JP5369296B2 - Aromatic polycarbonate resin composition and molded article - Google Patents
Aromatic polycarbonate resin composition and molded article Download PDFInfo
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- JP5369296B2 JP5369296B2 JP2008301612A JP2008301612A JP5369296B2 JP 5369296 B2 JP5369296 B2 JP 5369296B2 JP 2008301612 A JP2008301612 A JP 2008301612A JP 2008301612 A JP2008301612 A JP 2008301612A JP 5369296 B2 JP5369296 B2 JP 5369296B2
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- JP
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- Prior art keywords
- polycarbonate resin
- aromatic polycarbonate
- group
- molded article
- carbon atoms
- Prior art date
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- 229920005668 polycarbonate resin Polymers 0.000 title claims abstract description 54
- 239000004431 polycarbonate resin Substances 0.000 title claims abstract description 54
- 125000003118 aryl group Chemical group 0.000 title claims abstract description 52
- 239000000203 mixture Substances 0.000 title claims abstract description 28
- 239000003381 stabilizer Substances 0.000 claims abstract description 37
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 20
- 238000000465 moulding Methods 0.000 claims abstract description 19
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 15
- 239000011574 phosphorus Substances 0.000 claims abstract description 15
- 125000004432 carbon atom Chemical group C* 0.000 claims description 25
- 125000000217 alkyl group Chemical group 0.000 claims description 13
- 125000001424 substituent group Chemical group 0.000 claims description 12
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 11
- 125000005843 halogen group Chemical group 0.000 claims description 10
- 125000003342 alkenyl group Chemical group 0.000 claims description 6
- 125000003545 alkoxy group Chemical group 0.000 claims description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 6
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 5
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 150000002440 hydroxy compounds Chemical class 0.000 claims description 3
- 125000005429 oxyalkyl group Chemical group 0.000 claims description 3
- 125000006702 (C1-C18) alkyl group Chemical group 0.000 claims description 2
- 230000003678 scratch resistant effect Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 abstract description 16
- 230000008018 melting Effects 0.000 abstract description 16
- 238000002845 discoloration Methods 0.000 abstract description 7
- 125000002723 alicyclic group Chemical group 0.000 abstract 1
- 125000003003 spiro group Chemical group 0.000 abstract 1
- 239000000047 product Substances 0.000 description 35
- 229930185605 Bisphenol Natural products 0.000 description 25
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 23
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical class C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 17
- 238000006243 chemical reaction Methods 0.000 description 16
- 238000000034 method Methods 0.000 description 16
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 15
- 229920000642 polymer Polymers 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000012360 testing method Methods 0.000 description 11
- 150000001875 compounds Chemical class 0.000 description 10
- -1 cyclododecanyl group Chemical group 0.000 description 10
- 229920000515 polycarbonate Polymers 0.000 description 10
- 239000004417 polycarbonate Substances 0.000 description 10
- 239000000654 additive Substances 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 8
- 238000010521 absorption reaction Methods 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- YGYAWVDWMABLBF-UHFFFAOYSA-N Phosgene Chemical compound ClC(Cl)=O YGYAWVDWMABLBF-UHFFFAOYSA-N 0.000 description 7
- 230000006872 improvement Effects 0.000 description 7
- 238000001746 injection moulding Methods 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 230000009477 glass transition Effects 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 239000003963 antioxidant agent Substances 0.000 description 5
- AIBRSVLEQRWAEG-UHFFFAOYSA-N 3,9-bis(2,4-ditert-butylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP1OCC2(COP(OC=3C(=CC(=CC=3)C(C)(C)C)C(C)(C)C)OC2)CO1 AIBRSVLEQRWAEG-UHFFFAOYSA-N 0.000 description 4
- SSADPHQCUURWSW-UHFFFAOYSA-N 3,9-bis(2,6-ditert-butyl-4-methylphenoxy)-2,4,8,10-tetraoxa-3,9-diphosphaspiro[5.5]undecane Chemical compound CC(C)(C)C1=CC(C)=CC(C(C)(C)C)=C1OP1OCC2(COP(OC=3C(=CC(C)=CC=3C(C)(C)C)C(C)(C)C)OC2)CO1 SSADPHQCUURWSW-UHFFFAOYSA-N 0.000 description 4
- BHWMWBACMSEDTE-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)cyclododecyl]phenol Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCCCCCCCC1 BHWMWBACMSEDTE-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 239000012321 sodium triacetoxyborohydride Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000005809 transesterification reaction Methods 0.000 description 4
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- CGRTZESQZZGAAU-UHFFFAOYSA-N [2-[3-[1-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]-2-methylpropan-2-yl]-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]-2-methylpropyl] 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCC(C)(C)C2OCC3(CO2)COC(OC3)C(C)(C)COC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 CGRTZESQZZGAAU-UHFFFAOYSA-N 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- QSRJVOOOWGXUDY-UHFFFAOYSA-N 2-[2-[2-[3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoyloxy]ethoxy]ethoxy]ethyl 3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C)=CC(CCC(=O)OCCOCCOCCOC(=O)CCC=2C=C(C(O)=C(C)C=2)C(C)(C)C)=C1 QSRJVOOOWGXUDY-UHFFFAOYSA-N 0.000 description 2
- VVVYVOIWJYQTCR-UHFFFAOYSA-N 4-[1-(4-hydroxy-3-methylphenyl)cyclododecyl]-2-methylphenol Chemical compound C1=C(O)C(C)=CC(C2(CCCCCCCCCCC2)C=2C=C(C)C(O)=CC=2)=C1 VVVYVOIWJYQTCR-UHFFFAOYSA-N 0.000 description 2
- UMPGNGRIGSEMTC-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)-3,3,5-trimethylcyclohexyl]phenol Chemical compound C1C(C)CC(C)(C)CC1(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 UMPGNGRIGSEMTC-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000008346 aqueous phase Substances 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000006085 branching agent Substances 0.000 description 2
- 239000004566 building material Substances 0.000 description 2
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- DDTBPAQBQHZRDW-UHFFFAOYSA-N cyclododecane Chemical group C1CCCCCCCCCCC1 DDTBPAQBQHZRDW-UHFFFAOYSA-N 0.000 description 2
- GRWZHXKQBITJKP-UHFFFAOYSA-L dithionite(2-) Chemical compound [O-]S(=O)S([O-])=O GRWZHXKQBITJKP-UHFFFAOYSA-L 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 239000012760 heat stabilizer Substances 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000012074 organic phase Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- RSJKGSCJYJTIGS-UHFFFAOYSA-N undecane Chemical compound CCCCCCCCCCC RSJKGSCJYJTIGS-UHFFFAOYSA-N 0.000 description 2
- IDTODQQHHXCCBI-UHFFFAOYSA-N (4-methylphenyl) phenyl carbonate Chemical compound C1=CC(C)=CC=C1OC(=O)OC1=CC=CC=C1 IDTODQQHHXCCBI-UHFFFAOYSA-N 0.000 description 1
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- YUUKJEBYFUTBJG-UHFFFAOYSA-N 2,6-dibromo-4-[1-(3,5-dibromo-4-hydroxyphenyl)cyclododecyl]phenol Chemical compound C1=C(Br)C(O)=C(Br)C=C1C1(C=2C=C(Br)C(O)=C(Br)C=2)CCCCCCCCCCC1 YUUKJEBYFUTBJG-UHFFFAOYSA-N 0.000 description 1
- LQYGNZRTGYAJHA-UHFFFAOYSA-N 2-[1-(2-hydroxyphenyl)cyclododecyl]phenol Chemical compound OC1=CC=CC=C1C1(C=2C(=CC=CC=2)O)CCCCCCCCCCC1 LQYGNZRTGYAJHA-UHFFFAOYSA-N 0.000 description 1
- QKROMUJVWZNHRW-UHFFFAOYSA-N 2-butan-2-yl-4-[1-(3-butan-2-yl-4-hydroxyphenyl)cyclododecyl]phenol Chemical compound C1=C(O)C(C(C)CC)=CC(C2(CCCCCCCCCCC2)C=2C=C(C(O)=CC=2)C(C)CC)=C1 QKROMUJVWZNHRW-UHFFFAOYSA-N 0.000 description 1
- MQSVWTXCKSCUBT-UHFFFAOYSA-N 2-ethyl-4-[9-(3-ethyl-4-hydroxyphenyl)fluoren-9-yl]phenol Chemical compound C1=C(O)C(CC)=CC(C2(C3=CC=CC=C3C3=CC=CC=C32)C=2C=C(CC)C(O)=CC=2)=C1 MQSVWTXCKSCUBT-UHFFFAOYSA-N 0.000 description 1
- HNTOEDIBFQTIJJ-UHFFFAOYSA-N 2-tert-butyl-4-[1-(3-tert-butyl-4-hydroxyphenyl)cyclododecyl]phenol Chemical compound C1=C(O)C(C(C)(C)C)=CC(C2(CCCCCCCCCCC2)C=2C=C(C(O)=CC=2)C(C)(C)C)=C1 HNTOEDIBFQTIJJ-UHFFFAOYSA-N 0.000 description 1
- CSOQDRZGMGKOGN-UHFFFAOYSA-N 2-tert-butyl-4-[1-(5-tert-butyl-4-hydroxy-2-methylphenyl)-2-methylpropyl]-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(C(C)C)C1=CC(C(C)(C)C)=C(O)C=C1C CSOQDRZGMGKOGN-UHFFFAOYSA-N 0.000 description 1
- ZDRSNHRWLQQICP-UHFFFAOYSA-N 2-tert-butyl-4-[2-(3-tert-butyl-4-hydroxyphenyl)propan-2-yl]phenol Chemical compound C1=C(O)C(C(C)(C)C)=CC(C(C)(C)C=2C=C(C(O)=CC=2)C(C)(C)C)=C1 ZDRSNHRWLQQICP-UHFFFAOYSA-N 0.000 description 1
- YMTYZTXUZLQUSF-UHFFFAOYSA-N 3,3'-Dimethylbisphenol A Chemical compound C1=C(O)C(C)=CC(C(C)(C)C=2C=C(C)C(O)=CC=2)=C1 YMTYZTXUZLQUSF-UHFFFAOYSA-N 0.000 description 1
- RXNYJUSEXLAVNQ-UHFFFAOYSA-N 4,4'-Dihydroxybenzophenone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=C(O)C=C1 RXNYJUSEXLAVNQ-UHFFFAOYSA-N 0.000 description 1
- VWGKEVWFBOUAND-UHFFFAOYSA-N 4,4'-thiodiphenol Chemical compound C1=CC(O)=CC=C1SC1=CC=C(O)C=C1 VWGKEVWFBOUAND-UHFFFAOYSA-N 0.000 description 1
- NZGQHKSLKRFZFL-UHFFFAOYSA-N 4-(4-hydroxyphenoxy)phenol Chemical compound C1=CC(O)=CC=C1OC1=CC=C(O)C=C1 NZGQHKSLKRFZFL-UHFFFAOYSA-N 0.000 description 1
- RQCACQIALULDSK-UHFFFAOYSA-N 4-(4-hydroxyphenyl)sulfinylphenol Chemical compound C1=CC(O)=CC=C1S(=O)C1=CC=C(O)C=C1 RQCACQIALULDSK-UHFFFAOYSA-N 0.000 description 1
- BATCUENAARTUKW-UHFFFAOYSA-N 4-[(4-hydroxyphenyl)-diphenylmethyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 BATCUENAARTUKW-UHFFFAOYSA-N 0.000 description 1
- FLCXQXDIBIICJR-UHFFFAOYSA-N 4-[1-(4-hydroxy-3,5-dimethylphenyl)cyclododecyl]-2,6-dimethylphenol Chemical compound CC1=C(O)C(C)=CC(C2(CCCCCCCCCCC2)C=2C=C(C)C(O)=C(C)C=2)=C1 FLCXQXDIBIICJR-UHFFFAOYSA-N 0.000 description 1
- ACILMGHTFSUWCU-UHFFFAOYSA-N 4-[1-(4-hydroxy-3-phenylphenyl)cyclododecyl]-2-phenylphenol Chemical compound OC1=CC=C(C2(CCCCCCCCCCC2)C=2C=C(C(O)=CC=2)C=2C=CC=CC=2)C=C1C1=CC=CC=C1 ACILMGHTFSUWCU-UHFFFAOYSA-N 0.000 description 1
- UQUJICYNXRZLKG-UHFFFAOYSA-N 4-[1-(4-hydroxyphenyl)-5,6-dimethylcyclododecyl]phenol Chemical compound C1CCC(C)C(C)CCCCCCC1(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 UQUJICYNXRZLKG-UHFFFAOYSA-N 0.000 description 1
- PVFQHGDIOXNKIC-UHFFFAOYSA-N 4-[2-[3-[2-(4-hydroxyphenyl)propan-2-yl]phenyl]propan-2-yl]phenol Chemical compound C=1C=CC(C(C)(C)C=2C=CC(O)=CC=2)=CC=1C(C)(C)C1=CC=C(O)C=C1 PVFQHGDIOXNKIC-UHFFFAOYSA-N 0.000 description 1
- MUVCEXUDRYAMQP-UHFFFAOYSA-N 4-[7-ethyl-1-(4-hydroxyphenyl)cyclododecyl]phenol Chemical compound C1CCCCC(CC)CCCCCC1(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 MUVCEXUDRYAMQP-UHFFFAOYSA-N 0.000 description 1
- NUDSREQIJYWLRA-UHFFFAOYSA-N 4-[9-(4-hydroxy-3-methylphenyl)fluoren-9-yl]-2-methylphenol Chemical compound C1=C(O)C(C)=CC(C2(C3=CC=CC=C3C3=CC=CC=C32)C=2C=C(C)C(O)=CC=2)=C1 NUDSREQIJYWLRA-UHFFFAOYSA-N 0.000 description 1
- YWFPGFJLYRKYJZ-UHFFFAOYSA-N 9,9-bis(4-hydroxyphenyl)fluorene Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 YWFPGFJLYRKYJZ-UHFFFAOYSA-N 0.000 description 1
- VOWWYDCFAISREI-UHFFFAOYSA-N Bisphenol AP Chemical compound C=1C=C(O)C=CC=1C(C=1C=CC(O)=CC=1)(C)C1=CC=CC=C1 VOWWYDCFAISREI-UHFFFAOYSA-N 0.000 description 1
- HTVITOHKHWFJKO-UHFFFAOYSA-N Bisphenol B Chemical compound C=1C=C(O)C=CC=1C(C)(CC)C1=CC=C(O)C=C1 HTVITOHKHWFJKO-UHFFFAOYSA-N 0.000 description 1
- GIXXQTYGFOHYPT-UHFFFAOYSA-N Bisphenol P Chemical compound C=1C=C(C(C)(C)C=2C=CC(O)=CC=2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 GIXXQTYGFOHYPT-UHFFFAOYSA-N 0.000 description 1
- SDDLEVPIDBLVHC-UHFFFAOYSA-N Bisphenol Z Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)CCCCC1 SDDLEVPIDBLVHC-UHFFFAOYSA-N 0.000 description 1
- UTQFOMMICZDQMD-WWYGIIIWSA-N C/C=C\C(\C1(CCCCCCCCCCC1)c1ccccc1)=C/C=C Chemical compound C/C=C\C(\C1(CCCCCCCCCCC1)c1ccccc1)=C/C=C UTQFOMMICZDQMD-WWYGIIIWSA-N 0.000 description 1
- JXOPMZYUFSRFQO-SREVYHEPSA-N CC(C)C(C)(/C=C\C)[NH+]([O-])OC Chemical compound CC(C)C(C)(/C=C\C)[NH+]([O-])OC JXOPMZYUFSRFQO-SREVYHEPSA-N 0.000 description 1
- VTUFHIJHMMXIMN-FNORWQNLSA-N CCC/C(/[NH+]([O-])OC)=C\C Chemical compound CCC/C(/[NH+]([O-])OC)=C\C VTUFHIJHMMXIMN-FNORWQNLSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 239000004609 Impact Modifier Substances 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- JKIJEFPNVSHHEI-UHFFFAOYSA-N Phenol, 2,4-bis(1,1-dimethylethyl)-, phosphite (3:1) Chemical compound CC(C)(C)C1=CC(C(C)(C)C)=CC=C1OP(OC=1C(=CC(=CC=1)C(C)(C)C)C(C)(C)C)OC1=CC=C(C(C)(C)C)C=C1C(C)(C)C JKIJEFPNVSHHEI-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical compound C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- IZJIAOFBVVYSMA-UHFFFAOYSA-N bis(4-methylphenyl) carbonate Chemical compound C1=CC(C)=CC=C1OC(=O)OC1=CC=C(C)C=C1 IZJIAOFBVVYSMA-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 150000004651 carbonic acid esters Chemical class 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- ROORDVPLFPIABK-UHFFFAOYSA-N diphenyl carbonate Chemical compound C=1C=CC=CC=1OC(=O)OC1=CC=CC=C1 ROORDVPLFPIABK-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004945 emulsification Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000006081 fluorescent whitening agent Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- SJDACOMXKWHBOW-UHFFFAOYSA-N oxyphenisatine Chemical compound C1=CC(O)=CC=C1C1(C=2C=CC(O)=CC=2)C2=CC=CC=C2NC1=O SJDACOMXKWHBOW-UHFFFAOYSA-N 0.000 description 1
- QBDSZLJBMIMQRS-UHFFFAOYSA-N p-Cumylphenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=CC=C1 QBDSZLJBMIMQRS-UHFFFAOYSA-N 0.000 description 1
- NKTOLZVEWDHZMU-UHFFFAOYSA-N p-cumyl phenol Natural products CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000013001 point bending Methods 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 238000012643 polycondensation polymerization Methods 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 238000001175 rotational moulding Methods 0.000 description 1
- 150000003377 silicon compounds Chemical class 0.000 description 1
- 235000010265 sodium sulphite Nutrition 0.000 description 1
- 238000013112 stability test Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Polyesters Or Polycarbonates (AREA)
Abstract
Description
本発明は、芳香族ポリカーボネート樹脂組成物に関し、特にガラス転移温度が高く耐熱性に優れる芳香族ポリカーボネート樹脂組成物に関する。また、本発明は、本発明の芳香族ポリカーボネート樹脂組成物からなる成形品にも関する。 The present invention relates to an aromatic polycarbonate resin composition, and more particularly to an aromatic polycarbonate resin composition having a high glass transition temperature and excellent heat resistance. The present invention also relates to a molded product comprising the aromatic polycarbonate resin composition of the present invention.
芳香族ポリカーボネート樹脂は、機械的性質、電気的性質、透明性、寸法安定性、耐熱性に優れたエンジニアリングプラスチックスとして、電気・電子・OA機器部品、自動車部品、精密機械部品、医療部品、建材、家庭用品等として幅広く使用されている。このように、現在、幅広く使用されている芳香族ポリカーボネート樹脂は、ビスフェノールAにカーボネート前駆物質を反応させて得られる樹脂であるが、用途によってはさらに高い耐熱性が要求されることが多くなっている。例えば、自動車の軽量化による燃費向上を目的に、比重の高い金属類やガラス繊維強化熱硬化性樹脂から熱可塑性樹脂製部品への変更、熱源に近接して使用するヘッドライトレンズやインナーレンズの無機ガラスから熱可塑性樹脂への変更の際には、より高い耐熱性が要求されている。 Aromatic polycarbonate resin is an engineering plastics with excellent mechanical properties, electrical properties, transparency, dimensional stability, and heat resistance. Electrical, electronic and OA equipment parts, automotive parts, precision machine parts, medical parts, building materials. Widely used as household items. As described above, the aromatic polycarbonate resin widely used at present is a resin obtained by reacting bisphenol A with a carbonate precursor. However, depending on the application, higher heat resistance is often required. Yes. For example, for the purpose of improving fuel economy by reducing the weight of automobiles, changing from high specific gravity metals and glass fiber reinforced thermosetting resins to thermoplastic resin parts, headlight lenses and inner lenses used in close proximity to heat sources When changing from inorganic glass to thermoplastic resin, higher heat resistance is required.
このような要求に対し、例えば、特許文献1には、4,4’−シクロドデシリデンビスフェノール等のシクロアルキリデン基を有する2価フェノールの少なくとも1種と、カーボネート前駆物質とを反応させることによって製造した耐熱性ポリカーボネートが提案されている。特許文献1には、当該ポリカーボネートが、ガラス転移点Tgが高く、及び耐熱性の指標の一つであるDTULが高かったことが示されている。
しかし、樹脂組成物の耐熱性については、DTULの観点のみならず、種々の観点で求められる。特に、加熱溶融時に生じる黄色等の変色を軽減することは、種々の用途の成形品について望まれる。また、光学部品には、高い透明性が要求され、湿熱によって透明性を損なわないことも要求される。特許文献1には、上記耐熱性ポリカーボネート樹脂に、酸化防止剤や着色安定剤等の添加剤を混合することができることが記載されているが、具体例については記載がなく、勿論、溶融熱安定性の改善、成形品の色相の軽減、透明成形品の湿熱による不透明化の軽減等に寄与する添加剤の具体例について、なんら記載はない。
In response to such a demand, for example, Patent Document 1 discloses that by reacting at least one dihydric phenol having a cycloalkylidene group such as 4,4′-cyclododecylidenebisphenol with a carbonate precursor. Produced heat-resistant polycarbonate has been proposed. Patent Document 1 shows that the polycarbonate has a high glass transition point Tg and a high DTUL, which is one of heat resistance indicators.
However, the heat resistance of the resin composition is required not only from the viewpoint of DTUL but also from various viewpoints. In particular, it is desirable for molded articles for various uses to reduce discoloration such as yellow that occurs during heating and melting. Moreover, high transparency is requested | required of an optical component, and it is requested | required that transparency may not be impaired by wet heat. Patent Document 1 describes that additives such as antioxidants and coloring stabilizers can be mixed with the above heat-resistant polycarbonate resin, but there is no specific example, and of course, melt heat stability. There is no description of specific examples of additives that contribute to improvement of properties, reduction of hue of molded products, reduction of opacification of transparent molded products due to wet heat, and the like.
また、特許文献2には、耐熱性が改善されたポリカーボネート樹脂として、1,1−ビス(3,5−ジブロモ−4−ヒドロキシフェニル)シクロドデカン等のハロゲン基とシクロアルキリデン基を有する少なくとも1種の2価フェノールと、カーボネート前駆物質を反応させることによって製造した耐熱性ポリカーボネートが開示されている。しかし、特許文献2に開示されたポリカーボネートは、2価フェノールの芳香環上に少なくとも1個のハロゲン原子の存在が必須となっているが、この様なハロゲン原子は、ポリカーボネートの溶融成形時に離脱し易く、成形機のバレルやスクリューの腐蝕、金型腐蝕の原因となる。その結果、該樹脂を原料とする成形品は、黄変等の変色をしている場合がある。また、成形品を高温環境で使用する際にもハロゲン原子が離脱し、成形品の変色を促進するという欠点がある。 Patent Document 2 discloses at least one type of polycarbonate resin having improved heat resistance, such as 1,1-bis (3,5-dibromo-4-hydroxyphenyl) cyclododecane, which has a halogen group and a cycloalkylidene group. A heat-resistant polycarbonate produced by reacting a dihydric phenol with a carbonate precursor is disclosed. However, in the polycarbonate disclosed in Patent Document 2, it is essential that at least one halogen atom is present on the aromatic ring of the dihydric phenol, and such a halogen atom is released during the melt molding of the polycarbonate. It easily causes corrosion of the barrel and screw of the molding machine and corrosion of the mold. As a result, a molded product made from the resin may be discolored such as yellowing. In addition, when the molded product is used in a high-temperature environment, there is a disadvantage that halogen atoms are detached and the discoloration of the molded product is promoted.
特許文献3には、1,1−ビス−(4−ヒドロキシフェニル)−3,3,5−トリメチルシクロヘキサンのような特定の二官能カーボネート構造単位を含むポリカーボネート類と、特定のシリコン化合物からなる熱劣化に対して耐久性を示すように安定化され、そして改良された衝撃強度を示す高耐熱性成型組成物が開示されているが、高温熱風処理により黄変し易く、高温環境での使用に限界がある。 Patent Document 3 discloses a heat comprising a polycarbonate containing a specific bifunctional carbonate structural unit such as 1,1-bis- (4-hydroxyphenyl) -3,3,5-trimethylcyclohexane and a specific silicon compound. A highly heat-resistant molding composition that has been stabilized to exhibit durability against deterioration and exhibits improved impact strength has been disclosed, but is easily yellowed by high-temperature hot-air treatment, and can be used in high-temperature environments. There is a limit.
一方、芳香族ポリカーボネート樹脂組成物からなる成形品は、表面硬度が比較的低いので、耐擦傷性が要求される成形品、例えば、携帯電話ボタン、コンピューターのキーパッド等の部品では、表面に塗装などによってハードコート処理を施したり、又は表面硬度の高い樹脂と積層体として加工処理するなどの二次加工処理がしばしば施されることがある。コスト及び製品歩留まりの観点から、二次加工処理を必要としない、十分に高い表面硬度を有する成形品を製造可能なポリカーボネート樹脂組成物の提供が望まれている。 On the other hand, molded products made of an aromatic polycarbonate resin composition have a relatively low surface hardness, so that the surface of a molded product that requires scratch resistance, such as a cellular phone button or a computer keypad, is coated on the surface. A secondary processing treatment such as a hard coat treatment or a treatment with a resin having a high surface hardness and a laminate is often performed. From the viewpoint of cost and product yield, it is desired to provide a polycarbonate resin composition capable of producing a molded product having a sufficiently high surface hardness that does not require secondary processing.
このような要求に対し特許文献4には、特殊な繰返し構造と末端基を有するポリカーボネートが提案され、実施例では、該ポリカーボネートからなる成形フィルムが、所定の磨耗試験において磨耗量が少なかったことが示されている。しかし、樹脂材料には、成形品の表面硬度のみならず、上記した通り、溶融熱安定性や成形品の色相が変色しない等の種々の性質をバランスよく示すことが望まれている。特許文献4には、酸化防止剤や着色安定剤等の添加剤を混合することができることが記載されているが、具体例については記載がなく、勿論、成形品の色相の軽減、透明成形品の湿熱による不透明化の軽減等に寄与する添加剤の具体例について、なんら記載はない。 In response to such a requirement, Patent Document 4 proposes a polycarbonate having a special repeating structure and a terminal group, and in the examples, the molded film made of the polycarbonate had a small amount of wear in a predetermined wear test. It is shown. However, it is desired that the resin material exhibits not only the surface hardness of the molded product but also various properties such as melting heat stability and the hue of the molded product not changing color as described above. Patent Document 4 describes that additives such as an antioxidant and a color stabilizer can be mixed, but there is no description of specific examples, and of course, the hue of the molded product is reduced, and the transparent molded product. There is no description at all about specific examples of additives that contribute to the reduction of opacification due to wet heat.
また、特許文献5には、特に表面硬度が高いフィルムの材料として、4,4’−ジヒドロキシジフェニル系カーボネート構造型の特定の繰返し単位とビスフェノール系カーボネート構造型の特定の繰返し単位からなるポリカーボネートが提案されているが、特許文献4と同様、具体的な酸化防止剤や着色安定剤の記載はなく、成形品の色相の軽減、透明成形品の湿熱による不透明化の軽減等に寄与する添加剤の具体例について、なんら記載はない。 Patent Document 5 proposes a polycarbonate comprising a specific repeating unit of 4,4′-dihydroxydiphenyl carbonate structure type and a specific repeating unit of bisphenol carbonate structure type as a material for a film having a particularly high surface hardness. However, as in Patent Document 4, there is no description of specific antioxidants or coloring stabilizers, and additives that contribute to reducing the hue of the molded product, reducing the opacification of the transparent molded product due to wet heat, and the like. There is no description about specific examples.
一方、樹脂組成物からなる成形品中に添加される安定剤の中には、耐熱性の改善に寄与する一方で、湿熱によって加水分解し、成形品の不透明化の一因となるものがあり、耐熱性の改善と湿熱による不透明化の抑制との両立は困難な場合がある。
本発明は、上記従来技術の問題点を解決し、ガラス転移温度が高く耐熱性に優れ、溶融熱安定性にも優れ加熱溶融時の着色が少なく、さらに成形後は、当該成形品の湿熱による不透明化が生じ難い、芳香族性ポリカーボネート樹脂組成物を提供することを課題とする。
また、本発明の他の課題は、耐熱性に優れ、成形時の熱劣化による着色が少なく、及び湿熱による不透明化が生じ難く、表面硬度及び低吸水性に優れ、並びに引張り強さ、曲げ強さ、曲げ弾性率等の機械的性質も良好な、芳香族性ポリカーボネート樹脂組成物からなる成形品を提供することである。
On the other hand, some stabilizers added to a molded product made of a resin composition may contribute to improvement of heat resistance, but may hydrolyze by wet heat and contribute to opacification of the molded product. In some cases, it is difficult to achieve both improvement in heat resistance and suppression of opacification due to wet heat.
The present invention solves the above-mentioned problems of the prior art, has a high glass transition temperature, excellent heat resistance, excellent melting heat stability, little coloration during heating and melting, and after molding, due to the wet heat of the molded product It is an object of the present invention to provide an aromatic polycarbonate resin composition that hardly causes opacification.
Another object of the present invention is that it has excellent heat resistance, little coloration due to thermal deterioration during molding, and hardly causes opacification due to wet heat, is excellent in surface hardness and low water absorption, and has tensile strength and bending strength. Another object is to provide a molded article made of an aromatic polycarbonate resin composition having good mechanical properties such as flexural modulus.
本発明者らは、上記目的を達成するため鋭意研究を重ねた結果、シクロドデカン基を有し且つハロゲン原子を有しない少なくとも1種の2価フェノールと、カーボネート前駆物質とを少なくとも反応させることによって得られる芳香族ポリカーボネート樹脂とともに、特定のリン系安定剤及び特定のフェノール系安定剤を用いることにより、上記目的を達成し得るとの知見を得、本発明を完成するに至った。
即ち、本発明は上記目的を達成するため、下記式(1)で表される単位を少なくとも含む芳香族ポリカーボネート樹脂;該芳香族ポリカーボネート樹脂100重量部に対して、下記式(3)で表されるリン系安定剤0.001〜1重量部;及び該芳香族ポリカーボネート樹脂100重量部に対して、下記式(4)で表されるフェノール系安定剤0.001〜1重量部を含有する芳香族ポリカーボネート樹脂組成物を提供する。
As a result of intensive studies to achieve the above object, the present inventors have made at least a reaction between at least one dihydric phenol having a cyclododecane group and no halogen atom, and a carbonate precursor. By using a specific phosphorus-based stabilizer and a specific phenol-based stabilizer together with the obtained aromatic polycarbonate resin, the inventors have obtained knowledge that the above object can be achieved, and have completed the present invention.
That is, in order to achieve the above object, the present invention represents an aromatic polycarbonate resin containing at least a unit represented by the following formula (1); represented by the following formula (3) with respect to 100 parts by weight of the aromatic polycarbonate resin. A phosphor containing 0.001 to 1 part by weight of a phosphorus stabilizer; and 0.001 to 1 part by weight of a phenol stabilizer represented by the following formula (4) with respect to 100 parts by weight of the aromatic polycarbonate resin. A polycarbonate resin composition is provided.
本発明の芳香族ポリカーボネート樹脂組成物は、ガラス転移温度が高く耐熱性に優れ、溶融熱安定性にも優れ加熱溶融時の変色が少ない。当該芳香族ポリカーボネート樹脂組成物からなる成形品は、耐熱性に優れ、成形時の熱劣化により着色が少なく、及び湿熱による不透明化が生じ難く、さらに、表面硬度及び低吸水性にも優れ、並びに引張り強さ、曲げ強さ、曲げ弾性率等の機械的性質も良好であり、種々の用途に有用である。 The aromatic polycarbonate resin composition of the present invention has a high glass transition temperature, excellent heat resistance, excellent melting heat stability, and little discoloration during heating and melting. The molded article made of the aromatic polycarbonate resin composition is excellent in heat resistance, less colored due to thermal deterioration during molding, and less susceptible to opacification due to wet heat, and also excellent in surface hardness and low water absorption, and Mechanical properties such as tensile strength, bending strength, and flexural modulus are also good, and it is useful for various applications.
以下、本発明を詳細に説明する。本発明は、所定の芳香族ポリカーボネート樹脂、所定のリン系安定剤、及び所定のフェノール系安定剤を少なくとも含有する芳香族ポリカーボネート樹脂組成物に関する。以下、それぞれの成分について詳細に説明する。
1. 芳香族ポリカーボネート樹脂
本発明に用いる芳香族ポリカーボネート樹脂は、下記式(1)で表される単位を少なくとも含む。
Hereinafter, the present invention will be described in detail. The present invention relates to an aromatic polycarbonate resin composition containing at least a predetermined aromatic polycarbonate resin, a predetermined phosphorus stabilizer, and a predetermined phenol stabilizer. Hereinafter, each component will be described in detail.
1. Aromatic polycarbonate resin The aromatic polycarbonate resin used in the present invention contains at least a unit represented by the following formula (1).
式中、R1〜R26はそれぞれ独立して、水素原子、炭素原子数1〜9のアルキル基、炭素原子数6〜12のアリール基、炭素原子数1〜5のアルコキシ基、炭素原子数2〜5のアルケニル基又は炭素原子数7〜17のアラルキル基を表し、これらの基は置換基を有していてもよいが、ハロゲン原子で置換されることはない。
なお、本明細書において、「アルキル基」及び「アルケニル基」は、直鎖状、分岐鎖状、及び環状のいずれをも含む意味で用いられる。また「アルコキシ基」及び「アラルキル基」のアルキル基部分についても同様である。
前記アルキル基、アリール基、アルコキシ基、及びアラルキル基はそれぞれ、1以上の置換基を有していてもよく、当該置換基の好ましい例には、炭素原子数1〜5のアルキル基、及び炭素原子数1〜5のアルコキシ基が含まれる。ただし、ハロゲン原子で置換されることはない。
In the formula, R 1 to R 26 are each independently a hydrogen atom, an alkyl group having 1 to 9 carbon atoms, an aryl group having 6 to 12 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, or the number of carbon atoms. It represents a 2 to 5 alkenyl group or an aralkyl group having 7 to 17 carbon atoms, and these groups may have a substituent, but are not substituted with a halogen atom.
In the present specification, “alkyl group” and “alkenyl group” are used to mean any of linear, branched, and cyclic. The same applies to the alkyl group part of the “alkoxy group” and “aralkyl group”.
The alkyl group, aryl group, alkoxy group, and aralkyl group may each have one or more substituents. Preferred examples of the substituent include alkyl groups having 1 to 5 carbon atoms, and carbon. An alkoxy group having 1 to 5 atoms is included. However, it is not substituted with a halogen atom.
前記式(1)中、2つのフェニレン基の置換基の数は、0〜2であるのが好ましく、即ち、R1〜R4のうち、2以上が水素原子であるのが好ましい。また、前記式(1)中のシクロドデカニル基の置換基の数は、0〜2であるのが好ましい。 In the formula (1), the number of substituents of the two phenylene groups is preferably 0 to 2, that is, two or more of R 1 to R 4 are preferably hydrogen atoms. Moreover, it is preferable that the number of substituents of the cyclododecanyl group in the said Formula (1) is 0-2.
上記式(1)の構造単位は、当該構造単位を誘導するビスフェノール類と、炭酸エステル形成化合物との反応によって生じるものである。前記式(1)の構造単位を誘導するビスフェノール類の例には、下記構造式(5)で表される化合物が含まれる。 The structural unit of the above formula (1) is produced by a reaction between a bisphenol that induces the structural unit and a carbonate-forming compound. Examples of the bisphenols for deriving the structural unit of the formula (1) include compounds represented by the following structural formula (5).
式中、R1〜R26は、式(1)中のそれぞれと同義であり、好ましい範囲も同様である。 Wherein, R 1 to R 26 are the same as each in the formula (1), and preferred ranges are also the same.
前記式(5)で表される化合物の具体例としては、1,1−ビス(4−ヒドロキシフェニル)シクロドデカン、1,1−ビス(4−ヒドロキシ−3−メチルフェニル)シクロドデカン、1,1−ビス(4−ヒドロキシ−3−フェニルフェニル)シクロドデカン、1,1−ビス(4−ヒドロキシ−3−tert−ブチルフェニル)シクロドデカン、1,1−ビス(4−ヒドロキシ−3−sec−ブチルフェニル)シクロドデカン、1,1−ビス(4−ヒドロキシ−3−アリルフェニル)シクロドデカン、1,1−ビス(4−ヒドロキシ−3,5−ジメチルフェニル)シクロドデカン、7−エチル−1,1−ビス(4−ヒドロキシフェニル)シクロドデカン、5,6−ジメチル−1,1−ビス(4−ヒドロキシフェニル)シクロドデカン、1,1−ビス(2−ヒドロキシフェニル)シクロドデカンなどが挙げられる。これらは、2種類以上併用することも可能である。この中で、特に、1,1−ビス(4−ヒドロキシフェニル)シクロドデカン、1,1−ビス(4−ヒドロキシ−3−メチルフェニル)シクロドデカンが好ましい。 Specific examples of the compound represented by the formula (5) include 1,1-bis (4-hydroxyphenyl) cyclododecane, 1,1-bis (4-hydroxy-3-methylphenyl) cyclododecane, 1, 1-bis (4-hydroxy-3-phenylphenyl) cyclododecane, 1,1-bis (4-hydroxy-3-tert-butylphenyl) cyclododecane, 1,1-bis (4-hydroxy-3-sec- Butylphenyl) cyclododecane, 1,1-bis (4-hydroxy-3-allylphenyl) cyclododecane, 1,1-bis (4-hydroxy-3,5-dimethylphenyl) cyclododecane, 7-ethyl-1, 1-bis (4-hydroxyphenyl) cyclododecane, 5,6-dimethyl-1,1-bis (4-hydroxyphenyl) cyclododecane, 1,1 Bis (2-hydroxyphenyl) cyclododecane and the like. These can be used in combination of two or more. Among these, 1,1-bis (4-hydroxyphenyl) cyclododecane and 1,1-bis (4-hydroxy-3-methylphenyl) cyclododecane are particularly preferable.
また、本発明に用いる前記芳香族ポリカーボネート樹脂は、他の構造単位を含んでいてもよい。他の構造単位としては、下記式(2)で表される構造単位が好ましい。 Moreover, the aromatic polycarbonate resin used in the present invention may contain other structural units. The other structural unit is preferably a structural unit represented by the following formula (2).
式中、R1a〜R4aはそれぞれ独立して、水素原子、炭素原子数1〜6のアルキル基、炭素原子数2〜5のアルケニル基、又はフェニル基を表す。これらの基は置換基を有していてもよいが、ハロゲン原子以外の置換基であるのが好ましい。置換基の好ましい例は、上記式(1)中のR1〜R26のそれぞれが有する置換基の好ましい例と同様である。 In the formula, R 1a to R 4a each independently represent a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 2 to 5 carbon atoms, or a phenyl group. These groups may have a substituent, but are preferably a substituent other than a halogen atom. The preferable example of a substituent is the same as the preferable example of the substituent which each of R < 1 > -R < 26 > in the said Formula (1) has.
前記式(2)中、Xは、単結合、又は、 In the formula (2), X is a single bond, or
上記式(2)の構造単位は、当該構造単位を誘導するビスフェノール類と、炭酸エステル形成化合物との反応によって生じるものである。前記式(2)の構造単位を誘導するビスフェノール類の例には、下記構造式(6)で表される化合物が含まれる。 The structural unit of the above formula (2) is produced by a reaction between a bisphenol that induces the structural unit and a carbonate-forming compound. Examples of the bisphenols that derive the structural unit of the formula (2) include compounds represented by the following structural formula (6).
式中、R1a〜R4a、及びXについては、上記式(2)中のそれぞれと同義であり、好ましい範囲も同様である。 In formula, about R < 1a > -R < 4a > and X, it is synonymous with each in the said Formula (2), and its preferable range is also the same.
原料モノマーとして、前記式(5)のビスフェノール類とともに使用可能なビスフェノール類の例には、前記式(6)で表される化合物の他、種々のビスフェノール類が含まれる。具体的には、4,4’−ビフェニルジオール、ビス(4−ヒドロキシフェニル)メタン、ビス(4−ヒドロキシフェニル)エーテル、ビス(4−ヒドロキシフェニル)スルホン、ビス(4−ヒドロキシ−3−メチルフェニル)スルホン、ビス(4−ヒドロキシフェニル)スルホキシド、ビス(4−ヒドロキシフェニル)スルファイド、ビス(4−ヒドロキシフェニル)ケトン、1,1-ビス(4−ヒドロキシフェニル)エタン、2,2-ビス(4−ヒドロキシフェニル)プロパン、2,2−ビス(4−ヒドロキシ−3−t−ブチルフェニル)プロパン、2,2−ビス(4−ヒドロキシフェニル)ブタン、1,1−ビス(4−ヒドロキシフェニル)シクロヘキサン、2,2−ビス(4−ヒドロキシ−3−メチルフェニル)プロパン、2,2−ビス(4−ヒドロキシ−3,5−ジメチルフェニル)プロパン、1,1−ビス(4−ヒドロキシフェニル)−1−フェニルエタン、ビス(4−ヒドロキシフェニル)ジフェニルメタン、2,2−ビス(4−ヒドロキシ−3−アリルフェニル)プロパン、3,3,5−トリメチル−1,1−ビス(4−ヒドロキシフェニル)シクロヘキサン、1,1−ビス(4−ヒドロキシ−2−メチル−5−tert−ブチルフェニル)−2−メチルプロパン、9,9−ビス(4−ヒドロキシ−3−エチルフェニル)フルオレン、9,9−ビス(4−ヒドロキシ−3−メチルフェニル)フルオレン、9,9−ビス(4−ヒドロキシフェニル)フルオレン、α,ω−ビス[3−(o−ヒドロキシフェニル)プロピル]ポリジメチルジフェニルランダム共重合シロキサン、α,ω−ビス[3−(o−ヒドロキシフェニル)プロピル]ポリジメチルシロキサン、4,4’−[1,4−フェニレンビス(1−メチルエチリデン)]ビスフェノール、4,4’−[1,3−フェニレンビス(1−メチルエチリデン)]ビスフェノールなどが例示される。これらは、2種類以上併用することも可能である。また、これらの中でも特に2,2−ビス(4−ヒドロキシフェニル)プロパン、2,2−ビス(4−ヒドロキシ−3−メチルフェニル)プロパン、1,1−ビス(4−ヒドロキシフェニル)シクロヘキサンから選ばれることが好ましい。 Examples of bisphenols that can be used as the raw material monomer together with the bisphenols of the formula (5) include various bisphenols in addition to the compound represented by the formula (6). Specifically, 4,4′-biphenyldiol, bis (4-hydroxyphenyl) methane, bis (4-hydroxyphenyl) ether, bis (4-hydroxyphenyl) sulfone, bis (4-hydroxy-3-methylphenyl) ) Sulfone, bis (4-hydroxyphenyl) sulfoxide, bis (4-hydroxyphenyl) sulfide, bis (4-hydroxyphenyl) ketone, 1,1-bis (4-hydroxyphenyl) ethane, 2,2-bis (4 -Hydroxyphenyl) propane, 2,2-bis (4-hydroxy-3-tert-butylphenyl) propane, 2,2-bis (4-hydroxyphenyl) butane, 1,1-bis (4-hydroxyphenyl) cyclohexane 2,2-bis (4-hydroxy-3-methylphenyl) propane, 2,2-bis 4-hydroxy-3,5-dimethylphenyl) propane, 1,1-bis (4-hydroxyphenyl) -1-phenylethane, bis (4-hydroxyphenyl) diphenylmethane, 2,2-bis (4-hydroxy-3) -Allylphenyl) propane, 3,3,5-trimethyl-1,1-bis (4-hydroxyphenyl) cyclohexane, 1,1-bis (4-hydroxy-2-methyl-5-tert-butylphenyl) -2 -Methylpropane, 9,9-bis (4-hydroxy-3-ethylphenyl) fluorene, 9,9-bis (4-hydroxy-3-methylphenyl) fluorene, 9,9-bis (4-hydroxyphenyl) fluorene , Α, ω-bis [3- (o-hydroxyphenyl) propyl] polydimethyldiphenyl random copolymer siloxane α, ω-bis [3- (o-hydroxyphenyl) propyl] polydimethylsiloxane, 4,4 ′-[1,4-phenylenebis (1-methylethylidene)] bisphenol, 4,4 ′-[1,3 -Phenylenebis (1-methylethylidene)] bisphenol and the like are exemplified. These can be used in combination of two or more. Of these, 2,2-bis (4-hydroxyphenyl) propane, 2,2-bis (4-hydroxy-3-methylphenyl) propane, and 1,1-bis (4-hydroxyphenyl) cyclohexane are particularly selected. It is preferable that
前記芳香族ポリカーボネート樹脂は、ビスフェノール類として、前記式(5)で表されるビスフェノールのみを用いて製造されるものであってもよい。一方、他のビスフェノール類(好ましくは前記式(6)で表されるビスフェノール類)から誘導される構成単位も含む態様では、前記式(5)で表されるビスフェノール類は、使用される全ビスフェノール類の内、5モル%〜95モル%であるのが好ましく、10モル%〜90モル%であるのが好ましく、20モル%〜80モル%であるのが好ましい。また、他のビスフェノール類(好ましくは前記式(6)で表されるビスフェノール類)は、使用される全ビスフェノール類の内、95モル%〜5%であるのが好ましく、90モル%〜10モル%であるのがより好ましく、80モル%〜20モル%であるのがさらに好ましい。 The aromatic polycarbonate resin may be produced using only the bisphenol represented by the formula (5) as the bisphenol. On the other hand, in an embodiment including a structural unit derived from other bisphenols (preferably bisphenols represented by the formula (6)), the bisphenols represented by the formula (5) are all bisphenols used. Of these, 5 mol% to 95 mol% is preferable, 10 mol% to 90 mol% is preferable, and 20 mol% to 80 mol% is preferable. Further, the other bisphenols (preferably bisphenols represented by the formula (6)) is preferably 95 mol% to 5% of all bisphenols used, and preferably 90 mol% to 10 mol. %, More preferably 80 mol% to 20 mol%.
前記芳香族ポリカーボネート樹脂は、前記式(5)で表されるビスフェノールと、所望により前記式(6)で表されるビスフェノールとを含むビスフェノール類と、少なくとも1種の炭酸エステル形成化合物との反応によって製造することができる。製造方法については特に制限はなく、ビスフェノールAから誘導されるポリカーボネートを製造する際に利用される種々の方法、例えば、ビスフェノール類とホスゲンとの直接反応(ホスゲン法)、及びビスフェノール類とビスアリールカーボネートとのエステル交換反応(エステル交換法)などの方法、を採用することができる。 The aromatic polycarbonate resin is obtained by a reaction between a bisphenol represented by the formula (5) and, if desired, a bisphenol represented by the formula (6) and at least one carbonate-forming compound. Can be manufactured. The production method is not particularly limited, and various methods used in producing a polycarbonate derived from bisphenol A, such as a direct reaction between bisphenols and phosgene (phosgene method), and bisphenols and bisaryl carbonates. A method such as a transesterification reaction (transesterification method) can be employed.
使用可能な炭酸エステル形成化合物としては、例えば、ホスゲン;ジフェニルカーボネート、ジ−p−トリルカーボネート、フェニル−p−トリルカーボネート、ジ−p−クロロフェニルカーボネート、ジナフチルカーボネートなどのビスアリールカーボネート;が挙げられる。これらの化合物は2種類以上併用することも可能である。 Examples of carbonic acid ester forming compounds that can be used include phosgene; bisaryl carbonates such as diphenyl carbonate, di-p-tolyl carbonate, phenyl-p-tolyl carbonate, di-p-chlorophenyl carbonate, and dinaphthyl carbonate; . Two or more of these compounds can be used in combination.
ホスゲン法においては、通常、酸結合剤及び溶媒の存在下において、式(5)のビスフェノールやその他のビスフェノール類と、ホスゲンとを反応させる。酸結合剤としては、例えば、ピリジン;水酸化ナトリウム、水酸化カリウムなどのアルカリ金属の水酸化物;などが用いられる。また溶媒としては、例えば、塩化メチレン、クロロホルムなどが用いられる。さらに、縮重合反応を促進するために、トリエチルアミンのような第三級アミン又は第四級アンモニウム塩などの触媒を使用することができる。また重合度調節(分子量調節)のために、フェノール、p−tert−ブチルフェノール、p−クミルフェノール、長鎖アルキル置換フェノール等の一官能基化合物を、用いることが好ましい。また、所望により、亜硫酸ナトリウム、ハイドロサルファイトなどの酸化防止剤や、フロログルシン、イサチンビスフェノールなど分岐化剤を少量添加してもよい。反応は、通常、温度0〜150℃で進行し、5〜40℃で進行させるのが好ましい。反応時間は、反応温度によって左右されるが、通常、0.5分〜10時間、好ましくは1分〜2時間である。また、反応中は、反応系のpHを10以上に保持することが望ましい。 In the phosgene method, phosgene is usually reacted with the bisphenol of formula (5) and other bisphenols in the presence of an acid binder and a solvent. Examples of the acid binder include pyridine; alkali metal hydroxides such as sodium hydroxide and potassium hydroxide; and the like. Examples of the solvent include methylene chloride and chloroform. Furthermore, a catalyst such as a tertiary amine such as triethylamine or a quaternary ammonium salt can be used to accelerate the condensation polymerization reaction. Moreover, it is preferable to use monofunctional compounds, such as a phenol, p-tert-butylphenol, p-cumylphenol, and a long-chain alkyl substituted phenol, for polymerization degree adjustment (molecular weight adjustment). If desired, a small amount of an antioxidant such as sodium sulfite or hydrosulfite, or a branching agent such as phloroglucin or isatin bisphenol may be added. The reaction usually proceeds at a temperature of 0 to 150 ° C, preferably 5 to 40 ° C. While the reaction time depends on the reaction temperature, it is generally 0.5 min-10 hr, preferably 1 min-2 hr. Further, during the reaction, it is desirable to maintain the pH of the reaction system at 10 or more.
一方、エステル交換法においては、前記式(5)のビスフェノールやその他のビスフェノール類と、ビスアリールカーボネートとを混合し、減圧下で高温において反応させる。反応は、通常、150〜350℃で進行し、200〜300℃で進行させるのが好ましい。また、減圧度は最終で、好ましくは1mmHg以下にして、エステル交換反応により生成した該ビスアリールカーボネートから由来するフェノール類を系外へ留去させる。反応時間は反応温度や減圧度などによって左右されるが、通常1〜4時間程度である。反応は窒素やアルゴンなどの不活性ガス雰囲気下で行うことが好ましく、また、所望に応じ、分子量調節剤、酸化防止剤や分岐化剤を添加して反応を行ってもよい。 On the other hand, in the transesterification method, bisphenol of the formula (5) or other bisphenols and bisaryl carbonate are mixed and reacted at high temperature under reduced pressure. The reaction usually proceeds at 150 to 350 ° C and preferably proceeds at 200 to 300 ° C. Further, the degree of vacuum is finally reduced to 1 mmHg or less, and phenols derived from the bisaryl carbonate produced by the transesterification reaction are distilled out of the system. The reaction time depends on the reaction temperature, the degree of vacuum, etc., but is usually about 1 to 4 hours. The reaction is preferably carried out in an inert gas atmosphere such as nitrogen or argon, and the reaction may be carried out by adding a molecular weight regulator, an antioxidant or a branching agent as desired.
本発明に使用する芳香族ポリカーボネート樹脂は、機械的強度や成形性の点から、望ましい極限粘度として0.3〜2.0dl/gの範囲であることが好ましく、さらには0.35〜1.5dl/gの範囲であることが好ましい。極限粘度が0.3dl/g未満では機械的強度が低く、極限粘度が2.0dl/gを越えると流動性が低下し、成形性が悪化する。 The aromatic polycarbonate resin used in the present invention preferably has a desirable intrinsic viscosity in the range of 0.3 to 2.0 dl / g from the viewpoint of mechanical strength and moldability, and more preferably 0.35 to 1. The range is preferably 5 dl / g. When the intrinsic viscosity is less than 0.3 dl / g, the mechanical strength is low, and when the intrinsic viscosity exceeds 2.0 dl / g, the fluidity is lowered and the moldability is deteriorated.
2. 安定剤
本発明の芳香族ポリカーボネート樹脂組成物は、下記式(3)で表されるリン系安定剤の少なくとも1種、及び下記式(4)で表されるフェノール系安定剤の少なくとも1種を含有する。これらの安定剤は、耐熱性の向上、特に溶融安定性の改善、熱溶融時の変色の軽減に寄与する。また、安定剤の中には、耐熱性の改善に寄与するものの、耐加水分解性に劣り、湿熱によって加水分解し、成形品を不透明化させる一因になるものがある。本発明では、吸水率が低い前記芳香族ポリカーボネート樹脂とともに、上記特定のリン系安定剤及びフェノール系安定剤を用いているため、これらの安定剤の加水分解性が抑制され、成形品の湿熱による不透明化を抑制できる。その結果、従来困難であった、耐熱性の改善と、湿熱による不透明化の抑制を両立することができる。
2. Stabilizer The aromatic polycarbonate resin composition of the present invention comprises at least one phosphorus stabilizer represented by the following formula (3) and at least one phenol stabilizer represented by the following formula (4). contains. These stabilizers contribute to improvement in heat resistance, particularly improvement in melting stability, and reduction in discoloration during heat melting. Some stabilizers contribute to the improvement of heat resistance, but are poor in hydrolysis resistance and hydrolyze by moist heat to cause the molded product to become opaque. In the present invention, since the specific phosphorus stabilizer and phenol stabilizer are used together with the aromatic polycarbonate resin having a low water absorption rate, the hydrolyzability of these stabilizers is suppressed, and the wet heat of the molded product is reduced. Opacification can be suppressed. As a result, it is possible to achieve both improvement in heat resistance, which has been difficult in the past, and suppression of opacification due to wet heat.
2.−1 リン系安定剤
式中、R1b〜R4bはそれぞれ独立して、水素原子、水酸基、炭素原子数1〜18のアルキル基、又は炭素原子数1〜18のオキシアルキル基を表す。R1b〜R4bはそれぞれ同一であっても異なっていてもよい。
2つのフェニル基の置換基の数は、それぞれ0〜4のいずれであってもよいが、2又は3であるのが好ましい。
In the formula, R 1b to R 4b each independently represent a hydrogen atom, a hydroxyl group, an alkyl group having 1 to 18 carbon atoms, or an oxyalkyl group having 1 to 18 carbon atoms. R 1b to R 4b may be the same or different.
The number of substituents of the two phenyl groups may be any of 0 to 4, but is preferably 2 or 3.
上記式(3)で表されるリン系安定剤としては、例えば、ビス(2,4−ジ−tert−ブチルフェニル)ペンタエリスリトールジホスファイトが「アデカスタブPEP−24G」の商品名で、ビス(2,6−ジ−tert−ブチル−4−メチルフェニル)ペンタエリスリトールジホスファイトが「アデカスタブPEP−36」の商品名で、旭電化工業(株)より市販されている。 As a phosphorus stabilizer represented by the above formula (3), for example, bis (2,4-di-tert-butylphenyl) pentaerythritol diphosphite is a product name of “ADK STAB PEP-24G” and bis ( 2,6-di-tert-butyl-4-methylphenyl) pentaerythritol diphosphite is commercially available from Asahi Denka Kogyo Co., Ltd. under the trade name “ADK STAB PEP-36”.
2.−2 フェノール系安定剤
前記式中、Yはn価の基であり、nは1〜3の整数である。Yは、分子内にヒドロキシ基を1〜3個有するヒドロキシ化合物の残基である。
上記式(4)で表されるフェノール系安定剤としては、例えば、トリエチレングリコール−ビス[3−(3−tert−ブチル−4−ヒドロキシ−5−メチルフェニル)プロピオネート]が「アデカスタブAO−70」の商品名で、3,9−ビス{2−[3−(3−tert−ブチル−4−ヒドロキシ−5−メチルフェニル)プロピオニルオキシ]−1,1−ジメチルエチル}−2,4,8,10−テトラオキサスピロ[5,5]ウンデカンが「アデカスタブAO−80」の商品名で、旭電化工業(株)より市販されている。
In the above formula, Y is an n-valent group, and n is an integer of 1 to 3. Y is the residue of a hydroxy compound having 1-3 hydroxyl groups in the molecular.
As the phenol-based stabilizer represented by the above formula (4), for example, triethylene glycol-bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionate] is “Adeka Stab AO-70”. , 3,9-bis {2- [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionyloxy] -1,1-dimethylethyl} -2,4,8 , 10-tetraoxaspiro [5,5] undecane is commercially available from Asahi Denka Kogyo Co., Ltd. under the trade name “ADK STAB AO-80”.
上記熱安定剤の配合量は、芳香族ポリカーボネート樹脂100重量部に対して、上記式(3)で表されるリン系安定剤が0.001〜1重量部、及び上記式(4)で表されるフェノール系安定剤が0.001〜1重量部であり、好ましくはそれぞれ0.01〜0.5重量部であり、さらに好ましくはそれぞれ0.03〜0.3重量部である。リン系安定剤及びフェノール系安定剤がそれぞれ0.001重量部未満では熱安定性の改良効果が不十分であり、1重量部を越えるとモールドデボジットが発生することがある。 The blending amount of the heat stabilizer is 0.001 to 1 part by weight of the phosphorus stabilizer represented by the above formula (3) and 100 parts by weight of the aromatic polycarbonate resin and the above formula (4). The phenol-based stabilizer to be added is 0.001 to 1 part by weight, preferably 0.01 to 0.5 part by weight, and more preferably 0.03 to 0.3 part by weight. If the phosphorus stabilizer and the phenol stabilizer are each less than 0.001 part by weight, the effect of improving the thermal stability is insufficient, and if it exceeds 1 part by weight, a mold deposit may occur.
4. その他の添加剤
本発明の耐熱性芳香族ポリカーボネート樹脂組成物には、本発明の趣旨を逸脱しない範囲で、所望の特性を付与する紫外線吸収剤、蛍光増白剤、光安定剤、離型剤、滑剤、難燃剤、難燃助剤、耐衝撃性改良剤、帯電防止剤、可塑剤、相溶化剤、着色剤(カーボンブラック、酸化チタンなどの顔料、ブルーイング剤等の染料)、ガラス繊維、ガラスビーズ、ガラスフレーク、炭素繊維、繊維状マグネシウム、チタン酸カリウムウィスカー、セラミックウィスカー、マイカ、タルク、クレー、珪酸カルシウム等の補強剤、充填剤、他のポリマーなどの種々の添加剤の一種又は二種以上を添加してもよい。
4). Other Additives The heat-resistant aromatic polycarbonate resin composition of the present invention has an ultraviolet absorber, a fluorescent whitening agent, a light stabilizer, and a release agent that impart desired characteristics without departing from the spirit of the present invention. , Lubricants, flame retardants, flame retardant aids, impact modifiers, antistatic agents, plasticizers, compatibilizers, colorants (pigments such as carbon black and titanium oxide, dyes such as bluing agents), glass fibers Glass beads, glass flakes, carbon fibers, fibrous magnesium, potassium titanate whiskers, ceramic whiskers, mica, talc, clay, calcium silicate and other reinforcing agents, fillers, one of various additives such as other polymers or Two or more kinds may be added.
5. 芳香族ポリカーボネート樹脂組成物の調製方法
本発明の芳香族ポリカーボネート樹脂組成物の調製方法については特に制限はない。最終成形品を溶融成形する直前までの任意の段階で、前記芳香族ポリカーボネート樹脂に、前記式(3)のリン系安定剤、前記式(4)のフェノール系熱安定剤、及び必要に応じて、離型剤、難燃剤などの添加剤を添加し、混練することにより調製することができる。添加は、例えば、タンブラー、ヘンシェルミキサー、スーパーミキサー等を使用する方法、フィーダーにより定量的に押出機ホッパーに供給して混合する方法などにより行うことができる。混練は、一軸押出機、二軸押出機などを使用して行うことができる。混練の温度条件は、一般的には260〜340℃程度であり、好ましくは270〜320℃程度である。
5. Preparation method of aromatic polycarbonate resin composition There is no restriction | limiting in particular about the preparation method of the aromatic polycarbonate resin composition of this invention. At any stage until immediately before the final molded product is melt-molded, the aromatic polycarbonate resin is added to the phosphorus-based stabilizer of the formula (3), the phenol-based heat stabilizer of the formula (4), and as necessary. It can be prepared by adding additives such as a release agent and a flame retardant and kneading. The addition can be performed by, for example, a method using a tumbler, a Henschel mixer, a super mixer, or the like, a method of quantitatively feeding to an extruder hopper using a feeder, and mixing. The kneading can be performed using a single screw extruder, a twin screw extruder or the like. The temperature condition for kneading is generally about 260 to 340 ° C, preferably about 270 to 320 ° C.
6. 成形品
本発明は、本発明の芳香族ポリカーボネート樹脂組成物からなる成形品にも関する。本発明の成形品は、種々の成形方法により製造することができる。具体的には、射出成形、射出圧縮成形、押出成形、中空成形、回転成形、圧縮成形などの成形方法を利用することができる。生産性の観点では、前記芳香族ポリカーボネート樹脂組成物からなるペレットを一旦作製し、該ペレットから上記成形方法を利用して、成形品を製造するのが好ましい。さらに、押出成形によって一旦シート状の成形体を得た後、真空成形、圧空成形等により目的の成形品を製造することもできる。
6). Molded Article The present invention also relates to a molded article comprising the aromatic polycarbonate resin composition of the present invention. The molded article of the present invention can be produced by various molding methods. Specifically, molding methods such as injection molding, injection compression molding, extrusion molding, hollow molding, rotational molding, and compression molding can be used. From the viewpoint of productivity, it is preferable that a pellet made of the aromatic polycarbonate resin composition is once produced and a molded product is produced from the pellet using the molding method. Furthermore, once a sheet-like molded body is obtained by extrusion molding, a target molded product can be manufactured by vacuum molding, pressure molding, or the like.
本発明の成形品は、耐熱性に優れ、熱溶融時の熱劣化に起因する変色が生じ難く、及び成形後には湿熱による不透明化が生じ難い。また、表面硬度及び低吸水性に優れ、しかも種々の機械的性質も良好であることから、様々な用途に供することができる。以下、いくつかの例を挙げるが、これらに限定されるものではない。
6.−1 光学用成形品
本発明の成形品は、耐熱性に優れ、成形時の熱溶融に起因する変色がなく、高い透明性を有し、しかも、成形後には、湿熱による不透明化が生じ難い。表面硬度及び低吸水性にも優れ、種々の機械的性質も良好であることから、光学用成形品として有用である。例えば、画像表示装置や太陽電池等の部材として用いることができ、より具体的には、光学フィルム、フラットパネルディスプレイ用基板、太陽電池用基板、有機EL表示用基板、電子ペーパー用基板として、好適に使用される。
The molded product of the present invention is excellent in heat resistance, hardly undergoes discoloration due to thermal deterioration during heat melting, and is less likely to become opaque due to wet heat after molding. Moreover, since it is excellent in surface hardness and low water absorption, and also has various mechanical properties, it can be used in various applications. Some examples will be given below, but the present invention is not limited to these examples.
6). -1 Optical molded product The molded product of the present invention is excellent in heat resistance, has no discoloration caused by heat melting during molding, has high transparency, and is less likely to become opaque due to wet heat after molding. . Since it is excellent in surface hardness and low water absorption, and has various mechanical properties, it is useful as an optical molded article. For example, it can be used as a member such as an image display device or a solar cell, and more specifically, as an optical film, a flat panel display substrate, a solar cell substrate, an organic EL display substrate, or an electronic paper substrate. Used for.
6.−2 耐擦傷性成形品
本発明の成形品は、従来の芳香族ポリカーボネート樹脂組成物からなる成形品と比較して、表面硬度に優れる。従って、耐擦傷性が要求される用途、例えば、携帯電話のボタン、キーパッド等の部品等として用いる場合も、ハードコート処理や高硬度の樹脂層との積層等、二次加工処理が不要であり、コスト及び製品歩留まりの点で有利である。但し、勿論、本発明の芳香族ポリカーボネート樹脂組成物からなる成形品である限り、二次加工が施された成形品も本発明の範囲に含まれることはいうまでもない。
6). -2 Abrasion Resistant Molded Article The molded article of the present invention is excellent in surface hardness as compared with a molded article made of a conventional aromatic polycarbonate resin composition. Therefore, there is no need for secondary processing such as hard coating or lamination with a hard resin layer even when used for parts that require scratch resistance, such as parts for mobile phone buttons and keypads. This is advantageous in terms of cost and product yield. However, as a matter of course, as long as it is a molded article made of the aromatic polycarbonate resin composition of the present invention, it goes without saying that a molded article subjected to secondary processing is also included in the scope of the present invention.
6.−3 車両用ランプ成形品
本発明の成形品は耐熱性に優れているので、例えば、熱源に近い位置で用いられる部品として有用である。例えば、車両(例えば自動車)用のヘッドランプ、リアランプ、及びフォグランプ等のカバーケース、プロジェクターレンズ等のレンズ類、及びランプリフレクター等の車両用ランプ成形品として有用である。
6). -3 Vehicle Lamp Molded Product The molded product of the present invention is excellent in heat resistance, and is useful, for example, as a part used at a position close to a heat source. For example, it is useful as a vehicle lamp molded product such as a head lamp, a rear lamp, a cover lamp such as a fog lamp for a vehicle (for example, an automobile), a lens such as a projector lens, and a lamp reflector.
本発明の成形品は、その他、電気・電子・OA機器部品、精密機械部品、医療部品、建築・建材用品、家庭用品等として、幅広い用途への利用が期待できる。 In addition, the molded article of the present invention can be expected to be used in a wide range of applications such as electrical / electronic / OA equipment parts, precision machine parts, medical parts, building / building materials, household goods, and the like.
以下、実施例によって本発明を説明する。なお実施例中の「%」及び「部」は、特に断らない限り、「重量%」又は「重量部」を意味する。
1.物性の測定及び評価
以下の実施例及び比較例で作製したサンプルの物性の測定及び評価は、以下の方法により行った。
(1)曲げ弾性率、曲げ強度: ISO178による曲げ試験法に従い、三点曲げ試験を行った。
(2)DTUL(荷重たわみ温度): ISO75−1&2に従い、荷重1.80MPaの条件(A法)にて測定を行った。
(3)ガラス転移温度(Tg): JIS K7121に従い、DSC(セイコー社製、型式:SSC−5000)を用い、芳香族ポリカーボネート樹脂を、窒素気流下、室温から10℃/minの速度で昇温し、その変曲点をガラス転移温度として測定した。
(4)L値、a値、b値、YI値: JIS K7105に準じ、1mm厚の平板を試験片とし、日本電色工業(株)製のSE2000型分光式色彩計で、透過法により測定した。
(5)鉛筆硬度: JIS K5400に準じ、1mm厚の平板に5回の引掻き試験を行い硬度の評価を行った。
(6)吸水率: JIS K7209に準じ、試験片を23℃の純水中に浸漬し重量の増加率を測定した。
(7)耐湿熱性試験: プレッシャークッカー試験機((株)平山製作所製、HASTEST、MODEL PC−SIII)にて、試験片を120℃、ゲージ圧力1kg/cm2、湿度100%の水蒸気雰囲気中で50時間処理し、JIS K7136に従い、この処理前後のヘイズ値を測定し、その変化をΔヘイズとして算出し、耐加水分解性の指標とした。
(8)滞留熱安定性試験:卓上射出成形機(HAAKE社製、ミニジェット)にて、シリンダー温度350℃、金型温度120℃の条件で、溶融時間を15分間として射出成形を行い、溶融時間3分間の1mm厚の試験片と溶融時間15分間の成形片との色相の変化をΔEとして算出し、耐熱性の指標とした。
ΔE=((L15−L3)2+(a15−a3)2+(b15−b3)2)1/2
(L15、a15、b15:溶融時間15分間の試験片のL値、a値、b値。L3、a3、b3:溶融時間3分間の試験片のL値、a値、b値。)
Hereinafter, the present invention will be described by way of examples. In the examples, “%” and “part” mean “% by weight” or “part by weight” unless otherwise specified.
1. Measurement and Evaluation of Physical Properties Measurement and evaluation of physical properties of samples prepared in the following examples and comparative examples were performed by the following methods.
(1) Flexural modulus and bending strength: A three-point bending test was performed according to a bending test method according to ISO178.
(2) DTUL (deflection temperature under load): Measured under conditions (method A) under a load of 1.80 MPa according to ISO75-1 & 2.
(3) Glass transition temperature (Tg): In accordance with JIS K7121, DSC (manufactured by Seiko Co., Ltd., model: SSC-5000) was used to raise the temperature of the aromatic polycarbonate resin from room temperature at a rate of 10 ° C./min in a nitrogen stream. The inflection point was measured as the glass transition temperature.
(4) L value, a value, b value, YI value: According to JIS K7105, a 1 mm-thick flat plate is used as a test piece, and measured by a transmission method using a SE2000 type spectrocolorimeter manufactured by Nippon Denshoku Industries Co., Ltd. did.
(5) Pencil hardness: According to JIS K5400, the scratch was evaluated 5 times on a 1 mm thick flat plate to evaluate the hardness.
(6) Water absorption: According to JIS K7209, the test piece was immersed in pure water at 23 ° C., and the rate of increase in weight was measured.
(7) Moisture and heat resistance test: Using a pressure cooker tester (manufactured by Hirayama Seisakusho Co., Ltd., HAESTEST, MODEL PC-SIII), the test piece is in a steam atmosphere at 120 ° C., a gauge pressure of 1 kg / cm 2 , and a humidity of 100%. The haze value before and after this treatment was measured according to JIS K7136, and the change was calculated as Δhaze, which was used as an index for hydrolysis resistance.
(8) Stability heat stability test: Injection molding is performed with a desktop injection molding machine (HAAKE, minijet) under conditions of a cylinder temperature of 350 ° C. and a mold temperature of 120 ° C. with a melting time of 15 minutes. A change in hue between a test piece having a thickness of 1 mm for 3 minutes and a molded piece having a melting time of 15 minutes was calculated as ΔE and used as an index of heat resistance.
ΔE = ((L 15 −L 3 ) 2 + (a 15 −a 3 ) 2 + (b 15 −b 3 ) 2 ) 1/2
(L 15 , a 15 , b 15 : L value, a value, b value of a test piece having a melting time of 15 minutes. L 3 , a 3 , b 3 : L value, a value of a test piece having a melting time of 3 minutes, b value.)
2.樹脂の製造
製造例1:
5%の水酸化ナトリウム水溶液に1,1−ビス(4−ヒドロキシフェニル)シクロドデカン(以下「BPCD」と略称:田岡化学工業株式会社製)と2,2−ビス(4−ヒドロキシフェニル)プロパン(以下「BPA」と略称:三井化学株式会社製)をBPCDとBPAのモル比が30:70となるように添加し、ハイドロサルファイトを同時に溶解した。
これにメチレンクロライドを加えて撹拌しつつ、15℃に保ちながら、ついでホスゲンを吹き込んだ。
ホスゲン吹き込み終了後、分子量調節剤としてp−tert−ブチルフェノール(以下「PTBP」と略称:大日本インキ化学工業株式会社製)を加え激しく撹拌して、反応液を乳化させ、乳化後トリエチルアミンを加え、20〜25℃にて約1時間撹拌し、重合させた。
重合終了後、反応液を水相と有機相に分離し、有機相をリン酸で中和し、先液(水相)の導電率が10μS/cm以下になるまで水洗を繰り返した。得られた重合体溶液を、45℃に保った温水に滴下し、溶媒を蒸発除去して白色粉末状沈殿物を得た。
得られた沈殿物を濾過し、105℃、24時間乾燥して、重合体粉末を得た。
この重合体の塩化メチレンを溶媒とする濃度0.5g/dlの溶液の20℃における極限粘度は0.49dl/gであった。得られた重合体を赤外線吸収スペクトルにより分析した結果、1770cm-1付近の位置にカルボニル基による吸収、1240cm-1付近の位置にエーテル結合による吸収が認められ、カーボネート結合を有するポリカーボネート樹脂であることが確認された。
2. Resin production example 1:
1,1-bis (4-hydroxyphenyl) cyclododecane (hereinafter abbreviated as “BPCD” manufactured by Taoka Chemical Co., Ltd.) and 2,2-bis (4-hydroxyphenyl) propane (5% aqueous sodium hydroxide solution) Hereinafter, “BPA” (abbreviation: Mitsui Chemical Co., Ltd.) was added so that the molar ratio of BPCD to BPA was 30:70, and hydrosulfite was simultaneously dissolved.
Methylene chloride was added to this, and while stirring, phosgene was blown in while maintaining the temperature at 15 ° C.
After completion of phosgene blowing, p-tert-butylphenol (hereinafter abbreviated as “PTBP” as a molecular weight regulator) was added and stirred vigorously to emulsify the reaction solution. After emulsification, triethylamine was added, The mixture was stirred at 20 to 25 ° C. for about 1 hour for polymerization.
After completion of the polymerization, the reaction solution was separated into an aqueous phase and an organic phase, the organic phase was neutralized with phosphoric acid, and washing with water was repeated until the conductivity of the previous solution (aqueous phase) became 10 μS / cm or less. The obtained polymer solution was dropped into warm water maintained at 45 ° C., and the solvent was removed by evaporation to obtain a white powdery precipitate.
The obtained precipitate was filtered and dried at 105 ° C. for 24 hours to obtain a polymer powder.
The intrinsic viscosity at 20 ° C. of a solution having a concentration of 0.5 g / dl using methylene chloride as a solvent of this polymer was 0.49 dl / g. The results obtained polymer was analyzed by infrared absorption spectrum, absorption by carbonyl group at the position in the vicinity of 1770 cm -1, observed absorption by ether bond position near 1240 cm -1, it is polycarbonate resin having a carbonate bond Was confirmed.
製造例2:
製造例1において、「BPCD」と「BPA」の代わりに、「BPCD」のみを使用したことを除き、製造例1と同様の操作により、白色重合体粉末を得た。
この重合体の塩化メチレンを溶媒とする濃度0.5g/dlの溶液の20℃における極限粘度は0.48dl/gであった。
Production Example 2:
In Production Example 1, white polymer powder was obtained in the same manner as in Production Example 1, except that only “BPCD” was used instead of “BPCD” and “BPA”.
The intrinsic viscosity at 20 ° C. of a solution having a concentration of 0.5 g / dl using methylene chloride as a solvent of this polymer was 0.48 dl / g.
製造例3:
製造例1において、「BPCD」と「BPA」の代わりに、「BPA」のみを使用したことを除き、製造例1と同様の操作により、白色重合体粉末を得た。
この重合体の塩化メチレンを溶媒とする濃度0.5g/dlの溶液の20℃における極限粘度は0.48dl/gであった。
Production Example 3:
A white polymer powder was obtained in the same manner as in Production Example 1, except that only “BPA” was used in place of “BPCD” and “BPA” in Production Example 1.
The intrinsic viscosity at 20 ° C. of a solution having a concentration of 0.5 g / dl using methylene chloride as a solvent of this polymer was 0.48 dl / g.
3. 使用した材料
(A−1) 芳香族ポリカーボネート樹脂:製造例1で得られた重合体
(A−2) 芳香族ポリカーボネート樹脂:製造例2で得られた重合体
(A−3) 芳香族ポリカーボネート樹脂:製造例3で得られた重合体
(B−1) リン系安定剤:ビス(2,6−ジ−tert−ブチル−4−メチルフェニル)ペンタエリスリトールジホスファイト、旭電化工業(株)製「商品名:アデカスタブPEP−36」
(B−2) リン系安定剤:ビス(2,4−ジ−tert−ブチルフェニル)ペンタエリスリトールジホスファイト、旭電化工業(株)製「商品名:アデカスタブPEP−24G」
(B−3) リン系安定剤:トリス(2,4−ジ−tert−ブチルフェニル)ホスファイト、旭電化工業(株)製「商品名:アデカスタブ2112」
(C−1) フェノール系安定剤:トリエチレングリコール−ビス[3−(3−tert−ブチル−4−ヒドロキシ−5−メチルフェニル)プロピオネート]、旭電化工業(株)製「商品名:アデカスタブAO−70」
(C−2) フェノール系安定剤:3,9−ビス{2−[3−(3−tert−ブチル−4−ヒドロキシ−5−メチルフェニル)プロピオニルオキシ]−1,1−ジメチルエチル}−2,4,8,10−テトラオキサスピロ[5,5]ウンデカン、旭電化工業(株)製「商品名:アデカスタブAO−80」
(C−3) フェノール系安定剤:ペンタエリスリト−ルテトラキス[3−(3,5−ジ−tert−ブチル−4−ヒドロキシフェニル)プロピオネート]、チバ・スペシャルティー・ケミカルズ社製、「商品名:イルガノックス1010」
3. Material (A-1) Aromatic polycarbonate resin: Polymer obtained in Production Example 1 (A-2) Aromatic polycarbonate resin: Polymer obtained in Production Example 2 (A-3) Aromatic polycarbonate resin : Polymer (B-1) obtained in Production Example 3 Phosphorus stabilizer: Bis (2,6-di-tert-butyl-4-methylphenyl) pentaerythritol diphosphite, manufactured by Asahi Denka Kogyo Co., Ltd. "Product name: ADK STAB PEP-36"
(B-2) Phosphorus stabilizer: bis (2,4-di-tert-butylphenyl) pentaerythritol diphosphite, manufactured by Asahi Denka Kogyo Co., Ltd. “trade name: ADK STAB PEP-24G”
(B-3) Phosphorus stabilizer: Tris (2,4-di-tert-butylphenyl) phosphite, manufactured by Asahi Denka Kogyo Co., Ltd. “Product Name: ADK STAB 2112”
(C-1) Phenol-based stabilizer: triethylene glycol-bis [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionate], manufactured by Asahi Denka Kogyo Co., Ltd. “trade name: ADK STAB AO -70 "
(C-2) Phenol stabilizer: 3,9-bis {2- [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propionyloxy] -1,1-dimethylethyl} -2 4,8,10-tetraoxaspiro [5,5] undecane, manufactured by Asahi Denka Kogyo Co., Ltd. “trade name: ADK STAB AO-80”
(C-3) Phenol stabilizer: Pentaerythritol tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], manufactured by Ciba Specialty Chemicals, Inc., “trade name: Irganox 1010 "
4. 実施例1〜3、並びに比較例1及び2
芳香族ポリカーボネート樹脂及び各種添加剤を表1に示す割合で配合し、タンブラーで20分間混合後、スクリュー径40mmのベント付き単軸押出機(いすず化工機社製「SV−40」)により、シリンダー温度320℃、スクリュー回転数70rpmで混練し、押出されたストランドを切断してペレットを作製した。
得られたペレットを120℃、5時間乾燥後、射出成形機(住友重機械工業製、サイキャップM−2、型締め力75T)にて、シリンダー温度320℃、金型温度80℃、成形サイクル50秒の条件で射出成形を行い、ISO多目的試験片を作製した。また、卓上射出成形機(HAAKE社製、ミニジェット)にて、シリンダー温度350℃、金型温度120℃、溶融時間3分間の条件で射出成形を行い、厚み1mmの平板を作製した。このような方法で作製した成形品を、前述の方法による評価用の試験片として用い評価を行った。
4). Examples 1-3 and Comparative Examples 1 and 2
Aromatic polycarbonate resin and various additives are blended in the proportions shown in Table 1, mixed with a tumbler for 20 minutes, and then cylindered with a single screw extruder with a screw diameter of 40 mm (“SV-40” manufactured by Isuzu Chemical Industries). The mixture was kneaded at a temperature of 320 ° C. and a screw rotation speed of 70 rpm, and the extruded strand was cut to produce pellets.
The pellets obtained were dried at 120 ° C. for 5 hours, and then injection molding machine (manufactured by Sumitomo Heavy Industries, Psycap M-2, clamping force 75T), cylinder temperature 320 ° C., mold temperature 80 ° C., molding cycle. Injection molding was carried out under the condition of 50 seconds to produce an ISO multipurpose test piece. In addition, injection molding was performed on a table-top injection molding machine (manufactured by HAAKE, minijet) under the conditions of a cylinder temperature of 350 ° C., a mold temperature of 120 ° C., and a melting time of 3 minutes to produce a flat plate having a thickness of 1 mm. Evaluation was performed using the molded product produced by such a method as a test piece for evaluation by the above-described method.
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