JP4066608B2 - Package molded body and manufacturing method thereof - Google Patents
Package molded body and manufacturing method thereof Download PDFInfo
- Publication number
- JP4066608B2 JP4066608B2 JP2001077002A JP2001077002A JP4066608B2 JP 4066608 B2 JP4066608 B2 JP 4066608B2 JP 2001077002 A JP2001077002 A JP 2001077002A JP 2001077002 A JP2001077002 A JP 2001077002A JP 4066608 B2 JP4066608 B2 JP 4066608B2
- Authority
- JP
- Japan
- Prior art keywords
- lead electrode
- parting line
- molded body
- positive
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Description
【０００１】
【発明の属する分野】
本発明は各種インジケーター、ディスプレイ、光プリンターの書き込み光源及び液晶のバックライト用光源などに利用可能な発光素子を用いた発光装置に関し、特に発光装置の信頼性及び量産性の向上を図った発光装置の構成に関するものである。
【０００２】
【従来の技術】
近年、小型・薄型化を目的として、表面実装タイプの発光装置がリードタイプの発光装置に代えて多く使用されるようになって来ている。
この面実装タイプの発光装置は、パッケージ成形体の内部に発光素子チップが設けられ、そのパッケージは、発光素子チップの正負の電極がそれぞれ接続される正及び負のリード電極が一体成形されてなる。尚、このパッケージにおいて、正及び負のリード電極は、パッケージの接合面の両端部でその接合面に沿って内側に折り曲げられてなり、その内側に折り曲げられた部分ではんだ付けされるように構成されている。このようにして、光学特性に優れた発光装置とすることができる。
【０００３】
【発明が解決しようとする課題】
しかしながら、発光装置の利用分野の広がりと共に厳しい使用条件のもとで使用されるようになってきた現在では、さらに高い信頼性を有する発光装置が求められている。
【０００４】
そこで本発明は、厳しい環境条件のもとでも十分高い信頼性を有し且つ歩留まり良く生産することが可能なパッケージ成形体及びそれを用いた発光装置を提供することを目的とする。
【０００５】
以上の目的を達成するために、本発明に係るパッケージ成形体は、発光素子を収納する凹部と正と負のリード電極とを有し、前記正と負のリード電極の主面が前記凹部底面にてそれぞれ露出されかつ前記正と負のリード電極のそれぞれの一端部が外部に露出されているパッケージ成形体であって、前記リード電極の側面と交差したパーティングラインを側面に有し、前記パーティングラインから前記リード電極の側面の厚さ方向に樹脂バリを有し、前記パーティングライン下面側の成形樹脂部の幅は、前記パーティングライン上面側の成形樹脂部より幅狭であり、前記リード電極が、前記パーティングラインの下側の成形樹脂部の幅狭の部分に折り曲げられて納められていることを特徴とする。以上のように構成された本発明に係る発光装置用のパッケージ成形体は、高い信頼性を有し且つ製造歩留まり良く得ることができる。
【０００６】
また、本発明に係るパッケージ成形体の製造方法は、発光素子を収納する凹部と正と負のリード電極とを有し、前記正と負のリード電極の主面が前記凹部底面にてそれぞれ露出されかつ前記正と負のリード電極のそれぞれの一端部が外部に露出されているパッケージ成形体を製造する方法であって、前記リード電極を準備する工程と、金型の合わせ目の両方に凹部を有する上下の金型を準備する工程と、前記リード電極の側面が前記上下の金型の合わせ目と交差するように、前記リード電極を前記金型内に挿入する工程と、前記金型に成形樹脂を注入して、前記リード電極の側面と交差したパーティングラインを側面に有し、前記パーティングラインの下側の成形樹脂部が前記パーティングラインの上側の成形樹脂部よりも幅狭になるようにパッケージ成形体を形成する工程と、前記パーティングラインから前記リード電極の側面の厚さ方向に樹脂バリを形成する工程と、前記リード電極を折り曲げて前記パーティングラインの下側の成形樹脂部の幅狭の部分に納める工程と、を含むことを特徴とする。
【０００７】
【発明の実施の形態】
以下、本発明に係る実施の形態の発光装置について説明する。
本発明に係る実施の形態の発光装置は、以下のようにして構成される。
本実施の形態の発光装置において、パッケージ成形体は、例えば図１（ａ）に示すように、正のリード電極２ａと負のリード電極２ｂとが成形樹脂１により一体成形されて作製される。
詳細に説明すると、パッケージ成形体の上面には、発光素子を収納する凹部を有し、その凹部の底面には、正のリード電極と負のリード電極とが互いに分離されてそれぞれの主面が露出するように設けられる。
尚、本明細書において、パッケージ成形体の上面とは、発光素子が載置される側の面をいい、下面とは、実装基板に対向する面のことをいう。
【０００８】
また、正のリード電極の一端と負のリード電極の一端とは凹部の底部において互いに対向するように設けられ、正のリード電極の一端と負のリード電極の一端との間には成形樹脂が充填され、凹部の底面が形成される。
また、パッケージ成形体において、正のリード電極の他端と負のリード電極の他端は、成形樹脂部の側面から突き出すように設けられ、その突き出したアウタ・リード部がパッケージ成形体の下面である接合面の内側に折り曲げられて正負の接続端子部が構成される。
【０００９】
このような構成を有する発光装置用パッケージ成形体を用い、前記パッケージ成形体の凹部底面に発光素子が電気的に接続され、これらを覆うように前記凹部内にモールド部材である透光性樹脂が充填されて本発明の発光装置が得られる。
【００１０】
ここで、特に本実施の形態の発光装置は、パッケージ成形体の側面において、成形金型の合わせ目により形成されるパーティングライン３がアウタ・リード部２ａ、２ｂの側面と交差していることを特徴とし、これによって本実施の形態の発光装置は、厳しい使用環境下においても高い信頼性を有し且つ量産性良く得ることができるという優れた効果を有する。
【００１１】
すなわち本発明者は、種々の実験の結果、リード電極と成形樹脂部材との密着性が悪いことに起因して、信頼性の劣化や歩留まりの低下が起こることを見いだし、その問題点を解決するために完成されたものである。
【００１２】
リード電極がインサートされ一体成形されてなるパッケージ成形体は、前記リード電極を成形金型により挟み込み、閉じられた前記金型内に溶融された樹脂が注入及び硬化されて形成される。
【００１３】
成形金型の合わせ面は、成形機により強力に型締されてはいるものの、樹脂の射出圧力により金型に変形やズレが生じ、前記合わせ面の僅かな隙間が生じる。本明細書において、前記隙間に形成される樹脂線をパーティングラインと定義する。前記パーティングラインは外見上問題なく実装することができる。
【００１４】
しかしながら、金型の合わせ面がだれてしまったり、又は前記合わせ面の延長上に平面が存在したりすると、前記パーティングラインから横方向に樹脂バリが生じる傾向にある。
【００１５】
このような樹脂バリは、成形条件を修正したり型締力の大きい成形機を使用することにより抑制できる。
【００１６】
しかしながら、リード電極形成用金型の摩耗の度合いにより挿入されるリード電極の形状は常に一定ではなく、前記リード電極と成型金型との界面には多少の隙間が生じてしまう。この隙間と前記金型の合わせ目とが平行ライン上に位置していると、上記の対策では十分に対処できず前記リード電極の面に沿って前記パーティングラインから横バリが生じてしまう。
【００１７】
図３に示すように、リード電極の背面の延長線上に成型金型の合わせ目により形成されたパーティングラインを有するパッケージ成形体は、前記パーティングラインから前記リード電極のアウタ・リード部の背面に沿って横バリを有する傾向にある。前記横バリはフォーミング工程において障害となり、発光装置が小型化となるようにリード電極を成形樹脂部の側面に精度良く沿わせて加工することが非常に困難となる。また、この際にリード電極と成形部材との界面に縦方向に応力がかかり、横方向に延びたバリの先端部分から前記界面に隙間が生じ、更には横バリが剥がれたりする。
【００１８】
バリの剥がれは、成形部材のクラックの要因となり、前記クラックから水分や不純物が侵入され発光装置の信頼性がひどく低下してしまう。また、深くバリが剥れた場合には空壁が生じ外観不良となる。
【００１９】
これに対して、本実施の形態で用いられるパッケージ成形体は、インサートされたリード電極の側面とパーティングラインとが交差するように構成されることにより、前記のような樹脂バリの発生を最小限に押さえることができる。また、樹脂の充填ミス等により樹脂バリが発生したとしても、樹脂漏れ口であるパーティングラインとリード電極との接点が前記リード電極の側面上にあるため、前記接点部分からの樹脂もれの流れはリード電極の厚さ方向に導かれる。つまり樹脂バリは、パーティングラインからリード電極の側面の厚さ方向に沿って形成された縦バリのみとすることができる。前記縦バリは、横バリと比べ縦方向の応力に比較的強く剥がれにい。また本発明のパッケージ成形体はリード電極の長手方向にバリを有しないためフォーミング工程を良好に行うことができる。
【００２０】
以下、本発明の発光装置の各構成について詳述する。
（リード電極）
リード電極は、鉄入り銅等の高熱伝導体を用いて構成することができる。また、発光素子からの光の反射率の向上及びリード基材の酸化防止等のために、リード電極の表面に銀、アルミ、銅や金等の金属メッキを施すこともでき、またリード電極の表面の反射率を向上させるため平滑にすることが好ましい。また、リード電極の面積は大きくすることが好ましく、このようにすると放熱性を高めることができ、配置される発光素子チップの温度上昇を効果的に抑制することができる。これによって、発光素子チップに比較的多くの電力を投入することが可能となり光出力を向上させることができる。
【００２１】
リード電極は、例えば、０．１５ｍｍ厚の銅合金属からなる長尺金属板をプレスを用いた打ち抜き加工により各パッケージ成形体の正負のリード電極となる部分を形成する。プレス加工後の長尺金属板の各パッケージ成形体に対応する部分において、正のリード電極は、成形後のパッケージ凹部の底面でその一端面が負のリード電極の一端面と対向するように負のリード電極とは分離されている。
【００２２】
またリード電極は、リード電極の一端面に垂直な中心線を対称な軸とする開口部を有することが好ましく、これにより成形樹脂との結合強度を強くすることができる。この開口部はパッケージ成形体の端部の内側と外側に跨って位置するように設けられ、リード電極と成形樹脂との結合強度を強くすることができる。また、パッケージ成形体の外壁から突き出した各リード電極を、成形樹脂に大きな力がかからないように加工することができ信頼性の低下が抑制される。
【００２３】
更に、前記開口部は、射出成形後に少なくともそれぞれの開口部の一部が凹部底面から露出されることが好ましい。これにより成形樹脂とモールド樹脂と接合強度が強化され、ダイボンディング及びワイヤーボンディングによるリード電極の位置ズレを抑制することができる。
ここで、本実施の形態では、正のリード電極の一端面に垂直な中心線と負のリード電極の一端面に垂直な中心線は同一線上であり、その中心線が凹部底面の縦軸（本明細書において、凹部底面の直交する２つの軸のうちの上記中心軸と一致させる一方の軸を便宜上、縦軸と称し、他方の軸を横軸と称する。）と一致しており、このようなパッケージ成形体を用いることで信頼性が高く且つ指向特性に優れた発光装置が得られる。
特に、本実施の形態においては、凹部の底面に位置する正のリード電極にパッケージの縦軸に対して左右対称に２つの樹脂露出部が形成され、凹部の底面に位置する負のリード電極にパッケージの縦軸に対して左右対称に２つの樹脂露出部が形成されているので、左右対称の配置をとらない場合に比較して、透光性樹脂とパッケージ成形体との接合をより強くできるとともに左右対称の指向特性が得られ好ましい。
【００２４】
本発明の発光装置において、リード電極の背面と側面との交わる角は曲線を帯びていることが好ましい。このように、樹脂を注入する方向に合わせてリード電極の端部に丸びを設けると成形樹脂の流れがスムーズとなり、前記リード電極と成形樹脂部との密着性が強化させる。また、パッケージ底面に露出された一対のリード電極間の空間に隙間なく樹脂を充填させることができる。
また、成形樹脂部のリード電極との接合ラインは、前記リード電極と対応した形状となる。よって上記の形状を有するリード電極を用いると、成形樹脂部の側面上の前記背面との接合ラインは、底角が曲線を帯びた凹部形状とすることができる。これにより前記接合ラインにおける応力集中が回避されパッケージ・クラックの発生を抑制することができる。
【００２５】
また更に、リード電極の主面と側面との交わる角は鋭角に盛り上がっていることが好ましい。これにより、パッケージ凹部底面から露出される正のリード電極と負のリード電極との空間からパッケージ成形時に注入される成形樹脂が各リード電極の主面上への流出を阻止することができ、発光素子のダイボンディン不良及びワイヤーボンディング不良を防止することができる。また、リード電極とモールド樹脂との密着性が向上され、これらの界面での剥離を抑制することができる。
【００２６】
ここで、リード電極の主面とは、パッケージ成形体の凹部から露出される面側をいい、背面とは成形樹脂部と接する面側をいう。
【００２７】
また、パッケージ成形体の外壁から突き出した正のリード電極と負のリード電極のアウタ・リード部は、図１に示すようにパッケージ成形体の接合面の内側に折り曲げられ、Ｊ−ベンド（Ｂｅｎｄ）型の正負の接続端子部となる。尚、本発明の接続端子部の構造は、Ｊ−ベンド（Ｂｅｎｄ）型に限られるものではなく、ガルウィング型等の他の構造であってもよい。
【００２８】
（成形樹脂部）
本実施の形態の成形樹脂部は、正及び負からなる一対のリード電極がインサートされて閉じられた金型内に、パッケージ成形体の下面側にあるゲートから溶融された成形樹脂を流し込み硬化して形成される。また前記金型は、金型の合わせ目の両方に、リード電極を配置させるために彫り込まれた凹部を有する。つまりリード電極は、リード電極の側面が上下の金型の合わせ目と交差するように金型間に挿入される。このようにして形成されたパッケージ成形体は、インサートされたリード電極の側面と交差したパーティングラインを有する。これにより、成形樹脂部形成の際の樹脂量の調整ミス及び金型の型締圧の調整ミス等により、金型の合わせ目から樹脂が余分に流出しても、パーティングライン部分から流れ生じる樹脂バリは前記リード電極の厚さ方向に延びた縦バリとして形成されるため、リード電極の加工不良を抑制することができる。
【００２９】
また、電極の実装接合面と成形樹脂の底面とが略同一平面上となるように、成形樹脂部はゲートの両側の接合面に峰状の第１凸部及び第２凸部を有し、且つ前記第１凸部と第２凸部とが所定の空間を有するように構成されると、前記空間内にフロー半田時の仮止め樹脂を精度良く充填し、前記仮止め樹脂が前記リード電極の主面側に付着することで起こる半田付け不良を抑制することができ好ましい。
【００３０】
また、成形樹脂部の側面は、パーティングラインから下面側にかけてテーパ形状であると、成形金型から離型させる場合の成形樹脂部にかかる応力を緩和することができる。またテーパー形状に沿ってリード電極を加工することは容易であり、小型の発光装置が得られ好ましい。更に、パーティングラインから下面側の成形樹脂部の幅を前記パーティングライン上面側の成形樹脂部よりリード電極の厚さ程度狭くすると、前記上面側の成形樹脂部の幅以内にリード電極を納めることができ、密に実装することが可能な発光装置が得られる。
【００３１】
（発光素子）
本実施の形態に用いられる発光素子は、パッケージ成形体の凹部底面に露出された負のリード電極又は正のリード電極上に配置され、そのｎ電極と負のリード電極とがワイヤボンディングにより接続され、同様にｐ電極と正のリード電極とがワイヤボンディングにより接続される。このように、リード電極上に発光素子を配置させると発光素子の放熱性が向上され好ましい。
ここで、発光素子は、例えば、青色の発光が可能な窒化ガリウム系化合物半導体素子であり、該素子は、例えばサファイア基板上にｎ型層、活性層及びｐ型層を含む窒化物半導体層が形成され、活性層及びｐ型層の一部を除去して露出させたｎ型層の上にｎ電極が形成され、ｐ型層の上にｐ電極が形成されてなる。
【００３２】
（モールド部材）
前記発光素子を覆うように、パッケージ成形体の凹部内にモールド部材として透光性樹脂が充填される。透光性樹脂は、外力、水分等から発光素子を保護することができる。また透光性樹脂は、発光素子からの光を効率よく外部に等かさせるために高い光の透過性が要求される。尚、発光素子の電極とリード電極との間をワイヤーで接続する構造においてはワイヤーを保護する機能も有するものである。透光性樹脂等の具体的材料としては、エポキシ樹脂、シリコーン樹脂やアクリル樹脂等が適しており、透光性樹脂中にはＬＥＤチップからの光に対して特定のフィルター効果等を持たす為に着色染料や着色顔料を添加することもできる。
【００３３】
本実施の形態では、パッケージ成形体の凹部の底面に、正のリード電極に形成された開口部を介して成形樹脂が凹部の底面露出し、負のリード電極に形成された開口部を介して成形樹脂が凹部の底面に露出しているので、露出した成形樹脂とモールド樹脂とが強固に接合され、モールド樹脂とパッケージ成形体との接合を強くすることができる。
【００３４】
以上のように実装された実施の形態のパッケージ成形体は、挿入されたリード電極の側面とパーティングラインとが交差している。このようなパッケージ成形体を用いると、表面実装での高温／多湿環境に悪化されることなく高い耐湿性を有する発光装置を得ることができる。
【００３５】
【発明の効果】
以上詳細に説明したように、本発明に係るパッケージ成形体は、パーティングラインが挿入されたリード電極の側面と交差しているため、樹脂バリの流れる方向を所望の方向に調整することができ、高い信頼性を有し且つ製造歩留まり良く製造することができる。
また、本発明に係る発光装置は、信頼性の高い発光装置用のパッケージ成形体を有するため、信頼性及び光学特性の優れた発光装置が得られる。
【図面の簡単な説明】
【図１】 本発明の実施の形態であるパッケージ成形体の模式的側面図である。
【図２】 本発明の他の実施の形態であるパッケージ成形体の模式的側面図である。
【図３】 従来例の問題点を説明するための模式的側面図である。
【図４】 （ａ）は本発明の実施の形態である発光装置の模式的指図であり、（ｂ）はその模式的断面図である。
【符号の説明】
１…成形樹脂部、
２ａ…正のリード電極、
２ｂ…負のリード電極、
３…パーティングライン、
４…横バリ、
５…発光素子、
６…ワイヤ、
７…モールド部材。[0001]
[Field of the Invention]
The present invention relates to a light-emitting device using a light-emitting element that can be used for various indicators, displays, writing light sources for optical printers, light sources for backlights of liquid crystals, and the like. Is related to the configuration of
[0002]
[Prior art]
In recent years, surface-mounted light emitting devices have been increasingly used in place of lead type light emitting devices for the purpose of miniaturization and thinning.
In this surface mount type light emitting device, a light emitting element chip is provided inside a package molded body, and the package is formed by integrally forming positive and negative lead electrodes to which positive and negative electrodes of the light emitting element chip are respectively connected. . In this package, the positive and negative lead electrodes are folded inward along the joint surface at both ends of the joint surface of the package, and are soldered at the inner folded portion. Has been. In this manner, a light emitting device having excellent optical characteristics can be obtained.
[0003]
[Problems to be solved by the invention]
However, now that light emitting devices have been used under strict usage conditions as the field of use of light emitting devices expands, there is a need for light emitting devices with even higher reliability.
[0004]
In view of the above, an object of the present invention is to provide a package molded body that has sufficiently high reliability and can be produced with high yield even under severe environmental conditions, and a light-emitting device using the same.
[0005]
In order to achieve the above object, a molded package according to the present invention has a concave portion for accommodating a light emitting element and positive and negative lead electrodes, and the main surfaces of the positive and negative lead electrodes are the bottom surfaces of the concave portions. Each of the positive and negative lead electrodes is exposed to the outside and has a parting line intersecting the side surface of the lead electrode on the side surface. There is a resin burr in the thickness direction of the side surface of the lead electrode from the parting line, and the width of the molding resin portion on the lower surface side of the parting line is narrower than the molding resin portion on the upper surface side of the parting line, The lead electrode is folded and accommodated in a narrow portion of the molding resin portion below the parting line. The package molded body for a light-emitting device according to the present invention configured as described above can be obtained with high reliability and good manufacturing yield.
[0006]
In addition, the method for manufacturing a package molded body according to the present invention includes a concave portion for accommodating a light emitting element and positive and negative lead electrodes, and main surfaces of the positive and negative lead electrodes are respectively exposed at the bottom surface of the concave portion. A package molded body in which one end of each of the positive and negative lead electrodes is exposed to the outside, wherein the lead electrode is recessed in both the step of preparing the lead electrode and the joint of the mold A step of preparing upper and lower molds having a shape, a step of inserting the lead electrode into the mold such that a side surface of the lead electrode intersects a joint of the upper and lower molds, and The molding resin is injected, and a parting line intersecting the side surface of the lead electrode is provided on the side surface, and the molding resin part below the parting line is narrower than the molding resin part above the parting line. To be Forming a package molded body, forming a resin burr from the parting line in the thickness direction of the side surface of the lead electrode, and bending the lead electrode to form a molded resin portion below the parting line. And a process of fitting in a narrow portion.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a light emitting device according to an embodiment of the present invention will be described.
The light emitting device of the embodiment according to the present invention is configured as follows.
In the light emitting device of the present embodiment, the package molded body is produced by integrally molding a
More specifically, the upper surface of the package molded body has a concave portion for accommodating the light emitting element, and on the bottom surface of the concave portion, the positive lead electrode and the negative lead electrode are separated from each other, and the respective main surfaces are formed. Provided to be exposed.
In the present specification, the upper surface of the package molded body refers to the surface on which the light emitting element is placed, and the lower surface refers to the surface facing the mounting substrate.
[0008]
Also, one end of the positive lead electrode and one end of the negative lead electrode are provided so as to face each other at the bottom of the recess, and a molding resin is interposed between one end of the positive lead electrode and one end of the negative lead electrode. Filled to form the bottom surface of the recess.
Further, in the package molded body, the other end of the positive lead electrode and the other end of the negative lead electrode are provided so as to protrude from the side surface of the molded resin portion, and the protruding outer lead portion is the lower surface of the package molded body. A positive and negative connection terminal portion is formed by bending inside a certain joint surface.
[0009]
Using the package molded body for a light emitting device having such a configuration, a light emitting element is electrically connected to the bottom surface of the recess of the package molded body, and a translucent resin as a mold member is formed in the recess so as to cover them. The light emitting device of the present invention is obtained by filling.
[0010]
Here, in particular, in the light emitting device of the present embodiment, the
[0011]
That is, as a result of various experiments, the present inventor has found that deterioration in reliability and yield are caused due to poor adhesion between the lead electrode and the molded resin member, and solves the problem. It has been completed.
[0012]
The package molded body in which the lead electrode is inserted and integrally molded is formed by sandwiching the lead electrode with a molding die and injecting and curing the molten resin in the closed die.
[0013]
Although the mating surface of the molding die is strongly clamped by a molding machine, the mold is deformed or displaced due to the injection pressure of the resin, and a slight gap occurs between the mating surfaces. In the present specification, a resin wire formed in the gap is defined as a parting line. The parting line can be mounted without any problem in appearance.
[0014]
However, if the mating surface of the mold is tilted or a flat surface exists on the extension of the mating surface, resin burrs tend to be generated in the lateral direction from the parting line.
[0015]
Such resin burrs can be suppressed by correcting molding conditions or using a molding machine having a large clamping force.
[0016]
However, the shape of the lead electrode inserted is not always constant depending on the degree of wear of the lead electrode forming mold, and a slight gap is generated at the interface between the lead electrode and the molding die. If the gap and the joint of the mold are located on a parallel line, the above countermeasure cannot sufficiently cope with it, and a horizontal burr is generated from the parting line along the surface of the lead electrode.
[0017]
As shown in FIG. 3, a package molded body having a parting line formed by a molding die joint on an extension line on the back surface of the lead electrode is formed on the back surface of the outer lead portion of the lead electrode from the parting line. Tend to have horizontal burrs along. The lateral burr becomes an obstacle in the forming process, and it is very difficult to process the lead electrode along the side surface of the molded resin portion with high accuracy so that the light emitting device can be downsized. At this time, stress is applied to the interface between the lead electrode and the molded member in the vertical direction, a gap is generated at the interface from the tip of the burr extending in the horizontal direction, and the horizontal burr is peeled off.
[0018]
Detachment of burrs causes cracks in the molded member, and moisture and impurities penetrate from the cracks, so that the reliability of the light-emitting device is severely degraded. In addition, when the burr is peeled off deeply, an empty wall is formed, resulting in poor appearance.
[0019]
On the other hand, the package molded body used in the present embodiment is configured such that the side surface of the inserted lead electrode intersects the parting line, thereby minimizing the occurrence of the resin burrs as described above. It can be held to the limit. Even if resin burrs occur due to resin filling errors, etc., the contact between the parting line, which is a resin leak, and the lead electrode is on the side surface of the lead electrode. The flow is guided in the thickness direction of the lead electrode. That is, the resin burr can be only a vertical burr formed along the thickness direction of the side surface of the lead electrode from the parting line. The vertical burrs are relatively strong against stress in the vertical direction compared to the horizontal burrs and are not easily peeled off. Further, since the package molded body of the present invention does not have burrs in the longitudinal direction of the lead electrode, the forming process can be performed satisfactorily.
[0020]
Hereafter, each structure of the light-emitting device of this invention is explained in full detail.
(Lead electrode)
The lead electrode can be configured using a high thermal conductor such as iron-containing copper. In addition, in order to improve the reflectance of light from the light emitting element and to prevent oxidation of the lead base material, the surface of the lead electrode can be subjected to metal plating such as silver, aluminum, copper or gold. In order to improve the reflectance of the surface, smoothing is preferable. In addition, it is preferable to increase the area of the lead electrode. In this way, heat dissipation can be improved, and the temperature rise of the light emitting element chip to be arranged can be effectively suppressed. Accordingly, a relatively large amount of power can be input to the light emitting element chip, and the light output can be improved.
[0021]
For example, the lead electrode is formed by punching a long metal plate made of a copper alloy metal having a thickness of 0.15 mm into a positive and negative lead electrode of each package body. In the portion corresponding to each package molded body of the long metal plate after press working, the positive lead electrode is negative so that one end surface thereof faces the one end surface of the negative lead electrode at the bottom surface of the package recess after molding. These lead electrodes are separated from each other.
[0022]
Further, the lead electrode preferably has an opening having a center line perpendicular to one end face of the lead electrode as an axis of symmetry, whereby the bonding strength with the molding resin can be increased. The opening is provided so as to straddle the inner side and the outer side of the end of the package molded body, and the bonding strength between the lead electrode and the molding resin can be increased. In addition, each lead electrode protruding from the outer wall of the package molded body can be processed so that a large force is not applied to the molded resin, and a decrease in reliability is suppressed.
[0023]
Furthermore, it is preferable that at least a part of each opening is exposed from the bottom surface of the recess after the injection molding. As a result, the bonding strength between the molding resin and the molding resin is enhanced, and the positional deviation of the lead electrode due to die bonding and wire bonding can be suppressed.
Here, in the present embodiment, the center line perpendicular to one end face of the positive lead electrode and the center line perpendicular to one end face of the negative lead electrode are on the same line, and the center line is the vertical axis ( In this specification, of the two orthogonal axes of the bottom surface of the recess, one axis that coincides with the central axis is referred to as the vertical axis for convenience, and the other axis is referred to as the horizontal axis. By using such a package molded body, a light emitting device with high reliability and excellent directivity can be obtained.
In particular, in the present embodiment, two resin exposed portions are formed symmetrically with respect to the longitudinal axis of the package on the positive lead electrode located on the bottom surface of the recess, and the negative lead electrode located on the bottom surface of the recess is formed on the positive lead electrode. Since the two resin exposed portions are formed symmetrically with respect to the longitudinal axis of the package, the bonding between the translucent resin and the package molded body can be made stronger compared to the case where the symmetrical arrangement is not taken. In addition, a symmetrical directivity characteristic is obtained.
[0024]
In the light emitting device of the present invention, it is preferable that the angle between the back surface and the side surface of the lead electrode is curved. Thus, if the end of the lead electrode is rounded in accordance with the direction of injecting the resin, the flow of the molding resin becomes smooth, and the adhesion between the lead electrode and the molding resin portion is enhanced. Further, the resin can be filled in the space between the pair of lead electrodes exposed on the bottom surface of the package without any gap.
Further, the joining line with the lead electrode of the molded resin portion has a shape corresponding to the lead electrode. Therefore, when the lead electrode having the above-described shape is used, the joining line with the back surface on the side surface of the molded resin portion can have a concave shape with a curved base angle. Thereby, stress concentration in the joining line can be avoided and generation of package cracks can be suppressed.
[0025]
Furthermore, it is preferable that the angle between the main surface and the side surface of the lead electrode rises to an acute angle. As a result, the molding resin injected during the molding of the package from the space between the positive lead electrode and the negative lead electrode exposed from the bottom of the package recess can prevent the lead electrode from flowing out onto the main surface of each lead electrode. It is possible to prevent a die bondin defect and a wire bonding defect of the element. In addition, the adhesion between the lead electrode and the mold resin is improved, and peeling at these interfaces can be suppressed.
[0026]
Here, the main surface of the lead electrode refers to the surface side exposed from the concave portion of the package molded body, and the back surface refers to the surface side in contact with the molded resin portion.
[0027]
Further, the outer lead portions of the positive lead electrode and the negative lead electrode protruding from the outer wall of the package molded body are bent inside the joint surface of the package molded body as shown in FIG. The positive and negative connection terminals of the mold. Note that the structure of the connection terminal portion of the present invention is not limited to the J-bend type, and may be another structure such as a gull wing type.
[0028]
(Molded resin part)
In the molding resin portion of the present embodiment, the molding resin melted from the gate on the lower surface side of the package molded body is poured and cured into a mold in which a pair of positive and negative lead electrodes are inserted and closed. Formed. In addition, the mold has concave portions carved for arranging the lead electrodes at both joints of the mold. That is, the lead electrode is inserted between the molds so that the side surface of the lead electrode intersects the joint of the upper and lower molds. The package molded body thus formed has a parting line that intersects the side surface of the inserted lead electrode. As a result, even if an excess amount of resin flows out from the joint of the mold due to misalignment of the resin amount when forming the molded resin portion and misalignment of the mold clamping pressure of the mold, it flows from the parting line portion. Since the resin burr is formed as a vertical burr extending in the thickness direction of the lead electrode, processing defects of the lead electrode can be suppressed.
[0029]
In addition, the molding resin portion has a ridge-shaped first convex portion and a second convex portion on the joint surfaces on both sides of the gate so that the mounting joint surface of the electrode and the bottom surface of the molding resin are substantially on the same plane. When the first convex portion and the second convex portion are configured to have a predetermined space, the temporary filling resin at the time of flow soldering is accurately filled in the space, and the temporary fixing resin is the lead electrode. This is preferable because it can suppress soldering defects caused by adhering to the main surface side.
[0030]
Further, when the side surface of the molded resin portion is tapered from the parting line to the lower surface side, stress applied to the molded resin portion when being released from the molding die can be relieved. Further, it is easy to process the lead electrode along the taper shape, which is preferable because a small light emitting device can be obtained. Further, when the width of the molding resin portion on the lower surface side from the parting line is made narrower by the thickness of the lead electrode than the molding resin portion on the upper surface side of the parting line, the lead electrode is accommodated within the width of the molding resin portion on the upper surface side. Thus, a light-emitting device that can be densely mounted is obtained.
[0031]
(Light emitting element)
The light emitting element used in the present embodiment is disposed on the negative lead electrode or the positive lead electrode exposed on the bottom surface of the recess of the package molded body, and the n electrode and the negative lead electrode are connected by wire bonding. Similarly, the p electrode and the positive lead electrode are connected by wire bonding. Thus, it is preferable to dispose the light emitting element on the lead electrode because the heat dissipation of the light emitting element is improved.
Here, the light emitting element is, for example, a gallium nitride compound semiconductor element capable of emitting blue light, and the element includes, for example, a nitride semiconductor layer including an n-type layer, an active layer, and a p-type layer on a sapphire substrate. An n electrode is formed on the n-type layer formed and exposed by removing a part of the active layer and the p-type layer, and a p-electrode is formed on the p-type layer.
[0032]
(Mold member)
A light-transmitting resin is filled as a mold member in the concave portion of the package molded body so as to cover the light emitting element. The light-transmitting resin can protect the light emitting element from external force, moisture, and the like. In addition, the light-transmitting resin is required to have a high light transmittance in order to make the light from the light-emitting element equal to the outside efficiently. In addition, in the structure which connects between the electrode of a light emitting element, and a lead electrode with a wire, it also has a function which protects a wire. As specific materials such as translucent resin, epoxy resin, silicone resin, acrylic resin, etc. are suitable, and the translucent resin has a specific filter effect on the light from the LED chip. Coloring dyes and coloring pigments can also be added.
[0033]
In the present embodiment, the molding resin is exposed to the bottom surface of the concave portion of the package molded body through the opening formed in the positive lead electrode, and through the opening formed in the negative lead electrode. Since the molding resin is exposed on the bottom surface of the concave portion, the exposed molding resin and the mold resin are firmly bonded, and the bonding between the mold resin and the package molded body can be strengthened.
[0034]
In the package molded body of the embodiment mounted as described above, the side surface of the inserted lead electrode intersects with the parting line. When such a package molded body is used, a light emitting device having high moisture resistance can be obtained without being deteriorated by a high temperature / humidity environment in surface mounting.
[0035]
【The invention's effect】
As described above in detail, the package molded body according to the present invention intersects the side surface of the lead electrode into which the parting line is inserted, so that the flow direction of the resin burr can be adjusted to a desired direction. Therefore, it can be manufactured with high reliability and good manufacturing yield.
In addition, since the light-emitting device according to the present invention has a highly reliable package molded body for a light-emitting device, a light-emitting device with excellent reliability and optical characteristics can be obtained.
[Brief description of the drawings]
FIG. 1 is a schematic side view of a package molded body according to an embodiment of the present invention.
FIG. 2 is a schematic side view of a package molded body according to another embodiment of the present invention.
FIG. 3 is a schematic side view for explaining problems of a conventional example.
4A is a schematic instruction of a light emitting device according to an embodiment of the present invention, and FIG. 4B is a schematic cross-sectional view thereof.
[Explanation of symbols]
1 ... Molded resin part,
2a ... Positive lead electrode,
2b ... negative lead electrode,
3 ... Parting line,
4 ... Horizontal Bali,
5 ... Light emitting element,
6 ... Wire,
7: Mold member.
Claims (3)
前記リード電極の側面と交差したパーティングラインを側面に有し、
前記パーティングラインから前記リード電極の側面の厚さ方向に樹脂バリを有し、
前記パーティングライン下面側の成形樹脂部の幅は、前記パーティングライン上面側の成形樹脂部より幅狭であり、前記リード電極が、前記パーティングラインの下側の成形樹脂部の幅狭の部分に折り曲げられて納められていることを特徴とするパッケージ成形体。A concave portion for accommodating the light emitting element; and positive and negative lead electrodes, wherein main surfaces of the positive and negative lead electrodes are respectively exposed at the bottom surfaces of the concave portions, and one end portions of the positive and negative lead electrodes, respectively. Is a package molded body exposed to the outside ,
Having a parting line on the side surface that intersects the side surface of the lead electrode,
The resin flash possess from the parting line in the thickness direction of the side surface of the lead electrode,
The width of the molding resin part on the lower surface of the parting line is narrower than the molding resin part on the upper surface side of the parting line, and the lead electrode is narrower than the molding resin part on the lower side of the parting line. A package molded body characterized by being folded and stored in a part .
前記リード電極を準備する工程と、
金型の合わせ目の両方に凹部を有する上下の金型を準備する工程と、
前記リード電極の側面が前記上下の金型の合わせ目と交差するように、前記リード電極を前記金型内に挿入する工程と、
前記金型に成形樹脂を注入して、前記リード電極の側面と交差したパーティングラインを側面に有し、前記パーティングラインの下側の成形樹脂部が前記パーティングラインの上側の成形樹脂部よりも幅狭になるようにパッケージ成形体を形成する工程と、
前記パーティングラインから前記リード電極の側面の厚さ方向に樹脂バリを形成する工程と、
前記リード電極を折り曲げて前記パーティングラインの下側の成形樹脂部の幅狭の部分に納める工程と、
を含むことを特徴とするパッケージ成形体の製造方法。A concave portion for accommodating the light emitting element; and positive and negative lead electrodes, wherein main surfaces of the positive and negative lead electrodes are respectively exposed at the bottom surfaces of the concave portions, and one end portions of the positive and negative lead electrodes, respectively. Is a method of manufacturing a package molded body exposed to the outside,
Preparing the lead electrode;
Preparing upper and lower molds having recesses in both mold joints;
Inserting the lead electrode into the mold such that the side surface of the lead electrode intersects the joint of the upper and lower molds;
The molding resin is injected into the mold, and a parting line intersecting with the side surface of the lead electrode is provided on the side surface, and the molding resin part below the parting line is the molding resin part above the parting line Forming the package molded body to be narrower than,
Forming a resin burr in the thickness direction of the side surface of the lead electrode from the parting line;
Folding the lead electrode and placing it in a narrow portion of the molded resin portion below the parting line; and
The manufacturing method of the package molded object characterized by including.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001077002A JP4066608B2 (en) | 2001-03-16 | 2001-03-16 | Package molded body and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001077002A JP4066608B2 (en) | 2001-03-16 | 2001-03-16 | Package molded body and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002280616A JP2002280616A (en) | 2002-09-27 |
| JP4066608B2 true JP4066608B2 (en) | 2008-03-26 |
Family
ID=18933822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001077002A Expired - Fee Related JP4066608B2 (en) | 2001-03-16 | 2001-03-16 | Package molded body and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4066608B2 (en) |
Families Citing this family (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003007946A (en) * | 2001-06-27 | 2003-01-10 | Enomoto Co Ltd | Lead frame for surface-mounting led and manufacturing method thereof |
| US10340424B2 (en) | 2002-08-30 | 2019-07-02 | GE Lighting Solutions, LLC | Light emitting diode component |
| EP1540747B1 (en) | 2002-09-19 | 2012-01-25 | Cree, Inc. | Phosphor-coated light emitting diodes including tapered sidewalls, and fabrication methods therefor |
| US20050104072A1 (en) | 2003-08-14 | 2005-05-19 | Slater David B.Jr. | Localized annealing of metal-silicon carbide ohmic contacts and devices so formed |
| US7183587B2 (en) | 2003-09-09 | 2007-02-27 | Cree, Inc. | Solid metal block mounting substrates for semiconductor light emitting devices |
| US7029935B2 (en) | 2003-09-09 | 2006-04-18 | Cree, Inc. | Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same |
| US20060097385A1 (en) | 2004-10-25 | 2006-05-11 | Negley Gerald H | Solid metal block semiconductor light emitting device mounting substrates and packages including cavities and heat sinks, and methods of packaging same |
| US7322732B2 (en) | 2004-12-23 | 2008-01-29 | Cree, Inc. | Light emitting diode arrays for direct backlighting of liquid crystal displays |
| JP4698234B2 (en) * | 2005-01-21 | 2011-06-08 | スタンレー電気株式会社 | Surface mount semiconductor device |
| JP2009527071A (en) | 2005-12-22 | 2009-07-23 | クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド | Lighting device |
| US8441179B2 (en) | 2006-01-20 | 2013-05-14 | Cree, Inc. | Lighting devices having remote lumiphors that are excited by lumiphor-converted semiconductor excitation sources |
| KR101408622B1 (en) | 2006-01-20 | 2014-06-17 | 크리, 인코포레이티드 | Shifting spectral content in solid state light emitters by spatially separating lumiphor films |
| KR100735309B1 (en) | 2006-04-20 | 2007-07-03 | 삼성전기주식회사 | Surface mounting led package |
| JP2009538532A (en) | 2006-05-23 | 2009-11-05 | クリー エル イー ディー ライティング ソリューションズ インコーポレイテッド | Lighting device |
| KR20090013230A (en) | 2006-06-02 | 2009-02-04 | 히다치 가세고교 가부시끼가이샤 | Package for mounting optical semiconductor element and optical semiconductor device employing the same |
| JP2008010562A (en) * | 2006-06-28 | 2008-01-17 | Nippon Leiz Co Ltd | Light source device and plane lighting apparatus |
| KR100904152B1 (en) * | 2006-06-30 | 2009-06-25 | 서울반도체 주식회사 | Leadframe having a heat sink supporting part, fabricating method of the light emitting diode package using the same and light emitting diode package fabricated by the method |
| JP5622347B2 (en) * | 2006-08-09 | 2014-11-12 | セイコーエプソン株式会社 | Inertial sensor device |
| JP2010002427A (en) * | 2006-08-09 | 2010-01-07 | Epson Toyocom Corp | Inertial sensor, inertial sensor device and its manufacturing method |
| US7993038B2 (en) | 2007-03-06 | 2011-08-09 | Toyoda Gosei Co., Ltd. | Light-emitting device |
| JP5233992B2 (en) * | 2007-03-26 | 2013-07-10 | 日亜化学工業株式会社 | Light emitting device |
| JP5060172B2 (en) | 2007-05-29 | 2012-10-31 | 岩谷産業株式会社 | Semiconductor light emitting device |
| TWM329244U (en) * | 2007-10-01 | 2008-03-21 | Everlight Electronics Co Ltd | Light emitting diode device |
| JP5277610B2 (en) | 2007-10-29 | 2013-08-28 | 日亜化学工業株式会社 | Light emitting device, surface light emitting device, and package for light emitting device |
| TWM337834U (en) * | 2007-12-10 | 2008-08-01 | Everlight Electronics Co Ltd | Package structure for light emitting diode |
| JP5422906B2 (en) * | 2008-04-09 | 2014-02-19 | 日亜化学工業株式会社 | Light emitting device |
| US8598602B2 (en) | 2009-01-12 | 2013-12-03 | Cree, Inc. | Light emitting device packages with improved heat transfer |
| US7923739B2 (en) * | 2009-06-05 | 2011-04-12 | Cree, Inc. | Solid state lighting device |
| US9111778B2 (en) | 2009-06-05 | 2015-08-18 | Cree, Inc. | Light emitting diode (LED) devices, systems, and methods |
| US8860043B2 (en) | 2009-06-05 | 2014-10-14 | Cree, Inc. | Light emitting device packages, systems and methods |
| US8593040B2 (en) | 2009-10-02 | 2013-11-26 | Ge Lighting Solutions Llc | LED lamp with surface area enhancing fins |
| KR101103674B1 (en) * | 2010-06-01 | 2012-01-11 | 엘지이노텍 주식회사 | Light emitting device |
| US8269244B2 (en) | 2010-06-28 | 2012-09-18 | Cree, Inc. | LED package with efficient, isolated thermal path |
| US8772817B2 (en) | 2010-12-22 | 2014-07-08 | Cree, Inc. | Electronic device submounts including substrates with thermally conductive vias |
| TW201251140A (en) | 2011-01-31 | 2012-12-16 | Cree Inc | High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion |
| CN103348496A (en) | 2011-02-07 | 2013-10-09 | 克利公司 | Components and methods for light emitting diode (LED) lighting |
| WO2013069767A1 (en) * | 2011-11-11 | 2013-05-16 | 株式会社Ｎｅｏｍａｘマテリアル | Substrate for light emitting elements, light emitting module, and method for manufacturing light emitting module |
| JP5989388B2 (en) | 2012-04-19 | 2016-09-07 | 新光電気工業株式会社 | Package and package manufacturing method |
| US9500355B2 (en) | 2012-05-04 | 2016-11-22 | GE Lighting Solutions, LLC | Lamp with light emitting elements surrounding active cooling device |
| JP6204088B2 (en) | 2013-07-02 | 2017-09-27 | エスアイアイ・セミコンダクタ株式会社 | Semiconductor device |
| KR102486035B1 (en) * | 2016-01-28 | 2023-01-06 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | Light emitting device package and light emitting apparatus having the same |
-
2001
- 2001-03-16 JP JP2001077002A patent/JP4066608B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2002280616A (en) | 2002-09-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4066608B2 (en) | Package molded body and manufacturing method thereof | |
| JP3165078B2 (en) | Method for manufacturing surface mount components | |
| US6410979B2 (en) | Ball-grid-array semiconductor device with protruding terminals | |
| US9905497B2 (en) | Resin sealing type semiconductor device and method of manufacturing the same, and lead frame | |
| JP3636079B2 (en) | Package molded body and light emitting device | |
| JP4857791B2 (en) | Manufacturing method of semiconductor device | |
| KR101131353B1 (en) | Semiconductor device | |
| EP1494291A2 (en) | Solid-state imaging device and method for manufacturing the same | |
| JP2007207986A5 (en) | ||
| JPH1126647A (en) | Optical semiconductor device | |
| CN107437509B (en) | Semiconductor device and method for manufacturing the same | |
| CN111587486A (en) | Semiconductor device and method for manufacturing semiconductor device | |
| JP2000068397A (en) | Package for semiconductor device and manufacture thereof | |
| JP3418385B2 (en) | Method of forming semiconductor integrated circuit package and method of manufacturing the same | |
| US20060110857A1 (en) | Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same | |
| JP3426574B2 (en) | Surface mount component and method of manufacturing the same | |
| JP4631175B2 (en) | Package molded body and light emitting device | |
| JP2002223003A (en) | Package molding, its manufacturing method and light emitting device | |
| JP3747991B2 (en) | Manufacturing method of semiconductor device | |
| JP3741550B2 (en) | Semiconductor device and manufacturing method thereof | |
| JPH01102947A (en) | Plastic packaged semiconductor device and lead frame | |
| JP4534803B2 (en) | Manufacturing method of resin package | |
| JP2024046599A (en) | Semiconductor Device | |
| JP2009158624A (en) | Package for optical semiconductor device and production method therefor | |
| JP4911635B2 (en) | Semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20041019 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20070517 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070529 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070730 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20070918 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20071116 |
|
| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20071126 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20071218 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20071231 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110118 Year of fee payment: 3 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 4066608 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110118 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110118 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120118 Year of fee payment: 4 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120118 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130118 Year of fee payment: 5 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130118 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140118 Year of fee payment: 6 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |