JP3835710B2 - Method for manufacturing composite semiconductor device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a compound semiconductor device having a positioning structure of the external lead terminals are led to the outside of the insulating case.
[0002]
[Prior art]
The structure of this type of composite semiconductor device will be described with reference to FIGS.
First, in FIG. 6, an insulating substrate 2 made of ceramic or the like having a conductor layer formed on both sides is soldered onto a heat sink 1 made of copper or the like. On the insulating substrate 2, circuit components such as the semiconductor pellet 3 and the external lead-out terminal 4 are fixed by soldering. When these circuit components are fixed by soldering, a positioning jig (not shown) is used.
[0003]
Next, as shown in FIG. 7, an adhesive 5 is applied to the outer peripheral portion of the heat radiating plate 1.
Next, as shown in FIG. 8, an insulating case 6 having both end openings is prepared, and the lower end surface of the insulating case 6 is brought into contact with and adhered to the outer peripheral portion of the heat radiating plate 1 coated with the adhesive 5.
Next, after filling the insulating case 6 with the resin 7 and curing, the cover 8 is put on one opening end of the insulating case 6 to complete the target composite semiconductor device 9.
[0004]
[Problems to be solved by the invention]
Since the conventional composite semiconductor device is generally configured as described above, there are the following problems to be solved. Since the adhesive 5 is applied to the upper surface of the outer peripheral portion of the heat radiating plate 1 and the insulating case 6 is adhered, a locking portion for the external lead-out terminal 4 is provided on the insulation case 6 and a positioning jig for the external lead-out terminal 4 is provided. It cannot be used for soldering. That is, since the adhesive 5 generally cannot withstand the soldering temperature, the soldering process of each circuit component to the heat sink 1 and the bonding process of the insulating case 6 to the heat sink 1 need to be performed as separate processes. was there. For this reason, the number of work steps cannot be reduced, and the manufacturing cost of the composite semiconductor device cannot be sufficiently reduced.
[0005]
OBJECT OF THE INVENTION
The present invention has been made to solve the above-described problems, and when soldering the external lead-out terminal, the insulating case can also be used as a positioning jig for the external lead-out terminal. An object of the present invention is to provide a method of manufacturing a composite semiconductor device that can contribute to a reduction in manufacturing cost.
[0006]
[Means for Solving the Problems]
According to the invention described in claim 1, the step of solder fixing the insulating substrate on which the conductor layer is formed on the heat sink;
A step of solder-fixing a semiconductor pellet on the conductor layer;
Soldering an external lead-out terminal on the conductor layer;
In a method for manufacturing a composite semiconductor device, including a step of fixing a lower end portion of an insulating case having both ends opened and an outer peripheral portion of the heat sink with an adhesive,
The external lead terminal is temporarily fixed to the insulating case by a locking portion formed on the external lead terminal, and then
Placing the insulating case on the heat sink;
Soldering the conductor layer and the lower end of the external lead-out terminal, then,
The insulating case and the heat radiating plate are fixed by filling the adhesive reservoir groove with an adhesive defined by the inner peripheral surface of the lower end portion of the insulating case and the side surface of the outer peripheral portion of the heat radiating plate. A method of manufacturing a composite semiconductor device is provided.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to FIGS.
FIG. 1 is a plan view of the insulating case, and FIG. 2 is a front view thereof.
One feature of the composite semiconductor device of the present invention is that a locking portion for temporarily fixing the external lead-out terminal 4 is provided on the insulating case 16 itself. This locking portion is realized in the external lead-out terminal insertion hole 17 in this embodiment.
[0008]
That is, as shown in FIG. 3, a part of the external lead-out terminal insertion hole 17 is a wide square hole 17a having a relatively wide opening, and is formed at a communication portion with the small-diameter square hole 17b. part 18 an engagement portion 4a of the externally drawn terminals 4 that engaged in are also available is temporarily fixed external leadout terminals 4. As an actual locking procedure, the external lead-out terminal 4 is inserted from the lower square hole 17b side in FIG. 3, and further inserted against the spring force that tends to spread outward at the position of the locking portion 4a. By doing so, the locking portion 4a expands in the wide square hole 17a when it passes through the square hole 17b, and is regulated by the step portion 18 and the inner wall of the square hole 17a to be temporarily fixed.
[0009]
The lower end of the external lead-out terminal 4 must be positioned at a predetermined position on the insulating substrate 2. As shown in FIG. 2, positioning pins 19 projecting downward from the upper portion of the insulating case 16 are provided as positioning means. Is provided. The positioning pin 19 is configured to be positioned by inserting the tip 19a into a small hole provided on the surface of the heat radiating plate (not shown in FIG. 2).
[0010]
Next, the second feature of the present invention is that an inclined groove 20 is provided along the outer periphery of one opening of the insulating case 16 as shown in FIG. By providing the inclined groove portion 20, the heat radiation plate 1 and the insulating case 16 can be fixed by applying an adhesive to the inclined groove portion 20, as will be clarified in the following description of the manufacturing method.
[0011]
A method for manufacturing the following to the above configured composite semiconductor device as. In FIG. 4, when the external lead-out terminal 4 is soldered to a predetermined position of the heat sink 1, the external lead-out terminal 4 is inserted into the external lead-out terminal insertion hole 17 of the insulating case 16 and temporarily fixed by the locking portion 4a.
[0012]
Next, the entire insulating case 16 with the external lead terminal 4 temporarily fixed is placed on the heat sink 1. At this time, the positioning is performed by inserting the tip 19a of the positioning pin 19 (see FIG. 2) provided on the insulating case 16 into the small hole (not shown) of the heat radiating plate 1 as described above. By heating in the above state, the solder previously applied to the lower end of the external lead-out terminal 4 is melted and fixed with solder.
[0013]
Next, as shown in FIG. 5, the entire insulating case 16 is inverted, and the adhesive 5 is filled and cured in the inclined groove portion 20 of the insulating case 16 by the adhesive application nozzle 21 or the like. Subsequent processes complete the target composite semiconductor device through conventional processes.
[0014]
【The invention's effect】
As described above, since the adhesive for fixing the insulating case and the heat radiating plate can be applied from the back side of the heat radiating plate as described above, the adhesive can be bonded even after the insulating case and the heat radiating plate are fitted. Work becomes possible. Therefore, be allowed to heat the insulating case to solder melt temperature, can you to alternate the insulating case itself as a temporary fixing to the positioning jig external leadout terminals. As a result of the above, the insulating case can be fixed to the heat sink by the adhesive application process by an automatic machine without the manual application of the adhesive and the insulating case. The manufacturing cost of this type of composite semiconductor device can be reduced.
[Brief description of the drawings]
FIG. 1 is a plan view of an insulating case used in a composite semiconductor device of the present invention.
FIG. 2 is a front view of the insulating case.
FIG. 3 is an enlarged cross-sectional view of an external lead-out terminal insertion hole provided in the insulating case.
FIG. 4 is a cross-sectional view in which a part of a state in which an external lead terminal is temporarily fixed using the insulating case is cut out.
FIG. 5 is a cross-sectional view for explaining an adhesive application step in the present invention.
FIG. 6 is an explanatory diagram showing a manufacturing process of a conventional composite semiconductor device, in a state where circuit components are fixed to a heat sink.
FIG. 7 is an explanatory view showing a state in which an adhesive is applied to the outer peripheral portion of the heat radiating plate in order to adhere the insulating case to the heat radiating plate, similarly showing a conventional manufacturing process.
FIG. 8 is a cross-sectional view of a composite semiconductor device that shows a conventional manufacturing process and is completed through a predetermined processing process by bonding an insulating case to a heat sink.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Heat sink 2 Insulating substrate 3 Semiconductor pellet 4 External lead-out terminal 4a Locking part 5 Adhesive 8 Cover body 16 Insulating case 17 External lead-out terminal insertion hole 17a Square hole 17b Square hole 18 Step part 19 Positioning pin 20 Inclined groove part 21 Adhesive Application nozzle

Claims (1)

A step of solder fixing the insulating substrate on which the conductor layer is formed on the heat sink;
A step of solder-fixing a semiconductor pellet on the conductor layer;
Soldering an external lead-out terminal on the conductor layer;
In the method of manufacturing a composite semiconductor device, including a step of fixing the lower end portion of the insulating case having both ends opened and the outer peripheral portion of the heat sink with an adhesive,
The external lead terminal is temporarily fixed to the insulating case by a locking portion formed on the external lead terminal, and then
Placing the insulating case on the heat sink;
Soldering the conductor layer and the lower end of the external lead-out terminal, then,
The insulating case and the heat radiating plate are fixed by filling the adhesive reservoir groove with an adhesive defined by the inner peripheral surface of the lower end portion of the insulating case and the side surface of the outer peripheral portion of the heat radiating plate. A method of manufacturing a composite semiconductor device.

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