JP3965762B2 - Triplate line interlayer connector - Google Patents

Triplate line interlayer connector Download PDF

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JP3965762B2
JP3965762B2 JP06183898A JP6183898A JP3965762B2 JP 3965762 B2 JP3965762 B2 JP 3965762B2 JP 06183898 A JP06183898 A JP 06183898A JP 6183898 A JP6183898 A JP 6183898A JP 3965762 B2 JP3965762 B2 JP 3965762B2
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JPH11261308A (en
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雅彦 太田
充 平尾
久良 水柿
岳央 道坂
喜一 金丸
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Resonac Corp
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Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
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Description

【０００１】
【発明の属する技術分野】
本発明は、ミリ波帯におけるトリプレート線路の層間接続構造に関する。
【０００２】
【従来の技術】
従来のトリプレート線路の層間接続構造は、図６に示すように、第１の地導体１と第２の地導体２の略中間に、第１の誘電体４ａ及び第２の誘電体４ｂに挟んだ第１の給電線路５を形成した第１の給電基板６を配置した第１のトリプレート線路と、第２の地導体２と第３の地導体３の略中間に、第３の誘電体７ａ及び第４の誘電体７ｂに挟んだ第２の給電線路８を形成した第２の給電基板９を配置した第２のトリプレート線路とを、前記第２の地導体２に形成された第２のスロット１４を介して電磁結合している。
【０００３】
通常、第１の誘電体４ａ、第２の誘電体４ｂ、第３の誘電体７ａ、及び第４の誘電体７ｂには、給電線路の損失を抑えるため、比誘電率ε1≒１の低誘電率材料が用いられる。
また、第１の地導体１と第２の地導体２の間隔、及び第２の地導体２と第３の地導体３の間隔は、使用する周波数において線路に高次モードが発生することを避けるため、使用する周波数の線路実効波長（線路実効波長＝自由空間波長／誘電体の比誘電率の平方根）の略５分の１以下に設定される。
【０００４】
また、第１の給電線路５と第２の給電線路８とを、第２のスロット１４を介して良好に電磁結合させるためには、第２のスロット１４を使用する周波数で共振させる必要があるため、図７に示すように、第２のスロット１４の共振器長Ｌ８を使用する周波数の線路実効波長の略２分の１に設定すると共に、第１の給電線路５の接続終端部と、前記第２の給電線路８の接続終端部から、使用する周波数の線路実効波長の略４分の１となる線路長Ｌ７の位置に、第２のスロット１４が位置するように配置する必要がある。
また、第２のスロット１４の幅は、おおむね使用する周波数の線路実効波長の略１０分の１程度とされている。
【０００５】
このように、第２のスロット１４の共振器長Ｌ８を使用する周波数の線路実効波長の略２分の１に設定することにより、第２のスロット１４が使用する周波数で共振し、かつ、第１の給電線路５及び第２の給電線路８の接続終端部からの第２のスロット１４の設定位置Ｌ７を、使用する周波数の線路実効波長の略４分の１に設定することにより、給電線路から第２のスロット１４を見込んだインピーダンス整合が確保されて電力が反射することなく伝送される。
【０００６】
【発明が解決しようとする課題】
しかし、図６に示す、従来のトリプレート線路の層間接続構造では、第２のスロット１４の共振器長Ｌ８の長さの誤差に対する周波数変化が大きく、かつ、第１の給電線路５及び第２の給電線路８の接続終端部からの第２のスロット１４の設定位置Ｌ７の誤差に対する給電線路から第２のスロット１４を見込んだインピーダンスの変化が大きいので、周波数特性が狭帯域となるという課題があった。
【０００７】
また、第１の給電線路５及び第２の給電線路８と第２のスロット１４の電磁結合に伴い、第１の地導体１と第２の地導体２の間、及び第３の地導体３と第２の地導体２の間を横方向へ伝搬するパラレルプレート成分が発生し、損失が増加するという課題があった。
【０００８】
更に、例えば使用する周波数が７６．５ＧＨｚ帯のように、極めて高い周波数帯で、従来のトリプレート線路層間接続構造を実現しようとする場合、図７に示した第２のスロット１４の共振器長Ｌ８は、略２ｍｍ程度で、幅は０．４ｍｍ程度以下と極めて微細な寸法になるため、第２のスロット１４は、機械プレス加工等で形成することが難しくなると共に、組立時に、第１の給電線路５及び第２の給電線路８の接続終端部からの第２のスロット１４の設定位置Ｌ７を、略１ｍｍ程度に高精度で設定する必要がある等、精度の高い加工方法や組立構造の選択が不可欠であり、コストが高くなるという課題があった。
【０００９】
本発明は、損失の抑制に優れ、かつ、組立の容易なトリプレート線路層間接続器を提供することを目的とする。
【００１０】
【課題を解決するための手段】
本発明のトリプレート線路層間接続器は、図１に示すように、第１の地導体１と第２の地導体２の略中間に、第１の誘電体４ａ及び第２の誘電体４ｂに挟んだ、第１の給電線路５を形成した第１の給電基板６を配置した第１のトリプレート線路と、第２の地導体２と第３の地導体３の略中間に、第３の誘電体７ａ及び第４の誘電体７ｂに挟んだ、第２の給電線路８を形成した第２の給電基板９を配置した第２のトリプレート線路との電気的接続器であって、前記第１の給電基板６の第１の給電線路５の接続終端部と、前記第２の給電基板９の第２の給電線路８の接続終端部とに、それぞれ第１のパッチパターン１２ａ、第２のパッチパターン１２ｂを形成し、その第１のパッチパターン１２ａの周辺部の第１の誘電体４ａ及び第２の誘電体４ｂを削除すると共に、その削除した箇所に第１のパッチパターン１２ａとそれに接続した第１の給電線路５の形状よりも大きめのくりぬき部を有する第１のシールドスペーサ１０ａ及び第２のシールドスペーサ１０ｂを設け、かつ、前記第２のパッチパターン１２ｂの周辺部の第３の誘電体７ａ及び第４の誘電体７ｂを削除すると共に、その削除した箇所に第２のパッチパターン１２ｂとそれに接続した第２の給電線路８の形状よりも大きめのくりぬき部を有する第３のシールドスペーサ１１ａ及び第４のシールドスペーサ１１ｂを設け、さらに前記第１のパッチパターン１２ａ及び第２のパッチパターン１２ｂの中間に位置する部分の前記第２の地導体２に、第１のスロット１３を形成したことを特徴とする。
【００１１】
また、本発明のトリプレート線路層間接続器は、図２に示すように、第１のパッチパターン１２ａ及び第２のパッチパターン１２ｂの、線路接続方向の長さＬ１を使用する周波数の自由空間波長λ0の略０．３８倍とし、かつ第１のシールドスペーサ１０ａ、第２のシールドスペーサ１０ｂ、第３のシールドスペーサ１１ａ、及び第４のシールドスペーサ１１ｂのくりぬき部のパッチ周辺部の線路接続方向における寸法Ｌ２及び第１のスロット１３の線路接続方向における寸法Ｌ３を使用する周波数の自由空間波長λ0の略０．６倍とすることができる。
【００１２】
さらに、本発明のトリプレート線路層間接続器は、図３に示すように、第１のパッチパターン１２ａ及び第２のパッチパターン１２ｂの形状を円形とし、その直径Ｌ４を、使用する周波数の自由空間波長λ0の略０．３８倍とし、かつ第１のシールドスペーサ１０ａ、第２のシールドスペーサ１０ｂ、第３のシールドスペーサ１１ａ、及び第４のシールドスペーサ１１ｂのくりぬき部のパッチ周辺部の形状を円形としその直径Ｌ５を使用する周波数の自由空間波長λ0の略０．６倍とし、かつ、第１のスロット１３の形状を円形としその直径Ｌ６を使用する周波数の自由空間波長λ0の略０．６倍とすることもできる。
【００１３】
（作用）
本発明のトリプレート線路層間接続器において、図１に示す、第１のパッチパターン１２ａ及び第２のパッチパターン１２ｂは、使用する周波数で相互に電磁結合して１つの共振器を構成する。そして、第１のパッチパターン１２ａ及び第２のパッチパターン１２ｂは、従来構造の共振器と比較して非常に広帯域な特性を確保することができる。
【００１４】
第１のスロット１３は、このパッチ相互の電磁結合を妨げることなく、電力が第１の給電線路５から第２の給電線路８に伝送されるための窓として機能し、従来構造のスロットのように共振するものではないので、第１のスロット１３の線路接続方向における共振器長Ｌ３の長さの誤差に対する周波数変化は小さく、前記のパッチパターンによる共振器の広帯域な特性と相まって、周波数特性の安定したトリプレート線路層間接続器が構成できる。
【００１５】
第１のシールドスペーサ１０ａ、第２のシールドスペーサ１０ｂ、第３のシールドスペーサ１１ａ及び第４のシールドスペーサ１１ｂは、第１のパッチパターン１２ａ及び第２のパッチパターン１２ｂの周囲に、距離を隔てて金属壁を形成するもので、パラレルプレート成分が発生することなく、第１のパッチパターン１２ａの電力が全て第２のパッチパターン１２ｂに伝送され、低損失特性が実現できる。
【００１６】
また、第１のシールドスペーサ１０ａ、、第２のシールドスペーサ１０ｂ、第３のシールドスペーサ１１ａ及び第４のシールドスペーサ１１ｂは、第１の給電基板６及び第２の給電基板９を、それぞれ第１の地導体１と第２の地導体２及び第２の地導体２と第３の地導体３の略中間に安定に保持するスペーサとして機能し、第１のパッチパターン１２ａ及び第２のパッチパターン１２ｂ相互の距離を安定に維持することでパッチ相互の電磁結合を常に安定に保つことができる。
【００１７】
第１のパッチパターン１２ａ、第２のパッチパターン１２ｂ及び第１のスロット１３の形状は、図２に示すように正方形であるのが一般的であるが、幅方向の寸法は、共振周波数に対する影響が小さいため、必要に応じて長方形であっても良く、また、図３に示すように円形であっても同様に作用する。
また、例えば第１のパッチパターン１２ａと第１の給電線路５の接続部は、第１のパッチパターン１２ａの端部のインピーダンスと第１の給電線路５のインピーダンスを整合させるために、図４（ａ）に示すように、使用する周波数の線路実効波長の略４分の１の線路長のトランス線路１０１で接続するのが一般的であるが、図４（ｂ）に示すように、パッチ内部の整合点１０２で直接整合させる給電や、図４（ｃ）に示すように、僅かなギャップ１０３を介して容量結合させることもできる。
【００１８】
【実施例】
実施例１
第１の地導体１及び第３の地導体３には、厚さ１ｍｍのアルミ板を用い、第１の誘電体４ａ、第２の誘電体４ｂ、第３の誘電体７ａ、及び第４の誘電体７ｂには、厚さ０．３ｍｍで比誘電率約１．１の発泡ポリエチレンフォームを用い、第１の給電基板６には、ポリイミドフィルムに銅箔を貼り合わせたフレキシブル基板を用い、不要な銅箔をエッチングで除去して、第１の給電線路５と第１のパッチパターン１２ａを形成したものを用い、第２の給電基板９にも第１の給電基板と同じ、ポリイミドフィルムに銅箔を貼り合わせたフレキシブル基板を用い、不要な銅箔をエッチングで除去して、第２の給電線路８と第２のパッチパターン１２ｂを形成したものを用い、第２の地導体２には、厚さ０．７ｍｍのアルミ板に機械プレスで第１のスロット１３を打ち抜き加工したものを用い、第１のシールドスペーサ１０ａ、第２のシールドスペーサ１０ｂ、第３のシールドスペーサ１１ａ、及び第４のシールドスペーサ１１ｂには、厚さ０．３ｍｍのアルミ板を機械プレスで打ち抜き加工したものを用いた。
第１のパッチパターン１２ａ及び第２のパッチパターン１２ｂにおいては、図２（ｂ）に示すＬ１が、使用する周波数７６ＧＨｚの自由空間波長（λ0＝３．９５ｍｍ）の約０．３８倍となる１．５ｍｍとし、形状を正方形とした。
また、第１のスロット１３の寸法Ｌ３は、使用する周波数７６ＧＨｚの自由空間波長（λ0＝３．９５ｍｍ）の約０．５８倍となる２．３ｍｍとし、形状を正方形とした。
第１のシールドスペーサ１０ａ、第２のシールドスペーサ１０ｂ、第３のシールドスペーサ１１ａ、及び第４のシールドスペーサ１１ｂの寸法Ｌ２は、第１のスロット１３の寸法Ｌ３と同じ寸法とした。
さらに、第１の給電線路５と第１のパッチパターン１２ａの接続部には、使用する周波数７６ＧＨｚの自由空間波長（λ0＝３．９５ｍｍ）の約０．２４倍の長さのトランス線路１０１を形成し、第２の給電線路８と第２のパッチパターン１２ｂの接続部にも同じトランス線路１０１を形成して整合させた。
以上の各部材を図２（ａ）に示すように、順次重ねてトリプレート線路層間接続器を構成し、第１の給電線路５及び第２の給電線路８に計測器を接続して電力を給電すると共に、第１の給電線路５の端部における反射損失及び第１の給電線路５から第２の給電線路８の端面へ電力が通過する際の通過損失を測定した結果、図５に示すように７６ＧＨｚを中心に、±２ＧＨｚの範囲で反射損失−１５ｄＢ以下で、通過損失も１ｄＢ以下という、良好な特性が実現できた。
【００１９】
実施例２
実施例１と同様に、第１の地導体１及び第３の地導体３には、厚さ１ｍｍのアルミ板を用い、第１の誘電体４ａ、第２の誘電体４ｂ、第３の誘電体７ａ、及び第４の誘電体７ｂには、厚さ０．３ｍｍで比誘電率約１．１の発泡ポリエチレンフォームを用い、第１の給電基板６には、ポリイミドフィルムに銅箔を貼り合わせたフレキシブル基板を用い、不要な銅箔をエッチングで除去して、第１の給電線路５と第１のパッチパターン１２ａを形成したものを用い、第２の給電基板にも、第１の給電基板と同様に、ポリイミドフィルムに銅箔を貼り合わせたフレキシブル基板を用い、不要な銅箔をエッチングで除去して、第２の給電線路８と第２のパッチパターン１２ｂを形成したものを用い、第２の地導体２には、厚さ０．７ｍｍのアルミ板に機械プレスで第１のスロット１３を打ち抜き加工したものを用い、第１のシールドスペーサ１０ａ、第２のシールドスペーサ１０ｂ、第３のシールドスペーサ１１ａ、及び第４のシールドスペーサ１１ｂには、厚さ０．３ｍｍのアルミ板を機械プレスで打ち抜き加工したものを用いた。
第１のパッチパターン１２ａ及び第２のパッチパターン１２ｂにおいては、図３（ｂ）に示す直径Ｌ４が、使用する周波数７６ＧＨｚの自由空間波長（λ0＝３．９５ｍｍ）の約０．３８倍となる１．５ｍｍとし、形状を円形とした。
また、スロット寸法Ｌ６は、使用する周波数７６ＧＨｚの自由空間波長（λ0＝３．９５ｍｍ）の約０．５８倍となる直径２．３ｍｍとし、形状を円形とし、第１のシールドスペーサ１０ａ、第２のシールドスペーサ１０ｂ、第３のシールドスペーサ１１ａ、及び第４のシールドスペーサ１１ｂの寸法Ｌ５は、スロット寸法と同じ寸法とし、形状を円形とした。
さらに、第１の給電線路５と第１のパッチパターン１２ａの接続部に、使用する周波数７６ＧＨｚの自由空間波長（λ0＝３．９５ｍｍ）の約０．２４倍の長さのトランス線路１０１を形成し、第２の給電線路８と第２のパッチパターン１２ｂの接続部も同じトランス線路１０１を形成して整合させた。
以上の各部材を図３（ａ）に示すように、順次重ねてトリプレート線路層間接続器を構成し、第１の給電線路５及び第２の給電線路８に計測器を接続して電力を給電すると共に、第１の給電線路５の端部における反射損失及び第１の給電線路５から第２の給電線路８の端面へ電力が通過する際の通過損失を測定した結果、実施例１と同等の良好な特性が実現できた。
【００２０】
【発明の効果】
以上に説明したように、本発明のトリプレート線路層間接続器によって、広帯域で周波数特性の安定した低損失なトリプレート線路層間接続器が構成でき、かつ、組立誤差による特性変化も少ない安価なトリプレート線路層間接続器を提供することができる。
【図面の簡単な説明】
【図１】本発明の一実施例を示す分解斜視図である。
【図２】（ａ）は本発明の一実施例を示す断面図であり、（ｂ）は本発明の一実施例の要部平面図であり、（ｃ）は本発明の一実施例の他の要部平面図である。
【図３】（ａ）は本発明の他の実施例を示す断面図であり、（ｂ）は本発明の他の実施例の要部平面図であり、（ｃ）は本発明の他の実施例の他の要部平面図である。
【図４】（ａ）、（ｂ）及び（ｃ）はそれぞれ本発明の実施例に用いたパッチパターンと給電線路の接続形態を示す平面図である。
【図５】本発明の一実施例の反射損失と通過損失の周波数特性を示す線図である。
【図６】従来例を示す分解斜視図である。
【図７】従来例の課題を説明するための平面図である。
【符号の説明】
１．第１の地導体 ２．第２の地導体
３．第３の地導体
４ａ．第１の誘電体 ４ｂ．第２の誘電体
７ａ．第３の誘電体 ７ｂ．第４の誘電体
５．第１の給電線路 ８．第２の給電線路
６．第１の給電基板 ９．第２の給電基板
１０ａ．第１のシールドスペーサ １０ｂ．第２のシールドスペーサ
１１ａ．第３のシールドスペーサ １１ｂ．第４のシールドスペーサ
１２ａ．第１のパッチパターン １２ｂ．第２のパッチパターン
１３．第１のスロット １４．第２のスロット
１０１．トランス線路
１０２．整合点
１０３．ギャップ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an interlayer connection structure of a triplate line in the millimeter wave band.
[0002]
[Prior art]
As shown in FIG. 6, the conventional interlayer connection structure of the triplate line has a first dielectric 4a and a second dielectric 4b in the middle of the first ground conductor 1 and the second ground conductor 2, respectively. A third dielectric is provided approximately in the middle of the first triplate line having the first power supply substrate 6 forming the sandwiched first power supply line 5 and the second ground conductor 2 and the third ground conductor 3. A second triplate line having a second power supply substrate 9 formed with a second power supply line 8 sandwiched between a body 7a and a fourth dielectric 7b is formed on the second ground conductor 2. The second slot 14 is electromagnetically coupled.
[0003]
Usually, the first dielectric 4a, the second dielectric 4b, the third dielectric 7a, and the fourth dielectric 7b have a low relative dielectric constant ε 1 ≈1 in order to suppress the loss of the feed line. A dielectric material is used.
In addition, the distance between the first ground conductor 1 and the second ground conductor 2 and the distance between the second ground conductor 2 and the third ground conductor 3 indicate that a higher-order mode is generated in the line at the frequency used. In order to avoid this, it is set to be approximately one fifth or less of the line effective wavelength (line effective wavelength = free space wavelength / square root of the dielectric constant of the dielectric) of the frequency used.
[0004]
Further, in order to satisfactorily electromagnetically couple the first feed line 5 and the second feed line 8 through the second slot 14, it is necessary to resonate at the frequency at which the second slot 14 is used. Therefore, as shown in FIG. 7, the resonator length L8 of the second slot 14 is set to approximately one half of the line effective wavelength of the frequency used, and the connection termination portion of the first feed line 5; It is necessary to arrange the second slot 14 so as to be located at the position of the line length L7 that is approximately a quarter of the effective line wavelength of the frequency to be used from the connection termination portion of the second feed line 8. .
Further, the width of the second slot 14 is set to about one tenth of the effective line wavelength of the frequency to be used.
[0005]
In this way, by setting the resonator length L8 of the second slot 14 to approximately one half of the line effective wavelength of the frequency using the second slot 14, the second slot 14 resonates at the frequency used, and By setting the setting position L7 of the second slot 14 from the connection termination portion of the first feed line 5 and the second feed line 8 to approximately one quarter of the line effective wavelength of the frequency to be used, the feed line Thus, impedance matching is ensured in anticipation of the second slot 14, and power is transmitted without reflection.
[0006]
[Problems to be solved by the invention]
However, in the conventional interlayer connection structure of the triplate line shown in FIG. 6, the frequency change with respect to the error of the resonator length L8 of the second slot 14 is large, and the first feed line 5 and the second feed line 5 There is a problem that the frequency characteristic becomes a narrow band because a change in impedance in which the second slot 14 is expected from the feed line with respect to the error of the setting position L7 of the second slot 14 from the connection termination portion of the feed line 8 is large. there were.
[0007]
Further, with the electromagnetic coupling between the first feed line 5 and the second feed line 8 and the second slot 14, between the first ground conductor 1 and the second ground conductor 2 and the third ground conductor 3. There is a problem that a parallel plate component propagating in the lateral direction occurs between the first ground conductor 2 and the second ground conductor 2 to increase loss.
[0008]
Further, when the conventional triplate line interlayer connection structure is to be realized in a very high frequency band, for example, a frequency to be used is 76.5 GHz band, the resonator length of the second slot 14 shown in FIG. Since L8 is about 2 mm and the width is extremely small, about 0.4 mm or less, the second slot 14 is difficult to form by mechanical press work or the like, and the first slot is It is necessary to set the setting position L7 of the second slot 14 from the connection end portion of the feed line 5 and the second feed line 8 with high accuracy to about 1 mm. There was a problem that selection was indispensable and cost was high.
[0009]
It is an object of the present invention to provide a triplate line interlayer connector that is excellent in loss suppression and that can be easily assembled.
[0010]
[Means for Solving the Problems]
As shown in FIG. 1, the triplate line interlayer connector of the present invention is connected to the first dielectric 4 a and the second dielectric 4 b approximately in the middle between the first ground conductor 1 and the second ground conductor 2. The third triplate line between which the first power supply substrate 6 forming the first power supply line 5 is sandwiched and the second ground conductor 2 and the third ground conductor 3 are arranged in the middle. An electrical connector with a second triplate line on which a second feed substrate 9 having a second feed line 8 formed is sandwiched between a dielectric 7a and a fourth dielectric 7b. The first patch pattern 12a and the second patch terminal 12 are connected to the connection terminal portion of the first power supply line 5 of the first power supply substrate 6 and the connection terminal portion of the second power supply line 8 of the second power supply substrate 9, respectively. A patch pattern 12b is formed, and a first dielectric 4a and a second dielectric 4 around the first patch pattern 12a are formed. And the first shield spacer 10a and the second shield spacer 10b having a hollow portion larger than the shape of the first patch pattern 12a and the first feed line 5 connected to the first patch pattern 12a. And the third dielectric 7a and the fourth dielectric 7b at the periphery of the second patch pattern 12b are deleted, and the second patch pattern 12b and the second patch pattern connected to the second patch pattern 12b are removed at the deleted location. A third shield spacer 11a and a fourth shield spacer 11b having a hollow portion larger than the shape of the feed line 8 are provided, and further positioned between the first patch pattern 12a and the second patch pattern 12b. A first slot 13 is formed in a portion of the second ground conductor 2.
[0011]
Further, as shown in FIG. 2, the triplate line interlayer connector of the present invention has a free space wavelength of a frequency using the length L1 in the line connection direction of the first patch pattern 12a and the second patch pattern 12b. 0.38 times abbreviation of lambda 0, and the first shield spacer 10a, the second shield spacer 10b, the third shield spacer 11a, and the line connecting direction of the patch perimeter of cutouts of the fourth shield spacer 11b And the dimension L3 in the line connection direction of the first slot 13 can be approximately 0.6 times the free space wavelength λ 0 of the frequency used.
[0012]
Further, as shown in FIG. 3, the triplate line interlayer connector of the present invention has a circular shape of the first patch pattern 12a and the second patch pattern 12b, and its diameter L4 is a free space of a frequency to be used. 0.38 times substantially wavelength lambda 0, and the first shield spacer 10a, the second shield spacer 10b, the third shield spacer 11a, and the hollow portion shape of the patch periphery of the fourth shield spacer 11b a circular and substantially 0.6 times the free space wavelength lambda 0 of the frequency of using the diameter L5, and the free space wavelength lambda 0 of the frequencies of the shape of the first slot 13 is circular uses its diameter L6 substantially It can also be 0.6 times.
[0013]
(Function)
In the triplate line interlayer connector of the present invention, the first patch pattern 12a and the second patch pattern 12b shown in FIG. 1 are electromagnetically coupled to each other at a frequency to be used to constitute one resonator. The first patch pattern 12a and the second patch pattern 12b can ensure characteristics with a very wide band as compared with the resonator having the conventional structure.
[0014]
The first slot 13 functions as a window through which power is transmitted from the first feed line 5 to the second feed line 8 without interfering with the electromagnetic coupling between the patches. Therefore, the frequency change with respect to the length error of the resonator length L3 in the line connection direction of the first slot 13 is small, and coupled with the broadband characteristics of the resonator by the patch pattern, A stable triplate line interlayer connector can be constructed.
[0015]
The first shield spacer 10a, the second shield spacer 10b, the third shield spacer 11a, and the fourth shield spacer 11b are spaced around the first patch pattern 12a and the second patch pattern 12b. A metal wall is formed, and all the electric power of the first patch pattern 12a is transmitted to the second patch pattern 12b without generating a parallel plate component, so that a low loss characteristic can be realized.
[0016]
The first shield spacer 10a, the second shield spacer 10b, the third shield spacer 11a, and the fourth shield spacer 11b are connected to the first power supply substrate 6 and the second power supply substrate 9, respectively. The first and second patch patterns 12a and 12a function as a spacer that is stably held substantially in the middle between the second ground conductor 2 and the second ground conductor 2 and the second ground conductor 2 and the third ground conductor 3. By maintaining the distance between 12b stably, the electromagnetic coupling between patches can always be kept stable.
[0017]
The shapes of the first patch pattern 12a, the second patch pattern 12b, and the first slot 13 are generally square as shown in FIG. 2, but the dimension in the width direction has an effect on the resonance frequency. Since it is small, it may be rectangular as necessary, and even if it is circular as shown in FIG.
Further, for example, the connection portion between the first patch pattern 12a and the first feed line 5 is arranged in order to match the impedance of the end of the first patch pattern 12a with the impedance of the first feed line 5 as shown in FIG. As shown in a), it is common to connect with a transformer line 101 having a line length of about one-fourth of the effective line wavelength of the frequency used, but as shown in FIG. The power supply can be directly matched at the matching point 102 or capacitively coupled through a slight gap 103 as shown in FIG.
[0018]
【Example】
Example 1
As the first ground conductor 1 and the third ground conductor 3, an aluminum plate having a thickness of 1 mm is used, and the first dielectric 4a, the second dielectric 4b, the third dielectric 7a, and the fourth dielectric For the dielectric 7b, a foamed polyethylene foam having a thickness of 0.3 mm and a relative dielectric constant of about 1.1 is used. For the first power supply substrate 6, a flexible substrate in which a copper foil is bonded to a polyimide film is used. The copper foil is removed by etching, and the first power supply line 5 and the first patch pattern 12a are formed. The second power supply substrate 9 is also made of copper on a polyimide film, which is the same as the first power supply substrate. Using a flexible substrate bonded with foil, removing unnecessary copper foil by etching and forming the second feed line 8 and the second patch pattern 12b, the second ground conductor 2 is A mechanical press presses the first screw on a 0.7 mm thick aluminum plate. The first shield spacer 10a, the second shield spacer 10b, the third shield spacer 11a, and the fourth shield spacer 11b are made of an aluminum plate having a thickness of 0.3 mm. This was punched with a mechanical press.
In the first patch pattern 12a and the second patch pattern 12b, L1 shown in FIG. 2B is approximately 0.38 times the free space wavelength (λ 0 = 3.95 mm) of the frequency 76 GHz used. The shape was 1.5 mm and the shape was a square.
The dimension L3 of the first slot 13 is 2.3 mm, which is about 0.58 times the free space wavelength (λ 0 = 3.95 mm) of the frequency 76 GHz to be used, and the shape is square.
The dimension L2 of the first shield spacer 10a, the second shield spacer 10b, the third shield spacer 11a, and the fourth shield spacer 11b is the same as the dimension L3 of the first slot 13.
Further, a transformer line 101 having a length about 0.24 times the free space wavelength (λ 0 = 3.95 mm) of the frequency 76 GHz to be used is connected to the connection portion between the first feed line 5 and the first patch pattern 12a. And the same transformer line 101 was formed at the connecting portion between the second feed line 8 and the second patch pattern 12b and matched.
As shown in FIG. 2A, the above-described members are sequentially stacked to constitute a triplate line interlayer connector, and a measuring instrument is connected to the first feed line 5 and the second feed line 8 to supply power. FIG. 5 shows the result of measuring the reflection loss at the end of the first feed line 5 and the passage loss when power passes from the first feed line 5 to the end face of the second feed line 8 while feeding power. Thus, good characteristics such as a reflection loss of -15 dB or less and a pass loss of 1 dB or less in a range of ± 2 GHz centering on 76 GHz can be realized.
[0019]
Example 2
As in the first embodiment, the first ground conductor 1 and the third ground conductor 3 are made of an aluminum plate having a thickness of 1 mm, and the first dielectric 4a, the second dielectric 4b, and the third dielectric are used. Foamed polyethylene foam having a thickness of 0.3 mm and a relative dielectric constant of about 1.1 is used for the body 7a and the fourth dielectric 7b, and a copper foil is bonded to a polyimide film for the first power supply substrate 6. The first power supply board is also used for the second power supply board using a flexible board that is formed by removing unnecessary copper foil by etching and forming the first power supply line 5 and the first patch pattern 12a. In the same manner as described above, a flexible substrate in which a copper foil is bonded to a polyimide film is used, and unnecessary copper foil is removed by etching to form a second feed line 8 and a second patch pattern 12b. 2 ground conductor 2 is made of 0.7 mm thick aluminum plate. The first slot 13 is punched with a mechanical press, and the first shield spacer 10a, the second shield spacer 10b, the third shield spacer 11a, and the fourth shield spacer 11b have a thickness of 0. A 3 mm aluminum plate punched with a mechanical press was used.
In the first patch pattern 12a and the second patch pattern 12b, the diameter L4 shown in FIG. 3B is approximately 0.38 times the free space wavelength (λ 0 = 3.95 mm) of the frequency 76 GHz used. 1.5 mm and the shape was circular.
The slot dimension L6 is 2.3 mm in diameter, which is about 0.58 times the free space wavelength (λ 0 = 3.95 mm) of the frequency 76 GHz used, the shape is circular, the first shield spacer 10a, The dimension L5 of the second shield spacer 10b, the third shield spacer 11a, and the fourth shield spacer 11b is the same as the slot dimension, and the shape is circular.
Further, a transformer line 101 having a length of about 0.24 times the free space wavelength (λ 0 = 3.95 mm) of the frequency 76 GHz to be used is connected to the connection portion between the first feed line 5 and the first patch pattern 12a. The same transformer line 101 was also formed and matched at the connecting portion of the second feed line 8 and the second patch pattern 12b.
As shown in FIG. 3A, the above-described members are sequentially stacked to constitute a triplate line interlayer connector, and a measuring instrument is connected to the first feed line 5 and the second feed line 8 to supply power. As a result of measuring the reflection loss at the end of the first feed line 5 and the passage loss when power passes from the first feed line 5 to the end face of the second feed line 8 while feeding the power, Equivalent good characteristics could be realized.
[0020]
【The invention's effect】
As described above, with the triplate line interlayer connector of the present invention, a low-loss triplate line interlayer connector having a wide band and stable frequency characteristics can be configured, and an inexpensive tri-plate line with little characteristic change due to assembly errors can be formed. A plate line interlayer connector can be provided.
[Brief description of the drawings]
FIG. 1 is an exploded perspective view showing an embodiment of the present invention.
2A is a cross-sectional view showing an embodiment of the present invention, FIG. 2B is a plan view of a main portion of the embodiment of the present invention, and FIG. 2C is an embodiment of the present invention. It is another principal part top view.
3A is a cross-sectional view showing another embodiment of the present invention, FIG. 3B is a plan view of an essential part of another embodiment of the present invention, and FIG. It is another principal part top view of an Example.
FIGS. 4A, 4B, and 4C are plan views each showing a connection form of a patch pattern and a feed line used in an embodiment of the present invention.
FIG. 5 is a diagram showing frequency characteristics of reflection loss and passage loss according to an embodiment of the present invention.
FIG. 6 is an exploded perspective view showing a conventional example.
FIG. 7 is a plan view for explaining a problem of a conventional example.
[Explanation of symbols]
1. First ground conductor 2. Second ground conductor Third ground conductor 4a. First dielectric 4b. Second dielectric 7a. Third dielectric 7b. 4. Fourth dielectric material First feed line 8. Second feed line 6. First power supply board 9. Second power supply substrate 10a. First shield spacer 10b. Second shield spacer 11a. Third shield spacer 11b. Fourth shield spacer 12a. First patch pattern 12b. Second patch pattern 13. First slot 14. Second slot 101. Transformer line 102. Matching point 103. gap

Claims (3)

第１の地導体（１）と第２の地導体（２）の略中間に、第１の誘電体（４ａ）及び第２の誘電体（４ｂ）に挟んだ、第１の給電線路（５）を形成した第１の給電基板（６）を配置した第１のトリプレート線路と、第２の地導体（２）と第３の地導体（３）の略中間に、第３の誘電体（７ａ）及び第４の誘電体（７ｂ）に挟んだ、第２の給電線路（８）を形成した第２の給電基板（９）を配置した第２のトリプレート線路との電気的接続構造であって、前記第１の給電基板（６）の第１の給電線路（５）の接続終端部と、前記第２の給電基板（９）の第２の給電線路（８）の接続終端部とに、それぞれ第１のパッチパターン（１２ａ）、第２のパッチパターン（１２ｂ）を形成し、その第１のパッチパターン（１２ａ）の周辺部の第１の誘電体（４ａ）及び第２の誘電体（４ｂ）を削除すると共に、その削除した箇所に第１のパッチパターン（１２ａ）とそれに接続した第１の給電線路（５）の形状よりも大きめのくりぬき部を有する第１のシールドスペーサ（１０ａ）及び第２のシールドスペーサ（１０ｂ）を設け、かつ、前記第２のパッチパターン（１２ｂ）の周辺部の第３の誘電体（７ａ）及び第４の誘電体（７ｂ）を削除すると共に、その削除した箇所に第２のパッチパターン（１２ｂ）とそれに接続した第２の給電線路（８）の形状よりも大きめのくりぬき部を有する第３のシールドスペーサ（１１ａ）及び第４のシールドスペーサ（１１ｂ）を設け、さらに前記第１のパッチパターン（１２ａ）及び第２のパッチパターン（１２ｂ）の中間に位置する部分の前記第２の地導体（２）に、第１のスロット（１３）を形成したことを特徴とするトリプレート線路層間接続器。The first feed line (5) sandwiched between the first dielectric (4a) and the second dielectric (4b) between the first ground conductor (1) and the second ground conductor (2). The third dielectric is disposed approximately in the middle of the first triplate line on which the first power supply substrate (6) formed with the second power supply substrate (6) is disposed, and the second ground conductor (2) and the third ground conductor (3). Electrical connection structure with the second triplate line on which the second power supply substrate (9) on which the second power supply line (8) is formed is disposed between (7a) and the fourth dielectric (7b) A connection termination portion of the first feeding line (5) of the first feeding substrate (6) and a connection termination portion of the second feeding line (8) of the second feeding substrate (9). And forming a first patch pattern (12a) and a second patch pattern (12b), respectively, and a first dielectric on the periphery of the first patch pattern (12a) 4a) and the second dielectric (4b) are deleted, and a cutout portion larger than the shape of the first patch pattern (12a) and the first feed line (5) connected thereto is provided at the deleted portion. The first and second shield spacers (10a) and (10b) are provided, and the third dielectric (7a) and the fourth dielectric at the periphery of the second patch pattern (12b) are provided. (7b) and a third shield spacer (11a) having a hollow portion larger than the shape of the second patch pattern (12b) and the second feed line (8) connected to the second patch pattern (12b) ) And a fourth shield spacer (11b), and further, the second ground in a portion located between the first patch pattern (12a) and the second patch pattern (12b). The body (2), a triplate line inter-layer connector which is characterized in that formed the first slot (13). 第１のパッチパターン（１２ａ）及び第２のパッチパターン（１２ｂ）の、線路接続方向の長さＬ１を使用する周波数の自由空間波長λ0の略０．３８倍とし、かつ第１のシールドスペーサ（１０ａ）、第２のシールドスペーサ（１０ｂ）、第３のシールドスペーサ（１１ａ）、及び第４のシールドスペーサ（１１ｂ）のくりぬき部のパッチ周辺部の線路接続方向における寸法Ｌ２及び第１のスロット（１３）の線路接続方向における寸法Ｌ３を使用する周波数の自由空間波長λ0の略０．６倍としたことを特徴とする請求項１に記載のトリプレート線路層間接続器。The first patch spacer (12a) and the second patch pattern (12b) are approximately 0.38 times the free space wavelength λ 0 of the frequency using the length L1 in the line connection direction, and the first shield spacer (10a), the second shield spacer (10b), the third shield spacer (11a), the dimension L2 and the first slot in the line connection direction of the patch peripheral portion of the hollow portion of the fourth shield spacer (11b) The triplate line interlayer connector according to claim 1, wherein the dimension L3 in the line connection direction of (13) is approximately 0.6 times the free space wavelength λ 0 of the frequency used. 第１のパッチパターン（１２ａ）及び第２のパッチパターン（１２ｂ）の形状を円形とし、その直径Ｌ４を、使用する周波数の自由空間波長λ0の略０．３８倍とし、かつ第１のシールドスペーサ（１０ａ）、第２のシールドスペーサ（１０ｂ）、第３のシールドスペーサ（１１ａ）、及び第４のシールドスペーサ（１１ｂ）のくりぬき部のパッチ周辺部の形状を円形としその直径Ｌ５を使用する周波数の自由空間波長λ0の略０．６倍とし、かつ、第１のスロット（１３）の形状を円形としその直径Ｌ６を使用する周波数の自由空間波長λ0の略０．６倍としたことを特徴とする請求項１に記載のトリプレート線路層間接続器。The first patch pattern (12a) and the second patch pattern (12b) are circular in shape, the diameter L4 thereof is approximately 0.38 times the free space wavelength λ 0 of the frequency used, and the first shield The patch peripheral portion of the hollow portion of the spacer (10a), the second shield spacer (10b), the third shield spacer (11a), and the fourth shield spacer (11b) is circular and the diameter L5 is used. The frequency is approximately 0.6 times the free space wavelength λ 0 , and the shape of the first slot (13) is circular, and the diameter L6 is approximately 0.6 times the free space wavelength λ 0 of the frequency used. The triplate line interlayer connector according to claim 1.
JP06183898A 1998-03-13 1998-03-13 Triplate line interlayer connector Expired - Fee Related JP3965762B2 (en)

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JPH11261308A JPH11261308A (en) 1999-09-24
JP3965762B2 true JP3965762B2 (en) 2007-08-29

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Cited By (1)

* Cited by examiner, † Cited by third party
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