JP4610185B2 - Wiring board and manufacturing method thereof - Google Patents

Description

  The present invention relates to a wiring board that is suitably used for manufacturing a wiring board that is applied to various wiring boards, semiconductor element storage packages, and the like, and to a manufacturing method thereof. In particular, the present invention relates to a wiring substrate used for manufacturing a ceramic substrate having a function of a wiring conductor or a capacitor / magnetic shield capable of allowing heat dissipation and a large current, such as a power module substrate, and a manufacturing method thereof. .

  In recent years, heat generated from a semiconductor device has been increased with higher integration of semiconductor elements. In order to eliminate the malfunction of the semiconductor device, a wiring substrate capable of releasing such heat to the outside of the device is required. Further, as an electrical characteristic, signal delay becomes a problem due to an increase in calculation speed, and it has been required to use a wiring conductor having a small wiring conductor loss, that is, a low resistance.

  As a wiring board on which such a semiconductor element is mounted, a ceramic in which alumina ceramics is used as an insulating base and a wiring layer made of a refractory metal such as tungsten or molybdenum is deposited on the surface or inside thereof from the viewpoint of reliability. Wiring boards are frequently used. However, in a wiring layer made of a refractory metal that has been widely used in the past, the resistance can only be lowered to about 13 μΩ · cm. Therefore, in order to reduce the resistance value of the wiring conductor in the multilayer wiring board as described above and allow a large current to flow, the insulating base constituting the multilayer wiring board is formed by a thick copper (Cu) film or electroless plating. Forming a wiring conductor has been performed.

  However, in such a wiring conductor, the line width of the wiring pattern is limited by the area of the multilayer wiring board in order to increase the density of the wiring, and cannot be formed wider than a certain level. It was difficult to obtain a wiring conductor with a sufficient thickness at a low cost in a short time without adversely affecting the subsequent processes, and the above-mentioned reduction in resistance was not satisfied.

Therefore, in order to reduce the resistance value of the wiring conductor and allow a large current to flow, a through hole is formed in the ceramic grease sheet constituting the multilayer wiring board, and copper (Cu) having a low electric resistance value is formed in the through hole. A wiring conductor paste made of a low melting point metal such as silver or silver (Ag) has been proposed as a low resistance wiring conductor (see, for example, Patent Document 1).
JP-A-7-162157

However, in Patent Document 1, when the paste filled in a through hole provided in a predetermined sheet is dried, a gap is generated at the interface between the sheet and the paste filling portion, and due to repeated thermal history when the power element is operated. cracking the insulation layer and the conductor layer interface occurs, the cracks, moisture penetrates into the substrate, the internal wiring is a problem of corrosion.

  Therefore, the present invention provides a wiring board that can suppress a gap generated between different kinds of materials and that can block the atmosphere and avoid the progress of corrosion of internal wiring and the like, and a method of manufacturing the same, even when cracking occurs. With the goal.

Wiring board of the invention will be an insulating substrate made includes an insulating layer made of ceramics and stacked, one outermost insulating substrate, substantially the same as the insulator layer on the insulator layer a wiring board comprising comprising a conductor layer having a thickness, the front surface boundary between the insulator layer and the conductor layer on the surface side of the wiring board in the outermost insulating substrate of the one of which, the resin It is characterized by being covered with the containing coating resin layer.

The wiring board of the present invention is made by an insulating substrate made includes an insulating layer made of ceramics and stacked, one outermost insulating substrate, said insulator layer on the insulator layer a wiring board comprising comprises a conductive layer having substantially the same thickness, the front surface boundary between the insulator layer and the conductor layer on the surface side of the wiring board in the outermost insulating substrate of the one of which, It is characterized by being sequentially coated with a coated metal layer containing a metal and a coated resin layer containing a resin.

The wiring board of the present invention is made by an insulating substrate made includes an insulating layer made of ceramics and stacked, one outermost insulating substrate, said insulator layer on the insulator layer a wiring board comprising comprises a conductive layer having substantially the same thickness, the front surface boundary between the insulator layer and the conductor layer on the surface side of the wiring board in the outermost insulating substrate of the one of which, It is characterized by being sequentially coated with a coated ceramic layer containing a ceramic and a coated resin layer containing a resin.

The wiring board of the present invention is made by an insulating substrate made includes an insulating layer made of ceramics and stacked, one outermost insulating substrate, said insulator layer on the insulator layer a wiring board comprising comprises a conductive layer having substantially the same thickness, the front surface boundary between the insulator layer and the conductor layer on the surface side of the wiring board in the outermost insulating substrate of the one of which, It is characterized by being sequentially coated with a coated metal layer containing a metal, a coated ceramic layer containing a ceramic, and a coated resin layer containing a resin.

The wiring board of the present invention is made by an insulating substrate made includes an insulating layer made of ceramics and stacked, one outermost insulating substrate, said insulator layer on the insulator layer a wiring board comprising comprises a conductive layer having substantially the same thickness, the front surface boundary between the insulator layer and the conductor layer on the surface side of the wiring board in the outermost insulating substrate of the one of which, It is characterized by being sequentially coated with a coated ceramic layer containing ceramic, a coated metal layer containing metal, and a coated resin layer containing resin.

  Moreover, as for the wiring board of this invention, it is desirable that the thickness of the said coating resin layer is 10-100 micrometers.

  Moreover, as for the wiring board of this invention, it is desirable that the Young's modulus in 25 degreeC of the said coating resin layer is 3-10GPa.

The method for manufacturing a wiring board according to the present invention includes a plurality of insulating substrates each including an insulating layer made of ceramics, and one outermost insulating substrate is substantially the same as the insulating layer in the insulating layer. A method of manufacturing a wiring board comprising a conductor layer having the same thickness, wherein the one outermost insulating substrate forms a conductor layer molded body having substantially the same thickness as the insulator layer molded body. a composite molding manufacturing process formed by preparing a composite shaped body so as to penetrate the body, and sintering the composite shaped body, said conductive layer of said insulator layer substantially the same thickness, the insulator layer an insulating substrate fabricating step of fabricating the insulating substrate formed within the front surface boundary between the insulator layer and the conductor layer serving as the surface side of the wiring substrate, a coating resin layer containing a resin characterized in that it is produced by anda resin coating step of coating

A method of manufacturing a wiring board of the present invention, the composite molded product producing process, between the insulating substrate producing step, a laminating step of laminating said composite molding and other serial insulator layer molded article It is desirable to have it.

The method for manufacturing a wiring board according to the present invention includes a plurality of insulating substrates each including an insulating layer made of ceramics, and one outermost insulating substrate is substantially the same as the insulating layer in the insulating layer. a wiring substrate manufacturing method of comprising comprises a conductive layer of the same thickness, the one outermost insulating substrate is an insulator layer formed body and the conductor layer molded article of substantially the same thickness, the insulator layer the compact was formed so as to penetrate, the surface side of the wiring board wherein insulator layers molded body and the composite compact the front surface boundary is coated with the coating metal layer formed body and the conductor layer formed body a composite molded body preparing step of preparing a, and sintering the composite compact, the insulator layer and the conductive layer having substantially the same thickness, are <br/> formed on said insulator layer, said wiring board an insulating base surface boundary is coated with the coating metal layer on the surface side and the conductor layer serving as said insulator layer An insulating substrate fabricating step of fabricating the, the coating metal layer, characterized in that it is produced by comprising: a resin coating step of coating a coating resin layer containing a resin.

A method of manufacturing a wiring board of the present invention, comprises the composite molded body manufacturing process, between the insulating substrate producing step, a laminating step of laminating said composite molding and another insulating layer moldings It is desirable to do.

The method for manufacturing a wiring board according to the present invention includes a plurality of insulating substrates each including an insulating layer made of ceramics, and one outermost insulating substrate is substantially the same as the insulating layer in the insulating layer. a wiring substrate manufacturing method of comprising comprises a conductive layer of the same thickness, the one outermost insulating substrate is an insulator layer formed body and the conductor layer molded article of substantially the same thickness, the insulator layer the compact was formed so as to penetrate, the surface side of the wiring board wherein insulator layers molded body and the composite compact the front surface boundary is coated with coated ceramic layer molded body with the conductor layers formed body a composite molded body preparing step of preparing a, and sintering the composite shaped body, said conductive layer of said insulator layer substantially the same thickness is formed on the insulating layer, and a surface side of the wiring substrate the surface boundary of the conductive layer and the insulating layer is covered with a covering ceramic layer comprising An insulating substrate fabricating step of fabricating the insulating substrate, the coated ceramic layer, characterized in that it is produced by comprising: a resin coating step of coating a coating resin layer containing a resin.

A method of manufacturing a wiring board of the present invention, comprises the composite molded body manufacturing process, between the insulating substrate producing step, a laminating step of laminating said composite molding and another insulating layer moldings It is desirable to do.

The method for manufacturing a wiring board according to the present invention comprises an insulating substrate comprising an insulating layer made of ceramics.
A method of manufacturing a wiring board, wherein one outermost insulating substrate includes a conductor layer having substantially the same thickness as the insulator layer in the insulator layer. outermost insulating substrate, an insulating layer formed body and the conductor layer formed body having substantially the same thickness, is formed so as to penetrate the insulator layer molded body, the insulator layer composed of a surface side of the wiring substrate the front surface boundary portion between the molded body and the conductive layer molded body successively in the coating metal layer formed body and the covering ceramic layer molded body, the composite molding manufacturing step of manufacturing a composite molded body covering, the composite firing the shaped body, wherein the conductor layer of the insulating layer having substantially the same thickness, the formed in the insulator layer, the conductor layer serving as the surface side of the wiring board and said insulator layer surface boundary portion and the coating metal layer sequentially in the coated ceramic layer, an insulating substrate to produce a covered insulated substrate work A step, the coated ceramic layer, characterized in that it is produced by comprising: a resin coating step of coating a coating resin layer containing a resin.

A method of manufacturing a wiring board of the present invention, comprises the composite molded body manufacturing process, between the insulating substrate producing step, a laminating step of laminating said composite molding and another insulating layer moldings It is desirable to do.

The method for manufacturing a wiring board according to the present invention includes a plurality of insulating substrates each including an insulating layer made of ceramics, and one outermost insulating substrate is substantially the same as the insulating layer in the insulating layer. a wiring substrate manufacturing method of comprising comprising a conductor layer having the same thickness, the one outermost insulating substrate is an insulator layer formed body and the conductor layer molded article of substantially the same thickness, the insulator layer formed so as to pass through the molded body, the front surface boundary of the the surface of the wiring substrate and the insulating layer molded body and the conductive layer molded article coated ceramic layer molded body and the coating metal layer formed body sequentially between the composite compact preparation step of producing a composite molded article coated by baking the composite compact, the conductive layer of the insulator layer substantially the same thickness, the insulating layer is formed, the surface boundary between the insulator layer and the conductor layer serving as the surface side of the wiring substrate Includes but sequentially in the coated ceramic layer and the coating metal layer, an insulating substrate fabricating step of fabricating a covered insulated substrate, said coating metal layer, a resin coating step of coating a coating resin layer containing a resin, a It is produced by this.

In addition, the method for manufacturing a wiring board of the present invention includes a laminating step of laminating the composite molded body and another insulator layer molded body between the pre- composite molded body manufacturing process and the pre- insulating substrate manufacturing process. It is desirable to do.

Wiring board of the invention will be an insulating substrate made includes an insulating layer made of ceramics and stacked, one outermost insulating substrate, substantially the same as the insulator layer on the insulator layer a wiring board comprising comprising a conductor layer having a thickness, the front surface boundary between the insulator layer and the conductor layer on the surface side of the wiring board in the outermost insulating substrate of the one of which, the resin It is characterized by being covered with the containing coating resin layer.

Such, one outermost insulating substrate, wherein the wiring substrate made comprising a conductor layer of the insulating layer having substantially the same thickness in the insulator layer, the surface side of the wiring board insulation layer and the conductive It is important to cover the surface boundary with the body layer. As a result, even if a crack occurs at the interface between the insulator layer and the conductor layer due to the thermal history during operation of the power element, the crack can be prevented by providing a resin layer with a low Young's modulus on the substrate surface where stress is concentrated. Since the progress can be avoided and the atmosphere can be shut off, a conduction failure due to the progress of the corrosion of the conductor layer can be avoided, and the reliability of the wiring board is improved.

Front surface boundary between the insulator layer and the conductor layer on the surface side of the wiring board in the outermost insulating substrate of the one is, and the coating metal layer containing a metal, and a coating resin layer containing a resin It is characterized by being sequentially coated with.

  In this way, by forming a coated metal layer containing metal at the interface between the insulator layer and the conductor layer, a metal layer having a low Young's modulus with respect to deformation exists, and at the same time, a stress concentration site is covered. Thus, stress concentration at the part where different materials contact on the substrate surface can be avoided, so that cracking of the substrate can be avoided. Furthermore, it is important to provide a coating resin layer so as to cover the coating metal layer. This is to avoid solder flow when joining electronic components such as power elements mounted on the substrate surface. In addition, by providing a resin layer with a low Young's modulus on the substrate surface where stress is concentrated, the progress of cracks can be avoided and the atmosphere can be shut off. The reliability of the substrate is improved.

Front surface boundary between the insulator layer and the conductor layer on the surface side of the wiring board in the outermost insulating substrate of the one is, and the coated ceramic layer containing ceramic, and the coating resin layer containing a resin It is characterized by being sequentially coated with.

  Thereby, the intensity | strength of the interface of the insulator layer and conductor layer which stress concentrates can be raised, and higher reliability can be satisfied.

Front surface boundary between the insulator layer and the conductor layer on the surface side of the wiring board in the outermost insulating substrate of the one is, and the coating metal layer containing a metal, a coated ceramic layer containing ceramics , characterized in that it is successively coated with a coating resin layer containing a resin. Thereby, since the stress which generate | occur | produces in an insulator layer and a conductor layer is relieve | moderated with a covering metal layer, the intensity | strength of an interface part can be raised with a covering ceramic layer, A crack can be avoided.

Front surface boundary between the insulator layer and the conductor layer on the surface side of the wiring board in the outermost insulating substrate of the one is, and the coated ceramic layer containing ceramic, a coating metal layer containing a metal , characterized in that it is successively coated with a coating resin layer containing a resin. As a result, a structure in which the Young's modulus sequentially changes can be formed, so that the stress generated on the wiring board surface can be effectively relieved.

  Moreover, it is desirable that the thickness of the coating resin layer is 10 to 100 μm.

Thus, by setting the thickness of the coating resin layer to 10 μm or more, it is possible to avoid cracking of the resin layer and to suppress solder flow failure during component mounting. Further, when the thickness of the coating resin layer is 100 μm or less, printing failure of the solder paste due to the unevenness of the coating resin layer can be avoided, so that stable mountability can be obtained at the time of component mounting.

  In addition, it is important that the Young's modulus at 25 ° C. of the coating resin is 3 to 10 GPa. By setting the Young's modulus to 3 GPa or more, it is possible to reduce scratches and resin layer peeling that occur during the mounting process, and to avoid deterioration in reliability due to corrosion due to the atmosphere and contact between the insulator layer and the conductor layer interface. . On the other hand, by making it 10 GPa or less, the stress generated in the coating resin layer can be relaxed, and the cracking of the coating resin itself can be avoided.

Preparation of composite molded body in which said one outermost insulating substrate forms a conductor molded body having substantially the same thickness as that of the insulating layer molded body so as to penetrate through the insulating layer molded body. a step, by firing the composite compact, the insulator layer and the conductive layer having substantially the same thickness, and the insulating substrate fabricating step of fabricating the insulating substrate formed on said insulator layer, said wiring the front surface boundary of the insulating layer serving as a surface side of the substrate and the conductor layer, and a resin coating step of coating a coating resin layer containing a resin, in Rukoto be produced by having a boundary Even when cracks or gaps occur in the portion, corrosion of the conductor due to intrusion of moisture or foreign matter can be avoided, and reliability can be improved.
In addition, it is desirable to include a laminating step of laminating another insulator layer between the composite molded body producing step and the insulating substrate producing step, whereby the strength of the insulating substrate can be further increased. Reliability is improved. Further, by laminating other insulator layers, a three-dimensional circuit pattern can be formed and the substrate can be downsized.

Also, after forming the composite molded body, the surface boundary between the insulator layer molded body and the conductor layer molded body is coated with a metal layer molded body or a ceramic layer molded body, fired, and further coated with a coating resin layer By doing so, it is possible to avoid a decrease in reliability due to corrosion in addition to the generation of cracks.

  Needless to say, a laminate may also be formed in this embodiment.

  The wiring board according to the present invention includes, for example, a conductor layer having substantially the same thickness as the insulator layers 1a and 1b as shown in FIGS. 1 (a), (b), (c), FIGS. 2 (d) and (e). 3a, 3b, and other insulating layers 6a, 6b, 6c are laminated and integrated, and a wiring circuit is formed inside and on the surface of the wiring board 8, and the outermost layer of the wiring board 8 The insulator layer 1a and the conductor layer 3a are formed. The conductor layer 3a has substantially the same thickness as the insulator layer 1a, and has a function of flowing a current in a direction passing through the insulator layer 1a and in a surface direction of the conductor layer 1a.

  In the wiring board having such a configuration, since the large current circuit is arranged in a double row, the inductance can be reduced, and the response of the signal is improved.

  Then, as shown in FIG. 1A, the surface boundary portion on the surface side of the interface between the insulator layer 1a and the conductor layer 3a formed on the outermost layer of the wiring substrate 8 is covered with the coating resin layer 7. It is important that Thus, even if a gap occurs at the contact interface between the insulator layer 1a and the conductor layer 3a by covering the surface boundary portion with the coating resin layer 7, the coating resin having a low Young's modulus on the outermost surface of the interface portion The presence of the layer 7 can cover the gap, block the entry of moisture and foreign matter from the outside, and avoid the corrosion of the conductor and the accompanying deterioration of the conductor resistance.

  In the case of FIG. 1B, the interface between the insulator layer 1 a and the conductor layer 3 a on the surface of the wiring board is covered with the covering metal layer 4, and the covering resin layer 7 is further covered with the covering metal layer 4. It is covered with. As a result, the stress caused by the difference in thermal expansion occurring at the interface between the insulator layer 1a and the conductor layer 3a can be relieved with the heat generated when the power element is operated, and the crack at the interface can be avoided more effectively. it can.

  In the case of FIG. 1C, the interface between the insulator layer 1 a and the conductor layer 3 a on the surface of the wiring board is covered with the covering ceramic layer 5, and the covering resin layer 7 is further covered with the covering ceramic layer 5. It is covered with. As a result, the strength of the interface portion can be increased against the stress caused by the difference in thermal expansion occurring at the interface between the insulator layer 1a and the conductor layer 3a due to the heat generated when the power element is operated, so that cracking is avoided. it can.

  In the case of FIG. 2 (d), the interface between the insulator layer 1 a and the conductor layer 3 a on the surface of the wiring board is covered with the covering metal layer 4, and the covering ceramic layer 5 is further covered so as to cover the covering metal layer 4. Further, a coating resin layer 7 is formed so as to cover the coating ceramic layer 5.

Further, the interface between the insulating layer 1a and the conductive layer 3a of the wiring board surface is covered with a covering ceramic layer 5 in the case of FIG. 2 (e), the further the covering metal layer so as to cover the coated ceramic layer 5 4 and a coating resin layer 7 is formed so as to cover the coating metal layer 4. Thus, by forming a double coating layer of metal and ceramics at the stress-concentrating interface, stress relaxation and strength can be ensured, and cracking of the wiring board 8 can be avoided.

  It is important that the thickness of the coating resin layer 7 is 10 to 100 μm, and more preferably 25 to 50 μm.

  As described above, by setting the thickness of the coating resin layer 7 to 10 μm or more, it is possible to avoid cracking of the coating resin layer 7 and to suppress a solder flow failure during component mounting. Furthermore, by setting the thickness of the coating resin layer 7 to 10 μm or more, it is possible to avoid the coating resin layer 7 from being scraped in the resin layer formation such as screen printing, and the solder flow prevention layer can be suitably formed. Further, by setting the thickness of the coating resin layer 7 to 100 μm or less, the solder paste thickness can be uniformly formed in the component mounting process on the wiring board 8.

  This is because if the coating resin layer 7 is made too thick, the solder paste cannot be made uniform due to the unevenness of the surface of the wiring board 8 caused by the excessive thickness of the coating resin layer 7. Deteriorates significantly. In addition, mounting components are not easily mounted.

  In addition, it is important that the Young's modulus at 25 ° C. of the coating resin is 3 to 10 GPa, and it is more preferable that the resin is 4 to 7 GPa.

  Thereby, the crack and scratch which generate | occur | produce in the coating resin layer 7 are avoidable. By using a resin with a Young's modulus of 3 GPa or more, it is possible to reduce scratches and peeling of the resin layer that occur during the mounting process, and to suppress corrosion due to the interface between the insulator layer 1a and the conductor layer 3a coming into contact with the atmosphere, Reduced reliability can be avoided. On the other hand, by setting the pressure to 10 GPa or less, it is possible to avoid the cracking of the coating resin layer 7 itself located on the outermost surface of the wiring substrate 8 against the stress generated in the coating resin layer 7. Thereby, the corrosion by the interface of the insulator layer 1a and the conductor layer 3a coming into contact with the atmosphere can be suppressed, and the decrease in reliability can be avoided.

  Next, the manufacturing method of the wiring board 8 of this invention is demonstrated.

  First, for example, as shown in FIG. 3A, the insulating layer molded body 10 is disposed on the upper surface of a mold 39 having punched holes 37.

  Next, as shown in FIG. 3B, the conductor layer molded body 13 having the same thickness as the insulating layer molded body 10 is stacked on the insulating layer molded body 10.

  Next, as shown in FIG. 3 (c), the conductor layer molded body 13 is inserted into the insulating layer molded body 10 with a pressing die 35.

  Next, unnecessary portions of the conductor layer molded body 13 and the insulating layer molded body 10 are removed, so that a portion of the insulating layer molded body 10 as shown in FIG. It is possible to form a composite molded body 9 in which is formed.

  The wiring board 8 of the present invention is manufactured using the composite molded body 9 thus manufactured.

  The composite molded body 9 shown in FIG. 4 (a) is laminated with another composite molded body 9 or another molded body as necessary, and after firing, the interface between the insulator layer 1a and the conductor layer 3a. By forming the coating resin layer 7 so as to cover the wiring board 8, a wiring substrate 8 as shown in FIG.

  Moreover, the composite molded body 9 shown in FIG. 4B is obtained by forming a coated metal layer molded body 14 so as to cover the exposed interface between the insulating layer molded body 10 and the conductor layer molded body 13. After firing, a coating resin layer 7 is formed so as to cover the coating metal layer 4, whereby a wiring substrate as shown in FIG. 1B is obtained.

  Also, the composite molded body 9 shown in FIG. 4C is obtained by forming a coated ceramic layer molded body 15 so as to cover the exposed interface between the insulating layer molded body 10 and the conductor layer molded body 13. After the firing, the coating resin layer 7 is formed so as to cover the coating ceramic layer 5, whereby a wiring substrate as shown in FIG. 1C is obtained.

  Also, the composite molded body 9 shown in FIG. 4 (d) forms the coated metal layer molded body 14 and the coated ceramic layer so as to cover the exposed interface between the insulating layer molded body 10 and the conductor layer molded body 13. The body 15 is formed in sequence, and after firing, a coating metal layer 4 formed so as to cover the interface between the insulator layer 1a and the conductor layer 3a, and a coating resin so as to cover the coating ceramic layer 5 By forming the layer 7, a wiring substrate as shown in FIG.

  Also, the composite molded body 9 shown in FIG. 4 (e) forms the coated ceramic layer molded body 15 and the coated metal layer molding so as to cover the exposed interface between the insulating layer molded body 10 and the conductor layer molded body 13. The body 14 is formed in sequence, and after firing, a coating ceramic layer 5 formed so as to cover the interface between the insulator layer 1a and the conductor layer 3a, and a coating resin so as to cover the coating metal layer 4 By forming the layer 7, a wiring substrate as shown in FIG.

  In any case, a multilayer wiring board 8 can be produced by laminating with another composite molded body 9 or another molded body 6 before the firing step described above.

  As a result, a large current circuit can be three-dimensionally arranged on the wiring board 8, so that the wiring board 8 can be further miniaturized and the volume of the conductor layer 3 mainly composed of metal is increased. Since heat generated from the element can be effectively transmitted, malfunction of the element can be avoided.

  In forming the coating resin layer 7, the coating resin layer 7 is formed by screen printing, and the coating resin layer 7 formed on the surface of the wiring substrate 8 is cured by heat or light, so that the coating resin having a desired shape is formed. Layer 7 can be formed.

  In addition, the formation of the conductor layer 3 is not limited to the above method. For example, after laminating a ceramic green sheet having through holes of a predetermined shape and a ceramic green sheet on which a VIA conductor and a wiring layer are formed, a conductor paste Can also be produced by filling and drying using a screen printing method or a dispenser.

  In addition, by covering the paste for forming the coated metal layer 4 and the coated ceramic layer 5 by screen printing or the like, a fine gap at the interface between the insulator layer 1 and the conductor layer 3 can be filled. The densification of the can be achieved more reliably. For example, the coated metal layer 4 and the coated ceramic layer 5 are formed so as to cover the interface between the insulator layer 1a and the conductor layer 3a existing on the surface of the composite laminate with respect to the composite laminate produced in the same manner as the above method. The resulting paste is produced by a screen printing method, and the coated metal layer molded body 14 and the coated ceramic layer molded body 15 are formed. In addition, the smoothness of the wiring board 8 can be improved by pressurization thereafter. Next, the composite laminate on which the coated metal layer molded body 14 and the coated ceramic layer molded body 15 are formed is sintered in a wet non-oxidizing atmosphere, and the coated metal layer 4 and the coated layer are coated in the same manner as described above. A coating resin layer 7 is formed so as to cover the ceramic layer 5.

  In particular, when the coated ceramic layer 5 is provided, the coated ceramic layer has high strength against thermal stress during firing cooling in the firing step for producing a composite sintered body before forming the coated resin layer 7. The presence of 5 can suppress cracking of the composite sintered member. It is preferable to form the coated ceramic layer formed body 15 by screen printing or the like so as to cover the coated metal layer formed body 14 further on the composite laminate formed with the coated metal layer formed body 14.

(Insulator layer fabrication)
After adding and mixing 5% by mass of MnO ₂ , 3% by mass of SiO ₂ and 0.5% by mass of MgO with respect to the aluminum oxide powder (average particle size 1.8 μm), an organic resin for molding is further added. As a slurry, 10% by mass of an acrylic resin and toluene as a solvent were added and mixed by a ball mill for 24 hours to prepare a slurry. Using this slurry, a ceramic green sheet, which is the insulating layer molded body 10 having a length of 300 mm, a width of 300 mm, and a thickness of 230 μm, was produced by a doctor blade method.

  In addition, this insulating layer molded body 10 includes 50% by volume of copper powder having an average particle diameter of 3 μm, 50% by volume of tungsten powder having an average particle diameter of 2 μm, 4% by mass of an acrylic binder as an organic resin for printing, plastic A metal paste in which dibutyl phthalate is mixed at a ratio of 10% by mass is prepared as an agent, and is printed on the surface of the sheet in a predetermined pattern by screen printing. Further, a through hole having a diameter of 120 μm was formed in the sheet by a micro drill, and the metal paste was filled in the through hole to form a VIA.

(Conductor layer preparation)
On the other hand, 50% by volume of copper powder having an average particle size of 3 μm, 50% by volume of tungsten powder having an average particle size of 2 μm, 2% by mass of an acrylic resin as an organic resin for molding, and toluene as a solvent were added. A slurry was prepared by mixing for a period of time. Using this slurry, a metal sheet as the conductor layer molded body 13 having a length of 300 mm, a width of 300 mm, and a thickness of 230 μm was prepared by a doctor blade method.

(Creating metal coating)
The coating metal layer is 5% by mass of aluminum oxide powder (average particle size 1.8 μm) with respect to the Mo (average particle size 1.8 μm) powder, and the acrylic resin and cellulose resin 1.8% by mass as the organic resin for molding. Acetone was added to as a solvent and mixed for 24 hours by a ball mill to prepare a slurry, and then the solvent was volatilized to prepare a paste.

(Preparation of coated ceramic layer)
As the covering ceramic layer, it is desirable to use the same material as the insulating layer molded body 10, and 5% by mass of MnO ₂ , 3% by mass of SiO ₂ , MgO with respect to the aluminum oxide powder (average particle size 1.8 μm). Was added and mixed at a ratio of 0.5% by mass, and 3% by mass of acrylic resin as an organic resin for molding and acetone as a solvent were added and mixed for 24 hours with a ball mill to prepare a slurry. The paste was made to evaporate.

(Production of wiring board)
Next, a through hole having a size of 10 mm in length and 30 mm in width was formed in the central portion of the insulating layer molded body 10 by a punching apparatus as shown in FIG.

  Next, after the conductor layer molded body 13 is laminated on the insulating layer molded body 10 in which the through holes are formed, the pressing die 35 in the punching apparatus is lowered, and the lower surface of the pressing mold 35 is the insulating layer molded body 10. It was lowered to the same plane as the surface.

  As a result of raising the pressing die 35 and confirming the insulating layer molded body 10, the composite molded body 9 having a structure in which the conductor layer molded body 13 was embedded in the through hole portion of the insulating layer molded body 10 was formed. Thereafter, a paste was applied by printing to the joint interface portion between the insulating layer molded body 10 and the conductor layer molded body 13 to produce a composite molded body 9 having the coated metal layer molded body 14 and the coated ceramic layer molded body 15.

  Moreover, the composite molded body 9 without the coated metal layer molded body 14 and the coated ceramic layer molded body 15 was also produced at the same time.

  Thus, a composite molded body 9 as shown in FIGS. 4A to 4E was produced.

  Next, the composite molded body 9a manufactured as described above, and the composite molded body 9b in which the conductor layer 3 is embedded in the through hole manufactured in the same manner are stacked, and combined with the conductor layer. Sheets 6a, 6b, and 6c of other molded articles on which no ordinary wiring pattern was formed were laminated using an adhesion liquid to produce a laminate as shown in FIG. 1 (a). . Moreover, in laminating, while heating to a temperature of 60 degrees with respect to the laminated body, after applying a pressure of 5 MPa and performing temporary lamination, while heating to a temperature of 60 degrees with a hydrostatic press, A pressure of 9 MPa was applied for lamination.

  The obtained laminated body was baked at 1350 ° C. for 1 hour to produce a wiring board 8.

(Formation of coating resin layer)
Covering with the coating resin layer 7 having the thickness and Young's modulus shown in Table 1 so as to cover the surface boundary between the conductor layer 3 and the insulator layer 1 of the wiring board 8 or the coating metal layer 4 and the coating ceramic layer 5, Thermal curing was performed at 150 ° C. for 2 hours, and a wiring board 8 provided with the coating resin layer 7 was produced.

  Further, as a comparative example, a wiring board without the coating resin layer 7 was also produced.

The prepared sample was put into a temperature cycle reliability of −40 to 150 ° C., and the surface of the wiring board after 1000 cycles and the conductor resistance were measured. Further, cracks on the surface of the wiring board were judged by the presence or absence of color after the wiring board after reliability was immersed in a fluorescent flaw detection liquid and washed.

  Furthermore, a solder paste was printed on the wiring board by screen printing, and the blur after printing was confirmed with a binocular microscope with 4 magnifications.

The criterion for corrosion was that a sample having a resistance change rate of 5% or more of a conductor layer having substantially the same thickness as the insulator layer made of ceramic was judged as a corrosion-generated product.

  Sample No. in which the coating resin layer which is outside the scope of the present invention is not formed. In No. 1, cracks at the interface were confirmed in all samples, and metal corrosion was observed at the interface.

  In addition, Sample No. in which the coating resin layer outside the scope of the present invention was not formed. In Nos. 17 and 19, although cracks and corrosion at the interface portion are drastically reduced by the coated metal layer or the coated ceramic layer, the reliability is slightly lowered as compared with the sample of the present invention provided with the coated resin layer.

  On the other hand, sample no. In any of 2-16 and 18, no corrosion was observed.

  Below, the sample of this invention is demonstrated in detail.

  In the sample having a coating resin layer thickness of 10 μm or more, no occurrence of cracks on the substrate surface after reliability was observed.

  Sample No. with a coating resin layer thickness of 150 μm. In No. 8, in the printing of the solder paste used for mounting, it was not possible to print on a predetermined part, or a uniform coating thickness could not be ensured, and component mounting failure occurred.

  Further, when the Young's modulus of the resin was 1 GPa, peeling due to scratch occurred during the solder printing or mounting process.

It is sectional drawing for demonstrating the form of the wiring board in this invention. It is sectional drawing for demonstrating the form of the wiring board in this invention. It is sectional drawing for demonstrating the manufacturing method of the composite molded object in this invention. It is sectional drawing for demonstrating the form of the composite molded object in this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Insulator layer 3 ... Conductor layer 4 ... Cover metal layer 5 ... Cover ceramic layer 6 ... Other insulator layers 7 ... Cover resin layer 8 ... Wiring board

Claims (17)

By stacking a plurality of insulating substrate made includes an insulating layer made of ceramics, one of the outermost of the insulating substrate is provided with a conductive layer of the insulator layer and substantially the same thickness on the insulator layer A wiring board comprising:
Front surface boundary between the insulator layer and the conductor layer on the surface side of the wiring board in the outermost insulating substrate of the one, characterized in that it is coated with a coating resin layer containing a resin Wiring board. By stacking a plurality of insulating substrate made includes an insulating layer made of ceramics, one of the outermost of the insulating substrate is provided with a conductive layer of the insulator layer and substantially the same thickness on the insulator layer A wiring board comprising:
Front surface boundary between the insulator layer and the conductor layer on the surface side of the wiring board in the outermost insulating substrate of the one is, and the coating metal layer containing a metal, and a coating resin layer containing a resin A wiring board characterized by being sequentially coated with . By stacking a plurality of insulating substrate made includes an insulating layer made of ceramics, one of the outermost of the insulating substrate is provided with a conductive layer of the insulator layer and substantially the same thickness on the insulator layer A wiring board comprising:
Front surface boundary between the insulator layer and the conductor layer on the surface side of the wiring board in the outermost insulating substrate of the one is, and the coated ceramic layer containing ceramic, and the coating resin layer containing a resin A wiring board characterized by being sequentially coated with . By stacking a plurality of insulating substrate made includes an insulating layer made of ceramics, one of the outermost of the insulating substrate is provided with a conductive layer of the insulator layer and substantially the same thickness on the insulator layer A wiring board comprising:
Front surface boundary between the insulator layer and the conductor layer on the surface side of the wiring board in the outermost insulating substrate of the one is, and the coating metal layer containing a metal, a coated ceramic layer containing ceramics A wiring board which is sequentially coated with a coating resin layer containing a resin. By stacking a plurality of insulating substrate made includes an insulating layer made of ceramics, one of the outermost of the insulating substrate is provided with a conductive layer of the insulator layer and substantially the same thickness on the insulator layer A wiring board comprising:
Front surface boundary between the insulator layer and the conductor layer on the surface side of the wiring board in the outermost insulating substrate of the one is, and the coated ceramic layer containing ceramic, a coating metal layer containing a metal A wiring board which is sequentially coated with a coating resin layer containing a resin.   6. The wiring board according to claim 1, wherein the coating resin layer has a thickness of 10 to 100 [mu] m.   The wiring board according to claim 1, wherein the coating resin layer has a Young's modulus at 25 ° C. of 3 to 10 GPa. A plurality of insulating substrates each including an insulating layer made of ceramics are stacked, and one outermost insulating substrate includes a conductive layer having substantially the same thickness as the insulating layer in the insulating layer. A method for manufacturing a wiring board, comprising:
Preparation of composite molded body in which said one outermost insulating substrate forms a conductor molded body having substantially the same thickness as that of the insulating layer molded body so as to penetrate through the insulating layer molded body. a step, by firing the composite compact, the insulator layer and the conductive layer having substantially the same thickness, and the insulating substrate fabricating step of fabricating the insulating substrate formed on said insulator layer, said wiring the front surface boundary of the insulating layer serving as a surface side of the substrate and the conductor layer, and characterized by being manufactured by comprising the resin coating step of coating a coating resin layer containing a resin, a A method of manufacturing a wiring board. The composite molded body manufacturing process according to claim 8, wherein between the insulating substrate manufacturing process, characterized by comprising a laminating step of laminating said composite molding and other serial insulator layer molded article Wiring board manufacturing method. A plurality of insulating substrates each including an insulating layer made of ceramics are stacked, and one outermost insulating substrate includes a conductive layer having substantially the same thickness as the insulating layer in the insulating layer. A method for manufacturing a wiring board, comprising:
Wherein said one outermost insulating substrate is a conductive layer molded article of the insulating layer moldings substantially the same thickness, the formed so as to penetrate the insulator layer molded body, the surface side of the wiring substrate a composite molded body preparing step of preparing a composite shaped body the front surface boundary between the conductor layer formed body and the insulator layer molded article coated with a coating metal layer formed body, and sintering the composite compact, the insulator layer and the conductive layer having substantially the same thickness, the formed in the insulator layer, the conductor layer and the insulating layer and the surface boundary is coated metal layer serving as the surface side of the wiring substrate an insulating substrate fabricating step of fabricating the insulating substrate covered with, the coating metal layer is a resin coating step of coating a coating resin layer containing a resin, characterized by being produced by having a wire A method for manufacturing a substrate. The composite molded body manufacturing process, between the insulating substrate manufacturing process according to claim 10, characterized in that it comprises a laminating step of laminating said composite molding and another insulating layer moldings A method for manufacturing a wiring board. A plurality of insulating substrates each including an insulating layer made of ceramics are stacked, and one outermost insulating substrate includes a conductive layer having substantially the same thickness as the insulating layer in the insulating layer. A method for manufacturing a wiring board, comprising:
Wherein said one outermost insulating substrate is a conductive layer molded article of the insulating layer moldings substantially the same thickness, the formed so as to penetrate the insulator layer molded body, the surface side of the wiring substrate a composite molded body preparing step of preparing a composite shaped body the front surface boundary between the conductor layer formed body and the insulator layer molded article coated with a coated ceramic layer molded body, and sintering the composite compact, the insulator layer and the conductive layer having substantially the same thickness, the formed in the insulator layer, the conductor layer and the insulating layer and the surface boundary is coated ceramic layer of the surface side of the wiring substrate an insulating substrate fabricating step of fabricating the insulating substrate covered with, the coated ceramic layer and a resin coating step of coating a coating resin layer containing a resin, characterized by being produced by having a wire A method for manufacturing a substrate. The composite molded body manufacturing process, between the insulating substrate manufacturing process according to claim 12, characterized in that it comprises a laminating step of laminating said composite molding and another insulating layer moldings A method for manufacturing a wiring board. A plurality of insulating substrates each including an insulating layer made of ceramics are stacked, and one outermost insulating substrate includes a conductive layer having substantially the same thickness as the insulating layer in the insulating layer. A method for manufacturing a wiring board, comprising:
Wherein said one outermost insulating substrate is a conductive layer molded article of the insulating layer moldings substantially the same thickness, the formed so as to penetrate the insulator layer molded body, the surface side of the wiring substrate the front surface boundary between the conductor layer formed body and the insulator layer molded body successively in the coating metal layer formed body and the covering ceramic layer molded body, the composite molding manufacturing step of manufacturing a composite molded article coated , said composite shaped body was fired, the insulator layer and the conductive layer having substantially the same thickness, the formed in the insulator layer, wherein said conductor layer serving as the surface side of the wiring board insulator sequentially surface boundary between the layers in the coating metal layer and the coated ceramic layer, and the insulating substrate fabricating step of fabricating a covered insulated substrate, the coated ceramic layer, the resin is coated with a coating resin layer containing a resin-coated distribution characterized in that it is produced by comprising the step, Method of manufacturing a substrate. The composite molded body manufacturing process, between the insulating substrate manufacturing process according to claim 14, characterized in that it comprises a laminating step of laminating said composite molding and another insulating layer moldings A method for manufacturing a wiring board. A plurality of insulating substrates each including an insulating layer made of ceramics are stacked, and one outermost insulating substrate includes a conductive layer having substantially the same thickness as the insulating layer in the insulating layer. A method for manufacturing a wiring board, comprising:
Wherein said one outermost insulating substrate is a conductive layer molded article of the insulating layer moldings substantially the same thickness, the formed so as to penetrate the insulator layer molded body, the surface side of the wiring substrate the front surface boundary between the conductor layer formed body and the insulator layer molded body successively in the coated ceramic layer formed body and the coating metal layer molded article, a composite molded product producing step of producing a composite molded article coated , said composite shaped body was fired, the insulator layer and the conductive layer having substantially the same thickness, the formed in the insulator layer, wherein said conductor layer serving as the surface side of the wiring board insulator sequentially surface boundary between the layers in the coated ceramic layer and the coating metal layer, an insulating substrate fabricating step of fabricating a covered insulated substrate, said coating metal layer, a resin coated with a coating resin layer containing a resin-coated wiring board characterized by being manufactured by comprising the steps, the Manufacturing method. The lamination process which laminates | stacks the said composite molded object and another insulator layer molded object between the pre- composite molded object preparation process and the pre- insulation board | substrate preparation process is comprised, It comprises. A method for manufacturing a wiring board.

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