JP3853930B2 - Non-contact data carrier package and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a non-contact type data carrier package suitable for being mounted on an article that easily undergoes elastic deformation, such as various rubber products, and a manufacturing method thereof .
[0002]
[Prior art]
The data carrier system is composed of a transponder called a non-contact data carrier and an interrogator connected to the host side. Between these transponders and the interrogator, magnetism, induction electromagnetic field, microwave (radio wave), etc. Information is communicated in a non-contact manner via a transmission medium.
[0003]
In this data carrier system, a responder is attached to various individuals, information relating to the individual is read remotely by an interrogator and provided to a host to realize information processing relating to the individual.
[0004]
Information transmission systems for contactless data carrier systems include electromagnetic coupling systems, electromagnetic induction systems, microwave systems, and optical communication systems. Among these systems, the electromagnetic coupling system and the microwave system can use the energy of the transmission signal from the interrogator as the driving power for the responder. For this reason, there is a further advantage that there is no fear that the response capability is deteriorated or the usage limit is reached due to the approaching life of the battery as in the case where the battery is used as a drive source.
[0005]
FIG. 6 shows the overall configuration of the contactless data carrier system. As shown in the figure, the non-contact data carrier system includes an interrogator 10 and a responder (non-contact data carrier) 20.
[0006]
The interrogator 10 reads out the main control unit 11 that performs overall control of the interrogator 10, the interface unit 12 that controls input / output of data with the host device, and tag information received from the non-contact data carrier 20. A storage unit 13 such as a writable RAM, a signal conversion unit 14 that converts transmission information from a digital signal to an analog signal, and converts a reception signal from the non-contact data carrier 20 from an analog signal to a digital signal, and transmission For example, a modulation unit 15 that modulates a signal into a signal for transmission by an ASK (Amplitude Shift Keying) method, an FSK (Frequency Shift Keying) method, a demodulation unit 16 that demodulates a reception signal, a transmission antenna 17, and a reception antenna 18 And is configured.
[0007]
The responder (non-contact data carrier) 20 is a main control unit 21 that performs overall control of the non-contact data carrier 20, a storage unit 22 that does not require a power source backup such as an EEPROM that stores tag information, and digitally transmits transmission information. A signal conversion unit 23 that converts a signal into an analog signal and converts a reception signal from the interrogator 10 from an analog signal into a digital signal, and a modulation unit that modulates a transmission signal into a signal for transmission by the ASK method, the FSK method, or the like 24, a demodulator 25 that demodulates the received signal, a transmission antenna 26, and a reception antenna 27.
[0008]
The basic communication procedure of this contactless data carrier system is as follows.
[0009]
The interrogator 10 first transmits an interrogation signal for reading tag information for the non-contact data carrier 20. When the contactless data carrier 20 enters a range where the inquiry signal can be received, the contactless data carrier 20 receives the inquiry signal and transmits the tag information stored in the storage unit 22 as a response signal. The interrogator 10 receives and decodes the response signal and sends it to the host device as tag identification information.
[0010]
The transponder (non-contact data carrier package) is composed of an antenna component and a circuit component for transmitting and receiving signals to and from the interrogator. And internal parts such as circuit parts are hermetically sealed.
[0011]
[Problems to be solved by the invention]
In the non-contact data carrier package attached to the article, the circuit board, the antenna coil, and their joints may be damaged due to impact, vibration, etc. accompanying the movement of the article, resulting in poor response. In particular, the strength of the circuit board or the joint between the antenna coil and the circuit board is relatively weak, and some protection is required because they are not destroyed by an external mechanical shock.
[0012]
In addition, when such a non-contact data carrier package is attached to an article that is easily elastically deformed, such as a tire or a rubber mat, internal components such as a storage element and an antenna coil in the non-contact data carrier package due to elastic deformation of the article itself. There is a risk that the internal parts may be destroyed due to stress. In order to prevent such component destruction, a method is conceivable in which the entire carrier is surrounded by a hard material so that external force is not transmitted to the internal components. However, in this method, when the article itself is thin, a large stress is generated in the article itself due to the hard package of the non-contact data carrier at the time of deformation, and there is a risk of causing damage such as cracks.
[0013]
The present invention has been made in view of such circumstances, and is a non-contact data carrier having excellent durability capable of preventing destruction of internal components due to external mechanical shock or stress generated by deformation of the article itself. It is intended to provide a package and a manufacturing method thereof .
[0014]
[Means for Solving the Problems]
To achieve the above object, the non-contact data carrier package of the present invention, the circuit board and an antenna coil in a non-contact data carrier package configured to surround the outer portion, the circuit board, and said antenna coil A buffer layer made of a gel-like resin is provided facing the joint with the circuit board, and at least a part of the antenna coil does not face the buffer layer .
Further, the non-contact data carrier package manufacturing method of the present invention has a bonding step of bonding both end lines of the antenna coil to the terminals of the circuit board, the circuit board, and a bonding portion between the antenna coil and the circuit board. And a buffer layer installation step of arranging a buffer layer made of a gel-like resin so as not to face at least a part of the antenna coil, the circuit board and the joint provided with the buffer layer, and the antenna It is characterized by comprising a heating and pressurizing step that is sandwiched between a coil and an exterior part and integrated by heating and pressing.
[0015]
The present invention can disperse and absorb the force applied to the joint between the internal component, in particular, the circuit board and the antenna coil and the circuit board by an external impact or deformation of the article, by the buffer layer made of gel resin, It is possible to prevent a component from being broken by an external force, and it is possible to realize a contactless data carrier package that is durable and highly reliable.
[0016]
In addition, the present invention uses a gel-like resin buffer layer in which a gel-like resin is sealed in a resin-made film, so that the gel-like resin can be easily handled when forming an exterior part. As well as durability against repeated impacts and vibrations from the outside.
[0017]
Examples of the gel-like resin that can be used in the present invention include a silicone-based resin and a gelatin-based resin. However, a silicone-based resin is more suitable because it can withstand heat at the time of manufacturing a data carrier package.
[0018]
Examples of the resin film that encloses the gel-like resin include films such as a polyester resin, a polyethylene resin, a polypropylene resin, a polyamide resin, and a polyimide film resin.
[0019]
As the exterior resin, thermoplastic resins such as acrylonitrile / butylene / styrene copolymer resin (ABS resin), polybutylene terephthalate resin (PBT resin), polyphenylene sulfide resin (PPS resin), epoxy resin, phenol resin, unsaturated Thermosetting resins such as polyester resins can be used alone or in combination by the casting method or the like.
[0020]
In addition, a flexible resin may be used as the exterior resin. As the flexible resin, in addition to the heat allied elastomer and thermosetting elastomer, a resin such as foamed urethane and foamed polypropylene is foamed to provide flexibility. The resin film used when enclosing a thing and gel-like resin can be used.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0022]
FIG. 1 is a plan view showing a non-contact data carrier package according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along a line aa.
[0023]
As shown in these drawings, the internal components of the contactless data carrier package of the present embodiment are composed of an antenna coil 1 and a circuit board 2 on which an IC chip and the like are mounted. Each functional circuit of the responder shown in FIG. 6 (excluding the transmission / reception antenna portion) is incorporated in the IC chip. These internal parts are entirely surrounded by a buffer layer 3 made of gel resin, and the internal parts surrounded by the buffer layer 3 made of gel resin are housed in an exterior case 4 made of resin.
[0024]
The non-contact data carrier package having such a configuration can be manufactured as follows, for example.
[0025]
First, an antenna coil 1 having an inner diameter of 15 mm, an outer diameter of 20 mm, and a thickness of 0.5 mm is produced using a copper wire having a diameter of 0.06 mm. Next, both ends of the antenna coil 1 are soldered to terminals of an 8 mm square circuit board 2 on which various circuit elements including a memory element are mounted, and the antenna coil 1 and the circuit board 2 are electrically and physically connected. To join. Next, a gel resin such as a silicone gel resin θ gel (trade name; manufactured by Siegel Co., Ltd.) is placed on the exterior case 4 having a space of a diameter of 21 mm and a height of 3 mm, for example, an ABS resin case. After injecting until the thickness becomes 5 mm, an internal component composed of the antenna coil 1 and the circuit board 2 is placed thereon, and θ gel is injected until the space is filled, and then, for example, a lid 5 made of ABS resin is attached to the outer case 4 as an adhesive. Paste with. In this way, the contactless data carrier package of this embodiment is obtained.
[0026]
When a drop impact test of an iron ingot (mass 3 kg) was conducted on the non-contact data carrier package produced by this method and each of the comparative examples prepared without forming the gel-like resin buffer layer, While the contact data carrier package stopped responding at a drop height of 0.9 m (12.6 kg · m / s as momentum), the non-contact data carrier package of this embodiment had a drop height of 1.2 m (as momentum). The case material 4 did not break up to 14.6 kg · m / s), and the usefulness of the gel-like resin buffer layer 3 could be confirmed.
[0027]
Next, another embodiment of the present invention will be described.
[0028]
FIG. 3 is a plan view showing a non-contact data carrier package according to the second embodiment, and FIG. 4 is a cross-sectional view taken along the line aa.
[0029]
As shown in these drawings, the non-contact data carrier package of the present embodiment has at least a circuit board 2 and a region including the junction 6 between the circuit board 2 and the antenna coil 1 in a gel-like shape on a resin film 3b. A resin layer 3a is enclosed and covered with a buffer layer 3 ', which is further surrounded by an exterior material 4'.
[0030]
The non-contact data carrier package having such a configuration can be manufactured as follows, for example.
[0031]
First, an antenna coil 1 having an inner diameter of 38 mm, an outer diameter of 42 mm, and a thickness of 0.5 mm is produced using a copper wire having a diameter of 0.06 mm. Next, both ends of the antenna coil 1 are soldered to terminals of an 8 mm square circuit board 2 on which various circuit elements including a memory element are mounted, and the antenna coil 1 and the circuit board 2 are electrically and physically connected. To join. Next, as the gel resin 3a, for example, a silicone gel resin θ gel is sealed with a resin film 5b such as a polyester film to produce a gel resin buffer layer 3 ′ having an outer shape of 10 × 12 mm and a thickness of 2 mm.
[0032]
Next, the gel-like resin buffer layer 3 ′ is disposed so as to face at least the circuit board 2 and a region including the joint portion 6 between the circuit board 2 and the antenna coil 1, and has a thickness of 0.5 mm. Are sandwiched between raw SBR rubber sheets 4 ', pressed and heated to vulcanize and integrate the upper and lower SBR rubber sheets 4', and then punched into a desired size and shape, for example, a 46 mm diameter circle. In this way, the contactless data carrier package of this embodiment is obtained.
[0033]
A non-contact data carrier package produced by this method was subjected to a drop impact test of an iron ingot (mass 3 kg), and the responsiveness was lost even at a drop height of 1.1 m (momentum of 13.9 kg · m / s). In view of the experimental results of the non-contact data carrier package of the comparative example being damaged at a drop height of 0.9 m (momentum of 12.6 kg · m / s), a structure incorporating a gel-like resin buffer layer 3 ′ The usefulness of can be confirmed in the same way.
[0034]
In the non-contact data carrier package of the second embodiment, the bending rigidity of the peripheral portion of the circuit board is improved by the gel-like resin buffer layer 3 ′. The jig 9 shown in FIG. 5 was used to perform a repeated bending test on the non-contact data carrier package of the comparative example and this embodiment. In this test, the contactless data carrier package was pressed against the curvature surface of the jig 9 to repeatedly deform the package, and a communication test was performed each time to determine the number of times of bending that resulted in communication failure. As a result of this test, the package of the comparative example became incapable of communication after 10 to 14 bendings, whereas the package of the present embodiment was able to communicate even after 100 bendings. In the comparative example, the cause of communication failure was due to breakage of the circuit board and disconnection of the joint between the circuit board and the antenna coil.
[0035]
In this embodiment, the gel-like resin buffer layer is provided only on one side of the internal part, but it goes without saying that the gel-like resin buffer layer may be provided on both sides.
[0036]
【The invention's effect】
As described above, according to the non-contact data carrier package of the present invention, the force applied to the internal component, particularly the circuit board, and the joint between the antenna coil and the circuit board due to external impact or deformation of the article itself is gelled resin. It can be dispersed and absorbed by the buffer layer made of the above, and the internal parts can be prevented from being broken and the durability can be improved.
[0037]
Moreover, according to the present invention, as a buffer layer of the gel resin, the gel resin encapsulated in a resin film is used as the buffer layer, so that the gel resin can be easily handled when forming the exterior part. Workability is improved, and durability against repeated impacts and vibrations from the outside can be further increased.
[Brief description of the drawings]
FIG. 1 is a plan view showing a configuration of a contactless data carrier package according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of the contactless data carrier package of FIG. 1. FIG. 3 is a second embodiment of the present invention. FIG. 4 is a cross-sectional view of the non-contact data carrier package of FIG. 3. FIG. 5 is a diagram for explaining a bending test method for the non-contact data carrier package. [Figure] Diagram showing configuration of contactless data carrier system [Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Antenna coil 2 ... Circuit board 3, 3 '... Gel-like resin buffer layer 3a ... Resin film 3b ... Gel-like resin 4 ... Exterior case 4' ... Exterior material 6 ... Circuit board Joint with antenna coil

Claims (2)

In a non-contact data carrier package configured by surrounding a circuit board and an antenna coil with an exterior part,
A buffer layer made of a gel-like resin is provided facing the circuit board and the joint between the antenna coil and the circuit board, and at least a part of the antenna coil does not face the buffer layer. Non-contact data carrier package characterized by that. A joining step of joining both ends of the antenna coil to the terminals of the circuit board;
A buffer layer installation step of arranging a buffer layer made of a gel-like resin so as to face the junction between the circuit board and the antenna coil and the circuit board, and not to face at least a part of the antenna coil;
A heating and pressurizing step in which the circuit board and the joint provided with the buffer layer are sandwiched between the antenna coil and the exterior and integrated by heating and pressurizing;
A method of manufacturing a non-contact data carrier package, comprising:

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