JP5553741B2 - Light emitting device and manufacturing method thereof - Google Patents

Description

  The present invention relates to a light emitting device that converts light from a light emitting element with a wavelength conversion layer.

  In recent years, white LEDs having a large light emission amount (high power) have been put into practical use. For example, a high power white LED package has a structure in which high power LEDs are mounted at a high density on a substrate such as ceramic in order to improve the amount of light flux, and a phosphor-containing resin is in close contact with the LED. ing.

  On the other hand, a white LED package used in a vehicle lighting device such as a headlamp needs to form a predetermined cut-off line, and therefore, as in Patent Document 1, it reflects around the LED and the phosphor-containing resin. It is covered with a member (for example, white resin), and a cut-off line is formed at the boundary between the white resin and the phosphor resin.

JP 2009-218274 A

  As the output of the high-power white LED is improved, deterioration of the members constituting the LED package becomes a problem. In the structure of Patent Document 1, when the periphery of the phosphor-containing resin is covered with a white resin, light enters the surface of the white resin that contacts the phosphor-containing resin, and heat is conducted from the phosphor-containing resin. By using a silicone resin containing a light scattering material such as titanium oxide as the white resin, high reliability can be maintained for a long time if it is a normal LED output. However, in the case of a high-density, high-power LED package such as a high-power white LED, it has been clarified through experiments by the inventors that the white resin deteriorates and a phenomenon called oil bleed occurs.

  Oil bleed is a phenomenon in which the resin is reduced in molecular weight due to deterioration and an oily substance floats on the resin surface. When oil bleed occurs in the white resin, the floating oily substance spreads wet to the upper surface of the phosphor-containing resin and affects the light distribution characteristics of the emitted light. Further, the thickness near the end of the white resin is reduced by the oil bleed, and the amount of light passing through the white resin is increased.

  When a white ceramic instead of a white resin is used as the reflecting member having the structure of Patent Document 1, oil bleed does not occur. However, since white ceramics cannot be formed in the process of applying or filling uncured resin around the LED or phosphor-containing resin layer like white resin, it is necessary to mold the white ceramic in advance. . It is not easy to mold a white ceramic having a complicated shape and a small size that is in close contact with the side surface of the LED or the phosphor-containing resin layer with high accuracy. Further, if the white ceramic of the molded product is arranged outside the LED, a mounting problem of interfering with a bonding wire for supplying power to the LED also occurs.

  On the other hand, by arranging the light emitting element in a cavity such as a cup or a recess, and using the inner wall surface of the cavity as a reflector surface and reflecting the light emitted from the light emitting element, it is possible to increase the light extraction efficiency from above. In this case, the opening of the cavity becomes the light emitting surface. As the aperture size is smaller, the attenuation of light can be prevented and the luminous flux density can be increased. Therefore, a light emitting device having a cavity with a small aperture size is desired.

  An object of the present invention is to provide a method of manufacturing a light emitting device that has a small light emitting area and can prevent an oil bleed phenomenon.

  In order to achieve the above object, according to the first aspect of the present invention, the following light emitting device is provided. That is, a substrate, a light emitting element mounted on the substrate, an optical layer disposed on the light emitting element that transmits at least part of light emitted from the light emitting element, and mounted on the optical layer, A light emitting device having a plate-like optical member that transmits at least part of the emitted light, the outer periphery of the plate-like optical member is covered with a white ceramic outer frame, and the optical layer and the side surface of the white ceramic outer frame are It is covered with a light reflective resin member.

  For example, the above-mentioned plate-like optical member is larger than the light emitting element, and the optical layer may have an inclined side surface that connects the side surface of the light emitting element and the outer frame made of white ceramic. Further, for example, the plate-like optical member may be larger than the light-emitting element, and the optical layer may have an inclined side face that connects the side face of the light-emitting element and the outer periphery of the plate-like optical member.

  The lower surface of the white ceramic outer frame can be configured to protrude to the light emitting element side from the lower surface of the plate-like optical member. It is also possible to employ a configuration in which a notch is provided on the lower surface side at the boundary between the plate-like optical member and the white ceramic outer frame. In addition, the bottom surface of the white ceramic outer frame can be shaped to move away from the light emitting element as it moves away from the side surface of the plate-like optical member in the main plane direction.

  According to the second aspect of the present invention, the following method for manufacturing a light emitting device is provided. That is, a plate-shaped optical member whose outer periphery is covered with a white ceramic outer frame is mounted on the light emitting element with the optical layer interposed therebetween, and the outer periphery of the optical layer and the plate-shaped optical member made of white ceramic are mounted. And a second step of covering the outer periphery of the outer frame with a light-reflective resin material.

  In the first step described above, an uncured optical material is dropped between the plate-shaped optical member whose outer periphery is covered with a white ceramic outer frame and the light-emitting element, and the surface tension of the side surface of the light-emitting element is determined by the surface tension. An optical layer can be formed by forming an uncured optical material layer having inclined side surfaces connecting the white ceramic outer frame and curing the uncured optical material layer.

  Alternatively, in the first step, an uncured optical material is dropped between the plate-shaped optical member whose outer periphery is covered with an outer frame made of white ceramic and the light-emitting element, and the surface tension causes the side surface of the light-emitting element to It is also possible to form an optical layer by forming an uncured optical material layer having an inclined side surface connecting the outer periphery of the plate-shaped optical member and curing the uncured optical material layer.

  According to the present invention, since the light emitted from the side surface of the plate-like optical member can be reflected by the white ceramic outer frame, strong light can be prevented from entering the light-reflecting resin member. Therefore, deterioration of the light reflective resin member can be prevented and oil bleeding can be prevented. Moreover, since the upper surface of the plate-like optical member is a light emitting surface, the light emitting area can be reduced.

FIG. 3 is a cross-sectional view of the light emitting device according to the first embodiment. The graph which shows the transmittance | permeability of the white ceramic outer frame of the light-emitting device of FIG. (A)-(e) Explanatory drawing which shows the manufacturing process of the light-emitting device of Embodiment 1. FIG. 1A is a cross-sectional view when the inclined surface 130 of the reflective material layer 15 of the light emitting device in FIG. 1 is linear, and FIG. 1B is a curved surface that protrudes outward from the inclined surface 130 of the reflective material layer 15 of the light emitting device of FIG. FIG. The expanded sectional view of the light-emitting device of FIG. Sectional drawing of the light-emitting device of Embodiment 2. FIG. Sectional drawing of the light-emitting device of Embodiment 3. FIG. Sectional drawing of the light-emitting device of Embodiment 4. FIG.

  Hereinafter, a light emitting device according to an embodiment of the present invention will be described.

(Embodiment 1)
The inventors conducted an experiment to confirm the cause of oil bleed when white resin is used as a reflective member in a high-power LED package. The LED package used in the experiment is obtained by sealing a light emitting element having an emission peak at 450 nm with a resin containing a YAG phosphor having an emission peak at 550 nm. A glass plate-like transparent member is mounted on the upper surface serving as the light emitting surface of the LED package. The periphery of the resin containing the YAG phosphor and the side surface of the plate-like transparent member are covered with a white resin using dimethyl silicone.

The LED package, and that used was a 200 mA / mm ² as a light emitting element, the two prepared but was used high power 1050 mA / mm ² as a light-emitting device was compared with each other. These light emitting elements do not change in that they have a peak at 450 nm. When both were made to emit light at a temperature of 130 ° C., no oil bleeding occurred in the LED package using the 200 mA / mm ² light emitting element, but no oil bleeding occurred in the LED package using the 1050 mA / mm ² light emitting element. There has occurred. On the other hand, when the LED package that did not emit light was left at a temperature of 220 ° C., no oil bleed occurred.

When the LED package using the light emitting element of 1050 mA / mm ² under the temperature condition of 130 ° C. was caused to emit light and the oil bleed was generated, the temperature of the white resin was measured by thermography and found to be 166 ° C. That is, although the temperature of the white resin of the package was lower than 220 ° C., oil bleed occurred in the white resin. In addition, oil bleed did not occur in the entire area of the white resin, but oil bleed occurred in the white resin near the boundary forming the cut-off line. From these facts, it was confirmed that the cause of the occurrence of oil bleed was not mere thermal degradation, but light degradation caused by high-density light.

  Therefore, in the present invention, the following structure is adopted in order to further improve the reliability of the white resin of the high power LED package.

  FIG. 1 shows a cross-sectional view of the light emitting device of the first embodiment. The light emitting device includes a plate-like transparent member 14 on the upper surface of the phosphor-containing layer. A white ceramic outer frame 24 is disposed around the plate-like transparent member 14. In addition, the light emitting device includes a reflective surface 130 for extracting light at a position close to the side surface of the light emitting element.

  Specifically, a flip chip type light emitting element (LED) 11 is mounted by a plurality of bumps 12 on a submount substrate 10 having wirings formed on the upper surface. On the upper surface of the light emitting element 11, a phosphor-containing resin layer 13 containing a phosphor that absorbs a part of the light emitted from the light emitting element 11 and is excited to emit fluorescence of a predetermined wavelength is mounted. A plate-like transparent member 14 having a ceramic outer frame 24 is mounted. The white ceramic outer frame 24 is an outer frame that closely surrounds and surrounds the outer peripheral surface of the plate-like transparent member 14. The thickness of the outer frame 24 is the same as the thickness of the plate-like transparent member 14.

  A frame 16 is disposed on the substrate 10. The space between the light emitting element 11 and the frame body 16 is filled with the reflective material layer 15 and covers the outer peripheral side surfaces of the phosphor-containing resin layer 13 and the white ceramic outer frame 24. The reflective material layer 15 also fills a space between the bottom surface of the light emitting element 11 and the top surface of the substrate 10 so as to fill the space between the bumps 12.

  As the submount substrate 10, for example, an AlN ceramic substrate on which a wiring pattern such as Au is formed is used. For example, Au bumps are used as the bumps 12. As the light emitting element 11, an element that emits light having a desired wavelength is prepared. For example, one that emits blue light is used.

  The plate-like transparent member 14 is formed of a transparent body made of an inorganic material such as glass or quartz. The white ceramic outer frame 24 is formed of a ceramic material that is white and has a high reflectivity, such as alumina or aluminum nitride.

  The phosphor-containing resin layer 13 has a function of converting light from the light emitting element 11 into light having a desired wavelength. For example, it is made of a resin containing a phosphor that emits fluorescence of a desired wavelength using light from the light emitting element 11 as excitation light. Specifically, for example, it is made of a transparent resin (for example, a silicone resin) including a phosphor (for example, a YAG phosphor) that is excited by light emission of the light emitting element 11 that emits blue light and emits yellow fluorescence. Accordingly, a light emitting device that emits white light in which blue light and yellow light are mixed can be provided. The phosphor-containing resin layer 13 may contain a spacer such as glass beads having a particle size larger than that of the phosphor in addition to the phosphor.

  The film thickness of the phosphor-containing resin layer 13 is determined by the amount of phosphor necessary for obtaining a desired emission color and the phosphor content ratio. When white light is obtained using the YAG phosphor and the blue light emitting element 11, assuming that the phosphor content ratio of the phosphor-containing resin layer 13 is set to a ratio that can be easily manufactured, the phosphor-containing resin layer 13 The thickness is the thickness of the upper part of the light emitting element 11 and is about 50 μm. On the other hand, the thickness of the plate-like transparent member 14 is about 300 μm in consideration of handling properties. In FIG. 1, for the convenience of illustration, the thickness of the phosphor-containing resin layer 13 and the thickness of the plate-like transparent member 14 are shown to be equivalent, but the thickness of the phosphor-containing resin layer 13 is the same as that of the plate-like transparent member 14. It is about a fraction of that.

  For example, a ceramic ring is used for the frame body 16.

  The reflective material layer 15 is formed of a resin containing a non-conductive and highly reflective filler. As the filler, titanium oxide, zinc oxide, or the like is used, and as the resin, for example, a silicone resin that is hardly deteriorated by heat or light is used.

  The size of the plate-like transparent member 14 in the main plane direction is slightly larger than that of the light emitting element 11. Thereby, since the outer frame 24 is located outside the light emitting element 11, the side surface of the phosphor-containing resin layer 13 disposed between the white ceramic outer framed transparent plate member 14 and the light emitting element 11 is An inclined surface 130 that connects the side surface of the light emitting element 11 and the edge of the white ceramic outer frame 24 is formed. The reflective material layer 15 filling the outside of the phosphor-containing resin layer 13 also has a shape along the inclined surface 130. The inclined surface 130 at the boundary between the reflective material layer 15 and the phosphor-containing resin layer 13 is a reflective surface that reflects the light emitted from the light emitting element 11 and the phosphor-containing resin layer 13 upward, and forms a cavity.

  Accordingly, the light emitted upward and laterally from the light emitted from the light emitting element 11 is incident on the phosphor-containing resin layer 13 and is reflected directly or upward by the inclined surface 130, so that the plate-like transparent member 14 and is emitted from the upper surface of the plate-like transparent member 14. At that time, in the phosphor-containing resin layer 13, a part of the light is absorbed by the phosphor and converted into fluorescence. Thereby, the light (for example, white light) of the predetermined color which mixed the emitted light of the light emitting element 11, and fluorescence can be radiate | emitted upwards.

  In this structure, most of the light emitted from the side surface of the light emitting element 11 is reflected upward by the inclined surface 130 and therefore does not return to the inside of the light emitting element 11 and is not absorbed by the light emitting element 11. Further, since the distance between the side surface of the light emitting element 11 and the inclined surface 130 is short, it is hardly affected by absorption by the phosphor-containing resin layer 13. In this way, the light emitted from the light emitting element 11 can be efficiently reflected with the inclined surface 130 as a cavity and emitted from a small light emitting surface (the upper surface of the plate-like transparent member 14).

  Further, since the space between the light emitting element 11 and the substrate 10 is filled with the bump 12 and the reflective material layer 15, the light emitted from the light emitting element 11 to the lower surface side is reflected by the bump 12 or the reflective material layer 15. Then, it can be emitted upward. Therefore, it is possible to prevent light from being repeatedly reflected and attenuated between the bottom surface of the light emitting element 11 and the top surface of the substrate 10, thereby improving the light extraction efficiency upward.

  Since almost all of the light emitted from the light emitting device passes through the plate-like transparent member 14, when the amount of emitted light is large, the reflective material layer around the upper surface that is in contact with the side surface of the plate-like transparent member 14 through the side surface direction. Since the light emitted to 15 is also increased, the resin of the reflective material layer 15 around the upper surface of the plate-like transparent member 14 may be deteriorated and oil bleed may occur. The frame 24 prevents oil bleed from occurring. That is, since the white ceramic outer frame 24 is disposed around the plate-like transparent member 14, the light emitted from the side surface of the plate-like transparent member 14 is reflected by the white ceramic outer frame 24. Thereby, the light quantity which reaches | attains the upper layer area | region of the reflective material layer 15 from the plate-shaped transparent member 14 can be reduced significantly. Therefore, it is possible to prevent oil bleed from occurring in the upper layer region of the reflective material layer 15. Thereby, the upper surface of the plate-like transparent member 14 is not contaminated with an oily substance, and the film thickness of the reflective material layer 15 is not reduced in the vicinity of the white ceramic outer frame 24.

  Actually, an outer frame 24 made of alumina and having a width of 0.6 mm was manufactured, and the transmittance in the width direction was measured. As a result, the transmittance was about 11 to 12% as shown in FIG. Therefore, the light incident on the white ceramic outer frame 24 from the side surface of the plate-like transparent member 14 is attenuated to about 11 to 12% when reaching the reflective material layer 15. As a result, even when the amount of light emitted from the light emitting element 11 is large, the amount of light reaching the reflective material layer 15 outside the outer frame 24 can be reduced, and oil bleeding due to deterioration of the reflective material layer 15 can be reduced.

  In addition, since the light from the phosphor-containing resin layer 13 directly reaches the reflective material layer 15 on the inclined surface 130, the reflective material layer 15 may be deteriorated. However, since the inclined surface 130 is inclined, Compared to the case where the end face is vertical, the density of the light reaching it is reduced, and light deterioration is less likely to occur. The thickness of the phosphor-containing resin layer 13 is about a fraction of the thickness of the plate-like transparent member 14 (eg, the thickness of the plate-like transparent member 14 is about 300 μm, and the thickness of the phosphor-containing resin layer 13 is about 50 μm. Therefore, the influence caused by the deterioration of the resin of the reflecting material layer 15 in contact with the phosphor-containing resin layer 13 is smaller than the influence caused by the deterioration of the reflecting material layer 15 around the plate-like transparent member 14. Furthermore, even when the molecular weight of the resin of the reflective material layer 15 is reduced on the inclined surface 130, the white ceramic outer frame 24 suppresses the deterioration in the surface layer portion of the reflective material layer 15 thereon. Therefore, the movement of the oil-like substance caused by the low molecular weight is stopped by the surface without deterioration, and it is possible to prevent the oily substance from oozing out from the surface.

  Since the boundary between the plate-like transparent member 14 and the white ceramic outer frame 24 forms a cut-off line, a desired shape of the cut-off line can be realized by setting the boundary shape to a desired shape.

  Next, a method for manufacturing the light emitting device of the present embodiment will be described with reference to FIGS. In the present embodiment, the inclined surface 130 is formed using the surface tension of the uncured phosphor-containing resin layer 13.

  First, the plate-like transparent member 14 provided with the white ceramic outer frame 24 is manufactured. A white ceramic is previously molded into the shape of the outer frame 24. For example, a method of firing the ceramic material before firing into the shape of the outer frame 24 in advance and then firing can be used.

  Next, a white ceramic outer frame 24 is disposed on a sheet having a surface having good releasability (eg, a sheet made of polytetrafluoroethylene) in a room temperature environment, and an alkyl silicate or metal is placed in the outer frame 24. An alcoholate is injected and a curing process is performed under a predetermined temperature condition. Alkyl silicate or metal alcoholate forms an inorganic polymer when a condensation reaction is caused by dealcoholization under a predetermined temperature condition. Thereby, the plate-like transparent member 14 made of an inorganic polymer can be formed inside the white ceramic outer frame 24. In addition, the manufacturing method of the plate-shaped transparent member 14 provided with the white ceramic outer frame 24 is not limited to this method, a method of cooling after filling the outer frame 24 with molten glass, It is also possible to use a method in which the outer frame 24 expanded by heating is fitted to the outside of the cut glass plate and cooled.

  Next, as shown in FIG. 3A, the element electrode of the flip chip type light emitting element 11 is bonded to the wiring pattern on the upper surface of the submount substrate 10 using the bumps 12 and mounted. As shown in FIG. 3B, a plate provided with a white ceramic outer frame 24 that is coated (dropped) on the upper surface of the light-emitting element 11 with uncured phosphor-containing resin 13 ′ and slightly larger than the upper surface of the light-emitting element 11. A transparent member 14 is mounted. Thereby, as shown in FIG. 3C, the uncured phosphor-containing resin 13 ′ maintains the surface tension while covering at least a part of the side surface of the light-emitting element 11, whereby the side surface of the light-emitting element 11 and the outer frame 24. An inclined surface 130 connecting the edges is formed.

  The phosphor-containing resin 13 ′ is cured by a predetermined curing process to form the phosphor-containing resin layer 13. In addition, as long as the shape of the phosphor-containing resin layer 13 does not change in the subsequent steps, the phosphor-containing resin layer 13 may be cured under conditions that are semi-cured without being completely cured.

  Next, as shown in FIG. 3D, the frame 16 is bonded to the upper surface of the substrate 10 outside the light emitting element 11 with a resin or the like. As shown in FIG. 3E, an uncured reflective material is injected between the light emitting element 11, the phosphor-containing resin layer 13 and the outer frame 24, and the frame 16 with a dispenser or the like. At this time, the injection is performed so that the reflective material is sufficiently filled also around the bump 12 below the light emitting element 11. Further, the reflective material (uncured) is filled so as to adhere to the inclined surface 130 of the phosphor-containing resin layer 13 and the side surface of the wavelength conversion layer without any gap. Thereby, the reflective material layer 15 having an inclined surface along the inclined surface 130 of the phosphor-containing resin layer 13 can be formed. Finally, the reflective material is cured by a predetermined curing process to form the reflective material layer 15. Thus, the light emitting device of this embodiment is manufactured.

  In this embodiment, since the inclined surface 130 can be easily formed by utilizing the surface tension of the uncured transparent material, machining is not required, and an inclined surface (cavity) having a desired shape with a small opening. Can be manufactured.

  In the light emitting device of FIG. 1, the inclined surface 130 has a convex shape toward the inside of the phosphor-containing resin layer 13, but the present invention is not limited to this shape, and FIGS. As shown in b), it may be a linear inclined surface 130 or an inclined surface 130 convex outward. 4 (a) and 4 (b) can be manufactured by adjusting the amount of the phosphor-containing resin 13 'to be applied in the step of FIG. 3 (b). Specifically, if the amount of the phosphor-containing resin 13 ′ is small, an inclined surface 130 that is convex toward the inside is formed as shown in FIG. 1, and when the amount of the phosphor-containing resin 13 ′ is increased, FIG. A linear inclined surface 130 is formed as shown in (a), and when the amount of the phosphor-containing resin 13 ′ is further increased, a curved inclined surface 130 that protrudes outward is formed as shown in FIG. 4B. Can do.

  As described above, the light emitting device of the present embodiment uses the plate-like transparent member 14 provided with the white ceramic outer frame 24 to suppress white resin oil bleed while using the white resin as the reflective material layer 15. can do. Therefore, it is possible to provide a light emitting device that is high power, excellent in light distribution characteristics, and capable of forming a desired cutoff line.

  Since the reflective material layer 15 can be formed of white resin, the inclined surface 130 can be formed using surface tension. Thereby, a cavity can be formed at a position close to the light emitting element 11, and a light emitting device having a small light emitting area and high light extraction efficiency can be obtained. Moreover, since white resin can be filled also into the bottom face side of the light emitting element 11, luminous efficiency can further be improved. Further, the use of the white resin has an advantage that the manufacturing process becomes easier as compared with the case where the cavity is formed of white ceramic.

  Further, the white ceramic outer frame 24 hardly absorbs light, and the temperature does not easily rise even when a large amount of light is reflected. Therefore, there is a merit that the surrounding phosphor-containing resin layer 13 and the like are hardly affected by heat.

  Actually, when the light emitting device of FIG. 1 was manufactured to emit light with high output, it was confirmed that the oil bleed phenomenon did not occur in the reflective material layer 15.

(Embodiment 2)
The light-emitting device of Embodiment 2 is demonstrated using FIG.

  In the light emitting device of the first embodiment, a white ceramic outer frame 24 surrounding the periphery of the plate-like transparent member 14 is provided, and the thickness of the outer frame 24 is the same as the thickness of the plate-like transparent member 14 and the outer frame 24 and the plate shape. The lower surface of the transparent member 14 is a smooth integrated surface. For this reason, when the inclined surface 130 is configured by the surface tension of the uncured phosphor-containing resin layer 13, an inclined surface connecting the light emitting element 11 and the outer end surface of the outer frame is formed as shown in FIG. In this case, as shown in FIG. 5, the shape of the phosphor-containing resin layer 13 directly under the white ceramic outer frame 24 is a shape having an acute corner with a thin thickness, and the light from the light emitting element 11 is made of white ceramic. Multiple reflections are made at the lower part of the outer frame 24. For this reason, since more fluorescence is generated in the acute corner portion of the phosphor-containing resin layer 13 than in other portions, there is a possibility that color unevenness of the emission color occurs.

  Therefore, in the second embodiment, by making the thickness of the white ceramic outer frame 24 thicker than that of the plate-like transparent member 14 as shown in FIG. 6, the lower surface of the outer frame 24 is made smaller than the lower surface of the plate-like transparent member 14. The structure protrudes downward (to the light emitting element 11 side). When the three inclined surfaces 130 are formed by the surface tension of the uncured phosphor-containing resin layer 13 in the steps of FIGS. 3B and 3C, the inclined surfaces 130 are formed on the side surfaces of the light emitting element 11 as shown in FIG. It becomes a curved surface connecting the white ceramic outer frame 24.

  Thereby, since the phosphor-containing resin layer 13 is not formed under the white ceramic outer frame 24, color unevenness due to multiple reflection at the lower part of the outer frame 24 can be prevented.

  Other configurations and manufacturing methods are the same as those in the first embodiment, and thus the description thereof is omitted.

  Since the angle and length of the inclined surface 130 change depending on the position of the projecting lower surface of the white ceramic outer frame 24, the position of the lower surface of the white ceramic outer frame 24 is set according to the desired shape of the cavity. In order to form the inclined surface 130 that reflects light upward, the lower surface of the outer frame 24 is preferably positioned above the bottom surface of the light emitting element 11.

(Embodiment 3)
The light-emitting device of Embodiment 3 is demonstrated using FIG.

  In the third embodiment, in order to prevent the phosphor-containing resin layer 13 from being formed below the white ceramic outer frame 24 as in the second embodiment, a boundary between the white ceramic outer frame 24 and the plate-like transparent member 14 is used. A notch 25 is formed along the line. 3B and 3C, since the uncured phosphor-containing resin does not wet and spread to the white ceramic outer frame 24, the side surface of the plate-like transparent member 14 and the side surface of the light emitting element 11 Can be formed. Other configurations are the same as those of the first embodiment.

  The width and depth of the notch 25 do not wet and spread into the white ceramic outer frame 24 in consideration of the concentration of the uncured phosphor-containing resin and the wettability of the white ceramic outer frame 24 and the plate-like transparent member 14. Set to width and depth. For example, the width of the notch 25 is set to about 5 to 30 μm and the depth is set to about 5 to 50 μm. The reason for setting such a value is that if the width is larger than 30 μm, the light that has passed through the notched portion may come out on the light emitting surface and cause color unevenness. If the depth is larger than 50 μm, This is because the strength of the plate-like transparent member 14 may be reduced.

  As a method of manufacturing the white ceramic outer frame 24 and the plate-like transparent member 14 with the notch 25 formed at the boundary, as in the first embodiment, the white ceramic outer frame 24 is molded in advance, and the inside A method of forming an inorganic polymer by filling an alkyl silicate or a metal alcoholate into the polymer can be used. Since the convex member is arranged on the inner side surface of the white ceramic outer frame 24 before the step of filling the alkyl silicate or the like, it is possible to prevent the portion from being filled with the alkyl silicate or the like. A notch 25 corresponding to the shape can be formed in the inorganic polymer.

  In the example of FIG. 7, the lower portion of the inner side surface of the white ceramic outer frame 24 is recessed to form a part of the notch 25. As a method of manufacturing the white ceramic outer frame 24 in such a shape, a method of using a mold in which a lower part of the inner side surface is recessed during molding, or a method of cutting the lower part of the inner side surface by cutting or the like after molding is used. Can do.

  The notch 25 is not necessarily provided on the inner surface of the white ceramic outer frame 24 as shown in FIG. 7, and the inner surface of the outer frame 24 may be vertical.

(Embodiment 4)
The light-emitting device of Embodiment 4 is demonstrated using FIG.

  In the fourth embodiment, in order to prevent the phosphor-containing resin layer 13 from being formed below the white ceramic outer frame 24 as in the second embodiment, the bottom surface of the white ceramic outer frame 24 is formed as shown in FIG. The shape is such that the distance from the light emitting element 11 increases as the distance from the side surface of the plate-like transparent member 14 increases. That is, the cross-sectional shape of the white ceramic outer frame 24 is triangular so that the portion in contact with the plate-like transparent member 14 is equal to the thickness of the plate-like transparent member 14 and becomes thinner with increasing distance from the plate-like transparent member 14. did. Thereby, since the lower surface of the white ceramic outer frame 24 is not located on the same plane as the lower surface of the plate-like transparent member 14, it is possible to prevent the uncured phosphor-containing resin from spreading on the outer frame 24.

  The white ceramic outer frame 24 has a bottom angle x of about 45 ° ≦ x ≦ 60 ° in order to prevent wetting and spreading while maintaining low light transmittance in the main plane direction. It is desirable.

  3B and 3C, since the uncured phosphor-containing resin does not get wet to the white ceramic outer frame 24, the slope connecting the side surface of the plate-like transparent member 14 and the side surface of the light emitting element 11 is used. A surface 130 can be formed. Other configurations are the same as those of the first embodiment.

  In Embodiments 1 to 4 described above, the plate-like transparent member 14 is used, but instead of the plate-like transparent member 14, a plate-like member containing a phosphor such as a fluorescent ceramic or a phosphor plate can be used. It is. In this case, the phosphor-containing resin layer 13 may be a transparent resin layer that does not contain a phosphor.

DESCRIPTION OF SYMBOLS 10 ... Submount board | substrate, 11 ... Light emitting element, 12 ... Bump, 13 ... Phosphor containing resin layer, 14 ... Plate-shaped transparent member, 15 ... Reflective material layer, 16 ... Outer frame, 24 ... White ceramic outer frame, 25 ... Notch, 130 ... Inclined surface

Claims (9)

A substrate, a light-emitting element mounted on the substrate, an optical layer disposed on the light-emitting element and transmitting at least part of light emitted from the light-emitting element, and mounted on the optical layer, A plate-like optical member that transmits at least part of the light emitted from the light-emitting element,
The outer periphery of the plate-like optical member is covered with a white ceramic outer frame,
Side surfaces of the optical layer and the white ceramic outer frame are covered with a light-reflective resin member. The light-emitting device according to claim 1, wherein the plate-like optical member is larger than the light-emitting element,
The light emitting device, wherein the optical layer has an inclined side surface that connects a side surface of the light emitting element and the white ceramic outer frame. The light-emitting device according to claim 1, wherein the plate-like optical member is larger than the light-emitting element,
The optical layer has an inclined side surface connecting a side surface of the light emitting element and an outer periphery of the plate-like optical member.   3. The light emitting device according to claim 2, wherein a lower surface of the white ceramic outer frame protrudes toward the light emitting element from a lower surface of the plate-like optical member.   4. The light emitting device according to claim 3, wherein a notch is provided on a lower surface side at a boundary between the plate-like optical member and the white ceramic outer frame.   4. The light emitting device according to claim 3, wherein a bottom surface of the white ceramic outer frame has a shape that moves away from the light emitting element as it moves away from a side surface of the plate-like optical member in a main plane direction. . A first step of mounting a plate-like optical member, the outer periphery of which is covered with a white ceramic outer frame, on the light emitting element with an optical layer interposed therebetween;
A method of manufacturing a light emitting device, comprising: a second step of covering an outer periphery of the optical layer and an outer periphery of a white ceramic outer frame of the plate-like optical member with a light reflective resin material.   The light emitting device manufacturing method according to claim 7, wherein in the first step, an uncured optical material is provided between the light emitting element and the plate-like optical member whose outer periphery is covered with the white ceramic outer frame. The uncured optical material layer having an inclined side surface connecting the side surface of the light emitting element and the white ceramic outer frame is formed by the surface tension, and the uncured optical material layer is cured by A method of manufacturing a light emitting device, comprising forming an optical layer.   The light emitting device manufacturing method according to claim 7, wherein in the first step, an uncured optical material is provided between the light emitting element and the plate-like optical member whose outer periphery is covered with the white ceramic outer frame. And forming an uncured optical material layer having an inclined side surface connecting the side surface of the light emitting element and the outer periphery of the plate-like optical member by the surface tension, and curing the uncured optical material layer. The optical layer is formed by the method described above.

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