JP3772176B2 - Electronics - Google Patents

Description

  The present invention relates to an electronic device, and more particularly, to an arrangement of units accommodated in the electronic device.

Conventional electronic devices employ various structures in consideration of the characteristics and assemblability of the device with respect to the arrangement of the substrate on which the control circuit member is mounted.
For example, in an electronic apparatus with a built-in imaging optical system having a circuit board assembly shown in the perspective view of FIG. 15, a small circuit board 53 is provided in front of a large board 52 on which an optical system 50 with a photographing lens 51 is mounted. A large circuit board 54 is provided. The large circuit board 54 was provided with an opening 54 a for forming a photographing optical path at a portion facing the photographing lens 51.

  Further, in the conventional electronic apparatus having the circuit board assembly shown in the perspective view of FIG. 16, the daughter boards 71 to 74 of a plurality of circuit boards are orthogonal to the mother board 70 as a common circuit board. Arranged in the direction. The circuit boards are fastened and fixed to the main chassis 75 with screws.

  In the conventional electronic device shown in the exploded perspective view of FIG. 17, a casing serving as an exterior body is divided into, for example, casings 60, 61, and 62, and each casing is an operation member or the like. The shutter button 63 and the switch part, the battery case 64 and its terminal part, the operation switch button 65 and the switch part, etc. are attached. The terminal part and the switch part are connected to the main circuit board 66 through independent connectors.

  Further, in the conventional electronic apparatus including an image pickup circuit for image pickup signal processing, the image pickup circuit is vulnerable to noise, so that a noise source such as a DC / DC converter (hereinafter referred to as a DD converter) is sufficient. It was necessary to separate them by a certain distance or add a separate shield plate. The substrate for the imaging circuit is not necessarily disposed around the optical system where the imaging element is disposed.

  Further, in a conventional electronic device that can be connected to another accessory device such as a printer or its adapter, the docking unit as the connecting means is attached to the apparatus main body via an exterior body.

  In the above-described conventional electronic device shown in FIG. 16, for example, the mother board 70 is held at two positions of the screw holes b 1 of the main chassis 75, and the daughter boards 71 to 74 are connected to the screws of the main chassis 75. The holes a1 and a2 are held at eight locations, and the screws are attached at a total of 10 locations, and the assembly is complicated.

  Further, in this electronic device, when the mother circuit board 70 is arranged along the wide direction of the equipment, the widths of the daughter boards 71 to 74 are limited and become narrower.

  In the conventional electronic apparatus shown in FIG. 17, an electric member is individually attached to each casing, and a connector for connection is provided on each circuit board to be connected to the electric member. It is necessary and difficult to assemble. Further, when performing a function check of the apparatus, the plurality of circuit boards 66 are required. Further, an extra harness length for the connector is required.

  Further, in the case of the electronic apparatus having the above-described conventional imaging circuit board, a separate shield plate is required for noise countermeasures of the imaging circuit board, which is disadvantageous in terms of cost. Furthermore, since the image pickup circuit board and the image pickup element are separated from each other, it is disadvantageous for downsizing.

  In the conventional electronic device that can be combined with the accessory device described above, since the docking unit as the connecting means is attached via the housing, the housing is used for the inspection in the connection state with the accessory device. It was necessary to carry out in the state, and inconvenience occurred in the inspection in the assembly process.

  Further, since the docking unit as the coupling means is mounted on the housing, in order to maintain the holding strength of the unit, it is necessary to increase the thickness of the exterior body to increase its strength, which increases the size. It was inevitable.

  The present invention has been made to solve the above-described problems, and provides an electronic device that has good mounting efficiency, can be reduced in size, and has good assemblability in consideration of the function of the device. The purpose is to do.

An electronic apparatus according to the present invention includes an imaging optical system, a plurality of imaging elements for obtaining a video signal corresponding to an image by the imaging optical system, and a plurality of different imaging element substrates on which the imaging elements are mounted. And a plurality of different imaging circuit boards each mounted with a processing circuit for a video signal generated by the imaging device, wherein each imaging circuit board is connected to the imaging optical system. Arranged so that its main surface is in the direction along the side with respect to the optical path of the incident light to the corresponding image sensor, and connected to the corresponding image sensor substrate by a flexible substrate. It is characterized by.

  According to the present invention, in an electronic device, it is possible to provide an electronic device that has good mounting efficiency, can be miniaturized in consideration of the function of the device, and is easy to assemble.

Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a perspective view of an electronic camera as an electronic apparatus according to an embodiment of the present invention as seen from the subject side. 2 is a perspective view seen from the B direction (photographer side) in FIG. 1, FIG. 3 is a perspective view seen from the C direction (bottom side) in FIG. 1, and FIG. 4 is an electronic view of FIG. It is the perspective view which looked at the camera from D direction (grip side).

As shown in FIGS. 1 to 4, the casing that is the exterior body of the electronic camera of this embodiment is divided into a casing 5, a casing 6, and a casing 7. The casing 5 forms a grip portion, and a shutter button 18 is provided on the subject side and an operation switch button 8 is provided on the photographer side.
The casing 6 is a casing on the photographer side, and is provided with a finder window 9b and a warning display window 9. The casing 7 is a casing on the subject side, and is provided with a photographing window 7a and a finder window 7b.

As shown in FIG. 3, a docking unit 30 is provided on the bottom surface of the electronic camera. The docking unit 30 is a coupling means that can be coupled to another accessory device, for example, the coupling portion of the printer adapter 32 illustrated in the perspective view of FIG. 13. Has been. The docking unit 30 is a unit in which a projection 30a of a structural member for obtaining a mechanical coupling with the projection 32a of the printer 32 and a connector portion 30e for obtaining an electrical coupling are integrated.
Note that a battery case 5 a is disposed inside the side of the housing 5.

FIG. 5 is a perspective view showing the arrangement of the constituent units housed in the electronic camera of this embodiment. In addition, this figure is the perspective view seen from the same direction as the said FIG.
The configuration unit includes a main circuit unit 113 configured by an electric circuit board or the like, an optical system unit 111 configured by a photographing lens, an image sensor, and the like, a finder unit 112, and a docking unit 30.

  FIG. 6 is a perspective view showing the shape of the chassis main body 101 which is a structural member that houses the main circuit unit 113. The chassis main body 101 has a structure in which the main chassis 1, the sub chassis A2, and the sub chassis B3 are integrated by screw fastening. The main chassis 1 is provided with holes 1a and 1b for mounting the board and screw holes 1c to 1g.

  FIG. 7 is a perspective view showing an assembled state of a circuit board to be mounted on the chassis main body 101. The assembly board includes a mother board 10 as a common board that is provided in common to perform transmission / reception of signals or power related to a plurality of circuit boards, and a plurality of boards for mounting a video signal processing circuit related to an imaging optical system. Circuit boards having a relatively high degree of extension toward their own periphery and daughter boards 14 and 15 having a relatively low degree of extension toward their own periphery. Is done. Note that a DC / DC converter (DD converter) is mounted on the daughter board 14.

  The daughter boards 11 to 15 are coupled via connectors in a state where each of the daughter boards 11 to 15 is orthogonal to the mother board 10. The mother board 10 is provided with mounting bosses 10a and 10b. The daughter board 11 has a mounting hole 11a, the daughter board 12 has a mounting hole 12a, the daughter board 13 has a mounting hole 13a, and the daughter board 15 has. Are provided with mounting holes 15a and 15b, respectively.

  The combined substrate is incorporated in the chassis main body 101. In this case, first, the mother substrate 10 is attached to the main chassis 1 through the bosses 10a and 10b and the holes 1a and 1b, and the daughter substrates 11, 12, and 13 are attached. Is attached to the main chassis 1 through attachment holes 11a, 12a, 13a and screw holes 1e, 1f, 1g, and the daughter board 15 is attached to the main chassis 1 through screw holes 15a, 15b and attachment holes 1c, 1d. .

  In the assembled state, the DD converter 40 is covered with the shielding member portion 1e of the main chassis 1 in order to shield noise generated from the DD converter 40 mounted on the daughter board 14.

  The circuit board is incorporated in the chassis main body 101 and then accommodated in the casings 5, 6, and 7. The arrangement of the circuit board is such that the mother board 1 is parallel to the photographing optical axis O. Thus, the camera body is housed along the side surface E on the joint side of the housings 6 and 7, which is the surface having the narrowest width dimension as the exterior body shape of the camera. Further, the daughter substrates 11, 12, 13 having a relatively large extension degree are positioned relatively far from the subject in the direction of the photographing optical axis O with respect to the daughter substrates 14, 15 having a relatively small extension degree. Shall be installed.

  In the case of the camera of this embodiment, the number of mounting screws on the substrate is 7 as described above, which is smaller than the number of mounting screws 10 in the case of the conventional example, and the screw tightening operation is facilitated.

In addition, by adopting the arrangement posture of the substrate with respect to the camera casing as described above, it is possible to increase the size in the width direction of each daughter substrate, and an efficient substrate layout as a whole apparatus is possible.
Further, the daughter substrates 14 and 15 having a relatively small extension degree are arranged on the subject side, and an optical system unit 111 (to be described later) is provided on the upper portion of the daughter substrate as shown in the arrangement diagram of the constituent units in FIG. Since it is provided, it is not necessary to provide an opening for the optical path of the photographing optical system in the daughter board as in the conventional electronic device, and the mounting efficiency of the board can be increased.

FIG. 8 is a detailed layout of the optical system unit 111 shown in FIG.
In the optical system unit 111, the photographing light 27 entering along the optical axis O is reflected by the mirror 29, passes through the shutter unit 30 and the lens unit 28 constituting the photographing optical system, and is an image sensor. An image is formed on the image plane of the CCDA 20. Further, a part of the photographing light is further reflected to form an image on the imaging surface of the CCDB 22 which is an image pickup device.

  The CCDA 20 is mounted on the CCDA substrate 21, and the CCDB 22 is mounted on the CCDB substrate 23. An image pickup circuit board A24 and an image pickup circuit board B25 are arranged above the CCD substrates 21 and 23 and along the upper side of the lens unit 28. The CCDA and B substrates 21 and 23 and the imaging circuit substrates 24 and 25 are connected via flexible substrates 21a and 23a.

  With this arrangement, the CCDA, B 20, 22 and the imaging circuit boards 24, 25 are arranged very close to each other, and the length of the connecting flexible boards 21a, 23a can be shortened. Can be less affected by Further, the optical system unit 111 can be configured in a compact manner.

When the optical system unit 111 in FIG. 8 is assembled on the chassis main body 101 in FIG. 6, the shielding member portion 1 e of the main chassis 1 is positioned below the optical system unit 111, and the daughter board 14. Noise from the DD converter 40 disposed above is shielded and does not affect the imaging circuit.
Therefore, in the camera of this embodiment, it is not necessary to separately provide a noise shielding shield box or the like, which is advantageous in terms of space.

FIG. 9 is an exploded perspective view showing a mounting state of each operation circuit board and connector mounted on the housing 5 of the electronic camera of the present embodiment and a daughter board as a connection destination thereof.
As described above, the shutter 5, the operation switch button 8, and the battery case 5 a are disposed on the casing 5 serving as the grip portion. Further, in correspondence with the shutter button 18 and the operation switch button 8, respectively. A shutter substrate 16 and an operation switch substrate 17 are provided. The operation switch board 17 corresponds to a warning display window 9 provided in the housing 6 in addition to the operation switch 17a corresponding to the operation switch button 8, as shown in the perspective views of FIGS. A display element 17b is also mounted.

  Board connection connectors 16d and 17e are attached to the shutter board 16 and the operation switch board 17 via lead wires, respectively. A connector 5d is also attached to the terminal of the battery case via a lead wire. Each of the connectors can be connected to a corresponding connector 11d, 11e, 14d on the daughter boards 11, 14, respectively.

As described above, in the electronic camera according to the present embodiment, when the switches and the like are collectively arranged on the single housing 5 and the function check of the switches and the like is performed during assembly, the above-described conventional example shows. Thus, there is no need to assemble a plurality of cases, and the check operation can be easily performed. In addition, the function can be easily checked because the function can be checked when the connected daughter board is open.
Further, since the display element 17a is also mounted on the operation switch board 17, the number of boards and the number of connectors can be reduced.
In addition, since the shutter operation button 18 and the operation switch button 8 are collectively arranged in the casing 5 serving as a grip portion, the operation buttons are easy to operate.

FIG. 12 is a perspective view showing the docking unit attached to the main chassis in the electronic camera of this embodiment.
The docking unit 30 is a coupling means for coupling the electronic camera to an accessory device 32, which is an accessory electronic device as shown in FIG. 13, and includes four members as constituent members for obtaining mechanical coupling. It has a joint part 30a and a connector part 30e for obtaining electrical coupling. The engaging portion 30 a can be engaged with the protruding engaging portion 32 a of the docking unit of the accessory device 32. The connector 30e can also be connected to the connector 32e of the accessory device 32.
The docking unit main body 30d is attached to the main chassis 1 through four screw holes 30b, and further has a tripod screw hole 30f. The docking unit 30 is attached before the housing is attached.

  A perspective view of FIG. 14 shows a state in which an accessory device 32, for example, a printer adapter, is attached to the electronic camera body 31 of this embodiment via the docking unit 30. In this state, for example, a photographed image can be printed by connecting to a printer via the output connector 32f of the accessory device.

  In the docking unit 30 of the electronic camera of the present embodiment, since the docking unit is not attached via the housing as in the above-described conventional example, the coupling operation with the accessory device 32 is performed before the housing is attached. A function check can be performed. In addition, since the docking unit 30 is directly attached to the chassis, it is not necessary to increase the strength of the casing more than necessary.

  In addition, the present embodiment also has the following effects.

Since the common substrate is disposed along the minimum width surface of the housing, it is possible to increase the area of the plurality of circuit boards.
・ Easy attachment to circuit board structural members.

-Noise can be easily shielded by the DC / DC converter and can be performed without providing a separate member.

-The periphery of the imaging optical system is configured compactly, and the imaging circuit is less susceptible to noise.

-Connection with other electronic devices can be performed without an exterior body, and the connection means itself is improved in strength.

-Since the operation unit and the parts that respond to the operation unit are also arranged on the same substrate, it is effective in reducing the number of substrates and the number of assembly steps.

-Since the operation unit and the parts that respond to the operation unit are mounted on the same exterior body, it is easy to check at the time of assembly, and it is possible to eliminate the complications due to mixing of mechanical parts and electrical parts.

The perspective view which looked at the electronic camera as electronic equipment of one example of the present invention from the subject side. The perspective view which looked at the electronic camera of the said FIG. 1 from the B direction of FIG. The perspective view which looked at the electronic camera of the above-mentioned FIG. 1 from the C direction of FIG. The perspective view which looked at the electronic camera of the said FIG. 1 from the D direction of FIG. The perspective view which shows arrangement | positioning of the structural unit of the electronic camera of the said FIG. The perspective view of the chassis main body of the electronic camera of the said FIG. The perspective view which shows the circuit board assembly state of the electronic camera of the said FIG. The perspective view of the optical system unit of the electronic camera of the said FIG. 2 is an exploded perspective view of a housing and a circuit board on which operation switch members and the like of the electronic camera of FIG. 1 are mounted. FIG. The perspective view of the board | substrate part of the operation switch member of the said FIG. The perspective view of the state which incorporated the operation switch member of the said FIG. 10 in the housing | casing. The perspective view of the docking unit mounting state to the chassis of the electronic camera of FIG. FIG. 3 is a perspective view of the electronic camera of FIG. 1 or an accessory device to which a conventional electronic device can be coupled. FIG. 14 is a perspective view showing a coupling state of the electronic camera of FIG. 1 and the accessory device of FIG. 13. The perspective view which shows arrangement | positioning of the circuit board in the electronic device of a prior art example. The perspective view which shows the attachment state to the chassis of the circuit board in the electronic device of a prior art example. The disassembled perspective view of the housing | casing with which the operation member in the electronic device of a prior art example was attached, and a circuit board.

Explanation of symbols

1 ……… Main chassis (structure member)
10: Mother board (common board)
11, 12, 13
.... of relatively large shape or size
Daughter board (multiple circuit boards)
14, 15
.... of relatively small shape or size
Daughter board (multiple circuit boards)
17a: Operation switch button (operation unit)
17b …… Display element (parts that respond to operation)
18 ... Shutter button (operation unit)
20 ... CCDA (Image sensor)
21 ..... CCDA substrate (image sensor substrate)
21a …… Flexible substrate 22 ……… CCDB (Imaging device)
23 ... CCDB substrate (image sensor substrate)
23a …… Flexible substrate 24 ……… Imaging circuit board A
25 ... Imaging circuit board B
28 ……… Lens unit
(Imaging optical system)
29 ......... Mirror (imaging optical system)
33 ......... Shutter unit
(Imaging optical system)
30 ... Docking unit (coupling means)
40 ... DD converter (DC / DC converter)
101 …… Chassis body (structure member)


Attorney Susumu Ito

Claims (1)

Image pickup optical system, a plurality of image pickup elements for obtaining video signals corresponding to images by the image pickup optical system, a plurality of different image pickup element substrates on which the respective image pickup elements are mounted, and generated by the image pickup element A plurality of separate imaging circuit boards each having a video signal processing circuit mounted thereon, and an electronic device comprising:
  Each imaging circuit board is arranged such that its main surface is in a direction along its side with respect to the optical path of incident light to the corresponding imaging element in the imaging optical system, and the corresponding imaging element substrate Is an electronic device characterized by being connected by a flexible substrate.

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