such as a white substrate is used, a sufficient amount of light can be obtained from the surface opposite to the surface on which the light emitting element is mounted.

FIG. 1A is a plan view of a light-emitting device using a substrate according to Embodiment 1 of the present invention, and FIG. 1B is the same light-emitting device taken along line XX ′ of FIG. FIG. 1C is a cross-sectional view of the light emitting device taken along line YY ′ of FIG. FIG. 2 is an enlarged cross-sectional view around the LED (LED chip) in the light-emitting device according to Embodiment 1 of the present invention. FIG. 3 is an enlarged cross-sectional view of a main part of the light emitting device according to Embodiment 1 of the present invention. FIG. 4A is a surface SEM image of the substrate when the surface of the unbaked polycrystalline ceramic substrate is etched. FIG. 4B is a surface SEM image of the substrate when etching is performed after the surface of the polycrystalline ceramic substrate is shaved to adjust the thickness. FIG. 5 is a diagram for explaining a method for measuring the transmittance of the translucent substrate. FIG. 6 is a view for explaining the relationship between the etching time and the light transmission amount in the polycrystalline ceramic substrate of FIG. 4A. FIG. 7A is a plan view of the light-emitting device according to Embodiment 2 of the present invention, and FIG. 7B is a cross-sectional view of the light-emitting device taken along line XX ′ in FIG. FIG. 7C is a cross-sectional view of the light emitting device taken along line YY ′ of FIG. FIG. 8 is a cross-sectional view of a light emitting device according to a modification of the second embodiment of the present invention. FIG. 9 is a cross-sectional view of a light bulb shaped LED lamp according to Embodiment 3 of the present invention. FIG. 10A is a plan view of the light-emitting device according to Embodiment 3 of the present invention, and FIG. 10B is a cross-sectional view of the light-emitting device taken along line XX ′ in FIG. FIG. 10C is a cross-sectional view of the light emitting device taken along the line YY ′ in FIG. 10A, and FIG. 10D is the same taken along the line ZZ ′ in FIG. It is sectional drawing of a light-emitting device. FIG. 11 is a cross-sectional view of a lighting apparatus according to Embodiment 4 of the present invention.

  Hereinafter, a substrate, a light emitting device, an illumination light source, a method for manufacturing the substrate, and the like according to embodiments of the present invention will be described with reference to the drawings. Note that each of the embodiments described below shows a preferred specific example of the present invention. Therefore, the numerical values, shapes, materials, components, component arrangement positions, connection forms, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims showing the highest concept of the present invention are described as optional constituent elements.

  Each figure is a schematic diagram and is not necessarily illustrated strictly. Moreover, in each figure, the same code | symbol is attached | subjected about the same structural member.

(Embodiment 1)
Hereinafter, configurations of the substrate 10 and the light emitting device 1 according to Embodiment 1 of the present invention will be described with reference to FIGS. 1 and 2. 1A and 1B are diagrams showing a configuration of a light-emitting device using a substrate according to Embodiment 1 of the present invention, in which FIG. 1A is a plan view and FIG. 1B is an X-axis in FIG. A sectional view taken along line X ′, and FIG. 1C is a sectional view taken along line YY ′ of FIG. FIG. 2 is an enlarged cross-sectional view around the LED (LED chip) in the light-emitting device according to Embodiment 1 of the present invention.

  The light emitting device 1 in the present embodiment is a light emitting module having a light emitting element, and emits light of a predetermined color (wavelength). The light-emitting device 1 in this Embodiment is an LED module comprised by LED.

  As shown in FIG. 1A to FIG. 1C, the light emitting device 1 includes a substrate 10 and an LED 20. The light emitting device 1 further includes a sealing member 30, a metal wiring 40, a wire 50, and terminals 60a and 60b. The light emitting device 1 in the present embodiment has a COB (Chip On Board) structure in which a bare chip is directly mounted on the substrate 10.

  Hereinafter, each component of the light emitting device 1 will be described in detail.

(substrate)
The substrate 10 is a light emitting element mounting substrate for mounting a light emitting element, and is a first main surface 10a (front side surface) on which the LED 20 is mounted, and a surface facing the first main surface 10a. It has a certain second main surface 10b (back side surface). As shown to Fig.1 (a), the board | substrate 10 can use the rectangular thing of a rectangular shape by planar view, for example. In addition, the planar view shape of the substrate 10 is not limited to a rectangle, and other shapes such as a square or a circle can be used.

  The substrate 10 is a light transmissive substrate having light transmissive properties. The substrate 10 in the present embodiment is a substrate having a low light transmittance with respect to the light emitted from the LED 20, for example, a substrate having a total transmittance of 10% or less. As such a substrate 10, a white alumina substrate made of ceramic such as alumina or a resin substrate made of resin such as glass epoxy resin can be used.

  In the present embodiment, a polycrystalline alumina substrate (polycrystalline ceramic substrate) having a thickness of about 1 mm configured by firing alumina particles (ceramic particles) is used as the substrate 10. For example, a white alumina substrate having a thickness of 1 mm and a light reflectance of 94%, or a white alumina substrate having a thickness of 0.635 mm and a light reflectance of 88% can be used.

  Thus, the cost of the substrate can be suppressed by using the substrate 10 having a low light transmittance. In particular, by using an inexpensive white substrate among ceramic substrates, cost reduction can be realized.

  The ceramic substrate can be produced by adding a binder to a mixture of a ceramic raw material such as alumina particles, a scatterer, and a sintering aid (additive), pressure forming, and then firing. The raw material alumina particles (ceramic particles) grow and crystallize by firing to become alumina crystal grains having a particle size of several μm to several tens of μm.

  Moreover, as shown in FIG.1 (b) and FIG.1 (c), the board | substrate 10 has the uneven | corrugated | grooved part 11 in the 2nd main surface 10b. The concavo-convex portion 11 has a fine concavo-convex structure and is formed at a position facing at least the LED 20. The uneven portion 11 in the present embodiment is formed corresponding to the region where the sealing member 30 is formed, and the region where the uneven portion 11 is formed and the region where the sealing member 30 is formed are the same. ing. That is, the uneven portions 11 are formed in four rows along the longitudinal direction of the substrate 10.

(LED)
The LED 20 is an example of a light emitting element, and is a semiconductor light emitting element that emits light with a predetermined power. The plurality of LEDs 20 are all the same, and are all bare chips that emit visible light of a single color. In this embodiment, a blue light emitting LED chip that emits blue light when energized is used. As the blue LED chip, for example, a gallium nitride based semiconductor light emitting device having a center wavelength of 440 nm to 470 nm, which is made of an InGaN based material, can be used.

  The LEDs 20 are mounted only on the first main surface 10 a of the substrate 10, and a plurality of LEDs 20 are mounted in a plurality of rows along the long side direction of the substrate 10. In the present embodiment, the element rows having a plurality of LEDs 20 in a row are arranged in four rows in parallel.

  In addition, in this Embodiment, although several LED20 was mounted, what is necessary is just to change suitably the mounting number of LED20 according to the use of the light-emitting device 1. FIG. For example, when used for a low-output type LED lamp that replaces a miniature bulb, the number of LEDs 20 may be one. On the other hand, when used for a high-output type LED lamp, the number of LEDs 20 mounted in one element array may be further increased. Moreover, the element row | line | column of LED20 is not restricted to 4 rows, It is good also as 1-3 rows, and good also as 5 rows or more.

  Here, the LED 20 used in the present embodiment will be described with reference to FIG. FIG. 2 is an enlarged cross-sectional view around the LED (LED chip) in the light-emitting device according to Embodiment 1 of the present invention.

  As shown in FIG. 2, the LED 20 includes a sapphire substrate 21 and a plurality of nitride semiconductor layers 22 that are stacked on the sapphire substrate 21 and have different compositions.

  A cathode electrode 23 and an anode electrode 24 are provided at both ends of the upper surface of the nitride semiconductor layer 22. Wire bond portions 25 and 26 are provided on the cathode electrode 23 and the anode electrode 24, respectively.

  In the LEDs 20 adjacent to each other, each of the cathode electrode 23 of one LED 20 and the anode electrode 24 of the other LED 20 is connected to the metal wiring 40 by a wire 50 by wire bonding. Note that the electrodes of adjacent LEDs 20 may be directly connected by the wire 50 without using the metal wiring 40. That is, a chip-to-chip connection may be used.

  Each LED 20 is mounted on the substrate 10 with a translucent chip bonding material 27 so that the surface on the sapphire substrate 21 side faces the first main surface 10 a of the substrate 10. For the chip bonding material 27, a silicone resin containing a filler made of metal oxide can be used. By using a translucent material for the chip bonding material 27, loss of light emitted from the side surface of the LED 20 can be reduced, and generation of shadows by the chip bonding material 27 can be suppressed.

(Sealing member)
The sealing member 30 is made of resin, for example, and is formed on the substrate 10 so as to cover the LEDs 20. As shown in FIGS. 1A and 1B, the sealing member 30 is formed in a long shape so as to collectively seal one row of the plurality of LEDs 20. In the present embodiment, since the element rows of the LEDs 20 are mounted in four rows, the four sealing members 30 are formed. Each of the four sealing members 30 is linearly provided on the first main surface 10a of the substrate 10 along the arrangement direction (column direction) of the plurality of LEDs 20.

  The sealing member 30 is mainly made of a translucent material. However, when it is necessary to convert the wavelength of the light of the LED 20 to a predetermined wavelength, the wavelength conversion material is mixed into the translucent material.

  Sealing member 30 in the present embodiment is a wavelength conversion member that includes a phosphor as a wavelength conversion material and converts the wavelength (color) of light emitted from LED 20. Such a sealing member 30 can be constituted by, for example, an insulating resin material (phosphor-containing resin) containing phosphor particles. The phosphor particles are excited by light emitted from the LED 20 and emit light of a desired color (wavelength).

  As a resin material constituting the sealing member 30, for example, a silicone resin can be used. Further, a light diffusing material may be dispersed in the sealing member 30. The sealing member 30 is not necessarily formed of a resin material, and may be formed of an inorganic material such as a low-melting glass or a sol-gel glass in addition to an organic material such as a fluorine-based resin.

  For example, when the LED 20 is a blue LED that emits blue light, for example, YAG-based yellow phosphor particles can be used as the phosphor particles contained in the sealing member 30 in order to obtain white light. Thereby, a part of the blue light emitted from the LED 20 is converted into yellow light by the yellow phosphor particles contained in the sealing member 30. Then, the blue light that has not been absorbed by the yellow phosphor particles and the yellow light that has been wavelength-converted by the yellow phosphor particles are diffused and mixed in the sealing member 30 so that the white light is emitted from the sealing member 30. And emitted. In addition, particles such as silica are used as the light diffusing material.

  The sealing member 30 in the present embodiment is a phosphor-containing resin in which predetermined phosphor particles are dispersed in a silicone resin, and is formed by applying and curing the first main surface 10a of the substrate 10 with a dispenser. be able to. In this case, as shown in FIG.1 (c), the shape in the cross section perpendicular | vertical to the longitudinal direction of the sealing member 30 becomes a substantially semicircle.

  In addition, you may form the sealing member 30 so that planar view may become a rectangular shape instead of linear shape. In this case, for example, the sealing member 30 may be formed so as to collectively seal all the LEDs 20 on the substrate 10. Alternatively, the sealing member 30 may be formed so as to individually cover each LED 20. In this case, the sealing member 30 can be formed in a substantially hemispherical shape, for example.

(Metal wiring)
The metal wiring 40 is a conductive wiring through which an electric current for causing the LED 20 to emit light flows, and is patterned in a predetermined shape on the first main surface 10a of the substrate 10 as shown in FIG. The power supplied to the light emitting device 1 is supplied to each LED 20 by the metal wiring 40.

  The metal wiring 40 is formed to connect a plurality of LEDs 20 in each LED element row in series. For example, the metal wiring 40 is formed in an island shape between adjacent LEDs. The metal wiring 40 is formed to connect the element rows in parallel. Each LED 20 is electrically connected to the metal wiring 40 via the wire 50.

  The metal wiring 40 can be formed, for example, by patterning or printing a metal film made of a metal material. As a metal material of the metal wiring 40, for example, silver (Ag), tungsten (W), copper (Cu), or the like can be used. The surface of the metal wiring 40 may be plated with nickel (Ni) / gold (Au) or the like.

  The metal wiring 40 exposed from the sealing member 30 is preferably covered with a glass film (glass coat film) made of a glass material or a resin film (resin coat film) made of a resin material, except for the terminals 60a and 60b. . Thereby, the insulation in the light-emitting device 1 can be improved, or the reflectance of the surface of the substrate 10 can be improved.

(wire)
The wire 50 is a conductive wire such as a gold wire. As illustrated in FIG. 1B, the wire 50 connects the LED 20 and the metal wiring 40. As described in FIG. 2, the wire 50 connects the cathode electrode 23 (or anode electrode 24) provided on the upper surface of the LED 20 and the metal wiring 40 formed adjacent to both sides of the LED 20 by the wire 50. 26).

  Note that, as in the present embodiment, the wire 50 is entirely embedded in the sealing member 30 so as not to be exposed from the sealing member 30.

(Terminal)
The terminals 60 a and 60 b are external connection terminals for receiving DC power for causing the LEDs 20 to emit light from the outside of the light emitting device 1. The terminals 60 a and 60 b are power supply units of the light emitting device 1, and the DC power received by the terminals 60 a and 60 b is supplied to each LED 20 through the metal wiring 40 and the wire 50.

  The terminals 60 a and 60 b are formed in a predetermined shape on the first main surface 10 a of the substrate 10. Specifically, the terminals 60 a and 60 b are formed continuously with the metal wiring 40 and are electrically connected to the metal wiring 40. Therefore, the terminals 60 a and 60 b can be patterned simultaneously with the metal wiring 40 using the same metal material as the metal wiring 40.

(Features of the present invention)
The light emitting device 1 configured as described above includes a substrate 10 on which an uneven portion 11 is formed. The concavo-convex portion 11 has a concavo-convex structure directly formed on the substrate 10 and is configured by innumerable concave portions and convex portions formed on the surface of the second main surface 10 b of the substrate 10.

  The concavo-convex portion 11 in the present embodiment is formed according to the shape of the ceramic crystal grains constituting the ceramic substrate. Hereinafter, this point will be described in detail with reference to FIG. FIG. 3 is an enlarged cross-sectional view of a main part of the light-emitting device according to Embodiment 1 of the present invention, and schematically shows a cross-sectional configuration of the ceramic substrate.

  As shown in FIG. 3, the substrate 10 which is a polycrystalline ceramic substrate (ceramic sintered substrate) is used to bond a plurality of ceramic crystal grains (sintered particles) 11 a serving as a base and adjacent ceramic crystal grains 11 a to each other. The binder 11b. For example, when the substrate 10 is a polycrystalline alumina substrate, the ceramic crystal grains 11a are alumina crystal grains, and the binder 11b is an inorganic material such as a glass material.

  In the present embodiment, the surface shape (uneven shape) of the uneven portion 11 is the surface shape of the exposed ceramic crystal grains 11a as shown in FIG. That is, the surface shape of the concavo-convex portion 11 is a shape along the undulations of the exposed ceramic crystal grains 11a.

  The concavo-convex portion 11 having the fine concavo-convex structure configured as described above can be formed, for example, by using a polycrystalline ceramic substrate as the substrate 10 and subjecting the polycrystalline ceramic substrate to an acid treatment.

  Specifically, the surface of the second main surface 10b of the substrate 10 (polycrystalline ceramic substrate) is etched with an acid such as hot sulfuric acid. Thereby, the binder 11b near the surface of the second main surface 10b of the substrate 10 is melted, and the interface portion of the ceramic crystal grains 11a where the binder 11b was present appears as a groove (concave portion). That is, before the surface treatment with acid, the ceramic crystal grains 11a and the binder 11b are exposed on the surface of the substrate 10 (polycrystalline ceramic substrate), but exposed to the surface by performing the surface treatment with acid. The binder 11b to be selectively dissolved. Thereby, a recess can be formed on the surface of the substrate 10. As a result, the ceramic crystal grains 11a appear on the surface of the substrate 10 as convex portions. In this way, the uneven portion 11 is formed on the surface of the substrate 10.

  In the case where the concavo-convex portion 11 is formed in a predetermined region only on a part of the surface of the substrate 10, masking is performed on a region of the surface of the substrate 10 where the concavo-convex portion 11 is not formed, and then an etching process with acid is performed. In the present embodiment, as shown in FIG. 3, since the concavo-convex portion 11 is formed at a position facing the sealing member 30 on the second main surface 10b of the substrate 10, the sealing member 30 on the second main surface 10b Etching is performed after masking other than the opposite positions. Thereby, the uneven | corrugated | grooved part 11 can be formed only in the position facing the sealing member 30 in the 2nd main surface 10b.

  In addition, the uneven | corrugated | grooved part 11 can be formed also by methods other than the surface treatment by an acid. For example, the uneven portion 11 can be formed by polishing the surface of the substrate 10 using a polishing means such as sandpaper. In this case, it is preferable to clean the polished surface. Alternatively, the concavo-convex portion 11 can be formed by sandblasting the surface of the substrate 10.

  Further, as another method for forming the uneven portion 11 on the substrate 10, it is also possible to produce a polycrystalline ceramic substrate having the uneven portion 11 by forming the uneven portion at the stage of the mold before firing and then firing. is there. However, if the uneven portion is formed at the stage of the mold, the heat shrinkage rate is different between the portion where the uneven portion is present and the portion where the uneven portion is not present when firing, and therefore the unnecessary unevenness on the surface on which the LED 20 is mounted. May occur, making it difficult to mount the LED 20. Therefore, in order to form the concavo-convex portion 11 on the polycrystalline ceramic substrate, it is preferable to form the concavo-convex portion 11 after producing a polycrystalline ceramic substrate having both sides flat.

  Even when a resin substrate is used as the substrate 10, the concavo-convex portion 11 can be formed by forming a recess in the second main surface 10 b.

  And in this Embodiment, the uneven | corrugated | grooved part 11 is formed in the position which opposes LED20 in the 2nd main surface 10b of the board | substrate 10. FIG. Thereby, compared with the case where the uneven | corrugated | grooved part 11 is not formed, the taking-out amount of the light which goes to the 2nd main surface 10b among the light which LED20 mounted in the 1st main surface 10a emits can be increased. This point will be briefly described below.

  The LED 20 mounted on the first main surface 10a emits light in all directions around the LED 20. Accordingly, when the substrate 10 has translucency, the light of the LED 20 enters the substrate 10 from the first main surface 10a, passes through the substrate 10, and travels toward the second main surface 10b. In this case, even if the light reflectance of the substrate 10 is 80% or more and the light transmittance is low, the light from the LED 20 passes through the substrate 10 as leakage light and is emitted to the outside from the second main surface 10b. .

  At this time, when the uneven portion 11 is not formed and the second main surface 10b is a flat surface, the light traveling in the substrate 10 and traveling toward the second main surface 10b is inclined with respect to the second main surface 10b. A part of the light incident from the light source is reflected by the second main surface 10b and is not extracted outside the substrate 10. For example, light totally reflected by the second main surface 10 b is not extracted outside the substrate 10.

  On the other hand, when the concavo-convex portion 11 is formed, the light incident obliquely with respect to the second main surface 10 b is easily extracted to the outside through the concavo-convex structure of the concavo-convex portion 11. Thereby, the region where the uneven portion 11 is formed can increase the amount of light extracted compared to the region where the uneven portion 11 is not formed.

  As described above, when the uneven portion 11 is provided on the second main surface 10b of the substrate 10, the light transmitted through the inside of the substrate 10 and extracted from the second main surface 10b is compared with the case where the uneven portion 11 is not provided. The ratio of can be increased.

  Therefore, even if the LED 20 is arranged only on the first main surface 10a using a translucent white substrate as the substrate 10, the uneven portion 11 is formed at a position facing the LED 20 to form the first The amount of light transmitted from the two principal surfaces 10b can be increased.

  Here, the structure of the actually formed uneven portion 11 will be described with reference to FIGS. 4A and 4B. FIG. 4A is a surface SEM image of the substrate when the surface of the unbaked polycrystalline ceramic substrate is etched. FIG. 4B is a surface SEM image of the substrate when etching is performed after the surface of the polycrystalline ceramic substrate is cut to adjust the thickness. 4A and 4B, an alumina substrate having a thickness of 1 mm was used as the polycrystalline ceramic substrate, and hot sulfuric acid was used as the etching treatment liquid.

  As shown in FIG. 4A and FIG. 4B, in any case, the binder between the alumina crystal grains is dissolved, and an uneven portion along the surface shape of the alumina crystal grains is formed on the surface of the polycrystalline ceramic substrate. I understand that

  Moreover, the transmittance | permeability was measured about the polycrystalline-ceramic board | substrate of FIG. 4A and 4B. The transmittance was measured by the method shown in FIG. FIG. 5 is a diagram for explaining a method for measuring the transmittance of the translucent substrate.

  As shown in FIG. 5, the surface of the polycrystalline ceramic substrate to be measured is irradiated with the reference blue light through the slit, and the light transmitted through the polycrystalline ceramic substrate by the detector (integrating sphere + spectrometer). The amount of light (light transmission amount) was measured.

  As a result, it was confirmed that the light transmission amount increased in any of the polycrystalline ceramic substrates of FIGS. 4A and 4B as compared with the case where the uneven portions were not formed.

  4A is compared with the polycrystalline ceramic substrate of FIG. 4B with respect to the depth of the recess formed by melting the binder, the polycrystalline ceramic substrate of FIG. It can be seen that a deeper recess is formed than the polycrystalline ceramic substrate.

  Therefore, FIG. 4A (when an unbaked polycrystalline ceramic substrate is etched) has a smaller etching amount depending on the etching time than FIG. 4B (when the surface of the polycrystalline ceramic substrate is etched and etched). Since it is easy to control, the desired uneven part 11 can be formed. As a result, the polycrystalline ceramic substrate of FIG. 4A is easier to control the amount of light transmission by the etching time than the polycrystalline ceramic substrate of FIG. 4B.

  Here, the relationship between the etching time and the light transmission amount in the polycrystalline ceramic substrate of FIG. 4A will be described with reference to FIG. FIG. 6 is a view for explaining the relationship between the etching time and the light transmission amount in the polycrystalline ceramic substrate of FIG. 4A. In FIG. 6, the horizontal axis represents the etching time, and the vertical axis represents the light output ratio with respect to the light transmission amount (output of light passing through the back surface) of the polycrystalline ceramic substrate in the initial stage before etching (before processing). ing.

  As shown in FIG. 6, when the polycrystalline ceramic substrate (alumina substrate) was etched with hot sulfuric acid for 2 hours, the amount of light transmission increased by 6% compared to the polycrystalline ceramic substrate without etching (initial stage). Similarly, when the etching was performed for 4 hours and 12 hours, the light transmission increased by 12% and 56%, respectively. Thus, it can be seen that the amount of light transmission is increased by increasing the etching time. Even when the etching time was increased, the thickness of the polycrystalline ceramic substrate itself did not change. This is because what is dissolved by etching is mainly a binder, not the alumina crystal grains as a base material.

  As mentioned above, according to the board | substrate 10 which concerns on this Embodiment, the uneven | corrugated | grooved part 11 is formed in the position facing LED20 in the 2nd main surface 10b. Thereby, even if it is a case where LED20 is arrange | positioned only on the single side | surface of the 1st main surface 10a, the light transmission amount from the 2nd main surface 10b can be increased by the uneven | corrugated | grooved part 11. FIG. Thereby, not only light is emitted from the first main surface 10a, but also a sufficient amount of light can be emitted from the second main surface 10b. Therefore, a light emitting device (LED module) that emits light from both sides can be realized using a low-cost white substrate.

  Moreover, in this Embodiment, the uneven | corrugated | grooved part 11 is formed by surface-treating a polycrystalline ceramic substrate with an acid. Thus, by using a polycrystalline ceramic substrate as the substrate 10, the concavo-convex portion 11 can be formed by a simple construction method.

(Embodiment 2)
Next, the light emitting device 2 according to Embodiment 2 of the present invention will be described with reference to FIG. 7A and 7B are diagrams showing a configuration of a light emitting device according to Embodiment 2 of the present invention, in which FIG. 7A is a plan view, and FIG. 7B is a XX ′ line in FIG. Sectional drawing and FIG.7 (c) are sectional drawings in the YY 'line | wire of Fig.7 (a).

  As shown in FIG. 7A to FIG. 7C, the light emitting device 2 in the present embodiment further includes a wavelength conversion member 70 (second wavelength conversion member) with respect to the light emitting device 1 shown in FIG. Is provided.

  The wavelength conversion member 70 is formed at a position facing the LED 20 on the second main surface 10 b of the substrate 10. Since the uneven portion 11 is formed at a position facing the LED 20, the wavelength conversion member 70 is formed so as to overlap the uneven portion 11 in a plan view of the substrate 10. In the present embodiment, the wavelength conversion member 70 is formed at a position facing the sealing member 30 with the substrate 10 interposed therebetween. That is, four wavelength conversion members 70 are formed in a long shape.

  The wavelength conversion member 70 includes a wavelength conversion material such as a phosphor, and converts the wavelength (color) of the light of the LED 20 that has passed through the substrate 10. The wavelength conversion member 70 in the present embodiment is the same material as the sealing member 30 and is, for example, a phosphor-containing resin in which yellow phosphor particles that convert blue light into yellow light are dispersed in a silicone resin. In this case, the wavelength conversion member 70 can be formed by application with a dispenser, similarly to the sealing member 30.

  Thus, in this modification, since the wavelength conversion member 70 is formed at a position facing the LED 20 (region where the concavo-convex portion 11 is formed), the wavelength conversion member 70 is transmitted through the substrate 10 and emitted from the second main surface 10b. The light from the LED 20 is converted to a predetermined wavelength. In the present embodiment, the LED 20 emits blue light, and the wavelength conversion member 70 converts the wavelength of blue light into yellow light. As a result, part of the blue light transmitted through the substrate 10 and emitted from the second main surface 10b was converted into yellow light by the wavelength conversion member 70, and was not wavelength-converted by the yellow light and the wavelength conversion member 70. The blue light is mixed and emitted from the wavelength conversion member 70 as white light. Therefore, a light emitting device capable of emitting white light from both sides can be realized.

  In addition, since the wavelength conversion member 70 is formed so as to overlap with the concavo-convex portion 11 that increases the amount of light transmission, the amount of white light emitted from the second main surface 10b to the outside can be increased. .

  Further, when the uneven portion 11 is formed so as to protrude from the wavelength conversion member 70, the light from the protruded uneven portion 11 is not color-converted and the light transmission amount is increased. As a result, color unevenness occurs. Therefore, it is preferable that the uneven portion 11 is formed so as not to protrude from the wavelength conversion member 70. In other words, the wavelength conversion member 70 is preferably formed so as to cover the uneven portion 11, and the region where the uneven portion 11 is formed and the region where the wavelength conversion member 70 is formed may be the same.

  In addition, in this modification, although fluorescent substance containing resin was used as the wavelength conversion member 70, it is not restricted to this. For example, the wavelength conversion member 70 may be a phosphor film (phosphor layer) that is a sintered body of phosphor particles and an inorganic binder (binder) such as glass.

(Modification of Embodiment 2)
Next, a light emitting device 2A according to a modification of the second embodiment of the present invention will be described with reference to FIG. FIG. 8 is a cross-sectional view showing a configuration of a light emitting device according to a modification of the second embodiment of the present invention. FIG. 8 corresponds to the cross-sectional view of FIG.

  The light emitting device 2A in this modification is obtained by increasing the width of the wavelength conversion member 70 in the light emitting device 2 of the second embodiment.

  Specifically, as shown in FIG. 8, in the light emitting device 2 </ b> A in the present modification, the length in the width direction orthogonal to the thickness direction of the substrate 10 in the wavelength conversion member 70 </ b> A (in the present modification, the shorter side of the substrate 10). The length in the direction) is longer than the length of the sealing member 30 in the same width direction.

  Thus, by making the length in the width direction of the wavelength conversion member 70A longer than the length in the width direction of the sealing member 30, the light (blue light) of the LED 20 that travels in the substrate 10 spreads as it is. It is possible to suppress leakage from the second main surface 10b of the substrate 10 without being converted.

  In addition, it is preferable to increase the region where the concavo-convex portion 11 is formed as the width of the wavelength conversion member 70A is increased. For example, the region where the concavo-convex portion 11 is formed as in the second embodiment described above, The region may be the same as the region where the wavelength conversion member 70A is formed.

(Embodiment 3)
Next, an illumination light source according to Embodiment 3 of the present invention will be described. In the present embodiment, a bulb-type LED lamp (LED bulb) 100 will be described as an example of an illumination light source.

  FIG. 9 is a cross-sectional view of a light bulb shaped LED lamp according to Embodiment 3 of the present invention. In FIG. 9, the alternate long and short dash line drawn in the vertical direction on the paper indicates the lamp axis J (center axis) of the light bulb shaped lamp 100. In the present embodiment, the lamp axis J is identical to the globe axis. I'm doing it. The lamp axis J is an axis serving as a rotation center when the light bulb shaped lamp 100 is attached to a socket of a lighting device (not shown), and coincides with the rotation axis of the base 180. In FIG. 9, the drive circuit 140 is shown in a side view rather than a cross-sectional view.

  As shown in FIG. 9, a light bulb shaped lamp 100 according to the present embodiment is a light bulb shaped LED lamp that is a substitute for a light bulb shaped fluorescent lamp or an incandescent light bulb, and a light emitting device (LED module) 110 that is a light source, The globe 120, the support member 130 that supports the light emitting device 110, the drive circuit 140 for causing the light emitting device 1 to emit light, the circuit case 150 configured to surround the drive circuit 140, and the circuit case 150 A first housing 160 configured to surround the first housing 160, and a second housing 170 that forms an outer shell, a base 180 that receives power from the outside, and a screw 190.

  The bulb-shaped lamp 100 includes an envelope formed by the globe 120, the second housing 170, and the base 180. That is, the globe 120, the second housing 170, and the base 180 are exposed to the outside, and the outer surfaces of each are exposed to the outside air (atmosphere).

  Hereinafter, each component of the light bulb shaped lamp 100 according to the present embodiment will be described in detail with reference to FIG.

(Light emitting device)
The light emitting device 110 is a double-sided light emitting LED module. As shown in FIG. 9, the light emitting device 110 is disposed inside the globe 120, and has a spherical central position formed by the globe 120 (for example, inside the large diameter portion where the inner diameter of the globe 120 is large). Preferably they are arranged. Thus, by arranging the light emitting device 110 at the center position of the globe 120, it is possible to realize a light distribution characteristic approximate to that of an incandescent lamp using a conventional filament coil.

  The light emitting device 110 is held hollow in the globe 120 by the support member 130, and emits light by electric power supplied from the drive circuit 140 via the lead wires 143a and 43b.

  Here, each component of the light-emitting device 110 according to the present embodiment will be described with reference to FIG. 10A and 10B are diagrams showing the configuration of the light emitting device according to Embodiment 3 of the present invention, where FIG. 10A is a plan view, and FIG. 10B is the XX ′ line in FIG. 10A. 10C is a cross-sectional view taken along line YY ′ of FIG. 10A, and FIG. 10D is a cross-sectional view taken along line ZZ ′ of FIG.

  As shown in FIG. 10A to FIG. 10D, the light emitting device 110 in the present embodiment further includes through holes 80a, 80b, and 81 in the substrate 10 compared to the light emitting device 1 shown in FIG. The structure is provided.

  The through holes 80a and 80b are configured to electrically connect the light emitting device 110 and the two lead wires 143a and 143b. As shown in FIG. 9, the lead wire 143 a (143 b) is inserted into the through hole 80 a (80 b) at the tip and soldered to the terminal 60 a (60 b) of the substrate 10. Further, the through hole 81 is configured to be fitted with a convex portion 131 a provided at the top of the support member 130. The light emitting device 110 and the support member 130 are connected by fitting the convex portion 131 a and the through hole 81.

  As shown in FIG. 10A, in this embodiment, at least a connection surface (contact surface) that is a connection portion (contact portion) between the substrate 10 of the light emitting device 110 and the top of the support 131 of the support member 130. ), That is, the concavo-convex portion 11 is not formed in the region surrounded by the broken line in FIG. Thereby, the thermal contact between the light emitting device 110 and the support member 130 which is a heat radiating body can be improved.

(Glove)
Returning to FIG. 9, the globe 120 is a substantially hemispherical translucent cover for extracting light emitted from the light emitting device 110 to the outside of the lamp. Globe 120 in the present embodiment is a glass bulb (clear bulb) made of silica glass that is transparent to visible light. Therefore, the light emitting device 110 housed in the globe 120 can be viewed from the outside of the globe 120.

  The light emitting device 110 is covered with a globe 120. Thereby, the light of the light emitting device 110 incident on the inner surface of the globe 120 passes through the globe 120 and is extracted to the outside of the globe 120. In the present embodiment, globe 120 is configured to house light emitting device 110.

  The shape of the globe 120 is a shape in which one end is closed in a spherical shape and the other end has an opening 121. Specifically, the shape of the globe 120 is such that a part of the hollow sphere narrows while extending away from the center of the sphere, and the opening 121 is located away from the center of the sphere. Is formed. As the globe 120 having such a shape, a glass bulb having a shape similar to that of a general bulb-type fluorescent lamp or incandescent bulb can be used. For example, a glass bulb such as an A shape, a G shape, or an E shape can be used as the globe 120.

  Further, the opening 121 of the globe 120 is located between the support member 130 and the second housing 170. In this state, the globe 120 is fixed by applying an adhesive such as silicone resin between the support member 130 and the second housing 170.

  Note that the globe 120 is not necessarily transparent to visible light, and the globe 120 may have a light diffusion function. For example, a milky white light diffusing film can be formed by applying a resin containing a light diffusing material such as silica or calcium carbonate, a white pigment or the like to the entire inner surface or outer surface of the globe 120. In this way, by providing the globe 120 with the light diffusion function, light incident on the globe 120 from the light emitting device 110 can be diffused, so that the light distribution angle of the lamp can be expanded.

  Further, the shape of the globe 120 is not limited to the A shape or the like, and may be a spheroid or an oblate sphere. The material of the globe 120 is not limited to a glass material, and a resin such as acrylic (PMMA) or polycarbonate (PC) may be used.

(Support member)
The support member 130 is a support base that supports the light emitting device 110, and the light emitting device 110 is attached to the support member 130. The support member 130 can be made of metal or resin. When the support member 130 is made of resin, it can be made of a colored resin material such as white, or can be made of a resin material having translucency.

  The support member 130 also functions as a heat radiating member (heat sink) for radiating heat generated in the light emitting device 110 (LED 20). Therefore, the support member 130 is preferably composed of a metal material mainly composed of aluminum (Al), copper (Cu), iron (Fe), or the like, or a resin material having high thermal conductivity. Thereby, the heat generated in the light emitting device 110 via the support member 130 can be efficiently conducted to the first housing 160.

  The support member 130 includes a support column 131 that is mainly located inside the globe 120 and a pedestal 132 that is mainly surrounded by the first housing 160. In the present embodiment, both the support column 131 and the pedestal 132 are formed using aluminum.

  The column 131 is provided so as to extend from the vicinity of the opening 121 of the globe 120 toward the inside of the globe 120. The column 131 functions as a holding member that holds the light emitting device 110. Thus, since the light emitting device 110 is provided on the support column 131 extending inward of the globe 120, a light distribution characteristic with a wide light distribution angle can be realized. Can be obtained.

  In addition, one end of the support 131 is connected to the light emitting device 110, and the other end of the support 131 is connected to the pedestal 132.

  A fixing surface for fixing the substrate 10 of the light emitting device 110 is formed on the top of the support 131, and the fixing surface is a contact surface that contacts the back surface of the substrate 10. For example, the light emitting device 110 is placed on a fixed surface and adhered to the fixed surface with an adhesive or the like. In the present embodiment, a protrusion 131 a that protrudes from the fixed surface is provided on the top of the support column 131. The convex 131a is configured to fit into a through hole 81 (see FIG. 10A) provided in the substrate 10 of the light emitting device 110. The convex portion 131a functions as a position restricting portion that restricts the position of the light emitting device 110, and is configured to have a rectangular shape in plan view.

  The pedestal 132 is a member that supports the support 131 and is configured to close the opening 121 of the globe 120. The pedestal 132 is a disk-shaped member having a stepped portion, and includes a small-diameter portion 132a having a small diameter and a large-diameter portion 132b having a large diameter. A step portion of the pedestal 132 is configured by the difference in diameter between the small diameter portion 132a and the large diameter portion 132b, and the opening 121 of the globe 120 is in contact with the step portion (the upper surface of the large diameter portion 132b). Thereby, the opening part 121 of the globe 120 is closed.

  Further, in the stepped portion of the pedestal 132, with the opening 121 of the globe 120 sandwiched between the support member 130 and the opening end of the first housing 160 on the globe side, silicone resin or the like is formed around these By applying an adhesive (not shown), the support member 130, the first housing 160, and the opening 121 of the globe 120 can be fixed.

  The small-diameter portion 132 a is a portion of the pedestal 132 that is configured in a disc shape, and is configured to support the support 131 and close the opening 121 of the globe 120. The support column 131 is disposed at the center of the small diameter portion 132a. The small-diameter portion 132a is provided with two through holes for inserting the lead wires 143a and 143b.

  The large-diameter portion (fin) 32b is a portion that fits into the first housing 160, and the support member 130 has the first housing having the outer peripheral surface of the large-diameter portion 132b in contact with the inner peripheral surface of the first housing 160. It is connected to the body 160. Thereby, the heat of the support member 130 (base 132) can be efficiently conducted to the first housing 160.

  The large-diameter portion 132b has a structure extending from the small-diameter portion 132a toward the base side, and has, for example, a substantially cylindrical structure in which the outer diameter gradually changes. The large-diameter portion 132b can be configured such that, for example, the outer surface is the surface of the truncated cone.

  In addition, four concave portions are formed in the upper portion (end portion on the light emitting device side) of the large-diameter portion 132b as guide holes for caulking a part of the first housing 160. The recess is formed so as to cut out a part of the upper end portion of the large-diameter portion 132b.

(Drive circuit)
The drive circuit (circuit unit) 140 is a lighting circuit for causing the light emitting device 110 (LED 20) to emit light (light on), and supplies predetermined power to the light emitting device 110. For example, the drive circuit 140 converts AC power supplied from the base 180 via the pair of lead wires 143c and 43d into DC power, and the DC power is supplied to the light emitting device 110 via the pair of lead wires 143a and 43b. It is a power supply circuit for supplying.

  The drive circuit 140 includes a circuit board 141 and a plurality of circuit elements (electronic components) 142 mounted on the circuit board 141.

  The circuit board 141 is a printed wiring board in which metal wiring is patterned, and electrically connects a plurality of circuit elements 142 mounted on the circuit board 141. In the present embodiment, the circuit board 141 is arranged in a posture in which the main surface is orthogonal to the lamp axis. The circuit board 141 is sandwiched and held between the case main body 151 and the cap 152.

  The circuit element 142 is, for example, a capacitance element such as various capacitors, a resistance element, a rectifier circuit element, a coil element, a choke coil (choke transformer), a noise filter, a semiconductor element such as a diode or an integrated circuit element. Many of the circuit elements 142 are mounted on one main surface of the circuit board 141.

  The drive circuit 140 configured as described above is housed in the circuit case 150 and is fixed to the circuit case 150 by, for example, screwing, bonding, or engagement. In this way, the drive circuit 140 is covered with the circuit case 150 to ensure insulation. Note that a dimmer circuit, a booster circuit, or the like may be appropriately selected and combined with the drive circuit 140.

  The drive circuit 140 and the light emitting device 110 are electrically connected by a pair of lead wires 143a and 143b. The drive circuit 140 and the base 180 are electrically connected by a pair of lead wires 143c and 143d. These four lead wires 143a to 143d are, for example, alloy copper lead wires, and are composed of a core wire made of alloy copper and an insulating resin film covering the core wire.

  In the present embodiment, the lead wire 143a is a conducting wire (plus output terminal line) for supplying a high-voltage side voltage from the driving circuit 140 to the light emitting device 110, and the lead wire 143b is the light emitting device 110 from the driving circuit 140. It is a conducting wire (minus-side output terminal wire) for supplying a low-voltage side voltage. The lead wires 143a and 143b are inserted through through holes provided in the support member 130 and are drawn out to the light emitting device side (inside the globe 120).

  One end (core wire) of each of the lead wires 143a (143b) is inserted into the through hole 80a (80b) of the substrate 10 of the light emitting device 110 and soldered to the terminals 60a and 60b. On the other hand, the other end (core wire) of each of the lead wires 143a and 143b is electrically connected to the metal wiring of the circuit board 141 by solder or the like.

  On the other hand, the lead wires 143c and 143d are electric wires for supplying power for lighting the light emitting device 110 from the base 180 to the drive circuit 140. One end (core wire) of each of the lead wires 143c and 143d is electrically connected to the base 180 (shell portion 181 or eyelet portion 183), and each other end (core wire) is connected to the power input portion of the circuit board 141. It is electrically connected to (metal wiring) by solder or the like.

(Circuit case)
The circuit case 150 is an insulating case for housing the drive circuit 140 and is housed in the first housing 160 and the base 180. The circuit case 150 includes a case main body 151 and a cap 152.

  The case main body 151 is an insulating case (housing) having openings on both sides, and is connected to the first case portion 151a having a large-diameter cylindrical shape substantially the same shape as the first housing 160, and the first case portion 151a. In addition, the second case portion 151b having a small diameter cylindrical shape substantially the same shape as the base 180 is formed.

  The first case portion 151 a located on the glove side is housed in the first housing 160. Most of the drive circuit 140 is covered with the first case portion 151a.

  On the other hand, the 2nd case part 151b located in the nozzle | cap | die side is accommodated in the nozzle | cap | die 180, and the nozzle | cap | die 180 is externally fitted by the 2nd case part 151b. As a result, the opening on the base side of the circuit case 150 (case body 151) is closed. In the present embodiment, a screwing portion for screwing with the base 180 is formed on the outer peripheral surface of the second case portion 151b, and the base case 180 is screwed into the second case portion 151b so that the circuit case 150 ( The case body 151) is fixed. The case main body 151 can be configured using, for example, an insulating resin material such as polybutylene terephthalate (PBT).

  The cap part 152 is an insulating substantially bottomed cylindrical member configured in a cap shape. Similarly to the case body 151, the cap 152 can also be configured using an insulating resin material such as PBT, for example.

  The upper surface shape of the cap portion 152 is configured to follow the inner surface shape of the pedestal 132 of the support member 130. As a result, the cap portion 152 is fitted into the pedestal 132 and is fastened and fixed to the support member 130 (pedestal 132) by the screws 190.

  In the present embodiment, the circuit case 150 is provided with the cap portion 152, but the circuit case 150 may be configured by only the case main body 151 without providing the cap portion 152.

  The circuit case 150 configured as described above is arranged with a predetermined space between the first case portion 151a and the first housing 160. That is, the outer surface of the first case portion 151a and the inner surface of the first housing 160 are not in contact with each other.

(First housing)
The first housing 160 is configured to surround the drive circuit 140. That is, the drive circuit 140 is disposed inside the first housing 160. In the present embodiment, the first housing 160 surrounds the drive circuit 140 via the circuit case 150.

  The first housing 160 functions as a heat sink (heat radiator) and is connected to the support member 130 in contact with the support member 130. Accordingly, the heat generated in the light emitting device 110 is conducted to the first housing 160 through the support member 130. Thereby, the heat of the light emitting device 110 can be dissipated.

  The first housing 160 is preferably made of a material having high thermal conductivity, and may be a metal member made of metal, for example. First housing 160 in the present embodiment is formed using aluminum. Note that the first housing 160 may be formed using a non-metallic material such as a resin instead of a metal. In this case, the first housing 160 is preferably made of a nonmetallic material having high thermal conductivity.

  In the present embodiment, the first housing 160 is configured to be fitted with the pedestal 132 of the support member 130, and the portion of the first housing 160 to be fitted is a taper having a predetermined taper angle. Has become a department. In the present embodiment, the inner peripheral surface of the first housing 160 and the outer peripheral surface of the pedestal 132 of the support member 130 are in surface contact.

  The first housing 160 is a cylindrical body having a glove-side opening (first opening) and a base-side opening (second opening), and the glove-side opening is configured to be larger than the base-side opening. Has been. Specifically, the first housing 160 is a substantially cylindrical member having a constant thickness and gradually changing an inner diameter and an outer diameter. For example, the first casing 160 is configured in a skirt shape so that the inner surface and the outer surface are surfaces of a truncated cone. Yes. The first casing 160 in the present embodiment is configured such that the inner diameter and outer diameter gradually decrease toward the base 180 side. Therefore, the inner peripheral surface and the outer peripheral surface of the first housing 160 are tapered surfaces (inclined surfaces) configured to be inclined with respect to the lamp axis J.

  The first casing 160 configured as described above has a predetermined gap between the circuit case 150 (first case portion 151a) and the second casing 170, and the circuit casing 150 and the second casing. 170. That is, between the inner peripheral surface of the first housing 160 and the outer peripheral surface of the circuit case (first case portion 151a), and between the outer peripheral surface of the first housing 160 and the inner peripheral surface of the second housing 170. There is an air layer between them. Thus, even if the first housing 160 made of metal and the second housing 170 or the circuit case 150 made of resin having different thermal expansion coefficients are thermally expanded, the first housing 160 and the second housing 170 or the circuit. A difference in thermal expansion from the case 150 can be absorbed by the gap. Thereby, it can suppress that a crack generate | occur | produces in the 2nd housing | casing 170 and the circuit case 150. FIG.

(Second housing)
The second casing 170 is an insulating cover configured to surround the first casing 160. By covering the metal second housing 170 with the second housing 170 having insulation, the insulation of the light bulb shaped lamp 100 can be improved. The second housing 170 can be made of an insulating resin material such as PBT, for example.

  The outer surface of the second housing 170 is exposed outside the lamp (in the atmosphere). On the other hand, the inner peripheral surface of the second housing 170 faces the outer peripheral surface of the first housing 160. In the present embodiment, a gap is provided between the outer peripheral surface of second housing 170 and the inner peripheral surface of first housing 160.

  The second casing 170 is a substantially cylindrical member having a constant wall thickness and gradually changing the inner diameter and the outer diameter. For example, the second casing 170 can be configured in a skirt shape so that the inner surface and the outer surface are the surfaces of the truncated cone. In the present embodiment, the second housing 170 is configured such that the inner diameter and the outer diameter gradually decrease toward the base 180 side.

(Base)
The base 180 is a power receiving unit that receives power for causing the light emitting device 110 (LED 20) to emit light from outside the lamp. The base 180 is attached to a socket of a lighting fixture, for example. Thereby, the base 180 can receive electric power from the socket of the lighting fixture when the light bulb shaped lamp 100 is turned on. For example, AC power is supplied to the base 180 from a commercial power supply of AC 100V. The base 180 in the present embodiment receives AC power through two contact points, and the power received by the base 180 is input to the power input unit of the drive circuit 140 through a pair of lead wires 143c and 43b.

  The base 180 has a metal bottomed cylindrical shape, and includes a shell portion 181 whose outer peripheral surface is a male screw, and an eyelet portion 183 attached to the shell portion 181 via an insulating portion 182. On the outer peripheral surface of the base 180, a screwing portion for screwing into the socket of the lighting fixture is formed. Further, on the inner peripheral surface of the base 180, a screwing portion for screwing with the screwing portion of the case portion 51 (second case portion 151b) of the circuit case 150 is formed.

  The type of the base 180 is not particularly limited, but in this embodiment, a screw-type Edison type (E type) base is used. For example, as the base 180, an E26 type, an E17 type, an E16 type, or the like can be given. In the present embodiment, an E17 type base is used. The base 180 may be a base having another structure such as a plug-type base.

  According to the light bulb shaped lamp 100 according to the present embodiment configured as described above, the double-sided light emitting device 110 having the concavo-convex portion 11 is used. Therefore, the light emitted from the light emitting device 110 is transmitted through the light emitting device 110. Radiated in all directions as the center. Thereby, the light bulb shaped LED lamp having a light distribution characteristic with a wide light distribution angle similar to an incandescent light bulb can be realized.

  Further, in the present embodiment, the concavo-convex portion 11 is formed on the substrate 10 of the light-emitting device 110, but the concavo-convex portion 11 is formed at the connection portion between the light-emitting device 110 (substrate 10) and the support member 130 (support 131). Is not formed. Thereby, since the thermal contact between the light emitting device 110 and the support member 130 can be improved, it is possible to suppress the heat dissipation of the light emitting device 110 from being lowered by the uneven portion 11.

  In the present embodiment, the light emitting device 110 having the same configuration as that of the light emitting device 1 of the first embodiment is used, but a light emitting device having the same configuration as that of the second embodiment or its modification may be used. I do not care. Thereby, since white light is emitted from both surfaces of the light emitting device, illumination light more similar to an incandescent bulb can be obtained.

(Embodiment 4)
Next, an illumination apparatus according to Embodiment 4 of the present invention will be described with reference to FIG. FIG. 11 is a cross-sectional view of a lighting apparatus according to Embodiment 4 of the present invention.

  As shown in FIG. 11, lighting apparatus 300 according to the present embodiment is used, for example, by being mounted on an indoor ceiling, and includes light bulb shaped lamp 100 according to Embodiment 3 and lighting device 200.

  The lighting fixture 200 turns off and turns on the light bulb shaped lamp 100 and includes a fixture main body 210 attached to the ceiling and a translucent lamp cover 220 covering the light bulb shaped lamp 100.

  The instrument body 210 has a socket 211. A base 180 of the light bulb shaped lamp 100 is screwed into the socket 211. Electric power is supplied to the light bulb shaped lamp 100 through the socket 211.

  Thus, the light bulb shaped lamp 100 according to the above-described embodiment can be used as a light source of an illumination device.

(Other)
As mentioned above, although the board | substrate, its manufacturing method, the light-emitting device, the light source for illumination, and the illuminating device based on this invention were demonstrated based on embodiment and a modification, this invention is based on these embodiment and a modification. It is not limited.

  For example, in the above embodiment, an example in which the light emitting device is applied to a light bulb shaped lamp has been shown. However, the light emitting device may be used as a light source for other types of lamps such as a straight tube lamp, The light-emitting device may be used as a light source of a lighting device such as a downlight, a spotlight, or a base light. In addition, the light-emitting device may be used as a light source of various lighting devices. The light-emitting device may be used not only as an illumination light source but also as a light source for other products such as a display light source.

  Moreover, in said embodiment and modification, although the light-emitting device (LED module) was comprised so that white light might be emitted by a blue LED chip and a yellow fluorescent substance, it is not restricted to this. For example, in order to improve color rendering properties, a red phosphor or a green phosphor may be further mixed in addition to the yellow phosphor. Moreover, it is also possible to use a phosphor-containing resin containing a red phosphor and a green phosphor without using a yellow phosphor, and to emit white light by combining this with a blue LED chip. it can.

  Moreover, in said embodiment and modification, you may use the LED chip which light-emits colors other than blue as an LED chip. For example, when an ultraviolet light emitting LED chip is used, a combination of phosphor particles that emit light in three primary colors (red, green, and blue) can be used as the phosphor particles. Furthermore, a wavelength conversion material other than the phosphor particles may be used. For example, the wavelength conversion material absorbs light of a certain wavelength such as a semiconductor, a metal complex, an organic dye, or a pigment, and has a wavelength different from the absorbed light A material containing a substance that emits light may be used.

  Further, in the above embodiments and modifications, the LED is exemplified as the light emitting element, but other solid light emitting elements such as a semiconductor light emitting element such as a semiconductor laser, an organic EL (Electro Luminescence), or an inorganic EL may be used. .

  In addition, the present invention can be realized by various combinations conceived by those skilled in the art for each embodiment, or by arbitrarily combining the components and functions in each embodiment without departing from the spirit of the present invention. This form is also included in the present invention.

  The present invention can be widely used in a substrate on which a light-emitting element is mounted, a light-emitting device including the substrate, a lamp or a lighting device including the light-emitting device, and the like.

1, 2, 2A, 110 Light-emitting device 10 Substrate 10a First main surface 10b Second main surface 11 Concavity and convexity 11a Ceramic crystal grains 11b Binder 20 LED
21 Sapphire substrate 22 Nitride semiconductor layer 23 Cathode electrode 24 Anode electrode 25, 26 Wire bond part 27 Chip bonding material 30 Sealing member 40 Metal wiring 50 Wire 60a, 60b Terminal 70, 70A Wavelength conversion member 80a, 80b, 81 Through-hole DESCRIPTION OF SYMBOLS 120 Globe 121 Opening part 130 Support member 131 Support | pillar 131a Protruding part 132 Base 132a Small diameter part 132b Large diameter part 140 Drive circuit 141 Circuit board 142 Circuit element 143a, 143b, 143c, 143d Lead wire 150 Circuit case 151 Case main body 151a First body 1 case part 151b 2nd case part 152 cap part 160 1st housing | casing 170 2nd housing | casing 180 base 181 shell part 182 insulating part 183 eyelet part 190 screw 200 lighting fixture 210 instrument Body 211 Socket 220 lamp cover 300 illumination device

Claims (4)

A substrate having translucency;
A light emitting device mounted on the first main surface of the substrate;
A sealing member that includes a wavelength conversion material and seals the light emitting element;
A wavelength conversion member including a wavelength conversion material,
The substrate has a concavo-convex portion on a surface opposite to the surface on which the light emitting element is mounted,
The uneven portion is formed at a position facing the light emitting element,
The light emitting device, wherein the wavelength conversion material is formed so as to overlap the concavo-convex portion. The light emitting device according to claim 1 , wherein the uneven portion is formed so as not to protrude from the wavelength conversion member. The light-emitting device according to claim 1 or 2 ,
A heat radiator connected to the light emitting device,
The radiator is connected to a surface of the substrate of the light emitting device opposite to a surface on which the light emitting element is mounted;
The uneven portion is not formed on a connection surface between the heat radiator and the substrate. And a glove that covers the light emitting device.
The light source for illumination according to claim 3 , wherein the heat dissipating member is a support column that is provided so as to extend inward of the globe and supports the light emitting device.

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