JP4706677B2 - RFID tag manufacturing method - Google Patents

Description

  The present invention relates to a method for manufacturing an RFID (Radio Frequency Identification) tag. The RFID tag receives a command signal transmitted from a reader / writer, and updates tag information stored in a memory according to the information of the command signal. The information is added or the tag information is transmitted as a read signal to the RFID reader / writer, and is used for the entry / exit management of the living body / article or the distribution management.

  The RFID system performs wireless communication between an RFID tag having an IC chip and an RFID reader / writer. RFID tags include a so-called active type tag that is mounted with a battery and driven by the electric power, and a so-called passive type tag that receives electric power from a reader / writer and drives it as a power source. The active tag has a battery compared to the passive type, so it has advantages in terms of communication distance and communication stability, but has a complicated structure and disadvantages such as an increase in size and cost. There is also. And with recent improvements in semiconductor technology, IC chips have become smaller and higher performance for passive tags, and the use of passive tags in a wide range of fields has been expanded by extending communication distance and improving communication stability. This is an expected situation.

  In the passive induction tag, in the electromagnetic induction method applied to the RFID tag of the long wave band and the short wave band, a voltage is applied to the RFID tag by the electromagnetic induction action between the transmission antenna coil of the reader / writer and the antenna coil of the RFID tag. The IC chip is activated by this voltage to enable communication. Therefore, the RFID tag operates only within the induction electromagnetic field by the RFID reader / writer, and the communication distance becomes about several tens of centimeters. In addition, in radio frequency RFID tags such as UHF band and microwave band, the radio wave communication method is applied, and power is supplied to the IC chip of the RFID tag by radio waves, so the communication distance is about 1 to 8 m. And has improved significantly. Accordingly, RFID tags in high frequency bands such as UHF band and microwave band are collectively read and moved by a plurality of RFID tags that are difficult to realize in long wave band and short wave band RFID systems with short communication distances. RFID tags can be read, and the range of use is expected to expand significantly in the future. Then, as a passive tag of high frequency, such as a UHF band or a microwave band, there existed what was described in patent documents 1-5, for example.

  Regarding a conventional RFID tag, FIG. 3 of Patent Document 1 includes a half-wavelength microstrip line resonator 13, a dielectric substrate 14, and a ground conductor plate 15. By connecting the IC chip to the ground conductor plate 15, even if there is a metal object (conductor) on the ground conductor plate 15 side, the metal object (conductor) is hardly affected by the radiation characteristics of the antenna. An RFID tag that can be installed and pasted is disclosed. As for the details of the IC chip, FIG. 17 of Patent Document 1 shows that the dielectric material on the ground conductor side on the back surface of the ground line 104 where the IC 106 is connected to the central portion of the antenna conductor 100 by a technique such as wire bonding. In FIG. 18 to FIG. 21, similarly, the IC 121 is disposed so as to be buried in the dielectric material on the ground conductor side. As disclosed in paragraph No. 0028 of Patent Document 1, any bonding wire 122, 12, 2 can be used as long as the grounding surface can be formed on the side opposite to the surface on which the connection pad of IC 121 is formed. There is a description that one bonding wire 122 is unnecessary.

  In FIG. 1 of Patent Document 2, a terminal portion 3 formed on the surface of the substrate 1 and an IC chip disposed in an IC chip placement region 9 formed on a part of the substrate 1 and connected to the terminal portion 3 are shown. An RFID tag with a chip 6 is disclosed. For this purpose, it is not necessary to embed the IC chip 6 in the base material 1 and it can be mounted on the upper surface of the antenna. Therefore, an RFID tag having a simple structure can be manufactured by simply processing the surface of the base material 1, thereby reducing yield. It has been disclosed that manufacturing costs can be reduced.

  FIG. 19 of Patent Document 3 shows an RFID tag 5 having a dielectric member 10, an IC chip recess 10b, a film base 20, an antenna pattern 30, and an IC chip 40, and the dielectric member 10 has an IC chip. IC chip recess 10b in which IC chip 40 can be embedded is provided, IC chip 40 is embedded in this IC chip recess 10b, and antenna pattern 30 formed on the inner surface side of film substrate 20 is electrically connected to IC chip 40. As described above, there is disclosed a loop antenna in which a film substrate 20 is wound around a dielectric member 10 and configured by an antenna pattern 30 to suppress a decrease in communication distance even in the vicinity of a radio wave absorber.

  In FIG. 4 of Patent Document 4, an opening 31 for exposing a part of the dielectric 20 is formed on the antenna surface 30, and the opening includes a pair of first slits 31 a extending in parallel so as to face each other, and the pair. There is disclosed an RFID tag that includes a slit 31a and a second slit 31b that communicates with the pair of slits 31a, and the second slit 31b is positioned at an intermediate portion of the pair of first slits 31a. In the transmission / reception element (IC chip), the first and second feeding points are connected to 41 and 42.

  FIG. 1 and FIG. 2 of Patent Document 5 disclose an RFID tag in which an IC chip 13 is mounted on a slot antenna 10 formed by providing a slot 12 in the central longitudinal direction of a rectangular conductor plate 11. Yes.

Japanese Patent Laid-Open No. 2000-332523 (FIGS. 3, 17 to 21)

JP 2002-197434 (FIG. 1)

Japanese Patent Laying-Open No. 2006-53833 (FIG. 19)

Japanese Patent Laying-Open No. 2006-237664 (FIG. 4)

JP 2002-358494 A (FIGS. 1 and 2)

  However, although the RFID tag described in Patent Document 1 can be installed on a metal object (conductor), an IC chip is connected between the half-wavelength microstrip line resonator and the ground conductor plate. Because of the configuration, it is necessary to embed an IC chip inside the dielectric substrate. For this reason, there exists a subject that a structure is complicated and manufacture becomes difficult.

  The RFID tag described in Patent Document 2 is thicker than the antenna pattern and the conductor thickness of the terminal portion, and the IC chip is mounted on the surface of the base material even if the IC chip is downsized. As a result, a protrusion is formed on the surface of the RFID tag. Therefore, as described in Paragraph No. 0023 of Patent Document 2, it is necessary to cover and protect the entire mounting portion or a part of the IC chip to flatten the surface of the RFID tag. That is, when an antenna pattern and an IC chip are mounted on a substrate, the IC chip may be damaged due to an impact or the like, and it becomes difficult to directly print on the surface (upper surface) of the RFID tag using a label printer. There is a problem. Further, when a film on which an antenna pattern and an IC chip are mounted is bonded to a base material, the film bulges (protrusions) due to the IC chip is generated, so that there is still the above-described problem.

  The RFID tag described in Patent Document 3 is attached to or near a conductive object (conductor) such as a metal object, although the film (film base) bulges (projections) of the IC chip hardly occur. In such a case, there is a problem that the loop antenna does not operate due to the influence of the conductive object or the communication distance is extremely reduced.

  The RFID tag described in Patent Document 4 can be installed on a metal object (conductor) in the same manner as the RFID tag described in Patent Document 1. However, since the IC chip is provided outside the dielectric 20, even if the IC chip is miniaturized, the thickness of the IC chip is thicker than the antenna pattern and the conductor thickness of the terminal portion, and the IC chip is Since it is mounted on the surface of the substrate, a protrusion is formed on the surface of the RFID tag. For this reason, like the RFID tag described in Patent Document 2, there is a possibility that the IC chip may be damaged by impact or the like, and it is difficult to directly print on the surface (upper surface) of the RFID tag using a label printer. There is. Further, when a film on which an antenna pattern and an IC chip are mounted is bonded to a base material, the film bulges (protrusions) due to the IC chip is generated, so that there is still the above-described problem. In addition to this, it has a pair of first slits 31a extending in parallel so that the openings face each other, the pair of slits 31a, and a second slit 31b communicating with the pair of slits 31a. 31 is configured such that regions 36 and 37 defined by the dielectric 20 exposed through the opening 31 in the antenna surface 30 form a matching circuit for the transmitting and receiving elements, so that the feeding direction is in the lateral direction. On the other hand, the pair of slits 31a have a horizontally long shape, and the electric field of the cross polarization component in the vertical direction is also generated in the pair of slits 31a together with the electric field of the positive polarization in the horizontal direction in the second slit 31b. There is a problem that decreases.

  In addition, the generated cross-polarized light is radiated in a direction different from the direction originally intended for the positive-polarized wave, so there may be a case where a tag is in a place where communication is not desired when communicating with a reader / writer. There is also a problem that the installation and operation method of the tag becomes difficult. Furthermore, the patch antenna of the RFID tag described in Patent Document 5 is basically arranged such that the feeding points 41 and 42 are near the center of the antenna surface 30 but the slit is shifted from the center of the antenna surface 30. As a result, the pattern of the positive polarization is also asymmetrical, which affects the symmetry of the radiation pattern of the antenna. From these problems, it can be seen that the patch antenna disclosed in Patent Document 5 is centered on matching between the regions 36 and 37 and the transmitting / receiving element (IC chip).

  The RFID tag described in FIG. 1 and FIG. 2 of Patent Document 5 employs a slot antenna having a slot provided inside a conductor pattern. Similar to Patent Document 3, a conductive object (conductor) such as a metal object is used. ) Or installed in the vicinity thereof, there is a problem that the loop antenna or the dipole antenna does not operate due to the influence of the conductive object, or the communication distance is extremely reduced. Furthermore, since a magnetic field is generated in the longitudinal direction of the slot shown in FIG. 1 of Patent Document 5 and radiates by resonating at this length, the slot length needs to be about λ / 2 in order to radiate with high efficiency. Thus, there is a problem in miniaturization of the RFID tag.

  Accordingly, the present invention has been made to solve the above-described problems, and can be installed regardless of a conductive object or a non-conductive object without shortening the communication distance. A method of manufacturing an RFID tag that can easily manufacture a new RFID tag that can be printed by a label printer without causing a risk of damage to the IC chip due to an impact or the like because no protrusion is generated by the IC chip. The purpose is to provide.

The RFID tag manufacturing method according to claim 1 includes a conductor pattern forming step of forming a conductor pattern having a long and narrow slot on a part of a film base , and an IC chip through the slot. An IC chip connecting step for electrically connecting to an upper die having a concave portion and a lower die having a concave portion, and a cavity between the concave portion of the upper die and the concave portion of the lower die, and An injection gate formed by a transverse groove that crosses the concave portion from the outside formed on at least one of the mold-matching surface of the upper mold and the mold-matching surface of the lower mold, and through the injection gate a dielectric substrate forming step of implanting resin dielectric material in the cavity, prior to the injection of the resin, respectively including the said transverse groove, before the film substrate in which the conductor pattern is formed A film base material on which a conductive foil is formed on the mold mating surface and the concave portion of the upper mold is disposed on the mold mating surface and the concave portion of the lower mold. The air in the cavity is evacuated from a plurality of fine ventilation holes formed in the recesses, the conductor foil is sucked and fixed in the recesses of the lower mold, and the film substrate on which the conductor pattern is formed is At the same time as the formation of the dielectric substrate by sucking and fixing the IC chip toward the cavity side in the concave portion of the upper mold, a conductor pattern and the other main surface of the dielectric substrate are formed on one main surface of the dielectric substrate. And a pattern forming step of forming a ground conductor pattern.

Method of manufacturing the RFID tag according to claim 2, wherein the plurality of fine vent holes is that of claim 1 made of a breathable porous substrate.

Method of manufacturing the RFID tag according to claim 3, claim 1, wherein from said dielectric substrate and are formed conductive pattern and the ground conductor pattern and a film substrate removing step of removing the film substrate It is a thing of claim | item 2 .

As described above, in the RFID tag manufacturing method according to the present invention, since the IC chip is embedded in the dielectric substrate, the IC chip does not bulge. In the case of printing, there is an effect that an RFID tag can be obtained in which an IC chip is caught by a roller or a drum and damage to the IC chip due to this is reduced. In addition, since the structure of the obtained RFID tag is relatively simple, the RFID tag manufacturing method according to the present invention enables mass production at a time, and can greatly reduce the manufacturing time. There is an effect that the yield can be improved and the manufacturing cost can be reduced.

Embodiment 1 FIG.
First, the configuration of the RFID tag manufactured by the RFID tag manufacturing method according to the present invention and the operation in the RFID system will be described, and then the details of the RFID tag manufacturing method according to the present invention will be described. FIG. 1 is a configuration diagram of an RFID tag manufactured by the RFID tag manufacturing method according to this embodiment. 1A is a plan view of the RFID tag, FIG. 1B is a cross-sectional view taken along line AA ′ in FIG. 1A, and FIG. 1C is FIG. It is sectional drawing of the RFID tag which removed the film base material 2 of the RFID tag shown in FIG. In FIG. 1, reference numeral 1 denotes a dielectric substrate made of, for example, an olefin-based thermoplastic elastomer. However, the molten fluid resin does not need to be a molten organic material such as plastic, and a magnesium alloy or the like. It may be an inorganic fluid using the thixotropy possessed by or a reactive fluid such as cement. Reference numeral 2 denotes a film base material provided on one main surface (front surface) of the dielectric substrate 1 and on a ground conductor pattern 8 provided on the other main surface (back surface) of the dielectric substrate 1 described later.

  The film substrate 2 can be made of film polyethylene terephthalate (PET), polyimide, polyethylene naphthalate, polyvinyl chloride, etc., and the conductor pattern 3 or the ground conductor pattern 8 is formed by vacuum deposition or plating. Formed by a printing method or the like. The film substrate 2 may be a flexible substrate or a substrate that is not, and may be transparent or colored and translucent. When there is no need to protect the dielectric substrate 1, the film base 2 may be removed as shown in FIG. In addition, in Fig.1 (a), when the film base material 2 is transparency, the state seen through the film base material 2 is shown.

  Here, the film base 2 and the dielectric substrate 1 have the same dimensions in a plane. 3 is a conductor pattern provided on the film substrate 2. As shown in FIG. 1A, the conductor pattern 3 is formed on the inner side of the film base 2 with a distance d from the vertical and horizontal ends. In this case, it can be said that the conductor pattern 3 is formed at a distance d from the vertical and horizontal ends of the dielectric substrate 1. On the other hand, the film base 2 can be disposed on one main surface of the dielectric substrate at a distance d from the vertical and horizontal ends of the dielectric substrate 1. In this case, the conductor pattern 3 can also be provided on the entire surface of the film substrate 2. An elongated slot 4 is formed at the center of the conductor pattern 3 as shown in FIG. The slot 4 can be formed by etching or milling the conductor pattern 3. Of course, the slot 4 may be formed simultaneously with the formation of the conductor pattern 3 by etching, vacuum deposition, plating, printing, or the like. The length and width of the slot 4 can be determined by the frequency used. Reference numeral 5 denotes a hole (concave depression) formed in one main surface of the dielectric substrate 1. Reference numeral 6 denotes an IC chip, which is composed of a memory or the like as will be described later. The IC chip 6 is electrically connected to the conductor pattern 3 through the slot 4.

  Here, a connection configuration between the IC chip 6 and the conductor pattern 3 will be described. 7 and 7, as shown in FIGS. 1A and 1B, projecting electrical connection portions respectively extending from both sides of the opposing conductor patterns 3 and 3 constituting the slot 4 to the inside of the slot 4. Thus, the conductor patterns 3 and 3 on both sides of the slot 4 are continuously connected and electrically connected. These electrical connection portions 7 and 7 may be formed simultaneously with the formation of the conductor pattern 3 by etching. Terminals (not shown) of the IC chip 6 are connected to the electrical connection portions 7 and 7. If the size of the IC chip 6 is the same as or smaller than the width of the slot 4, it will fall within the width of the slot 4, but at this time, the terminals (not shown) of the IC chip 6 are electrically connected. Connected to the units 7 and 7. However, when the size of the IC chip 6 is larger than the width of the slot 4, the terminal (not shown) of the IC chip may be electrically connected to a portion near the slot 4 of the conductor pattern 3 through the slot. Therefore, in this case, it is not necessary to provide the electrical connection portions 7 and 7 as described above.

  Further, in FIG. 1A, the IC chip 6 is arranged at the center in the length direction of the slot 4, but the arrow attached to the slot 4 in FIG. You may arrange | position at the edge part of the length direction of the slot 4 which moved along. Since the hole portion 5 of the dielectric substrate 1 is formed to insert the IC chip 6, the depth and the width thereof correspond to the size of the IC chip. Of course, when the molding material is arranged around the IC chip 6, the hole 5 is necessarily larger than the outer shape of the IC chip 6. Of course, the position where the hole 5 is formed is determined according to the position in the slot 4 where the IC chip 6 is placed. In any case, the shape and dimensions of the slot 4 must be matched to the number and characteristic impedance of the electrical connection portions 7 of the IC chip 6 to be mounted. For example, in order to achieve impedance matching, in addition to fine adjustment of the shape of the slot 4, in the case where there are two connection terminals of the IC chip 6, two electrical connection portions 7 having a width capable of impedance matching are formed. do it. Next, 8 is a ground conductor pattern provided on the other main surface (back surface) of the dielectric substrate 1. Reference numeral 9 denotes an adhesive sheet for bonding the dielectric substrate 1 and the film substrate 2 on which the conductor pattern 3 or the ground conductor pattern 8 is formed. The adhesive sheet 9 is provided in a portion corresponding to a portion other than the IC chip 6 (hole portion 5) on the surface (one main surface) of the dielectric substrate 1 on which the conductor pattern 3 is formed. 2 can be bonded and fixed.

  FIG. 2A is a conceptual diagram schematically showing how transmission / reception is performed between an RFID tag and an RFID reader / writer. FIG. 2B is a configuration diagram of the RFID tag, and in particular, a block configuration diagram functionally showing the internal configuration of the IC chip 6. 2A and 2B, reference numeral 10 denotes an RFID tag having the configuration shown in FIG. Reference numeral 11 denotes an antenna portion provided in the RFID tag 10, which corresponds to the conductor pattern 3 in which the slot 4 is formed in FIG. As shown in FIGS. 1A and 1B described above, the antenna portion 11 of the RFID tag 10 is provided with the conductor pattern 3 having the slots 4 on one main surface (front surface) of the dielectric substrate 1, and the dielectric substrate. Since the ground conductor pattern 8 is provided on the other main surface (back surface) of the one, the RFID tag 10 functions as a patch antenna. That is, the conductor pattern 3 having the slot 4 functions as an antenna pattern (radiating portion). The conductor pattern 3 and the slot 4 are adjusted so as to obtain impedance matching between the operating frequency of the RFID system and the IC chip 6 so as to be excited. Since this adjustment is greatly related to the thickness and relative dielectric constant of the dielectric substrate 1, a desired radiation pattern and gain can be obtained by adjusting and designing these conditions together. As described above, the slot 4 is formed in the central portion of the conductor pattern 3 so that the radiation pattern of the conductor pattern 3 is good. By adjusting and designing in accordance with such conditions, a desired radiation pattern and gain in the RFID tag 10 can be obtained, and without increasing the size of the RFID tag 10, that is, the dielectric substrate 1, for example, 1 to 1 A communication distance of about 8 m can be obtained.

  Reference numeral 12 denotes an RFID reader / writer, and reference numeral 13 denotes an antenna unit provided in the RFID reader / writer 12, which performs wireless communication with the antenna unit 11 of the RFID tag 10. Reference numeral 6 denotes the IC chip described in FIG. 1, and the specific configuration thereof is as shown in FIG. An analog unit 14 receives a transmission wave from the RFID reader / writer 12 by the antenna unit 11 of the RFID tag 10 and outputs the received wave to the digital circuit 21 at the subsequent stage. Reference numeral 15 denotes an A / D converter that performs A / D conversion on the transmission wave, and reference numeral 16 denotes a power that is generated by smoothing the transmission wave received by the antenna unit 11 with a rectifier circuit. It is a power supply control part which performs control. A memory unit 17 is mounted on the RFID tag 10 and stores tag information such as individual identification information. Reference numeral 18 denotes a demodulation unit that demodulates the transmission wave, and reference numeral 19 denotes a control unit that controls a circuit in the IC chip 6 including the memory unit 17 by the transmission wave demodulated by the demodulation unit 18. A modulation unit 20 modulates information extracted from the memory unit 17 by the control unit 19. 21 is a digital unit composed of the demodulation unit 15, the control unit 16 and the modulation unit 17, and 22 is a D / A conversion which D / A converts the signal transmitted from the modulation unit 20 and outputs it to the analog unit 14. Part.

  Here, the basic operation of such an RFID system will be described. The tag information is stored in the memory unit 17 of the RFID tag 10 in accordance with the use (biological / article entry / exit management and logistics management) using the RFID system, and the RFID reader / writer 12 itself The tag information can be updated, written, or read when the RFID tag 10 is present or moved (attached to a living body / article subject to entry / exit management or physical distribution management) in the transmission / reception area it can. The RFID reader / writer 12 transmits a command signal for instructing the RFID tag 10 to update, write, or read from the antenna unit 13 of the RFID reader / writer 12 to the antenna unit 11 of the RFID tag 10 as a transmission wave. The antenna unit 11 of the RFID tag 10 receives the transmission wave, and the transmission wave is detected and stored (smoothed) by the power supply control unit 16 to generate an operation power supply for the RFID tag 10, and the operation power supply to each circuit of the RFID tag 10. Supply. Further, the command signal of the transmission wave is demodulated by the demodulator 18. The control unit 19 performs data processing from the instruction content of the demodulated command signal, and instructs the memory unit 17 to update or write tag information, or to read the tag information. A return wave obtained by modulating the read signal output from the unit 17 by the modulation unit 20 is transmitted from the antenna unit 11 to the antenna unit 13 of the RFID reader / writer 12 via the analog unit 14, and the RFID reader / writer 12 receives the read signal. Thus, desired information is obtained.

  Furthermore, the operation of the RFID system using the RFID tag manufactured by the RFID tag manufacturing method according to the embodiment will be described in detail. The RFID reader / writer 12 performs update / write or read to the RFID tag 10. A command signal to be commanded is transmitted as a transmission wave from the antenna unit 13 of the RFID reader / writer 12 to the antenna unit 11 of the RFID tag 10. The conductor pattern 3, which is a radio wave radiation portion of the dielectric substrate 1 constituting the RFID tag 10, receives the transmission wave, generates a potential difference between the opposing portions of the slot 4, and the transmission wave is supplied to the IC chip 6. As described above, the transmission wave supplied to the IC chip 6 is detected and stored (smoothed) by the power supply control unit 16 to generate an operating power supply for the RFID tag 10, and each circuit (IC chip 6) of the RFID tag 10. To supply the operation power, the command signal is demodulated from the transmission wave, the tag information is updated / written and / or read from / to the memory unit 17 from the instruction content of the demodulated command signal, and the memory unit The readout signal output from the circuit 17 traces back the same path as the transmission wave supplied to the IC chip 6 as a return wave, and returns to the RFID reader / writer 12 from the conductor pattern 3 that is the radiation section. Waves are transmitted, the antenna unit 13 of the RFID reader-writer 12 receives the reply wave, it comes to obtaining the desired information. Note that the content of wireless communication data performed by the RFID system may be conventional or new, and since the ground conductor pattern 8 is formed on the back surface of the dielectric substrate 1, By directing the back side to the installation target surface, it is possible to manufacture a simple structure RFID tag that can be installed regardless of whether the installation target is a conductor or non-conductor. It can be used in a wide range of fields such as management, equipment management, and car entrance / exit management, and can be installed even if the installation target or installation target surface is a conductor such as a conductive object.

  Next, FIGS. 3A to 3C show manufacturing methods of the conductor pattern 3 and the mounting method of the IC chip 6 among the manufacturing methods of the RFID tag according to the embodiment, based on the sectional views. The process will be described. In Fig.3 (a), the conductor layer formation process which forms the conductor layer 23 on the film base material 2 (the back side of the film base material 2) is shown (film base material 201 with a conductor). Then, as shown in FIG. 3B, the region where the conductor pattern 3 is to be formed and the region where the electrical connection portions 7 are to be formed inside the slot 4 are masked, and the conductor pattern 3 and the electrical connection are formed by etching or the like. The conductor pattern formation process which forms the parts 7 and 7 simultaneously is shown (film base material 202 with a conductor). In addition, you may form a conductor pattern in a film base material, without performing a conductor layer formation process in the film base material 2. FIG. Then, as shown in FIG. 3C, in the IC chip connection step, the connection terminals 24 and 24 of the IC chip 6 are electrically connected to the electrical connection portions 7 and 7 by soldering. The electrical connection method is generally thermocompression bonding by reflow, but may be connected by other methods.

  FIG. 4 is a plan view in which a conductor layer is formed on the entire surface of the film substrate (film substrate 201). FIG. 5A is a rear view of the film substrate 2 after the conductor pattern 3 and the slot 4 are formed. As shown in FIG. 4, the conductor layer 23 is entirely formed on the back surface side of the film base 2, and a peripheral portion separated from the end of the film base 2 (dielectric substrate 1) by a predetermined distance d. A configuration of the conductor pattern 3 is shown in which the conductor layer in the slot 4 portion excluding the electrical connection portions 7 and 7 is removed by, for example, etching. The configuration of the film base 2 when viewed from the surface of the film base 2 at this time is shown in FIG. This is a case where the film substrate 2 is transparent or translucent. FIG. 6A is a rear view (film base material 202) in a state where the IC chip 6 is attached to the inside of the slot 4 on the film base material 2. FIG. FIG. 6B is a state diagram (film base material 202) when the state where the IC chip is attached to the film base material 2 is viewed from the front side of the film base material 2, and the electrical connection portions 7 and 7 and the IC chip. 6 is visible through the transparent or translucent film substrate 2. Conventionally, as shown in FIG. 7, the RFID tag is manufactured by attaching the hole 5 to the dielectric substrate 1 formed by etching or milling, as shown in FIG. 7. FIG. 7 is a surface view (top view) of a dielectric substrate having a hole, and shows the dielectric substrate 1 in which a hole 5 for inserting the IC chip 6 is formed on one main surface of the dielectric substrate 1. .

  FIG. 8 is an electric field diagram showing an electric field (indicated by an arrow) of the RFID tag manufactured by the RFID tag manufacturing method according to the embodiment. FIG. 8 also shows a partial enlarged view around the IC chip 6 and shows the state of the electric field with arrows in the partial enlarged view. The arrows shown in FIG. 8 indicate the electric field between the ground conductor pattern 8 and the conductor pattern 3. Since such an electric field is formed between the conductors, the electric field runs between the opposing portions of the slot 4. A potential difference occurs. A position where the intensity of the electric field in the thickness direction of the dielectric substrate 1 is zero is used as a feeding point of the IC chip. As shown in FIG. 8, since the left and right electric fields cancel each other out inside the dielectric substrate 1, the electric field strength is at a position along the longitudinal axis of the slot 4 (the depth direction in FIG. 8). Becomes zero. Therefore, if the electrical connection portion 7 of the IC chip 6 is arranged at this position, the power feeding loss can be greatly reduced. Therefore, with this configuration, the symmetry of the radiation pattern of the conductor pattern 3 is hardly adversely affected, the communication distance can be greatly extended, and even if the configuration is simple, the performance is greatly improved. There is an effect that an improved RFID tag can be obtained.

  FIG. 9 is a characteristic diagram showing a change in characteristic impedance of the RFID tag 10 manufactured by the RFID tag manufacturing method according to the embodiment. As described above, it has been described that the conductor pattern 3 is formed at a predetermined distance d from the end of the film substrate 2, but this means that the ground conductor pattern 8 is formed on the entire other main surface of the dielectric substrate 1. Therefore, it can be said that the predetermined distance d is a dimensional difference at the four corners of the conductor pattern 3 and the ground conductor pattern 8, as shown in FIG. In this way, the predetermined distance d is the same at the four corners of the conductor pattern 3 and the ground conductor pattern 8 even when the ground conductor pattern 8 is not formed on the entire other main surface of the dielectric substrate 1. It can be considered as a dimensional difference. Therefore, in FIG. 9, the horizontal axis represents a predetermined distance or the above-described dimensional difference d and the wavelength ratio of the used frequency of the RIFD tag, and the vertical axes R [Ω] and X [Ω] are the real parts of the characteristic impedance, respectively. And the imaginary part. Where λ on the horizontal axis is the wavelength of the operating frequency. According to the characteristic diagram of FIG. 9, when the predetermined distance d is 0.13λ or more, the characteristic impedance of the RFID tag 10 is substantially constant. Therefore, by setting the predetermined distance d to be 0.13λ or more, the characteristic impedance of the RFID tag can be obtained regardless of whether the RFID tag is installed in the air, regardless of whether it is a conductor or a non-conductor object. Therefore, the RFID performance does not deteriorate, and wireless communication with the RFID reader / writer 12 can be achieved. Since the electric field strength at the position of the hole portion 5 of the dielectric substrate 1 is zero, it can be said that it is almost the same as the change in characteristic impedance of the RFID tag when there is no hole portion 5.

  Next, FIG. 10 is a plan view showing the configuration of the RFID tag manufactured by the RFID tag manufacturing method according to the embodiment, and FIG. 11 is an enlarged plan view of the vicinity of the slot shown in FIG. . FIG. 11A is a plan view when the IC chip is not mounted, and FIG. 11B is a plan view when the IC chip is mounted. So far, the case where two connection terminals 24, that is, two IC chips are used has been described, but when the connection terminal 24 mounts four IC chips, the electrical connection portions 7 and 7 In addition, two dummy pads 25 and 25 are provided inside the slot 4 and in the vicinity of the connection terminals. The dummy pads 25 and 25 are formed at the same time as the electrical connection portions 7 and 7 are formed. Moreover, the dummy pads 25 and 25 seen through the film base 2 from FIGS. 10 and 11 are mere dummy pads that are not electrically connected to the conductor pattern 3 and the electrical connection portions 7 and 7. As described above, since it is possible to flexibly cope with a change in the specification of the IC chip 6 mounted on the RFID, it is possible to manufacture an RFID tag with a simple structure at low cost. Note that the number of dummy pads 25 is not limited to two.

  Hereinafter, production of the film base 202 in the RFID tag manufacturing method according to Embodiment 1 of the present invention will be described. 12 is a block diagram of an injection mold used for the RFID tag manufacturing method according to the first embodiment, FIG. 12a is a side sectional view of the injection mold, and FIG. 12b is a front view of the injection mold. FIGS. 13A and 13B are schematic views of the mold opening state when the film bases 201 and 202 with conductors and the like provided with a pattern or the like are positioned on the injection mold according to the first embodiment, and FIG. 14 is the embodiment. 2 is a schematic diagram of a mold clamping state in which an injection mold used in the RFID tag manufacturing method according to No. 1 is clamped and a molten fluid resin is filled and molded. FIG. In the figure, the same reference numerals are given to the same or corresponding parts.

  As shown in FIG. 12, the injection mold 26 of the present invention has a pair of an upper mold 27 having an upper mold surface 27a (concave) and a lower mold 28 having a lower mold surface 28a (concave). It consists of a mold. The mold fitting surface 29 of the upper mold 27 and the mold fitting surface 30 of the lower mold 28 are in contact with each other so as to face each other so that the mold is clamped, thereby forming a resin molding inside the injection mold 26. The upper mold surface 27a and the lower mold surface 28a are provided with the cavity 31 for the injection, and at the same time, the injection gate 32 for injecting the molten fluid resin into the cavity 31 has the transverse groove 32a and the transverse groove 32b. It is provided by overlapping. In the first embodiment, one injection gate 32 may be provided in advance in at least one position of the upper mold 27 or the lower mold 28. The negative pressure portion 27b and the negative pressure portion 28b that are in contact with the inner cavities 31 of the upper mold 27 and the lower mold 28 are provided with a plurality of fine vent holes 33 and vent holes 34 (breathable porous base material) for injection. By operating an exhaust pump 37 that is an exhaust device provided outside the molding die 26, it can be sucked through the vent pipes 35 and 36. The film bases 201 and 202 provided with a pattern or the like are arranged on the vent holes 33 and 34 provided in the negative pressure portion 27b and the negative pressure portion 28b and fixed.

  The conductor-attached film base 201 is the one shown in FIGS. 3A and 4, while the conductor film base 202 has the IC chip 6 mounted thereon as shown in FIGS. 3D and 6A. It is shown in (b). The conductor-attached film base 201 may be the one that forms the conductor film base 202 by providing the conductor pattern 3 or may be separately manufactured. Moreover, since the film base material 201 with a conductor is for providing the grounding conductor pattern 8, even if it does not use a film base material, conductor foils, such as copper foil which performed the chemical conversion treatment, may be sufficient. In addition, the planar shape of the film base materials 201 and 202 is a planar shape that matches the bottom surface shape of the upper and lower mold surfaces 30a and 30b for positioning. Next, using the injection mold 26, the conductor pattern 3 and the ground conductor pattern 8 are respectively transferred to the front and back surfaces of the resin molded substrate (injection molded substrate) which is the dielectric substrate 1. A method for manufacturing an RFID tag that is a molded product will be described in detail.

  As shown in FIG. 13, the air in the vent pipes 35 and 36 is exhausted in the A and B directions by operating the exhaust pump 37 with the injection mold 26 of the present invention in the mold open state. As a result, the negative pressure portion 27b and the plurality of vent holes 33 provided in the negative pressure portion 28b and the negative pressure portion 28b of the upper die 27 and the lower die 28 are both negative pressure. The surrounding air is exhausted in the C or D direction. Along the upper mold surface 27a of the upper mold 27, the conductor pattern surface of the film base 202 is inserted outward to be positioned at a predetermined position, and along the upper mold surface 27a. It is fixed by suction (because the planar shape of the film base material 202 matches the bottom surface shape of the upper mold surface 27a). Further, along the inner surface of the lower mold surface 28a of the lower mold 28, the grounding conductor pattern surface of the film base 201 is inserted outward to be positioned at a predetermined position, and the lower mold Suction and fixed along the surface 28a (because the planar shape of the film substrate 201 matches the bottom surface shape of the lower mold surface 28a) (film substrate placement step). Next, as shown in FIG. 14, the injection mold 26 is clamped to provide the cavity 31 and the injection gate 32 (injection port) (injection mold clamping process). The film substrate 201 may be disposed on the upper mold surface 27a, and the film substrate 202 may be disposed on the lower mold surface 28a.

  A molten resin (thermoplastic resin) 38 is injected, filled, and molded from the provided injection gate 32 into the cavity 31 formed by the recess, and the resin molding substrate ( A dielectric substrate 1) is obtained. Note that the molten fluid resin does not need to be a molten organic material such as plastic, and may be an inorganic fluid material using thixotropy such as a magnesium alloy or a reactive fluid material such as cement, In short, any fluid material that can be inserted into the cavity 31 from the injection gate 32 and can be solidified thereafter (dielectric substrate forming step and pattern forming step) may be used. The operation of the exhaust pump 37 is stopped, the injection mold 26 is opened, the film base 202 is disposed on one main surface of the resin-molded substrate (dielectric substrate 1), and the film base 201 is disposed on the other main surface. The RFID tag of the molded product arranged integrally is taken out (dielectric substrate taking out step). When the injected resin 38 is injected more than the volume of the cavity 31 inside the injection mold 26, the resin 38 remaining in the injection gate 32 is solidified to form the inner tube shape of the injection gate 32 on the dielectric substrate 1. Therefore, the excess resin remaining in the injection gate 32 is separated from the RFID tag and polished to a surface roughness (post-processing step). The chemical conversion treatment is generally used for a resin molded substrate such as forming fine streaks on the surface of the conductor foil or forming a layer on the surface of the conductor foil in order to improve the adhesiveness with the resin 38. Use what you can. Further, when the degree of adhesion is low only by the chemical conversion treatment, an adhesive sheet 9 as shown in FIG. 1 is placed on the chemical conversion treated surface of the chemical conversion treatment layer. In addition, even if it does not perform a chemical conversion treatment and only places the adhesive sheet similar to the adhesive sheet on the surface opposite to the surface opposite to the vent hole 34, the conductive foil is sufficiently bonded to the conductive foil 32 and the resin. If the degree is obtained, the chemical conversion treatment is not necessary (preparation step of the ground conductor pattern forming step). Moreover, regarding the film base material 202 and the film base material 201, an adhesive sheet may be used and a chemical conversion treatment may be performed.

  As described above, in the first embodiment of the present invention, conventionally, a predetermined portion of the film base is placed on the mold mating surfaces of a pair of molds for pattern positioning, and then the mold clamping is performed. The pattern could only be transferred and formed on one side of the molded resin substrate (dielectric substrate 1 in FIG. 7). Therefore, each pattern applied to a plurality of film substrates is positioned by a single molding process, and a cavity is provided between the plurality of film substrates to fill and mold the molten fluid resin. As a result, since the pattern on the film base material could not be transferred and formed on a plurality of surfaces of the molded resin substrate which is the base material of the product, the dielectric shown in FIG. The RFID tag is completed by supporting the film substrate 2 on the dielectric substrate 1 so that the IC chip 6 attached to the film substrate 2 is inserted into the hole 5 of the dielectric substrate 1 on the body substrate 1. In contrast to this, it is possible to position each pattern applied to a plurality of film base materials and provide a cavity between the plurality of film base materials to fill and mold the molten fluid resin. Since it is, the step of providing a hole 5 in the dielectric substrate 1 is unnecessary.

In Embodiment 1 of the present invention, the film base 202 and the film base 201 are evacuated (sucked) by the air holes 33 and 34 and are brought into close contact with the injection mold 26. The film base material 202 and the film base material 201 do not stretch during the injection molding, and there is an effect that the RFID tag conductor pattern 3 and the ground conductor pattern 8 formed after the resin 38 is solidified can be prevented from being thinned or cut. Moreover, since each film base material 2 which is a base material of the film base material 202 and the film base material 201 has the effect which protects the conductor pattern 3 and the grounding conductor pattern 8 which are antenna patterns which are copper foil, it removes. It may be stored without any. Further, instead of removing all the film base materials, one side (one main surface or other main surface) or a part of the RFID tag may be removed. Of course, it is also possible to mechanically turn off and remove all film base materials by a machine or manual work (film base material removal step). In addition, a flexible RFID tag can be manufactured by a flexible dielectric substrate by manufacturing the dielectric substrate 1 using a low hardness (for example, JIS-A55) olefin-based thermoplastic elastomer as the resin 38. Therefore, an RFID tag that can be installed along the curved surface of a curved object such as a drum can can be obtained. The curved surface on which the RFID tag can be installed is such that the electrical connection between the IC chip 6 and the conductor pattern 3 is not disconnected. Even if the conductor pattern 3 is bent, since the electrical length does not change, the radiation pattern is slightly deformed. However, the conductor pattern 3 does not hinder the operation of the RFID tag as a radio wave radiation portion. Furthermore, in the mold clamping process of the injection mold, although not shown, the upper mold 27 and the lower mold 28 are provided with guide pins and guide holes, respectively. In general, after the upper mold 27 and the lower mold 28 are positioned by fitting, the mold is clamped and fixed. The same can be said for these features in the following second to fifth embodiments.

Embodiment 2. FIG.
The RFID tag manufacturing method according to Embodiment 1 of the present invention will be described below with reference to the drawings. FIG. 15 is a configuration diagram of a film base material used in the RFID tag manufacturing method according to the second embodiment, and FIG. 15A is a side view of the film base material 39 (39 (a)) provided with the conductor pattern 3. 15 (b) is a top view of the film base 39 (39 (a)) provided with the conductor pattern 3, and FIG. 15 (c) is a film base 39 (39 (b) provided with the ground conductor pattern 8. )) Is a side view, and FIG. 15 (d) is a top view of the film base 39 (39 (b)) provided with the ground conductor pattern 8. Three ground conductor patterns 8 are formed, but the number of patterns formed on the film base 39 is not limited to three. FIG. 16 is a schematic diagram of a clamped state in which an injection mold used in the RFID tag manufacturing method according to Embodiment 2 is clamped and a molten fluid resin is filled and molded. The first embodiment is the same as the first embodiment except that the shape of the film substrate is changed from an independent shape to a continuous film substrate 39 in a tape shape. In the figure, the same reference numerals are given to the same or corresponding parts. Further, in FIG. 15B, the conductor pattern 3 is formed by, for example, etching the conductor layer of the peripheral portion and the slot 4 portion separated from the dotted line marked on the film base material 39a by a predetermined distance d. Yes. The area of the rectangle indicated by the dotted line in FIG. 15B is the same as that of the ground conductor pattern 8 shown in FIGS. 15C and 15D. That is, it is the same as the area of the resin molded substrate to be molded.

  The RFID tag molded in the second embodiment of the present invention uses the same injection mold as in the first embodiment of the present invention, and transfers the conductor pattern 3 and the ground conductor pattern 8 having the same shape. Since it is an obtained molded product, the same product is molded. The difference is that the shape of the film base material 202 used for molding and the base material of the film base material 201 is changed to a tape-like film base material 39, the positioning procedure of the conductor pattern 3 and the ground conductor pattern 8, and the fluid in which the resin is melted. The resin injection route only changes slightly.

  Since the injection pump 37 is operated with the injection mold 26 of the present invention in the mold open state, air is exhausted from the negative pressure portion 27b and the negative pressure portion 28b of the upper mold 27 and the lower mold 28. . The film base material 39a and the film base material 39b are arranged so that the conductor pattern 3 and the ground conductor pattern 8 are arranged at predetermined positions on the die mating surface 30 of the upper mold 27 and the lower mold 28, respectively. The upper mold surface 27a and the lower mold surface 28a of the upper mold 27 and the lower mold 28 gradually become negative pressure, and the tape-like film base material 39a and the film base material 39b are inserted along the mold surfaces. Then, the conductor pattern 3 and the ground conductor pattern 8 are also sucked and fixed at positions on the predetermined mold surface on the negative pressure portion 27b and the negative pressure portion 28b. Since the upper mold 27 and the lower mold 28 are provided with a transverse groove 32a and a transverse groove 32b for forming an injection gate, respectively, the film base material 39a and the film base material 39b are provided with the transverse groove 32a and the transverse groove. The upper mold surface 27a and the lower mold surface 28a on the side closer to the transverse groove 32a and the transverse groove 32b are further inserted inward from above the upper mold surface 27a and the lower mold surface 28a on the opposite side where 32b is provided. The surface 28a is inserted from the inside to the outside, and finally, the shape of the transverse grooves 32a and the transverse grooves 32b is included, and the surfaces are fixed by suction along the mating surfaces 29 and 30. If a slit or the like is provided in a part of the film substrate 39, the film substrate 39 can be easily along the mold surface (concave portion).

  Next, as shown in FIG. 16, the injection mold 26 is clamped, so that the cavity 31 (opposite recess) and the injection gate 32 (opposite crossing) via the film base 39a and the film base 39b. A groove 32a and a transverse groove 32b) are provided. The tape-shaped film base material 39a inserted into the transverse groove 32a and the transverse groove 32b and the injection gate 32 (gap formed in the film) formed by the film base material 39b toward the cavity 31 The molten resin 38 is poured, filled, and molded, and the resin molded substrate (dielectric substrate 1) is obtained after the resin molding (molded fluid resin) is cured. The operation of the exhaust pump 37 is stopped, the injection mold 26 is opened, the film base 39a is disposed on one main surface of the resin molded substrate (dielectric substrate 1), and the other main surface on the opposite surface side. The RFID tag having the film base 39b is taken out. Next, when the injected resin 38 is injected more than the volume of the cavity 31 inside the injection mold 26, the resin 38 remaining in the injection gate 32 is solidified to the dielectric substrate 1 to the injection gate 32. Since the inner tube-shaped surplus resin of the film base material 39a and the film base material 39b at the corresponding position is formed, it remains between the film base material 39a and the film base material 39b at the position corresponding to the injection gate 32. Excess resin is separated from the RFID tag and polished to a surface roughness. Finally, an RFID tag is obtained by mechanically or manually removing all or part of the film base material and removing it. Of course, in order to protect the conductor pattern 3 and the ground conductor pattern 8, the film base material corresponding to the conductor pattern 3 and the ground conductor pattern 8 may be left. The film substrate 39b may be disposed on the upper mold surface 27a, and the film substrate 39a may be disposed on the lower mold surface 28a.

  As described above, in the second embodiment of the present invention, the transverse groove 32a and the crossing are formed on the mold mating surfaces 29 and 30 of the upper mold 27 and the lower mold 28 of the injection mold 26 of the present invention. By providing the groove 32b, it is possible to inject, fill and mold the molten resin 38 between the film base 39a and the film base 39b, so that it is integrated with the film provided with a pattern or the like on both sides of the resin molded substrate. A special effect is obtained in that an RFID, which is a molded product molded in the same manner, is obtained. In addition, since the film base 39 is used as a tape-like film, the tape-like film base 39 is continuously inserted on the mold surface of the injection mold or is continuously formed integrally. RFID tags to be used can be taken in, which has the effect of significantly improving productivity and workability. In addition, since the molten resin 38 is injected into the cavity from the injection gate (gap formed in the film) formed by the film base 39a and the film base 39b, the mold-matching surface of the injection mold body The effect of preventing the crossing grooves (injection gates) from becoming dirty is obtained. Further, since the facing film base material 39a and the film base material 39b attached to the molded product are separated from each other, an effect that the RFID tag and the film base material are easily separated can be obtained.

Embodiment 3 FIG.
The third embodiment of the present invention will be described below with reference to the drawings. FIG. 17 is a configuration diagram of a mold clamping state of an injection mold used in the RFID tag manufacturing method according to the third embodiment. In FIG. 17, an injection mold 40 includes an upper mold 27 of the injection mold 26 and a negative pressure part 27b and a negative pressure part 28b (mold surface) of the lower mold 28 described in the first embodiment of the present invention. 30a and 30b), instead of a plurality of fine vent holes 33 and vent holes 34, a porous breathable solid material (breathable porous base material) is used. It is. In the drawing, the same reference numerals are assigned to the same or corresponding parts.

  The porous, breathable solid material may be pumice or ceramics, or may be a sintered powder of PTFE (tetrafluoroethylene resin) or an organic material such as plastic, or the like. Porous metal or the like may be used, and in short, any solid material having a vent hole inside may be used. As can be seen from FIG. 17, the porous portion 41 and the porous portion 42 made of a solid material are disposed so as to be flush with the respective mold matching surfaces 29 and 30 of the upper mold 27 and the lower mold 28, An upper mold surface 27a and a lower mold surface 28a (concave portion) are provided on the inner side of each flush surface (the mold matching surface of the porous portion). When the exhaust pump 37 is operated, air is exhausted from the surfaces of the porous portion 41 and the porous portion 42 formed of the breathable porous base material, so that the surface and the periphery thereof become negative pressure, and the film base material 202 is easily provided. , 201, 39a, 39b, etc. can be sucked and fixed.

  The injection mold 40 according to the third embodiment having the above-described configuration is obtained in the first or second embodiment by the same operation as in the first or second embodiment. It is possible to obtain an RFID tag which is a molded product formed integrally with the film provided with the conductor pattern 3 and the ground conductor pattern 8 on both surfaces of the resin molded substrate. Further, by forming the porous portion 41 and the porous portion 42 with a sintered body of PTFE powder, the surface energy of the porous portion is in a range from a low temperature of at least −50 ° C. to a high temperature of 460 ° C. while maintaining the porous property. In particular, the film substrate 202, 201, 39a, 39b, etc. can be easily removed from the upper mold and the lower mold.

  The porous portion may be nested with a porous material having air permeability. In that case, in FIG. 17, the injection mold 43 includes an upper mold 27 of the injection mold 26 and a negative pressure portion 27b and a negative pressure portion 28b of the lower mold 28 described in the first embodiment of the present invention. Instead of the plurality of fine vent holes 33 and vent holes 34 that form the mold surfaces 30a and 30b), the porous portion is made of a nest 45 and a nest 46 made of a porous material. Since the porous portion is composed of the insert 45 and the insert 46, the molding surface as the mold can be easily removed from the upper mold and the lower mold, so that the effect of facilitating the maintenance of the mold can be obtained.

Embodiment 4 FIG.
The fourth embodiment of the present invention will be described below with reference to the drawings. FIG. 18 is a configuration diagram of a mold clamping state of an injection mold used in the RFID tag manufacturing method according to the fourth embodiment. In FIG. 18, an injection mold 44 is coated with a fluororesin such as PTFE, FEP, PFA, etc. on the molding surface of the nesting made of a breathable porous material described in the third embodiment of the present invention. The negative pressure portions 45a and 46a are formed in the same manner, except that projecting fixing pins 47 and 48 are respectively provided on a part thereof. In the figure, the same reference numerals are given to the same or corresponding parts.

  The injection mold 44 according to the fourth embodiment having the above-described configuration is formed on both surfaces of the resin molded substrate as obtained in the third embodiment by the same operation as the third embodiment. It is possible to obtain an RFID tag which is a molded product formed integrally with a film or pattern to which the ground conductor pattern 8 is applied. Further, by providing the fluororesin coating negative pressure portions 45a and 46a on the molding surfaces of the insert 45 and the insert 46 made of a porous material, the first film and the second film can be easily formed from the insert 45 and the insert 46. Can be easily removed, so that the workability can be improved. In particular, PTFE coated so as to be sintered on a porous material can ensure sufficient air permeability in the range from a low temperature of −50 ° C. to a high temperature of 460 ° C. Is particularly effective. Further, since the projecting fixing pins 47 and 48 are respectively provided in a part of the negative pressure portion formed on the molding surface of each nesting, the film base materials 202, 201, 39a, 39b and the like are previously placed at predetermined positions. Since holes corresponding to the fixing pins 47 and 48 are provided and the holes are inserted into the fixing pins 47 and 48, the pattern on the film can be placed at a predetermined position on the shaping surface with high accuracy. Positioning can be performed, and a special effect that the film is not easily displaced due to resin flow can be obtained. In other embodiments and the prior art, such an effect can be obtained by providing a similar fixing pin on the molding surface of the mold or the insert.

Embodiment 5. FIG.
Hereinafter, a fifth embodiment of the present invention will be described with reference to FIGS. 3 to 7, 13, 14, and 19. FIG. FIG. 19 is a configuration diagram of a protrusion jig used in the RFID tag manufacturing method according to the fifth embodiment and a molded resin molded substrate. FIG. 19A is a protrusion treatment having a protrusion 49 a corresponding to the hole 5. 19B is a side view of the tool 49, and FIG. 19B shows a hole 5 on one main surface before providing the conductor pattern 3 (including the IC chip 6) that is an intermediate product of the RFID tag manufacturing method according to the fifth embodiment. 1 is a perspective view of a dielectric substrate 1 having a ground conductor pattern 8 on the other main surface. In the first to fourth embodiments, the conductor pattern 3 (including the IC chip 6) and the ground conductor pattern 8 are formed at the time of injection molding of the resin molded substrate which is the dielectric substrate 1, but in the fifth embodiment, Although only the ground conductor pattern 8 is formed on the dielectric substrate 1 and then the conductor pattern 3 (including the IC chip 6) is bonded to the dielectric substrate 1 using the above-described adhesive sheet or the like will be described. The difference is that in the first to fourth embodiments, the film bases 202 and 39a (that is, the conductor pattern 3) are sucked and fixed (evacuated) to the mold surface, but in the fifth embodiment, the protrusion jig is used. 49 is sucked and fixed (evacuated) to the mold surface. In the figure, the same reference numerals are given to the same or corresponding parts.

  As shown in FIG. 13, the air in the vent pipes 35 and 36 is exhausted in the A and B directions by operating the exhaust pump 37 with the injection mold 26 of the present invention in the mold open state. As a result, the negative pressure portion 27b and the plurality of vent holes 33 provided in the negative pressure portion 28b and the negative pressure portion 28b of the upper die 27 and the lower die 28 are both negative pressure. The surrounding air is exhausted in the C or D direction. Along the upper mold surface 27a of the upper mold 27, the projection 49a of the projection jig 49 is inserted outward to be positioned at a predetermined position, and suction fixed along the upper mold surface 27a. (Because the planar shape of the projection jig 49 matches the bottom surface shape of the upper mold surface 27a). Further, along the inner surface of the lower mold surface 28a of the lower mold 28, the grounding conductor pattern surface of the film base 201 is inserted outward to be positioned at a predetermined position, and the lower mold Suction and fixed along the surface 28a (because the planar shape of the film substrate 201 matches the bottom surface shape of the lower mold surface 28a) (film substrate placement step). Next, as shown in FIG. 14, the injection mold 26 is clamped to provide the cavity 31 and the injection gate 32 (injection port) (injection mold clamping process). However, in the fifth embodiment, not the RFID tag shown in FIG. 14 but the one not formed on the film substrate 202 is formed. The film base 201 may be disposed on the upper mold surface 27a and the protrusion jig 49 may be disposed on the lower mold surface 28a. Alternatively, one of the vent holes and the vent pipe may be eliminated, and the upper mold surface 27a. Alternatively, the protrusion 49a is formed on the lower mold surface 28a (the one where the vent holes and the ventilation pipes are eliminated), and the upper mold surface 27a and the lower mold surface 28a are not pulled on both sides but on one side. May be.

  A molten resin (thermoplastic resin) 38 is injected, filled, and molded from the provided injection gate 32 into the cavity 31 formed by the recess, and the resin molding substrate ( A dielectric substrate 1) is obtained. Note that the molten fluid resin does not need to be a molten organic material such as plastic, and may be an inorganic fluid material using thixotropy such as a magnesium alloy or a reactive fluid material such as cement, In short, any fluid that can be inserted into the cavity 31 from the injection gate 32 and solidified thereafter (dielectric substrate forming step and ground conductor pattern forming step) may be used. The operation of the exhaust pump 37 is stopped, the injection mold 26 is opened, the hole 5 is provided on one main surface of the resin-molded substrate (dielectric substrate 1), and the film base 201 is integrated on the other main surface. The resin-molded substrate of the molded product arranged on the substrate is removed (dielectric substrate removal step). When the injected resin 38 is injected more than the volume of the cavity 31 inside the injection mold 26, the resin 38 remaining in the injection gate 32 is solidified to form the inner tube shape of the injection gate 32 on the dielectric substrate 1. Therefore, the excess resin remaining on the injection gate 32 is separated from the resin molded substrate and polished to a surface roughness (post-processing step). An IC chip manufactured on the dielectric substrate 1 shown in FIG. 7 or FIG. 19B by the manufacturing method (conductor layer forming step (can be omitted), conductor pattern forming step, IC chip connecting step) described in the first embodiment. The film substrate 202 mounted with 6 is bonded (fixing step). Further, in order to fix the dielectric substrate 1 and the film base 202, an adhesive may be used instead of the adhesive sheet 9 as shown in FIG.

  As described above, in the fifth embodiment of the present invention, the projection jig 49 and the film base 201 are evacuated (sucked) by the vent hole 33 and the vent hole 34 and are brought into close contact with the injection mold 26. Therefore, the film base 201 is not stretched during the injection molding of the resin 38, and there is an effect that the conductor pattern 3 and the ground conductor pattern 8 of the RFID tag formed after the resin 38 is solidified can be prevented from being thinned or cut. In addition, each film substrate 39 which is the substrate of the film substrate 201 has an effect of protecting the conductor pattern 3 and the ground conductor pattern 8 which are antenna patterns which are copper foils, and therefore can be stored without being removed. Good. Further, instead of removing all the film base materials, one side (one main surface or other main surface) or a part of the RFID tag may be removed. Of course, it is also possible to mechanically turn off and remove all film base materials by a machine or manual work (film base material removal step). Further, since the film base 202 shown in FIGS. 3 to 6 is provided after the resin molding of the dielectric substrate 1, an IC chip electrically connected to the conductor pattern 3 of the film base 202 is injected into the cavity 31. Even if it does not withstand the temperature of the molten resin (thermoplastic resin) 38, it can be used. In the fixing process of the film substrate 202, the IC chip 5 is fitted into the hole 6, but when the molding material is arranged around the IC chip 6 and fixed, the outer shape of the IC chip 6 is inevitably required. As a result, the hole 5 becomes larger.

  As in the present invention, by designing and manufacturing the dielectric substrate 1 (resin molded substrate) by injection molding, a resin (thermoplastic resin) 38 is applied to the dielectric substrate obtained by laminating several printed substrates. In addition to significantly lowering the substrate cost (manufacturing cost) of a dielectric substrate injection-molded using a metal substrate, the dielectric material (material) of the dielectric substrate used in the RFID tag is a general printed circuit board. With dielectric materials such as polytetrafluoroethylene (fluororesin), ceramics, and glass epoxy, it is difficult to produce a substrate with any thickness, and it is not possible to flexibly respond to changes in required dimensions depending on the RFID tag installation position. On the other hand, with a dielectric substrate by injection molding, the thickness and shape can be easily changed by simply changing the mold. It can be easily manufactured. Also, by using an olefin polymer resin with a low dielectric loss tangent among the resins (thermoplastic resins) as a dielectric substrate for RFID tags, radiation efficiency is improved and high-gain RFID tags can be manufactured. It is. In addition, the specific gravity of the olefin polymer resin is about half that of a general printed circuit board, and the RFID tag can be reduced in weight. Further, the IC chip 6 is mounted on a hard and thick material such as a dielectric substrate made of polytetrafluoroethylene (fluorine resin), ceramic, glass epoxy, etc. used in a general printed circuit board. In this case, there is no dedicated equipment for mounting, and it takes time to mount one by one. On the other hand, there are many equipments for mounting the IC chip 6 on the film bases 2 and 39 in the market for resin molded substrates. Since it is on the market, mass production is possible at one time, and the manufacturing time and cost including the formation of the hole 5 can be greatly reduced.

It is a RFID tag block diagram manufactured by the manufacturing method of the RFID tag which concerns on this invention. 1 is a basic configuration diagram of an RFID system. It is a RFID tag manufacturing process figure manufactured with the manufacturing method of the RFID tag concerning this invention. It is a block diagram of the film base material which concerns on this invention. It is a conductor pattern figure formed in the film base material concerning this invention. It is a conductor pattern figure (IC chip connection completed) formed in the film base material which concerns on this invention. It is a dielectric substrate block diagram in which the hole which concerns on this invention was formed. It is an RFID tag electric field diagram manufactured by the RFID tag manufacturing method according to the present invention. It is a RFID tag characteristic impedance figure manufactured by the manufacturing method of the RFID tag concerning this invention. It is a RFID tag block diagram (with a dummy pad) manufactured by the manufacturing method of the RFID tag which concerns on this invention. It is the RFID tag slot vicinity enlarged view manufactured with the manufacturing method of the RFID tag which concerns on this invention (with a dummy pad). It is a block diagram of the clamping state of the injection mold used for the manufacturing method of the RFID tag which concerns on Embodiment 1 of this invention. It is a schematic diagram of the mold opening state when the film base with a conductor of the injection mold used for the manufacturing method of the RFID tag according to Embodiment 1 of the present invention is positioned. Schematic diagram of a clamped state in which an injection mold used in the RFID tag manufacturing method according to Embodiment 1 of the present invention is clamped and filled with molten fluid resin and molded It is a block diagram of the film base material used for the manufacturing method of the RFID tag which concerns on Embodiment 2 of this invention. It is a schematic diagram of the clamping state which clamped the injection mold used for the manufacturing method of the RFID tag which concerns on Embodiment 2 of this invention, and filled and shape | molded the melted fluid resin. It is a block diagram of the clamping state of the injection mold used for the manufacturing method of the RFID tag which concerns on Embodiment 3 of this invention. It is a block diagram of the clamping state of the injection mold used for the manufacturing method of the RFID tag which concerns on Embodiment 4 of this invention. It is a block diagram of the protrusion jig | tool used for the manufacturing method of the RFID tag which concerns on Embodiment 5 of this invention, and the molded resin molding board | substrate.

Explanation of symbols

1 ... dielectric substrate, 2 ... film substrate,
201 ... Film substrate with conductor (with conductor layer (grounding conductor pattern 8)),
202 ... Film substrate with conductor (with conductor pattern 3), 3 ... Conductor pattern,
4 ... Slot, 5 ... Hole, 6 ... IC chip, 7 ... Electrical connection, 8 ... Grounding conductor pattern,
9 ... Adhesive sheet, 10 ... RFID tag, 11 ... Antenna part (tag),
12 ... RFID reader / writer, 13 ... antenna unit (reader / writer),
14 ... Analog part, 15 ... A / D conversion part, 16 ... Power supply control part, 17 ... Memory part,
18 ... demodulator, 19 ... controller, 20 ... modulator, 21 ... digital part,
22 ... D / A converter, 23 ... conductor layer, 24 ... connection terminal, 25 ... dummy pad,
26 ... Injection mold, 27 ... Upper mold, 28 ... Lower mold, 29 ... Mold mating surface,
30 ... Mold matching surface, 31 ... Cavity, 32 ... Injection gate (injection port),
33 ... vent (vacuum port), 34 ... vent (vacuum port), 35 ... vent piping,
36 ... vent pipe (vacuum port), 37 ... exhaust pump, 38 ... resin (thermoplastic resin)
39 ... Film base material, 40 ... Injection mold, 41 ... Porous part, 42 ... Porous part,
43 ... Injection mold, 44 ... Injection mold, 45 ... Nest, 46 ... Nest,
47 ... fixing pin, 48 ... fixing pin, 49 ... projection jig.

Claims (3)

  A conductor pattern forming step of forming a conductor pattern having a long and narrow slot on a part of the film substrate; and an IC chip connecting step of electrically connecting an IC chip to the conductor pattern via the slot; An upper mold having a recess and a lower mold having a recess are overlapped, and a cavity is formed between the recess of the upper mold and the recess of the lower mold, and the die mating surface of the upper mold and the lower mold A dielectric that injects a resin of a dielectric material into the cavity through the injection gate by forming an injection gate formed by a transverse groove that crosses the concave portion from the outside formed on at least one of the mold mating surfaces of the mold Before the body substrate forming step and the injection of the resin, the film base material on which the conductor pattern is formed, including the transverse grooves, is formed on the mold fitting surface and the concave portion of the upper mold. Is formed on the mold mating surface and the concave portion of the lower mold, and the plurality of fine ventilation holes formed in the concave portion of the upper mold and the concave portion of the lower mold The air in the cavity is evacuated, the conductive foil is sucked and fixed in the concave portion of the lower mold, and the film substrate on which the conductive pattern is formed is placed in the concave portion of the upper mold and the IC chip is moved to the cavity side. And a pattern forming step of forming a conductor pattern on one principal surface of the dielectric substrate and a ground conductor pattern on the other principal surface of the dielectric substrate simultaneously with the formation of the dielectric substrate by suction fixing RFID tag manufacturing method.   The RFID tag manufacturing method according to claim 1, wherein the plurality of fine ventilation holes are made of a gas-permeable porous substrate. The RFID tag manufacturing method according to claim 1, further comprising a film base material removing step of removing the film base material from the dielectric substrate on which the conductor pattern and the ground conductor pattern are formed .

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