JP4162474B2

JP4162474B2 - Supply method to resin molding die, extraction method from resin molding die, supply mechanism, and extraction mechanism

Info

Publication number: JP4162474B2
Application number: JP2002341964A
Authority: JP
Inventors: 滋平田; 政信高橋; 弘樹尾張; 直毅高田
Original assignee: Towa Corp
Current assignee: Towa Corp
Priority date: 2002-11-26
Filing date: 2002-11-26
Publication date: 2008-10-08
Anticipated expiration: 2022-11-26
Also published as: JP2004179283A

Description

【０００１】
【発明の属する技術分野】
本発明は、樹脂成形用金型へ樹脂成形前後の成形材料を供給して取出す、樹脂成形用金型への供給方法と取出方法及び供給機構と取出機構の改良に関するものである。
【０００２】
【従来の技術】
従来より、樹脂成形用金型（三枚型）へ樹脂成形前の成形材料を供給機構にて供給して、金型から樹脂成形後の成形材料を取出機構にて取出すことが行われている。
【０００３】
例えば、従来の樹脂成形用金型には、上型と下型と中間プレートとから成る樹脂封止成形用金型と、樹脂成形前の成形材料を金型に供給する供給機構と、樹脂成形後の成形材料を取出す取出機構と、取出機構に付設された金型面をクリーニングするクリーニング部と、前述した金型・機構全体を制御する制御機構とが設けられている。
なお、樹脂成形前の成形材料とは、例えば、半導体チップとワイヤとを装着した基板と、前記基板の該チップ・ワイヤ部分（樹脂成形体）を樹脂封止する樹脂材料とを示す。
また、樹脂成形後の成形材料とは、例えば、加熱溶融化された樹脂材料を嵌装された樹脂成形体に溶融樹脂として注入してから溶融樹脂が硬化して形成する成形済基板と、成形済基板と連通した樹脂材料を注入する樹脂通路部分である不要樹脂材料とを示す。
【０００４】
また、中間プレートには、例えば、基板における樹脂成形体側を下方向に嵌装して樹脂封止する上型側金型面に形成されたキャビティと、加熱溶融化された樹脂材料をキャビティ底面の略中央部から上下垂直方向に下型側金型面に貫通した樹脂通路とが設けられている。
また、下型の金型面には、例えば、中間プレートの樹脂通路と型締めすることで形成され且つ連通した樹脂通路と、前記樹脂通路と連通し且つ樹脂材料を供給する樹脂供給用のポットと、ポット内に嵌装した樹脂加圧用のプランジャとが設けられている。
【０００５】
また、供給機構は、樹脂成形前の基板と樹脂材料とを搬送すると共に、中間プレートのキャビティに基板を供給セットしてから下型のポットに樹脂材料を供給するように構成されている。
また、取出機構は、樹脂成形後の樹脂封止済基板を中間プレートのキャビティから取出してから下型の金型面にある不要樹脂材料を取出すように構成されていると共に、前述の取出して退出する時に、各金型面をクリーニング部でクリーニングするように構成されている。
【０００６】
即ち、金型（上型・下型・中間プレート）が型開きした状態で、樹脂成形前の基板と樹脂材料とを有する供給機構が、まず、上型と中間プレートとの間に進入してキャビティに樹脂成形体側を下方向に供給し、次に、樹脂材料のみ有する供給機構が一旦金型外部へ退出し、次に、中間プレートと下型との間に進入してポットに樹脂材料を供給し、次に、供給機構は金型外部へ退出する。
次に、金型が型締めした状態で、キャビティ内に嵌装された樹脂成形体に予め加熱溶融化された溶融樹脂を樹脂通路を介して注入し、次に、溶融樹脂にて樹脂封止された樹脂成形体が硬化されて成形済基板と樹脂通路とが連通状態の樹脂成形後の成形材料を成形する。
次に、金型が型開きするのと同時に、キャビティ（樹脂成形体）底面と連通した樹脂通路との接合部分で硬化した樹脂材料が切断分離され、成形済基板と樹脂通路である不要樹脂材料とに分離される。
次に、金型が型開きした状態で、取出機構が、まず、上型と中間プレートとの間に進入して離型した成形済基板を取出し、次に、成形済基板のみ有する取出機構が一旦金型外部へ退出し、中間プレートと下型との間に進入して離型した不要樹脂材料を取出し、次に、樹脂成形後の成形済基板（製品）と不要樹脂材料とを有する取出機構が金型外部へ退出する。
このとき、取出機構のクリーニング部にて金型面を退出する時に、各金型面をクリーニングするように構成されている。
【０００７】
なお、前述したような従来例が記載されている特許公報文献等を調査したが発見できなかった。
【０００８】
【発明が解決しようとする課題】
しかしながら、金型が型開きした状態で、樹脂成形前後の成形材料を有する供給機構と取出機構とが、三枚型の金型構造に進入・退出を繰り返し実施する必要があるので、製品の生産性を低下させると云う弊害がある。
また、制御機構における供給機構と取出機構とを制御する設定条件が、非常に緻密なものとなるので、制御機構におけるソフトバグを生じさせて、正確な制御が出来なくなり、金型と各機構とが接触して、成形材料を供給することや取出すことが正確に出来なくなり、作業性を著しく低下させると云う弊害が発生する。
【０００９】
従って、本発明は、樹脂成形用金型（三枚型）への樹脂成形前後の成形材料を各別に且つ同時に一体型の供給機構と取出機構とを用いることにより供給・取出作業を効率良く実施して、製品の生産性を向上させることを目的とする。
【００１０】
【課題を解決するための手段】
前記した技術的課題を解決するために本発明に係わる樹脂成形用金型への供給方法は、上型、下型、及び、上型と下型との間に設けられた中間プレートから成る電子部品の樹脂成形用金型において、下型の上面側における所定位置に樹脂材料を供給するとともに中間プレートの上面側における所定位置に成形前基板を供給する樹脂成形用金型への供給方法であって、単数個の供給機構を使用して、樹脂材料と成形前基板とを各別に且つ同時に供給することを特徴とする。
【００１１】
また、前記した技術的課題を解決するために本発明に係わる樹脂成形用金型からの取出方法は、上型、下型、及び、上型と下型との間に設けられた中間プレートから成る電子部品の樹脂成形用金型において、下型の上面側における所定位置から不要樹脂材料を取り出すとともに中間プレートの上面側における所定位置から成形済基板を取り出す樹脂成形用金型からの取出方法であって、単数個の取出機構を使用して、不要樹脂材料と成形済基板とを各別に且つ同時に取り出すことを特徴とする。
【００１２】
また、前記した技術的課題を解決するために本発明に係わる樹脂成形用金型からの取出方法は、上述した取出方法において、取出機構は、不要樹脂材料と成形済基板とを各別に且つ同時に取り出す際に、上型と中間プレートと下型とが各々有する金型面の少なくとも１つをクリーニングすることを特徴とする。
【００１３】
また、前記した技術的課題を解決するために本発明に係わる樹脂成形用金型への供給機構は、上型、下型、及び、上型と下型との間に設けられた中間プレートから成る電子部品の樹脂成形用金型において、下型の上面側における所定位置に樹脂材料を供給するとともに中間プレートの上面側における所定位置に成形前基板を供給する樹脂成形用金型への供給機構であって、樹脂材料を供給する部分と成形前基板を供給する部分とが、樹脂材料を供給する部分が下段になり成形前基板を供給する部分が上段になるようにして、かつ、各々の一方の端部の側において連結されているようにして一体的に設けられているとともに、樹脂材料と成形前基板とを各別に且つ同時に供給することを特徴とする。
【００１４】
また、前記した技術的課題を解決するために本発明に係わる樹脂成形用金型からの取出機構は、上型、下型、及び、上型と下型との間に設けられた中間プレートから成る電子部品の樹脂成形用金型において、下型の上面側における所定位置から不要樹脂材料を取り出すとともに中間プレートの上面側における所定位置から成形済基板を取り出す樹脂成形用金型からの取出機構であって、不要樹脂材料を取り出す部分と成形済基板を取り出す部分とが、不要樹脂材料を取り出す部分が下段になり成形済基板を取り出す部分が上段になるようにして、かつ、各々の一方の端部の側において連結されているようにして一体的に設けられているとともに、不要樹脂材料と成形済基板とを各別に且つ同時に取り出すことを特徴とする。
【００１５】
また、前記した技術的課題を解決するために本発明に係わる樹脂成形用金型からの取出機構は、上述した取出機構において、取出機構は、不要樹脂材料と成形済基板とを各別に且つ同時に取り出す際に、上型と中間プレートと下型とが各々有する金型面の少なくとも１つをクリーニングすることを特徴とする。
【００１６】
【発明の実施の形態】
即ち、基本的に、上型と下型と中間プレートとから成る樹脂成形用金型（三枚型）と樹脂成形前後の成形材料を各別に且つ同時に供給・取出する一体型の供給機構と取出機構とを備えたことを特徴とする。
なお、金型の型開き時に、一体型の供給機構にて、下型の金型面と中間プレートの下型側金型面との所定位置と、前記した上型の金型面と中間プレートの上型側金型面との所定位置とに、少なくとも一個所の金型面の所定位置に樹脂成形前の成形材料を各別に且つ同時に供給する。
また、金型を型締めして樹脂成形完了した後に、金型を型開き時に、一体型の取出機構にて、前述した少なくとも一個所の金型面の所定位置に樹脂成形後の成形材料を各別に且つ同時に取出すと共に、前記金型面からの進入・退出時に前記した少なくとも一個所の金型面をクリーニングする少なくとも一個所の金型面をクリーニング部にてクリーニングすることができる。
【００１７】
従って、本発明は、樹脂成形用金型（三枚型）への樹脂成形前後の成形材料を各別に且つ同時に一体型の供給機構と取出機構とを用いることにより供給・取出作業を効率良く実施して、製品の生産性を向上させることができる。
【００１８】
【実施例】
以下、実施例図に基づいて、詳細に説明する。
【００１９】
まず、図１乃至図６に基づいて、第一実施例を説明する。
なお、図１は、本発明に係る樹脂成形用金型への供給機構と取出機構とを搭載した樹脂成形装置を示した平面図である。
また、図２乃至図６は、図１に対応する前記した金型と供給機構と取出機構とを示した断面図である。
【００２０】
例えば、本発明に係る樹脂成形装置は、図１に示すように、樹脂成形前の成形材料（成形前材料）を供給・移送・整列させる樹脂成形前の基板用機構１と樹脂材料用機構２とを設けたインモジュールユニット３（インユニット３）と、インユニット３に着脱自在で且つ樹脂成形用金型４を搭載したプレス機構５を設けたプレスモジュールユニット６（プレスユニット６）と、プレスユニット６に着脱自在で且つ金型４で樹脂成形された樹脂成形後の成形材料（成形後材料）を受取・ディゲート・製品収納させる各機構を設けたアウトモジュールユニット７（アウトユニット７）と、インユニット３・プレスユニット６・アウトユニット７間に設けた搬送レール８と、搬送レール８に沿って往復動する成形前材料を金型４へ各別に且つ同時に供給する一体型の供給機構９と成形後材料を金型４から各別に且つ同時に取出す一体型の取出機構１０と、装置全体を制御する制御機構（図示しない）とを設けている。
【００２１】
また、成形前材料とは、図１・図４に示すように、例えば、基板１１上の所定部位に一列に三個の半導体チップ１２（電子部品）と基板１１側と該チップ１２とを電気的に接続する複数本のワイヤ１３とから構成された樹脂成形前の基板（成形前基板１００）と、三個のタブレット樹脂における樹脂材料１４とを示す。
なお、基板上１１に装着された該チップ１２及び樹脂材料１４は、単数個の配列や単数列で複数個の配列や複数列で複数個の配列にしたものでもよい。
また、成形後材料とは、図５（２）に示すように、硬化した成形済基板３７（製品）と不要樹脂材料３８とを示しており、後述で詳細に説明する。
【００２２】
また、インユニット３の基板用機構１には、図１で示すように、例えば、成形前基板１００を供給する基板供給部１５と、基板供給部１５から移送される基板移送部１６と、基板移送部１６から移送された二枚の成形前基板１００を所定間隔で略平行に整列させる基板整列部１７とを設けている。
また、インユニット３の樹脂材料用機構２には、タブレット樹脂である樹脂材料１４を供給する樹脂材料供給部１８と、樹脂材料供給部１８から直列で移送される樹脂材料移送部１９と、樹脂材料移送部１９から移送された三個のタブレット樹脂を所定間隔で直列に嵌装させる樹脂材料整列部２０とを設けている。
ここで、基板整列部１７の基板１１と樹脂材料整列部２０の樹脂材料１４との配置については、図１に示すように、二枚の基板１１との間に略平行に所定間隔で構成されている、つまりは、プレス機構５の金型４の所定位置へ供給するのと同じ配置に構成されていると共に、その配置に対応してインユニット３・アウトユニット７・供給機構９・取出機構１０の各機構配置も同様に構成されている。
また、アウトユニット７は、図１に示すように、成形後材料である切断分離された二枚の成形済基板３７と不要樹脂材料３８とを取出機構１０にて受渡す成形後材料用の受取機構４０と、成形後材料を有する受取機構４０が移動して製品と不要樹脂材料３８とを切断分離するディゲート機構４１と、更に製品のみを有する受取機構４０が移動して収納する製品収納機構４２とを設けている。
【００２３】
また、プレス機構５の樹脂成形用金型４は、図１・図４に示すように、上型２１と下型２２と両型２１・２２との間にある中間プレート２３とを設けている。
また、上型２１には金型面（上型面２４）が設けられている。下型２２には金型面（下型面２５）が設けられている。更に、中間プレート２３には、上型面２４に当接し得る上型側金型面２６と下型面２５に当接し得る下型側金型面２７とが設けられている。
また、中間プレート２３は、図４・図５に示すように、上型側金型面２６に形成された基板セット用の凹所２８と、樹脂成形される該チップ１２・ワイヤ１３部分（樹脂成形体２９）を下方向に嵌装できるキャビティ３０と、加熱溶融化された樹脂材料１４をキャビティ３０天面の略中央部から上下垂直方向に下型側金型面２７に貫通したスプル３２とを設けている
また、下型面２５には、中間プレート２３のスプル３２と型締めすることで形成され且つ連通したランナ３３と、ランナ３３と連通し且つ樹脂材料１４を供給する樹脂供給用のポット３４と、ポット３４内に嵌装した樹脂加圧用のプランジャ３５とを設けている。
また、金型４の型締め時に、キャビティ３０とポット３４とはスプル３２とランナ３３とから成る樹脂通路３１を通して連通することができるように構成されていると共に、樹脂通路３１は基板１１上に非接触状態で構成されている。
また、金型４には樹脂材料１４を加熱溶融化させる加熱ヒータ（図示しない）を埋設していると共に、加熱ヒータにより金型４を所定温度に昇温させて樹脂材料１４を加熱溶融化して溶融樹脂３６となるように構成されている。
【００２４】
また、供給機構９は、図１・図２に示すように、上型２１と中間プレート２３との間（図例の二点鎖線部分である上部領域Ａ）に進入・退出する両型２１・２３に非接触状態である上部供給部材４３と、下型２２と中間プレート２３との間（図例の二点鎖線部分である下部領域Ｂ）に進入・退出する両型２２・２３に非接触状態である下部供給部材４４と、各供給部材４３・４４と連結し且つ金型４への進入方向と相対向配置し且つ金型４と衝突しない供給連結部材４５とを設けている。
また、上部供給部材４３は上型側金型面２６の所定位置に成形前基板１００を供給する上型側金型面供給部４６と、下部供給部材４４には下型面２５の所定位置に樹脂材料１４を供給する下型面供給部４７とを設けている。
また、取出機構１０は、図３に示すように、前述の供給機構９とほぼ同様に、上部領域Ａに進入・退出する上部取出部材４８と、下部領域Ｂに進入・退出する下部取出部材４９と、各取出部材４８・４９を連結する取出連結部材５０とを設けている。
また、上部取出部材４８には離型した成形済基板３７を取出す上型側金型面取出部５１と、下部取出部材４９には離型した不要樹脂材料３８を取出す下型面取出部５２と、取出連結部材５０と相対向する二個所の先端部５３に円柱形状をした四個の回転ブラシを備えたクリーニング部５４とを設けている。
また、各供給部４６・４７は、チャック固定方式・吸着固定方式・電磁固定方式等を使用して成形前材料を固定するように構成されている。更に、各取出部５１・５２は、チャック固定方式・吸着固定方式・電磁固定方式等を使用して成形後材料を固定するように構成されている。そして、各供給部４６・４７及び各取出部５１・５２は、各供給部材４３・４４及び各取出部材４８・４９より容易に着脱自在に取付・取外しすることができる。
従って、各金型面２４・２５・２６・２７における少なくとも一個所の所定位置に樹脂成形前後の成形材料を一体型の供給機構９・取出機構１０にて各別に且つ同時に供給して取出すことができるように構成されている。
【００２５】
即ち、一体型の供給機構９が金型４の型開き時に成形前材料を金型４へ供給する場合、まず、供給機構９がインユニット３の方向へ搬送レール８に沿って移動し、次に、基板用機構１の基板整列部１７における二枚の成形前基板１００を略同時に上型側金型面供給部４６で受取り、次に、樹脂材料整列部２０の三個の樹脂材料１４を略同時に下型面供給部４７で受取る。
このとき、各整列部１７・２０にある成形前材料１００・１４を各供給部４６・４７で受取るのには、各整列部１７・２０の各待機位置を上下垂直方向に移動して各供給部４６・４７へ各別に受取れるように構成されていると共に、各供給部４６・４７が成形前材料１００・１４を受取る順序は、任意に選択できる。
次に、成形前材料１００・１４を有する供給機構９はプレス機構５の金型４へ進入・退出できる待機位置（図２（１）参照）まで搬送レール８で移動する。
次に、上部供給部材４３は上部領域Ａに向かって、下部供給部材４４は下部領域Ｂに向かって、各別に且つ同時に進入する。そして、上型側金型面供給部４６は上型側金型面２６の所定位置の直上部まで、下型面供給部４７は下型面２５の所定位置の直上部まで、各別に且つ同時に進入して停止する（図２（２）参照）。
次に、図２（２）で示す状態で、上型側金型面供給部４６に固定されている成形前基板１００を、樹脂成形体２９が形成されるべき側を下にして、上型側金型面２６の所定位置である凹所２８へ供給セットする（図４、図６参照）。それと共に、下型面供給部４７に固定されている樹脂材料１４を、下型面２５の所定位置であるポット３４へ供給セットする（図４参照）。
次に、各供給部材４３・４４が各別に且つ同時に金型４から退出し、次に、金型４へ進入・退出できる待機位置まで供給機構９が移動して戻り、次に、インユニット３の方向へ搬送レール８に沿って移動して戻ることで成形前材料１００・１４を各金型面２５・２６へ前述と同様に連続して供給できる。
従って、金型４の型開き時に、一体型の供給機構９にて、下型面２５の所定位置と中間プレート２３の上型側金型面２６との所定位置とにおける金型面の所定位置に成形前材料１００・１４を各別に且つ同時に供給することができるので、供給作業を効率良く実施して、製品の生産性を向上させることができる。
【００２６】
次に、金型４を型締め時に、ポット３４内で加熱溶融化された樹脂材料１４をプランジャ３５で加圧することで樹脂通路３１（スプル３２・ランナ３３）を通してキャビティ３０内に溶融樹脂３６を注入充填する（図５（１）参照）。
次に、硬化に必要な所要時間経過後に、金型４を型開きしてキャビティ３０内で成形された樹脂成形体２９と基板１１となる成形済基板３７及び樹脂通路３１内等での不要樹脂材料３８をキャビティ３０天面とスプル３２との接合部３９で樹脂成形体２９と不要樹脂材料３８とが切断分離される（図５（２）参照）。
【００２７】
次に、一体型の取出機構１０が金型４の型開き時に成形後材料を金型４から取出す場合、まず、取出機構１０がプレス機構５の金型４へ進入・退出できる待機位置、つまりは、図２（１）で示す供給機構９の待機位置と同様の位置まで搬送レール８で移動する。
次に、上部取出部材４８は上部領域Ａと下部取出部材４９は下部領域Ｂとへ各別に且つ同時に金型４に進入し、次に、上型側金型面取出部５１は上型側金型面２６の所定位置の直上部と下型面取出部５２は下型面２５の所定位置の直上部とへ各別に且つ同時に金型４に進入して停止する（図３（１）参照）。
このとき、成形後材料が存在しない上型面２４と中間プレート２３の下型側金型面２７とは、各金型面２４・２７に当接する二個のクリーニング部５４が進入することによって同時にクリーニングされる（図３（１）参照）。
次に、図３（１）で示す状態で、上型側金型面取出部５１は、上型側金型面２６の所定位置である凹所２８から、離型した樹脂成形体２９の側を下にした成形済基板３７を取出す（図６参照）。それと共に、下型面取出部５２は、下型面２５の所定位置にある、スプル３２・ランナ３３が連通した樹脂通路３１において硬化して中間プレート２３から離型した不要樹脂材料３８を取出す（図６参照）。
なお、図６については、四個のクリーニング部５４を図例から省いて説明している。
次に、成形後材料３７・３８を有する取出機構１０は、各別に且つ同時に金型４から退出する。
このとき、進入時にクリーニングされていない下型面２５と中間プレート２３の上型側金型面２６とは、各金型面２５・２６に当接する二個のクリーニング部５４が退出することによって同時にクリーニングされる（図３（２）参照）。
次に、金型４へ進入・退出できる待機位置まで移動して戻り、次に、アウトユニット７の方向へ搬送レール８に沿って移動して切断分離された成形済基板３７と不要樹脂材料３８とを受取機構４０で受渡す。
このとき、各取出部５１・５２にある成形後材料３７・３８を受取機構４０で受取るのには、受取機構４０の待機位置を上下垂直方向に移動して成形後材料３７・３８を各別に受取れるように構成されていると共に、受取機構４０が成形後材料３７・３８を受取る順序は、任意に選択できる。
この場合、成形済基板３７は、受取機構４０の待機位置を上下垂直方向に移動して受取られるが、切断分離された不要樹脂材料３８は、受取機構４０の下部に設けた不要材料用の廃棄部（図示しない）へ廃棄されるように構成されている。
次に、取出機構１０がプレスユニット７の方向へ搬送レール８に沿って金型４へ進入・退出できる待機位置まで移動して戻ることで成形後材料３７・３８を各金型面２５・２６から前述と同様に連続して取出すことができる。
従って、金型４の型開き時に、一体型の取出機構１０にて、下型面２５の所定位置と中間プレート２３の上型側金型面２６との所定位置とにおける金型面の所定位置に成形後材料３７・３８を各別に且つ同時に取出すことができるので、取出作業を効率良く実施して、製品の生産性を向上させることができる。
【００２８】
次に、金型４の型開き時に成形済基板３７と不要樹脂材料３８とは切断分離しているので、デイゲート機構４１は使用せずに製品収納機構４２へ製品のみを有する受取機構４０が直接移動し、次に、製品収納機構４２に到達した成形済基板３７を載置した受取機構４０からピックアップされて複数枚の製品が製品収納機構４２に収納されると共に、受取機構４０も取出機構１０から成形後材料３７・３８を受取位置まで戻る。
【００２９】
即ち、連続して樹脂成形できる前述の装置に搭載された樹脂成形用金型４（三枚型）への樹脂成形前後の成形材料を各別に且つ同時に一体型の供給機構９と取出機構１０とを用いることにより供給・取出作業を効率良く実施して、製品の生産性を向上させることができる。
【００３０】
次に、図７・図８に基づいて、第二・第三実施例を説明する。
なお、基本的に、第一実施例に準ずるものとして第一実施例と同一符号を記することにすると共に、第一実施例と顕著に相違する部分を後述にて説明する。
また、金型４の型開き時において、成形前材料１００・１４を金型４へ供給機構９にて直上部に供給する図７（１）及び図８（１）と成形後材料３７・３８を金型４から取出機構１０にて取出した図７（２）及び図８（２）とを示してあって、クリーニング部５４については図例から省いて説明することにする。
【００３１】
即ち、第二実施例は、図７（１）に示すように、金型４の型開き時に、一体型の供給機構９にて各別に且つ同時に、下部領域Ｂには樹脂材料１４と樹脂成形体２９側を上方向の成形前基板１００とが供給される。
また、図７（２）に示すように、金型４の型開き時に、樹脂成形され硬化して且つ接合部３９にて切断分離された二枚の成形済基板３７と不要樹脂材料３８とが、一体型の取出機構１０にて各別に且つ同時に、下部領域Ｂには二枚の成形済基板３７と上部領域Ａには不要樹脂材料３８とが離型され取出される。
従って、連続して樹脂成形できる第一実施例の装置に搭載された樹脂成形用金型４（三枚型）への樹脂成形前後の成形材料を各別に且つ同時に一体型の供給機構９と取出機構１０とを用いることにより供給・取出作業を効率良く実施して、製品の生産性を向上させることができる。
【００３２】
また、第三実施例において、図８（１）に示すように、金型４の型開き時に、一体型の供給機構９にて各別に且つ同時に、上部領域Ａには樹脂材料１４と樹脂成形体２９側を上方向の二枚の成形前基板１００と、下部領域Ｂにも上部領域Ａと同様に、樹脂材料１４と樹脂成形体２９側を上方向の二枚の成形前基板１００とが供給される。
また、図８（２）に示すように、金型４の型開き時に、樹脂成形され硬化して且つ接合部３９にて不要樹脂材料３８と接合された二枚の成形済基板３７（一組の成形後材料）が、一体型の取出機構１０にて各別に且つ同時に、上部領域Ａ及び下部領域Ｂにある二組の成形後材料が離型され取出される。
この場合、図示していないが、金型４の型締め時に、キャビティ３０とポット３４とから成る樹脂通路３１を通して連通するように構成されていると共に、樹脂通路３１は基板１１上に接触状態で構成されている。
また、図１で示すディゲート機構４１を用いて、ニ組の成形後材料である不要樹脂材料３８と二枚の成形済基板３７との各接合部３９を切断分離して、四枚の成形済基板３７（製品）のみを製品収容機構４２へと移動される。
つまり、四枚の成形前基板１００を同時に樹脂成形できる構成となっている。
従って、連続して樹脂成形できる第一実施例の装置に搭載された樹脂成形用金型４（三枚型）への樹脂成形前後の成形材料を各別に且つ同時に一体型の供給機構と取出機構とを用いることにより供給・取出作業を効率良く実施して、更なる製品の生産性を向上させることができる。
【００３３】
なお、第一・第二・第三実施例（本実施例）において、プレスユニット６については、図１０で示すように、例えば、四個を連結状態にある複数個のプレスユニット６をインユニット３・アウトユニット７間に設けた装置にしてもよい。
また、搬送レール８については、図示していないが、例えば、プレス機構５を二本の搬送レール８の間に配置させるようにして、一方のレール８には供給機構９を取付け、他方のレール８には取出機構１０を取付けるような構成でもよい。
また、本実施例における装置の構成条件は、図１・図１０に限定されることなく、配置・形状・寸法・材質・材料・制御等における追加や変更や削除を行ってもよい。
【００３４】
また、成形前基板１００としては、図示していないが、例えば、基板１１上の所定部位に配列された該チップ１２と基板１１側と該チップ１２とを電気的に接続する複数個のバンプとを構成した成形前基板１００（フリップチップ基板）を用いてもよいし、樹脂材料１４については、液状樹脂・顆粒樹脂・粉末樹脂等の任意の樹脂材料１４でも、形状・寸法・材料等を変更して対応してよい。
【００３５】
また、成形後材料については、図９（１）に示すように、第一実施例における金型４構造を除いた成形済基板３７と不要樹脂材料３８とが接合した状態を示してあって、単数個のキャビティ３０内に嵌装された単数個の該チップ１２を樹脂成形しているが、図９（２）・図９（３）・図９（４）で示すように、例えば、複数個のキャビティ３０内に単数列で複数個や複数列で複数個の該チップ１２を樹脂成形するようにしてもよい。
また、樹脂通路３１等の接合部３９を樹脂成形体２９の略中央部ではなく、図９（４）で示すように、キャビティ３０側面である任意のキャビティ３０表面に非接触状態で設けたり、或いは、図９（３）で示すように、該チップ１２装着側の基板１１上に樹脂通路３１を接触状態で設けるようにしてもよい。
【００３６】
また、本実施例におけるプレス機構５の金型４（三枚型）については、樹脂通路３１を通して樹脂材料１４をキャビティ３０内に注入充填するトランスファー成形を採用しているが、キャビティ３０内に加熱溶融化された樹脂材料１４を予め準備した状態で成形前基板１００を上型面２４の所定位置に供給セットして樹脂成形体２９側を下方向に向けて浸漬させる樹脂通路３１を有さない基板浸漬成形にて樹脂成形してもよい。
また、本実施例でのトランスファー成形と前記基板浸漬成形においても、金型４の型締め時に、少なくとも加熱溶融化された樹脂材料１４と接触する金型面を外気遮断状態にして外気遮断範囲を形成して外気遮断範囲内の空気を強制的に吸引排出する真空成形を併用したり、或いは、金型４の上部領域Ａと下部領域Ｂとの少なくとも一方の領域に離型フィルムを供給する離型フィルム供給機構（図示しない）を設けてフィルム成形を併用して樹脂成形してもよい。
なお、離型フィルムを金型面に被覆して張架できるように供給機構９・取出機構１０の供給部材４３・４４及び取出部材４８・４９に該フィルム張架手段等の補助機構を設けて実施してもよい。
【００３７】
また、供給機構９・取出機構１０の供給連結部材４５・取出連結部材５０については、金型４への進入方向と相対向に配置せずに、上部供給領域Ａ・下部供給領域Ｂへ成形前材料１００・１４の供給・取出ができれば、任意の配置にて供給部材４３・４４と取出部材４８・４９とを適宜に選択して連結してもよい。
また、各金型面２４・２５・２６・２７をクリーニング部５４にてクリーニングするのには、取出機構１０の進入・退出するのと同時に、クリーニングする金型面を適宜に変更してクリーニングすることができる。
また、クリーニング部５４については、例えば、回転ブラシ等の清掃部材を備えたもので例示したが、バキューム等のクリーニング手段を備えたものでもよいし、清掃部材・クリーニング手段の併用でもよい。
また、一体型の取出機構１０の先端部５３にクリーニング部５４を備えたが、適宜に各金型面２４・２５・２６・２７を各別に且つ同時にクリーニングできるのであれば、配置・形状・寸法・材質・材料・制御等における追加や変更や削除を行ってもよい。
また、切断分離された不要樹脂材料３８は、第一・第二実施例の場合は受取機構４０の下部に設けた不要材料用の廃棄部へ廃棄されるが、第三実施例の場合のような切断分離されていない成形後材料はディゲート機構４１でディゲートする際に下部に廃棄部を設けるようにしてもよいし、前記両廃棄部を装置内部或いは装置外部に一括して廃棄できる廃棄機構（図示しない）を適宜に設けてもよい。
【００３８】
また、本発明は、上述の各実施形態に限定されるものではなく、本発明の趣旨を逸脱しない範囲内で、必要に応じて、任意にかつ適宜に変更・選択して採用できるものである。
【００３９】
【発明の効果】
本発明によれば、樹脂成形用金型への樹脂成形前後の成形材料を各別に且つ同時に一体型の供給機構と取出機構とを用いることにより供給・取出作業を効率良く実施して、製品の生産性を向上させるという優れた効果を奏するものである。
【図面の簡単な説明】
【図１】図１は、本発明に係る本実施例における樹脂成形用金型への供給機構と取出機構とを搭載した樹脂成形装置を示した平面図である。
【図２】図２（１）及び図２（２）は、図１に対応する供給機構を示す概略拡大横側面図である。
【図３】図３（１）及び図３（２）は、図１に対応する取出機構を示す概略拡大横断面図である。
【図４】図４は、図２（２）に対応する供給機構を示す概略拡大縦側面図である。
【図５】図５（１）及び図５（２）は、図１に対応する前記金型を示す概略拡大縦断面図である。
【図６】図６は、図３（１）に対応する取出機構を示す概略拡大縦側面図である。
【図７】図７（１）及び図７（２）は、本発明に係る他の実施例における供給機構及び取出機構を示す概略拡大縦側面図である。
【図８】図８（１）及び図８（２）は、本発明に係る他の実施例における供給機構及び取出機構を示す概略拡大縦側面図である。
【図９】図９（１）乃至図９（４）は、本発明に係る成形後材料の概略拡大斜視図である。
【図１０】図１０は、本発明に係る本実施例における樹脂成形用金型への供給機構と取出機構とを搭載した他の樹脂成形装置を示した平面図である。
【符号の説明】
１基板用機構
２樹脂材料用機構
３インモジュールユニット（インユニット）
４樹脂成形用金型（三枚型）
５プレス機構
６プレスモジュールユニット（プレスユニット）
７アウトモジュールユニット（アウトユニット）
８搬送レール
９供給機構
１０取出機構
１１基板
１２半導体チップ
１３ワイヤ
１４樹脂材料
１５基板供給部
１６基板移送部
１７基板整列部
１８樹脂材料供給部
１９樹脂材料移送部
２０樹脂材料整列部
２１上型
２２下型
２３中間プレート
２４上型面
２５下型面
２６上型側金型面
２７下型側金型面
２８凹所
２９樹脂成形体
３０キャビティ
３１樹脂通路
３２スプル
３３ランナ
３４ポット
３５プランジャ
３６溶融樹脂
３７成形済基板（製品）
３８不要樹脂材料
３９接合部
４０受取機構
４１ディゲート機構
４２製品収納機構
４３上部供給部材
４４下部供給部材
４５供給連結部材
４６上型側金型面供給部
４７下型面供給部
４８上部取出部材
４９下部取出部材
５０取出連結部材
５１上型側金型面取出部
５２下型面取出部
５３先端部
５４クリーニング部
Ａ上部領域
Ｂ下部領域[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for supplying and removing a molding material before and after resin molding to a resin molding die, and a method for supplying and removing the resin molding die, and a supply mechanism and an extraction mechanism.
[0002]
[Prior art]
Conventionally, a molding material before resin molding is supplied to a resin molding mold (three-sheet mold) by a supply mechanism, and a molding material after resin molding is taken out from the mold by a removal mechanism. .
[0003]
For example, a conventional resin molding die includes a resin sealing molding die composed of an upper die, a lower die and an intermediate plate, a supply mechanism for supplying molding material before resin molding to the die, and resin molding. A take-out mechanism for taking out the subsequent molding material, a cleaning unit for cleaning a mold surface attached to the take-out mechanism, and a control mechanism for controlling the above-described mold / mechanism as a whole are provided.
The molding material before resin molding refers to, for example, a substrate on which a semiconductor chip and a wire are mounted, and a resin material for resin-sealing the chip wire portion (resin molded body) of the substrate.
Further, the molding material after resin molding is, for example, a molded substrate formed by injecting a heat-melted resin material as a molten resin into a fitted resin molded body and then curing the molten resin, and molding The unnecessary resin material which is a resin channel | path part which inject | pours the resin material connected with the completed board | substrate is shown.
[0004]
In addition, the intermediate plate includes, for example, a cavity formed on the upper mold side mold surface that is fitted with the resin molded body side of the substrate downward and sealed with resin, and a heat-melted resin material on the bottom surface of the cavity. A resin passage penetrating from the substantially central portion to the lower mold surface in the vertical direction is provided.
Also, on the lower mold surface, for example, a resin passage formed and clamped with the resin passage of the intermediate plate, and a resin supply pot that communicates with the resin passage and supplies resin material. And a plunger for pressurizing the resin fitted in the pot.
[0005]
The supply mechanism is configured to convey the substrate before resin molding and the resin material, and supply and set the substrate to the cavity of the intermediate plate and then supply the resin material to the lower mold pot.
The take-out mechanism is configured to take out the resin-encapsulated substrate after resin molding from the cavity of the intermediate plate and then take out the unnecessary resin material on the lower mold surface. In this case, each mold surface is cleaned by the cleaning unit.
[0006]
That is, with the mold (upper mold, lower mold, and intermediate plate) opened, a supply mechanism having a substrate and a resin material before resin molding first enters between the upper mold and the intermediate plate. The resin molding side is supplied downward to the cavity, and then the supply mechanism having only the resin material once exits from the mold, and then enters between the intermediate plate and the lower mold to put the resin material into the pot. Supply, and then the supply mechanism exits outside the mold.
Next, in a state where the mold is clamped, a molten resin previously heated and melted is injected into the resin molded body fitted in the cavity through the resin passage, and then the resin is sealed with the molten resin. The molded resin material is cured and the molded material after resin molding in which the molded substrate and the resin passage are in communication with each other is molded.
Next, at the same time when the mold is opened, the cured resin material is cut and separated at the joint portion between the bottom surface of the cavity (resin molded body) and the resin passage communicating with the cavity, and the unnecessary resin material that is the molded substrate and the resin passage And separated.
Next, in a state where the mold is opened, the take-out mechanism first takes out between the upper mold and the intermediate plate and takes out the molded substrate which has been released, and then takes out the take-out mechanism having only the molded substrate. Once out of the mold, take out between the intermediate plate and the lower mold and take out the unnecessary resin material, then take out the molded substrate (product) after resin molding and unnecessary resin material The mechanism leaves the mold.
At this time, each mold surface is cleaned when the mold surface is withdrawn by the cleaning unit of the take-out mechanism.
[0007]
In addition, although patent gazette literature etc. in which the conventional examples as described above are described were investigated, they were not found.
[0008]
[Problems to be solved by the invention]
However, with the mold open, the supply mechanism and take-out mechanism that have molding materials before and after resin molding need to repeatedly enter and exit the three-sheet mold structure. There is a detrimental effect of lowering the sex.
In addition, since the setting conditions for controlling the supply mechanism and the take-out mechanism in the control mechanism are extremely precise, a soft bug in the control mechanism is generated, and accurate control cannot be performed. , The molding material cannot be supplied or taken out accurately, and the workability is significantly reduced.
[0009]
Therefore, according to the present invention, the molding material before and after the resin molding to the resin molding die (three-sheet mold) is separately and simultaneously performed by using the integrated supply mechanism and the extraction mechanism efficiently. The object is to improve the productivity of the product.
[0010]
[Means for Solving the Problems]
In order to solve the above technical problem, a method of supplying to a resin molding die according to the present invention is an electronic device comprising an upper die, a lower die, and an intermediate plate provided between the upper die and the lower die. In a resin molding die for a part, a resin material is supplied to a predetermined position on the upper surface side of the lower mold and a pre-molding substrate is supplied to a predetermined position on the upper surface side of the intermediate plate. Thus, a single supply mechanism is used to supply the resin material and the substrate before molding separately and simultaneously.
[0011]
Further, in order to solve the above technical problem, the method of taking out from the resin molding die according to the present invention includes an upper die, a lower die, and an intermediate plate provided between the upper die and the lower die. In the mold for resin molding of electronic components, a method for taking out from the mold for resin molding, which takes out unnecessary resin material from a predetermined position on the upper surface side of the lower mold and takes out a molded substrate from a predetermined position on the upper surface side of the intermediate plate Then, it is characterized in that an unnecessary resin material and a molded substrate are taken out separately and simultaneously using a single take-out mechanism.
[0012]
Further, in order to solve the above technical problem, the method for taking out from the resin molding die according to the present invention is the above-described take-out method, wherein the take-out mechanism separates the unnecessary resin material and the molded substrate separately and simultaneously. At the time of taking out, at least one of the mold surfaces of the upper mold, the intermediate plate, and the lower mold is cleaned.
[0013]
Further, in order to solve the above technical problem, the supply mechanism to the resin molding die according to the present invention includes an upper die, a lower die, and an intermediate plate provided between the upper die and the lower die. In a resin molding die for electronic components, a supply mechanism to a resin molding die that supplies a resin material to a predetermined position on the upper surface side of the lower mold and supplies a pre-molding substrate to a predetermined position on the upper surface side of the intermediate plate A part for supplying a resin material and a part for supplying a substrate before molding. The part for supplying the resin material is in the lower stage and the part for supplying the pre-molding substrate is in the upper stage, and is connected on one end side of each. The resin material and the pre-molding substrate are separately and simultaneously supplied while being provided integrally.
[0014]
Further, in order to solve the above technical problem, the take-out mechanism from the resin molding die according to the present invention includes an upper die, a lower die, and an intermediate plate provided between the upper die and the lower die. In a resin molding die for electronic parts, an unloading mechanism from a resin molding die for taking out an unnecessary resin material from a predetermined position on the upper surface side of the lower die and taking out a molded substrate from a predetermined position on the upper surface side of the intermediate plate. There is a part to take out the unnecessary resin material and a part to take out the molded substrate. The part where the unnecessary resin material is taken out is at the lower stage, the part from which the molded substrate is taken out is at the upper stage, and the parts are connected on the one end side. In addition to being provided integrally, the unnecessary resin material and the molded substrate are taken out separately and simultaneously.
[0015]
Further, in order to solve the above technical problem, the take-out mechanism from the resin molding die according to the present invention is the take-out mechanism described above, wherein the take-out mechanism separates the unnecessary resin material and the molded substrate separately and simultaneously. At the time of taking out, at least one of the mold surfaces of the upper mold, the intermediate plate, and the lower mold is cleaned.
[0016]
DETAILED DESCRIPTION OF THE INVENTION
In other words, basically, a mold for resin molding (three-plate mold) consisting of an upper mold, a lower mold, and an intermediate plate, and an integral supply mechanism for supplying and taking out molding materials before and after resin molding separately and at the same time. And a mechanism.
In addition, when the mold is opened, a predetermined position between the lower mold surface and the lower mold surface of the intermediate plate and the above-described upper mold surface and the intermediate plate by an integrated supply mechanism. The molding material before resin molding is supplied separately and simultaneously to a predetermined position on at least one mold surface at a predetermined position on the upper mold side mold surface.
Further, after the mold is clamped and the resin molding is completed, when the mold is opened, the molding material after the resin molding is placed at a predetermined position on the above-described at least one mold surface by the integral take-out mechanism. At least one mold surface for cleaning at least one mold surface at the time of entering / exiting from the mold surface can be cleaned by the cleaning unit.
[0017]
Therefore, according to the present invention, the molding material before and after the resin molding to the resin molding die (three-sheet mold) is separately and simultaneously performed by using the integrated supply mechanism and the extraction mechanism efficiently. Thus, the productivity of the product can be improved.
[0018]
【Example】
Hereinafter, it demonstrates in detail based on an Example figure.
[0019]
First, the first embodiment will be described with reference to FIGS.
FIG. 1 is a plan view showing a resin molding apparatus equipped with a supply mechanism and a take-out mechanism for a resin molding die according to the present invention.
2 to 6 are sectional views showing the above-described mold, supply mechanism, and take-out mechanism corresponding to FIG.
[0020]
For example, as shown in FIG. 1, a resin molding apparatus according to the present invention includes a substrate mechanism 1 and a resin material mechanism 2 before resin molding for supplying, transferring, and aligning molding materials (pre-molding materials) before resin molding. An in-module unit 3 (in-unit 3), a press-module unit 6 (press-unit 6) provided with a press mechanism 5 detachably attached to the in-unit 3 and mounted with a resin molding die 4; An out module unit 7 (out unit 7) provided with mechanisms for receiving, delegating, and storing the product after molding (molded material) that is detachably attached to the unit 6 and molded by the mold 4; Conveying rail 8 provided between in-unit 3, press unit 6, and out-unit 7 and pre-molding material that reciprocates along conveying rail 8 are separately and simultaneously supplied to mold 4. A take-out mechanism 10 of the integral remove the molded material after the feed mechanism 9 integral from the mold 4 and simultaneously to each other to, is provided with a control mechanism for controlling the entire device (not shown).
[0021]
In addition, as shown in FIGS. 1 and 4, the pre-molding material means that, for example, three semiconductor chips 12 (electronic components), the substrate 11 side, and the chip 12 are electrically connected to a predetermined portion on the substrate 11 in a line. 3 shows a substrate before resin molding (substrate 100 before molding) composed of a plurality of wires 13 to be connected to each other, and a resin material 14 in three tablet resins.
The chip 12 and the resin material 14 mounted on the substrate 11 may be a single array, a single array, a plurality of arrays, or a plurality of arrays.
Further, as shown in FIG. 5B, the post-molding material indicates a cured molded substrate 37 (product) and an unnecessary resin material 38, which will be described in detail later.
[0022]
Further, as shown in FIG. 1, the substrate mechanism 1 of the in-unit 3 includes, for example, a substrate supply unit 15 that supplies a pre-molding substrate 100, a substrate transfer unit 16 that is transferred from the substrate supply unit 15, and a substrate A substrate alignment unit 17 is provided for aligning the two pre-molding substrates 100 transferred from the transfer unit 16 approximately in parallel at a predetermined interval.
Further, the resin material mechanism 2 of the in-unit 3 includes a resin material supply unit 18 that supplies a resin material 14 that is a tablet resin, a resin material transfer unit 19 that is transferred in series from the resin material supply unit 18, and a resin There is provided a resin material alignment unit 20 for fitting three tablet resins transferred from the material transfer unit 19 in series at predetermined intervals.
Here, the arrangement of the substrate 11 of the substrate aligning portion 17 and the resin material 14 of the resin material aligning portion 20 is configured at a predetermined interval substantially parallel to the two substrates 11 as shown in FIG. That is, it is configured in the same arrangement as that for supplying to the predetermined position of the mold 4 of the press mechanism 5, and in-unit 3, out-unit 7, supply mechanism 9, take-out mechanism corresponding to the arrangement. The ten mechanism arrangements are similarly configured.
Further, as shown in FIG. 1, the out unit 7 receives the two molded substrates 37 and the unnecessary resin material 38 that are cut and separated, which are post-molding materials, and delivers them to the post-molding material by the delivery mechanism 10. A mechanism 40, a delegation mechanism 41 that moves and separates the product and the unnecessary resin material 38 by moving the receiving mechanism 40 having the material after molding, and a product storage mechanism 42 that further moves and stores the receiving mechanism 40 having only the product. And are provided.
[0023]
Further, as shown in FIGS. 1 and 4, the resin molding die 4 of the press mechanism 5 is provided with an upper die 21, a lower die 22, and an intermediate plate 23 between both the dies 21 and 22. .
The upper die 21 is provided with a mold surface (upper die surface 24). The lower mold 22 is provided with a mold surface (lower mold surface 25). Further, the intermediate plate 23 is provided with an upper mold side mold surface 26 that can contact the upper mold surface 24 and a lower mold side mold surface 27 that can contact the lower mold surface 25.
As shown in FIGS. 4 and 5, the intermediate plate 23 includes a recess 28 for substrate setting formed on the upper mold side mold surface 26 and the chip 12 / wire 13 portion (resin molded). A cavity 30 in which the molded body 29) can be fitted downward, and a sprue 32 through which the heat-melted resin material 14 penetrates the lower mold side mold surface 27 vertically from the substantially central portion of the top surface of the cavity 30; Have
Further, on the lower mold surface 25, a runner 33 that is formed and communicated with the sprue 32 of the intermediate plate 23, a resin supply pot 34 that communicates with the runner 33 and supplies the resin material 14, and A resin pressurizing plunger 35 fitted in the pot 34 is provided.
Further, when the mold 4 is clamped, the cavity 30 and the pot 34 can be communicated with each other through the resin passage 31 including the sprue 32 and the runner 33, and the resin passage 31 is formed on the substrate 11. It is configured in a non-contact state.
In addition, a heater (not shown) for heating and melting the resin material 14 is embedded in the mold 4, and the mold 4 is heated to a predetermined temperature by the heater to heat and melt the resin material 14. The molten resin 36 is configured.
[0024]
As shown in FIGS. 1 and 2, the supply mechanism 9 includes both dies 21 and 21 that enter and exit between the upper die 21 and the intermediate plate 23 (upper region A, which is a two-dot chain line portion in the figure). 23 is in non-contact with the upper supply member 43 which is in a non-contact state, and is not in contact with both molds 22 and 23 which enter and exit between the lower mold 22 and the intermediate plate 23 (lower region B which is a two-dot chain line portion in the figure) The lower supply member 44 which is in a state, and the supply connection member 45 which is connected to each of the supply members 43 and 44 and is disposed opposite to the approach direction to the mold 4 and does not collide with the mold 4 are provided.
The upper supply member 43 has an upper mold side mold surface supply unit 46 for supplying the pre-molding substrate 100 to a predetermined position on the upper mold side mold surface 26, and the lower supply member 44 has a predetermined position on the lower mold surface 25. A lower mold surface supply unit 47 for supplying the resin material 14 is provided.
Further, as shown in FIG. 3, the take-out mechanism 10 includes an upper take-out member 48 that enters and leaves the upper region A and a lower take-out member 49 that enters and exits the lower region B, as in the above-described supply mechanism 9. And an extraction connecting member 50 for connecting the extraction members 48 and 49 to each other.
Further, an upper mold side mold surface extraction unit 51 for extracting the molded substrate 37 that has been released from the upper extraction member 48, and a lower mold surface extraction unit 52 for extracting the unnecessary resin material 38 that has been released from the lower extraction member 49. A cleaning portion 54 having four rotating brushes having a cylindrical shape is provided at two tip portions 53 opposite to the take-out connecting member 50.
Each of the supply units 46 and 47 is configured to fix the pre-molding material using a chuck fixing method, an adsorption fixing method, an electromagnetic fixing method, or the like. Furthermore, each extraction part 51 * 52 is comprised so that the material after shaping | molding may be fixed using a chuck | zipper fixing system, a suction fixing system, an electromagnetic fixing system, etc. And each supply part 46 * 47 and each taking-out part 51 * 52 can be attached or detached easily from each supply member 43 * 44 and each taking-out member 48 * 49 so that attachment or detachment is possible.
Therefore, the molding material before and after the resin molding can be separately and simultaneously supplied to and taken out from at least one predetermined position on each mold surface 24, 25, 26, and 27 by the integrated supply mechanism 9 and the extraction mechanism 10. It is configured to be able to.
[0025]
That is, when the integrated supply mechanism 9 supplies the pre-molding material to the mold 4 when the mold 4 is opened, first, the supply mechanism 9 moves along the transport rail 8 in the direction of the in-unit 3, and then Next, the two pre-molding substrates 100 in the substrate alignment unit 17 of the substrate mechanism 1 are received by the upper mold side mold surface supply unit 46 almost simultaneously, and then the three resin materials 14 of the resin material alignment unit 20 are received. The sheet is received by the lower mold surface supply unit 47 substantially simultaneously.
At this time, in order to receive the pre-molding materials 100 and 14 in the alignment units 17 and 20 by the supply units 46 and 47, the standby positions of the alignment units 17 and 20 are moved vertically to supply The parts 46 and 47 are configured to be received separately, and the order in which the supply parts 46 and 47 receive the pre-molding materials 100 and 14 can be arbitrarily selected.
Next, the supply mechanism 9 having the pre-molding materials 100 and 14 moves on the conveyance rail 8 to a standby position (see FIG. 2 (1)) where the press mechanism 5 can enter and exit the mold 4.
Next, the upper supply member 43 enters the upper region A, and the lower supply member 44 enters the lower region B separately and simultaneously. Then, the upper mold side mold surface supply unit 46 extends to a position directly above the predetermined position of the upper mold side mold surface 26, and the lower mold surface supply unit 47 extends to a position immediately above the predetermined position of the lower mold surface 25. Enter and stop (see Fig. 2 (2)).
Next, in the state shown in FIG. 2 (2), the pre-molding substrate 100 fixed to the upper mold side mold surface supply unit 46 is placed with the side on which the resin molded body 29 is to be formed facing down. Supply and set to a recess 28 which is a predetermined position of the side mold surface 26 (see FIGS. 4 and 6). At the same time, the resin material 14 fixed to the lower mold surface supply section 47 is supplied and set to the pot 34 which is a predetermined position of the lower mold surface 25 (see FIG. 4).
Next, the supply members 43 and 44 are individually and simultaneously withdrawn from the mold 4, and then the supply mechanism 9 is moved back to a standby position where it can enter and exit the mold 4. The material 100 · 14 before molding can be continuously supplied to the mold surfaces 25 and 26 in the same manner as described above by moving back along the transport rail 8 in the direction of.
Therefore, when the mold 4 is opened, the predetermined position of the mold surface between the predetermined position of the lower mold surface 25 and the predetermined position of the upper mold side mold surface 26 of the intermediate plate 23 by the integrated supply mechanism 9. In addition, since the pre-molding materials 100 and 14 can be supplied separately and simultaneously, the supply operation can be performed efficiently and the productivity of the product can be improved.
[0026]
Next, when the mold 4 is clamped, the resin material 14 heated and melted in the pot 34 is pressurized by the plunger 35, whereby the molten resin 36 is introduced into the cavity 30 through the resin passage 31 (the sprue 32 and the runner 33). Fill and fill (see FIG. 5 (1)).
Next, after the time required for curing has elapsed, the mold 4 is opened and the resin molded body 29 molded in the cavity 30, the molded substrate 37 to be the substrate 11, and unnecessary resin in the resin passage 31, etc. The resin molded body 29 and the unnecessary resin material 38 are cut and separated at the joint portion 39 between the top surface of the cavity 30 and the sprue 32 (see FIG. 5B).
[0027]
Next, when the integrated take-out mechanism 10 takes out the molded material from the mold 4 when the mold 4 is opened, first, a standby position where the take-out mechanism 10 can enter and exit the mold 4 of the press mechanism 5, that is, Moves on the transport rail 8 to the same position as the standby position of the supply mechanism 9 shown in FIG.
Next, the upper take-out member 48 enters the mold 4 separately and simultaneously into the upper region A and the lower take-out member 49 into the lower region B, and then the upper die side die surface takeout part 51 is the upper die side die 51. The upper part of the mold surface 26 at a predetermined position and the lower mold surface take-out part 52 enter the mold 4 separately and simultaneously to the upper part of the lower mold surface 25 at a predetermined position (see FIG. 3 (1)). .
At this time, the upper mold surface 24 having no post-molding material and the lower mold side mold surface 27 of the intermediate plate 23 are simultaneously formed by the entry of the two cleaning portions 54 that come into contact with the mold surfaces 24 and 27. It is cleaned (see FIG. 3 (1)).
Next, in the state shown in FIG. 3 (1), the upper mold side mold surface extraction portion 51 is separated from the recess 28, which is a predetermined position of the upper mold side mold surface 26, on the side of the resin molded body 29 that has been released. Then, the molded substrate 37 is taken out (see FIG. 6). At the same time, the lower mold surface take-out portion 52 takes out the unnecessary resin material 38 which is cured and released from the intermediate plate 23 in the resin passage 31 where the sprue 32 and the runner 33 communicate with each other at a predetermined position of the lower mold surface 25 ( (See FIG. 6).
Note that FIG. 6 is described with the four cleaning units 54 omitted from the example.
Next, the take-out mechanism 10 having the post-molding materials 37 and 38 is withdrawn from the mold 4 separately and simultaneously.
At this time, the lower mold surface 25 that is not cleaned at the time of entry and the upper mold side mold surface 26 of the intermediate plate 23 are simultaneously released by the two cleaning portions 54 that come into contact with the mold surfaces 25 and 26 withdraw. It is cleaned (see FIG. 3 (2)).
Next, the molded substrate 37 and the unnecessary resin material 38 which are separated by moving along the transport rail 8 in the direction of the out unit 7 are moved back to the standby position where the mold 4 can enter and exit. Are received by the receiving mechanism 40.
At this time, in order to receive the post-molding materials 37 and 38 in the take-out portions 51 and 52 by the receiving mechanism 40, the post-molding materials 37 and 38 are separately moved by moving the standby position of the receiving mechanism 40 in the vertical direction. The order in which the receiving mechanism 40 receives the post-molding materials 37 and 38 can be arbitrarily selected.
In this case, the molded substrate 37 is received by moving the standby position of the receiving mechanism 40 in the vertical direction, but the unnecessary resin material 38 that has been cut and separated is discarded for unnecessary materials provided in the lower part of the receiving mechanism 40. It is configured to be disposed of in a part (not shown).
Next, the take-out mechanism 10 moves back in the direction of the press unit 7 along the transport rail 8 to a standby position where it can enter and exit the die 4, thereby returning the post-molding materials 37 and 38 to the die surfaces 25 and 26. Can be continuously taken out as described above.
Therefore, when the mold 4 is opened, the predetermined position of the mold surface between the predetermined position of the lower mold surface 25 and the predetermined position of the upper mold side mold surface 26 of the intermediate plate 23 is removed by the integral take-out mechanism 10. In addition, since the post-molding materials 37 and 38 can be taken out separately and simultaneously, the take-out operation can be carried out efficiently and the productivity of the product can be improved.
[0028]
Next, since the molded substrate 37 and the unnecessary resin material 38 are cut and separated when the mold 4 is opened, the receiving mechanism 40 having only the product is directly connected to the product storage mechanism 42 without using the delegate mechanism 41. Next, the product is picked up from the receiving mechanism 40 on which the molded substrate 37 that has reached the product storage mechanism 42 is placed, and a plurality of products are stored in the product storage mechanism 42. Then, the molded materials 37 and 38 are returned to the receiving position.
[0029]
That is, the molding material before and after the resin molding to the resin molding die 4 (three-sheet mold) mounted on the above-described apparatus capable of continuous resin molding is separately and simultaneously provided with an integral supply mechanism 9 and an extraction mechanism 10. By using this, it is possible to efficiently carry out supply / removal work and improve product productivity.
[0030]
Next, second and third embodiments will be described with reference to FIGS.
Basically, the same reference numerals as those in the first embodiment are used as the first embodiment, and portions that are significantly different from the first embodiment will be described later.
Also, when the mold 4 is opened, the pre-molding materials 100 and 14 are supplied to the mold 4 directly above the feeding mechanism 9 as shown in FIGS. 7 (2) and FIG. 8 (2) taken out from the mold 4 by the take-out mechanism 10, and the cleaning unit 54 will be described by omitting it from the illustrated example.
[0031]
That is, in the second embodiment, as shown in FIG. 7 (1), when the mold 4 is opened, the resin material 14 and the resin molding are formed in the lower region B separately and simultaneously by the integrated supply mechanism 9. The pre-molding substrate 100 is supplied with the body 29 side upward.
Further, as shown in FIG. 7 (2), when the mold 4 is opened, the two molded substrates 37 and the unnecessary resin material 38 that are molded and cured by resin and cut and separated at the joint 39 are formed. The two parts of the molded substrate 37 and the unnecessary resin material 38 are released from the lower region B and removed from the upper region A separately and simultaneously by the integrated extraction mechanism 10.
Therefore, the molding material before and after resin molding on the resin molding die 4 (three-sheet mold) mounted on the apparatus of the first embodiment capable of continuous resin molding is taken out separately and simultaneously with the integrated supply mechanism 9. By using the mechanism 10, it is possible to efficiently carry out the supply / removal work and improve the productivity of the product.
[0032]
Further, in the third embodiment, as shown in FIG. 8 (1), when the mold 4 is opened, the integral material supply mechanism 9 separately and simultaneously forms the resin material 14 and the resin molding in the upper region A. Similarly to the upper region A, the two pre-molding substrates 100 with the body 29 side facing upward and the lower region B with the two pre-molding substrates 100 facing the resin molded body 29 side with the upper direction A are also provided. Supplied.
Further, as shown in FIG. 8B, when the mold 4 is opened, two molded substrates 37 (one set) which are resin-molded and cured and joined to the unnecessary resin material 38 at the joint 39. The two after-molding materials in the upper region A and the lower region B are separated and taken out by the integrated take-out mechanism 10 separately and simultaneously.
In this case, although not shown, the mold 4 is configured to communicate with the resin passage 31 including the cavity 30 and the pot 34 when the mold 4 is clamped, and the resin passage 31 is in contact with the substrate 11. It is configured.
Further, by using the degate mechanism 41 shown in FIG. 1, each joint 39 between the two unnecessary molded resin materials 38 and the two molded substrates 37 is cut and separated to form four molded products. Only the substrate 37 (product) is moved to the product accommodation mechanism 42.
That is, the four pre-molding substrates 100 can be molded simultaneously.
Accordingly, the molding material before and after the resin molding to the resin molding die 4 (three-sheet mold) mounted on the apparatus of the first embodiment capable of continuous resin molding is separately and simultaneously provided with an integral supply mechanism and an extraction mechanism. Can be used to efficiently carry out the supply / removal work and further improve the productivity of the product.
[0033]
In the first, second, and third embodiments (the present embodiment), as shown in FIG. 10, for example, a plurality of press units 6 that are connected in four units are in-unit. 3. An apparatus provided between the out unit 7 may be used.
Although not shown in the figure, for example, the press mechanism 5 is disposed between the two transport rails 8 so that the supply mechanism 9 is attached to one rail 8 and the other rail is provided. 8 may be configured to attach the take-out mechanism 10.
Further, the configuration conditions of the apparatus in the present embodiment are not limited to those shown in FIGS. 1 and 10, and additions, changes, and deletions in arrangement, shape, dimensions, material, material, control, and the like may be performed.
[0034]
Although not shown in the figure, the pre-molding substrate 100 includes, for example, a plurality of bumps that electrically connect the chip 12, the substrate 11 side, and the chip 12 arranged at predetermined positions on the substrate 11. The pre-molding substrate 100 (flip chip substrate) that constitutes the substrate may be used, and the resin material 14 may be changed in shape, size, material, etc., even with any resin material 14 such as liquid resin, granule resin, and powder resin You may respond.
[0035]
As for the post-molding material, as shown in FIG. 9 (1), the molded substrate 37 excluding the mold 4 structure in the first embodiment and the unnecessary resin material 38 are joined, The single chip 12 fitted into the single cavity 30 is resin-molded. As shown in FIGS. 9 (2), 9 (3), and 9 (4), for example, a plurality of chips 12 are formed. A plurality of chips 12 in a single row or a plurality of rows 12 may be resin-molded in each cavity 30.
Further, the joint portion 39 such as the resin passage 31 is provided in a non-contact state on the surface of an arbitrary cavity 30 that is the side surface of the cavity 30 as shown in FIG. Alternatively, as shown in FIG. 9 (3), a resin passage 31 may be provided in contact with the substrate 11 on the chip 12 mounting side.
[0036]
Further, for the mold 4 (three-sheet type) of the press mechanism 5 in this embodiment, transfer molding in which the resin material 14 is injected and filled into the cavity 30 through the resin passage 31 is employed. In a state where the melted resin material 14 is prepared in advance, the pre-molding substrate 100 is supplied and set at a predetermined position on the upper mold surface 24 and does not have the resin passage 31 in which the resin molded body 29 side is immersed downward. Resin molding may be performed by substrate immersion molding.
Further, also in the transfer molding and the substrate immersion molding in this embodiment, when the mold 4 is clamped, at least the mold surface in contact with the heat-melted resin material 14 is in the outside air blocking state, and the outside air blocking range is set. It is used together with vacuum forming for forcibly sucking and discharging air within the outside air blocking range, or a release film for supplying a release film to at least one of the upper region A and the lower region B of the mold 4. A mold film supply mechanism (not shown) may be provided, and resin molding may be performed together with film molding.
An auxiliary mechanism such as a film stretching means is provided on the supply members 43 and 44 of the supply mechanism 9 and the take-out mechanism 10 and the take-out members 48 and 49 so that the release film can be covered and stretched. You may implement.
[0037]
Further, the supply connection member 45 and the extraction connection member 50 of the supply mechanism 9 and the extraction mechanism 10 are not arranged opposite to the entry direction to the mold 4 and are formed into the upper supply area A and the lower supply area B before molding. As long as the materials 100 and 14 can be supplied and taken out, the supply members 43 and 44 and the take-out members 48 and 49 may be appropriately selected and connected in any arrangement.
Further, in order to clean the mold surfaces 24, 25, 26, and 27 by the cleaning unit 54, the mold surfaces to be cleaned are appropriately changed and cleaned at the same time as the take-out mechanism 10 enters and exits. be able to.
In addition, the cleaning unit 54 is illustrated as having a cleaning member such as a rotating brush, for example. However, the cleaning unit 54 may include a cleaning unit such as a vacuum, or a combination of a cleaning member and a cleaning unit.
Further, the cleaning unit 54 is provided at the tip 53 of the integrated take-out mechanism 10. However, if the mold surfaces 24, 25, 26, and 27 can be appropriately cleaned separately and at the same time, the arrangement, shape, and dimensions are determined.・ Additions, changes, and deletions in materials, materials, and controls may be performed.
Further, in the first and second embodiments, the unnecessary resin material 38 that has been cut and separated is discarded into the waste section for unnecessary materials provided in the lower portion of the receiving mechanism 40, but as in the case of the third embodiment. The material after molding that has not been cut and separated may be provided with a discarding portion at the bottom when it is delegated by the degate mechanism 41, or a discarding mechanism that can discard both the discarding units in the apparatus or outside the apparatus in a lump ( (Not shown) may be provided as appropriate.
[0038]
Further, the present invention is not limited to the above-described embodiments, and can be arbitrarily changed and selected as necessary within a range not departing from the gist of the present invention. .
[0039]
【The invention's effect】
According to the present invention, the molding material before and after the resin molding to the resin molding die is separately and simultaneously performed by using the integral feeding mechanism and the unloading mechanism to efficiently carry out the feeding and unloading work. It has an excellent effect of improving productivity.
[Brief description of the drawings]
FIG. 1 is a plan view showing a resin molding apparatus equipped with a supply mechanism and a take-out mechanism for a resin molding die in this embodiment according to the present invention.
2 (1) and FIG. 2 (2) are schematic enlarged lateral side views showing a supply mechanism corresponding to FIG.
3 (1) and 3 (2) are schematic enlarged cross-sectional views showing the take-out mechanism corresponding to FIG.
FIG. 4 is a schematic enlarged vertical side view showing a supply mechanism corresponding to FIG. 2 (2).
5 (1) and FIG. 5 (2) are schematic enlarged longitudinal sectional views showing the mold corresponding to FIG.
FIG. 6 is a schematic enlarged vertical side view showing the take-out mechanism corresponding to FIG. 3 (1).
FIGS. 7A and 7B are schematic enlarged vertical side views showing a supply mechanism and an extraction mechanism in another embodiment according to the present invention.
8 (1) and 8 (2) are schematic enlarged vertical side views showing a supply mechanism and a take-out mechanism in another embodiment according to the present invention.
9 (1) to 9 (4) are schematic enlarged perspective views of a post-molding material according to the present invention.
FIG. 10 is a plan view showing another resin molding apparatus equipped with a supply mechanism and an extraction mechanism for a resin molding die in the present embodiment according to the present invention.
[Explanation of symbols]
1 Substrate mechanism
2 Mechanism for resin materials
3 In-module unit (in-unit)
4 Molds for resin molding (three-sheet mold)
5 Press mechanism
6 Press module unit (press unit)
7 Out module unit (out unit)
8 Transport rail
9 Supply mechanism
10 Removal mechanism
11 Substrate
12 Semiconductor chip
13 wires
14 Resin materials
15 Substrate supply unit
16 Substrate transfer section
17 Board alignment part
18 Resin material supply section
19 Resin material transfer section
20 Resin material alignment section
21 Upper mold
22 Lower mold
23 Intermediate plate
24 Upper mold surface
25 Lower mold surface
26 Upper mold side mold surface
27 Lower mold side mold surface
28 recess
29 resin moldings
30 cavities
31 Resin passage
32 sprue
33 Lanna
34 pots
35 Plunger
36 Molten resin
37 Molded substrate (product)
38 Unnecessary resin material
39 joints
40 Receiving mechanism
41 Degate mechanism
42 Product storage mechanism
43 Upper supply member
44 Lower supply member
45 Supply connection member
46 Upper mold side mold surface supply section
47 Lower mold surface supply section
48 Upper extraction member
49 Lower extraction member
50 Extraction connecting member
51 Upper mold side mold surface extraction part
52 Lower mold surface extraction part
53 Tip
54 Cleaning section
A Upper area
B Lower area

Claims

Resin material is supplied to a predetermined position on the upper surface side of the lower mold in a mold for resin molding of an electronic component comprising an upper mold, a lower mold, and an intermediate plate provided between the upper mold and the lower mold And a supply method to the resin molding die for supplying the pre-molding substrate to a predetermined position on the upper surface side of the intermediate plate,
A supply method to a resin molding die, wherein a single supply mechanism is used to supply the resin material and the pre-molding substrate separately and simultaneously.

In a mold for resin molding of an electronic component comprising an upper mold, a lower mold, and an intermediate plate provided between the upper mold and the lower mold, an unnecessary resin material is applied from a predetermined position on the upper surface side of the lower mold. It is a method for taking out from a mold for resin molding to take out a molded substrate from a predetermined position on the upper surface side of the intermediate plate,
A method for taking out from a resin molding die, wherein the unnecessary resin material and the molded substrate are taken out separately and simultaneously using a single take-out mechanism.

The take-off mechanism cleans at least one of mold surfaces of the upper mold, the intermediate plate, and the lower mold when the unnecessary resin material and the molded substrate are taken out separately and simultaneously. The method for taking out from the resin molding die according to claim 2.

Resin material is supplied to a predetermined position on the upper surface side of the lower mold in a mold for resin molding of an electronic component comprising an upper mold, a lower mold, and an intermediate plate provided between the upper mold and the lower mold And a supply mechanism to the resin molding die for supplying the pre-molding substrate to a predetermined position on the upper surface side of the intermediate plate,
The portion for supplying the resin material and the portion for supplying the pre- molding substrate are arranged such that the portion for supplying the resin material is at the bottom and the portion for supplying the substrate before molding is at the top. It is provided integrally so as to be connected on one end side ,
A supply mechanism for a resin molding die, wherein the resin material and the pre-molding substrate are separately and simultaneously supplied.

In a mold for resin molding of an electronic component comprising an upper mold, a lower mold, and an intermediate plate provided between the upper mold and the lower mold, an unnecessary resin material is applied from a predetermined position on the upper surface side of the lower mold. A take-out mechanism from a resin molding die that takes out a molded substrate from a predetermined position on the upper surface side of the intermediate plate,
The part from which the unnecessary resin material is taken out and the part from which the molded substrate is taken out are arranged such that the part from which the unnecessary resin material is taken out is at the bottom and the part from which the molded substrate is taken out is at the top. It is integrally provided so as to be connected on the end side ,
A mechanism for taking out a resin molding die, wherein the unnecessary resin material and the molded substrate are taken out separately and simultaneously.

The take-off mechanism cleans at least one of mold surfaces of the upper mold, the intermediate plate, and the lower mold when the unnecessary resin material and the molded substrate are taken out separately and simultaneously. The take-out mechanism from the resin molding die according to claim 5.