JP5336775B2 - Light emitting device - Google Patents

Description

  The present invention relates to a light emitting device using a plurality of LED chips (light emitting diode chips) having different emission colors.

  Conventionally, as a light emitting device in which a desired mixed color light (for example, white light) is obtained using a plurality of LED chips having different emission colors, as shown in FIG. 9, three LED chips having different emission colors are provided. 21 ', 22', 23 ', a mounting substrate 10' on which these three LED chips 21 ', 22', 23 'are mounted on one surface side, and the mounting substrate 10 on the one surface side of the mounting substrate 10'. There has been proposed one including an outer lens 40 ′ disposed so as to surround three LED chips 21 ′, 22 ′, and 23 ′ (see Patent Document 1). In Patent Document 1, the three LED chips 21 ′, 22 ′, and 23 ′ are arranged on one straight line in a plan view, and the upper LED chip 22 ′ in FIG. 9 is a green LED. The chip, the middle LED chip 21 ′ is a red LED chip, and the lower LED chip 23 ′ is a blue LED chip.

The outer lens 40 ′ described above is formed in a quadrangular prism shape, the light incident surface 40a ′ is formed in a concave curved surface shape, and the light emitting surface 40b ′ is formed in a convex curved surface shape. In the light emitting device having the configuration shown in FIG. 9, the outer lens 40 ′ is formed of an acrylic resin to which a light diffusing material such as silica is added.
Japanese Patent Laid-Open No. 10-319871

  By the way, in the light emitting device having the configuration shown in FIG. 9, the light emitted from each of the LED chips 21 ′, 22 ′, and 23 ′ is reflected and mixed by the light diffusing material in the outer lens 40 ′. Can be suppressed.

  However, in the case where a light diffusing material is contained in the outer lens 40 ′ as in the light emitting device having the configuration shown in FIG. 9, the scattering loss due to the light diffusing material is increased, and the light extraction efficiency of the entire light emitting device is increased. Will fall.

  The present invention has been made in view of the above-described reasons, and an object thereof is to provide a light-emitting device capable of suppressing the occurrence of uneven color without using a light diffusing material.

The invention of claim 1, the emission color and a plurality of LED chips having different, a mounting substrate to which the plurality of LED chips are disposed close to each other in one surface, the Te said one surface smell of the implementation substrate a plurality of sealing the lens unit to be radiated forward through L ED chip sealing each said L ED lens function part of the front end side of the light was formed in a convex lens shape from the chip, the one surface side of the implementation substrate collimates the light from each of said L ED chip incident on the light incident surface disposed so as to cover the respective said sealing lens unit in a outer lens leading to the light emitting surface side, the lens function part, the is formed for each LED chip to the convex shape, to characterized in that the rugged structure portion widening the diffusion range of the light from the light emitting surface on each of said L ED tip of the a Utarenzu is formed The

According to the present invention, a plurality of sealing that radiated forward through the front side of the lens function unit light formed in a convex lens shape of each of the LED chips from the sealing to the L ED chip in one surface side of the mounting board a lens unit, directing collimated light from said implementation each said L ED chip in which said substrate is disposed in a manner to cover these sealing lens portion in one surface incident on the light incident surface to the light exit surface side and a outer lens, the lens function part, wherein each LED chip is formed in a convex lens shape, rugged structure portion is formed to widen a diffusion range of light from each of the L ED chip on the light exit surface of the a Utarenzu since it is, it is possible to enhance the directivity of light emitted from each of the L ED chip respectively by the sealing lens unit that has seals each of the L ED chip, Wherein L ED chip light emitted from the sealing lens unit that has sealed respectively guided to the light exit surface side of the A Utarenzu and collimated by the A Utarenzu of the A Utarenzu of the light emitting surface since it is possible to color mixture to expand the diffusion range by the concave convex portions, it is possible to suppress the occurrence of color unevenness without using the light diffusing material.

According to a second aspect of the invention, in the invention of claim 1, wherein the outer lens has a recess for accommodating each said sealing lens unit on the mounting substrate side, by the inner bottom surface and inner surface of the recess The light incident surface is configured to have a function of totally reflecting and collimating light incident on the inner surface of the recess by the outer surface of the outer lens, and the sealing lens portion is more than the lens function portion. The side surface of the chip sealing part on the mounting substrate side is a straight line closer to the optical axis than a virtual curve smoothly continuing to the curve of the lens function part in a cross section including the optical axis of the LED chip. To do.

According to the present invention, as compared with the case where the chip seal portion of each of said sealing lens portion is formed gradually larger shape outer diameter with distance from the lens function part, and the outer surface of the outer lens the optical path length becomes long between the side surface of the switch-up sealing portion of the sealing lens portion, the outer light emitted from the side surface of the switch-up sealing portion of each of said sealing lens unit Collimation is easier on the outer surface of the lens.

  According to a third aspect of the present invention, in the first aspect of the invention, in the sealing lens portion, a chip sealing portion closer to the mounting substrate than the lens function portion is formed in an inverted truncated cone shape, and the chip sealing portion The side surfaces of the light-emitting diode constitute a total reflection surface that totally reflects light from the LED chip.

According to the present invention, the so LED chip light emitted laterally from is totally reflected by the side surface of the chip sealing portion of the sealing lens unit, the Chi-up sealing portion of the sealing lens unit wherein it is possible to reduce the light emitted from the side surface, the light emitted from the sealing lens portion can be efficiently collimated by the outer lens.

  According to a fourth aspect of the present invention, in the first to third aspects of the present invention, the outer lens has a region where light emitted through the lens function portion of the sealing lens portion is incident on the light incident surface. It is characterized by being formed in a convex curved surface that is convex on the mounting substrate side.

  According to the present invention, the light incident surface of the outer lens is incident as compared to the case where the region where the light emitted through the lens function portion of the sealing lens portion is incident is formed in a planar shape. It makes it easier to collimate light.

According to a fifth aspect of the present invention, in the first to fourth aspects of the present invention, a light shielding member for shielding light from each LED chip is disposed between the sealing lens portions.

  According to this invention, it is possible to prevent the light of the LED chip from passing between the sealing lens portions.

According to a sixth aspect of the invention, in the fifth aspect of the invention, the light shielding member is formed of a material that reflects light from each of the LED chips.

  According to this invention, it is possible to prevent an absorption loss from occurring in the light shielding member, and it is possible to increase the light extraction efficiency.

  According to the first aspect of the invention, there is an effect that it is possible to suppress the occurrence of uneven color without using a light diffusing material.

(Embodiment 1)
As shown in FIG. 1, the light-emitting device of the present embodiment includes a plurality of LED chips 20, a mounting substrate 10 in which the plurality of LED chips 20 are arranged close to each other on one surface side, and the above-described mounting substrate 10. A plurality of (four in this embodiment) sealing lens portions 30 each sealing each LED chip 20 on one surface side, and each sealing lens portion 30 covering the one surface side of the mounting substrate 10. The outer lens 40 is provided.

  The light emitting device of the present embodiment uses a red LED chip as the upper right LED chip 20 (21) and a green LED chip as the lower right LED chip 20 (22) in FIG. The blue LED chip is used as the upper left LED chip 20 (23), and the yellow LED chip is used as the lower left LED chip 20 (24). The red light, the green light, the blue light, and the yellow light. White light can be obtained as mixed color light. However, the emission color of each LED chip 20 is not particularly limited, and may be appropriately selected according to a desired mixed color. The number of LED chips 20 is not limited to four, and may be three, for example, LED chips 21, 22, and 23. In this case, white light can also be obtained.

  Further, the mounting substrate 10 is formed in a rectangular plate shape, and a plurality of LED chips 20 are arranged close to the central portion on the one surface side. Here, in the present embodiment, the four LED chips 20 are mounted on the mounting substrate 10, but the center of each of the four LED chips 20 in a plan view corresponds to each of four corners of a virtual square. It is arranged to be. Here, a conductive pattern (not shown) for feeding power to each LED chip 20 is formed on the mounting substrate 10. In addition, when the number of LED chips 20 is three, for example, it is preferable to arrange so that the center of each of the three LED chips 20 is a position corresponding to each of the three vertices of a virtual equilateral triangle in plan view. . More specifically, the plurality of LED chips 20 are preferably arranged so as to have rotational symmetry with respect to a virtual center line passing through the optical axis of the outer lens 40.

  The sealing lens portion 30 is formed in a bullet-like shape as a whole, and radiates light from the LED chips 21, 22, 23, 24 forward through the lens function portion 30a on the front end side formed in a convex lens shape. It has a function. In short, the sealing lens unit 30 has a lens function that enhances the directivity of light emitted from the LED chip 20. Note that the chip sealing portion 30b closer to the mounting substrate 10 than the lens function portion 30a in the sealing lens portion 30 is formed in a shape in which the outer diameter gradually increases as the distance from the lens function portion 30a increases. In the part 30, the convex curved surface of the lens function part 30a formed in a convex lens shape and the side surface of the chip sealing part 30b are smoothly continuous. As a material of the sealing lens unit 30, for example, a light-transmitting material such as epoxy resin, glass, silicone resin, polycarbonate resin, acrylic resin may be employed.

  The outer lens 40 collimates the light from each LED chip 21, 22, 23, 24 incident on the light incident surface 40a and guides it to the light emitting surface 40b side, and each LED chip 21 on the light emitting surface 40b side. , 22, 23, 24 is formed with a concavo-convex structure portion 43 that widens the diffusion range of light. Here, the concavo-convex structure portion 43 has a triangular pyramid shape or a conical peak portion arranged in a two-dimensional array and has a triangular wave cross section. Increase the diffusion range. As a material of the outer lens 40, for example, a light-transmitting material such as acrylic resin, glass, silicone resin, epoxy resin, or polycarbonate resin may be employed.

  The above-described outer lens 40 has a recess 41 that accommodates each sealing lens portion 30 on the mounting substrate 10 side, and the above-described light incident surface 40 a is configured by the inner bottom surface 41 a and the inner side surface 41 b of the recess 41. And is shaped so as to have a function of collimating light incident on the inner bottom surface 41a of the recess 41 and a function of totally reflecting the light incident on the inner surface 41b of the recess 41 by the outer surface 42 and collimating. Is designed. In addition, the dashed-dotted line in Fig.1 (a) has shown the optical path of the light radiated | emitted from LED chip 20. FIG.

Here, the outer lens 40 is formed in a shape in which the outer diameter gradually increases as the distance from the mounting substrate 10 increases, and the outer lens 40 is arranged so that the optical axis coincides with the center of the above-described virtual square. The recess 41 of the outer lens 40 has a circular opening shape, and the inner bottom surface 41a of the recess 41 is a circular plane. The recess 41 of the outer lens 40 is formed so that the opening area gradually increases as the distance from the inner bottom surface 41a increases.

  In the light emitting device of the present embodiment described above, each LED chip 20 is sealed on the one surface side of the mounting substrate 10, and light from the LED chip 20 passes through the lens function part 30 a on the front end side formed in a convex lens shape. A plurality of sealing lens portions 30 that radiate forward and the light from each LED chip 20 incident on the light incident surface 40a arranged so as to cover each sealing lens portion 30 on the one surface side of the mounting substrate 10 are collimated. And the outer lens 40 that leads to the light emitting surface 40b side, and the light emitting surface 40b of the outer lens 40 is formed with the concavo-convex structure portion 43 that widens the diffusion range of light from each LED chip 20, so that each LED The directivity of light emitted from each LED chip 20 can be increased by the sealing lens portion 30 sealing each chip 20, and each L The light emitted from the sealing lens portion 30 sealing each of the D chips 20 is collimated by the outer lens 40 and guided to the light emitting surface 40b side of the outer lens 40, so that the light emitting surface 40b of the outer lens 40 is obtained. Since the uneven structure portion 43 can widen the diffusion range and mix the colors, the occurrence of uneven color can be suppressed without using a light diffusing material.

(Embodiment 2)
The basic configuration of the light emitting device of the present embodiment is substantially the same as that of the first embodiment. As shown in FIGS. 2 and 3, the side surface of the chip sealing portion 30b of the sealing lens portion 30 is the optical axis of the LED chip 20. The difference is that the cross section includes a straight line SL (see FIG. 3) closer to the optical axis of the LED chip 20 than a virtual curve VL (see FIG. 3) smoothly following the curve of the lens function unit 30a. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

  Thus, in the light emitting device of the present embodiment, the outer diameter of the sealing lens portion 30 of each sealing lens portion 30 is increased as compared with the case where the outer diameter is gradually increased as the distance from the lens function portion 30a increases. Even if the optical path length between the outer surface of the lens 40 and the side surface of the chip sealing portion 30b of the sealing lens portion 30 becomes long, and the relative positional deviation between the sealing lens portion 30 and the outer lens 40 occurs, The light emitted from the side surface of the chip sealing portion 30 b of each sealing lens portion 30 is easily collimated by the outer surface 42 of the outer lens 40. In addition, the dashed-dotted line in FIG. 3 has shown the optical path of the light radiated | emitted from LED chip 20. FIG.

  In the light emitting device of the present embodiment, as shown in FIG. 2B, a plurality of sealing lens portions 30 are adjacent to each other so that adjacent sealing lens portions 30 overlap each other. As described above, the connecting portions 31 that are positioned so that the adjacent sealing lens portions 30 do not overlap and connect the adjacent sealing lens portions 30 continuously and integrally may be integrally formed.

(Embodiment 3)
The basic configuration of the light emitting device of this embodiment is substantially the same as that of the first embodiment. As shown in FIG. 5, the chip sealing portion 30a of each sealing lens portion 30 is formed in an inverted truncated cone shape, and the chip sealing is performed. The difference is that the side surface of the stop portion 30b forms a total reflection surface that totally reflects light from the LED chip 20. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

  Thus, in the light emitting device of the present embodiment, the light emitted from the LED chip 20 to the side is totally reflected by the side surface of the chip sealing portion 30b of the sealing lens portion 30, so the chip of the sealing lens portion 30 The light emitted from the side surface of the sealing portion 30b can be reduced, and the light emitted from the sealing lens portion 30 can be efficiently collimated. Note that the alternate long and short dash line in FIG. 5 indicates the optical path of the light emitted from the LED chip 20.

(Embodiment 4)
The basic configuration of the light emitting device of the present embodiment is substantially the same as that of the first embodiment, and is emitted through the lens function part 30a of the sealing lens part 30 in the light incident surface 40a of the outer lens 40 as shown in FIG. The difference is that the light incident region (inner bottom surface 41a of the recess 41) is formed in a convex curved surface that is convex toward the mounting substrate 10 side. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

  Therefore, in the light emitting device of the present embodiment, when the region where the light emitted through the lens function unit 30a of the sealing lens unit 30 is incident is formed in a planar shape in the light incident surface 40a of the outer lens 40. Compared to incident light, it becomes easier to collimate. Note that the alternate long and short dash line in FIG. 6 indicates the optical path of the light emitted from the LED chip 20.

  In other embodiments, the inner bottom surface 41a of the recess 41 of the outer lens 40 may be formed in a convex curved surface.

(Embodiment 5)
The basic configuration of the light emitting device of the present embodiment is substantially the same as that of the first embodiment, and as shown in FIG. 7, a light blocking member 35 that blocks light from the LED chip 20 is disposed between adjacent sealing lens portions 30. Is different. In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 1, and description is abbreviate | omitted.

  The material of the light shielding member 35 may be a light shielding material capable of shielding light from the LED chip 20, and may be, for example, an epoxy resin containing a black filler.

  Therefore, in the light emitting device of this embodiment, since the light shielding member 35 is disposed between the adjacent sealing lens portions 30, the light emitted from the LED chip 20 seals the LED chip 20. It can prevent entering into the sealing lens part 30 adjacent to the sealing lens part 30. FIG. Note that the alternate long and short dash line in FIG. 7 indicates the optical path of the light emitted from the LED chip 20.

(Embodiment 6)
The basic configuration of the light emitting device of the present embodiment is substantially the same as that of the third embodiment. As shown in FIG. 8, a light shielding member 35 is disposed between adjacent sealing lens portions 30, and the light shielding member 35 corresponds to each LED. The difference is that it is made of a material that reflects light from the chip 20 (for example, Al, Ag, etc.). In addition, the same code | symbol is attached | subjected to the component similar to Embodiment 4, and description is abbreviate | omitted.

  Therefore, in the light emitting device of this embodiment, since the light shielding member 35 is disposed between the adjacent sealing lens portions 30, the light emitted from the LED chip 20 seals the LED chip 20. Since it can prevent entering into the sealing lens part 30 adjacent to the sealing lens part 30, and since the light shielding member 35 is formed with the material which reflects the light from each LED chip 20, it is a light shielding member. It is possible to prevent the occurrence of absorption loss at 35 and to increase the light extraction efficiency. Note that the alternate long and short dash line in FIG. 8 indicates the optical path of the light emitted from the LED chip 20.

The light-emitting device of Embodiment 1 is shown, (a) is a schematic sectional drawing, (b) is a principal part schematic plan view. The light-emitting device of Embodiment 2 is shown, (a) is a schematic sectional drawing, (b) is a principal part schematic plan view. It is principal part explanatory drawing of a light-emitting device same as the above. It is a principal part schematic plan view in the other structural example of a light-emitting device same as the above. 6 is a schematic cross-sectional view showing a light emitting device according to Embodiment 3. FIG. 6 is a schematic cross-sectional view showing a light emitting device according to Embodiment 4. FIG. 6 is a schematic cross-sectional view showing a light emitting device according to Embodiment 5. FIG. 10 is a schematic cross-sectional view showing a light emitting device according to Embodiment 6. FIG. The light-emitting device of a prior art example is shown, (a) is a principal part schematic plan view, (b) is a sectional side view.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Mounting substrate 20 LED chip 30 Sealing lens part 30a Lens functional part 30b Chip sealing part 35 Light shielding member 40 Outer lens 40a Light incident surface 40b Light output surface 41 Recess 41a Inner bottom surface 41b Inner side surface 42 Outer side surface 43 Uneven structure part VL Virtual curve SL Straight line

Claims (6)

Sealing the emission color and a plurality of LED chips having different, a mounting substrate to which the plurality of LED chips are disposed close to each other in one surface, said L ED chip respectively Te said one surface smell of the implementation substrate and wherein L ED and a plurality of sealing the lens unit to be radiated forward through the front side of the lens function unit light formed in a convex lens shape from chips, each said sealing lens portion in one surface side of the implementation substrate the arranged so as to cover collimates the light from each of said L ED chip incident on the light incident surface and a outer lens leading to the light emitting surface side, the lens function part, said convex lens for each of the LED chip is formed on the light-emitting apparatus characterized by rugged structure portion widening the diffusion range of light, which are formed from the respective said L ED chip to the light emitting surface of the a Utarenzu. The outer lens has a recess for accommodating each said sealing lens unit on the mounting substrate side, by the inner bottom surface and inner surface of the recess is configured that the light incident surface, the inner of the recess The light incident on the side surface has a function of totally reflecting and collimating the outer surface of the outer lens, and the side surface of the chip sealing portion closer to the mounting substrate than the lens function portion is the sealing lens portion. The light-emitting device according to claim 1, wherein a cross section including the optical axis of the LED chip is a straight line closer to the optical axis than a virtual curve smoothly continuing to the curve of the lens function unit.   In the sealing lens portion, a chip sealing portion closer to the mounting substrate than the lens function portion is formed in an inverted truncated cone shape, and a side surface of the chip sealing portion totally reflects light from the LED chip. The light-emitting device according to claim 1, wherein the light-emitting device constitutes a reflective surface.   The outer lens has a convex curved surface in which a region of the light incident surface on which light emitted through the lens function portion of the sealing lens portion is incident is convex toward the mounting substrate side. The light emitting device according to any one of claims 1 to 3. 5. The light-emitting device according to claim 1, wherein a light-shielding member that shields light from each of the LED chips is disposed between the sealing lens portions. The light-emitting device according to claim 5 , wherein the light shielding member is formed of a material that reflects light from each of the LED chips.

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