JP5031960B2 - Substrate processing apparatus and semiconductor device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the manufacturing and running costs. SOLUTION: A boat 30 is carried by a carrying apparatus 40, with the boat 30 put on a boat putting board 35 in a CVD system 1 provided with a heat treatment stage 4 for carrying the boat 30 into and carry out of a processing tube 11 for processing a wafer W supporting the boat 30, a waiting stage 5 which is to be set at a position apart from the heat treatment stage 4, a wafer- moving and mounting device 50 for mounting and removing the wafer W on and from the boat 30 of the waiting stage 5 and a boat carrying device 40 for carry the boat 30 between the heat treatment stage 4 and the waiting stage 5. As a result, the manufacturing costs of the boat and the CVD system can be reduced, by projecting positioning pins on the boat mounting board and the running cost increase of the CVD system can be prevented replacement of the boat putting board can correspond to wear and damages to the positioning pins.

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate processing apparatus, and more particularly to a substrate processing apparatus in which two or more boats are used. For example, a semiconductor wafer as a substrate on which a semiconductor integrated circuit including a semiconductor element is built in a semiconductor device manufacturing method. The present invention relates to a material that can be effectively used for heat treatment such as annealing, oxide film formation, diffusion, and film formation (hereinafter referred to as a wafer).
[0002]
[Prior art]
2. Description of the Related Art A batch type vertical hot wall type heat treatment apparatus (furnace, hereinafter referred to as a heat treatment apparatus) is widely used to perform heat treatment such as annealing, oxide film formation, diffusion, and film formation on a wafer in a semiconductor device manufacturing method. in use.
[0003]
As a conventional heat treatment apparatus of this kind, there is one described in Japanese Patent No. 2681055. In this heat treatment apparatus, a boat exchange device is disposed between the wafer transfer device and the space directly below the process tube, and a pair (two) of boats are placed on the rotary table of the boat exchange device, A pair of boats rotate 180 degrees around the rotary table, whereby an unprocessed boat and a processed boat are exchanged. That is, in this heat treatment apparatus, while one boat (first boat) holding a wafer group is being processed in the process chamber of the process tube, a new wafer is transferred to the other boat (second boat). It is transferred by a loading device.
[0004]
[Problems to be solved by the invention]
However, the heat treatment apparatus described above has the following problems because it is aligned between the boat and the rotary table and the seal cap of the boat elevator when replacing the boat. Since the positioning portion for positioning is integrally formed on the bottom surface of the boat formed of quartz or silicon carbide (SiC), the expensive boat becomes even more expensive.
[0005]
Further, at the time of alignment, the alignment portion on the boat side and the alignment portion on the rotary table and seal cap side rub against each other, which may cause the alignment portions to be worn or damaged. If the positioning portion on the boat side is worn or damaged, it is necessary to update the entire boat, which increases the running cost of the substrate processing apparatus.
[0006]
An object of the present invention is to provide a substrate processing apparatus that can reduce manufacturing costs and running costs.
[0007]
[Means for Solving the Problems]
The substrate processing apparatus according to the present invention includes a processing stage in which the boat is carried in and out of a process tube that processes the substrate while being supported by the boat, a standby stage set at a position separated from the processing stage, A substrate processing apparatus comprising: a substrate transfer device that loads and unloads the substrate with respect to the boat of the standby stage; and a boat transfer device that transfers the boat between the processing stage and the standby stage. In
The boat is transported by the boat transport device in a state of being mounted on a boat mounting plate.
[0008]
According to the above-mentioned means, by forming the alignment portion on the boat mounting plate that is separate from the boat, the manufacturing cost is significantly reduced compared to the case where the alignment portion is integrally formed on the boat. be able to. In addition, by forming the alignment portion on the boat mounting plate, even if the alignment portion is worn or damaged, it is only necessary to update the boat mounting plate without updating the entire boat. An increase in running cost of the substrate processing apparatus can be prevented.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
[0010]
In the present embodiment, the substrate processing apparatus according to the present invention is configured as a batch type vertical hot wall type diffusion / CVD apparatus (hereinafter referred to as a CVD apparatus), and performs annealing, oxide film formation, and diffusion on the wafer. It is used to perform diffusion / CVD processing such as processing and film formation processing. In the following description, front, rear, left and right are based on FIG. That is, the pod stage 8 side is the front side, the opposite side is the rear side, the clean unit 3 side is the left side, and the opposite side is the right side.
[0011]
As shown in FIG. 1, a CVD apparatus 1 in which a CVD method according to the present embodiment is implemented includes a housing 2 formed in a rectangular parallelepiped box shape in plan view. A clean unit 3 is installed on the left side wall of the housing 2, and the clean unit 3 supplies clean air to the inside of the housing 2. A heat treatment stage 4 is set at substantially the center of the rear part inside the housing 2, and a standby stage (hereinafter referred to as a standby stage) 5 in which an empty boat is temporarily placed on the front and rear of the left side of the heat treatment stage 4 to wait. In addition, a stage (hereinafter referred to as a cooling stage) 6 for temporarily placing the processed boat and cooling it is set. A wafer transfer stage 7 is set in the approximate center of the front part inside the housing 2, and a pod stage 8 is set in front of it. A notch aligner 9 is installed on the left side of the wafer transfer stage 7. Hereinafter, the configuration of each stage will be described in order.
[0012]
As shown in FIG. 2, a process tube 11 is vertically arranged above the heat treatment stage 4 so that the center line is vertical. As shown in FIG. 3, the process tube 11 includes an outer tube 12 and an inner tube 13 arranged concentrically with each other, and the outer tube 12 is made of quartz glass and has an upper end closed and a lower end opened. The inner tube 13 is formed in a cylindrical shape in which both upper and lower ends are opened using quartz glass or silicon carbide. A cylindrical hollow portion of the inner tube 13 forms a processing chamber 14 into which a plurality of wafers held concentrically aligned by a boat are loaded, and a lower end opening of the inner tube 13 is a wafer as a substrate to be processed. It constitutes a furnace port for taking in and out.
[0013]
A manifold 15 is disposed at the lower end of the process tube 11, and the process tube 11 is supported vertically by the manifold 15 being supported by the housing 2. An exhaust pipe 16 is connected to a part of the side wall of the manifold 15 so as to communicate with the processing chamber 14, and the other end of the exhaust pipe 16 is a vacuum exhaust device for evacuating the processing chamber 14 to a predetermined degree of vacuum. (Not shown). A gas introduction pipe 17 is connected to the other part of the side wall of the manifold 15 so as to communicate with the processing chamber 14, and the other end of the gas introduction pipe 17 is a gas for supplying a gas such as a raw material gas or a nitrogen gas. It is connected to a supply device (not shown).
[0014]
A heater unit 18 is concentrically provided outside the process tube 11 so as to surround the process tube 11, and the heater unit 18 is supported vertically by the housing 2. The heater unit 18 is configured to uniformly heat the inside of the process tube 11 throughout.
[0015]
A seal cap 20 formed in a disk shape substantially equal to the outer diameter of the process tube 11 is disposed concentrically immediately below the process tube 11 in the heat treatment stage 4, and the seal cap 20 is configured by a feed screw mechanism. The boat elevator 19 moves up and down in the vertical direction. A rotating shaft 21 is inserted in the vertical direction on the center line of the seal cap 20 and is rotatably supported by a bearing device 22 and hermetically sealed by a mechanical seal 23. The rotary shaft 21 is configured to be rotationally driven by a rotary actuator 24 installed on the lower surface of the seal cap 20. A cradle 25 that supports the boat 30 while standing vertically is fixed to the upper end of the rotating shaft 21 horizontally.
[0016]
As shown in FIGS. 4 and 5, the upper surface of the cradle 25 has three alignment grooves 26 formed in the shape of an elongated trapezoidal section in cross section, centering on the center point of the upper surface of the cradle 25. Each of the alignment grooves 26 can be fitted with three alignment pins 37 projecting from the lower surface of the boat mounting plate 35 to be described later. It is formed as follows. A circular escape hole 27 having a constant depth is concentrically placed on the upper surface of the cradle 25, and a boat presence / absence detector for detecting whether the boat 30 is on the cradle 25 at the bottom surface of the escape hole 27. (Hereinafter referred to as presence / absence detection unit) 28 and a boat identification detection unit (hereinafter referred to as identification detection unit) 29 for identifying the boat 30 on the cradle 25 are provided. The presence / absence detection unit 28 and the identification detection unit 29 are configured to detect a detection element protruding on the lower surface of the boat mounting plate 35 described later by a limit switch or the like, and the detection result of the CVD apparatus 1 is detected. The data is transmitted to a controller (not shown).
[0017]
In the present embodiment, two boats 30 are alternately mounted on and supported by the seal cap 20 and are carried into and out of the process tube 11. The two boats 30 and 30 are identically designed, but have individual differences due to, for example, processing errors, assembly errors, and cleaning by etching. However, since the two boats 30 and 30 are designed to be identical in design, one of them will be described as a representative unless it is necessary to distinguish between the two boats.
[0018]
As shown in FIGS. 2 to 5, the boat 30 has a pair of upper and lower end plates 31 and 32, and a plurality of boats (three in this embodiment) arranged vertically between the end plates 31 and 32. ), And a plurality of holding grooves 34 are provided at equal intervals in the longitudinal direction so as to be opened in the same plane. Then, the outer peripheral portion is inserted between the plurality of holding grooves 34 so that the wafers W are horizontally aligned and held in the boat 30 with their centers aligned.
[0019]
As shown in detail in FIGS. 4 and 5, a boat mounting plate 35 is detachably brought into contact with the lower surface of the lower end plate 32 of the boat 30. The boat mounting plate 35 is made of a non-metallic material such as ceramic or resin, and is formed in a disc shape having an outer diameter equal to the outer diameter of the lower end plate 32. A circular ring-shaped abutting portion 36 protrudes from the lower surface of the boat mounting plate 35, and the outer diameter of the abutting portion 36 is set equal to the outer diameter of the cradle 25 of the seal cap 20. It is set equal to the inner diameter of the escape hole 27 of the cradle 25. A space for inserting an arm of a boat transfer device 40, which will be described later, is formed outside the contact portion 36 on the lower surface of the boat mounting plate 35, and is used for engaging the arm with the outer peripheral surface of the contact portion 36. An engaging portion is configured.
[0020]
On the lower surface of the boat mounting plate 35, three alignment pins 37 are arranged on the concentric circle centered on the center point of the lower surface of the boat mounting plate 35 at equal intervals in the circumferential direction and project downward in the vertical direction. Each alignment pin 37 is formed so as to be fitted in each of the three alignment grooves 26, which are submerged in the upper surface of the cradle 25. That is, the three alignment pins 37 are each formed in a trapezoidal cone shape having a conical surface corresponding to the inverted trapezoidal shape of the alignment groove 26, and on the concentric circle centering on the center point of the lower surface of the boat 30. They are arranged at regular intervals of 120 degrees in the circumferential direction so as to be fitted into the alignment grooves 26. A presence / absence detector 38 corresponding to the presence / absence detector 28 of the cradle 25 and an identification detector 39 corresponding to the identification detector 29 are provided on the bottom surface of the inner surface of the contact portion 36 of the boat mounting plate 35. Projecting vertically downward. In the present embodiment, the presence / absence detected element 38 and the identification object 39 are constituted by bolts.
[0021]
As shown in FIG. 1, between the standby stage 5 and the cooling stage 6, there is provided a boat transfer device 40 that transfers the boat 30 between the heat treatment stage 4, the standby stage 5, and the cooling stage 6. Yes. As shown in FIG. 6, the boat conveyance device 40 is configured by a SCARA robot, and a pair of first arms 41 that reciprocate by about 90 degrees in a horizontal plane. And a second arm 42. Each of the first arm 41 and the second arm 42 is formed in an arc shape, and is in contact with the abutting portion while being inserted outside the abutting portion 36 of the boat mounting plate 35 abutted against the lower surface of the boat 30. By engaging with the outer peripheral surface of 36, the entire boat 30 can be vertically supported via the boat mounting plate 35.
[0022]
As shown in FIGS. 1 and 6, a standby stage 43 that vertically supports the boat 30 is installed on the standby stage 5, and the first arm 41 of the boat transfer device 40 holds the boat 30 on the standby stage 43. And the seal cap 20 of the heat treatment stage 4. A cooling table 44 is installed on the cooling stage 6, and the second arm 42 is configured to convey the boat 30 between the cooling table 44 and the seal cap 20 of the heat treatment stage 4. Alignment grooves 45, 45 are submerged in the same configuration as the alignment groove 26 of the cradle 25 of the seal cap 20 on the upper surfaces of the standby table 43 and the cooling table 44, and presence / absence detection units 46, 46 and identification Detection units 47 and 47 are provided.
[0023]
As shown in FIGS. 1 and 2, a wafer transfer device 50 is installed on the wafer transfer stage 7, and the wafer transfer device 50 stands by with the pod stage 8, the notch alignment device 9, and the wafer W. It is configured to be transported between the stage 5 and attached / detached between the pod 60, the notch aligning device 9 and the boat 30. That is, the wafer transfer device 50 includes a base 51, and a rotary actuator 52 is horizontally installed on the base 51. A first linear actuator 53 is horizontally installed on the rotary actuator 52, and the rotary actuator 52 is configured to turn the first linear actuator 53 in a horizontal plane. A second linear actuator 54 is horizontally installed on the first linear actuator 53, and the first linear actuator 53 is configured to reciprocate the second linear actuator 54. A mounting base 55 is horizontally installed on the second linear actuator 54, and the second linear actuator 54 is configured to reciprocate the mounting base 55. On one side surface of the mounting base 55, a plurality of tweezers 56 (five in the present embodiment) for supporting the wafer W from below are arranged horizontally at equal intervals in the vertical direction. The base 51 of the wafer transfer device 50 is moved up and down by an elevator 57 constituted by a feed screw mechanism.
[0024]
On the pod stage 8, FOUPs (front opening unified pods, hereinafter referred to as pods) 60 as carriers (storage containers) for carrying the wafers W are placed one by one. The pod 60 is formed in a substantially cubic box shape with one surface opened, and a door 61 is detachably attached to the opening. When a pod is used as a wafer carrier, the wafer is transported in a sealed state, so that the cleanliness of the wafer can be maintained even if particles are present in the surrounding atmosphere. it can. Therefore, since it is not necessary to set the cleanliness in the clean room where the CVD apparatus is installed, the cost required for the clean room can be reduced. Therefore, in CVD apparatus 1 according to the present embodiment, pod 60 is used as a wafer carrier. The pod stage 8 is provided with a pod opener 62 that opens and closes the pod 60 by attaching and detaching the door 61 of the pod 60.
[0025]
Hereinafter, a method for operating the boat in the CVD apparatus according to the above configuration will be described.
[0026]
While being mounted on the boat mounting plate 35, one boat (hereinafter referred to as the first boat 30 </ b> A) is transported and mounted on the standby stage 43 of the standby stage 5 by the boat transfer device 40. The wafer W housed in the pod 60 of the pod stage 8 is loaded (charged) by the wafer transfer device 50 into the first boat 30A placed on the stand 43. That is, as shown in FIGS. 1 and 2, the first boat 30 </ b> A is transported by the boat transport device 40 and placed on the standby stage 43 of the standby stage 5. On the other hand, as shown in FIG. 1, the pod 60 containing a plurality of wafers W is supplied to the pod stage 8, and as shown in FIG. 2, the pod 60 connects the door 61 to the pod opener 62. Removed and released.
[0027]
Here, when the first boat 30 </ b> A is mounted on the standby table 43 via the boat mounting plate 35, the three alignment pins 37 protruding from the boat mounting plate 35 are radially formed on the standby table 43. The first boat 30A is accurately centered on the standby base 43 and is oriented in a direction specified in advance because the first boat 30A is inserted into the submerged three alignment grooves 45, respectively. In other words, the direction of the wafer insertion direction defined by the three holding members 33 of the first boat 30A is in a state that exactly matches the forward / backward direction of the tweezer 56 of the wafer transfer device 50. Therefore, the loading operation by the wafer transfer device 50 is properly executed.
[0028]
Further, in the stand 43, the presence / absence detection unit 46 and the identification detection unit 47 detect the presence / absence detection element 38 and the identification detection element 39 of the boat placement plate 35. Is determined to be on the waiting stand 43. Then, the controller controls the wafer transfer device 50 with control conditions corresponding to the first boat 30A. Control conditions corresponding to the first boat 30A include, for example, the pitch of the holding grooves 34 for holding the wafers W and the center point defined by the holding grooves 34 in the three directions.
[0029]
When the designated number of wafers W are loaded into the first boat 30A on the standby stage 5, the first boat 30A is picked up from the standby table 43 by the first arm 41 of the boat transfer device 40 via the boat mounting plate 35. Is done. That is, the first arm 41 is inserted into the outside of the abutting portion 36 of the boat mounting plate 35 of the first boat 30A and engaged with the lower surface of the boat mounting plate 35 from below, thereby vertically moving the first boat 30A. It will be in a supported state. The first arm 41 that has picked up the first boat 30 </ b> A rotates about 90 degrees, thereby transporting the first boat 30 </ b> A from the standby stage 5 to the heat treatment stage 4 and delivering it onto the cradle 25 of the seal cap 20.
[0030]
Since the alignment groove 26, presence / absence detection unit 28, and identification detection unit 29 are arranged in the cradle 25 of the seal cap 20 in the same manner as the standby table 43, The mounted first boat 30A is accurately aligned, checked for presence or absence, and identified. Then, the controller commands a control condition corresponding to the first boat 30A to the temperature control sub-controller, the pressure control sub-controller, the gas control sub-controller, and the like.
[0031]
The first boat 30A vertically supported by the cradle 25 of the seal cap 20 is lifted by the boat elevator 19 and is carried into the processing chamber 14 of the process tube 11 as shown in FIG. When the first boat 30A reaches the upper limit, the outer peripheral portion of the upper surface of the seal cap 20 is seated on the lower surface of the manifold 15, and the lower end opening of the manifold 15 is closed in a sealed state. Closed state.
[0032]
When the processing chamber 14 is hermetically closed by the seal cap 20, the processing chamber 14 is evacuated to a predetermined degree of vacuum by the exhaust pipe 16, and the heater unit 18 has a predetermined processing temperature (for example, 800 to 1000 ° C.) over the whole. Heated uniformly. When the temperature of the processing chamber 14 is stabilized, a processing gas is supplied to the processing chamber 14 through the gas introduction pipe 17 at a predetermined flow rate. As a result, a predetermined CVD film is formed on the wafer W.
[0033]
During the film forming process for the first boat 30A, the other boat (hereinafter referred to as the second boat 30B) is placed on the standby table 43 of the standby stage 5 while being mounted on the boat mounting plate 35. The wafer W of the pod 60 is loaded onto the second boat 30B by the wafer transfer device 50. Also in this case, since the three alignment pins 37 projecting from the boat mounting plate 35 of the second boat 30B are fitted into the three alignment grooves 45 radiated from the standby table 43, The two boats 30B are accurately aligned with the standby table 43, and the direction of the two boats 30B is directed in advance. That is, the loading operation of the wafer W to the second boat 30B by the wafer transfer device 50 is properly executed.
[0034]
Here, since the detection object 39 for identification corresponding to the detection part 47 for identification is not attached to the boat mounting plate 35 of the second boat 30B, the presence / absence detection part 46 of the standby table 43 is detected by the presence / absence detection element 38. However, the identification detection unit 47 does not detect the identification target 39. As a result, the controller determines that the second boat 30B is on the standby platform 43. Then, the controller controls the wafer transfer device 50 under control conditions corresponding to the second boat 30B.
[0035]
In turn, when a predetermined processing time in the process tube 11 for the first boat 30A elapses, the seal cap 20 supporting the first boat 30A is lowered by the boat elevator 19, and the first boat 30A is processed by the process tube 11. It is unloaded from the chamber 14. The first boat 30A (including the held wafer W group) carried out from the processing chamber 14 of the process tube 11 is in a high temperature state.
[0036]
Subsequently, the high-temperature processed first boat 30A unloaded from the processing chamber 14 is mounted on the boat mounting plate 35, and then from the heat treatment stage 4 on the axis of the process tube 11 to the cooling stage 6, Immediately transferred and placed by the second arm 42 of the boat conveying device 40. At this time, the second arm 42 is inserted outside the contact portion 36 of the boat mounting plate 35 of the processed first boat 30A and vertically supported from below, and the first boat 30A is supported by the boat mounting plate 35. The first boat 30 </ b> A is conveyed from above the receiving table 25 of the seal cap 20 of the heat treatment stage 4 to the cooling table 44 of the cooling stage 6 by passing through about 90 degrees.
[0037]
Here, since the alignment groove 45, presence / absence detection unit 46, and identification detection unit 47 are also arranged in the cooling table 44 in the same manner as the standby table 43, the first boat 30 </ b> A transferred to the cooling table 44 is It will be accurately aligned, checked for presence and identification.
[0038]
Since the cooling stage 6 is set in the vicinity of the clean air outlet of the clean unit 3, the high temperature first boat 30 </ b> A transferred to the cooling stage 44 of the cooling stage 6 is discharged from the outlet of the clean unit 3. It is cooled very effectively by the clean air that blows out.
[0039]
The first boat 30 </ b> A cooled to, for example, 150 ° C. or less in the cooling table 44 is transferred to the standby stage 5 via the heat treatment stage 4 by the boat transfer device 40. When transferred to the standby table 43, the three holding members 33 of the first boat 30A are in a state where the wafer transfer device 50 side is opened.
[0040]
When the first boat 30A is returned to the standby table 43, the wafer transfer device 50 receives (discharges) the processed wafer W from the first boat 30A of the standby table 43 and transfers it to the pod 60 of the pod stage 8. Store it. Also in this case, the three alignment pins 37 projecting from the boat mounting plate 35 of the first boat 30A are respectively fitted into the three alignment grooves 45 radiated from the standby base 43, so One boat 30A is accurately centered on the stand 43 and is oriented in a direction designated in advance. Therefore, the wafer discharging operation from the first boat 30A to the pot 60 by the wafer transfer device 50 is properly executed. In addition, since the presence / absence detection unit 46 and the identification detection unit 47 detect the presence / absence detected elements 38 and the identification target elements 39 of the boat mounting plate 35, the controller transfers the wafer under control conditions corresponding to the first boat 30A. The mounting apparatus 50 is controlled.
[0041]
When all the processed wafers W are returned to the pod 60, new wafers W to be processed next are loaded into the first boat 30A on the stand 43 by the wafer transfer device 50.
[0042]
Thereafter, the above-described operation is alternately repeated between the first boat 30A and the second boat 30B, whereby a large number of wafers W are batch processed by the CVD apparatus 1.
[0043]
According to the embodiment, the following effects can be obtained.
[0044]
1) By providing alignment pins on the boat mounting plate that is separate from the boat, the manufacturing cost of the boat and thus the CVD equipment is greatly reduced compared to the case where the alignment pins are formed integrally with the boat. can do.
[0045]
2) By forming the alignment pin on the boat mounting plate, even if the alignment pin is worn or damaged, it is only necessary to update the boat mounting plate without updating the entire boat. An increase in running cost of the CVD apparatus can be prevented.
[0046]
Needless to say, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention.
[0047]
For example, not only the alignment pin is disposed on the boat mounting plate side but also an alignment groove may be disposed. Further, the alignment portion is not limited to a combination of a groove and a pin.
[0048]
The boat identification detection unit is not limited to being provided on each of the standby stage, the cooling stage, and the heat treatment stage, but may be provided at least on the stage (the standby stage in the embodiment) on which the wafer transfer operation is performed. . Further, by arranging the boat identification detection unit also on the arm of the boat transfer device, the location of the boat can be recognized even during the boat transfer.
[0049]
The present invention is not limited to a CVD apparatus, and can be applied to general substrate processing apparatuses such as an annealing apparatus, an oxide film forming apparatus, a diffusion apparatus, and a film forming apparatus.
[0050]
In the above embodiment, the case where the wafer is processed has been described. However, the substrate to be processed may be a photomask, a printed wiring board, a liquid crystal panel, a compact disk, a magnetic disk, or the like.
[0051]
【Effect of the invention】
As described above, according to the present invention, the manufacturing cost and running cost of the substrate processing apparatus can be reduced.
[Brief description of the drawings]
FIG. 1 is a plan sectional view showing a CVD apparatus according to an embodiment of the present invention.
FIG. 2 is a perspective view thereof.
FIG. 3 is a partially omitted vertical sectional view showing the heat treatment stage during processing.
FIG. 4 is a partial sectional view showing a boat support state of a seal cap.
FIG. 5 is an exploded perspective view thereof.
FIG. 6 is a perspective view showing a boat transfer device.
[Explanation of symbols]
W ... wafer (substrate), 1 ... CVD apparatus (substrate processing apparatus), 2 ... housing, 3 ... clean unit, 4 ... heat treatment stage, 5 ... standby stage, 6 ... cooling stage, 7 ... wafer transfer stage, 8 Pod stage, 9 notch aligning device, 11 process tube, 12 outer tube, 13 inner tube, 14 processing chamber, 15 manifold, 16 exhaust pipe, 17 gas introduction pipe, 18 heater unit, 19 DESCRIPTION OF SYMBOLS ... Boat elevator, 20 ... Seal cap, 21 ... Rotating shaft, 22 ... Bearing device, 23 ... Mechanical seal, 24 ... Rotary actuator, 25 ... Receptacle, 26 ... Alignment groove, 27 ... Relief hole, 28 ... Existence of boat Detecting unit 29 ... Boat identifying detecting unit 30 ... Boat 30A ... First boat 30B ... Second boat 31 ... Upper end plate 32 Lower end plate, 33 ... holding member, 34 ... holding groove, 35 ... boat mounting plate, 36 ... contact portion, 37 ... positioning pin, 38 ... presence / absence detected element, 39 ... identification target, 40 DESCRIPTION OF SYMBOLS ... Boat transfer device 41 ... First arm 42 ... Second arm 43 ... Standby stand 44 ... Cooling stand 45 ... Alignment groove 46 ... Presence / absence detection unit 47 ... Detection unit 50 ... Wafer transfer Loading device 51 ... Base 52 ... Rotary actuator 53 ... First linear actuator 54 ... Second linear actuator 55 ... Mounting base 56 ... Tweezer 57 ... Elevator 60 ... Pod 61 ... Door 62 ... Pod Opener.

Claims (3)

A processing stage in which the boat is carried into and out of a process tube for processing the substrate while being supported by the boat;
A standby stage set at a position separated from the processing stage;
A substrate transfer device for loading and unloading the substrate with respect to the boat of the standby stage;
A boat mounting plate that is detachably contacted with the boat;
A boat transfer device that supports the boat mounted on the boat mounting plate via the boat mounting plate and transfers it between the processing stage and the standby stage by an arm that reciprocally rotates in a horizontal plane. When,
A substrate processing apparatus comprising:   When the boat placed on the boat placing plate is placed on the processing stage or the standby stage, the boat placing plate with respect to the processing stage or the standby stage is placed on the boat placing plate. The substrate processing apparatus according to claim 1, wherein an alignment portion that aligns the mounting positions is formed. A step of loading a substrate onto a boat mounted on a boat mounting plate that is detachably contacted with the boat at a standby stage set at a position separated from the processing stage; and
A boat transfer device supports the boat mounted on the boat mounting plate via the boat mounting plate, and transfers the boat from the standby stage to the processing stage by an arm that reciprocates in a horizontal plane. Process,
Carrying the substrate into a processing chamber in a state supported by the boat mounted on the boat mounting plate at the processing stage, and processing the substrate in the processing chamber;
A method for manufacturing a semiconductor device comprising:

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