JP5339318B2 - Low dielectric loss resin for multilayer wiring board, resin composition, prepreg, and multilayer wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a low dielectric-loss resin composition which can be melted into a low-boiling point general-purpose solvent and is excellent in the process workability of a wiring substrate while maintaining excellent characteristics of polyphenylene ether. <P>SOLUTION: The multilayer wiring substrate low dielectric loss resin which is a copolymer composed of repeating units of a formula (1). The multilayer wiring substrate uses the resin. Wherein, X is the repeating unit of a specific formula, R1 and R2 are each a hydrocarbon group of C1, and n and m are each an integer of 1 or more. <P>COPYRIGHT: (C)2006,JPO&amp;NCIPI

Description

  The present invention relates to a low dielectric loss resin suitable for a high-frequency mounting material, a resin composition containing the resin, a prepreg, and a multilayer wiring board using the resin composition.

  In recent years, the signal band of information communication devices such as PHS and mobile phones, and the CPU clock time of computers have reached the GHz band, and higher frequencies have been promoted. The transmission loss of electrical signals is proportional to the product of dielectric loss tangent and frequency. Therefore, the transmission loss increases as the frequency of the signal used increases. An increase in transmission loss causes signal attenuation, resulting in a decrease in signal transmission reliability. Therefore, an insulating material having a very small dielectric loss tangent is strongly desired in the high frequency region.

  Removal of polar groups in the molecular structure is effective for reducing the dielectric loss tangent (dielectric loss) of the insulating material. Many structures such as a fluororesin, a curable polyolefin, a cyanate ester resin, a curable polyphenylene ether, a polyetherimide modified with divinylbenzene or divinylnaphthalene have been proposed. However, fluororesin is generally a thermoplastic resin and there are limits to multilayering. Moreover, since it does not dissolve in a general-purpose solvent, a high-temperature and high-pressure process is required when producing a wiring board. Although curable polyolefin is excellent in dielectric characteristics, sufficient characteristics cannot be obtained in terms of heat resistance. Cyanate esters and polyetherimides have excellent heat resistance but have limited dielectric properties.

  In contrast, curable polyphenylene has been developed as a material that can achieve both heat resistance and dielectric properties. For example, Patent Document 1 and Patent Document 2 have been reported. However, there is no description in what field the resin described in Patent Document 1 is used. Patent Document 2 describes reacting a mixture of a polyphenylene resin and a conjugated aromatic diene compound or the like. However, general polyphenylene ether is hardly soluble in general low-boiling general-purpose solvents, and chloroform (halogen-based solvent), hot toluene, etc. are often used for varnish preparation in the wiring board manufacturing process. There remains a problem with respect to.

  Patent Document 3 discloses that a composition containing a thermosetting polyphenylene ether resin and a crosslinking agent is used for a multilayer wiring board. Patent Document 4 describes that a reaction product of a polyphenylene resin and an unsaturated carboxylic acid or an anhydride thereof is used for a printed circuit board.

  Non-Patent Document 1 describes a thermosetting photosensitive polyphenylene ether resin, and describes that this resin contains an allyl group.

JP 7-133347 A JP 2001-302791 A JP 2003-17861 A JP 2004-106274 A Proceedings of the Society of Polymer Science, vol. 53, no. 1 (2004)

  An object of the present invention is to maintain the excellent characteristics of polyphenylene ether, to be soluble in a low-boiling general-purpose solvent, and to have a low dielectric loss resin excellent in process processability of a wiring board, a resin composition containing the resin, and a plastic material thereof It is to provide a prepreg using multilayer and a multilayer wiring board.

  According to the present invention, there is provided a low dielectric loss resin for a multilayer wiring board, which is a copolymer comprising a repeating unit of the formula (1).

Here, X is a repeating unit of formula (2) and / or formula (3), R ^{1 and} R ² are hydrocarbon groups having 1 carbon atom, and R ^{3 to} R ⁸ are those having 3 to 9 carbon atoms. It is a hydrocarbon group, and n, m, p, r and s are integers of 1 or more representing the degree of polymerization. At least one of R ^{1 to} R ⁸ may have a polymerizable unsaturated bond.

  By using the low dielectric loss copolymer of the present invention, a resin composition that is excellent in heat resistance while maintaining the characteristics of low dielectric loss, is non-halogen, and is soluble in an organic solvent having a boiling point of 150 ° C. or lower. Can be obtained. Wiring boards using this as the matrix resin for the insulating layer can be manufactured with the same processability and moldability as conventional products such as epoxy resins, and the electrical characteristics have extremely low dielectric loss performance compared to conventional epoxy resins. ing. In addition, the thermal properties typified by solder heat resistance are the same as or better than those of conventional epoxy wiring boards.

  In Patent Document 4, a modified product using a hydroxyl group at the terminal of polyphenylene ether is disclosed. In order to obtain a certain degree of mechanical strength as in the present invention, a high molecular weight compound (molecular weight of 5,000 or more, particularly 1 It is considered that the modification with only the terminal does not sufficiently improve the heat resistance and solubility in a low-boiling solvent, which are the objectives of the present invention. In contrast, in the present invention, a part of the main chain of polyphenylene ether is modified with a copolymer by an amount necessary for improving the characteristics. Therefore, unlike the known examples, the solubility required to make the varnish at the time of circuit board creation is ensured, and the solder heat resistance, which is indispensable to ensure mounting reliability as a circuit board, is a leap forward compared to conventional polyphenylene ether. Excellent characteristics were obtained.

  As one embodiment of the present invention, there is provided a low dielectric loss resin for a multilayer wiring board, which is a random copolymer comprising repeating units of the formula (1).

Here, X is a repeating unit of formula (2) and / or formula (3), R ¹ and R ² are C ¹ hydrocarbon groups, and R ³ , R ⁵ and R ⁷ are the same or Differently, it has a saturated hydrocarbon group, an unsaturated hydrocarbon group or an aromatic hydrocarbon group having 2 to 9 carbon atoms, and R ⁴ , R ⁶ and R ⁸ are the same or different and have 1 to 9 carbon atoms. A saturated hydrocarbon group, an unsaturated hydrocarbon group, and an aromatic hydrocarbon group, and m, n, p, r, and s are integers of 1 or more representing the degree of polymerization.

  The molecular weight of the copolymer is preferably 5,000 to 30,000. The present invention provides a binary copolymer in which X is a repeating unit of formula (2). There is also provided a terpolymer where X is a repeating unit of formula (3).

  Also, the conventional general method can be used for the method of manufacturing an electronic component in the present invention. Typical solvents include halogen compounds and aromatic hydrocarbon compounds, but are not particularly limited and can be used. Halogen compounds include dichloromethane, chloroform, methyl tetrachloride and the like. Aromatic hydrocarbons include toluene and xylene. Other solvents include N, N-dimethylformamide, N, N-dimethylacetamide, diethyl ether, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, tetrahydrofuran, dioxane, cyclohexanone and the like. The varnish can be prepared by dissolving or uniformly dispersing the copolymer in such a solvent.

  Among the solvents listed above, in the present invention, a low dielectric loss resin for a multilayer wiring board in which the copolymer is soluble in a non-halogen organic solvent having a boiling point of 150 ° C. or lower is more preferably 20% by weight or more. Accordingly, a resin composition for a multilayer wiring board comprising a non-halogen organic solvent having a boiling point of 150 ° C. or lower and the low dielectric loss resin dissolved in the organic solvent is provided. The resin composition may contain a colorant, a catalyst (such as a radical crosslinking accelerator) and the like as necessary.

  In producing the varnish, it is possible to dissolve or uniformly disperse a predetermined amount of the copolymer of the present invention in the above solvent, and further add a second component and a third component as necessary. Moreover, in order to accelerate | stimulate the crosslinking reaction of thermosetting material, a catalyst or an accelerator can be added. Examples of the crosslinking reaction catalyst for crosslinking the unsaturated bond include a cation or a radical active species. In addition, fillers such as fillers, colorants, flame retardants, adhesion promoters, coupling agents, antifoaming agents, leveling agents, ion trappers, polymerization inhibitors, antioxidants, viscosity modifiers, etc., are added as necessary. can do.

In practice, in order to apply the low dielectric loss resin of the present invention to a multilayer wiring board, a varnish is prepared by dissolving in an organic solvent, and this is impregnated into a fiber base material such as a glass cloth and dried to prepare a prepreg. . When R ^{1 to} R ⁸ in the above formula (1), formula (2) and / or formula (3) do not have an unsaturated bond, a low dielectric loss resin for a multilayer wiring board which is a thermoplastic resin is provided.

When at least one of R ^{1 to} R ^{8 in} the above formula (1), formula (2) and / or formula (3) has an unsaturated bond, a low dielectric loss resin for multilayer wiring boards, which is a thermosetting resin, is used. Provided. This thermosetting resin is soluble in a solvent before being cured, and the varnish can be adjusted, and a prepreg can be prepared using the varnish. The prepreg is used after impregnating a base material such as glass cloth with varnish and drying. This is laminated with a wiring layer by a known method to make a multilayer wiring board.

  The present invention includes an electrical component having an insulating layer in which various insulating materials having different dielectric constants are dispersed in the thermosetting resin. With this configuration, the dielectric constant can be easily adjusted while suppressing an increase in the dielectric loss tangent of the insulating layer. In the resin composition of the present invention, the dielectric constant at 1 GHz can be adjusted in the range of about 2.3 to 3.0 depending on the type and amount of high molecular weight material to be blended. Furthermore, in a high frequency electric component in which a low dielectric constant insulator having a dielectric constant of 1.0 to 2.2 at 1 GHz is dispersed in the insulating layer, the dielectric constant of the insulating layer can be adjusted to about 1.5 to 2.2. Is possible.

  On the other hand, in the present invention, the dielectric constant is 3.1 to 20 while suppressing an increase in dielectric loss tangent by dispersing a high dielectric constant insulator having a dielectric constant of 3.0 to 10,000 at 1 GHz in the insulating layer. A high-frequency electrical component having a high dielectric constant insulating layer can be produced.

As a typical polyphenylene ether, there is a polymer of 2,6-dimethylphenol in which R ^{1 to} R ⁸ are all hydrocarbon groups having 1 carbon atom. The dielectric properties of this 2,6-dimethylphenol polymer show excellent values, but it is a thermoplastic resin with a melting point of around 200 ° C., and a wiring board using this is a reflow process in component mounting (around 260 ° C. at maximum) ) Causes deformation and flow of the insulating layer, which is problematic in terms of heat resistance. Further, the wiring board needs mechanical strength (toughness), and the molecular weight is desirably 10,000 or more. If the molecular weight is lower than that, it is difficult to obtain sufficient strength of the resin. However, 2,6-dimethylphenol polymer becomes difficult to dissolve in a solvent when the molecular weight is 10,000 or more, and a solvent that is difficult to handle, such as chloroform (halogen-based solvent) or hot toluene (50 ° C. or more) must be used. . For this reason, it is difficult to apply an organic solvent which is non-halogen-based and generally has a boiling point of 150.degree.

In the present invention, R ¹ and R ² in the copolymer structure are hydrocarbon groups having 1 carbon atom, and by introducing a substituent having 3 to 9 carbon atoms into a part of R ^{3 to} R ⁸ , heat resistance is improved. In addition, it is possible to provide a material excellent in solubility in a solvent. The substituent of the present invention is bulkier than the methyl group, and the solubility of the resin in general-purpose organic solvents is improved and the heat resistance is also improved.

Another method of the present invention has the following configuration. That is, R ¹ and R ² in the random copolymer structure are hydrocarbon groups having 1 carbon atom, and R ³ , R ⁵ , and R ⁷ may be the same or different. Moreover, it has a C2-C9 saturated hydrocarbon group, unsaturated hydrocarbon group, and aromatic hydrocarbon group, and R ⁴ , R ⁶ , and R ⁸ may be the same or different. Furthermore, by having a saturated hydrocarbon group having 1 to 9 carbon atoms, an unsaturated hydrocarbon group, or an aromatic hydrocarbon group, it is possible to provide a material having excellent heat resistance and solubility in a solvent. it can. The substituent of the present invention is bulkier than the methyl group, and the solubility of the resin in general-purpose organic solvents is improved and the heat resistance is also improved.

  One of the substituents is a hydrocarbon group having an unsaturated bond. Specific examples include substituents having an unsaturated bond among various hydrocarbon groups having 2 to 9 carbon atoms such as vinyl group, allyl group, isopropenyl group, butenyl group, isobutenyl group, pentenyl group and the like. These unsaturated bonds cause a crosslinking reaction due to heat, and contribute to the improvement of heat resistance of the wiring board. In other words, the deformation and flow of the insulating layer can be suppressed in the reflow process (around 260 ° C. at the maximum) during component mounting on the wiring board. Moreover, the solubility with respect to a solvent can also be improved by introduce | transducing the substituent which lengthened the molecular chain compared with the methyl group.

  Examples of other substituents include hydrocarbon groups including aromatic hydrocarbons. Specific examples include phenyl group, tolyl group, xylyl group, cumenyl group, mesityl group, benzyl group, phenethyl group, styryl group, cinnamyl group and the like. The introduction of these aromatic hydrocarbon groups can improve the heat resistance of the resulting copolymer, and can also improve the solubility in a solvent due to the effect of a bulky substituent.

  Furthermore, heat resistance and solubility can be further improved by using a ternary copolymer. The amount of introduction of these substituents is preferably about 5 to 30 mol%. If it is 5 mol% or less, the effect of introducing substituents is small, and the effect of improving heat resistance and solubility may not be sufficient. Moreover, in the case of 30 mol% or more, in the case of the substituent which has an unsaturated bond, a crosslinking density becomes high too much and the toughness of the hardened | cured material obtained may fall. In the case of aromatic hydrocarbon substituents, there are concerns that there may be excessive bulky substituents, resulting in an increase in solution viscosity at the time of varnish preparation and a decrease in mechanical strength due to a decrease in the density of the resulting cured product. The The copolymer according to the present invention is a thermoplastic and thermosetting resin, and its glass transition point is 220 ° C. or higher.

  Examples of the copolymer used in the present invention include the following substances. For example, as the hydrocarbon group having an unsaturated bond, a copolymer of (2,6-dimethylphenyl ether) and (2-vinyl-6-methylphenyl ether), (2,6-dimethylphenyl ether) and (2 -Allyl-6-methylphenyl ether) copolymer, (2,6-dimethylphenyl ether) and (2,6-divinylphenyl ether) copolymer, (2,6-dimethylphenyl ether) and (2 , 6-diallylphenyl ether), (2,6-dimethylphenyl ether) and (2,6-diisopropenyl phenyl ether), (2,6-dimethylphenyl ether) and (2 , 6-dibutenyl phenyl ether), a copolymer of (2,6-dimethylphenyl ether) and (2,6-diisobutenyl phenyl ether). A copolymer of (2,6-dimethylphenyl ether) and (2,6-dipentenyl phenyl ether), a copolymer of (2,6-dimethylphenyl ether) and (2,6-diisopentenyl phenyl ether) Examples thereof include a polymer and a copolymer of (2,6-dimethylphenyl ether) and (2,6-dinonenyl phenyl ether).

  On the other hand, as a copolymer having an aromatic hydrocarbon group, a copolymer of (2,6-dimethylphenyl ether) and (2-phenyl-6-methylphenyl ether), (2,6-dimethylphenyl ether) And (2-tolyl-6-methylphenyl ether) copolymer, (2,6-dimethylphenyl ether) and (2,6-diphenylphenyl ether) copolymer, (2,6-dimethylphenyl ether) And (2,6-ditolylphenyl ether) copolymer, (2,6-dimethylphenyl ether) and (2,6-dixylphenyl ether) copolymer, (2,6-dimethylphenyl ether) Copolymer of (2,6-dicenyl phenyl ether) and (2,6-dimethylphenyl ether) and (2,6-dimesityl phenyl ether) , A copolymer of (2,6-dimethylphenyl ether) and (2,6-dibenzylphenyl ether), a copolymer of (2,6-dimethylphenyl ether) and (2,6-diphenethylphenyl ether) Copolymer, copolymer of (2,6-dimethylphenyl ether) and (2,6-distyrylphenyl ether), copolymer of (2,6-dimethylphenyl ether) and (2,6-dicinnamylphenyl ether) Coalescence is mentioned.

  Further, as the terpolymer, a copolymer of (2,6-dimethylphenyl ether), (2-allyl-6-methylphenyl ether) and (2,6-diphenylphenyl ether), (2,6 -Dimethylphenyl ether), (2-allyl-6-methylphenyl ether) and (2-phenyl-6-methylphenyl ether) copolymer, (2,6-dimethylphenyl ether) and (2,6-divinyl) Copolymer of (phenyl ether) and (2,6-diphenyl phenyl ether), copolymer of (2,6-dimethylphenyl ether), (2,6-diallylphenyl ether) and (2,6-diphenylphenyl ether) Compound, (2,6-dimethylphenyl ether) and (2,6-dipropenyl phenyl ether) and (2,6-diphenylphenyl ether) A copolymer of (2,6-dimethylphenyl ether), (2,6-dibutenylphenyl ether) and (2,6-diphenylphenyl ether), (2,6-dimethylphenyl ether) and Copolymers of (2,6-diisobutenyl phenyl ether) and (2,6-diphenyl phenyl ether), (2,6-dimethylphenyl ether), (2,6-dipentenyl phenyl ether) and (2,6 -Diphenylphenyl ether), (2,6-dimethylphenyl ether), (2,6-diallylphenyl ether) and (2,6-ditolylphenyl ether), (2,6- A copolymer of (dimethylphenyl ether), (2,6-diallylphenyl ether), and (2,6-dixylphenyl ether), Copolymer of (tilphenyl ether), (2,6-dibutenyl phenyl ether) and (2,6-ditolyl phenyl ether), (2,6-dimethylphenyl ether) and (2,6-dibutenyl phenyl ether) ) And (2,6-dixylphenyl ether), (2,6-dimethylphenyl ether), (2,6-diisobutenyl phenyl ether) and (2,6-ditolylphenyl ether) A polymer, a copolymer of (2,6-dimethylphenyl ether), (2,6-diisobutenyl phenyl ether) and (2,6-dixylphenyl ether), (2,6-dimethylphenyl ether) and ( And a copolymer of (2,6-diisopentenyl phenyl ether) and (2,6-diphenyl phenyl ether).

  In the present invention, by blending a rubber component containing a styrene residue that is compatible with the copolymer component, it is possible to impart further film-forming ability, flexibility and adhesion to the cured product comprising the resin composition of the present invention. . This makes it possible to produce various types of wiring boards that are unlikely to peel off the insulating layer and the conductor layer, that is, with high reliability. Examples of rubber components include styrene-butadiene, styrene-isoprene, styrene-ethylene-butylene-styrene, styrene-ethylene-propylene-styrene, styrene-maleic acid-butadiene, acrylonitrile-butadiene-styrene, acrylonitrile-ethylene-propylene- Examples include styrene. The molecular weight of the rubber component is 5,000 or more. More preferably, it is 5,000-100,000.

  If the molecular weight is small, the film forming ability, flexibility and adhesion may be insufficient. On the other hand, if the molecular weight is too large, the viscosity increases when the resin composition is varnished, which may make mixing and stirring, film formation, and impregnation difficult. There is no restriction | limiting in particular in the kind of rubber component, You may mix and use 2 or more types. As a compounding quantity of a rubber component, 5 to 50 weight% is desirable. If it exceeds 50% by weight, the characteristics of the copolymer component of the present invention cannot be fully utilized.

  Further, by using a rubber component having a carbon atom and hydrogen atom ratio of 99% or more with respect to the entire constituent elements of the rubber component, it is possible to further reduce the dielectric loss tangent. A preferred example is styrene-butadiene. Styrene-butadiene is highly compatible with the copolymer component of the present invention and has a low dielectric constant. Thereby, a softness | flexibility and adhesiveness can be provided to a resin composition, without impairing the dielectric characteristic of a copolymer component. About the ratio of the styrene site | part per molecule | numerator, it is desirable that the ratio of a styrene site | part will be 30-80 wt%. If the ratio of the styrene moiety is too small, the compatibility with the copolymer component is lowered, and the film-forming property, strength, and flexibility of the resin composition become insufficient. Moreover, when the ratio of a styrene site | part is too large, the softness | flexibility and adhesiveness of a resin composition will fall, and peel strength will become small.

  In producing the varnish, it is possible to dissolve or uniformly disperse a predetermined amount of the copolymer of the present invention in the above solvent, and further add a second component and a third component as necessary. Moreover, in order to accelerate | stimulate the crosslinking reaction of thermosetting material, a catalyst or an accelerator can be added. The addition amount is not particularly limited, but is preferably about 0.0005 to 10 parts by weight with respect to 100 parts by weight of the copolymer. If the amount added is too large, it may adversely affect electrical characteristics such as dielectric loss. Also, if the amount added is too small, the promoting effect will not be sufficient. By adding a crosslinking reaction catalyst or accelerator, a crosslinking reaction proceeds at a low temperature, and an insulating material having excellent heat resistance can be obtained.

As a crosslinking reaction catalyst for crosslinking unsaturated bonds, cation or radical active species are shown below. Examples of the cationic catalyst include diaryl iodonium salts, triaryl sulfonium salts, and aliphatic sulfonium salts having BF ₄ ⁻ , PF ₆ ⁻ , AsF ₆ ⁻ , and SbF ₆ ⁻ as counter anions. As radical catalysts, benzoin compounds represented by benzoin and benzoinmethyl, acetophenone and acetophenone compounds represented by 2,2-dimethoxy-2-phenylacetophenone, thioxanthone and thioxanthone represented by 2,4-diethylthioxanthone Compounds, bisazido compounds represented by 4,4′-diazidochalcone, 2,6-bis (4′-azidobenzal) cyclohexanone and 4,4′-diazidobenzophenone, azobisisobutyronitrile, 2,2- Azo compounds such as azobispropane, m, m′-azoxystyrene, hydrazine, 2,5-dimethyl-2,5- (t-butylperoxy) hexyne-3, 2,5-dimethyl-2,5- (T-Butylperoxy) hexane, dicumyl peroxide, ben Organic peroxides such as zoyl peroxide are listed. In addition, fillers such as fillers, colorants, flame retardants, adhesion promoters, coupling agents, antifoaming agents, leveling agents, ion trappers, polymerization inhibitors, antioxidants, viscosity modifiers, etc., are added as necessary. can do.

  Here, the manufacturing method of the wiring board can be divided into two specifications. One is a method of making a prepreg by impregnating the obtained varnish into a reinforcing material. The other is a resin-only substrate coated directly on copper foil or the like and having no reinforcing material as an insulating layer. Although there is no particular limitation in the present invention, a reinforcing material is often used in the case of a rigid board on which many mounting parts are mounted. Further, when constituting a flexible substrate or a build-up substrate, a reinforcing material is often not used. As the reinforcing material, a woven fabric, a non-woven fabric, a non-woven paper, a film or the like that is generally applied as a wiring board can be used. Typical examples include inorganic oxides such as E glass, S glass, D glass, silica glass, and A glass, and organic substances such as polyimide and polyaramid. In the present invention, by dispersing the high molecular weight material in the insulating layer, the insulating layer can be given strength, elongation, adhesion to conductor wiring, and film forming ability. This makes it possible to produce prepregs necessary for the production of multilayer wiring boards, laminated sheets with conductor foil and prepreg laminated and cured (hereinafter abbreviated as laminated sheets), and high-density multilayers by thin film formation processes. It is also possible to create a wiring board.

  The high molecular weight body preferably has a molecular weight of 5,000 or more, more preferably 6,000 to 100,000, still more preferably 10,000 to 60,000. When the molecular weight is small, the mechanical strength may not be improved sufficiently. When the molecular weight is too large, the viscosity increases when the resin composition is varnished, and mixing and stirring and film formation become difficult.

  Examples of the high molecular weight substance may include a monomer selected from butadiene, isoprene, styrene, ethylstyrene, divinylbenzene, N-vinylphenylmaleimide, acrylate ester, acrylonitrile, a copolymer, and a substituent. Good polyphenylene oxide, cyclic polyolefin, polysiloxane, polyetherimide and the like can be mentioned. Among them, polyphenylene oxide and cyclic polyolefin are preferable because of high strength and low dielectric loss tangent.

To actually apply the resin of the present invention to a multilayer wiring board, a varnish is prepared by dissolving in an organic solvent, impregnated into a fiber base material such as glass cloth, and dried to prepare a prepreg. When R ^{1 to} R ⁸ in the above formula (1), formula (2) and / or formula (3) do not have an unsaturated bond, a low dielectric loss resin for a multilayer wiring board which is a thermoplastic resin is provided.

When at least one of R ^{1 to} R ^{8 in} the above formula (1), formula (2) and / or formula (3) has an unsaturated bond, a low dielectric loss resin for a multilayer wiring board which is a thermosetting resin is provided. Is done. This thermosetting resin is soluble in a solvent before being cured, and the varnish can be adjusted, and a prepreg can be prepared using the varnish. The prepreg is used after impregnating a base material such as glass cloth with varnish and drying. This is laminated with a wiring layer by a known method to make a multilayer wiring board.

  The present invention can be applied to an electrical component having an insulating layer in which various insulating materials having different dielectric constants are dispersed in the thermosetting resin. With this configuration, the dielectric constant can be easily adjusted while suppressing an increase in the dielectric loss tangent of the insulating layer. In the resin composition of the present invention, the dielectric constant at 1 GHz can be adjusted in the range of about 2.3 to 3.0 depending on the type and amount of the high molecular weight material to be blended. Furthermore, in a high frequency electric component in which a low dielectric constant insulator having a dielectric constant of 1.0 to 2.2 at 1 GHz is dispersed in the insulating layer, the dielectric constant of the insulating layer can be adjusted to about 1.5 to 2.2. Is possible. By reducing the dielectric constant of the insulating layer, electrical signals can be transmitted at higher speed. This is because the transmission speed of the electric signal is proportional to the inverse of the square root of the dielectric constant. The lower the dielectric constant of the insulating layer, the higher the transmission speed.

  The low dielectric constant insulator is preferably one or more of low dielectric constant resin particles, hollow resin particles, hollow glass balloons and voids (air), and the particle size is an average from the viewpoint of the strength of the insulating layer and the insulation reliability. The particle size is preferably 0.2 to 100 μm, more preferably 0.2 to 60 μm. Examples of the low dielectric constant resin particles include polytetrafluoroethylene particles, polystyrene-divinylbenzene crosslinked particles, and the hollow particles include hollow styrene-divinylbenzene crosslinked particles, silica balloons, glass balloons, and shirasu balloons. . The low dielectric constant insulating layer is suitable for forming a sealing resin of a semiconductor device that requires high-speed transmission, wiring such as an MCM substrate that electrically connects chips, and a circuit such as a high-frequency chip inductor.

  On the other hand, in the present invention, the dielectric constant is 3.1 to 20 while suppressing an increase in dielectric loss tangent by dispersing a high dielectric constant insulator having a dielectric constant of 3.0 to 10,000 at 1 GHz in the insulating layer. A high-frequency electrical component having a high dielectric constant insulating layer can be produced. By increasing the dielectric constant of the insulating layer, it is possible to reduce the size of the circuit and increase the capacity of the capacitor, thereby contributing to the downsizing of high-frequency electrical components. The high dielectric constant and low dielectric loss tangent insulating layer is suitable for forming capacitors, resonant circuit inductors, filters, antennas and the like.

Examples of the high dielectric constant insulator used in the present invention include ceramic particles or insulated metal particles. Specifically, silica, alumina, zirconia, ceramic particles; e.g. _{MgSiO 4, Al 2 O 3,} MgTiO 3, ZnTiO 3, ZnTiO 4, TiO 2, CaTiO 3, SrTiO 3, SrZrO 3, BaTi 2 O 5, BaTi ₄ O ₉ , Ba ₂ Ti ₉ O ₂₀ , Ba (Ti, Sn) ₉ O ₂₀ , ZrTiO ₄ , (Zr, Sn) TiO ₄ , BaNd ₂ Ti ₅ O ₁₄ , BaSmTiO ₁₄ , Bi ₂ O ₃ —BaO—Nd Examples thereof include high dielectric constant insulators such as ₂ O ₃ —TiO ₂ , La ₂ Ti ₂ O ₇ , BaTiO ₃ , Ba (Ti, Zr) O ₃ , and (Ba, Sr) TiO _3. Fine metal particles that have been subjected to insulation treatment, such as gold, silver, palladium, copper, nickel, iron, cobalt, zinc, Mn-Mg-Z System, Ni-Zn-based, Mn-Zn-based, carbonyl iron, Fe-Si-based, Fe-Al-Si-based, may be mentioned Fe-Ni system, or the like.

  The particles of the high dielectric constant insulator are crushed, granulated, or sprayed with a thermally decomposable metal compound and heat treated to produce metal fine particles (Japanese Patent Publication No. Sho 63-31522, Japanese Patent Laid-Open No. 6-172802). , Japanese Patent Laid-Open No. 6-279816) and the like. In the spray pyrolysis method, boric acid, silicic acid, phosphoric acid that reacts with the metal compound that is the starting material, such as carboxylate, phosphate, sulfate, etc., and forms a ceramic by reacting with the metal, or ceramic after oxidation Various metal salts are mixed and subjected to spray pyrolysis treatment. As a result, metal particles having an insulating layer on the surface can be formed. The average particle size of the high dielectric constant insulator is preferably about 0.2 to 100 μm, and more preferably an average particle size of 0.2 to 60 μm from the viewpoint of the strength of the insulating layer and the insulation reliability. If the particle size is small, it becomes difficult to knead the resin composition, and if it is too large, the dispersion becomes non-uniform, which may cause a dielectric breakdown, resulting in a decrease in insulation reliability. The shape of the high dielectric constant particles may be spherical, crushed, or whisker-like. Hereinafter, the present invention will be described in detail with reference to Examples and Comparative Examples.

Reference Example 1 (Synthesis of Copolymer 1)
Nitrobenzene 40 ml, magnesium sulfate 2.4 g (20 mmol), cuprous chloride 0.26 g (2.7 mmol), pyridine 21.6 ml (0.27 mol) were placed in a two-necked flask containing a stir bar, and 50 ml / min. The mixture was stirred at 25 ° C. for 30 minutes under an oxygen stream. 4.4 g (36 mmol) of 2,6-dimethylphenol dissolved in 25 ml of nitrobenzene and 0.59 ml (4.0 mmol) of 2-allyl-6-methylphenol were added to the reactor, and subsequently under an oxygen stream of 50 ml / min. Stir at 25 ° C. for 90 minutes. After completion of the reaction, the reaction mixture was precipitated in a large excess of hydrochloric acid / methanol, washed several times with methanol, dissolved in chloroform, and insolubles were filtered off. It was reprecipitated again in a large excess of hydrochloric acid / methanol, washed several times with methanol, and then dried in vacuo at 80 ° C. for 6 hours to obtain a white solid.

( Reference Example 2) (Synthesis of Copolymer 2)
Nitrobenzene 40 ml, magnesium sulfate 2.4 g (20 mmol), cuprous chloride 0.26 g (2.7 mmol), pyridine 21.6 ml (0.27 mol) were placed in a two-necked flask containing a stir bar, and 50 ml / min. The mixture was stirred at 25 ° C. for 30 minutes under an oxygen stream. 3.9 g (32 mmol) of 2,6-dimethylphenol dissolved in 25 ml of nitrobenzene and 1.8 g (8.0 mmol) of 2,6-bis (3-methyl-2-butenyl) phenol were added to the reactor, followed by 50 ml. The mixture was stirred at 25 ° C. for 90 minutes under an oxygen stream / minute. After completion of the reaction, the reaction mixture was precipitated in a large excess of hydrochloric acid (10 ml) / methanol (700 ml), washed several times with methanol, dissolved in chloroform, and insoluble matter was filtered off. It was reprecipitated again in a large excess of hydrochloric acid / methanol, washed several times with methanol, and then dried in vacuo at 80 ° C./12 hours to obtain a white solid.

( Reference Example 3) (Synthesis of Copolymer 3)
Nitrobenzene 40 ml, magnesium sulfate 2.4 g (20 mmol), cuprous chloride 0.26 g (2.7 mmol), pyridine 21.6 ml (0.27 mol) were placed in a two-necked flask containing a stir bar, and 50 ml / min. The mixture was stirred at 25 ° C. for 30 minutes under an oxygen stream. 4.4 g (36 mmol) of 2,6-dimethylphenol dissolved in 25 ml of nitrobenzene and 0.98 g (4.0 mmol) of 2,6-diphenylphenol were added to the reactor, followed by 25 ° C. under an oxygen stream of 50 ml / min. For 90 minutes. After completion of the reaction, the reaction mixture was precipitated in a large excess of hydrochloric acid (10 ml) / methanol (700 ml), washed several times with methanol, dissolved in chloroform, and insoluble matter was filtered off. It was reprecipitated again in a large excess of hydrochloric acid / methanol, washed several times with methanol, and then dried in vacuo at 80 ° C./12 hours to obtain a white solid.

(Example 1 ) (Synthesis of Copolymer 4)
Nitrobenzene 40 ml, magnesium sulfate 2.4 g (20 mmol), cuprous chloride 0.26 g (2.7 mmol), pyridine 21.6 ml (0.27 mol) were placed in a two-necked flask containing a stir bar, and 50 ml / min. The mixture was stirred at 25 ° C. for 30 minutes under an oxygen stream. 3.9 g (32 mmol) of 2,6-dimethylphenol, 0.98 g (4.0 mmol) of 2,6-diphenylphenol and 0.59 ml (4.0 mmol) of 2-allyl-6-methylphenol dissolved in 25 ml of nitrobenzene Was then stirred for 90 minutes at 25 ° C. under an oxygen stream of 50 ml / min. After completion of the reaction, the reaction mixture was precipitated in a large excess of hydrochloric acid (10 ml) / methanol (700 ml), washed several times with methanol, dissolved in chloroform, and insoluble matter was filtered off. It was reprecipitated again in a large excess of hydrochloric acid / methanol, washed several times with methanol, and then dried in vacuo at 80 ° C./12 hours to obtain a white solid.

(Example 2 ) (Synthesis of Copolymer 5)
Nitrobenzene 40 ml, magnesium sulfate 2.4 g (20 mmol), cuprous chloride 0.26 g (2.7 mmol), pyridine 21.6 ml (0.27 mol) were placed in a two-necked flask containing a stir bar, and 50 ml / min. The mixture was stirred at 25 ° C. for 30 minutes under an oxygen stream. 3.9 g (32 mmol) of 2,6-dimethylphenol, 0.648 g (4.0 mmol) of 2-methyl-6- (3-methyl-2-butenyl) phenol and 2-allyl-6-6 dissolved in 25 ml of nitrobenzene 0.59 ml (4.0 mmol) of methylphenol was added to the reactor, followed by stirring at 25 ° C. for 90 minutes under an oxygen stream of 50 ml / min. After completion of the reaction, the reaction mixture was precipitated in a large excess of hydrochloric acid (10 ml) / methanol (700 ml), washed several times with methanol, dissolved in chloroform, and insoluble matter was filtered off. It was reprecipitated again in a large excess of hydrochloric acid / methanol, washed several times with methanol, and then dried in vacuo at 80 ° C./12 hours to obtain a white solid.

In each of Reference Examples 1 to 3 and Examples 1 and 2 , 100 g of the copolymer was dissolved in the solvent shown in Table 1 to prepare a varnish having a solid content of 40% by weight. Furthermore, 0.05% by weight of 2,5-dimethyl-2,5- (t-butylperoxy) hexyne-3 (manufactured by NOF Corporation, perhexine 25B) was added as a crosslinking reaction accelerator.

The cured product was characterized by applying the varnish to a polyester film and removing the solvent at 120 ° C. for 10 minutes to obtain a resin powder before crosslinking. The obtained powder was pressed and thermoformed with a press using a spacer having a thickness of 1 mm to obtain a cured resin plate. The molding conditions were a pressure of 2 MPa, 130 ° C./30 minutes, a further temperature increase, and heating at 180 ° C./60 minutes.

  Substrate characteristics were obtained by impregnating the above varnish into E glass cloth (Nittobo, thickness 50 μm) and removing the solvent at 120 ° C. for 10 minutes to obtain a prepreg. Three obtained prepregs were stacked, copper foil (Nihon Electrolysis, thickness 18 μm) was placed on the top and bottom of the prepreg, and pressed and thermoformed with a press to obtain a copper clad laminate. The molding conditions were a pressure of 2 MPa, 130 ° C./30 minutes, a further temperature increase, and heating at 180 ° C./60 minutes.

Table 1 shows the resin compositions, cured products, and substrate characteristics of Reference Examples 1 to 3, Examples 1 and 2, and Comparative Example.

(Comparative example)
As a polymer of 2,6-dimethyl-1,4-phenylene ether, a commercial product manufactured by Aldrich was used.
(Measurement of relative dielectric constant and dielectric loss tangent)
The measurement was performed at 10 GHz by a cavity resonance method (Agilent Technology's 8722ES network analyzer, Kanto Electronics Application Development cavity resonator).
(Glass-transition temperature)
The peak position of tan δ was defined as the transition temperature using a viscoelasticity measuring device (DVA-200 manufactured by IT Measurement Control). The measurement heating rate was 5 ° C./min.
(Solder heat resistance)
In accordance with JIS standard C6481, a 25 × 25 mm square double-sided copper-clad laminate was floated in a 260 ° C. solder bath for 120 seconds, and the sample taken out was examined for swelling, peeling, deformation, warping, and the like.

(Example 3 )
Nitrobenzene 40 ml, magnesium sulfate 2.4 g (20 mmol), cuprous chloride 0.26 g (2.7 mmol), pyridine 21.6 ml (0.27 mol) were placed in a two-necked flask containing a stir bar, and 50 ml / min. The mixture was stirred at 25 ° C. for 30 minutes under an oxygen stream. 3.9 g (32 mmol) of 2,6-dimethylphenol, 0.98 g (4.0 mmol) of 2,6-diphenylphenol and 2,6-bis (3-methyl-2-butenyl) methylphenol dissolved in 25 ml of nitrobenzene 0.9 g (4.0 mmol) was added to the reactor, followed by stirring for 90 minutes at 25 ° C. under an oxygen stream of 50 ml / min.

  After completion of the reaction, the reaction mixture was precipitated in a large excess of hydrochloric acid (10 ml) / methanol (700 ml), washed several times with methanol, dissolved in chloroform, and insoluble matter was filtered off. Again, reprecipitate in a large excess of hydrochloric acid / methanol, wash several times with methanol, and vacuum dry at 80 ° C./12 hours to obtain a white solid, (2,6-dimethylphenyl ether) and (2,6-diiso A copolymer of (pentenylphenyl ether) and (2,6-diphenylphenyl ether) was obtained.

  80 g of the copolymer and 20 g of a styrene-butadiene component (molecular weight 40,000, styrene content 40%, manufactured by Nippon Zeon Co., Ltd.) were dissolved in methyl ethyl ketone to prepare a varnish having a solid content of 40% by weight. Furthermore, 0.05% by weight of 2,5-dimethyl-2,5- (t-butylperoxy) hexyne-3 (manufactured by NOF Corporation, perhexine 25B) was added as a crosslinking reaction accelerator.

  The cured product was characterized by applying the varnish to a polyester film and removing the solvent at 120 ° C. for 10 minutes to obtain a resin powder before crosslinking. The obtained powder was pressed and thermoformed with a press using a spacer having a thickness of 1 mm to obtain a cured resin plate. The molding conditions were a pressure of 2 MPa, 130 ° C./30 minutes, a further temperature increase, and heating at 180 ° C./60 minutes.

Substrate characteristics were obtained by impregnating the above varnish into E glass cloth (Nittobo, thickness 50 μm) and removing the solvent at 120 ° C. for 10 minutes to obtain a prepreg. Three obtained prepregs were stacked, copper foil (Nihon Electrolysis, thickness 18 μm) was placed on the top and bottom of the prepreg, and pressed and thermoformed with a press to obtain a copper clad laminate. The molding conditions were a pressure of 2 MPa, 130 ° C./30 minutes, and a further temperature increase,
Heated at 180 ° C./60 minutes.

  By adding a styrene-butadiene component as the second component, the copper peel strength of the obtained copper-clad laminate showed a very high value of 1.5 kN / m. This is due to the effect that film forming ability, flexibility and adhesiveness can be imparted by blending a rubber component as the second component.

  Measurement method: (copper peel strength) The 90-degree peel strength was measured according to JIS standard C6481.

Hereinafter, the electronic component of the present invention will be described based on required characteristics required for each electronic component.
(1) Semiconductor Device Conventionally, a high-frequency semiconductor element is mounted in a space formed by a base material 1 as shown in FIG. 1 in order to reduce the inter-wiring capacitance that hinders high-frequency operation. The semiconductor chip 3 is sealed by a sealing material 5 and a cover 4 and is manufactured in a hermetic seal type hermetic package having an air layer as an insulating layer. The terminal 6 of the semiconductor chip that is connected to the wire wiring 7 from the side surface of the substrate 1 is exposed.

  In the present invention, a low dielectric constant and low dielectric constant containing a crosslinking component having a predetermined blending ratio, low dielectric constant insulator particles, and optionally containing a high molecular weight material, a flame retardant and a second crosslinking component, a release agent, a colorant and the like. The tangent resin composition is mixed and dispersed in an organic solvent or without a solvent. Then, the semiconductor chip is coated with the low dielectric constant and low dielectric loss tangent resin composition, and if necessary dried and cured, thereby producing a semiconductor device insulated and protected by the low dielectric constant and low dielectric loss tangent resin layer. . The low dielectric constant and low dielectric loss tangent resin composition can be cured by heating at 120 ° C to 240 ° C.

  FIG. 2 shows an example of the high-frequency semiconductor device of the present invention, but the shape is not particularly limited. In FIG. 2, the semiconductor chip 3 is electrically connected to the lead frame 9 by wire wiring 7. The portion of the lead frame 9 on which the semiconductor chip 3, the wire wiring 7 and the semiconductor chip 3 are mounted is sealed with a low dielectric loss resin 8.

According to the present invention, a high-efficiency high-frequency semiconductor device having a high transmission rate and a small dielectric loss can be manufactured by an inexpensive molding method. As a method for forming a low dielectric constant and low dielectric loss tangent insulating layer according to the present invention, there are transfer press, potting and the like, which are appropriately selected according to the shape of the semiconductor device. Although the form of the semiconductor device is not particularly limited, for example, a tape carrier type package, a semiconductor device in which a semiconductor chip is mounted on a wiring substrate on a bare chip, and the like can be given as examples.
(2) Multilayer substrate A dielectric loss tangent is low compared with the conventional thermosetting resin composition. Therefore, a wiring board using this cross-linking component as an insulating layer is a wiring board with low dielectric loss and excellent high frequency characteristics. Hereinafter, a method for producing a multilayer wiring board will be described.

  In the present invention, the prepreg or conductive foil with an insulating layer, which is a starting material for the multilayer wiring board, is prepared as follows. First, a low dielectric loss tangent resin containing a cross-linking component, a high molecular weight material, a low dielectric constant insulator particle or a high dielectric constant insulator particle, a flame retardant and a second cross-linking component, a colorant, etc. The composition is kneaded in a solvent to form a slurry. Thereafter, it is prepared by applying to a substrate such as glass cloth, non-woven fabric, or conductive foil and drying. The prepreg can be used as a core material of a laminated plate, an adhesive layer / insulating layer between the laminated plate and the laminated plate or conductor foil.

  On the other hand, the conductor foil with an insulating layer is used when a conductor layer is formed on the surface of the core material by laminating or pressing. The core material of the present invention is a base material that supports and reinforces a conductive foil with an insulating layer, such as glass cloth, nonwoven fabric, film material, ceramic substrate, glass substrate, epoxy general-purpose resin plate, general-purpose laminated plate, etc. As an example. The solvent used for slurrying is preferably a solvent such as a cross-linking component, a high molecular weight body, a flame retardant, etc., such as dimethylformamide, methyl ethyl ketone, methyl isobutyl ketone, dioxane, tetrahydrofuran, toluene, chloroform, Can be raised. The drying conditions (B stage) of the prepreg and the conductor foil with insulating layer are adjusted according to the solvent used and the thickness of the applied resin layer. For example, when an insulating layer having a dry film thickness of about 50 μm is formed using toluene, the insulating layer may be dried at 80 to 130 ° C. for 30 to 90 minutes. The thickness of a preferable insulating layer is 50-300 micrometers as needed, and it adjusts with the use and required characteristics (wiring pattern size, direct current resistance).

  Hereinafter, an example of producing a multilayer wiring board will be shown. FIG. 3 shows a first example. FIG. 3A: A prepreg 10 having a predetermined thickness and a conductor foil 11 are stacked. The conductor foil to be used is arbitrarily selected from materials having good conductivity such as gold, silver, copper, and aluminum. As for the surface shape, a foil with large irregularities is used when it is necessary to increase the adhesive strength with the prepreg, and a foil having a relatively smooth surface is used when it is necessary to further improve the high frequency characteristics. The thickness of the conductor foil is preferably about 9 to 35 μm from the viewpoint of etching processability. FIG. 3B: A laminated plate 13 having a conductor layer on its surface is obtained by bonding and curing by pressing that heats the prepreg and the conductor foil while pressing them. The heating conditions are preferably 120 to 240 ° C., 1.0 to 10 MPa, and 1 to 3 hours. Further, the temperature and pressure of the press working may be multistage within the above range. The laminate obtained by the present invention exhibits excellent high-frequency transmission characteristics due to the very low dielectric loss tangent of the insulating layer.

  Next, an example of creating a double-sided wiring board will be described. FIG. 3C: A through hole 14 is formed by drilling at a predetermined position of the previously produced laminate. FIG. 3D: A plating film 15 is formed in the through hole by plating, and the front and back conductor foils are electrically connected. FIG. 3E: Conductor wiring 16 is formed by patterning the conductive foils on both sides.

  Next, an example of creating a multilayer wiring board will be described. FIG. 4A: A laminate 13 is prepared using a prepreg having a predetermined thickness and a conductive foil. FIG. 4B: Conductor wiring 16 is formed on both sides of the laminate. FIG. 4C: A prepreg 10 and a conductor foil 11 having a predetermined thickness are superimposed on the laminated board after pattern formation. FIG. 4D: Heating and pressing are performed to form a conductor foil on the outer layer. FIG. 4E; a through hole 14 is formed by drilling at a predetermined position. FIG. 4F; a plating film 15 is formed in the through hole, and the layers are electrically connected. FIG. 4G: Patterning is performed on the outer layer conductor foil to form the conductor wiring 16.

  Next, an example of creating a multilayer wiring board using a copper foil with an insulating layer is shown. FIG. 5A: A conductive foil 18 with an insulating layer having an uncured insulating layer 17 is formed by applying a varnish of the resin composition of the present invention to the conductive foil 11 and drying it. FIG. 5B: The lead terminal 19 and the conductor foil 18 with an insulating layer are stacked. FIG. 5C; the lead terminal 19 and the insulating layer-attached conductor foil 18 are bonded together by press working to form the laminated plate 13. The adhesion between the core material and the insulating layer can be improved by previously coupling or roughening the surface of the core material. FIG. 5D: Conductive wiring 16 is formed by patterning the conductive foil 18 of the laminate 13. FIG. 5E: Conductor foil with an insulating layer is stacked on the laminated board 13 on which wiring is formed. FIG. 5F: The laminated plate 13 and the conductor foil with an insulating layer are bonded by press working. FIG. 5G: A through hole 14 is formed at a predetermined position. FIG. 5H: a plating film 15 is formed in the through hole 14. FIG. 5I: Conductor wiring 16 is formed by patterning the outer layer conductor foil 11.

  Next, an example of producing a multilayer substrate by screen printing is shown. FIG. 6A: The conductor foil of the laminate 13 is patterned to form conductor wiring 16. FIG. 6B: The insulating layer 17 is formed by applying and drying the varnish of the resin composition of the present invention by screen printing. At this time, a resin composition having a partially different dielectric constant can be applied by screen printing, and an insulating layer having a different dielectric constant can be formed in the same plane as the insulating layer 17. FIG. 6C: Conductive foil 11 is superimposed on insulating layer 17 and bonded by pressing. FIG. 6D: a through hole 14 is formed at a predetermined position. FIG. 6E: a plating film 15 is formed in the through hole. FIG. 6F: Conductor wiring 16 is formed by patterning the outer layer conductive foil 11.

  The present invention is not limited to the above example, and various wiring boards can be formed. For example, a plurality of laminates with wiring formed can be laminated at once via prepreg to increase the number of layers, or the layers can be electrically connected by blind via holes formed by laser processing or dry etching processing to build up multilayers A wiring board can also be created. In the production of multilayer wiring boards, the dielectric constant and dielectric loss tangent of each insulating layer can be selected arbitrarily. For the purpose of low dielectric loss, high-speed transmission, miniaturization, cost reduction, etc. by mixing insulating layers with different characteristics. You can combine them accordingly.

  By using the low dielectric loss tangent resin composition of the present invention as an insulating layer, a high frequency electronic component having a small dielectric loss and excellent high frequency characteristics can be obtained. Furthermore, high-performance high-frequency electrical components having various functions can be obtained by incorporating element patterns in the conductor wiring by the method for producing a multilayer wiring board as described above. As an example, a multilayer wiring board having at least one function of a capacitor, an inductor, and an antenna can be manufactured.

Examples of electronic components obtained by combining the present invention with other electronic component materials will be described below. Table 2 shows the composition and characteristics of the resin composition used in the present invention. The composition ratio in the table represents the weight ratio. The name of the reagent used in the examples, the method for preparing the varnish, and the method for evaluating the performance necessary as an electronic material for the resin are described below. In addition, although the copolymer polymer synthesize | combined on the conditions of the reference example 1 and Example 1 was mentioned as an example as a high molecular weight body, the range of this patent is not limited by this.
(Flame retardants)
Hishiguard: Nippon Chemical Industry, red phosphorus particles (Hishiguard TP-A10), average particle size 20 μm
(Low dielectric constant insulator)
Z-36: manufactured by Tokai Kogyo, borosilicate glass balloon (average particle size 56 μm)
(High dielectric constant insulator)
Ba-Ti-based: Barium titanate-based inorganic filler having a dielectric constant of 70 at 1 GHz, density = 5.5 g / cm ³ , and average particle size of 1.5 μm (preparation method of varnish)
A resin composition varnish was prepared by mixing and dispersing a predetermined amount of the resin composition in toluene.
(Measurement of relative dielectric constant and dielectric loss tangent)
It measured at 10 GHz by the cavity resonance method (Agilent Technology 8722ES type network analyzer, Kanto Electronics application development cavity resonator).
(Flame retardance)
The flame retardancy was evaluated according to the UL-94 standard using a sample size of 70 × 3 × 1.5 mm 3.
( Reference Example 4 , Example 4 )
Reference Example 4 and Example 4 are examples of resin compositions obtained by adding red phosphorus particles as a flame retardant to Reference Example 1 and Example 1 . By adding a flame retardant, the resin composition can be made flame retardant, and the safety of electrical components is improved.
( Reference Examples 5 and 6 , Example 5 )
Reference Examples 5 , 6 and Example 5 are examples in which a glass balloon (Z36) was added to Reference Examples 1 and 1 as a low dielectric constant insulator. The dielectric constant decreased from 2.8 to 2.0 with increasing amount of Z36 added. An electrical component using the resin composition for an insulating layer has a small dielectric loss and a high speed transmission property.
(Examples 6 and 7 )
Examples 6 and 7 are examples in which ceramic particles (Ba-Ti system) are added to Example 1 as a high dielectric constant insulator. The dielectric constant increased from 2.8 to 12.1 with increasing Ba-Ti content. An electrical component using the present resin composition for the insulating layer has a small dielectric loss and is a small-sized high-frequency electrical component.

It is sectional drawing which shows the structural example of the conventional high frequency semiconductor device. It is sectional drawing which shows the structural example of the high frequency semiconductor device of this invention. It is a flowchart which shows the example of preparation of the multilayer wiring board of this invention. It is a flowchart which shows the other example of preparation of the multilayer wiring board by this invention. It is a flowchart which shows the other example of preparation of the multilayer wiring board of this invention. It is a flowchart which shows another preparation example of the multilayer wiring board by this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Base material, 2 ... Recessed part, 3 ... Semiconductor chip, 4 ... Cover, 5 ... Sealing material, 6 ... Terminal, 7 ... Wire wiring, 8 ... Low dielectric constant insulating layer, 9 ... Lead frame, 10 ... Prepreg, 11 DESCRIPTION OF SYMBOLS ... Conductive foil, 13 ... Laminated board, 14 ... Through hole, 15 ... Plating film, 16 ... Conductor wiring, 17 ... Insulating layer.

Claims (12)

A low dielectric loss resin for multilayer wiring boards, which is a copolymer composed of repeating units of the formula (1).

Here, X is a repeating unit of the formula (3), R ¹ and R ² are methyl groups, R ^{5 to} R ⁸ are hydrocarbon groups having 2 to 9 carbon atoms, and n, m, r , S is an integer of 1 or more representing the degree of polymerization. At least one of R ^{5 to} R ⁸ has a polymerizable unsaturated bond, and the units having R ¹ and R ² , the units having R ⁵ and R ^6, and the units having R ⁷ and R ⁸ are different from each other.

  The low dielectric loss resin for multilayer wiring boards according to claim 1, wherein the copolymer has a molecular weight of 5,000 to 30,000.   2. The low dielectric loss resin for a multilayer wiring board according to claim 1, wherein the copolymer is soluble in a non-halogen organic solvent having a boiling point of 150 [deg.] C. or less in an amount of 20% by weight or more.   The low dielectric loss resin for multilayer wiring boards according to claim 1, wherein the copolymer has a glass transition point of 220 ° C. or higher.   A low dielectric loss resin composition for multilayer wiring boards, comprising a non-halogen organic solvent having a boiling point of 150 ° C. or lower and the low dielectric loss resin according to claim 1 dissolved in the organic solvent.   Furthermore, the low dielectric loss resin composition for multilayer wiring boards of Claim 5 containing a rubber component. The low dielectric loss resin composition for multilayer wiring boards containing the low dielectric loss resin of Claim 5 or Claim 6 containing 0.01-1 wt% of peroxide as a crosslinking accelerator.   The low dielectric loss resin composition for multilayer wiring boards containing the low dielectric loss resin in any one of Claims 1-7 which contains the flame retardant in an insulating layer.   The insulating layer of the resin composition for multilayer wiring boards according to any one of claims 5 to 8 is selected from low dielectric constant resin particles having an average particle diameter of 0.1 to 100 µm, hollow resin particles, hollow glass balloons, and voids. A low dielectric loss resin composition for multilayer wiring boards, comprising at least one kind of low dielectric constant phase.   The resin composition for a multilayer wiring board according to any one of claims 5 to 9, comprising an insulating layer to which ceramic particles are added as a high dielectric constant insulator. .   A prepreg for a multilayer wiring board produced using the low dielectric loss resin composition according to claim 5 or 6.   The multilayer wiring board manufactured using the prepreg for multilayer wiring boards of Claim 11.

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