JP5610039B2 - Wiring board manufacturing method - Google Patents

Description

  The present invention relates to a wiring board having a structure in which an in-plane conductor on one of the other main surfaces of an insulating layer is electrically connected by an interlayer connector (through via or the like), and a method of manufacturing the same. The present invention relates to an interlayer connection structure that drastically improves the electrical characteristics between them, and a method of manufacturing a wiring board having the interlayer connection structure.

  Conventionally, when a wiring board having a wiring pattern formed on both sides of an insulating layer (double-sided wiring board) or a multilayer board having a structure in which components are mounted on this wiring board and covered with an insulating layer is formed, For example, it is manufactured as shown in FIG. 7 using an interlayer connector such as a through via.

  FIGS. 7A to 7E are cross-sectional views showing a conventional method for manufacturing a double-sided wiring board (two-layer circuit board). First, an insulating substrate 820 such as a glass epoxy substrate having a sheet 810 attached to one side is shown. A through hole 830 is formed at a predetermined location, and a first copper foil 840 is bonded to the lower surface of the insulating substrate 820 (FIG. 7A). Next, the through-hole 830 is filled with the conductive paste 850 (FIG. 7B). At this time, the conductive paste 850 is filled by printing using the sheet 810 as a print mask. Next, the sheet 810 is peeled from the insulating substrate 820 (FIG. 7C). At this time, an amount of the conductive paste 850 depending on the thickness of the sheet 810 may remain above the surface of the insulating substrate 820 above the through hole 830. Next, after the second copper foil 860 is attached to the upper surface of the insulating substrate 820, the insulating substrate 820 and the second copper foil 860 are bonded together and the conductive paste 850 is cured (FIG. 7D). . Next, the first copper foil 840 and the second copper foil 860 are selectively etched to form a first circuit pattern 870a and a second circuit pattern 870b (FIG. 7E). In this way, the first circuit pattern 870a and the second circuit pattern 870b are electrically connected by the conductive paste 850 filled in the through hole 830, and the double-sided wiring board (two-layer wiring circuit board) 880 is connected. Is manufactured. (See, for example, Patent Document 1 (paragraphs [0002]-[0004], FIG. 8)).

JP-A-6-268345

  In the wiring substrate 880 of FIG. 7D, the in-plane conductor on the other main surface side of the insulating layer (insulating substrate 820) is formed of metal foil (circuit patterns 870a and 870b of the copper foils 840 and 860), Further, the in-plane conductors on both main surfaces are joined to the end face of the through via as an interlayer connector formed by filling the through-hole 830 with the conductive paste 850, whereby the double-sided inner conductor is electrically connected. Has been.

  In this case, the in-plane conductors and the through vias on both main surfaces of the insulating layer are formed of different conductive materials, and a bonding interface of different materials (hereinafter referred to as a different interface) exists between them. For this reason, the wiring board 880 has a problem that the electrical connection reliability is lowered because the conduction resistance value through the through vias of the in-plane conductors (copper foils 840 and 860) on both main surfaces is increased.

  The present invention relates to a method of manufacturing a wiring board having a structure in which in-plane conductors on one main surface side of an insulating layer are electrically connected by an interlayer connector, and the electric power of the in-plane conductors on both main surface sides of the insulating layer. It is an object of the present invention to provide a novel method for manufacturing a wiring board with dramatically improved connection reliability.

In order to achieve the above-described object, a method of manufacturing a wiring board according to the present invention includes a first bonding step of releasably bonding a metal conductor made of a metal foil or a metal plate on a first support member; A first conductor processing step of processing the metal conductor on the support member from above to continuously form a first in-plane conductor portion, an interlayer conductor portion, and a second in-plane conductor portion, and the first conductor processing The metal conductor processed by the process is built in an insulating layer, an in-plane conductor on one main surface side of the insulating layer is formed by the first in-plane conductor portion, and the insulating layer is formed by the second in-plane conductor portion. An insulating layer forming step of forming an in-plane conductor on the other main surface side, a first peeling step of peeling the first support member from the metal conductor, and the insulating layer after peeling of the first support member A second contact for releasably bonding the second support member to the one main surface side of the A step, and a second conductor processing step further processing the remaining part of the first conductor processing process of the metal conductors from the other principal surface of the insulating layer, after said second conductor processing process, the other An insulating layer replenishing step of replenishing the insulating layer on the main surface side, a second peeling step of peeling the second support member from the metal conductor, and the both of the insulating layers after the second peeling step. the surface of the double-sided conductor portions by polishing the main surface side it is characterized by comprising a polishing step of exposing from the insulating layer.

In the first conductor processing step, the metal conductor is patterned into a predetermined pattern and then half-etched from the upper surface side. In the second conductor processing step, the metal conductor is half-etched from the lower surface side, An in-plane conductor that is a wiring pattern, a circuit pattern, or a wiring land is formed by each of the first and second in-plane conductor portions, and at least one of the first and second in-plane conductor portions is an electronic component by a bonding member. These electrodes may be connected.

According to the method for manufacturing a wiring board of the present invention, after a metal conductor made of a metal foil or a metal plate is detachably bonded on the first support member in the first bonding step, the first conductor processing step performs the first step. The metal conductor bonded to the support member can be processed to continuously form the first in-plane conductor portion, the interlayer conductor portion, and the second in-plane conductor portion. Next, in the insulating layer forming step, the processed metal conductor is embedded in the insulating layer in a state of being bonded to the support member, and an in-plane conductor on one main surface side of the insulating layer is formed by the first in-plane conductor portion. The in-plane conductor on the other main surface side of the insulating layer can be formed by the second in-plane conductor portion. Then, the first separation step, the first supporting member was peeled off, and further, after bonding the one major surface side of the insulating layer releasably to the second support member by a second bonding step, a second Through the conductor processing step, the metal conductor can be further processed from the other main surface side (back side). Then, the second supporting member is peeled off by the second peeling step, and both main surface sides of the insulating layer are polished by the polishing step to expose the surfaces of the conductor portions in both sides from the insulating layer, thereby manufacturing the wiring board. it can. In this case, the metal conductor can be processed from both main surface sides of the insulating layer, and the inner conductor portion and the interlayer conductor portion can be continuously formed with a smaller area, and manufactured by the method of the invention of claim 1. A wiring board having the same effect as the wiring board can be manufactured in a smaller size.

It is sectional drawing of the components mounting state of the wiring board of the 1st Embodiment of this invention. It is sectional drawing explaining the manufacturing process of a part of wiring board of FIG. FIG. 7 is a cross-sectional view illustrating the remaining manufacturing steps of the wiring board of FIG. 1. It is sectional drawing of the components mounting state of the wiring board of the 2nd Embodiment of this invention. It is sectional drawing explaining the manufacturing process of the wiring board of FIG. It is sectional drawing of the multilayer substrate of the 3rd Embodiment of this invention. It is sectional drawing explaining the manufacturing process of a prior art example.

  An embodiment of the present invention will be described in detail with reference to FIGS.

(First embodiment)
First, a first embodiment corresponding to claim 2 will be described with reference to FIGS.

[Configuration of wiring board]
FIG. 1 is a cross-sectional view showing a configuration of a wiring board (double-sided wiring board) 1a according to the present embodiment. The wiring board 1a is an in-plane conductor (for example, a wiring land) on one main surface side (upper surface side) of an insulating layer 2. A first in-plane conductor portion 3 that forms a conductor, a second in-plane conductor portion 4 that forms an in-plane conductor (for example, a wiring land) on the other main surface side (lower surface side) of the insulating layer 2, and the insulating layer 2. And an interlayer conductor 5 as an interlayer connector (through via) that penetrates and electrically connects both inner surface conductors 3 and 4. The in-plane conductors 3 and 4 and the interlayer conductor 5 are made of the same material. The conductive member, specifically, a copper (Cu) foil 6 which is an example of the metal conductor of the present invention is continuously formed. In this case, the heterogeneous interface does not exist between the in-plane conductor portions 3 and 4 and the interlayer conductor portion 5, and the wiring substrate 1a has a dramatic increase in conduction resistance value between the in-plane conductors formed by the in-plane conductor portions 3 and 4. The electrical connection reliability is remarkably improved.

  And, if necessary, the electrodes of various chip-shaped electronic components 8 such as capacitors, coils, transistors, ICs, etc. are connected to the conductor portions 3, 4 on both sides via bonding members 7 such as solder bumps, A highly reliable circuit module having the double-sided wiring board structure shown in FIG. 1 is formed.

  By the way, in this embodiment, the interlayer conductor part 5 is formed by processing (half-etching) the copper foil 6 from one main surface side to the other main surface side and vice versa, as will be described later. In this case, the copper foil 6 does not become extremely narrow and narrow (narrow) only at the center portion in the thickness direction to be the interlayer conductor portion 5, and the conduction resistance between the in-plane conductors formed by the in-plane conductor portions 3 and 4. The value is reliably reduced and the electrical connection reliability is improved. Further, since the interlayer conductor portion 5 and the like can be formed in a desired area (thickness), the degree of freedom in board design is increased, and the wiring board 1a can be reduced in area (downsized).

  And in order to achieve size reduction (thinning), the thickness of the copper foil 6 is 35 micrometers, for example. The insulating layer 2 is made of a thermosetting resin such as an epoxy resin, a phenol resin, or a cyanate resin. At that time, in order to prevent the warp and the like by combining the heat conduction characteristics and the like with the copper foil 6, the insulating layer 2 preferably contains an inorganic filler of an inorganic powder such as silica powder or alumina powder.

[Method of manufacturing a wiring board]
FIGS. 2 and 3 show the manufacturing process of the wiring board 1a in this order. In the case of this embodiment, the copper foil 6 is moved from one main surface side to the other main surface side or vice versa as necessary, and from both sides. In order to form the in-plane conductor parts 3 and 4 and the interlayer conductor part 5 by half etching, the copper foil 6 is processed from one main surface side of the insulating layer 2 to the other main surface side as a processing step of the copper foil 6. And a process of processing the copper foil 6 on the contrary. Therefore, the manufacturing process of the wiring board 1a is roughly the first half of the process of half-etching the copper foil 6 from one main surface side to the other main surface side with the insulating layer forming step interposed therebetween, and vice versa. A half-etching step.

  The first half of the process consists of a first bonding step (FIG. 2 (a)), a first resist forming step (FIG. 2 (b)), a first conductor processing step (half etching step) (FIG. 2 (c)). And a first resist removing step (FIG. 2D).

  In the first bonding step (FIG. 2A), the copper foil 6 is peelably bonded onto the base substrate 9 as the first support member of the present invention, and the copper foil 6 is formed into a predetermined pattern by laser irradiation or the like. Pattern. As described above, the copper foil 6 has a thickness of, for example, 35 μm, and the base substrate 9 is, for example, an adhesive film. A two-layer laminate of the adhesive film and the copper foil 6 is formed by the adhesion.

  In the first resist formation step (FIG. 2 (b)), the first in-plane conductor portion 3 is processed into a wiring land having a predetermined size and shape. Apply.

  In the first conductor processing step (FIG. 2C), the copper foil 6 is gently half-etched from the upper surface side to the lower surface side by chemical treatment with an acid, and the first in-plane conductor is sequentially formed from the upper surface side by the copper foil 6. The part 3, the interlayer conductor part 5, and the second in-plane conductor part 4 are continuously formed. At this time, the copper foil 6 is gradually etched from the upper surface side by the half etching, and at least the first in-plane conductor portion 3 and the interlayer conductor portion 5 are formed by etching the copper foil 6, so that the interlayer conductor portion 5 is formed. Only the central portion of the copper foil 6 in the thickness direction is extremely narrowed and does not become thin (narrow). Thereafter, the process shifts to the first resist removing step (FIG. 2D), and the resist 10 that is no longer needed is removed.

  Next, in the insulating layer forming step (FIG. 2 (e)), the above-described thermosetting resin prepreg is pressurized while being heated in a vacuum so as not to generate bubbles and the copper foil 6 is in the prepreg state. 2, the insulating layer 2 is pressure-bonded to the base substrate 9, and a composite 11 a having a structure in which the copper foil 6 is built in the insulating layer 2 is formed. With this ultrathin layer, the copper foil 6 is vacuum laminated at 110 ° C. for 10 minutes, for example, and the copper foil 6 is built in the insulating layer 2. The lower surface of the copper foil 6 is exposed from the insulating layer 2 and directly adhered to the base substrate 9. Thereafter, the base substrate 9 is peeled off from the composite 11a by the first peeling step (FIG. 2F) to expose the lower surface of the copper foil 6.

  The latter half of the process consists of a second bonding step (FIG. 3A), a second resist forming step (FIG. 3B), a second conductor processing step (FIG. 3C), and second resist removal in the order of the steps. It comprises a process (FIG. 3D), an insulating layer replenishment process (FIG. 3E), a second peeling process (FIG. 3F), and a polishing process (FIG. 3G).

  In the second bonding step (FIG. 3A), the base substrate 12 is bonded as a second support member to the upper surface of the insulating layer 2 in the composite 11a in a detachable manner. The base substrate 12 is, for example, an adhesive film similar to the base substrate 9 and is formed by reusing the base substrate 9 if possible.

  In the second resist forming step (FIG. 3B), a necessary part required for further etching and processing the portion remaining by etching from the upper surface side of the first conductor processing step of the copper foil 6 from the lower surface side. A resist 13 is applied to the resist pattern. Specifically, when the left side of the copper foil 6 is half-etched from the upper surface side by the first conductor processing step, the right side of the copper foil 6 is half-etched from the lower surface side, and the second in-plane conductor portion 4 and the interlayer In order to process the conductor part 5, the resist 13 is apply | coated to the lower surface left side of the copper foil 6 (copper foil 6 of the center of FIG.3 (b)). In addition, the resist 13 is apply | coated to the whole lower surface of the copper foil 6 which is not etched (copper foil 6 on the right side of FIG. 3B). Moreover, the resist 13 is apply | coated to the lower surface center part for the copper foil 6 etched from both right and left (copper foil 6 on the left side of FIG. 3B).

  In the second conductor processing step (FIG. 3C), the copper foil 6 is half-etched from the lower surface side by chemical treatment with acid to process the second in-plane conductor portion 4 and the interlayer conductor portion 5 to obtain a copper foil. 6, the first in-plane conductor portion 3, the interlayer conductor portion 5, and the second in-plane conductor portion 4 having a desired size (area) are formed continuously (integrally). In addition, when half-etching the copper foil 6 from the lower surface side, the composite 11a may be turned upside down in consideration of ease of processing.

  Next, the resist 13 that has become unnecessary in the second resist removing step (FIG. 3D) is removed, and the half etching on the lower surface side of the copper foil 6 is performed in the insulating layer supplementing step (FIG. 3E). The resulting concave portion is filled with a thermosetting resin prepreg by, for example, vacuum lamination at 110 ° C. for 10 minutes.

Thereafter, the insulating layer 2 is cured by heating at 200 ° C. for 60 minutes, for example, and then the base substrate 12 is peeled off from the insulating layer 2 by a second peeling step (FIG. 3F), and finally, a polishing step (FIG. 3). According to (g)), both main surface sides of the insulating layer 2 are polished to expose the surfaces of the first and second in-plane conductor portions 3 and 4 from the insulating layer 2 to manufacture the wiring board 1a.

  Therefore, in the case of this embodiment, the conductive member is easily obtained, easily processed, and the copper foil 6, which is an example of a metal conductor having a uniform material, is half-etched from both main surface sides of the insulating layer 2 to be first. The second in-plane conductor portions 3 and 4 and the interlayer conductor portion 5 can be formed continuously in a small area as much as possible so that no heterogeneous interface exists between the conductor portions 3 to 5, and the insulating layer 2 It is possible to manufacture and provide a wiring board 1a in which the conduction resistance value between the in-plane conductors on both the main surfaces is small and the electrical connection reliability is dramatically improved.

(Second Embodiment)
Next, a second embodiment corresponding to claim 1 will be described with reference to FIGS.

[Configuration of wiring board]
FIG. 4 is a cross-sectional view showing the configuration of the wiring board (double-sided wiring board) 1b of this embodiment. The most different point of the wiring board 1b from the wiring board 1a of FIG. 2 is processed in one direction from one main surface side to the other main surface side (half-etching), and the number of processes is reduced to half that in the case of the first embodiment. In this case, the processing direction of the copper foil 6 is limited to one direction, but at least the first in-plane conductor portion 3 and the interlayer conductor portion 5 are etched, so that the copper foil 6 is the same as in the first embodiment. Only the central portion (interlayer conductor portion 5) in the thickness direction is not extremely narrowed and narrowed (narrow), and the resistance value becomes sufficiently small, so that the electrical connection reliability is remarkably improved. Further, the interlayer conductor portion 5 and the like can be formed in a desired size. Therefore, it is possible to provide a novel double-sided wiring board 1b having the same effects as the wiring board 1a of the first embodiment by a simpler manufacturing process.

[Method of manufacturing a wiring board]
FIG. 5 shows a sequential manufacturing process of the wiring board 1b. In the case of this embodiment, the copper foil 6 is half-etched in one direction from one main surface side to the other main surface side of the insulating layer 2 to form the wiring substrate 1. The first in-plane conductor portion 3, the second in-plane conductor portion 4, and the interlayer conductor portion 5 are formed.

  Therefore, the manufacturing process is the same bonding process as the first bonding process, the first resist forming process, the first conductor processing process, the first resist removing process, and the insulating layer forming process of the first half of the first embodiment (FIG. 5). (A)), resist formation step (FIG. 5B), conductor processing step (half etching step) (FIG. 5C), resist removal step (FIG. 5D), insulating layer formation step (FIG. 5). (E)), a peeling process (FIG. 5 (f)), and a polishing process (FIG. 5 (g)).

  In the bonding step (FIG. 5A), the copper foil 6 is detachably bonded onto the base substrate 14 as a support member, and in this state, the copper foil 6 is patterned by laser irradiation or the like. The copper foil 6 has a thickness of 35 μm, for example, as in the first embodiment, and the base substrate 14 is an adhesive film, for example.

  In the resist formation step (FIG. 5B), a resist 15 is applied to the upper surface of the copper foil 6 in a required resist pattern necessary for land formation or the like.

  In the conductor processing step (FIG. 5C), the copper foil 6 is gently half-etched from the upper surface side to the lower surface side by chemical treatment with an acid, and the first in-plane conductor portion in order from the upper surface side by the copper foil 6 3, the interlayer conductor 5 and the second in-plane conductor 4 are continuously formed. Thereafter, the resist 15 that is no longer needed is removed by a resist removing step (FIG. 5D).

  Next, in the insulating layer forming step (FIG. 5 (e)), the thermosetting resin prepreg is pressurized while being heated in vacuum, and the copper foil 6 is embedded in the insulating layer 2 in the prepreg state and the insulating layer is formed. 2 is bonded to the base substrate 14 to form a composite 11b having a structure in which the copper foil 6 is embedded in the insulating layer 2. The insulating layer 2 is an ultra-thin layer of 10 μm, for example, as in the first embodiment. Further, the lower surface of the copper foil 6 is exposed from the substantially insulating layer 2 and is directly bonded to the base substrate 14.

  Then, after the resin layer 2 is cured by heating at 200 ° C. for 60 minutes, for example, the base substrate 14 is peeled off from the insulating layer 2 by a peeling step (FIG. 5F), and finally the polishing step (FIG. 5G) )) To polish at least one main surface side (upper surface side) of the insulating layer 2 to expose the surfaces of the first and second in-plane conductor portions 3 and 4 from the insulating layer 2 to manufacture the wiring substrate 1b.

  Therefore, in the case of this embodiment, the copper foil 6 is half-etched from one main surface side of the insulating layer 2 to continuously form the first and second in-plane conductor portions 3 and 4 and the interlayer conductor portion 5. The in-plane conductors on both main surfaces of the insulating layer 2 can be made so that no heterogeneous interface exists between the conductor portions 3 to 5 and the number of steps is halved compared to the first embodiment. It is possible to manufacture and provide a wiring board 1b having a small conduction resistance value between them and improved electrical connection reliability.

(Third embodiment)
Next, an embodiment in which the multilayer substrate 1c including the component 16 such as the electronic component 8 is manufactured using the ultrathin wiring substrate 1a manufactured in the first embodiment, for example, will be described with reference to FIG. To do.

  In the present embodiment, the wiring board 1a is prepared by the mounting board preparation step (FIG. 6A). In the wiring substrate 1 a, the polished surfaces of the first and second in-plane conductor portions 3 and 4 of the copper foil 6 are exposed on both main surface sides of the cured insulating layer 2.

  Then, in the component mounting process (FIG. 6B), the electrodes of the component 16 are provided on the surface of the required first in-plane conductor 3 via the metal bumps 17 such as solder, and the metal bumps 17 are reflowed and the like. 16 is mounted on the wiring board 1a, and a very thin connection layer of the component 16 is formed by the wiring board 1a.

  Next, in the insulating layer forming step (FIG. 6C), the thermosetting resin prepreg for forming the insulating layer 18 is heated and pressed and bonded to the wiring board 1a on which the component 16 is mounted, from above. Components are built in the insulating layer 18, and then the heating temperature is raised to cure the insulating layer 18.

  Next, by the wiring layer preparation step (FIG. 6D), the thin wiring board 19 in which the copper foil 61 is built in the insulating layer 21 is prepared, and the conductive paste 20 is applied to the in-plane conductor portion 31 on the upper surface. .

  The wiring board 19 is a wiring board manufactured by a method substantially similar to the manufacturing method of the second embodiment, for example, and the insulating layer 21 corresponding to the insulating layer 2 may be completely cured. In order to adhere well to the insulating layer 18, the insulating layer 21 is preferably in a semi-cured state. For example, the wiring substrate 19 includes an adhesion process (FIG. 5A), a resist formation process (FIG. 5B), a conductor processing process (half etching process) (FIG. 5C), and resist removal shown in FIG. 5. It is manufactured through the process (FIG. 5D), the insulating layer forming process (FIG. 5E), the peeling process (FIG. 5F), and the polishing process (FIG. 5G). When 21 is made into a semi-cured state, the insulating layer 21 is semi-cured by controlling the heating time and temperature of the insulating layer 21 corresponding to the insulating layer 2 in the insulating layer forming step (FIG. 5E). To be held in. Also, the copper foil 61 of the wiring board 19 corresponding to the copper foil 6 is half-etched from the upper surface side (one main surface side), and the in-plane conductor portions 31 and 41 corresponding to the in-plane conductor portions 3 and 4 and the interlayer An interlayer conductor portion 51 corresponding to the conductor portion 5 is formed, and the in-plane conductor portion 41 on the lower surface side (the other main surface side) is not etched and remains in the original pattern shape.

  Then, in the bonding step (FIG. 6E), the in-plane conductor portion 31 of the wiring board 19 is bonded to the in-plane conductor portion 4 of the substrate 1a to which the insulating layer 18 is bonded via the conductive paste 19, and this state The whole is heated to 200 ° C. or more to completely cure the insulating layer 21 of the wiring board 19, and the thin wiring layer of the wiring board 19 is connected to the lower side of the insulating layer 18 through the thin connection layer of the wiring board 1 a. Then, a thin multilayer substrate 1c having a structure in which a resin substrate is stacked and a component is incorporated is manufactured.

  In this case, the connection via of the component 16 is not necessary, and the manufacturing process is reduced correspondingly, and the substrate area becomes small and thin. A circuit module can be provided.

  For example, after the formation process of the insulating layer 18 (FIG. 6C) or the bonding process (FIG. 6E), the upper surface of the insulating layer 18 is polished so that the upper surface of the electrode of the component 16 is insulated. A wiring board similar to the wiring board 1a is provided on the wiring board via a metal bump, and a component is mounted on the wiring board via the metal bump. It is possible to manufacture a multilayer substrate with a built-in component, and by repeating these, a multilayer substrate with a built-in component can be manufactured. This is a smaller, thinner and cheaper structure than the case of manufacturing by forming connection vias and the like.

  Further, even if the wiring board 1b is used instead of the wiring board 1a, a multilayer board with built-in components similar to the multilayer board 1c can be manufactured.

  The present invention is not limited to the above-described embodiments, and various modifications other than those described above can be made without departing from the spirit thereof. For example, the conductive member of the present invention is Further, various metal foils other than the copper foil 6, various metal plates including a copper plate thicker than the metal foil, and a resin body containing metal may be used. The insulating layers 2, 18, and 21 may not be formed of a thermosetting resin, but may be formed of a photocurable resin or the like. Furthermore, the base substrates 9 and 12 can be formed of various films and plates of metals and resins.

  Next, it is needless to say that the area, thickness, etc. of the conductive member such as the copper foil 6 and the insulating layer may be appropriately set according to the design conditions.

  And this invention is applicable to the wiring board of various uses, and its manufacturing method.

DESCRIPTION OF SYMBOLS 1a, 1b Wiring board 2 Insulating layer 3 1st in-plane conductor part 4 2nd in-plane conductor part 5 Interlayer conductor part 6 Copper foil 9, 12 Base board

Claims (2)

A first bonding step of releasably bonding a metal conductor made of a metal foil or a metal plate on the first support member;
A first conductor processing step of processing the metal conductor on the first support member from the upper surface side to continuously form a first in-plane conductor portion, an interlayer conductor portion, and a second in-plane conductor portion;
The metal conductor processed by the first conductor processing step is built in an insulating layer, an in-plane conductor on one main surface side of the insulating layer is formed by the first in-plane conductor portion, and the second in-plane conductor is formed. Forming an in-plane conductor on the other main surface side of the insulating layer by a portion; and
A first peeling step of peeling the first support member from the metal conductor;
A second bonding step of releasably bonding the second support member to the one main surface side of the insulating layer after peeling of the first support member;
A second conductor processing step of further processing a portion remaining in the first conductor processing step of the metal conductor from the other main surface side of the insulating layer;
An insulating layer replenishing step of replenishing the insulating layer on the other main surface side after the second conductor processing step;
A second peeling step of peeling the second support member from the metal conductor;
A method of manufacturing a wiring board comprising: after the second peeling step, a polishing step of polishing both the main surface sides of the insulating layer to expose the surfaces of the conductor portions in both surfaces from the insulating layer. .   In the first conductor processing step, the metal conductor is half-etched from the upper surface side after being patterned into a predetermined pattern,
  In the second conductor processing step, the metal conductor is half-etched from the lower surface side,
  An in-plane conductor that is a wiring pattern, a circuit pattern, or a wiring land is formed by each of the first and second in-plane conductor portions, and at least one of the first and second in-plane conductor portions is an electron by a bonding member. The electrode of the part is connected
The method for manufacturing a wiring board according to claim 1.

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