JP3494960B2 - Scanning laser processing apparatus and laser processing method capable of processing simulation - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus that irradiates a laser beam to perform various kinds of processing and printing on an object to be processed.

[0002]

2. Description of the Related Art A laser processing apparatus for performing processing such as printing or punching on objects to be processed of various materials such as resin and glass by irradiating a laser beam while controlling a laser irradiation position by a scanning method. Known from the past. This main device usually uses an X-axis galvanometer mirror and a Y-axis galvanometer mirror installed in the optical path of the laser beam,
By changing the laser irradiation position to a scan type in two directions of the X axis direction and the Y axis direction on the processing plane, processing is performed at a desired position of the processing target.

When actually performing processing by such a laser processing apparatus, positioning of the processing object with respect to the irradiation position of the laser, in other words, alignment and processing of the processing object with respect to the coordinate system of the laser beam scan of the processing apparatus. You need to make a size decision.

For this reason, in the past, the test processing was actually repeated on the object to be processed, and the main processing was carried out based on the result.

On the other hand, by using a visible laser beam having no processing function as guide light emitted coaxially with the laser beam for actual processing, the laser irradiation position is aligned with the object to be processed. It is also known that the technology is performed prior to.

For example, Japanese Unexamined Patent Publication No. 10-58167 uses a He-Ne laser which emits light in the visible wavelength region as a guide light separately from a laser beam in a laser marking (printing) device, and indicates a frame of a region to be marked. It is disclosed that the drawing of the area diagram is continuously repeated at high speed. This creates a standing projected image of the marking area on the surface of the object to be processed due to the visual afterimage effect that humans have. It teaches that it can be done.

[0007]

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention As described above,
In laser processing, as a method of positioning an object to be processed and determining a processing size without performing actual processing, there is a method of using visible light having no processability as guide light in addition to laser light for processing. The guide light is particularly useful when using an invisible wavelength laser. In this case, the processing laser for actual processing and the guide light laser are of course set coaxially.

On the other hand, in the laser processing apparatus, in many cases, a lens is arranged in the optical system in order to narrow down the spot of the laser light. However, since the guide light naturally uses the laser in the visible wavelength range, the refraction in the lens is larger than that of the processing laser which is often the infrared wavelength. Therefore, even if the processing laser beam and the guide light beam are set to be coaxial, the irradiation position of the guide light beam is displaced from the irradiation position of the processing laser when passing through the lens. As a result, when the processing position is determined by irradiation of the guide light beam, there is a problem that the actual processing position deviates from the actual processing position.

Further, when the object to be machined is positioned by using the guide light, only the frame of the marking area is displayed by the guide light in the above-mentioned Japanese Patent Laid-Open No. 10-58167, but this can only confirm the rough position. However, it was not possible to confirm in advance what kind of processing would actually be performed.

[0010]

In order to solve the above problems, the laser processing apparatus according to the first aspect of the present invention is a laser processing apparatus for performing processing using a laser on a workpiece by a scanning method. There is a laser oscillator that emits a laser beam for processing that actually performs processing, and a guide light laser that is used as a guide light beam in the visible wavelength range for visual confirmation of processing and that is set almost coaxially with the processing laser beam. A guide light source for emitting a beam, a scanning optical system for moving the irradiation position of the processing laser beam and the guide light beam with respect to a workpiece placed near the processing plane in a scan manner, the processing laser beam, and the And a correction unit that corrects the positional deviation from the guide light beam.

As an example, the correction means has data regarding the positional deviation between the irradiation positions of the processing laser beam and the guide light beam regarding a plurality of specific scan positions on the processing plane, and the correction is performed using the data. To configure.

Specifically, the plurality of specific scan positions are set as grid points of an orthogonal coordinate system set on the processing plane, and the correction means uses data on the grid points for the grid points, except for the grid points. Regarding the points, it is preferable that the correction is performed using data obtained by performing linear interpolation using the data on the grid points.

More preferably, the correction means is further configured to correct the distortion of the irradiation position of the processing laser beam using a correction formula defined in a rectangular coordinate system set on the processing surface. Specifically, the correction formula is x, y the coordinate value of the position to be irradiated with the processing laser beam, X, Y the corrected coordinate value, A, B, a, b constants specific to the device. , X = x + Ay ² x + By Y = Y-ax ² y + bx.

The present invention also provides, in another aspect, a method for providing a simulation of machining before machining in laser machining. That is, the laser processing method of the present invention is a laser processing method for performing laser processing on a workpiece placed in the vicinity of a processing plane with a laser according to set data while moving an irradiation point of a processing laser beam by a scanning method. Prior to processing the workpiece with the processing laser beam, a guide light beam having a wavelength in the visible wavelength range is repeatedly scanned at high speed on a processing locus to be followed by the processing laser beam during the processing. By doing so, processing simulation is performed using the visual afterimage effect.

In this processing method, the set data can be changed based on the result of the simulation.

The machining simulation of the present invention can be carried out by the following device. That is, a laser processing apparatus that performs processing using a laser on a workpiece by a scanning method, a laser oscillator that emits a processing laser beam that performs actual processing, and a visible wavelength used for visual confirmation of processing. Light source for emitting a guide light beam that is a guide light beam in a region and is set to be substantially coaxial with the processing laser beam, the processing laser beam for the workpiece placed near the processing plane, and A scan optical system that scan-moves the irradiation position of the guide light beam so that the irradiation positions of both beams are substantially the same, and control for driving and controlling the first laser oscillator, the second laser oscillator, and the scan optical system. Means for controlling the guide light beam before the processing of the workpiece by the processing laser beam. The processing laser beam machining path on to follow during processing, it is scan method laser processing apparatus, which is characterized in that the control to scan repeatedly at high speed.

In this device, it is more preferable to provide a correction means for correcting the positional deviation between the processing laser beam and the guide light beam. Further, this correction means can have the same configuration as the correction means in the first aspect of the present invention.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A scan type laser printer as an embodiment of the present invention will be described below with reference to the drawings. This laser printer uses a laser to perform planar printing of characters such as letters and numbers and various figures and designs on the surface of objects (printing objects) made of various materials such as glass and resin. is there.

FIG. 2 is a schematic view showing a laser head 10 of a scan type laser printer as an embodiment of the present invention. The laser head 10 includes a CO ₂ laser oscillator 11 that outputs a laser for processing (that is, printing), a semiconductor laser oscillator 12 that outputs a laser in the visible region as a guide light source, and a laser beam output from each laser oscillator. Beam combiner 14 for making coaxial with each other,
It has an XY galvanometer scanner box 16 for two-dimensionally scanning a laser beam, and an fθ lens 18 for converging the laser beam into a spot term.

The lasers output from the respective laser oscillators enter the beam combiner 14. The beam combiner 14 transmits the processing laser beam from the CO ₂ laser oscillator 11 and reflects the guide light laser beam from the semiconductor laser oscillator 12. As a result, the laser beams output from the beam combiner are coaxial with each other.

The laser beam emitted from the beam combiner enters the XY galvano scanner box 16. XY
The galvano scanner box 16 has a known X-axis galvano mirror 23, a Y-axis galvano mirror 24 (see FIG. 1), and an X-axis scanner 21 and a Y-axis scanner 22 (FIG. 1) for moving them. Under the control of the controller 40 (FIG. 1), the X-axis and Y-axis scanners 21 and 22 are used to
By rotating the Y-axis galvanometer mirrors 23 and 24 around their respective axes, the laser irradiation position is moved in the X-axis and Y-axis directions of the printing surface. As a result, the laser beam can be freely scanned at any position on the printing surface.

The laser beam emitted from the XY galvano scanner box 16 enters the fθ lens. The laser light incident on the fθ lens 18 is converged by the fθ lens and becomes a spot light, which is applied to the printing object placed on the printing surface 19. Next, with reference to FIG. 1 which is a block diagram of the laser printing apparatus, the overall configuration including the control system of the apparatus will be described.

The laser printer 1 mainly comprises an input device 20, an output device 30, a controller 40 and the laser head 10 described above.

The input device 20 is a device for inputting various data and commands to the device to the laser printer from the outside, and has a key input device such as a touch panel or a keyboard for an operator to input. The input device 20 may be a personal computer separately from the laser printer. The data input from the outside by the input device is the print data such as character strings such as alphanumeric characters to be printed by the laser printing device and various figures and patterns, the printing speed, the laser output, the printing size, the printing start position, etc. Information about various settings.

The laser printer 1 further includes an output device 30, and various information and signals can be output to an external device via the output devices 30. For example, when a problem occurs in the laser printer 1, it may be configured to output a signal for activating an external patrol light, a buzzer or the like through an output device to issue a warning. When the laser printer 1 is incorporated in a part of the production line, it is possible to send information notifying the state of the laser printer to other devices in the line. Specifically, the malfunction of the apparatus as described above and the start and end timings of printing on the individual print objects by the laser printing apparatus can be transmitted to other devices.

The controller 40 is a part that controls the entire apparatus, and performs various processing on various data input from the input device 20 such as correction of misalignment of guide light and processing light described later in detail. 41, a storage unit 43 that can store fixed pattern data such as characters, marks, and graphics to be printed, and can store the data used for the positional deviation correction and the correction calculation processing result, and the storage unit 43 that is calculated in the calculation processing unit 41. It has a control processing unit 42 for controlling the driving of the X-axis scanner 21, the Y-axis scanner 22 of the laser head and the laser oscillator based on the data stored in the table to control the execution of the actual printing process. The arithmetic processing unit 41 and the control processing unit 42 are composed of a CPU. This is the same C
The PU may have respective functions, or may be configured by separate CPUs. The storage unit 43 is composed of a non-volatile memory such as a flash memory or a ROM.

Next, an outline of the printing operation of the laser printing apparatus will be described. Here, a case where characters are printed using font data stored in advance in the storage unit will be described as an example.

First, the character data to be printed is input by the input device. At this time, print parameters such as print size, print size, and print position are also input.

The arithmetic processing unit 41 reads out necessary font data from the storage unit 43 based on the input data,
Based on the data such as the font data, the print size data, the print position data, etc., the print data in which the actual print position, that is, the print position where the laser beam is irradiated, is represented by the x and y coordinates on the print surface is calculated. .

By the way, as described above, the semiconductor laser light as the guide light and the CO ₂ laser light as the processing light have a positional deviation when passing through the fθ lens due to the difference in wavelength. In this apparatus, in order to correct this, separate print data is calculated for each of the semiconductor laser light (for printing simulation) and the CO ₂ laser light (for actual printing). Details of this correction will be described later.

The print data obtained by the calculation in the calculation processing section 41 is temporarily stored in the storage section 43.

The apparatus of the present embodiment can perform printing simulation by moving only the guide light before actual printing. In response to a print simulation start command input from the input device 20, the control processing unit reads the print simulation print data stored in the storage unit 43, and according to the data, the semiconductor laser oscillator 12 and the galvano scanner box 16 are read. X axis,
The Y-axis scanners 21 and 22 are driven to repeatedly scan the object to be printed with the guide light of the semiconductor laser beam at high speed. By repeating scanning at a speed higher than a certain level, it is possible to observe the print pattern in a state of being floated on the print object by the visual afterimage effect of human. This scanning speed is, for example, 1000 to 3000 mm / s.

By observing the drawn image of this simulation, it is confirmed whether there is no problem in the print contents, print size, print position, etc., that is, whether the desired print can be obtained. If the printing contents (characters to be printed) are incorrect, re-enter the character from the input device. If there is a problem with the print size or print position, change those parameters using the input device. It is preferable that the parameter change is reflected on the simulated drawn image in real time because the correction becomes easy.

When the simulation drawing image is printed as desired with or without correction, a command for instructing the main printing is input from the input device. In response to this, the control processing unit stops the semiconductor laser oscillator 11,
The guide light is turned off, the print data for the main print is read from the storage unit 43, and the main print is performed on the print target by using the processing laser beam from the CO ₂ laser oscillator 11.

Then, in the following, a semiconductor laser for the guide light is used.
Laser beam and CO for processing (printing) ₂Laser beam position
The misregistration correction will be described.

The CO ₂ laser is around 10 μm (10640
(nm) in the infrared wavelength range (invisible range). On the other hand, the semiconductor laser used as the guide light must, of course, be one that is in the visible visible wavelength range, which is a wavelength much shorter than the CO ₂ laser beam for printing. For example, wavelength 620 to 680 nm
The red semiconductor laser is used. On the other hand, the laser head uses the fθ lens 18 for focusing the laser beam,
The refractive index of the lens material (glass or plastic) increases as the wavelength of light decreases. Therefore, even if the semiconductor laser beam for guide light is set to be coaxial with the CO ₂ laser beam for printing, the guide light laser irradiation position on the printing surface (processing plane) after passing through the fθ lens is the processing laser. It is displaced from the irradiation position. FIG. 3 schematically shows this state. FIG. 3 shows an example of a case in which the printing of a square area of 100 mm on a side as a maximum printing area is instructed by the apparatus of the present embodiment and actually printed. Compared to the shape drawn by the CO ₂ laser for processing shown by the solid line, the shape drawn by the semiconductor laser as the guide light shown by the dotted line is closer to the inside.
This is because the wavelength of the semiconductor laser is short and the refraction when passing through the lens becomes large.

A method of correcting this deviation will be described below. (1) Positional deviation correction method between both beams FIG. 4 shows a position where a plane laser xy coordinate is set on a printing surface and a processing laser is applied to a lattice point (that is, a point where each coordinate value is an integer) in the coordinate. Is indicated by a black dot (and a solid line connecting them),
On the other hand, the corresponding irradiation points of the guide light laser are shown by white dots (and broken lines connecting them). FIG. 4 shows a part near the corners of the print area. The amount of deviation between the respective lattice points corresponding to each other becomes a unique value depending on the configuration of the optical system of the laser head including the fθ lens. Further, not only the irradiation positions of the two guide lights are displaced from each other, but also as can be seen from FIG. 4, an inherent distortion due to the optical system of the device occurs in the laser drawing image itself (see the drawing image of the guide light in FIG. 4). Is a so-called barrel-shaped distortion).

In the first embodiment of the misregistration correction, when the processing laser is previously irradiated to each grid point of the print surface coordinate system,
The position coordinates of each irradiation point of the corresponding guide light laser are measured in advance. This makes it possible to find how much the guide light laser is displaced at the printing position of each grid point. An example thereof is shown in Table 1 of FIG. For example, looking at the points of the print laser position coordinates (2.00, 1.00) in this table, the corresponding irradiation position coordinates of the guide light laser are (3.25, 2.28). Therefore, the deviation amount of the guide light laser at this position is
(3.25, 2.28)-(2.00, 1.00) = (1.25, 1.28). Therefore, in order to eliminate the positional deviation between the processing laser beam and the guide light laser beam, the correction of (-1.25, -1.28) may be added to the guide light laser at this position. Since the target position coordinates are (2.00, 1.00), the corrected coordinates are (2.00, 1.00) + (-1.25, -1.28) = (0.75, -0.28). The corrected coordinates of the guide light laser at each point obtained in this way are shown in Table 2 of FIG.

The table shown in FIG. 5 is only a part of the print area, but in reality, such a correction value is obtained for the coordinate position of the entire surface of the print area, and the correction data table is stored in the storage unit 43 of the controller 40. Remember as. And the arithmetic processing unit 4
The reference numeral 1 reads the correction data from the storage unit 43 and calculates the corrected print data for the guide light laser when the above-described print data is calculated.

In this embodiment, the correction data is obtained only for the grid points of the coordinates, and for the positions other than the grid points, the correction data of the grid points are used to perform linear interpolation (interpolation) to make the correction coordinates. To decide. For example coordinates (1.5
, 1.5) is the midpoint between the coordinates (1.0, 1.0) and (2.0, 2.0), so the corrected coordinates (-
0.37, -0.26) and coordinate (2.0, 2.0)
, 0.75) {(-0.37, -0.26) + (0.81, 0.75)} / 2 = (0.22, 0.2
5) is required.

(2) Method for Correcting Distortion of Beam Irradiation Position As described above, in the laser printing apparatus (or laser processing apparatus), peculiar distortion due to the optical system of the apparatus occurs. An example thereof is shown in FIG. FIG. 6 shows by solid lines how the actual printed image is distorted when the square image data shown by the dotted lines is drawn. X as in this embodiment
In a laser head in which a Y galvano scanner and an fθ lens are combined, the distortion of an actual drawn figure with respect to an ideal drawn image is generally barrel distortion as shown in FIG. 6A. In FIG. 6, a rectangle indicated by a dotted line indicates a square ideal drawing figure, and a solid line indicates a drawing figure including a distortion that is actually drawn. Further, due to the influence of how each part is assembled in the laser head and their mutual arrangement, distortion such as a square tilted as shown in FIG. 6B may occur.

In this embodiment, this distortion is corrected using a correction formula. We found by computer simulation that the positional deviation can be corrected accurately by using the following formula. X = x + Ay ² x + By (Equation 1) Y = y-ax ² y + bx (Equation 2) where x and y are coordinate values to be irradiated with laser light, X, Y is a corrected coordinate value, and A, B, a, and b are constants unique to the optical system of the laser head. These constants are obtained by actually irradiating a plurality of (somewhat many) measurement points with a laser to obtain data, and based on them, a statistical method (for example, the least square method) or the like. These values are obtained in advance for each individual device and stored as a correction formula in the storage unit 43.
Remember.

When calculating the print data for the laser described above, the calculation processing section 41 calculates the corrected print data using this correction formula. As a result, the distortion is corrected and it is possible to print in a shape according to the data to be printed.

The correction according to the above-described correction formula of this embodiment can correct both types (a) and (b) shown in FIG. 6 and a combination thereof. The values of the constants A, B, a, and b in the correction formula are shown in Fig. 6 (a) and (b), respectively.
They are related to the quantities shown as A, B, a, and b, respectively.

Ideally, the distortion correction using this correction formula should be performed for each of the guide light beam and the processing laser beam, but in practice, it will be sufficient if only the processing laser is used. Is obtained.

Although the present invention has been described above with reference to the preferred embodiments, the above embodiments are merely examples, and the present invention is not limited thereto.

For example, although the laser printing device is used in the above-described embodiment, the present invention is not limited to this, and can be applied to a device that performs various other processes such as cutting and drilling using a laser.

In the above embodiment, the CO ₂ laser is used as the processing laser beam, but other lasers may be used.

The same applies to the guide light source, and the light source is not limited to the semiconductor laser and may be any light source that emits light in the visible wavelength range. For example, a He-Ne laser or an LED instead of a laser may be used.

Further, the correction using the correction formula in the correction example 2 is not limited to the form of the formula 1 and the formula 2 shown therein, and other correction formulas in the coordinate system set with respect to the machining plane can be used. Those that are used to correct distortion are also included within the scope of the present invention.

[0051]

According to the present invention, in the scanning type laser processing apparatus, the positional deviation between the processing laser beam and the guide light beam due to the difference in the refractive index of the fθ lens is corrected, and the irradiation positions of both are corrected. Therefore, it is possible to accurately set the processing position based on the guide light.

Further, prior to actual processing, a guide light beam having a wavelength in the visible wavelength range is repeatedly scanned at high speed on a processing locus to be followed by the processing laser beam at the time of the processing, thereby actually processing. It is possible to simulate accurate machining position and machining state without a problem. Therefore, positioning of the object to be processed and setting of the processing size become easy. Also, unlike the conventional method, positioning and setting of machining size can be performed without using a prototype work. Further, since the machining position and the machining parameters can be set while monitoring the machining state in real time by simulation, the preparatory work becomes easy and the working time can be shortened.

[Brief description of drawings]

FIG. 1 is a block diagram showing an overall configuration of a laser printer which is an embodiment of the present invention.

FIG. 2 is a schematic diagram schematically showing a configuration of a laser head of the laser printing apparatus shown in FIG.

FIG. 3 is a diagram schematically showing a deviation of irradiation positions of a processing laser and a guide light laser in the laser printer of the above embodiment.

FIG. 4 is a diagram showing in more detail the positional deviation between the processing laser and the guide light laser at the corners of the print area.

FIG. 5 is a table showing an example of various values at some grid points of xy coordinates taken on the printing surface of the laser printing apparatus, and Table 1 shows the position coordinates of the processing laser and the guide light laser and those. Table 2 shows the correction coordinates of the guide light laser with respect to the target position coordinates of the guide light laser.

FIG. 6A and FIG. 6B are diagrams showing examples of print position distortion in the laser printer.

[Explanation of symbols]

1 Laser Printing Device 10 Laser Head 11 CO ₂ Laser Oscillator 12 Semiconductor Laser Oscillator 14 Beam Combiner 16 Galvano Scanner Box 18 fθ Lens 19 Printing Surface 20 Input Device 21 X-Axis Scanner 22 Y-Axis Scanner 23 X-Axis Galvano Mirror 24 Y-Axis Galvano Mirror 30 output device 40 controller 41 arithmetic processing unit 42 control processing unit 43 storage unit

─────────────────────────────────────────────────── --Continued from the front page (56) References JP-A-2-104486 (JP, A) JP-A-4-253585 (JP, A) JP-A-11-254172 (JP, A) JP-A 2000-33488 (JP, A) JP 10-328864 (JP, A) JP 1-162591 (JP, A) JP 6-90052 (JP, A) JP 10-15676 (JP, A) (JP 58) Fields investigated (Int. Cl. ⁷ , DB name) B23K 26/00-26/42

Claims (5)

(57) [Claims] 1. A laser processing apparatus for processing a workpiece using a laser by a scanning method, comprising a laser oscillator for emitting a processing laser beam used for actual processing, and a processing state. A guide light source for emitting a guide light beam in the visible wavelength range used for visual confirmation, a beam combiner for coaxially forming the processing laser beam and the guide light beam, and the workpiece. A scanning optical system for moving the irradiation positions of the processing laser beam and the guide light beam in a scan manner, and an irradiation position of the processing laser beam and an irradiation position of the guide light beam on the workpiece. Compensation means for compensating for the positional deviation of the, the compensation means, the irradiation position of the processing laser beam on the workpiece and The correction means has a data table relating to a positional deviation between the irradiation position of the guide light beam and a specific position, and the correction means moves the irradiation position by irradiating the workpiece with the guide light beam by the scanning optical system. At this time, the irradiation position is corrected by the scanning optical system based on the data table, and the guide light beam is irradiated onto the workpiece and illuminated.
The movement of the shooting position is performed by the processing target of the processing laser beam.
Before the irradiation on the object, the processing laser beam
Follow the machining trajectory when irradiation is performed and the irradiation position is moved.
In addition, the scan type laser processing device is characterized in that it is performed at a high speed and exhibits a visual afterimage effect . 2. A laser processing apparatus for processing a workpiece by using a laser by a scanning method, comprising a laser oscillator for emitting a processing laser beam used for actual processing, and a processing state. A guide light source for emitting a guide light beam in the visible wavelength range used for visual confirmation, a beam combiner for coaxially forming the processing laser beam and the guide light beam, and the workpiece. A scanning optical system for moving the irradiation positions of the processing laser beam and the guide light beam in a scan manner, and an irradiation position of the processing laser beam and an irradiation position of the guide light beam on the workpiece. Compensation means for compensating for the positional deviation of the, the compensation means, the irradiation position of the processing laser beam on the workpiece and The correction means has a data table relating to a positional deviation between the irradiation position of the guide light beam and a specific position, and the correction means moves the irradiation position by irradiating the workpiece with the guide light beam by the scanning optical system. At this time, the irradiation position is corrected by the scanning optical system based on the data table, and the specific position in the data table is on the processing plane.
Corresponding to each grid point on the set Cartesian coordinate system,
The means is arranged such that the irradiation position of the guide light beam is aligned with the lattice point.
When responding, use the data in the data table
The irradiation position is corrected so that the irradiation position is equal to or more than the grid point.
When it is outside, interpolation using the data on the grid point
The irradiation position is corrected using the obtained data.
Scan method laser processing apparatus according to claim Ukoto. 3. A laser processing apparatus for processing a workpiece by using a laser by a scanning method, comprising a laser oscillator for emitting a processing laser beam used for actual processing, and a processing state. A guide light source for emitting a guide light beam in the visible wavelength range used for visual confirmation, a beam combiner for coaxially forming the processing laser beam and the guide light beam, and the workpiece. A scanning optical system for moving the irradiation positions of the processing laser beam and the guide light beam in a scan manner, and an irradiation position of the processing laser beam and an irradiation position of the guide light beam on the workpiece. Compensation means for compensating for the positional deviation of the, the compensation means, the irradiation position of the processing laser beam on the workpiece and The correction means has a data table regarding a positional deviation between the irradiation position of the guide light beam and a specific position, and the correction means moves the irradiation position by irradiating the workpiece with the guide light beam by the scanning optical system. At this time, the irradiation position is corrected by the scanning optical system based on the data table, and the specific position in the data table is changed to the orthogonal coordinate system.
The correction means is arranged in the Cartesian coordinate system.
Using the distortion correction equation defined in
A scanning laser processing device characterized by performing distortion correction on the irradiation position of the laser. 4. The distortion correction formula is such that coordinates of a position to be irradiated with the processing laser beam are x, y, corrected coordinates are X, Y, constants unique to the laser processing apparatus are A, B, a,
when the ^{b, X = x + Ay 2} x + By Y = Y - ax 2 claim 3 scan type laser processing method, wherein a given by y + bx. 5. A laser processing method for performing laser processing on a workpiece according to set processing data while moving an irradiation point of a processing laser beam on the workpiece by a scanning method. By irradiating the work piece with a guide light beam in the visible wavelength range, the irradiation position of the guide beam light is moved at a high speed on the processing locus where the irradiation point of the processing laser beam is to be moved, A simulation of the processing performed on the workpiece is performed, the processing data is reset based on the result of the simulation, and processing by the processing laser beam is performed based on the reset processing data. The irradiation position of the guide light beam is the laser beam for processing at a specific position set on the workpiece. Regarding positional displacement between the guide light beam and the irradiation position of the beam,
A laser processing method, wherein the laser processing method is corrected based on a data table stored in advance.