JP3507035B2 - Jig for cleaning substrates for semiconductor integrated circuits - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for holding a substrate when cleaning the substrate on which a semiconductor integrated circuit is mounted.

[0002]

9 to 11 show an example of a ball grid array type semiconductor device. In this semiconductor device, a semiconductor integrated circuit 42 mounted on an upper surface of a substrate 41 is molded with a resin 43. A plurality of terminals 4 for connecting the semiconductor device to an electronic circuit on the lower surface of the substrate.
4, the substrate 41 is formed with a complicated conductive path for electrically connecting the semiconductor integrated circuit 42 and the terminal 44 by printing or the like.

The board 41 is manufactured by a board maker, but the boards are not manufactured individually one by one, but are manufactured in a state in which a large number of boards are connected to one original plate.
In the past, the substrate was supplied to the semiconductor device manufacturer who is the user of the substrate in the state of the original plate, and the original device was cut by this semiconductor device maker. However, with the high integration of the semiconductor integrated circuit 42, the original plate is extremely cut. High precision is required, and at present, a substrate maker is required to deliver a substrate obtained by accurately cutting an original plate to a semiconductor device maker.

Further, in the board maker, a cleaning agent or pure water is sprayed on the cut board, or the board is washed by putting it in a water tank containing the cleaning agent or pure water, and then cutting the board at the time of cutting. Removing debris and other dirt, then
Substrates are dried and stored in a tray for semiconductor device storage before being delivered to semiconductor device manufacturers. By the way, there are front and back, front and back, left and right direction of the substrate, it is necessary to wash the entire substrate while maintaining the directionality of this substrate, conventionally, the substrate after cutting is placed on a tray for storing semiconductor devices, Another tray is stacked on top of it to sandwich the substrate, and the substrate is washed together with these trays.

However, when the tray for storing the semiconductor device is diverted for cleaning the substrate, pure water for cleaning or a cleaning agent is accumulated in the contact portion between the substrate and the tray or the uneven portion of the tray,
In some cases, the pure water or cleaning agent for cleaning does not come into sufficient contact with the substrate to cause uneven cleaning, or the pure water or cleaning agent is not sufficiently removed in the subsequent drying step.

[0006]

[Object] An object of the present invention is to maintain the orientation of a substrate for a semiconductor integrated circuit in a predetermined direction, and to wash the substrate reliably and sufficiently.
Moreover, it is an object of the present invention to provide a jig for cleaning a substrate for a semiconductor integrated circuit, which can surely dry the substrate after cleaning in a short time and can be easily transferred to a tray for housing a semiconductor device.

[0007]

In order to achieve the above object, a cleaning jig for a semiconductor integrated circuit substrate according to a first aspect of the present invention comprises a plurality of engaging projections projecting upward on the upper surface of an outer peripheral frame. Engagement recesses are formed on the lower surface of the outer peripheral frame below each of the engagement projections, and in the outer peripheral frame, there are a large number of communication windows partitioned by vertical and horizontal bars, and on the upper surface of the peripheral portion of each communication window, The upper end portion is provided with a guide projection of a lower diameter which is formed in a hemispherical shape, and is provided with a supporting rib projecting from the inner peripheral surface of each communicating window to the inside of the communicating window and defining the substrate supporting plane at the upper end. It is as a configuration.

According to a second aspect of the present invention, there is provided a jig for cleaning a substrate for a semiconductor integrated circuit, wherein the upper ends of the supporting ribs are rounded around the protruding direction, and the upper ends are the upper surfaces of the vertical horizontal rail and the outer peripheral frame. It is configured so as to project above.

According to a third aspect of the present invention, there is provided a cleaning jig for a semiconductor integrated circuit substrate, wherein a plurality of engaging projections projecting upward on the upper surface of the outer peripheral frame and an outer peripheral frame below each of the engaging projections. Engagement recesses are formed on the lower surface, and a large number of communication windows partitioned by vertical and horizontal crosspieces are provided in the outer peripheral frame. A lower portion with a hemispherical upper end formed on the upper surface of the peripheral portion of each communication window. Each of the communication windows is provided with a diameter-expanding guide protrusion, protrudes from the inner peripheral surface of each communication window to the inside of the communication window, and is rounded around the protrusion direction at the upper and lower ends. Support ribs projecting vertically from the upper and lower surfaces are provided, and the upper end of the support rib defines the substrate support plane.

According to a fourth aspect of the present invention, there is provided a cleaning jig for a semiconductor integrated circuit substrate, wherein when two cleaning jigs are vertically stacked, the upper end of the guide protrusion of the lower cleaning jig is provided. Defines the support plane of the upper jig that supports the lower surface of the upper cleaning jig.

According to a fifth aspect of the present invention, there is provided a cleaning jig for a substrate for a semiconductor integrated circuit, wherein when two cleaning jigs are vertically stacked, an engaging protrusion of the lower cleaning jig is It is configured such that the upper and lower cleaning jigs are fitted in the engaging recesses, and the horizontal movements of the upper and lower cleaning jigs are restricted by fitting the engaging projections and the engaging recesses.

[0012]

Embodiments of the cleaning jig according to the present invention will be described below in detail with reference to the specific examples shown in the accompanying drawings. The jig 1 of the present invention is used as a set of two jigs. A large number of substrates are placed on one jig, another jig is stacked on the jig, and two jigs are provided on the upper and lower sides. It is configured to be housed between them, and the same jig is used for the upper and lower jigs.

The jig 1 is provided with a large number (40 in FIGS. 1 and 2) of communication windows 5 and 5 which are defined by vertical bars 3 and horizontal bars 4 in an outer peripheral frame 2. Is formed in a similar shape having a size slightly larger than the planar shape of the substrate to be cleaned. Specifically, for example, if the planar shape of the substrate is a 27 mm square, the communication window is a 27.30 mm square. To do.

On the upper surface of the outer peripheral frame 2, engaging projections 6,
6 are provided so as to project at required intervals, and engaging recesses 7, 7 into which the engaging projections are fitted are formed on the lower surface of the outer peripheral frame corresponding to the engaging projections. These engaging projections 6, 6
The engaging recesses 7 and 7 are for restricting the horizontal displacement of the upper and lower jigs when the two jigs are vertically stacked.

Further, on the upper surface of the outer peripheral frame 2, support projections 8, 8 having a lower diameter than the engaging projections 6, 6 and having a shape of a circular cone with a lower diameter having a hemispherical upper end are appropriately formed. These support protrusions abut on the lower surface of the outer peripheral frame of the upper jig when the two jigs are stacked vertically to support the upper jig, It is for defining the interval.

However, on the inner peripheral surfaces of the four sides of each of the communication windows 5 and 5, the vertical ribs 3 and the horizontal rails 4, or the vertical and horizontal rails and the supporting ribs 9 protruding from the outer peripheral frame 2 to the inside of the communication window. , 9 are provided for each side (two in the figure).

These support ribs 9 and 9 are provided to support the substrate 10 above the communication window, and FIG.
As shown in FIG. 5, the upper ends of the supporting ribs project above the vertical and horizontal crosspieces 3 and 4 and the upper surface of the outer peripheral frame 2 to define the substrate supporting plane 11, and the upper ends of the supporting ribs have, for example, a radius of curvature of 0. A radius of about 4 mm is provided around the protruding direction of the support ribs so that the contact area with the lower surface of the substrate 10 is extremely small.

The lower ends of the supporting ribs also have horizontal and vertical crosspieces 3, 4.
And the lower end portion of the supporting rib is also provided with a radius of curvature of about 0.4 mm around the protruding direction of the supporting rib.

The amount of protrusion of these support ribs toward the center of the communication window, that is, in the horizontal direction is the minimum necessary to support the lower surface of the substrate to the extent that the substrate does not fall off the communication window. For example, the 27 mm square substrate described above is used. When the bearing is supported, the protrusion amount is about 0.5 to 1.0 mm, and the upper and lower ends on the tip side in the protrusion direction are rounded.

The vertical bars 3 and the horizontal bars 4 forming the four sides of each of the communication windows 5 and 5, or the vertical and horizontal bars and the upper surfaces of the inner periphery of the outer peripheral frame 2 are each formed with a hemispherical upper end. A plurality of (two in the figure) guide protrusions 12, 12 each having a truncated cone shape whose bottom portion expands in diameter are provided.
Reference numerals 2 and 12 are for guiding the side surface of the substrate when setting the substrate on the supporting ribs 9 and 9 and for restricting the horizontal movement of the substrate 10 placed on the supporting ribs 9 and 9. is there.

Since the guide protrusions 12, 12 are frustoconical in shape and have side surfaces with curved surfaces, the guide protrusions 12, 1 are formed.
The contact area between 2 and the side surface of the substrate is extremely small, so that there is an advantage that the cleaning agent or pure water is unlikely to collect between the guide protrusion and the side surface of the substrate during cleaning.

The guide protrusions 12 and 12 have the same tip height as that of the support protrusions 8 and 8. The guide protrusions 12 and 12, like the support protrusions 8 and 8, stack two jigs vertically. In this case, the upper and lower jigs are supported by contacting the vertical and horizontal crosspieces 3 and 4 of the upper jig or the lower surface of the outer peripheral frame 2 to define the distance between the upper and lower jigs. 8 and the upper ends of the guide protrusions 12, 12 define a support plane 13 for the upper jig.

In the figure, reference numerals 14 and 14 indicate a handle, and letters and symbols such as a maker name and a product name of the jig are described on the upper surface of the handle. These letters and symbols are used for cleaning the substrate. It is preferable to form a convex shape having a low height so that the cleaning agent and pure water do not accumulate during the process.

Further, reference numerals 15 and 15 in the figure denote projections formed on the lower surface of the outer peripheral frame 2, and these projections project slightly below the lower ends of the support ribs 9 (for example, 0.
(About 1 mm), when the jig is placed on a flat surface such as a workbench, the bottom surface of the jig is lifted from the flat surface to prevent the lower ends of the supporting ribs 9 and 9 from contacting the flat surface and cleaning. It is also used to prevent the cleaning agent and pure water from accumulating between the jig and the flat surface later, and it is preferable to form it as flat as possible.

As shown in FIG. 6, the cleaning jig of the present invention having the above-mentioned structure is such that the substrate 10 is placed on the supporting ribs 9 and 9 of the communication window 5 in the jig 1 on the lower side and the lower side. Other jig 1'is placed on the jig of 1 and used.

When the substrate 10 is placed on the lower jig 1,
The substrate is guided by the side surfaces of the guide protrusions 12, 12 around the communication window 5 and set at the center of the communication window, and the supporting ribs 9, 9 are provided.
Is supported on the communication window by the upper end of the. That is, the substrate is supported at a position higher than the vertical and horizontal crosspieces 3, 4 around the communication window or the vertical and horizontal crosspieces and the inner periphery of the outer peripheral frame 2, and a gap is formed between the four sides of the substrate and the communication window. To be done.

After setting the substrate 10 on the lower jig 1,
Place the upper jig 1'onto the lower jig. At this time, the engaging recess 7'formed on the lower surface of the outer peripheral frame 2'of the upper jig 1'is fitted into the engaging projection 6 of the lower jig 1,
As described above, the engaging projection 6 and the engaging recess 7 ′ are for restricting the horizontal displacement of the upper and lower jigs, and are located between the upper end of the engaging projection 6 and the central portion of the engaging recess 7 ′. Do not touch.

That is, the upper jig 1'is the lower jig 1
Are supported by the guide projections 12, 12 and the upper ends of the support projections 8, 8, i.e. on the support plane 13 defined by these guide projections and support projections.

Therefore, the engaging projection 6 of the lower jig 1
A gap is formed between the upper end of the engaging recess 7'of the upper jig 1'and the center of the engaging recess 7'of the upper jig 1 '. It is designed not to collect water.

Also, the supporting ribs 9'of the upper jig 1 ',
The lower end of 9'projects downward from the lower surface of the vertical bar 3'or the horizontal bar 4 ', faces the upper surface of the substrate 10, and restricts the upward movement of the substrate.

That is, the movement of the substrate 10 in the vertical direction is such that the upper ends of the supporting ribs 9 of the lower jig 1 and the upper jig 1 '.
Of the support ribs 9'and 9 ', and the distance between the upper and lower support ribs 9 and 9'is about 1.8 mm if the thickness of the substrate 10 is about 0.8 to 1.5 mm. Is preferred.

Since the lower end of the supporting rib 9'of the upper jig 1'projects below the vertical and horizontal crosspieces 3 ', 4'and the outer peripheral frame 2'of the jig 1', two boards are used. Even if the substrate is supported upside down by the supporting ribs 9'in the state of being housed between the jigs, a gap is formed between the vertical and horizontal crosspieces 3'and 4'and the outer peripheral frame 2'and the substrate. The cleaning agent and pure water do not collect.

As described above, with the substrate 10 accommodated between the upper and lower jigs 1 and 1 ', an appropriate fixing tool such as a clip is provided between the handles 14 and 14' formed on the left and right of the upper and lower jigs. It is sandwiched and immersed in a water tank containing a cleaning agent or pure water, or sprayed with a cleaning agent or pure water for cleaning.

The cleaning agent and pure water are connected to the communication windows 5 of the upper and lower jigs,
The upper and lower surfaces of the substrate 10 are brought into contact with each other through 5 ', and chips and other stains attached to the substrate surface when the substrate is cut are removed by a cleaning agent or pure water.

At this time, the cleaning agent and pure water not only come into contact with the upper and lower surfaces of the substrate, but also flow through the gaps between the four sides of the substrate and the vertical and horizontal bars or the outer peripheral frame, so that the entire surface of the substrate is evenly distributed. To be washed.

The cleaned substrate is placed in a dryer while being housed between the upper and lower jigs 1 and 1'to remove the cleaning agent and pure water adhering to the substrate and the jig. At this time, since the substrate 10 is in contact with the supporting ribs 9 and 9 in a very small area, there is almost no possibility that the cleaning agent or pure water will remain between the supporting ribs and the substrate, and the upper and lower ends of the supporting ribs. Since the parts project vertically above and below the horizontal bars and the outer peripheral frame, a gap is formed between the four sides of the substrate and the vertical and horizontal horizontal bars and the outer peripheral frame. The cleaning agent and pure water are less likely to remain because they easily flow down through the gap, so that reliable drying is performed.

After the substrate is dried, the upper jig 1'is removed and the substrate is transferred to the shipping tray. As a substrate shipping tray, a tray for housing a semiconductor device manufactured using the substrate is generally used, and FIG. 7 shows an example of the substrate mounting surface of the shipping tray 20.

In this shipping tray 20, the outer periphery of the base 21 is surrounded by an edge frame 22, and vertical and horizontal partition frames 23 and 24 projecting in the edge frame 22 form a pocket 25 for accommodating a substrate. There is.

Corner ribs 26, 26 are provided at the intersections of the vertical and horizontal partition frames 23, 24, that is, at the four corners of the pocket, and support ribs formed on the side surfaces of these corner ribs on the center side of the pocket. The substrate 1 by the parts 27,
It supports 4 corners of 0.

When transferring the substrates, as shown in FIG. 8, with the substrate 10 placed on the jig 1, the shipping tray 20 is placed on the jig 1 with its substrate mounting surface facing downward. Put.

At this time, the engaging projections 6 on the upper surface of the jig 1 are inscribed in the inner peripheral surface of the edge frame 22 of the shipping tray 20, so that the jig and the shipping tray are aligned in the horizontal direction, and the jig is fixed. Vertical and horizontal bars 3 and 4 of the tool and a guide projection 12 on the outer peripheral frame 2,
12 is designed to be inserted between the corner ribs 26, 26 of the shipping tray.

That is, the positions of the engagement projections 6 and the guide projections 12 and 12 of the jig 1 are determined according to the shape of the substrate mounting surface of the shipping tray.
Can be provided at any position on the outer peripheral frame 2 of the jig, and the guide protrusions 12, 12 can be freely set in intervals and positions provided on the periphery of the communication windows 5, 5. It can be easily adapted to various shipping trays.

After the shipping tray 20 is set on the jig 1, the jig 1 and the shipping tray 20 are engaged with each other and turned upside down, so that the substrate is placed on the jig supporting ribs 9 and 9 from above the shipping tray. 20 on the support steps 27, 27. At this time, the substrate 10 is guided by the guide protrusions 12, 12 of the jig 1 and the corner ribs 26, 26 of the shipping tray 20 to smoothly transfer the substrate.

The shipping trays on which the substrates are placed can be stacked one above the other in a state that the substrates are accommodated therein. When the shipping trays of about 10 to 15 sheets are stacked, the semiconductor which is a substrate user can be used. Shipped to the equipment manufacturer.

In the figure, reference numeral 28 is a handle of the shipping tray 20, 29 is a peripheral frame fitted to the inner peripheral surface of the edge frame 22 when the shipping trays are stacked, and 30 is a semiconductor device manufacturer. The ribs for restricting the horizontal movement of the semiconductor device when the semiconductor device is housed are shown.

In the embodiment described above, the support protrusions 8,
8 and the guide projections 12 and 12 have the same tip height to define the support plane 13 of the jig 1 ′ to be placed on the upper side by the tips of the support projections and the guide projections.
The height of the tip of each of the guide projections 12 is made higher than the height of the tip of each of the guide projections 12, and the support projections 8 enable the support plane 1 of the upper jig
3 may be specified, or the supporting protrusions 8 and 8 are not provided,
The support plane 13 of the upper jig 1'may be defined only by the tips 12, 12 of the guide protrusions.

[0047]

According to the cleaning jig of the present invention, the lower surface of the substrate is supported by the upper ends of the supporting ribs projecting from the inner peripheral surfaces of the four sides of each communication window to the inside of the communication window, and the communication is performed. Since the lower-diameter expanded guide projections provided upright on the four sides of the window regulate the horizontal movement of the substrate, the substrate is stably supported on the communication window.

When another jig having the same structure is further placed on the jig on which the substrate is placed, the substrate is formed by the upper end of the guide protrusion of the lower jig and the lower end of the guide protrusion of the upper jig. Vertical movement is restricted.

Further, since the substrate is supported by the supporting ribs which project inward from the four sides of the communication window, the entire upper and lower surfaces of the substrate appear in the communication window without being hidden by the horizontal and vertical crosspieces or the outer peripheral frame, and therefore the cleaning is performed. In some cases, the cleaning agent or pure water comes into sufficient contact with the entire substrate through the communication window, and the substrate can be reliably cleaned.

Further, the upper and lower ends of the supporting ribs are provided so as to project from the horizontal and vertical crosspieces and the upper and lower surfaces of the outer periphery, and the upper and lower ends of the supporting ribs are rounded around the projecting direction. A gap is formed between the side surface and the four sides of the communication window, and the contact area between the supporting rib and the substrate is extremely small. Therefore, cleaning is performed between the four sides of the substrate and the communication window and between the substrate and the supporting rib. The cleaning agent and pure water can be more reliably flowed to clean the substrate, and the cleaning agent and pure water are less likely to accumulate, so that the substrate can be dried reliably after cleaning in a short time.

The engaging projections on the upper surface of the jig may be provided anywhere on the outer peripheral frame other than the periphery of the communication window.
Also, the guide protrusions can be freely arranged in the vicinity of the communication window, and the arrangement position and interval can be set freely. Therefore, the board mounting surface of the shipping tray and the jig can be fitted according to the shape of the existing board shipping tray. The structure can be easily adapted, and the substrates can be easily transferred from the jig to the shipping tray.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of a cleaning jig according to the present invention.

FIG. 2 is a bottom view showing an embodiment of a cleaning jig according to the present invention.

FIG. 3 is a partially enlarged plan view showing an embodiment of a cleaning jig according to the present invention.

FIG. 4 is a partially enlarged bottom view showing an embodiment of the cleaning jig according to the present invention.

5 is a vertical cross-sectional view taken along line VV of FIG.

FIG. 6 is an enlarged vertical sectional view showing a usage state of the cleaning jig according to the present invention.

FIG. 7 is an enlarged plan view of the substrate mounting surface of the shipping tray on which the substrate after cleaning is placed.

FIG. 8 is an enlarged vertical sectional view showing an engagement state between the cleaning jig and the shipping tray when the cleaned substrate is transferred from the cleaning jig of the present invention to the shipping tray.

FIG. 9 is a plan view showing an example of a semiconductor device with a part thereof cut away.

FIG. 10 is a front view showing an example of a semiconductor device.

FIG. 11 is a bottom view showing an example of a semiconductor device.

[Explanation of symbols]

1, 1'jig 2 outer peripheral frame 3 Vertical bars 4 Horizontal bars 5 Communication window 6 Engagement protrusion 7 Engagement recess 8 Support protrusion 9 Support rib 10 Substrate 11 substrate support plane 12 guide protrusion 13 Supporting surface of upper jig 14 Handle 15 protrusions 20 Shipping tray 21 Base 22 Edge frame 23 Vertical partition frame 24 Horizontal Partition Frame 25 Pockets 26 corner rib 27 support step 28 Handle 29 Perimeter frame 30 ribs

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Seiji Higashi 2-25-1, Nishi-nippori, Arakawa-ku, Tokyo Inside Shinon Electric Industry Co., Ltd. (72) Kohei Tadokoro 2-25-1, Nishi-nippori, Arakawa-ku, Tokyo Inside Shinon Electric Industry Co., Ltd. (56) Reference JP-A-7-112785 (JP, A) JP-A-7-277388 (JP, A) JP-A-11-10103 (JP, A) (58) Field (Int.Cl. ⁷ , DB name) H01L 23/12 B65D 85/86 H05K 3/26 H01L 21/52

Claims (5)

(57) [Claims] 1. A plurality of engaging projections projecting upward on the upper surface of an outer peripheral frame, and engaging recesses on the lower surface of the outer peripheral frame below these engaging projections, respectively. It has a large number of communication windows divided by crosspieces,
The upper part of the periphery of each communicating window is provided with a lower-diameter guide projection whose upper end is formed in a hemispherical shape. Also, it projects from the inner peripheral surface of each communicating window to the inside of the communicating window, and the substrate supporting plane at the upper end. A jig for cleaning a substrate for a semiconductor integrated circuit, which is provided with a supporting rib that defines 2. The supporting rib according to claim 1, wherein the upper end of the supporting rib is rounded around the projecting direction, and the upper end of the supporting rib projects above the upper surfaces of the vertical and horizontal rails and the outer peripheral frame. Cleaning jig. 3. A plurality of engaging projections projecting upward on the upper surface of the outer peripheral frame, and engaging recesses on the lower surface of the outer peripheral frame below these engaging projections, respectively. It has a large number of communication windows divided by crosspieces,
The upper surface of the periphery of each communication window is provided with a lower-diameter guide projection whose upper end is formed in a hemispherical shape. For a semiconductor integrated circuit, which is provided with supporting ribs whose upper and lower ends respectively project above and below the vertical and horizontal bars and the upper and lower surfaces of the outer peripheral frame, and which defines the substrate supporting plane at the upper ends of the supporting ribs. A jig for cleaning substrates. 4. The guide projection according to claim 1, wherein when the two cleaning jigs are vertically stacked, the upper projection is provided at the upper end of the guide projection of the lower cleaning jig. A jig for cleaning a semiconductor integrated circuit substrate that defines the support plane of the upper jig that supports the lower surface of the jig. 5. The engagement protrusion according to claim 1, wherein when the two cleaning jigs are vertically stacked, the engagement protrusion of the lower cleaning jig has an upper cleaning jig. A jig for cleaning a substrate for a semiconductor integrated circuit in which the horizontal movements of the upper and lower cleaning jigs are restricted by being fitted into the engaging recesses of the tool, and by fitting the engaging projections and the engaging recesses.