JP5187808B2 - Conductivity imparting agent and conductive material - Google Patents
Conductivity imparting agent and conductive material Download PDFInfo
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- JP5187808B2 JP5187808B2 JP2007000156A JP2007000156A JP5187808B2 JP 5187808 B2 JP5187808 B2 JP 5187808B2 JP 2007000156 A JP2007000156 A JP 2007000156A JP 2007000156 A JP2007000156 A JP 2007000156A JP 5187808 B2 JP5187808 B2 JP 5187808B2
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- 239000004020 conductor Substances 0.000 title claims description 30
- 239000003795 chemical substances by application Substances 0.000 claims description 71
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- KTQDYGVEEFGIIL-UHFFFAOYSA-N n-fluorosulfonylsulfamoyl fluoride Chemical class FS(=O)(=O)NS(F)(=O)=O KTQDYGVEEFGIIL-UHFFFAOYSA-N 0.000 claims description 22
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- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 4
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- 229910052744 lithium Inorganic materials 0.000 description 4
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- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
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- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
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- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 1
- SPBDXSGPUHCETR-JFUDTMANSA-N 8883yp2r6d Chemical compound O1[C@@H](C)[C@H](O)[C@@H](OC)C[C@@H]1O[C@@H]1[C@@H](OC)C[C@H](O[C@@H]2C(=C/C[C@@H]3C[C@@H](C[C@@]4(O[C@@H]([C@@H](C)CC4)C(C)C)O3)OC(=O)[C@@H]3C=C(C)[C@@H](O)[C@H]4OC\C([C@@]34O)=C/C=C/[C@@H]2C)/C)O[C@H]1C.C1C[C@H](C)[C@@H]([C@@H](C)CC)O[C@@]21O[C@H](C\C=C(C)\[C@@H](O[C@@H]1O[C@@H](C)[C@H](O[C@@H]3O[C@@H](C)[C@H](O)[C@@H](OC)C3)[C@@H](OC)C1)[C@@H](C)\C=C\C=C/1[C@]3([C@H](C(=O)O4)C=C(C)[C@@H](O)[C@H]3OC\1)O)C[C@H]4C2 SPBDXSGPUHCETR-JFUDTMANSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
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- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
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- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
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- 239000011737 fluorine Substances 0.000 description 1
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- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
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- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 1
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- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- VDVLPSWVDYJFRW-UHFFFAOYSA-N lithium;bis(fluorosulfonyl)azanide Chemical compound [Li+].FS(=O)(=O)[N-]S(F)(=O)=O VDVLPSWVDYJFRW-UHFFFAOYSA-N 0.000 description 1
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Landscapes
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
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Description
本発明は、熱可塑性樹脂、紫外線硬化剤、ゴム、エラストマー又は粘着剤などに添加し、樹脂あるいは基材等に導電性を付与するために用いる導電性付与剤及び該導電性付与剤が添加されてなる導電性材料に関する。 In the present invention, a conductivity imparting agent used for imparting conductivity to a resin or a substrate is added to a thermoplastic resin, an ultraviolet curing agent, rubber, an elastomer or an adhesive, and the conductivity imparting agent is added. It relates to a conductive material.
熱可塑性樹脂、紫外線硬化剤、ゴム、エラストマー又は粘着剤等に導電性付与剤が添加されてなる導電性材料は、防塵シート、帯電防止フィルム、除電マット、帯電防止床材などの導電性シート、電子写真式プリンターや複写機の導電性ロール（帯電ロール、現像ロール、転写ロールなど）、磁気記録媒体用基材、半導体用素材、液晶ディスプレイなどの保護フィルムなどに用いられている。 A conductive material obtained by adding a conductivity-imparting agent to a thermoplastic resin, an ultraviolet curing agent, rubber, an elastomer, or an adhesive is a conductive sheet such as a dustproof sheet, an antistatic film, a static elimination mat, an antistatic flooring, It is used for conductive rolls (charging rolls, developing rolls, transfer rolls, etc.) of electrophotographic printers and copying machines, base materials for magnetic recording media, semiconductor materials, protective films for liquid crystal displays, and the like.
従来、導電性付与剤に使用されるイオン導電剤として、過塩素酸リチウムが知られている（例えば特許文献１参照）。過塩素酸リチウムは、他のイオン導電剤と比較して帯電防止性、すなわち導電性に優れ、さらに安価であるためコスト的に非常に有利なイオン導電剤であるが、該化合物は消防法に定める危険物第１類に属する酸化性固体であり、可燃物と混合すると発熱、発火の危険性があるため、取り扱い上、特段の注意を要し、樹脂等への添加量が制限される。すなわち、導電性に優れた導電性材料を得るべく、高濃度の過塩素酸リチウムを添加した導電性付与剤の製造は、安全面から困難を伴うものである。 Conventionally, lithium perchlorate is known as an ionic conductive agent used for a conductivity imparting agent (see, for example, Patent Document 1). Lithium perchlorate is an ionic conductive agent that is very advantageous in terms of cost because it is superior in antistatic property, that is, conductivity, and is cheaper than other ionic conductive agents. Since it is an oxidizable solid belonging to the first class of hazardous materials and there is a risk of heat generation and ignition when mixed with combustible materials, special care is required in handling, and the amount added to the resin is limited. That is, in order to obtain a conductive material having excellent conductivity, it is difficult to produce a conductivity imparting agent to which a high concentration of lithium perchlorate is added.
近年、イオン導電剤として、ビス（トリフルオロメタンスルホニル）イミド酸リチウムやトリス（トリスフルオロメタンスルホニル）メタン酸リチウム等の含フッ素有機アニオン塩類を用いた導電性付与剤が提案されている（例えば特許文献２参照）。該化合物は、比較的導電性が良好で、相溶性が良いなど導電性材料として優れた特性を有している。しかし近年では更に高い導電性を有する導電性材料の開発が望まれている。 In recent years, conductivity imparting agents using fluorine-containing organic anion salts such as lithium bis (trifluoromethanesulfonyl) imidoate and lithium tris (trisfluoromethanesulfonyl) methanoate have been proposed (for example, patent documents). 2). The compound has excellent properties as a conductive material, such as relatively good conductivity and good compatibility. However, in recent years, development of a conductive material having higher conductivity has been desired.
本発明の目的は、熱可塑性樹脂、紫外線硬化剤、ゴム、エラストマーまたは粘着剤などへ混練する際に、相溶性良く簡便に混練することができ、非常に高い導電性を付与させることができる導電性付与剤及び導電性材料を提供することである。また、該導電性材料を使用し、ブリード等発生せず、安定性に優れた導電性部材、導電性フィルムを提供することにある。 The object of the present invention is to conduct kneading into thermoplastic resins, ultraviolet curing agents, rubbers, elastomers or pressure-sensitive adhesives, and the like, which can be easily kneaded with good compatibility and can impart very high conductivity. It is providing a property imparting agent and a conductive material. Another object of the present invention is to provide a conductive member and a conductive film that are excellent in stability and that do not generate bleed or the like using the conductive material.
前記課題に鑑み、本発明者らは鋭意検討した結果、イオン導電剤として、ビス（フルオロスルホニル）イミド塩をポリエーテルポリオールに溶解させてなる導電性付与剤が、前記課題を解決し得ることを見いだし、本発明を完成するに至った。 In view of the above problems, the present inventors have intensively studied. As a result, a conductivity imparting agent obtained by dissolving a bis (fluorosulfonyl) imide salt in a polyether polyol as an ionic conductive agent can solve the above problems. As a result, the present invention has been completed.
すなわち本発明は、以下の（１）〜（１２）に示すものである。 That is, this invention is shown to the following (1)-(12).
（１）下記一般式〔１〕 (1) The following general formula [1]
で示されるビス（フルオロスルホニル）イミド塩が、ポリエーテルポリオールに溶解されてなる導電性付与剤。
The electroconductivity imparting agent formed by melt | dissolving the bis (fluoro sulfonyl) imide salt shown by polyether polyol.
（２）前記Ｍが、リチウム、ナトリウム、カリウムからなる群から選ばれる少なくとも１つであることを特徴とする前記（１）に記載の導電性付与剤。 (2) The conductivity-imparting agent according to (1), wherein M is at least one selected from the group consisting of lithium, sodium, and potassium.
（３）前記Ｍが、下記一般式〔２〕 (3) Said M is the following general formula [2]
及び下記一般式〔３〕
And the following general formula [3]
からなる群から選ばれる少なくとも１つであることを特徴とする前記（１）に記載の導電性付与剤。
The conductivity-imparting agent according to (1), wherein the conductivity-imparting agent is at least one selected from the group consisting of:
（４）前記ポリエーテルポリオールが、ポリオキシエチレングリコール、ポリオキシプロピレングリコール、ポリテトラメチレンエーテルグリコール、ポリオキシエチレングリコール−ポリオキシプロピレングリコールブロック共重合体及びポリエチレン主鎖とポリオキシアルキレングリコール側鎖で構成されるポリエーテルポリオールからなる群から選ばれる少なくとも１種であることを特徴とする前記（１）〜（３）のいずれかに記載の導電性付与剤。 (4) The polyether polyol is polyoxyethylene glycol, polyoxypropylene glycol, polytetramethylene ether glycol, polyoxyethylene glycol-polyoxypropylene glycol block copolymer, polyethylene main chain, and polyoxyalkylene glycol side chain. It is at least 1 sort (s) chosen from the group which consists of comprised polyether polyol, The electroconductivity imparting agent in any one of said (1)-(3) characterized by the above-mentioned.
（５）前記ビス（フルオロスルホニル）イミド塩が、前記ポリエーテルポリオール中に１〜５０重量％の範囲で含有されてなることを特徴とする前記（１）〜（４）のいずれかに記載の導電性付与剤。 (5) The bis (fluorosulfonyl) imide salt is contained in the polyether polyol in a range of 1 to 50% by weight, according to any one of (1) to (4), Conductivity imparting agent.
（６）熱可塑性樹脂１００重量部に、前記（１）〜（５）のいずれかに記載の導電性付与剤が０．１〜５０重量部添加されてなることを特徴とする導電性材料。 (6) A conductive material obtained by adding 0.1 to 50 parts by weight of the conductivity imparting agent according to any one of (1) to (5) to 100 parts by weight of a thermoplastic resin.
（７）ゴム又はエラストマー１００重量部に、前記（１）〜（５）のいずれかに記載の導電性付与剤が０．１〜５０重量部添加されてなることを特徴とする導電性材料。 (7) A conductive material obtained by adding 0.1 to 50 parts by weight of the conductivity-imparting agent according to any one of (1) to (5) to 100 parts by weight of rubber or elastomer.
（８）紫外線硬化剤１００重量部に、前記（１）〜（５）のいずれかに記載の導電性付与剤が０．１〜５０重量部添加されてなることを特徴とする導電性材料。 (8) A conductive material obtained by adding 0.1 to 50 parts by weight of the conductivity imparting agent according to any one of (1) to (5) to 100 parts by weight of an ultraviolet curing agent.
（９）粘着剤１００重量部に、前記（１）〜（５）のいずれかに記載の導電性付与剤が０．１〜５０重量部添加されてなることを特徴とする導電性材料。 (9) A conductive material obtained by adding 0.1 to 50 parts by weight of the conductivity-imparting agent according to any one of (1) to (5) to 100 parts by weight of an adhesive.
（１０）前記（６）〜（９）のいずれかに記載の導電性材料を成型してなることを特徴とする導電性部材。 (10) A conductive member formed by molding the conductive material according to any one of (6) to (9).
（１１）前記（６）〜（９）のいずれかに記載の導電性材料を、有機溶剤に溶解してなることを特徴とするコーティング剤。 (11) A coating agent obtained by dissolving the conductive material according to any one of (6) to (9) in an organic solvent.
（１２）前記（１１）に記載のコーティング剤を基材上に塗布乾燥して形成されてなることを特徴とするコーティング組成物。 (12) A coating composition formed by applying and drying the coating agent according to (11) on a substrate.
本発明の導電性付与剤は、イオン導電剤としてビス（フルオロスルホニル）イミド塩が含有されてなり、これを用いたことにより、樹脂等への相溶性、特にポリエーテルポリオールとの相溶性に優れた導電性付与剤が得られ、該導電性付与剤を含んだ導電性材料は、樹脂あるいはゴム表面へのブリードによる汚染が低減されるという効果を有する。その上、該導電性付与剤を用いた導電性材料は導電性が非常に高く、極めて優れた電気特性を発現し、また従来知られているイオン導電剤に比べ樹脂への添加量を低減できるため経済性にも優れる。 The conductivity-imparting agent of the present invention contains a bis (fluorosulfonyl) imide salt as an ionic conductive agent. By using this, the compatibility with a resin or the like, particularly with a polyether polyol is excellent. In addition, the conductivity imparting agent is obtained, and the conductive material containing the conductivity imparting agent has an effect of reducing contamination due to bleeding on the resin or rubber surface. In addition, the conductive material using the conductivity-imparting agent has very high conductivity, exhibits extremely excellent electrical characteristics, and can reduce the amount added to the resin compared to conventionally known ionic conductive agents. Therefore, it is excellent in economic efficiency.
以下、本発明の導電性付与剤について詳細に説明する。 Hereinafter, the conductivity imparting agent of the present invention will be described in detail.
本発明でいう導電性付与剤とは、イオン導電剤をポリエーテルポリオールに溶解させたものである。 The conductivity imparting agent referred to in the present invention is obtained by dissolving an ionic conductive agent in a polyether polyol.
本発明は、イオン導電剤として、下記一般式〔１〕で表されるビス（フルオロスルホニル）イミド塩がポリエーテルポリオールに溶解されてなることを特徴とする導電性付与剤である。ビス（フルオロスルホニル）イミド塩は導電性、耐熱性に優れ、また、樹脂等との相溶性、特にポリエーテルポリオールとの相溶性に優れる。 The present invention is a conductivity-imparting agent obtained by dissolving a bis (fluorosulfonyl) imide salt represented by the following general formula [1] as an ionic conductive agent in a polyether polyol. The bis (fluorosulfonyl) imide salt is excellent in conductivity and heat resistance, and is excellent in compatibility with resins and the like, particularly in compatibility with polyether polyols.
一般式〔１〕 General formula [1]
ビス（フルオロスルホニル）イミド塩における前記カチオン成分としては特に制限がないが、特にリチウム、ナトリウム、カリウムからなる群から選ばれる少なくとも１つのアルカリ金属であることが好ましい。 The cation component in the bis (fluorosulfonyl) imide salt is not particularly limited, but is preferably at least one alkali metal selected from the group consisting of lithium, sodium, and potassium.
また、前記カチオン成分が、下記一般式〔２〕又は〔３〕で表されるビス（フルオロスルホニル）イミド塩も特に好適に用いることができる。 Further, a bis (fluorosulfonyl) imide salt in which the cation component is represented by the following general formula [2] or [3] can also be particularly preferably used.
一般式〔２〕 General formula [2]
一般式〔３〕 General formula [3]
（式中、Ｒ３は炭素数１〜１８のアルキル基又は炭素数１〜１８のハロゲン化アルキル基を示し、Ｒ４及びＲ５はそれぞれ同一であっても異なっていてもよい水素、炭素数１〜４のアルキル基又は炭素数１〜４のハロゲン化アルキル基を示す。） (In the formula, R 3 represents an alkyl group having 1 to 18 carbon atoms or a halogenated alkyl group having 1 to 18 carbon atoms, and R 4 and R 5 may be the same as or different from each other, hydrogen or carbon number. (A 1-4 alkyl group or a C1-C4 halogenated alkyl group is shown.)
本発明に用いられる一般式〔２〕で表されるカチオンとしては、Ｎ−イソプロピル−３−メチルピリジニウムイオン、Ｎ−イソプロピル−４−メチルピリジニウムイオン、Ｎ−イソプロピル−３−エチルピリジニウムイオン、Ｎ−イソプロピル−４−エチルピリジニウムイオン、Ｎ−ｎ−プロピル−３−メチルピリジニウムイオン、Ｎ−ｎ−プロピル−４−メチルピリジニウムイオン、Ｎ−ｎ−プロピル−３−エチルピリジニウムイオン、Ｎ−ｎ−プロピル−４−エチルピリジニウムイオン、Ｎ−ｎ−ブチル−３−メチルピリジニウムイオン、Ｎ−ｎ−ブチル−４−メチルピリジニウムイオン、Ｎ−ｎ−ブチル−３−エチルピリジニウムイオン、Ｎ−ｎ−ブチル−４−エチルピリジニウムイオン、Ｎ−エチル−３−メチルピリジニウムイオン、Ｎ−エチル−４−メチルピリジニウムイオン、Ｎ−エチル−３−エチルピリジニウムイオン、Ｎ−エチル−４−エチルピリジニウムイオン、Ｎ−ｎ−ヘキシル−３−メチルピリジニウムイオン、Ｎ−ｎ−ヘキシル−４−メチルピリジニウムイオン、Ｎ−ｎ−ヘキシル−３−エチルピリジニウムイオン、Ｎ−ｎ−ヘキシル−４−エチルピリジニウムイオン、Ｎ−ｎ−オクチル−３−メチルピリジニウムイオン、Ｎ−ｎ−オクチル−４−メチルピリジニウムイオン、Ｎ−ｎ−オクチル−３−エチルピリジニウムイオン、Ｎ−ｎ−オクチル−４−エチルピリジニウムイオン、Ｎ−ｎ−ドデシル−３−メチルピリジニウムイオン、Ｎ−ｎ−ドデシル−４−メチルピリジニウムイオン、Ｎ−ｎ−ドデシル−３−エチルピリジニウムイオン、Ｎ−ｎ−ドデシル−４−エチルピリジニウムイオン、Ｎ−ｎ−オクタデシル−３−メチルピリジニウムイオン、Ｎ−ｎ−オクタデシル−４−メチルピリジニウムイオン、Ｎ−ｎ−オクタデシル−３−エチルピリジニウムイオン、Ｎ−ｎ−オクタデシル−４−エチルピリジニウムイオン、Ｎ−イソプロピルピリジニウムイオン、Ｎ−ｎ−ブチルピリジニウムイオン、Ｎ−ｎ−ヘキシルピリジニウムイオン、Ｎ−ｎ−オクチルピリジニウムイオンなどが挙げられるが、本発明はこれらに限定されるものではない。また、上記カチオンのうち特に、Ｎ−イソプロピル−３−メチルピリジニウムイオン、Ｎ−イソプロピル−４−メチルピリジニウムイオン、Ｎ−ｎ−プロピル−３−メチルピリジニウムイオン、Ｎ−ｎ−プロピル−４−メチルピリジニウムイオン、Ｎ−ｎ−ブチル−３−メチルピリジニウムイオン、Ｎ−ｎ−ブチル−４−メチルピリジニウムイオン、Ｎ−エチル−３−メチルピリジニウムイオン、Ｎ−エチル−４−メチルピリジニウムイオンはピリジン環のアルキル基が短く、且つピリジン環窒素のアルキル基が適度の長さである為マトリックスポリマーへのアンカー効果が適度に小さいことなどから、カチオンの輸率が大きく高い導電率が得られる。 Examples of the cation represented by the general formula [2] used in the present invention include N-isopropyl-3-methylpyridinium ion, N-isopropyl-4-methylpyridinium ion, N-isopropyl-3-ethylpyridinium ion, N- Isopropyl-4-ethylpyridinium ion, Nn-propyl-3-methylpyridinium ion, Nn-propyl-4-methylpyridinium ion, Nn-propyl-3-ethylpyridinium ion, Nn-propyl- 4-ethylpyridinium ion, Nn-butyl-3-methylpyridinium ion, Nn-butyl-4-methylpyridinium ion, Nn-butyl-3-ethylpyridinium ion, Nn-butyl-4- Ethylpyridinium ion, N-ethyl-3-methylpyridinium ion N-ethyl-4-methylpyridinium ion, N-ethyl-3-ethylpyridinium ion, N-ethyl-4-ethylpyridinium ion, Nn-hexyl-3-methylpyridinium ion, Nn-hexyl-4- Methylpyridinium ion, Nn-hexyl-3-ethylpyridinium ion, Nn-hexyl-4-ethylpyridinium ion, Nn-octyl-3-methylpyridinium ion, Nn-octyl-4-methylpyridinium ion Ion, Nn-octyl-3-ethylpyridinium ion, Nn-octyl-4-ethylpyridinium ion, Nn-dodecyl-3-methylpyridinium ion, Nn-dodecyl-4-methylpyridinium ion, Nn-dodecyl-3-ethylpyridinium ion, Nn-do Sil-4-ethylpyridinium ion, Nn-octadecyl-3-methylpyridinium ion, Nn-octadecyl-4-methylpyridinium ion, Nn-octadecyl-3-ethylpyridinium ion, Nn-octadecyl- Examples include 4-ethylpyridinium ion, N-isopropylpyridinium ion, Nn-butylpyridinium ion, Nn-hexylpyridinium ion, and Nn-octylpyridinium ion, but the present invention is not limited thereto. is not. Among the cations mentioned above, in particular, N-isopropyl-3-methylpyridinium ion, N-isopropyl-4-methylpyridinium ion, Nn-propyl-3-methylpyridinium ion, Nn-propyl-4-methylpyridinium ion Ion, Nn-butyl-3-methylpyridinium ion, Nn-butyl-4-methylpyridinium ion, N-ethyl-3-methylpyridinium ion, N-ethyl-4-methylpyridinium ion is alkyl of pyridine ring Since the group is short and the alkyl group of the nitrogen in the pyridine ring has an appropriate length, the anchor effect on the matrix polymer is moderately small. Therefore, the conductivity of the cation is large and a high conductivity can be obtained.
本発明に用いられる一般式〔３〕で表されるカチオンとしては、Ｎ−イソプロピル−３，４−ジメチル−ピリジニウムイオン、Ｎ−イソプロピル−３−エチル−４−メチルピリジニウムイオン、Ｎ−ｎ−プロピル−３，４−ジメチルピリジニウムイオン、Ｎ−ｎ−プロピル−３−エチル−４−メチルピリジニウムイオン、Ｎ−ｎ−ブチル−３，４−ジメチルピリジニウムイオン、Ｎ−ｎ−ブチル−３−エチル−４−メチルピリジニウムイオン、Ｎ−エチル−３，４−ジメチルピリジニウムイオン、Ｎ−エチル−３−エチル−４−メチルピリジニウムイオン、Ｎ−ｎ−ヘキシル−３，４−ジメチルピリジニウムイオン、Ｎ−ｎ−ヘキシル−３−エチル−４−メチルピリジニウムイオン、Ｎ−ｎ−オクチル−３，４−ジメチルピリジニウムイオン、Ｎ−ｎ−オクチル−３−エチル−４−メチルピリジニウムイオン、Ｎ−ｎ−ドデシル−３，４−ジメチルピリジニウムイオン、Ｎ−ｎ−ドデシル−３−エチル−４−メチルピリジニウムイオン、Ｎ−ｎ−オクタデシル−３，４−ジメチルピリジニウムイオン、Ｎ−ｎ−オクタデシル−３−エチル−４−メチルピリジニウムイオンなどが挙げられるが、本発明はこれらに限定されるものではない。また、上記カチオンのうち特に、Ｎ−イソプロピル−３，４−ジメチル−ピリジニウムイオン、Ｎ−ｎ−プロピル−３，４−ジメチルピリジニウムイオン、Ｎ−ｎ−ブチル−３，４−ジメチルピリジニウムイオン、Ｎ−エチル−３，４−ジメチルピリジニウムイオンはピリジン環のアルキル基が短く、且つピリジン環窒素のアルキル基が適度の長さである為マトリックスポリマーへのアンカー効果が適度に小さいことなどから、カチオンの輸率が大きく高い導電率が得られる。 Examples of the cation represented by the general formula [3] used in the present invention include N-isopropyl-3,4-dimethyl-pyridinium ion, N-isopropyl-3-ethyl-4-methylpyridinium ion, and Nn-propyl. -3,4-dimethylpyridinium ion, Nn-propyl-3-ethyl-4-methylpyridinium ion, Nn-butyl-3,4-dimethylpyridinium ion, Nn-butyl-3-ethyl-4 -Methylpyridinium ion, N-ethyl-3,4-dimethylpyridinium ion, N-ethyl-3-ethyl-4-methylpyridinium ion, Nn-hexyl-3,4-dimethylpyridinium ion, Nn-hexyl -3-Ethyl-4-methylpyridinium ion, Nn-octyl-3,4-dimethylpyridinium ion Nn-octyl-3-ethyl-4-methylpyridinium ion, Nn-dodecyl-3,4-dimethylpyridinium ion, Nn-dodecyl-3-ethyl-4-methylpyridinium ion, Nn- Examples include octadecyl-3,4-dimethylpyridinium ion and Nn-octadecyl-3-ethyl-4-methylpyridinium ion, but the present invention is not limited to these. Among the above cations, particularly, N-isopropyl-3,4-dimethyl-pyridinium ion, Nn-propyl-3,4-dimethylpyridinium ion, Nn-butyl-3,4-dimethylpyridinium ion, N -Ethyl-3,4-dimethylpyridinium ion has a short alkyl group on the pyridine ring and a moderate length of the alkyl group on the pyridine ring nitrogen. Large transport number and high conductivity can be obtained.
前記ビス（フルオロスルホニル）イミド塩は安定性が高く、発熱、発火等の危険性がなく、ポリエーテルポリオールに溶解させることにより、安全性が高く、相溶性に優れ、高導電性の導電性付与剤が得られる。 The bis (fluorosulfonyl) imide salt is highly stable and has no danger of heat generation, ignition, etc., and is dissolved in a polyether polyol to provide high safety, excellent compatibility, and high conductivity. An agent is obtained.
前記ポリエーテルポリオールとしては、ポリオキシエチレングリコール、ポリオキシプロピレングリコール、ポリテトラメチレンエーテルグリコール、ポリオキシエチレングリコール−ポリオキシプロピレングリコールブロック共重合体及びポリエチレン主鎖とポリオキシアルキレングリコール側鎖とで構成されるポリエーテルポリオールからなる群の少なくとも１種を用いることにより、導電性を高めるとともに、熱可塑性樹脂またはゴム、エラストマー、紫外線硬化剤及び粘着剤への相溶性をさらに向上させることができ好ましい。 The polyether polyol includes polyoxyethylene glycol, polyoxypropylene glycol, polytetramethylene ether glycol, polyoxyethylene glycol-polyoxypropylene glycol block copolymer, and a polyethylene main chain and a polyoxyalkylene glycol side chain. The use of at least one member selected from the group consisting of polyether polyols is preferred because it improves conductivity and further improves the compatibility with thermoplastic resins or rubbers, elastomers, ultraviolet curing agents and adhesives.
前記ビス（フルオロスルホニル）イミド塩の添加量については、該ビス（フルオロスルホニル）イミド塩が溶解できる範囲であれば特に制限がないが、得られる導電性付与剤の電気特性、ハンドリング、経済性等の面から、好ましくは該ポリエーテルポリオールにビス（フルオロスルホニル）イミド塩が１〜５０重量％の範囲で添加される。より好ましくは５〜２５重量％の範囲で添加される。 The amount of the bis (fluorosulfonyl) imide salt added is not particularly limited as long as the bis (fluorosulfonyl) imide salt can be dissolved, but the electrical properties, handling, economy, etc. of the resulting conductivity imparting agent are not particularly limited. From this aspect, preferably, the bis (fluorosulfonyl) imide salt is added to the polyether polyol in the range of 1 to 50% by weight. More preferably, it is added in the range of 5 to 25% by weight.
次に、本発明の導電性材料について、以下に説明する。 Next, the conductive material of the present invention will be described below.
本発明でいう導電性材料とは、前記導電性付与剤を樹脂等に混合した導電性材料であって、主にコーティング用途に好適に用いられる導電性材料をいう。 The conductive material as used in the field of this invention is the conductive material which mixed the said conductivity imparting agent with resin etc., Comprising: The conductive material mainly used suitably for a coating use is said.
本発明は、熱可塑性樹脂、ゴムまたはエラストマー、紫外線硬化剤または粘着剤に前記導電性付与剤が添加混合されてなる導電性材料である。 The present invention is a conductive material obtained by adding and mixing the conductivity imparting agent to a thermoplastic resin, rubber or elastomer, an ultraviolet curing agent or an adhesive.
前記熱可塑性樹脂としては、例えば、ポリエチレン、ポリプロピレン、ポリスチレン等のポリオレフィン系樹脂、ポリアセタール、ポリアクリレート、ポリアクリル樹脂、ポリフェニレンエーテル、ポリスチレン、ポリエーテルケトン、ポリエチレンテレフタレート、ポリエステル樹脂、ポリカーボネート、ポリウレタン樹脂、ポリアミド樹脂、ポリ塩化ビニル樹脂、ポリ塩化ビニリデン、ポリイミド、ポリエーテルイミド、ポリアミドイミド、ポリフェニレンサルファイド、ポリサルホン、エポキシ樹脂等があげられる。得られる導電性材料の導電性に優れる点から、ポリアクリル樹脂、ポリエステル樹脂、ポリウレタン樹脂、ポリアミド樹脂、ポリ塩化ビニル樹脂、エポキシ樹脂の少なくとも１種が好ましい。 Examples of the thermoplastic resin include polyolefin resins such as polyethylene, polypropylene, and polystyrene, polyacetal, polyacrylate, polyacrylic resin, polyphenylene ether, polystyrene, polyetherketone, polyethylene terephthalate, polyester resin, polycarbonate, polyurethane resin, and polyamide. Examples thereof include resins, polyvinyl chloride resins, polyvinylidene chloride, polyimides, polyether imides, polyamide imides, polyphenylene sulfides, polysulfones, and epoxy resins. In view of excellent conductivity of the obtained conductive material, at least one of polyacrylic resin, polyester resin, polyurethane resin, polyamide resin, polyvinyl chloride resin, and epoxy resin is preferable.
前記熱可塑性樹脂に対する本発明の導電性付与剤の添加量は特に制限がないが、好ましくは、熱可塑性樹脂１００重量部に対し、前記導電性付与剤を０．１〜５０重量部添加されてなるものであり、さらに好ましくは熱可塑性樹脂１００重量部に対し、前記導電性付与剤を５〜２５重量部添加されてなるものである。 The amount of the conductivity-imparting agent of the present invention added to the thermoplastic resin is not particularly limited, but preferably 0.1 to 50 parts by weight of the conductivity-imparting agent is added to 100 parts by weight of the thermoplastic resin. More preferably, 5 to 25 parts by weight of the conductivity imparting agent is added to 100 parts by weight of the thermoplastic resin.
また、前記ゴムまたはエラストマーとしては、例えば、ウレタンゴム、アクリルゴム、アクリロニトリル／ブタジエンゴム、エピクロルヒドリンゴム、エピクロルヒドリン／エチレンオキサイド共重合体ゴム、シリコンゴム、フルオロオレフィン／ビニルエーテル共重合体ウレタンゴム、スチレン／ブタジエン共重合体ゴム及びそれらの発泡体からなる群から選ばれる少なくとも１種があげられる。 Examples of the rubber or elastomer include urethane rubber, acrylic rubber, acrylonitrile / butadiene rubber, epichlorohydrin rubber, epichlorohydrin / ethylene oxide copolymer rubber, silicon rubber, fluoroolefin / vinyl ether copolymer urethane rubber, styrene / butadiene. Examples thereof include at least one selected from the group consisting of copolymer rubbers and foams thereof.
前記ゴムまたはエラストマーに対する本発明の導電性付与剤の添加量は特に制限がないが、好ましくは、ゴムまたはエラストマー１００重量部に対し、前記導電性付与剤を０．１〜５０重量部添加されてなるものであり、さらに好ましくはゴムまたはエラストマー１００重量部に対し、前記導電性付与剤を５〜２５重量部添加されてなるものである。 The amount of the conductivity-imparting agent of the present invention added to the rubber or elastomer is not particularly limited, but preferably 0.1 to 50 parts by weight of the conductivity-imparting agent is added to 100 parts by weight of the rubber or elastomer. More preferably, 5 to 25 parts by weight of the conductivity-imparting agent is added to 100 parts by weight of rubber or elastomer.
また、前記紫外線硬化剤としては、例えば、ジイソシアネート類、単官能基あるいは多官能基を有するアクリレート、アクリル酸又はメタクリル酸が挙げられる。該ジイソシアネート類とポリエーテルポリオールとを反応させることによりウレタン化し、ついで単官能基あるいは多官能基を有するアクリレートと反応させることによってポリウレタンアクリレートからなる紫外線硬化型樹脂を得ることができる。また、アクリル酸またはメタクリル酸をポリエーテルポリオールに添加し、脱水エステル化反応させることによっても紫外線硬化型樹脂を得ることも可能である。 Examples of the ultraviolet curing agent include diisocyanates, acrylates having a monofunctional group or a polyfunctional group, acrylic acid, or methacrylic acid. By reacting the diisocyanate with a polyether polyol, it is urethanized, and then reacted with an acrylate having a monofunctional group or a polyfunctional group to obtain an ultraviolet curable resin composed of polyurethane acrylate. It is also possible to obtain an ultraviolet curable resin by adding acrylic acid or methacrylic acid to a polyether polyol and causing a dehydration esterification reaction.
紫外線硬化型樹脂を得るための前記ポリエーテルポリオールとしては、例えば、ポリオキシエチレングリコール、ポリオキシプロピレングリコール、ポリオキシエチレングリコールとポリオキシプロピレングリコールのブロック共重合体などがあげられる。 Examples of the polyether polyol for obtaining the ultraviolet curable resin include polyoxyethylene glycol, polyoxypropylene glycol, and a block copolymer of polyoxyethylene glycol and polyoxypropylene glycol.
前記ジイソシアネート類としては、トリレンジイソシアネート、ヘキサメチレンジイソシアネート、イソホロンジイソシアネート、キシレンジイソシアネートなどがあげられる。また、前記アクリレートとしては、トリメチロールプロパントリアクリレート、ペンタエリスリトールトリアクリレート、テトラメチロールメタントリアクリレート、ブタンジオールジアクリレート、ポリエチレングリコールジアクリレートなどがあげられる。 Examples of the diisocyanates include tolylene diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, and xylene diisocyanate. Examples of the acrylate include trimethylolpropane triacrylate, pentaerythritol triacrylate, tetramethylolmethane triacrylate, butanediol diacrylate, polyethylene glycol diacrylate, and the like.
前記紫外線硬化剤に対する本発明の導電性付与剤の添加量は特に制限がないが、好ましくは、紫外線硬化剤１００重量部に対し、前記導電性付与剤を０．１〜５０重量部添加されてなるものであり、さらに好ましくは紫外線硬化剤１００重量部に対し、前記導電性付与剤を５〜２５重量部添加されてなるものである。 Although there is no restriction | limiting in particular in the addition amount of the electroconductivity imparting agent of this invention with respect to the said ultraviolet curing agent, Preferably, 0.1-50 weight part of said electroconductivity imparting agent is added with respect to 100 weight part of ultraviolet curing agents. More preferably, 5 to 25 parts by weight of the conductivity imparting agent is added to 100 parts by weight of the ultraviolet curing agent.
また、前記粘着剤としては、例えば、ゴム系粘着剤、アクリル系粘着剤、シリコーン系粘着剤などが挙げられる。ゴム系粘着剤としては天然ゴム、ＳＢＲ、あるいはポリブタジエン、ポリイソプレン、ポリスチレンなどのブロック共重合体からなる粘着剤が挙げられる。アクリル系粘着剤としてはアクリル酸ブチル、アクリル酸２エチルヘキシル、アクリル酸エチル、アクリル酸などからなる粘着剤、及びエネルギー線硬化性無溶剤型アクリル系粘着剤の原料としてはラウリルアクリレート、２-エチルヘキシルアクリレート、グリシジルアクリレート、エチルアクリレートなどが挙げられる。 Examples of the pressure-sensitive adhesive include rubber-based pressure-sensitive adhesives, acrylic pressure-sensitive adhesives, and silicone-based pressure-sensitive adhesives. Examples of the rubber-based pressure-sensitive adhesive include natural rubber, SBR, or a pressure-sensitive adhesive made of a block copolymer such as polybutadiene, polyisoprene, and polystyrene. Acrylic pressure-sensitive adhesives include butyl acrylate, 2-ethylhexyl acrylate, ethyl acrylate, acrylic acid, etc., and energy ray-curable solvent-free acrylic pressure-sensitive adhesives are lauryl acrylate, 2-ethylhexyl acrylate , Glycidyl acrylate, ethyl acrylate and the like.
前記粘着剤に対する本発明の導電性付与剤の添加量は特に制限がないが、好ましくは、粘着剤１００重量部に対し、前記導電性付与剤を０．１〜５０重量部添加されてなるものであり、さらに好ましくは粘着剤１００重量部に対し、前記導電性付与剤を５〜２５重量部添加されてなるものである。 Although there is no restriction | limiting in particular in the addition amount of the electroconductivity imparting agent of this invention with respect to the said adhesive, Preferably, 0.1-50 weight part of said electroconductivity imparting agent is added with respect to 100 weight part of adhesives. More preferably, 5 to 25 parts by weight of the conductivity-imparting agent is added to 100 parts by weight of the pressure-sensitive adhesive.
前記熱可塑性樹脂、ゴム、エラストマー、紫外線硬化剤または粘着剤１００重量部に対し、本発明の導電性付与剤が、０．１〜５０重量部添加されてなることを特徴とする導電性材料において、導電性付与剤の添加量が０．１重量部未満の場合、導電性が不十分となる場合があり、また、５０重量部より超の場合、導電性は十分であるが、ブリードや滲みだしが発生しやすくなる場合がある。 In the conductive material, wherein 0.1 to 50 parts by weight of the conductivity-imparting agent of the present invention is added to 100 parts by weight of the thermoplastic resin, rubber, elastomer, ultraviolet curing agent or pressure-sensitive adhesive. If the added amount of the conductivity-imparting agent is less than 0.1 parts by weight, the conductivity may be insufficient, and if it exceeds 50 parts by weight, the conductivity is sufficient, but bleeding or bleeding may occur. There are cases where dashi is likely to occur.
本発明の導電性材料をフィルム状、シート状あるいはロール状等所望の形状に成形することによって、防塵シート、帯電防止フィルム、除電マット、帯電防止床材などの導電性シート、電子写真式プリンターや複写機の導電性ロール（帯電ロール、現像ロール、転写ロールなど）、磁気記録媒体用基材、半導体用素材、液晶ディスプレイなどの保護フィルムなどに用いる導電性部材とすることができる。 By forming the conductive material of the present invention into a desired shape such as a film, sheet, or roll, a conductive sheet such as a dustproof sheet, an antistatic film, a static elimination mat, an antistatic flooring, an electrophotographic printer, The conductive member can be used for a conductive roll (such as a charging roll, a developing roll, and a transfer roll) of a copying machine, a magnetic recording medium substrate, a semiconductor material, and a protective film for a liquid crystal display.
また、本発明の導電性材料を、適切な可溶性溶媒に溶解させることにより、コーティング剤として用いることができ、該コーティング剤を、樹脂フィルム、ガラス等の基材に塗布した後、乾燥、硬化させることにより、これら基材表面に導電性塗膜が形成されてなるコーティング組成物とすることが可能である。 The conductive material of the present invention can be used as a coating agent by dissolving it in an appropriate soluble solvent. The coating agent is applied to a substrate such as a resin film or glass, and then dried and cured. Thus, a coating composition in which a conductive coating film is formed on the surface of these substrates can be obtained.
基材としては、ポリエチレンテレフタレートフィルム（以下、「ＰＥＴフィルム」と略記する。）、ポリエステルフィルム、ＰＣ（ポリカーボネート）、ＰＳ（ポリスチレン）、アクリル、ＴＡＣ（セルローストリアセテート）、ポリエチレンフィルム、ポリプロピレンフィルム等が挙げられる。 Examples of the substrate include polyethylene terephthalate film (hereinafter abbreviated as “PET film”), polyester film, PC (polycarbonate), PS (polystyrene), acrylic, TAC (cellulose triacetate), polyethylene film, and polypropylene film. It is done.
コーティング剤とする際の溶媒としては、トルエン、メチルエチルケトン、酢酸エチル、酢酸ブチル、イソプロピルアルコール等が挙げられる。また、該溶媒の添加量としては特に制限がないが、好ましくは、導電性材料１０重量部に対し、溶媒を１０〜９０重量部の範囲で添加したものである。また、コーティング方法については公知の方法を用いる事ができる。 Examples of the solvent used as the coating agent include toluene, methyl ethyl ketone, ethyl acetate, butyl acetate, isopropyl alcohol and the like. Moreover, there is no restriction | limiting in particular as the addition amount of this solvent, However, Preferably a solvent is added in 10-90 weight part with respect to 10 weight part of electroconductive materials. Moreover, about a coating method, a well-known method can be used.
以下、本発明を、実施例によりさらに詳細に説明する。なお、本発明は実施例により、なんら限定されない。なお実施例中、「部」は「重量部」を表す。 Hereinafter, the present invention will be described in more detail with reference to examples. In addition, this invention is not limited at all by the Example. In the examples, “part” represents “part by weight”.
実施例１
ポリエーテルポリオールとしてポリオキシエチレングリコール−ポリオキシプロピレングリコールブロック共重合体（日本油脂（株）、ＰＬＯＮＯＮ１０４）（以下、「ＰＥＯ−ＰＰＯ」と略記する。）９０部に、ビス（フルオロスルホニル）イミド塩として、リチウムビス（フルオロスルホニル）イミド（以下、「ＬＳＩ」と略記する。）１０部を加えた後、温度７０℃で加熱混練し導電性付与剤を得た。
Example 1
As a polyether polyol, polyoxyethylene glycol-polyoxypropylene glycol block copolymer (Nippon Yushi Co., Ltd., PLONON 104) (hereinafter abbreviated as “PEO-PPO”) 90 parts, bis (fluorosulfonyl) imide salt As above, after adding 10 parts of lithium bis (fluorosulfonyl) imide (hereinafter abbreviated as “LSI”), the mixture was heated and kneaded at a temperature of 70 ° C. to obtain a conductivity-imparting agent.
ついで、熱可塑性樹脂であるメタクリル樹脂（三菱レーヨン（株）、アクリペットＩＲＨ−７０、）（以下、「ＰＭＭＡ」と略記する。）９０部に、先に得られた導電性付与剤１０部を添加し、テストロール機（日新科学（株）製、ＨＲ−２型）中、温度１８０℃で加熱、混練させて、厚さ１ｍｍの導電性シートを得た。 Subsequently, 90 parts of methacrylic resin (Mitsubishi Rayon Co., Ltd., Acrypet IRH-70) (hereinafter abbreviated as “PMMA”), which is a thermoplastic resin, is added to 10 parts of the conductivity imparting agent obtained above. It was added and heated and kneaded at a temperature of 180 ° C. in a test roll machine (manufactured by Nisshin Kagaku Co., Ltd., HR-2 type) to obtain a conductive sheet having a thickness of 1 mm.
得られた導電性シートの温度２３℃、湿度４０％における表面抵抗を、表面抵抗測定機（三菱化学（株）製、ＨＴ−２１０）を用いて測定した結果を表１に示す。また、表面へのブリード性の確認は、導電性シートを２つに折り曲げ、温度４０℃、湿度８０％の環境下１００日間放置した後、導電性付与剤の滲みだしの有無を目視で観察することにより行った。結果を表１に示す。 Table 1 shows the results obtained by measuring the surface resistance of the obtained conductive sheet at a temperature of 23 ° C. and a humidity of 40% using a surface resistance measuring instrument (manufactured by Mitsubishi Chemical Corporation, HT-210). In order to confirm the bleeding property on the surface, the conductive sheet is folded in two and left for 100 days in an environment of a temperature of 40 ° C. and a humidity of 80%, and then the presence or absence of the conductivity imparting agent is visually observed. Was done. The results are shown in Table 1.
実施例２
ポリエーテルポリオールとしてＰＥＯ−ＰＰＯ８０部に、ビス（フルオロスルホニル）イミド塩として、Ｎ−n−ブチル−３−メチルピリジニウムビス（フルオロスルホニル）イミド（以下、「ＢＰＳＩ」と略記する。）２０部を加えた後、温度７０℃で加熱混練し導電性付与剤を得た。
Example 2
20 parts of Nn-butyl-3-methylpyridinium bis (fluorosulfonyl) imide (hereinafter abbreviated as “BPSI”) is added as a bis (fluorosulfonyl) imide salt to 80 parts of PEO-PPO as a polyether polyol. Thereafter, the mixture was heated and kneaded at a temperature of 70 ° C. to obtain a conductivity imparting agent.
ついで、熱可塑性樹脂であるポリウレタン樹脂（大日本インキ化学工業（株）、パンデックスＴ−８１９０Ｎ）（以下、「ＰＵ」と略記する。）９０部に、先に得られた導電性付与剤１０部を添加し、テストロール機（日新科学（株）製、ＨＲ−２型）中、温度１８０℃で加熱、混練させて、厚さ１ｍｍの導電性シートを得た。 Subsequently, 90 parts of a polyurethane resin (Dainippon Ink Chemical Co., Ltd., Pandex T-8190N) (hereinafter abbreviated as “PU”), which is a thermoplastic resin, was added to the conductivity-imparting agent 10 previously obtained. Part was added and heated and kneaded at a temperature of 180 ° C. in a test roll machine (manufactured by Nisshin Kagaku Co., Ltd., HR-2 type) to obtain a conductive sheet having a thickness of 1 mm.
得られた導電性シートについて、実施例１と同様に評価した結果を表１に示す。 Table 1 shows the results of evaluating the obtained conductive sheet in the same manner as in Example 1.
実施例３
ポリエーテルポリオールとしてＰＥＯ−ＰＰＯ８０部に、ビス（フルオロスルホニル）イミド塩として、Ｎ−ｎ−オクチル−３−メチルピリジニウムビス（フルオロスルホニル）イミド（以下「ＯＰＳＩ」と略記する。）２０部を加えた後、温度７０℃で加熱混練し導電性付与剤を得た。
Example 3
20 parts of Nn-octyl-3-methylpyridinium bis (fluorosulfonyl) imide (hereinafter abbreviated as “OPSI”) is added as a bis (fluorosulfonyl) imide salt to 80 parts of PEO-PPO as a polyether polyol. Thereafter, the mixture was heated and kneaded at a temperature of 70 ° C. to obtain a conductivity imparting agent.
ついで、発泡性ゴムであるウレタン（日本ポリウレタン工業（株）、ニッポラン５１１９）（以下、「ＵＲ」と略記する。）９０部に、先に得られた導電性付与剤１０部を添加し、温度１１０℃で加熱、混練させて発泡及び架橋させた後、成型用金型に流し込んで、厚み１２ｍｍの導電性ゴム成型体を得た。 Next, 10 parts of the conductivity-imparting agent obtained above is added to 90 parts of urethane (Nippon Polyurethane Industry Co., Ltd., Nippon Run 5119) (hereinafter abbreviated as “UR”), which is an expandable rubber, After heating and kneading at 110 ° C. to foam and crosslink, the mixture was poured into a molding die to obtain a conductive rubber molded body having a thickness of 12 mm.
得られた導電性シートについて、実施例１と同様に評価した結果を表１に示す。 Table 1 shows the results of evaluating the obtained conductive sheet in the same manner as in Example 1.
比較例１
イオン導電剤にビス（トリフルオロメタン）スルホニルイミド酸リチウム（以下、「ＬＴＳＩ」と略記する。）１０部を用いた以外は、実施例１と同様にして、導電性シートを得た。得られた導電性シートについて、実施例１と同様にして、評価した。結果を表１に示す。実施例１から実施例３との比較においてＬＴＳＩを用いた場合、表面抵抗値は実施例のものより低く、またブリードの発生が観察された。
Comparative Example 1
A conductive sheet was obtained in the same manner as in Example 1 except that 10 parts of bis (trifluoromethane) sulfonylimido acid (hereinafter abbreviated as “LTSI”) was used as the ionic conductive agent. The obtained conductive sheet was evaluated in the same manner as in Example 1. The results are shown in Table 1. When LTSI was used in comparison with Example 1 to Example 3, the surface resistance value was lower than that of the Example, and the occurrence of bleeding was observed.
実施例４
ポリエーテルポリオールであるポリオキシエチレングリコール−ポリオキシプロピレングリコールブロック共重合体（日本油脂（株）、ＰＬＯＮＯＮ２０１）（以下、「ＰＥＯ−ＰＰＯ」と略記する。）９０部に、ビス（フルオロスルホニル）イミド塩として、ＬＳＩ１０部を溶解させ、導電性付与剤を得た。
Example 4
90 parts of polyoxyethylene glycol-polyoxypropylene glycol block copolymer (Nippon Yushi Co., Ltd., PLONON 201) (hereinafter abbreviated as “PEO-PPO”), which is a polyether polyol, is bis (fluorosulfonyl) imide. As a salt, 10 parts of LSI was dissolved to obtain a conductivity-imparting agent.
得られた導電性付与剤１００部に、硬化剤としてトリレンジイソシアネート（日本ポリウレタン工業（株）：コロネートＬ）（以下、「ＴＤＩ」と略記する。）４０部を添加し、さらに有機溶媒として、メチルエチルケトン１００部を添加、溶解させて、コーティング剤を得た。 To 100 parts of the resulting conductivity imparting agent, 40 parts of tolylene diisocyanate (Nippon Polyurethane Industry Co., Ltd .: Coronate L) (hereinafter abbreviated as “TDI”) is added as a curing agent, and as an organic solvent, 100 parts of methyl ethyl ketone was added and dissolved to obtain a coating agent.
前記コーティング剤を、ＰＥＴフィルム上に、バーコーター（＃１０コーティングロッド）を用いて塗布後、乾燥、硬化させて、厚み２μｍのウレタン樹脂からなる導電性塗膜を形成させた導電性フィルムを作製した。 The coating agent is applied onto a PET film using a bar coater (# 10 coating rod), then dried and cured to produce a conductive film made of a 2 μm thick urethane resin film. did.
得られた導電性フィルムについて、実施例１と同様にして、評価した。結果を表２に示す。 The obtained conductive film was evaluated in the same manner as in Example 1. The results are shown in Table 2.
実施例５
ＰＥＯ−ＰＰＯ８０部に、ビス（フルオロスルホニル）イミド塩としてＢＰＳＩ２０部を添加、溶解させ、導電性付与剤を得た。
Example 5
In 80 parts of PEO-PPO, 20 parts of BPSI as a bis (fluorosulfonyl) imide salt was added and dissolved to obtain a conductivity-imparting agent.
得られた導電性付与剤１００部に、ＴＤＩ３５部を添加し、さらに溶媒として、メチルエチルケトン１００部を添加、溶解させて、コーティング剤を得た。 35 parts of TDI was added to 100 parts of the resulting conductivity imparting agent, and 100 parts of methyl ethyl ketone was added and dissolved as a solvent to obtain a coating agent.
該コーティング剤を用い、実施例４と同様にして、ＰＥＴフィルム上に厚み２μｍのウレタン樹脂からなる導電性被膜を形成させ、得られた導電性フィルムを評価した。結果を、表２に示す。 Using the coating agent, a conductive film made of a urethane resin having a thickness of 2 μm was formed on a PET film in the same manner as in Example 4, and the obtained conductive film was evaluated. The results are shown in Table 2.
実施例６
ＰＥＯ−ＰＰＯ８０部に、ビス（フルオロスルホニル）イミド塩としてＯＰＳＩ２０部を添加、溶解させ、導電性付与剤を得た。
Example 6
To 80 parts of PEO-PPO, 20 parts of OPSI as a bis (fluorosulfonyl) imide salt was added and dissolved to obtain a conductivity imparting agent.
得られた導電性付与剤１００部に、ヘキサメチレンジイソシアネート（日本ポリウレタン工業（株）製）（以下、「ＨＤＩ」と略記する。）３５部及びジブチルスズジラウレート０．０１部を加え、８５℃で３時間ウレタン化反応を行った。次いで、トリメチロールプロパントリアクリレート（以下、「ＴＰＴ」と略記する。）３０部、重合禁止剤ハイドロキノン０．１部を加え８０℃で４時間反応を行った。 To 100 parts of the resulting conductivity imparting agent, 35 parts of hexamethylene diisocyanate (manufactured by Nippon Polyurethane Industry Co., Ltd.) (hereinafter abbreviated as “HDI”) and 0.01 part of dibutyltin dilaurate are added, and 3 parts at 85 ° C. are added. A time urethane reaction was carried out. Subsequently, 30 parts of trimethylolpropane triacrylate (hereinafter abbreviated as “TPT”) and 0.1 part of a polymerization inhibitor hydroquinone were added and reacted at 80 ° C. for 4 hours.
前記反応生成物１００部に、光重合開始剤（長瀬産業（株）：ダロキュア１１７３）を４部及び、さらに溶媒として、メチルエチルケトン１００部を添加、溶解させて、コーティング剤を得た。 To 100 parts of the reaction product, 4 parts of a photopolymerization initiator (Nagase Sangyo Co., Ltd .: Darocur 1173) and 100 parts of methyl ethyl ketone as a solvent were added and dissolved to obtain a coating agent.
該コーティング剤を、ＰＥＴフィルム上に、バーコーター（＃５コーティングロッド）を用いて塗布後、１００ｍＪ／ｃｍ２の紫外線を照射し硬化させて、厚み２μｍのポリウレタンアクリレートからなる導電性塗膜を形成させ、導電性フィルムを得た。 The coating agent is applied onto a PET film using a bar coater (# 5 coating rod) and then cured by irradiating with 100 mJ / cm 2 of ultraviolet rays to form a conductive coating film made of polyurethane acrylate having a thickness of 2 μm. To obtain a conductive film.
得られた導電性フィルムについて、実施例１と同様にして評価した結果を表２に示す。 Table 2 shows the results of evaluating the obtained conductive film in the same manner as in Example 1.
比較例２
イオン導電剤にＬＴＳＩ２０部を用いた以外は、実施例４と同様にしてウレタン樹脂からなる導電性塗膜を形成させ、導電性フィルムを得た。得られた導電性塗膜について、実施例４と同様にして評価した結果、ＬＴＳＩを用いた場合、表面抵抗値は高くブリードが発生した。結果を表２に示す。
Comparative Example 2
A conductive coating film made of a urethane resin was formed in the same manner as in Example 4 except that 20 parts of LTSI was used as the ionic conductive agent to obtain a conductive film. As a result of evaluating the obtained conductive coating film in the same manner as in Example 4, when LTSI was used, the surface resistance value was high and bleeding occurred. The results are shown in Table 2.
本発明の導電性付与剤を用いてなる導電性材料は、耐ブリード性、耐熱性、帯電防止性に優れ、長期間安定した特性を持続でき、また透明性にも優れているので、防塵シート、除電マット及び帯電防止床材などの導電性シート、帯電防止フィルム、帯電防止剥離フィルム、各種ディスプレイの帯電防止剤、粘着剤、導電性塗料、導電性コーティング剤、電子写真式プリンターや複写機の導電性ロール（帯電ロール、クリーニングロール、現像ロールなど）、ポリマー２次電池などの電気化学デバイス用電解質、磁気記録媒体用基材、半導体用素材、液晶ディスプレイの保護フィルムなどへ適用できる。 The conductive material using the conductivity-imparting agent of the present invention is excellent in bleed resistance, heat resistance and antistatic properties, can maintain stable characteristics for a long period of time, and has excellent transparency. , Conductive sheets such as static elimination mats and antistatic flooring materials, antistatic films, antistatic release films, antistatic agents for various displays, adhesives, conductive paints, conductive coating agents, electrophotographic printers and copiers It can be applied to electroconductive rolls (charging rolls, cleaning rolls, developing rolls, etc.), electrolytes for electrochemical devices such as polymer secondary batteries, magnetic recording medium substrates, semiconductor materials, and protective films for liquid crystal displays.
Claims (5)
下記一般式〔１〕
が０．１〜５０重量部添加されてなることを特徴とする導電性材料。 In 100 parts by weight of thermoplastic resin,
The following general formula [1]
下記一般式〔１〕
が０．１〜５０重量部添加されてなることを特徴とする導電性材料。 To 100 parts by weight of rubber or elastomer,
The following general formula [1]
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| JP7037281B2 (en) * | 2017-03-31 | 2022-03-16 | リンテック株式会社 | Antistatic silicone adhesive composition and protective sheet |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO1995026056A1 (en) * | 1994-03-21 | 1995-09-28 | Centre National De La Recherche Scientifique | Ionic conducting material having good anticorrosive properties |
| EP1626041B1 (en) * | 1998-02-03 | 2016-07-13 | ACEP Inc. | New materials useful as electolytic solutes |
| JP3766616B2 (en) * | 2001-07-30 | 2006-04-12 | 三光化学工業株式会社 | Resin composition for antistatic coating, method for producing the same, and molded article using the same |
| JP4396917B2 (en) * | 2003-09-09 | 2010-01-13 | 日本カーリット株式会社 | Conductivity imparting agent and conductive material |
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