JP3598416B2 - Heat transport device for electronic equipment - Google Patents

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a heat transport device of the electronic device, to a heat transport device, in particular keeping the electronic components in the cooled predetermined temperature.
[0002]
[Prior art]
A conventional electronic device includes an independent metal plate or a part of a housing as described in JP-A-63-250900, JP-A-3-255697, and JP-A-5-29153. A metal plate is interposed between the heat-generating member and the metal housing wall, and the heat generated by the heat-generating member is transported to the metal housing wall, which is a heat radiating portion, by heat conduction and radiated. Further, as described in Japanese Patent Application Laid-Open No. 55-71092, a heat pipe is formed on the wall of a metal housing and the heat generating member is thermally connected to the wall of the metal housing to thereby generate heat generated by the heat generating member. Is dissipated by the metal housing wall.
[0003]
[Problems to be solved by the invention]
In the above conventional example, in the examples of JP-A-63-250900, JP-A-3-255697, and JP-A-5-29153, the heat transfer path from the heat-generating member to the metal casing wall is formed by the casing wall. It has only a thin section of about 1 mm in thickness, so that heat is not efficiently conducted. Therefore, it was not possible to sufficiently cope with an increase in the amount of heat generated. Further, depending on the component arrangement, the conduction distance to the metal housing wall is not always short. For this reason, the arrangement of parts or the structure of the housing has been limited, such as disposing the heating member near the housing. On the other hand, in an electronic device or the like that requires high performance, the arrangement of components including a heat-generating member has a great effect on performance due to a wiring length and the like due to an increase in speed of an electronic circuit. Therefore, in the conventional example, downsizing and high performance of the electronic device have been hindered. Similarly, in the example of Japanese Patent Application Laid-Open No. 55-71092, the heat-generating member must be directly connected to the metal housing wall, and the arrangement of components including the heat-generating member or the housing structure is limited. Therefore, when giving priority to obtaining the optimal component arrangement, it is necessary to take measures such as installing radiation fins individually on the heat-generating members, and the housing has to be enlarged.
[0004]
This onset Ming, heat electronic components is exothermic member is generated in the heating member of an electronic device mounted in a narrow space together with other members, the heat radiating portion or in efficiently transported to the heat generating member to a predetermined temperature It is an object to provide a heat transport device for cooling.
[0005]
[Means for Solving the Problems]
In order to solve the above problems, the heat transport device of the present invention has a thin heat receiving member that has a liquid flow path inside and is attached to an electronic component to be cooled, and the electronic component has a liquid flow path inside. A heat radiating member attached to a wall surface of the housing to be housed; a resin flexible tube connected to the heat receiving member and the liquid flow path of the heat radiating member to form a liquid circulation flow path; and provided in the circulation flow path. And a liquid drive device provided therein, wherein the liquid is sealed in the circulation flow path to be integrally formed. In this case, the liquid flow path of the heat receiving member can be formed to meander along the heat receiving surface of the electronic component that receives heat. Further, in this case, the connecting portion of the heat receiving member to which the flexible tube is connected can be formed on the side of the heat receiving member and can be formed to extend in the extending direction of the internal liquid flow path.
[0006]
According to the above configuration, as a medium for transporting heat of the electronic component, a liquid (for example, water) having a higher specific heat than a metal or the like and capable of transporting heat by flowing is used. The heat transport efficiency can be greatly improved as compared with the heat conduction member. In addition, since a resin-made flexible tube, which can be freely routed and has insulation and heat insulation properties, is used for a flow path for circulating the liquid between the heat-receiving member and the heat-dissipating member, it is disposed in contact with other components. Even if it is installed, the thermal effect on other parts can be suppressed, and it can be arranged between narrow parts without being affected by electrical insulation or arrangement of parts.
[0007]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, some embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows a first embodiment of the present invention. The electronic device includes a wiring board 2 on which a plurality of semiconductor elements are mounted, a keyboard 4, a disk device 6, a display device 8, and the like, and is housed in a metal housing 10. Among the semiconductor elements mounted on the wiring board 2, the semiconductor element 12 that generates a particularly large amount of heat is cooled by a heat transport device including a heat receiving header 14, a heat radiation header 16, a flexible tube 18, and the like. As shown in the figure, the semiconductor element 12 and the heat receiving header 14 are brought into contact with each other with a thermal compound or a high thermal conductive silicon rubber interposed therebetween, and the heat generated in the semiconductor element 12 is efficiently transmitted to the heat receiving header 14. Further, the heat receiving header 14 connected to the semiconductor element 12 is connected by a flexible tube 18 to a heat radiating header 16 installed on a housing wall on the back of the display device 8. The heat radiating header 16 is thermally and physically attached to the metal housing wall via a thermal compound, a high thermal conductive silicon rubber, or directly by means of a screw 20 or the like.
[0008]
A flow path is formed inside the heat receiving header 14 and the heat radiation header 16, and a liquid is sealed therein. Further, a liquid driving device is incorporated in the heat radiation header 16, and the liquid is driven between the heat receiving header 14 and the heat radiation header 16. The liquid is driven by reciprocation or circulation between the two. Since the heat-receiving header 14 and the heat-radiating header 16 are connected by a flexible tube, even when a large number of components are mounted in a very narrow housing, the heat-generating semiconductor element and the heat-generating semiconductor element can be connected independently of each other. The heat can be easily connected to the housing wall, which is the heat radiating portion, and the heat is transported by driving the liquid. Therefore, the heat generated in the high heat generating semiconductor element is effectively transported to the heat radiating header. In the heat radiating section, the heat radiating header and the metal housing wall are thermally connected, so the heat is widely diffused to the housing wall due to the high thermal conductivity of the metal housing, and high heat radiation performance is obtained. Can be Therefore, the semiconductor element can be efficiently cooled.
[0009]
FIG. 2 shows details of the heat transport device used in FIG. Fins are provided inside the heat receiving header 14 and the heat radiation header 16 to form a liquid flow path and efficiently transmit heat to the liquid inside from the header wall. Further, the heat dissipation header 16 has a liquid drive mechanism built therein. The heat receiving header 14 can be set to any size in accordance with the size of the heat generating member (also referred to as the heat generating member 1) such as the semiconductor element 12, and is thermally connected to the heat generating member 1 by means such as contact. Further, a structure in which a metal pipe is welded to a metal plate (copper, aluminum, or the like) may be used. On the other hand, as the liquid drive mechanism inside the heat radiation header, as an example, a mechanism in which a part of the flow path is used as the cylinder 22 and the piston 24 is reciprocated by the motor 26 and the link mechanism 28 is shown. The heat radiating header 16 is attached to the wall of the metal casing 10, but a boss 30 for screwing to the casing wall may be formed integrally with the casing wall at the time of die casting. The flexible tube 18 connecting the heat receiving header 14 and the heat radiating header 16 is made of resin and has an inner diameter of about 2 mm. Therefore, both the heat receiving header 14 and the heat radiating header 16 can be made thin, and even a high heat generating semiconductor element mounted in a small space can be effectively cooled.
[0010]
FIG. 3 shows a second embodiment of the present invention. In the present embodiment, the fins 32a and 32b are integrally formed on the inside of the display-side housing of the metal housing 10 to which the heat radiation header 16 is attached. The height of the fins 32a is substantially equal to the thickness of the heat radiation header 16 so as not to hinder the mounting of the display. By providing the fins at right angles to each other, the housing can have high rigidity. However, when the device is used, the height of the horizontal fins 32b is lower than that of the vertical fins 32a so as not to hinder the flow of the rising air due to natural convection. Further, an air hole 34 is provided in the housing to promote natural convection heat radiation.
[0011]
FIG. 4 shows a third embodiment of the present invention. In the present embodiment, the flow path 36 of the heat dissipation header constituting the heat transport device is directly formed on the wall surface of the metal housing 10 by integral molding by die casting when the metal housing is molded. The flow path 36 of the heat radiation header is hermetically sealed by a lid 38 connected to the flexible tube 18, and is separately provided between the heat receiving header 14 attached to the heat generating semiconductor element and the flow path 36 of the heat radiation header via the flexible tube 18. The liquid is driven by the liquid driving device 40 to be driven. For the driving of the liquid, liquid circulation by a small pump or a liquid driving mechanism shown as an example in FIG. 2 is used. According to this embodiment, there is no contact thermal resistance between the heat dissipation header and the metal housing wall surface as the heat dissipation surface, so that effective heat dissipation can be performed, and the flow path of the heat dissipation header is integrally molded by die casting when molding the metal housing. , It is possible to form a complicated flow path structure.
[0012]
FIG. 5 shows a fourth embodiment of the present invention. In the present embodiment, the heat radiating portion constituting the heat transport device is a metal pipe 42 and is directly attached to the metal housing 10. The metal pipe 42 is connected to the flexible tube 18 by connectors 44a and 44b, and is connected between the heat receiving header attached to the heat-generating semiconductor element and the metal pipe 42 by a liquid driving device separately provided via the flexible tube 18. Is driven. The metal pipe has an inner diameter (about 2 mm) similar to that of the flexible tube. On the other hand, a U-shaped groove portion 46 is provided on the housing wall by integral molding, and by fitting a metal pipe into the U-shaped groove portion 46, particularly without using a means such as welding. Can also be efficiently thermally connected. According to the present embodiment, even when the heat radiating portion and the metal casing are in linear contact with the metal pipe, heat is widely diffused to the casing wall due to the high thermal conductivity of the metal casing. In addition, it is possible to install a metal pipe constituting a liquid flow path on the entire surface of the housing wall with a simple structure, so that a large area of the housing wall can be effectively used as a heat radiation surface. Therefore, high heat dissipation performance can be obtained.
[0013]
FIG. 6 shows a fifth embodiment of the present invention. The electronic device includes a wiring board 2 on which a plurality of semiconductor elements are mounted, a keyboard 4, a disk device 6, a display device 8, and the like, and is housed in a metal housing 10. Among the semiconductor elements mounted on the wiring board 2, the semiconductor element 12 that generates a particularly large amount of heat is cooled by a heat transport device including a heat receiving header 14, a heat radiation header 16, a flexible tube 18, and the like. The semiconductor element 12 and the heat receiving header 14 are brought into contact with each other with a thermal compound or high thermal conductive silicon rubber interposed therebetween, and the heat generated in the semiconductor element 12 is efficiently transmitted to the heat receiving header 14. Further, the heat receiving header 14 connected to the semiconductor element 12 is connected by a flexible tube 18 to a heat radiation header 16 installed on a housing wall of the main body on which a wiring board and the like are mounted. The heat radiating header 16 is thermally and physically attached to the metal housing wall via a thermal compound, a high heat conductive silicon rubber, or directly by means of screws or the like. A flow path is formed inside the heat receiving header 14 and the heat radiation header 16, and a liquid is sealed therein. The details of the heat transport device are the same as those shown in FIG. However, in the heat dissipation header shown in FIG. 2, the liquid drive mechanism regulates the thickness of the entire heat dissipation header. Therefore, in a device in which only a very narrow mounting space can be obtained, the liquid drive device may be installed separately from the heat radiation header.
[0019]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, the heat | fever generate | occur | produced by the heat generating member of the electronic device by which the electronic component which is a heat generating member was mounted in the narrow space with other members can be efficiently transported to a heat radiating part, and the heat generating member is set to predetermined temperature. It can be cooled efficiently.
[Brief description of the drawings]
FIG. 1 is a perspective view of a first embodiment of the present invention.
FIG. 2 is a detailed perspective view of the embodiment of FIG.
FIG. 3 is a perspective view of a second embodiment of the present invention.
FIG. 4 is a configuration explanatory view of a third embodiment of the present invention.
FIG. 5 is a perspective view of a fourth embodiment of the present invention.
FIG. 6 is a perspective view of a fifth embodiment of the present invention.
[Explanation of symbols]
2 Wiring board 4 Key board 6 Disk device 8 Display device 10 Metal casing 12 Semiconductor element heating member 14 Heat receiving header 16 Heat dissipation header 18 Flexible tube 20 Screw 22 Cylinder 24 Piston 26 Motor 28 Link mechanism 30 Boss 32a, 32b Fin 34 Air hole 36 Flow path 38 Lid 40 Liquid drive device 42 Metal pipes 44a, 44b Connector 46 U-shaped groove

Claims (3)

A thin heat-receiving member that has a liquid flow path inside and is attached to an electronic component to be cooled; A resin-made flexible tube connected to the heat receiving member and the liquid flow path of the heat radiation member to form a liquid circulation flow path; and a liquid drive device provided in the circulation flow path, wherein the circulation flow path A heat transport device for electronic equipment, wherein the heat transfer device is integrally formed by sealing the liquid. The heat transport device according to claim 1, wherein the liquid flow path of the heat receiving member is formed to meander along a heat receiving surface of the electronic component that receives heat. The connecting portion of the heat receiving member to which the flexible tube is connected is formed on a side of the heat receiving member and extends in a direction in which an internal liquid flow path extends. A heat transport device for an electronic device according to the above.

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