JP4168389B2 - Thin wire chip manufacturing method and manufacturing apparatus - Google Patents

Thin wire chip manufacturing method and manufacturing apparatus Download PDF

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Publication number
JP4168389B2
JP4168389B2 JP2003168175A JP2003168175A JP4168389B2 JP 4168389 B2 JP4168389 B2 JP 4168389B2 JP 2003168175 A JP2003168175 A JP 2003168175A JP 2003168175 A JP2003168175 A JP 2003168175A JP 4168389 B2 JP4168389 B2 JP 4168389B2
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wire
fine
wires
stranded
cutting
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JP2005005532A (en
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雄一 西
司 三家本
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Proterial Ltd
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Hitachi Metals Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/43Manufacturing methods
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00011Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01015Phosphorus [P]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01047Silver [Ag]

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Processing (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a material for a thin wire chip capable of manufacturing a high-quality and low-cost fine metal ball. <P>SOLUTION: The problem can be solved by cutting a twisted wire to at least two thin wires twisted in a predetermined length in a longitudinal direction. <P>COPYRIGHT: (C)2005,JPO&amp;NCIPI

Description

【0001】
【発明の属する技術分野】
本発明は、細線チップを製造する技術に係るものであり、詳しくは、細線チップを溶融し、球状化させて微小な金属球を得る溶融法において用いられる細線チップを得るに好適な製造装置および製造方法に関するものである。
【0002】
【従来の技術】
近年、真球度が高く、直径の揃った微小金属球が様々な分野で要求されている。例えば電子機器の分野では、FC(Flip Chip)、BGA(BallGrid Array)、或いはCSP(Chip Size Package)などエリアアレイ型の接続端子を有するパッケージが広く用いられるようになっている。エリアアレイ型パッケージは、並設された入出力用の接続端子をその裏面に有し、例えば表面に半田が被覆された銅ボールや半田ボールなど微小金属球がその接続端子に配列され、実装基板上に搭載され、一括リフローされることにより、実装基板と接続される。
【0003】
電子機器の高性能化および小型、薄型化に伴い、パッケージは多端子化するとともに接続端子の配列ピッチは狭小化する傾向にある。そのようなパッケージにパッケージングされる電子部品を実装基板に実装する場合や、そのようなパッケージを実装基板に実装する場合には、平面方向において高精度に位置合わせをする必要がある。さらに一部の電子機器では、耐衝撃性や放熱性の改善のため、高さ方向、つまり電子部品或いはパッケージと実装基板との間の空隙を高精度に保持する必要がある。すなわち、このような電子機器において、電子部品或いはパッケージと実装基板とを接続する微小金属球は、互いを電気的に導通させるのみならず、空隙を保持するためのスペーサとしても機能するものである。その空隙の間隔は数百μm以下であり、さらにその間隔を一様に保持する必要がある。したがって、スペーサとして機能する微小金属球としては、その直径が数百μm以下と径小で、直径のバラツキが小さく、さらに真球度が高いものが採用される。
【0004】
通常、電気的導通のみを目的とした微小金属球としては、融点の低いSn基のはんだ合金を主体としたものが使用される。しかしながら、スペーサとしての機能が要求される用途では、リフロー時の変形を避けるために、融点の高いCu等を主体とした微小金属球にはんだ合金を被覆したものが採用される。
【0005】
なお上記説明以外でも、例えば機械装置の分野において、小型ベアリング用のボールとしてステンレスを主体とした真球度が高く直径の揃った微小金属球が望まれている。
【0006】
前記微小金属球は、例えば、その体積と同一の体積を有する細線を切断した同材質の細線チップを準備し、細線チップを、その融点より高温の油中に投入し、溶融した細線チップの表面張力で球状化させ、微小金属球を得る油中溶融法、或いは細線チップの融点より高温の雰囲気に加熱された炉芯管に投入し、自由落下させながら球状化させる気中溶融法など、溶融法により製造される。
【0007】
溶融法で用いる前記細線チップの製造方法の一例が下記特許文献1に開示されている。特許文献1には、「複数本の金属細線を束ねて塩化ビニール等の樹脂で被覆し、これを一定長さに切断した後に被覆をはがして、一定長さの金属線を取り出」し、或いは「複数本の金属線をテープの間に平行に並べて挟み込み、このテープを一定幅に切断してから金属線を取り出」し、微小金属球の材質と同一の金属からなる細線を長手方向に定寸切断して細線チップを得る製造方法が提案されている。
【0008】
特許文献1で例示される細線を定寸切断し細線チップを得る方法によれば、長手方向に一定の直径を有する細線を定寸切断することにより、体積のバラツキ範囲の少ない細線チップを容易に得ることができ、従って、前記溶融法において、直径のバラツキが小さな微小金属球を製造することができる。
【0009】
さらに、特許文献1の方法によれば、樹脂やテープなど結束剤で束ねられた複数本の細線を定寸切断するので細線チップを効率的に製造できるとともに、金属細線の直径が径小になった場合でも、径小化による金属細線の剛性低下に起因する切断精度の低下、切断不良または金属細線自体の破断などの現象の発生を抑制することが可能となり、さらに体積のバラツキの少ない細線チップを得ることができるという利点がある。
【0010】
しかしながら、特許文献1の製造方法によれば、複数本の金属細線を結束剤(樹脂、テープ)で束ねる必要があり、金属細線を切断した後に結束剤を細線チップから除去する工程が別途必要になるためコスト高になるという経済的な問題があった。さらに、樹脂やテープの除去が不完全な場合にはその残渣が微小金属球に混入するという品質上の問題があった。
【0011】
【特許文献1】
特開平3−180401号公報
【0012】
【発明が解決しようとする課題】
本発明は、上述した問題を解決するため本発明者らが鋭意検討しなされたものであり、品質が高く低コストな微小金属球を製造可能な細線チップの製造装置および製造方法を提供することを目的としている。
【0013】
【課題を解決するための手段】
上記目的は、少なくとも2本の細線が撚り合わされた撚り線をその長手方向に所定長さに切断する本発明により達成される。すなわち、本発明の製造方法によれば、細線が寄り合わされた、つまり所定のピッチで互いに巻回されてなる撚り線は、単一の細線に比べて剛性が高いので細線チップの体積バラツキを小さくすることができ直径の揃った微小金属球が製造されるとともに、細線を束ねる際に結束剤を用いる必要がないので、結束剤の除去工程が不要となり経済的に微小金属球が製造され、また、結束剤の残渣が混入することがない高品質な微小金属球が製造される。なお、細線の断面形状は、略円形状または略矩形状、略三角形状など種々の形状を選択することができる。
【0014】
さらに、前記細線を撚り合わせて撚り線を形成する工程で撚り線を形成しつつ、その撚り線をその長手方向に所定の長さに切断すれば、予め撚り線を準備する必要がなく、したがって、所望の撚り線を任意に形成することができ生産の自由度が高いので好ましい。
【0015】
さらに、上記発明において、撚り線の切断部位に流体(例えば空気や窒素など気体、或いは水や油など液体)を吹付ければ、切断された撚り線は流体により即座に解かれて個々に分離され、効率的に細線チップを得ることができるので好ましい。
【0016】
上記発明は、少なくとも2本の細線を撚り合わせて撚り線を形成する撚り線形成部と、撚り線をその長手方向に所定の長さ切断する切断部とを有する本発明の製造装置により実施される。さらに、撚り線が切断される位置に流体を吹付ける流体供給手段を設けることで、切断された撚り線を個々に分離する上記発明が実施される。
【0017】
なお、細線のうち少なくとも一本を芯線とし、残余の細線を該芯線に巻回して撚り線を形成すれば、撚り線の屈曲が抑制され、搬送時や切断時の撓みが少ないためにより切断不良が低減され好ましい。さらに、前記芯線を1本とし、その芯線に6本の細線を巻回したものとすれば、その切断端部の解け方を一様にでき、もって細線チップの体積バラツキを小さくできるので好ましい。
【0018】
細線の直径は特に限定されるものではないが、剛性が低下し切断不良の生じやすい直径100μm以下の細線を切断して細線チップを製造する場合において本発明は好適である。
【0019】
なお、細線を巻回するピッチを小さくすれば撚り線の剛性を高くすることができるが、細線が斜めに切断されるため得られる細線チップの体積のバラツキが大きくなり、さらに、端部が解けにくく切断不良が生じやすい。また、細線の巻回ピッチを大きくすれば、切断端部は解けやすく得られる細線チップの体積バラツキも少ないが、素材の剛性が低下するため切断不良が生じやすい。もって、細線の巻回ピッチは、細線チップの長手方向の長さより大きく、撚り線の剛性を維持できるピッチを選択する必要がある。
【0020】
さらに、細線の素材は特に限定されることはなく、例えばNiまたはW、Mo、Snを主体としたものでもよいが、前記パッケージに採用する微小金属球を製造するためには、CuまたはAu、Agを主体とした細線であることが望ましい。
【0021】
【発明の実施の形態】
本発明の製造方法および製造装置ついて図面を参照し説明する。
[実施態様1]
図1、2は、細線を撚り合わせてなる撚り線の断面図と平面図であり、本発明の第1態様を説明する図である。図3は、図1の撚り線を切断し、細線チップを製造する製造装置の概略構成図である。
【0022】
本発明で細線チップを製造するために用いられる撚り線1は、図1に示すように、少なくとも2本(本態様では6本)の細線11を有し、それぞれの細線11が互いに所定のピッチPで巻回され、撚り合わされてなるものである。このように複数本の細線11を互いに巻回することにより細線11同士が撚られた状態となり、接着剤などを用いることなく機械的に結束された細線11により剛性の高い素材1が形成される。
【0023】
さらに、図2に示すように、基本的には前記撚り線1と同様であるが、複数本の細線21のうち少なくとも1本を芯線211とし、残余(本態様では6本)の細線212は芯線211に所定のピッチPで巻回された撚り線2とすれば、撚り線1と同様に細線21同士は機械的に結束される一方で、撚り線2の中心部に位置する芯線211により撚り線2自体の屈曲が抑制されるので好ましい。
【0024】
予め準備された上記撚り線1,2は、図3に一例を示すように、その長手方向に所定の長さに切断する切断部31を具備した製造装置3により、その長手方向に所定の長さに切断され、細線チップとなる。
【0025】
この製造装置3の構成について詳しく説明する。上記切断部31は、供給された撚り線1,2を所定の長さ毎に下方(一方)へ間欠的に送り出す送りユニット32と、所定の長さ毎に送り出された撚り線1,2を切断する切断ユニット33とを有している。なお、撚り線1,2は、例えば図示するようにボビン34に予め巻き取っておき、ガイドローラなどで支持されながら送りユニット32へ供給される。
【0026】
送りユニット32は、図示するように、ボビン34から供給された撚り線1,2を挟持する一対のローラ321を有し、一方のローラは、その回転を制御する制御装置(図示せず。)によって所定の回転角度毎に間欠的に回転可能になされている。従って、ローラ321に挟持された撚り線1,2は、所定の長さ毎に下方に送り出されることとなる。
【0027】
切断ユニット33は、上記送線ユニット32から送り出された撚り線1,2が挿通可能な孔部351が形成されたダイ35と、撚り線1,2の長手方向に対し略直交する方向に横動可能でダイ33の下方に配設された撚り線1,2を切断するカッター36とを有している。カッター36は、前記制御装置の制御により前記一方のローラ321の回転動作に同期して間欠的に作動され、したがって、送り出された撚り線1,2は所定の長さ毎に切断される。
孔部351の直径は、孔部351の中での撚り線1,2のふらつきを防止して切断精度の低下や切断不良を抑制するために、撚り線1,2の直径に対し5倍以下とすることが望ましい。さらに、孔部351の直径が小さい場合には、孔部351の内壁に撚り線1,2が接触し易く、撚り線1,2の断線や引掛りによる送り不良が生じやすいので、撚り線1,2の直径に対し2倍以上とすることが望ましい。さらに加えて、3倍以上〜4倍以下とすれば好適である。
【0028】
上記により切断された撚り線1,2は機械的に撚り合わされているので、その殆どは自然に解けて個々に分離するが、例えば切断後の撚り線1,2に超音波振動や空気の吹付けなど所定の外力を作用させれば、より確実に細線チップを分離することができる。
【0029】
なお、撚り線1,2を切断し細線チップを製造する装置の構成は、上記説明に限定されることなく、例えば、撚り線1,2を連続的に送り出しながら、カッターを間欠的に作動させて、所定の長さ毎に撚り線1,2を切断する構成としてもよい。さらに、複数毎の刃が等ピッチで並列された鋸刃状のカッターで連続的に送り出される撚り線を切断する構成としてもよい。
【0030】
[実施態様2]
本発明の第2態様について図4を参照し説明する。図4は、第2態様の製造装置の概略構成図であり、図1〜3と同一の構成については同一の符号を付しその詳細な説明を省略する。
【0031】
図4に示す製造装置4は、上記と同様な切断部31と、少なくとも2本以上の細線11,21を撚り合わせて撚り線1,2を形成する撚り線形成部41とを有している。なお、細線11、21は、例えば図示するようにボビン44に予め巻き取っておき撚り線形成部41へ供給され、撚り線形成部41で形成された撚り線1,2は、ガイドローラなどで支持されながら切断部31へ供給される。
【0032】
撚り線形成部41は、例えばワイヤロープや電線、化学繊維を製造する際に用いられる線材を撚り合わせる周知の構成、例えば特開平10−193018号公報に例示されるような細線を撚り合わせる構成を有しており、図1に示すように所定のピッチPで細線11を互いに巻回し、或いは図2に示すように所定のピッチPで細線21を芯線211の周囲に巻回し、撚り線1,2を形成する。
【0033】
かかる構成の製造装置4によれば、少なくとも2本以上の細線11、21を撚り線形成部41で撚り合わせて撚り線1,2を形成する工程で撚り線1,2を形成しつつ、その撚り線1,2をその長手方向に所定の長さに切断部31で切断することにより、細線チップが形成される。この第2態様の切断装置4によれば、予め撚り線1,2を準備することなく、所望の直径の細線11,21により任意の撚り線1,2を形成することができる。
【0034】
なお、図3,4に示すように、撚り線1,2が切断される部位に流体371を吹付ける流体供給手段37を設ければ、流体371の圧力により切断された撚り線1,2はその位置で解かれて個々の細線チップに分離される。したがって、細線チップの分離の信頼性をより向上できるとともに、効率的に細線チップが製造される。
なお、前記流体371としては、空気が最も低コストであるが、細線チップの切断面の酸化を抑制したい場合には不活性ガス(窒素、アルゴンなど)を採用すればよい。また、流体371の圧力を高めたい場合には、水や油などを主体とした液体を採用すればよい。この流体371の流量が過剰になると撚り線1,2が振動し、安定した切断が困難となるので、撚り線1,2の強度および製造条件により適切な流量を設定する必要がある。例えば、Cuを主体としたφ50μmの細線が図2に示すように7本撚り合わせてなる撚り線2を、流体371として空気を採用した図3の製造装置3で切断した場合の空気の流量の最適な範囲は、0.02〜0.03(MPa)であった。
【0035】
次に、上記第1および第2態様の製造装置3,4を用いて細線チップを作成し、その細線チップを用いて微小金属球を溶融法により作成した実施例について図面を参照し説明する。図5は、第1態様の製造装置3で作成された細線チップ(実施例1)により製造された微小金属球の直径の分布を示したものである。図6は、第2態様の製造装置4で作成された細線チップ(実施例2)により製造された微小金属球の直径の分布を示したものである。図7は、従来の切断装置で単線を切断し、作成された細線チップ(比較例)により製造された微小金属球の直径の分布を示したものである。図8は、実施例1および2と比較例の作業時間とその内容を説明する図である。なお、図8の作業時間は、細線を単線で切断した時間を基準とし相対的に表示されている。
【0036】
【実施例1】
図1に示すように、Cuを主体とした直径が50μmの細線11が、巻回ピッチP=1mm(公差50μm)で6本互いに巻回された撚り線1を準備した。図3の製造装置3でその撚り線1を処理して、1000個の細線チップを作成した。その細線チップを気中溶融法で球状化し、目標直径が50μmの微小金属球を得た。
【0037】
【実施例2】
Cuを主体とした直径が50μmの細線21を6本準備し、図4に示す製造装置4にその細線21を装着して、上記と同様な撚り線1を撚り合わせて、撚り線1を切断し、1000個の細線チップを作成した。その細線チップを気中溶融法で球状化し、目標直径が50μmの微小金属球を得た。
【0038】
【比較例】
Cuを主体とした直径が50μmの細線を単線を準備した。その単線を切断し、1000個の細線チップを作成し、目標直径が50μmの微小金属球を得た。
【0039】
実施例1および2ともに微小金属球の直径分布は細線を単線で切断した場合と同等であった。さらに、細線を単線で切断した場合には細線の剛性不足に起因した切断不良や送り不良により作業時間の約20%の割合で切断中に停止したが、実施例1および2では装置が停止することは皆無であった。
【発明の効果】
以上説明したように、本発明によれば、少なくとも2本以上の細線が撚り合わされてなる撚り線を切断して細線チップを製造するので、細線を束ねるために樹脂やテープを用いる必要がなく、樹脂やテープの除去工程が不要となり経済的に微小金属球を製造することができ、また樹脂やテープの残渣が混入することがない高品質な微小金属球を製造することが可能となる。
【図面の簡単な説明】
【図1】本発明で用いる撚り線の一例を示す図である。
【図2】本発明で用いる撚り線の一例を示す図である。
【図3】本発明の第1態様に係る製造装置の概略構成図である。
【図4】本発明の第2態様に係る製造装置の概略構成図である。
【図5】本発明の実施例1で製造された微小金属球の直径の分布を示した図である。
【図6】本発明の実施例2で製造された微小金属球の直径の分布を示した図である。
【図7】従来の製造方法で製造された微小金属球の直径の分布を示したものである。
【図8】実施例1、2と比較例の作業時間と作業の内容を説明する図である。
【符号の説明】
1(2):撚り線、11(21):細線
3:製造装置、31:切段部、32:送りユニット、33:切断ユニット
4:製造装置、41:撚り線形成部
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a technique for manufacturing a fine wire tip, and more specifically, a manufacturing apparatus suitable for obtaining a fine wire tip used in a melting method for melting a fine wire tip and spheronizing it to obtain a fine metal sphere, and It relates to a manufacturing method.
[0002]
[Prior art]
In recent years, fine metal spheres with high sphericity and uniform diameter have been required in various fields. For example, in the field of electronic devices, packages having area array connection terminals such as FC (Flip Chip), BGA (Ball Grid Array), and CSP (Chip Size Package) are widely used. The area array type package has input / output connection terminals arranged side by side on its back surface, for example, fine metal balls such as copper balls or solder balls whose surfaces are coated with solder are arranged on the connection terminals, and the mounting substrate It is mounted on and connected to the mounting board by batch reflow.
[0003]
As electronic devices become more sophisticated, smaller, and thinner, packages are becoming more terminals and the arrangement pitch of connection terminals tends to be narrower. When an electronic component to be packaged in such a package is mounted on a mounting board, or when such a package is mounted on a mounting board, it is necessary to align with high accuracy in the planar direction. Further, in some electronic devices, in order to improve impact resistance and heat dissipation, it is necessary to maintain the height direction, that is, the gap between the electronic component or package and the mounting substrate with high accuracy. That is, in such an electronic device, the fine metal sphere that connects the electronic component or package and the mounting substrate not only electrically connects each other but also functions as a spacer for holding a gap. . The gap interval is several hundred μm or less, and it is necessary to keep the gap uniform. Therefore, as the fine metal spheres that function as spacers, those having a diameter as small as several hundred μm or less, small variations in diameter, and high sphericity are employed.
[0004]
Usually, as the fine metal spheres for the purpose of electrical conduction only, those mainly composed of Sn-based solder alloys having a low melting point are used. However, in applications where a function as a spacer is required, in order to avoid deformation at the time of reflow, a metal alloy ball mainly composed of Cu or the like having a high melting point is coated with a solder alloy.
[0005]
In addition to the above description, for example, in the field of mechanical devices, a small metal ball having a high sphericity and a uniform diameter mainly made of stainless steel is desired as a ball for a small bearing.
[0006]
The fine metal sphere is prepared, for example, by preparing a thin wire chip made of the same material by cutting a thin wire having the same volume as the volume, and the thin wire chip is poured into oil having a temperature higher than its melting point, and the surface of the melted thin wire chip Melting, such as melting in oil by spheroidizing with tension to obtain fine metal spheres, or in-air melting method in which it is placed in a furnace core tube heated to an atmosphere higher than the melting point of the fine wire tip and spheroidized while being dropped freely Manufactured by the law.
[0007]
An example of a method for manufacturing the fine wire chip used in the melting method is disclosed in Patent Document 1 below. In Patent Document 1, “bundling a plurality of fine metal wires and covering them with a resin such as vinyl chloride, cutting them to a certain length, and then removing the coating, taking out a certain length of metal wires” Or, “Place multiple metal wires in parallel between tapes, cut this tape to a certain width and then take out the metal wires”, and make thin wires made of the same metal as the material of the fine metal spheres in the longitudinal direction. A manufacturing method has been proposed in which a thin wire chip is obtained by cutting into a predetermined size.
[0008]
According to the method of sizing a fine wire exemplified in Patent Document 1 to obtain a fine wire tip, a thin wire tip having a small volume variation range can be easily obtained by sizing a fine wire having a constant diameter in the longitudinal direction. Therefore, in the melting method, it is possible to produce a fine metal sphere having a small variation in diameter.
[0009]
Furthermore, according to the method of Patent Document 1, since a plurality of fine wires bundled with a binding agent such as resin or tape are cut to a certain size, a fine wire chip can be efficiently manufactured, and the diameter of the metal fine wire is reduced. Even in such a case, it is possible to suppress the occurrence of phenomena such as a decrease in cutting accuracy due to a decrease in the rigidity of the fine metal wire due to a reduction in diameter, a defective cutting, or a breakage of the fine metal wire itself, and a thin wire chip with less volume variation. There is an advantage that can be obtained.
[0010]
However, according to the manufacturing method of Patent Document 1, it is necessary to bundle a plurality of fine metal wires with a binding agent (resin, tape), and an additional step of removing the binding agent from the fine wire chip after cutting the fine metal wires is necessary. Therefore, there was an economic problem that the cost would be high. Furthermore, when the removal of the resin or the tape is incomplete, there is a quality problem that the residue is mixed into the fine metal sphere.
[0011]
[Patent Document 1]
Japanese Patent Laid-Open No. 3-180401
[Problems to be solved by the invention]
The present invention has been intensively studied by the present inventors in order to solve the above-described problems, and provides a manufacturing apparatus and a manufacturing method of a fine wire chip capable of manufacturing a high-quality and low-cost micro metal sphere. It is an object.
[0013]
[Means for Solving the Problems]
The above object is achieved by the present invention in which a stranded wire in which at least two fine wires are twisted together is cut into a predetermined length in the longitudinal direction. That is, according to the manufacturing method of the present invention, the twisted wires formed by twisting the thin wires, that is, wound around each other at a predetermined pitch, have higher rigidity than a single thin wire, so that the volume variation of the thin wire chip is reduced. In addition to producing fine metal spheres with a uniform diameter, it is not necessary to use a binding agent when bundling fine wires, so the step of removing the binding agent is unnecessary, and the micro metal spheres are manufactured economically. Thus, high-quality fine metal spheres are produced in which binder residues are not mixed. In addition, various shapes, such as a substantially circular shape, a substantially rectangular shape, and a substantially triangular shape, can be selected for the cross-sectional shape of a thin wire | line.
[0014]
Furthermore, if the stranded wire is cut to a predetermined length in the longitudinal direction while forming the stranded wire in the step of forming the stranded wire by twisting the fine wires together, it is not necessary to prepare the stranded wire in advance, and therefore The desired stranded wire can be formed arbitrarily, and the degree of freedom in production is high, which is preferable.
[0015]
Furthermore, in the above invention, if a fluid (for example, a gas such as air or nitrogen, or a liquid such as water or oil) is sprayed on the cut portion of the stranded wire, the cut stranded wire is immediately unwound and separated individually by the fluid. It is preferable because a thin wire chip can be obtained efficiently.
[0016]
The above-mentioned invention is carried out by the manufacturing apparatus of the present invention having a stranded wire forming portion that twists at least two fine wires to form a stranded wire, and a cutting portion that cuts the stranded wire in a longitudinal direction thereof by a predetermined length. The Furthermore, the said invention which isolate | separates the cut | disconnected strand wire separately is implemented by providing the fluid supply means which sprays the fluid in the position where a strand wire is cut | disconnected.
[0017]
If at least one of the thin wires is a core wire and the remaining thin wires are wound around the core wire to form a stranded wire, bending of the stranded wire is suppressed and less bending occurs during transportation and cutting, resulting in poor cutting. Is preferable. Further, it is preferable that the number of the core wire is one and six fine wires are wound around the core wire, so that the cutting end portion can be uniformly unwound and the volume variation of the fine wire tip can be reduced.
[0018]
The diameter of the thin wire is not particularly limited, but the present invention is suitable when a thin wire chip is manufactured by cutting a thin wire having a diameter of 100 μm or less, which is likely to cause cutting failure due to reduced rigidity.
[0019]
Note that if the pitch for winding the thin wire is reduced, the rigidity of the stranded wire can be increased. However, since the fine wire is cut obliquely, the variation in the volume of the fine wire tip obtained is increased and the end portion is unraveled. Difficult to cut easily. Also, if the winding pitch of the thin wire is increased, the volume variation of the thin wire tip that can be easily unraveled at the cut end is small, but the rigidity of the material is lowered, so that cutting failure tends to occur. Therefore, the winding pitch of the fine wire is larger than the length in the longitudinal direction of the fine wire chip, and it is necessary to select a pitch that can maintain the rigidity of the stranded wire.
[0020]
Furthermore, the material of the thin wire is not particularly limited, and may be, for example, Ni, W, Mo, or Sn. However, in order to manufacture the fine metal sphere used in the package, Cu or Au, It is desirable that the wire is mainly composed of Ag.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
The manufacturing method and manufacturing apparatus of the present invention will be described with reference to the drawings.
[Embodiment 1]
1 and 2 are a cross-sectional view and a plan view of a stranded wire formed by twisting fine wires together, and are diagrams for explaining a first aspect of the present invention. FIG. 3 is a schematic configuration diagram of a manufacturing apparatus for manufacturing a fine wire chip by cutting the stranded wire of FIG. 1.
[0022]
As shown in FIG. 1, the stranded wire 1 used for manufacturing the fine wire chip in the present invention has at least two (six in this embodiment) fine wires 11, and each fine wire 11 has a predetermined pitch with respect to each other. It is wound with P and twisted together. In this way, by winding a plurality of thin wires 11 to each other, the thin wires 11 are twisted together, and the highly rigid material 1 is formed by the thin wires 11 that are mechanically bound without using an adhesive or the like. .
[0023]
Further, as shown in FIG. 2, basically the same as the stranded wire 1, but at least one of the plurality of thin wires 21 is a core wire 211, and the remaining (six in this embodiment) thin wires 212 are When the stranded wire 2 wound around the core wire 211 at a predetermined pitch P is used, the fine wires 21 are mechanically bound to each other like the stranded wire 1, while the core wire 211 located at the center of the stranded wire 2 is used. This is preferable because bending of the stranded wire 2 itself is suppressed.
[0024]
The stranded wires 1 and 2 prepared in advance have a predetermined length in the longitudinal direction by the manufacturing apparatus 3 including a cutting part 31 that cuts the longitudinal direction in a predetermined length as shown in FIG. Then, it is cut into thin wire chips.
[0025]
The configuration of the manufacturing apparatus 3 will be described in detail. The cutting unit 31 includes a feeding unit 32 that intermittently feeds the supplied stranded wires 1 and 2 downward (one side) every predetermined length, and the stranded wires 1 and 2 sent out every predetermined length. And a cutting unit 33 for cutting. The stranded wires 1 and 2 are wound around a bobbin 34 in advance as shown in the figure, for example, and supplied to the feed unit 32 while being supported by a guide roller or the like.
[0026]
As shown in the figure, the feed unit 32 has a pair of rollers 321 that sandwich the stranded wires 1 and 2 supplied from the bobbin 34, and one of the rollers controls a rotation device (not shown). Thus, it can be rotated intermittently at every predetermined rotation angle. Accordingly, the stranded wires 1 and 2 sandwiched between the rollers 321 are sent downward every predetermined length.
[0027]
The cutting unit 33 has a die 35 in which a hole 351 into which the stranded wires 1 and 2 sent out from the transmission unit 32 can be inserted, and a direction substantially perpendicular to the longitudinal direction of the stranded wires 1 and 2. And a cutter 36 for cutting the stranded wires 1 and 2 disposed below the die 33. The cutter 36 is intermittently operated in synchronization with the rotation operation of the one roller 321 under the control of the control device, and therefore the fed stranded wires 1 and 2 are cut at predetermined lengths.
The diameter of the hole portion 351 is 5 times or less than the diameter of the twisted wires 1 and 2 in order to prevent wobbling of the twisted wires 1 and 2 in the hole portion 351 and to suppress a decrease in cutting accuracy and cutting failure. Is desirable. Furthermore, when the diameter of the hole 351 is small, the stranded wires 1 and 2 are likely to come into contact with the inner wall of the hole 351, and the stranded wire 1 and 2 are likely to be poor due to disconnection or catching. , 2 is preferably more than twice the diameter. In addition, it is preferable to set it to 3 times to 4 times.
[0028]
Since the stranded wires 1 and 2 cut as described above are mechanically twisted together, most of them are naturally unraveled and separated individually. For example, the stranded wires 1 and 2 after cutting are subjected to ultrasonic vibration or air blowing. If a predetermined external force such as attachment is applied, the fine wire tip can be separated more reliably.
[0029]
In addition, the structure of the apparatus which cut | disconnects the strands 1 and 2 and manufactures a thin wire | line chip | tip is not limited to the said description, For example, a cutter is operated intermittently, sending out the strands 1 and 2 continuously. And it is good also as a structure which cuts the strands 1 and 2 for every predetermined length. Furthermore, it is good also as a structure which cut | disconnects the strand wire sent out continuously with the saw blade-shaped cutter with which every several blade was parallelly arranged with equal pitch.
[0030]
[Embodiment 2]
The second aspect of the present invention will be described with reference to FIG. FIG. 4 is a schematic configuration diagram of the manufacturing apparatus according to the second aspect. The same components as those in FIGS. 1 to 3 are denoted by the same reference numerals, and detailed description thereof is omitted.
[0031]
The manufacturing apparatus 4 shown in FIG. 4 has a cutting part 31 similar to the above, and a stranded wire forming part 41 that twists at least two or more fine wires 11 and 21 to form stranded wires 1 and 2. . For example, the thin wires 11 and 21 are wound around a bobbin 44 in advance as shown in the drawing and supplied to the stranded wire forming portion 41. The stranded wires 1 and 2 formed by the stranded wire forming portion 41 are supported by a guide roller or the like. While being supplied to the cutting unit 31.
[0032]
The stranded wire forming unit 41 has a known configuration in which, for example, a wire rope, an electric wire, and a chemical fiber are twisted together, for example, a configuration in which fine wires are twisted as exemplified in JP-A-10-193018. 1, the thin wires 11 are wound around each other at a predetermined pitch P as shown in FIG. 1, or the thin wires 21 are wound around the core wire 211 at a predetermined pitch P as shown in FIG. 2 is formed.
[0033]
According to the manufacturing apparatus 4 having such a configuration, while forming the stranded wires 1 and 2 in the process of forming the stranded wires 1 and 2 by twisting at least two fine wires 11 and 21 at the stranded wire forming portion 41, A fine wire chip is formed by cutting the stranded wires 1 and 2 into a predetermined length in the longitudinal direction by the cutting portion 31. According to the cutting device 4 of the second aspect, the arbitrary stranded wires 1 and 2 can be formed from the thin wires 11 and 21 having a desired diameter without preparing the stranded wires 1 and 2 in advance.
[0034]
As shown in FIGS. 3 and 4, if the fluid supply means 37 for spraying the fluid 371 is provided at the site where the stranded wires 1 and 2 are cut, the stranded wires 1 and 2 cut by the pressure of the fluid 371 are It is unraveled at that position and separated into individual thin wire chips. Therefore, the reliability of separation of the fine line chip can be further improved, and the fine line chip is efficiently manufactured.
Note that air is the lowest cost as the fluid 371, but an inert gas (nitrogen, argon, or the like) may be employed when it is desired to suppress oxidation of the cut surface of the thin wire chip. Further, when it is desired to increase the pressure of the fluid 371, a liquid mainly composed of water or oil may be employed. If the flow rate of the fluid 371 is excessive, the stranded wires 1 and 2 vibrate and stable cutting becomes difficult, so it is necessary to set an appropriate flow rate depending on the strength of the stranded wires 1 and 2 and the manufacturing conditions. For example, the flow rate of air when a twisted wire 2 formed by twisting seven fine wires having a diameter of 50 μm mainly composed of Cu as shown in FIG. 2 is cut by the manufacturing apparatus 3 of FIG. The optimum range was 0.02 to 0.03 (MPa).
[0035]
Next, an embodiment in which a fine wire chip is produced using the manufacturing apparatuses 3 and 4 according to the first and second aspects and a fine metal sphere is produced by the melting method using the fine wire chip will be described with reference to the drawings. FIG. 5 shows the distribution of diameters of the fine metal spheres manufactured by the fine wire chip (Example 1) created by the manufacturing apparatus 3 of the first aspect. FIG. 6 shows the distribution of the diameters of the fine metal spheres manufactured by the thin wire tip (Example 2) created by the manufacturing apparatus 4 of the second mode. FIG. 7 shows a distribution of diameters of micro metal spheres manufactured by a thin wire chip (comparative example) produced by cutting a single wire with a conventional cutting device. FIG. 8 is a diagram illustrating the working time and contents of Examples 1 and 2 and the comparative example. In addition, the work time of FIG. 8 is displayed relatively on the basis of the time which cut | disconnected the thin line with the single line.
[0036]
[Example 1]
As shown in FIG. 1, a stranded wire 1 was prepared in which six thin wires 11 mainly composed of Cu and having a diameter of 50 μm were wound around each other at a winding pitch P = 1 mm (tolerance 50 μm). The twisted wire 1 was processed with the manufacturing apparatus 3 of FIG. 3 to produce 1000 fine wire chips. The fine wire tip was spheroidized by an air melting method to obtain a fine metal sphere having a target diameter of 50 μm.
[0037]
[Example 2]
Six thin wires 21 having a diameter of 50 μm mainly composed of Cu are prepared, the thin wires 21 are attached to the manufacturing apparatus 4 shown in FIG. 4, the twisted wires 1 similar to the above are twisted together, and the twisted wires 1 are cut. 1000 fine wire chips were produced. The fine wire tip was spheroidized by an air melting method to obtain a fine metal sphere having a target diameter of 50 μm.
[0038]
[Comparative example]
A single wire was prepared as a thin wire mainly composed of Cu and having a diameter of 50 μm. The single wire was cut to produce 1000 fine wire chips, and a fine metal sphere having a target diameter of 50 μm was obtained.
[0039]
In both Examples 1 and 2, the diameter distribution of the fine metal spheres was equivalent to that obtained when the fine wire was cut with a single wire. Furthermore, when the thin wire is cut with a single wire, the wire is stopped during cutting at a rate of about 20% of the work time due to cutting failure or feeding failure due to insufficient rigidity of the thin wire, but in Examples 1 and 2, the apparatus stops. There was nothing.
【The invention's effect】
As described above, according to the present invention, since a fine wire chip is manufactured by cutting a stranded wire formed by twisting at least two fine wires, there is no need to use a resin or a tape to bundle the fine wires, A resin or tape removal step is not required, and a fine metal sphere can be produced economically, and a high-quality fine metal sphere that does not contain a resin or tape residue can be produced.
[Brief description of the drawings]
FIG. 1 is a diagram showing an example of a stranded wire used in the present invention.
FIG. 2 is a diagram showing an example of a stranded wire used in the present invention.
FIG. 3 is a schematic configuration diagram of the manufacturing apparatus according to the first aspect of the present invention.
FIG. 4 is a schematic configuration diagram of a manufacturing apparatus according to a second aspect of the present invention.
FIG. 5 is a diagram showing the distribution of diameters of the fine metal spheres manufactured in Example 1 of the present invention.
FIG. 6 is a diagram showing a distribution of diameters of micro metal spheres manufactured in Example 2 of the present invention.
FIG. 7 shows a distribution of diameters of fine metal spheres manufactured by a conventional manufacturing method.
FIG. 8 is a diagram illustrating work time and work contents of Examples 1 and 2 and a comparative example.
[Explanation of symbols]
1 (2): Stranded wire, 11 (21): Fine wire 3: Manufacturing device, 31: Cut section, 32: Feed unit, 33: Cutting unit 4: Manufacturing device, 41: Stranded wire forming portion

Claims (5)

少なくとも2本の細線が撚り合わされた撚り線をその長手方向に所定長さに切断する細線チップの製造方法。A method of manufacturing a fine wire chip, comprising cutting a stranded wire in which at least two fine wires are twisted together into a predetermined length in the longitudinal direction. 請求項1に記載の製造方法において、前記細線を撚り合わせて前記撚り線を形成する工程を有することを特徴とする細線チップの製造方法。The manufacturing method according to claim 1, further comprising a step of twisting the thin wires to form the stranded wires. 請求項1または2に記載の製造方法において、前記撚り線の切断部位に流体を吹付けることを特徴とする細線チップの製造方法。The manufacturing method according to claim 1 or 2, wherein a fluid is sprayed onto a cut portion of the stranded wire. 少なくとも2本の細線を撚り合わせて撚り線を形成する撚り線形成部と、前記撚り線をその長手方向に所定の長さに切断する切断部とを有する細線チップの製造装置。An apparatus for producing a fine wire chip, comprising: a stranded wire forming portion for twisting at least two fine wires to form a stranded wire; and a cutting portion for cutting the stranded wire into a predetermined length in the longitudinal direction thereof. 請求項4に記載の製造装置において、前記撚り線の切断部位に流体を吹付ける流体供給手段を有することを特徴とする細線チップの製造装置。5. The manufacturing apparatus according to claim 4, further comprising fluid supply means for spraying a fluid onto the cut portion of the stranded wire.
JP2003168175A 2003-06-12 2003-06-12 Thin wire chip manufacturing method and manufacturing apparatus Expired - Fee Related JP4168389B2 (en)

Priority Applications (1)

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Applications Claiming Priority (1)

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WO2012034506A1 (en) * 2010-09-13 2012-03-22 徐州华星焊材有限公司 High-speed twisting machine for welding wire

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JP2018083198A (en) * 2016-11-11 2018-05-31 有限会社北陸ベンディング Manufacturing method of spiral wavy wire
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012034506A1 (en) * 2010-09-13 2012-03-22 徐州华星焊材有限公司 High-speed twisting machine for welding wire

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