JP5452786B2 - Board assembly structure and electronic equipment - Google Patents
Board assembly structure and electronic equipment Download PDFInfo
- Publication number
- JP5452786B2 JP5452786B2 JP2013547422A JP2013547422A JP5452786B2 JP 5452786 B2 JP5452786 B2 JP 5452786B2 JP 2013547422 A JP2013547422 A JP 2013547422A JP 2013547422 A JP2013547422 A JP 2013547422A JP 5452786 B2 JP5452786 B2 JP 5452786B2
- Authority
- JP
- Japan
- Prior art keywords
- board
- connector
- chassis
- assembly structure
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 description 26
- 230000000694 effects Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
- H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
- H01R13/6591—Specific features or arrangements of connection of shield to conductive members
- H01R13/6594—Specific features or arrangements of connection of shield to conductive members the shield being mounted on a PCB and connected to conductive members
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
この発明は、基板をシャーシ内に組み付ける基板組み付け構造およびこの構造を備える電子機器に関する。 The present invention relates to a board assembly structure for assembling a board in a chassis and an electronic apparatus including the structure.
基板をシャーシ内に組み付ける際に、シャーシの外部に露出させる必要のあるコネクタが基板上に配置されている場合、下記のように組み付けられることがある。
先ず、基板を、コネクタが配置された側をシャーシの側面に対して傾けながら当該側面に向けて導入し、コネクタの外部との接続に供せられる端部を当該側面に設けた開口部に挿通させることによって、コネクタの端部が開口部から外部に露出した状態でシャーシ内に組み付けられる。なお、このように、基板を傾けながら所定部位に近づけて組み付ける従来の技術としては、例えば特許文献1に開示される電気接続構造がある。When the board is assembled in the chassis and the connector that needs to be exposed to the outside of the chassis is arranged on the board, the board may be assembled as follows.
First, the board is introduced toward the side of the chassis while the side on which the connector is disposed is tilted with respect to the side of the chassis, and the end provided for connection to the outside of the connector is inserted into the opening provided on the side. By doing so, the connector is assembled in the chassis with the end of the connector exposed to the outside through the opening. Note that, as a conventional technique for assembling a substrate close to a predetermined part while tilting the substrate, there is an electrical connection structure disclosed in Patent Document 1, for example.
従来では、基板の実装面からの高さがコネクタより高い電子部品が当該コネクタの周辺に実装されていると、基板を傾けながらシャーシ内の上記側面に向けて導入するときに、当該側面に上記電子部品が接触して破損する可能性があるという課題があった。
例えば、特許文献1の電気接続構造においても基板の端辺部に背の高い電子部品が実装されていると、基板を傾けながら所定部位に近づけた際に、当該部品が組み付け側の壁面に接触する可能性がある。Conventionally, when an electronic component whose height from the mounting surface of the board is higher than the connector is mounted around the connector, when the board is tilted and introduced toward the side face in the chassis, There existed a subject that an electronic component might contact and be damaged.
For example, even in the electrical connection structure of Patent Document 1, when a tall electronic component is mounted on the edge of the board, the component comes into contact with the wall surface on the assembly side when the board is tilted and brought close to a predetermined part. there's a possibility that.
この発明は、上記のような課題を解決するためになされたもので、組み付け時に基板上の電子部品がシャーシ側の面に接触することを防止できる基板組み付け構造およびこの構造を備える電子機器を得ることを目的とする。 The present invention has been made to solve the above-described problems, and obtains a board assembly structure capable of preventing electronic components on the board from coming into contact with the chassis-side surface during assembly, and an electronic apparatus including the structure. For the purpose.
この発明に係る基板組み付け構造は、コネクタが配置された基板と側面に開口部が形成されたシャーシを備え、基板を、コネクタが配置された側をシャーシの側面に対して傾けながら当該側面に向けて導入し、コネクタの外部との接続に供せられる端部を開口部に挿通させることにより、当該端部が開口部から外部に露出した状態でシャーシ内に組み付けられる基板組み付け構造において、コネクタを覆うように設けたコネクタホルダと、コネクタホルダに形成され、基板のコネクタが配置された側に実装された電子部品より当該基板の端面に近い位置にあり、かつ当該基板の実装面からの高さが電子部品よりも高い当たり形状部とを備える。 A board assembly structure according to the present invention includes a board on which a connector is disposed and a chassis having an opening formed on a side surface, and the board is directed toward the side surface while the side on which the connector is disposed is inclined with respect to the side surface of the chassis. In the board assembly structure in which the end portion provided for connection with the outside of the connector is inserted into the opening portion, and the end portion is exposed to the outside from the opening portion, the board is assembled in the chassis. A connector holder provided so as to cover and a height closer to the end surface of the board than the electronic component mounted on the side where the connector of the board is disposed, and the height from the mounting surface of the board Is provided with a contact shape portion higher than that of the electronic component.
この発明によれば、組み付け時に基板上の電子部品がシャーシ側の面に接触することを防止できるという効果がある。 According to the present invention, there is an effect that it is possible to prevent the electronic component on the board from coming into contact with the surface on the chassis side during assembly.
以下、この発明をより詳細に説明するため、この発明を実施するための形態について、添付の図面に従って説明する。
実施の形態1.
図1は、この発明に係る基板組み付け構造を備える電子機器を示す斜視図である。図1に示す電子機器1は、この発明に係る基板組み付け構造を内部に有する電子機器であり、シャーシ3の天面を覆うカバー2、少なくとも2面(天面、前面など)が開口した箱状のシャーシ3およびシャーシ3の前面に設けられたパネル4を備える。その内部構成としては、図2に示すように、パネル4が裏面(シャーシ3の内部側の面)にパネル基板4aを備えており、フロントシャーシ6を介してシャーシ3の前面に組み付けられる。Hereinafter, in order to describe the present invention in more detail, modes for carrying out the present invention will be described with reference to the accompanying drawings.
Embodiment 1 FIG.
FIG. 1 is a perspective view showing an electronic apparatus having a board assembly structure according to the present invention. An electronic device 1 shown in FIG. 1 is an electronic device having a board assembly structure according to the present invention, and is a
また、シャーシ3の後面3Aには、図2に示すように開口部3aが形成されており、基板5は、当該基板5上に配置されたコネクタ7の外部との接続に供せられる側の端部が、シャーシ3の開口部3aから外部に露出するようにシャーシ3内に組み付けられる。
コネクタ7は、基板5の実装面の端部に配置されて、当該コネクタ7の外部との接続に供せられる側の端部を除く部分(シャーシ3の内部側に露出する部分)がコネクタホルダ7aによって覆われている。Further, an
The
なお、電子機器1では、基板5を、図3(a)に矢印で示すように、コネクタ7を配置した側をシャーシ3の後面3Aに対して傾けながら当該後面3Aに向けて導入し、コネクタ7の外部との接続に供せられる端部を開口部3aに挿通させることにより、コネクタ7の上記端部が開口部3aから外部に露出した状態でシャーシ3内に組み付けられる。
このとき、コネクタ7を配置した端部側に実装される電子部品8の高さ(基板5の実装面からの高さ)が、コネクタホルダ7aを含むコネクタ7よりも高い場合、図3(b)に示すように、電子部品8が後面3Aに接触して破損する可能性がある。In the electronic device 1, as shown by an arrow in FIG. 3A, the
At this time, when the height of the
つまり、図4に示すように、コネクタ7の外部との接続に供せられる側の端部を、シャーシ3の後面3Aに形成した開口部3aに挿通させるときに、基板5が、コネクタ7側が下がるように傾いているため、コネクタ7より高い電子部品8が、シャーシ3の後面3Aに接触する。この場合、基板5をシャーシ3の後面3Aに向けて無理に導入すると、当該接触により電子部品8が傾いて基板5との接合部が破損する恐れがある。
That is, as shown in FIG. 4, when the end of the
そこで、この発明では、図5(a)に示すように、従来のコネクタホルダ7aの代わりにコネクタホルダ7Aを使用する。コネクタホルダ7Aは、図5(b)(符号Aを付した部分の拡大図)に示すように、コネクタ7の外部との接続に供せられる側の端部と同じ側の上部、すなわち基板5をシャーシ3内に組み付けたときに後面3A側を向く上部に、電子部品8よりも基板5の端部に近い位置にあり、かつ基板5の実装面からの高さが電子部品8よりも高くなるように形成した当たり形状部9を備える。
Therefore, in the present invention, as shown in FIG. 5A, a
コネクタ7の外部との接続に供せられる側の端部が開口部3aから外部に露出するように当該基板5をシャーシ3内に組み付けるときに、従来と同様に、コネクタ7側が下がるように傾けながらシャーシ3内の後面3Aに向けて基板5を導入していくと、この発明では、図6に示すように、電子部品8よりも先に当たり形状部9がシャーシ3の後面3Aに接触する。これにより、電子部品8がシャーシ3の後面3Aに直接接触することがなく、破損を防止できる。なお、図5(a)のように、1枚の板材を折り曲げてコネクタホルダ7Aを形成することで、この発明に係る基板組み付け構造を簡易な構成で実現することができる。
When assembling the
また、図7(a)、図7(b)(符号Bを付した部分の拡大図)に示すように、コネクタホルダ7Aの実装面側の端部には、係合凸部10a,10bと、孔部12が形成された取り付け板部11が設けられる。また、基板5には、実装されたコネクタ7の周囲に孔部13a,13b,14aが形成されている。コネクタホルダ7Aの取り付けは、まず、基板5の孔部13a,13bに係合凸部10a,10bを挿入して位置決めを行い、ねじを孔部12および孔部14aに挿通させてねじ止めする。
Further, as shown in FIGS. 7A and 7B (enlarged view of the portion denoted by reference symbol B), the end portions on the mounting surface side of the
以上のように、この実施の形態1によれば、コネクタ7を覆うように設けたコネクタホルダ7Aと、コネクタホルダ7Aに形成され、基板5のコネクタ7が配置された側に実装された電子部品8より当該基板5の端面に近い位置にあり、かつ当該基板5の実装面からの高さが電子部品8よりも高い当たり形状部9とを備える。このように構成することで、組み付け時に基板5上の電子部品8がシャーシ3側の面に接触することを防止できる。
As described above, according to the first embodiment, the
また、この実施の形態1によれば、電子機器1が、上記の基板組み付け構造を備えるので、上記と同様の効果が得られる電子機器1を提供することができる。 Moreover, according to this Embodiment 1, since the electronic device 1 is provided with said board | substrate assembly | attachment structure, the electronic device 1 with the same effect as the above can be provided.
なお、本発明はその発明の範囲内において、実施の形態の任意の構成要素の変形、もしくは実施の形態の任意の構成要素の省略が可能である。 In the present invention, any component of the embodiment can be modified or any component of the embodiment can be omitted within the scope of the invention.
この発明に係る基板組み付け構造は、組み付け時に基板上の電子部品がシャーシ側の面に衝突することを防止できるので、小型化により組み付け時にシャーシの側面と基板の端部との距離が近くなる可能性がある車載用の電子機器に好適である。 The board assembly structure according to the present invention can prevent the electronic components on the board from colliding with the surface on the chassis side during the assembly, so that the distance between the side surface of the chassis and the edge of the board can be reduced during the assembly due to downsizing. This is suitable for a vehicle-mounted electronic device.
1 電子機器、2 カバー、3 シャーシ、3a 開口部、3A 後面、4 パネル、4a パネル基板、5 基板、6 フロントシャーシ、7 コネクタ、7a,7A コネクタホルダ、8 電子部品、9 当たり形状部、10a,10b 係合凸部、11 取り付け板部、12,13a,13b,14a 孔部。 1 electronic device, 2 cover, 3 chassis, 3a opening, 3A rear surface, 4 panel, 4a panel substrate, 5 substrate, 6 front chassis, 7 connector, 7a, 7A connector holder, 8 electronic component, 9 per shape, 10a , 10b engagement convex part, 11 mounting plate part, 12, 13a, 13b, 14a hole part.
Claims (2)
前記コネクタを覆うように設けたコネクタホルダと、
前記コネクタホルダに形成され、前記基板の前記コネクタが配置された側に実装された電子部品より当該基板の端面に近い位置にあり、かつ当該基板の実装面からの高さが前記電子部品よりも高い当たり形状部とを備えることを特徴とする基板組み付け構造。A board on which a connector is disposed and a chassis having an opening formed on a side surface; the board is introduced toward the side surface while the side on which the connector is disposed is inclined with respect to the side surface of the chassis; In the board assembly structure that is assembled into the chassis in a state where the end is exposed to the outside by inserting the end that is provided for connection with the outside into the opening,
A connector holder provided to cover the connector;
The electronic component formed on the connector holder and closer to the end face of the board than the electronic part mounted on the side of the board where the connector is disposed, and the height from the mounting surface of the board is higher than that of the electronic part A board assembly structure comprising a high contact shape portion.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2012/000567 WO2013114423A1 (en) | 2012-01-30 | 2012-01-30 | Structure for assembling board, and electronic instrument |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5452786B2 true JP5452786B2 (en) | 2014-03-26 |
JPWO2013114423A1 JPWO2013114423A1 (en) | 2015-05-11 |
Family
ID=48904520
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013547422A Active JP5452786B2 (en) | 2012-01-30 | 2012-01-30 | Board assembly structure and electronic equipment |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5452786B2 (en) |
WO (1) | WO2013114423A1 (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0569987U (en) * | 1992-02-27 | 1993-09-21 | 株式会社ケンウッド | Connector holder |
JP2008016333A (en) * | 2006-07-06 | 2008-01-24 | Funai Electric Co Ltd | Method and structure of mounting base board with hdmi connector |
JP2008130333A (en) * | 2006-11-20 | 2008-06-05 | Funai Electric Co Ltd | Mounting structure for hdmi connector |
-
2012
- 2012-01-30 WO PCT/JP2012/000567 patent/WO2013114423A1/en active Application Filing
- 2012-01-30 JP JP2013547422A patent/JP5452786B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0569987U (en) * | 1992-02-27 | 1993-09-21 | 株式会社ケンウッド | Connector holder |
JP2008016333A (en) * | 2006-07-06 | 2008-01-24 | Funai Electric Co Ltd | Method and structure of mounting base board with hdmi connector |
JP2008130333A (en) * | 2006-11-20 | 2008-06-05 | Funai Electric Co Ltd | Mounting structure for hdmi connector |
Also Published As
Publication number | Publication date |
---|---|
WO2013114423A1 (en) | 2013-08-08 |
JPWO2013114423A1 (en) | 2015-05-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4494441B2 (en) | Electrical connector | |
JP4908621B1 (en) | Electronics | |
JP4348725B2 (en) | Socket for mounting electronic parts | |
US20090268420A1 (en) | Shielding assembly | |
KR101473266B1 (en) | Connector | |
JP2014082844A (en) | Electric connection box | |
US10010016B2 (en) | Shield can device for shielding electromagnetic wave | |
JP2010103447A (en) | Case for housing electronic circuit board | |
US7817435B2 (en) | Assembly structure for power supply circuit unit of electric device | |
JP4589933B2 (en) | connector | |
JP5472724B2 (en) | Electrical junction box | |
JP5452786B2 (en) | Board assembly structure and electronic equipment | |
JP2009141057A (en) | Electronic equipment and slot | |
JP4937418B2 (en) | Electronics | |
JP2015046483A (en) | Waterproof housing | |
JP2012146593A (en) | Support structure of connector jack and electronic apparatus having connector jack | |
JP4869419B2 (en) | Electronics | |
JP2011124414A (en) | Electronic device | |
KR100738348B1 (en) | Electromagnetic wave shield cover for display apparatus | |
JP5663419B2 (en) | Electronic circuit module | |
JP4910838B2 (en) | Open / close detection structure of the housing | |
JP5733164B2 (en) | Circuit unit | |
JP2015185625A (en) | Electric device | |
JP2014079038A (en) | Electric connection box | |
JP3189662U (en) | Printed circuit board with harness fixing function |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20131203 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20131227 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 5452786 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |