JP4543688B2 - Circuit board manufacturing method and manufacturing apparatus - Google Patents

Description

  The present invention relates to a circuit board manufacturing method and a manufacturing apparatus using a flexible film having a highly accurate circuit pattern and excellent in productivity.

  In the conventional peeling of the flexible film, the rigid substrate is generally a product, and the flexible film is generally a protective film. Therefore, there is no particular attention to the quality of the flexible film after peeling, and the main focus is on reliably peeling the flexible film. In addition, there are some applications where flexible products are peeled off from rigid substrates, but those that place importance on the efficiency of the peeling work and methods that bend the product to reduce the peeling force have been adopted. Yes. For this reason, there has been no idea of peeling while maintaining the flatness and dimensional accuracy of the flexible film (for example, peeling without causing strain of about several hundred μm).

  On the other hand, in recent years, it has been proposed to form a very fine circuit pattern by attaching a flexible film to a reinforcing plate and maintaining dimensional accuracy. Since the circuit pattern of the flexible film substrate is used after being peeled off from the reinforcing plate, it is desired to suppress the dimensional change of the circuit pattern when peeling from the reinforcing plate to the micron order. Therefore, it is required to peel the flexible film without applying stress as much as possible.

As a method of peeling the flexible film from the rigid substrate, a method of peeling the flexible film while fixing the rigid substrate has been proposed. Specifically, the end of the flexible film is gripped (for example, see Patent Document 1), an adhesive tape is pressed against the surface of the flexible film (for example, see Patent Document 2), or a rigid substrate is acceptable. To a method of peeling a flexible film by turning up the flexible film from the end (for example, refer to Patent Document 3) or a peeling roller while maintaining an obtuse angle at which the flexible film is formed. A method of transferring a flexible film and then scraping off the flexible film from a peeling roller with a scraper (see, for example, Patent Document 4) has been proposed. However, all of them are intended to peel off a flexible film, which is a protective film, from the product, and it has been solved to peel off a flexible film on which a fine circuit pattern is formed without impairing dimensional accuracy and flatness. There wasn't.
JP-A-5-319675 (2nd page) JP-A-7-315682 (page 3) JP 2002-104726 A (page 5) JP 7-215577 A (2nd page)

  The object of the present invention is to solve the problems of the prior art as described above, peel the flexible film with low stress without bending or distortion, and further suppress the dimensional change of the flexible film at the time of peeling. It is an object of the present invention to provide a circuit board manufacturing method and a manufacturing apparatus capable of performing the above.

That is, in the present invention, ( 1 ) after forming a circuit pattern on a surface opposite to a bonding surface of a flexible film bonded to a reinforcing plate via an organic layer that can be peeled, the flexible film is peeled off. A method for manufacturing a circuit board, wherein a curved support is rotated and moved relative to the reinforcement plate, and at least a part of the flexible film is placed along the curved support and the flexible plate. When the film is peeled off , the rotational peripheral speed V1 on the flexible film support surface of the support is set to be higher than the relative movement speed V2 of the support with respect to the reinforcing plate, and the flexible film is flexible when peeled off. A circuit board manufacturing method for controlling tension applied to a film .
( 2 ) A circuit board manufacturing apparatus that peels a flexible film from a flexible film substrate in which a flexible film on which a circuit pattern is formed is bonded to a reinforcing plate via an organic layer that can be peeled off. a holding means for holding the reinforcing plate, seen including a curved distancing means away from the reinforcing plate in contact with the support curved at least a portion of the flexible film, the bending distancing means rotates the support Rotation drive device, relative movement drive device for moving the support relative to the reinforcing plate holding means, and the rotational speed of the support and the relative movement speed of the support relative to the reinforcing plate holding means are independently controlled. A circuit board manufacturing apparatus having a speed control device .
(3) the rotation speed V1 is the than the relative moving speed V2, the two having a speed ratio control device for controlling so as to increase the tension control device for controlling the tension applied to the flexible film upon peeling A circuit board manufacturing apparatus according to claim 1.

  According to the present invention, while holding the reinforcing plate, the reinforcing plate and the flexible film are separated along the curved support, so that the flexible film has a low stress. It was possible to peel without distortion, and the dimensional change of the flexible film at the time of peeling could be made minute.

  Furthermore, since the speed of each part of the peeling unit and the tension acting on the flexible film are controlled so that the peeling angle is optimized, the peeling of the flexible film from the reinforcing plate It can be performed stably without damage to the circuit pattern.

  Further, according to the method for manufacturing a circuit board according to the present invention, since the circuit board is manufactured using the excellent peeling method described above, a high-quality circuit board can be manufactured.

  The present invention is a method in which when a reinforcing plate and a flexible film to be a circuit board are peeled, a part of the flexible film is peeled along a curved support.

  The preferable example of the peeling method and apparatus of the flexible film of this invention is demonstrated referring drawings.

  1 is a schematic front view of a peeling apparatus 1 of the present invention, FIG. 2 is a schematic front view showing another embodiment using the peeling apparatus 1, and FIG. 3 is another diagram of a support 12 that is an element of the peeling apparatus 1. It is a schematic front view which shows an embodiment. FIG. 9 is a schematic front view of a peeling unit 90 which is another embodiment of the peeling unit 10 used in the peeling apparatus 1.

  Further, FIG. 12 shows the upper limit of the peeling apparatus according to the present invention by monitoring the rotational peripheral speed of the flexible film support surface of the support 12, the relative movement speed of the support 12 with respect to the reinforcing plate 2 and the tension applied to the flexible film. FIG. 12 is a schematic front view of the peeling apparatus 200 for explaining a specific example of the setting means, and FIG.

  First, the peeling apparatus 1 described in FIG. 1 will be described. The peeling apparatus 1 described in FIG. 1 mainly has the following configuration. A flexible film substrate 6 bonded to a reinforcing plate 2 that is a glass substrate through an organic material layer 3 from which the flexible film 4 can be peeled, a mounting table A30 that holds the reinforcing plate 2, and the flexible film 4 are reinforced. It comprises a peeling unit 10 that actually peels from the plate 2 and a mounting table B32 on which the peeled flexible film 4 is placed.

  The mounting table A30 and the mounting table B32 are respectively mounted on the base 34 so as to freely move up and down, and can be moved up and down independently by a driving source (not shown). Further, suction holes are arranged on the upper surfaces of the mounting table A30 and the mounting table B32, respectively, and those mounted on the surface can be sucked and held independently by a vacuum source (not shown).

  Next, the peeling unit 10 includes a support body 12 having a holding portion 14 in contact with the flexible film 4 at the tip, a frame 18 that holds the support body 12 in a cantilevered manner via a shaft 16, and a frame 18. The rail 20 is freely guided in the horizontal direction on the base 34. The holding part 14 is not provided, and the flexible film may be peeled directly along the support 12, but the holding part 14 having a cushioning property and the holding part 14 provided with a recess for accommodating the height of the electronic component are provided. By adopting it, it becomes easier to suppress damage due to peeling. The shaft 16 is driven by a rotary drive device (not shown). The rotational speed of the rotary drive device can be set freely, and a slip ring is inserted between the shaft 16 and the rotary drive device so that the rotary drive device slips when a torque exceeding the set value is applied. The upper limit of the applied tension can be controlled. A suction hole is disposed on the surface of the holding portion 14. And the part which the flexible film 4 contacts can be adsorb | sucked with the vacuum source which is not shown in figure. The suction holes provided in the holding unit 14 are configured such that the portions where the holding unit 14 and the flexible film 4 are in contact are sequentially sucked. Moreover, the contact surface with the flexible film 4 is a curved surface so that the holding | maintenance part 14 can hold | maintain the flexible film 4 in a curve. Moreover, the flexible film 4 currently hold | maintained at the holding | maintenance part 14 can be peeled from the holding | maintenance part 14 by sending gas into the adsorption hole arrange | positioned on the surface of the holding | maintenance part 14 by the ventilation source which is not shown in figure.

  The material of the holding portion 14 is not particularly limited, but is preferably an elastic body such as plastic, rubber, or foamed plastic, and has cushioning properties. There are effects such as preventing the flexible film from being damaged, easily forming a recess corresponding to an electronic component, which will be described later, and preventing the flexible film from being broken by the edge of the recess. In addition, as the material of the holding portion 14, a material having a tack property such as a silicone resin accumulates the extension of the flexible film as the peeling progresses, and the amount of deviation between the holding portion 14 and the flexible film 4. Can be prevented from increasing, and therefore, an increase in the peeling angle with the progress of peeling can be suppressed, which is preferable. As a measure of tackiness, it is preferable that the peel strength in the direction of 180 ° is 9.8 N / m or less when the flexible film 4 is peeled from the holding portion 14.

The support 12 or the holding portion 14 in contact with the flexible film is preferably antistatic or conductive in order to suppress the charging potential of the flexible film due to peeling charging. When the charging potential is increased, a discharge may occur and the circuit pattern or electronic component may be damaged. Since the antistatic or conductive member is in contact with the surface opposite to the release surface of the flexible film, the potential can be lowered even if the charge generated on the release surface is the same. Can be prevented. As the antistatic material, a plastic, rubber, foamed plastic, or the like containing a conductive material and having a surface resistance of 10 ¹² Ω or less can be employed.

  The holding portion 14 is provided with a radius of curvature that takes into account the amount of deformation and the peelability allowed for the flexible film 4 on which the circuit pattern is formed. However, a different radius of curvature may be given partially. If the radius of curvature is too small, the metal circuit pattern undergoes plastic deformation and curls, or the effect of reducing the stress at the end of the electronic component becomes insufficient. On the other hand, if the radius of curvature is too large, the force in the direction of stretching the flexible film will be larger than the force used to peel the flexible film, resulting in the plastic pattern of the circuit pattern made of a metal film or the flexible film. Cause. Therefore, the lower limit value of the radius of curvature of at least a part of the holding portion 14 that contacts the flexible film 4 is preferably 20 mm or more, more preferably 30 mm or more, and even more preferably 50 mm or more. Moreover, as an upper limit of the magnitude | size of the one part curvature radius which contacts the flexible film 4 of the holding | maintenance part 14 at least, Preferably it is 1000 mm or less, More preferably, it is 800 mm or less, More preferably, it is 700 mm or less. In the present invention, the radius of curvature is the radius of a circle having the same curvature as the portion having the curvature.

  Further, the rotation of the support 12 and the horizontal movement of the frame 18 are independently performed by a drive motor (not shown), and the contact portion between the holding portion 14 and the flexible film 4 is in the horizontal direction (horizontal in the figure). It is controlled to move sequentially in the direction of the arrow). The rotational peripheral speed V1 on the flexible film holding surface of the support body 12, that is, the surface of the holding portion 14, is made larger than the relative movement speed V2 of the support body with respect to the reinforcing plate, and V1 is applied to the support body by a torque limiting mechanism. Control is performed within a range not lower than V2 so that the torque does not exceed a predetermined value. V1, V2 and torque can be controlled by mechanical, electronic, or a combination of both. As the mechanical torque control system, a system called a slip ring can be adopted, which is preferable in terms of simplicity. As described later, the electronic torque control method can be realized by a combination of a torque sensor and a servo motor, which is preferable in terms of high control accuracy and high control freedom. The initial setting values of V1 and V2 are preferably set so that V1 / V2 is 1.01 or more. The torque limit setting value is set in a range that is sufficient to prevent the peeling angle from increasing with the progress of peeling, and that the circuit pattern or flexible film made of metal does not cause plastic deformation. It should be selected appropriately depending on the material, width, and thickness of the flexible film.

  In one embodiment of the present invention, it is important that the range of the peeling angle 40 that is an angle formed by the flexible film 4 and the reinforcing plate 2 shown in FIG. 7 is 1 ° or more and 80 ° or less. If the peeling angle is too large, the flexible film may bend at the peeling point. If a circuit pattern made of metal is formed on the flexible film, the circuit pattern may be folded or deformed. There is. On the other hand, if the peel angle is too small, the force in the direction of stretching the flexible film will be larger than the force used to peel the flexible film, causing a circuit pattern made of a metal film or plastic deformation of the flexible film. become. Therefore, the range of the peeling angle 40 for peeling the flexible film from the flexible film substrate 6 with low stress without distortion is more preferably 2 ° or more and 70 ° or less, and most preferably 5 ° or more and 60 ° or less. It is.

  In this invention, peeling force is measured by 180 degree direction peel strength when peeling the 1-cm-wide flexible film bonded with the reinforcement board through the peelable organic substance layer. The peeling speed when measuring the peeling force is 300 mm / min. In the present invention, in order to control the above-described peeling angle within an optimum range, the peeling force is preferably in the range of 0.098 N / m to 98 N / m.

  Since the mounting table A30 can freely move up and down, when the flexible film 4 and the reinforcing plate 2 are peeled off, the mounting table A30 is moved up and down to a position where the flexible film 4 and the holding portion 14 come into contact with each other with a constant pressure. . On the other hand, the mounting table B32 is provided for mounting the flexible film 4 adsorbed on the holding unit 14 of the peeling unit 10 on the mounting table B32. That is, after the peeling is completed, the peeling unit 10 moves to the mounting table B32 as indicated by the broken line in FIG. 1 while adsorbing the flexible film 4. The mounting table B32 is moved up and down so that the distance between the holding unit 14 and the mounting table B32 is preferably 0.1 to 3 mm, more preferably 0.1 to 1 mm, and the suction is released, so that the flexible film 4 is removed. It releases from the holding | maintenance part 14, and it mounts on mounting base B32.

  Next, the peeling method of the flexible film 4 using the peeling apparatus 1 shown in FIG. 1 is demonstrated. After the mounting table A30 is lowered to the lowest point, the flexible film substrate 6 is placed on the lower side (that is, the flexible film 4 is on the upper side) by the transfer means (not shown) and placed on the mounting table A30. Place. Subsequently, a vacuum source (not shown) is operated to suck and hold the flexible film substrate 6 on the mounting table A30. Next, the frame 18 is moved and the support 12 is rotated so that the starting point S of the holding unit 14 of the peeling unit 10 is positioned directly above the right end of the flexible film 4 in the drawing. When the positioning of the holding unit 14 is completed, the mounting table A30 is raised, and the right end of the flexible film 4 and the starting point S of the holding unit 14 are brought into contact with each other with a predetermined pressure. The pressure is preferably 0.001 to 1 MPa, more preferably 0.01 to 0.2 MPa.

  Next, in that state, a vacuum source (not shown) is operated, and the holding unit 14 is adsorbed to the flexible film 4. Thereafter, the leftward movement of the frame 18 and the left rotation of the support 12 are advanced. The curved surface of the holding portion 14 is sequentially brought into contact with the upper surface of the flexible film 4 from the right side (FIG.). As a result, the flexible film 4 is sequentially bent from the right side, so that the flexible film 4 is separated from the reinforcing plate 2, and as a result, both are sequentially peeled from the right side. When the final point E of the holding portion 14 comes into contact with the left end of the flexible film 4 and passes through it, peeling is completed. When the peeling is completed, the movement of the frame 18 and the rotation of the support 12 are stopped, and the mounting table A30 is lowered so that the flexible film 4 and the reinforcing plate 2 are completely separated. These mechanisms correspond to the separating means in the present invention. In addition, other mechanisms may be used as long as the peel angle can be controlled to 80 ° or less.

  Thereafter, the support 12 is rotated clockwise until the central portion of the flexible film 4 adsorbed by the holding portion 14 is directly below. Then, the frame 18 is moved rightward so that the flexible film 4 held by the holding unit 14 is positioned so as to be directly above the mounting table B32. Subsequently, the mounting table B32 is raised so that the clearance between the upper surface of the mounting table B32 and the lowest point of the central portion of the flexible film 4 is 0.1 to 1 mm. When the clearance is set, the suction of the holding portion 14 is released, and the flexible film 4 is transferred to the mounting table B32. Next, the separated flexible film 4 and the reinforcing plate 2 on the mounting table A30 are each transferred to the next step by a transfer device (not shown). The reinforcing plate 2 is transferred after releasing the suction. Subsequently, the peeling unit 10 is returned to the original position, and thereafter the same operation is repeated to peel the next flexible film substrate 6.

  In the peeling apparatus shown in FIG. 2A, a holding member 22 that holds the end of the flexible film 4 in a hook shape is fixed to one end of the support 12 of the peeling apparatus 1 in FIG. The material of the holding member 22 is not particularly limited. For example, metal, resin, ceramics, or the like can be used, but the main body is made of metal and the contact portion with the flexible film 4 is soft such as rubber or resin, and A composite structure that is difficult to slip is preferably used.

  The peeling method using the peeling apparatus shown in FIG. 2 (a) is as follows.

  The mounting table A30 is lowered to the lowest point, and then the frame 18 is moved to the right so that the holding unit 14 does not come directly above the mounting table A30. In this state, the flexible film substrate 6 is mounted on the mounting table A30 with the reinforcing plate 2 on the lower side (the flexible film 4 is on the upper side) by transfer means (not shown). Subsequently, a vacuum source (not shown) is operated to suck and hold the flexible film substrate 6 on the mounting table A30.

  Next, the mounting table A <b> 30 is raised so that the hook-shaped portion of the holding member 22 comes to a position where it fits in the right end portion of the flexible film 4. Then, the frame 18 is moved to the left side, and the right end portion of the flexible film 4 is fitted into the hook-shaped portion of the holding member 22 as shown in FIG. The right end of the film 4 can be held. The clearance in the thickness direction between the hook portion of the holding member 22 and the right end portion of the flexible film 4 at this time is preferably 0.1 to 5 mm, more preferably 0.5 to 1.5 mm.

  In order to hold the end of the flexible film 4 with the holding member 22, the end of the flexible film 4 may protrude from the reinforcing plate 2. Further, as shown in FIG. 2B, the flexible film substrate 6 in which the lead film 23 is bonded to the end of the flexible film 4 by another method is placed on the placing table A30, and the lead film 23 is obtained. These ends may be held by the holding member 22.

  Next, in this state, the leftward movement of the frame 18 and the left rotation of the support 12 are performed in synchronization with each other, and the curved surface of the holding portion 14 is sequentially brought into contact with the upper surface of the flexible film 4 from the right side (FIG.). As a result, while the flexible film 4 is curved, the right end thereof is sequentially lifted upward and is pulled away from the reinforcing plate 2 that is sucked and held, so that both are peeled sequentially from the right side. When the final point E of the holding portion 14 comes into contact with the left end of the flexible film 4 and passes through it, peeling is completed. When the peeling is completed, the movement of the frame 18 and the rotation of the support 12 are stopped, and the mounting table A30 is lowered so that the flexible film 4 and the reinforcing plate 2 are completely separated.

  Thereafter, the frame 18 is moved to the right and positioned so that the end of the flexible film that is not held by the holding member 22 is aligned with the end of the mounting table B32. In this state, the movement of the frame 18 in the right direction and the right rotation of the support 12 are performed in synchronization, and the flexible film 4 is transferred to the mounting table B32.

  Next, the holding of the holding member 22 is released, and the frame 18 is further moved to the right side so that the right end portion of the flexible film 4 is detached from the hook-shaped portion of the holding member 22, and the flexible film 4 is mounted. Completely transferred to the table B32. When the transfer is completed, the mounting table B32 is lowered to the lowest point. Then, the separated flexible film 4 and the reinforcing plate 2 are transferred to the next step by a transfer device (not shown). Subsequently, the peeling unit 10 is returned to the original position, and thereafter the same operation is repeated to peel the next flexible film substrate 6.

  When the electronic component 5 such as an IC chip is mounted on the flexible film 4, the holding portion 14 of the support 12 has a recess 36 corresponding to the electronic component 5 as shown in FIG. It is preferable to be provided. The size of the recess 36 may be changed by providing an adapter. As an example of the size of the recess corresponding to the IC chip, as shown in FIG. 4, the depth is 0.5 to 2 mm, and the length and width are 1 to 20 mm. Further, the shape of the concave portion may be a groove shape in which a plurality of IC chips can be accommodated, and the direction of the groove may be parallel to the curvature direction of the holding portion 14 as shown in FIG. As shown in FIG. 4, the holding portion 14 may be perpendicular to the curvature direction. Further, a suction hole may be provided in the bottom surface 74 of the recess 36, and the bottom surface 74 and the electronic component may be in contact with each other so that the electronic component 5 can also be fixed to the holding portion 14 by suction. Furthermore, the holding part 14 can be made of a flexible material having micropores that can be vacuum-sucked, and the electronic component 5 can be embedded in the material and fixed by suction.

  In the present invention, when a circuit pattern made of metal is provided on the flexible film 4, the circuit pattern is deformed by a force when it is peeled off, and the flexible film 4 is warped or the circuit pattern dimension is changed. The accuracy is prevented from decreasing, and further, when an electronic component such as an IC chip is mounted on a circuit board made of a flexible film, the force for peeling the electronic component mounting portion increases and the end of the electronic component Since the force is concentrated on the circuit board and the circuit board may be deformed, by implementing the present invention, reliability with respect to deformation, warpage, dimensional accuracy and the like can be achieved. Even when an electronic component such as an IC chip is resin-sealed, it is preferable because stress applied to the end of the electronic component at the time of peeling is relieved and the reliability of the circuit board is improved.

  The holding method of the flexible film substrate 6 by the mounting table A30 is not particularly limited, and may be electrostatic adsorption in addition to the vacuum adsorption shown in the above embodiment. In order to be able to perform electrostatic adsorption, it is desirable that the mounting table A30 be conductive and have a structure to which a ground potential or an arbitrary voltage can be applied depending on the method of applying static electricity. Moreover, in order to reduce the peeling force of the peelable organic substance layer 3, it is preferable that the mounting base A30 is provided with a heating device inside or above. For the same purpose, it is preferable that a heating device is provided to the support 12 or the holding unit 14. In order to sufficiently reduce the peeling force, it is preferable that the heating temperature is high. However, if the heating temperature is too high, the organic layer is denatured and it is difficult to remove the organic layer remaining on the flexible film 4 after peeling. Therefore, the heating temperature of the peelable organic layer 3 is preferably 30 ° C. or higher and 280 ° C. or lower.

  Next, a peeling apparatus 200 which is an embodiment of the present invention will be described with reference to FIGS. In the peeling apparatus 200, instead of a slip ring, the peeling unit 10 of the peeling apparatus 1 is replaced with a rotational peripheral speed of the flexible film support surface of the support body 12, a relative moving speed of the support body 12 with respect to the reinforcing plate 2, and flexibility. An electrical control means for monitoring the tension applied to the film and setting an upper limit is added to the peeling unit 220. More specifically, the peeling apparatus 200 gives the linear scale 202 that measures the relative moving speed V2 of the frame 18 to the mounting table A30 (fixed), the encoder 204 that measures the rotational angular velocity of the support 12 and the support 12. An electromagnetic clutch 206 for controlling torque is added to the peeling device 1. Assuming that the length from the center of the shaft 16 until the holding portion 14 comes into contact with the flexible film 4 of the flexible film substrate 6 at the holding surface is R, the rotational angular velocity observed by the encoder 204 is multiplied by R. By combining them, the rotational peripheral speed V1 on the holding surface of the holding unit 14 is calculated. The holding part 14 holding surface has the same meaning as the flexible film supporting surface of the support 12. Further, the peeling device 200 uses the rotation peripheral speed V1 on the holding surface of the holding unit 14 derived from the measurement by the encoder 204 and the speed information of the relative movement speed V2 of the frame 18 measured by the linear scale 202, A control device 212 that can control the speed of the rotary motor 210 that rotates the support 12 via the electromagnetic clutch 206 and the shaft 16 and the linear motor 208 that drives the frame 18 is also added to the peeling device 1. ing. Here, the control device 212 also has a function of controlling the driving torque of the support 12 by changing the supply voltage to the electromagnetic clutch 206. The rotary motor 210 and the electromagnetic clutch 206 are attached to the frame 18 via a support bracket 214.

  When the frame 18 moves at the relative movement speed V2, the support body 12 attached to the frame 18 also moves at the relative movement speed V2.

Now, in the peeling apparatus 200, when peeling the flexible film 4 of the flexible film board | substrate 6 from the reinforcement board 2, the peeling angle 40 shown by FIG. 7 is controllable.
That is, when the rotational peripheral speed V1 on the holding surface of the holding portion 14 is smaller than the relative moving speed V2 of the frame 18, the flexible film 4 is slackened and the position of the peeling point P in FIG. It becomes very unstable. At this time, as the magnitude of V1 / V2 is reduced, the peeling point P moves to the right side, and thus the magnitude of the peeling angle 40 is increased while exhibiting unstable behavior. On the other hand, when the rotational peripheral speed V1 on the holding surface of the holding portion 14 is larger than the relative movement speed V2 of the frame 18, tension is applied to the flexible film 4 from the support body 12. In this state of V1 / V2> 1, the tension acting on the flexible film 4 increases as the magnitude of V1 / V2 increases, and the peeling point P moves to the left in FIG. It becomes smaller gradually. Moreover, since there is no slack of the flexible film 4, the position of the peeling point P is also stabilized, and as a result, peeling is stabilized. Therefore, the peel angle 40 can be set to a desired value by adjusting the magnitude of V1 / V2 under the condition of V1 / V2> 1 where the peel is stabilized.

  However, if V1 / V2 becomes too large, the tension applied to the flexible film 4 becomes too large and the flexible film 4 is greatly deformed, and a precise circuit pattern formed on the flexible film 4 Dimensional shape may change or a circuit pattern may be damaged and become defective.

  In order to eliminate such an inconvenience, it is preferable to limit the tension acting on the flexible film 4 at the time of peeling to a size that does not cause a problem. In the peeling device 200, the voltage supplied to the electromagnetic clutch 206 can be adjusted so that the torque applied to the support 12 can be controlled to be equal to or less than a predetermined value. Since the flexible film 4 is held by the holding portion 14 of the support 12, the torque applied to the support 12 is converted into a tension acting on the flexible film. Therefore, if the torque applied to the support 12 is limited, the tension acting on the flexible film 4 can be limited. However, in this case, when the torque reaches the limit value, the rotation of the shaft 16 of the support 12 is in a state of sliding with respect to the rotation of the rotary motor 210, and the rotary motor 210 rotates at the rotational peripheral speed on the holding surface of the holding unit 14. Even if the operation is such that V1 becomes a predetermined value, the actual rotational peripheral speed V1 on the holding surface of the holding portion 14 is smaller than that when the electromagnetic clutch 206 does not slip. The magnitude of the rotational peripheral speed V1 on the actual holding portion 14 holding surface is determined depending on the torque limit value. At this time, it is desirable to select a torque limit value so that V1 / V2> 1 and a desired range of peel angle 40 can be obtained.

  As described above, the peeling device 200 adjusts the rotational peripheral speed V1 and the relative movement speed V2 on the holding surface of the holding unit 14 and stabilizes the peeling as V1 / V2> 1, while adjusting the torque applied to the support 12. Since the tension acting on the flexible film 4 can be limited, the peeling can be performed stably without deforming the flexible film 4 and without damaging the circuit pattern on the flexible film 4. it can.

  In the peeling apparatus 200, V1 / V2> 1 is set, and control for limiting the working tension to the flexible film is performed by the control apparatus 212 by torque control using the electromagnetic clutch 206, and the holding unit. 14 It can also be performed by speed control of the rotational peripheral speed V1 on the holding surface and the relative movement speed V2 of the frame 18. The speed control mentioned here means that the supply voltage to the electromagnetic clutch 206 is first increased to increase the limit torque so that the rotation of the support 12 does not slip relative to the rotation of the rotary motor 210, and further V1 / V2. The rotational speed of the rotary motor 210 and the relative movement speed V2 of the frame 18 by the linear motor 208 are controlled so that the value becomes an appropriate value larger than 1. If V1 / V2 is increased, the acting tension on the flexible film 4 is increased. Therefore, V1 / V2 is determined so that the tension is limited.

  Any of the above speed control and torque control may be used, but in the case of torque control, the elongation of the flexible film 4 is accumulated due to the progress of peeling for a long time, and the peeling angle 40 increases. The flexible film on which the circuit pattern is always formed can be peeled off with low stress.

  The torque control using the electromagnetic clutch 206 may be another mechanical torque control method such as a slip ring or an electronic torque control method realized by a combination of a torque sensor and a servo motor. A combination of both mechanical and electronic torque control is also possible. The ratio V1 / V2 between the rotational peripheral speed V1 on the holding surface of the holding part 14 and the relative movement speed V2 of the frame 18 is preferably 1.01 or more. The limit value of the torque applied to the support 12 and the tension acting on the flexible film 4 is sufficient to prevent the peeling angle from increasing with the progress of peeling, and a circuit pattern made of metal or possible. The flexible film needs to be set in a range in which plastic deformation does not occur, and is appropriately selected depending on the material, width, and thickness of the flexible film. The tension applied to the flexible film 4 is preferably 300 N / m or less, more preferably 200 N / m or less.

  The method of peeling the flexible film 4 using the peeling device 200 is as follows: 1) Select an appropriate value satisfying V1 / V2> 1 so that the peeling angle 40 becomes a desired value by the control device 212; 2) Rotation The speed of the motor 210 is controlled so as to become the rotational peripheral speed V1 on the holding surface of the predetermined holding portion 14; 3) The linear motor 208 is driven and the relative movement speed V2 of the frame 18 is controlled so as to become a predetermined value. 4) Adjusting the supply voltage to the electromagnetic clutch 206 to limit the torque applied to the support 12 to limit the tension to the flexible film 4 at the time of peeling, as well as the flexibility by the peeling device 1 This is exactly the same as the film 4 peeling method.

  In the peeling apparatus 1, the peeling unit 10 can be replaced with a peeling unit 80 shown in FIG. 8 or a peeling unit 90 shown in FIG. The peeling unit 80 includes a mounting table A30 that holds the reinforcing plate 2 of the flexible film substrate 6 bonded to the reinforcing plate 2 that is a glass substrate through the organic material layer 3 that can peel the flexible film 4, and a flexible base. The peelable member 81 is configured to peel the flexible film 4 from the peelable organic material layer 3 by holding the conductive film 4 and pulling it in the direction of the extension line of the peeling angle 40 indicated by the arrow.

  The peeling member 81 holds the end of the flexible film 4 by a driving source (not shown), and can pull the flexible film 4 while keeping the peeling angle 40 in the range of 1 ° to 80 °. In order to control the corner 40 more stably, it is preferable to use a peeling unit 90 described below.

  The peeling unit 90 shown in FIG. 9 has a mounting table 92 that holds the reinforcing plate 2 of the flexible film substrate 6 bonded to the reinforcing plate 2 that is a glass substrate through the organic material layer 3 that can peel the flexible film 4. And a peeling member 91 that peels the flexible film 4 from the peelable organic material layer 3 by holding the end of the flexible film 4 and pulling it in the direction of the extension line of the peeling angle 40 indicated by an arrow. In order to support the flexible film 4 at this time, it is composed of a support roll 95 attached to the frame 94.

  The mounting table 92 and the frame 94 are attached to the base 34 of the peeling apparatus 1 and can be moved in the horizontal direction independently by a driving source and a guide (not shown). The support roll 95 can be rotated by a drive source (not shown), can be separated from the drive source to be a free roll, or can be fixed so as not to rotate.

  The peeling member 91 holds the end portion of the flexible film 4 by a driving source (not shown), and in conjunction with the movement of the mounting table 92, the flexible film 4 is extended from the peeling angle 40 indicated by an arrow. By pulling in the direction, peeling can be performed while keeping the peeling angle 40 in the range of 1 ° to 80 °. When peeling is performed, the frame 94 to which the support roll 95 is attached may be stopped, or may be moved in the direction of the arrow, that is, in the direction opposite to the moving direction of the mounting table 92.

  As another embodiment, the peeling member 91 is held by the driving source (not shown) to hold the end of the flexible film 4, and the frame 94 is moved in the direction of the arrow, that is, in the left direction in FIG. Then, by pulling the flexible film 4, it is possible to peel the film while keeping the peel angle 40 in the range of 1 ° to 80 °. When peeling is performed, the mounting table 92 may be stopped, or may be moved in a direction opposite to the frame 94.

  When peeling using the peeling unit 90, it is preferable that the flexible film 4 is always supported on the surface of the support roll 95. As a result, the flexible film is guided by the support roll, so that the peeling is performed stably. Further, when peeling, the support roll 95 is preferably driven so that the peripheral speed at the contact surface with the flexible film 4 is substantially the same as the moving speed of the flexible film, or is free to rotate. As a result, there is no slip between the support roll 95 and the flexible film 4, and problems such as scratches on the flexible film 4 can be prevented. The support roll 95 may be rotationally fixed when peeling, but is preferably used when damage to the surface of the flexible film 4 can be ignored.

  The peeling units 80 and 90 may be used in place of the peeling unit 220 of the peeling apparatus 200.

  Examples of the reinforcing plate 2 used in the present invention include plates made of inorganic glass such as soda lime glass, borosilicate glass, and quartz glass, ceramics such as alumina, silicon nitride, and zirconia, stainless steel, Invar alloy, and titanium. Those having a small linear expansion coefficient and hygroscopic expansion coefficient such as a plate made of metal or glass fiber reinforced resin are preferable. Among them, a plate made of inorganic glass and metal is preferable in that appropriate flexibility can be easily obtained. In addition, it has excellent heat resistance and chemical resistance, has a large area with high surface smoothness and is easily available at low cost, is difficult to plastically deform, and is less likely to generate particles due to contact with a transport device A plate made of an inorganic glass is particularly preferable because it is an insulator and does not deposit due to electrolytic plating.

  When a glass substrate having a small thickness is used for the reinforcing plate, warping and twisting increase due to the expansion / contraction force of the flexible film, and the glass substrate may be broken when vacuum-adsorbed on a flat mounting table. Moreover, a flexible film will deform | transform by vacuum adsorption | suction and removal | desorption, and there exists a tendency for ensuring of position accuracy to become difficult. On the other hand, in a glass substrate having a large thickness, it becomes difficult to bend due to peeling, and flatness is lowered due to uneven thickness, and exposure accuracy is also lowered. In addition, the handling load by the robot or the like becomes large, and it becomes impossible to operate quickly, resulting in a decrease in productivity and an increase in transportation cost. From these points, the thickness of the glass substrate is preferably in the range of 0.3 mm to 1.1 mm.

  When a metal substrate with a small thickness is used for the reinforcing plate, warping and twisting increase due to the expansion and contraction force of the flexible film, making it impossible to vacuum-suck on a flat mounting table, and warping or twisting of the metal substrate occurs. When the flexible film is deformed by the amount, a predetermined positional accuracy cannot be ensured. Also, if there is a fold, it becomes a defective product at that time. On the other hand, in the case of a metal substrate having a large thickness, flatness is lowered due to uneven thickness, and it is difficult to bend for peeling, and the exposure accuracy is also lowered. In addition, the handling load by the robot or the like becomes large, and it becomes impossible to operate quickly, resulting in a decrease in productivity and an increase in transportation cost. Therefore, the thickness of the metal substrate is preferably in the range of 0.1 mm to 0.7 mm.

  In the present invention, a plastic film is used as the flexible film. For example, films such as polycarbonate, polyether sulfide, polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polyimide, polyamide, and liquid crystal polymer can be employed. Among these, a polyimide film is preferably used because it is excellent in heat resistance and chemical resistance. In addition, a liquid crystal polymer is preferably used in terms of excellent electrical characteristics such as low dielectric loss and low hygroscopicity. It is also possible to employ a flexible glass fiber reinforced resin plate. Moreover, these films may be laminated | stacked.

  Examples of the resin for the glass fiber reinforced resin plate include epoxy, polyphenylene sulfide, polyphenylene ether, maleimide (co) polymer resin, polyamide, and polyimide.

  The thickness of the flexible film is preferably thin for light weight, downsizing, or formation of fine via holes, while the thicker one is required to ensure mechanical strength and maintain flatness. From a preferable point, the range of 4 μm to 125 μm is preferable.

  As the peelable organic layer used in the present invention, an adhesive or a pressure-sensitive adhesive is used. Examples of the peelable adhesive or pressure-sensitive adhesive include a pressure-sensitive adhesive called an acrylic or urethane-based re-peeling agent. Adhesive strength in the region called weak to medium adhesive is preferable in order to have sufficient adhesive force during flexible film processing, and can be easily peeled off during peeling and does not cause distortion in the flexible film substrate. . A silicone resin having tackiness can also be used. It is also possible to use an epoxy resin having tackiness.

  As organic materials that can be peeled, those whose adhesive strength and adhesive strength are reduced at low temperatures, those whose adhesive strength and adhesive strength are reduced by ultraviolet irradiation, and those whose adhesive strength and adhesive strength are reduced by heat treatment are suitably used. . Among these, those caused by ultraviolet irradiation are preferable because of large changes in adhesive strength and adhesive strength. An example of a material whose adhesive strength and adhesive strength are reduced by ultraviolet irradiation is a two-component cross-linking acrylic pressure-sensitive adhesive. Examples of those in which adhesive strength and adhesive strength decrease in a low temperature region include acrylic pressure-sensitive adhesives that reversibly change between a crystalline state and an amorphous state, and are preferably used.

  If the thickness of the peelable organic material layer used in the present invention is too thin, the flatness will be poor, and the peel force will be greatly reduced, resulting in uneven peel strength due to uneven film thickness. It is preferable that it is 0.3 micrometer or more. On the other hand, if the peelable organic layer is too thick, the anchoring strength of the organic layer on the flexible film is improved and the adhesive strength becomes too strong. Therefore, the thickness is preferably 10 μm or less, and preferably 20 μm or less. Further preferred. When bonding electronic components to a circuit pattern on a flexible film fixed via a peelable organic layer on the reinforcing plate, the thickness of the peelable organic layer is used to suppress changes in the thickness direction of the circuit pattern. Is preferably 5 μm or less. When the peelable organic material layer is thick, when the electronic component is heated and pressed, the amount of deformation of the peelable organic material layer is large, and the circuit pattern of the joint portion sinks, which may cause a problem in the reliability of the wiring circuit. When the sinking is large, the circuit pattern may come into contact with the edge of the electronic component to cause a short circuit. The sinking is preferably 6 μm or less, and more preferably 3 μm or less in order to ensure the reliability of the wiring circuit.

  In consideration of peeling between the flexible film and the reinforcing plate, the adhesive strength between the peelable organic layer and the reinforcing plate is greater than the adhesive strength between the peelable organic layer and the flexible film. Is preferred. As a method for controlling the adhesive strength on both sides in this way, for example, there is a method using aging of an adhesive. That is, a surface with reduced adhesive strength can be obtained by applying a pressure-sensitive adhesive on the side where the adhesive strength is to be increased, and then proceeding with crosslinking for a predetermined period in a state where the air is shut off.

  Although the manufacture example of the flexible film board | substrate 6 in the manufacturing method of the circuit board of this invention is demonstrated below, this invention is not limited to this.

  A peelable organic substance is applied to an aluminoborosilicate glass having a thickness of 1.1 mm using a spin coater, a blade coater, a roll coater, a bar coater, a die coater, screen printing, or the like. Use of a die coater is preferable in order to uniformly apply to a single-wafer substrate sent intermittently. After applying the peelable organic material, drying is performed by heat drying or vacuum drying to obtain a peelable organic material layer having a thickness of 2 μm. An air barrier film made of a release film (a silicone resin layer is provided on a polyester film) is bonded onto the applied peelable organic layer and left at room temperature for 1 week. This period is called aging, and the cross-linking of the peelable organic substance proceeds and the adhesive force gradually decreases. The standing period and the storage temperature are selected so that a desired adhesive strength can be obtained. Instead of laminating the air blocking film, it can be stored in a nitrogen atmosphere or in a vacuum. It is also possible to apply a peelable organic substance to a long film substrate, dry it, and then transfer it to a reinforcing plate.

  Next, a polyimide film having a thickness of 25 μm is prepared. The air blocking film on the glass substrate is peeled off, and the polyimide film is bonded to the glass substrate. As described above, a metal layer (which may be a circuit pattern) may be formed in advance on one or both sides of the polyimide film. The polyimide film may be attached in a cut sheet having a predetermined size in advance, or may be attached and cut while being wound from a long roll. For such a pasting operation, low stress and high accuracy can be achieved by holding a polyimide film on the surface of the flexible planar body proposed in the pamphlet of International Publication No. 03/009657 and then pressing it onto the glass substrate. A method of laminating a polyimide film on the glass substrate side can be suitably employed. Such a laminating apparatus will be described with reference to FIG. 10 is a schematic front view of the laminating apparatus. The flexible sheet 102 is charged by the electrostatic withstand device 104 and the polyimide film 4 is adsorbed. A flexible fabric or thin film can be used for the flexible planar body 102 and is fixed to the frame body 113. Further, the electrostatic charging device 104 is supported by a support column 115 on the base 105, and the support column 115 is electrostatically charged with the frame body 113 and the mounting table 101 that move to the left and right in FIG. The device 104 moves so as not to interfere. Next, the glass substrate 2 on which the peelable organic layer 2 is applied is held on the mounting table 101 by vacuum suction or the like. The polyimide film 4 is pressed against the peelable organic material layer 3 together with the flexible planar body 102 with the squeegee 103, and the polyimide film 4 is transferred to the glass substrate 2 side. The squeegee 103 is held by a squeegee holder 114 and can move and move up and down. The mounting table 101 can be moved to the left and right in the figure by a rail 106, a guide 107, a nut 108, a ball screw 111, and a motor 112.

  When a metal layer (which may be a circuit pattern) is not provided on the surface opposite to the bonded surface of the polyimide film, the metal layer is formed by a full additive method or a semi-additive method. Furthermore, if necessary, plating with gold, nickel, tin or the like is performed to obtain a circuit pattern.

  Moreover, a connection hole can be provided in a polyimide film in circuit pattern formation. That is, it is possible to provide a via hole for making an electrical connection with the metal layer provided on the side of the bonding surface with the single wafer substrate, or to provide a ball placement hole for the ball grid array. Laser holes and chemical etching can be employed as the method for providing the connection holes. When electrical connection is made, it is preferable that after the connection hole is formed, the inner surface of the hole is made into a conductor by plating at the same time as the circuit pattern is formed. The diameter of the connection hole for electrical connection is preferably 15 μm to 200 μm. The diameter of the hole for installing the ball is preferably 50 μm to 800 μm, more preferably 80 μm to 800 μm.

  If necessary, a solder resist layer is formed on the circuit pattern. As the solder resist, a photosensitive solder resist or a thermosetting solder resist is preferable. Among these, it is more preferable to use a photosensitive solder resist for the fine circuit pattern. A photosensitive solder resist is applied onto the circuit pattern with a spin coater, blade coater, roll coater, bar coater, die coater, screen printing machine, etc., dried, and then exposed to ultraviolet rays through a predetermined photomask and developed. Thus, a solder resist pattern is obtained. Next, curing is performed at 100 ° C. to 200 ° C.

  Next, electronic components such as an IC chip, a resistor and a capacitor are mounted on the formed circuit pattern. The means for mounting the electronic component is preferably performed using an apparatus that has an optical position detection function and a positioning function such as a movable stage and can ensure mounting accuracy.

  In addition, as a method of connecting the electronic component and the circuit board, a metal layer such as tin, gold, or solder formed on the connection portion of the circuit board and a metal layer such as gold or solder formed on the connection portion of the electronic component The method of thermocompression bonding and metal bonding, the circuit board and the electronic circuit while crimping the metal layer of tin, gold, solder, etc. at the connection part of the circuit board and the metal layer of gold, solder, etc. formed at the connection part of the electronic component Examples include a method in which an anisotropic conductive adhesive or non-conductive adhesive disposed between components is cured and mechanically joined.

  In order to protect the circuit pattern and peel the flexible film without distortion, it is preferable to form a protective layer on the entire surface or part of the flexible film substrate 6. That is, by forming the protective layer, an effect of suppressing an excessive increase in the peeling angle at the time of peeling the flexible film can be obtained. The same effect can be obtained by providing a protective layer on the flexible film, peeling the flexible film, and then removing the protective layer. The protective layer may be formed by laminating a film-like member or coating a liquid material. When the protective layer is liquid, the solution is applied onto the flexible film substrate with a spin coater, blade coater, roll coater, bar coater, die coater, screen printer, curtain coater, and the like, and dried. Furthermore, the protective layer may be removed by dissolving with water or a solvent after peeling the circuit board from the reinforcing plate, and is preferably a solder resist from the viewpoint of having the function.

  Also, the normal circuit pattern has a bias in the wiring direction, and the distribution is often such that the longitudinal direction of the wiring is aligned with a specific direction. In such a case, it is preferable to peel in a direction perpendicular to the direction in which many longitudinal directions of the wiring are arranged, since deformation of the film can be reduced.

  After connecting the circuit board and the electronic component, the circuit board and the glass substrate are peeled using the peeling method of the present invention. The circuit board on which the electronic component is mounted can be peeled off from the glass substrate after the polyimide film with a circuit pattern is cut into pieces or an assembly of pieces using a laser, a high-pressure water jet, a cutter, or the like.

  In the present invention, it is allowed to insert a resistance element or a capacitance element into the circuit pattern as appropriate. In addition, an insulating layer and a wiring layer can be laminated on at least one surface of the flexible film substrate to form a multilayer.

  Since the present invention is particularly effective for securing the mounting accuracy of a large-scale LSI having a small connection pitch and a large number of pins, the LSI package form (mounting form) is not particularly limited, such as a bare chip, a ball grid array type, etc. It can be applied to both.

  The use of the circuit board obtained by the production method of the present invention is not particularly limited, but it is preferably used for a wiring board of an electronic device, an IC package interposer, a wafer level burn-in socket wiring board, and the like.

  Hereinafter, the present invention will be described more specifically with reference to examples, but the present invention is not limited thereto.

Example 1
As a flexible film, a polyimide film having a thickness of 25 μm and a 290 mm square (“Kapton” 100EN manufactured by Toray Du Pont Co., Ltd.) was prepared.

  A 1.1 mm thick, 300 mm square single-side polished soda glass prepared as a reinforcing plate is coated with an ultraviolet curable adhesive “SK Dyne” SW-22 (manufactured by Soken Chemical Co., Ltd.) and a curing agent L45 (Soken Chemical). (Mixed) was mixed at 100: 3 (weight ratio) and dried at 80 ° C. for 2 minutes. The peelable organic layer thickness after drying was 2 μm. Next, an air-blocking film (a film in which a silicone resin layer that can be easily released on a polyester film) was bonded to the organic layer, and left for one week.

While peeling off the air blocking film, a polyimide film was bonded to the peelable organic layer with a roll laminator. The polyimide film laminated on the glass was cut according to the glass end. Thereafter, ultraviolet rays were irradiated from the glass substrate side at 1000 mJ / cm ² to cure the organic layer.

  Subsequently, a 6 nm thick chromium: nickel = 20: 80 (weight ratio) alloy film and a 200 nm thick copper film were laminated on the polyimide film in this order by sputtering. A positive photoresist was applied onto the copper film with a spin coater and dried at 80 ° C. for 10 minutes. The photoresist was exposed and developed through a photomask to form a photoresist layer having a thickness of 10 μm in a portion where a plating film was unnecessary.

  The test photomask pattern had the following shape. 240 connection pads (width: 25 μm, length: 80 μm) are arranged on a square side with a length of 3.5 mm on each side, and each connection pad has a width of 20 μm and a length of 5 mm from the center of the width of 25 μm. The wiring lead-out part is arranged. 240 pads (width 50 μm, length 100 μm) per side were arranged on the side of a square having the same length as the square and a side of 30 mm in length. A unit in which a wiring lead portion from a connection pad on a square having a side length of 3.5 mm and a pad on a square having a side length of 30 mm are connected one-to-one with a wiring having a width of 20 μm is taken as one unit. The units were equally arranged on a 300 mm square substrate at a pitch of 40 mm in 7 rows and 7 columns. In addition, four markers (disposed 200 mm apart from each other in the direction parallel to the side), which are arranged at a distance of about 141 mm from the center of the substrate for length measurement, were provided on the photomask pattern.

  Next, a copper layer having a thickness of 5 μm was formed by electrolytic plating in a copper sulfate plating solution using the copper film as an electrode. The photoresist was stripped with a photoresist stripping solution, and then the copper film and the chromium-nickel alloy film that were under the resist layer were removed by soft etching with a hydrogen peroxide-sulfuric acid aqueous solution. Subsequently, a tin layer having a thickness of 0.4 μm was formed on the copper plating film by electroless plating to obtain a circuit pattern.

  Two points (200 mm in the x direction and 200 mm in the y direction) originally separated by about 283 mm in the diagonal direction provided for the above-mentioned length measurement by the length measuring machine SMIC-800 (manufactured by Sokkia Co., Ltd.) When the distance was measured, it was within ± 2 μm with respect to the photomask pattern, and the position accuracy was kept very good.

  Next, a model IC chip of 4 mm × 4 mm, in which four rows are arranged in a square with 60 gold-plated bumps arranged in a row at 50 μm pitch, is mounted on a flip chip bonder FC-70 (manufactured by Toray Engineering Co., Ltd.) on the IC chip side. While being heated to 300 ° C., metal bonding was performed to the connection pads of the circuit pattern. The alignment of the bumps of the model IC chip and the connection pads of the circuit pattern was good.

  Using the peeling apparatus 1 shown in FIG. 1, the polyimide film with a circuit pattern to which the IC chip was connected was peeled from the glass substrate. The curvature radius of the curved surface of the holding portion 14 is 600 mm, the degree of vacuum for adsorbing the flexible film at the holding portion 14 is 100 hPa, and the holding portion 14 is made of polyurethane rubber having a hardness of 70 °. The pressing pressure of the holding part 14 against the flexible film was 0.01 MPa, and the right side moving speed when peeling the frame 18 was 0.3 m / min. The holding portion 14 shown in FIG. 3 is provided with a recess 36 (5 × 5 mm, depth 1 mm) corresponding to the IC chip. The polyimide film side with a circuit pattern to which an IC chip was connected was placed on the mounting table A30 shown in FIG. 1, and vacuum suction was performed at 100 hPa. The peeling angle between the reinforcing plate and the flexible film during peeling was a maximum of 20 °. The rotational peripheral speed of the holding part was 0.31 m / min. Moreover, it adjusted so that a slip ring might work when the tension | tensile_strength added to a polyimide film became 160 N / m or more. The wiring lead-out part of the circuit pattern on the polyimide film was slightly curled due to the peeling, but it was good without any breaks or cracks. Two points (200 mm in the x direction and 200 mm in the y direction) that were originally about 283 mm apart in the diagonal direction provided for length measurement on the peeled polyimide film with a length measuring machine SMIC-800 (manufactured by Sokkia Co., Ltd.) ) Was measured to be ± 5 μm or less with respect to the photomask pattern.

Example 2
A circuit pattern was obtained in the same manner as in Example 1. Next, using a screen printer on the flexible film from which the circuit pattern was obtained, a solder resist “FLEX PHOTO IMAGE MASK” NPR-90 (Nippon Polytech) (Made by Co., Ltd.) was applied and dried at 70 ° C. for 30 minutes. Thereafter, the solder resist layer was irradiated with ultraviolet rays at 500 mJ / cm ² and further thermally cured at 150 ° C. for 30 minutes. Finally, ultraviolet rays were applied at 1500 mJ / cm ² for post exposure to form a solder resist layer. The solder resist layer thickness after thermosetting was 24 μm.

  Two points (200 mm in the x direction and 200 mm in the y direction) originally separated by about 283 mm in the diagonal direction provided for the above-mentioned length measurement by the length measuring machine SMIC-800 (manufactured by Sokkia Co., Ltd.) When the distance was measured, it was within ± 2 μm with respect to the photomask pattern, and the position accuracy was kept very good.

  Next, in the same manner as in Example 1, the IC chip was metal-bonded to the connection pad of the circuit pattern. The alignment of the bumps of the model IC chip and the connection pads of the circuit pattern was good.

  Using the peeling apparatus 1 shown in FIG. 1, the polyimide film with a circuit pattern to which the IC chip was connected was peeled from the glass substrate in the same manner as in Example 1. The circuit pattern on the polyimide film was free from deformation such as curling and folding, and was good. Two points (200 mm in the x direction and 200 mm in the y direction) that were originally about 283 mm apart in the diagonal direction provided for length measurement on the peeled polyimide film with a length measuring machine SMIC-800 (manufactured by Sokkia Co., Ltd.) ) Was measured to be ± 5 μm or less with respect to the photomask pattern.

Example 3
A circuit pattern was obtained in the same manner as in Example 1. Two points (200 mm in the x direction and 200 mm in the y direction) originally separated by about 283 mm in the diagonal direction provided for the above-mentioned length measurement by the length measuring machine SMIC-800 (manufactured by Sokkia Co., Ltd.) When the distance was measured, it was within ± 2 μm with respect to the photomask pattern, and the position accuracy was kept very good.

  Next, as in Example 1, the IC chip was metal bonded to the connection pad of the circuit pattern. The alignment of the bumps of the model IC chip and the connection pads of the circuit pattern was good.

  Next, a 20 wt% aqueous solution of polyvinyl alcohol was applied on the circuit board and dried at 90 ° C. for 20 minutes to form a protective layer. The protective layer thickness after drying was 18 μm.

  Using the peeling apparatus 1 shown in FIG. 1, the polyimide film with a circuit pattern to which the IC chip was connected was peeled from the glass substrate in the same manner as in Example 1. Next, the protective layer formed on the circuit board was washed with water, dried and removed.

  The circuit pattern on the polyimide film was free from deformation such as curling and folding, and was good. Two points (200 mm in the x direction and 200 mm in the y direction) that were originally about 283 mm apart in the diagonal direction provided for length measurement on the peeled polyimide film with a length measuring machine SMIC-800 (manufactured by Sokkia Co., Ltd.) ) Was measured to be ± 5 μm or less with respect to the photomask pattern.

Example 4
A polyimide film with a circuit pattern to which an IC chip was connected was obtained in the same manner as in Example 2 except that the curvature radius of the curved surface of the holding portion 14 was 70 mm. The peeling angle between the reinforcing plate and the flexible film during peeling was a maximum of 70 °.

  The wiring lead-out part of the circuit pattern on the polyimide film was slightly curled due to the peeling, but it was good without any breaks or cracks. Two points (200 mm in the x direction and 200 mm in the y direction) that were originally about 283 mm apart in the diagonal direction provided for length measurement on the peeled polyimide film with a length measuring machine SMIC-800 (manufactured by Sokkia Co., Ltd.) ) Was measured to be ± 5 μm or less with respect to the photomask pattern.

Example 5
A circuit pattern was obtained in the same manner as in Example 1. The glass substrate side was adsorbed to the mounting table A30 with a vacuum adsorption mechanism using the peeling apparatus of FIG. 1, one end of the polyimide film was attached to the holding unit 14 with an adhesive tape, and the film was gradually wound up from the glass substrate.

  Although the polyimide film was slightly curled by peeling, no breaks or cracks were observed, and the film was good. Two points (200 mm in the x direction and 200 mm in the y direction) that were originally about 283 mm apart in the diagonal direction provided for length measurement on the peeled polyimide film with a length measuring machine SMIC-800 (manufactured by Sokkia Co., Ltd.) ) Was measured to be ± 5 μm or less with respect to the photomask pattern.

Example 6
A circuit pattern was obtained in the same manner as in Example 1, and then a solder resist layer was formed in the same manner as in Example 2. Two points (200 mm in the x direction and 200 mm in the y direction) originally separated by about 283 mm in the diagonal direction provided for the above-mentioned length measurement by the length measuring machine SMIC-800 (manufactured by Sokkia Co., Ltd.) When the distance was measured, it was within ± 2 μm with respect to the photomask pattern, and the position accuracy was kept very good.

  It peeled like Example 1 except the curvature radius of the holding | maintenance part having been 1200 mm. At this time, the peel angle between the reinforcing plate being peeled and the flexible film was 10 ° at the maximum. The circuit pattern on the polyimide film was free from deformation such as curling and folding, and was good. However, with a length measuring machine SMIC-800 (manufactured by Sokkia Co., Ltd.), two points (200 mm in the x direction and 200 mm in the y direction) originally separated by about 283 mm in the diagonal direction provided for length measurement on the peeled polyimide film. When measuring the distance of a point 200 mm away, there was a distortion of 26 μm with respect to the photomask pattern.

Example 7
As a flexible film, a polyimide film having a thickness of 25 μm and a 290 mm square (“Kapton” 100EN manufactured by Toray Du Pont Co., Ltd.) was prepared.

  A 1.1 mm thick, 300 mm square single-side polished soda glass prepared as a reinforcing plate is coated with a UV-curable adhesive “SK Dyne” SW-22 (manufactured by Soken Chemical Co., Ltd.) and a curing agent L45 (Soken Chemical). (Mixed) was mixed at 100: 3 (weight ratio) and dried at 80 ° C. for 2 minutes. The peelable organic layer thickness after drying was 2 μm. Next, an air-blocking film (a film in which a silicone resin layer that can be easily released on a polyester film) was bonded to the organic layer, and left for one week.

The polyimide film was bonded to the glass on which the peelable organic layer was formed with the laminating apparatus shown in FIG. The polyimide film laminated on the glass was cut according to the glass end. Thereafter, ultraviolet rays were irradiated from the glass substrate side at 1000 mJ / cm ² to cure the organic layer.

  Subsequently, a 6 nm thick chromium: nickel = 20: 80 (weight ratio) alloy film and a 200 nm thick copper film were laminated on the polyimide film in this order by sputtering. A positive photoresist was applied onto the copper film with a spin coater and dried at 80 ° C. for 10 minutes. The photoresist was exposed and developed through a photomask to form a photoresist layer having a thickness of 10 μm in a portion where a plating film was unnecessary.

  The test photomask pattern had the following shape. 240 connection pads (width: 25 μm, length: 80 μm) are arranged on a square side with a side of 3.5 mm, and each connection pad has a width of 20 μm and a length of 5 mm from the center of the width of 25 μm. The wiring lead-out part is arranged. 240 pads (width 50 μm, length 100 μm) per side were arranged on the side of a square having the same length as the square and a side of 30 mm in length. A unit in which a wiring lead portion from a connection pad on a square having a side length of 3.5 mm and a pad on a square having a side length of 30 mm are connected one by one with a wiring having a width of 20 μm is taken as one unit. The units were equally arranged on a 300 mm square substrate at a pitch of 40 mm in 7 rows and 7 columns. In addition, four markers (disposed 200 mm apart from each other in the direction parallel to the side), which are arranged about 141 mm diagonally from the center of the substrate for length measurement, were provided on the photomask pattern.

  Next, a copper layer having a thickness of 5 μm was formed by electrolytic plating in a copper sulfate plating solution using the copper film as an electrode. The photoresist was stripped with a photoresist stripping solution, and then the copper film and the chromium-nickel alloy film that were under the resist layer were removed by soft etching with a hydrogen peroxide-sulfuric acid aqueous solution. Subsequently, a tin layer having a thickness of 0.4 μm was formed on the copper plating film by electroless plating to obtain a circuit pattern.

  Two points (200 mm in the x direction and 200 mm in the y direction) originally separated by about 283 mm in the diagonal direction provided for the above-mentioned length measurement by the length measuring machine SMIC-800 (manufactured by Sokkia Co., Ltd.) When the distance was measured, it was within ± 2 μm with respect to the photomask pattern, and the position accuracy was kept very good.

  Next, a model IC chip of 4 mm × 4 mm in which 60 gold-plated bumps at a pitch of 50 μm are arranged in a row and 4 rows are arranged in a square is mounted on a flip chip bonder FC-70 (manufactured by Toray Engineering Co., Ltd.). While being heated to 300 ° C., metal bonding was performed to the connection pads of the circuit pattern. The alignment of the bumps of the model IC chip and the connection pads of the circuit pattern was good.

  Using the peeling apparatus 200 shown in FIG. 11, the polyimide film with a circuit pattern to which the IC chip was connected was peeled from the glass substrate. The curvature radius of the curved surface of the holding portion 14 is 600 mm, the degree of vacuum for adsorbing the flexible film at the holding portion 14 is 100 hPa, and the holding portion 14 is made of polyurethane rubber having a hardness of 70 °. The pressing pressure of the holding part 14 against the flexible film was 0.01 MPa, and the right side relative movement speed V2 when peeling the frame 18 was 0.3 m / min. The holding portion 14 shown in FIG. 11 was provided with a recess 36 (5 × 5 mm, depth 1 mm) corresponding to the IC chip. The polyimide film side with a circuit pattern to which an IC chip was connected was placed on the mounting table A30 shown in FIG. 11, and vacuum suction was performed at 100 hPa. The speed of the rotary motor 210 was controlled so that the rotational peripheral speed V1 on the holding surface of the holding portion 14 was 0.31 m / min. Furthermore, peeling was performed by adjusting the supply voltage to the electromagnetic clutch 206 so that the tension applied to the polyimide film 4 was 160 N / m.

  As a result, the peel angle between the reinforcing plate during peeling and the flexible film was 20 ° at the maximum. The wiring lead-out portion of the circuit pattern on the polyimide film was slightly curled due to the peeling, but it was good without any breaks or cracks. Two points (200 mm in the x direction and 200 mm in the y direction) that were originally about 283 mm apart in the diagonal direction provided for length measurement on the peeled polyimide film with a length measuring machine SMIC-800 (manufactured by Sokkia Co., Ltd.) The distance was measured with a difference of ± 3 μm or less with respect to the photomask pattern, which was very good.

Example 8
A polyimide film with a circuit pattern to which an IC chip was connected was obtained in the same manner as in Example 7 except that a silicone resin was used for the holding portion 14. The peeling angle between the reinforcing plate and the flexible film during peeling was a maximum of 15 °. Moreover, when peeling a polyimide film from the holding | maintenance part 14 which consists of silicone resins, the peel strength of a 180 degree direction was 0.98 N / m.

  As a result of peeling, no curling, bending, or cracking was found in the wiring drawing portion of the circuit pattern on the polyimide film. Two points (200 mm in the x direction and 200 mm in the y direction) that were originally about 283 mm apart in the diagonal direction provided for length measurement on the peeled polyimide film with a length measuring machine SMIC-800 (manufactured by Sokkia Co., Ltd.) When the distance was measured, the difference was ± 3 μm or less with respect to the photomask pattern, which was very good.

Example 9
A circuit pattern was obtained in the same manner as in Example 7. Example except that the rotation motor 210 is controlled so that the rotational peripheral speed V1 at the holding surface of the holding unit 14 is 0.3 m / min, and the right relative movement speed V2 at the time of peeling of the frame 18 is made the same. It peeled like 7. At this time, the peeling angle 40 between the reinforcing plate and the flexible film may exceed 80 ° near the peeling end point of the flexible film, and the flexible film on which the circuit pattern is formed strongly curls near the peeling end point. did. Two points (200 mm in the x direction and 200 mm in the y direction) that were originally about 283 mm apart in the diagonal direction provided for length measurement on the peeled polyimide film with a length measuring machine SMIC-800 (manufactured by Sokkia Co., Ltd.) As a result, the photomask pattern was distorted by 15 μm.

Comparative Example 1
A circuit pattern was obtained in the same manner as in Example 1, and the model IC chip was metal bonded. The glass substrate side is adsorbed to the mounting table A30 with a vacuum adsorption mechanism, one end of the polyimide film is gripped, the end of the polyimide film is lifted, and the glass substrate is gradually peeled off so that the peeling angle is approximately 90 °. .

  In the portion where the model IC chip is mounted, the peeling force of the polyimide film from the substrate is increased, and a part of the circuit pattern on the polyimide film after peeling is broken, and cannot be used as a product. Further, in the part where the model IC chip was not mounted, curling occurred in a part of the circuit pattern on the polyimide film after peeling.

The schematic front view of the peeling apparatus of this invention. The schematic front view which shows another embodiment of the peeling apparatus of this invention. The schematic front view which shows another embodiment of the support body 12. FIG. The top view which shows the shape of the groove | channel formed in the support body 12. FIG. The top view which shows another shape of the groove | channel formed in the support body 12. FIG. The top view which shows another shape of the groove | channel formed in the support body 12. FIG. The schematic front view which shows another embodiment of the support body 12. FIG. The schematic front view which shows the detail of the peeling unit 80. FIG. The schematic front view which shows the peeling unit 90 which is another embodiment of a peeling unit. 1 is a schematic front view of a laminating apparatus suitable for the present invention. The schematic front view which shows another embodiment of the peeling apparatus of this invention. Side view of the peeling device of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Peeling device 2 Reinforcement board 3 Organic layer which can be peeled 4 Flexible film 5 Electronic component 6 Flexible film board 10 Peeling unit 12 Support body 14 Holding part 16 Shaft 18 Frame 20 Rail 22 Holding member 23 Lead film 30 Mounting stand A
32 Mounting table B
34 base 36 recess 40 peeling angle 80 peeling unit 81 peeling member 82 mounting table 90 peeling unit 91 peeling member 92 mounting table 93 base 94 frame 95 support roll 100 laminating device 101 mounting table 102 flexible planar body 103 Squeegee 104 Electrostatic charging device 106 Rail 111 Ball screw 200 Peeling device 202 Linear scale 204 Encoder 206 Electromagnetic clutch 208 Linear motor 210 Rotating motor 212 Control device 220 Peeling unit

Claims (3)

A method for producing a circuit board, wherein a circuit pattern is formed on a surface opposite to a bonding surface of a flexible film bonded to a reinforcing plate through an organic layer that can be peeled, and then the flexible film is peeled off. When peeling the reinforcing plate and the flexible film along the curved supporting body , at least a part of the flexible film while rotating the curved supporting body and moving it relative to the reinforcing plate , A circuit for controlling the tension applied to the flexible film when the flexible film is peeled off, and the rotational peripheral speed V1 on the flexible film support surface of the support is larger than the relative moving speed V2 of the support to the reinforcing plate. A method for manufacturing a substrate. A circuit board manufacturing apparatus for peeling a flexible film from a flexible film substrate in which a flexible film on which a circuit pattern is formed is bonded to a reinforcing plate via an organic layer that can be peeled off. holding means for holding a saw including a curved distancing means away from the reinforcing plate in contact with the curved support at least a portion of the flexible film, the bending distancing means, rotation drive device for rotating the support member A relative movement drive device for moving the support relative to the reinforcing plate holding means, and a speed control device for independently controlling the rotational speed of the support and the relative moving speed of the support relative to the reinforcing plate holding means. An apparatus for manufacturing a circuit board. The rotation speed V1 is the than the relative moving speed V2, according to claim 2 having a speed ratio control device for controlling so as to increase the tension control device for controlling the tension applied to the flexible film upon peeling Circuit board manufacturing equipment.

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