JP5026220B2 - Component mounting method and apparatus - Google Patents

Description

  The present invention relates to a component mounting apparatus and method for mounting components on a component mounting region of a substrate having a component mounting region at its edge, particularly a substrate represented by a liquid crystal glass panel substrate, a plasma display panel substrate, or the like.

  Conventionally, a substrate such as a liquid crystal display (LCD) panel or a plasma display panel (PDP) substrate (hereinafter referred to as a “panel substrate”), a component such as an electronic component, a mechanical component, or an optical component, a flexible printed circuit board (FPC). A display device is manufactured by mounting a substrate such as a substrate) or a semiconductor package component such as a COG (Chip On Glass), a TCP (Tape Carrier Package), an IC chip, or a COF (Chip On Film). ing.

  In a component mounting apparatus for such a panel substrate (for example, a liquid crystal display substrate), an anisotropic conductive film is applied to each terminal portion (component mounting region) formed at the two edge portions of the panel substrate 1. (ACF) ACF adhering device for performing an ACF adhering step for adhering a sheet, a component temporary crimping device for performing a component temporary crimping step for temporarily crimping a component such as TCP via an ACF sheet at each terminal portion, and a long side The long side main crimping apparatus for performing the long side final crimping process for heating and pressing the parts temporarily crimped to the terminal part of the wire and pressing and joining them through the ACF sheet, and the short side terminal part The short side main crimping device that performs the final crimping and bonding process to the part temporarily bonded to the part, and the panel substrate is held from the lower surface side so that work can be performed with each device. Convey sequentially And a substrate transfer device. In the conventional component mounting line having such a configuration, the components are mounted on the respective terminal portions of the panel substrate by performing predetermined processes in each device while sequentially conveying the panel substrate by the substrate conveying device. .

  In such a component mounting apparatus, in order to improve the time required for transporting the panel substrate, in the substrate holding device for mounting and holding the panel substrate when performing various processes, for example, two panel substrates A configuration is employed in which two stages are provided so that the two can be held simultaneously (see, for example, Patent Documents 1 and 2). Thus, by providing two stages in the board holding device, it is possible to efficiently realize component mounting on a plurality of panel boards.

Japanese Patent No. 3596492 Japanese Patent No. 3879730

  In recent years, display devices have also been diversified, and panel substrates of various sizes, such as panel substrates for mobile phones and panel substrates for personal computers, are handled in component mounting apparatuses. From the viewpoint of improving the efficiency of component mounting on the panel substrate and suppressing an increase in production cost, it is preferable to handle panel substrates of various sizes with a single component mounting apparatus.

  However, in a configuration in which two stages are equipped with one substrate holding device, since the two stages are adjacent to each other, the size of the panel substrate that can be held is limited to only one stage. This is stricter than the substrate holding device, and this is a factor that hinders efficient component mounting.

  Further, when the panel substrate is moved while being held by the substrate holding device, a particularly large panel substrate may be subjected to a large stress depending on the holding state. In such a case, the panel substrate may be damaged or the quality of the panel substrate may be deteriorated. In particular, in the thinning of the panel substrate, the plate thickness is reduced from 1.1 mm to 0.7 mm and 0.5 mm, and in the future, it is predicted that the thickness will be reduced to 0.3 mm or less.

  Accordingly, an object of the present invention is to solve the above-described problem, and in a component mounting apparatus including a component holding apparatus having two stages capable of holding a substrate having a component mounting area at an edge thereof. An object of the present invention is to provide a component mounting method and apparatus capable of reliably holding various types of substrates and efficiently mounting components on the substrate.

  In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, the substrate is held by the substrate holding device including the first and second stages arranged adjacent to each other to place and hold the substrate, and the substrate is arranged on the upper surface of the edge of the substrate. In the component mounting method for mounting components in the component mounting area,
Determining whether the size of the substrate held by the substrate holding device is equal to or less than a predetermined reference value;
If it is determined to be equal to or less than the reference value, as a hold around a substantially planar center of the substrate by performing a holding yo Rimoto plate only in the first stage, to the component mounting area of the substrate Mount the parts
When it is determined that the reference value is exceeded, the substrate is held by the first stage with the position decentered from the substantial plane center of the substrate as the holding center, and the first stage Provided is a component mounting method characterized in that a held substrate is supported by the second stage and a component is mounted on the component mounting region of the substrate.

According to the second aspect of the present invention, the substrate is held by the substrate holding device including the first and second stages arranged adjacent to each other to place and hold the substrate, and the substrate is arranged on the upper surface of the edge of the substrate. In the component mounting method for mounting components in the component mounting area,
Determining whether the size of the substrate held by the substrate holding device is equal to or less than a predetermined reference value;
When it is determined that the reference value is equal to or less than the reference value, the first corner is positioned at a predetermined position with respect to the first stage, with one corner of the rectangular substrate as a position reference. Hold the board only by the stage, and mount the component on the component mounting area of the board,
When it is determined that the reference value is exceeded, the first corner is positioned at the predetermined position with respect to the first stage with the one corner of the substrate as a position reference. A component mounting method characterized by holding a substrate by a stage and mounting a component on the component mounting region of the substrate by supporting the substrate held by the first stage by the second stage. I will provide a.

According to the third aspect of the present invention, the component is mounted on the substrate by placing the edge portion on one side of the substrate on the edge support base and crimping the component against the edge portion with a crimping head. Is done by
With respect to the substrate determined to exceed the reference value, the raising / lowering operation of the substrate for alignment between the edge support base and the edge raises the first and second stages together. Alternatively, the component mounting method according to the first aspect or the second aspect, which is performed by lowering, is provided.

  According to the fourth aspect of the present invention, the second stage is lowered with respect to the substrate determined to exceed the reference value, and the support of the substrate is released by the second stage. The first stage is rotated horizontally, the edge on the other side of the substrate is placed on the edge support, and the component is crimped to the edge on the other side by a crimping head. The component mounting method according to the third aspect is provided.

  According to the fifth aspect of the present invention, after the first stage is rotated horizontally, the substrate is supplementarily supported by the substrate support auxiliary member disposed at a position facing the edge support base via the first stage. The component mounting method according to the fourth aspect is provided in which component mounting is performed in a state where the component mounting is performed.

According to the sixth aspect of the present invention, the size of the substrate held by the substrate holding device is not more than the first reference value, using the predetermined reference value that is the size of the substrate as the first reference value. A predetermined value that is smaller than the first reference value and that can be mounted on the second stage together with the first stage as a second reference value. Determining whether the size of the substrate is less than or equal to the second reference value;
When it is determined that the value is equal to or less than the second reference value, the substrate is held on the first stage, and another substrate having the same size as the substrate is held on the second stage. The component mounting method according to the first aspect or the second aspect is provided.

According to the seventh aspect of the present invention, a first stage and a second stage arranged adjacent to each other for mounting and holding a substrate having a component mounting area on which the component is mounted at the edge thereof;
A horizontal movement device capable of integrally moving the first and second stages in the horizontal direction;
An edge support base on which the edge of the substrate held on the first or second stage is placed;
A crimping head for crimping and mounting a component on the component mounting region of the substrate placed on the edge support; and
It is determined whether or not the size of the substrate held by the substrate holding device is equal to or smaller than a predetermined reference value. When it is determined that the size is equal to or smaller than the reference value, the substantial plane center of the substrate is When it is determined that the substrate is held only by the first stage as the holding center and exceeds the reference value, the position decentered from the substantial plane center of the substrate is used as the holding center as the holding center. There is provided a component mounting apparatus comprising: a control device that holds a substrate by a first stage and that supports the substrate held by the first stage by the second stage .

According to the eighth aspect of the present invention, the first stage and the second stage arranged adjacent to each other for mounting and holding a rectangular substrate having a component mounting area on which the component is mounted at the edge thereof, ,
A horizontal movement device capable of integrally moving the first and second stages in the horizontal direction;
An edge support base on which the edge of the substrate held on the first or second stage is placed;
A bonding head for mounting by crimping the hand portion products to the component mounting area of the substrate in a state of being placed on the edge support stand,
It is determined whether or not the size of the substrate held by the substrate holding device is equal to or smaller than a predetermined reference value. If it is determined that the size is equal to or smaller than the reference value, one corner portion of the substrate is determined as a position reference. When the substrate is held only by the first stage so that the one corner is positioned at a predetermined position with respect to the first stage, and on the other hand, when it is determined that the reference value is exceeded, the substrate is The substrate is held by the first stage so that the one corner is positioned at the predetermined position with respect to the first stage with the one corner of the substrate as a position reference, and the substrate is held by the first stage. There is provided a component mounting apparatus comprising a control device for supporting a substrate by the second stage .

  According to the present invention, when component mounting is performed on a substrate using a substrate holding apparatus having first and second stages adjacent to each other, whether or not the size of the substrate is equal to or less than a predetermined reference value is determined. If it is less than the reference value, the substrate is held only by the first stage or the second stage, or by the respective stages of the first and second stages, so that each substrate is efficient. Component mounting can be performed. On the other hand, when it is determined that the substrate size exceeds the reference value, that is, when the substrate is a relatively large substrate, the substrate is held by the first stage and supplementary by the second stage. A substrate holding form that supports the substrate is employed. By adopting such a substrate holding form, it is possible to suppress occurrence of large stress, deflection, or the like on a large size and / or thin size substrate. In particular, when a large and / or thin substrate is held and transported (particularly in vertical movement), a large stress is easily applied to the substrate, and the substrate may be damaged. However, by adopting the holding form as in the present invention, it is possible to perform reliable holding while suppressing the occurrence of damage or the like on the large and / or thin substrate. Therefore, it is possible to hold various substrates with different sizes according to the sizes, and to perform efficient component mounting.

  Embodiments according to the present invention will be described below in detail with reference to the drawings.

(Embodiment)
In describing a component mounting apparatus and a component mounting method according to an embodiment of the present invention, first, the form of the panel substrate 1 handled in these component mounting apparatuses and methods and the panel substrate 1 are applied. An outline of the mounting process will be described with reference to FIGS. 1A, 1B, and 1C.

  First, as shown in FIG. 1A, a substrate handled in this embodiment is a substrate (hereinafter referred to as “panel substrate”) 1 typified by a liquid crystal display (LCD) panel substrate, a plasma display panel (PDP) substrate, or the like. There is a terminal portion 2 in which a component mounting region R1 on which a component is mounted is disposed at the edges of two sides adjacent to each other in a square shape. In addition, such a panel substrate 1 generally has a rectangular shape, and each terminal portion 2 includes a long side terminal portion (terminal portion on the back side in FIG. 1A) and a short side terminal portion. (Terminal portion on the near side in the drawing in FIG. 1A). In addition, a plurality of terminal electrodes 2a are formed in each terminal portion 2, and each component is mounted and electrically connected to these terminal electrodes 2a. Further, the area inside the edge of the panel substrate 1 is a display area in which images such as images and character information are displayed. The panel substrate 1 is mainly made of a glass material, and is thinned so that the thickness thereof is, for example, 0.5 mm or less.

  With respect to the panel substrate 1 having such a structure, the component mounting method according to the present embodiment uses an ACF sheet as a bonding member to the terminal electrode 2a of each terminal portion 2 in the ACF bonding process, which is an example of the bonding member arranging process. 3 (see FIG. 1B), and then, for example, a TCP 4 is mounted as a component via the ACF sheet 3 in the component temporary crimping step and the main crimping step, which are examples of the component placement step (or component mounting step). (See FIG. 1C), that is, an outer lead bonding process is performed.

  Next, FIG. 2 is a schematic perspective view showing a configuration of a component mounting line 100 which is an example of a component mounting apparatus that performs such an outer lead bonding process.

  As shown in FIG. 2, the component mounting line 100 includes an ACF adhering device 20 that performs an ACF adhering process on the panel substrate 1 and a TCP 4 or the like on the panel substrate 1 on which the ACF sheet 3 is adhered. The component temporary crimping apparatus 30 for performing the component temporary crimping process of the component, and the main crimping process for performing the final crimping process of performing the final crimping and mounting of the TCP 4 temporarily crimped to the terminal portions 2 on the long side and the short side of the panel substrate 1. The apparatus 40 and the board | substrate conveyance apparatus 50 which conveys the panel board | substrate 1 between each apparatus are provided. Each apparatus is provided with a panel substrate holding device having two stages for holding the panel substrate 1, and in a state where two panel substrates 1 having a predetermined size or less are simultaneously held as will be described later. Each process can be carried out.

  The ACF adhering apparatus 20 includes two crimping units 23 that cut the tape-like ACF sheet 3 fed from the tape supply unit 21 to the tape collecting unit 22 into a predetermined length and affix it to the terminal portion 2 of the panel substrate 1. And a substrate holding device that transfers and holds the panel substrate 1 conveyed from the substrate conveying device 50 and positions the terminal portion 2 of the held panel substrate 1 and the crimping unit 23. A panel substrate holding device 24 is provided. The panel substrate holding device 24 has a function of moving the held panel substrate 1 in the X-axis direction or the Y-axis direction (XY movement function) and a plane (horizontal plane) including the X-axis direction and the Y-axis direction. 1 has a function of rotating the panel substrate 1 (θ rotation function) and a function of moving the panel substrate 1 up and down in the Z-axis direction (lifting function). The terminal portion 2 on the short side can be aligned with each crimping unit 23. Further, the ACF adhering apparatus 20 is provided with two recognition cameras 26 for recognizing the positions of the terminal portions 2 of the panel substrate 1 in order to perform such alignment. Further, the ACF attaching operation by each crimping unit 23 is performed in a state where the terminal portion 2 of the panel substrate 1 is supported by a backup tool (an example of an edge support base) 25 from below. In FIG. 2, the X-axis direction and the Y-axis direction are substantially along the surface of the panel substrate 1, the transport direction of the panel substrate 1 is the X-axis direction, and the direction orthogonal to the X-axis direction is Y. It is an axial direction, and the illustrated vertical direction is the Z-axis direction.

  The component temporary press-bonding device 30 includes a TCP supply cassette unit (not shown) that supplies a plurality of TCPs 4 housed in a cassette, and a TCP 4 supplied from the TCP supply cassette unit via an ACF sheet 3. A plurality of temporary crimping heads 32 that are temporarily crimped to the terminal electrodes 2a, a panel on which the panel substrate 1 is transferred and held, and the terminal portion 2 of the held panel substrate 1 and the temporary crimping head 32 are positioned. And a substrate holding device 33. The component pre-crimping device 30 is provided with four pre-crimp heads 32, and each of the pre-crimp heads 32 is rotatably arranged evenly on a concentric circle, and is located on the circumference in the upper position of FIG. A so-called rotary system is adopted in which the respective temporary crimping heads 32 are sequentially arranged at the TCP supply position and the temporary crimping position which is a lower position. Further, the component temporary press-bonding device 30 recognizes the holding posture of the two recognition cameras 34 for recognizing the terminal portion 2 of the panel substrate 1 and the TCP 4 sucked and held by the temporary press-fit head 32 at the TCP supply position. The pre-center camera 36 is further provided. The panel substrate holding device 33 has an XY movement function, a θ rotation function, and a lifting function. In addition, the component pre-crimping operation by each of the pre-crimp heads 32 is pre-crimped by heating while pressing the TCP 4 through the ACF sheet 3 to the terminal portions 2 on the long side and short side of the panel substrate 1. Further, this temporary crimping operation is performed in a state where the terminal portion 2 of the panel substrate 1 is supported by a backup tool (an example of an edge support base) 35 from below.

  The crimping apparatus 40 presses the TCP 4 in a state of being temporarily crimped to the terminal portions 2 on the long side and the short side of the panel substrate 1 via the ACF sheet 3 with a higher pressing force and heating temperature than the temporary crimping. The plurality of pressure-bonding heads 41 as an example of a mounting head that performs the main pressure bonding, that is, thermocompression bonding (mounting), to the respective terminal electrodes 2a via the ACF sheet 3 by heating while the panel substrate is transferred. And a panel substrate holding device 43 that aligns each TCP 4 temporarily crimped to the terminal portion 2 of the held panel substrate 1 and each crimping head 41. The panel substrate holding device 43 has an XY movement function, a θ rotation function, and an elevation function. Further, in order to perform such alignment, two recognition cameras 44 that recognize the positions of the terminal portion 2 and the TCP 4 of the panel substrate 1 are provided. The main crimping operation by the crimping head 41 is performed in a state where the terminal portion 2 of the panel substrate 1 is supported from the lower surface side thereof by the backup tool 42 (an example of an edge support base).

  The substrate transfer device 50 includes a panel holding unit 51 that holds the lower surface of the panel substrate 1 by vacuum suction means (not shown) so as to be releasable, a lifting unit (not shown) that moves the panel holding unit 51 up and down, and a panel A moving device 53 is provided that moves the holding unit 51 and the elevating unit along the X-axis direction in the drawing to transfer the panel substrate 1 between the devices. Moreover, in the board | substrate conveyance apparatus 50, the panel holding | maintenance part 51 is separately arrange | positioned between each process, ie, between each apparatus, and the conveyance for delivery of the panel board | substrate 1 between apparatuses is mutually independent. It is possible to do. In the present embodiment, the case where the panel holding unit 51 holds the panel substrate 1 by vacuum suction means will be described as an example. However, instead of such a case, a panel having mechanical chuck means is provided. The panel substrate 1 may be held by the holding unit. Further, instead of providing an elevating unit (not shown) for performing the elevating operation of the panel holding unit 51, the elevating function of the panel holding devices 24, 33, 43 in each process without providing such an elevating unit. May be used to transport the panel substrate 1 between the devices in the Z-axis direction.

  Further, the component mounting line 100 is provided with a control device 19 that performs overall operation control of the respective devices 20, 30, 40, and 50 while associating them with each other's operations. The control device 19 sequentially controls the conveyance of the panel substrate 1 from the upstream device to the downstream device while performing individual operation control in each device, and the components for the plurality of panel substrates 1 are controlled. Mounting operation is performed. Note that the control method of the control device 19 may be a case where a centralized control method is adopted, or each device is individually provided and exchanges a transport control signal of the panel substrate 1 between the devices. It may be a case where a control method is performed.

  Next, in the component mounting line 100, the configuration of the panel substrate holding devices 24, 33, and 43 included in the devices 20, 30, and 30 will be described in detail. Since the panel substrate holding devices 24, 33, and 43 have the same configuration, the configuration of the panel substrate holding device 43 will be described as a representative. FIG. 3 shows a schematic plan view of the panel substrate holding device 43, FIG. 4 shows a schematic side view seen from the Y-axis direction, and FIG. 5 shows a schematic side view seen from the X-axis direction.

  As shown in FIGS. 3, 4, and 5, the panel substrate holding device 43 is disposed adjacent to each other along the X-axis direction, and the first stage 61 that individually mounts and holds the panel substrate 1. And a second stage 62. On the mounting surface of the panel substrate 1 which is the upper surface of the first stage 61 and the second stage 62, for example, suction means (not shown) for sucking and holding the mounted panel substrate 1 is provided.

  Further, the panel substrate holding device 43 includes θ rotation devices 63 and 64 for rotating and moving the first and second stages 61 and 62 in a horizontal plane (that is, θ rotation with the Z axis as a rotation axis), and first and second stages. Elevating devices 65 and 66 for moving the two stages 61 and 62 individually, and the first and second stages, the θ rotating devices 63 and 64, and the elevating devices 65 and 66 are integrally moved forward and backward along the Y-axis direction. Similarly, a Y-axis moving device 67 and an X-axis moving device 68 for moving forward and backward in the X-axis direction are provided. In the present embodiment, the X-axis moving device 68 and the Y-axis moving device 67 constitute a horizontal direction moving device. In addition, although the case where a single Y-axis moving device is provided as the Y-axis moving device 67 that moves the first and second stages 61 and 62 and the like integrally in the Y-axis direction has been described. Instead of such a case, a plurality of, for example, two Y-axis moving devices may be provided to integrally move the first and second stages 61, 62 and the like. That is, various configurations can be adopted as the configuration of the moving device as long as the first and second stages 61 and 62 can be integratedly moved back and forth along the Y-axis direction.

  Since the panel substrate holding device 43 has such a configuration, for example, the panel substrate 1 is held by the first stage 61 and another panel substrate 1 is also held by the second stage 62. Are moved by the θ rotation devices 63 and 64, moved up and down by the lifting devices 65 and 66, and moved in the XY direction by the Y-axis moving device 67 and the X-axis moving device 68. It is possible to align the backup tool 42 with the terminal portion 2 of each panel substrate 1.

  Next, a component mounting operation in the component mounting line 100 having such a configuration will be described. In addition, each operation | movement demonstrated below is controlled by the control apparatus 19, and is performed.

  First, the panel substrate 1 is carried into the component mounting line 100 shown in FIG. The carried-in panel substrate 1 is held by the panel holding unit 51 of the substrate transfer device 50 and is transferred in the X-axis direction in the drawing by the moving device 53 in the holding state, and the panel substrate holding device 24 of the ACF adhering device 20 is transferred. Placed on top. When the lower surface of the panel substrate 1 placed on the panel substrate holding device 24 is sucked and held, the suction holding by the panel holding portion 51 of the substrate transfer device 50 is released. The details of the method for placing (holding) the panel substrate 1 will be described later.

  Next, the XY movement of the panel substrate 1 held by the panel substrate holding device 24 is performed to align the long-side terminal portion 2 with the crimping unit 23, and then the crimping unit 23 is lowered. Then, the ACF sheet 3 is attached to the terminal portion 2 on the long side (ACF attaching step). In this positioned state, since the long side terminal portion 2 is directly supported by the backup tool 25 from the lower surface side, the ACF sheet 3 can be reliably adhered. . Thereafter, θ rotation of the respective stages 61 and 62 is performed by the panel substrate holding device 24 to align the terminal portion 2 on the short side and the crimping unit 23, and the ACF sheet 3 is moved by the crimping unit 23. Affixed to the terminal portion 2 on the short side. When the ACF adhering process is completed, the panel holding unit 51 of the substrate transfer device 50 holds the lower surface of the panel substrate 1 by suction, and the suction holding by the panel substrate holding device 24 is released, so that the panel substrate 1 is transferred to the substrate transfer device 50. Is passed on. Thereafter, the panel substrate 1 with the ACF sheet 3 attached thereto is conveyed to the component provisional pressure bonding device 30 by the substrate conveying device 50.

  In the substrate temporary crimping device 30, the panel substrate 1 transported by the substrate transport device 50 is placed on the panel substrate holding device 33 and delivered. On the other hand, the TCP 4 is supplied to the temporary press-bonding head 32 positioned at the TCP supply position, and the TCP 4 is sucked and held by the temporary press-bonding head 32. Thereafter, each temporary pressure bonding head 32 is rotated and the temporary pressure bonding head 32 holding the TCP 4 by suction is positioned at the temporary pressure bonding position. At the same time, various movements of the panel substrate 1 are performed by the panel substrate holding device 33, thereby aligning the terminal electrode 2 a of the terminal portion 2 on the long side 2 and the provisional pressure bonding head 32. When the pressure-bonding head 32 is lowered, the TCP 4 is temporarily pressure-bonded to the terminal electrode 2 a via the ACF sheet 3. Similar operations are sequentially repeated, and the TCP 4 is temporarily crimped to each terminal electrode 2a (component temporary crimping step). When the TCP 4 temporary crimping to the long side terminal portion 2 is completed, the panel substrate holding device 33 rotates the panel substrate 1 by θ, and the short side terminal portion 2 and the temporary crimping head 32 are aligned. In other words, the TCP 4 is temporarily crimped to the terminal electrodes 2a of the terminal portion 2 on the short side. When the component temporary press-bonding process is completed, the panel holding unit 51 of the substrate transfer device 50 holds the lower surface of the panel substrate 1 by suction, and the suction holding by the panel substrate holding device 33 is released, so that the panel substrate 1 is transferred to the substrate transfer device 50. Is passed on. Thereafter, the substrate transport apparatus 50 transports the panel substrate 1 in a state where the TCP 4 is temporarily press-bonded to the main press-bonding apparatus 40.

  In the main crimping device 40, the panel substrate 1 transported by the substrate transport device 50 is placed on the panel substrate holding device 43 and delivered. Thereafter, after the long-side terminal portion 2 of the panel substrate 1 is placed on the backup tool 42 by the panel substrate holding device 43, the respective thermocompression bonding heads 41 are lowered so that each of the temporary attachment states is in a temporarily attached state. The TCP 4 is heated while being pressed against each terminal electrode 2a through the ACF sheet 3, and the TCP 4 is mounted by thermocompression bonding (main pressure bonding step). The TCP 4 is pressed by the thermocompression bonding head 41 through a protective tape so that dirt or the like does not adhere to the pressing surface of the thermocompression bonding head 41. Further, the ACF sheet 3 is thermally cured by applying heat to the ACF sheet 3 from the thermocompression bonding head 41. When the main crimping process is completed, the panel holding unit 51 of the substrate transfer device 50 holds the lower surface of the panel substrate 1 by suction, and the suction holding by the panel substrate holding device 43 is released, so that the panel substrate 1 is transferred to the substrate transfer device 50. Delivered. Thereafter, the panel board 1 with the respective TCPs 4 mounted thereon is carried by the board carrying device 50 and carried out of the component mounting line 100. In the component mounting line 100, a plurality of panel substrates 1 are sequentially transported by the substrate transport device 50, and a predetermined process is performed in each device, whereby an outer lead bonding process is performed. The configuration in which the plurality of thermocompression bonding heads 41 are provided in the main compression bonding apparatus 40 in which the main compression bonding process is performed has been described. However, instead of such a configuration, an integrated thermocompression bonding head is provided. A simple configuration can also be adopted.

  Next, in each of the panel board holding devices 24, 33, and 43 provided in the component mounting line 100 of the present embodiment, the panel boards 1 of various sizes are held using different holding forms according to the sizes. A method will be described. In the following description, the panel substrate holding device 43 will be described as an example.

  As shown in FIG. 3, the panel substrate holding device 43 includes a first stage 61 and a second stage 62 arranged in the X-axis direction. In the present embodiment, in the panel substrate holding apparatus having two stages as described above, the reference values of the two substrate sizes as shown in FIG. 6 with respect to the size (planar size) of the panel substrate 1, That is, by setting the first reference value Q1 and the second reference value Q2 that is smaller than the first reference value, depending on the magnitude relationship between the respective reference values Q1 and Q2, the three types of holding forms are properly used. The panel substrate 1 is reliably held and efficiently mounted. Here, when the panel substrate 1 is held so that the center of the panel substrate 1 coincides with the holding center of either the first stage 61 or the second stage 62, the size of the panel substrate 1 is large. Either the first stage 61 or the second stage 62 with the size of the panel substrate 1 overlaid on the other stage (the mounting surface of the panel substrate 1) or one corner of the panel substrate as a position reference. When the panel substrate 1 is held on one stage, the substrate size at which the panel substrate 1 overlaps the other stage (the mounting surface of the panel substrate 1) is set as a first reference value Q1 (described later). (See FIG. 7C). Further, when it is assumed that the first stage 61 and the second stage 62 are substantially on the same plane, which is smaller than the first reference value Q1, the panel substrate 1 having the same size on each of the first stage 61 and the second stage 62. Is set as the second reference value Q2 (refer to FIG. 7A described later) that can be mounted (that is, two panel substrates 1 of the same size can be mounted in substantially the same plane).

  FIG. 8 is a flowchart showing the main procedure for properly using the holding form of the panel substrate 1. Moreover, the schematic explanatory drawing of each holding form is shown to FIG. 7A, FIG. 7B, and FIG. 7C.

  First, in step S <b> 1 of the flowchart of FIG. 8, the control device 19 acquires size data of the panel substrate 1 carried into the main crimping device 40 in the component mounting line 100. A first reference value Q1 and a second reference value Q2, which are reference values for the size of the panel substrate 1, are previously input and stored in the control device 19. Further, the size data of the panel substrate 1 may be related to the panel substrate 1 to be transferred and input to the control device 19 as data, or instead of such a case. In this case, a means for detecting the size of the panel substrate 1 may be provided, and the size data of the panel substrate 1 may be acquired by the detecting means.

  The control device 19 determines whether or not the size data of the panel substrate 1 to be loaded is equal to or less than the stored first reference value Q1 (step S2). When it is determined that it is equal to or less than the first reference value Q1, the plane center (or the center of gravity or the substantial center of the panel substrate 1) P1 of the panel substrate 1 is set as the holding center by the first stage 61 (step S3). ).

  Next, the control device 19 determines whether the size data of the panel substrate 1 is equal to or smaller than the stored second reference value Q2 (step S4). When it is determined that the value is equal to or smaller than the second reference value Q2, whether or not the panel substrate 1 having the same size as the panel substrate 1 to be loaded is further loaded (whether or not the loading preparation is completed) is confirmed. (Step S5). When it is confirmed in step S5 that the same size panel substrate 1 is loaded, that is, two panel substrates 1 of the same size are loaded, the plane center P1 of each panel substrate 1 and the second Position alignment is performed so that the centers of the first and second stages 61 and 62 coincide with each other, and the panel substrate 1 is placed and held on the first stage 61, and another panel substrate is also mounted on the second stage 62. 1 is placed and held (step S6). This holding form (state) is the state shown in FIG. 7A. That is, the two panel substrates 1 having the same size are held in the first and second stages 61 and 62 without interfering with each other.

  On the other hand, in the case where it is determined in step S5 that the panel substrate 1 of the same size is not carried in, the panel substrate 1 is not held by the second stage 62, and only the first stage 61 has the panel. The substrate 1 is placed and held (step S10). In this holding form, the plane center P1 of the panel substrate 1 is in a state of being coincident with the center of the first stage 61.

  If it is determined in step S4 that the size data of the panel substrate 1 exceeds the second reference value Q2, the panel substrate 1 is not held on the second stage 62. The panel substrate 1 is placed and held only on the first stage 61 (step S10). For example, when the panel substrate 1 having a size exceeding the second reference value Q2 is simultaneously held by the first and second stages 61 and 62, the panel substrates 1 interfere with each other. In order to reliably prevent such interference, the panel substrate 1 is held only by the first stage 61 as shown in step S4. This holding form (state) is the state shown in FIG. 7B. Further, in this holding form, the planar center P1 of the panel substrate 1 is in a state of being coincident with the center of the first stage 61.

  In step S2, if it is determined that the size data of the panel substrate 1 exceeds the first reference value Q1, the position (shifted) is shifted from the plane center of the panel substrate 1. Is set as the holding center P2 by the first stage 61 (step S8). After that, the eccentric holding center P2 and the first stage 61 are aligned, and the panel substrate 1 is placed and held on the first stage 61. At the same time, for example, the vicinity of the end of the panel substrate 1 is placed and supported on the upper surface of the second stage 62 (step S9). Such a holding form (state) is the state shown in FIG. 7C. The panel substrate 1 shown in FIG. 7A is a relatively large panel substrate 1 in the size of the panel substrate 1 held by the first stage 61 or the second stage 62, and the position eccentric from the center of the plane is the holding center. The deflection of the panel substrate 1 is supported by supporting the end portion of the panel substrate 1 on the second stage 62 by using the fact that the holding center is decentered while being held by the first stage 61 as P2. In addition, it is possible to reduce the stress load generated during moving and transporting. In the present embodiment, when the first stage 61 holds the relatively large and / or thin panel substrate 1 that exceeds the first reference value Q1, the panel is formed by at least a part of the second stage 62. If the substrate 1 is supported, an auxiliary support effect can be obtained. Thus, not only when the panel substrate 1 is supported by a part of the second stage 62, but also when the panel substrate 1 is supported by the entire mounting surface of the second stage 62. Good.

  7A, FIG. 7B, and FIG. 7C, in a state where the panel substrate 1 is held, the terminal portion 2 of the panel substrate 1 and the crimping head 41 are aligned, The TCP 4 is crimped and mounted on the panel substrate 1 (step S7).

  As shown in FIGS. 7A, 7B, and 7C, the plane center of the panel substrate 1 is basically set as the holding center, and the position shifted from the plane center is set to the large-sized panel substrate 1. Although the case of setting as the holding center has been described, other holding forms may be employed. For example, as shown in FIGS. 9A and 9B, a panel C of various sizes can be obtained by using one corner C (upper left corner in the figure) of a rectangular flat panel substrate as a position reference and changing the position reference. A holding form in which the substrate 1 is placed and held on the first stage 61 can also be adopted. Even in such a holding form, the panel substrate 1 having a size exceeding the first reference value Q1 can be held by the first stage 61 and supported by the second stage 62 in an auxiliary manner. Retention can be realized. Further, when such a holding form is adopted, the positional relationship between the two sides where the terminal portion 2 on which the TCP 4 is mounted is arranged and the first stage 61 regardless of the size of the panel substrate 1. Therefore, the time required for positioning the panel substrate 1 for component mounting and the pressure bonding head 41 can be made constant, which is advantageous in terms of transport tact.

  As described above, the holding form is properly used according to the size of the panel substrate 1, so that, for example, as shown in the schematic explanatory diagram of FIG. 10, the lifting and lowering operation of the held panel substrate 1 is performed. In some cases, the second stage 62 is raised or lowered integrally with the first stage 61 with respect to the large panel substrate 1, so that excessive stress or deflection is caused on the panel substrate 1. It can be prevented from occurring. In particular, when the panel substrate 1 is moved up and down in this way, excessive stress and deflection may occur with respect to the large panel substrate 1, but not only the first stage 61 but also the first substrate 61 By supporting the two stages 62 in an auxiliary manner, the panel substrate 1 can be securely held while being prevented from being damaged.

  On the other hand, the relatively small panel substrate 1 can be individually held by each of the first stage 61 and the second stage 62, and the time required for transporting the panel substrate 1 can be shortened and efficient. Component mounting can be realized.

  Further, the mounting (main press bonding) operation of the TCP 4 is performed on the long side terminal portion 2 in a state where the large panel substrate 1 is held by the first stage 61 and supplementarily supported by the second stage 62. As shown in FIG. 10, after the panel substrate 1 is separated from the backup tool 42 (not shown), the mounting operation of the TCP 4 is performed on the terminal portion 2 on the short side. As shown in the schematic explanatory diagram, first, the second stage 62 that performs auxiliary support is lowered and separated from the lower surface of the panel substrate 1. Thereafter, as shown in the schematic explanatory diagrams of FIGS. 12 and 13, the first stage 61 is rotated by 90 degrees θ in the horizontal plane, whereby the terminal portion 2 on the short side can be arranged along the X-axis direction. In addition, the TCP 4 can be mounted on the short side terminal portion 2. At this time, even if the auxiliary support of the second stage 62 is released, the panel substrate 1 rotated 90 degrees in the horizontal plane is subjected to centrifugal force along the horizontal plane of the panel substrate 1 to alleviate the deflection of the panel substrate 1. It can be rotated while. 13 and 14, the substrate that supports the panel substrate 1 at a position facing the backup tool 42 across the first stage 61 during the mounting operation on the short side terminal portion 2. A panel auxiliary support 69, which is an example of a support auxiliary member, may be further provided. The panel auxiliary support 69 is preferably provided with an elevating function.

  In the description of the above-described embodiment, the panel substrate 1 having a size exceeding the first reference value Q1 is held by the first stage 61 and supplementarily supported by the second stage 62. Although such a holding | maintenance form was demonstrated, this embodiment is not restricted only about such a case. Instead of such a case, the panel substrate 1 may be held (for example, held by suction) by the second stage 62.

  When the mounting region on the short side of the panel substrate 1 is arranged on the upstream side in the transport direction in the X-axis direction, which is the transport direction of the panel substrate 1, the panel is mounted on the first stage 61 located on the upstream side in the transport direction. When the substrate 1 is held and, on the contrary, the mounting region on the short side of the panel substrate 1 is arranged on the downstream side in the transport direction, the panel substrate 1 is held on the second stage 62 located on the downstream side in the transport direction. Is preferred. By doing in this way, the place nearer the mounting area on the short side of the panel substrate 1 can be reliably supported by the stage.

  Further, the holding form of the panel board 1 in the panel board holding apparatus 43 provided in the component mounting line 100 has been described, but the same holding form can be applied to the other panel board holding apparatuses 24 and 33.

  In addition, the description has been given of the case where the TCP4 mounting operation is performed on the short side terminal portion 2 after the TCP4 mounting operation is performed on the long side terminal portion 2, but instead of such a case, First, the mounting operation may be performed from the short side terminal portion 2 side, and then the mounting operation to the long side terminal portion 2 may be performed. In this case, the auxiliary support of the panel substrate 1 is similarly used during the mounting operation to the terminal portion 2 on the short side.

  In addition, the first reference value Q1 and the second reference value Q2, which are references for selecting the holding form of the panel substrate 1, are specifications such as the strength due to the increase in size and / or thickness of the panel substrate 1 to be handled, It is desirable to set an appropriate value based on conditions such as the distance between the stage 61 and the second stage 62 and the size of the holding surface. Specifically, when the panel substrate 1 is held such that the center of the panel substrate 1 coincides with the holding center of either the first stage 61 or the second stage 62, the size of the panel substrate 1 is reduced. The size of the panel substrate 1 that is large and the panel substrate 1 overlaps the other stage, or the panel substrate 1 on one of the first stage 61 and the second stage 62 with one corner of the panel substrate as a position reference. Is held as the first reference value Q1, and the first stage 61 and the second stage 62 are substantially smaller than the first reference value Q1. In other words, the same size panel substrate 1 can be placed on the first stage 61 and the second stage 62 at the same time. Chi, it is desirable to set the placement possible) substrate size two panel substrates 1 of the same size at substantially the same plane as the second reference value Q2.

  In the description of the above embodiment, when it is determined that the size of the panel substrate 1 is equal to or smaller than the second reference value Q2, the panel substrate 1 having the same size is placed on each of the first stage 61 and the second stage 62. Although the case where the respective steps are performed while being held at the same time has been described, the present invention is not limited only to such a case. Instead of such a case, after one panel substrate 1 is first held by the first stage 61 and a predetermined operation such as positioning is performed, another panel substrate 1 is placed on the second stage 62. The timing at which the two panel substrates 1 are held on the stages 61 and 62 may be different.

  According to the present embodiment, in a panel substrate holding apparatus having two stages, various panel substrates 1 having different sizes are held in a holding form corresponding to the size, so that excessive stress and deflection are applied to the panel. Efficient component mounting can be performed while reliably preventing occurrence on the substrate 1.

  It is to be noted that, by appropriately combining arbitrary embodiments of the various embodiments described above, the effects possessed by them can be produced.

FIG. 1 is an external view of a panel substrate handled in a component mounting line according to an embodiment of the present invention. External view of panel board handled by component mounting line of this embodiment (ACF sheet attached state) External view of the panel board handled in the component mounting line of this embodiment (TCP temporary press-bonded state) Schematic plan view of the component mounting line of this embodiment Schematic plan view of the panel substrate holding device provided in this crimping device Schematic side view of the panel substrate holding device of FIG. 3 as seen from the Y-axis direction. Schematic side view of the panel substrate holding device of FIG. 3 viewed from the X-axis direction Schematic plan view for explaining the standard value of the panel substrate size Schematic diagram showing how to hold a panel substrate (small panel substrate) having a size less than or equal to the second reference value Schematic diagram showing a holding form of a panel substrate (medium panel substrate) having a size equal to or smaller than the first reference value and exceeding the second reference value Schematic diagram showing how to hold a panel substrate (large panel substrate) with a size exceeding the first reference value Flow chart showing a procedure for selecting a holding form according to the size of the panel substrate The schematic diagram which shows the holding | maintenance form of the panel board | substrate (small panel board | substrate) concerning the modification of this embodiment The schematic diagram which shows the holding | maintenance form of the panel board | substrate (large sized panel board | substrate) concerning the modification of this embodiment Schematic explanatory diagram showing a state in which the large panel substrate is moved up and down while being held by the stage It is a schematic explanatory drawing which shows the procedure of the rotation operation | movement for changing direction of a large sized panel board | substrate, Comprising: The figure which shows the state which has lowered | hung the 2nd stage It is a schematic explanatory view showing the procedure of the rotation operation for changing the direction of the large-sized panel substrate, and shows a state in which the first stage is rotating (side view) FIG. 6 is a schematic explanatory view showing a procedure of a rotating operation for changing the direction of a large panel substrate, and showing a state in which the first stage is rotating (plan view) Schematic diagram showing a configuration in which a panel substrate support device is further provided with a panel auxiliary support

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Panel substrate 2 Terminal part 2a Terminal electrode 3 ACF sheet 4 TCP
DESCRIPTION OF SYMBOLS 19 Control apparatus 20 ACF sticking apparatus 21 Tape supply part 22 Tape collection | recovery part 23 Crimp unit 24 Panel board holding apparatus 25 Backup tool 30 Component temporary crimping apparatus 32 Crimping head 33 Panel board holding apparatus 40 Main crimping apparatus 41 Crimping head 42 Backup tool 43 Panel substrate holding device 50 Substrate transport device 51 Panel holding unit 53 Moving device 61 First stage 62 Second stage 63, 64 θ rotating device 65, 66 Lifting device 67 Y axis moving device 68 X axis moving device 69 Panel auxiliary support 100 Component mounting line P1 Holding center P2 Eccentric holding center Q1 First reference value Q2 Second reference value

Claims (8)

A component that mounts a component in a component mounting region disposed on the upper surface of the edge of the substrate by holding the substrate in a substrate holding device including first and second stages arranged adjacent to each other to place and hold the substrate In the implementation method,
Determining whether the size of the substrate held by the substrate holding device is equal to or less than a predetermined reference value;
When it is determined that the value is equal to or less than the reference value, the substrate is held only by the first stage with the substantial plane center of the substrate as the holding center, and the component is mounted on the component mounting region of the substrate. Implement,
When it is determined that the reference value is exceeded, the substrate is held by the first stage with the position decentered from the substantial plane center of the substrate as the holding center, and the first stage A component mounting method comprising: supporting a held substrate by the second stage, and mounting a component on the component mounting region of the substrate. A component that mounts a component in a component mounting region disposed on the upper surface of the edge of the substrate by holding the substrate in a substrate holding device including first and second stages arranged adjacent to each other to place and hold the substrate In the implementation method,
Determining whether the size of the substrate held by the substrate holding device is equal to or less than a predetermined reference value;
When it is determined that the reference value is equal to or less than the reference value, the first corner is positioned at a predetermined position with respect to the first stage, with one corner of the rectangular substrate as a position reference. Hold the board only by the stage, and mount the component on the component mounting area of the board,
When it is determined that the reference value is exceeded, the first corner is positioned at the predetermined position with respect to the first stage with the one corner of the substrate as a position reference. A component mounting method characterized by holding a substrate by a stage and mounting a component on the component mounting region of the substrate by supporting the substrate held by the first stage by the second stage. . The mounting of the component on the substrate is performed by placing the edge portion on one side of the substrate on the edge support base and crimping the component to the edge portion with a crimping head,
With respect to the substrate determined to exceed the reference value, the raising / lowering operation of the substrate for alignment between the edge support base and the edge raises the first and second stages together. Alternatively, the component mounting method according to claim 1, wherein the component mounting method is performed by lowering.   The second stage is lowered with respect to the substrate determined to exceed the reference value, the support of the substrate is released by the second stage, and then the first stage is rotated horizontally to obtain the substrate. The said edge part in other one side is mounted in the said edge part support stand, and the said component is crimped | bonded with the crimping | compression-bonding head with respect to the said edge part in said other one side, Component mounting is performed. Component mounting method.   After the first stage is rotated horizontally, component mounting is performed in a state in which the board is supplementarily supported by a board support auxiliary member disposed at a position facing the edge support base via the first stage. The component mounting method according to claim 4, wherein the component mounting method is performed. Using the predetermined reference value, which is the size of the substrate, as a first reference value, it is determined whether the size of the substrate held by the substrate holding device is equal to or smaller than the first reference value, and the first A predetermined value that is smaller than the reference value and can be mounted on the second stage together with the first stage is set as a second reference value, and the substrate size is equal to or smaller than the second reference value. To determine whether
When it is determined that the value is equal to or less than the second reference value, the substrate is held on the first stage, and another substrate having the same size as the substrate is held on the second stage. The component mounting method according to claim 1, wherein the component is mounted. A first stage and a second stage arranged adjacent to each other for mounting and holding a substrate having a component mounting area on which the component is mounted at the edge thereof;
A horizontal movement device capable of integrally moving the first and second stages in the horizontal direction;
An edge support base on which the edge of the substrate held on the first or second stage is placed;
A crimping head for crimping and mounting a component on the component mounting region of the substrate placed on the edge support; and
It is determined whether or not the size of the substrate held by the substrate holding device is equal to or smaller than a predetermined reference value. When it is determined that the size is equal to or smaller than the reference value, the substantial plane center of the substrate is When it is determined that the substrate is held only by the first stage as the holding center and exceeds the reference value, the position decentered from the substantial plane center of the substrate is used as the holding center as the holding center. A component mounting apparatus comprising: a control device that holds the substrate by the first stage and that supports the substrate held by the first stage by the second stage . A first stage and a second stage arranged adjacent to each other for mounting and holding a rectangular substrate having a component mounting area on which the component is mounted;
A horizontal movement device capable of integrally moving the first and second stages in the horizontal direction;
An edge support base on which the edge of the substrate held on the first or second stage is placed;
A crimping head for crimping and mounting a component on the component mounting region of the substrate placed on the edge support; and
It is determined whether or not the size of the substrate held by the substrate holding device is equal to or smaller than a predetermined reference value. If it is determined that the size is equal to or smaller than the reference value, one corner portion of the substrate is determined as a position reference. When the substrate is held only by the first stage so that the one corner is positioned at a predetermined position with respect to the first stage, and on the other hand, when it is determined that the reference value is exceeded, the substrate is The substrate is held by the first stage so that the one corner is positioned at the predetermined position with respect to the first stage with the one corner of the substrate as a position reference, and the substrate is held by the first stage. A component mounting apparatus comprising: a control device that supports the substrate by the second stage .

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