JP5335391B2 - Inspection apparatus and inspection method - Google Patents

Description

  The present invention includes an imaging unit for correcting the probing position, performs the correction of the probing position in the inspection object based on the offset amount between the inspection probe and the imaging unit, and causes the inspection probe to be probed. The present invention relates to an inspection apparatus and an inspection method for performing an inspection on an inspection object based on an electrical signal input via a probe.

  As this type of inspection apparatus, a circuit board inspection apparatus disclosed by the applicant in Japanese Patent Application Laid-Open No. 2002-350483 is known. The circuit board inspection apparatus includes a circuit board suction device, a moving mechanism, an inspection probe, a control unit, and the like, and causes the inspection probe to be probed at a predetermined probing position on the circuit board sucked by the circuit board suction device. A predetermined electrical inspection can be performed based on an electrical signal input through the inspection probe. In this case, the probing position where the probe for probing should be probed is stored in advance in the storage unit. However, when the circuit board is attracted to the circuit board suction device, the position shift occurs, or the circuit board is distorted. Therefore, it is necessary to correct the probing position at the time of inspection. For this reason, in this type of circuit board inspection apparatus, a predetermined mark (such as a fiducial mark) provided on the circuit board by attaching an imaging unit to an attachment part (moving body) to which an inspection probe is attached is provided. Based on the difference value between the measured position of the sign obtained from the image pickup unit and the theoretical position of the sign, and the offset amount (separation length) between the inspection probe and the image pickup unit. The probing position is corrected.

On the other hand, since the above-described offset amount may change due to a positional deviation when the inspection probe and the imaging unit are attached to the attachment part and a difference in the shape and size of the inspection probe, inspection of the circuit board (probing) Prior to (position correction), it is necessary to accurately specify (measure) this offset amount. As a method of specifying this type of offset amount, a method using a dedicated substrate provided with a dent sheet (pressure-sensitive sheet) (for example, an interprobe error measuring method disclosed by the applicant in Japanese Patent Laid-Open No. 6-331653) )It has been known. In this type of method, first, the dedicated board is set in a circuit board suction device (fixture), and then the inspection probe is probed at a predetermined probing position on the dedicated board to generate a dent on the dedicated board. . Subsequently, while visually confirming a captured image by the imaging unit, the moving unit is operated to move the imaging unit (attachment unit) to a position where the dent is imaged. Next, the distance of the inspection probe (attachment part) from the predetermined reference position to the probing position described above, and the distance of the imaging part (attachment part) from the reference position to the position of the image pickup part when the dent is imaged The difference value between the two distances is specified as the offset amount.
JP 2002-350483 (page 3, FIG. 1-2) JP-A-6-331653 (page 3, Fig. 1-3)

  However, the conventional circuit board inspection apparatus that specifies the offset amount by the above-described specifying method has the following problems to be solved. That is, this circuit board inspection apparatus requires a process of setting a dedicated board for specifying an offset amount prior to inspection, and resetting a circuit board to be inspected after specifying the offset amount. Moreover, the process of operating a moving mechanism is also required, confirming the captured image by an imaging part visually. For this reason, in the conventional circuit board inspection apparatus that specifies the offset amount by the above-described specifying method, it is difficult to shorten the inspection time and to automate the inspection due to the necessity of these steps. Improvement of the point is desired.

  The present invention has been made in view of such problems to be solved, and a main object of the present invention is to provide an inspection apparatus and an inspection method capable of shortening the inspection time and automating the inspection.

  In order to achieve the above object, an inspection apparatus according to claim 1, wherein an inspection probe for probing the object to be inspected and a moving body to which an imaging unit for correcting a probing position in the object to be inspected are attached within a predetermined movement range. A movement mechanism that moves the movement mechanism, a movement control unit that controls the movement mechanism, and a correction processing unit that corrects the probing position based on an offset amount between the inspection probe and the imaging unit, An inspection apparatus configured to be able to perform an inspection on the inspection object based on an electrical signal input through the inspection probe, wherein the inspection probe and the imaging unit are in a Y-axis direction within the movement range. A first detector that optically detects the passage of the first probe that crosses the first line, the inspection probe, and the imaging unit A second detection unit for optically detecting the passage when the second line crossing the X-axis direction in the movement range crosses the second line, and the movement control unit controls the movement mechanism. The inspection probe and the imaging unit execute a moving process for moving the moving body so as to pass across both the first line and the second line, and the correction processing unit executes the moving process. When the inspection probe is detected by the first detector, the distance from the predetermined position to the movable body along the X-axis direction and the imaging unit is detected by the first detector A first specifying process for specifying a distance along the X-axis direction from the predetermined position to the moving body is performed, and the inspection probe is detected by the second detection unit. The distance along the Y-axis direction from the predetermined position to the moving body when it is performed and the Y-axis direction from the predetermined position to the moving body when the imaging unit is detected by the second detection unit The second specifying process for specifying the distance along the line is executed, and the offset amount is specified based on the distances specified in the both specifying processes.

  The inspection apparatus according to claim 2 is the inspection apparatus according to claim 1, wherein in the movement process, the movement control unit controls the movement mechanism so that the inspection probe and the imaging unit are the first. A first movement process for moving the moving body in one direction along the X-axis direction so as to pass across the line; and the inspection probe and the imaging unit are controlled by the movement mechanism to control the second probe. A second movement process that moves the moving body in one direction along the Y-axis direction so as to pass across the line, and the correction processing unit performs the first movement process when the first movement process is performed. The first specifying process is executed, and the second specifying process is executed when the second movement process is executed.

  The inspection apparatus according to claim 3 is the inspection apparatus according to claim 2, wherein in the movement process, the movement control unit is configured to move the moving body in a direction opposite to the one direction along the X-axis direction. A fourth movement process for continuously moving the moving body in a direction opposite to the one direction along the Y-axis direction. The correction processing unit is continuously executed after execution of the second movement process, and the correction processing unit starts from the predetermined position when the inspection probe is detected by the first detection unit during execution of the third movement process. A distance along the X-axis direction to the moving body and a distance along the X-axis direction from the predetermined position to the moving body when the imaging unit is detected by the first detection unit are specified. Third specific And the distance along the Y-axis direction from the predetermined position to the movable body when the inspection probe is detected by the second detection unit when the fourth movement process is performed. Executing a fourth specifying process of specifying a distance along the Y-axis direction from the predetermined position to the moving body when the imaging unit is detected by the second detecting unit; The offset amount between the center position of the inspection probe and the center position of the imaging unit is specified based on the distances specified in each of the specifying processes from to the fourth specifying process.

  Further, the inspection method according to claim 4, the inspection object to be probed by the inspection object and the moving body to which the imaging unit for correcting the probing position in the inspection object is attached are moved within a predetermined movement range, The probing position is corrected based on an offset amount between the inspection probe and the imaging unit to cause the inspection probe to be probed, and the inspection target is based on an electric signal input through the inspection probe. An inspection method for performing an inspection on a body, wherein both the first line vertically traversing in the Y-axis direction within the movement range and the second line traversing in the X-axis direction within the movement range include the inspection probe and the When the moving process is performed, the moving process is performed to move the moving body so that the imaging unit passes across. When the inspection probe and the imaging unit pass across the first line, optically detect the passage, and when the inspection probe and the imaging unit pass across the second line The passage is optically detected, and when the passage of the inspection probe through the first line is detected, the distance from the predetermined position to the movable body along the X-axis direction and the first line of the imaging unit The first specifying process for specifying the distance along the X-axis direction from the predetermined position to the moving body when the passage of the test is detected is performed, and the passage of the second line of the inspection probe is detected. Whether the distance from the predetermined position to the moving body along the Y-axis direction and the passage of the second line of the imaging unit is detected. Run the second specifying processing for specifying a distance along the Y-axis direction to the movable body, specifying the offset amount based on the respective distances identified respectively in the two specific processing.

  In the inspection apparatus according to claim 1 and the inspection method according to claim 4, when the inspection probe and the imaging unit pass across the first line during the movement process, the passage is optically detected. The first specifying process for specifying the distance along the X-axis direction from the predetermined position at that time to the moving body is executed, and when the inspection probe and the imaging unit pass across the second line, the passage Is detected, and a second specifying process for specifying a distance along the Y-axis direction from the predetermined position to the moving body is executed, and an offset is performed based on the distances specified in both specifying processes. Specify the amount. For this reason, in this inspection apparatus and inspection method, unlike the conventional circuit board inspection apparatus in which the offset amount is specified by the conventional specifying method, the process of attaching and detaching the dedicated board and the image picked up by the image pickup unit It is possible to eliminate the step of operating the moving mechanism while visually confirming the image. Therefore, according to this inspection apparatus and inspection method, it is possible to sufficiently shorten the time required for specifying the offset amount, and hence the inspection time. In addition, since the process of attaching and removing the dedicated substrate and the process of operating the moving mechanism while visually confirming the captured image can be eliminated, it is possible to reliably realize inspection automation.

  In the inspection apparatus according to claim 2, the movement control unit performs a first movement process of moving the moving body in one direction along the X-axis direction and moves the moving body in one direction along the Y-axis direction. The correction processing unit executes the first specifying process at the time of executing the first moving process and executes the second specifying process at the time of executing the second moving process. For this reason, in this inspection apparatus and inspection method, for example, the offset is compared with the configuration and method in which the moving probe is moved so that the inspection probe and the imaging unit obliquely cross the first line and the second line. The amount can be accurately specified.

  In the inspection apparatus according to claim 3, the movement control unit continuously executes the third movement process after the execution of the first movement process and continuously executes the fourth movement process after the execution of the second movement process. The correction processing unit executes the third specifying process when the third movement process is executed, and executes the fourth specifying process when the fourth movement process is executed. For this reason, according to this inspection apparatus, as a result of being able to specify the center position of the inspection probe and the imaging unit based on each distance specified in each specification process from the first specification process to the fourth specification process, Even if the outer diameter of the tip of the inspection probe and the imaging unit is unknown, the offset amount between the center position of the inspection probe and the center position of the imaging unit can be reliably and accurately specified.

  Hereinafter, the best mode of an inspection apparatus and an inspection method according to the present invention will be described with reference to the accompanying drawings.

  First, the configuration of the substrate inspection apparatus 1 shown in FIG. 1 will be described. The substrate inspection apparatus 1 is an example of an inspection apparatus according to the present invention. As shown in the figure, the substrate holding unit 2, the probing mechanisms 3a and 3b (hereinafter also referred to as “probing mechanism 3” when not distinguished), Imaging units 4a and 4b (hereinafter also referred to as “imaging unit 4” when not distinguished), moving mechanism 5, inspection unit 6, storage unit 7, first sensor 8 (first detection unit in the present invention), second sensor 9 (Second detection unit in the present invention) and the control unit 10 are configured to be able to perform a predetermined electrical inspection on the circuit board 100 as the inspection object according to the inspection method according to the present invention.

  The substrate holding unit 2 is configured to be able to place the circuit board 100, and is configured to be able to hold the circuit board 100 placed on the placement surface by suction, for example. The probing mechanism 3 moves the inspection probe 31 in the vertical direction (Z-axis direction) under the control of the control unit 10, and inspects the inspection probe 31 at a predetermined probing position on the circuit board 100 held by the substrate holding unit 2. Probing (contact). In this case, as shown in FIG. 2, the probing mechanisms 3a and 3b are movable plates 53a and 53b of the moving mechanism 5 (movable bodies in the present invention, and hereinafter also referred to as “moving plate 53” when not distinguished). Each is attached. The imaging unit 4 images the circuit board 100 held by the substrate holding unit 2 from above the substrate holding unit 2 under the control of the control unit 10. In this case, as shown in the figure, the imaging unit 4 is attached to a moving plate 53 of the moving mechanism 5, and when the moving plate 53 moves, a predetermined movement is performed together with the probing mechanism 3 (inspection probe 31). Within the range (for example, within the movement range A indicated by the one-dot chain line in the figure), it is moved in the X axis-Y axis direction (the direction of arrow X and the direction of arrow Y shown in the figure).

  As shown in FIG. 2, the moving mechanism 5 includes, as an example, four guide rails 51a to 51d (hereinafter also referred to as “guide rail 51” when not distinguished), and six sliders 52a to 52f (hereinafter not distinguished). (Sometimes also referred to as “slider 52”), and two moving plates 53a and 53b. As shown in the figure, the guide rails 51a and 51b are arranged so as to be separated from each other by a predetermined length and parallel to each other. The sliders 52a and 52c are arranged on the guide rail 51a so as to be movable along the length direction of the guide rail 51a (the direction of the arrow X shown in the figure), and the sliders 52b and 52d are the length direction of the guide rail 51b. The guide rail 51b is movably disposed along the (X-axis direction). The guide rail 51c is orthogonal to the guide rails 51a and 51b, and both ends thereof are fixed to the sliders 52a and 52b. The guide rail 51d is orthogonal to the guide rails 51a and 51b. Both end portions thereof are fixed to the sliders 52c and 52d.

  The slider 52e is disposed on the guide rail 51c so as to be movable along the length direction of the guide rail 51c (the direction of the arrow Y shown in the figure), and the slider 52f is arranged in the length direction (Y-axis direction) of the guide rail 51d. ) Along the guide rail 51d. The moving plate 53a is attached on the slider 52e, and the moving plate 53b is attached on the slider 52f. In this case, when the control unit 10 controls the drive unit (not shown), the sliders 52a to 52d and the guide rails 51c and 51d are moved along the X-axis direction, and the sliders 52e and 52f are moved along the Y-axis direction. Moved. With this configuration, the moving plates 53a and 53b, and the probing mechanism 3 and the imaging unit 4 attached to the moving plates 53a and 53b can be arbitrarily moved in the X-axis and Y-axis directions within the moving range A. It has become.

  The inspection unit 6 performs a predetermined electrical inspection on the circuit board 100 based on the electric signal Si input through the inspection probe 31 probed on the circuit board 100 under the control of the control unit 10. The storage unit 7 stores position data Dp. In this case, the position data Dp includes information indicating the probing position on the circuit board 100 and a fiducial mark M provided on the circuit board 100 (a mark used for alignment when manufacturing the circuit board 100). The information indicating the position of is included. The storage unit 7 also stores offset data Do indicating the offset amount O between the inspection probe 31 and the imaging unit 4 specified by the control unit 10.

  As an example, the first sensor 8 is a transmissive optical sensor, and as shown in FIG. 2, a light emitting unit 81 that emits detection light B1 (for example, laser light) and a light receiving unit that receives the detection light B1. 82. As shown in the figure, the light emitting unit 81 is arranged so that the emitted detection light B1 is vertically cut in the movement range A in the Y-axis direction, and the light receiving unit 82 is arranged at a position where the detection light B1 can be received. It is installed. In this case, the optical path of the detection light B1 emitted by the light emitting unit 81 corresponds to the first line in the present invention. The first sensor 8 passes through the detection light B1 (the optical path of the detection light B1) emitted by the light emitting unit 81 (detection light) when the inspection probe 31 and the imaging unit 4 are moved along the X-axis direction. When B1 is cut off), the passage is detected (detected optically) and a detection signal Sd is output.

  The second sensor 9 is a transmissive optical sensor similar to the first sensor 8, and as shown in FIG. 2, the detection light B2 (hereinafter, when the detection light B1 and the detection light B2 are not distinguished from each other, “ A light emitting unit 91 that emits the detection light B), and a light receiving unit 92 that receives the detection light B2. As shown in the figure, the light emitting unit 91 is arranged so that the emitted detection light B2 crosses in the X-axis direction within the movement range A, and the light receiving unit 92 is arranged at a position where the detection light B2 can be received. It is installed. In this case, the optical path of the detection light B2 emitted by the light emitting unit 91 corresponds to the second line in the present invention. The second sensor 9 is moved when the inspection probe 31 and the imaging unit 4 are moved along the Y-axis direction and pass across the detection light B2 (the optical path of the detection light B2) (the detection light B2 is blocked). The passage is detected (optically detected) and a detection signal Sd is output.

  The control unit 10 controls each unit and each mechanism constituting the substrate inspection apparatus 1 in accordance with an operation of an operation unit (not shown). Specifically, the control unit 10 functions as a movement control unit in the present invention and controls the movement mechanism 5 so that the inspection probe 31 and the imaging unit 4 pass across the detection light B1 and the detection light B2. A moving process for moving the moving plate 53 is executed. Further, the control unit 10 functions as a correction processing unit in the present invention, and executes an offset amount specifying process for specifying the offset amount O between the inspection probe 31 and the imaging unit 4. Further, the control unit 10 causes the imaging unit 4 to image the fiducial mark M of the circuit board 100 held by the substrate holding unit 2 and identifies the fiducial mark M identified from the position of the imaging unit 4 at that time. A correction process for correcting the probing position is executed based on the difference value between the actual measurement position and the theoretical position of the fiducial mark M indicated by the position data Dp and the offset amount O specified by the offset amount specifying process. .

  Next, a method for performing an electrical inspection on the circuit board 100 using the substrate inspection apparatus 1 will be described with reference to the accompanying drawings. In this case, in the initial state, as shown in FIG. 2, the moving plate 53a is located at the initial position P1, the moving plate 53b is the initial position P2 (the initial positions P1 and P2 correspond to the predetermined positions in the present invention, and When not distinguished, it is assumed to be located at “initial position P”).

  Prior to the inspection, the offset amount O between the inspection probe 31 and the imaging unit 4 is specified. Specifically, an operation unit (not shown) is operated to instruct execution of the offset amount specifying process. In response to this, the control unit 10 controls the first sensor 8 to emit the detection light B. Next, the control unit 10 executes a movement process. In this moving process, the control unit 10 first controls the moving mechanism 5 to move the moving plate 53a from the initial position P1 in the direction of the arrow X1 shown in FIG. 2 (one direction along the X-axis direction in the present invention). The first movement process for moving to is executed.

  Subsequently, as shown in FIG. 3, when the end portion on the traveling direction side (right side in this example) at the tip of the inspection probe 31 passes across the detection light B <b> 1 as the moving plate 53 a moves. The first sensor 8 detects the passage and outputs a detection signal Sd. At this time, the control unit 10 specifies the distance T1 along the X-axis direction from the initial position P1 to the moving plate 53a when the detection signal Sd is output. Next, as shown in FIG. 4, when the moving plate 53a is further moved and the end portion on the traveling direction side at the front end portion of the imaging unit 4a passes across the detection light B1, the first sensor 8 The passage is detected and a detection signal Sd is output, and the control unit 10 specifies a distance T2 along the X-axis direction from the initial position P1 to the moving plate 53a at that time. Note that the process of specifying the distance T1 and the distance T2 corresponds to the first specifying process in the present invention.

  Subsequently, as shown in FIG. 5, when both the inspection probe 31 and the imaging unit 4 a have completely passed the detection light B <b> 1, the control unit 10 indicates the direction of the arrow X <b> 2 shown in FIG. A third movement process is performed in which the movement is performed in a direction opposite to one direction along the axial direction. Next, as shown in FIG. 6, when the moving plate 53a moves and the end portion on the traveling direction side (the left side in this example) at the tip of the imaging unit 4a passes across the detection light B1, One sensor 8 detects the passage and outputs a detection signal Sd, and the control unit 10 specifies a distance T3 along the X-axis direction from the initial position P1 to the movable plate 53a at that time.

  Subsequently, as shown in FIG. 7, when the moving plate 53 a is further moved and the end portion on the traveling direction side at the distal end portion of the inspection probe 31 passes across the detection light B <b> 1, the first sensor 8. Detects the passage and outputs a detection signal Sd, and the control unit 10 specifies a distance T4 along the X-axis direction from the initial position P1 to the moving plate 53a at that time. Note that the process of specifying the distance T3 and the distance T4 corresponds to the third specifying process in the present invention. Next, when the moving plate 53a is located at the initial position P1, the control unit 10 controls the moving mechanism 5 to stop the movement of the moving plate 53a.

  Subsequently, the control unit 10 controls the first sensor 8 to stop the emission of the detection light B1 and controls the second sensor 9 to emit the detection light B2. Next, the control unit 10 controls the moving mechanism 5 to move the moving plate 53a from the initial position P1 in the direction of the arrow Y1 shown in FIG. 8 (one direction along the Y-axis direction in the present invention). Execute the move process. Subsequently, as shown in the figure, when the moving plate 53a moves, the end portion on the traveling direction side (the lower side in this example) at the distal end portion of the inspection probe 31 passes across the detection light B2. In addition, the second sensor 9 outputs the detection signal Sd, and the control unit 10 specifies the distance T5 along the Y-axis direction from the initial position P1 to the moving plate 53a at that time. Next, as shown in FIG. 9, when the moving plate 53a is further moved and the end portion on the traveling direction side at the front end portion of the imaging unit 4a passes across the detection light B2, the second sensor 9 Detecting the passage and outputting the detection signal Sd, the control unit 10 specifies a distance T6 along the Y-axis direction from the initial position P1 to the moving plate 53a at that time. Note that the process of specifying the distance T5 and the distance T6 corresponds to the second specifying process in the present invention.

  Subsequently, as shown in FIG. 10, when the inspection probe 31 and the imaging unit 4a completely pass through the detection light B2, the control unit 10 indicates the direction of the arrow Y2 shown in FIG. 10 (Y in the present invention). A fourth movement process is performed in which the movement is performed in a direction opposite to one direction along the axial direction. Next, as shown in FIG. 11, when the moving plate 53a moves and the end portion on the traveling direction side (the upper side in this example) at the tip of the imaging unit 4a passes across the detection light B2, The two sensors 9 detect the passage and output a detection signal Sd, and the control unit 10 specifies a distance T7 along the Y-axis direction from the initial position P1 to the moving plate 53a at that time. Subsequently, as shown in FIG. 12, when the moving plate 53a is further moved and the end portion on the traveling direction side at the distal end portion of the inspection probe 31 passes across the detection light B2, the second sensor 9 is moved. Detects the passage and outputs a detection signal Sd, and the control unit 10 specifies a distance T8 along the Y-axis direction from the initial position P1 to the moving plate 53a at that time. Note that the process of specifying the distance T7 and the distance T8 corresponds to the fourth specifying process in the present invention. Next, when the moving plate 53a is positioned at the initial position P1, the control unit 10 controls the moving mechanism 5 to stop the movement of the moving plate 53a and controls the second sensor 9 to emit the detection light B2. Stop.

  Subsequently, the control unit 10 determines the offset amount based on the distances T1 to T8 specified in the specific processes from the first specific process to the fourth specific process (hereinafter also referred to as “distance T” when not distinguished). Specify O. Here, as shown in FIG. 13, the difference value between the distance T1 and the distance T4 corresponds to the outer diameter of the tip of the inspection probe 31 (the portion that has passed across the detection light B1), and the distance T2 and the distance The difference value from T3 corresponds to the outer diameter of the tip of the imaging unit 4 (the portion that has passed across the detection light B1). For this reason, the control unit 10, as shown in the figure, the imaging unit 4 indicated by the average value of the distance T2 and the distance T3 from the center position of the inspection probe 31 indicated by the average value of the distance T1 and the distance T4. The distance to the center position is calculated, and this distance is specified as an X-axis direction component (hereinafter also referred to as “offset amount Ox”) of the offset amount O from the center of the inspection probe 31 to the center of the imaging unit 4.

  Further, as shown in FIG. 14, the difference value between the distance T5 and the distance T8 corresponds to the outer diameter of the distal end portion of the inspection probe 31 (the portion that has passed through the detection light B2), and the distance T6 and the distance T7. Is equivalent to the outer diameter of the tip of the imaging unit 4 (the portion that has passed across the detection light B2). For this reason, the control unit 10 determines the distance from the center position of the inspection probe 31 indicated by the average value of the distance T5 and the distance T8 to the center position of the imaging unit 4 indicated by the average value of the distance T6 and the distance T7. The distance is calculated and specified as the Y-axis direction component (hereinafter also referred to as “offset amount Oy”) of the offset amount O from the center of the inspection probe 31 to the center of the imaging unit 4. Next, the control unit 10 generates offset data Do indicating the specified offset amount O (offset amount Ox and offset amount Oy) and stores the offset data Do in the storage unit 7. Thus, the specification of the offset amount O between the inspection probe 31 attached to the moving plate 53a and the imaging unit 4a is completed. Subsequently, the control unit 10 specifies the offset amount O between the inspection probe 31 attached to the moving plate 53b and the imaging unit 4b in the same procedure as described above. Thus, the offset amount specifying process ends.

  In this case, in the substrate inspection apparatus 1 and the inspection method, as described above, the inspection plate 31 and the imaging unit 4 are moved through the detection plate B so as to pass through the detection light B (both detection light B1 and B2). At the time of executing the moving process to move, the first specifying process to the fourth specifying process are executed to specify each distance T, and the offset amount O is specified based on each distance T. Therefore, unlike the circuit board inspection apparatus in which the offset amount is specified by the conventional specifying method, the board inspection apparatus 1 and the inspection method are imaged by the process of attaching and removing the dedicated board or by the imaging unit 4. As a result of eliminating the step of operating the moving mechanism 5 while visually confirming the captured image, it is possible to reliably reduce the inspection time and automate the inspection. Moreover, in this board | substrate inspection apparatus 1 and the inspection method, in addition to a 1st specific process and a 2nd specific process, in order to perform a 3rd specific process and a 4th specific process, distance T1, T4 specified in each specific process The center position of the inspection probe 31 can be specified based on T5 and T8, and the center position of the imaging unit 4 can be specified based on the distances T2, T3, T6, and T7. For this reason, even if the outer diameters of the distal ends of the inspection probe 31 and the imaging unit 4 are unknown, it is possible to reliably specify the offset amount O between these centers.

  Next, after the circuit board 100 to be inspected is held by the board holding unit 2, the operation unit is operated to instruct the start of the inspection. In response to this, the control unit 10 reads the position data Dp stored in the storage unit 7. Next, the control unit 10 specifies the position (theoretical position) of the fiducial mark M based on the position data Dp, and then controls the moving mechanism 5 to place the imaging unit 4 above the position. Move. Next, the control unit 10 controls the imaging unit 4 to image the fiducial mark M. Subsequently, the control unit 10 specifies the actual position (measured position) of the fiducial mark M based on the captured image, and specifies the difference value between the theoretical position and the measured position.

  Next, the control unit 10 specifies the probing position based on the position data Dp, reads the offset data Do, specifies the offset amount O, and the theoretical amount in the above-described fiducial mark M and the offset amount O. The probing position is corrected based on the difference value between the position and the actually measured position. Subsequently, the control unit 10 controls the probing mechanism 3 and the moving mechanism 5 to move the inspection probe 31 and to probe the inspection probe 31 to the corrected probing position. Next, the inspection unit 6 performs a predetermined electrical inspection on the circuit board 100 based on the electrical signal Si input through the inspection probe 31 according to the control of the control unit 10. Then, the control part 10 displays the result of the test | inspection by the test | inspection part 6 on the display part outside a figure.

  As described above, in the substrate inspection apparatus 1 and the inspection method, when the inspection probe 31 and the imaging unit 4 pass across the detection light B1 during the movement process, the passage is optically detected and detected. When the first specifying process for specifying the distance T along the X-axis direction from the initial position P to the moving plate 53 is executed, and when the inspection probe 31 and the imaging unit 4 pass across the detection light B2 A second specifying process for optically detecting the passage and specifying a distance T along the Y-axis direction from the initial position P to the moving plate 53 at that time is executed, and each distance specified in each of the specifying processes An offset amount O is specified based on T. For this reason, in this board inspection apparatus 1 and the inspection method, unlike the conventional circuit board inspection apparatus that specifies the offset amount O by the conventional identification method, the process of attaching and removing the dedicated board or the imaging unit 4 It is possible to eliminate the step of operating the moving mechanism 5 while visually confirming the captured image. Therefore, according to the substrate inspection apparatus 1 and the inspection method, the time required for specifying the offset amount O, and hence the inspection time, can be sufficiently shortened. In addition, since the process of attaching and removing the dedicated substrate and the process of operating the moving mechanism 5 while visually confirming the captured image can be eliminated, the automation of the inspection can be realized with certainty.

  In the substrate inspection apparatus 1 and the inspection method, the first movement process for moving the moving plate 53 in one direction along the X-axis direction is performed, and the moving plate 53 in one direction along the Y-axis direction. The second movement process is executed to move the first movement process, and the first identification process is executed when the first movement process is executed, and the second identification process is executed when the second movement process is executed. Therefore, in the substrate inspection apparatus 1 and the inspection method, for example, in comparison with the configuration and method in which the moving probe 53 is moved so that the inspection probe 31 and the imaging unit 4 pass through the detection light B obliquely, The offset amount O can be specified accurately.

  Moreover, in this board | substrate inspection apparatus 1 and the test | inspection method, after execution of a 1st movement process, a 3rd movement process is performed continuously, a 3rd specific process is performed at the time of the execution of the 3rd movement process, and a 2nd movement The fourth movement process is executed continuously after the process is executed, and the fourth specifying process is executed when the fourth movement process is executed. For this reason, according to this board | substrate inspection apparatus 1 and the test | inspection method, as a result of being able to specify the center position of the probe 31 for an inspection and the imaging part 4 based on each distance T specified in each specific process, the probe 31 for an inspection Even if the outer diameter of the tip of the imaging unit 4 is unknown, the offset amount O between the center position of the inspection probe 31 and the center position of the imaging unit 4 can be reliably and accurately specified.

  In addition, this invention is not limited to said structure. For example, although an example using the transmissive first sensor 8 and the second sensor 9 has been described above, a configuration using the reflective first sensor 8 and the second sensor 9 can also be adopted. Moreover, although the example which employ | adopted the 1st sensor 8 and the 2nd sensor 9 which detect using the laser beam as a detection light was mentioned above, the sensor which equipped with LED and detected using light other than a laser, for example was employ | adopted You can also

  In addition, two movement processes of a first movement process for moving the moving plate 53 along the X-axis direction and a second movement process for moving the moving plate 53 along the Y-axis direction are performed, and each movement process is performed. As described above, the configuration and method for separately executing the first specifying process and the second specifying process at the time of execution of the above are described. For example, the first specifying process and the second specifying process are moved in a direction inclined with respect to the X axis direction (Y axis direction). The plate 53 is moved (for example, the moving plate 53a is moved in the direction from the upper left to the lower right in FIG. 2), so that the inspection probe 31 and the imaging unit 4 can detect the detection lights B1 and B2 in one movement process. It is also possible to employ a configuration and a method for executing the first specifying process and the second specifying process at the time of one movement process so as to pass across both.

  Further, for example, when the outer diameters of the distal ends of the inspection probe 31 and the imaging unit 4 are known, the third movement process and the fourth movement process, and the third identification process and the fourth identification process are omitted (performed). A configuration for specifying the offset amount O between the centers of the tips of the inspection probe 31 and the imaging unit 4 based on each distance T specified in the first specifying process and the second specifying process and its known value; The method can also be adopted.

  Moreover, although the example provided with the board | substrate holding part 2 which hold | maintains the circuit board 100 by adsorption | suction was mentioned above, the board | substrate holding part which hold | maintains the circuit board 100 by a clamp is also employable. Moreover, although the example applied to the substrate inspection apparatus 1 for probing two inspection probes 31 has been described above, it can be applied to a substrate inspection apparatus for probing one or more inspection probes 31. It is.

1 is a configuration diagram showing a configuration of a substrate inspection apparatus 1. FIG. 3 is a plan view of the substrate inspection apparatus 1 showing the arrangement of the substrate holding unit 2, the moving mechanism 5, the first sensor 8, and the second sensor 9. FIG. 6 is a first explanatory diagram for explaining an offset amount specifying process at the time of inspecting the circuit board 100. FIG. 10 is a second explanatory diagram for explaining an offset amount specifying process at the time of inspection of the circuit board 100. FIG. FIG. 10 is a third explanatory diagram for explaining an offset amount specifying process at the time of inspecting the circuit board 100. FIG. 10 is a fourth explanatory diagram for explaining an offset amount specifying process at the time of inspecting the circuit board 100. FIG. 10 is a fifth explanatory view for explaining an offset amount specifying process at the time of inspecting the circuit board 100. FIG. 10 is a sixth explanatory diagram for explaining an offset amount specifying process at the time of inspecting the circuit board 100. FIG. 12 is a seventh explanatory diagram for describing an offset amount specifying process at the time of inspecting the circuit board 100. FIG. 10 is an eighth explanatory diagram for describing an offset amount specifying process at the time of inspecting the circuit board 100; FIG. 12 is a ninth explanatory diagram for describing offset amount specifying processing at the time of inspection of circuit board 100; It is a 10th explanatory view for explaining offset amount specific processing at the time of inspection to circuit board. FIG. 12 is an eleventh explanatory diagram for explaining an offset amount specifying process at the time of inspecting the circuit board 100. FIG. 16 is a twelfth explanatory diagram for explaining an offset amount specifying process at the time of inspecting the circuit board 100.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate inspection apparatus 4a, 4b Image pick-up part 5 Movement mechanism 8 1st sensor 9 2nd sensor 10 Control part 31 Inspection probe 53a Movement board 53b Movement board 81 Light emission part 82 Light reception part 91 Light emission part 92 Light reception part 100 Circuit board A Movement Range B1 Detected light B2 Detected light Do Offset data O Offset amount Ox Offset amount Oy Offset amount Si electrical signal T1 to T8 Distance X1 arrow X2 arrow Y1 arrow Y2 arrow

Claims (4)

A moving mechanism for moving a movable body to which an inspection probe to be probed by the inspection object and an imaging unit for correcting a probing position in the inspection object is attached within a predetermined movement range, and a movement control for controlling the movement mechanism And a correction processing unit that corrects the probing position based on an offset amount between the inspection probe and the imaging unit, and based on the electrical signal input through the inspection probe An inspection apparatus configured to be able to execute an inspection on an inspection object,
A first detection unit that optically detects the inspection probe and the imaging unit when the probe and the imaging unit pass across a first line that runs vertically in the Y-axis direction within the movement range;
A second detection unit for optically detecting the inspection probe and the imaging unit when passing through a second line crossing in the X-axis direction within the movement range;
The movement control unit controls the moving mechanism to execute a moving process for moving the moving body so that the inspection probe and the imaging unit pass across both the first line and the second line. And
The correction processing unit includes a distance along the X-axis direction from a predetermined position to the moving body when the inspection probe is detected by the first detection unit during the movement process, and the imaging unit. When the first detection unit detects the distance along the X-axis direction from the predetermined position to the moving body when the first detection unit is detected, the inspection probe is the second The distance along the Y-axis direction from the predetermined position to the moving body when detected by the detecting unit and the distance from the predetermined position to the moving body when the imaging unit is detected by the second detecting unit A second specifying process for specifying a distance along the Y-axis direction is executed, and the offset amount is determined based on the distances specified in the both specifying processes. Inspection apparatus constant to. In the movement process, the movement control unit controls the movement mechanism so that the inspection probe and the imaging unit pass in one direction along the X-axis direction so as to pass across the first line. A first movement process for moving a movable body; and the movement mechanism to control the inspection probe and the imaging unit in one direction along the Y-axis direction so as to pass across the second line. Executing a second movement process for moving the moving body;
The inspection apparatus according to claim 1, wherein the correction processing unit executes the first specifying process when the first moving process is executed, and executes the second specifying process when the second moving process is executed. In the movement process, the movement control unit continuously executes a third movement process for moving the moving body in a direction opposite to the one direction along the X-axis direction after the execution of the first movement process. And continuously executing a fourth movement process for moving the moving body in the direction opposite to the one direction along the Y-axis direction after the execution of the second movement process,
The correction processing unit includes a distance along the X-axis direction from the predetermined position to the moving body when the inspection probe is detected by the first detection unit when the third movement process is performed. While performing the 3rd specific process which specifies the distance along the said X-axis direction from the said predetermined position when the said imaging part is detected by the said 1st detection part to the said mobile body, a said 4th movement process When the inspection probe is detected by the second detection unit, the distance from the predetermined position to the movable body along the Y-axis direction and the imaging unit are detected by the second detection unit. A fourth specifying process that specifies the distance along the Y-axis direction from the predetermined position to the moving body when the first specifying process is performed, and the fourth specifying process is performed from the first specifying process. Inspection device according to claim 2, wherein identifying the offset amount between the center position of the test probe on the basis of the respective distances identified respectively with the center position of the imaging unit in each particular process up. An inspection probe to be probed by the inspection object and a movable body to which an imaging unit for correcting the probing position of the inspection object is attached are moved within a predetermined movement range, and between the inspection probe and the imaging unit. An inspection method for correcting the probing position based on the offset amount of the probe, probing the probe for inspection, and performing an inspection on the inspection object based on an electric signal input through the inspection probe. ,
The movable body so that the inspection probe and the imaging unit pass across both the first line vertically running in the Y-axis direction within the moving range and the second line crossing in the X-axis direction within the moving range. Execute the move process to move
When the movement process is performed, the inspection probe and the imaging unit optically detect the passage when the inspection probe and the imaging unit pass across the first line, and the inspection probe and the imaging unit detect the second line. When it passes across the line, it detects the passage optically,
The distance along the X-axis direction from the predetermined position when the passage of the first probe of the inspection probe is detected and the predetermined time when the passage of the first line of the imaging unit is detected. The first specifying process for specifying the distance from the position to the moving body along the X-axis direction is performed, and the movement from the predetermined position when the passage of the inspection probe through the second line is detected A second specifying a distance along the Y-axis direction to the body and a distance along the Y-axis direction from the predetermined position to the moving body when the passage of the second line of the imaging unit is detected An inspection method for executing the specifying process and specifying the offset amount based on the distances specified in the two specifying processes.

Images