JP5683922B2 - Lamp, lighting device, and method of manufacturing lamp - Google Patents

Description

  The present invention relates to a lamp using a semiconductor light emitting element such as a light emitting diode (LED), an illumination device including the lamp, and a method for manufacturing the lamp.

  In recent years, semiconductor light emitting devices such as LEDs have been used in various lamps as highly efficient and space-saving light sources.

  As a lamp using LED (LED lamp), a straight tube fluorescent lamp type straight tube type LED lamp (straight tube type LED lamp) or a bulb fluorescent light bulb type LED lamp (bulb type LED lamp), etc. There is. For example, Patent Document 1 discloses a conventional straight-tube LED lamp. Patent Document 2 discloses a conventional light bulb type LED lamp.

  Some of such LED lamps use an LED module including a plurality of LEDs as a light source. As the LED module, for example, a module including a mounting substrate made of a ceramic substrate, a plurality of LEDs mounted on the mounting substrate, and a phosphor-containing resin that converts the wavelength of the LED light and seals the LED is proposed. ing.

  Further, in the LED lamp, the LED module is mounted on a metal base that functions as a heat sink in order to release heat generated in the LED, and is fixed to the base.

JP 2009-043447 A JP 2009-037995 A

  However, since a separate fixing member is required to fix the LED module to the base, there is a problem that the number of parts increases and the manufacturing process becomes complicated. In particular, in a straight tube type LED lamp, a plurality of LED modules are used because the mounting substrate is divided and configured in consideration of the brittle fracture property of the ceramic substrate. In this case, since the plurality of LED modules are arranged in a line along the tube axis direction of the long straight pipe, many fixing members are required. Further, when a separate fixing member is used, the portion provided with the fixing member jumps out of the base, so that the light from the LED module is blocked by the protruding portion of the fixing member, and there is a problem that a discontinuous shadow is generated.

  In addition, as an easy-to-manufacture fixing method that does not use a separate fixing member, it is conceivable to fix the LED module and the base with an adhesive. However, when the LED lamp is attached to the lighting device, the LED module is often located on the lower side (floor side) with respect to the base. There is a problem that the module falls due to its own weight.

  The present invention has been made to solve such a problem, and an object of the present invention is to provide a lamp capable of fixing an LED module to a base with a simple configuration and a method for manufacturing the lamp.

  In order to achieve the above object, an embodiment of a lamp manufacturing method according to the present invention includes a step of placing a mounting substrate on which a semiconductor light emitting element is mounted on a base, and plastically deforming a part of the base. A step of fixing the mounting substrate to the base, and a step of arranging the base on which the mounting substrate is fixed in a housing.

  Thereby, the mounting board | substrate with which the semiconductor light-emitting element was mounted can be fixed to a base by carrying out plastic deformation of a part of base. Therefore, the mounting substrate can be fixed to the base with a simple configuration without using a separate fixing member. In addition, since the mounting substrate can be fixed to the base without using an adhesive, the mounting substrate does not drop due to insufficient adhesive fixing force. Furthermore, since the mounting substrate is fixed using a part of the base, the heat dissipation of the heat generated in the semiconductor light emitting element can be improved.

  Furthermore, in an aspect of the method for manufacturing a lamp according to the present invention, the base is opposite to a mounting surface for mounting the mounting substrate and a side surface of the mounting substrate mounted on the mounting surface. A convex portion having a side wall portion, and in the step of fixing the mounting substrate to the base, the side wall portion of the convex portion protrudes toward the mounting substrate and contacts the mounting substrate. Preferably, the mounting substrate is fixed to the base by plastically deforming the convex portion.

  Thus, the mounting substrate can be fixed using the side wall portion facing the mounting substrate, so that the mounting substrate can be easily fixed to the base.

  Furthermore, in one aspect of the method for manufacturing a lamp according to the present invention, the convex portion further includes a flat portion having a predetermined distance in the thickness direction of the mounting substrate from the mounting surface, and the mounting substrate is In the step of fixing to the base, it is preferable to form a recess in the planar portion so that the side wall portion of the convex portion protrudes toward the mounting substrate and contacts the mounting substrate.

  Thereby, a convex part can be plastically deformed by the mechanical stress at the time of forming a hollow in the plane part of the convex part of a base.

  Alternatively, in one aspect of the method for manufacturing a lamp according to the present invention, the convex portion further includes a thin portion that is thinner than other portions in the convex portion, and the mounting substrate is fixed to the base. In the step of performing, it is preferable that the side wall portion of the convex portion is protruded toward the mounting substrate and is brought into contact with the mounting substrate by pressurizing the thin portion.

  Thereby, since the mechanical strength of the convex part in a thin part becomes lower than the mechanical strength of the convex part except a thin part, the convex part in a thin part becomes easy to carry out plastic deformation by stress. Therefore, a fixing part for fixing the mounting substrate can be easily formed. In addition, workability is improved because the thin portion serves as a mark indicating the stress application position.

  Furthermore, in one aspect of the method for manufacturing a lamp according to the present invention, the thin portion is preferably a linear groove portion.

  Thereby, since the fixing portion for supporting the mounting substrate can be formed in a straight line, the mounting substrate can be firmly supported and fixed, and the heat dissipation can be further improved.

  Further, in one aspect of the method for manufacturing a lamp according to the present invention, the base is provided with a mounting surface for mounting the mounting substrate and a protruding portion protruding in a direction substantially parallel to the mounting surface. In the step of fixing the mounting board to the base, the mounting part is plastically deformed so that the protruding part of the protruding part contacts the mounting board. It is preferable to fix the substrate to the base.

  Thereby, since the projecting portion has low mechanical strength and is easily plastically deformed, a fixing portion for easily supporting the mounting substrate can be formed.

  Further, in one aspect of the lamp manufacturing method according to the present invention, in the step of fixing the mounting substrate to the base, a part of the base is plastically deformed by caulking part of the base. The mounting board is preferably fixed to the base.

  Thereby, the mounting substrate can be fixed to the base by caulking.

  Also, one aspect of the lamp according to the present invention is a housing, a base disposed in the housing, a mounting substrate placed on the base, and a semiconductor light emitting element mounted on the mounting substrate. The base has a fixing part for fixing the mounting board formed by plastic deformation of a part of the base, and the mounting board is fixed by the fixing part. It is fixed to the base.

  Thereby, the fixing | fixed part for fixing a mounting board | substrate can be formed by carrying out the plastic deformation of a part of base. Therefore, the mounting substrate can be fixed to the base with a simple configuration without using a separate fixing member. In addition, since the mounting substrate can be fixed to the base without using an adhesive, the mounting substrate does not drop due to insufficient adhesive fixing force. Furthermore, since the mounting substrate is fixed using a part of the base, the heat dissipation of the heat generated in the semiconductor light emitting element can be improved.

  Furthermore, in one aspect of the lamp according to the present invention, the base includes a mounting surface for mounting the mounting substrate, and a side wall portion facing the side surface of the mounting substrate mounted on the mounting surface. And the fixing portion is formed by plastically deforming the convex portion so that the side wall portion of the convex portion protrudes toward the mounting substrate and contacts the mounting substrate. It is preferred that

  Thereby, a fixing | fixed part can be formed using the side wall part which opposes a mounting board | substrate.

  Furthermore, in one aspect of the lamp according to the present invention, the convex portion further includes a flat portion having a predetermined distance in the thickness direction of the mounting substrate from the mounting surface, and the fixing portion is the flat portion. It is preferable that the protrusion is formed by plastic deformation by the stress when forming the depression.

  Thereby, a fixing | fixed part can be formed with the mechanical stress at the time of forming a hollow in the plane part of the convex part of a base.

  Alternatively, in one aspect of the lamp according to the present invention, the convex portion further includes a thin portion that is thinner than other portions in the convex portion, and the fixing portion pressurizes the thin portion. It is preferable that the protrusion is formed by plastic deformation by the stress of.

  Thereby, since the mechanical strength of the convex part in a thin part becomes lower than the mechanical strength of the convex part except a thin part, the convex part in a thin part becomes easy to carry out plastic deformation by stress. Therefore, a fixing part for fixing the mounting substrate can be easily formed. In addition, workability is improved because the thin portion serves as a mark indicating the stress application position.

  Furthermore, in one aspect of the lamp according to the present invention, it is preferable that the thin portion is a linear groove portion.

  Thereby, since the fixing portion for supporting the mounting substrate can be formed in a straight line, the mounting substrate can be firmly supported and fixed, and the heat dissipation can be further improved.

  Further, in one aspect of the lamp according to the present invention, the base includes a mounting surface on which the mounting substrate is mounted, and a protrusion provided with a protruding portion protruding in a direction substantially parallel to the mounting surface. It is preferable that the fixing portion is formed by plastically deforming the protruding portion so that the protruding portion contacts the mounting substrate.

  Thereby, since the projecting portion has low mechanical strength and is easily plastically deformed, a fixing portion for easily supporting the mounting substrate can be formed.

  Moreover, the one aspect | mode of the illuminating device which concerns on this invention is equipped with the one aspect | mode of said lamp | ramp.

  Thus, the present invention can also be realized as an illumination device including the above-described lamp.

  According to the lamp and the illumination device of the present invention, the LED module can be fixed to the base with a simple configuration, and the heat dissipation of the heat generated in the semiconductor light emitting element can be improved.

  Further, according to the lamp manufacturing method of the present invention, the LED module can be fixed to the base by a simple method, and the heat dissipation of the heat generated in the semiconductor light emitting element can be improved.

FIG. 1 is a partially cutaway external perspective view showing a schematic configuration of a lamp according to a first embodiment of the present invention. FIG. 2 is a plan view of the LED module in the lamp according to the first embodiment of the present invention. FIG. 3A is a partially enlarged plan view of the base on which the LED module is placed in the lamp according to the first embodiment of the present invention, and FIG. It is sectional drawing of the same base cut | disconnected along the XX 'line of a). FIG. 4 is an enlarged perspective view of a base in the lamp according to the first embodiment of the present invention. FIG. 5A to FIG. 5C are cross-sectional views showing the steps of the lamp manufacturing method according to the first embodiment of the present invention. FIG. 6A is a partially enlarged plan view of the base on which the LED module is placed in the lamp according to the second embodiment of the present invention, and FIG. It is sectional drawing of the same base cut | disconnected along the XX 'line of a). FIG. 7 is an enlarged perspective view of the base in the lamp according to the second embodiment of the present invention. FIG. 8A to FIG. 8B are cross-sectional views showing the steps of the lamp manufacturing method according to the first embodiment of the present invention. FIG. 9A and FIG. 9B are cross-sectional views showing the steps of the lamp manufacturing method according to the first modification of the second embodiment of the present invention. FIG. 10A and FIG. 10B are cross-sectional views showing the steps of the lamp manufacturing method according to the second modification of the second embodiment of the present invention. FIG. 11A is a partially enlarged plan view of a base on which an LED module is placed in a lamp according to a third embodiment of the present invention, and FIG. It is sectional drawing of the same base cut | disconnected along the XX 'line of a). 12 (a) to 12 (c) are cross-sectional views illustrating the steps of the lamp manufacturing method according to the third embodiment of the present invention. FIG. 13 is a perspective view showing a configuration of a lighting apparatus according to the fourth embodiment of the present invention. FIG. 14 is a partially enlarged plan view of a base in a state where an LED module is placed in a lamp according to another embodiment of the present invention. FIG. 15 is an enlarged perspective view of a base in a lamp according to another embodiment of the present invention. FIG. 16A to FIG. 16C are cross-sectional views showing the steps of the lamp manufacturing method according to the fifth embodiment of the present invention. FIG. 17A to FIG. 17C are cross-sectional views showing the steps of the lamp manufacturing method according to the sixth embodiment of the present invention. FIG. 18 is a perspective view of another LED module according to the present invention.

  Hereinafter, a lamp, a method for manufacturing the lamp, and a lighting device according to an embodiment of the present invention will be described with reference to the drawings.

(First embodiment)
First, a lamp 1 according to a first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a partially cutaway external perspective view showing a schematic configuration of a lamp according to a first embodiment of the present invention.

  As shown in FIG. 1, a lamp 1 according to a first embodiment of the present invention is a straight tube type LED lamp having substantially the same shape as a straight tube fluorescent lamp, and includes a long tubular straight tube 10 and an LED module. 20 and a base 30 on which the LED module 20 is placed. Further, the lamp 1 includes a pair of caps 40 attached to both ends of the straight tube 10.

  Note that a lighting circuit (not shown) is installed inside or outside the lamp 1 to receive power through the base 40 and cause the LED of the LED module 20 to emit light. For example, the lighting circuit can be configured by a rectifier circuit including a diode bridge using four Zener diodes.

  Next, the detailed configuration of each component of the lamp shown in FIG. 1 will be described below.

  First, the straight pipe 10 according to the present embodiment will be described. As shown in FIG. 1, the straight pipe 10 is a housing (envelope) for housing the LED module 20 and the base 30. The straight pipe 10 is a long cylindrical body having openings at both ends, and its cross-sectional shape is an annular shape. The straight tube 10 can be formed of a glass tube or a plastic tube.

In the present embodiment, the straight tube 10 is a glass tube, and is composed of, for example, soda-lime glass in which silica (SiO ₂ ) is composed of 70 to 72 [%]. The straight pipe 10 has the same dimensional standard as that of the straight pipe before sealing both ends used for manufacturing a fluorescent lamp specified in JIS (Japanese Industrial Standard). As the straight tube 10, for example, a glass tube having a length of 1198 [mm], an outer diameter of 25.5 [mm], and a thickness of 0.7 [mm] is used.

  Moreover, it is preferable that the outer surface or inner surface of the straight pipe 10 is subjected to a diffusion treatment. Thereby, the light emitted from the LED module 20 can be diffused. As the diffusion treatment, for example, there is a method of applying silica, calcium carbonate or the like to the inner surface of the straight tube 10 such as a glass tube.

  Next, the LED module 20 according to the present embodiment will be described with reference to FIG. FIG. 2 is a plan view of the LED module in the lamp according to the first embodiment of the present invention.

  As shown in FIG. 2, the LED module 20 according to the present embodiment is a COB type (Chip On Board) light emitting module, and is a linear light source that emits light in a linear shape (linear shape). The LED module 20 includes a mounting substrate 21, a plurality of LEDs 22 arranged on the mounting substrate 21, and a sealing member 23 that seals the LEDs 22. Further, the LED module 20 includes a wiring 24, an electrostatic protection element 25, an electrode terminal 26, and a wire 27.

  The mounting substrate 21 is an LED mounting substrate for mounting the LEDs 22, and is a long rectangular substrate in this embodiment. As the mounting substrate 21, a ceramic substrate made of alumina or translucent aluminum nitride, an aluminum substrate made of aluminum alloy, a transparent glass substrate, a flexible flexible substrate (FPC) made of resin, or the like can be used. In the present embodiment, the mounting substrate 21 has a long side (length in the longitudinal direction) of 140 [mm], a short side (length in the short direction) of 7 [mm], and a thickness of 1 [mm]. A ceramic substrate made of alumina (alumina substrate) was used.

  The plurality of LEDs 22 is an example of a semiconductor light emitting element, and is directly mounted on the mounting substrate 21. The plurality of LEDs 22 are arranged in a line (in a straight line) along the longitudinal direction of the mounting substrate 21. Each LED 22 is a bare chip that emits monochromatic visible light, and is die-bonded on the mounting substrate 21 by a die attach material (die bond material). As each LED 22, for example, a blue light emitting LED chip that emits blue light is used. As the blue light emitting LED chip, for example, a gallium nitride based semiconductor light emitting element made of an InGaN based material and having a center wavelength of 440 nm to 470 nm can be used.

  The sealing member 23 is a phosphor-containing resin containing a phosphor that is a light wavelength converter, and converts the wavelength of the light from the LED 22 and simultaneously seals all the LEDs 22 on the mounting substrate 21 to form the LED 22. Protect. The sealing member 23 has a substantially semicircular dome shape whose cross-sectional shape is convex upward, and is formed linearly along the arrangement direction of the LEDs 22 so as to cover all the LEDs 22 on the mounting substrate 21. In the present embodiment, the linear (stripe-shaped) sealing member 23 is formed closer to one long side than a straight line passing through the center of the mounting substrate 21 in the short direction. The sealing member 23 is formed without interruption from the end surface of one short side of the mounting substrate 21 to the end surface of the other short side. As the sealing member 23, for example, when the LED 22 is a blue light emitting LED, a phosphor-containing resin in which YAG (yttrium, aluminum, garnet) -based yellow phosphor particles are dispersed in a silicone resin in order to obtain white light. Can be used.

  In this embodiment, a blue light-emitting LED chip is used as the LED 22, and a phosphor-containing resin containing yellow phosphor particles is used as the sealing member 23. As a result, the yellow phosphor particles are excited by the blue light of the blue light emitting LED chip to emit yellow light, so that the excited yellow light and the blue light of the blue light emitting LED chip are emitted from the sealing member 23 (light emitting portion). And emits white light.

  The wiring 24 is a metal wiring made of tungsten (W), copper (Cu), or the like, and is patterned in a predetermined shape in order to electrically connect the plurality of LEDs 22 to each other. Further, the wiring 24 is patterned so as to electrically connect the plurality of LEDs 22 and the electrostatic protection element 25 and also to the electrode terminal 26.

  The electrostatic protection element 25 is, for example, a Zener diode, and prevents the LED 22 having a low reverse withstand voltage from being destroyed by static electricity having a reverse polarity generated on the mounting substrate 21.

  The electrode terminal 26 is a power supply / reception unit (external connection terminal) that receives DC power from an external power source and supplies DC power to the LED 22, and is electrically connected to the wiring 24. For example, when a direct current is supplied from the electrode terminal 26 to the LED 22, the LED 22 emits light, and desired light is emitted from the LED 22. In the present embodiment, the two electrode terminals 26 are offset to one long side of the mounting substrate 21 with the sealing member 23 as a reference.

  The wire 27 is an electric wire for electrically connecting the LED 22 and the wiring 24, and is composed of, for example, a gold wire. A p-side electrode and an n-side electrode for supplying current are formed on the upper surface of the chip of the LED 22, and each of the p-side electrode and the n-side electrode and the wiring 24 are wire-bonded by wires 27.

  Next, the base 30 according to the present embodiment will be described with reference to FIG. FIG. 3A is a partially enlarged plan view of the base on which the LED module is placed in the lamp according to the first embodiment of the present invention, and FIG. It is sectional drawing of the same base cut | disconnected along the XX 'line of a).

  The base 30 is disposed inside the straight pipe 10 and is fixed to the straight pipe 10. As shown in FIGS. 3A and 3B, the base 30 is a long substrate on which a plurality of LED modules 20 are placed, and dissipates heat from the LED modules 20. It also functions as a heat sink. Therefore, the base 30 is preferably composed of a high thermal conductivity material such as a metal. In this embodiment, a long aluminum substrate made of aluminum is used.

  Moreover, as shown in FIG.3 (b), in this embodiment, the base 30 is a semi-cylinder shape, and the surface of the planar surface is the mounting surface 31 for mounting the LED module 20, The back surface of the cylindrical surface is a surface facing the straight pipe 10. The cylindrical surface on the back side of the base 30 has substantially the same shape as the inner surface of the straight pipe 10, and the cylindrical surface on the back side of the base 30 and the inner surface of the straight pipe 10 are bonded with an adhesive or the like. 10 and the base 30 are fixed. Thereby, since the base 30 is interposed between the straight tube 10 and the LED module 20, the heat of the LED module 20 can be efficiently guided to the straight tube 10. Therefore, the heat of the LED module 20 can be radiated from the outer surface of the straight tube 10.

  As described above, in the present embodiment, the mounting substrate 21 is used as the primary mounting substrate for the LEDs, and the base 30 is used as the secondary mounting substrate.

  Here, the base 30 will be described in detail with reference to FIG. FIG. 4 is an enlarged perspective view of a base in the lamp according to the first embodiment of the present invention.

  As shown in FIG. 3A and FIG. 4, the base 30 has an elongated shape along the tube axis direction of the straight pipe 10, and one surface (front surface) of the base 30 is A long convex portion 32 having a convex cross section formed along the tube axis direction is formed. In the present embodiment, the two convex portions 32 are provided so as to be opposed to each other with a predetermined interval, and a concave portion (groove) extending along the tube axis direction is constituted by the opposed convex portions 32.

  As shown in FIGS. 3B and 4, the bottom surface of the concave portion constituted by the two convex portions 32 is a mounting surface 31 for mounting the mounting substrate 21 of the LED module 20, and has a planar shape. It consists of a flat part. On the mounting surface 31, the plurality of LED modules 20 are mounted in a line along the longitudinal direction of the base 30 (the tube axis direction of the straight pipe). Further, as shown in FIG. 3A, for the adjacent LED modules 20, the electrode terminal 26 of one LED module 20 and the electrode terminal 26 of the other LED module 20 adjacent to this are connected by a wiring 50. Electrically connected. Thereby, LED22 of the some LED module 20 on the base 30 is connected in series. In addition, the wiring 50 can be comprised by electrically conductive members, such as a lead wire which consists of a conducting wire with an insulating film, for example.

  As shown in FIGS. 3B and 4, the convex portion 32 of the base 30 has a side wall portion 32 a that faces the side surface of the mounting substrate 21 and a predetermined distance from the mounting surface 31 in the thickness direction of the mounting substrate 21. And a flat planar portion 32b (flat portion) having Further, a fixing portion 33 for fixing the mounting substrate 21 to the base 30 is formed on the convex portion 32 of the base 30. The fixed portion 33 is configured by plastically deforming a part of the convex portion 32 of the base 30.

  In the present embodiment, the fixing portion 33 is formed by plastically deforming the side wall portion 32 a of the convex portion 32. A plurality of conical depressions 34 are formed in the flat surface portion 32 b of the convex portion 32. The fixing portion 33 is formed by plastic deformation of the convex portion 32 due to mechanical stress when the depression 34 is formed in the flat portion 32 b of the convex portion 32.

  Specifically, the fixing portion 33 is formed by pressurizing the flat portion 32b of the convex portion 32 with a punch or the like to form the depression 34. In this case, when the recess 34 is formed, a stress is generated in the convex portion 32, and the side wall portion 32 a of the convex portion 32 is plastically deformed by the stress so as to protrude toward the mounting substrate 21. The protruding side wall portion 32 a abuts on the mounting substrate 21 as a fixing portion 33 and supports the mounting substrate 21 by pressing the mounting substrate 21 from obliquely above the mounting substrate 21. By this plastic deformation, the interval between the opposing sidewall portions 32a is narrowed, and the interval between the sidewall portions 32a in the portion where the fixing portion 33 is formed is larger than the interval between the sidewall portions 32a in the portion where the fixing portion 33 is not formed. It is getting shorter.

  As described above, the lamp 1 according to the present embodiment forms the fixing portion 33 for fixing the LED module 20 using a part of the base 30, and the edge of the convex portion 32 of the base 30. The side wall part 32a is adhered to the mounting substrate 21 so as to caulk the side wall part 32a as a part. Thereby, the LED module 20 (mounting substrate 21) is fixed to the base 30 by the fixing portion 33, and the movement of the mounting substrate 21 is restricted in this fixed state. In other words, the movement of the mounting substrate 21 in the direction perpendicular to the mounting surface 31 is restricted by the fixing portion 33 that contacts the mounting substrate 21, and is parallel to the mounting surface 31 and with respect to the longitudinal direction of the base 30. The movement of the mounting substrate 21 in the vertical direction is restricted. In the present embodiment, the movement of the mounting substrate 21 in the longitudinal direction of the base 30 is also restricted by the fixing portion 33.

  Further, the fixing portion 33 formed in this way is a part of the base 30 as a heat sink and is formed so as to be in contact with the LED mounting surface (front surface) of the mounting substrate 21. Thereby, the heat generated in the LED is conducted through the mounting substrate 21 and is conducted from the LED mounting surface of the mounting substrate 21 to the fixing portion 33. That is, the heat generated in the LED can be conducted from the fixing portion 33 as well. Thereby, the heat dissipation of the LED module 20 can also be improved. In addition, since the LED module 20 tends to accumulate heat in a center part, it is preferable to form the fixing | fixed part 33 in the at least center part of the LED module 20 (mounting board | substrate 21).

  In the present embodiment, considering the fixing state of the LED module 20 to the base 30 and the heat dissipation, four fixing portions 33 are formed for one LED module 20 as shown in FIG. Then, two are formed so as to face each other on one long side and two on the other long side.

  Returning to FIG. 1, the pair of caps 40 according to the present embodiment will be described next. Each base 40 includes a bottomed cylindrical base body and a pair of base pins extending outward from the outer surface of the bottom of the base body. The base 40 can be appropriately selected according to the lighting fixture to which the lamp 1 is mounted. For example, a G-type base or the like is used. Electric power can be supplied to the LED module 20 by the base pin of the base 40. In this case, the power supply to the LED module 20 may be configured to be performed from both of the pair of caps 40, or may be configured to be performed from only one of them. In the latter case, the other base is used to attach to the luminaire.

  As described above, the straight pipe 10 and the base 30 are fixed by an adhesive (not shown). The adhesive is disposed between the back surface of the base 30 and the inner surface of the straight pipe 10. As the adhesive, it is preferable to use a material having a thermal conductivity of 1 [W / m · K] or more from the viewpoint of heat dissipation, and from the viewpoint of weight reduction, an adhesive having a specific gravity of 2 or less. It is preferable to use it. As the adhesive, for example, an adhesive made of silicone resin or cement is used.

  Next, a method for manufacturing the lamp according to the first embodiment of the present invention will be described with reference to FIG. FIG. 5A to FIG. 5B are cross-sectional views showing the steps of the lamp manufacturing method according to the first embodiment of the present invention.

  First, as shown in FIG. 5A, a plurality of mounting boards 21 (LED modules 20) on which LEDs (not shown) are mounted are placed on a placement surface 31 of a base 30 (mounting board placement step). ). At this time, the length of the mounting surface 31 in the width direction of the mounting substrate 21 (the interval between the side wall portions 32a of the opposing convex portions 32) is configured to be slightly longer than the length of the mounting substrate 21 in the width direction. ing. That is, a slight gap exists between the side wall portion 32a and the mounting substrate 21. This takes into consideration the ease of work when placing the LED module 20 and the prevention of chipping of the mounting substrate 21 when placing the LED module 20.

  Subsequently, as shown in the figure, the center punch 100 having a sharp tip is disposed so as to face the flat portion 32 b of the convex portion 32 of the base 30. At this time, the distance between the tip of the center punch 100 and the side wall surface of the side wall portion 32a of the convex portion 32 (the mounting substrate side edge of the flat surface portion 32b) is such that the side wall portion 32a of the convex portion 32 when the recess 34 is formed. The distance is set such that it protrudes toward the mounting substrate 21 and comes into contact with the mounting substrate 21. The distance between the tip of the center punch 100 and the side wall surface of the side wall part 32a of the convex part 32 (the mounting board side edge of the flat part 32b) is preferably 0.5 [mm] to 2.0 [mm]. In this embodiment, the thickness is 1.0 [mm]. Note that the position of the tip of the center punch 100 is controlled by recognizing the mounting board side edge (edge) of the flat portion 32b by image processing or the like and controlling the position from the edge to be a predetermined distance. be able to. Alternatively, the position of the tip of the center punch 100 can be controlled by attaching a recognition mark or the like to the surface of the flat portion 32b in advance.

  Next, as shown in FIG. 5B, a part of the base 30 is plastically deformed by the center punch 100 to fix the mounting board 21 to the base 30 (mounting board fixing step).

  Specifically, as shown in the figure, the center punch 100 allows the side wall portion 32a of the convex portion 32 to protrude toward the mounting substrate 21 and to come into contact with the mounting substrate 21. Make a dent in place. That is, a recess is formed so that the interval between the side wall portions 32a of the convex portions 32 facing each other is narrowed.

  As a result, the flat surface portion 32 b of the convex portion 32 is pressurized by the tip of the center punch 100, and the side wall portion 32 a of the convex portion 32 protrudes toward the mounting substrate 21 due to the mechanical stress generated in the convex portion 32 by this pressurization. To contact the mounting substrate 21. As a result, the protruding and abutting side wall portion 32a supports the mounting substrate 21 as a fixing portion 33 so as to press the mounting substrate 21 obliquely from above. As described above, in this embodiment, the side wall portion 32 a of the convex portion 32 of the base 30 is plastically deformed so as to be caulked, and is in close contact with the mounting substrate 21 as the fixing portion 33. Thereby, the movement of the mounting substrate 21 is restricted, and the mounting substrate 21 can be fixed to the base 30.

  It is preferable that the center punch 100 is pressed with a pressing force that does not give an impact to the mounting substrate 21. The same applies to the following embodiments.

  Next, as shown in FIG. 5 (c), the center punch 100 is removed from the base 30. Thereby, it will be in the state where the dent 34 was formed in the flat part of the convex part 32 of the base 30 as a trace which formed the fixing | fixed part 33. FIG.

  Thereafter, although not shown, the base 30 on which the mounting substrate 21 is fixed is placed on the straight pipe 10 (base placement step). At this time, the base 30 and the straight pipe 10 are fixed by, for example, an adhesive. Specifically, the base 30 to which the adhesive is applied is inserted through one opening of the straight pipe 10 made of a glass tube, and the base 30 is disposed at a predetermined position in the straight pipe 10. Thereafter, the adhesive is cured by a predetermined method. Further, after that, other parts such as a base 40 are provided. Thereby, the lamp 1 can be completed.

  In FIG. 5, the case where the fixing portion 33 is formed only on one convex portion 32 is illustrated, but the other convex portion 32 can be similarly performed. Or you may form the fixing | fixed part 33 simultaneously about the convex part 32 which opposes.

  As described above, the lamp 1 and the manufacturing method thereof according to the first embodiment of the present invention are based on the LED module 20 by the fixing portion 33 formed by plastically deforming a part (the convex portion 32) of the base 30. It can be fixed to the base 30. Therefore, the LED module 20 can be fixed to the base 30 with a simple configuration without using a separate fixing member. Moreover, since the LED module 20 can be fixed to the base 30 without using an adhesive, the problem of dropping of the LED module that may occur when the LED module 20 is fixed only by the adhesive does not occur.

  Further, according to the lamp 1 and the manufacturing method thereof according to the first embodiment of the present invention, the fixing portion 33 which is a part of the base 30 is in contact with the mounting substrate 21, so that heat generated in the LED module 20 is dissipated. It can also improve the performance.

(Second Embodiment)
Next, a lamp according to a second embodiment of the present invention will be described with reference to FIGS. 6 (a), 6 (b) and 7. FIG. 6A is a partially enlarged plan view of the base on which the LED module is placed in the lamp according to the second embodiment of the present invention, and FIG. It is sectional drawing of the same base cut | disconnected along the XX 'line of a). FIG. 7 is an enlarged perspective view of the base in the lamp according to the second embodiment of the present invention.

  The LED lamp according to the second embodiment of the present invention has the same basic configuration as the lamp 1 according to the first embodiment of the present invention. Accordingly, in FIGS. 6A, 6B and 7, the same components as those shown in FIGS. 3A, 3B and 4 are denoted by the same reference numerals. Detailed description will be omitted or simplified.

  The lamp according to the second embodiment of the present invention is different from the lamp 1 according to the first embodiment of the present invention in the configuration of the base 30A.

  As shown in FIGS. 6A and 7, the base 30 </ b> A according to the present embodiment has a long shape along the tube axis direction of the straight pipe 10, similarly to the base 30 according to the first embodiment. On one surface (front surface) of the base 30A, a long convex portion 32A having a convex cross section formed along the tube axis direction is formed. Also in this embodiment, the two convex portions 32A are provided so as to face each other with a predetermined interval, and the concave portions (grooves) extending along the tube axis direction are configured by the facing convex portions 32A.

  Further, as shown in FIGS. 6B and 7, the bottom surface of the concave portion constituted by the two convex portions 32 </ b> A is a mounting surface 31 </ b> A for mounting the mounting substrate 21 of the LED module 20. It is comprised by the shape flat part. On the mounting surface 31A, the plurality of LED modules 20 are mounted in a line along the longitudinal direction of the base 30A (the tube axis direction of the straight pipe).

  As shown in FIGS. 6B and 7, the convex portion 32 </ b> A of the base 30 </ b> A has a predetermined distance in the thickness direction of the mounting substrate 21 from the mounting surface 31 </ b> A and the side wall portion 32 </ b> Aa facing the side surface of the mounting substrate 21. It has the planar plane part 32Ab (flat part) which has. Further, an elongated fixing portion 36 for fixing the mounting substrate 21 to the base 30A is formed on the convex portion 32A of the base 30A. The fixed portion 36 is configured by plastically deforming a part of the convex portion 32A of the base 30A.

  In this embodiment, unlike the first embodiment, the convex portion 32 </ b> A of the base 30 </ b> A has a groove portion 35 for forming the fixing portion 36. The groove part 35 is formed so as to be recessed from the surface of the flat part 32Ab of the convex part 32A in the vicinity of the side wall part 32Aa of the convex part 32A. The groove portion 35 formed in this way is a thin-walled portion that is thinner than the other portions in the convex portion 32A, and is already formed before the convex portion 32A is plastically deformed. In the present embodiment, the groove portion 35 has a concave cross-sectional shape and is formed in a straight line along the longitudinal direction of the base 30A.

  Also in the present embodiment, as in the first embodiment, the fixing portion 36 is formed by plastically deforming the side wall portion 32Aa of the convex portion 32A. However, in the present embodiment, the fixing portion 36 is fixed using the groove portion 35. A portion 36 is formed.

  That is, the groove 35 formed in advance before the plastic deformation of the protrusion 32A has the mechanical strength of the protrusion 32A in the periphery of the groove 35, and particularly the mechanical strength of the side wall 32Aa closer to the mounting substrate 21 than the groove 35. The mechanical strength of the convex portion 32A other than the peripheral portion of the groove portion 35 is lower. Accordingly, the side wall 32Aa of the convex portion 32A is easily plastically deformed by a stress such as pressurization, so that the fixing portion 36 can be easily formed.

  Furthermore, the groove part 35 can be used as a mark (recognition mark) indicating a stress application position when applying stress to the convex part 32A. Thereby, since the location which pressurizes convex part 32A can be specified easily, the workability | operativity at the time of forming the fixing | fixed part 36 improves.

  The specific formation of the fixing portion 36 is performed by applying a pressure in the lateral direction to the side wall portion 32Aa of the convex portion 32A by rolling a pressure roller or the like along the groove portion 35. The side wall portion 32Aa of the convex portion 32A is plastically deformed so as to protrude toward the mounting substrate 21 by the mechanical stress generated at this time, and the fixing portion 36 is formed by this plastic deformation. Since the fixing portion 36 formed in this way is formed linearly along the longitudinal direction of the base 30, it abuts on all the long side portions of the mounting substrate 21 and is mounted from obliquely above the mounting substrate 21. The long side portion of the substrate 21 is supported so as to be pressed. In addition, the space | interval of the opposing side wall part 32Aa is narrowed by this plastic deformation.

  As described above, the lamp according to the present embodiment also forms the fixing portion 36 that fixes the LED module 20 using a part of the base 30A, and is an edge portion of the convex portion 32A of the base 30A. The side wall 32Aa is brought into close contact with the mounting substrate 21 so as to caulk the side wall 32Aa. Thereby, the LED module 20 (mounting substrate 21) is fixed to the base 30A by the fixing portion 36, and the movement of the mounting substrate 21 is restricted in this fixed state. That is, the movement of the mounting substrate 21 in the direction perpendicular to the mounting surface 31A is restricted by the fixing portion 36 that contacts the mounting substrate 21, and is parallel to the mounting surface 31A and with respect to the longitudinal direction of the base 30A. The movement of the mounting substrate 21 in the vertical direction is restricted. Also in the present embodiment, the movement of the mounting substrate 21 in the longitudinal direction of the base 30 </ b> A is also restricted by the fixing portion 36.

  Further, in the present embodiment, unlike the first embodiment, the entire length side portion of the mounting substrate 21 is supported by the fixing portion 36 extending along the longitudinal direction of the base 30. Thereby, the mounting substrate 21 can be supported and fixed more firmly than in the first embodiment.

  Also in this embodiment, the fixing portion 36 is a part of the base 30 </ b> A as a heat sink and is formed so as to be in contact with the LED mounting surface (front surface) of the mounting substrate 21. Thereby, the heat generated in the LED is conducted through the mounting substrate 21 and is conducted from the LED mounting surface of the mounting substrate 21 to the fixing portion 36. That is, the heat generated in the LED can be conducted from the fixing portion 36 as well. Thereby, the heat dissipation of the LED module 20 can also be improved. In addition, in the present embodiment, since the entire length side portion of the mounting substrate 21 is in contact with the fixed portion 36, the heat dissipation can be further improved as compared with the first embodiment.

  Next, a method for manufacturing a lamp according to the second embodiment of the present invention will be described with reference to FIG. FIG. 8A to FIG. 8C are cross-sectional views showing steps of a lamp manufacturing method according to the second embodiment of the present invention.

  First, as shown in FIG. 8A, as in the first embodiment, a plurality of mounting boards 21 (LED modules 20) on which LEDs (not shown) are mounted are placed on the mounting surface 31A of the base 30A. Place. Subsequently, as shown in the figure, the roller 100A having a sharp tip is disposed so as to face the groove portion 35 of the base 30A.

  Next, as shown in FIG. 8B, a part of the base 30A is plastically deformed by the roller 100A to fix the mounting substrate 21 to the base 30A.

  Specifically, as shown in the figure, the peripheral portion of the groove portion 35 of the convex portion 32A by the roller 100A so that the side wall portion 32Aa of the convex portion 32A protrudes toward the mounting substrate 21 and contacts the mounting substrate 21. Pressurize. At this time, the roller 100A is rolled along the groove portion 35 so that all of the side wall portions 32Aa formed along the longitudinal direction of the base 30A are successively tilted toward the mounting substrate 21 side. That is, the roller 100A advances along the longitudinal direction of the base 30A while applying pressure to the depth direction of the groove portion 35 (the vertical direction of the flat surface portion 32Ab) and the side wall portion 32Aa.

  As a result, as shown in FIG. 8C, an elongated fixing portion 36 for fixing the mounting substrate 21 to the base 30A can be formed.

  That is, the side wall portion 32Aa of the convex portion 32A is sequentially pressed along the longitudinal direction of the substrate 30 by the roller 100A, and the side wall portion 32Aa of the convex portion 32A is mounted by the mechanical stress generated in the convex portion 32A by this pressurization. It protrudes toward the substrate 21 and comes into contact with the mounting substrate 21. As a result, the protruding and abutting side wall portion 32Aa supports the mounting substrate 21 as a fixing portion 36 so as to hold the mounting substrate 21 from obliquely above the mounting substrate 21. As described above, the side wall portion 32Aa of the convex portion 32A of the base 30A is plastically deformed so as to be caulked, and is in close contact with the mounting substrate 21 as the fixing portion 36. Thereby, the movement of the mounting substrate 21 is restricted, and the mounting substrate 21 can be fixed to the base 30.

  Thereafter, in the same manner as in the first embodiment, the lamp 30 can be completed by arranging the base 30A to which the mounting substrate 21 is fixed in the straight tube 10 and providing other parts such as the cap 40.

  Although FIG. 8 illustrates the case where the fixing portion 36 is formed only on one of the convex portions 32A, the same can be applied to the other convex portion 32A. Or you may form the fixing | fixed part 36 simultaneously about the convex part 32A which opposes.

  As described above, in the lamp and the manufacturing method thereof according to the second embodiment of the present invention, as in the first embodiment, the fixed portion formed by plastically deforming a part of the base 30A (the convex portion 32A). 36, the LED module 20 can be fixed to the base 30A. Therefore, the LED module 20 can be fixed to the base 30A with a simple configuration without using a separate fixing member. Moreover, since the LED module 20 can be fixed to the base 30A without using an adhesive, the problem of dropping of the LED module that may occur when the LED module 20 is fixed only by the adhesive does not occur. Furthermore, according to the lamp and the manufacturing method thereof according to the present embodiment, since the full length side portion of the mounting substrate 21 is supported by the fixing portion 36, the mounting substrate 21 can be supported and fixed more firmly.

  Further, according to the lamp 1 and the manufacturing method thereof according to the second embodiment of the present invention, the fixed portion 33 that is a part of the base 30 is in contact with the mounting substrate 21 as in the first embodiment. The heat dissipation of the heat generated in the LED module 20 can also be improved. In addition, in the present embodiment, since the entire length side portion of the mounting substrate 21 is in contact with the fixed portion 36, the heat dissipation can be further improved.

  Furthermore, according to the lamp and the manufacturing method thereof according to the second embodiment of the present invention, the fixing portion 36 can be formed using the groove portion 35. Accordingly, the side wall portion 32Aa of the convex portion 32A is easily plastically deformed, and thus the fixing portion 36 can be easily formed. Moreover, since the groove part 35 becomes a mark which shows a stress addition position, the workability | operativity at the time of forming the fixing | fixed part 36 improves.

(Modification 1 of 2nd Embodiment)
Next, the lamp | ramp which concerns on the modification 1 of the 2nd Embodiment of this invention is demonstrated using FIG. FIG. 9A and FIG. 9B are cross-sectional views showing the steps of the lamp manufacturing method according to the first modification of the second embodiment of the present invention. FIGS. 9A and 9B correspond to FIGS. 8A and 8C, respectively.

  The lamp according to the first modification differs from the lamp according to the second embodiment of the present invention shown in FIG. 8 in the configuration of the base 30B.

  In the first modification, the convex portion 32B of the base 30B is provided on the mounting substrate 21 from the side wall portion 32Ba facing the side surface of the mounting substrate 21 and the mounting surface 31B, as in the second embodiment shown in FIG. A flat surface portion 32Bb (flat portion) having a predetermined distance in the thickness direction is provided, and a groove portion 35B for forming the fixing portion 36B is formed in the vicinity of the side wall portion 32Ba of the convex portion 32B.

  And in this modification 1, unlike 2nd Embodiment, the groove part 35B is formed so that the bottom face may become the same surface as the mounting surface 31B. That is, the groove part 35B according to the first modification is formed to have a depth greater than that of the groove part 35 according to the second embodiment. Other configurations are the same as those of the second embodiment.

  The fixing portion 36B according to the first modification can be formed by the same method as in the second embodiment. That is, the fixed part 36B is formed by plastically deforming the side wall part 32Ba of the convex part 32B by the roller 100A. In this case, in the first modification, since the depth of the groove portion 35B is deep, the mechanical strength of the convex portion 32B in the peripheral portion of the groove portion 35B is further reduced as compared with the second embodiment, so that the side wall is caused by mechanical stress. The portion 32Ba is more easily plastically deformed. Therefore, in the first modification, the fixing portion 36B can be formed more easily than in the second embodiment.

(Modification 2 of the second embodiment)
Next, the lamp | ramp which concerns on the modification 2 of the 2nd Embodiment of this invention is demonstrated using FIG. FIG. 10A and FIG. 10B are cross-sectional views showing the steps of the lamp manufacturing method according to the second modification of the second embodiment of the present invention. 10 (a) and 10 (b) correspond to FIGS. 8 (a) and 8 (c), respectively.

  The lamp according to the second modification is different from the lamp according to the second embodiment of the present invention shown in FIG. 8 in the configuration of the base 30C.

  In the second modification, the convex portion 32C of the base 30C is provided on the mounting substrate 21 from the side wall portion 32Ca facing the side surface of the mounting substrate 21 and the mounting surface 31C, as in the second embodiment shown in FIG. A flat surface portion 32Cb (flat portion) having a predetermined distance in the thickness direction is provided, and a groove portion 35C for forming a fixing portion 36C is formed in the vicinity of the side wall portion 32Ca of the convex portion 32C.

  In the second modification, the shape of the concave portion of the groove portion 35C is different from that of the groove portion 35 of the second embodiment, and the shape of the concave portion of the groove portion 35C in the second modification example is formed so that the cross section is V-shaped. ing. Other configurations are the same as those of the second embodiment.

  In the second modification, the fixing portion 36C can be formed by the same method as in the second embodiment. That is, the fixed part 36C is formed by plastically deforming the side wall part 32Ca of the convex part 32C by the roller 100A. In this case, in the second modification, since the cross-sectional shape of the groove 35C is a V-order shape, the sharp tip of the roller 100A is guided to the bottom of the V-shape, so the position of the tip of the roller 100A is set at a certain location ( V-bottom) can be stabilized. Thereby, the fixing portion 36C can be formed uniformly along the longitudinal direction of the base 30C.

(Third embodiment)
Next, a lamp according to a third embodiment of the present invention will be described with reference to FIG. FIG. 11A is a partially enlarged plan view of a base on which an LED module is placed in a lamp according to a third embodiment of the present invention, and FIG. It is sectional drawing of the same base cut | disconnected along the XX 'line of a).

  The lamp according to the third embodiment of the present invention has the same basic configuration as the lamp 1 according to the first embodiment of the present invention. Accordingly, in FIGS. 11A and 11B, the same components as those shown in FIGS. 3A and 3B are denoted by the same reference numerals, and detailed description thereof is omitted. Or simplify.

  The lamp according to the third embodiment of the present invention is different from the lamp 1 according to the first embodiment of the present invention in the configuration of the base 30D.

  As shown in FIG. 11A, the base 30D according to the present embodiment has an elongated shape along the tube axis direction of the straight pipe 10, as with the base 30 according to the first embodiment. In addition, on one surface (surface on the front side) of the base 30D, a long convex portion 32D having a convex cross section formed along the tube axis direction is formed. Also in this embodiment, the two convex portions 32D are provided so as to face each other with a predetermined interval, and a concave portion (groove) extending along the tube axis direction is configured by the facing convex portions 32D.

  Moreover, as shown in FIG. 11B, the bottom surface of the concave portion constituted by the two convex portions 32D is a mounting surface 31D for mounting the mounting substrate 21 of the LED module 20, and is flat and flat. It consists of parts. On the mounting surface 31D, the plurality of LED modules 20 are mounted in a line along the longitudinal direction of the base 30D (the tube axis direction of the straight pipe).

  As shown in FIGS. 11A and 11B, a fixing portion 37 is formed on the convex portion 32D of the base 30D. The fixing portion 37 is configured by plastically deforming a part of the convex portion 32D of the base 30D in order to fix the mounting substrate 21 to the base 30D. Specifically, the fixing portion 37 is formed by plastically deforming a protruding portion provided so as to protrude from the side wall surface of the convex portion 32D.

  That is, before pressurization, a punch or the like is pressed from the vertical direction of the mounting surface 31D against the bowl-shaped protruding portion provided so as to protrude substantially parallel to the mounting surface 31D from the top of the convex portion 32D. The protrusion is bent toward the mounting substrate 21 by the mechanical stress generated at this time. The bent protruding portion abuts on the mounting substrate 21 as the fixed portion 37 and supports the mounting substrate 21 from above the mounting substrate 21.

  At this time, the protrusion before pressurization is provided in a bowl shape so as to protrude from the upper part of the protrusion 32D toward the protrusion 32D facing the protrusion 32D (in the width direction of the recess between the protrusions). Therefore, the mechanical strength is weak, and it can be easily plastically deformed by stress such as pressurization. Thereby, the fixing | fixed part 37 can be processed and formed easily.

  Further, as shown in FIG. 11A, the fixing portion 37 is formed by plastically deforming a protruding portion that partially protrudes at a predetermined interval along the longitudinal direction of the base 30D. When stress is applied to the portion, the protrusion itself becomes a mark indicating the stress application position. Thereby, since the location to pressurize can be specified easily, the workability | operativity at the time of forming the fixing | fixed part 37 improves. In addition, this protrusion part is integrally molded with convex part 32D, and comprises a part of convex part 32D.

  As described above, the lamp according to the present embodiment forms the fixing portion 37 that fixes the LED module 20 by using a part of the base 30D, and the lamp provided on the convex portion 32D of the base 30D. The protrusion is shaped to be in close contact with the mounting substrate 21. As a result, the LED module 20 (mounting substrate 21) is fixed to the base 30D by the fixing portion 37 formed by the caulking protrusion, and the movement of the mounting substrate 21 is restricted in this fixed state. In other words, the movement of the mounting substrate 21 in the direction perpendicular to the mounting surface 31D is restricted by the fixing portion 37 that contacts the mounting substrate 21, and is parallel to the mounting surface 31D and with respect to the longitudinal direction of the base 30D. The movement of the mounting substrate 21 in the vertical direction is restricted. In the present embodiment, the movement of the mounting substrate 21 in the longitudinal direction of the base 30 </ b> D is also restricted by the fixing portion 37.

  Further, the fixing portion 37 formed in this way is a part of the base 30 </ b> D as a heat sink and is formed so as to be in contact with the LED mounting surface (front surface) of the mounting substrate 21. Thereby, the heat generated in the LED is conducted through the mounting substrate 21 and is conducted from the LED mounting surface of the mounting substrate 21 to the fixing portion 37. That is, the heat generated by the LED can be conducted from the fixing portion 37 as well. Thereby, the heat dissipation of the LED module 20 can also be improved. In addition, since the LED module 20 tends to accumulate heat in a center part, it is preferable to form the fixing | fixed part 37 at least in the center part of the LED module 20 (mounting board | substrate 21).

  In the present embodiment, considering the fixing state of the LED module 20 to the base 30 and the heat dissipation, four fixing portions 37 are formed for one LED module 20 as shown in FIG. Then, two are formed so as to face each other on one long side and two on the other long side.

  Next, a method for manufacturing a lamp according to the third embodiment of the present invention will be described with reference to FIG. 12 (a) to 12 (c) are cross-sectional views illustrating the steps of the lamp manufacturing method according to the third embodiment of the present invention. FIGS. 12A to 12C correspond to FIGS. 5A to 5C, respectively.

  First, as shown in FIG. 12A, as in the first embodiment, a plurality of mounting boards 21 (LED modules 20) on which LEDs (not shown) are mounted are mounted on a mounting surface 31D of a base 30D. Placed on.

  Subsequently, as shown in the figure, the center punch 100 having an acute tip is disposed so as to face the hook-shaped protrusion 37a provided on the protrusion 32D of the base 30D. In addition, the protrusion part 37a before pressurization is the collar part formed in the thin-plate-like collar shape provided in the upper part of convex part 32D, Comprising: As above-mentioned, parallel to mounting surface 31D, it is opposite The protrusion 32D is formed integrally with the protrusion 32D so as to protrude toward the protrusion 32D (in the width direction of the recess).

  Next, as shown in FIG. 12B, a part of the base 30D is plastically deformed by the center punch 100 to fix the mounting substrate 21 to the base 30D.

  Specifically, the center punch 100 from above the protrusion 37a (perpendicular to the mounting surface 31D) with respect to the protrusion 37a so that the protrusion 37a provided on the protrusion 32D contacts the mounting substrate 21. Pressurize.

  As a result, the protruding portion 37 a of the convex portion 32 </ b> D is pressurized by the tip of the center punch 100, and the protruding portion 37 a is bent downward by this pressure and comes into contact with the mounting substrate 21. Thereby, the bent protruding portion 37a supports the mounting substrate 21 as a fixing portion 37 so as to press the mounting substrate 21 from above. In this manner, the protruding portion 37 a is plastically deformed so as to be caulked, and is closely attached to the mounting substrate 21 as the fixing portion 37. Thereby, the movement of the mounting substrate 21 is regulated, and the mounting substrate 21 can be fixed to the base 30D.

  Next, as shown in FIG. 12C, the center punch 100 is removed from the base 30D.

  Thereafter, similarly to the first embodiment, the lamp 30 can be completed by placing the base 30D to which the mounting substrate 21 is fixed on the straight tube 10 and providing other parts such as the cap 40.

  In FIG. 12, the case where the fixing portion 37 is formed only on one convex portion 32 </ b> D is illustrated, but the same can be applied to the other convex portion 32 </ b> D. Or you may form the fixing | fixed part 37 simultaneously about convex part 32D which opposes.

  As described above, in the lamp and the manufacturing method thereof according to the third embodiment of the present invention, the LED module 20 is mounted on the base by the fixing portion 37 formed by plastically deforming a part (projecting portion 37a) of the base 30D. It can be fixed to 30D. Therefore, the LED module 20 can be fixed to the base 30D with a simple configuration without using a separate fixing member. Further, since the LED module 20 can be fixed to the base 30D without using an adhesive, the problem of dropping the LED module that may occur when the LED module 20 is fixed only by the adhesive does not occur.

  Further, according to the lamp 1 and the manufacturing method thereof according to the third embodiment of the present invention, the fixing portion 37 that is a part of the base 30D is in contact with the mounting substrate 21, so that the heat generated in the LED module 20 is dissipated. It can also improve the performance.

  Furthermore, according to the lamp and the manufacturing method thereof according to the third embodiment of the present invention, the fixing portion 37 can be formed using the protruding portion 37a partially protruding from the protruding portion 32D. Therefore, since the protruding portion 37a has a structure that easily undergoes plastic deformation, the fixing portion 37 can be easily formed. Moreover, since the protrusion part 37a which protrudes partially becomes a mark which shows a stress addition position, the workability | operativity at the time of forming the fixing | fixed part 37 improves.

(Fourth embodiment)
Next, the illuminating device 200 which concerns on the 4th Embodiment of this invention is demonstrated using FIG. FIG. 13 is a perspective view showing a configuration of a lighting apparatus according to the fourth embodiment of the present invention.

  The lighting device 200 according to the fourth embodiment of the present invention includes the lamp 1 according to the first embodiment and a lighting fixture 210.

  The lighting fixture 210 includes a pair of sockets 220 that are electrically connected to the lamp 1 and hold the lamp 1, a fixture body 230 to which the socket 220 is attached, and a circuit box (not shown). The inner surface 231 of the instrument main body 230 is a reflecting surface that reflects light emitted from the lamp 1 in a predetermined direction (for example, downward). The circuit box houses therein a lighting circuit that supplies power to the lamp 1 when a switch (not shown) is in an on state and does not supply power in an off state. The lighting device 200 according to the present embodiment is mounted on a ceiling or the like via a fixture, for example.

  In this embodiment, the lamp 1 according to the first embodiment is used as the lamp. However, the lamp according to the second and third embodiments or a modification thereof may be used.

(Other modifications or other embodiments)
As mentioned above, although the lamp | ramp and lighting device which concern on this invention were demonstrated based on embodiment and a modification, this invention is not limited to these embodiment and a modification.

  For example, in the first embodiment, three recesses 34 are formed in the base 30 for one LED module 20 to form the three fixing portions 33. However, the present invention is not limited to this. As shown in FIG. 14, only three fixing portions 33 may be formed for one LED module 20. In this case, the mounting substrate 21 can be fixed by forming two fixing portions 33 on one long side and one fixing side 33 on the other long side. Further, the fixing portion 33 may be formed in a plurality of four or more.

  In the above embodiment, the mounting substrate 21 is fixed only by the fixing portion that is a part of the base, but the present invention is not limited to this. For example, as shown in FIG. 15, one long side of the mounting substrate 21 is fixed by the fixing portion according to the present embodiment such as the fixing portion 33, and the other long side of the mounting substrate 21 is different from the fixing portion 33. Other fixing members 60 may be used for fixing. The fixing member 60 fixes one long side portion of one mounting substrate 21 to the base 30, and the surface of the base 30 by screws 61 in a state where the mounting substrate 21 is sandwiched between the mounting substrate 21 and the base 30. It is fixed with screws. For example, as shown in FIG. 15, the fixing member 60 is a flexible resin component formed so as to straddle the side wall portion 32 a from the surface of the flat portion 32 b of the convex portion 32 of the base 30 to the surface of the mounting substrate 21. Or it can comprise with a metal piece.

  In the above-described embodiment, a part of the base is plastically deformed by pressing from above the base (in a direction perpendicular to the mounting surface), but the present invention is not limited to this. For example, a fixing portion for fixing the mounting substrate may be formed by plastically deforming a part of the base by applying pressure from the lateral direction of the base (the horizontal direction with respect to the mounting surface). Such a method will be described below with reference to FIGS. 16 and 17. FIG. 16A to FIG. 16C are cross-sectional views showing the steps of the lamp manufacturing method according to the fifth embodiment of the present invention. FIGS. 17A to 17C are cross-sectional views showing the steps of the lamp manufacturing method according to the sixth embodiment of the present invention. FIGS. 16A to 16C and FIGS. 17A to 17C correspond to FIGS. 5A to 5C, respectively.

  First, as shown to Fig.16 (a), in the lamp | ramp which concerns on the 5th Embodiment of this invention, the convex part 32E of the base 30E is formed in thickness thinly so that it may deform | transform easily. . As shown in the figure, first, the mounting substrate 21 (LED module 20) is placed on the placement surface 31E of the base 30E, and the center punch 100B having a sharp tip is placed on the outer side surface of the convex portion 32E. Arrange to face each other.

  Next, as shown in FIG. 16B, the convex portion 32E is pressed from the side by the center punch 100B so that the interval between the convex portions 32E facing each other is narrowed. As a result, the convex portion 32E (side wall portion 32Ea) is tilted toward the mounting substrate 21 so as to come into contact with the mounting substrate 21 as a fixing portion and to support the mounting substrate 21 from an obliquely upper side of the mounting substrate 21. Thereby, the movement of the mounting substrate 21 is restricted, and the mounting substrate 21 can be fixed to the base 30E.

  Next, as shown in FIG. 16C, the center punch 100B is removed from the base 30E. Thereby, the lamp | ramp which concerns on the 5th Embodiment of this invention can be obtained.

  In addition, as shown in FIG. 17A, also in the lamp according to the sixth embodiment of the present invention, the convex portion 32F of the base 30F is formed with a small thickness in the lateral direction so as to be easily deformed. . Then, as shown in the figure, first, the mounting substrate 21 (LED module 20) is placed on the placement surface 31F of the base 30F, and the center punch 100C having a sharp tip and a thin tip is placed on the side surface outside the convex portion 32F. It arranges so that it may face.

  Next, as shown in FIG. 17B, the convex portion 32F is pressurized from the lateral direction by the center punch 100C. Accordingly, a portion of the side wall surface of the convex portion 32 </ b> F that faces the side surface of the mounting substrate 21 protrudes toward the side surface of the mounting substrate 21 and contacts the side surface of the mounting substrate 21. Thus, the protruding portion of the convex portion 32F supports the mounting substrate 21 so that the side surface of the mounting substrate 21 is pressed from both sides as a fixing portion. Therefore, the movement of the mounting substrate 21 is restricted, and the mounting substrate 21 can be fixed to the base 30F.

  Next, as shown in FIG. 17C, the center punch 100C is removed from the base 30F. Thereby, the lamp | ramp which concerns on the 6th Embodiment of this invention can be obtained.

  In the above embodiment, the LED module 20 is a COB type (Chip On Board) in which the LED itself (bare chip) is directly mounted on the mounting substrate 21. However, the present invention is not limited to this. For example, as shown in FIG. 18, a package type in which an LED chip is mounted in a cavity molded with resin or the like, and the inside of the cavity is sealed with a phosphor-containing resin, that is, a surface mount type (SMD: Surface Mount Device). LED module 300 may be used.

  An SMD type LED module 300 shown in FIG. 18 includes a mounting substrate 301 and a plurality of packages 390 mounted on the mounting substrate 301 in a line. The package 390 is made of resin or the like, and the LED chip 321 is mounted in the cavity. The mounted LED chip 321 is covered with a phosphor-containing resin 320. The plurality of packages 390 are electrically connected to each other by a wiring pattern or a wire, and are also electrically connected to electrode terminals 391 that are external connection terminals.

  Moreover, in each said embodiment, although the base was comprised so that it might accommodate in the inside of the cylindrical straight pipe 10, it is not restricted to this. For example, the base itself may be configured as a part of the housing, and the side opposite to the LED module mounting surface of the base may be configured as the outer surface. That is, a metal casing that is a solid and semi-circular cross section and made of a metal such as aluminum, and a translucent section that is attached to the metal casing so as to cover the LED module and has a semicircular cross section A lamp may be constituted by a protective cover. That is, the metal casing and the translucent cover constitute the entire lamp casing.

  For example, the metal housing has a substantially semi-cylindrical shape, and the LED module 20 is mounted on the flat surface covered with the translucent cover, and the cylindrical surface is exposed to the outside. The translucent cover has a substantially semi-cylindrical shape and is made of a synthetic resin such as plastic. Note that a base having the same configuration as the base 40 according to the above-described embodiment of the present invention is attached to both ends of the translucent cover and the metal casing.

  Moreover, although said embodiment demonstrated the straight tube | pipe type LED lamp, it is not restricted to this. For example, it can be applied to a light bulb type LED lamp. In this case, a ceramic substrate having a shape close to a square having a small aspect ratio can be used as a mounting substrate for the LED module. Moreover, as a base on which such an LED module is placed, a base having a convex portion formed so as to be a concave portion having the same size as the ceramic substrate having the above shape can be used. And the fixing | fixed part for fixing a mounting board | substrate to a base is formed by carrying out the plastic deformation of the convex part of this base.

  Moreover, in said embodiment, although a part of base was plastically deformed by mechanical stress, it is not restricted to this. For example, a part of the base may be plastically deformed by a thermal stress by a laser or the like. In this case, it is possible to melt the part of the convex part by irradiating the side wall part of the convex part of the base with the laser, and fix the mounting substrate to the base using the part of the melted convex part as a fixing part .

  Moreover, in said 1st Embodiment, although the hollow was formed using the center punch, it is not restricted to this. You may form a hollow using hollow formation means other than a center punch. Furthermore, in each of the above-described embodiments, the pressurizing means for pressurizing the convex portion of the base is an example, and is not limited to these pressurizing means.

  Moreover, in said 2nd Embodiment and its modifications 1 and 2, although the thin part was comprised with the linear groove part formed along the elongate direction of the base, it is not restricted to this. The thin portion may be constituted by a conical depression or the like partially formed in a spot shape.

  In the second embodiment and the modified examples, the fixing portion is formed so as to tilt the side wall portion by rolling the pressure roller along the groove. However, the present invention is not limited to this. For example, by using a punch to intermittently press the groove along the longitudinal direction of the base, the side wall portion of only the pressed portion may be tilted to intermittently form the fixing portion.

  Moreover, in said 3rd Embodiment, although the bowl-shaped convex part 37 is formed intermittently in the longitudinal direction of base 30D, it is not restricted to this. For example, the base may be configured such that the ridge-shaped convex portions are formed in the entire longitudinal direction of the base. Thereby, a base can be easily formed by extrusion processes, such as aluminum. In this case, a roller or a punch may be used as the pressurizing unit that pressurizes the convex portion and plastically deforms the convex portion. When using a roller, the fixed part can be formed by pressurizing the entire convex part along the longitudinal direction of the base, and when using a punch, the convex part is intermittently along the longitudinal direction of the base. The fixing portion can be formed by pressurizing.

  Moreover, in said embodiment, although LED was illustrated as a semiconductor light-emitting device, a semiconductor laser and organic EL (Electro Luminescence) may be sufficient.

  In addition, the present invention includes various modifications made by those skilled in the art without departing from the scope of the present invention. Moreover, you may combine each component in several embodiment arbitrarily in the range which does not deviate from the meaning of invention.

  The present invention can be widely used in lamps and lighting devices in which semiconductor light emitting elements such as LEDs are used.

1 Lamp 10 Straight tube 20, 300 LED module 21, 301 Mounting board 22 LED
23 Sealing member 24 Wiring 25 Electrostatic protection element 26 Electrode terminal 27 Wire 30, 30A, 30B, 30C, 30D, 30E, 30F Base 31, 31A, 31B, 31C, 31D, 31E, 31F Mounting surface 32, 32A , 32B, 32C, 32D, 32E, 32F Convex part 32a, 32Aa, 32Ba, 32Ca, 32Ea Side wall part 32b, 32Ab, 32Bb, 32Cb Planar part 33, 36, 36C, 37 Fixed part 34 Depression 35, 35B, 35C Groove part 37a Projection 40 Base 50 Wiring 60 Fixing member 100, 100B, 100C Center punch 100A Roller 200 Lighting device 210 Lighting fixture 220 Socket 230 Appliance main body 231 Inner surface 320 Phosphor-containing resin 321 LED chip 390 Package 391 Electrode terminal

Claims (8)

Placing a mounting substrate on which a semiconductor light emitting element is mounted on a base;
A step of plastically deforming a part of the base to fix the mounting substrate to the base;
Placing the base on which the mounting substrate is fixed in a housing, and
The base includes a mounting surface for mounting the mounting substrate, and a convex portion having a side wall portion facing the side surface of the mounting substrate mounted on the mounting surface,
The convex portion further includes a plane portion having a predetermined distance in the thickness direction of the mounting substrate from the mounting surface.
In the step of fixing the mounting substrate to the base, the convex portion is plastically deformed so that the side wall portion of the convex portion protrudes toward the mounting substrate and comes into contact with the mounting substrate. Fixed to the base,
Further, in the step of fixing the mounting substrate to the base, by forming a recess in the flat surface portion, the side wall portion of the convex portion protrudes toward the mounting substrate and is brought into contact with the mounting substrate.
Method of manufacturing a lamp. Placing a mounting substrate on which a semiconductor light emitting element is mounted on a base;
A step of plastically deforming a part of the base to fix the mounting substrate to the base;
Placing the base on which the mounting substrate is fixed in a housing, and
The base includes a mounting surface for mounting the mounting substrate, and a convex portion having a side wall portion facing the side surface of the mounting substrate mounted on the mounting surface,
The convex part further includes a thin part having a thinner thickness than other parts in the convex part,
In the step of fixing the mounting substrate to the base, the convex portion is plastically deformed so that the side wall portion of the convex portion protrudes toward the mounting substrate and comes into contact with the mounting substrate. Fixed to the base,
Further, in the step of fixing the mounting substrate to the base, by pressing the thin-walled portion, the side wall portion of the convex portion protrudes toward the mounting substrate and contacts the mounting substrate.
Method of manufacturing a lamp. The lamp manufacturing method according to claim 2 , wherein the thin portion is a linear groove portion. In the step of fixing the mounting substrate to the base, by caulking a part of the base, according to claim 1 for securing a portion of the base to the base of the mounting substrate by plastic deformation 4. The method for manufacturing a lamp according to any one of 3 above. A housing,
A base disposed in the housing;
A mounting board placed on the base;
A semiconductor light emitting device mounted on the mounting substrate,
The base has a fixing portion for fixing the mounting board, which is formed by plastically deforming a part of the base.
The mounting substrate is fixed to the base by the fixing portion,
The base includes a mounting surface for mounting the mounting substrate, and a convex portion having a side wall portion facing the side surface of the mounting substrate mounted on the mounting surface,
The fixing portion is formed by plastically deforming the convex portion so that the side wall portion of the convex portion protrudes toward the mounting substrate and comes into contact with the mounting substrate.
The convex portion further includes a plane portion having a predetermined distance in the thickness direction of the mounting substrate from the mounting surface.
The fixed portion is formed by plastically deforming the convex portion by a stress when forming a recess in the flat portion.
Lamp. A housing,
A base disposed in the housing;
A mounting board placed on the base;
A semiconductor light emitting device mounted on the mounting substrate,
The base has a fixing portion for fixing the mounting board, which is formed by plastically deforming a part of the base.
The mounting substrate is fixed to the base by the fixing portion,
The base includes a mounting surface for mounting the mounting substrate, and a convex portion having a side wall portion facing the side surface of the mounting substrate mounted on the mounting surface,
The fixing portion is formed by plastically deforming the convex portion so that the side wall portion of the convex portion protrudes toward the mounting substrate and comes into contact with the mounting substrate.
The convex part further includes a thin part having a thinner thickness than other parts in the convex part,
The fixed portion is formed by plastically deforming the convex portion by a stress when the thin portion is pressed.
Lamp. The lamp according to claim 6 , wherein the thin portion is a linear groove portion. An illuminating device comprising the lamp according to any one of claims 5 to 7 .

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