JP4399709B2 - Cleaning composition for tin-containing alloy parts and cleaning method - Google Patents
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本発明はスズ含有合金製部品用洗浄剤組成物および当該洗浄剤組成物を用いた洗浄方法に関する。 The present invention relates to a cleaning composition for tin-containing alloy parts and a cleaning method using the cleaning composition.
従来、各種の電子部品や合金製部品単体を洗浄する際は、トリクロロエチレン、パークロロエチレン、塩化メチレン等の塩素系溶剤を主成分とする塩素系洗浄剤が用いられていた。これら塩素系溶剤は、不燃性で乾燥性にも優れるという利点があるが、オゾン層破壊や土壌汚染などの環境問題、人体に対する毒性などの理由から、現在ではその使用が制限されている。また、電子部品等の洗浄において、近年、特に重視される塩素イオン、硫酸イオンなどのイオン性残さに対しては、塩素系溶剤による洗浄効果がほとんど認められないという問題点があった。 Conventionally, when cleaning various electronic components and alloy single components, a chlorine-based cleaning agent mainly containing a chlorine-based solvent such as trichlorethylene, perchloroethylene, or methylene chloride has been used. These chlorinated solvents have the advantage of being nonflammable and excellent in drying properties, but their use is currently limited due to environmental problems such as ozone layer destruction and soil contamination, and toxicity to the human body. Further, in the cleaning of electronic parts and the like, there has been a problem that a cleaning effect by a chlorine-based solvent is hardly recognized for ionic residues such as chlorine ions and sulfate ions, which are particularly important in recent years.
そこで本出願人は特定のグリコールエーテル系化合物、ノニオン性界面活性剤およびポリオキシアルキレンリン酸エステル系界面活性剤を必須成分として含有してなる非ハロゲン系の洗浄剤組成物を提案した(特許文献1参照)。当該洗浄剤組成物は、洗浄力、毒性、臭気、引火性、被洗浄物への影響、イオン性残さに対する洗浄性に優れており、光学部品、電子部品、セラミック部品等の精密部品の洗浄用に賞用されている。 Accordingly, the present applicant has proposed a non-halogen cleaning composition comprising a specific glycol ether compound, a nonionic surfactant and a polyoxyalkylene phosphate ester surfactant as essential components (Patent Literature). 1). This cleaning composition is excellent in cleaning power, toxicity, odor, flammability, influence on objects to be cleaned, and cleaning performance for ionic residues, and is used for cleaning precision parts such as optical parts, electronic parts, ceramic parts, etc. It is used for awards.
かかる非ハロゲン系洗浄剤組成物を用いた洗浄は、洗浄剤で洗浄後、水すすぎ工程、乾燥工程により行われるが、合金製部品を搭載する被洗浄物を洗浄する場合、水すすぎ工程時に合金表面が顕著に変色する、という問題が生じることがあった。こうした問題を解決すべく、本出願人は、特許文献1に記載の洗浄剤組成物にさらにポリオキシアルキレンアミン系界面活性剤を必須成分として含有し、洗浄剤の1重量%水溶液のpHを6〜8とした、すすぎ工程時の変色を抑制する洗浄剤組成物(特許文献2参照)や、更には揮発性有機塩基、炭酸塩、窒素系複素環化合物からなる洗浄剤や水すすぎ剤を用いた洗浄剤組成物・すすぎ剤(特許文献3参照)を提案している。 Cleaning using such a halogen-free cleaning composition is performed by a water rinsing process and a drying process after cleaning with a cleaning agent. When cleaning an object to be cleaned on which an alloy part is mounted, the alloy is used during the water rinsing process. There was a problem that the surface was noticeably discolored. In order to solve such problems, the present applicant further contains a polyoxyalkyleneamine surfactant as an essential component in the cleaning composition described in Patent Document 1, and the pH of a 1 wt% aqueous solution of the cleaning agent is 6 A cleaning composition that suppresses discoloration during the rinsing step (see Patent Document 2), or a cleaning agent or a water rinsing agent made of a volatile organic base, carbonate, or nitrogen-based heterocyclic compound is used. Proposed a cleaning composition / rinsing agent (see Patent Document 3).
しかしながら、近頃、前記電子部品等の小型化、薄型化、軽量化等の要求から、搭載される合金製部品の金属成分が、例えば銅、亜鉛からなるシンチュウといった単純な構成のものから、強度、導電性、耐熱性、熱伝導性等の細かな要求に応えられるよう、複雑な組成のものへと変わり始めており、これまでに開発された非ハロゲン系洗浄剤組成物や水すすぎ剤を用いた水系洗浄では、洗浄後の水すすぎ工程時における合金製部品の変色が抑えられず、製品の外観や品質が低下するという問題が生じることがあった。 However, recently, due to demands for downsizing, thinning, weight reduction, etc. of the electronic parts, the metal components of the mounted alloy parts are, for example, those having a simple configuration such as Shinchu made of copper and zinc, strength, It has begun to change into a complex composition to meet the fine requirements of conductivity, heat resistance, thermal conductivity, etc., using non-halogen-based cleaning compositions and water rinses developed so far In the water-based cleaning, discoloration of the alloy part during the water rinsing process after cleaning cannot be suppressed, resulting in a problem that the appearance and quality of the product are deteriorated.
従来の変色は、例えばシンチュウの場合には、水との接触により、シンチュウを構成する2種の金属(すなわち銅および亜鉛)のうち、イオン化傾向の大きい亜鉛が優先的に水へ溶出することで、合金表層の銅−亜鉛組成割合が変わり、相対的に多く残留している銅が水や空気で酸化され変色することに起因するものであった。 In the conventional discoloration, for example, in the case of Sinchu, zinc having a high ionization tendency preferentially elutes into water among the two kinds of metals (ie, copper and zinc) constituting the Sinchu by contact with water. The copper-zinc composition ratio of the alloy surface layer was changed, and the relatively large amount of remaining copper was oxidized and discolored by water or air.
これに対し最近のスズ含有合金(例えば銅、スズ、ニッケル、リンからなる銅合金)の場合には、合金中の微量成分であるスズが、水すすぎ工程ではなく洗浄工程で洗浄剤中に溶出し、相対的に多く残留している銅面が活性状態となり、水すすぎ工程で水や空気で酸化され赤茶色に変色するというものであった。こうした変色現象は特許文献2や特許文献3の洗浄剤組成物等を用いても解決することができず、逆に、特許文献3の洗浄剤組成物を用いると、水すすぎ剤中の窒素系複素環化合物が活性状態となった銅面に過剰に付着することで、酸化以外の変色を引き起こすという問題が生じることがあった。 On the other hand, in the case of recent tin-containing alloys (for example, copper alloys composed of copper, tin, nickel, and phosphorus), tin, which is a minor component in the alloy, elutes into the cleaning agent in the cleaning process rather than the water rinsing process. However, a relatively large amount of the remaining copper surface becomes active, and is oxidized with water or air in the water rinsing process and turns reddish brown. Such a discoloration phenomenon cannot be solved even by using the cleaning composition of Patent Document 2 and Patent Document 3, and conversely, when the cleaning composition of Patent Document 3 is used, the nitrogen system in the water rinsing agent is used. When the heterocyclic compound is excessively attached to the copper surface in an active state, there is a problem that discoloration other than oxidation occurs.
本発明は、スズ含有合金製部品を洗浄した際に酸化や窒素系複素環化合物の付着等による変色を起こすことなく、水系洗浄ができる洗浄剤組成物を提供し、さらには当該洗浄剤組成物を用いた洗浄方法を提供することを目的とする。 The present invention provides a cleaning composition capable of aqueous cleaning without causing discoloration due to oxidation or adhesion of a nitrogen-based heterocyclic compound when a tin-containing alloy part is cleaned, and further, the cleaning composition It aims at providing the washing | cleaning method using.
本発明者らは前記課題を解決すべく鋭意検討を重ねた結果、特定組成の洗浄剤組成物を用いて洗浄を行うことにより、前記課題を解決することを見出した。本発明はかかる知見に基づき完成されたものである。 As a result of intensive studies to solve the above problems, the present inventors have found that the above problems can be solved by performing cleaning using a cleaning composition having a specific composition. The present invention has been completed based on such findings.
すなわち、本発明は、(A)一般式(1):(R1−COO)h M1(式中、R1は炭素数1〜18のアルキル基または炭素数1〜18のアルケニル基、M1は、スズ原子、hは2を示す。)で表わされる有機カルボン酸塩、(B)ベンゾトリアゾール誘導体および(C)有機溶剤を有効成分として含有するスズ含有合金製部品用洗浄剤組成物;当該洗浄剤を用いてスズ含有合金製部品を洗浄することを特徴とする洗浄方法に関する。 That is, the present invention relates to (A) general formula (1): (R 1 —COO) h M 1 (wherein R 1 is an alkyl group having 1 to 18 carbon atoms or an alkenyl group having 1 to 18 carbon atoms, M 1 represents a tin atom, and h represents 2. ) A detergent composition for a tin-containing alloy part containing an organic carboxylate represented by the formula: (B) a benzotriazole derivative and (C) an organic solvent as active ingredients; The present invention relates to a cleaning method for cleaning a tin-containing alloy part using the cleaning agent.
本発明の洗浄剤組成物を用いることにより、スズ含有合金製部品(特にスズを含有する銅合金製の部品)を洗浄した際に、洗浄性を低下させること無く、かつ当該部品の変色を防止することができる。 By using the cleaning composition of the present invention, when a tin-containing alloy part (particularly a copper alloy part containing tin) is cleaned, the cleaning property is not deteriorated and discoloration of the part is prevented. can do.
本発明のスズ含有合金製部品用洗浄剤組成物は、(A)有機カルボン酸塩(以下、(A)成分という)、(B)窒素系複素環化合物(以下、(B)成分という)および(C)有機溶剤(以下、(C)成分という)を有効成分として含有するものである。 The cleaning composition for tin-containing alloy parts of the present invention comprises (A) an organic carboxylate (hereinafter referred to as (A) component), (B) a nitrogen-based heterocyclic compound (hereinafter referred to as (B) component) and (C) An organic solvent (hereinafter referred to as “component (C)”) is contained as an active ingredient.
(A)成分としては、一般式(1):(R1−COO)h M1(式中、R1は炭素数1〜18のアルキル基、炭素数1〜18のアルケニル基、M1はスズ原子、hは2を示す。)で表されるモノカルボン酸塩を用いる。特にスズ含有銅合金を洗浄したときの変色防止効果が著しいことから、オクチル酸スズが溶解性、微量金属成分の溶出抑制効果の点から好ましい。
ールが好ましい。
As the component (A), the general formula (1): (R 1 —COO) h M 1 (wherein R 1 is an alkyl group having 1 to 18 carbon atoms, an alkenyl group having 1 to 18 carbon atoms, and M 1 is A monocarboxylate represented by a tin atom and h is 2. ). In particular, since the effect of preventing discoloration when a tin-containing copper alloy is washed is significant, tin octylate is preferable from the viewpoint of solubility and the effect of suppressing elution of trace metal components.
Is preferred.
(B)成分としては、ベンゾトリアゾール、1−メチルベンゾトリアゾール、1−ヒドロキシメチルベンゾトリアゾール、1−((2−エチルヘキシルアミノ)メチル)ベンゾトリアゾール、1−(2,3−ジヒドロキシプロピル)ベンゾトリアゾール、カルボキシベンゾトリアゾールなどのベンゾトリアゾール誘導体が挙げられる。これら(B)成分の中でも、変色防止効果の点から、ベンゾトリアゾール誘導体が好ましく、特にベンゾトリアゾールが好ましい。 (B) As the component base benzotriazole, 1-methylbenzotriazole, 1-hydroxymethyl-benzotriazole, 1 - ((2-ethylhexyl) methyl) benzotriazole, 1- (2,3-dihydroxypropyl) benzo triazoles include benzotriazole derived material such as carboxybenzotriazole. Among these (B) components, a benzotriazole derivative is preferable from the viewpoint of the effect of preventing discoloration, and benzotriazole is particularly preferable.
本発明における(C)成分としては、特に限定されず公知のものを使用することができる。具体的には、例えば、ヘキサン、ヘプタン、オクタン等の炭化水素系溶剤、メタノール、エタノール、プロパノール等のアルコール系溶剤、アセトン、メチルエチルケトン等のケトン系溶剤、ジエチルエーテル、テトラヒドロフラン、グリコールエーテル類等のエーテル系溶剤、酢酸エチル、酢酸メチル等のエステル系溶剤、窒素化合物系溶剤など各種公知の有機溶剤が使用できる。なお、これらの中では、洗浄性等の点からグリコールエーテル類を用いることが好ましく、特にグリコールエーテル類のなかでも、一般式(5):R3O−(CH2CHR4O)k−R5(式中、R3は水素原子または炭素数1〜5の直鎖もしくは分岐鎖アルキル基を、R4は炭素数1〜5の直鎖または分岐鎖アルキル基を、R5は水素原子またはメチル基を、kは2〜4の整数を示す。)で表されるグリコールエーテル類を使用することが、洗浄性、安全性、環境特性などの点から好ましい。一般式(5)で表されるグリコールエーテル類としては、例えば、ジエチレングリコールモノメチルエーテル、ジエチレングリコールジメチルエーテル、ジエチレングリコールモノエチルエーテル、ジエチレングリコールジエチルエーテル、ジエチレングリコールメチルエチルエーテル、ジエチレングリコールモノプロピルエーテル、ジエチレングリコールジプロピルエーテル、ジエチレングリコールメチルプロピルエーテル、ジエチレングリコールエチルプロピルエーテル、ジエチレングリコールモノブチルエーテル、ジエチレングリコールジブチルエーテル、ジエチレングリコールメチルブチルエーテル、ジエチレングリコールエチルブチルエーテル、ジエチレングリコールプロピルブチルエーテル、ジエチレングリコールモノペンチルエーテル、ジエチレングリコールジペンチルエーテル、ジエチレングリコールメチルペンチルエーテル、ジエチレングリコールエチルペンチルエーテル、ジエチレングリコールプロピルペンチルエーテル、ジエチレングリコールブチルペンチルエーテル、ジエチレングリコールモノヘキシルエーテルならびにこれらに対応するトリ−もしくはテトラエチレングリコールエーテル類が挙げられる。これらの中でもジエチレングリコールモノブチルエーテル、ジエチレングリコールジブチルエーテル、ジエチレングリコールモノヘキシルエーテルが好ましい。 As (C) component in this invention, it does not specifically limit but a well-known thing can be used. Specifically, for example, hydrocarbon solvents such as hexane, heptane and octane, alcohol solvents such as methanol, ethanol and propanol, ketone solvents such as acetone and methyl ethyl ketone, ethers such as diethyl ether, tetrahydrofuran and glycol ethers Various known organic solvents such as ester solvents such as organic solvents, ethyl acetate and methyl acetate, and nitrogen compound solvents can be used. Of these, glycol ethers are preferably used from the standpoint of detergency and the like, and among the glycol ethers, general formula (5): R 3 O— (CH 2 CHR 4 O) k —R 5 (wherein R 3 represents a hydrogen atom or a linear or branched alkyl group having 1 to 5 carbon atoms, R 4 represents a linear or branched alkyl group having 1 to 5 carbon atoms, and R 5 represents a hydrogen atom or It is preferable to use a glycol ether represented by the following formula: k represents a methyl group, and k represents an integer of 2 to 4. From the viewpoint of detergency, safety, environmental characteristics, and the like. Examples of the glycol ether represented by the general formula (5) include diethylene glycol monomethyl ether, diethylene glycol dimethyl ether, diethylene glycol monoethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol monopropyl ether, diethylene glycol dipropyl ether, and diethylene glycol methyl. Propyl ether, diethylene glycol ethyl propyl ether, diethylene glycol monobutyl ether, diethylene glycol dibutyl ether, diethylene glycol methyl butyl ether, diethylene glycol ethyl butyl ether, diethylene glycol propyl butyl ether, diethylene glycol monopentyl Or tetraethylene glycol ethers include - ether, diethylene glycol dipentyl ether, diethylene glycol methyl pentyl ether, diethylene glycol ethyl pentyl ether, diethylene glycol propyl pentyl ether, diethylene glycol butyl pentyl ether, triethylene corresponding to diethylene glycol hexyl ether, as well as these. Among these, diethylene glycol monobutyl ether, diethylene glycol dibutyl ether, and diethylene glycol monohexyl ether are preferable.
(A)〜(C)成分の使用量は特に限定されないが、通常、(A)成分を洗浄剤組成物の0.001〜0.45重量%程度、好ましくは0.005〜0.4重量%、より好ましくは0.01〜0.35重量%、(B)成分を洗浄剤組成物の0.001〜1重量%程度、好ましくは0.01〜0.1重量%、(C)成分を40〜99重量%程度、好ましくは70〜99重量%となるように添加する。(A)成分を前記割合で、洗浄剤中に含有することにより、合金中の微量金属成分の溶出を抑制することができるため好ましい。合金中の微量金属成分の溶出の抑制はカルボン酸塩の平衡反応を利用するものであるため、少量の添加で十分に金属成分の溶出を抑制することができる。これらカルボン酸塩の含有量が0.001%未満では、平衡反応による溶出抑制能力が不足し、合金中から微量金属成分が溶出し始める場合がある。逆に0.45%を超えて含有すると、洗浄剤中に存在するフリーカルボン酸量が多くなりすぎるため、酸の影響で合金中から金属成分が溶出する場合がある。(B)成分を、洗浄剤組成物の0.001〜1重量%用いることにより、特に銅合金の変色抑制効果が向上するため好ましい。(C)成分を洗浄剤組成物の40〜99重量%用いることにより、フラックス成分の溶解性が向上するため好ましい。 Although the usage-amount of (A)-(C) component is not specifically limited, Usually, (A) component is about 0.001-0.45 weight% of a cleaning composition, Preferably it is 0.005-0.4 weight. %, More preferably 0.01 to 0.35% by weight, and component (B) is about 0.001 to 1% by weight of the detergent composition, preferably 0.01 to 0.1% by weight, and component (C) Is added in an amount of about 40 to 99% by weight, preferably 70 to 99% by weight. It is preferable to contain the component (A) in the above ratio in the cleaning agent because elution of trace metal components in the alloy can be suppressed. Since suppression of the elution of the trace metal component in the alloy utilizes the equilibrium reaction of the carboxylate, the elution of the metal component can be sufficiently suppressed with a small amount of addition. If the content of these carboxylates is less than 0.001%, the ability to suppress elution due to equilibrium reaction is insufficient, and trace metal components may begin to elute from the alloy. On the other hand, if the content exceeds 0.45%, the amount of free carboxylic acid present in the cleaning agent becomes excessive, and the metal component may be eluted from the alloy due to the influence of the acid. It is preferable to use the component (B) in an amount of 0.001 to 1% by weight of the cleaning composition because the discoloration suppressing effect of the copper alloy is particularly improved. It is preferable to use 40 to 99% by weight of the component (C) because the solubility of the flux component is improved.
なお、当該洗浄剤組成物には、さらに、(D)ノニオン性界面活性剤(以下、(D)成分という)、(E)ポリオキシアルキレンリン酸エステル系界面活性剤(以下、(E)成分という)および(F)ポリオキシアルキレンアミン系界面活性剤(以下、(F)成分という)からなる群より選ばれる少なくとも一種を混合しても良い。 The detergent composition further includes (D) a nonionic surfactant (hereinafter referred to as (D) component), (E) a polyoxyalkylene phosphate ester-based surfactant (hereinafter referred to as (E) component). And (F) a polyoxyalkyleneamine surfactant (hereinafter referred to as “component (F)”) may be mixed.
(D)成分としては、そのイオン性がノニオン性であれば特に制限されず、公知のものを使用することができる。具体的には、例えば、ポリオキシエチレンアルキル(C6以上)エーテル、ポリオキシエチレンフェニルエーテル、ポリオキシエチレンアルキルフェニルエーテル等のポリエチレングリコールエーテル型ノニオン性界面活性剤;ポリエチレングリコールモノエステル、ポリエチレングリコールジエステル等のポリエチレングリコールエステル型ノニオン性界面活性剤;高級脂肪族アミンのエチレンオキサイド付加物;脂肪酸アミドのエチレンオキサイド付加物;ソルビタン脂肪酸エステル、ショ糖脂肪酸エステル等の多価アルコール型ノニオン性界面活性剤;脂肪酸アルカノールアミド等、さらにはこれらに対応するポリオキシプロピレン系ノニオン性界面活性剤およびポリオキシエチレンポリオキシプロピレン共重合型ノニオン性界面活性剤をあげることができる。これらノニオン性界面活性剤は1種単独でまたは2種以上組み合わせて使用できる。これらの中では洗浄力の点から、好ましいものは、ポリエチレングリコールエーテル型ノニオン界面活性剤であり、さらに好ましいものとしては一般式(6):R6O−(CH2CH2O)m−H(式中、R6は炭素数6〜20の直鎖もしくは分岐鎖のアルキル基、フェニル基、または炭素数7〜12の直鎖もしくは分岐鎖アルキル基で置換されたフェニル基を、mは2〜20の整数を示す。)で表されるポリエチレングリコールエーテル型のノニオン性界面活性剤を用いることが好ましい。 The component (D) is not particularly limited as long as its ionicity is nonionic, and known components can be used. Specifically, for example, polyethylene glycol ether type nonionic surfactants such as polyoxyethylene alkyl (C6 or more) ether, polyoxyethylene phenyl ether, polyoxyethylene alkyl phenyl ether; polyethylene glycol monoester, polyethylene glycol diester, etc. Polyethylene glycol ester type nonionic surfactants; ethylene oxide adducts of higher aliphatic amines; ethylene oxide adducts of fatty acid amides; polyhydric alcohol type nonionic surfactants such as sorbitan fatty acid esters and sucrose fatty acid esters; fatty acids Alkanolamide, etc., and corresponding polyoxypropylene nonionic surfactants and polyoxyethylene polyoxypropylene copolymer type nonionic surfactants It can be mentioned. These nonionic surfactants can be used alone or in combination of two or more. Among these, from the viewpoint of detergency, preferred are polyethylene glycol ether type nonionic surfactants, and more preferred are those represented by general formula (6): R 6 O— (CH 2 CH 2 O) m —H. (In the formula, R 6 represents a linear or branched alkyl group having 6 to 20 carbon atoms, a phenyl group, or a phenyl group substituted with a linear or branched alkyl group having 7 to 12 carbon atoms; It is preferable to use a polyethylene glycol ether type nonionic surfactant represented by the following formula: ~ 20.
(E)成分としては、ポリオキシアルキレンリン酸エステル系界面活性剤であれば特に制限されず、公知のものを使用することができるが、一般式(7):R7O−(CH2CH2O)n−PO(OH)X(式中、R7 は炭素数5〜20の直鎖もしくは分岐鎖のアルキル基、フェニル基、または炭素数7〜12の直鎖もしくは分岐鎖のアルキル基で置換されたフェニル基を、nは0〜20の整数、Xは水酸基または一般式(8):R8O−(CH2CH2O)n−(式中、R8 は炭素数5〜20の直鎖もしくは分岐鎖のアルキル基、フェニル基、または炭素数7〜12の直鎖もしくは分岐鎖のアルキル基で置換されたフェニル基を、nは前記と同じを示す。)で表される基を示す。)で表されるポリオキシエチレンリン酸エステル系界面活性剤またはその塩を用いることで、特に水で希釈して使用する際に、優れた洗浄性向上効果があるため好ましい。なお、かかる塩としては、ナトリウム塩、カリウム塩などの金属塩、アンモニウム塩、アルカノールアミン塩などが例示できる。 The component (E) is not particularly limited as long as it is a polyoxyalkylene phosphate ester-based surfactant, and a known one can be used, but the general formula (7): R 7 O— (CH 2 CH 2 O) n -PO (OH) X (wherein R 7 is a linear or branched alkyl group having 5 to 20 carbon atoms, a phenyl group, or a linear or branched alkyl group having 7 to 12 carbon atoms. N is an integer of 0 to 20, X is a hydroxyl group or R 8 O— (CH 2 CH 2 O) n — (wherein R 8 has 5 to 5 carbon atoms) 20 represents a linear or branched alkyl group, a phenyl group, or a phenyl group substituted with a linear or branched alkyl group having 7 to 12 carbon atoms, and n represents the same as above. Polyoxyethylene phosphate ester-based interface represented by The use of sex, or a salt thereof, when used in particular dilution with water, the preferred because of the excellent cleaning property improving effect. Examples of such salts include metal salts such as sodium salts and potassium salts, ammonium salts, and alkanolamine salts.
(F)成分としては、ポリオキシアルキレンアミン系界面活性剤であれば特に制限されず、公知のものを使用することができる。これらの中では、洗浄性、環境特性、引火性の点から、一般式(9): The component (F) is not particularly limited as long as it is a polyoxyalkylene amine surfactant, and known components can be used. Among these, general formula (9): from the viewpoints of cleanability, environmental characteristics, and flammability
これら(D)〜(F)成分を使用する場合には、その使用量は特に制限されないが、(D)成分を、通常、洗浄剤組成物の0.1〜60重量%程度、好ましくは1〜30重量%含有するのがよい。0.1重量%未満では水すすぎ時のすすぎ性が著しく低下する傾向があり、60重量%を超えて含有すると、相対的に(C)成分の含有量が減少し洗浄性が低下する傾向がある。(E)成分を、通常、洗浄剤組成物の0.1〜60重量%程度、好ましくは0.5〜10重量%含有するのがよい。0.1重量%未満では水希釈時の洗浄性向上効果が低く、60重量%を超えて含有すると、余剰の添加となり効果の向上がみられないばかりか、むしろ被洗浄物に対する腐食等の影響が出ることがあり好ましくない。(F)成分を、通常、洗浄剤組成物の0.1〜60重量%程度、好ましくは0.5〜10重量%含有するのがよい。0.1重量%未満だと、水希釈時の洗浄性向上効果が低く、60重量%を超えて含有すると、余剰の添加となり効果の向上がみられないばかりか、むしろ被洗浄物に対する腐食等の影響が出ることがあり好ましくない。なお、(D)〜(F)成分は、いずれか一成分を単独で添加しても良くまた2以上の成分を組み合わせて用いてもよいが、(D)〜(F)成分すべてを添加した場合に、洗浄性が良好となるため好ましい。 When these components (D) to (F) are used, the amount used is not particularly limited, but the component (D) is usually about 0.1 to 60% by weight of the detergent composition, preferably 1 It is good to contain -30% by weight. If the amount is less than 0.1% by weight, the rinsing property at the time of rinsing with water tends to be remarkably lowered. If the amount exceeds 60% by weight, the content of the component (C) is relatively reduced and the detergency tends to be lowered. is there. (E) It is good to contain a component normally about 0.1 to 60 weight% of a cleaning composition, Preferably it is 0.5 to 10 weight%. If it is less than 0.1% by weight, the effect of improving detergency when diluted with water is low, and if it exceeds 60% by weight, not only will it be added excessively but the effect will not be improved. May occur, which is not preferable. (F) It is good to contain a component normally about 0.1 to 60 weight% of a cleaning composition, Preferably it is 0.5 to 10 weight%. If it is less than 0.1% by weight, the effect of improving detergency when diluted with water is low, and if it exceeds 60% by weight, not only will it be added excessively but the effect will not be improved, but rather corrosion on the object to be cleaned, etc. It is not preferable because of the influence of. In addition, although (D)-(F) component may add any one component independently and may use it in combination of 2 or more components, (D)-(F) all components were added. In this case, it is preferable because the cleaning property is improved.
本発明の洗浄剤組成物は、(A)〜(C)成分を必須成分とし、さらに必要に応じて(D)〜(F)成分を含有するものであるが、さらに水を含有させることにより、引火点が消滅する等、安全性が向上することができるため、水を添加し水溶液として使用することもできる。かかる場合には、通常、前記洗浄剤組成物の濃度が10重量%程度以上となるよう調整する。洗浄性の点から、前記洗浄剤組成物の濃度が50〜98重量%程度になるようにするのが好ましい。 The cleaning composition of the present invention comprises the components (A) to (C) as essential components, and further contains components (D) to (F) as necessary, but further contains water. Since the safety can be improved, for example, the flash point disappears, water can be added and used as an aqueous solution. In such a case, the concentration of the cleaning composition is usually adjusted to be about 10% by weight or more. From the viewpoint of detergency, it is preferable that the concentration of the detergent composition is about 50 to 98% by weight.
なお、本発明の洗浄剤組成物を水溶液として使用する場合のそのpHは、特に制限されないが、洗浄剤組成物を5重量%水溶液とした場合に、5.5〜8.0程度を示すように調製することが、洗浄対象を侵さないため好ましい。 In addition, the pH in particular when using the cleaning composition of this invention as aqueous solution is although it does not restrict | limit, When a cleaning composition is made into 5 weight% aqueous solution, it will show about 5.5-8.0. It is preferable to prepare it in such a manner that the object to be cleaned is not affected.
本発明の洗浄剤組成物は、スズ含有合金製部品の洗浄において良好な洗浄性および変色防止効果を示す。スズ含有合金としては、具体的には、例えば、青銅(銅−スズ合金)、りん青銅(銅−スズ−リン合金)、共晶ハンダ合金(スズ−鉛合金)、鉛フリーハンダ合金(スズ−銀−銅合金など)等が挙げられる。これらの中でも、特に、スズ含有合金としてスズを含有する銅合金に用いた場合に、高い洗浄性および変色防止効果を示す。 The cleaning composition of the present invention exhibits good cleaning properties and anti-discoloration effect in cleaning of tin-containing alloy parts. Specific examples of the tin-containing alloy include bronze (copper-tin alloy), phosphor bronze (copper-tin-phosphorus alloy), eutectic solder alloy (tin-lead alloy), and lead-free solder alloy (tin- Silver-copper alloy, etc.). Among these, particularly when used for a copper alloy containing tin as a tin-containing alloy, it exhibits high detergency and anti-discoloration effect.
さらに本発明の洗浄剤組成物には、必要により消泡剤、防錆剤、酸化防止剤などの添加剤を配合することができる。該添加剤の使用量は洗浄剤に対して0.1%程度以下とされる。 Furthermore, additives, such as an antifoamer, a rust inhibitor, and antioxidant, can be mix | blended with the cleaning composition of this invention as needed. The amount of the additive used is about 0.1% or less with respect to the cleaning agent.
本発明の洗浄剤組成物を用いて、被洗浄物を洗浄するにあたっては、各種の洗浄方法を採用できるが、以下に、一般的な洗浄方法として、電子部品上のロジンフラックスに接触させる場合について説明する。すなわち、洗浄剤組成物に電子部品を直接浸漬して洗浄する方法、該水溶液を、スプレー装置を使用してフラッシュする方法、あるいは機械的手段によりブラッシングする方法などを適宜選択して採用することができる。フリップチップ実装基板を洗浄する場合、50μm以下の隙間に洗浄剤を通液させなければならず、ダイレクトパス洗浄装置(荒川化学工業株式会社製、商品名、特許第2621800号)を用いて洗浄するのが最適である。 In cleaning an object to be cleaned using the cleaning composition of the present invention, various cleaning methods can be employed. In the following, as a general cleaning method, the rosin flux on the electronic component is contacted. explain. That is, a method of directly immersing and cleaning an electronic component in a cleaning composition, a method of flushing the aqueous solution using a spray device, or a method of brushing by a mechanical means may be appropriately selected and employed. it can. When cleaning a flip chip mounting substrate, the cleaning agent must be passed through a gap of 50 μm or less, and cleaning is performed using a direct pass cleaning device (trade name, Japanese Patent No. 2621800, manufactured by Arakawa Chemical Industries, Ltd.). Is the best.
また、洗浄剤組成物を適用する際の条件は、洗浄剤組成物中の洗浄剤成分の濃度、該成分の使用割合、除去すべきフラックスの種類等により適宜選択すればよく、一般に除去すべきフラックスを洗浄除去するのに有効な温度と時間で洗浄剤をフラックスに接触させる。洗浄剤組成物の使用時の温度は20℃程度から80℃程度である。これは使用温度が20℃よりも低い場合にはフラックスの溶解性が悪くなるため、また、80℃よりも高くなる場合には水分等の蒸発のために洗浄が不可能になるためである。これらのことから通常は50〜70℃程度とするのが好ましい。電子部品上のフラックスを、例えば60℃程度の温度において浸漬法により除去する場合には、一般に本発明の洗浄剤組成物にハンダフラックスを有する電子部品を約1〜20分程度浸漬すれば、良好に除去することができる。 In addition, the conditions for applying the cleaning composition may be appropriately selected depending on the concentration of the cleaning component in the cleaning composition, the use ratio of the component, the type of flux to be removed, and the like, and should generally be removed. The cleaning agent is brought into contact with the flux at a temperature and time effective to clean and remove the flux. The temperature at the time of use of a cleaning composition is about 20 degreeC to about 80 degreeC. This is because the solubility of the flux deteriorates when the use temperature is lower than 20 ° C., and when the temperature is higher than 80 ° C., cleaning becomes impossible due to evaporation of moisture and the like. Therefore, it is usually preferable to set the temperature to about 50 to 70 ° C. When removing the flux on the electronic component by, for example, the dipping method at a temperature of about 60 ° C., it is generally good if the electronic component having the solder flux is immersed in the cleaning composition of the present invention for about 1 to 20 minutes. Can be removed.
こうしてフラックスを除去された電子部品は仕上げ処理として、洗浄剤組成物による洗浄のあとに、プレリンス処理、仕上げリンス処理の水すすぎ処理を行い残留している可能性のある洗浄剤組成物を完全に除去する。また、本発明においては、合金の種類等により必要に応じて、特許文献3記載の水すすぎ剤を使用してもよい。このような水洗処理により、基板の清浄度は、非常に高いものとなる。 The electronic component from which the flux has been removed in this way is subjected to a pre-rinsing process and a water rinse process for the final rinsing process after the cleaning with the cleaning composition to completely remove the remaining cleaning composition. Remove. Moreover, in this invention, you may use the water rinse agent of patent document 3 as needed by the kind etc. of an alloy. By such water washing treatment, the cleanliness of the substrate becomes very high.
以下、実施例を挙げ、本発明をさらに詳しく説明するが、本発明はこれら実施例のみに限定されるものではない。なお、各例の部および%は重量基準である。 EXAMPLES Hereinafter, although an Example is given and this invention is demonstrated in more detail, this invention is not limited only to these Examples. In addition, the part and% of each example are a basis of weight.
以下の表1、実施例1〜8、比較例1〜2のような組成の洗浄剤を調整した。 The cleaning agents having the compositions shown in Table 1 below, Examples 1 to 8 and Comparative Examples 1 and 2 were prepared.
表1中、成分(A)は一般式(1)あるいは(2)で表される有機カルボン酸塩であり、a1はオクチル酸スズ、a2はオレイン酸スズを示す。成分(B)は窒素系複素環化合物であり、b1はベンゾトリアゾール、b2は1−メチルベンゾトリアゾールを示す。成分(C)は有機溶剤であり、c1はジエチレングリコールモノブチルエーテル、c2は1,3−ジメチルイミダゾリジノンを示す。成分(D)はノニオン性界面活性剤であり、dはポリエチレングリコールアルキルエーテル型ノニオン性界面活性剤(第一工業製薬(株)製、商品名「ノイゲンET−135」、一般式(6)においてR6が炭素数12〜14の分岐鎖アルキル基、mが9であるもの)を示す。成分(E)はポリオキシアルキレンリン酸エステル系界面活性剤であり、eはポリオキシエチレンアルキルエーテルのリン酸モノエステル(一般式(7)においてR7が炭素数12の直鎖アルキル基、nが16、Xが水酸基であるもの)を示す。成分(F)はポリオキシアルキレンアミン系界面活性剤であり、fはポリオキシエチレンアルキルアミン(一般式(9)においてR9が炭素数12の直鎖アルキル基、p+qが10、Zが水素原子であるもの)を示す。 In Table 1, the component (A) is an organic carboxylate represented by the general formula (1) or (2), a1 represents tin octylate, and a2 represents tin oleate. Component (B) is a nitrogen-based heterocyclic compound, b1 represents benzotriazole, and b2 represents 1-methylbenzotriazole. Component (C) is an organic solvent, c1 represents diethylene glycol monobutyl ether, and c2 represents 1,3-dimethylimidazolidinone. Component (D) is a nonionic surfactant, d is a polyethylene glycol alkyl ether type nonionic surfactant (Daiichi Kogyo Seiyaku Co., Ltd., trade name “Neugen ET-135”, in general formula (6) R 6 is a branched alkyl group having 12 to 14 carbon atoms, and m is 9. Component (E) is a polyoxyalkylene phosphate ester surfactant, e is a polyoxyethylene alkyl ether phosphate monoester (in formula (7), R 7 is a linear alkyl group having 12 carbon atoms, n 16 and X is a hydroxyl group). Component (F) is a polyoxyalkyleneamine surfactant, f is a polyoxyethylene alkylamine (in formula (9), R 9 is a linear alkyl group having 12 carbon atoms, p + q is 10, Z is a hydrogen atom That is).
実施例および比較例で得られた各種洗浄剤組成物を以下の試験に供した。 Various detergent compositions obtained in Examples and Comparative Examples were subjected to the following tests.
ダイオードがハンダ(スズ/鉛=5/95ハンダ)実装された 銅合金 NB109(日本ベルパーツ(株)製、組成 Cu/Ni/Sn/P=98.1/1.0/0.9/0.05)製リードフレームをダイレクトパス洗浄装置(荒川化学工業株式会社製)を用い、実施例1〜8、比較例1〜2の洗浄剤にて、50℃加温下、4分間洗浄し、次いで、特許文献3記載の水すすぎ剤(荒川化学工業株式会社製、商品名「パインアルファST−700BR」、0.1%水溶液)にて、30℃で、各4分間、2回すすぎ後、60℃下、5分間、熱風乾燥を行った。当該洗浄にて得られた被洗浄物について、(1)洗浄性(フラックス除去度)、(2)清浄度、(3)表面変色度の評価を行った。 Copper alloy NB109 (manufactured by Nippon Bell Parts Co., Ltd., composition Cu / Ni / Sn / P = 98.1 / 1.0 / 0.9 / 0) on which the diode is mounted by solder (tin / lead = 5/95 solder) .05) Using a direct pass cleaning device (Arakawa Chemical Industries, Ltd.), the lead frame manufactured was cleaned with the cleaning agents of Examples 1 to 8 and Comparative Examples 1 and 2 at 50 ° C. for 4 minutes, Next, after rinsing twice for 4 minutes each at 30 ° C. with a water rinsing agent described in Patent Document 3 (trade name “Pine Alpha ST-700BR”, 0.1% aqueous solution, manufactured by Arakawa Chemical Industries, Ltd.) Hot air drying was performed at 60 ° C. for 5 minutes. About the to-be-cleaned object obtained by the said washing | cleaning, (1) Detergency (Flux removal degree), (2) Cleanliness degree, (3) Surface discoloration degree was evaluated.
(1)洗浄性(フラックス除去度)
ハンダ実装部のフラックス除去の度合いを、以下の判定基準に基づき、光学顕微鏡(50倍、キーエンス(株)製、商品名「VH−8000」)を用いて目視判定した。結果を表2に示す。
○:良好に除去できる。 △:若干残存する。 ×かなり残存する。
(1) Detergency (degree of flux removal)
The degree of flux removal of the solder mounting portion was visually determined using an optical microscope (50 times, manufactured by Keyence Corporation, trade name “VH-8000”) based on the following criteria. The results are shown in Table 2.
○: Can be removed satisfactorily. Δ: Some remaining. X It remains quite.
(2)清浄度
前記洗浄、乾燥後リードフレームを、オメガメーター600−RC(アルファメタルズ社製)を用いて、清浄度(残留イオン濃度)を測定した。結果を表2に示す。
(2) Cleanliness The cleanliness (residual ion concentration) of the lead frame after washing and drying was measured using an omega meter 600-RC (manufactured by Alpha Metals). The results are shown in Table 2.
(3)表面変色度
前記洗浄、乾燥後リードフレーム表面変色度を、以下の判定基準に基づき、目視判定した。結果を表2に示す。
○:変色なし。 △:リードフレーム表面に若干変色、シミが見られる。×:リードフレーム表面が激しく変色する。
(3) Surface discoloration The lead frame surface discoloration after washing and drying was visually determined based on the following criteria. The results are shown in Table 2.
○: No discoloration. Δ: Some discoloration and spots are observed on the surface of the lead frame. X: The lead frame surface is severely discolored.
当該洗浄剤組成物は高い清浄度が要求されるスズ含有合金製部品の洗浄に用いることができる。 The said detergent composition can be used for washing | cleaning of the components made from a tin containing alloy by which high cleanliness is requested | required.
Claims (13)
The cleaning method according to claim 12, wherein the tin-containing alloy part is a copper alloy part containing tin.
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WO2007119392A1 (en) * | 2006-03-17 | 2007-10-25 | Arakawa Chemical Industries, Ltd. | Cleaner composition for removal of lead-free soldering flux, rinsing agent for removal of lead-free soldering flux, and method for removal of lead-free soldering flux |
JP5995092B2 (en) * | 2013-02-20 | 2016-09-21 | 荒川化学工業株式会社 | Cleaning composition for removing polyamideimide resin |
JP6243792B2 (en) * | 2014-05-12 | 2017-12-06 | 花王株式会社 | Manufacturing method of circuit board on which solder is solidified, manufacturing method of circuit board on which electronic parts are mounted, and cleaning composition for flux |
JP2024112297A (en) * | 2023-02-07 | 2024-08-20 | 花王株式会社 | Flux cleaning composition |
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