JP3902969B2 - RF-ID media - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an RF-ID medium capable of writing and reading information in a non-contact state.
[0002]
[Prior art]
In recent years, with the progress of the information-oriented society, information is recorded on a card, and information management and settlement using the card are performed. Information is recorded on a label or tag attached to a product or the like, and the product or the like is managed using the label or tag.
[0003]
In such information management using a card, label, or tag, a non-contact type IC equipped with an IC capable of writing and reading information in a non-contact state with respect to the card, label, or tag. Cards, non-contact type labels, and non-contact type IC tags are rapidly spreading due to their excellent convenience.
[0004]
In non-contact type IC cards, non-contact type IC labels, and non-contact type IC tags capable of writing and reading information in a non-contact state, those using an electromagnetic coupling method utilizing mutual induction of coils by an alternating magnetic field, The electromagnetic induction method using the induced power generated by the dielectric flux of the two coils, the microwave method for transmitting and receiving data by microwaves, the information writing / reading side provided on the card or label side and the outside There are the electrostatic coupling method that performs communication by charging between antennas with the capacitor principle, and the optical method that uses light energy modulation by flashing near infrared light at high speed. The electromagnetic induction method using the induced power due to the coil's dielectric magnetic flux is the most transparent because of its excellent transparency and high data transmission reliability. Ku has been used.
[0005]
In a non-contact type IC card, a non-contact type IC label, and a non-contact type IC tag using an electromagnetic induction method, a coil-shaped antenna is formed on a base substrate, and in a non-contact state via this antenna An IC module capable of writing and reading information is mounted in a state of being connected to an antenna, and power is supplied to the IC module via the antenna and information written in the IC module is read out. Information is written in the IC module.
[0006]
Here, in the non-contact type IC card, the non-contact type IC label, and the non-contact type IC tag by the electromagnetic induction method as described above, the antenna formed in the coil shape generates a current due to the electromagnetic induction. When an IC module is mounted, it is necessary to have a structure that forms one loop through the IC module.
[0007]
6A and 6B are diagrams showing a structure of a general non-contact type IC tag by an electromagnetic induction method, where FIG. 6A is a diagram showing an internal structure, and FIG. It is sectional drawing.
[0008]
As shown in FIG. 6, the non-contact type IC tag in this conventional example has an IC module 511 capable of writing and reading information from the outside on a resin sheet 515 and an IC module via a contact 514. A current is supplied to the IC module 511 by electromagnetic induction from an information writing / reading device (not shown) provided externally, and information is written to and read from the IC module 511 in a non-contact state. And an inlet 510 on which a conductive antenna 512 is formed and a surface of the inlet 510 on which the IC module 511 is mounted are stacked via an adhesive layer 550 to protect the IC module 511 and the antenna 512, and the surface thereof And a top sheet 520 on which information is printed. Further, the antenna 512 formed on the resin sheet 515 has both ends of the coil shape connected to each other on the surface of the resin sheet 515 opposite to the surface on which the antenna 512 is formed, whereby the IC module 511 is connected. Is mounted, a single loop is formed through the IC module 511.
[0009]
In the non-contact type IC tag 500 configured as described above, the IC module 511 is connected from the antenna 512 by electromagnetic induction from the information writing / reading device by being brought close to the information writing / reading device provided outside. Is supplied to the IC module 511 from the information writing / reading device, and the information written in the IC module 511 is read by the information writing / reading device in a non-contact state. .
[0010]
Here, in the connection of both ends of the coil shape of the antenna 512 formed on the resin sheet 515, since the antenna 512 is formed in a coil shape on the resin sheet 515, both ends so as to straddle other antenna portions. However, it is necessary to electrically insulate the pattern for connecting both ends from the pattern straddling both ends.
[0011]
Therefore, as shown in FIG. 6, both ends are connected on the surface of the resin sheet 515 opposite to the surface on which the antenna 512 is formed, or a resist is printed on a pattern portion across the antenna 512, By forming a pattern for connecting both ends, the pattern for connecting both ends is electrically insulated from the pattern straddling it.
[0012]
[Problems to be solved by the invention]
However, in the conventional non-contact type IC tag as described above, when connecting both ends of the antenna formed in a coil shape, a pattern is formed on the surface opposite to the surface on which the antenna of the resin sheet is formed. Or by printing a resist on the antenna pattern and further printing a pattern on it, the pattern for connecting both ends of the antenna formed in the coil shape and the pattern straddling it can be electrically connected. For example, when an antenna pattern is formed by printing, the pattern of the part that forms the coil shape and the pattern of the part that straddles it must be printed in separate processes, and time and effort There is a problem that it takes.
[0013]
The present invention has been made in view of the problems of the prior art as described above. In an RF-ID medium having an antenna formed in a coil shape, both ends of the coil shape are troublesome. An object of the present invention is to provide an RF-ID medium that can be connected without taking time.
[0014]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides:
An antenna having a coil shape is formed, and at least a base substrate on which an IC module connected to the antenna and in which information is written and read out in a non-contact state via the antenna is mounted. In RF-ID media,
A U-shape that covers the IC module is provided, the ends of the U-shape are connected to both ends of the coil shape of the antenna, and the IC module is covered by the U-shape. And a connection member made of a conductive material mounted on the base substrate.
[0015]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides:
An antenna having a coil shape is formed, and at least a base substrate on which an IC module connected to the antenna and in which information is written and read out in a non-contact state via the antenna is mounted. In RF-ID media,
Of the IC module 3 A shape extending along the side, connecting both ends of the coil shape of the antenna, and the shape of the IC module by the shape. 3 A connecting member made of a conductive material mounted on the base substrate is provided along the side.
[0016]
Also, An antenna having a coil shape is formed, and at least a base substrate on which an IC module connected to the antenna and in which information is written and read out in a non-contact state via the antenna is mounted. In RF-ID media,
It has a shape along the four sides of the IC module, connects both ends of the antenna coil shape, and depends on the shape. Along the four sides of the IC module , Mounted on the base substrate Having a connecting member made of a conductive material It is characterized by that.
[0017]
In addition, when the connection member is mounted on the base substrate, the height relative to the base substrate is higher than the height of the IC module when the IC module is mounted on the base substrate. It is characterized by having such a thickness.
[0018]
Further, the connecting member is characterized in that the thickness of the portion adjacent to the side of the IC module is thicker than the thickness of the other portion.
[0019]
(Function)
In the present invention configured as described above, both ends of the coil shape of the antenna have a U-shape that covers the IC module, and the conductive material mounted on the base substrate so as to cover the IC module. Since it is connected by a connecting member made of a material, both ends of the coil shape of the antenna can be easily connected only by mounting the connecting member on the base substrate, and it is bent with respect to the RF-ID media. The possibility of the RF-ID media being damaged or the RF-ID media and the antenna being disconnected is reduced when an external force is applied in the direction to be applied or pressure is applied to the IC module. .
[0020]
In addition, a connecting member made of a conductive material that has a shape in which both ends of the coil shape of the antenna are along at least two sides of the IC module and is mounted on the base substrate so as to be along at least two sides of the IC module. In the case where the antenna is connected to each other, both ends of the coil shape of the antenna can be easily connected only by mounting the connecting member on the base substrate, and in a direction to be bent with respect to the RF-ID media. When external force is applied or pressure is applied to the entire RF-ID media, the possibility of the RF-ID media being damaged or the RF-ID media and the antenna being disconnected is reduced. .
[0021]
Further, the thickness of the connecting member is set so that the height of the connecting member relative to the base substrate when the connecting member is mounted on the base substrate is the height of the IC module when the IC module is mounted on the base substrate. If the pressure is higher than this, when pressure is applied to the entire surface of the RF-ID media, the pressure is not applied to the IC module, and the IC module can be more reliably protected.
[0022]
Further, if the shape of the connecting member is such that the thickness of the portion adjacent to the side of the IC module is thicker than the thickness of the other portion, the region where the connecting member is mounted becomes a gentle convex shape. .
[0023]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
[0024]
(First embodiment)
FIG. 1 is a diagram showing an example of a non-contact type IC tag which is a first embodiment of the RF-ID media of the present invention, (a) is a diagram showing a structure, and (b) is a diagram showing (a). It is sectional drawing in the shown AA 'part.
[0025]
In this embodiment, as shown in FIG. 1, an IC module 111 capable of writing and reading information from the outside is mounted on a resin sheet 115 via an adhesive 116, and the IC module 111 is connected via a contact 114. To supply current to the IC module 111 by electromagnetic induction from an information writing / reading device (not shown) provided outside, and to write and read information to and from the IC module 111 in a non-contact state. Are stacked on the surface of the inlet 110 on which the IC module 111 is mounted via an adhesive layer 150 to protect the IC module 111 and the antenna 112 and on the surface thereof. It is comprised from the surface sheet 120 on which information is printed. Note that the antenna 112 is formed in a coil shape in a state where the area where the IC module 111 is mounted on the resin sheet 115 is disconnected, and when the IC module 111 is mounted, the disconnected portion of the antenna 112 forms the IC module 111. It is the structure connected via. Moreover, the part used as the both ends of the coil shape of the antenna 112 is formed in the both sides which pinched | interposed the antenna 112 of this disconnection part. Further, the connection member 113 having a U-shape that covers the IC module 111 covers the IC module 111, and the portions where the U-shaped ends are the ends of the coil shape of the antenna 112 are electrically connected. So that the antenna 112 is mounted on the resin sheet 115 via the adhesive 117 containing conductive particles so that the antenna 112 is connected to the loop through the IC module 111 and the connection member 113. Is forming. In this connecting member 113, a metal having a large plastic deformation force, such as stainless steel, stainless spring steel, phosphor bronze plate, quenched ribbon steel, or spring steel, or a brass plate, brass plate, copper plate, etc. , Iron plate, duralumin and other metal plates. Note that the adhesive 117 includes minute conductive particles, and the adhesive 117 alone does not have conductivity, and only those in contact with each other through the conductive particles conduct. Thus, the end of the connection member 113 and the antenna 112 are conducted.
[0026]
In the non-contact type IC tag 100 configured as described above, the IC module 111 is connected to the IC module 111 from the antenna 112 by electromagnetic induction from the information writing / reading device by being brought close to the information writing / reading device provided outside. Is supplied to the IC module 111 from the information writing / reading device, and the information writing / reading device is read by the information writing / reading device in a non-contact state. .
[0027]
In the non-contact type IC tag 100 as described above, both ends of the coil shape of the antenna 112 are connected by the connection member 113 made of metal and mounted on the resin sheet 115 so as to cover the IC module 111. Both ends of the coil shape of the antenna 112 can be easily connected only by mounting the connection member 113 on the resin sheet 115, and an external force is applied to the non-contact type IC tag 100 in the bending direction. When pressure is applied to the IC module 111, the possibility that the IC module 111 is damaged or the IC module 111 and the antenna 112 are disconnected at the contact 114 is reduced. Further, since the connection member 113 is not in contact with the IC module 111, an inexpensive adhesive can be used as the adhesive 117 for bonding the connection member 113 and the resin sheet 115, and the connection member It is not necessary to perform fine pressure control when the adhesive 113 and the resin sheet 115 are bonded together by the adhesive 117.
[0028]
Hereinafter, a method for manufacturing the non-contact type IC tag 100 as described above will be described.
[0029]
FIG. 2 is a diagram for explaining a method of manufacturing the non-contact type IC tag 100 shown in FIG.
[0030]
First, the coil-shaped antenna 112 is formed on the resin sheet 115 by printing, etching, or the like (FIG. 2A).
[0031]
Next, the IC module 111 is mounted on the resin sheet 115 via the conductive adhesive 116 so that the IC module 111 is mounted on the antenna 112, and a predetermined pressure is applied to the IC module 111 to apply the IC. The module 111 and the resin sheet 115 are bonded together with an adhesive 116, and the antenna 112 and the IC module 111 are electrically connected to each other at a contact 114 provided on the back surface of the IC module 111, thereby completing the inlet 110 (FIG. 2 ( b)).
[0032]
Next, an adhesive containing conductive particles on the resin sheet 115 so as to cover the IC module 111 and to be electrically connected to both ends of the coil shape of the antenna 112. The connecting member 113 and the resin sheet 115 are bonded together by the adhesive 117 by mounting through 117 and applying a predetermined pressure to the connecting member 113 (FIG. 2C).
[0033]
Here, the structure of the connection member 113 will be described in detail.
[0034]
FIG. 3 is a view showing an example of the structure of the connecting member 113 shown in FIG.
[0035]
As shown in FIG. 3, the connection member 113 in this embodiment has a structure in which the connection portion 118 connected to the antenna 112 has a plurality of pointed shapes, and is predetermined in a state of being mounted on the resin sheet 115. When the pressure is applied, the antenna portion of the resin sheet 115 is joined so that the tip shape bites into the antenna 112 portion of the resin sheet 115. Thereby, when it mounts on the resin sheet 115, the contact area of the connection member 113 and the antenna 112 increases, and the resistance value between the antenna 112 and the connection member 113 can be decreased.
[0036]
Thereafter, the surface sheet 120 is laminated on the inlet 110 via the adhesive layer 150 to complete the non-contact type IC tag 100 (FIG. 2D).
[0037]
(Second Embodiment)
4A and 4B are diagrams showing another example of a non-contact type IC tag which is the second embodiment of the RF-ID medium of the present invention. FIG. 4A is a diagram showing the structure, and FIG. (C) is a cross-sectional view taken along the line BB 'shown in (a).
[0038]
In this embodiment, as shown in FIG. 4, an IC module 211 capable of writing and reading information from the outside is mounted on a resin sheet 215 via an adhesive 216, and the IC module 211 via a contact 214. Is supplied to the IC module 211 by electromagnetic induction from an information writing / reading device (not shown) provided outside, and information is written to and read from the IC module 211 in a non-contact state. Are laminated on the surface of the inlet 210 on which the IC module 211 is mounted via the adhesive layer 250 to protect the IC module 211 and the antenna 212 and on the surface thereof. It is comprised from the surface sheet 220 on which information is printed. The antenna 212 is formed in a coil shape in a state where the area where the IC module 211 is mounted on the resin sheet 215 is disconnected, and when the IC module 211 is mounted, the disconnected portion is connected to the IC module 211. It is the structure connected via. Moreover, the part used as the both ends of the coil shape of the antenna 212 is formed in the both sides which pinched | interposed the antenna 212 of this disconnection part. Further, the connection member 213 made of a metal having a U-shape along the three sides of the IC module 211 is along the three sides of the IC module 211 and becomes both ends of the coil shape of the antenna 212. It is mounted on the resin sheet 215 via a conductive adhesive 217 so as to be electrically connected to the antenna 212 at a part, whereby the antenna 212 is connected via the IC module 211 and the connection member 213. One loop is formed. Further, as shown in FIG. 4C, when the connection member 213 is mounted on the resin sheet 215, the connection member 213 does not come into contact with the resin sheet 215 except for the portions that become both ends of the coil shape of the antenna 212. It has a shape. In addition, regarding the thickness of the connection member 213, the height relative to the resin sheet 215 when mounted on the resin sheet 215 via the adhesive 217 is equal to the IC mounted on the resin sheet 215 via the adhesive 216. It is preferable that the height of the module 211 be higher.
[0039]
In the non-contact type IC tag 200 configured as described above, both ends of the coil shape of the antenna 212 are made of metal and are connected by connection members 213 mounted on the resin sheet 215 so as to follow the outer shape of the IC module 211. Therefore, both ends of the coil shape of the antenna 212 can be easily connected simply by mounting the connection member 213 on the resin sheet 215, and in a direction to be bent with respect to the non-contact type IC tag 200. When an external force is applied or pressure is applied to the entire surface of the non-contact type IC tag 200, the IC module 211 is damaged, or the IC module 211 and the antenna 212 are disconnected at the contact 214. The possibility of doing is reduced. Further, since the connection member 213 is not in contact with the IC module 211, an inexpensive adhesive can be used as the adhesive 217 for bonding the connection member 213 and the resin sheet 215, and the connection member It is not necessary to perform fine pressure control when bonding 213 and the resin sheet 215 with the adhesive 217. Further, since the connection member 213 is not provided on the IC module 211, the thickness of the non-contact type IC tag 200 in the region where the IC module 211 is mounted is different from that described in the first embodiment. Can be made thin, and thereby the flatness of the surface of the non-contact type IC tag 200 can be improved.
[0040]
(Third embodiment)
FIG. 5 is a diagram showing another example of a non-contact type IC tag which is a third embodiment of the RF-ID media of the present invention, (a) is a diagram showing the structure, and (b) is (a) (C) is a cross-sectional view taken along the line BB 'shown in (a).
[0041]
In this embodiment, as shown in FIG. 5, an IC module 311 capable of writing and reading information from the outside is mounted on a resin sheet 315 via an adhesive 316, and the IC module 311 is connected via a contact 314. Is supplied to the IC module 311 by electromagnetic induction from an information writing / reading device (not shown) provided outside, and information is written to and read from the IC module 311 in a non-contact state. Are stacked on the surface of the inlet 310 on which the IC module 311 is mounted via an adhesive layer 350 to protect the IC module 311 and the antenna 312, and on the surface thereof It is comprised from the surface sheet 320 on which information is printed. Note that the antenna 312 is formed in a coil shape in a state where the area where the IC module 311 is mounted on the resin sheet 315 is disconnected, and when the IC module 311 is mounted, the disconnected part is the IC module 311. It is the structure connected via. In addition, portions that are both ends of the coil shape of the antenna 312 are formed on both sides of the disconnected portion of the antenna 312. Further, the connection member 313 made of metal has a hole into which the IC module 311 enters, and the antenna 312 is connected to the antenna 312 at both ends of the coil shape of the antenna 312 so that the IC module 311 enters the hole. It is mounted on the resin sheet 315 via a conductive adhesive 317 so as to be electrically connected, whereby the antenna 312 forms one loop via the IC module 311 and the connection member 313. is doing. Further, as shown in FIG. 5C, the connecting member 313 does not come into contact with the resin sheet 315 except for portions that are both ends of the coil shape of the antenna 312 when mounted on the resin sheet 315. It has a shape. In addition, the thickness of the connecting member 313 is a shape that becomes thinner from the portion adjacent to the hole to the outer periphery. It is preferable that the height relative to the resin sheet 315 when mounted via the agent 317 is higher than the height of the IC module 311 mounted via the adhesive 316 on the resin sheet 315.
[0042]
In the non-contact type IC tag 300 configured as described above, both ends of the coil shape of the antenna 312 are mounted on the resin sheet 315 so that the IC module 311 enters a hole formed of metal and formed inside. Since both ends of the coil shape of the antenna 312 can be easily connected simply by mounting the connection member 313 on the resin sheet 315 and connected to the non-contact type IC tag 300 because the connection members 313 are connected. When an external force is applied in the bending direction or pressure is applied to the entire surface of the non-contact type IC tag 300, the IC module 311 is damaged, or the IC module 311 and the antenna 312 are connected at the contact point 314. The possibility of disconnection is reduced. Further, since the connecting member 313 is not in contact with the IC module 311, an inexpensive adhesive can be used as the adhesive 317 for bonding the connecting member 313 and the resin sheet 315, and the connecting member It is not necessary to perform fine pressure control when adhering 313 and the resin sheet 315 with the adhesive 317. Further, since the connecting member 313 is not provided on the IC module 311, the thickness of the non-contact type IC tag 300 in the area where the IC module 311 is mounted is different from that described in the first embodiment. Can be made thin, and thereby the flatness of the surface of the non-contact type IC tag 300 can be improved.
[0043]
In addition, in what was demonstrated in 2nd Embodiment, in the connection member 213 which has a U-shape along 3 sides of IC module 211, and what was demonstrated in 3rd Embodiment Has been described by taking as an example the connection member 313 having a hole composed of sides adjacent to the four sides of the IC module 311, but if a connection member having a shape adjacent to at least two sides of the IC module is used. When an external force is applied to the non-contact type IC tag in the bending direction or pressure is applied to the entire surface of the non-contact type IC tag, the IC module may be damaged, the IC module and the antenna Is less likely to break at the contacts.
[0044]
Needless to say, the present invention also includes a non-contact type IC tag configured by combining the above-described embodiments.
[0045]
Further, in the above-described embodiments, the non-contact type IC tag has been described as an example of the RF-ID medium capable of writing and reading information in a non-contact state. Not only a tag but a non-contact IC label, a non-contact IC card, or the like can be applied as long as it includes an inlet in which an IC module is mounted.
[0046]
【The invention's effect】
As described above, in the present invention, an antenna having a coil shape is formed, and a base on which an IC module that is connected to the antenna and performs writing and reading of information in a non-contact state via the antenna is mounted. An RF-ID medium having at least a base material, which has a U-shape that covers the IC module, and ends of the U-shape are connected to both ends of the antenna coil shape, and Since the connection member made of a conductive material mounted on the base substrate is provided so as to cover the IC module with the U-shape, both ends of the coil shape of the antenna can be easily connected, and the RF-ID When external force is applied to the media in the bending direction or pressure is applied to the IC module, the RF-ID Or A is accidentally damaged, it is possible that the RF-ID media and the antenna to reduce the possibility of or accidentally disconnected.
[0047]
In addition, it has a shape along at least two sides of the IC module, connects both ends of the coil shape of the antenna, and is mounted on the base substrate so as to be along at least two sides of the IC module depending on the shape. In the case where the connection member made of a conductive material is provided, both ends of the antenna coil shape can be easily connected, and an external force is applied to the RF-ID media in the direction in which the antenna is bent. When pressure is applied to the entire ID medium, the possibility that the RF-ID medium is damaged or the RF-ID medium and the antenna are disconnected is reduced.
[0048]
Further, the thickness of the reinforcing member is the height of the reinforcing member relative to the base substrate when the reinforcing member is mounted on the base substrate, and the height of the IC module when the IC module is mounted on the base substrate. In the case where the pressure is higher than this, when pressure is applied to the entire surface of the RF-ID media, the pressure is not applied to the IC module, and the IC module can be more reliably protected.
[0049]
In addition, when the shape of the reinforcing member is such that the thickness of the portion adjacent to the side of the IC module is thicker than the thickness of the other portion, the region where the reinforcing member is mounted should be a gentle convex shape. Can do.
[Brief description of the drawings]
1A and 1B are diagrams showing an example of a non-contact type IC tag according to a first embodiment of an RF-ID medium of the present invention. FIG. 1A is a diagram showing a structure, and FIG. It is sectional drawing in the shown AA 'part.
2 is a view for explaining a method of manufacturing the non-contact type IC tag shown in FIG. 1. FIG.
FIG. 3 is a view showing a structural example of a connecting member shown in FIG. 1;
FIGS. 4A and 4B are diagrams showing another example of a non-contact type IC tag according to the second embodiment of the RF-ID media of the present invention, where FIG. 4A is a diagram showing the structure, and FIG. (C) is a cross-sectional view taken along the line BB 'shown in (a).
FIGS. 5A and 5B are diagrams showing another example of a non-contact type IC tag according to a third embodiment of the RF-ID media of the present invention, FIG. 5A is a diagram showing a structure, and FIG. (C) is a cross-sectional view taken along the line BB 'shown in (a).
6A and 6B are diagrams showing a structure of a general non-contact type IC tag using an electromagnetic induction method, in which FIG. 6A is a diagram showing an internal structure, and FIG. 6B is a cross-sectional view taken along a line AA ′ shown in FIG. It is sectional drawing.
[Explanation of symbols]
100, 200, 300 Non-contact IC tag
110, 210, 310 Inlet
111, 211, 311 IC module
112, 212, 312 Antenna
113,213,313 Connection member
114, 214, 314 contact
115,215,315 resin sheet
116,117,216,217,316,317 Adhesive
118 Connection part
120, 220, 320 Surface sheet
150, 250, 350 Adhesive layer

Claims (5)

An antenna having a coil shape is formed, and at least a base substrate on which an IC module connected to the antenna and in which information is written and read out in a non-contact state via the antenna is mounted. In RF-ID media,
A U-shape that covers the IC module is provided, the ends of the U-shape are connected to both ends of the coil shape of the antenna, and the IC module is covered by the U-shape. And an RF-ID medium comprising a connecting member made of a conductive material mounted on the base substrate. An antenna having a coil shape is formed, and at least a base substrate on which an IC module connected to the antenna and in which information is written and read out in a non-contact state via the antenna is mounted. In RF-ID media,
It has a shape along the three sides of the IC module, connects both ends of the coil shape of the antenna, and is mounted on the base substrate along the three sides of the IC module by the shape. An RF-ID medium comprising a connecting member made of a conductive material. An antenna having a coil shape is formed, and at least a base substrate on which an IC module connected to the antenna and in which information is written and read out in a non-contact state via the antenna is mounted. In RF-ID media,
Comprising a shape along the four sides of the IC module, and connecting both ends of the coil shape of the antenna, and the shape by along the four sides of the IC module is mounted on the base substrate An RF-ID medium comprising a connecting member made of a conductive material . In the RF-ID media according to claim 2 or 3,
When the connection member is mounted on the base substrate, the height relative to the base substrate is higher than the height of the IC module when the IC module is mounted on the base substrate. An RF-ID medium characterized by having a large thickness. In the RF-ID media according to claim 2 or 3,
The RF-ID medium, wherein the connection member has a shape in which a thickness of a portion adjacent to the side of the IC module is larger than a thickness of other portions.

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