JP4728201B2 - Component mounting machine and component mounting method - Google Patents

Description

  The present invention relates to a component mounter and a component mounting method for mounting a component such as a semiconductor element on a substrate.

  Conventionally, bumps, which are protruding terminals formed of solder, gold, etc. arranged on electrodes on a circuit surface with a circuit surface of a component such as a semiconductor element connected to the electrodes of the substrate, There is a mounting method for electrical connection.

  This mounting method is called a flip chip mounting method, and as a method of adopting the flip chip mounting method, for example, there is a method called C4 (Controlled Collapse Chip Connection).

  FIG. 24 is a process diagram showing a process of the C4 method. As shown in FIG. 24, in the C4 method, precoated solder is formed on the electrodes of the substrate, and solder bumps are formed on the components. In addition, the flux is transferred to the solder bumps of the component, and the component bumps are mounted on the electrodes on the substrate.

  Further, the component and the substrate are joined by heating and melting the solder by reflow, and thereafter, an adhesive that is a thermosetting resin is filled between the component and the substrate. That is, the space between the component and the substrate is sealed.

  In this state, heat is applied again, and the adhesive is cured, so that the component is fixed to the substrate, and the bonding reliability between the component and the substrate is improved. This adhesive is also referred to as underfill or underfill agent.

FIG. 25 is a diagram illustrating a state in which the adhesive is filled between the component and the substrate.
The adhesive is filled by a capillary underfill method. The capillary underfill method is a method in which an adhesive is infiltrated between the component and the substrate from the peripheral portion of the component by using a capillary phenomenon after the component and the substrate are joined.

  Therefore, when a plurality of components are mixedly mounted on the substrate, as shown in FIG. 25A, components other than the components to be filled with the adhesive (represented by rectangles with dots in the drawing). There is a possibility that the adhesive will adhere to the surface.

  Therefore, in the conventional construction method, as shown in FIG. 25 (B), in order to secure an area for pouring the adhesive and to prevent adhesion of the adhesive to other parts, They are arranged on the substrate at a certain interval.

  In addition, a technique related to a method of attaching an adhesive to a substrate instead of a component and mounting the component on the substrate is also disclosed (for example, see Patent Document 1).

  FIG. 26 is a process diagram showing a process of a method of applying an adhesive to a substrate and mounting a component on the substrate.

  According to this construction method, (1) an adhesive is applied to a substrate, (2) a surface on which a bump of a component exists (hereinafter referred to as “bump surface”) is directed downward, and the component and the substrate are pressure-bonded. . Thereafter, the component is heated while being pressed toward the substrate, and the component is fixed to the substrate.

  In addition, the method of joining a component and a board | substrate after apply | coating an adhesive agent to a board | substrate in this way is called a no-flow underfill system.

  In this method, when an amount of adhesive suitable for fixing the component to the substrate is applied to the substrate with a width (W1) equivalent to the width of the component, for example, as shown in FIG. Adhesive may not spread around the periphery of the part.

Therefore, by applying a slightly larger amount of adhesive than the case of FIG. 27A to the substrate with a width (W2) wider than the width of the component as shown in FIG. It is possible to spread the adhesive until the component is stably fixed to the substrate.
Japanese Patent No. 2830852

  In recent years, miniaturization and functional improvement of electronic devices have been demanded by general consumers and industry, and high-density component mounting on a substrate is desired.

  However, in the C4 method, which is the first prior art described above, as described with reference to FIG. 25 (B), it is necessary to secure a certain amount of space between the components, thereby realizing high-density component mounting. Is difficult.

  Furthermore, since the adhesive is infiltrated using the capillary phenomenon in the gap between the component and the substrate, there is also a problem that it takes time to infiltrate especially when the number of bumps is large.

  In addition, since the adhesive is poured from one side or two adjacent sides of the component, the adhesive may not penetrate evenly between the component and the substrate. In this case, the fixing force of the component to the substrate by the adhesive is reduced.

  Here, in order to improve the penetration speed and uniformity of the adhesive, it is common practice to provide the component mounting machine with a board heater that heats the entire board in order to improve the wettability of the adhesive. ing.

  However, in this case, a container (such as a syringe or a cartridge) for storing the adhesive and a nozzle for applying the adhesive from above the substrate are positioned on the heated substrate. Moreover, since it may take 30 seconds or more to apply the adhesive once, or it may be applied to one component more than once, these containers and the application nozzle are also heated.

  Therefore, not only a substrate heater but also a cooling unit for cooling these containers and application nozzles is required. Therefore, the structure of the entire apparatus related to component mounting becomes complicated.

  Further, in the above-described second prior art method for mounting a component on a substrate coated with an adhesive, as described with reference to FIG. 27B, certainty of fixing the component to the substrate is provided. In order to increase the width, it is necessary to make the width of application of the adhesive to the substrate somewhat wider than the width of the component. For this reason, it is difficult to realize high-density component mounting as in the conventional method using the capillary phenomenon.

  Further, widening the width of application of the adhesive to the substrate in this way means that the amount of adhesive required for mounting one component on the substrate is increased. As a result, the production cost per component mounting board increases, and the weight of the component mounting board also increases.

  In the second prior art described above, when components are mounted on a board, the components are heated and mounted one by one while adjusting the applied pressure one by one, which increases the time required for mounting the components per board. is there.

  In order to solve this problem, for example, when there are five components mounted on the board, five pressing nozzles that hold the five components at their respective positions are provided, and the five components are heated together. It is possible.

  However, in this case, it is extremely difficult to position the five pressing nozzles with high accuracy, press them with a constant force, and heat all the five nozzles at a uniform temperature. Therefore, even if heat-pressure bonding is performed with such a configuration, it is inevitable that bonding failure occurs due to a displacement of the pressing nozzle or the like.

  In order to solve this problem, a method of heating a plurality of parts after mounting a plurality of parts on a substrate coated with an adhesive has been developed.

  However, since this method does not press the component during heating, the force in the direction of the substrate acting on the component during heating is only the weight of the component. For this reason, defective bonding frequently occurs due to the influence of variations in the height of the bumps, and is not practically used in mass production.

  In view of the above problems, the present invention is a component mounting machine and a component mounting method adopting a flip chip mounting method, which efficiently secures an effective fixing force and bonding property of a component to a substrate, and An object is to provide a component mounting machine and a component mounting method for realizing high-density component mounting.

  In order to achieve the above object, a component mounter of the present invention is a component mounter for mounting a component having a bump that is a protruding terminal on a substrate, and a bump surface that is a surface having the bump of the component, and An application unit that applies an adhesive to at least one of the substrates, and an application amount control unit that controls an application amount V, which is an amount of the adhesive applied by the application unit, to an amount that satisfies V1> V ≧ V2. And mounting means for mounting the component on the substrate in a state where the adhesive is interposed between the component and the substrate, the component and the substrate being mounted on the substrate. Are bonded by being heated at a predetermined heating temperature, and the V1 and V2 are the bump surfaces in the positional relationship between the component and the substrate when the component is bonded to the substrate. Rim of Is a capacity of a space region surrounded by the boundary surface, which is a virtual surface linearly extending toward the substrate, the component, and the substrate, and V1 is formed by the boundary surface and the substrate. The component-side angle is a capacity of the space area in a state where the adhesive is in contact with the substrate at the predetermined heating temperature, and V2 is in contact with the boundary surface without intersecting the bump. It is the capacity of the space area in the state of being.

  As described above, the component mounter of the present invention includes means for controlling the adhesive application amount V to an amount satisfying V1> V ≧ V2. When the component is mounted on the substrate with such an amount of adhesive interposed between the component and the substrate, the adhesive makes the surface between the component and the substrate convex inwardly, Wet and spread until the contact angle to the substrate reaches a natural contact angle at a predetermined heating temperature.

  That is, the internal pressure of the adhesive in close contact with the component and the substrate can be reduced, and a pressing force other than its own weight can be applied to the component. Thereby, when the board | substrate with which components were mounted is heated, the effective bondability of a component and a board | substrate can be ensured.

  Further, since the coating amount V is an amount that can cover at least the bump surface including the bumps, an effective fixing force between the component and the substrate is ensured.

  Furthermore, if the coating amount is in such a range, the adhesive does not protrude from the parts unnecessarily, and high-density component mounting is possible.

  Further, in the component mounting machine of the present invention, the coating unit applies the adhesive to the bump surface from above with the bump surface facing upward, and the component mounting machine further includes the bonding by the coating unit. An inversion unit that inverts the component coated with an agent may be provided, and the mounting unit may mount the component inverted by the inversion unit on a substrate positioned under the component.

  In this way, the adhesive is applied from above the bump surface of the component, and is reversed and mounted on the substrate, so that the adhesive is applied when the adhesive is applied to the bump surface and when the component is mounted on the substrate. Will contact the bump surface and the surface of the substrate in a downwardly convex shape.

  As a result, the adhesive spreads while extruding air from the vicinity of the center of the bump surface and the vicinity of the center of the region where the component on the board is mounted to the outside. During this expansion, the gravity acting on the adhesive effectively acts as a force that pushes air outward. Therefore, the remaining of bubbles can be suppressed both between the adhesive and the component and between the adhesive and the substrate.

  By suppressing the remaining of the bubbles, it is possible to suppress the occurrence of problems such as the lifting of the component due to the expansion of the bubbles during heating, and it is possible to more reliably bond the component and the substrate.

  Further, an adhesive can be applied to each component, and the component to which the adhesive has been applied can be immediately mounted on the substrate. Thereby, for example, the possibility of adhesion and mixing of foreign matters to the adhesive can be reduced.

  Further, since the adhesive is applied to the bump surface and mounted on the substrate, it is not necessary to secure an area between components for applying the adhesive on the substrate. This also enables high-density component mounting.

  Furthermore, the present invention can be realized as a method in which the operations performed by the characteristic components in the component mounter of the present invention are steps, or can be realized as a program including those steps, or a CD- on which the program is stored. It can be realized as a storage medium such as a ROM or an integrated circuit. The program can also be distributed via a transmission medium such as a communication network.

  In the present invention, by controlling the amount of the adhesive applied within a predetermined range, it is possible to ensure an effective fixing force and bondability between the component and the substrate. In other words, such an effect can be produced by an efficient method.

  Also, the component can be stably fixed to the substrate with a lean amount of adhesive, and the adhesive does not unnecessarily protrude from the component. Therefore, high-density component mounting is possible.

  Further, since the amount of adhesive applied is small, the production cost and weight of the component mounting board are not unnecessarily increased.

  As described above, the present invention provides a component mounting machine and a component mounting method for efficiently securing an effective fixing force and bonding property of a component to a substrate and realizing high-density component mounting. can do.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
First, the configuration of the component mounter 1 according to the embodiment will be described with reference to FIGS. 1 and 2.

FIG. 1 is a perspective view showing an overview of a component mounter 1 according to an embodiment.
A component mounter 1 shown in FIG. 1 is a component mounter that mounts components such as semiconductor elements on a substrate by a flip chip mounting method.

  The component mounter 1 includes a transfer unit 2, a beam 9, a component supply unit 22, and a conveyor 30.

  The beam 9 is a component that moves in the X-axis direction and moves the transfer unit 2 in the Y-axis direction.

  The transfer unit 2 is a component that performs component adsorption and mounting on a substrate, and includes a head 4 to which two nozzles 3 are attached, a moving table 6, an application unit 5, and a tank 5a.

  The nozzle 3 is an example of a mounting unit in the component mounter of the present invention, and is a component that performs suction of the component 20 and mounting of the sucked component 20 on the substrate 23.

  The two nozzles 3 are attached to the head 4 in opposite directions and are in a positional relationship in which one nozzle 3 is directed upward and the other nozzle 3 is directed downward. Also, operations such as suction of the components 20 can be performed alternately. The nozzle 3 moves in parallel to the Z-axis direction with respect to the head 4, thereby sucking the component 20 from the component supply unit 22 and mounting the component 20 on the substrate 23.

  The moving table 6 is attached to the beam 9 so as to be movable in parallel to the beam 9 in the Y-axis direction. In addition, a head 4, an application unit 5, and a tank 5 a are attached to the movable table 6. The movable table 6 has a function of inverting the head 4 around the θ axis.

  With this configuration, the head 4 can move on the XY plane and can be reversed about the θ axis. The nozzle 3 moves and reverses as the head 4 moves and reverses.

  The application unit 5 is a component that applies an adhesive to the component 20 that is sucked and inverted by the nozzle 3. The adhesive is replenished from the tank 5a.

  Further, the amount of adhesive applied to the component 20 by the application unit 5, that is, the amount of adhesive applied is controlled by an application amount control unit (not shown in FIG. 1). The amount of application amount controlled by the application amount control unit and the effect produced by the adhesive of the application amount will be described later with reference to FIGS.

  The component supply unit 22 is a component that supplies the component 20 to the transfer unit 2. A plurality of components 20 are placed on the component supply unit 22 with their bump surfaces facing downward.

  The conveyor 30 is a component that transfers the substrate 23 on which components are to be mounted. When the component 20 is mounted by the transfer unit 2, the substrate 23 is transported and loaded by a conveyor 30 to a downstream device connected to the component mounting machine 1, for example, a reflow furnace. Or after the board | substrate 23 is discharged | emitted from the component mounting machine 1 by the conveyor 30, it is carried and thrown into the reflow furnace etc. which were provided separately.

  The substrate 23 put into the reflow furnace is heated, and the component 20 is bonded to the substrate 23 and fixed.

  Specifically, in the reflow furnace, the adhesive and the solder constituting at least one of the bumps of the component 20 and the precoat portion 24 formed on the electrodes of the substrate 23 are heated.

  By heating, the solder is melted, and the electrode on the component 20 and the electrode on the substrate 23 corresponding to the electrode are joined through the solder.

  Further, along with this bonding, the adhesive applied to the component 20 is cured by the application unit 5 described later, and the component is fixed to the substrate.

  In the present embodiment, the adhesive applied to the component by the application unit 5 has a viscosity and wettability that does not drop from the component when applied to the component and reversed.

  Specifically, the viscosity of the adhesive used in the component mounting machine 1 of the present embodiment may be a value included in the range of 0.001 Pascal second (Pa · s) to 200 Pa · s.

  Furthermore, if the viscosity is in the range of 0.1 Pa · s to 3 Pa · s, it is more suitable as an adhesive used for the component mounting machine 1. Furthermore, if it exists in the range of 0.5 Pa.s-1 Pa.s, it is optimal as an adhesive agent used for the component mounting machine 1. FIG.

  As for the wettability of the adhesive, if the adhesive is dripped onto the bump surface of the component at room temperature, the contact angle between the adhesive and the bump surface of the component should be 90 degrees or less. Good.

  Here, the “contact angle” is an angle formed by a tangent to the liquid surface at a point where the solid and the liquid are in contact with each other, and is defined as an angle including the liquid. Such a contact angle between a solid and a liquid is also referred to as a “wetting angle” because it is related to the wettability of the liquid with respect to the solid.

  Examples of the thermosetting resin that is optimal as an adhesive used in the component mounting machine 1 include an epoxy resin.

  Thus, if it is a thermosetting resin having a viscosity within the range of at least 0.001 Pa · s to 200 Pa · s, it can be used in the component mounting machine 1 as an adhesive for fixing the component to the substrate. . In other words, the component mounter 1 can use various types of thermosetting resins as adhesives, thereby suppressing generation of wasteful costs.

  FIG. 2 is a functional block diagram illustrating an outline of a functional configuration of the component mounter 1. In FIG. 2, the components originally provided in the component mounter such as the component supply unit 22 are omitted, and the characteristic configurations of the present invention are illustrated and described. Since the two nozzles 3 are functionally the same, only the one nozzle 3 is shown and described.

  As shown in FIG. 2, the beam 9, the coating unit 5, the moving table 6, and the conveyor 30 are controlled by the mounting control unit 10. Further, operations such as suction of the components of the nozzle 3 are also controlled by the mounting control unit 10 via the movable table 6.

  In addition, the movable table 6 includes a reversing unit 7 that reverses the head 4. The reversing unit 7 reverses the head 4 to a position where one of the two nozzles 3 is directed downward and the other is directed upward according to the control of the mounting control unit 10.

  Further, as described above, the application amount of the adhesive to the component by the application unit 5 is controlled by the application amount control unit 28.

  The operations of the mounting control unit 10 and the application amount control unit 28 can be realized by, for example, a computer having a central processing unit (CPU), a storage device, and an interface for inputting and outputting information.

Next, the operation of the component mounter 1 will be described with reference to FIGS. 3 and 4.
FIG. 3 is a flowchart showing a flow of processes related to component mounting in the component mounting machine 1, and FIG. 4 is a process diagram illustrating an outline of the processes shown in FIG.

  FIG. 3 is a flowchart showing the flow of an operation in which one nozzle 3 is focused and the nozzle 3 picks up a component and mounts it on the substrate. The operation in which the two nozzles 3 alternately pick up components will be described later with reference to FIG.

  As shown in FIG. 3, first, the nozzle 3 sucks the component 20 placed in the component supply unit 22 (S1). In this state, the bump surface of the component 20 attracted by the nozzle 3 faces downward. After that, the reversing unit 7 reverses the head 4 so that the nozzle that sucks the component is turned upward, and the top and bottom of the component are reversed. That is, the bump surface faces upward (S2).

  The application amount control unit 28 controls the application amount of the adhesive applied to the bump surface of the component 20 by the application unit 5 to a predetermined application amount (S3).

  The application unit 5 applies an amount of adhesive according to the control of the application amount control unit 28 from above the bump surface (S4).

  The component 20 to which the adhesive is applied turns upside down when the reversing unit 7 reverses the head 4, and the bump surface to which the adhesive is applied faces downward (S5).

  The component 20 with the bump surface facing downward is mounted on the substrate 23 below when the nozzle 3 is lowered (S6). Thereby, the bump part of the component 20 and the electrode part of the board | substrate 23 will be in the state aligned.

  The substrate 23 on which the component 20 is mounted is transferred by the conveyor 30. Then, the component 20 and the board | substrate 23 are joined by heating by a reflow furnace and solidifying after melt | dissolving a solder. Also, the adhesive is cured.

  In addition, although the temperature required for hardening of an adhesive agent changes with kinds of adhesive agent, it is about 150 to 240 degreeC grade.

  Moreover, although the temperature required for solder reflow differs depending on the type of solder, it is about 130 ° C to 230 ° C. Under these circumstances, if an adhesive that cures after the solder melts is selected, and the reflow temperature profile is determined, the curing of the adhesive and the reflow of the solder can be performed only once. Is possible.

  The above process will be briefly described with reference to FIG. 4. As shown in FIG. 4, (1) a predetermined amount controlled by the coating amount control unit 28 with the bump surface on which the bump 21 of the component 20 is present facing upward. Apply adhesive. Further, this application is performed from above the center of the bump surface, and as shown in the figure, the adhesive is formed in a mountain shape with the center near the apex.

  (2) Invert the part. As a result, the bump surface to which the adhesive is applied faces downward and opposes the surface of the substrate 23 having the precoat portion 24 formed on the electrode. (3) The component 20 is mounted on the substrate 23 by the nozzle 3 that sucks the component 20.

  The substrate 23 on which the component 20 is mounted is heated in a reflow furnace, whereby solder reflow and adhesive curing are performed simultaneously.

  Here, the predetermined application amount of the adhesive that the application unit 5 applies to the component 20 in the component mounting machine 1 is an amount that produces an effect of applying a pressing force other than its own weight to the component 20.

  Therefore, when the board | substrate 23 with which the component 20 was mounted | worn in the component mounting machine 1 is heated in a reflow furnace, the bump of the component 20 and the electrode of the board | substrate 23 will be joined more stably.

  Then, next, the application quantity which the application part 5 apply | coats an adhesive agent to components, and its effect are demonstrated using FIGS.

The application amount control unit 28 is a processing unit that controls the application amount as described above. The coating amount V applied by the coating unit 5 to one component by the coating amount control unit 28 is specifically a value obtained as a value satisfying the following (Equation 1).
V1 ≧ V> V2 (Formula 1)

  These V1 and V2 will be described with reference to FIG.

  FIG. 5 is a diagram for explaining the application amount of the adhesive applied to the component by the application unit 5 in the component mounting machine 1. 5A to 5C are views of the component 20 and the substrate 23 viewed from the side in the positional relationship between the component 20 and the substrate 23 when the component is bonded to the substrate.

  As shown in FIG. 5A and FIG. 5B, V1 and V2 indicate that the substrate 23 extends from the periphery of the bump surface in the positional relationship between the component 20 and the substrate 23 when the component 20 is bonded to the substrate 23. Is defined as a capacity of a space region surrounded by the boundary surface linearly extending toward the surface, the component 20 and the substrate 23.

  The “boundary surface” described above is a virtual boundary surface between the adhesive for defining V1 and V2 and the atmosphere.

  For example, when the shape of the bump surface is an n-gon, the boundary surface is formed by a surface linearly extended from each of the n sides toward the substrate 23.

  In addition, a closed space region is formed by the virtual boundary surface, the component 20, and the substrate 23 as described above, and V1 and V2 are defined by the capacity of the space region. That is, V1 and V2 are defined as capacities that can be filled in this space region.

  Specifically, V1 is the capacity of the space region in a state where the angle on the component 20 side formed by the boundary surface and the substrate 23 is α, as shown in FIG.

  This angle α is a natural contact angle of the adhesive to the substrate 23 at the heating temperature when heated in the reflow furnace. Hereinafter, α is also referred to as “natural angle α”.

  Further, V2 will be described. As shown in FIG. 5B, V2 is a capacity of the space region in a state where the boundary surface is in contact with the bump 21 without intersecting. In other words, the amount of the adhesive can cover the bump surface including all the bumps 21, and the surface area of the adhesive (including the surface in contact with the component 20 and the substrate) is minimized. In addition, an angle formed by the boundary surface and the substrate 23 at this time is represented by γ.

  In the component mounting machine 1, an adhesive of V, which is obtained in this way and satisfies an amount satisfying V1 ≧ V> V2, is applied to the component.

  Further, if the angle between the boundary surface and the substrate 23 corresponding to the coating amount V is β, and V1 ≧ V> V2 is expressed by the angle between the boundary surface and the substrate 23, α> β ≧ γ.

  These V1 and V2 may be calculated from geometric conditions such as various sizes such as the width of the part, or may be obtained by actual measurement using some fluid.

  In the present embodiment, for example, as shown in FIG. 5C, the application amount control unit 28 applies an amount of adhesive corresponding to the capacity of the gap between the component 20 and the substrate 23 after bonding. The application unit 5 is controlled.

  That is, the coating unit 5 is controlled so that the coating amount is such that the angle β formed by the boundary surface and the substrate 23 is approximately 90 degrees. The coating amount V in this case is naturally an amount satisfying V1 ≧ V> V2.

  The amount corresponding to the capacity of the gap between the component 20 after bonding and the substrate 23 can be easily calculated from the size of each part of the component 20 or the like.

  FIG. 6 is a diagram for explaining a simple method for obtaining an amount corresponding to the capacity of the gap between the component 20 after bonding and the substrate 23.

  As shown in FIG. 6, the length of the component 20 is L1, the width is L2, the distance between the component 20 and the substrate 23 is L3, and the volume per bump 21 is B.

  Note that L3 is a distance when the component 20 is bonded to the substrate 23, and is obtained by actual measurement, for example. Further, L3 is not actually measured, and for example, the value of the height of the bump 21 as it is may be used as L3. Alternatively, a value obtained by subtracting a predetermined value from the height of the bump 21 may be used as L3.

As described above, when L1, L2, L3, and B are defined and the total volume of all the bumps 21 in the component 20 is expressed as ΣB, the coating amount V is obtained by the following (formula 2).
V = L1 × L2 × L3-ΣB (Formula 2)

  That is, the application amount V can be obtained by subtracting the total volume of the bumps 21 included in the component 20 from the volume of the gap between the component 20 and the substrate 23 when there is no bump 21.

  If the electrode on the substrate 23 side is relatively large and its volume is not negligible, the sum of the volumes of the electrodes on the substrate 23 side to be bonded to the bumps 21 of one component 20 is obtained and subtracted from the right side of (Equation 2). That's fine.

  The application amount control unit 28 stores the application amount V thus obtained in a predetermined storage area, and controls the application unit 5 to apply the application amount V of adhesive to the component 20. .

  The adhesive whose amount of application is controlled in this way is applied to the component 20, and the component 20 is mounted on the substrate 23 so that the substrate 23 wets and spreads.

  Hereinafter, a change in shape due to wet spreading of the adhesive will be specifically described. A case is assumed where an adhesive with an application amount V satisfying the above (Formula 1) is applied to the component 20 and mounted on the substrate 23, and then the component 20 and the substrate 23 are joined through a heating process.

  In this case, assuming that the contact angle of the adhesive with respect to the substrate 23 is δ, the adhesive starts to spread on the substrate 23 after the component 20 is mounted on the substrate 23. Then, at the latest in the heating step, δ approaches a natural angle α.

  That is, when an adhesive with an application amount V satisfying the above (formula 1) is applied to the component 20 and mounted on the substrate 23, the adhesive gradually spreads on the substrate 23 as shown in FIG. Become.

  FIG. 7 is a schematic diagram showing how the adhesive spreads on the substrate 23 in the present embodiment.

  As shown in FIG. 7, the component mounter 1 of the present embodiment applies (1) an adhesive having an application amount V that satisfies the above (formula 1) to the bump surface of the component 20. For example, it is assumed that an amount of adhesive corresponding to the capacity of the gap between the component 20 after bonding and the substrate 23 described with reference to FIG.

  (2) The component 20 is reversed and mounted on the substrate 23. Immediately after mounting, the contact angle δ of the adhesive with respect to the substrate 23 is larger than the natural angle α.

  (3) After the component 20 is mounted on the substrate 23, the adhesive begins to spread on the substrate 23, and (4) the contact angle between the mounting of the component 20 on the substrate 23 and the heating process in the reflow furnace. δ approaches the natural angle α. Further, the surface between the adhesive component 20 and the substrate 23 has an inwardly convex curved shape.

  As described above, the component mounter 1 according to the present embodiment applies the adhesive to the component 20 before the component 20 and the substrate 23 are joined, and mounts the component 20 on the substrate 23. After the mounting, the adhesive spreads wet on the substrate 23 and exerts a force to spread the contact angle to the substrate 23 to the natural angle, and the wet spread force is balanced at the contact angle equal to the natural angle. It will be taken.

  Here, in order to improve the fixing force of the component 20 to the substrate 23, it is first considered to increase the application amount of the adhesive as described with reference to FIG.

  However, if the application amount of the adhesive is increased more than necessary, high-density component mounting is not possible, and the component 20 is in a direction opposite to the substrate 23 caused by the surface tension of the adhesive. Power will work.

  Specifically, when the surface shape between the component and the substrate of the adhesive is convex outward when the component and the substrate are joined by heating, the surface tension generates an internal pressure in the liquid adhesive. It will be. Therefore, the component is bonded to the substrate while receiving a force in a direction away from the substrate.

  In other words, the component undergoes a bonding process with respect to the substrate while receiving a force in a direction that makes the bonding with the substrate uncertain, which also causes a bonding failure.

  Therefore, the component mounter 1 according to the embodiment of the present invention controls the coating amount V to an amount less than the above V1. Accordingly, the contact angle of the adhesive with respect to the substrate 23 can be changed from a state larger than the natural angle α to the natural angle α while the upper end of the surface of the adhesive is positioned on the periphery of the bump surface.

  That is, when attention is paid to the surface shape of the adhesive, the component 20 and the substrate 23 are joined together while the surface between the adhesive component 20 and the substrate 23 changes to a curved shape that is convex inward.

  This means that the surface tension acts as a negative internal pressure on the liquid adhesive, and as a result, the surface tension acts in the direction of narrowing the gap between the component 20 and the substrate 23. This means that the substrate 23 is bonded. In other words, the component 20 and the substrate 23 that are in close contact with the adhesive and face each other are joined in a direction approaching each other while receiving a force from the adhesive.

  In other words, the component 20 is joined to the substrate 23 while receiving a push-down force that is apparently caused by the adhesive spreading wet on the substrate.

  In this way, the component mounter 1 can apply a pressing force other than its own weight to the component 20 by controlling the coating amount V to an amount equal to or less than V1. Thereby, joining of the component 20 and the board | substrate 23 can be performed more reliably.

  In addition, the component mounter 1 according to the embodiment of the present invention controls the coating amount V to be larger than the above-described V2. This V2 is an amount that can cover the bump surface including all the bumps. Therefore, the effect of applying a pressing force other than its own weight to the component 20 is exhibited, and an effective fixing force is ensured.

  Further, paying attention to the amount of adhesive protruding from the component 20, the coating amount V is smaller than the above-described V1, and therefore, as shown in FIG. 8, the distance that the adhesive protrudes from the component 20 is expressed as L3 / tan α. Can fit within. Therefore, high-density mounting of components on the substrate is possible.

  Here, the approximate value of the above-described pressing force can be obtained from calculation using the surface tension of the adhesive.

  Hereinafter, a calculation example of the pressing force due to the wet spread of the adhesive will be described with reference to FIGS. 9 and 10.

  As shown in FIG. 9, the contact angle of a liquid with a solid is explained by the balance of the interfacial tension between the liquid, the solid and the gas. In general, the surface tension means an interfacial tension that works between the liquid phase and the counterpart when in the gas phase.

As shown in FIG. 9, when the interfacial tension between solid gases is fa, the interfacial tension between liquid gases is fb, the interfacial tension between solid liquids is fc, and the contact angle after completion of liquid wetting is α, (Equation 3) holds.
fa−fc = fbcos α (Formula 3)

That is, when the force “fa− fc ” in the external direction of the liquid acts, the force “fbcos α” in the internal direction of the liquid due to the surface tension of the adhesive is offset, and the contact angle is maintained at α. .

  Here, in the component mounter 1, the contact angle of the adhesive with respect to the substrate 23 at a certain moment after the component 20 is mounted on the substrate 23 is denoted by δ.

  FIG. 10A is a schematic view from the side of the component 20 and the substrate 23 in a state where the contact angle of the adhesive to the substrate 23 is δ. FIG. 10B is a diagram illustrating an assumed value for calculating a pressing force due to wetting and spreading of the adhesive.

  δ is an angle larger than the natural angle α, and apparently a force (fδ) that makes the contact angle δ closer to α acts on the adhesive. This force is in a direction parallel to the substrate 23, but the adhesive is a liquid and acts as a force (F) that pushes down the component 20 that is in close contact with the adhesive due to its surface tension, viscosity, and fluidity. Become.

  Hereinafter, the approximate value of the apparent pressing force F will be described with a specific calculation example.

  As shown in FIG. 10B, it is assumed that the component 20 having both the length L1 and the width L2 of 4 mm and the weight of 29.6 mgf is bonded to the substrate 23.

  Moreover, the surface tension of the epoxy resin generally used is about 0.045 mN / mm. Therefore, it is assumed that a bisphenol A type epoxy resin to which about 0.2% of a fluorosurfactant is added is used as an adhesive for underfill, and that the environmental temperature is about 25 ° C. In this case, the surface tension fb of the adhesive is about 0.029 mN / mm. Further, it is assumed that the natural angle α of the adhesive with respect to the substrate 23 is 45 degrees.

Here, fδ is an external force of the adhesive, and the following (formula 4) is established.
fδ = fbcos α (Formula 4)

  From the above physical property values and (Equation 4), fδ is obtained as follows.

  fδ = 0.020506 mN / mm (Formula 5)

  That is, a tension of about 0.0205 mN acts on the outer peripheral portion of the component per 1 mm length toward the outside.

  A force obtained by multiplying this fδ by the outer peripheral length of the component 20 (2 × (L1 + L2)) is applied to the adhesive. Let that force be F.

  F = 0.328098 mN (Formula 6)

  Here, since the volume may be constant at the level of the above-described force, the above-described force F acts as a pressing force of the component.

When this is converted into a weight unit system, the pressing force F is expressed as (Equation 7).
F = 33.5 mgf (Formula 7)

  Accordingly, the component 20 receives a force approximately equal to its own weight as a pressing force due to the adhesive spreading wet.

  Moreover, the said calculation result is a calculation result in about 25 degreeC environment. Therefore, it is considered that the conditions change when heated in a reflow furnace. However, even in the case of the capillary underfill method, since the filling speed into the gap is increased by heating, the viscosity decreases due to heating, and at the same time, even if the interfacial tension between the air and the adhesive decreases, It is considered that the interfacial tension between adhesives does not change greatly with temperature. That is, it can be considered that the change in the pressing force F is small.

  As described above, in the component mounter 1 according to the embodiment of the present invention, the amount of the adhesive interposed between the component and the substrate is controlled to V which is an amount satisfying V1> V ≧ V2. In other words, the surface of the adhesive between the component and the substrate after joining the component and the substrate is controlled to an amount that forms a curved surface shape that is convex inward.

  As a result, as described above, a pressing force is exerted on the component mounted on the substrate due to the wet spread of the adhesive other than its own weight.

  Thereby, for example, when a substrate on which a component is mounted is heated in a reflow furnace, effective bonding can be ensured without pressing the component with a nozzle or the like.

  In addition, since a nozzle that pressurizes the components is unnecessary as described above, a plurality of components mounted on one substrate can be heated together. Furthermore, a plurality of substrates each having a plurality of components mounted thereon can be heated together.

  Therefore, for example, the component mounting board can be produced more efficiently than the conventional method shown in FIG.

  Further, as described above, the amount of the adhesive is not less than V2, which is the amount that can cover the bump surface including all the bumps. Therefore, not only the bondability but also an effective fixing force is ensured.

  In addition, the amount of adhesive protruding from the components can be suppressed, and high-density component mounting on the substrate becomes possible.

  In the component mounter 1 according to the embodiment of the present invention, as described with reference to FIGS. 3 and 4, the adhesive is applied to the bump surface with the bump surface of the component facing upward. In addition, the component to which the adhesive is applied is mounted on the substrate with the component facing downward.

As a result, it is possible to improve the fixing force and bondability of the component to the substrate.
Specifically, the component mounting machine 1 can make it difficult for bubbles to remain between the adhesive and the component and between the adhesive and the substrate by operating in such a process. As a result, it is possible to improve the fixing force and bondability of the component to the substrate.

  Hereinafter, the difference in bubble generation between when the adhesive is applied to the substrate as in the second prior art and when the adhesive is applied with the bump surface of the component facing upward will be described.

  First, with reference to FIG. 11, a bubble generation mechanism between a component and an adhesive when an adhesive is applied to the substrate and the component is mounted, and occurrence of a bonding failure between the component and the substrate due to the bubble are described with reference to FIG. 11. explain.

  FIG. 11 is a schematic view showing a state in which bubbles remain between the component and the adhesive by applying the adhesive to the substrate and mounting the component on the substrate.

  As shown in (1) of FIG. 11, the application height (h) of the adhesive on the substrate needs to be larger than the bump height (H) of the component. That is, it is necessary to apply the adhesive to the substrate so that h> H.

  Therefore, in order to maintain the coating height, it is necessary to increase the viscosity of the adhesive so that it does not easily spread on the substrate. Specifically, the viscosity of the adhesive used in such a no-flow underfill method is approximately 20 Pa · s to 140 Pa · s.

  Therefore, from the relationship between the curvature radius R of the adhesive on the substrate and the wettability of the adhesive with respect to the bump surface, the positional relationship between the component and the substrate changes from the state shown in (2) to (3) in FIG. When the transition is made instantaneously, bubbles tend to remain in the vicinity of the bumps of the component.

  This is because the adhesive spreads while the bump surface wets incompletely because the wettability of the adhesive is low and the radius of curvature R is large. In other words, the adhesive spreads without being able to completely extrude the air existing between the adhesive and the bump surface to the outside.

  When heated in this state, the remaining bubbles expand due to heat, and an upward force tends to be applied to the component. The thermal expansion coefficient of air is about 100 times that of the adhesive. Further, as described above, the force in the board direction acting on the component is only the weight of the component.

  As a result, bumps of parts such as semiconductor chips have variations in height, so that bumps with low height tend not to contact with the electrodes on the substrate even if the bumps are melted by reflow. Become. As a result, the component and the board are in an incompletely joined state.

  Therefore, when adopting such a process in the production of a component mounting board, it is necessary to prevent the occurrence of poor bonding by heating the component while pressing it with a nozzle or the like as described above.

  Next, in the component mounter 1 of the present embodiment, a mechanism that can suppress the generation of bubbles between the component and the adhesive by applying an adhesive to the component will be described.

FIG. 12 is a diagram illustrating the shape of the adhesive when the adhesive is discharged from the application unit 5.
As shown in FIG. 12, when the adhesive is discharged from the tip of the application part 5, it becomes spherical due to surface tension. Alternatively, at least the lower end of the adhesive has a downward convex curve.

  When the adhesive having a downwardly convex curved shape is hung on a horizontal plane, it spreads to the plane while pushing air outward as shown in FIG. Become.

  In other words, assuming that an adhesive having a certain viscosity and wettability is used, the adhesive when the adhesive contacts the bump surface when the adhesive is applied to the bump surface of the component from above as described above. The radius of curvature is smaller than that shown in FIG. 11 when the component is mounted on the substrate coated with the adhesive.

  For this reason, the adhesive easily spreads while wetting the bump surface, and air bubbles hardly remain between the component and the adhesive.

  Moreover, force is applied to the adhesive vertically downward by gravity (G). That is, the dead weight of the adhesive effectively acts on the adhesive as a force that pushes air between the flat surface and the adhesive outward. Accordingly, this also makes it difficult for bubbles to remain between the component and the adhesive.

  Furthermore, since the component to which the adhesive is applied is reversed and mounted on the lower substrate, the generation of bubbles between the adhesive and the substrate can be suppressed.

  More specifically, the shape of the adhesive on the bump surface after the application is completed becomes a mountain shape having a vertex near the center as described above. Therefore, when the component is mounted on the substrate with the bump surface facing downward, the apex portion of the mountain-shaped adhesive first comes into contact with the substrate.

  Here, it is assumed that the adhesive on the bump surface after application is completed is in a state close to a flat surface due to reasons such as low viscosity of the adhesive or low surface tension. Even in such a case, when the component is reversed, the adhesive becomes a mountain shape having a downward apex near the center due to gravity.

  That is, as the component comes closer to the substrate, the adhesive between the component and the substrate spreads while pushing air outward from the vicinity immediately below the center of the bump surface as shown in FIG. Naturally, gravity also affects the spread of the adhesive.

  That is, when the adhesive between the component 20 and the substrate 23 spreads on the substrate 23, not only the weight of the component and the force at the time of mounting received downward from the nozzle 3, but also the weight of the adhesive is applied to the substrate 23 and the adhesive. This effectively acts as a force for pushing the air between the substrate 23 and the outside, making it difficult for bubbles to remain between the substrate 23 and the adhesive.

  Furthermore, the coating amount is an amount between V1 and V2 as described above. Thereby, it is possible to prevent the adhesive from unnecessarily protruding from directly under the component 20.

  FIG. 14 is a diagram illustrating how the adhesive spreads on the substrate 23 when the component 20 is mounted on the substrate 23.

  As shown in FIG. 14, as the component 20 approaches the substrate 23, the adhesive spreads from near the center of the component 20 toward the outside.

  As described with reference to FIG. 5B, the component mounter 1 applies at least an amount of adhesive that covers at least the bump surface including all the bumps. Therefore, as shown in FIG. 14, the component 20 can be mounted on the substrate 23 in a state where the adhesive is spread to the peripheral portion of the bump surface of the component 20. In this case, the component 20 is mounted on the substrate 23 in a state where the adhesive spreads to the peripheral portion without the adhesive dripping from the peripheral portion of the bump surface due to the viscosity of the adhesive.

  That is, as shown in FIG. 27A, unlike the case where an adhesive is applied to the board side in the width equivalent to the width of the component, as shown in FIG. it can. That is, the component 20 can be efficiently and stably fixed to the substrate 23 with a minimum amount of adhesive necessary for fixing the component 20 to the substrate 23.

  Further, it is not a capillary underfill method in which an adhesive is poured after a component is mounted on a substrate. Therefore, when a plurality of components are mounted on one substrate, it is not necessary to secure an area for pouring the adhesive between the components as shown in FIG.

  Therefore, when mounting a plurality of components on one board with the component mounting machine 1 of the present embodiment, or when mounting a component on a board on which other components are already mounted, the components on the board are closer to each other than before. Can be made. This also enables high-density component mounting.

  As a result of the control by the application amount control unit 28, the amount of adhesive applied to the component by the application unit 5 is, as a specific numerical value, the component having a size of about 2 mm × 2 mm to 20 mm × 20 mm. In the case of a bare chip, it is about 0.4 microliter (μl) to 120 μl.

  Further, if it is a large BGA (Ball Grid Array) having a size of about 60 mm × 60 mm, it is about 3600 μl.

  Here, the viscosity of the adhesive varies depending on the environment such as ambient temperature. Therefore, even when the adhesive is applied to a certain part by the amount determined as described above, the manner in which the adhesive spreads on the bump surface varies depending on the surrounding environment.

FIG. 15 is a diagram illustrating an example of the state of the adhesive applied to the bump surface.
15 (A) and 15 (B) are diagrams showing an example of a state in which the adhesive is applied to the bump surface and spreads, and FIG. 15 (C) is a state in which the adhesive stops at the peripheral portion of the bump surface. FIG.

  For example, when an adhesive is applied to a certain part in an amount satisfying V1> V ≧ V2, the adhesive may spread over the entire bump surface as shown in FIG. As shown in (B), the adhesive may not spread over the entire bump surface.

  However, as shown in FIG. 15C, the adhesive on the component 20 stops at the periphery of the bump surface due to surface tension. Of course, if a large amount of adhesive is applied, the adhesive will spill from the bump surface. As described above, the amount V of adhesive applied will be described with reference to FIGS. 5 (A) and 5 (B). As described above, in order to make the amount satisfying V1> V ≧ V2, the amount is not so large as to spill from the bump surface.

  Therefore, it is possible to use an adhesive having a low viscosity, that is, easy to spread. For example, an adhesive having a viscosity (about 0.65 Pa · s to 8.0 Pa · s) and wettability equivalent to those of the adhesive used in the capillary underfill method can be used.

  Here, as shown in FIGS. 25 (A), 25 (B), and 26, when the adhesive is applied on the substrate, the adhesive is applied on the substrate in an amount necessary for fixing the components. However, it may spread on the substrate more than necessary depending on the surrounding environment.

  However, when the adhesive is applied to the component as in the component mounting machine 1 of the present embodiment, the adhesive is stopped at the peripheral portion of the component due to the surface tension of the adhesive. In this state, even when the components are reversed and mounted on the substrate, the amount of adhesive applied is between V1 and V2, as described above, and the surface of the adhesive There is also an influence of tension, and as shown in FIG. 14, it does not protrude from the parts unnecessarily.

  That is, the component mounter 1 of the present embodiment can mount one component on the board in a compact manner.

  In addition, as described above, reflow and curing can be simultaneously performed on the substrate on which the component is mounted by the component mounter 1 of the present embodiment. In other words, it is only necessary to heat the substrate with the components mounted once.

  Therefore, for example, as compared with the C4 method shown in FIG. 24, the number of steps related to component mounting is reduced, and the possibility of damage to components and boards due to heat is reduced.

  Further, when the upper and lower parts of the component with the adhesive applied to the bump surface are turned upside down, the adhesive on the bump surface becomes a mountain shape with the center near the downward apex. Therefore, when the component is mounted on the board, if the component and the board come close to each other while keeping them parallel, the adhesive will first contact the immediate vicinity of the center of the component on the board, and gradually outside the contact point. To expand.

  When the adhesive spreads, the weight of the adhesive acts effectively as a force that pushes out bubbles between the adhesive and the substrate. Therefore, it is difficult for bubbles to remain between the adhesive and the substrate.

  In addition, the adhesive spreads in the gap between the component and the substrate so that the adhesive spreads almost evenly from directly under the center of the component toward the peripheral edge. Therefore, compared to the case where the adhesive is poured from one side or two sides of the component as shown in FIGS. 25A and 25B, the bias of the adhesive is less likely to occur. This also stabilizes the component and the board.

  Further, the component mounting machine 1 applies an adhesive for each component, and immediately mounts the component to which the adhesive is applied on the substrate. Therefore, for example, there is no generation of dust due to cutting, compared to a method that includes a process of cutting into individual semiconductor elements after applying an adhesive at the wafer stage. It becomes possible to almost eliminate the sex.

  In addition, since it is not necessary to use an adhesive that becomes solid at room temperature, for example, in order to ensure that the component is mounted on the substrate, a process of heating the adhesive and dissolving it before mounting is required. do not do.

  As described above, the component mounter 1 according to the present embodiment applies the adhesive with the bump surface facing upward, reverses the component, and mounts it on the substrate, thereby generating bubbles between the adhesive, the component, and the substrate. Can be suppressed. Thereby, the fixing force and bonding property with respect to the board | substrate of components can be improved.

  Next, a case where the component mounting machine 1 uses two nozzles 3 and mounts components on a board more efficiently than when only one nozzle 3 is used will be described with reference to FIG.

  FIG. 16 is a process diagram illustrating a process in which the component mounter 1 according to the present embodiment mounts a component on a board using two nozzles 3.

  One of the two nozzles 3 is a nozzle A and the other is a nozzle B. Further, a component sucked by the nozzle A is a component a, and a component sucked by the nozzle B is a component b. Further, a substrate on which the component a is mounted by the nozzle A is a substrate κ, and a substrate on which the component b is mounted by the nozzle B is a substrate ω. These are simply indicated as A, B, a, b, κ, and ω in the figure.

  As shown in FIG. 16, (1) the nozzle A adsorbs the component a. (2) The head 4 is reversed and the nozzle B is directed downward to suck the component b. (3) In this state, the bump surface of the component a is facing upward, and an adhesive is applied to the bump surface of the component a by the application unit 5.

  (4) The head 4 is inverted, the bump surface of the component b is facing upward, the upper and lower sides of the component a are inverted, and the bump surface is at a position facing the substrate κ. In this state, an adhesive is applied to the bump surface of the component b by the application unit 5. Further, the component a is mounted on the substrate κ by the nozzle A.

  (5) The substrate κ on which the component a is mounted is transferred to the reflow furnace by the conveyor 30 and heated. That is, solder reflow and adhesive curing are performed. Thereby, the joining operation | work of the component a with respect to the board | substrate (kappa) is complete | finished. Further, after an adhesive is applied to the bump surface of the component b and the component a is mounted on the substrate κ by the nozzle A, the nozzle B is directed downward. Further, the component b is mounted on the substrate ω by the nozzle B.

  The board ω on which the component b is mounted is transferred to the reflow furnace by the conveyor 30 and is subjected to solder reflow and adhesive curing processing.

  In addition, when the heating process with respect to the board | substrate (omega) is performed in the reflow furnace, components are not adsorb | sucked to the nozzle A and the nozzle B. FIG. Therefore, the mounting control unit 10 moves the head 4 including the nozzle A and the nozzle B to the component supply unit 22 and causes the nozzle A and the nozzle B to suck the next component. That is, a series of processes starting from the process (1) is started.

  The component mounter 1 can sequentially mount components on a plurality of substrates by repeating the steps (1) to (5) described above.

  As described above, when two nozzles 3 are used in the component mounting machine 1, it is possible to advance the joining of components to the board more efficiently than when only one nozzle 3 is used.

  Specifically, in the component mounter 1, when only one nozzle 3 is used, for example, when only the nozzle A is used, the above description and FIG. It is necessary to perform four steps: (1) adsorption of component a, (3) application of adhesive to component a, (4) mounting of component a to substrate κ, and (5) reflow and curing. That is, in order to join each of the two components to the two substrates using only the nozzle A, it is necessary to perform eight steps.

  However, in the case where two nozzles 3 are used, as described above, the steps (1) to (5) and the step of heating the substrate on which the component is mounted in the step (5) are totaled in six steps. Each of the two components can be bonded to two substrates. In other words, the component mounter 1 can advance the joining of the components to the board more efficiently by using two nozzles 3 than when only one nozzle 3 is used.

  In the above description, the steps (2) and (3) may be performed simultaneously. That is, when the nozzle B adsorbs the component b, the adhesive may be applied to the component a that is inverted and has a bump surface facing upward.

  As shown in FIG. 1, in the component mounter 1 according to the present embodiment, both the head 4 and the coating unit 5 are attached to the moving table 6 and move as the moving table 6 moves.

  Therefore, when the nozzle B adsorbs the component b, the application unit 5 can apply the adhesive to the component a.

  Further, in this case, after the adhesive is applied to the component a, the head moves to a position above the substrate, but reversal may be performed so that the bump surface of the component a faces downward while moving. Alternatively, the adhesive may be applied to the component “a” while moving and reversed after the application is completed.

  Here, it is considered that movement of the part after application of the adhesive to the part or while applying the adhesive to the part affects the application state of the adhesive. However, if there is no substantial problem such as the adhesive spilling from the component due to the low viscosity of the adhesive, the process can be further compressed in this way, and the substrate of the component can be more efficiently Can be implemented.

  As described above, the component mounter 1 according to the present embodiment can more efficiently mount the component on the substrate by using two nozzles for sucking the component and mounting the component on the substrate. it can.

  Further, the component mounter 1 may use three or more nozzles 3. For example, the head 4 may have a shape in which three or more nozzles 3 are attached on the radiation around the θ axis shown in FIG. Further, the mounting control unit 10 may control each component to sequentially perform component adsorption, adhesive application, and the like for each component.

  In the present embodiment, the coating amount V obtained in advance is stored in the coating amount control unit 28, and the coating unit 5 is stored in the coating amount control unit 28 under the control of the coating amount control unit 28. It is assumed that the applied amount V of adhesive is applied to the component 20.

  However, for example, the application amount control unit 28 may acquire component information such as various sizes of the component 20 and the number of bumps, and calculate the application amount V based on the information. In this case, for example, the application amount control unit 28 only needs to include a processing unit that acquires component information and a processing unit that performs numerical calculation based on the component information.

  Furthermore, the coating amount control unit 28 having such a processing unit acquires component information including the number of L1, L2, L3, B and bumps described in the description of FIG. What is necessary is just to calculate V using Formula 2).

  Thereby, for example, when the numerical values such as L1 are found from a catalog or the like, the user simply inputs various numerical values to the component mounting machine 1 and the component mounting machine 1 is subjected to the above-described adhesive spread. Component mounting with a component push-down effect can be performed.

Moreover, you may control the application quantity of the adhesive agent to components based on the application | coating state of an adhesive agent.
FIG. 17 is a schematic diagram showing an outline of a configuration for controlling the amount of adhesive applied to a component based on the height of the adhesive formed in a mountain shape on the component.

  FIG. 17A is a schematic diagram when the configuration is viewed from the X-axis direction, and FIG. 17B is a schematic diagram when the configuration is viewed from the Y-axis direction.

  As shown in FIG. 17A, the movable table 6 is provided with a detection unit 25 having a phototube 26. An irradiation unit 26 a that irradiates light toward the photoelectric tube 26 at a position in front of the photoelectric tube 26 is installed.

  The photoelectric tube 26 is a kind of optical sensor, and the detection unit 25 is an adhesive formed in a mountain shape on the component 20 by the light beam irradiated from the irradiation unit 26a being blocked near the top of the adhesive and being interrupted. It is possible to detect that the height of has reached a predetermined height.

  That is, the detection unit 25 does not actually measure the height of the peak of the mountain shape. However, by treating the height in the vicinity of the apex as the height of the adhesive, the height of the adhesive that is continuously discharged from the coating unit 5 and formed in a mountain shape has reached a predetermined height. Can be detected.

  The position of the phototube 26 in the X-axis direction is shifted from a straight line parallel to the Z-axis direction passing through the center of the tip of the coating unit 5 as shown in FIG. Further, the position of the phototube 26 in the Z-axis direction is such that the adhesive application amount is equal to the optimum application amount for the component 20, for example, the height of the adhesive crest where V is obtained by the above (Equation 2). Set to the same position. Let Hp be the height of the peak of the adhesive that provides the optimum coating amount for the component 20.

  This Hp may be obtained by applying an adhesive with an application amount V to the component 20 and actually measuring the height of the peak of the adhesive. Moreover, you may obtain | require by calculation from the application amount V and the shape at the time of the application | coating to the components 20 of an adhesive agent.

  With this configuration, when the height of the peak of the adhesive applied to the component 20 reaches Hp, the light beam 26b irradiated from the irradiation unit 26a is blocked by the adhesive, and the photoelectric tube 26 receives the light beam 26b. become unable. Thereby, the detection unit 25 can detect that the height of the peak of the adhesive applied to the component 20 has reached Hp.

  Therefore, if the discharge of the adhesive from the application part 5 is stopped at the time of this detection, the height of the adhesive crest on the component 20 is substantially Hp. Accordingly, the amount of adhesive applied is suitable for the component 20.

  The component mounter 1 further includes a plurality of pairs of photoelectric tubes 26 and irradiation units 26a in the Z-axis direction, so that an amount of adhesive suitable for each component can be accommodated for a plurality of types of components having different sizes. Can be applied.

  Further, the amount of the adhesive applied to the part may be controlled based on the shape of the adhesive instead of the height of the mountain-shaped adhesive applied to the part.

  FIG. 18 is a schematic diagram showing an outline of a configuration for controlling the amount of adhesive applied to a component based on the shape of the adhesive on the component.

  FIG. 18A is a schematic diagram when the configuration is viewed from the X-axis direction, and FIG. 18B is a schematic diagram when the configuration is viewed from the Y-axis direction.

  As shown in FIG. 18A, the moving table 6 is provided with a detection unit 25 having a camera 27. Specifically, the camera 27 is installed at a position where the shape of the adhesive pile applied to the component 20 can be imaged.

  The detection unit 25 can detect that the shape has reached a predetermined shape by causing the camera 27 to capture an image of the mountain shape of the adhesive applied to the component 20.

  For example, the shape of the adhesive having a coating amount suitable for the component 20 is specified by applying the adhesive with the coating amount V obtained by the above (Formula 2) to the component 20 and measuring the shape thereof. Can do.

  It is assumed that the shape thus identified is, for example, a shape 27a indicated by a dotted line in FIG. In this case, the shape of the adhesive discharged from the application unit 5 gradually approaches the shape 27a.

  The detection unit 25 compares the contour line other than the bottom of the mountain shape of the adhesive imaged by the camera 27 with the dotted line portion of the shape 27a. By this comparison, for example, when the contour line is located outside the dotted line in 90% of the length of the dotted line part of the shape 27a, or the area of the mountain shape of the adhesive imaged by the camera 27 However, when the area of the part surrounded by the bump surface of the component 20 and the dotted line part of the shape 27a becomes 90%, the detection unit 25 detects that the shape of the adhesive being applied has reached the shape 27a. .

  Therefore, if the discharge of the adhesive from the application unit 5 is stopped at the time of this detection, the shape of the adhesive on the component 20 becomes substantially the same as the shape 27a. Accordingly, the amount of adhesive applied is suitable for the component 20.

  In addition, the shape corresponding to the application amount of the adhesive suitable for the component 20 varies depending on the viscosity of the adhesive changing according to the temperature at the time of applying the adhesive to the component. Therefore, even if the component mounter 1 stores a plurality of shapes according to the temperature and the detection unit 25 selects a shape corresponding to the amount of adhesive applied to the component 20 according to the temperature. Good.

  As described above, the component mounter 1 according to the present embodiment includes the detection unit 25 that detects the application state of the adhesive such as the height and shape of the adhesive crest applied to the component, thereby providing the application state. Based on this, it is possible to control the application amount V of the adhesive to the component to an amount satisfying V1> V ≧ V2.

  FIG. 19 is a block diagram illustrating an outline of a functional configuration of the component mounter 1 including the detection unit 25 that detects the application state of the adhesive.

  The component mounter 1 shown in FIG. 19 includes a detection unit 25 in addition to the components included in the component mounter 1 shown in FIG.

  As described above, the detection unit 25 includes the phototube 26 or the camera 27, and the height of the adhesive applied to the component has reached a predetermined height, or the shape of the adhesive is predetermined. It is possible to detect that the vicinity of the shape is reached. That is, it can be detected that the amount of the adhesive being applied to the component has become an amount suitable for the component.

  The application amount control unit 28 uses the detection unit 25 to control the application amount. Specifically, a signal indicating that the application amount suitable for the component has been received is received from the detection unit 25, and control is performed to stop the discharge of the adhesive to the application unit 5.

  The application start timing is controlled by, for example, the mounting control unit 10 and notified to the application amount control unit 28. Alternatively, it is controlled by the application amount control unit 28 and notified to the mounting control unit 10.

  With such a configuration, the component mounter 1 can control the application amount V of the adhesive to the component to an amount satisfying V1> V ≧ V2 based on the application state.

  Further, in the present embodiment, the application of the adhesive to the component performed by the application unit 5 is performed from above the center of the bump surface.

  However, the application of the adhesive to the component performed by the application unit 5 may not be performed from above the center of the bump surface, but may be performed from above the center.

FIG. 20 is a diagram illustrating an example of the application position of the adhesive on the bump surface of the component.
In each of FIGS. 20A to 20C, a dotted circle represents a region near the center of the bump surface, and a hatched circle in the region represents an adhesive application position. Yes. In addition, eight white circles around the area represent bumps.

  As shown in FIG. 20A, when the adhesive is applied from above the center of the bump surface, the adhesive spreads evenly from the center of the bump surface. As shown in FIGS. 20B and 20C, when the adhesive is applied from above the position slightly deviated from the center of the bump surface, the adhesive is applied to the side closest to the application position. After reaching, the adhesive will reach the remaining sides.

  Thus, although there is a difference in the spreading method, in any case, the application amount V of the adhesive satisfies V1> V ≧ V2 as described with reference to FIGS. 5 (A) and 5 (B). It is the amount to be filled, and is also affected by the surface tension of the adhesive, so that the adhesive does not spill from the bump surface.

  Also, as shown in FIG. 20B and FIG. 20C, even when the adhesive is applied from a position that is not precisely at the center of the bump surface, the adhesive formed on the bump surface The shape of the mountain is a mountain shape with a vertex near the center.

  In addition, when the bump surface is facing upward, even when the shape of the adhesive is close to a flat surface, that is, when the bulge is not clearly understood, the component is inverted and bonded when the component is mounted on the board. The agent is affected by gravity, and has a mountain shape with a downward apex near the center.

  For this reason, as described above, when the component is mounted on the substrate, the adhesive spreads while pushing air existing in the gap between the substrate and the component from near the center of the component to the outside. Moreover, gravity acts effectively as a force that pushes air outward.

  Note that the shape of the region near the center of the bump surface and the ratio of the size to the bump surface shown in FIGS. 20A to 20C are examples, and these shapes and ratios are the shape of the bump surface of the component and the wetness. It depends on the properties and the viscosity of the adhesive. That is, the allowable range of the adhesive application position may be determined based on experimental values, theoretical values, and the like.

  In addition, as described with reference to FIGS. 3 and 4, the component mounter 1 according to the present embodiment has the functional and construction features of applying an adhesive to a component, inverting it, and mounting it on a substrate. Have. The characteristics of the component mounting machine 1 can be applied to various construction methods.

  For example, the above construction method features can also be applied to the C4 method described with reference to FIG.

FIG. 21 is a process diagram showing an example in which the construction method features of the component mounting machine 1 are applied to the C4 construction method.
As shown in FIG. 21, (1) an amount V of adhesive satisfying V1> V ≧ V2 is applied to the bump surface of the component 20. Further, a flux is applied to the precoat portion formed on the electrode of the substrate 23. (2) The component 20 is inverted and mounted on the substrate 23. (3) Reflow and curing are performed by heating.

  In addition, when using the adhesive agent containing the hardening | curing agent which has the same function as flux, such as an acid anhydride, the application | coating process of a flux is unnecessary in the process of said (1).

  Also by such a process, the component 20 is fixed to the substrate 23 efficiently and stably. Further, even when a plurality of components are mounted on the board, reflow can be performed at once.

  Similarly, the above-mentioned characteristics of the construction method are applied to so-called gold-gold bonding, in which a gold bump formed on a semiconductor element and a gold portion formed on an electrode of a substrate are metal-bonded while being vibrated by ultrasonic waves. be able to.

  That is, the component mounting machine 1 can perform component mounting using ultrasonic waves by including an ultrasonic generator that generates ultrasonic waves.

  FIG. 22 is a process diagram illustrating a process in which the component mounting machine 1 includes the ultrasonic generator 35 and performs gold-gold bonding.

  As shown in FIG. 22, (1) gold bumps 21 a are formed on a component 20 that is a semiconductor element, and an amount V of adhesive satisfying V1> V ≧ V2 is applied to the bump surface by the application unit 5. The (2) The component 20 is inverted and comes to a position facing the substrate on which the gold part 24a is formed on the electrode. (3) The component 20 is pressed while being vibrated by the ultrasonic generator 35, and the gold bump 21a and the gold part 24a are joined. (4) The adhesive is cured by heating.

  As described above, the mounting method in which the gold-gold bonding is performed using the vibration caused by the ultrasonic wave is characterized by the mounting method performed by the component mounting machine 1 in which the adhesive is applied to the component, reversed, and mounted on the substrate. Can be applied.

  Here, in the case of applying pressure while oscillating a component in this way, if the adhesive adheres to the tip of the nozzle to be vibrated and pressurized, for example, if the adhesive attached to the nozzle tip is cured, Parts that are subject to pressure may be damaged.

  However, in the component mounting machine 1 according to the present embodiment, as described above, the application amount V of the adhesive is controlled so as to satisfy V1> V ≧ V2. That is, it is possible to prevent the adhesive from protruding from the parts unnecessarily. Furthermore, application can be performed in a state where air bubbles are not mixed in the adhesive, and it is possible to eliminate the expansion of the air bubbles when heated and the adhesive coming out from the side of the component.

  Therefore, it is possible to prevent the adhesive from adhering to the nozzle to be pressurized when the pressure is applied while being vibrated. That is, it is possible to prevent the occurrence of problems due to the adhesive adhered to the nozzle.

  In addition, when implementing the mounting method which performs gold | metal | money joining using the vibration by an ultrasonic wave, instead of forming the gold | metal part 24a on the electrode of a board | substrate, you may form the electrode itself with gold | metal | money.

  Moreover, the component mounting machine 1 of this Embodiment may be provided with the plasma generator which irradiates atmospheric pressure plasma to the bump surface of components. By performing plasma treatment on the bump surface of the component, the affinity of the bump surface to the adhesive is improved, and the adhesive is easily spread.

  FIG. 23 is a process diagram showing a process in which the component mounter 1 includes a plasma generator and mounts a component on a substrate.

  As shown in FIG. 23, (1) the bump surface of the component 20 adsorbed by the nozzle 3 is subjected to plasma processing by the plasma generator 36. (2) The component 20 is reversed, and the application part 5 applies an adhesive amount V that satisfies V1> V ≧ V2 to the bump surface. (3) The component 20 is inverted and mounted on the substrate 23. (4) Reflow and curing are performed by heating.

  The plasma generated by the plasma generator 36 is preferably a plasma generated by a gas containing at least oxygen gas.

  In this way, the C4 method, the mounting method using ultrasonic waves, and the mounting method using plasma are applied by the component mounting machine 1 in which the adhesive is applied to the component, reversed, and mounted on the substrate. The above features can be applied.

  In addition, for example, as described above, the material of the bump on the component electrode and the material of the pre-coating part or the electrode itself when not pre-coating are both gold, but the material of the bump is solder. In addition, when there is no precoat portion on the substrate and it is directly prefluxed on the electrode, when both the bump and the precoat portion are solder, the bump is a gold wire bump or a gold plated bump, and the precoat formed on the electrode of the substrate The above steps can be performed in various combinations, such as when the material of the part is Pb-free solder.

  In addition to the Pb-free solder, there are eutectic, high Pb, and the like. However, any type of solder does not hinder the implementation of the above process.

  As described above, whether or not the process of applying the adhesive to the component, inverting it, and mounting it on the board, which is a feature of the construction method implemented by the component mounting machine 1, depends on the mounting method and the joining of the component and the board. The present invention can be applied to all construction methods including a step of fixing the component to the substrate by curing the adhesive between the component and the substrate without depending on the aspect, the kind of the adhesive, and the additional processing content.

  That is, in all these methods, the effect of fixing the component to the substrate efficiently and stably is exhibited.

  Here, if the material of at least one of the electrode or precoat portion of the substrate and the bump of the component is solder, the component and the substrate are joined by reflow of solder. Therefore, applying a force in the board direction to the component during the reflow brings about an effect of improving the bonding property between the component and the board.

  Therefore, by controlling the coating amount V to an amount satisfying V1> V ≧ V2 as described above, the effect of giving a pressing force other than its own weight to the component is as described above. This is most noticeable when at least one of the materials is solder.

  In addition, the component mounter 1 in the present embodiment is configured to mount the component on the substrate after applying an adhesive to the bump surface of the component.

  However, the component may be mounted on the substrate after the amount of adhesive controlled by the coating amount control unit 28 is applied separately on both the bump side and the substrate side of the component.

  For example, this is a case where the thickness of the solder precoat formed on the substrate side is large and the unevenness of the substrate is large.

In this case, by applying to the substrate side as well, mixing of bubbles can be eliminated, which is effective.
Alternatively, the component may be mounted on the substrate after the amount of adhesive controlled by the coating amount control unit 28 is applied to the substrate.

  For example, at a room temperature, the contact angle with the substrate is large, for example, a value of around 90 degrees, a shape with high viscosity and a protruding tip, and a contact angle that remains larger than the natural angle α even after mounting the component. A case is assumed in which an adhesive is used that has a contact angle close to the natural angle α at the heating temperature in the reflow furnace.

  In this case, the surface of the adhesive between the component and the substrate may not be inwardly convex as shown in FIG. 7 during the period from after the component is mounted on the substrate at room temperature to before heating. Conceivable.

  However, if the adhesive has spread to the periphery of the bump surface and the amount V of adhesive applied to the substrate satisfies V1 ≧ V> V2, while the component is being heated, The surface of the adhesive in between changes to an inwardly convex shape, and the contact angle gradually approaches the natural angle α.

  That is, in this process, a pressing force due to the wetting and spreading of the adhesive acts on the component, and the bonding between the component and the substrate can be made more reliable.

  That is, the component mounter 1 may apply the adhesive to at least one of the bump surface of the component and the substrate.

  In addition, the adhesive used in the present embodiment is a thermosetting resin having a viscosity included in a range of at least 0.001 Pa · s to 200 Pa · s.

  However, regardless of whether or not the viscosity of the adhesive is included in the above range, the component mounting machine 1 may perform processing according to the viscosity of the adhesive and may include a component for the processing. good.

  For example, when reversing the part after applying the adhesive to the part, the viscosity of the adhesive is low, so if there is a possibility that the adhesive may spill out of the part due to inertia or centrifugal force, the adhesive should be added to improve the viscosity. You may have the structure part to cool. Further, the reversing unit 7 may slow the reversing speed.

  The component that performs the cooling may be actively cooled by cold air or the like, or may be cooled by not inverting the component until the adhesive on the component is lowered to a predetermined temperature at room temperature.

  Further, for example, when the viscosity is high and the wet spread on the bump surface or the substrate of the component is poor, a component that heats the adhesive may be included to reduce the viscosity. The component that performs the heating may be positively heated by warm air or the like, or may be heated by not inverting the part until the adhesive on the part rises to a predetermined temperature at room temperature.

  In the case where the adhesive is cooled or heated, the cooling or heating may be performed until the part to which the adhesive is applied is reversed.

  Furthermore, in order to improve the wetting and spreading on the bump surface of the component or on the substrate, the drawing portion may be applied in accordance with the shape of the bump surface of the component by discharging the adhesive while the coating unit 5 moves. .

  Examples of drawing application are “×”, “*”, and the like. Also, other shapes may be used as long as there is no region surrounded by the adhesive when applied to the bump surface. That is, it is sufficient if the adhesive spreads the surface of the substrate so that air can be easily pushed outward from the vicinity of the center of the bump surface.

  In addition, the component mounting machine 1 includes a reversing unit 7 in the moving table 6 as a functional configuration, and the reversing unit 7 reverses the head 4 and reverses the top and bottom of the nozzle 3 sucking the component, thereby It was assumed that the top and bottom were reversed. However, the part may be reversed by other means.

  For example, the head 4 itself may have a function of reversing by providing a motor or the like for reversing the head 4. In other words, the component mounter 1 only needs to have a function of turning the component upside down when the component to which the adhesive is applied is mounted on the substrate.

  In addition, the substrate on which the component is mounted in the component mounting machine 1 is transferred to the reflow furnace and heated. However, the component mounting machine 1 may include a component that performs solder reflow and adhesive curing.

  For example, the nozzle 3 may have a heating function, and the nozzle 3 may be subjected to solder reflow and adhesive curing.

  Further, the application unit 5 and the tank 5a are attached to the movable table 6 and are moved as the movable table 6 moves. With this configuration, for example, as described with reference to FIG. 16, when one nozzle 3 is sucking a component from the component supply unit 22, the application unit 5 is a component sucked by the other nozzle 3. An adhesive can be applied. However, it may not be attached to the movable table 6.

  The application unit 5 and the tank 5a may be attached to any position in the component mounting machine 1 as long as the adhesive can be applied to the bump surface in the upward state.

  In the component supply unit 22, the plurality of components 20 are placed with their bump surfaces facing downward. However, the plurality of components 20 may be placed with the bump surface facing up, respectively. In this case, a unit that reverses and holds the bump surface of the component 20 from the component supply unit 22 may be provided, and a surface that is not the electrode surface of the reversed component 20 may be sucked by the nozzle 3.

  Further, in the head 4 to which two nozzles 3 are attached, the nozzle 3 is configured to move in parallel with the head 4 in the Z-axis direction. However, the nozzle 3 may be configured not to move with respect to the head 4, and the entire head 4 may be configured to move in the Z-axis direction with respect to the moving table 6.

  The present invention can be applied to a component mounter for mounting components such as semiconductor elements on a substrate. In particular, the present invention is useful as a component mounting machine and a component mounting method that employ a method of fixing a component to a substrate by curing an adhesive between the component and the substrate.

It is a perspective view which shows the external appearance of the component mounting machine of embodiment. It is a functional block diagram which shows the outline | summary of the functional structure of the component mounting machine of embodiment. It is a flowchart which shows the flow of the process which concerns on the component mounting in the component mounting machine of embodiment. FIG. 4 is a process diagram illustrating an outline of a process illustrated in FIG. 3. (A) is a figure for demonstrating V1 in embodiment, (B) is a figure for demonstrating V2 in embodiment, (C) is V1> in embodiment. It is a figure for demonstrating an example of the application quantity V which satisfy | fills V> V2. It is a figure for demonstrating the simple method of calculating | requiring the quantity corresponded to the capacity | capacitance of the clearance gap between the components after joining, and a board | substrate. It is a schematic diagram which shows the wet spreading method on the board | substrate of an adhesive agent in embodiment. It is a figure which shows the maximum value of the protrusion distance from the component of the adhesive agent when the component mounting machine of embodiment mounts a component on a board | substrate. It is a figure for demonstrating the contact angle with respect to the solid of a liquid. (A) is a schematic diagram from the side of the component and the substrate in a state where the contact angle of the adhesive to the substrate is δ, and (B) is an assumed value for calculating the pressing force due to wetting and spreading of the adhesive FIG. It is a schematic diagram which shows a mode that a bubble remains between components and an adhesive agent by apply | coating an adhesive agent to a board | substrate and mounting components on a board | substrate. It is a figure which shows the shape of the adhesive agent at the time of an adhesive agent being discharged from an application part. It is a schematic diagram which shows a mode that an adhesive spreads on a surface, extruding air. It is a figure which shows a mode that an adhesive agent spreads on a board | substrate in the case of mounting | wearing to the board | substrate of components. (A) is a figure which shows an example of the state which the adhesive spread on the bump surface, (B) is a figure which shows another example of the state where the adhesive spread on the bump surface, (C) It is a figure which shows the state which the adhesive agent has stopped in the peripheral part of the bump surface. It is process drawing which shows the process in which the component mounting machine of this Embodiment mounts components on a board | substrate using two nozzles. (A) is a schematic diagram when a configuration for controlling the amount of adhesive applied to a component based on the height of the adhesive formed in a mountain shape on the component is viewed from the X-axis direction; (B) is a schematic diagram when the configuration is viewed from the Y-axis direction. (A) is a schematic diagram when a configuration for controlling the amount of adhesive applied to a component based on the shape of the adhesive on the component is viewed from the X-axis direction, and (B) is the configuration It is a schematic diagram at the time of seeing from the Y-axis direction. It is a block diagram which shows the outline | summary of a functional structure of a component mounting machine provided with the detection part which detects the application | coating state of an adhesive agent. (A) is a figure which shows the 1st example of the application | coating position of the adhesive agent on the bump surface of components, (B) is a figure which shows the 2nd example of the said position, (C) is It is a figure which shows the 3rd example of the said position. It is process drawing which shows the example which applied the characteristic on the process of the component mounting machine of this Embodiment to C4 construction method. It is process drawing which shows the process in which the component mounting machine of this Embodiment is equipped with an ultrasonic generator and performs gold-gold joining. It is process drawing which shows the process in which the component mounting machine of this Embodiment is equipped with a plasma generator and mounts components on a board | substrate. It is process drawing which shows the process of the conventional C4 construction method. (A) is a figure which shows a mode that an adhesive agent adheres to components in the conventional C4 construction method, (B) is a mode that the adhesive agent is poured from the area | region ensured for the pouring of the adhesive agent. FIG. It is a figure which shows the process with which it fills between board | substrates. It is process drawing which shows the process of the conventional construction method which apply | coats an adhesive agent to a board | substrate, and mounts components on a board | substrate. (A) is a figure which shows an example of the application | coating width | variety of the adhesive agent in the construction method shown in FIG. 26, (B) is a figure which shows another example of the application | coating width | variety of the adhesive agent in the construction method shown in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Component mounting machine 2 Transfer part 3 Nozzle 4 Head 5 Application | coating part 5a Tank 6 Moving stand 7 Inversion part 9 Beam 10 Mounting control part 20 Component 21 Bump 21a Gold bump 22 Component supply part 23 Substrate 24 Precoat part 24a Gold part 25 Detection Unit 26 photocell 26a irradiation unit 27 camera 28 coating amount control unit 30 conveyor 35 ultrasonic generator 36 plasma generator

Claims (6)

A component mounter for mounting a component having a bump as a protruding terminal on a substrate,
A bump surface which is a surface having a bump of a component, and an application means for applying an adhesive to at least one of the substrates;
Coating amount control means for controlling the coating amount V, which is the amount of adhesive applied by the coating means, to an amount satisfying V1> V ≧ V2,
A mounting means for mounting the component on the substrate in a state where the adhesive is interposed between the component and the substrate;
The component and the substrate are joined by being heated at a predetermined heating temperature after the component is mounted on the substrate,
V1 and V2 are boundaries that are virtual surfaces linearly extending from the periphery of the bump surface toward the substrate in the positional relationship between the component and the substrate when the component is bonded to the substrate. A capacity of a space region surrounded by a surface, the component, and the substrate;
The V1 is a capacity of the space region in a state where an angle on the component side formed by the boundary surface and the substrate is equal to a contact angle of the adhesive with respect to the substrate at the predetermined heating temperature.
Wherein V2 is Ri capacity der of the spatial region in a state in which the boundary surface is in contact without intersecting the bumps,
The application means, with the bump surface facing upward, applies the adhesive to the bump surface from above,
The component mounter further includes
Comprising reversing means for reversing the top and bottom of the component to which the adhesive has been applied by the application means;
The mounting means is reversed by the reversing means so that the component in a state in which the adhesive applied to the component has a downward convex shape is brought close to the substrate located under the component. By going, the component is mounted on the board,
The coating amount control means includes
Acquisition means for acquiring component information including the size of the component and the number of bumps;
Based on the component information acquired by the acquisition unit, and having a calculation unit that calculates an amount corresponding to the capacity of the gap between the component and the substrate when the component and the substrate are joined,
A component mounting machine that controls the coating amount V to an amount satisfying V1> V ≧ V2 by setting the coating amount V to an amount calculated by the calculation means . further,
A detecting means for detecting that the shape of the adhesive applied to the bump surface after the application of the adhesive by the applying means has become a predetermined shape;
When the detecting unit detects that the shape of the adhesive has become a predetermined shape, the coating amount control unit causes the coating unit to stop the application of the adhesive, thereby reducing the coating amount V. The component mounting machine according to claim 1, wherein the component mounting machine is controlled so as to satisfy V1> V ≧ V2. further,
A detecting means for detecting that the height of the adhesive applied to the bump surface after the application of the adhesive is started by the applying means reaches a predetermined height;
When the detecting means detects that the height of the adhesive has reached a predetermined height, the application amount control means causes the application means to stop the application of the adhesive to thereby apply the application amount. The component mounting machine according to claim 1, wherein V is controlled to an amount that satisfies V1> V ≧ V2. A method of mounting a component having a bump, which is a protruding terminal, on a substrate,
An application step of applying an adhesive to at least one of the bump surface, which is the surface having the bumps of the component, and the substrate;
A coating amount control step of controlling the coating amount V, which is the amount of adhesive applied in the coating step, to an amount satisfying V1> V ≧ V2,
A mounting step of mounting the component on the substrate with the adhesive interposed between the component and the substrate;
The component and the substrate are joined by being heated at a predetermined heating temperature after the component is mounted on the substrate,
V1 and V2 are boundaries that are virtual surfaces linearly extending from the periphery of the bump surface toward the substrate in the positional relationship between the component and the substrate when the component is bonded to the substrate. A capacity of a space region surrounded by a surface, the component, and the substrate;
The V1 is a capacity of the space region in a state where an angle on the component side formed by the boundary surface and the substrate is equal to a contact angle of the adhesive with respect to the substrate at the predetermined heating temperature.
Wherein V2 is Ri capacity der of the spatial region in a state in which the boundary surface is in contact without intersecting the bumps,
In the application step, the adhesive is applied to the bump surface from above with the bump surface facing upward,
The component mounting method further includes:
A reversing step of reversing the top and bottom of the part to which the adhesive has been applied in the application step,
In the mounting step, by reversing in the reversing step, the component in a state in which the adhesive applied to the component has a downward convex shape is brought close to a substrate located under the component. By going, the component is mounted on the board,
The coating amount control step includes
An acquisition step of acquiring component information including the size of the component and the number of bumps;
A calculation step of calculating an amount corresponding to a capacity of a gap between the component and the substrate when the component and the substrate are joined based on the component information acquired in the acquisition step;
In the coating amount control step,
A component mounting method for controlling the coating amount V to an amount satisfying V1> V ≧ V2 by setting the coating amount V to an amount calculated in the calculation step . further,
A detection step of detecting that the shape of the adhesive applied to the bump surface after the application of the adhesive is started in the application step has become a predetermined shape;
In the application amount control step, when it is detected in the detection step that the shape of the adhesive has become a predetermined shape, the application amount V is set by stopping application of the adhesive in the application step. The component mounting method according to claim 4, wherein the amount is controlled so as to satisfy V1> V ≧ V2. further,
A detection step of detecting that the height of the adhesive applied to the bump surface after the start of application of the adhesive in the application step has reached a predetermined height;
In the coating amount control step, when the detection step detects that the height of the adhesive has reached a predetermined height, the coating amount is stopped by stopping the coating of the adhesive in the coating step. The component mounting method according to claim 4 , wherein V is controlled to an amount that satisfies V1> V ≧ V2.

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