JP5017723B2 - Microchip having optical measurement cuvette and method of using the same - Google Patents

Description

  The present invention relates to a microchip useful as a micro-TAS (Micro Total Analysis System) that is suitably used for biochemical tests such as DNA, proteins, cells, immunity and blood, chemical synthesis, and environmental analysis.

  In recent years, the importance of detecting, detecting or quantifying biological substances such as DNA (Deoxyribo Nucleic Acid), enzymes, antigens, antibodies, proteins, viruses and cells, and chemical substances in fields such as medicine, health, food, and drug discovery There have been proposed various biochips and microchemical chips (hereinafter collectively referred to as microchips) that can be easily measured. Microchips can perform a series of experiments and analysis operations performed in the laboratory within a chip of several centimeters to 10 centimeters square and several millimeters to several centimeters in thickness. However, it has many advantages such as low cost, high reaction speed, high-throughput inspection, and the ability to obtain the inspection result immediately at the site where the sample is taken.

  The microchip has a fluid circuit therein, and the fluid circuit includes, for example, a liquid reagent holding unit that holds a liquid reagent, a sample (for example, blood), a weighing unit that measures a liquid reagent, and a sample. Each part such as an optical measurement cuvette (detection part) for analyzing and / or inspecting the mixed liquid, and a fine flow path (for example, several) The width is about 100 μm). The microchip is typically used by being mounted on a device (centrifuge) capable of applying a centrifugal force thereto. By applying a centrifugal force in an appropriate direction to the microchip, the sample and liquid reagent can be weighed, mixed, and introduced into the optical measurement cuvette. Inspection / analysis of the liquid mixture introduced into the optical measurement cuvette (for example, detection of a specific component in the liquid mixture) is, for example, substantially perpendicular to the microchip surface to the optical measurement cuvette containing the liquid mixture. The detection light can be irradiated from various angles, and the transmittance can be measured.

  In this way, by using a microchip, it is possible to conduct experiments / analysis etc. with an extremely small amount of solution compared to conventional experiments / analysis systems using pumps, pipettes, stirrers, etc. When the amount of liquid is very small (several tens of microliters) and the cross-sectional diameter of the optical measurement cuvette needs to be reduced, it is difficult to accurately align the optical measurement cuvette with the optical axis of the detection light. was there. In particular, in a microchip that controls the liquid movement or the like in the fluid circuit using centrifugal force, the microchip may move slightly in the microchip mounting portion in the centrifugal device due to the centrifugal force. Is remarkable. In particular, when using a centrifuge that integrates the centrifuge and the optical measurement means and cannot move the light source position itself, it cannot be aligned with the optical axis by fine adjustment of the light source position. Therefore, it is necessary to make the microchip itself have a structure capable of accurately aligning with the optical axis.

  In addition, although the prior art about this invention was demonstrated based on the general technical information which the applicant acquired, the information which should be disclosed as prior art literature information before filing in the range which an applicant memorize | stores. Applicant does not have.

  As a solution to the above problem, it is conceivable to increase the cross-sectional area of the optical measurement cuvette irradiated with the detection light and facilitate the alignment of the optical axis, but this should be introduced into the optical measurement cuvette. It becomes necessary to increase the amount of liquid, and the merit of using a microchip is reduced.

  The present invention has been made in view of such a situation, and an object of the present invention is to provide a microchip capable of accurately aligning an optical measurement cuvette and an optical axis and a method of using the microchip. .

  The present invention has an optical measurement cuvette formed by laminating a first substrate having a groove provided on the substrate surface or a through hole penetrating in the thickness direction, and one or more second substrates. A microchip, wherein the cuvette for optical measurement is composed of the groove or the through hole and the substrate surface of the second substrate, and the side wall surface of the second substrate is at least a part of the side wall surface of the microchip. Provides a microchip located inside the side wall surface of the first substrate. Here, in all the side wall surfaces of the microchip, the side wall surface of the second substrate may be located inside the side wall surface of the first substrate.

  In the microchip of the present invention, the substrate surface of the second substrate is preferably smaller than the substrate surface of the first substrate.

  In addition, the side wall surface of the first substrate in the at least part of the side wall surface of the microchip, in which the side wall surface of the second substrate is located inside the side wall surface of the first substrate, has a protrusion on the surface thereof. It is preferable not to have, and it is more preferable that it is a plane.

  Further, the present invention is a method for using any one of the above microchips, wherein a centrifugal force can be applied, and the microchip is mounted on a device having a portion on which the microchip is mounted. Including a step of applying centrifugal force in one or more directions, and the direction of the centrifugal force that is finally applied to the microchip is such that the side wall surface of the second substrate is inside the side wall surface of the first substrate. A method of using a microchip in which the side wall surface of the microchip located in a direction is pressed against an inner wall surface of a portion on which the microchip is mounted is provided.

  In the microchip of the present invention, at least a part of the side wall surface of the first substrate having grooves or through holes mainly constituting the optical measurement cuvette is positioned outside the side wall surface of the second substrate to be bonded. (I.e., projecting). According to the microchip having such a configuration, the protruding side wall surface of the first substrate is a surface that is pressed against the fixed surface of the microchip mounting portion of the centrifuge device, so that the optical axis of the detection light in the optical measurement can be reduced. The alignment accuracy with the cuvette for optical measurement can be improved.

<First Embodiment>
1 to 3 are schematic views showing an example of the microchip according to the first embodiment. FIG. 1 is a schematic top view, FIG. 2 is a schematic perspective view, and FIG. 3 is a schematic exploded perspective view. 1-3, the microchip 100 includes a first substrate 101 and two second substrates 102a and 102b, which are transparent substrates, and the second substrates 102a and 102b serve as the first substrate 101. It is pasted so that it can be held. The first substrate 101 has a total of seven through holes 103 penetrating in the thickness direction, and the substrate surfaces of the two second substrates 102 a and 102 b seal the opening of the through hole 103. Yes. The diameter of the opening on the second substrate 102b side of the through hole 103 is about 1 mm, and the diameter of the opening on the second substrate 102a side is about 1.5 mm. The cavity formed by the through-hole 103 and the second substrate surface is a microchip optical measurement cuvette. For example, the optical measurement cuvette may be connected to the microchip surface from below the microchip. By irradiating detection light in a substantially vertical direction and measuring the transmittance, etc., the inspection of the liquid (for example, a mixture of a sample (blood, etc.) and a liquid reagent) contained in the optical measurement cuvette Analysis (for example, detection of a specific component in the mixed solution) is performed. In addition to the cuvette for optical measurement, the microchip 100 is not particularly limited. For example, a measuring unit for measuring a sample or a liquid reagent, a mixing unit for mixing the sample and the liquid reagent, and other necessary units are provided. And a fine channel (including a channel for introducing a liquid into the optical measurement cuvette) that appropriately connects these parts are formed, but they are omitted in FIGS. ing.

  In this embodiment, a black substrate is used as the first substrate 101, and the size is about 62 mm in width (A in FIG. 1) × about 30 mm in length (B in FIG. 1) × about 9 mm in thickness. On the other hand, the two second substrates 102 a and 102 b that are transparent substrates have a substrate surface smaller than the substrate surface of the first substrate 101. Specifically, the outer shapes of the substrate surfaces of the second substrates 102 a and 102 b are approximately the same as those of the first substrate 101, but have a slightly smaller size than the first substrate 101. (See FIG. 1). By bonding the first substrate 101 and the second substrates 102a and 102b in an appropriate arrangement, the side walls of the second substrates 102a and 102b are formed on the first substrate 101 over the entire outer periphery of the microchip. A region where the substrate surface of the first substrate 101 is partially exposed with a width of approximately 0.3 mm (C in FIG. 1) when the microchip is viewed from above and below from the side wall surface of the substrate. Is formed. Note that the thickness of the second substrates 102a and 102b is 1.6 mm.

  Thus, in the microchip 100, the side wall surface of the first substrate 101 having the through hole 103 mainly constituting the optical measurement cuvette protrudes from the side wall surfaces of the bonded second substrates 102a and 102b. It has a side wall surface region. In the present embodiment, the protruding side wall surface region is formed over the entire outer periphery of the microchip. Hereinafter, among the side wall surfaces of the first substrate, the side wall surface protruding from the side wall surface of the second substrate (located on the outside of the microchip) is referred to as the “projecting side wall surface” of the first substrate. To do. As described above, according to the microchip in which the substrate on which the portion (through hole) mainly constituting the optical measurement cuvette is formed has the protruding side wall surface, the protruding side wall surface of the first substrate is connected to the microscopic portion of the centrifuge. By setting the surface to be pressed against the fixed surface in the chip mounting portion (hereinafter also referred to as “alignment reference surface”), the alignment accuracy between the optical axis of the detection light and the cuvette for optical measurement in optical measurement is improved. be able to. Hereinafter, this point will be described in more detail.

  As described above, in a microchip having a fluid circuit inside, such as the microchip of the present invention, the sample, the liquid reagent are metered in the fluid circuit, the sample and the liquid reagent are mixed, and the sample, the liquid reagent and the mixture are mixed. A series of operations such as movement of the liquid to each part (for example, introduction of the liquid into the optical measurement cuvette) can be performed by applying a centrifugal force in an appropriate direction to the microchip. Application of centrifugal force to the microchip is performed using, for example, a centrifuge having a microchip mounting portion for mounting the microchip.

  A centrifugal device that applies centrifugal force to a microchip has, for example, a circular stage that can freely rotate (rotate to revolve the microchip) around a centrifugal center, and is provided on the surface of the stage or on the stage. The microchip mounting portion can be provided on the surface of a circular stage for rotating the microchip. The configuration of the microchip mounting portion is not particularly limited, and can be, for example, a groove for fitting a microchip having substantially the same shape as the outer shape of the microchip, or a fixed wall that supports the mounted microchip. It can also consist of. FIG. 4 is a schematic perspective view showing a state in which a microchip is mounted on a centrifuge provided with a microchip mounting portion composed of a fixed wall for supporting the microchip. As shown in FIG. 4, the microchip mounting portion 200 can be provided with a fixture 203 using, for example, a leaf spring or a spring for fixing the position of the mounted microchip. The microchip placed on the circular stage 201 of the centrifuge and placed along the fixing walls 202a and 202b for supporting the microchip is pressed by the fixture 203, and the circular stage 201 is moved in this state. Centrifugal force is applied by rotating.

  After a predetermined centrifugal operation is performed, detection light is irradiated toward the optical measurement cuvette of the microchip from an optical measurement device (not shown) located at the lower part of the circular stage 201, and its transmittance is measured. By doing so, inspection and analysis are performed. In the microchip of the present embodiment having a plurality of optical measurement cuvettes, different types of liquids can be accommodated in each optical measurement cuvette, and a plurality of inspections and analyzes are performed with one microchip. be able to. The optical measurement cuvette can be irradiated with the detection light by rotating the circular stage 201 and sequentially arranging the optical measurement cuvettes on the optical axis of the detection light.

  Here, as described above, even when the microchip mounted on the microchip mounting portion 200 is supported by a fixture or the like, the microchip is applied within the microchip mounting portion 200 by application of centrifugal force. The optical measurement cuvette and the optical axis of the detection light may be displaced from each other, which may make optical measurement difficult. Therefore, in order to eliminate such misalignment and allow the opening of the optical measurement cuvette to be disposed on the optical axis, at least the centrifugal force applied last to the microchip (i.e., The direction of the centrifugal force applied immediately before the optical measurement is set to a direction in which any side wall surface of the microchip is pressed against, for example, the fixed wall 202a (see FIG. 4). It is important to finely adjust the position of the microchip and place and fix it at an appropriate position for optical measurement. At this time, when the microchip is pressed against the fixed wall and the position is adjusted, the microchip mounting part 200 is installed at a position where the optical measurement cuvette can be disposed on the optical axis by the rotation of the circular stage 201. . When the microchip mounting portion is a groove for fitting the microchip, the fixed wall that presses against the side wall surface of the microchip is the inner wall surface of the groove.

  However, even if the microchip side wall surface can be pressed against the inner wall surface of the fixed wall of the microchip mounting portion by such a final centrifugation operation, the microchip not according to the present invention is used. For the following reasons, it may be difficult to align the optical axis of the detection light with the optical measurement cuvette. That is, a microchip configured such that the side wall surface of the first substrate and the side wall surface of the second substrate form the same surface (that is, the first substrate does not have a protruding side wall surface) or In the microchip in which the side wall surface of the second substrate is located outside the side wall surface of the first substrate (that is, the microchip having the protruding side wall surface of the second substrate), Many manufacturing factors that cause fluctuations in the microchip side wall surface structure, such as fluctuations in the dimensions of the first and second substrates, and misalignment when the first and second substrates are bonded to each other, are considered. It is. For example, in a microchip configured such that the side wall surface of the first substrate and the side wall surface of the second substrate form the same surface, the first substrate and the second substrate are bonded together. The side wall surface of the first substrate or the second substrate may protrude due to a slight misalignment or the like. In addition, in the microchip in which the side wall surface of the second substrate is located outside the side wall surface of the first substrate, the microchip protrudes due to a slight misalignment when the first substrate and the second substrate are bonded together. Can vary from microchip to microchip.

  Therefore, in the microchip as described above, since it is difficult to sufficiently control the protruding accuracy of the protruding sidewall surface, the fluctuation of the structure of the microchip sidewall surface between the microchips tends to increase. Even when the microchip side wall surface is pressed against the inner wall surface of the fixed wall of the microchip mounting portion by applying a centrifugal force, the optical measurement cuvette and the inner wall surface are between the microchips. The relative positional relationship is likely to vary, and as a result, it may be difficult to align the optical measurement cuvette with the optical axis of the detection light. In addition, when the bonding deviation between the first substrate and the second substrate occurs, the coordinates of the optical measurement cuvette are displaced, or the perpendicularity between the light incident surface of the optical measurement cuvette and the optical axis. Is expected to get worse.

  On the other hand, according to the microchip of the present embodiment having the protruding side wall surface on the first substrate provided with the through holes constituting the optical measurement cuvette, the alignment accuracy between the optical measurement cuvette and the optical axis is mainly In addition, since it depends only on the dimensional accuracy of the first substrate (position accuracy of the through hole in the first substrate, etc.), the minute dimensional fluctuation of the second substrate and the second substrate at the time of substrate bonding Regardless of a slight positional deviation, accurate alignment with the optical axis can be achieved. As described above, in this embodiment, the alignment accuracy between the optical measurement cuvette and the optical axis mainly depends on the dimensional accuracy of the first substrate. This is because the (through hole) is formed in the first substrate.

  The microchip 100 of the present embodiment has the protruding side wall surface of the first substrate over the entire side wall surface. Therefore, the “alignment reference plane” to be pressed against the inner wall surface of the fixed wall of the microchip mounting portion may be any side wall surface of the microchip. However, considering that the alignment accuracy between the optical measurement cuvette and the optical axis depends on the dimensional accuracy of the first substrate, the protruding side wall surface of the side wall surface closest to the optical measurement cuvette is used as the alignment reference surface. It is preferable. In this respect, in the microchip 100 of the present embodiment, the protruding side wall surfaces X and X ′ shown in FIGS. 2 and 3 or the protruding side wall surface on the side facing the protruding side wall surface are used as alignment reference surfaces. It is preferable to do. Here, the protruding side wall surfaces X and X ′ are on the same plane. FIG. 5 is a schematic perspective view showing a state in which the position of the microchip 100 is adjusted by mounting the microchip 100 of the present embodiment on the microchip mounting portion of the centrifuge and applying centrifugal force in the direction of the arrow. In FIG. 5, the protruding side wall surfaces X and X 'are used as alignment reference surfaces. By the application of centrifugal force in the direction of the arrow, the protruding side wall surfaces X and X ′ are pressed against and closely contacted with the inner wall surface of the fixed wall 202a. Thereby, alignment of the microchip 100 within the microchip mounting portion is performed.

  The protruding side wall surface of the first substrate set as the alignment reference surface preferably has no protrusion on the surface. For example, when the first substrate is manufactured by injection molding, the gate position may be set in the side wall surface of the first substrate, but a projection is formed on the side wall surface due to this. There is. Therefore, when the gate position is set in the side wall surface, it is preferable to provide the gate position on the side wall surface that is not used as the alignment reference surface. If there is a protrusion on the alignment reference surface, the relative positional relationship between the optical measurement cuvette and the inner wall surface of the fixed wall varies depending on the degree of the protrusion. As a result, the optical measurement cuvette and the optical axis of the detection light This is because it may be difficult to align the positions.

  Moreover, it is preferable that the protrusion side wall surface of the 1st board | substrate set to an alignment reference plane is a plane. As a result, when the microchip is aligned by applying a centrifugal force and pressing the alignment reference surface against the inner wall surface of the fixed wall, the alignment can be performed on the surface. Can be improved. When the protruding side wall surface of the first substrate is also in the form of a point or a dot, accurate alignment may not be performed when the wall surface is pressed against the inner wall surface of the fixed wall.

  Moreover, it is preferable that the protruding side wall surface of the first substrate set as the alignment reference surface is the most protruding side wall surface among the side wall surfaces of the microchip. Thereby, a microchip mounting part can be produced comparatively easily. As described above, the microchip mounting portion in the centrifugal device can be, for example, a groove (holder) for fitting the microchip, but when the microchip has a side wall surface protruding from the protruding side wall surface, the groove The groove of the microchip mounting portion is structured so as to allow the protruding side wall surface to escape (for example, accommodate the protruding portion) so that the pressing of the protruding side wall surface (reference surface) to the fixed wall is not hindered. (Holder) needs to be formed. However, such a structure of the microchip mounting portion may be difficult to produce by injection molding or drill molding. Note that, according to the microchip of this embodiment having the protruding side wall surface on the first substrate, it is easy to create the microchip mounting portion for the same reason as described above. That is, when the second substrate has a protruding side wall surface, and the side wall surface of the first substrate is set as the alignment reference surface, a structure in which the protruding portion of the second substrate escapes to the microchip mounting portion. Although it is necessary to form, such a structure may be difficult to create.

  The microchip of this embodiment can be variously modified without departing from the spirit of the present invention. First, the numerical values related to the dimensions of the microchip described above are merely examples, and are not limited to the above numerical values. In the present embodiment, the protruding width (C in FIG. 1) of the side wall surface of the first substrate 101 with respect to the second substrate is about 0.3 mm. However, the present invention is not limited to this. When the vertical and horizontal lengths of the substrate are the above values, the length can be about 1 mm or less. The protrusion width does not need to be uniform over the entire outer periphery of the microchip, and the protrusion width with respect to the second substrate 102a and the protrusion width with respect to the second substrate 102b may be the same or different.

  In the present embodiment, the protruding sidewall surface is formed over the entire outer periphery of the microchip. However, the present invention is not limited to this, and the protruding sidewall surface is formed at least in the region set as the alignment reference surface. Just do it. However, considering the control of the dimensional accuracy during substrate manufacturing and the ease of control of the bonding position accuracy during substrate bonding, the outer shape of the first substrate surface is substantially similar to that of the first substrate, and is slightly reduced. A method of manufacturing a microchip having a protruding side wall formed over the entire outer periphery by manufacturing a second substrate having the size and attaching the second substrate to the first substrate is preferable.

  In the present embodiment, seven through holes constituting the optical measurement cuvette are provided in the first substrate. However, the present invention is not limited to this, and one or more optical measurement cuvettes may be provided. The first substrate does not necessarily need to be a black substrate, and may be a transparent substrate or another colored substrate. However, when the first substrate and the second substrate are bonded by fusion of the substrate surface by light irradiation, and the second substrate is a transparent substrate, the first substrate is a colored substrate. It is preferable to use a black substrate. The blackening can be performed, for example, by adding a black pigment such as carbon black to a resin used as a substrate material. The second substrate does not necessarily have to be transparent as a whole, but at least a region for sealing the opening of the through hole of the first substrate needs to be transparent so that optical measurement can be performed. is there.

  Furthermore, the external shape of the microchip is not limited to the shape of the present embodiment, and various shapes can be adopted. FIG. 6 is a schematic perspective view showing another example of the microchip of the present invention. Similar to the microchips of FIGS. 1 to 3, the microchip 400 shown in FIG. 6 includes a first substrate 401 and two second substrates 402a and 402b, which are transparent substrates, and a second substrate 102a. And 102b are bonded so as to sandwich the first substrate 101, and the protruding side wall surface of the first substrate is formed over the entire outer periphery of the microchip. In the microchip shown in FIG. 6, for example, the protruding side wall surface on the protruding side wall surface Y or the side wall surface located on the opposite side can be used as the alignment reference surface.

<Second Embodiment>
7 to 9 are schematic views illustrating an example of a microchip according to the second embodiment, in which FIG. 7 is a schematic top view, FIG. 8 is a schematic side view, and FIG. 9 is a schematic perspective view. The microchip 500 shown in FIGS. 7 to 9 includes a first substrate 501 that is a transparent substrate and a second substrate 502 that is a black substrate, and an opening in a groove 503 provided on the surface of the first substrate 501. The portions are bonded together so as to be sealed by the substrate surface of the second substrate 502. The cavity formed by the groove 503 and the second substrate surface is a microchip optical measurement cuvette. In the microchip of this embodiment, the detection light is applied to the optical measurement cuvette, for example, at an angle substantially parallel to the microchip surface. 7 to 9, the other parts of the fluid circuit and the flow paths are omitted as in the case of FIGS.

  In the microchip of this embodiment, the second substrate 502 has a substrate surface smaller than the substrate surface of the first substrate 501. Specifically, the outer shape of the substrate surface of the second substrate 502 is approximately the same as that of the first substrate 501, but has a size slightly reduced as compared with the first substrate 501. (See FIG. 7). By bonding the first substrate 501 and the second substrate 502 together, the first substrate is a substrate in which a part (groove) mainly constituting the optical measurement cuvette is formed over the entire outer periphery of the microchip. A protruding sidewall surface is formed on the substrate. With this configuration, the same effect as in the first embodiment can be obtained.

  Here, in the microchip of the present embodiment, the alignment reference surface can be set to any protruding side wall surface. For example, referring to FIG. 9, the protruding sidewall surface Z1, Z2 or Z3 can be used as the alignment reference surface, and the other protruding sidewall surface can be used as the alignment reference surface. However, considering that the alignment accuracy between the optical measurement cuvette and the optical axis depends on the dimensional accuracy of the first substrate, the protruding side wall surface of the side wall surface closest to the optical measurement cuvette is used as the alignment reference surface. It is preferable. Further, considering the parallelism between the optical measurement cuvette and the optical axis and the perpendicularity between the light incident end face of the optical measurement cuvette and the optical axis, it is preferable to use the protruding side wall surface Z2 or Z3 as the alignment reference surface. . The protruding side wall surface of the first substrate that serves as the alignment reference surface preferably has no protrusions, and more preferably is a flat surface. Further, the microchip of this embodiment can be modified in the same manner as in the first embodiment.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

1 is a schematic top view showing an example of a microchip according to a first embodiment of the present invention. 1 is a schematic perspective view showing an example of a microchip according to a first embodiment of the present invention. 1 is a schematic exploded perspective view showing an example of a microchip according to a first embodiment of the present invention. It is a schematic perspective view which shows the state which mounted the microchip in the centrifuge provided with the microchip mounting part comprised from the fixed wall for microchip support. It is a schematic perspective view which shows a mode that the microchip of 1st Embodiment is mounted in the microchip mounting part of a centrifuge, and the position of a microchip is adjusted by applying a centrifugal force. It is a schematic perspective view which shows another example of the microchip of this invention. It is a schematic top view which shows an example of the microchip which concerns on the 2nd Embodiment of this invention. It is a schematic side view which shows an example of the microchip which concerns on the 2nd Embodiment of this invention. It is a schematic perspective view which shows an example of the microchip which concerns on the 2nd Embodiment of this invention.

Explanation of symbols

  100, 400, 500 microchip, 101, 401, 501 first substrate, 102a, 102b, 402a, 402b, 502 second substrate, 103, 403 through hole, 200 microchip mounting portion, 201 circular stage, 202a 202b fixed wall, 203 fixture, 503 groove.

Claims (8)

A microchip having a cuvette for optical measurement, which is formed by laminating a first substrate having a groove or a through-hole penetrating in the thickness direction provided on the substrate surface and one or more second substrates. And
The optical measurement cuvette is composed of the groove or the through hole and a substrate surface of the second substrate,
In at least a part of the side wall surface of the microchip, the side wall surface of the second substrate is located inside the side wall surface of the first substrate ,
The substrate surface of the second substrate is a microchip smaller than the substrate surface of the first substrate .   2. The microchip according to claim 1, wherein a side wall surface of the second substrate is located inside a side wall surface of the first substrate in all side wall surfaces of the microchip. A microchip having a cuvette for optical measurement, which is formed by laminating a first substrate having a groove or a through-hole penetrating in the thickness direction provided on the substrate surface and one or more second substrates. And
The optical measurement cuvette is composed of the groove or the through hole and a substrate surface of the second substrate,
In all the side wall surfaces of the microchip, the side wall surface of the second substrate is located inside the side wall surface of the first substrate. A microchip having a cuvette for optical measurement, which is formed by laminating a first substrate having a groove or a through-hole penetrating in the thickness direction provided on the substrate surface and one or more second substrates. And
The optical measurement cuvette is composed of the groove or the through hole and a substrate surface of the second substrate,
In at least a part of the side wall surface of the microchip, the side wall surface of the second substrate is located inside the side wall surface of the first substrate,
Wherein in said at least a portion of the side wall surface of the microchip sidewall surface of the first substrate is now microchip such has a projection on its surface. 5. The microchip according to claim 4, wherein the side wall surface of the second substrate is located inside the side wall surface of the first substrate in all the side wall surfaces of the microchip. The microchip according to claim 4, wherein a substrate surface of the second substrate is smaller than a substrate surface of the first substrate. The microchip according to any one of claims 4 to 6, wherein a side wall surface of the first substrate in the at least a part of the side wall surface of the microchip is a flat surface. A method of using the microchip according to any one of claims 1 to 7
A step of applying a centrifugal force to the device having a portion on which the microchip is mounted, and applying a centrifugal force in one or more directions to the microchip;
Here, the direction of the centrifugal force that is applied last to the microchip is such that the side wall surface of the microchip in which the side wall surface of the second substrate is located inside the side wall surface of the first substrate, A method of using a microchip, which is a direction in which the microchip is pressed against an inner wall surface of a part on which the microchip is mounted.

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